Semiconductor process equipment

Abstract

The invention discloses semiconductor processing equipment, and belongs to the technical field of semiconductor processing, the semiconductor processing equipment comprises a cavity, a door body, an air inlet pipe and a blocking assembly, the door body can be connected with the cavity in a sealing manner to define a process cavity, the process cavity is used for accommodating a wafer boat, and the air inlet pipe and the blocking assembly are both arranged in the cavity. An opening of the air inlet pipe faces the door body; in the axial direction of the cavity, the blocking assembly is located between the door body and the air inlet pipe and comprises a plurality of blocking plates which are arranged at intervals in the axial direction, and in the plane perpendicular to the axial direction of the cavity, the projection of the outer edge of each blocking plate covers the projection of the wafer boat. The semiconductor process equipment can solve the problems that in the gas feeding process of existing semiconductor process equipment, due to the fact that gas flows to the furnace door, a sealing ring between the furnace door and the furnace body is prone to losing efficacy, sealing of the furnace body loses efficacy, and normal proceeding of the process is affected.

Description

Technical Field

[0001] The present application belongs to the field of semiconductor processing technology, and specifically relates to a semiconductor process equipment. Background Art

[0002] The horizontal diffusion furnace is an important equipment in the processing of semiconductor products such as solar cells. It usually includes a furnace body and a furnace door. The furnace door is equipped with carriers such as process paddles, and a part of the carrier can be extended into the furnace body. The carrier boat is carried by the carrier, and the carrier usually carries multiple carrier boats. Multiple carrier boats can be installed on the carrier together through a bracket. During the process, after the carrier is installed in the furnace body, the furnace door can be used to achieve the purpose of sealing with the furnace body. Among them, the furnace door and the furnace body are generally connected by a flange, and the flange is provided with a groove. By setting a sealing ring made of rubber or other materials in the groove, a good sealing relationship can be formed between the furnace door and the furnace body.

[0003] The furnace body is also provided with an air intake pipe for conveying gas. In order to achieve a relatively good process effect, the air intake pipe is usually used to heat the gas during the process of conveying gas into the furnace body, so that the temperature of the gas when it is input into the furnace body meets the process temperature. However, since the opening of the current air intake pipe in the furnace body is facing the side where the furnace door is located, and the distance between the opening of the air intake pipe and the furnace door is relatively small, a large amount of gas flows to the area where the furnace door is located during the process of introducing gas. Under the baking and impact of the hot air flow for a long time, the sealing ring between the furnace door and the furnace body is very likely to fail, resulting in failure of the seal of the furnace body, affecting the normal progress of the process. Summary of the invention

[0004] The purpose of the embodiments of the present application is to provide a semiconductor process equipment to solve the problem that in the process of introducing gas into the current semiconductor process equipment, the gas flows to the furnace door, causing the sealing ring between the furnace door and the furnace body to fail easily, resulting in failure of the seal of the furnace body and affecting the normal progress of the process.

[0005] The embodiment of the present application discloses a semiconductor process equipment, which includes a cavity, a door body, an air inlet pipe and a blocking component, wherein: The door body can be sealed and connected to the cavity body to form a process cavity, and the process cavity is used to accommodate the carrier boat. The air inlet pipe and the blocking component are both arranged in the cavity body, and the opening of the air inlet pipe faces the door body; In the axial direction of the cavity, the blocking assembly is located between the door body and the air inlet pipe, and the blocking assembly includes a plurality of blocking plates, which are arranged at intervals along the axial direction, and in a plane perpendicular to the axial direction of the cavity, the projection of the outer edge of each of the blocking plates covers the projection of the supporting boat.

[0006] The embodiment of the present application discloses a semiconductor process equipment, whose door body can be sealed and connected with the cavity body, and encloses a process cavity for accommodating a carrying boat. Of course, a device such as a sealing ring made of rubber material can be set between the door body and the cavity body to maintain a good sealing connection relationship between the door body and the cavity. At the same time, an air inlet pipe and a blocking component are arranged inside the cavity body, wherein the opening of the air inlet pipe faces the door body, and a blocking component is arranged between the door body and the air inlet pipe in the axial direction of the cavity, so that the blocking component can provide a blocking effect on the gas sent into the process cavity through the air inlet pipe, preventing the relatively high temperature gas from directly flowing to the door body in large quantities, thereby preventing the sealing ring and other devices between the door body and the cavity from being easily invalidated due to long-term high temperature, and under the action of the blocking component, the gas can be reversed to the end of the cavity away from the door body, so that the gas entering through the air inlet pipe can gradually diffuse from the end of the cavity where the door body is located to the other end to fill the entire process cavity.

[0007] Furthermore, even if there is still a small amount of gas flowing in the direction of the door body, since the blocking assembly includes a plurality of blocking plates arranged at axial intervals along the cavity, under the multiple blocking effects of the plurality of blocking plates, even if the gas entering through the air inlet pipe flows toward the location of the door body, the heating effect of the gas on the door body is relatively weak, thereby ensuring that the service life of the sealing ring between the door body and the cavity is relatively high, thereby ensuring that the sealing effect between the cavity and the door body is relatively stable and reliable, so that the process in the semiconductor process equipment can proceed normally.

