Temperature control method and constant temperature system
By adjusting the temperature and flow rate of the heat exchange fluid in a constant temperature system, the problems of fast heat production rate of high-power lasers and poor adjustment accuracy of existing temperature control systems are solved, and more efficient temperature regulation and laser wavelength stability are achieved.
Patent Information
- Application Number
- CN202510316689.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-18
- Publication Date
- 2025-04-18
- Estimated Expiration
- 2045-03-18
AI Technical Summary
High-power high-thermal lasers have problems with large heat production and fast heat production rates. The existing temperature control system has a low regulation rate and poor accuracy, which seriously restricts the stability of the laser wavelength.
A temperature control method and a constant temperature system are provided, and by adjusting the temperature and flow rate of the heat exchange fluid, using the first circulation pipe and the cooling mechanism, the efficient heat exchange and temperature regulation of the device to be processed is achieved.
The accuracy and adjustment range of temperature adjustment are improved, making the temperature of the device to be processed more stable, and the wavelength stability of the laser is improved.
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Figure CN119847252A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of laser temperature control, and in particular to a temperature control method and a constant temperature system. Background Art
[0002] High-power, high-heat lasers have the problem of generating large amounts of heat at a fast rate. A fast temperature control system with a wide adjustment range enables the laser to maintain a constant operating temperature.
[0003] At present, water cooling is generally used for high-power laser equipment. The heat of the laser is taken out through contact heat dissipation and conducted to the water cooling box. The water cooling box reduces the water temperature through air cooling and then circulates it to the laser. However, this system has the characteristics of low adjustment rate and poor adjustment accuracy, which seriously restricts the stability of the laser wavelength. TEC, as a mainstream fast adjustment device, solves the above problems but has a low adjustment range, poor adjustment ability for high temperature difference, and long-term reliability risks. Summary of the invention
[0004] The object of the present invention is to provide a temperature control method and a constant temperature system, which can adjust the temperature and flow rate of a heat exchange fluid and improve the accuracy and adjustment range of the temperature adjustment.
[0005] In a first aspect, the present invention provides a temperature control method, which is applied to a constant temperature system, wherein the constant temperature system comprises a first circulation pipeline, wherein a heat exchange fluid is provided in the first circulation pipeline, and wherein the heat exchange fluid is used to perform heat exchange treatment on a device to be treated, comprising the steps of: Obtain the temperature n1 of the heat exchange fluid at the location where the heat exchange with the device to be processed is performed; According to n1 and n2, the temperature and flow rate of the heat exchange fluid are adjusted so that n1 approaches n2, where n2 is the set temperature.
[0006] Furthermore, when k≥a2 or k≤a1, the heat exchange fluid flow rate is adjusted so that n1 approaches n2; When a1<k<0, or 0<k<a2, adjust the temperature of the heat exchange fluid so that n1 approaches n2; Among them, a1 and a2 are set values, k= .
[0007] Furthermore, when k≥a2 or k≤a1, the step of adjusting the heat exchange fluid flow rate so that n1 approaches n2 is specifically as follows: When k≥a2 or k≤a1, and the current flow rate is within the set range of flow regulation, adjust the heat exchange fluid flow rate so that n1 approaches n2; When k≥a2 or k≤a1, and the current flow rate reaches the critical value of the set range of flow rate regulation, the heat exchange liquid temperature is adjusted so that n1 approaches n2.
[0008] Furthermore, in the step of adjusting the flow rate of the heat exchange fluid, the flow rate is changed in stages according to the adjustment interval time t in an increasing or decreasing manner.
[0009] Further, when a2≤k<b2, or b1<k≤a1, adjust t to t1; When k≥b2 or k≤b1, adjust t to t2; Among them, b1<a1<0<a2<b2; t1>t2.
