Multilayer electronic component

Abstract

The present disclosure provides a multilayer electronic component. The multilayer electronic component may include a body including a capacitance forming portion including a dielectric layer and internal electrodes alternately disposed with the dielectric layer in a first direction, an upper cover portion disposed above the capacitance forming portion in the first direction, a lower cover portion disposed above the upper cover portion in the first direction, and an identification portion disposed above the upper cover portion in the first direction, the lower covering part is arranged below the capacitance forming part in the first direction, and the identification part is arranged above the upper covering part in the first direction; and an external electrode disposed on the main body, and an average thickness of the lower cover portion in the first direction may be greater than an average thickness of the upper cover portion in the first direction, and the identification portion may include a waterproof material and a non-conductive heat resistant coating.

Description

[0001] This application claims the benefit of priority from Korean Patent Application No. 10-2023-0137728 filed on October 16, 2023 in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] The present disclosure relates to a multi-layer electronic assembly. Background Art

[0003] Multilayer ceramic capacitors (MLCC, a type of multilayer electronic component) are chip capacitors that are mounted on printed circuit boards of various electronic products (such as image display devices including liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smartphones, and mobile phones) and used to charge or discharge them.

[0004] Multilayer ceramic capacitors are used as components in various electronic devices due to their small size, high capacitance, and ease of mounting, and with the miniaturization and high output power of various electronic devices such as computers and mobile devices, the demand for miniaturization and high capacitance of multilayer ceramic capacitors is also increasing.

[0005] When a direct current voltage or an alternating current voltage is applied to a multilayer ceramic capacitor in which internal electrodes are stacked on each other with a dielectric layer interposed therebetween, a piezoelectric phenomenon may occur between the internal electrodes and vibration may occur.

[0006] As the dielectric constant of the dielectric layer increases, vibration tends to become significant when the shape of the sheet is relatively large based on the same capacitance. The vibration is transmitted from the external electrodes of the multilayer ceramic capacitor to the printed circuit board on which the multilayer ceramic capacitor is mounted. In this case, the printed circuit board vibrates and generates noise.

[0007] That is, when the noise generated by the vibration of the printed circuit board is included in the audible frequency (20 Hz to 20000 Hz), its vibration sound is unpleasant to humans, and this type of sound is called acoustic noise.

[0008] In order to reduce acoustic noise, a technology has been developed in which thicker stacking is performed on the lower portion of the capacitance forming portion and a light cover portion is provided on the lower portion of the capacitance forming portion in addition to the lower cover portion to identify the lower portion of the capacitance forming portion.

[0009] However, in order to achieve sensitivity in distinguishing the upper and lower portions of the capacitance forming portion, the degree of freedom in design may be reduced because the optical cover must be thick, and the moisture resistance reliability may be reduced because it is not easy to ensure the thickness of the upper cover.

[0010] Therefore, it is necessary to develop a structure that can reduce acoustic noise while ensuring moisture-resistant reliability.

[0011] [Prior art reference] [Patent Document] Korean Patent Publication No. 10-2014-0012577. Summary of the invention

[0012] An aspect of the present disclosure is to provide a multilayer electronic component having excellent reliability.

[0013] One aspect of the present disclosure is to reduce acoustic noise in multi-layer electronic assemblies.

[0014] An aspect of the present disclosure is to easily identify upper and lower portions of a multi-layer electronic component.

[0015] However, aspects of the present disclosure are not limited to the above and may be more easily understood in the course of describing specific embodiments of the present disclosure.

[0016] According to one aspect of the present disclosure, a multilayer electronic component may include: a main body, including a capacitor forming part, an upper covering part, a lower covering part and an identification part, the capacitor forming part including a dielectric layer and internal electrodes alternately arranged with the dielectric layer in a first direction, the upper covering part is arranged above the capacitor forming part in the first direction, the lower covering part is arranged below the capacitor forming part in the first direction, and the identification part is arranged above the upper covering part in the first direction; and an external electrode arranged on the main body, wherein the average thickness of the lower covering part in the first direction is greater than the average thickness of the upper covering part in the first direction, and the identification part includes a waterproof material and a non-conductive heat-resistant coating.

[0017] One of the various effects of the present disclosure is to improve the moisture resistance reliability of a multilayer electronic component.

[0018] One of the various effects of the present disclosure is to reduce acoustic noise of a multi-layer electronic component.

[0019] One of various effects of the present disclosure is to easily distinguish the upper and lower parts of a multi-layered electronic component.

