Method, system and equipment for optimizing shot blasting process and medium

Abstract

The invention discloses a method, a system, equipment and a medium for optimizing a shot peening process, and the method comprises the following steps: under the condition of setting multiple index values of target shot peening process indexes, carrying out corresponding multiple shot peening experiments on a material to obtain multiple parts of measurement data corresponding to the material after the multiple shot peening experiments; calculating the crack closing stress, the crack arrest stress and the stress concentration factor of the material according to each part of measurement data in sequence; according to the measurement data, the crack closing stress, the crack arrest stress and the stress concentration factor, calculating the expansion rate of the surface crack of the material; selecting a target expansion rate from the expansion rates corresponding to the multiple parts of measurement data; the target expansion rate is the lowest expansion rate in the expansion rates corresponding to the multiple parts of measurement data; the material is subjected to shot blasting treatment according to the index value corresponding to the target expansion rate, the fatigue performance of the material can be determined according to the material crack expansion rate, then shot blasting process parameters are designed, and the shot blasting process can be provided.

Description

Technical Field

[0001] The present application relates to the field of material analysis technology, and in particular to a method, system, equipment and medium for optimizing a shot peening process. Background Art

[0002] In the field of materials science, shot peening can improve the fatigue performance of materials by introducing a large amount of plastic deformation to change the chemical and physical properties of materials. Shot peening will introduce high residual compressive stress, which is a physical property of the material. Residual compressive stress can inhibit the formation of fatigue cracks and reduce the crack growth rate, which can adjust the fatigue performance of materials.

[0003] However, the surface roughness of the material will usually increase after shot peening, where surface roughness belongs to the category of the physical state of the material surface and is a physical parameter that measures the smoothness of the material surface. The greater the surface roughness, the better the surface quality, and the fatigue resistance of its parts will usually be higher. Therefore, the increase in surface roughness leads to increased surface stress concentration, thereby reducing the fatigue life of the parts. Moreover, the prior art only analyzes the fatigue performance of the material by obtaining the residual stress of the material or observing the surface condition of the material, and does not clarify the relationship between the chemical and physical properties of the material after shot peening and the fatigue performance of the material, resulting in the inability to directly determine the material performance based on the shot peening process parameters, which is not conducive to improving the shot peening process. Summary of the invention

[0004] The following is a summary of the subject matter described in detail herein. This summary is not intended to limit the scope of the claims.

[0005] The main purpose of the embodiments of the present disclosure is to propose a method, system, equipment and storage medium for optimizing the shot peening process, which can clarify the relationship between the shot peening process and fatigue performance of the material, and is conducive to the design of the shot peening process.

[0006] A first aspect of an embodiment of the present application provides a method for optimizing a shot peening process for a central controller, the method comprising: Under the condition of setting multiple index values ​​of the target shot peening process index, performing multiple corresponding shot peening experiments on the material to obtain multiple measurement data corresponding to the material after the multiple shot peening experiments; Calculating the crack closure stress, crack arrest stress and stress concentration factor of the material according to each of the measurement data in turn; Calculating the propagation rate of the surface crack of the material according to the measurement data, the crack closure stress, the crack arrest stress and the stress concentration factor; Selecting a target expansion rate from the expansion rates corresponding to the multiple measurement data; the target expansion rate is the lowest expansion rate among the expansion rates corresponding to the multiple measurement data; Shot peening the material according to the index value corresponding to the target expansion rate; The target shot peening process index includes at least one of shot size, spraying air pressure, spraying distance, shot peening flow rate and shot peening coverage rate.

[0007] The embodiment of the present application provides a method for optimizing a shot peening process, by performing corresponding multiple shot peening experiments on a material while setting multiple indicator values ​​of a target shot peening process indicator, obtaining multiple measurement data corresponding to the material after the multiple shot peening experiments; calculating the crack closure stress, crack arrest stress and stress concentration factor of the material in turn according to each measurement data; calculating the expansion rate of the surface crack of the material according to the measurement data, the crack closure stress, the crack arrest stress and the stress concentration factor; selecting a target expansion rate from the expansion rates corresponding to the multiple measurement data; the target expansion rate is the lowest expansion rate among the expansion rates corresponding to the multiple measurement data; performing shot peening on the material according to the indicator value corresponding to the target expansion rate can determine the fatigue performance of the material according to the crack expansion rate of the material, and then designing the shot peening process parameters, which is conducive to providing a shot peening process.

[0008] In some embodiments of the present application, the measurement data includes residual stress, crack length, and grain composition, and the crack closure stress and crack arrest stress of the material are calculated in sequence according to each piece of the measurement data, including: Fitting the residual stress in each of the measurement data to obtain a fitted residual stress; Calculating the crack closure stress according to the fitted residual stress; The crack arrest stress is calculated based on the crack closure stress and the grain composition in each piece of the measurement data.

[0009] In some embodiments of the present application, the calculation formula of the crack closure stress includes: ; in, is the crack closure stress, is the crack length of the material, with the superscript represents the number of half grains that the crack passes through, is the fitted residual stress.

[0010] In some embodiments of the present application, the calculation formula of the crack arrest stress includes: ; ; ; in, is the number of half crystals that the crack passes through, To pass through The grain orientation factor for a semi-crystalline is the strength at the grain boundary, is the width of the grain boundary, is the grain size, is the crack closure stress, is the fatigue strength of the material, is the crack closure stress, The crack propagates through the The stress that needs to be overcome at the grain boundary when a half-grain is formed is called the crack arrest stress.

[0011] In some embodiments of the present application, the measurement data includes a microscopic pit depth and a microscopic pit half-width on the surface of the material, and the step of calculating the stress concentration factor of the material according to each piece of the measurement data in turn includes: Calculating the stress concentration factor of the material according to the microscopic pit depth and the microscopic pit half width; The calculation formula of the stress concentration factor includes: ; ; , 0.30; , 0.15; in, is the microscopic pit depth, is the half-width of the microscopic pit, is the grain size, is the microscopic pit parameter of the material after shot peening, is the stress concentration factor, i is the number of half grains that the crack passes through, To measure the parameters of the material surface, to calculate The intermediate variable.