[0008] At the same time, in the embodiment of the present application, in a plane perpendicular to the axial direction of the cavity, the projection of the outer edge of each blocking plate covers the projection of the carrier boat, so that during the process, the process gas introduced into the cavity from the gas supply component located on the side where the door body is located will not directly impact the one of the multiple carrier boats closest to the door body, so that the gas entering from the side where the door body is located can flow at the outer edges of the multiple carrier boats after passing through the blocking component, so as to ensure that the deposition uniformity of the gas on the semiconductor workpieces to be processed on each carrier boat is relatively higher. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings: Figure 1 A schematic diagram of the structure of a semiconductor process equipment disclosed in an embodiment of the present application; Figure 2 It is a schematic diagram of the assembly between the blocking component and the process paddle of the semiconductor process equipment disclosed in the embodiment of the present application; Figure 3 for Figure 2 A magnified schematic diagram of the structure in the middle; Figure 4-Figure 7 A schematic diagram of the structure of a blocking plate in a semiconductor process equipment disclosed in an embodiment of the present application; Figure 8 A schematic diagram of the structure of a mounting seat in a semiconductor process equipment disclosed in an embodiment of the present application; Figure 9-14 It is a schematic diagram of the assembly of the blocking component and the mounting seat in the semiconductor process equipment disclosed in the embodiment of the present application.

[0010] Reference numerals: 100-Cavity, 200-door body, 310-intake pipe, 320-air supply parts, 400-blocking assembly, 401-first blocking plate, 402-second blocking plate, 410-blocking plate, 411-gas-distributing hole, 412-installation inlay, 500-mounting seat, 510-seat body, 511-support wall, 512-first limiting wall, 513-second limiting wall, 514-perforation, 520-plug-in portion, 521-first baffle, 522-second baffle, 523-connecting hole, 610-bolt, 630-nut, 710-process paddle, 720-bracket, 730-carrying boat. DETAILED DESCRIPTION

[0011] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0012] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0013] The present application embodiment discloses a semiconductor process equipment, which is optionally a diffusion furnace. Figure 1-14As shown, the semiconductor process equipment includes a cavity 100, a door body 200, an air inlet pipe 310 and a blocking assembly 400. Of course, the semiconductor process equipment may also include sealing devices such as sealing rings, and devices such as process paddles 710 for carrying a carrying boat 730. Considering the simplicity of the text, they will not be introduced one by one here.

[0014] The door body 200 may be sealed and connected to the cavity 100. Specifically, the two may be connected by providing a sealing ring so that when the door body 200 is in a closed state, the door body 200 can form a sealed connection with the cavity 100. Accordingly, when the door body 200 and the cavity body 100 are in a sealed state, the two can enclose a process chamber for providing a process environment, and the process chamber is used to accommodate the carrier boat 730. Accordingly, the carrier boat 730 can carry multiple wafers. Of course, the process chamber can also increase the number of carrier boats 730 that can be transported together by arranging a process paddle 710, that is, the process paddle 710 can carry multiple carrier boats 730 at the same time. Usually, the multiple carrier boats 730 are distributed in the cavity body 100 along the axial direction of the cavity body 100. More specifically, the multiple carrier boats 730 can be carried on the bracket 720 at the same time. In the process of transporting the multiple carrier boats 730, the bracket 720 can be grasped by a robot, and the bracket 720 carrying the multiple carrier boats 730 can be placed on the process paddle 710.

[0015] The air inlet pipe 310 is used to transport process gas, and the blocking component 400 is used to provide a blocking effect. Both are arranged in the cavity 100. In order to improve the process effect of the wafers on each carrier boat 730 to be relatively good, in the semiconductor process equipment disclosed in the embodiment of the present application, the opening of the air inlet pipe 310 is toward the door body 200, and usually, when the number of carrier boats 730 is multiple, the air inlet pipe 310 is usually extended to cross the carrier boat 730 closest to the door body 200 among the multiple carrier boats 730.

[0016] Furthermore, since the temperature of the gas transported in the air intake pipe 310 is relatively high and the opening of the air intake pipe 310 is toward the door body 200, the flow direction of the gas in the air intake pipe 310 is toward the door body 200. This causes the gas to impact the sealing ring between the door body 200 and the cavity 100 for providing a seal. Since the sealing ring is usually formed of rubber material, it is easy to cause the sealing ring to fail under the action of high temperature for a long time.

[0017] To this end, in the embodiment of the present application, in the axial direction of the cavity, the blocking assembly 400 is located between the door body 200 and the air inlet pipe 310, and the blocking assembly 400 includes a plurality of blocking plates 410, and the plurality of blocking plates 410 are arranged at intervals along the aforementioned axial direction. In this case, due to the blocking of the plurality of blocking plates 410, the gas output from the air inlet pipe 310 cannot directly impact the door body 200, thereby significantly reducing the probability of failure of the sealing ring and increasing the service life of the sealing ring.