[0020] However, the advantages and effects of the present disclosure are not limited to the above and may be more easily understood in the course of describing specific embodiments of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The above and other aspects, features and advantages of the present disclosure will be more clearly understood through the following detailed description in conjunction with the accompanying drawings, in which: Figure 1is a perspective view schematically illustrating a multilayer electronic component according to an example embodiment of the present disclosure; Figure 2 is along Figure 1 A schematic cross-sectional view taken along line II' of ; Figure 3 is along Figure 1 A schematic cross-sectional view taken along line II-II'; Figure 4 is a multilayer electronic component corresponding to Figure 2 ; Figure 5 is a perspective view schematically showing a conventional multi-layer electronic component; and Figure 6 is along Figure 5 Schematic cross-sectional view taken along line III-III'. DETAILED DESCRIPTION

[0022] Hereinafter, example embodiments of the present disclosure will be described with reference to the accompanying drawings. However, the embodiments of the present disclosure may be shown in many different forms and should not be construed as being limited to the specific embodiments set forth herein. The example embodiments disclosed herein are provided to better explain the present disclosure to those skilled in the art. Therefore, in the accompanying drawings, for the sake of clarity, the shapes and sizes of the elements may be exaggerated, and the same or similar reference numerals will always be used to represent the same or similar elements.

[0023] In addition, in order to clearly describe the present disclosure in the drawings, contents irrelevant to the description are omitted, and although the size (e.g., thickness) of each component shown in the drawings is arbitrarily shown for the convenience of description, the present disclosure is not limited thereto. In addition, components having the same functions within the scope of the same concept are described using the same reference numerals. Throughout the specification, unless otherwise specified, when a part "includes" or "contains" a component, this means that other components are not excluded and other components may be further included.

[0024] In the drawings, a first direction may be defined as a thickness direction, a second direction may be defined as a length direction, and a third direction may be defined as a width direction.

[0025] Multilayer electronic components Figure 1 is a perspective view schematically illustrating a multilayer electronic component according to an example embodiment of the present disclosure.

[0026] Figure 2 is along Figure 1 Schematic cross-sectional view taken along line II'.

[0027] Figure 3 is along Figure 1 Schematic cross-sectional view taken along line II-II'.

[0028] In the following, reference will be made to Figures 1 to 3 The multilayer electronic component 100 according to some example embodiments of the present disclosure is described in detail. In addition, as an example of the multilayer electronic component, a multilayer ceramic capacitor will be described, but the present disclosure is not limited thereto.

[0029] According to some example embodiments of the present disclosure, a multilayer electronic component 100 may include: a main body 110 including a capacitor forming portion Ac, an upper covering portion 112, a lower covering portion 113 and an identification portion 140, the capacitor forming portion Ac including a dielectric layer 111 and internal electrodes 121 and 122 alternately arranged with the dielectric layer 111 in a first direction, the upper covering portion 112 being arranged above the capacitor forming portion Ac in the first direction and adjacent to the capacitor forming portion Ac in the first direction, the lower covering portion 113 being arranged below the capacitor forming portion Ac in the first direction and adjacent to the capacitor forming portion Ac in the first direction, the identification portion 140 being arranged on an upper portion of the upper covering portion 112 in the first direction; and external electrodes 131 and 132 being arranged on the main body 110, and an average thickness tc2 of the lower covering portion 113 being greater than an average thickness tc1 of the upper covering portion 112, and the identification portion 140 may include a waterproof material and a non-conductive heat-resistant coating.

[0030] Figure 5 is a perspective view schematically showing a conventional multilayer electronic component 200, Figure 6 is along Figure 5 Schematic cross-sectional view taken along line III-III'.

[0031] In a conventional multilayer electronic component 200 including a main body 210, a thicker stack is performed on the lower portion of the capacitor forming portion Ac to reduce acoustic noise, and in addition to a lower covering portion 213 having the same composition as the upper covering portion 212, an optical covering portion 214 for identifying the lower portion of the capacitor forming portion is provided on the lower portion of the capacitor forming portion, thereby identifying the upper and lower portions of the multilayer electronic component 200.

[0032] However, in order to achieve the sensitivity of identifying the upper and lower parts of the multilayer electronic component 200, as shown in FIG. Figure 6 As shown, there is a problem that the degree of freedom in design is reduced because the light cover 214 must be thicker than the lower cover 213, and there is a problem that the moisture resistance reliability is reduced because it is not easy to ensure the thickness of the upper cover 212.

[0033] On the other hand, in the present disclosure, the identification part 140 including the waterproof material and the non-conductive heat-resistant paint may be disposed on the upper portion of the upper cover part 112 in the first direction, thereby reducing acoustic noise while ensuring moisture-resistant reliability.