[0012] In some embodiments of the present application, the calculation formula of the expansion rate includes: ; ; in, is the opening displacement of the crack front, is the shear modulus, is Poisson's ratio, is the yield strength, is the crack closure stress, is the length of the crack,i is the number of half grains that the crack passes through, is the cumulative damage length of the crack, is the maximum applied stress, is the number of cyclic loading, and is the fitting constant.

[0013] In some embodiments of the present application, the calculation formula for the length of the crack includes: ; ; ; ; in and The cracks are i The starting and ending positions of each grain are The two extreme values ​​of is the crack arrest stress on the rough surface of the material, For the The grain size of a semi-crystalline is the microscopic pit parameter of the material after shot peening, To pass through The length of the crack when the crystal is half full.

[0014] To achieve the above object, a second aspect of an embodiment of the present invention provides a system for optimizing a shot peening process, the system comprising: An experimental module, used to perform a plurality of corresponding shot peening experiments on the material under the condition of setting a plurality of index values ​​of the target shot peening process index, and obtain a plurality of measurement data corresponding to the material after the plurality of shot peening experiments; A statistical module, for calculating the crack closure stress, crack arrest stress and stress concentration factor of the material according to each piece of the measurement data in turn; A calculation module, used for calculating the propagation rate of the surface crack of the material according to the measurement data, the crack closure stress, the crack arrest stress and the stress concentration factor; A screening module, configured to select a target expansion rate from the expansion rates corresponding to the plurality of measurement data; the target expansion rate is the lowest expansion rate among the expansion rates corresponding to the plurality of measurement data; A processing module, used for performing shot peening on the material according to the index value corresponding to the target expansion rate; The target shot peening process index includes at least one of shot size, spraying air pressure, spraying distance, shot peening flow rate and shot peening coverage rate.

[0015] To achieve the above-mentioned purpose, the third aspect of an embodiment of the present invention provides an electronic device, comprising: at least one control processor and a memory for communicating with the at least one control processor; the memory stores instructions that can be executed by the at least one control processor, and the instructions are executed by the at least one control processor so that the at least one control processor can execute the above-mentioned method for optimizing the shot peening process.

[0016] To achieve the above-mentioned purpose, a fourth aspect of an embodiment of the present invention provides a computer-readable storage medium, wherein the computer-readable storage medium stores computer-executable instructions, and the computer-executable instructions are used to enable a computer to execute the above-mentioned method for optimizing a shot peening process.

[0017] It can be understood that the beneficial effects of the second to fourth aspects compared with the related art are the same as the beneficial effects of the first aspect compared with the related art. Please refer to the relevant description in the first aspect, and no further details will be given here. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which: Figure 1 It is a schematic flow chart of a method for optimizing a shot peening process provided in an embodiment of the present application; Figure 2 is a coverage determination diagram provided in an embodiment of the present application; Figure 3 is a graph showing the relationship between the residual stress and the depth from the surface at different coverage levels after shot peening provided in an embodiment of the present application; Figure 4 is a graph showing the relationship between the surface roughness and the depth from the surface at different coverage levels after shot peening provided in an embodiment of the present application; Figure 5 is a grain composition diagram corresponding to different coverage levels after shot peening provided in an embodiment of the present application; Figure 6 is a graph showing the relationship between the microhardness and the depth from the surface at different coverage levels after shot peening provided in an embodiment of the present application; Figure 7 is a relationship diagram between the fitted residual stress and the depth from the surface corresponding to different coverage levels after shot peening provided in an embodiment of the present application; Figure 8 It is a schematic diagram of crack propagation provided in an embodiment of the present application; Fig. 9is a graph showing the relationship between the crack arrest stress and the depth from the surface corresponding to different coverage levels after shot peening provided in an embodiment of the present application; Fig.10 is a relationship diagram between the rough surface parameters and the number of grains corresponding to different coverage levels after shot peening provided in an embodiment of the present application; Fig.11 is a stress concentration factor diagram corresponding to different coverage levels after shot peening provided in an embodiment of the present application; Fig.12 is a relationship diagram between the yield strength and the depth from the surface at different coverage levels after shot peening provided in an embodiment of the present application; Fig.13 is a relationship diagram between the crack front opening displacement and the depth from the surface corresponding to different coverage levels after shot peening provided in an embodiment of the present application; Fig.14 It is a structural schematic diagram of a training system for optimizing shot peening process provided in an embodiment of the present application; Fig.15 It is a schematic diagram of the hardware structure of the electronic device provided in the embodiment of the present application. DETAILED DESCRIPTION

[0019] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0020] In the description of this application, if there is a description of first, second, etc., it is only for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0021] In the description of the present application, it should be understood that the descriptions involving orientation, such as the orientation or positional relationship indicated as up, down, etc., are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0022] In the description of this application, it should be noted that, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meaning of the above terms in this application based on the specific content of the technical solution.

[0023] First, some nouns involved in this application are analyzed: Shot peening is a surface strengthening process that improves the fatigue performance of materials by improving their chemical and physical properties. It is a cold processing process that uses shot to bombard the workpiece surface and implant residual compressive stress to improve the fatigue strength of the workpiece. It is widely used to improve the mechanical strength of parts as well as wear resistance, fatigue resistance and corrosion resistance.

[0024] In the field of materials science, shot peening can improve the fatigue performance of materials by introducing a large amount of plastic deformation to change the chemical and physical properties of materials. Shot peening will introduce high residual compressive stress, which is a physical property of the material. Residual compressive stress can inhibit the formation of fatigue cracks and reduce the crack growth rate, which can adjust the fatigue performance of materials.

[0025] However, the surface roughness of the material will usually increase after shot peening, where surface roughness belongs to the category of the physical state of the material surface and is a physical parameter that measures the smoothness of the material surface. The greater the surface roughness, the better the surface quality, and the fatigue resistance of its parts will usually be higher. Therefore, the increase in surface roughness leads to increased surface stress concentration, thereby reducing the fatigue life of the parts. Moreover, the prior art only analyzes the fatigue performance of the material by obtaining the residual stress of the material or observing the surface condition of the material, and does not clarify the relationship between the chemical and physical properties of the material after shot peening and the fatigue performance of the material, resulting in the inability to directly determine the material performance based on the shot peening process parameters, which is not conducive to improving the shot peening process.

