Intelligent human body infrared sensing module

Abstract

The invention discloses an intelligent human body infrared sensing module which comprises a metal shell, a metal base, a power pin, a signal pin, an infrared optical filter, an optical transmission clamping plate, a light diffusion sheet, a ceramic substrate, an infrared sensing body capacitor, a sensing body support capacitor, a circuit board and an intelligent digital signal processing chip. The LED lamp is characterized in that the light diffusing sheet, the circuit board and the intelligent digital signal processing chip are integrated in the metal shell and the metal base; the infrared inductor capacitor and the inductor support capacitor form a capacitive PIR pyroelectric sensor; the input end of the intelligent digital signal processing chip is connected with the inductor support capacitor, and induction control signals are output through a signal pin of the metal base. By optimizing the structural design and introducing the intelligent digital signal processing chip with the built-in A / D converter, the accuracy and sensitivity of human body detection are improved; and meanwhile, the anti-interference capability and durability of the module are enhanced.

Description

Technical Field

[0001] The invention relates to an intelligent human infrared sensing module, which is particularly suitable for the fields of smart home, security monitoring, etc., and is used for detecting infrared signals of the human body and performing intelligent processing. Background Art

[0002] With the development of science and technology, infrared sensing technology is increasingly used in the fields of IoT smart home, security monitoring, etc. Traditional infrared sensing modules have problems such as low sensitivity, poor anti-RF interference ability, and large background noise, which limit their application in complex environments. Therefore, it is of great significance to develop a highly sensitive and reliable intelligent human infrared sensing module. Summary of the invention

[0003] The present invention aims to provide an intelligent human infrared sensing module, which improves the accuracy and sensitivity of human body detection by optimizing the structural design and introducing an intelligent digital signal processing chip with a built-in A / D converter, while enhancing the module's anti-interference ability and durability.

[0004] Technical Solution

[0005] The intelligent human infrared sensor module of the present invention comprises the following components:

[0006] 1Metal casing: protects internal components and prevents external interference.

[0007] 2Metal base: supports the entire module and provides power pins and signal pins.

[0008] 3 Power pins and signal pins: connect to external circuits, provide power and output signals.

[0009] 4. Infrared filter: Filters light in non-infrared bands and improves infrared transmittance.

[0010] 5. Light channel card board: embedded with infrared filter and diffuser to guide infrared signal into the sensor capacitor.

[0011] 6 Diffuser: forms a curtain-type Fresnel lens to reflect and refract infrared signals.

[0012] 7 Ceramic substrate: printed with U-shaped infrared sensitive material to form an infrared sensing capacitor.

[0013] 8 Infrared sensor capacitor: It is composed of U-shaped infrared sensitive material sintered on a ceramic substrate.

[0014] 9 Induction body bracket capacitor: The plates connected to the infrared induction body capacitor are located at both ends of the ceramic substrate.

[0015] 10 Circuit board: integrated intelligent digital signal processing chip and other electronic components.

[0016] 11 Intelligent digital signal processing chip: The chip has a built-in A / D converter to filter out high-frequency and low-frequency interference generated by various factors, thereby improving the accuracy and sensitivity of human body detection.

[0017] Detailed description:

[0018] Module structure:

[0019] 1The diffuser, circuit board and intelligent digital signal processing chip are integrated in the metal housing and the metal base.

[0020] 2. The infrared filter and the diffuser are embedded on the upper and lower surfaces of the optical card, and the external infrared signal is input to the surface of the infrared sensor capacitor plate through the optical card.

[0021] 3 The induction body bracket capacitor is connected to the plates of the infrared induction body capacitor and is located at both ends of the ceramic substrate to form a capacitive PIR pyroelectric sensor.

[0022] 4 The surface of the diffuser has semicircular ripples, forming a curtain-type Fresnel lens, which reflects and refracts the infrared signal to the sensing surface of the capacitive PIR pyroelectric sensor.