[0034] Hereinafter, each configuration included in the multilayer electronic component 100 according to some example embodiments of the present disclosure will be described.

[0035] The body 110 may include dielectric layers 111 and internal electrodes 121 and 122 that are alternately stacked.

[0036] There is no particular limitation on the specific shape of the body 110, but Figures 1 to 3 As shown, the body 110 may have a hexahedral shape or a shape similar to the hexahedral shape. Due to shrinkage of ceramic powder particles included in the body 110 during a sintering process, the body 110 may not have a hexahedral shape with completely straight lines but may have a substantially hexahedral shape.

[0037] The body 110 may have a first surface 1 and a second surface 2 opposite to each other in a first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and opposite to each other in the second direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface 1 and the second surface 2 and the third surface 3 and the fourth surface 4 and opposite to each other in a third direction.

[0038] Since edge regions of the dielectric layer 111 where the internal electrodes 121 and 122 are not provided overlap each other in the first direction, a step difference due to the thickness of the internal electrodes 121 and 122 may occur, so that when viewed from the first surface or the second surface, a corner connecting the first surface with the third surface to the sixth surface and / or a corner connecting the second surface with the third surface to the sixth surface may have a shape that contracts toward the center of the body 110 in the first direction. Alternatively, due to shrinkage behavior during the sintering process of the body, when viewed from the first surface or the second surface, a corner connecting the first surface 1 with the third surface 3, the fourth surface 4, the fifth surface 5, and the sixth surface 6 and / or a corner connecting the second surface 2 with the third surface 3, the fourth surface 4, the fifth surface 5, and the sixth surface 6 may have a shape that contracts toward the center of the body 110 in the first direction. Optionally, in order to prevent chipping defects, each corner of the surface of the connecting body 110 can be rounded by performing a separate process so that the corners connecting the first surface and the third surface to the sixth surface and / or the corners connecting the second surface and the third surface to the sixth surface can have a rounded shape.

[0039] In addition, in order to suppress the step difference caused by the inner electrodes 121 and 122, after stacking, cutting may be performed such that the inner electrodes are exposed on the two side surfaces of the capacitance forming portion Ac in the third direction (width direction). Then, the edge portions 114 and 115 are formed by stacking a single dielectric layer or two or more dielectric layers on the two side surfaces of the capacitance forming portion Ac in the third direction (width direction). In this case, the corners connecting the first surface to the fifth and sixth surfaces and the corners connecting the second surface to the fifth and sixth surfaces may not have a contracted shape.

[0040] In a state where the plurality of dielectric layers 111 forming the main body 110 are sintered, adjacent dielectric layers 111 may be integrated to such an extent that it is difficult to identify the boundary between adjacent dielectric layers 111 without using a scanning electron microscope (SEM). The number of dielectric layers is not particularly limited and may be determined in consideration of the size of the multilayer electronic component. For example, the main body may be formed by stacking 400 or more dielectric layers.

[0041] The dielectric layer 111 may be formed by: manufacturing a ceramic slurry including ceramic powder particles, an organic solvent, and a binder, coating the slurry on a carrier film and drying it to prepare a ceramic green sheet, and then sintering the ceramic green sheet. The ceramic powder particles are not particularly limited as long as sufficient electrostatic capacitance can be obtained. However, for example, barium titanate (BaTiO3)-based powder particles may be used as the ceramic powder particles. For a more specific example, the ceramic powder particles may be at least one of BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), and Ba(Ti 1-y Zr y )O3 (0 < y < 1).

[0042] The average thickness td of the dielectric layer 111 is not particularly limited, but may be arbitrarily set according to desired characteristics or purposes. For example, the average thickness td of the dielectric layer 111 may be 100 μm or less.

[0043] Here, the average thickness td of the dielectric layer 111 may refer to the first direction average size of the dielectric layer 111 disposed between the internal electrodes 121 and 122. The average thickness of the dielectric layer 111 may be measured by scanning the first and second direction cross sections of the body 110 with a scanning electron microscope (SEM) at a magnification of 10,000 times. More specifically, the average value may be obtained by measuring the thickness at a plurality of regions (e.g., 30 regions spaced apart from each other at equal intervals in the second direction) of one dielectric layer 111. 30 regions with equal intervals may be specified in the capacitor forming portion Ac to be described below. In addition, when the average value is obtained by extending the average value measurement to 10 dielectric layers 111, the average thickness of the dielectric layer 111 may be further generalized.

[0044] The body 110 may include: a capacitor forming portion Ac, which is arranged inside the body 110 and is configured to form a capacitor by including a first internal electrode 121 and a second internal electrode 122 arranged to face each other and having a dielectric layer 111 interposed between the first internal electrode 121 and the second internal electrode 122; and covering portions 112 and 113, which are formed above and below the capacitor forming portion Ac in a first direction.

