Packaging jig capable of reducing silver colloid climbing

Abstract

The invention provides a packaging jig capable of reducing silver colloid climbing, and relates to the technical field of semiconductor packaging. An inner insertion beam frame is inserted into the outer fixed base, and the inner insertion beam frame is arranged outside the glue carrying inner groove in a sleeving manner; a glue flowing frame groove is formed in the inner insertion beam frame; a high leakage prevention groove is formed in the inner insertion beam frame, and the high leakage prevention groove is connected with the glue flowing frame groove; when a sizing material climbs to the position of a high leakage prevention groove, the excessive sizing material is leaked into a glue flowing frame groove through the high leakage prevention groove, flows into a solid gel groove under the action of an inclined rectangular through hole and falls asleep with the solidification of the sizing material, and the excessive sizing material is fixed in the solid gel groove, so that the sizing material is fixed; the problems that for a traditional packaging frame at present, the glue climbing risk of a thin chip to which glue is dispensed is large, the bonding strength between the frame and plastic packaging glue is low, and the glue climbing risk of the thin chip in the installation process is high are solved.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor packaging, and in particular to a packaging fixture capable of reducing the height of silver paste climbing. Background Art

[0002] Semiconductor packaging is the process of connecting semiconductor chips to external circuits. Packaging can protect chips from physical and chemical damage, while providing reliable electrical connections and heat dissipation paths. The development of semiconductor packaging technology is of great significance to improving the performance, reliability and miniaturization of electronic products. With the continuous development of semiconductor technology, the integration of integrated circuits is getting higher and higher, packaging technology is also constantly improving, and chips are becoming thinner and thinner. At present, in the process of semiconductor packaging, it is usually fixed by gluing the frame. As the amount of glue increases, the chip is prone to glue creeping during installation. In order to facilitate the installation of the chip, a packaging frame is needed; As for the current traditional packaging frame, the risk of glue creeping up the frame is relatively high for thin chips that are glued, which reduces the bonding strength between the frame and the plastic packaging adhesive, and increases the risk of glue creeping up the thin chip during installation. At the same time, the chip needs to be repaired after long-term use, and the adhesive needs to be melted before removal. However, since the adhesive leaks into the external groove before solidifying, it is difficult to melt it uniformly with the bottom adhesive, making it inconvenient to remove the thin chip. Summary of the invention

[0003] The disclosed embodiment relates to a packaging jig capable of reducing the height of silver glue climbing, comprising a telescopic slide and an insert beam frame. The telescopic slide is slidably connected in an inner extension groove to facilitate the outward extension processing under the action of a spring, and at the same time of outward extension, the constraint plug-in is driven to be inserted into the inner part of the constraint card slot, so as to constrain the inner insertion beam frame by means of insertion, and the chip can be removed by removing the inner insertion beam frame together, so as to facilitate the inspection and processing of the chip. Moreover, a glue flow frame groove and an anti-height leakage groove are provided in the inner part of the insert beam frame, so that the glue that climbs up will not contact other positions of the chip after leaking out, thereby reducing the influence of the glue on the chip and facilitating its use.

