Cooling roller, cooling device, evaporation coating equipment and cooling method

Abstract

The invention provides a cooling roller, a cooling device, evaporation coating equipment and a cooling method.The cooling roller is characterized in that a ceramic coating is sprayed on the surface of the cooling roller, and the ceramic coating comprises a mixture of an insulating material and a conductive material.

Description

Technical Field

[0001] The present disclosure relates to the field of batteries, and in particular to a cooling roller, a cooling device, a vacuum evaporation coating equipment and a cooling method. Background Art

[0002] In the vacuum evaporation coating industry, metal films such as aluminum and copper are generally plated on micron-sized substrates. However, the substrates are usually very thin, and the metal film vapor plated on the substrates is high-temperature gas, which can easily "burn" the substrate. Therefore, during the coating process, the heat brought by the high-temperature gas needs to be dissipated in time to prevent the substrate from being burned, and then a qualified composite current collector product can be made. Summary of the invention

[0003] In view of the above technical problems, the present disclosure provides a vacuum evaporation coating device and a cooling method to solve or at least alleviate the technical problem of heat dissipation during the coating process.

[0004] According to a specific embodiment of the present disclosure, the present disclosure provides a cooling roller, comprising: spraying a ceramic coating on the surface of the cooling roller, wherein the ceramic coating comprises a mixture of an insulating material and a conductive material.

[0005] In some embodiments, the ceramic coating comprises a mixture of aluminum oxide and titanium oxide; wherein the mixing mass ratio of aluminum oxide to titanium oxide is 5%-30%.

[0006] In some embodiments, the thickness of the ceramic coating is 200-500 μm; or,

[0007] The roughness of the ceramic coating is Ra0.1-Ra0.3.

[0008] In some embodiments, the cooling roller comprises: a circulating cooling channel configured to cool the outer surface of the cooling roller.

[0009] In some embodiments, the circulating cooling channel includes at least one of the following: a linear structure, a meandering structure, a serpentine structure, or a spiral structure.

[0010] In some embodiments, a positive voltage or a negative voltage is applied to the cooling roller, and the positive voltage or the negative voltage has a value range of 1-750V.

[0011] An embodiment of the present disclosure provides a cooling device, comprising a cooling roller as described above.

[0012] In some embodiments, it also includes:

[0013] The fluid input device is configured to provide cooling fluid to the circulating cooling channel in the cooling roller.

[0014] In some embodiments, the cooling fluid includes at least one of the following: pure water, impure water, or a cold air flow.

[0015] An embodiment of the present disclosure provides an evaporation coating device, comprising a cooling device as described in any one of the above.

[0016] In some embodiments, it also includes:

[0017] A guide roller, located upstream or downstream of the cooling roller, the guide roller applying a voltage opposite to that of the cooling roller;

[0018] An evaporation device, used for evaporating a conductive layer onto the substrate to be coated carried by the cooling roller;

[0019] Wherein, in response to the conductive layer being evaporated onto the substrate to be coated, the conductive layer is tightly adsorbed on the cooling roller under the action of Coulomb force.

[0020] In some embodiments, the conductive layer includes a metal material or an alloy material.

[0021] In some embodiments, the substrate to be coated includes at least one of the following: a metal material, an alloy material, or an organic material.

[0022] The present disclosure provides a method for cooling a substrate using an evaporation coating device, comprising:

[0023] Providing a cooling roller, wherein the cooling roller is configured to carry a substrate to be coated;

[0024] Spraying a ceramic material mixture onto the surface of the cooling roller by spraying to form a ceramic coating, and as the cooling roller rotates, the substrate to be coated adheres to the surface of the ceramic coating;

[0025] applying a positive voltage or a negative voltage to the cooling roller;

[0026] Arranging a guide roller so as to be located upstream or downstream of the cooling roller, and applying a voltage opposite to the voltage of the cooling roller to the guide roller;

[0027] Providing an evaporation device for evaporating a conductive layer onto the substrate to be coated carried by the cooling roller;

[0028] Wherein, in response to the conductive layer being evaporated onto the substrate to be coated, the conductive layer is tightly adsorbed on the cooling roller under the action of Coulomb force.

[0029] In some embodiments, before providing the cooling roller, the step includes: preparing a ceramic coating mixture including an insulating material and a conductive material.