[0045] In addition, the capacitance forming part Ac is a portion contributing to forming the capacitance of the capacitor and may be formed by repeatedly stacking a plurality of first internal electrodes 121 and a plurality of second internal electrodes 122 with the dielectric layer 111 interposed therebetween.

[0046] The covering portions 112 and 113 may include an upper covering portion 112 disposed above and adjacent to the capacitance forming portion Ac in the first direction and a lower covering portion 113 disposed below and adjacent to the capacitance forming portion Ac in the first direction.

[0047] The upper cover 112 and the lower cover 113 may be formed by stacking a single dielectric layer or two or more dielectric layers in a thickness direction on the upper and lower surfaces of the capacitance forming part Ac, respectively, and may be mainly used to prevent damage to the internal electrodes due to physical stress or chemical stress.

[0048] The upper cover 112 and the lower cover 113 do not include an internal electrode, and may include the same material as the dielectric layer 111 .

[0049] That is, the upper cover 112 and the lower cover 113 may include a ceramic material, for example, a barium titanate (BaTiO 3 )-based ceramic material.

[0050] In some example embodiments, an average thickness tc2 of the lower cover 113 in the first direction may be greater than an average thickness tc1 of the upper cover 112 in the first direction. Therefore, acoustic noise may be reduced.

[0051] In some example embodiments, when the average thickness of the upper cover portion is referred to as tc1, the average thickness of the lower cover portion is referred to as tc2, and the average thickness of the identification portion is referred to as tc3, (tc1+tc3) / tc2 may be less than or equal to 0.85. When (tc1+tc3) / tc2 is greater than 0.85, the effect of reducing acoustic noise may be insufficient.

[0052] In addition, (tc1+tc3) / tc2 may be greater than or equal to 0.43 and less than or equal to 0.85. When (tc1+tc3) / tc2 is greater than 0.85, the effect of reducing acoustic noise may be insufficient, and when (tc1+tc3) / tc2 is less than 0.43, moisture resistance reliability may be reduced.

[0053] In addition, an average thickness of the identification portion 140 in the first direction may be greater than or equal to 10 μm and less than or equal to 40 μm.

[0054] Here, the average thickness tc1 of the upper cover 112 may refer to an average size of the upper cover 112 in the first direction, and the average thickness tc2 of the lower cover 113 may refer to an average size of the lower cover 113 in the first direction.

[0055] In addition, the average thickness tc1 of the upper cover 112 and the average thickness tc2 of the lower cover 113 are not particularly limited and may be appropriately selected according to the size of the multilayer electronic component.

[0056] For example, when the multilayer electronic component is 1005 size (length 1.0 mm, width 0.5 mm), the average thickness of the upper cover may be greater than or equal to 58 μm and less than or equal to 88 μm. In addition, the average thickness of the lower cover may be greater than or equal to 104 μm and less than or equal to 134 μm.

[0057] When the average thickness of the upper cover is less than 58 μm, moisture resistance reliability may be reduced, and when the average thickness of the upper cover is greater than 88 μm, the thickness of the multilayer electronic component may be significantly increased.

[0058] When the average thickness of the lower cover is less than 104 μm, the effect of reducing acoustic noise may be insufficient, and when the average thickness of the lower cover is greater than 134 μm, the thickness of the multilayer electronic component may be significantly increased.

[0059] In some example embodiments, when an average thickness of the capacitance forming portion is referred to as tac and an average thickness of the lower covering portion is referred to as tc2, tac / tc2 may be greater than or equal to 4 and less than or equal to 7.

[0060] The identification part 140 may be disposed on an upper portion of the upper cover part 112 in the first direction, and may include a waterproof material and a non-conductive heat-resistant paint.

[0061] In order to reduce acoustic noise, when the lower cover 113 is made thicker than the upper cover 112, since the moisture penetration path in the upper cover 112 is shortened, most of the moisture penetration may occur in the upper cover 112. According to some example embodiments of the present disclosure, since the identification part 140 includes a waterproof material and is disposed on the upper cover 112 that is thinner than the lower cover 113, the moisture resistance reliability can be improved by blocking the moisture penetration path.

[0062] In addition, when the optical cover 214 is used to identify the upper and lower parts of the multilayer electronic component 100, the optical cover 214 is generally formed by stacking one or more dielectric layers to which elements for realizing different colors are added. However, in order to ensure the sensitivity for identifying the upper and lower parts, the optical cover 214 must be thick, and therefore, the optical cover 214 must be provided on the lower part of the multilayer electronic component 100, and there is a problem that the degree of freedom in designing the multilayer electronic component is reduced.