[0026] Based on this, the embodiments of the present application provide a method, system, electronic equipment and medium for optimizing the shot peening process, aiming to clarify the relationship between the shot peening process and the fatigue performance of the material, which is conducive to the design of the shot peening process.

[0027] The method, system, electronic device and medium for optimizing the shot peening process provided in the embodiments of the present application are specifically described through the following embodiments. First, the method for optimizing the shot peening process in the embodiments of the present application is described.

[0028] The embodiments of the present application can acquire and process relevant data based on artificial intelligence technology. Artificial Intelligence (AI) is the theory, method, technology and application system that uses digital computers or machines controlled by digital computers to simulate, extend and expand human intelligence, perceive the environment, acquire knowledge and use knowledge to obtain the best results.

[0029] AI basic technologies generally include sensors, dedicated AI chips, cloud computing, distributed storage, big data processing technology, operation / interaction systems, mechatronics, etc. AI software technologies mainly include computer vision technology, robotics technology, biometrics technology, speech processing technology, natural language processing technology, and machine learning / deep learning.

[0030] The method for optimizing the shot peening process provided in the embodiment of the present application relates to the field of material analysis technology. The method for optimizing the shot peening process provided in the embodiment of the present application can be applied to the terminal, can also be applied to the server side, and can also be software running in the terminal or the server side. In some embodiments, the terminal can be a smart phone, a tablet computer, a laptop computer, a desktop computer, etc.; the server side can be configured as an independent physical server, or it can be configured as a server cluster or distributed system composed of multiple physical servers, and can also be configured as a cloud server that provides basic cloud computing services such as cloud services, cloud databases, cloud computing, cloud functions, cloud storage, network services, cloud communications, middleware services, domain name services, security services, CDN, and big data and artificial intelligence platforms; the software can be an application that implements the method for optimizing the shot peening process, etc., but is not limited to the above forms.

[0031] The present application can be used in many general or special computer system environments or configurations. For example: personal computers, server computers, handheld or portable devices, tablet devices, multiprocessor systems, microprocessor-based systems, set-top boxes, programmable consumer electronics, network PCs, minicomputers, mainframe computers, distributed computing environments including any of the above systems or devices, etc. The present application can be described in the general context of computer-executable instructions executed by a computer, such as program modules. Generally, program modules include routines, programs, objects, components, data structures, etc. that perform specific tasks or implement specific abstract data types. The present application can also be practiced in distributed computing environments, in which tasks are performed by remote processing devices connected through a communication network. In a distributed computing environment, program modules can be located in local and remote computer storage media including storage devices.

[0032] It should be noted that in each specific implementation of the present application, when it comes to the need to perform relevant processing based on data related to user identity or characteristics such as user information, user behavior data, user historical data, and user location information, the user's permission or consent will be obtained first, and the collection, use, and processing of these data will comply with relevant laws, regulations, and standards. In addition, when the embodiment of the present application needs to obtain the user's sensitive personal information, the user's separate permission or consent will be obtained through a pop-up window or by jumping to a confirmation page. After clearly obtaining the user's separate permission or consent, the necessary user-related data for the normal operation of the embodiment of the present application will be obtained.

[0033] For this purpose, refer to Figure 1The embodiment of the present application provides a method for optimizing the shot peening process. The method is applied to a central controller. The controller can be a server, an electronic device, or a mobile terminal, etc., which is not specifically limited here. The method includes the following steps S110 to S150.

[0034] Step S110 , when setting multiple index values ​​of the target shot peening process index, perform multiple corresponding shot peening experiments on the material to obtain multiple sets of measurement data corresponding to the material after the multiple shot peening experiments.

[0035] In this step, the target shot peening process indicators can be shot size, jet pressure, jet distance, shot peening flow rate and shot peening coverage. Among them, the shot peening process is a surface treatment technology that impacts the surface of the material by high-speed jet media (such as steel balls, ceramic beads, etc.), thereby changing the surface properties of the material (such as hardness, residual stress distribution, fatigue life, etc.). Therefore, by optimizing the physical and chemical parameters of the material through the shot peening process parameters, the optimization and design of the process parameters can be achieved, which can avoid the cost of experimental exploration of the shot peening process parameters, and can also further understand the mechanism of fatigue-resistant manufacturing.

[0036] Specifically, multiple different experimental condition groups are set according to the target shot peening process indicators. For each set of experimental conditions, a sufficient number of samples of the same material are prepared to ensure the reliability and repeatability of the experimental data. At the same time, while controlling other variables unchanged, the material samples are shot peened according to the preset process parameters. After shot peening, the various performance indicators of the material samples (such as surface hardness, residual stress, microstructure changes, etc.) are measured using appropriate measurement methods according to the characteristics of different performance indicators to obtain measurement results. This provides data support for the subsequent analysis of the data of each group of experiments to find the optimal combination of shot peening process parameters.

[0037] In some embodiments, shot peening experiments are carried out after the research object and material are determined, and the coverage level is used as the current experimental indicator. By setting a relatively wide coverage level, for example, including a coverage level from 100% to 800%, samples with obvious differences in physical and chemical properties are obtained, thereby more deeply analyzing the fatigue performance of the material.

[0038] Specifically, the coverage level is obtained by controlling the shot peening time of the shot peening experiment. The method for determining a coverage level of 100% is the blue ink method, that is, a layer of fluorescent agent is applied to the surface of the shot peening sample, and a certain shot peening time is controlled until the fluorescent agent on the surface of the sample is completely wiped out due to the impact of the projectile. The shot peening time at this time is recorded as t. The shot peening time for a coverage level of 200% is 2t, and so on, to obtain shot peening samples with different coverage rates. The coverage rate is determined based on the following: Figure 2 As shown, Figure 2 (a) is a shot peened sample with a coverage of 49%, (b) is a shot peened sample with a coverage of 81%, (c) is a shot peened sample with a coverage of 90%, and (d) is a shot peened sample with a coverage of 98%. Figure 2 In (d), it can be clearly seen that there are traces of craters.