[0018] Of course, since the blocking plate 410 cannot completely block the gas output from the inlet pipe 310 from flowing to the door body 200, the gas can pass over the blocking plate 410 from the edge of the blocking plate 410 and continue to flow to the door body 200. Accordingly, the aforementioned part of the gas will be blocked by the door body 200 after flowing to the door body 200, and will flow back in the opposite direction. This part of the gas will flow to the area where the carrier boat 730 is located in the chamber 100. In order to prevent the aforementioned part of the gas from contacting the wafer on the carrier boat 730 closest to the door body 200 (and the wafer on the carrier boat 730 closest to the door body 200 among the multiple carrier boats 730), the wafer 730 is preferably a wafer having a certain size and a certain width. 0) will undergo a more concentrated reaction, resulting in poor film formation uniformity of the wafers. In the embodiment of the present application, the projection of the outer edge of each blocking plate 410 can cover the projection of the carrier boat 730 in a plane perpendicular to the axial direction of the chamber 100, so that each blocking plate 410 can block the multiple carrier boats 730 as a whole from the "front", so that the airflow blocked back from the door body 200 will try not to flow from the area where the carrier boat 730 is located, but will flow from above and around the carrier boat 730, thereby achieving the purpose of improving the uniformity of film formation.

[0019] Specifically, the outer shape of each blocking plate 410 can be a rectangular structure, and by making the side length of the blocking plate 410 larger than the diameter of the carrying boat 730, the blocking plate 410 can block the carrying boat 730 when the centers of the blocking plate 410 and the carrying boat 730 coincide with each other, that is, in a plane perpendicular to the axial direction of the cavity 100, the projection of the outer edge of each blocking plate 410 covers the projection of the carrying boat 730. In another embodiment of the present application, considering that the wafer and the chamber 100 are usually located in a circular structure, the outer shape of each blocking plate 410 can also be a circular structure. In this case, the diameter of the blocking plate 410 can be equal to the diameter of the wafer. By making the blocking plate 410 parallel to the wafer and making the center of the blocking plate 410 and the center of the wafer located on the same straight line, it can be basically ensured that the blocking plate 410 can block the wafer on the carrying boat 730, that is, in a plane perpendicular to the axial direction of the chamber 100, the projection of the blocking plate 410 can just cover the projection of the wafer. Of course, the diameter of the blocking plate 410 can also be larger than the diameter of the wafer, which can further ensure that the projection of the blocking plate 410 can cover the projection of the wafer in the aforementioned plane. Furthermore, the diameter of the blocking plate 410 can be larger than the size of the carrying boat 730 in the corresponding direction, which can further enhance the blocking effect of the blocking plate 410 on the wafer. In addition, the number of the blocking plates 410 can be two, three or more, which is not limited herein.

[0020] An embodiment of the present application discloses a semiconductor process equipment, wherein a door body 200 can be sealed and connected to a cavity body 100 to form a process cavity for accommodating a carrying boat 730. Of course, a device such as a sealing ring made of rubber material can be arranged between the door body 200 and the cavity body 100 to maintain a good sealing connection relationship between the door body 200 and the cavity body 100. At the same time, an air inlet pipe 310 and a blocking component 400 are provided in the cavity 100, wherein the opening of the air inlet pipe 310 faces the door body 200, and in the axial direction of the cavity 100, a blocking component 400 is provided between the door body 200 and the air inlet pipe 310, so that the blocking component 400 can provide a blocking effect on the gas sent into the process chamber through the air inlet pipe 310, prevent the relatively high temperature gas from directly flowing to the door body 200 in large quantities, and further prevent the sealing ring and other components between the door body 200 and the cavity 100 from failing due to long-term high temperature. Under the action of the blocking component 400, the gas can flow in the opposite direction to the end of the cavity 100 away from the door body 200, so that the gas entering through the air inlet pipe 310 can gradually diffuse from one end of the cavity 100 where the door body 200 is located to the other end to fill the entire process chamber.

[0021] Furthermore, even if there is still a small amount of gas flowing in the direction of the door body 200, since the blocking assembly 400 includes a plurality of blocking plates 410 arranged at axial intervals along the cavity 100, under the multiple blocking effects of the plurality of blocking plates 410, even if the gas entering through the air inlet pipe 310 flows toward the position of the door body 200, the heating effect of the gas on the door body 200 is relatively weak, thereby ensuring that the service life of the sealing ring between the door body 200 and the cavity 100 is relatively high, thereby ensuring that the sealing effect between the cavity 100 and the door body 200 is relatively stable and reliable, so that the process in the semiconductor process equipment can proceed normally.

[0022] At the same time, in the embodiment of the present application, in a plane perpendicular to the axial direction of the cavity 100, the projection of the outer edge of each blocking plate 410 covers the projection of the carrier boat 730, so that during the process, the process gas introduced into the cavity 100 from the gas replenishing member 320 located on the side where the door body 200 is located will not directly impact the one of the multiple carrier boats 730 closest to the door body 200, so that the gas entering from the side where the door body 200 is located can flow at the outer edges of the multiple carrier boats 730 after passing through the blocking assembly 400, so as to ensure that the deposition uniformity of the gas on the semiconductor workpiece to be processed on each carrier boat 730 is relatively higher.