[0023] Key components:

[0024] 1 Infrared sensor capacitor: U-shaped infrared sensitive material is printed on the ceramic substrate, and the material is sintered on the ceramic substrate to form an infrared sensor capacitor. The interdigital spacing of the U-shaped symmetrical structure is 0.2mm to 0.8mm to optimize the capacitor performance.

[0025] 2. Inductive support capacitor: rectangular structure, concave in the middle, electrodes at both ends are respectively connected to the infrared inductive capacitor plate and the auxiliary fixing end, and welded on the ceramic substrate. The connecting electrodes are made of highly conductive materials (such as copper or silver) to improve the reliability of electrical connection.

[0026] 3 Intelligent digital signal processing chip: 8-pin SMD package, located directly below the ceramic plate of the sensor, with intelligent control functions such as sensitivity adjustment, trigger mode control, delay time and ambient light monitoring. The pins are gold-plated to improve corrosion resistance and conductivity.

[0027] Manufacturing method

[0028] Step 1: Grind the pyroelectric inductor ceramic powder, filter it with a 500-mesh steel mesh, and prepare the inductor slurry.

[0029] Step 2: Print a conductive paste with a thickness of 0.5-12 μm on a ceramic plate to make in-body electrodes.

[0030] Step 3: Print the pyroelectric inductor bottom protective film on the ceramic and dry and cure it at 160°C.

[0031] Step 4: Print a pyroelectric inductor ceramic slurry with a thickness of 0.05-0.15 mm on the bottom protective film to form a U-shaped capacitor plate.

[0032] Step 5: Sintering the ceramic substrate of the pyroelectric inductor at a temperature of 1000°C-1200°C for 6 hours.

[0033] Step 6: Sputter metal on the surface of the U-shaped capacitor plate to form a silver electrode.

[0034] Step 7: polarize the ceramic pyroelectric inductor, polarization temperature: 135°C, voltage: 1.5-6KV / mm, time: 5-10min.

[0035] Step 8: Make the inductor end electrodes and weld the inductor bracket capacitor.

[0036] Step 9: Laser cut the ceramic plate, clean the surface of the sensor, and form a pyroelectric ceramic sensitive unit chip.

[0037] Step 10: Solder the pyroelectric ceramic sensor chip to the circuit board, located in the center of the circuit board.

[0038] Other features

[0039] 1. Metal shell: There is a positioning end on the brim, which is located in the center of the identification end of the metal base device. The metal shell is welded and sealed in a closed environment, and the sensor is simultaneously filled with protective inert gas (such as argon or nitrogen). The metal shell is made of anti-corrosion material to improve durability.

[0040] 2 Infrared filter: Use coated single crystal silicon wafer to improve infrared transmittance.

[0041] 3 Diffuser: There are semicircular grooves on the surface. The upper and lower pieces are deflected 90° and compounded together. The internal horizontal and vertical directions form staggered corrugated reflective surfaces. The spacing of the corrugated reflective surfaces is 0.1mm to 0.5mm, which helps to improve the reception efficiency of infrared signals.

[0042] Beneficial effects:

[0043] 1: High sensitivity: New ferroelectric ceramic composite materials and special microstructure processing significantly improve infrared absorption efficiency.

[0044] 2: High stability: Adaptive temperature compensation circuit ensures stable performance under different ambient temperatures.

[0045] 3: Strong anti-interference ability: The capacitive PIR pyroelectric sensor and signal processing chip are shielded in the shell and tube, which has stronger anti-RF interference ability.

[0046] 4: Chip wide voltage, low power consumption: power supply voltage 1.2-5V, current 10uA. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] Figure 1 : Schematic diagram of the overall external structure of the intelligent human infrared sensing module.

[0048] Figure 2 : Schematic diagram of the power supply and signal control pin structure.

[0049] Figure 3 : Schematic diagram of the infrared filter position structure of the metal casing.