[0004] In a first aspect of the present disclosure, a packaging fixture is provided that can reduce the height of silver glue climbing, specifically comprising: an external solid base; an external wiring sheet is fixedly connected to the outside of the external solid base, and the external wiring sheet is electrically connected to the power-carrying component in the external solid base; an inner extending groove is provided on the inner wall of the external solid base; a telescopic slide is slidably connected in the inner extending groove; a restraining plug is fixedly connected to the outer wall of the telescopic slide; a glue-carrying inner groove is fixed to the inside of the external solid base by screws; an inner insert beam frame is inserted into the inside of the external solid base, and the inner insert beam frame is sleeved on the outside of the glue-carrying inner groove; a glue flow frame groove is provided in the inside of the inner insert beam frame; an anti-height leakage groove is provided in the inside of the inner insert beam frame, and the anti-height leakage groove is connected to the glue flow frame groove; a solid gel groove is provided at the bottom of the inner insert beam frame, and the solid gel groove and the glue flow frame groove are connected through a rectangular through hole connected; constraint slots are equidistantly provided on the outer wall of the inner insert beam frame, and constraint blocks are inserted into the inside of the constraint slots; a bottom solid frame is sleeved in the solid gel groove, and the bottom solid frame is fixed to the bottom of the inner insert beam frame by screws; a rubber rod is fixedly connected to the outer wall of the bottom solid frame, and the rubber rod is distributed in the solid gel groove; the inner extending groove is set as a rectangular groove, a cylindrical rod is set inside the inner extending groove, and a disc-shaped protrusion is set on the cylindrical rod of the inner extending groove; the telescopic slide is set as an L-shaped structure, a friction plate is set on the top of the telescopic slide, a circular groove is set on the telescopic slide, the circular groove of the telescopic slide is connected with a circular through hole, a spring is set on the inner side of the telescopic slide, and the telescopic slide is slidably connected in the inner extending groove; the inner insert beam frame is set as a rectangular frame-like structure, and a rectangular frame-like protrusion is set on the inner wall of the inner insert beam frame.

[0005] At least in some embodiments, the outer solid base is configured as a rectangular parallelepiped structure, a rectangular groove is provided on the top of the outer solid base, and a power supply component is provided inside the outer solid base.

[0006] At least in some embodiments, the external wiring sheet is configured as a conductive metal sheet, a circular connection hole is provided on the external wiring sheet, and there are two groups of external wiring sheets in total.

[0007] At least in some embodiments, the constraint plug is configured as a trapezoidal block structure; the inner glue carrier groove is configured as a rectangular parallelepiped structure, and a rectangular groove is provided on the top of the inner glue carrier groove.

[0008] At least in some embodiments, the glue flow frame groove is configured as a rectangular frame-shaped groove, and an inclined surface is provided on the inner wall of the glue flow frame groove.

[0009] At least in some embodiments, the anti-high leakage groove is a circular through hole; the solid gel groove is configured as a rectangular frame-shaped groove, and the inner side of the solid gel groove is connected to a rectangular frame-shaped groove.

[0010] At least in some embodiments, the constraint slot is configured as a rectangular groove; the bottom solid frame is configured as a rectangular frame-like structure, a rectangular frame-like protrusion is provided on the inner wall of the bottom solid frame, and circular grooves are equidistantly provided on the outer wall of the bottom solid frame.

[0011] At least in some embodiments, the adhesive rod is configured as a cylindrical structure, a cylindrical protrusion is provided on the adhesive rod, and a contact groove is provided on the cylindrical protrusion of the adhesive rod.

[0012] The packaging fixture provided by the present invention can reduce the height of silver paste and has the following beneficial effects: The present invention provides an inner insertion bundle frame, which inserts a chip into an external solid base and the inside of an inner glue-carrying groove. As the chip is inserted, the glue inside the inner glue-carrying groove climbs up. When the glue climbs up to the position of the anti-height leakage groove, the excess glue leaks out into the glue flow frame groove through the anti-height leakage groove, and flows into the inside of the solid gel groove under the action of the inclined rectangular through hole, and solidifies the glue, and the excess glue is fixed inside the solid gel groove, thereby completing the fixation of the glue.

[0013] In addition, a telescopic slide is provided, and the screws at the bottom of the outer fixed base are removed to release the constraint between the outer fixed base and the inner glue-carrying groove, and then the bottom of the outer fixed base is subjected to a heat treatment to soften the bottom layer of the glue, and then the telescopic slide is pushed outward to adjust the telescopic movement in the inner extension groove, and at the same time, the constraint block is driven to slide out from the inside of the constraint card slot to contact the constraint of the inner insertion bundle frame, so that the chip together with the bottom glue can be removed by pulling up the inner insertion bundle frame, so as to facilitate its use. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the technical solution of the embodiment of the present invention, the drawings of the embodiment are briefly introduced below.