[0030] In some embodiments, the ceramic coating comprises a mixture of aluminum oxide and titanium oxide.

[0031] Wherein, the mixing mass ratio of the aluminum oxide and the titanium oxide is 5%-30%.

[0032] In some embodiments, the thickness of the ceramic coating is 200-500 μm; or,

[0033] The roughness of the ceramic coating is Ra0.1-Ra0.3.

[0034] In some embodiments, providing the cooling roller includes: setting a circulating cooling channel at a portion of the cooling roller adjacent to an outer surface of the cooling roller, and inputting a cooling fluid into the circulating cooling channel to cool the outer surface of the cooling roller.

[0035] In some embodiments, the cooling fluid includes at least one of the following: pure water, impure water, or a cold air flow.

[0036] In some embodiments, the conductive layer includes a metal material or an alloy material.

[0037] In some embodiments, the substrate to be coated includes at least one of the following: a metal material, an alloy material, or an organic material.

[0038] In some embodiments, the positive voltage or negative voltage applied to the cooling roller has a value in the range of 1-750V.

[0039] In some embodiments, the voltage applied to the guide roller ranges from 1V to 750V.

[0040] Compared with the prior art, the above solution of the embodiment of the present disclosure has at least the following beneficial effects:

[0041] The present invention provides a cooling roller, a cooling device, a vacuum evaporation coating equipment and a cooling method, wherein a ceramic coating is sprayed on the surface of the cooling roller so that the ceramic coating is added between the coated conductive layer and the cooling roller, a voltage is applied to the cooling roller with the ceramic coating, and a reverse voltage is applied to the rollers other than the cooling roller that are in contact with the substrate, so that the substrate is tightly adsorbed on the cooling roller through the Coulomb force, thereby quickly dissipating the heat of the conductive layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] The drawings herein are incorporated into the specification and constitute a part of the specification, showing embodiments consistent with the present disclosure, and together with the specification, are used to explain the principles of the present disclosure. Obviously, the drawings described below are only some embodiments of the present disclosure, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. In the drawings:

[0043] Figure 1A three-dimensional diagram of a partial structure of an evaporation coating device provided in some embodiments of the present disclosure;

[0044] Figure 2 A side view of a partial structure of an evaporation coating device provided in some embodiments of the present disclosure;

[0045] Figure 3 A cross-sectional view of a cooling roller after coating provided in some embodiments of the present disclosure;

[0046] Figure 4 A graph showing the relationship between the thickness of a ceramic film layer and the Coulomb force provided in some embodiments of the present disclosure;

[0047] Figure 5 A schematic flow chart of a cooling method for evaporative coating equipment provided in some embodiments of the present disclosure.

[0048] The reference numerals in the specific implementation manner are as follows:

[0049] Evaporation coating equipment 100; cooling roller 110, circulating cooling channel 111, substrate 120, guide roller 130, power supply 140, ceramic coating 160, evaporation device 170, conductive layer 180. DETAILED DESCRIPTION

[0050] In order to make the purpose, technical scheme and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0051] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present disclosure belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit the present disclosure.

[0052] It should also be noted that the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a product or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such product or device. In the absence of more restrictions, the elements defined by the sentence "comprises a" do not exclude the presence of other identical elements in the product or device including the elements.

[0053] In the description of the embodiments of the present invention, the orientations or positional relationships indicated by technical terms such as "upper", "lower", and "thickness" are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of describing the embodiments of the present invention and simplifying the description. They do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the embodiments of the present invention.

[0054] In the description of the embodiments of the present invention, the term "and / or" is only a description of the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B may represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0055] In the description of the embodiments of the present invention, the symbol “~” represents the two endpoint data before and after the “~” and all data between the two endpoints. For example, A~B represents all data greater than or equal to A and less than or equal to B.

[0056] Reference to "embodiments" in this disclosure means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the disclosure. The appearance of the phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described in this disclosure may be combined with other embodiments.