[0050] Figure 4 : Schematic diagram of the position structure of the diffuser and infrared filter.

[0051] Figure 5 : One of the internal structure diagrams of the intelligent human infrared sensing module.

[0052] Figure 6 : Schematic diagram of the U-shaped infrared sensor capacitor and the sensor bracket capacitor structure.

[0053] Figure 7 : The second schematic diagram of the internal structure of the intelligent human infrared sensing module.

[0054] Figure 8 : Packaging structure and circuit diagram of intelligent digital signal processing chip.

[0055] Fig. 9 : Trigger mode and output level timing diagram of the intelligent human infrared sensing module. DETAILED DESCRIPTION

[0056] The present invention relates to an intelligent human infrared sensing module, which is particularly suitable for the fields of smart home, security monitoring and industrial automation. The module realizes efficient capture and accurate processing of infrared signals through a highly sensitive capacitive PIR pyroelectric sensor and an intelligent digital signal processing chip with built-in A / D converter function.

[0057] See also Figure 1-Figure 9 , which is a specific embodiment of the intelligent human infrared sensing module described in this application.

[0058] The intelligent human infrared sensing module in this embodiment includes a metal shell 3, a metal shell brim edge positioning end 3-1, and a metal shell top window 3-2; a metal base 2, a metal base identification end 2-1; power pins 1-5 and 1-6, circuit board pads 1-1-1 and 1-3-1; signal output pins REL 1-4, signal input pin ONE 1-1, signal input pin SENS 1-2, signal input pin ONTIME 1-3, and circuit board pad 1-2-1; an infrared filter 10, an optical pass card 9, a diffuser 8, a ceramic substrate 6, U-shaped infrared sensor capacitors 7-1 and 7-2, sensor bracket capacitors 5-1 and 5-2, a circuit board 4, a resistor and capacitor element 11, and a digital signal processing chip 12.

[0059] Structure composition:

[0060] 1Metal shell and base:

[0061] See also Figure 1-Figure 3 The metal shell 3 and the metal base 2 provide mechanical support and protection, and have good electromagnetic shielding performance. There is a positioning end 3-1 on the brim of the metal shell, which is located in the center of the device identification end 2-1 of the metal base, which is convenient for installation and identification. The metal shell is welded and sealed in a closed environment, and a protective inert gas (such as argon or nitrogen) is simultaneously filled into the sensor to prevent internal components from moisture and oxidation, thereby extending the service life. The metal shell is made of anti-corrosion materials (such as stainless steel or aluminum alloy), which improves durability and adapts to various harsh environments.

[0062] 2 Power pins and signal pins:

[0063] Power pins 1-5 and 1-6 are used to connect external circuits and provide power supply; signal pins include:

[0064] REL(1-4): Signal output pin, output control signal.

[0065] ONE(1-1): Signal input pin, receiving the initial trigger signal.

[0066] SENS(1-2): Sensitivity adjustment pin, which adjusts the sensitivity by setting different voltages through an external resistor network.

[0067] ONTIME (1-3): Delay time adjustment pin, which determines the time of outputting high level after triggering.

[0068] 3 Infrared filter and diffuser:

[0069] See also Figure 4 and Figure 6, the infrared filter 10 and the diffuser 8 are used to filter and disperse the infrared signal respectively, so as to improve the sensing accuracy. The infrared filter 10 adopts the coated single crystal silicon wafer, which significantly improves the infrared transmittance. The diffuser 8 has a semicircular groove on its surface, and the upper and lower pieces are deflected 90° and compounded together, forming an interlaced corrugated reflection surface in the horizontal and vertical directions, with a spacing of 0.1mm to 0.5mm, which helps to improve the reception efficiency of the infrared signal. These components are embedded in the top window of the metal shell, fixed by black resin glue and encapsulated in the sensor to ensure long-term stable working performance.