[0015] The drawings described below are only related to some embodiments of the present invention, but are not intended to limit the present invention.

[0016] In the attached picture: Figure 1 A schematic diagram of a three-dimensional assembly structure according to an embodiment of the present invention is shown; Figure 2 A schematic diagram of a bottom-up structure of a three-dimensional assembly according to an embodiment of the present invention is shown; Figure 3 A schematic diagram showing a decomposition structure according to an embodiment of the present invention is shown; Figure 4 A schematic diagram showing an exploded bottom-up structure according to an embodiment of the present invention is shown; Figure 5 A schematic diagram showing a partial cutaway structure according to an embodiment of the present invention is shown; Figure 6 The embodiment according to the present invention is shown. Figure 5 The schematic diagram of the enlarged structure of part A is shown; Figure 7 A schematic diagram showing an assembly structure of an external fixed base and a telescopic slide according to an embodiment of the present invention is shown; Figure 8 A schematic diagram showing an assembly structure of an inner insert beam frame and a bottom fixed frame according to an embodiment of the present invention is shown; Fig. 9 A schematic diagram showing a bottom-up structure of an insert beam frame according to an embodiment of the present invention is shown; Fig.10 A schematic diagram of an assembly structure of an external fixed base and an internally inserted bundle frame according to an embodiment of the present invention is shown.

[0017] Reference numerals list 1. External solid base; 2. External wiring piece; 3. Inner extension slot; 4. Telescopic slide; 5. Constraint plug-in block; 6. Glue-carrying inner slot; 7. Inner insertion bundle frame; 8. Glue flow frame slot; 9. Anti-height leakage slot; 10. Glue-carrying slot; 11. Constraint card slot; 12. Bottom solid frame; 13. Glue rod. DETAILED DESCRIPTION

[0018] The embodiments of the present invention are further described in detail below in conjunction with the accompanying drawings and examples.

[0019] Example 1: Please refer to Figures 1 to 10The present invention proposes a packaging fixture that can reduce the height of silver glue climbing, comprising: an external solid base 1; an external wiring sheet 2 is fixedly connected to the outside of the external solid base 1, and the external wiring sheet 2 is electrically connected to the power-carrying component in the external solid base 1; an inner extension groove 3 is opened on the inner wall of the external solid base 1; a telescopic slide 4 is slidably connected in the inner extension groove 3; a restraining plug 5 is fixedly connected to the outer wall of the telescopic slide 4; a glue-carrying inner groove 6 is fixed to the inside of the external solid base 1 by screws; an inner insertion beam frame 7 is inserted into the inside of the external solid base 1, and the inner insertion beam frame 7 is sleeved on the outside of the glue-carrying inner groove 6; a glue flow frame groove 8 is opened in the