[0063] On the other hand, according to some example embodiments of the present disclosure, since the identification portion 140 includes a non-conductive heat-resistant coating, the upper and lower portions of the multilayer electronic component 100 can be identified by the identification portion 140 even though the identification portion 140 has a thinner thickness, so that the conventional optical covering portion 214 having a thicker thickness can be replaced by the identification portion 140.

[0064] In some example embodiments, when the average thickness of the upper cover in the first direction is referred to as tc1, and the average thickness of the identification part in the first direction is referred to as tc3, tc3 / tc1 may be greater than or equal to 0.21 and less than or equal to 0.83. When tc3 / tc1 is greater than 0.83, the effect of reducing acoustic noise may be insufficient, and when tc3 / tc1 is less than 0.21, moisture resistance reliability may be reduced.

[0065] As an example of a method of measuring the above tc3, tc1, tac, and tc2, a cross section in the first direction and the second direction cut from the center of the main body in the third direction (eg Figure 2The first direction dimensions of the identification portion 140, the upper covering portion 112, the capacitor forming portion Ac and the lower covering portion 113 can be measured at five regions spaced apart from each other at equal intervals in the first direction and the second direction cross-sections, respectively, and the average values ​​of the first direction dimensions of the identification portion 140, the upper covering portion 112, the capacitor forming portion Ac and the lower covering portion 113 can be obtained respectively, and the average values ​​of the first direction dimensions of the identification portion 140, the upper covering portion 112, the capacitor forming portion Ac and the lower covering portion 113 can be referred to as tc3, tc1, tac and tc2, respectively. The first direction dimension of the upper covering portion can be the first direction dimension from the interface between the upper covering portion and the identification portion 140 to the upper surface of the inner electrode disposed at the uppermost portion in the first direction, and the first direction dimension of the lower covering portion can be the first direction dimension from the first surface to the lower surface of the inner electrode disposed at the lowermost portion in the first direction.

[0066] The non-conductive heat-resistant paint included in the identification part 140 in the present disclosure may include a material that maintains the original color and is non-conductive even when heat-treated at a temperature of 100 degrees or more and 1400 degrees or less.

[0067] In some example embodiments, the non-conductive heat-resistant paint included in the identification portion 140 may be different in brightness and / or color from the lower cover portion 113. In addition, the non-conductive heat-resistant paint included in the identification portion 140 may be different in brightness and / or color from the upper cover portion 112.

[0068] As a specific example of the non-conductive heat-resistant paint included in the identification part 140, the non-conductive heat-resistant paint may include one or more selected from the group consisting of Ba, Si and Al. In addition, even if the non-conductive heat-resistant paint does not include Ba, Si and Al, the non-conductive heat-resistant paint may also include inorganic ceramic elements. In addition, the non-conductive heat-resistant paint may include one or more selected from the group consisting of Ba, Si, Al and inorganic ceramic elements. Therefore, even if the identification part 140 has a thinner thickness, it is possible to achieve a sensitivity equal to or better than that of a conventional light cover 214 having a thicker thickness.

[0069] In the present disclosure, the waterproof material included in the identification part 140 may include a material having a contact angle with water of 100 degrees or more.

[0070] In some example embodiments, the waterproof material included in the identification portion 140 may include at least one selected from the group consisting of silicon (Si) and fluorine (F), so that the identification portion 140 may have a waterproof property. More specifically, the waterproof material included in the identification portion 140 may include at least one selected from the group consisting of a silicon-based hydrocarbon compound and a fluorine-based hydrocarbon compound.

[0071] The method of forming the identification part 140 is not particularly limited, for example, the identification part 140 may be formed by mixing a non-conductive heat-resistant paint and a waterproof material and then applying the mixture to an upper portion of the upper cover 112 in the first direction.

[0072] In some example embodiments, the identification part 140 may be provided to cover the entire upper portion of the upper cover part 112 in the first direction.

[0073] However, the present disclosure is not limited thereto, and reference is made to Figure 2 The corresponding diagram Figure 4 As a multilayer electronic component according to another example embodiment of the present disclosure, the identification portion 140' may be configured to cover only a portion of the upper portion of the upper cover portion 112 in the first direction, and an area on the upper portion of the upper cover portion 112 in the first direction that is not covered by the identification portion 140' may be covered by the external electrodes 131 and 132.

[0074] More specifically, the main body 110 may include a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and opposite to each other in a third direction, the external electrodes 131 and 132 may be arranged on the third surface and the fourth surface and may extend to a portion of the first surface, a portion of the second surface, a portion of the fifth surface, and a portion of the sixth surface, and the identification portion 140 may be arranged on an area of ​​the second surface not covered by the external electrodes 131 and 132.