[0070] 4Ceramic substrate and infrared sensor capacitor:

[0071] See also Figure 6 and Figure 8 , the ceramic substrate 6 carries a U-shaped infrared sensitive material, which is sintered to form infrared sensing body capacitors 7-1 and 7-2. The material width is 0.5mm to 2mm, and the thickness is 0.05-0.15mm, which is optimized to achieve the best performance. The U-shaped structure helps to increase the surface area of ​​the material, thereby enhancing the infrared absorption capacity. The sensing body bracket capacitors 5-1 and 5-2 support the infrared sensing body capacitors and are electrically connected to them. They are located at both ends of the ceramic substrate. The two bracket capacitors have the same capacity. The symmetrical U-shaped infrared ceramic body and the bracket capacitor 5 form a new set of sensing capacitors 5-1U and 5-2U, which makes the reversely connected capacitor plates asymmetric to enhance the sensitivity of the sensing signal.

[0072] 5 Circuit board and digital signal processing chip:

[0073] See also Figure 5 and Figure 8 The circuit board 4 is made of glass fiber or ceramic material with a thickness of 0.1-1.6mm, connecting the power pin and the signal pin. The digital signal processing chip 12 is located in the center of the circuit board and adopts a low-noise design to improve the signal amplification effect. The chip 12 is an 8-pin SMD package with a built-in A / D converter, which can analyze background noise in real time, filter high-frequency and low-frequency interference, and improve the accuracy and sensitivity of human body detection. The chip functions include:

[0074] OEN (photoresistor enable terminal): controls the light sensor.

[0075] SENS (sensitivity pin): adjust the sensitivity.

[0076] ONTIME (trigger delay time adjustment pin): select 16 levels of delay time.

[0077] REL (sensor output pin): output TTL high and low levels.

[0078] VSS (power ground).

[0079] VDD (sensor power supply pin).

[0080] Manufacturing method:

[0081] 1. Grinding and preparing slurry:

[0082] Grind the pyroelectric inductor ceramic powder, filter it with a 500-mesh steel mesh, and prepare the inductor slurry. Introduce rare earth element doping (such as lanthanum and cerium) to improve the performance and stability of pyroelectric materials.

[0083] 2. Printing conductive paste and protective film:

[0084] Print 0.5-12μm thick conductive paste on the ceramic plate to make the inductive body electrodes. Print the pyroelectric inductive body bottom protective film on the ceramic and dry and solidify at 160℃.

[0085] 3. Forming U-shaped capacitor plates:

[0086] Print pyroelectric inductor ceramic slurry with a thickness of 0.05-0.15mm on the bottom protective film to form a U-shaped capacitor plate. 4 Sintering ceramic substrate:

[0087] The ceramic substrate of the pyroelectric inductor is sintered at a temperature of 1000°C-1200°C for 6 hours.

[0088] 5. Metal sputtering and polarization treatment:

[0089] Metal sputtering is performed on the surface of the U-shaped capacitor plate to form a silver electrode. The ceramic pyroelectric inductor is polarized at a temperature of 135°C, a voltage of 1.5-6KV / mm, and a time of 5-10 minutes.

[0090] 6 welding electrodes and laser cutting:

[0091] Make the inductor end electrodes, weld the inductor bracket capacitors, laser cut the ceramic plate, clean the inductor surface, and form the pyroelectric ceramic sensitive unit chip.

[0092] 7. Soldering Chips:

[0093] The pyroelectric ceramic sensitive element chip is soldered on the circuit board and located in the center of the circuit board.

[0094] Working principle:

[0095] 1. Infrared signal acquisition:

[0096] The infrared filter 10 and the diffuser 8 work together to guide the external infrared signal to the sensor capacitor plate. The diffuser is designed to effectively disperse and reflect infrared rays, increasing the sensor's ability to receive infrared rays from different directions.

[0097] 2Capacitance change detection:

[0098] The capacitive PIR pyroelectric sensor composed of the infrared sensing body capacitor and the sensing body bracket capacitor detects the capacitance change and generates an electrical signal. The U-shaped symmetrical structure and the specific interdigital spacing design can optimize the capacitance performance and improve the response speed and sensitivity of the sensor.