inner insertion beam frame 7; an anti-high leakage groove 9 is opened in the inner insertion beam frame 7, and the anti-high leakage groove 9 is connected to the flow The inner plug-in bundle frame 7 is connected with the glue frame groove 8; a solid gel groove 10 is provided at the bottom of the inner plug-in bundle frame 7, and the solid gel groove 10 is connected with the flow gel frame groove 8 through a rectangular through hole; constraint slots 11 are equidistantly provided on the outer wall of the inner plug-in bundle frame 7, and a constraint plug 5 is inserted into the inner part of the constraint slot 11; a bottom solid frame 12 is sleeved in the solid gel groove 10, and the bottom solid frame 12 is fixed to the bottom of the inner plug-in bundle frame 7 by screws; a glue rod 13 is fixed to the outer wall of the bottom solid frame 12, and the glue rod 13 is distributed in the solid gel groove 10; the inner extension groove 3 is set as a rectangular groove, and a cylindrical rod is provided inside the inner extension groove 3, and a disc-shaped protrusion is provided on the cylindrical rod of the inner extension groove 3; the inner extension groove 3 is used to assist in the installation and fixation of the telescopic The slide 4 drives the constraint plug 5 to be inserted into the constraint card slot 11 during the sliding adjustment process, so that the inner insertion beam frame 7 is constrained when the insertion is completed, thereby maintaining the stability of the inner insertion beam frame 7, facilitating the constraint processing of the thin chip, and making it easy to use; the telescopic slide 4 is set as an L-shaped structure, the top of the telescopic slide 4 is provided with a friction plate, the telescopic slide 4 is provided with a circular groove, the circular groove of the telescopic slide 4 is connected with a circular through hole, the inner side of the telescopic slide 4 is provided with a spring, and the telescopic slide 4 is slidably connected in the inner extension groove 3; the telescopic slide 4 is connected in the inner extension groove 3 by sliding, so that it drives the constraint plug 5 to adjust its position by sliding, thereby The control constraint plug 5 is inserted into the constraint card slot 11 to facilitate the constraint of the inner insertion beam frame 7, and at the same time, it is quickly inserted under the action of the spring, so as to facilitate the quick docking processing of the auxiliary device by instantaneous insertion, so as to facilitate its use; the inner insertion beam frame 7 is set as a rectangular frame structure, and a rectangular frame-shaped protrusion is provided on the inner wall of the inner insertion beam frame 7; the inner insertion beam frame 7 is used to control the top liquid level of the glue by opening a glue flow frame groove 8 and a solid glue groove 10 on the inner and outer walls respectively, and cooperating with the anti-high leakage groove 9, and in the process of chip installation, the glue is prevented from climbing up by leaking out, so as to avoid the glue from affecting the wire piece, so as to facilitate the assembly of the chip.

