Silicon wafer transmission method, sorting equipment and silicon wafer transmission device

By introducing a flexible operation control instruction system in silicon wafer transmission and sorting equipment, the problems of low efficiency and low degree of automation in the prior art are solved, and higher equipment automation and production efficiency are achieved.

CN119852206AActive Publication Date: 2025-04-18XIAN ESWIN MATERIAL TECHNOLOGY CO LTD +1
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Patent Information

Application Number
CN202411822376.0
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-11
Publication Date
2025-04-18
Estimated Expiration
2044-12-11

AI Technical Summary

Technical Problem

The prior art has problems such as inefficiency, complex operation, error-prone and difficult to achieve full automation in the process of silicon wafer transmission and sorting, especially in high-capacity production scenarios.

Method used

By providing a silicon wafer transmission method, sorting equipment and silicon wafer transmission device, the operating form of the sorting equipment can be flexibly switched, and precise control of the silicon wafer transmission path and bearing position can be achieved by receiving different operation control instructions (first operation control instructions or second operation control instructions).

Benefits of technology

It improves the flexibility and automation of sorting equipment, supports sorting operations under different production needs, reduces manual intervention, improves transmission efficiency and sorting accuracy, reduces error rates, and maximizes equipment productivity.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention provides a silicon wafer transmission method, sorting equipment and a silicon wafer transmission device, and is applied to the sorting equipment, the method comprises the following steps: receiving a first operation control instruction or a second operation control instruction from an EAP equipment automation platform; transmitting a silicon wafer from a first carrier to a target bearing position in a target carrier under the condition that the first operation control instruction is received; or, under the condition that the second operation control instruction is received, the silicon wafer is transmitted from the first carrier to one bearing position in one second carrier of the first target loading port. The transmission path is distinguished through the first operation control instruction and the second operation control instruction, so that the sorting equipment can flexibly switch operation modes according to actual production requirements, automatic scheduling and sorting control are achieved, the error rate is effectively reduced, and maximization of the equipment utilization rate is facilitated.
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Citation Information

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