[0099] 3Signal Processing:

[0100] The digital signal processing chip 12 receives the electrical signal, analyzes and processes it through the built-in intelligent algorithm, and finally outputs the control signal. The chip has a built-in 16-bit high-precision AD converter, which effectively filters low-frequency and high-frequency noise interference through a secondary bandpass filter. All signal processing is completed in the shielded tube shell, which has a stronger ability to resist radio frequency interference.

[0101] 4Temperature compensation:

[0102] The temperature compensation circuit ensures stable sensing performance under different ambient temperatures. The adaptive temperature compensation circuit automatically adjusts the sensing threshold according to the ambient temperature to ensure stable operation of the sensor over a wide temperature range.

[0103] Experimental data and test results: 1 Sensitivity test:

[0104] By changing the voltage on the SENS pin, the sensing distance under different sensitivity settings was tested. The results showed that under different sensitivity settings, the sensing distance ranged from the shortest 1 meter to the longest 10 meters, meeting the needs of different application scenarios.

[0105] 2. Delay time test:

[0106] By adjusting the input voltage of the ONTIME pin, the output high level duration under different delay time settings is tested. The results show that the delay time can be flexibly adjusted from 1 second to 3000 seconds to meet various application requirements.

[0107] 3. Anti-interference ability test:

[0108] The test results in a strong electromagnetic interference environment show that the module has strong anti-RF interference capability and can work stably in a complex electromagnetic environment.

[0109] 4 Temperature stability test:

[0110] The test results were carried out in the temperature range of -25℃ to 85℃, and the temperature compensation circuit can effectively maintain the stability of the sensing performance with an error range within ±5%.

[0111] Application examples:

[0112] 1Smart Home:

[0113] Applied to smart door locks, smart lighting systems, etc., to achieve automatic sensing and control and improve life convenience.

[0114] 2 Security monitoring:

[0115] Used for intrusion detection, personnel flow monitoring, etc. to improve the level of security prevention.

[0116] 3Industrial Automation:

[0117] Used for personnel detection and equipment control on the production line to improve production efficiency.

[0118] It can be seen from the above embodiments that the beneficial effects of the present invention include:

[0119] 1: High sensitivity: New ferroelectric ceramic composite materials and special microstructure processing significantly improve infrared absorption efficiency.

[0120] 2: High stability: Adaptive temperature compensation circuit ensures stable performance under different ambient temperatures.

[0121] 3: Strong anti-interference ability: The capacitive PIR pyroelectric sensor and signal processing chip are shielded in the shell and tube, which has stronger anti-RF interference ability.

[0122] 4: Chip wide voltage, low power consumption: power supply voltage 1.2-5V, current 10uA.

[0123] The above description shows and describes several preferred embodiments of the present application, but as mentioned above, for ordinary technicians in this field, the specific embodiments are only illustrative descriptions of the present invention. Obviously, the specific implementation of the present invention is not limited to the above-mentioned methods. As long as various non-substantial improvements are made using the method concepts and technical solutions of the present invention, or the concepts and technical solutions of the present invention are directly applied to other occasions without improvement, they are all within the scope of protection of the present invention.

Claims

1. An intelligent human infrared sensing module, comprising: ●Metal housing and base; ●Power pins and signal pins; ●Infrared filter, light pass card, diffuser; ●Ceramic substrate and U-shaped infrared sensitive material; ●Infrared sensor capacitor and sensor bracket capacitor; ● Circuit board and intelligent digital signal processing chip; characterized by: ●The diffuser, circuit board and intelligent digital signal processing chip are integrated in the metal housing and base; ●U-shaped infrared sensitive material is printed on the ceramic substrate to form an infrared sensing body capacitor; ●The optical card is embedded with infrared filters and diffusers, and the external infrared signal is input to the surface of the inductive capacitor plate through the optical card; ●The induction body bracket capacitor is connected to the plate of the infrared induction body capacitor to form a capacitive PIR pyroelectric sensor; ●The diffuser has semicircular ripples, forming a curtain-type Fresnel lens; ●The intelligent digital signal processing chip has a built-in A / D converter, which is connected to the induction body bracket capacitor to output the induction control signal.