[0020] Embodiment 2: Based on Embodiment 1, Figures 1 to 10As shown, the external solid base 1 is set as a rectangular parallelepiped structure, the top of the external solid base 1 is provided with a rectangular groove, and the interior of the external solid base 1 is provided with a power-on component; the external solid base 1 is used to assist in the installation and fixation of other structures of the device, and is connected to the external wiring sheet 2 and the chip through the internal power-on component to maintain its normal use after the chip is assembled; the external wiring sheet 2 is set as a conductive metal sheet, and a circular connection hole is provided on the external wiring sheet 2, and there are two groups of external wiring sheets 2; the external wiring sheet 2 is used to connect with the power-on component inside the external solid base 1, so that the chip can be connected after being connected to the external circuit, so as to facilitate the normal use of the chip; the constraint plug 5 is set as a trapezoidal block structure; the constraint plug The block 5 is used to adjust the position driven by the telescopic slide 4, and is inserted into the inside of the constraint card slot 11 during the adjustment process, so as to facilitate the constraint of the inner insertion bundle frame 7 after insertion, so as to assist in the external discharge of the rubber while maintaining stability; the inner glue-carrying groove 6 is set as a rectangular parallelepiped structure, and a rectangular groove is provided on the top of the inner glue-carrying groove 6; the inner glue-carrying groove 6 is used to assist in loading the rubber for fixing the chip, so as to facilitate the fixing of the chip; the glue flow frame groove 8 is set as a rectangular frame-shaped groove, and an inclined surface is provided on the inner wall of the glue flow frame groove 8; the glue flow frame groove 8 is used to assist in the leakage of the climbing rubber by connecting with the anti-high leakage groove 9, so as to facilitate the rubber climbing position to be too high to avoid it from hitting the core The anti-leakage groove 9 is a circular through hole; the anti-leakage groove 9 is used to assist the leakage of the climbing rubber by connecting with the flow frame groove 8, so that the rubber climbing position is too high to avoid affecting the use of the chip and facilitate its use; the solid gel groove 10 is set as a rectangular frame-shaped groove, and the inner side of the solid gel groove 10 is connected with a rectangular frame-shaped groove; the constraint card slot 11 is set as a rectangular groove; the constraint card slot 11 is used to constrain the inner plug-in frame 7 through the constraint plug-in block 5 during the insertion of the constraint plug-in block 5, so as to facilitate its overall stability and facilitate its use; the bottom solid frame 12 is set as a rectangular frame-shaped structure, and the bottom solid frame A rectangular frame-shaped protrusion is provided on the inner wall of the frame 12, and circular grooves are equidistantly provided on the outer wall of the bottom solid frame 12; the bottom solid frame 12 is used to constrain the adhesive rod 13 to facilitate its connection with the adhesive, so that it can be removed together with the adhesive during the removal process, which is convenient for its use; the adhesive rod 13 is set as a cylindrical structure, and a cylindrical protrusion is provided on the adhesive rod 13, and a contact groove is provided on the cylindrical protrusion of the adhesive rod 13; the adhesive rod 13 is used to connect while the adhesive leaks into the solid gel groove 10, so that when the chip is removed, the chip can be removed by removing the inner insert bundle frame 7 as a whole to prevent it from affecting the chip during the removal process. Specific usage and function of this embodiment: In the present invention, during assembly, the external wiring sheet 2 is connected to the power-carrying component in the external solid base 1, and then the glue-carrying inner groove 6 is fixed to the inside of the external solid base 1 by screws, and it is kept stable, and then the bottom solid frame 12 is sleeved in the solid gel groove 10, and the two are fixed by screws, and then the inner plug-in bundle frame 7 is inserted into the inside of the external solid base 1 as a whole, and during the insertion process, it is sleeved in the glue-carrying inner groove 6, and the glue-carrying inner groove 6 is made to fit the inner wall of the inner plug-in bundle frame 7, Then, the glue is loaded into the glue-carrying inner groove 6, and finally the chip is inserted into the outer solid base 1 and the glue-carrying inner groove 6. As the chip is inserted, the glue inside the glue-carrying inner groove 6 climbs up, and when the glue climbs up to the position of the anti-high leakage groove 9, the excess glue leaks out to the glue flow frame groove 8 through the anti-high leakage groove 9, and flows into the solid gel groove 10 under the action of the inclined rectangular through hole, and the excess glue is solidified, and the excess glue is fixed inside the solid gel groove 10, thereby completing the fixation of the glue; When the chip is removed, the screws at the bottom of the outer base 1 are removed to release the constraint between the outer base 1 and the inner glue-carrying groove 6, and then the bottom of the outer base 1 is heat-treated to soften the glue bottom layer, and then the telescopic slide 4 is pushed outward to adjust the telescopic slide in the inner extension groove 3, and at the same time, the constraint block 5 is driven to slide out from the inside of the constraint card slot 11 to contact the constraint of the inner insertion beam frame 7, so that the chip together with the bottom glue can be removed by pulling up the inner insertion beam frame 7, so as to facilitate its use.