[0023] As described above, the semiconductor process equipment includes an air inlet pipe 310, which can transport process gas into the process chamber. Since the opening of the air inlet pipe 310 faces the door body 200, and the gas outputted by the air inlet pipe 310 is blocked by the blocking plate 410, the uniformity of the gas flow will be affected to a certain extent. Therefore, in the semiconductor process equipment disclosed in the embodiment of the present application, in order to further improve the uniformity of the gas in the process chamber, the semiconductor process equipment may also include a gas replenishing member 320, which is installed on the side of the door body 200 facing the blocking assembly 400. Intuitively speaking, the gas replenishing member 320 extends into the inner side of the door body 200 so that the gas replenishing member 320 can transport process gas into the process chamber. At the same time, by providing a plurality of uniform gas holes 411 on each blocking plate 410, the process gas can also pass through the uniform gas holes 411 to flow to the other side of the blocking plate 410, and achieve the purpose of diffusion through the blocking plate 410, thereby further improving the uniformity of film formation of the wafers on the carrier boat 730 by improving the uniformity of gas distribution in the process chamber.

[0024] Specifically, the shape of the air-leveling holes 411 can be circular or rectangular. Of course, the size of the air-leveling holes 411 usually needs to be relatively small to ensure that the air-leveling holes 411 can effectively provide the air-leveling effect. In addition, the air-leveling holes 411 can be evenly distributed on the blocking plate 410 to further improve the air-leveling performance of the air-leveling holes 411. In a specific embodiment of the present application, the shape of the air-leveling holes 411 can be circular holes, and the diameter thereof can be less than 10 mm. Furthermore, the diameter of the air-leveling holes 411 can be between 5-8 mm, which can basically ensure that the air-leveling holes 411 have a relatively efficient air-leveling effect. Of course, it is also necessary to limit the distribution number of the air uniforming holes 411 to ensure that the blocking plate 410 can provide a good air uniforming effect. Optionally, when the size of the air uniforming holes 411 adopts the aforementioned scheme, the sum of the areas of the multiple air uniforming holes 411 on any blocking plate 410 can account for 10% to 20% of the area of ​​the blocking plate 410. This allows the blocking plate 410 to provide a good blocking effect for the sealing ring between the door body 200 and the cavity 100 while also providing a good air uniforming effect.

[0025] In a specific embodiment of the present application, the diameter of the uniform air holes 411 can be 6 mm, and the sum of the areas of the multiple uniform air holes 411 on any baffle plate 410 accounts for 12.27% of the area of ​​the baffle plate 410. Accordingly, the multiple uniform air holes 411 on any baffle plate 410 are distributed as evenly as possible on the baffle plate 410, for example, they can be distributed in a determinant or in a stepped ring shape, which is not limited in this article. In addition, the distribution of the uniform air holes 411 on the baffle plate 410 can also be regionally evenly distributed, such as Figure 6 As shown, the blocking plate 410 is divided into upper and lower areas, wherein the multiple air-uniform holes 411 in the upper area are evenly distributed, and correspondingly, the multiple air-uniform holes 411 in the lower area are evenly distributed, but the density of the air-uniform holes 411 in the upper area and the lower area is not necessarily the same.

[0026] As described above, each baffle plate 410 is provided with a plurality of uniform gas holes 411, and since the plurality of baffle plates 410 are spaced apart along the axial direction of the chamber 100, the shapes and structures of the plurality of baffle plates 410 can be made to correspond to each other, and based on this, the projections of the plurality of baffle plates 410 can be made to completely overlap in a plane perpendicular to the axial direction of the chamber 100. Of course, since the molecular size of the gas is much smaller than the size of the uniform gas hole 411, after any molecule of the gas passes through a uniform gas hole 411 of a baffle plate 410, it may change its flow direction under the action of the flow field force, and then, when the any molecule of the gas flows to the next baffle plate 410, it may be blocked by the area on the baffle plate 410 where no uniform gas hole 411 is provided, or pass through other positions on the baffle plate 410 that are different from the positions on the previous baffle plate 410 where the gas molecules pass through, so that the plurality of baffle plates 410 that meet the above structure and arrangement can also provide relatively good uniform gas effect for the gas.

[0027] Taking into account that during the process, the overall flow direction of the gas in the area where the supporting boat 730 is located is from the position where the door body 200 is located to the position of the tail of the cavity 100, and further, in order to prevent the multiple baffles 410 that meet the above-mentioned structure and arrangement from providing a poor gas uniformity effect when the gas flow rate is relatively large, in another embodiment of the present application, one of any two adjacent baffles 410 can be a first baffle 401, and the other can be a second baffle 402, and in a plane perpendicular to the axial direction of the cavity 100, at least part of the projection of the multiple gas uniformity holes 411 on the first baffle 401 is located outside the projection of each gas uniformity hole 411 on the second baffle 402, so that the multiple gas uniformity holes 411 on the first baffle 401 and the second baffle 402 can be in a staggered distribution state, which can further enhance the gas uniformity effect of the multiple baffles 410.