[0010] Furthermore, the temperature control method further comprises the steps of: The heat exchange liquid is cooled by a cooling mechanism, wherein the cooling mechanism comprises a second circulation pipeline, wherein the second circulation pipeline has a cooling liquid therein, and the cooling liquid is used to exchange heat with the heat exchange liquid after heat exchange with the device to be processed; The step of using the cooling mechanism to cool the heat exchange fluid comprises: When d1≤k≤d2, the flow rate of the coolant in the second circulation pipeline is controlled to remain unchanged; When k>d2, the flow rate of the coolant in the second circulation pipeline is increased; When k<d1, the flow rate of the coolant in the second circulation pipeline is reduced; Among them, d1<0<d2; And / or, the step of cooling the heat exchange fluid by using a cooling mechanism comprises: Step 1. After receiving the adjustment instruction, increase or decrease the flow value of the coolant in the direction of the set range according to the current flow value of the coolant; Step 2. At an interval T, detect the flow value of the coolant in the second circulation pipeline; Step 3. When the detected flow value is within the set range, stop adjusting the flow of the second heat exchange fluid; When the detected flow value is not within the set range, the flow value of the coolant is increased or decreased in the direction toward the set range and then step 2 is executed.
[0011] Furthermore, when k≥c2 or k≤c1, the flow rate and temperature of the heat exchange fluid are adjusted simultaneously, wherein c1<b1<a1<0<a2<b2<c2.
[0012] Furthermore, when k ≥ c2, the flow rate of the heat exchange fluid is adjusted to the maximum, and the heating temperature of the heat exchange fluid is adjusted to the minimum; When k≤c1, adjust the flow rate of the heat exchange fluid to the minimum and adjust the heating temperature of the heat exchange fluid to the maximum.
[0013] Furthermore, the heat exchange fluid is heated by a heating mechanism; the flow rate of the heat exchange fluid is adjusted by a pump body; The temperature control method includes the following steps before obtaining the temperature n1 of the heat exchange fluid at the location where the device to be processed is subjected to heat exchange: Reset the output range and initial value of the heating mechanism; Reset the output frequency range, initial frequency and initial flow of the inverter of the pump body.
[0014] In a second aspect, the present invention provides a constant temperature system for implementing the above-mentioned temperature control method, comprising: a liquid storage tank, a controller and a heat exchange structure, wherein the liquid storage tank and the heat exchange structure are connected through a first circulation pipeline so that the heat exchange liquid circulates between the liquid storage tank and the heat exchange structure; In the first circulation pipeline, a section of the pipeline where the heat exchange liquid flows from the liquid storage tank to the heat exchange structure is provided with a pump body, a heating mechanism and a flow sensor, the pump body is used to make the heat exchange liquid in the liquid storage tank flow into the heat exchange structure, the flow sensor is used to detect the flow of the heat exchange liquid; the heating mechanism is used to heat the heat exchange liquid; In the first circulation pipeline, a first temperature sensor is provided in a section of the pipeline where the heat exchange liquid flows from the heat exchange structure to the liquid storage tank, for obtaining the temperature n1 of the heat exchange liquid at the location where the heat exchange is performed on the device to be processed; The controller is electrically connected to the pump body, the heating mechanism, the flow sensor and the first temperature sensor respectively. The controller adjusts the flow of the heat exchange fluid through the pump body and the temperature of the heat exchange fluid through the heating mechanism according to n1 and n2 so that n1 approaches n2.
[0015] The beneficial effects of the embodiments of the present invention are: In this solution, starting from the temperature and flow of the heat exchange fluid, the temperature and flow of the heat exchange fluid are adjusted according to n1 and n2, which can improve the accuracy and range of temperature regulation and make n1 closer to n2. Integrating the temperature and flow control logic into a control system can more effectively coordinate the relationship between the two, thereby improving the accuracy and range of temperature regulation. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0017] Figure 1 A flow chart of a temperature control method provided by an embodiment of the present invention; Figure 2 A schematic diagram of a constant temperature system provided in an embodiment of the present invention.