[0039] Furthermore, if Figure 3 As shown, Figure 3 is the relationship between the residual stress and the depth from the surface at different coverage levels after shot peening, and is the relationship between the residual stress and the depth at different coverage levels measured by an X-ray diffractometer, wherein the residual stress is measured in order to calculate the crack closure stress at different coverage levels.

[0040] Furthermore, if Figure 4 As shown, Figure 4 It is the relationship between the surface roughness and the depth from the surface at different coverage levels after shot peening. It is measured by white light interferometer. Its purpose is to characterize the surface profile after shot peening, obtain the depth and width of the crater after shot peening, and use the depth and width of the crater as input to calculate the stress concentration factor to measure the change in surface quality after shot peening. Specifically, the larger the stress concentration factor, the worse the surface quality. Figure 4 (a) is a surface topography diagram, which shows the microscopic topography of the part surface after machining. Figure 4 (a) The microscopic profile characteristics after shot peening can be identified and Figure 4 (a) Extract its contour features, respectively. Figure 4 (b) and Figure 4 (c) as shown, according to Figure 4 As shown by the arrow in the middle, Figure 4 The data in (b) and 4(c) are from Figure 4 (a) The extracted contour curve, where the ordinate represents the depth of the contour and the abscissa represents the position of the contour. Figure 4 (b) and Figure 4 The distribution characteristics of the micro-contour curve shown in (c) are used to calculate the depth and half-width of the crater after shot peening. The stress concentration factor is calculated based on the contour and half-width of the crater, and the influence of the rough surface on the fatigue resistance of the material can be obtained.

[0041] Furthermore, if Figure 5 As shown, Figure 5 The grain composition corresponding to different coverage levels after shot peening, including grain size and depth, is measured using a backscattered electron diffractometer. The purpose is to consider the effect of grain size when calculating the crack arrest stress. Figure 5 (a) and Figure 5(b) describes the distribution trend of grain size in the depth direction of the material. Depth refers to the distance from the surface of the material. The grain size is measured by backscattered electron diffraction. Figure 5 (a) and Figure 5 (b) shows the grain size distribution under different coverage. Grain size is a key factor affecting fatigue crack growth rate. By measuring the grain size of different coverage, its influence on crack growth rate can be calculated, and then the influence of coverage on fatigue life of parts can be evaluated, providing a theoretical basis for designing and optimizing shot peening process parameters. Since grain size has a significant effect on crack growth rate, the influence of grain composition must be considered.

[0042] Furthermore, if Figure 6 As shown, Figure 6 It is the relationship between the microhardness and the depth from the surface at different coverage levels after shot peening, which is specifically measured using a Vickers hardness tester. The purpose of measuring Vickers hardness is to use the relationship between Vickers hardness and yield strength to convert it into the corresponding yield strength, and use the calculated yield strength as the input condition for calculating the crack growth rate. Specifically, the test depth is the depth of the shot peening strengthening layer of the material, Figure 3~Figure 6 All describe the distribution results of the corresponding parameters along the depth in the figure.

[0043] Step S120, calculating the crack closure stress, crack arrest stress and stress concentration factor of the material according to each measurement data in turn.

[0044] In this step, the measured data include residual stress, crack length and grain composition, where grain composition refers to the composition of the crystal structure inside the metal material, including grain size, shape and grain boundary characteristics. After the material is shot peened, a large number of dislocations and other defects are introduced due to plastic deformation, which will lead to grain refinement (i.e., grain size reduction) and may cause phase transformation inside the material, thereby changing the overall grain composition of the material.

[0045] In some embodiments, in step S120, the crack closure stress and the crack arrest stress of the material are calculated in sequence according to each piece of measurement data, including the following steps: Step S210, fitting the residual stress in each measurement data to obtain a fitted residual stress; Step S220, calculating the crack closure stress according to the fitted residual stress; Step S230: Calculate the crack arrest stress according to the crack closure stress and the grain composition in each measurement data.

[0046] In this embodiment, the function Fitting the actual residual stress, , as well as For the parameters that need to be determined, the fitting parameters are obtained according to the actual residual stress results. The following Table 1 shows the fitting parameters corresponding to different coverage levels after shot peening.

[0047] Table 1

[0048] Further, among them, The relationship between the fitted residual stress and the depth from the surface at different coverage levels after shot peening is calculated as follows: Figure 7 shown.

[0049] In some embodiments, the calculation formula for the crack closure stress includes: ; in, is the crack closure stress, is the crack length of the material, represents the number of half grains that the crack passes through, To fit the residual stress.

[0050] In this embodiment, Indicates passing through The crack closure stress at half a grain is is the length of the crack, corresponding to the first The length of half a grain, is the fitted residual stress function. Through actual measurement, the function Fitting obtained.

[0051] Specifically, it is necessary to fit a function of the variation of residual stress along depth based on the material test data after shot peening, which involves experimentally measuring the residual stress at different depths and using mathematical methods (such as polynomial fitting) to obtain a function that describes the variation of residual stress with depth.

[0052] In this embodiment, the formula can be used to calculate the crack closure stress. The crack closure acts on both sides of the crack and has a closing effect on the crack expansion. The greater the crack closure stress, the greater its inhibitory effect on crack expansion, the longer the service life of the parts, and the better the corresponding shot peening process parameters.

[0053] In some embodiments, the calculation formula of the crack arrest stress includes: ； ； ; in, is the number of half crystals that the crack passes through, To pass through The grain orientation factor for a semi-crystalline is the strength at the grain boundary, is the width of the grain boundary, is the grain size, is the crack closure stress, is the fatigue strength of the material, The crack propagates through the The stress that needs to be overcome at the grain boundary when a half-grain is formed is called the crack arrest stress.