[0021] In this article, there are a few points to note: 1. The drawings of the embodiments of the present disclosure only involve structures related to the embodiments of the present disclosure, and other structures may refer to general designs.

[0022] 2. In the absence of conflict, the embodiments of the present disclosure and the features therein may be combined with each other to obtain new embodiments.

[0023] The above are only specific embodiments of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A packaging fixture capable of reducing the height of silver paste, characterized in that: include: External fixed base (1); The external fixed base (1) is fixedly connected to an external wiring sheet (2), and the external wiring sheet (2) is electrically connected to a power-carrying component in the external fixed base (1); an inner extending groove (3) is provided on the inner wall of the external fixed base (1); a telescopic slide (4) is slidably connected in the inner extending groove (3); a restraining plug (5) is fixedly connected to the outer wall of the telescopic slide (4); a glue-carrying inner groove (6) is fixed to the inside of the external fixed base (1) by screws; the inner plug of the external fixed base (1) is An inner insert beam frame (7) is provided, and the inner insert beam frame (7) is sleeved on the outside of the glue-carrying inner groove (6); a glue flow frame groove (8) is provided inside the inner insert beam frame (7); an anti-high leakage groove (9) is provided inside the inner insert beam frame (7), and the anti-high leakage groove (9) is connected to the glue flow frame groove (8); a solid gel groove (10) is provided at the bottom of the inner insert beam frame (7), and the solid gel groove (10) is connected to the glue flow frame groove (8) via a rectangular through hole; and the outer wall of the inner insert beam frame (7) is equidistantly provided with a plurality of A constraint slot (11) is provided, and a constraint insert (5) is inserted into the constraint slot (11); a bottom fixing frame (12) is sleeved inside the solid gel slot (10), and the bottom fixing frame (12) is fixed to the bottom of the inner inserting frame (7) by screws; a rubber rod (13) is fixedly connected to the outer wall of the bottom fixing frame (12), and the rubber rod (13) is distributed in the solid gel slot (10); the inner extension slot (3) is configured as a rectangular groove, and a cylindrical rod is provided inside the inner extension slot (3), and the inner A disc-shaped protrusion is provided on the cylindrical rod of the extension groove (3); the telescopic slide (4) is configured as an L-shaped structure, a friction plate is provided on the top of the telescopic slide (4), a circular groove is provided on the telescopic slide (4), the circular groove of the telescopic slide (4) is connected to a circular through hole, a spring is provided on the inner side of the telescopic slide (4), and the telescopic slide (4) is slidably connected in the inner extension groove (3); the inner insertion beam frame (7) is configured as a rectangular frame-shaped structure, and a rectangular frame-shaped protrusion is provided on the inner wall of the inner insertion beam frame (7).

2. The packaging fixture capable of reducing the silver paste climbing according to claim 1, characterized in that: The external solid base (1) is configured as a rectangular parallelepiped structure, a rectangular groove is provided on the top of the external solid base (1), and a power supply component is provided inside the external solid base (1).

3. The packaging fixture capable of reducing the height increase of silver paste according to claim 1, characterized in that: The external wiring sheet (2) is configured as a conductive metal sheet, a circular connection hole is provided on the external wiring sheet (2), and there are two groups of external wiring sheets (2) in total.

4. The packaging fixture capable of reducing the silver paste climbing according to claim 1, characterized in that: The restraining plug block (5) is configured as a trapezoidal block structure; the glue-carrying inner groove (6) is configured as a rectangular parallelepiped structure, and a rectangular groove is provided at the top of the glue-carrying inner groove (6).

5. The packaging fixture capable of reducing the height climbing of silver paste according to claim 1, characterized in that: The glue flow frame groove (8) is configured as a rectangular frame-shaped groove, and an inclined surface is provided on the inner wall of the glue flow frame groove (8).

6. The packaging fixture capable of reducing the silver paste climbing according to claim 1, characterized in that: The anti-high leakage groove (9) is a circular through hole; the solid gel groove (10) is configured as a rectangular frame-shaped groove, and the inner side of the solid gel groove (10) is connected to a rectangular frame-shaped groove.

7. The packaging fixture capable of reducing the silver paste climbing according to claim 1, characterized in that: The restraining slot (11) is configured as a rectangular groove; the bottom fixing frame (12) is configured as a rectangular frame-shaped structure; a rectangular frame-shaped protrusion is provided on the inner wall of the bottom fixing frame (12); and circular grooves are provided at equal intervals on the outer wall of the bottom fixing frame (12).

8. The packaging fixture capable of reducing the silver paste climbing according to claim 1, characterized in that: The adhesive rod (13) is configured as a cylindrical structure, a cylindrical protrusion is provided on the adhesive rod (13), and a contact groove is provided on the cylindrical protrusion of the adhesive rod (13).

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