[0018] Icons: 100-liquid storage tank; 110-automatic liquid filling port; 120-manual liquid filling port; 130-liquid level sensor; 140-exhaust port; 150-liquid discharge port; 200-pump body; 300-heating mechanism; 400-filter; 500-flow sensor; 610-first temperature sensor; 620-second temperature sensor; 710-first pressure sensor; 720-second pressure sensor; 810-first valve body; 820-second valve body; 900-cooling mechanism; 910-heat exchanger; 920-second circulation pipeline. DETAILED DESCRIPTION
[0019] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.
[0020] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0021] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.
[0022] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the product of the invention is usually placed when in use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.
[0023] In addition, the terms "horizontal", "vertical" and the like do not mean that the components are required to be absolutely horizontal or suspended, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.
[0024] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0025] like Figure 1 and Figure 2 As shown, the temperature control method provided by the present invention is applied to a constant temperature system, and the constant temperature system can perform constant temperature treatment on a device to be treated, such as a laser. The working characteristics of a laser are extremely sensitive to temperature. Temperature changes can cause the output power and wavelength of the laser to drift, thereby affecting its performance and reliability.
[0026] The constant temperature system comprises a first circulation pipeline, in which a heat exchange liquid is arranged. The heat exchange liquid may be a fluorinated liquid. The heat exchange liquid is used to perform heat exchange treatment on the device to be treated, thereby changing the temperature around the device to be treated.
[0027] The method comprises the steps of: The temperature n1 of the heat exchange fluid at the location where heat exchange with the device to be processed is performed is obtained.
[0028] In this embodiment, the first circulation pipeline includes a liquid inlet pipeline and a liquid return pipeline. One end of the liquid inlet pipeline is connected to the liquid storage tank 100, and the other end is used to connect to the inlet of the heat exchange pipeline of the heat exchange structure; one end of the liquid return pipeline is connected to the liquid storage tank 100, and the other end is used to connect to the outlet of the heat exchange pipeline. The liquid storage tank 100 stores heat exchange liquid. A first temperature sensor 610 is provided on the liquid return pipeline, and the first temperature sensor 610 is used to detect the temperature of the heat exchange liquid flowing out of the heat exchange pipeline of the heat exchange structure. The temperature directly reflects the temperature of the surrounding environment of the device to be processed, that is, the temperature n1 of the heat exchange liquid at the place where the device to be processed is subjected to heat exchange.
[0029] According to n1 and n2, the temperature and flow rate of the heat exchange fluid are adjusted so that n1 approaches n2, where n2 is the set temperature.
[0030] Starting from the liquid storage tank 100 , a pump body 200 , a heating mechanism 300 and a flow sensor 500 are sequentially arranged on the liquid inlet pipeline.
[0031] After the heating mechanism 300 is working, the temperature of the heat exchange fluid may change. Specifically, when other parameters remain unchanged, the heating power of the heating mechanism 300 increases, and n1 increases; conversely, when the heating power of the heating mechanism 300 decreases, n1 decreases. After the flow rate changes, the contact time between the heat exchange fluid and the heat exchange structure changes, and n1 changes. Specifically, when other parameters remain unchanged, when the power of the pump body 200 increases, the flow rate increases, and n1 decreases; conversely, when the power of the pump body 200 decreases, the flow rate decreases, and n1 increases.
[0032] According to the regulation performance of flow rate and temperature, the pump body 200 can be used to roughly adjust n1 so that n1 tends to n2, and then the heating mechanism 300 can be used to finely adjust n1 so that the difference between n1 and n2 tends to zero. When k≥a2 or k≤a1, the heat exchange liquid flow rate is adjusted to make n1 tend to n2; when a1<k<0, or 0<k<a2, the heat exchange liquid temperature is adjusted to make n1 tend to n2; wherein, k=
[0033] a1 and a2 are both set values, which are set before the system is started according to the performance requirements of the device to be thermostatically treated.
