Radiator for power module and power equipment
By introducing multiple intermediate partitions and through-hole structures into the heat sink, the problem of insufficient heat dissipation performance of high-power semiconductor devices is solved, and more efficient heat dissipation effect is achieved, and the reliability of power equipment is improved.
Patent Information
- Application Number
- CN202411748715.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-29
- Publication Date
- 2025-04-18
AI Technical Summary
The high heat density generated by high-power semiconductor devices leads to heat dissipation challenges. The existing heat dissipation performance of the heat dissipation is insufficient, which affects the operating reliability of the equipment.
A radiator structure is designed, including a base plate, a plurality of intermediate partitions and at least two sets of heat dissipation fins. The intermediate partition plate contains through holes to enhance turbulence phenomenon, expand the heat exchange area and flow rate, and thereby improve heat dissipation performance.
By increasing the heat exchange area and flow rate, the heat dissipation performance of the radiator is significantly improved, the heat dissipation efficiency of the power module is improved, and the operational reliability of the power equipment is enhanced.
Smart Images
Figure CN119852256A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of energy technology, and in particular to a heat sink and a power device for a power module. Background Art
[0002] With the development of electronic technology, high-power semiconductor devices are increasingly widely used in the power electronics industry. As the computing power of high-power semiconductor devices continues to increase, their power consumption also increases significantly. Therefore, high-power semiconductor devices generate more and more heat, and the heat flux density is also increasing, which poses a higher challenge to the heat dissipation of high-power semiconductor devices.
[0003] At present, the heat dissipation of high-power semiconductor devices mainly utilizes the heat conduction between the heat sink and the high-power semiconductor to dissipate the heat generated by the high-power semiconductor through the heat sink. The heat dissipation performance of the heat sink has a great influence on the heat dissipation efficiency of the high-power semiconductor. Therefore, improving the heat dissipation performance of the heat sink is one of the key factors to achieve effective heat dissipation of high-power semiconductor devices. Summary of the invention
[0004] The present application provides a heat sink and a power device for a power module, which are used to improve the heat dissipation performance of the heat sink to achieve effective heat dissipation of the power module, thereby improving the operating reliability of the power device.
[0005] In the first aspect, the present application provides a heat dissipation structure for a power module, the heat dissipation structure comprising a base plate, one or more intermediate partitions and at least two groups of heat dissipation fins, wherein the base plate is used to contact the power module. One or more intermediate partitions are located on the same side of the base plate and are arranged opposite to the base plate. Along the direction from the base plate to the intermediate partition, each intermediate partition is located between two adjacent groups of heat dissipation fins, and the intermediate partition adjacent to the base plate is connected to the base plate through a group of heat dissipation fins. In addition, in the present application, at least one intermediate partition includes a first through hole. The design scheme of the radiator provided in the embodiment of the present application is adopted. Since the base plate, one or more intermediate partitions and at least two groups of heat dissipation fins can all be used for heat exchange with the heat exchange medium, it is beneficial to increase the heat exchange area of the radiator, thereby facilitating the improvement of the heat dissipation performance of the radiator. In addition, since at least one of the middle partitions includes a first through hole, the heat exchange medium can not only flow along the extension direction of the middle partition, but also flow between the flow channels on both sides of the middle partition through the first through hole, which is conducive to enhancing the turbulence phenomenon, thereby improving the mixing effect of the cold and hot heat exchange mediums, so as to improve the heat dissipation effect of the radiator. Moreover, compared with the solution of the radiator with only one flow channel, the solution provided by the present application uses the middle partition to separate at least two flow channels without changing the thickness of the radiator. The width of the two flow channels is small, which is conducive to increasing the flow rate of the heat exchange medium and generating turbulence, thereby improving the heat dissipation performance of the radiator.
[0006] In a possible implementation of the present application, the radiator includes two or more intermediate partitions, at least two of the two or more intermediate partitions include first through holes, and along the arrangement direction of the two or more intermediate partitions, the first through holes of at least two intermediate partitions are staggered. This can enhance the turbulence phenomenon while also changing the flow direction of the heat exchange medium, which is beneficial to improving the heat dissipation performance of the radiator.
[0007] In the present application, along the arrangement direction of two or more intermediate partitions, the projection of at least one first through hole on the bottom plate falls within the area of the bottom plate that is used to contact the power module. This can improve the mixing effect of the cold and hot heat exchange medium in the area of the bottom plate that is used to contact the power module, which is beneficial to improving the heat exchange efficiency between the radiator and the power module.
[0008] In a possible implementation of the present application, a group of heat dissipation fins located on the side of the middle partition including the first through hole facing the bottom plate includes at least two first heat dissipation fins and at least two second heat dissipation fins, the at least two first heat dissipation fins are arranged opposite to the first through hole, and the at least two second heat dissipation fins are distributed around the at least two first heat dissipation fins. Among them, the spacing between two adjacent first heat dissipation fins is smaller than the spacing between two adjacent second heat dissipation fins. In this way, the distribution density of the heat dissipation fins arranged opposite to the first through hole can be greater than the distribution density of the heat dissipation fins in other parts, which is conducive to enhancing the turbulence phenomenon, so as to enhance the mixing effect of the cold and hot heat exchange working medium, thereby improving the heat dissipation performance of the radiator.