[0075] In addition, the edge portions 114 and 115 may be provided on both side surfaces of the capacitance forming portion Ac in the third direction (width direction).

[0076] The edge portions 114 and 115 may include a first edge portion 114 disposed on one side surface of the capacitance forming portion Ac in the third direction (width direction) and a second edge portion 115 disposed on the other side surface of the capacitance forming portion Ac in the third direction (width direction). That is, the edge portions 114 and 115 may be disposed on both side surfaces of the capacitance forming portion Ac in the third direction (width direction).

[0077] like Figure 3 As shown, the edge portions 114 and 115 may refer to regions between both ends of the first and second internal electrodes 121 and 122 in the third direction and an outer surface of the body 110 in the third direction in a cross section obtained by cutting the body 110 in the width-thickness direction.

[0078] The edge portions 114 and 115 may mainly serve to prevent damage to the inner electrodes due to physical stress or chemical stress.

[0079] The edge portions 114 and 115 may be formed by forming internal electrodes by coating a conductive paste on regions of the ceramic green sheet except for regions where the edge portions are to be formed.

[0080] In addition, in order to suppress the step difference caused by the internal electrodes 121 and 122, cutting may be performed after stacking so that the internal electrodes are exposed to two side surfaces of the capacitor forming portion Ac in the third direction (width direction), and then, edge portions 114 and 115 may be formed by stacking a single dielectric layer or two or more dielectric layers on the two side surfaces of the capacitor forming portion Ac in the third direction (width direction).

[0081] In addition, the width of the edge portions 114 and 115 in the third direction is not particularly limited. However, in order to more easily achieve miniaturization and high capacitance of the multilayer electronic component, the average width of the edge portions 114 and 115 in the third direction may be 600 μm or less.

[0082] The average width of the edge portions 114 and 115 may refer to an average size of an area where the inner electrode is spaced apart from the fifth surface in the third direction and an average size of an area where the inner electrode is spaced apart from the sixth surface in the third direction, and may be an average value obtained by averaging the third-direction dimensions of the edge portions 114 and 115 measured at five areas spaced apart from each other at equal intervals on the side surface of the capacitor forming portion Ac.

[0083] Therefore, in some example embodiments, at least one of an average size of a region where the internal electrodes 121 and 122 are spaced apart from the fifth surface in the third direction and an average size of a region where the internal electrodes 121 and 122 are spaced apart from the sixth surface in the third direction may be 600 μm or less.

[0084] The internal electrodes 121 and 122 may include a first internal electrode 121 and a second internal electrode 122. The first internal electrodes 121 and the second internal electrodes 122 may be alternately disposed to face each other with the dielectric layer 111 interposed therebetween, and the first internal electrodes 121 and the second internal electrodes 122 may be exposed to the third surface 3 and the fourth surface 4 of the body 110, respectively.

[0085] The first internal electrode 121 may be spaced apart from the fourth surface 4 and may be exposed through the third surface 3, and the second internal electrode 122 may be spaced apart from the third surface 3 and may be exposed through the fourth surface 4. The first external electrode 131 may be disposed on the third surface 3 of the body and may be connected to the first internal electrode 121, and the second external electrode 132 may be disposed on the fourth surface 4 of the body and may be connected to the second internal electrode 122.

[0086] That is, the first internal electrode 121 is not connected to the second external electrode 132 but is connected to the first external electrode 131, and the second internal electrode 122 is not connected to the first external electrode 131 but is connected to the second external electrode 132. Therefore, the first internal electrode 121 may be formed to be spaced apart from the fourth surface 4 by a certain distance, and the second internal electrode 122 may be formed to be spaced apart from the third surface 3 by a certain distance. In addition, the first internal electrode 121 and the second internal electrode 122 may be spaced apart from the fifth surface and the sixth surface of the body 110.

[0087] The conductive metal included in the internal electrodes 121 and 122 may be one or more selected from the group consisting of Ni, Cu, Pd, Ag, Au, Pt, In, Sn, Al, Ti, and alloys thereof, and the present disclosure is not limited thereto.

[0088] The average thickness te of the internal electrodes in the first direction is not particularly limited. In this case, the thickness of the internal electrodes 121 and 122 may refer to the first direction dimension of the internal electrodes 121 and 122. For example, the average thickness te of the internal electrodes may be 0.05 μm to 3.0 μm.