[0034] Specifically, when k≤a1, the flow rate of the heat exchange fluid is reduced to increase n1; When a1<k<0, the heating mechanism 300 enables PID negative feedback to increase the power of the heating mechanism 300 to increase n1; When 0<k<a2, the heating mechanism 300 enables PID negative feedback to reduce the power of the heating mechanism 300 to reduce n1; When k≥a2, increase the flow rate of the heat exchange fluid to reduce n1.
[0035] However, when k≥a2 or k≤a1, and the current flow rate reaches the critical value of the set range of flow rate regulation, the heat exchange liquid temperature is adjusted so that n1 approaches n2.
[0036] That is to say, after the flow rate is adjusted, the maximum or minimum flow rate has been reached and the flow rate cannot be adjusted any further, and the value of k is still k≥a2 or k≤a1, then the heating mechanism 300 is introduced to cooperate with the flow rate to further change n1. Specifically, when k≥a2 and the flow rate of the heat exchange fluid is the largest, the power of the heating mechanism 300 is reduced to reduce n1. When k≤a1 and the flow rate of the heat exchange fluid is the smallest, the power of the heating mechanism 300 is increased to increase n1. When the current flow rate is within the set range of the flow rate adjustment, it still relies solely on flow adjustment to make n1 approach n2.
[0037] In the step of adjusting the flow rate of the heat exchange fluid, the flow rate is changed in stages according to the adjustment interval time t in an increasing or decreasing manner.
[0038] In this embodiment, the pump body 200 is a magnetic pump, and its power regulation is a step-by-step regulation, and the regulation interval time is t, which can be changed. When the power of the magnetic pump completes a change, the system needs a certain reaction time, that is, when the power of the magnetic pump changes, the temperature detected by the first temperature sensor 610 will not change immediately, and time t is reserved for reaction. At this time, the temperature detected by the first temperature sensor 610 is closer to the actual n1. If k≥a2 or k≤a1 within the t time, the range of k does not change, indicating that the current pump body 200 power is insufficient and needs to be changed; and within the t time, the range of k has changed, that is, a1<k<0, or 0<k<a2, indicating that it is not necessary to adjust through the flow, and then the heating mechanism 300 can be used for adjustment. If the above-mentioned adjustment method is not adopted, but the power of the pump body is continuously changed, the temperature detected by the first temperature sensor 610 is much different from the actual n1, and the flow rate will be over-regulated.
[0039] When a2≤k<b2, or b1<k≤a1, t is adjusted to t1; when k≥b2 or k≤b1, t is adjusted to t2; wherein, b1<a1<0<a2<b2; t1>t2.
[0040] Assuming that the current adjustment interval time t=3s, when it is detected that the temperature difference between n1 and n2 is small, the time setting of the timer of the magnetic pump is adjusted, that is, the adjustment interval time t=4s, thereby increasing the reaction time and improving the accuracy; when it is detected that the temperature difference between n1 and n2 is large, the time setting of the timer of the magnetic pump is adjusted, that is, the adjustment interval time t=2s, shortening the reaction time, speeding up the temperature adjustment speed, and making n1 approach n2 faster.
[0041] The step of adjusting the temperature of the heat exchange fluid comprises: The heat exchange fluid is heated by the heating mechanism 300 .
[0042] The initial temperature of the heat exchange liquid in the liquid storage tank 100 is lower than n2, and the heating mechanism 300 can make n1 approach n2.
[0043] The constant temperature system may further include a cooling mechanism 900, wherein the cooling mechanism 900 includes a second circulation pipe 920, wherein the second circulation pipe 920 has a cooling liquid, and the cooling liquid may be water. The cooling liquid is used to exchange heat with the heat exchange liquid after heat exchange with the device to be processed. The cooling mechanism 900 cools down the heat exchange liquid flowing out of the heat exchange structure, and after cooling, the heat exchange liquid returns to the liquid storage tank 100 to prevent the temperature of the heat exchange liquid in the liquid storage tank 100 from being too high.
[0044] The flow rate of the coolant can be adjusted automatically or manually.