[0009] In a possible implementation of the present application, along the direction from the bottom plate to the middle partition plate, the diameter of the port of the first through hole close to the bottom plate is smaller than the diameter of the port of the first through hole far from the bottom plate. This is conducive to reducing the pressure drop of the heat exchange medium, thereby reducing the power of the driving device that drives the heat exchange medium, thereby improving energy utilization.
[0010] In addition, in the present application, along the direction from the middle partition to the bottom plate, the thickness of the middle partition is less than the height of the heat dissipation fins, which can ensure the smooth flow of the heat exchange medium while also facilitating the increase of the heat dissipation area of the radiator.
[0011] In a possible implementation of the present application, the radiator further includes a top cover, one or more intermediate partitions and at least two groups of heat dissipation fins are located between the bottom plate and the top cover, and the top cover is connected to an adjacent intermediate partition through a group of heat dissipation fins. Since the top cover can also be used for heat exchange with the heat exchange medium, the heat exchange area between the radiator and the heat exchange medium can be further increased, thereby improving the heat dissipation performance of the radiator.
[0012] In a possible implementation, the radiator further includes a shell, which is provided with one or more intermediate partitions and at least two groups of heat dissipation fins, and the shell is connected to the bottom plate. In addition, there is a gap between the top cover and the shell along the direction from the intermediate partition to the bottom plate. This is conducive to increasing the flow channel in the cavity of the radiator, which is conducive to increasing the flow rate of the heat exchange medium, thereby facilitating improving the heat dissipation performance of the radiator.
[0013] In another possible implementation of the present application, the radiator further includes a distribution layer, which divides the cavity formed between the shell and the bottom plate into a distribution cavity and a heat dissipation cavity. The inlet and outlet of the radiator are connected to the distribution cavity, and the top cover, one or more intermediate partitions, and at least two groups of heat dissipation fins are located in the heat dissipation cavity. In addition, the top cover also includes a second through hole, and the distribution layer also includes a third through hole. With this solution, the heat exchange medium can enter the heat dissipation cavity through the third through hole after entering the distribution cavity, which can play a role in equalizing the flow of the heat exchange medium entering the heat dissipation cavity, and can also adjust the flow direction of the heat exchange medium entering the heat dissipation cavity to improve the heat dissipation efficiency of the radiator.
[0014] In a second aspect, the present application further provides a power device, which includes a housing, a circuit board, a power module, and the heat sink of the first aspect, wherein the circuit board and the power module are contained in the housing, and the power module is electrically connected to the circuit board. In the power device provided by the present application, since the heat sink has a good heat dissipation performance, it can achieve effective heat dissipation of the power module, thereby facilitating the improvement of the operating reliability of the power device. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 A schematic diagram of a new energy vehicle provided in an embodiment of the present application;
[0016] Figure 2 A schematic diagram of the structure of a radiator provided in an embodiment of the present application;
[0017] Figure 3 for Figure 2 Exploded view of the heat sink shown in;
[0018] Figure 4 for Figure 2 A view of the radiator shown in FIG.
[0019] Figure 5 for Figure 4 BB cross-sectional view of the radiator shown in;
[0020] Figure 6 for Figure 5 A schematic diagram of the structure shown in;
[0021] Figure 7 An exploded view of another structure of a heat sink provided in an embodiment of the present application;
[0022] Figure 8 for Figure 7 A schematic diagram of the heat sink shown in;
[0023] Fig. 9 Another schematic diagram of the structure of the heat sink provided in the embodiment of the present application;
[0024] Fig.10Another schematic diagram of the structure of the heat sink provided in the embodiment of the present application;
[0025] Fig.11 Another schematic diagram of the structure of the heat sink provided in the embodiment of the present application;
[0026] Fig.12 Another schematic diagram of the structure of the heat sink provided in the embodiment of the present application;
[0027] Fig.13 A possible arrangement of a plurality of first through holes of the middle partition provided in an embodiment of the present application;
[0028] Fig.14 Another schematic diagram of the structure of the heat sink provided in the embodiment of the present application;
[0029] Fig.15 A cross-sectional view of another structure of a radiator provided in an embodiment of the present application;
[0030] Fig.16 for Fig.15 Another cross-sectional view of the radiator shown;
[0031] Fig.17 for Fig.15 The schematic structural diagram of the radiator shown;
[0032] Fig.18 Another schematic diagram of the structure of the heat sink provided in the embodiment of the present application;
[0033] Fig.19 Another schematic diagram of the structure of the heat sink provided in the embodiment of the present application;
[0034] Fig. 20 Another schematic diagram of the structure of the heat sink provided in the embodiment of the present application;
[0035] Fig.21 Another schematic diagram of the structure of the heat sink provided in the embodiment of the present application;
[0036] Fig. 22 A simplified structural diagram of a power device provided in an embodiment of the present application.