[0054] Specifically, crack arrest stress refers to the critical stress value that can prevent cracks from continuing to expand under the action of an external load. For shot peened parts, crack arrest stress helps optimize process parameters and thus improve the fatigue performance of the material.

[0055] In some embodiments, the crack closure stress is calculated based on The crack arrest stress is calculated based on the measured grain composition. Specifically, based on the dislocation balance in the three regions of crack propagation, the restraint force in front of the slip band under loading conditions is for: ; in is the applied load stress, and They represent the normalized fatigue crack length and fatigue damage length respectively. Figure 8 Shown and Description in the crack propagation zone. and It can be calculated according to the following formula: ; ; in is the crack length, is the grain size, is the width of the grain boundary, subscript is the number of half grains that the crack passes through, and its value is i=1, 3, 5... When the crack front extends to the grain boundary, the applied load stress cannot make the plastic zone pass through the grain boundary, resulting in the crack stopping. Therefore, the critical condition for the crack to stop expanding is that the external load stress and the resistance at the grain boundary are equal. = =1, bring into the constraint The load stress formula can be obtained from the formula as follows: ; ; in, is the applied load stress, The stress that needs to be overcome at the grain boundary when the crack extends through the i-th half grain is called the crack arrest stress.

[0056] Further, simplifying the load stress formula, It can be approximated as: ; in, is the width of the grain boundary, is the grain size, It is the resistance encountered by cracks at the grain boundary, which is related to the material properties. Its maximum value can be obtained by the strength at the grain boundary and the grain orientation factor.

[0057] Furthermore, we can get: ; in, is the strength at the grain boundary, To pass through Grain orientation factor when there are half grains.

[0058] Furthermore, by simplifying the load stress formula, we can obtain for: ; In addition, the width of the grain boundary is much smaller than the grain size Yes, therefore The formula can be further simplified to obtain formula: ; When a fatigue crack initiates and propagates through the first grain, the stress that prevents the crack from extending is the fatigue limit ( ). Therefore, for the case where the crack passes through the first grain, =1, The formula can be expressed as: ; in, is the fatigue strength of the parts. formula and The formula can be used to obtain a new The expression is: ; In the process of crack propagation through grains, the orientation of grains is different. There have been relevant studies on the effect of grain orientation factor on crack propagation behavior, which show that the orientation of grains will increase during crack propagation. ) can be expressed as: ; in, is the number of half grains that the crack passes through, and its value is i=1, 3, 5...

[0059] For shot peened parts, the fatigue performance is Therefore, without considering the stress concentration caused by the roughness after shot peening, the crack arrest stress of the shot peened parts is It can be expressed as: = ; like Fig. 9 The figure shows the relationship between the crack arrest stress and the depth from the surface at different coverage levels after shot peening without considering the influence of the material surface roughness.

[0060] In some embodiments, in step S120, the crack closure stress and the crack arrest stress of the material are calculated in sequence according to each piece of measurement data, including the following steps: Step S240, calculating the stress concentration factor of the material according to each measurement data in turn, including: Calculate the stress concentration factor of the material according to the micro pit depth and the micro pit half width; The calculation formula of stress concentration factor includes: ; ; , 0.30; , 0.15; in, is the microscopic pit depth, is the half-width of the microscopic pit, is the grain size, is the microscopic pit parameter of the material after shot peening, is the stress concentration factor, i is the number of half grains that the crack passes through, To measure the parameters of the material surface, to calculate The intermediate variable.

[0061] In this embodiment, the measured data includes the microscopic pit depth and the microscopic pit half width on the material surface. It is a parameter to measure the influence of surface roughness on crack arrest stress. The smaller the value, the greater the influence of roughness on crack arrest stress. It represents the stress concentration factor. The stress concentration factor is one of the parameters that reflect the surface quality of parts. The greater the stress concentration, the more likely it is for stress concentration to occur, and it is also the place where fatigue cracks are likely to form first.

[0062] Specifically, the microscopic pits are identified based on the measured shot peening surface morphology. The identification of the microscopic pits is based on the cross-sectional profile of the morphology, and the depth and half-width of the pits under different process parameters are calculated. The influence coefficient of the stress concentration factor and the crack arrest stress is calculated based on the depth and half-width of the pits. .

[0063] like Fig.10 The following are the rough surface parameters calculated for different coverage levels after shot peening. The relationship between the number of grains, It is a parameter related to the microscopic pits after shot peening, usually less than 1, and can be calculated by the following formula: ; ; in, is the depth of the microscopic pit, is the half width of the microscopic pit, is the grain size, is the microscopic pit parameter of the material after shot peening, is the stress concentration factor.

[0064] Furthermore, the microscopic pits formed after shot peening and the stress concentration factor have the following relationship: , 0.30; , 0.15; in, It is the stress concentration factor. It can be found that the depth, width and shape of the micro-pits will significantly affect the stress concentration factor.

[0065] like Fig.11 The figure shows the calculated stress concentration factors at different coverage levels after shot peening. .

[0066] Furthermore, the microhardness after shot peening is measured, and the relationship between the microhardness and the yield strength of the material is used to convert it into the yield strength of the material.

[0067] Specifically, the relationship between microhardness and yield strength is: ; in, Indicates Vickers hardness, through which the yield strength of the material can be obtained ,like Fig.12 The relationship between the yield strength and the depth from the surface for different coverage levels after shot peening is shown.

[0068] Step S130: Calculate the propagation rate of the surface crack of the material according to the measurement data, the crack closure stress, the crack arrest stress and the stress concentration factor.

[0069] In this step, the fatigue crack growth rate is calculated based on the calculated closure stress, yield strength, stress concentration factor and crack arrest stress.

[0070] In some embodiments, the calculation formula for the crack growth rate includes: ; ; in, is the opening displacement of the crack front, is the shear modulus, is Poisson's ratio, is the yield strength, is the crack closure stress, is the length of the crack, i is the number of half grains that the crack passes through, is the cumulative damage length of the crack, is the maximum applied stress, is the number of cyclic loading, and is the fitting constant.