[0045] In one practicable manner (automatically), the step of cooling the heat exchange fluid by using the cooling mechanism 900 includes: When d1≤k≤d2, d1<0<d2, for the cooling mechanism, k is within the preset temperature range and there is no need to adjust the coolant flow rate.
[0046] When k>d2, the flow rate of the coolant in the second circulation pipeline 920 is increased, wherein the adjustment method can be staged adjustment, that is, at a certain time interval T (set value), check whether d1≤k≤d2 is satisfied. If not, continue to increase a certain cooling water flow rate. If satisfied, no further adjustment is made.
[0047] When k<d1, the flow rate of the coolant in the second circulation pipeline 920 is reduced, wherein the adjustment method can be staged adjustment, that is, every certain time T (set value), check whether d1≤k≤d2 is satisfied, if not, continue to reduce a certain cooling water flow rate, if satisfied, no longer adjust. The action of the cooling mechanism is associated with the temperature of the first coolant, so that the cooling mechanism can work at the most suitable flow rate.
[0048] In another practicable manner (manual), the step of cooling the heat exchange fluid by using the cooling mechanism 900 includes: Step 1. After receiving the adjustment instruction, increase or decrease the flow value of the coolant in the direction of the set flow range according to the current flow value of the coolant; The setting range is the range manually given before the constant temperature system is started. If the current flow value is within the setting range, no adjustment is required; if the current flow value is greater than the maximum value of the setting range, the flow rate is reduced; conversely, if the current flow value is less than the minimum value of the setting range, the flow rate is increased.
[0049] Step 2. At an interval T, detect the flow value of the coolant in the second circulation pipeline 920; After each flow adjustment, you need to wait for a certain period of time before taking subsequent actions, because you need to give the system time to react. It is more accurate to wait for the system flow to stabilize and then detect the current flow value.
[0050] Step 3. When the detected flow value is within the set range, stop adjusting the flow of the coolant. When the detected flow value is not within the set range, increase or decrease the flow of the coolant in the direction of the set range and then execute step 2 until the detected flow value is within the set range, completing the flow adjustment of the coolant.
[0051] When k≥c2 or k≤c1, the flow rate and temperature of the heat exchange fluid are adjusted simultaneously, wherein c1<b1<a1<0<a2<b2<c2.
[0052] When k≥c2 or k≤c1, it indicates that the temperature difference between n1 and n2 is large and needs to be quickly reduced. The power of the pump body 200 and the heating mechanism 300 can be adjusted simultaneously to make n1 quickly approach n2.
[0053] Specifically, when k≥c2, the flow rate of the heat exchange fluid is adjusted to a maximum, and the heating temperature of the heat exchange fluid is adjusted to a minimum.
[0054] For example, set n2=25℃, c2=40%, and the detected n1=45℃, and the calculated k=80%. At this time, the thermostat enables negative feedback at the same time, reduces the power of the heating mechanism to the minimum, and increases the output power of the pump inverter, so that the flow rate of the heat exchange fluid in the pipeline increases to the maximum, and the temperature is quickly reduced.
[0055] When k≤c1, adjust the flow rate of the heat exchange fluid to the minimum and adjust the heating temperature of the heat exchange fluid to the maximum.
[0056] For example, set n2=25℃, c1=-40%, and the detected n1=5℃, and the calculated k=-80%. At this time, the thermostat enables negative feedback at the same time, increases the power of the heating mechanism to the maximum, and reduces the output power of the pump inverter, so that the flow rate of the heat exchange fluid in the pipeline is reduced to the minimum, and the temperature is raised quickly.
[0057] The temperature control method includes the following steps before obtaining the temperature n1 of the heat exchange fluid at the location where the heat exchange with the device to be processed is performed: resetting the output range and initial value of the heating mechanism 300; resetting the output frequency range, initial frequency and initial flow of the inverter of the pump body 200.