[0028] Of course, in the embodiment of the present application, the structures and sizes of the multiple baffles 410 can still be made to be the same. In this case, the projections of the two baffles 410 with the same structure in the plane perpendicular to the axial direction of the cavity 100 can be mutually offset by making the installation positions of any two adjacent baffles 410 different, so that the overall uniform flow effect of the multiple baffles 410 is relatively better. In other embodiments of the present application, the distribution positions of the multiple uniform air holes 411 on any two adjacent baffles 410 can also be different, which can also ensure that the projections of the multiple uniform air holes 411 on the two adjacent baffles 410 in the plane perpendicular to the axial direction of the cavity 100 can be mutually offset.

[0029] As described above, the blocking assembly 400 includes a plurality of blocking plates 410, and the number of the blocking plates 410 may be two, three or more. In a specific embodiment of the present application, the number of the blocking plates 410 may be greater than or equal to 5, which makes the overall blocking effect of the blocking plates 410 relatively good. In this case, each blocking plate 410 may be provided with a plurality of gas uniformity holes 411, thereby ensuring that the blocking assembly 400 still has a high flow uniformity effect on the gas.

[0030] When the number of baffle plates 410 is greater than 2, optionally, the number of the first baffle plate 401 and the second baffle plate 402 is one, and the first baffle plate 401 and the second baffle plate 402 are arranged adjacent to each other and sandwiched between multiple other baffle plates 410. Of course, they can also be arranged at the position closest to the door body 200 among the multiple other baffle plates 410 to further enhance the overall uniform flow effect of the multiple baffle plates 410.

[0031] Based on the above-mentioned embodiments of the present application, further, the number of the above-mentioned first blocking plates 401 and the second blocking plates 402 can be multiple, and the multiple first blocking plates 401 and the multiple second blocking plates 402 can be alternately distributed in the axial direction of the chamber 100, which can further enhance the uniform flow effect of the blocking assembly 400, so that the deposition uniformity of the multiple wafers on each carrying boat 730 is relatively higher.

[0032] As described above, in order to prevent the gas flowing from the door body 200 to the tail of the chamber 100 from having a more concentrated effect on the wafers on the carrier boat 730 closest to the door body 200, in the semiconductor process equipment disclosed in the embodiment of the present application, the size of the blocking plate 410 is increased so that the outer edge of the blocking plate 410 can be located outside the outer edge of the carrier boat 730, and it is mentioned in the above embodiment of the present application that the size of the blocking plate 410 is larger than the size of the carrier boat 730, so that the blocking plate 410 is used to provide a shielding effect for the carrier boat 730. Specifically, the outer edge size of the blocking plate 410 can be larger than the outer edge size of the carrier boat 730 by more than 10 mm. In order to further improve the uniformity of the gas distribution in the height direction of the chamber 100 as much as possible, in another embodiment of the present application, in the support direction of the carrier boat 730, that is, in the height direction of the chamber 100, the distance between the upper edge of at least one blocking plate 410 and the upper edge of the carrier boat 730 can be greater than or equal to 45 mm. Of course, for each blocking plate 410, the distance between its upper edge and the upper edge of the carrying boat 730 can be equal, that is, the shape and size of each blocking plate 410 are the same. Alternatively, the distance between the upper edge of each blocking plate 410 and the upper edge of the carrying boat 730 can be different, which is not limited in this article. In a specific embodiment of the present application, the size of the two blocking plates 410 closest to the door body 200 can be smaller than the size of the other blocking plates 410, which can prevent the two blocking plates 410 closest to the door body 200 from generating a relatively large blockage to the gas, which is not conducive to the diffusion effect of the gas in the cavity.

[0033] Of course, the maximum size of each baffle plate 410 also needs to be designed to prevent the baffle plate 410 from being too large and causing additional interference to the gas flow in the cavity 100. Specifically, in the embodiment of the present application, the area of ​​each baffle plate 410 can account for 70%-90% of the cross-sectional area of ​​the cavity.

[0034] Accordingly, the spacing between any adjacent baffles 410 in the axial direction of the cavity 100 can be selected according to the overall size of the cavity 100 and the baffles 410. Generally, the spacing between two adjacent baffles 410 needs to be greater than 10 mm to ensure that gas can flow between the baffles 410 and prevent the baffle assembly 400 from being a whole in the flow field, thereby greatly weakening the uniform flow effect generated by the multiple baffles 410. Of course, when multiple uniform gas holes 411 are provided on each baffle 410, in order to further enhance the uniform flow effect generated by the multiple baffles 410 as a whole, the spacing between any two adjacent baffles 410 can be between 20-30 mm.