[0057] In the related technology, when the vacuum evaporation coating industry is producing metal conductive films, in order to ensure that the substrate is not burned, a high-speed substrate travel is often used. This method reduces the amount of heat received by the substrate per unit time, thereby reducing the amount of heat to be dissipated by the substrate. However, the thickness of the substrate is very thin, basically between tens of nanometers and 100 nanometers. The high travel speed can easily tear the substrate apart, and the film thickness requirement of the finished composite current collector is generally in the micron level. Therefore, multiple repeated coating processes are required to meet the finished product requirements, and the high travel speed will also affect the performance of other coated layers.

[0058] To this end, the present disclosure provides a cooling roller, comprising: spraying a ceramic coating on the surface of the cooling roller, wherein the ceramic coating comprises a mixture of an insulating material and a conductive material. A cooling device comprising the cooling roller. And an evaporation coating device comprising the cooling device, wherein the evaporation coating device further comprises: a guide roller located upstream or downstream of the cooling roller, wherein the guide roller applies a voltage opposite to the voltage of the cooling roller; and an evaporation device for evaporating a conductive layer onto a substrate to be coated carried by the cooling roller; wherein, in response to the conductive layer being evaporated onto the substrate to be coated, the conductive layer is tightly adsorbed to the cooling roller under the action of the Coulomb force.

[0059] The cooling roller, cooling device, vacuum evaporation coating equipment and cooling method provided by the present invention spray a ceramic coating on the surface of the cooling roller so that the ceramic coating is added between the coated conductive layer and the cooling roller, a voltage is applied to the cooling roller with the ceramic coating, and a reverse voltage is applied to the roller other than the cooling roller that is in contact with the substrate, so that the substrate is tightly adsorbed on the cooling roller through Coulomb force, thereby quickly dissipating the heat of the conductive layer.

[0060] The embodiments of the present disclosure are described in detail below with reference to the accompanying drawings.

[0061] See also Figure 1-Figure 3 ,in, Figure 1 This is a three-dimensional diagram of the local structure of the evaporation coating equipment. Figure 2 This is a side view of the local structure of the evaporation coating equipment. Figure 3 It is a schematic diagram of a cooling roller and a film layer structure. According to a specific implementation of the present disclosure, an embodiment of the present disclosure provides a cooling roller, including: spraying a ceramic coating on the surface of the cooling roller, wherein the ceramic coating includes a mixture of an insulating material and a conductive material.

[0062] The vacuum evaporation coating device 100 provided in the embodiment of the present disclosure includes a cooling roller 110, and the cooling roller 110 is configured to carry a substrate 120 to be coated. The cooling roller 110 drives the substrate 120 to run along the surface of the cooling roller 110 by continuous and uniform rotation, and coating is achieved during the operation. A positive voltage or a negative voltage is applied to the cooling roller 110 through a power supply 140, that is, the cooling roller 110 can be connected to the positive electrode of the power supply 140, and can also be connected to the negative electrode of the power supply 140, and there is no limitation on this. A ceramic coating 160 is provided on the surface of the cooling roller 110, and the ceramic coating 160 is provided on the surface of the cooling roller 110. The ceramic coating 160 is disposed on the surface of the cooling roller 110 by spraying. The ceramic coating 160 can be disposed by plasma thermal spraying or the like. The ceramic coating 160 is uniformly sprayed on the outer surface of the cooling roller 110. The outer surface of the ceramic coating 160 is in contact with the substrate 120. As the cooling roller 110 rotates, the substrate 120 to be coated is in contact with the surface of the ceramic coating 160 and runs. The vacuum evaporation coating equipment 100 also includes at least one guide roller 130. The guide roller 130 is located upstream or downstream of the cooling roller 110. The upstream refers to the position relative to the substrate 120. The downstream refers to the direction in which the substrate 120 is transported, the substrate 120 first passes through the guide roller 130 and then passes through the cooling roller 110 for coating, and the downstream refers to the direction in which the substrate 120 is transported, the substrate 120 first passes through the cooling roller 110 for coating and then passes through the guide roller 130 for transmission, and at least one of the guide rollers 130 applies a voltage opposite to the voltage of the cooling roller 110, that is, when the cooling roller 110 is connected to the positive electrode of the power supply 140, the guide roller 130 is connected to the negative electrode of the power supply 140, and when the cooling roller 110 is connected to the negative electrode of the power supply 140, the guide roller 1 30 is connected to the positive electrode of the power supply 140, and the two have opposite polarities, so that a voltage with a preset range is formed between the guide roller 130 and the cooling roller 110; the vacuum evaporation coating equipment 100 also includes a vapor deposition device 170, which is usually placed under the cooling roller 110, and the vapor deposition device 170 is used to vapor-deposit a conductive layer 180 onto the substrate 120 to be coated carried by the cooling roller 110; wherein, in response to the conductive layer 180 being vapor-deposited onto the substrate 120 to be coated, the conductive layer 180 is tightly adsorbed on the cooling roller 110 under the action of the Coulomb force. Figure 3 As shown, when the conductive layer 180 is vapor-deposited on the substrate 120 to be coated, the substrate 120 is transmitted through the guide roller 130 and carries the same voltage as the guide roller 130. At this time, the voltage applied to the cooling roller 110 is opposite to the voltage polarity of the conductive layer 180, so that the substrate 120 is tightly adsorbed on the cooling roller 110 through the ceramic coating 160 through the Coulomb force, so that the heat of the conductive layer 180 can be quickly dissipated.

