Semiconductor packaging structure and radio frequency system

Abstract

The embodiment of the invention provides a semiconductor packaging structure and a radio frequency system. The semiconductor packaging structure comprises a circuit board, a pre-packaged tube core and a heat dissipation assembly. The pre-packaged tube core is electrically connected with the circuit board, and the pre-packaged tube core is arranged between the circuit board and the heat dissipation assembly; the heat dissipation assembly comprises a heat dissipation layer and a heat dissipation pipe shell, the heat dissipation pipe shell is connected with the circuit board, and the heat dissipation layer is arranged between the pre-packaging pipe core and the heat dissipation pipe shell. According to the scheme, an alloy tube shell structure with a complex manufacturing process is converted into the circuit board, the pre-packaged tube core and the heat dissipation tube shell which can be independently manufactured, a good heat dissipation channel between the pre-packaged tube core and the heat dissipation tube shell is achieved through the heat dissipation layer, and the components can be flexibly selected according to product requirements; and huge equipment investment and manpower cost in the actual production process are avoided.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a semiconductor packaging structure and a radio frequency system. Background Art

[0002] Traditional packaging of power devices mostly uses alloy tubes and shells, such as tungsten copper (W / Cu), molybdenum copper (Mo / Cu), etc. Alloy tube and shell packaging has significant advantages in high-power devices, especially in heat dissipation, mechanical strength, electromagnetic shielding and environmental adaptability. The materials usually used for alloy tubes and shells are oxygen-free copper, but the disadvantage is that the thermal expansion coefficient is too high; Kovar alloy, the disadvantage is that the heat dissipation capacity is too low and the specific gravity is high; SiC / Al composite materials, although they have the advantages of low expansion, high thermal conductivity, light weight, and low cost, their thermal conductivity is relatively general; diamond materials have high thermal conductivity and can be used as heat sinks, but the cost is high, and the traditional brazing method of combining with the packaging alloy has problems such as complex process, low reliability, and large interface thermal resistance. With the continuous enrichment of application scenarios, the alloy tube and shell packaging method is limited to larger-scale use due to problems such as complex process, production precision, and high cost caused by material compatibility risks.

[0003] In practical applications, a variety of composite materials are usually used to make alloy tube shells. For example, in the Chinese invention patent with application number CN200610096639.X, a SiC / Al base substrate with steps is used, and a diamond heat sink is inlaid on the steps. The steps of the manufacturing method are operated, including batching, inlaying, metallization, electroplating, etc. This method improves the heat dissipation performance while further increasing the manufacturing cost. In addition, in the packaging of power devices, there are often multiple die packages together. For example, in the Chinese invention patent with application number CN202310507410.4, the control chip and the GaN chip are 3D stacked and parallel to each other. It is necessary to set a half-etched groove at the bottom of the inner end of the frame pin to enhance the bonding force with the plastic package. The frame pins connected to the D pole of the GaN chip and the control pin of the control chip are located on the adjacent sides of the packaging structure to reduce the package size. This method has complex manufacturing processes and extremely high requirements for tolerance control. The control chip and the GaN chip are stacked closely, and the heat conduction path is relatively complex. Complex manufacturing processes, strict tolerance control requirements, and possible heat dissipation design needs have all led to a significant increase in equipment investment, labor costs, and testing costs during the production process. Summary of the invention

[0004] In order to solve one or more of the above-mentioned technical problems existing in the prior art, the embodiments of the present application provide a new semiconductor packaging structure and a radio frequency system to solve the technical problems existing in the prior art of process complexity and the inability to balance production accuracy and production cost.

[0005] In order to achieve the above-mentioned purpose, the technical solution adopted by this application to solve its technical problems is: In a first aspect, the present application provides a semiconductor packaging structure, including a circuit board, a pre-packaged die, and a heat dissipation component; The prepackaged tube die is electrically connected to the circuit board, and the prepackaged tube die is arranged between the circuit board and the heat dissipation component; The heat dissipation component comprises a heat dissipation layer and a heat dissipation shell, the heat dissipation shell is connected to the circuit board, and the heat dissipation layer is arranged between the pre-packaged tube core and the heat dissipation shell.

[0006] In a specific embodiment, a receiving groove is provided on a side of the heat dissipation tube shell facing the circuit board, and the pre-packaged tube core and the heat dissipation layer are arranged in the receiving groove.

[0007] In a specific embodiment, the material of the heat dissipation shell includes one or more of diamond and ceramic.

[0008] In a specific embodiment, the semiconductor package structure further includes: The buffer is made of elastic material and is arranged between the circuit board and the heat dissipation component.

[0009] In a specific embodiment, the buffer is disposed around the heat dissipation layer and the pre-packaged die.

[0010] In a specific embodiment, the circuit board includes at least a signal port, a surface mount pad, and a circuit structure; The circuit structure is manufactured inside or on the surface of the circuit board and connected to the signal port; The surface mount pad is located on the surface of the circuit board and is electrically connected to the circuit structure. The pre-packaged tube core is electrically connected to the circuit board through the surface mount pad.

[0011] In a specific embodiment, the signal port includes at least one, and at least one of the signal ports is located on any surface or any side of the circuit board; And / or, the surface mount pads include at least two.

[0012] In a specific embodiment, the prepackaged die includes a die pad located on a surface of the prepackaged die and a semiconductor die embedded in the prepackaged die by 3D packaging technology; The die pad is electrically connected to the semiconductor die, and the prepackaged die is electrically connected to the circuit board through the die pad.

[0013] In a specific embodiment, the die pad is located on any surface of the pre-packaged die.

[0014] In a specific embodiment, the heat dissipation layer is in direct contact with the pre-packaged tube core and the heat dissipation tube shell or is welded or bonded with a thermally conductive material.