[0035] As described above, in a specific embodiment of the present application, the diameter of the uniform gas hole 411 is 6 mm, and the sum of the areas of the multiple uniform gas holes 411 on each baffle plate 410 accounts for 12.27% of the area of ​​the baffle plate 410. The number of baffle plates 410 can be 5 or more, and the spacing between any two adjacent baffle plates 410 can be between 22-27 mm, so as to improve the deposition uniformity of the wafers on the multiple carrier boats 730 and further prevent the film thickness uniformity of the wafers on the carrier boat 730 closest to the door body 200 from deteriorating. At the same time, the area of ​​each baffle plate 410 can account for 78% of the cross-sectional area of ​​the chamber 100, so as to ensure that the uniform flow effect of the baffle plate 410 is relatively strong and basically does not interfere with the normal flow of gas.

[0036] In the semiconductor process equipment disclosed in the embodiment of the present application, the plurality of blocking plates 410 of the blocking assembly 400 are all located in the chamber 100. Specifically, the blocking plates 410 can be fixedly installed at specific positions in the chamber 100 by welding or connecting with threaded connectors. In order to reduce the difficulty of disassembling and assembling each blocking plate 410 in the blocking assembly 400, so as to facilitate the work of sending the carrying boat 730 into the chamber 100 and taking the carrying boat 730 out of the chamber 100, in another embodiment of the present application, each blocking plate 410 can be provided with a mounting notch 412 extending inward from the edge, that is, when the outer edge shape of the blocking plate 410 is circular, the blocking plate 410 is not a complete circular structure, and a notch is provided at its edge, and the notch can be used as a mounting structure for the blocking plate 410.

[0037] Based on the above situation, correspondingly, the blocking assembly 400 can also include a mounting seat 500, and the mounting seat 500 includes a seat body 510 and a plurality of plug-in parts 520, wherein the seat body 510 can be a sheet-like or cubic structure, and the seat body 510 can be interconnected with the process paddle 710. For example, the seat body 510 and the process paddle 710 can be formed into a detachable fixed connection relationship through connecting parts such as bolts 610, and before the carrier boat 730 needs to be transferred, the seat body 510 can be detached from the process paddle 710, and after the transfer of the carrier boat 730 is completed, the seat body 510 can be installed to the corresponding position on the process paddle 710.

[0038] As described above, the edge of each blocking plate 410 is provided with a mounting recess 412. Therefore, in the embodiment of the present application, during the process of assembling the blocking plate 410 and the mounting seat 500, the plurality of blocking plates 410 can be sleeved outside the seat body 510 through their respective mounting recesses 412, so that the seat body 510 can provide support for the plurality of blocking plates 410. Accordingly, the shape and size of the mounting recesses 412 can correspond to the cross-sectional shape and size of the outer surface of the seat body 510, so that the blocking plate 410 can be sleeved outside the seat body 510 through its mounting recesses 412, so that the blocking plate 410 and the seat body 510 form a pre-positioned relationship.

[0039] Of course, in order to ensure that the blocking plate 410 can form a relatively reliable relative fixed relationship with the mounting seat 500, in the embodiment of the present application, as described above, the mounting seat 500 further includes a plurality of plug-in portions 520, and the plurality of plug-in portions 520 are all provided with plug-in slots, and by making the plurality of plug-in portions 520 all fixedly connected to the same side of the seat body 510, the plurality of blocking plates 410 can be plugged into the respective plug-in slots of the plurality of plug-in portions 520 one by one, so as to ensure that each blocking plate 410 can form a relatively fixed relationship with the seat body 510 through the limiting matching relationship formed between the plug-in slot and the limiting matching relationship formed with the seat body 510. Accordingly, the gap size of the plug-in slot formed by each plug-in portion 520 needs to correspond to the thickness size of the blocking plate 410, so as to ensure that the blocking plate 410 can be installed in the plug-in slot and form a relatively stable limiting matching relationship with the plug-in portion 520.

[0040] In the above embodiment, in order to ensure that the blocking plate 410 can form a relatively good plug-in fit with the plug-in portion 520, it is necessary to extend a portion of the blocking plate 410 into the plug-in slot of the plug-in portion 520. This may cause a small number of air uniformity holes 411 on the blocking plate 410 to be located in the plug-in slot and blocked by the plug-in portion 520, thereby producing a certain adverse effect on the uniform flow effect of the blocking component 400.

[0041] To this end, in a specific embodiment of the present application, each plug-in portion 520 may include a first baffle 521 and a second baffle 522 spaced apart along the axial direction of the cavity 100, and accordingly, the above-mentioned plug-in slot may be formed between the first baffle 521 and the second baffle 522. At the same time, by providing a connecting hole 523 on both the first baffle 521 and the second baffle 522, and by connecting the connecting hole 523 of the first baffle 521 with the connecting hole 523 on the second baffle 522 through at least one gas-uniform hole 411 of the blocking plate 410, the degree of adverse effects of the setting of the plug-in portion 520 on the gas-uniform effect of the blocking plate 410 may be reduced, thereby ensuring that each blocking plate 410 can form a stable matching relationship with the cavity, while minimizing the reduction of the gas-uniform effect of each blocking plate 410.