[0063] In some embodiments, the substrate to be coated includes a metal material or an alloy material or an organic material. In some embodiments, the material of the substrate 120 can be a high molecular polymer material with insulating properties, and can form a film layer with a stable structure and a thin thickness, which is convenient for heat transfer. The material of the substrate layer 120 can be selected from one or more composite materials of polyethylene terephthalate, o-phenylphenol, polypropylene, polyimide polyvinyl chloride, polybutylene terephthalate, polyethylene naphthalate, polyetheretherketone, polyamide, polyethylene glycol, polyamideimide, polycarbonate, cyclic polyolefin, polyphenylene sulfide, polyvinyl acetate, polytetrafluoroethylene, polymethylenenaphthalene, polyvinylidene fluoride, polyethylene naphthalate, polypropylene carbonate, polyvinylidene fluoride-hexafluoropropylene, poly (vinylidene fluoride-co-chlorotrifluoroethylene), silicone, vinylon, polypropylene, polyethylene, polystyrene, polyethernitrile, polyurethane, polyphenylene oxide, polyester and polysulfone and its derivatives. In some embodiments, the thickness of the substrate layer is 4-8 μm, for example, 5 μm to 7 μm. The substrate layer 120 needs to be as thin as possible while ensuring its insulation properties and structural stability.

[0064] In some embodiments, the material of the substrate 120 may be at least one of a metal or a metal oxide or an alloy material, including but not limited to at least one of copper, aluminum, copper oxide, aluminum oxide, copper alloy, aluminum alloy or copper-aluminum alloy.

[0065] In some embodiments, the ceramic coating includes a mixture of an insulating material and a conductive material. The ceramic coating needs to have high insulation but not complete insulation, and needs to have a certain leakage current. Therefore, the insulating material in the ceramic coating ensures that the ceramic coating has insulation, and the conductive material ensures that the ceramic coating has a certain leakage current. In some embodiments, the ceramic coating includes a mixture of aluminum oxide and titanium oxide, wherein aluminum oxide is an insulating material and titanium oxide is a conductive material.

[0066] In some embodiments, the mixing mass ratio of aluminum oxide to titanium oxide is 5%-30%.

[0067] In some embodiments, the thickness of the ceramic coating 160 is 200-500 μm. Figure 4 As shown, the ceramic coating 160 should be as thin as possible to increase the Coulomb force on both sides of the ceramic coating 160, so that the substrate 120 to be coated and the cooling roller 110 can fit more closely. Under the same voltage, when the thickness exceeds 500μm, the Coulomb force on both sides of the ceramic coating 160 will decrease significantly. Therefore, setting the thickness of the ceramic coating 160 to 200-500μm can maximize the adsorption of the substrate 120 to be coated on the surface of the cooling roller 110, so as to quickly remove the heat in the hot vapor, thereby enhancing the cooling effect on the conductive layer 180.

[0068] In some embodiments, the roughness of the ceramic coating 160 is Ra0.1-Ra0.3, for example, the roughness of the ceramic coating 160 is Ra0.2. During the coating process, the surface smoothness of the ceramic coating 160 should be maintained as much as possible, so that the substrate 120 to be coated and the ceramic coating 160 are seamlessly connected, which can further enhance the heat conduction efficiency of the conductive layer 180.