[0037] Reference numerals:
[0038] 1000-on-board power supply; 100-power battery; 101-on-board charger; 2000-powertrain; 200-motor controller; 201-motor;
[0039] 3000-wheels;
[0040] 1- radiator; 10- bottom plate; 20- housing; 21- inlet; 22- outlet; 30a- first group of heat dissipation fins; 30b- second group of heat dissipation fins;
[0041] 30c-the third group of heat dissipation fins; 301-the first heat dissipation fins; 302-the second heat dissipation fins; 40-the middle partition; 401-the first through hole; 50-the top cover;
[0042] 501 - second through hole; 60 - distribution layer; 601 - third through hole; 71 - distribution cavity; 72 - heat dissipation cavity; 2 - housing; 3 - circuit board; 4 - power module. DETAILED DESCRIPTION
[0043] In order to make the purpose, technical scheme and advantages of the present application clearer, the embodiments of the present application will be further described in detail below in conjunction with the accompanying drawings. However, the example implementation can be implemented in various forms and should not be construed as being limited to the implementations set forth herein. The same reference numerals in the figures represent the same or similar structures, and thus their repeated description will be omitted. The words expressing position and direction described in the embodiments of the present application are all illustrated by taking the accompanying drawings as examples, but changes may be made as needed, and the changes made are all included in the scope of protection of the present application. The drawings of the embodiments of the present application are only used to illustrate the relative position relationship and do not represent the true proportion.
[0044] It should be noted that specific details are described in the following description to facilitate understanding of the present application. However, the embodiments of the present application can be implemented in a variety of other ways different from those described herein, and those skilled in the art can make similar generalizations without violating the connotation of the embodiments of the present application. Therefore, the present application is not limited to the specific implementation methods disclosed below.
[0045] Power devices are widely used in photovoltaic power generation systems, energy storage systems, or powertrain systems of new energy vehicles to convert current or voltage in the application system. Power devices can include inverters, microinverters or optimizers in photovoltaic power generation systems, converters in energy storage systems, on-board power supplies, motor controllers or microcontroller units (MCUs) in new energy vehicles, or site blade power supplies.
[0046] Taking new energy vehicles as an example, Figure 1 A schematic diagram of a new energy vehicle provided in an embodiment of the present application. Figure 1 As shown, the new energy vehicle provided in the embodiment of the present application includes an on-board power supply 1000, a power assembly 2000 and a wheel 3000. Among them, the power assembly 2000 is used to receive power from the on-board power supply 1000 and drive the wheel 3000. In the embodiment of the present application, the new energy vehicle includes an electric vehicle or a hybrid vehicle.
[0047] The vehicle power supply 1000 mainly includes a power battery 100 and an on-board charger (OBC) 101 . The on-board charger 101 is used to convert AC power into DC high-voltage power to supply the power battery 100 .
[0048] The powertrain 2000 includes a motor controller 200 and a motor 201. The motor controller 200 is used to drive the motor 201. Specifically, the motor controller 200 receives the direct current output by the power battery 100 and outputs the alternating current to the motor 201. The motor 201 receives the power from the motor controller 200 and drives the wheels 3000.
[0049] In the present application, the on-board charger 101 and the motor controller 200 etc. all include a power module, which may include various power devices such as chips, inductors, resistors or capacitors. These power devices are connected according to certain functional combinations and then packaged as a whole through a packaging process. With the rapid development of power devices such as on-board power supplies and motor controllers, the power density of power modules in power devices is getting higher and higher. In order to ensure the reliable operation of the power module, it is necessary to dissipate the heat generated by the power module in a timely manner, which puts high demands on the heat dissipation performance of the radiator. It is understandable that there are many factors that affect the heat dissipation performance of the radiator, such as the heat exchange area, the type of heat exchange medium, and the flow rate. By analyzing the factors that affect the heat dissipation performance of the radiator, a radiator that meets the heat dissipation requirements can be obtained.
[0050] In view of this, the embodiment of the present application designs the radiator by analyzing the factors affecting the radiator to improve the heat dissipation performance of the radiator, thereby meeting the heat dissipation requirements of the power module, which is conducive to improving the operating reliability of the power device. In order to facilitate understanding of the solution provided by the present application, it is described in detail in conjunction with specific embodiments.
[0051] Figure 2 A schematic diagram of the structure of the heat sink provided in the embodiment of the present application. Figure 2 As shown, in the present application, the radiator may include a base plate 10 and an outer shell 20, and the outer shell 20 is buckled on the base plate 10 to form a cavity between the outer shell 20 and the base plate 10, and the heat exchange medium can flow in the cavity to achieve heat exchange between the heat exchange medium and the base plate 10.
[0052] The present application does not limit the type of radiator, and an exemplary radiator may be a liquid-cooled radiator or an air-cooled radiator, and the heat exchange medium of the radiator may be either a liquid medium or air.
[0053] In the present application, the material of the housing 20 and the bottom plate 10 is not limited. For example, the material of the housing 20 can be a lightweight material such as plastic to reduce the weight of the entire radiator. In addition, the material of the housing 20 can also be a metal such as copper, aluminum, or a metal alloy to improve the heat dissipation performance of the radiator. The bottom plate 10 can be used to contact the power module, and the bottom plate 10 can be a plate-shaped structure made of a metal such as copper, aluminum, or a metal alloy to achieve heat conduction between the power module and the bottom plate 10.
[0054] The present application does not limit the specific connection method between the housing 20 and the base plate 10, which can be detachably connected by fasteners such as screws to facilitate the subsequent maintenance of the radiator.