[0071] In this embodiment, the shear modulus is also called the shear modulus or rigidity modulus, which is the ratio of the shear stress to the shear strain within the elastic deformation proportional limit range under the action of shear stress. It characterizes the ability of the material to resist shear deformation. The larger the shear modulus, the stronger the rigidity of the material, that is, the material is not easy to deform when subjected to shear force. The Poisson's ratio refers to the ratio of the transverse normal strain to the axial normal strain when the material is subjected to unidirectional tension or compression, also called the transverse deformation coefficient, which is an elastic constant reflecting the transverse deformation of the material.

[0072] In some embodiments, the calculation formula for the crack length includes: ; ; ; ; in, and The cracks are i The starting and ending positions of each grain are The two extreme values ​​of is the crack arrest stress on the rough surface of the material, For the The grain size of a semi-crystalline is the microscopic pit parameter of the material after shot peening, To pass through The length of the crack when the crystal is half full.

[0073] Specifically, is the crack arrest stress considering the rough surface, Calculated by the following formula: .

[0074] When the maximum external load stress is greater than the fatigue crack arrest stress, the crack will extend through the plastic region to the next grain as the cyclic loading proceeds. Assuming that the crack extension rate and the crack front opening displacement ( ), that is: ; in is the number of cyclic loading, is the length of the crack, and is the fitting constant. It can be calculated by the following formula: ; in, is the shear modulus, is Poisson's ratio, is the maximum applied stress, the length of the crack The cumulative damage length of fatigue crack can be The calculation results are: ; ; ; ; in, is the cumulative damage length of fatigue crack, and The cracks are i The starting and ending positions of each grain are The two extreme values ​​of is the crack arrest stress on the rough surface of the material, For the The grain size of a semi-crystalline is the microscopic pit parameter of the material after shot peening, To pass through The length of the crack when the crystal is half full. Indicates the maximum value of stress due to rough surface. The formation rate of the crack front displacement under the coupling of different parameters is calculated, and then the crack expansion under different process parameters is compared, thereby linking the physical and chemical properties of the material with the fatigue performance of the part.

[0075] Step S140: Select a target expansion rate from the expansion rates corresponding to the multiple measurement data; the target expansion rate is the lowest expansion rate among the expansion rates corresponding to the multiple measurement data.

[0076] In this step, if Fig.13 The figure shows the relationship between the crack front opening displacement and the depth from the surface at different coverage levels after shot peening calculated under different process parameters. The formation rate of the crack front displacement under the coupling of different parameters can be further calculated. Through the expansion rate corresponding to multiple measurement data, the expansion of cracks under different process parameters can be compared, thereby linking the physical and chemical properties of the material with the fatigue performance of the part.

[0077] Specifically, the expansion rates corresponding to all the measured data are sorted and sorted according to the numerical value or the minimum value is directly found. Then, among all the expansion rates, the one with the smallest value is selected as the target expansion rate, where a lower expansion rate means that the material has better fatigue resistance. By identifying the experimental conditions with the lowest expansion rate, a basis is provided for the design of shot peening process parameters to achieve the best fatigue resistance.

[0078] Step S150, performing shot peening on the material according to the index value corresponding to the target expansion rate; The target shot peening process index includes at least one of shot size, spraying air pressure, spraying distance, shot peening flow rate and shot peening coverage rate.

[0079] In this step, the material is shot peened according to the index value corresponding to the target expansion rate. Selecting the process parameters with the lowest expansion rate helps to extend the service life of the parts and reduce the cost and risk caused by fatigue failure. Moreover, by systematically calculating, sorting and comparing the fatigue crack growth rate of the material under different experimental conditions, the optimal shot peening process parameters can be effectively determined, thereby improving the overall fatigue performance of the material.

[0080] like Fig.14 As shown, some embodiments of the present application provide a system for optimizing the shot peening process, the system includes an experimental module 1510, a statistical module 1520, a calculation module 1530, a screening module 1540, and a processing module 1550, specifically: The experiment module 1510 is used to perform a plurality of corresponding shot peening experiments on the material under the condition of setting a plurality of index values ​​of the target shot peening process index, and obtain a plurality of measurement data corresponding to the material after the plurality of shot peening experiments; A statistical module 1520 is used to calculate the crack closure stress, crack arrest stress and stress concentration factor of the material according to each measurement data in turn; A calculation module 1530, for calculating the propagation rate of surface cracks of the material according to the measurement data, the crack closure stress, the crack arrest stress and the stress concentration factor; The screening module 1540 is used to select a target expansion rate from the expansion rates corresponding to the multiple measurement data; the target expansion rate is the lowest expansion rate among the expansion rates corresponding to the multiple measurement data; A processing module 1550 is used to perform shot peening on the material according to the index value corresponding to the target expansion rate; The target shot peening process index includes at least one of shot size, spraying air pressure, spraying distance, shot peening flow rate and shot peening coverage rate.

[0081] In some implementations, the statistics module 1520 may include: fitting the residual stress in each piece of measurement data to obtain a fitted residual stress.

[0082] In some embodiments, the statistics module 1520 may include: calculating the crack closure stress according to the fitted residual stress.

[0083] In some embodiments, the statistics module 1520 may include: calculating the crack arrest stress according to the crack closure stress and the grain composition in each measurement data.

[0084] In some implementations, the statistics module 1520 may include: ; in, is the crack closure stress, is the crack length of the material, represents the number of half grains that the crack passes through, To fit the residual stress.

[0085] In some implementations, the statistics module 1520 may include: ; ; ; in, is the number of half crystals that the crack passes through, To pass through The grain orientation factor for a semi-crystalline is the strength at the grain boundary, is the width of the grain boundary, is the grain size, is the crack closure stress, is the fatigue strength of the material, is the crack closure stress, The crack propagates through the The stress that needs to be overcome at the grain boundary when a half-grain is formed is called the crack arrest stress.

[0086] In some implementations, the statistics module 1520 may include calculating a stress concentration factor of a material based on a micro-pit depth and a micro-pit half-width.