[0042] Specifically, the connecting hole 523 can be a circular hole with a relatively large diameter. In another embodiment of the present application, the connecting hole 523 can be an elongated hole, and the number of connecting holes 523 arranged on the first baffle plate 521 and the second baffle plate 522 can be multiple, and the extension directions of the multiple connecting holes 523 are the same, and the distribution direction is perpendicular to the extension direction.

[0043] In addition, the number of the plug-in parts 520 included in the mounting seat 500 may be equal to the number of the blocking plates 410. In this case, a blocking plate 410 is correspondingly plugged into each plug-in part 520. Alternatively, in other embodiments of the present application, the number of the plug-in parts 520 may be greater than the number of the blocking plates 410. In this case, a blocking plate 410 may be installed every one or more plug-in parts 520. Of course, in the case of different specific parameters of the processing technology, the spacing between any two adjacent blocking plates 410 may also be flexibly selected according to the actual situation, and this is not limited herein.

[0044] In order to further improve the installation stability of the blocking assembly 400 in the cavity 100, the seat body 510 and the process paddle 710 can be formed into a pre-positioned relationship. In detail, in the embodiment of the present application, the seat body 510 includes a support wall 511, a first limiting wall 512 and a second limiting wall 513, wherein a plurality of plug-in parts 520 are fixed to the top of the support wall 511 to ensure that the seat body 510 can provide support for the plurality of plug-in parts 520 and the blocking plate 410 plugged into each plug-in part 520; at the same time, the first limiting wall 512 is fixed to one side of the support wall 511, and the second limiting wall 513 is fixed to the other side of the support wall 511, and the first limiting wall 512 and the second limiting wall 513 are both away from the support wall 511. One side of the plug-in portion 520 extends so that the seat body 510 can be integrally mounted outside the process paddle 710, and by designing parameters such as the spacing between the first limiting wall 512 and the second limiting wall 513, it can be ensured that the first limiting wall 512 and the second limiting wall 513 can form a more reliable limiting matching relationship with the process paddle 710, which can further enhance the stability of the assembly relationship between the mounting seat 500 and the process paddle 710, and can also enable the mounting seat 500 and the process paddle 710 to form a pre-positioning relationship, thereby facilitating the installation of the connecting parts therebetween.

[0045] In addition, the process paddle 710 can be installed on the door body 200. For example, the door body 200 can be provided with a through hole, and the process paddle 710 is installed in the through hole and forms a relatively fixed relationship with the door body 200. Accordingly, a part of the process paddle 710 can be located in the cavity 100 to ensure that the process paddle 710 can provide a good supporting effect for the bracket 720 and the carrying boat 730. At the same time, the mounting seat 500 can be installed on the process paddle 710. Specifically, the support wall 511 can be supported on the process paddle 710, and the support wall 511 and the process paddle 710 form a surface contact matching relationship, so that the silicon carbide part provides a relatively better supporting effect for the mounting seat 500 and the plurality of blocking plates 410. In addition, the process paddle 710 can be sandwiched between the first limiting wall 512 and the second limiting wall 513, and then in the distribution direction of the first limiting wall 512 and the second limiting wall 513, the mounting seat 500 can form a good limiting matching relationship with the process paddle 710.

[0046] Of course, in order to prevent the blocking assembly 400 from moving relative to the process paddle 710 during the process and thus adversely affecting the process, after the mounting seat 500 is sleeved outside the process paddle 710, the mounting seat 500 and the process paddle 710 can be fixedly connected as one by connecting members such as bolts 610. Specifically, the mounting seat 500 can be fixedly connected to the process paddle 710 by setting a through hole 514 at the corresponding position of the support wall 511 and the process paddle 710, and the connecting members such as bolts 610 can be passed through the through holes 514 of the support wall 511 and the process paddle 710, so as to ensure that the mounting seat 500 can form a fixed connection relationship with the process paddle 710. Of course, the above-mentioned through holes 514 can also be formed at the corresponding positions of the first limiting wall 512, the second limiting wall 513 and the process paddle 710.

[0047] Furthermore, in order to improve the compatibility between the uniform flow effect of the blocking component 400 and the specific conditions of the process, in another embodiment of the present application, the position of the blocking component 400 on the process paddle 710 can be made adjustable. To this end, a through hole 514 can be provided on both the first limiting wall 512 and the second limiting wall 513, and an adjustment slot can be provided on the process paddle 710, and the adjustment slot can extend along the axial direction of the cavity 100, so that by changing the position of the bolt 610 in the adjustment slot, the bolt 610 can form an adjustable matching relationship with the adjustment slot in the axial direction of the cavity 100, thereby achieving the purpose of adjusting the position of the blocking component 400 in the cavity 100. Of course, in the process of assembling the mounting seat 500, the position adjustment of the mounting seat 500 can be completed according to the corresponding needs, and then the bolt 610 is sequentially passed through the through hole 514 of the first limiting wall 512, the adjustment long hole of the process paddle 710 and the corresponding through hole 514 on the second limiting wall 513, and then the bolt 610 is fixedly connected with the nut 630, so that the mounting seat 500 can form a reliable fixed connection relationship with the process paddle 710. In addition, compared with the solution of forming the adjustment long hole on the first limiting wall 512 and the second limiting wall 513, the adjustment long hole is formed on the process paddle 710, which can appropriately increase the adjustment range.