[0055] It is understandable that the housing 20 may be provided with an inlet 21 for the heat exchange medium to enter, and an outlet 22 for the heat exchange medium to flow out, so as to utilize the circulation of the heat exchange medium to achieve its heat dissipation function. In addition, the circulation of the heat exchange medium may be achieved by a driving device such as a pump.
[0056] Figure 3 for Figure 2 An exploded view of the heat sink is shown in Figure . Figure 3 As shown, the radiator also includes heat dissipation fins, and the housing 20 is covered with heat dissipation fins. Figure 4 , Figure 4 for Figure 2 A view of the heat sink shown in . In addition, refer to Figure 5 , Figure 5 for Figure 4 In this embodiment of the present application, the radiator further comprises two groups of radiating fins and a middle partition 40, and the housing 20 is provided with the middle partition 40 and at least two groups of radiating fins so that the two groups of radiating fins and the middle partition 40 are accommodated in the cavity.
[0057] like Figure 5 As shown, the middle partition 40 is arranged opposite to the bottom plate 10, and the middle partition 40 is located between the two groups of heat dissipation fins. For the convenience of distinction, the two groups of heat dissipation fins can be respectively recorded as the first group of heat dissipation fins 30a and the second group of heat dissipation fins 30b, wherein the first group of heat dissipation fins 30a is located between the middle partition 40 and the bottom plate 10, and the second group of heat dissipation fins 30b is located on the side of the middle partition 40 away from the bottom plate 10, that is, along the direction from the bottom plate 10 to the middle partition 40, the two groups of heat dissipation fins are arranged on both sides of the middle partition 40.
[0058] In the present application, the intermediate partition 40 and the bottom plate 10 may be connected via the first group of heat dissipation fins 30a. The first group of heat dissipation fins 30a and the bottom plate 10 may be connected via welding, or the first group of heat dissipation fins 30a and the bottom plate 10 may be an integrally formed structure.
[0059] exist Figure 5 In the illustrated embodiment, the second group of heat dissipating fins 30b and the middle partition plate 40 may also be connected by welding, or the second group of heat dissipating fins 30b and the middle partition plate 40 may be an integrally formed structure to improve the structural reliability of the heat sink.
[0060] It is worth mentioning that in the present application, the first group of heat dissipation fins 30a may include a plurality of heat dissipation fins, and the second group of heat dissipation fins 30b may also include a plurality of heat dissipation fins. In addition, the specific configuration of the first group of heat dissipation fins 30a and the second group of heat dissipation fins 30b may be the same or different. Exemplarily, the number, cross-sectional shape, and distribution of the heat dissipation fins in the first group of heat dissipation fins 30a and the second group of heat dissipation fins 30b are the same, or the number of the first group of heat dissipation fins 30a and the second group of heat dissipation fins 30b is the same, but the cross-sectional shape and distribution are not completely the same.
[0061] In addition, the materials of the middle partition 40 and the bottom plate 10 may be the same or different, and the materials of the two groups of heat dissipation fins may be the same or different from the bottom plate 10. For example, in a possible embodiment, the materials of the middle partition 40, the bottom plate 10 and the two groups of heat dissipation fins are the same, for example, copper, and the middle partition 40, the bottom plate 10 and the two groups of heat dissipation fins are an integrated structure. This can reduce thermal resistance while ensuring the structural reliability of the radiator, thereby facilitating the improvement of the heat dissipation performance of the radiator.
[0062] Figure 6 for Figure 5 Schematic diagram of the structure shown in. Figure 6 The dotted arrow in is used to indicate the flow direction of the heat exchange medium. From the above introduction, it can be seen that the design scheme of the radiator provided by the present application, since the bottom plate 10, the middle partition 40 and the two sets of heat dissipation fins can all be in thermal contact with the heat exchange medium, it is beneficial to increase the heat exchange area of the radiator, thereby helping to improve the heat dissipation efficiency of the radiator. In addition, compared with the scheme in which the cavity of the radiator is used as a whole flow channel, the scheme provided by the present application uses the middle partition 40 to separate the cavity of the radiator into at least two flow channels without changing the thickness of the radiator. The height of the two flow channels is relatively small, which is beneficial to increase the flow rate of the heat exchange medium and also to generate turbulence, thereby helping to improve the heat dissipation performance of the radiator.
[0063] Figure 7Another schematic diagram of the structure of the heat sink provided in the embodiment of the present application is shown in FIG. Figure 7 As shown, the radiator further includes a top cover 50. Figure 8 , Figure 8 for Figure 7 In the present application, the middle partition 40, the first group of heat dissipation fins 30a and the second group of heat dissipation fins 30b are located between the bottom plate 10 and the top cover 50, and the top cover 50 is connected to the adjacent middle partition 40 through the second group of heat dissipation fins 30b. This is conducive to increasing the heat exchange area of the radiator, so as to improve the heat dissipation performance of the radiator.
[0064] In the present application, the material of the top cover 50 can be copper, aluminum or other metal or metal alloy to improve the heat dissipation performance of the radiator. In addition, the top cover 50 and the second group of heat dissipation fins 30b can be welded, or the two can be an integrally formed structure to ensure the structural reliability of the radiator.