[0058] Before the treated device is subjected to constant temperature treatment, the system is initialized first, wherein the inverter output frequency range of the pump body 200, the inverter initial output frequency of the pump body 200, the output range of the heating mechanism 300, the initial output setting of the heating mechanism 300, and the flow setting range are set. For example, the inverter output frequency range of the pump body 200 is 0-50HZ, the inverter initial frequency of the pump body 200 is set (for example, 25HZ), the output range of the heating mechanism 300 is set 0%-100%, the initial output setting of the heating mechanism 300 is set (for example, 35%), and the flow setting range is 2 L / min-10 L / min.
[0059] like Figure 2 As shown, the constant temperature system provided by the present invention includes: a liquid storage tank 100 and a first circulation pipeline.
[0060] The liquid storage tank 100 stores heat exchange liquid, which can be replenished regularly by an automatic liquid replenishment mechanism, wherein the automatic liquid replenishment mechanism may include a liquid pump, one end of which is connected to a replenishment bucket, and a controller may regularly suck the heat exchange liquid in the replenishment bucket into the liquid storage tank 100. The automatic liquid replenishment port 110 of the liquid storage tank 100, i.e., the port connected to the automatic liquid replenishment mechanism, is provided with a solenoid valve to control the opening and closing of the port. A manual liquid replenishment port 120 may also be provided to manually replenish the heat exchange liquid into the liquid storage tank 100.
[0061] A liquid level sensor 130 is provided in the liquid storage tank 100 to avoid excessive liquid injection. The liquid storage tank 100 includes an exhaust port 140, and the exhaust port 140 is provided with a solenoid valve to exhaust the liquid storage tank 100 during liquid replenishment to avoid excessive internal pressure. The liquid storage tank 100 includes a drain port 150 and a solenoid valve that controls the opening and closing of the drain port 150, thereby realizing automatic control of the opening and closing. A ball valve that is manually opened and closed is also provided at the drain port 150. The on and off of the drain port 150 is uniformly controlled by the solenoid valve and the ball valve, that is, the drain port 150 is opened only when both are in a conducting state, thereby avoiding accidental opening of the drain port 150.
[0062] The number of the first circulation pipelines may be one or two. In the present embodiment, the number of the first circulation pipelines is two, and the environmental temperature of the device to be processed A and the device to be processed B can be adjusted at the same time.
[0063] The first circulation pipeline includes a liquid inlet pipeline and a liquid return pipeline. One end of the liquid inlet pipeline is connected to the liquid storage tank 100, and the other end is used to connect to the inlet of the heat exchange pipeline of the heat exchange structure; one end of the liquid return pipeline is connected to the liquid storage tank 100, and the other end is used to connect to the outlet of the heat exchange pipeline.
[0064] Taking the side of the device A to be processed as an example, starting from the liquid storage tank 100, the liquid inlet pipeline is sequentially provided with a pump body 200, a heating mechanism 300, a filter 400, a flow sensor 500, a second temperature sensor 620, a first pressure sensor 710 and a first valve body 810.
[0065] The pump body 200 is used to allow the heat exchange liquid in the liquid storage tank 100 to flow into the heat exchange pipe of the heat exchange structure. The pump body 200 may be a magnetic pump.
[0066] The heating mechanism 300 is used to heat the heat exchange liquid. The filter 400 may be a heat exchange liquid filter 400, filtering impurities in the heat exchange liquid. The flow sensor 500 detects the flow of the heat exchange liquid, and the flow sensor 500 can display the flow value, that is, intuitively reflecting the change of the power of the pump body 200.
[0067] The second temperature sensor 620 can detect and display the temperature of the heat exchange fluid before it enters the heat exchange structure, and provide data for detection and data analysis.
[0068] The first pressure sensor 710 can detect the pressure in the liquid inlet pipe, and cooperate with the second pressure sensor 720 on the liquid return pipe to reflect whether the heat exchange structure is leaking. When there is a large difference between the front and rear pressure values, it is necessary to check whether the heat exchange structure is damaged.
[0069] Starting from the heat exchange structure, a second valve body 820, a first temperature sensor 610, a second pressure sensor 720 and a cooling mechanism 900 are arranged on the liquid return pipeline.