2. The sensing module according to claim 1, characterized in that: ●There is a rectangular ceramic substrate on the inductor support capacitor; ●The width of the U-shaped infrared sensitive material is 0.5mm to 2mm, and the thickness is 0.05mm to 0.15mm; ●The intelligent digital signal processing chip can analyze background noise in real time and filter out high-frequency and low-frequency interference.

3. The sensing module according to claim 1, characterized in that: ●The infrared filter and diffuser are located on the upper and lower sides of the optical card, embedded in the top window of the metal shell, and fixed by black resin glue; ●The infrared filter uses coated single crystal silicon wafer to improve infrared transmittance.

4. The sensing module according to claim 1, characterized in that: ●The diffuser has a semicircular groove on its surface, and the upper and lower pieces are combined together by 90° deflection; ●The spacing between the corrugated reflective surfaces is 0.1mm to 0.5mm, which improves the efficiency of infrared signal reception.

5. The sensing module according to claim 1, characterized in that: ●The digital signal processing chip is an 8-pin SMD package, located directly below the ceramic substrate; ●The pins are gold-plated to improve corrosion resistance and conductivity; ●The chip has the functions of sensitivity adjustment, trigger mode control, delay time and ambient light monitoring.

6. The sensing module according to claim 1, characterized in that: ●The infrared sensor capacitor is a U-shaped symmetrical structure, with the fingers distributed in the center of the ceramic substrate; ●The interdigital spacing is 0.2mm to 0.8mm to optimize capacitor performance.

7. The sensing module according to claim 1 or 4, characterized in that: ●The U-shaped symmetrical capacitor plate is printed with a protective film underneath and sintered on a ceramic substrate; ●The middle plate has a rectangular groove, and the two side plates have semicircular grooves in the middle; ●Use laser etching technology to form precise microstructures to enhance mechanical strength and stability; ●The protective film is made of materials such as silicon nitride or zirconium oxide.

8. The sensing module according to claim 1, characterized in that: ●The induction body bracket capacitor is rectangular, concave in the middle, and the electrodes at both ends are connected to the infrared induction body capacitor plate and the auxiliary fixing end respectively; ●The connecting electrodes are made of highly conductive materials (such as copper or silver) to improve the reliability of electrical connection.

9. The sensing module according to claim 1, characterized in that: ●There is a positioning end on the brim of the metal shell, which is located in the center of the identification end of the metal base device; ●The metal shell is welded and sealed in a closed environment and filled with protective inert gas (such as argon or nitrogen); ●The metal shell is made of anti-corrosion material to improve durability.

10. The sensing module according to claim 1, characterized in that: The manufacturing method of the capacitive PIR pyroelectric sensor comprises the following steps: ● Grind the pyroelectric inductor ceramic powder, filter it with a 500-mesh steel mesh, and prepare the slurry; ●Printing conductive paste on ceramic plates to make electrodes; ●Print the bottom protective film and dry and solidify it; ● Printing pyroelectric inductor ceramic slurry to form U-shaped capacitor plates; ●Sintering ceramic substrate, temperature 1000℃-1200℃, time 6 hours; ●Metal sputtering to form silver electrodes; ●Polarization treatment, polarization temperature 135℃, voltage 1.5~6KV / mm, time 5-10min; ● Make terminal electrodes and weld the inductor support capacitors; ●Laser cutting of ceramic plates, cleaning of the surface, and formation of sensitive unit chips; ●Solder the sensitive unit chip on the circuit board, located in the center of the circuit board.

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