[0089] Here, the average thickness te of the internal electrode can be measured by scanning the first and second direction cross sections of the body 110 with a scanning electron microscope (SEM) at a magnification of 10,000 times. More specifically, the average value can be obtained by measuring the thickness at a plurality of regions of one internal electrode 121 or 122 (for example, at 30 regions spaced apart from each other at equal intervals in the second direction). 30 regions with equal intervals can be specified in the capacitor forming portion Ac. In addition, when the average value is obtained by extending the average value measurement to 10 internal electrodes 121 and 122, the average thickness of the internal electrodes 121 and 122 can be further generalized.

[0090] The external electrodes 131 and 132 may be disposed on the body 110 .

[0091] For a specific example, the external electrodes 131 and 132 may be disposed on the third surface 3 and the fourth surface 4 of the body 110. The external electrodes 131 and 132 may include a first external electrode 131 and a second external electrode 132, which are respectively disposed on the third surface 3 and the fourth surface 4 of the body 110 and are respectively connected to the first internal electrode 121 and the second internal electrode 122.

[0092] In some example embodiments, a structure in which the multilayer electronic component 100 has two external electrodes 131 and 132 is described, but the number or shape of the external electrodes 131 and 132 may be changed according to the shapes of the internal electrodes 121 and 122 or other purposes.

[0093] In addition, the external electrodes 131 and 132 may include any material (such as metal) as long as the material has conductivity, and the specific material of the external electrodes 131 and 132 may be determined in consideration of electrical characteristics, structural stability, etc. In addition, the external electrodes 131 and 132 may have a multi-layer structure.

[0094] For example, the external electrodes 131 and 132 may include electrode layers 131 a and 132 a disposed on the body 110 and plating layers 131 b and 132 b formed on the electrode layers 131 a and 132 a .

[0095] For a more specific example of the electrode layers 131 a and 132 a , the electrode layers 131 a and 132 a may be fired electrodes including a conductive metal and glass, or may be resin-based electrodes including a conductive metal and resin.

[0096] In addition, the electrode layers 131a and 132a can be formed by sequentially forming a fired electrode and a resin-based electrode on the main body. In addition, the electrode layers 131a and 132a can be formed by transferring a sheet including a conductive metal to the main body, or by transferring a sheet including a conductive metal to the fired electrode.

[0097] A material having excellent conductivity may be used as the conductive metal included in the electrode layers 131a and 132a, but the present disclosure is not limited thereto. For example, the conductive metal may be one or more selected from the group consisting of nickel (Ni), copper (Cu), and alloys thereof.

[0098] The plating layers 131b and 132b may be used to improve mounting characteristics. The type of the plating layers 131b and 132b is not particularly limited, and the plating layers 131b and 132b may be plating layers including one or more of Ni, Sn, Pd, and alloys thereof, and may be formed of a plurality of layers.

[0099] For a more specific example of the plating layers 131b and 132b, the plating layers 131b and 132b may be Ni plating layers or Sn plating layers, or the plating layers 131b and 132b may be in the form of sequentially forming Ni plating layers and Sn plating layers on the electrode layers 131a and 132a, or may be in the form of sequentially forming Sn plating layers, Ni plating layers, and Sn plating layers on the electrode layers 131a and 132a. In addition, the plating layers 131b and 132b may include a plurality of Ni plating layers and / or a plurality of Sn plating layers.

[0100] <Invention Example> After preparing sample sheets by changing the average thickness tc3 of the identification part, the average thickness tc1 of the upper cover part, and the average thickness tc2 of the lower cover part, moisture resistance reliability and acoustic noise were evaluated and listed in Table 1 below.

[0101] For moisture resistance reliability, after preparing 1,200 sample pieces for each test number, the sample pieces were mounted on three boards in which 20 sample pieces could be mounted per channel and 20 channels could be mounted on one board, that is, 400 sample pieces could be mounted on one board, and then, at a temperature of 85°C and a relative humidity of 85%, a voltage of 1.2Vr was applied for 24 hours, and thus, sample pieces whose insulation resistance values ​​were reduced by 5 orders of magnitude or more compared to the initial value were determined to be defective, and the number of sample pieces determined to be defective was listed.

[0102] The acoustic noise was measured with a 40HF device from GRAS. The acoustic noise was measured under the following conditions: DC bias 3 V, AC voltage (peak to peak): 1 Vp-p, frequency: 400 Hz to 20 kHz (sine sweep), 400 Hz to 10 kHz (low frequency) and 400 Hz to 20 kHz (full frequency).

[0103] Table 1:

[0104] Referring to the above Table 1, it can be confirmed that when tc3 / tc1 is less than 0.21, the moisture resistance reliability is defective, and it can be confirmed that when tc3 / tc1 is greater than 0.83, the acoustic noise exceeds 29 dB and the acoustic noise suppression effect is insufficient.