[0070] The first valve body 810 and the second valve body 820 are respectively located at the inlet and outlet of the heat exchange pipe and can be both ball valves. The inlet and outlet of the heat exchange structure can be changed by manual opening and closing. When the heat exchange structure needs to be replaced, the first valve body 810 and the second valve body 820 can be closed.
[0071] The first temperature sensor 610 is used to detect the temperature of the heat exchange liquid flowing out of the heat exchange pipe of the heat exchange structure, which directly reflects the temperature of the surrounding environment of the device A to be processed, that is, n1. n1 is compared with the set temperature n2, so as to adjust the power of the pump body 200 and the heating mechanism 300 to reduce the difference between n1 and the set temperature n2. Specifically, the controller of the system is electrically connected to the pump body 200, the heating mechanism 300, the flow sensor 500 and the first temperature sensor 610 respectively. The controller adjusts the power of the pump body 200 and the heating mechanism 300 according to n1 and n2 so that n1 approaches n2.
[0072] For the device A to be processed, a cooling mechanism 900 is provided on the liquid return pipe, and the first temperature sensor 610 is located between the cooling mechanism 900 and the heat exchange structure. The cooling mechanism 900 is used to dissipate heat from the heat exchange liquid. The controller of the system is electrically connected to the cooling mechanism 900, and the cooling mechanism 900 can be used to cool the heat exchange liquid, and then the power of the heating mechanism 300 is reduced or the heating is stopped, so that the temperature of the heat exchange liquid flowing into the heat exchange structure is reduced to avoid the actual temperature of the heat exchange liquid being too high, wherein the set temperature n2 is the working temperature required when the device A to be processed is working. The cooling mechanism 900 includes a heat exchanger 910 and a second circulation pipe 920, and the heat exchanger 910 is respectively connected to the second circulation pipe 920 and the liquid return pipe, so that the second circulation pipe 920 absorbs the heat of the liquid return pipe through the heat exchanger 910. The coolant circulating in the cooling pipe can be water.
[0073] The heat exchange fluid may be a fluorinated fluid.
[0074] For another first circulation pipeline, the first circulation pipeline performs a constant temperature treatment on the device to be processed B. The two first circulation pipelines share a liquid storage tank 100, so only one cooling mechanism 900 is required.
[0075] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.
Claims
1. A temperature control method, applied to a constant temperature system, the constant temperature system comprising a first circulation pipeline, the first circulation pipeline having a heat exchange fluid, the heat exchange fluid being used to perform heat exchange treatment on a device to be treated, characterized in that: Includes steps: Obtain the temperature n1 of the heat exchange fluid at the location where the heat exchange with the device to be processed is performed; According to n1 and n2, the temperature and flow rate of the heat exchange fluid are adjusted so that n1 approaches n2, where n2 is the set temperature.
2. The temperature control method according to claim 1, characterized in that: When k≥a2 or k≤a1, adjust the heat exchange fluid flow rate so that n1 approaches n2; When a1<k<0, or 0<k<a2, adjust the temperature of the heat exchange fluid so that n1 approaches n2; Among them, a1 and a2 are set values, k= .
3. The temperature control method according to claim 2, characterized in that: When k≥a2 or k≤a1, the step of adjusting the heat exchange fluid flow rate so that n1 approaches n2 is specifically as follows: When k≥a2 or k≤a1, and the current flow rate is within the set range of flow regulation, adjust the heat exchange fluid flow rate so that n1 approaches n2; When k≥a2 or k≤a1, and the current flow rate reaches the critical value of the set range of flow rate regulation, the heat exchange liquid temperature is adjusted so that n1 approaches n2.
4. The temperature control method according to claim 2, characterized in that: In the step of adjusting the flow rate of the heat exchange fluid, the flow rate is changed in stages according to the adjustment interval time t in an increasing or decreasing manner.