[0069] In some embodiments, the conductive layer 180 includes a metal material or an alloy material. The metal material is selected from one or more of Ni, Ti, Cu, Ag, Au, Pt, Fe, Co, Cr, W, Mo, Al, Mg, K, Na, Ca, Sr, Ba, Si, Ge, Sb, Pb, In and Zn. The alloy material includes a nickel-copper alloy, an aluminum-zirconium alloy, etc.

[0070] In some embodiments, Figure 1 As shown, the conductive layer 180 is evaporated onto the surface of the substrate 120 to be coated by the evaporation device 170. In some embodiments, during the evaporation process, a metal wire is placed in the evaporation device 170 or a continuous wire feeding method is used to vaporize the metal wire in the evaporation device 170, and the high-temperature metal gas evaporates to the surface of the substrate 120 to be coated, forming a thin film on the surface of the substrate 120 to be coated. The thickness of the formed metal conductive layer 180 is 0.3-2 μm. In the process of forming a thin film, the gaseous metal quickly changes from a gaseous state to a solid state, and a large amount of heat is released instantly during this process, and the released heat needs to be dissipated as soon as possible. In this embodiment, during the evaporation process, once the metal vapor reaches the surface of the substrate 120 to be coated, since the substrate 120 to be coated is in contact with the guide roller 130, the substrate 120 to be coated will form a voltage with the same polarity as the guide roller 130, so that the metal vapor is instantly conductive and generates a Coulomb force opposite to the voltage on the cooling roller 110, so that the substrate 120 to be coated will instantly adhere to the surface of the ceramic coating 160, and the heat generated by the metal vapor is quickly removed through the cooling channel of the cooling roller 110, thereby avoiding burn damage to the substrate 120.

[0071] In some embodiments, the metal material evaporation method can also use an electron beam evaporation device for coating. The electron beam evaporation device can include a target container for placing a metal target material, the opening direction of the target container is toward the substrate 120, and an auxiliary circuit can be provided. The auxiliary circuit has an adsorption electric field for adsorbing secondary electrons. The secondary electrons generated by the reflection of the target material are adsorbed by the auxiliary circuit, thereby preventing the secondary electrons from damaging the substrate 120, removing static electricity, eliminating the secondary electrons on the substrate 120, and eliminating or weakening the secondary electrons before they reach the surface of the substrate 120, thereby avoiding damage or burn-through of the substrate by the secondary electrons, so that the performance of the product after coating meets the standards.

[0072] In some embodiments, the electron beam evaporation device may further include a particle gun, which is configured to heat and evaporate the target material. It should be noted that the particle gun of the present disclosure is configured to heat and evaporate the target material, that is, to heat and melt the target material, so that the target material evaporates and vaporizes, and the generated metal vapor flow is deposited on the substrate 120 when it encounters the substrate 120. In an optional embodiment, the particle gun can be an electron gun, a ray emitter, etc. In actual use, when the particle gun is used at the beginning, the target material has not yet reached the melting temperature, and there may be splashing of the target material. In an optional embodiment, the electron beam evaporation device may also include: an isolation plate, which is arranged between the substrate 120 and the target material container. When the electron beam evaporation device is not in use and when the particle gun is used to start bombarding the target material, the isolation plate is placed to isolate the target material container and the substrate 120; after the melting degree of the target material reaches the standard, the isolation plate is removed and the evaporation operation is started.

[0073] In some embodiments, the positive voltage or negative voltage applied to the cooling roller ranges from 1 to 750 V, for example, 500 V or 600 V. The higher the voltage, the stronger the Coulomb force. Under the premise of ensuring safety, a high positive voltage or negative voltage should be used as much as possible.

[0074] In some embodiments, Figure 3 As shown, the cooling roller 110 includes a circulating cooling channel 111, and the circulating cooling channel 111 is configured to cool the outer surface of the cooling roller. The circulating cooling channel 111 has a channel inlet and a channel outlet. The cooling fluid enters from the channel inlet and flows out from the channel outlet after a cycle. In some embodiments, the circulating cooling channel 111 includes at least one of the following: a linear structure, a circular structure, a serpentine structure, or a spiral structure. The linear structure can reduce the vortex of the air (or water, oil) flow, and has little loss to the device structure, but the air (or water, oil) flow is short and the cooling effect is general; the serpentine structure can be designed to make the air (or water, oil) flow flow distance long enough to increase the cooling distance, but there is still an air (or water, oil) flow vortex. For the spiral structure, especially the circular spiral structure, the cooling distance can be increased, and there is basically no air (or water, oil) flow vortex, which is the best circulating cooling channel.