[0087] In some implementations, the statistics module 1520 may include: ; ; , 0.30; , 0.15; in, is the depth of the microscopic pit, is the half width of the microscopic pit, is the grain size, is the microscopic pit parameter of the material after shot peening, is the stress concentration factor.

[0088] In some implementations, the calculation module 1530 may include: ; ; in, is the opening displacement of the crack front, is the shear modulus, is Poisson's ratio, is the yield strength, is the crack closure stress, is the length of the crack, i is the number of half grains that the crack passes through, is the cumulative damage length of the crack, is the maximum applied stress, is the number of cyclic loading, and is the fitting constant.

[0089] In some implementations, the calculation module 1530 may include: ; ; ; ; in, is the cumulative damage length of fatigue crack, and The cracks are i The starting and ending positions of each grain are The two extreme values ​​of is the crack arrest stress on the rough surface of the material, For the The grain size of a semi-crystalline is the microscopic pit parameter of the material after shot peening, To pass through The length of the crack when the crystal is half full.

[0090] It should be noted that the system for optimizing the shot peening process provided in this embodiment and the method for optimizing the shot peening process described above are based on the same inventive concept, so the relevant contents of the method for optimizing the shot peening process described above are also applicable to the contents of the system for optimizing the shot peening process, and therefore, they will not be repeated here.

[0091] In order to, the system performs corresponding multiple shot peening experiments on the material under the condition of setting multiple indicator values ​​of the target shot peening process indicators, and obtains multiple measurement data corresponding to the material after the multiple shot peening experiments; calculates the crack closure stress, crack arrest stress and stress concentration factor of the material according to each measurement data in turn; calculates the surface crack expansion rate of the material according to the measurement data, crack closure stress, crack arrest stress and stress concentration factor; selects the target expansion rate from the expansion rates corresponding to the multiple measurement data; the target expansion rate is the lowest expansion rate among the expansion rates corresponding to the multiple measurement data; shot peening is performed on the material according to the indicator value corresponding to the target expansion rate, and the fatigue performance of the material can be determined according to the crack expansion rate of the material, and then the shot peening process parameters are designed, which is conducive to providing a shot peening process.

[0092] An embodiment of the present application also provides an electronic device, which includes a memory and a processor. The memory stores a computer program, and the processor implements the above-mentioned method for optimizing the shot peening process when executing the computer program.

[0093] like Fig.15 , Fig.15 A schematic diagram of the hardware structure of an electronic device provided in an embodiment of the present application, wherein the electronic device includes: At least one battery; at least one memory; at least one processor; at least one program; The programs are stored in the memory, and the processor executes at least one program to implement the method for optimizing the shot peening process described above in the present disclosure.

[0094] The electronic device may be any intelligent terminal including a mobile phone, a tablet computer, a personal digital assistant (PDA), a vehicle-mounted computer, etc.

[0095] The electronic device according to the embodiment of the present application is described in detail below.

[0096] The processor 1600 may be implemented by a general-purpose central processing unit (CPU), a microprocessor, an application-specific integrated circuit (ASIC), or one or more integrated circuits, and is used to execute relevant programs to implement the technical solutions provided in the embodiments of the present disclosure; The memory 1700 can be implemented in the form of a read-only memory (ROM), a static storage device, a dynamic storage device, or a random access memory (RAM). The memory 1700 can store an operating system and other application programs. When the technical solution provided in the embodiments of this specification is implemented by software or firmware, the relevant program code is stored in the memory 1700, and the processor 1600 calls and executes a method for optimizing a shot peening process in the embodiments of the present disclosure.

[0097] Input / output interface 1800, used to implement information input and output; Communication interface 1900, used to realize communication interaction between the device and other devices, which can be realized through wired mode (such as USB, network cable, etc.) or wireless mode (such as mobile network, WIFI, Bluetooth, etc.); Bus 2000 , which transmits information between various components of the device (e.g., processor 1600 , memory 1700 , input / output interface 1800 , and communication interface 1900 ); The processor 1600 , the memory 1700 , the input / output interface 1800 , and the communication interface 1900 are connected to each other in communication within the device via the bus 2000 .

[0098] The embodiment of the present disclosure also provides a storage medium, which is a computer-readable storage medium. The computer-readable storage medium stores computer-executable instructions, and the computer-executable instructions are used to enable a computer to execute the above-mentioned method for optimizing the shot peening process.

[0099] The memory, as a non-transient computer-readable storage medium, can be used to store non-transient software programs and non-transient computer executable programs. In addition, the memory may include a high-speed random access memory, and may also include a non-transient memory, such as at least one disk storage device, a flash memory device, or other non-transient solid-state storage device. In some embodiments, the memory may optionally include a memory remotely disposed relative to the processor, and these remote memories may be connected to the processor via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0100] The embodiments described in the embodiments of the present disclosure are intended to more clearly illustrate the technical solutions of the embodiments of the present disclosure and do not constitute a limitation on the technical solutions provided by the embodiments of the present disclosure. Those skilled in the art will appreciate that with the evolution of technology and the emergence of new application scenarios, the technical solutions provided by the embodiments of the present disclosure are also applicable to similar technical problems.

[0101] Those skilled in the art will appreciate that the technical solutions shown in the figures do not limit the embodiments of the present disclosure and may include more or fewer steps than shown in the figures, or a combination of certain steps, or different steps.

[0102] The device embodiments described above are merely illustrative, and the units described as separate components may or may not be physically separated, that is, they may be located in one place or distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0103] Those skilled in the art will appreciate that all or some of the steps in the methods disclosed above, and the functional modules / units in the systems and devices may be implemented as software, firmware, hardware, or a suitable combination thereof.

[0104] The terms "first", "second", "third", "fourth", etc. (if any) in the specification of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0105] It should be understood that in the present application, "at least one (item)" means one or more, and "plurality" means two or more. "And / or" is used to describe the association relationship of associated objects, indicating that three relationships may exist. For example, "A and / or B" can mean: only A exists, only B exists, and A and B exist at the same time, where A and B can be singular or plural. The character " / " generally indicates that the objects associated before and after are in an "or" relationship. "At least one of the following" or similar expressions refers to any combination of these items, including any combination of single or plural items. For example, at least one of a, b or c can mean: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, c can be single or multiple.