[0048] It should be noted that, in this article, the terms "comprise", "include" or any other variant thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise one..." do not exclude the presence of other identical elements in the process, method, article or device including the element. In addition, it should be pointed out that the scope of the methods and devices in the embodiments of the present application is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in reverse order according to the functions involved, for example, the described method may be performed in an order different from that described, and various steps may also be added, omitted, or combined. In addition, the features described with reference to certain examples may be combined in other examples.

[0049] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. A semiconductor process equipment, characterized in that: It includes a cavity, a door body, an air intake pipe and a blocking component, wherein: The door body can be sealed and connected to the cavity body to form a process cavity, and the process cavity is used to accommodate the carrier boat. The air inlet pipe and the blocking component are both arranged in the cavity body, and the opening of the air inlet pipe faces the door body; In the axial direction of the cavity, the blocking assembly is located between the door body and the air inlet pipe, and the blocking assembly includes a plurality of blocking plates, which are arranged at intervals along the axial direction, and in a plane perpendicular to the axial direction of the cavity, the projection of the outer edge of each of the blocking plates covers the projection of the supporting boat.

2. The semiconductor process equipment according to claim 1, characterized in that: The semiconductor process equipment further comprises an air supply component, which is installed on a side of the door body facing the blocking assembly, and each of the blocking plates is provided with a plurality of air-distributing holes.

3. The semiconductor process equipment according to claim 2, characterized in that: One of any two adjacent baffles is a first baffle plate, and the other is a second baffle plate. In a plane perpendicular to the axial direction of the cavity, at least part of the projections of the multiple air-uniform holes on the first baffle plate are located outside the projections of the multiple air-uniform holes on the second baffle plate.

4. The semiconductor process equipment according to claim 3, characterized in that: The number of the first blocking plates and the number of the second blocking plates are both plural, and the plurality of the first blocking plates and the plurality of the second blocking plates are alternately distributed in the axial direction.

5. The semiconductor process equipment according to claim 2, characterized in that: The diameter of the uniform air hole is between 5-8 mm; And / or the sum of the areas of the plurality of the uniform air holes on any one of the baffle plates accounts for 10%-20% of the area of ​​the baffle plate.

6. The semiconductor process equipment according to claim 2, characterized in that: In the supporting direction of the carrying boat, the distance between the upper edge of at least one of the blocking plates and the upper edge of the carrying boat is greater than or equal to 45 mm; and / or the distance between any two adjacent blocking plates is between 20-30 mm; and / or the number of the blocking plates is greater than or equal to 5; And / or the area of ​​each of the blocking plates accounts for 70%-90% of the cross-sectional area of ​​the cavity.

7. The semiconductor process equipment according to claim 2, characterized in that: Each of the blocking plates is provided with a mounting recess extending inward from the edge, and the blocking assembly also includes a mounting seat, which includes a seat body and a plurality of plug-in parts, and the plurality of blocking plates are sleeved on the outside of the seat body through their respective mounting recesses, and each of the plug-in parts is provided with a plug-in groove, and the plurality of plug-in parts are fixedly connected to the same side of the seat body, and the plurality of blocking plates are plugged into the respective plug-in grooves of the plurality of plug-in parts one by one.

8. The semiconductor process equipment according to claim 7, characterized in that: The seat body comprises a supporting wall, a first limiting wall and a second limiting wall, the plurality of plug-in parts are fixed to the top of the supporting wall, the first limiting wall is fixed to one side of the supporting wall, the second limiting wall is fixed to the other side of the supporting wall, and the first limiting wall and the second limiting wall both extend to the side of the supporting wall away from the plug-in part; The semiconductor process equipment includes a process paddle, which is installed on the door body, and a part of the process paddle is located in the cavity. The support wall supports the process paddle, and the support wall is in contact with the process paddle surface. The process paddle is clamped between the first limiting wall and the second limiting wall.

9. The semiconductor process equipment according to claim 8, characterized in that: The first limiting wall and the second limiting wall are both provided with through holes, and the process paddle is provided with an adjustment long hole extending along the axial direction of the cavity. Bolts pass through the adjustment long holes and each of the through holes and are fixedly connected with nuts. In the axial direction, the bolts are adjustably matched with the adjustment long holes.

10. The semiconductor process equipment according to claim 7, characterized in that: Each of the plug-in parts includes a first baffle and a second baffle arranged at intervals along the axial direction, the plug-in groove is formed between the first baffle and the second baffle, the first baffle and the second baffle are both provided with connecting holes, and the connecting hole of the first baffle is connected with the connecting hole of the second baffle through at least one of the air uniforming holes of the baffle plate.

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