[0065] You can continue to refer to Figure 5 In this application, along the direction from the middle partition 40 to the bottom plate 10, that is, Figure 5 In the Y direction shown in FIG, there is a gap between the top cover 50 and the housing 20 to form a flow channel between the top cover 50 and the housing 20. This is beneficial to increase the heat exchange area between the radiator and the heat exchange medium, so as to improve the heat dissipation efficiency of the radiator.
[0066] The present application does not limit the size of each flow channel. For example, the width of each flow channel along the Y direction can be the same or different. For example, in one possible embodiment, the width of the flow channel between the bottom plate 10 and the middle partition 40 is 2 mm, and the width of the flow channel between the middle partition 40 and the top cover 50 is 1 mm. In another possible embodiment of the present application, the width of the flow channel between the bottom plate 10 and the middle partition 40 and between the middle partition 40 and the top cover 50 can be 1.5 mm.
[0067] In addition, the thickness of the bottom plate 10, the middle partition plate 40 and the top cover 50 is not limited in the present application. For example, the thickness of the bottom plate 10 can be 0.5 mm-2 mm, the thickness of the middle partition plate 40 can be 0.5 mm-1 mm, and the thickness of the top cover 50 can be 0.5 mm-1 mm. In this way, the thickness of the entire radiator can be relatively small, which is conducive to realizing a thin design of the radiator.
[0068] It is worth mentioning that in the embodiment of the present application, along the direction from the middle partition 40 to the bottom plate 10, the thickness of the middle partition 40 can be less than or equal to the height of the cooling fins, which can ensure the smooth flow of the heat exchange medium while also facilitating the increase of the heat dissipation area of the radiator.
[0069] Fig. 9 Another schematic diagram of the structure of the heat sink provided in the embodiment of the present application. Fig. 9 In the illustrated embodiment, the middle partition 40 includes a first through hole 401, so that the two flow channels located on both sides of the middle partition 40 along the Y direction can be connected, so that not only the heat exchange medium can flow along the extension direction of the middle partition 40, but also the heat exchange medium can flow in a direction perpendicular to the middle partition 40, which is conducive to the enhancement of turbulence, thereby improving the mixing effect of cold and hot heat exchange mediums, and further improving the heat dissipation effect of the radiator.
[0070] In the embodiment of the present application, the setting position of the first through hole 401 can be adjusted according to the relative position of the heat sink and the power module to be cooled. For example, the projection of at least one first through hole 401 on the base plate 10 can fall within the area of the base plate 10 that is used to contact the power module, thereby improving the mixing effect of the cold and hot heat exchange working media in the area of the base plate that is used to contact the power module, which is beneficial to improving the heat exchange efficiency between the heat sink and the power module.
[0071] It is worth mentioning that the present application does not limit the specific arrangement of the first through hole 401. For example, the first through hole 401 may be a hole of a regular shape such as a round hole, a square hole or a diamond hole, or may be a hole of other irregular shapes. In the present application, the aperture of the first through hole 401 may be selected according to the size of the particles allowed in the flow channel of the radiator, and may be 2 mm ± 1 mm, for example, 1.5 mm, 1.8 mm, 2.5 mm or 2.8 mm, etc., to avoid clogging of the first through hole 401.
[0072] In addition, the first through hole 401 can be a hole of equal aperture or a hole of unequal aperture. Fig.10 In the heat sink shown, the first through hole 401 is an expanded hole, and along the direction from the bottom plate 10 to the middle partition plate 40 , the diameter of the end of the first through hole 401 close to the bottom plate 10 is smaller than the diameter of the end away from the bottom plate 10 .
[0073] It can be understood that by adjusting the setting of the first through hole 401, the flow direction of the heat exchange medium can also be adjusted. For example, the first through hole 401 can be set as an inclined hole so that the projection of the opening of the first through hole 401 close to the base plate 10 on the base plate 10 can at least partially cover the part of the base plate 10 that is used to contact the power module, so that the heat exchange medium can flow from the first through hole 401 to the part of the base plate 10 that is used to contact the power module, which is beneficial to improving the heat exchange efficiency between the heat exchange medium and the power module, thereby improving the heat dissipation efficiency of the power module.
[0074] In addition, the middle partition plate 40 may be provided with only one first through hole 401 or multiple first through holes 401, which may be specifically provided according to the heat dissipation requirements of the power module and the number of heat dissipation modules. Fig.11 In the heat sink shown in FIG. 1 , the middle partition plate 40 may include a plurality of first through holes 401 , and the arrangement of the plurality of first through holes 401 may be the same or different. Fig.11 In the embodiment shown, no heat dissipation fins are disposed between two adjacent first through holes 401. Fig.12 The heat sink shown also includes a case where a heat dissipation fin is provided between two adjacent first through holes 401 .
[0075] In addition, if Fig.13 As shown, Fig.13 A possible arrangement of the plurality of first through holes 401 of the middle partition is shown. For the convenience of illustration, Fig.13 The structure of the heat dissipation fins is omitted. In this embodiment, the plurality of first through holes 401 of the middle partition plate 40 may be arranged in an array, wherein the plurality of first through holes 401 may be arranged relative to the area of the bottom plate 10 for contacting the power module, so as to facilitate the improvement of the heat exchange efficiency between the heat exchange medium and the power module.