[0106] In the several embodiments provided in the present application, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0107] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0108] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0109] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application is essentially or the part that contributes to the prior art or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including multiple instructions to enable an electronic device (which can be a personal computer, server, or network device, etc.) to perform all or part of the steps of each embodiment method of the present application. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (Read-Only Memory, ROM), random access memory (Random Access Memory, RAM), disk or optical disk and other media that can store programs.

[0110] The above is a specific description of the preferred implementation of the embodiments of the present application, but the embodiments of the present application are not limited to the above-mentioned implementation methods. Technical personnel familiar with the field can also make various equivalent modifications or substitutions without violating the spirit of the embodiments of the present application. These equivalent modifications or substitutions are all included in the scope defined by the claims of the embodiments of the present application.

[0111] The embodiments of the present application are described in detail above in conjunction with the accompanying drawings, but the present application is not limited to the above embodiments. Various changes can be made within the knowledge scope of ordinary technicians in the relevant technical field without departing from the purpose of the present application.

Claims

1. A method for optimizing a shot peening process, characterized in that: The method comprises: Under the condition of setting multiple index values ​​of the target shot peening process index, performing multiple corresponding shot peening experiments on the material to obtain multiple measurement data corresponding to the material after the multiple shot peening experiments; Calculating the crack closure stress, crack arrest stress and stress concentration factor of the material according to each of the measurement data in turn; Calculating the propagation rate of the surface crack of the material according to the measurement data, the crack closure stress, the crack arrest stress and the stress concentration factor; Selecting a target expansion rate from the expansion rates corresponding to the multiple measurement data; the target expansion rate is the lowest expansion rate among the expansion rates corresponding to the multiple measurement data; Shot peening the material according to the index value corresponding to the target expansion rate; The target shot peening process index includes at least one of shot size, spraying air pressure, spraying distance, shot peening flow rate and shot peening coverage rate.

2. The method for optimizing the shot peening process according to claim 1, characterized in that: The measurement data includes residual stress, crack length and grain composition, and the crack closure stress and crack arrest stress of the material are calculated in turn according to each of the measurement data, including: Fitting the residual stress in each of the measurement data to obtain a fitted residual stress; Calculating the crack closure stress according to the fitted residual stress; The crack arrest stress is calculated based on the crack closure stress and the grain composition in each piece of the measurement data.

3. The method for optimizing the shot peening process according to claim 2, characterized in that: The calculation formula of the crack closure stress includes: ； in, is the crack closure stress, is the crack length of the material, with the superscript represents the number of half grains that the crack passes through, is the fitted residual stress.

4. The method for optimizing the shot peening process according to claim 3, characterized in that: The calculation formula of the crack arrest stress includes: ； ； ； in, is the number of half crystals that the crack passes through, To pass through The grain orientation factor for a semi-crystalline is the strength at the grain boundary, is the width of the grain boundary, is the grain size, is the crack closure stress, is the fatigue strength of the material, is the crack closure stress, The crack propagates through the The stress that needs to be overcome at the grain boundary when a half-grain is formed is called the crack arrest stress.

5. The method for optimizing the shot peening process according to claim 2, characterized in that: The measurement data includes the microscopic pit depth and the microscopic pit half width on the surface of the material, and the stress concentration factor of the material is calculated according to each piece of the measurement data in turn, including: Calculating the stress concentration factor of the material according to the microscopic pit depth and the microscopic pit half width; The calculation formula of the stress concentration factor includes: ； ； ， 0.30； ， 0.15； in, is the microscopic pit depth, is the half-width of the microscopic pit, is the grain size, is the microscopic pit parameter of the material after shot peening, is the stress concentration factor, i is the number of half grains that the crack passes through, To measure the parameters of the material surface, to calculate The intermediate variable.

6. The method for optimizing shot peening process according to claim 1, characterized in that: The calculation formula of the expansion rate includes: ； ； in, is the opening displacement of the crack front, is the shear modulus, is Poisson's ratio, is the yield strength, is the crack closure stress, is the length of the crack, i is the number of half grains that the crack passes through, is the cumulative damage length of the crack, is the maximum applied stress, is the number of cyclic loading, and is the fitting constant.

7. The method for optimizing the shot peening process according to claim 6, characterized in that: The calculation formula of the crack length includes: ； ； ； ； in, and The cracks are i The starting and ending positions of each grain are The two extreme values ​​of is the crack arrest stress on the rough surface of the material, For the The grain size of a semi-crystalline is the microscopic pit parameter of the material after shot peening, To pass through The length of the crack when the crystal is half full.

8. A system for optimizing a shot peening process, characterized in that: The system comprises: An experimental module, used to perform a plurality of corresponding shot peening experiments on the material under the condition of setting a plurality of index values ​​of the target shot peening process index, and obtain a plurality of measurement data corresponding to the material after the plurality of shot peening experiments; A statistical module, for calculating the crack closure stress, crack arrest stress and stress concentration factor of the material according to each piece of the measurement data in turn; A calculation module, used for calculating the propagation rate of the surface crack of the material according to the measurement data, the crack closure stress, the crack arrest stress and the stress concentration factor; A screening module, configured to select a target expansion rate from the expansion rates corresponding to the plurality of measurement data; the target expansion rate is the lowest expansion rate among the expansion rates corresponding to the plurality of measurement data; A processing module, used for performing shot peening on the material according to the index value corresponding to the target expansion rate; The target shot peening process index includes at least one of shot size, spraying air pressure, spraying distance, shot peening flow rate and shot peening coverage rate.

9. An electronic device, characterized in that: It includes at least one control processor and a memory for communicating with the at least one control processor; the memory stores instructions that can be executed by the at least one control processor, and the instructions are executed by the at least one control processor so that the at least one control processor can execute a method for optimizing a shot peening process as described in any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer-executable instructions, and the computer-executable instructions are used to enable a computer to execute the method for optimizing a shot peening process according to any one of claims 1 to 7.

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