[0105] On the other hand, in test numbers 5 to 9 where tc3 / tc1 was equal to or greater than 0.21 and equal to or less than 0.83, it was confirmed that no moisture resistance reliability defect occurred and acoustic noise was also suppressed.

[0106] Although the exemplary embodiments of the present disclosure have been described in detail above, the present disclosure is not limited to the above embodiments and the accompanying drawings, but is defined by the appended claims. Therefore, those of ordinary skill in the art may make various substitutions, modifications or changes without departing from the scope of the present disclosure defined by the appended claims, and these substitutions, modifications or changes should be interpreted as being included within the scope of the present disclosure.

[0107] In addition, the expression "exemplary embodiment" used in the present disclosure does not mean the same embodiment, and is provided to emphasize and explain different unique characteristics. However, the embodiment presented above does not exclude the combination of features with another embodiment. For example, although a matter described in a specific embodiment is not described in another embodiment, unless there is a description opposite or contradictory to the matter in another embodiment, the matter can be understood as a description related to another embodiment.

[0108] In the present disclosure, the terms are only used to describe specific embodiments and are not intended to limit the present disclosure. Unless the context clearly indicates otherwise, a singular form may also include a plural form.

Claims

1. A multilayer electronic component comprising: A main body, comprising a capacitor forming part, an upper covering part, a lower covering part and an identification part, wherein the capacitor forming part comprises a dielectric layer and inner electrodes arranged alternately with the dielectric layer in a first direction, the upper covering part is arranged above the capacitor forming part in the first direction, the lower covering part is arranged below the capacitor forming part in the first direction, and the identification part is arranged above the upper covering part in the first direction; as well as an outer electrode, disposed on the body, wherein the average thickness of the lower covering portion in the first direction is greater than the average thickness of the upper covering portion in the first direction, and The identification portion includes a waterproof material and a non-conductive heat-resistant paint.

2. The multilayer electronic component according to claim 1, wherein When the average thickness of the upper cover portion is tc1 and the average thickness of the identification portion in the first direction is tc3, tc3 / tc1 is greater than or equal to 0.21 and less than or equal to 0.

83.

3. The multilayer electronic component according to claim 1, wherein: When the average thickness of the upper cover is tc1, the average thickness of the lower cover is tc2, and the average thickness of the identification portion in the first direction is tc3, (tc1+tc3) / tc2 is greater than or equal to 0.43 and less than or equal to 0.

85.

4. The multilayer electronic component according to claim 1, wherein: When the average thickness of the capacitance forming portion in the first direction is tac and the average thickness of the lower covering portion is tc2, tac / tc2 is greater than or equal to 4 and less than or equal to 7.

5. The multilayer electronic component according to claim 1, wherein An average thickness of the identification portion in the first direction is greater than or equal to 10 μm and less than or equal to 40 μm.

6. The multilayer electronic component according to claim 1, wherein: The average thickness of the upper cover is greater than or equal to 58 μm and less than or equal to 88 μm.

7. The multilayer electronic component according to claim 1, wherein: The average thickness of the lower cover portion is greater than or equal to 104 μm and less than or equal to 134 μm.

8. The multilayer electronic component according to claim 1, wherein The non-conductive heat-resistant paint is different in brightness and / or color from the lower cover portion and / or the upper cover portion.

9. The multilayer electronic component according to claim 1, wherein: The non-conductive heat-resistant coating includes one or more selected from the group consisting of Ba, Si, Al and inorganic ceramic elements.

10. The multilayer electronic component according to claim 1, wherein The waterproof material includes at least one selected from the group consisting of Si and F.

11. The multilayer electronic component according to claim 1, wherein The waterproof material includes at least one selected from the group consisting of silicon-based hydrocarbon compounds and fluorine-based hydrocarbon compounds.

12. The multilayer electronic component according to claim 1, wherein The identification portion is provided to cover the entire upper portion of the upper cover portion in the first direction.

13. The multilayer electronic component according to claim 1, wherein The identification portion is provided to cover a portion of an upper portion of the upper cover portion in the first direction, and a region of the upper portion of the upper cover portion in the first direction that is not covered by the identification portion is covered by the external electrode.

14. The multilayer electronic component according to claim 1, wherein The body includes a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and opposite to each other in the third direction, and The external electrodes are arranged on the third surface and the fourth surface and extend to cover a portion of the first surface, a portion of the second surface, a portion of the fifth surface and a portion of the sixth surface, and the identification portion is arranged on an area of ​​the second surface not covered by the external electrodes.

Images