[0075] In some embodiments, the present disclosure further provides a cooling device, comprising a cooling roller as described in any one of the above embodiments, and a fluid input device configured to provide a cooling fluid to a circulating cooling channel in the cooling roller, wherein the cooling fluid comprises at least one of the following: pure water, impure water, or cold air flow.

[0076] According to a specific embodiment of the present disclosure, the present disclosure provides a cooling method for a substrate of a vacuum evaporation coating device, such as Figure 5As shown, the method comprises the following steps:

[0077] Step S501: providing a cooling roller, wherein the cooling roller is configured to carry a substrate to be coated;

[0078] Step S502: spraying a ceramic material mixture onto the surface of the cooling roller to form a ceramic coating, and as the cooling roller rotates, the substrate to be coated adheres to the surface of the ceramic coating;

[0079] Step S503: applying a positive voltage or a negative voltage to the cooling roller;

[0080] Step S504: arranging a guide roller so as to be located upstream or downstream of the cooling roller, and applying a voltage opposite to the voltage of the cooling roller to the guide roller;

[0081] Step S505: providing an evaporation device for evaporating a conductive layer onto the substrate to be coated carried by the cooling roller; wherein, in response to the conductive layer being evaporated onto the substrate to be coated, the conductive layer is tightly adsorbed on the cooling roller under the action of Coulomb force.

[0082] In some embodiments, before spraying the ceramic material mixture onto the surface of the cooling roller to form a ceramic coating, a ceramic coating mixture including an insulating material and a conductive material is prepared. For example, aluminum oxide and titanium oxide are mixed in a mass ratio of 5% to 30% to form the ceramic coating mixture, and the ceramic coating mixture is uniformly sprayed onto the surface of the cooling roller by plasma spraying to form a ceramic coating with a thickness of 200 to 500 μm and a roughness of Ra0.1 to Ra0.3.

[0083] In some embodiments, positive or negative voltages of opposite polarity are applied to the cooling roller and the guide roller, for example, the voltage range is 1-750V, such as 500V or 600V, so that the substrate to be coated on the guide roller is attached with the same voltage as the guide roller.

[0084] In some embodiments, the metal or alloy conductive material is evaporated and vaporized to the surface of the substrate to be coated, so that it instantly has the same voltage as the guide roller. At this time, the voltage polarity formed on the cooling roller is opposite to the voltage polarity of the conductive layer material. In this way, the opposite voltages on the metal conductive layer and the cooling roller generate Coulomb force, so that the substrate to be coated 120 will instantly adhere to the surface of the ceramic coating 160, and the heat generated by the metal vapor is quickly removed through the cooling flow channel of the cooling roller 110, avoiding burn damage to the substrate 120.

[0085] In some embodiments, providing a cooling roller includes: providing a circulating cooling channel at a portion of the cooling roller adjacent to the outer surface of the cooling roller, and inputting a fluid into the circulating cooling channel to cool the outer surface of the cooling roller, cooling the outer surface of the cooling roller through the circulating cooling channel, providing a liquid or gas cooling fluid, entering from an inlet of the circulating cooling channel and flowing out from an outlet, to achieve instant cooling of the metal vapor. The cooling fluid includes at least one of the following: pure water, impure water, or cold air flow.

[0086] In some embodiments, the above method can be used to perform multi-layer coating, for example, multiple metal or alloy film layers are successively coated on the surface of the substrate 120, and the coating method of each layer is the same, which will not be described in detail here. It has been verified experimentally that the multi-layer coating method of this method can avoid damage to the substrate and even the coated layer.

[0087] The present invention provides a vacuum evaporation coating equipment and cooling method, which adds a ceramic coating between the coated conductive layer and the cooling roller, applies voltage to the cooling roller of the ceramic coating, and applies a reverse voltage to the roller other than the cooling roller that is in contact with the substrate, so that the substrate is tightly adsorbed on the cooling roller through Coulomb force, thereby quickly dissipating the heat of the conductive layer.