5. The temperature control method according to claim 4, characterized in that: When a2≤k<b2, or b1<k≤a1, adjust t to t1; When k≥b2 or k≤b1, adjust t to t2; Among them, b1<a1<0<a2<b2; t1>t2.
6. The temperature control method according to claim 2, characterized in that: The temperature control method further comprises the steps of: The heat exchange liquid is cooled using a cooling mechanism (900), wherein the cooling mechanism (900) comprises a second circulation pipeline (920), wherein the second circulation pipeline (920) has a cooling liquid therein, and the cooling liquid is used to exchange heat with the heat exchange liquid after heat exchange with the device to be processed; The step of using the cooling mechanism (900) to cool the heat exchange fluid comprises: When d1≤k≤d2, the flow rate of the coolant in the second circulation pipeline (920) is controlled to remain unchanged; When k>d2, the flow rate of the coolant in the second circulation pipeline (920) is increased; When k<d1, reducing the flow rate of the coolant in the second circulation pipeline (920); Among them, d1<0<d2; And / or, the step of using the cooling mechanism (900) to cool the heat exchange fluid comprises: Step 1. After receiving the adjustment instruction, increase or decrease the flow value of the coolant in the direction of the set range according to the current flow value of the coolant; Step 2. At an interval T, detect the flow value of the coolant in the second circulation pipeline (920); Step 3. When the detected flow value is within the set range, stop adjusting the flow of the second heat exchange fluid; When the detected flow value is not within the set range, the flow value of the coolant is increased or decreased in the direction toward the set range and then step 2 is executed.
7. The temperature control method according to claim 2, characterized in that: When k≥c2 or k≤c1, the flow rate and temperature of the heat exchange fluid are adjusted simultaneously, wherein c1<b1<a1<0<a2<b2<c2.
8. The temperature control method according to claim 7, characterized in that: When k ≥ c2, adjust the flow rate of the heat exchange fluid to the maximum and adjust the heating temperature of the heat exchange fluid to the minimum; When k≤c1, adjust the flow rate of the heat exchange fluid to the minimum and adjust the heating temperature of the heat exchange fluid to the maximum.
9. The temperature control method according to claim 1, characterized in that: The heat exchange liquid is heated by using a heating mechanism (300); and the flow rate of the heat exchange liquid is adjusted by using a pump body (200); The temperature control method includes the following steps before obtaining the temperature n1 of the heat exchange fluid at the location where the device to be processed is subjected to heat exchange: Resetting the output range and initial value of the heating mechanism (300); The output frequency range, initial frequency and initial flow rate of the frequency converter of the pump body (200) are reset.
10. A constant temperature system for implementing the temperature control method according to any one of claims 1 to 9, characterized in that: include: A liquid storage tank (100), a controller and a heat exchange structure, wherein the liquid storage tank (100) and the heat exchange structure are connected via a first circulation pipeline so that the heat exchange liquid circulates between the liquid storage tank (100) and the heat exchange structure; In the first circulation pipeline, a section of the pipeline where the heat exchange liquid flows from the liquid storage tank (100) to the heat exchange structure is provided with a pump body (200), a heating mechanism (300) and a flow sensor (500); the pump body (200) is used to allow the heat exchange liquid in the liquid storage tank (100) to flow into the heat exchange structure; the flow sensor (500) is used to detect the flow rate of the heat exchange liquid; and the heating mechanism (300) is used to heat the heat exchange liquid. In the first circulation pipeline, a first temperature sensor (610) is provided in a section of the pipeline where the heat exchange liquid flows from the heat exchange structure to the liquid storage tank (100), and is used to obtain the temperature n1 of the heat exchange liquid at the location where heat exchange is performed on the device to be processed; The controller is electrically connected to the pump body (200), the heating mechanism (300), the flow sensor (500) and the first temperature sensor (610) respectively. The controller adjusts the flow rate of the heat exchange fluid through the pump body (200) and the temperature of the heat exchange fluid through the heating mechanism (300) according to n1 and n2, so that n1 approaches n2.
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