[0076] Fig.14 Another schematic diagram of the structure of the heat sink provided in the embodiment of the present application. Fig.14 In the illustrated embodiment, the top cover 50 may further include a second through hole 501, and the heat exchange medium between the top cover 50 and the housing 20 may flow through the second through hole 501 to the flow channel of the top cover 50 facing the bottom plate 10. It is understandable that the second through hole 501 plays a similar role to the first through hole 401 on the intermediate cover plate 40, and will not be described in detail herein. In addition, the second through hole 501 may be arranged opposite to the first through hole 401, or may be arranged in an interlaced manner, and may be arranged according to specific heat dissipation requirements, and is not limited in this application.
[0077] Reference Fig.15 , Fig.15 A cross-sectional view of another structure of the heat sink provided in an embodiment of the present application. In this embodiment, the heat sink further includes a distribution layer 60. Along the direction from the middle partition 40 to the bottom plate 10, the distribution layer 60 divides the cavity of the heat sink into a distribution cavity 71 and a heat dissipation cavity 72. The present application does not limit the material of the distribution layer 60, which can be a lightweight material such as plastic to reduce the weight of the entire heat sink. The material of the distribution layer 60 can be the same as or different from the material of the housing 20.
[0078] In addition, the distribution layer 60 and the shell 20 may be detachably connected by plugging or snapping, or the distribution layer 60 and the shell 20 may be an integrally formed structure, which is not limited in the present application.
[0079] It is understandable that the middle partition plate 40, the heat dissipation fins and the top cover 50 are located in the heat dissipation cavity 72 for heat exchange with the heat exchange medium. In addition, in the present application, the inlet 21 and the outlet 22 of the housing 20 of the radiator can be connected to the distribution cavity 71. Fig.16 , Fig.16 for Fig.15 Another cross-sectional view of the heat sink shown in FIG. 1 is used to illustrate the structure of the distribution layer. Fig.16 As shown, the distribution layer 60 includes a third through hole 601, which is also referred to Fig.15 and Fig.16 After the heat exchange medium enters the distribution chamber 71 from the inlet 21, it can enter the heat dissipation chamber 72 through the third through hole 601 for heat exchange; and after the heat exchange, the heat exchange medium enters the distribution chamber 71 and can flow out of the radiator through the outlet 22, thereby realizing the circulation of the heat exchange medium.
[0080] In the present application, the third through hole 601 of the distribution layer 60 can not only play a role in balancing the flow of the heat exchange medium flowing to the heat dissipation cavity 72, but also adjust the flow direction of the heat exchange medium by adjusting its position. Fig.17 As shown, Fig.17 for Fig.15 The schematic diagram of the heat sink is shown in FIG. Fig.17 In the illustrated embodiment, the third through hole 601 may be arranged opposite to the second through hole 501 and the first through hole 401. In other possible embodiments of the present application, at least two of the third through hole 601, the second through hole 501 and the first through hole 401 may be arranged in a staggered manner. This is used to adjust the flow direction of the heat exchange medium, for example, to make it flow to the area of the bottom plate that is used to contact the power module, so as to improve the heat dissipation efficiency of the radiator.
[0081] In the above embodiments, the specific configuration of the heat sink is described by taking the heat sink including one intermediate partition 40 as an example. However, in the present application, the number of the intermediate partitions 40 is not specifically limited. Fig.18 In the embodiment shown, the heat sink includes two intermediate partitions 40, and the two intermediate partitions 40 are arranged in a spaced relationship in a direction away from the base plate 10. Fig.18As shown, the bottom plate is connected to the adjacent middle partition 40 through the first group of heat dissipation fins 30a, the two adjacent middle partitions 40 are connected through the second group of heat dissipation fins 30b, and the top cover 50 is connected to the adjacent middle partition 40 through the third group of heat dissipation fins 30c. In this embodiment, the radiator includes two middle partitions 40 and three groups of heat dissipation fins. This can increase the heat exchange area of the radiator, which is beneficial to improving the heat dissipation efficiency of the radiator. In addition, since the radiator cavity can be divided into multiple flow channels by setting two middle partitions 40, the height of each flow channel can be made smaller, which is beneficial to increase the flow rate of the heat exchange medium and enhance the turbulence phenomenon, which is beneficial to improve the heat dissipation performance of the radiator.
[0082] Fig.18 The specific arrangement of each part of the heat sink in the embodiment shown can refer to any of the above embodiments, for example, the width of the flow channel between two adjacent intermediate partitions 40 can be the same as the width of other flow channels (for example, both are 0.8mm-1mm), or different; for example, the third group of heat dissipation fins 30c can be arranged with reference to the first group of heat dissipation fins 30a and the second group of heat dissipation fins 30b, etc. They are not listed one by one here, but they should be understood to fall within the protection scope of this application.
[0083] It is worth mentioning that the above is only an exemplary introduction to the number of the intermediate partitions 40, which can be specifically designed according to the space of the heat sink cavity and the heat dissipation requirements of the power module. For example, in some possible embodiments of the present application, the heat sink may include more than two intermediate partitions 40, such as three, four or five. Fig.18 The embodiments shown are similar and will not be described in detail here.