[0088] The following is an introduction to substrate coating, cooling process and test data through specific examples:

[0089] Embodiment 1:

[0090] In this embodiment, a special ceramic coating is sprayed on the surface of the cooling roller of the vacuum evaporation coating equipment. The coating composition is a mixture of aluminum oxide and titanium oxide. The mixing ratio of aluminum oxide and titanium oxide is 10%. The spraying method is plasma thermal spraying. The spraying thickness is about 400μm, and the surface roughness Ra is controlled at about 0.25. The cooling roller is installed in the vacuum evaporation coating equipment, and a positive DC voltage is applied to the shaft end of the cooling roller. In the substrate transport path, a negative DC voltage is applied to any guide roller behind the cooling roller, and then the vacuum evaporation coating is carried out. When the aluminum vapor is evaporated onto the substrate film, the aluminum film is negatively charged and the cooling roller is positively charged. There is a ceramic coating between the cooling roller and the aluminum film. According to Coulomb's law, the aluminum film and the cooling roller will generate Coulomb force, so that the aluminum film is tightly adsorbed on the cooling roller, so that the film is fully in contact with the cooling roller, and the cyclic cooling of the cooling roller is used to take away a large amount of heat released by the instantaneous solidification of the aluminum vapor, thereby ensuring that the substrate film is not "scalded" or even "burned" during the coating process. By using this method for vacuum evaporation coating, an aluminum film with a thickness of 1μm can be formed on one side in a single pass without any "scalding" on the surface of the substrate.

[0091] Embodiment 2:

[0092] In this embodiment, a ceramic coating is sprayed on the surface of the cooling roller of the vacuum evaporation coating equipment. The coating composition is a mixture of copper oxide and titanium oxide. The mixing ratio of copper oxide and titanium oxide is 10%. The spraying method is plasma thermal spraying. The spraying thickness is about 400μm, and the surface roughness Ra is controlled at about 0.25. The cooling roller is installed in the vacuum evaporation coating equipment, and a positive DC voltage is applied to the shaft end of the cooling roller. In the substrate transport path, a negative DC voltage is applied to any guide roller behind the cooling roller, and then the vacuum evaporation coating is carried out. When the copper vapor is evaporated onto the substrate film, the copper film is negatively charged and the cooling roller is positively charged. There is a ceramic coating between the cooling roller and the copper film. According to Coulomb's law, the copper film and the cooling roller will generate Coulomb force, so that the copper film is tightly adsorbed on the cooling roller, so that the film is fully in contact with the cooling roller, and the cyclic cooling of the cooling roller is used to take away a large amount of heat released by the instantaneous solidification of the copper vapor, thereby ensuring that the substrate film is not "scalded" or even "burned" during the coating process. By using this method for vacuum evaporation coating, a copper film with a thickness of 1μm can be formed on one side in a single pass without any "scalding" on the surface of the substrate.

[0093] Comparative Example 1:

[0094] This comparative example is basically the same as Example 1, except that the surface of the cooling roller where the conductive layer is deposited is not provided with a ceramic coating. The experimental results show that the substrate film has multiple "scald" marks during the coating process, and the metal material penetrates the substrate and "burns" occurs at some locations. It is difficult to form a copper film on one side in a single pass by vacuum evaporation coating in this way.

[0095] The experimental conclusion shows that the cooling roller with a ceramic coating can make the substrate tightly adsorbed on the cooling roller, so that the substrate is fully in contact with the cooling roller, and the circulating cooling of the cooling roller can take away a large amount of heat released by the instantaneous solidification of the coated metal vapor, thereby ensuring that the substrate film will not be "scalded" or even "burned" during the coating process.

[0096] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them; although the present disclosure has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present disclosure, and they should all be included in the scope of the claims and specification of the present disclosure. In particular, as long as there is no structural conflict, the various technical features mentioned in the various embodiments can be combined in any way. The present disclosure is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of the claims.

Claims

1. A cooling roller, characterized in that: include: A ceramic coating is sprayed on the surface of the cooling roller, wherein the ceramic coating comprises a mixture of an insulating material and a conductive material.

2. The cooling roller according to claim 1, characterized in that The ceramic coating comprises a mixture of aluminum oxide and titanium oxide; wherein the mixing mass ratio of aluminum oxide to titanium oxide is 5%-30%.

3. The cooling roller according to claim 1, characterized in that The thickness of the ceramic coating is 200 to 500 μm; or, The roughness of the ceramic coating is Ra0.1-Ra0.

3.

4. The cooling roller according to claim 1, characterized in that The cooling roller comprises: a circulating cooling channel configured to cool the outer surface of the cooling roller.

5. The cooling roller according to claim 4, characterized in that The circulating cooling channel includes at least one of the following: a linear structure, a meandering structure, a serpentine structure or a spiral structure.

6. The cooling roller according to claim 1, characterized in that A positive voltage or a negative voltage is applied to the cooling roller, and the positive voltage or the negative voltage has a value range of 1-750V.

7. A cooling device, characterized in that: The cooling roller comprises the cooling roller described in any one of claims 1 to 6.

8. The cooling device according to claim 7, characterized in that: Also includes: The fluid input device is configured to provide cooling fluid to the circulating cooling channel in the cooling roller.

9. The cooling device according to claim 8, characterized in that: The cooling fluid includes at least one of the following: pure water, impure water or cold air flow.

10. An evaporation coating device, characterized in that: A cooling device comprising any one of claims 7 to 9.

11. The evaporation coating equipment according to claim 10, characterized in that: Also includes: A guide roller, located upstream or downstream of the cooling roller, the guide roller applying a voltage opposite to that of the cooling roller; An evaporation device, used for evaporating a conductive layer onto the substrate to be coated carried by the cooling roller; Wherein, in response to the conductive layer being evaporated onto the substrate to be coated, the conductive layer is tightly adsorbed on the cooling roller under the action of Coulomb force.

12. The evaporation coating equipment according to claim 11, characterized in that: The conductive layer includes a metal material or an alloy material.

13. The evaporation coating equipment according to claim 11, characterized in that: The substrate to be coated includes at least one of the following: a metal material, an alloy material or an organic material.

14. A method for cooling a substrate using an evaporation coating device, characterized in that: include: Providing a cooling roller, wherein the cooling roller is configured to carry a substrate to be coated; Spraying a ceramic material mixture onto the surface of the cooling roller by spraying to form a ceramic coating, and as the cooling roller rotates, the substrate to be coated adheres to the surface of the ceramic coating; applying a positive voltage or a negative voltage to the cooling roller; Arranging a guide roller so as to be located upstream or downstream of the cooling roller, and applying a voltage opposite to the voltage of the cooling roller to the guide roller; Providing an evaporation device for evaporating a conductive layer onto the substrate to be coated carried by the cooling roller; Wherein, in response to the conductive layer being evaporated onto the substrate to be coated, the conductive layer is tightly adsorbed on the cooling roller under the action of Coulomb force.

15. The method according to claim 14, characterized in that Before providing the cooling roller, the method includes preparing a ceramic coating mixture including an insulating material and a conductive material.

16. The method according to claim 14, characterized in that The ceramic coating comprises a mixture of aluminum oxide and titanium oxide, Wherein, the mixing mass ratio of the aluminum oxide and the titanium oxide is 5%-30%.

17. The method according to claim 14, characterized in that The thickness of the ceramic coating is 200 to 500 μm; or, The roughness of the ceramic coating is Ra0.1-Ra0.

3.

18. The method according to claim 14, characterized in that The provision of the cooling roller comprises: arranging a circulating cooling channel at a portion of the cooling roller adjacent to an outer surface of the cooling roller, and inputting a cooling fluid into the circulating cooling channel to cool the outer surface of the cooling roller.

19. The method according to claim 18, characterized in that The cooling fluid includes at least one of the following: pure water, impure water or cold air flow.

20. The method according to claim 14, characterized in that The conductive layer includes a metal material or an alloy material.

21. The method according to claim 14, characterized in that The substrate to be coated includes at least one of the following: a metal material, an alloy material or an organic material.

22. The method according to claim 14, characterized in that The positive voltage or negative voltage applied to the cooling roller has a value range of 1-750V.

23. The method according to claim 14, characterized in that The voltage applied to the guide roller ranges from 1 to 750V.

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