[0084] As can be seen from the above description, the middle partition 40 can be provided with a first through hole 401 to connect the flow channels on both sides of the middle partition 40, thereby enhancing the turbulence phenomenon. Fig.19 , Fig.19 Another schematic diagram of the structure of the heat sink provided in the embodiment of the present application. In this embodiment, the heat sink includes two intermediate partitions 40, the two intermediate partitions 40 are arranged adjacent to each other, and the two intermediate partitions 40 each include a first through hole 401. In addition, as Fig.19 As shown, along the arrangement direction of the two middle partitions 40, the first through holes 401 of the two middle partitions 40 are staggered, which can not only enhance the turbulence phenomenon, but also change the flow direction of the heat exchange medium. For example, the relative position relationship of the first through holes 401 of the two middle partitions 40 can be designed to guide the heat exchange medium to the area of the bottom plate 10 that is used to contact the power module, so as to improve the heat exchange efficiency between the radiator and the power module.
[0085] It can be understood that when the radiator includes more than two intermediate partitions 40, at least two of the intermediate partitions 40 may include the first through hole 401, so that the relative position and / or aperture of the first through hole 401 of each intermediate partition 40 is adjusted along the arrangement direction of the two or more intermediate partitions 40, so as to adjust the flow direction of the heat exchange medium. Fig.17 The embodiments shown are similar and will not be described in detail here.
[0086] Considering that the specific arrangement of the heat sink fins has a great influence on the flow resistance of the heat exchange medium, in the present application, the heat sink fins can also be arranged according to specific design requirements. Fig. 20 , Fig. 20 Another schematic diagram of the structure of the heat sink provided in the embodiment of the present application. In this embodiment, the heat dissipation fins may be cylindrical, which is conducive to reducing the flow resistance of the heat exchange medium to reduce the pressure drop, thereby facilitating the increase of the flow rate of the heat exchange medium, and facilitating the reduction of the power of the driving device for driving the heat exchange medium to flow, so as to improve the energy utilization rate.
[0087] In addition, it can be understood that different distribution densities of heat sink fins have different effects on the flow resistance and heat exchange area of the heat exchange medium. Based on this, in the present application, the distribution density of heat sink fins at different positions can be adjusted to balance the requirements of the heat sink for flow resistance and heat dissipation performance. For example, Fig.21 Another schematic diagram of the structure of the heat sink provided in the embodiment of the present application. Fig.21 In the illustrated embodiment, the heat sink includes a middle partition 40, and the middle partition 40 includes a first through hole 401. Among them, the first group of heat dissipation fins 30a, that is, a group of heat dissipation fins located on the side of the middle partition 40 including the first through hole 401 close to the bottom plate 10, includes at least two first heat dissipation fins 301 and at least two second heat dissipation fins 302, at least two first heat dissipation fins 301 are arranged opposite to the first through hole 401, and at least two second heat dissipation fins 302 are distributed around the at least two first heat dissipation fins 301. In this embodiment of the present application, the spacing between two adjacent first heat dissipation fins 301 is smaller than the spacing between two adjacent second heat dissipation fins 302. In this way, the distribution density of the heat dissipation fins arranged opposite to the first through hole 401 can be greater than the distribution density of the heat dissipation fins of other parts, which is conducive to enhancing the turbulence phenomenon, so as to improve the mixing effect of the cold and hot heat exchange working medium, thereby improving the heat dissipation performance of the heat sink.
[0088] It is worth mentioning that in Fig.21In the illustrated embodiment, the cross-sectional shapes of the first heat dissipating fin 301 and the second heat dissipating fin 302 are different, for example, the cross-sectional shape of the first heat dissipating fin 301 is a rhombus, and the cross-sectional shape of the second heat dissipating fin 302 is a circle, that is, in this embodiment, the cross-sectional shape of the heat dissipating fin is changed to adjust the distribution density of the heat dissipating fins in different regions. In some other possible embodiments of the present application, the cross-sectional shape of the first heat dissipating fin 301 and the second heat dissipating fin 302 can also be the same, for example, the cross-sectional shape of the first heat dissipating fin 301 and the second heat dissipating fin 302 are both rhombus or circle, and the distribution density can be adjusted by adjusting the spacing between the heat dissipating fins in different regions or adjusting the cross-sectional area of the heat dissipating fins.
[0089] exist Fig.21 In the illustrated embodiment, the distribution mode of the heat dissipation fins of the heat sink with one intermediate partition 40 is mainly described, and when the heat sink has multiple intermediate partitions 40, a similar arrangement mode may also be adopted, for example, a group of heat dissipation fins between two adjacent intermediate partitions 40 may be arranged according to the above distribution mode, etc. They will not be described in detail here, but they should all be understood to fall within the protection scope of this application.
[0090] This application does not limit the specific application scenarios of the heat sink introduced in the above embodiment, and it can be used in various power devices to dissipate heat for power modules with heat dissipation requirements. Fig. 22 , Fig. 22 A structural diagram of a power device provided in an embodiment of the present application. In practical applications, the power device may include a housing and a circuit board 3 accommodated in the housing 2, a power module 4, and a heat sink provided in any of the above embodiments of the present application, and the power module 4 is electrically connected to the circuit board 3. Among them, the circuit board 3 can be a printed circuit board (PCB), a flexible printed circuit (FPC), or a hard-soft combination circuit board. The present application does not limit the specific type of the power module 4. The power module may include a plurality of ports, which are electrically connected to the circuit board respectively, so as to use the circuit board to provide the power module with functions such as current or voltage input and output and power supply.
[0091] In addition, the power module 4 is in thermal contact with the base plate 10 of the radiator, so the heat generated by the power module 4 can be conducted to the base plate 10, and then conducted to the cooling fins, the middle partition plate 40 and the top cover 50 of the radiator 1, so as to achieve heat exchange with various parts of the radiator 1 through the circulation flow of the heat exchange medium, thereby achieving the effect of cooling the power module 4.
[0092] It is worth mentioning that the present application does not limit the specific configuration of the power module 4. For example, the power module 4 may include a substrate, a chip, a heat dissipation base plate, and a packaging layer, wherein the substrate is fixed to the heat dissipation base plate, the chip is located on the side of the substrate away from the heat dissipation base plate, and the packaging layer is used to wrap the chip and the substrate to achieve packaging of the chip and the substrate. In this way, the heat dissipation base plate of the power module 4 can be in thermal contact with the bottom plate 10 of the radiator 1, so that the heat generated by the chip is conducted to the bottom plate 10 of the radiator 1 through the substrate and the heat dissipation base plate, thereby achieving heat dissipation of the power module 4 by the radiator 1.
[0093] In the various embodiments of the present application, unless otherwise specified or there is a logical conflict, the terms and / or descriptions between different embodiments are consistent and can be referenced to each other, and the technical features in different embodiments can be combined to form new embodiments according to their internal logical relationships.
[0094] The above are only specific implementations of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.
Claims
1. A heat sink for a power module, characterized in that: The heat sink comprises a bottom plate, one or more intermediate partitions and at least two groups of heat dissipation fins, wherein: The bottom plate is used to contact the power module; The one or more intermediate partitions are located on the same side of the bottom plate and are arranged opposite to the bottom plate; along the direction from the bottom plate to the intermediate partitions, each of the intermediate partitions is located between two adjacent groups of the heat dissipation fins, and the intermediate partitions adjacent to the bottom plate are connected to the bottom plate through a group of the heat dissipation fins; At least one of the intermediate partitions includes a first through hole.
2. The heat sink according to claim 1, characterized in that The heat sink comprises two or more intermediate partitions, wherein at least two of the two or more intermediate partitions comprise first through holes, and along the arrangement direction of the two or more intermediate partitions, the first through holes of at least two of the intermediate partitions are staggered.
3. The heat sink according to claim 2, characterized in that Along the arrangement direction of the two or more intermediate partitions, a projection of at least one of the first through holes on the bottom plate falls within a region of the bottom plate for contacting the power module.
4. The radiator according to any one of claims 1 to 3, characterized in that: A group of the heat dissipation fins located on the side of the middle partition including the first through hole facing the bottom plate includes at least two first heat dissipation fins and at least two second heat dissipation fins, the at least two first heat dissipation fins are arranged opposite to the first through hole, and the at least two second heat dissipation fins are distributed around the at least two first heat dissipation fins; The distance between two adjacent first heat dissipation fins is smaller than the distance between two adjacent second heat dissipation fins.
5. The radiator according to any one of claims 1 to 4, characterized in that: Along the direction from the bottom plate to the middle partition plate, the diameter of the end of the first through hole close to the bottom plate is smaller than the diameter of the end of the first through hole far from the bottom plate.
6. The radiator according to any one of claims 1 to 5, characterized in that: Along the direction from the middle partition to the bottom plate, the thickness of the middle partition is less than or equal to the height of the heat dissipation fins.
7. The radiator according to any one of claims 1 to 6, characterized in that: The radiator further comprises a top cover, wherein the one or more intermediate partitions and the at least two groups of heat dissipation fins are located between the bottom plate and the top cover; the top cover is connected to an adjacent intermediate partition through a group of the heat dissipation fins.
8. The heat sink according to claim 7, characterized in that The radiator also includes a shell, which covers the one or more intermediate partitions and the at least two groups of heat dissipation fins, and the shell is connected to the base plate; along the direction from the intermediate partition to the base plate, there is a gap between the top cover and the shell.
9. The heat sink according to claim 8, characterized in that The radiator also includes a distribution layer, which divides the cavity formed between the shell and the base plate into a distribution cavity and a heat dissipation cavity. The inlet and outlet of the radiator are connected to the distribution cavity. The top cover, the one or more intermediate partitions and the at least two groups of heat dissipation fins are located in the heat dissipation cavity. The top cover includes a second through hole, and the distribution layer includes a third through hole.
10. A power device, characterized in that: It comprises a shell, a circuit board, a power module and the heat sink as described in any one of claims 1 to 9, wherein the circuit board, the power module and the heat sink are accommodated in the shell, the power module is electrically connected to the circuit board, and the bottom plate of the heat sink is in thermal contact with the power module.