[0015] In a specific embodiment, the semiconductor packaging structure further includes a positioning component, which includes a first positioning member arranged on the circuit board and a second positioning member arranged on the heat dissipation tube shell, and the circuit board and the heat dissipation tube shell are aligned through the first positioning member and the second positioning member.

[0016] In a specific embodiment, the first positioning member and / or the second positioning member comprises a positioning hole or a positioning groove.

[0017] In a specific embodiment, the circuit board and the heat dissipation shell are sealed and connected.

[0018] In a second aspect, the present application provides a radio frequency system, comprising at least a semiconductor packaging structure as described in any one of the first aspects.

[0019] The beneficial effects of the technical solution provided by the embodiment of the present application are: The semiconductor packaging structure and radio frequency system provided in the embodiments of the present application include a semiconductor packaging structure circuit board, a prepackaged tube core and a heat dissipation component; the prepackaged tube core is electrically connected to the circuit board, and the prepackaged tube core is arranged between the circuit board and the heat dissipation component; the heat dissipation component includes a heat dissipation layer and a heat dissipation tube shell, the heat dissipation tube shell is connected to the circuit board, and the heat dissipation layer is arranged between the prepackaged tube core and the heat dissipation tube shell. The present application scheme transforms the alloy tube shell structure with complex manufacturing process into several components, namely, a circuit board, a prepackaged tube core and a heat dissipation tube shell that can be independently manufactured, and realizes a good heat dissipation channel between the prepackaged tube core and the heat dissipation tube shell through the heat dissipation layer, and these components can be flexibly selected according to product requirements, thereby avoiding huge equipment investment and labor costs in the actual production process. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0021] Figure 1 is a structural schematic diagram of a semiconductor packaging structure provided in Embodiment 1 of the present application from one viewing direction; Figure 2 is a structural schematic diagram of another viewing direction of the semiconductor package structure provided in the first embodiment of the present application; Figure 3 is an exploded view of the semiconductor packaging structure provided in Embodiment 1 of the present application; Figure 4 It is a structural schematic diagram of a circuit board provided in Embodiment 1 of the present application from one viewing direction; Figure 5 is a schematic structural diagram of another view of the circuit board provided in the first embodiment of the present application; Figure 6 It is a structural schematic diagram of a pre-packaged tube die provided in the first embodiment of the present application from one viewing direction; Figure 7 is a schematic structural diagram of another viewing direction of the pre-packaged tube die provided in the first embodiment of the present application; Figure 8 This is a structural schematic diagram of the pre-packaged tube die provided in the first embodiment of the present application from another perspective; Fig. 9 is an exploded view of the semiconductor packaging structure provided in the second embodiment of the present application; Fig.10 is an exploded view of the semiconductor packaging structure provided in Embodiment 3 of the present application; Fig.11 This is an exploded view of the semiconductor packaging structure provided in Example 4 of the present application. DETAILED DESCRIPTION

[0022] In order to make the purpose, technical solutions and advantages of this application clearer, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the drawings in the embodiments of this application. Obviously, the described embodiments are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0023] As described in the background art, conventional packaging of existing power devices mostly adopts alloy tube shells. However, in practical applications, the alloy tube shell packaging method has the problem of not being able to take into account both production cost and process complexity and production accuracy.

[0024] In response to the above problems, the present application creatively proposes a new semiconductor packaging structure and radio frequency system, which transforms the alloy tube shell structure with complex manufacturing process into several components including circuit board, pre-packaged tube core and heat dissipation tube shell that can be independently manufactured, and realizes a good heat dissipation channel between the pre-packaged tube core and the heat dissipation tube shell through the heat dissipation layer, and these components can be flexibly selected according to product requirements, avoiding huge equipment investment and labor costs in the actual production process.

[0025] The scheme of the embodiment of the present application is described in detail below with reference to the accompanying drawings.

[0026] Embodiment 1 Reference Figures 1 to 3 As shown, the semiconductor packaging structure provided by the embodiment of the present application generally includes a circuit board 100, a pre-packaged tube core 200 and a heat dissipation assembly 300. Among them, the pre-packaged tube core 200 is arranged between the circuit board 100 and the heat dissipation assembly 300, and the pre-packaged tube core 200 is electrically connected to the circuit board 100. The heat dissipation assembly 300 includes a heat dissipation layer 310 and a heat dissipation shell 320. In a specific implementation, the heat dissipation shell 320 is connected to the circuit board 100, and the heat dissipation layer 310 is arranged between the pre-packaged tube core 200 and the heat dissipation shell 320.

[0027] In some specific embodiments, the circuit board 100 may be a traditional PCB board or a ceramic wiring carrier board, which is not specifically limited here, and the user may make a selection according to actual product requirements.

[0028] Reference Figure 4 and Figure 5 As shown, as a preferred implementation, in the embodiment of the present application, the circuit board 100 at least includes a signal port 110, a surface mount pad 120 and a circuit structure 130. Among them, the signal port 110 includes at least one, and the signal port 110 can be made on any surface or any side of the circuit board 100. For example, the signal port 110 can be made on any surface (including but not limited to the upper surface or the lower surface) or any side of the circuit board 100, or one or more signal ports 110 can be set on the upper surface, the lower surface and the side of the circuit board 100, which is not specifically limited here. In some specific embodiments, the signal port 110 can be implemented using a gold-plated pad or a gold-plated through hole or a semi-through hole.

[0029] Further references Figure 4 As shown, the surface mount pad 120 is arranged on the surface of the circuit board 100, the circuit structure 130 is made inside or on the surface of the circuit board 100, the surface mount pad 120 is electrically connected to the circuit structure 130, and the circuit structure 130 is connected to the signal port 110. It can be understood that the pre-packaged die 200 can also be electrically connected to the circuit board 100 through the surface mount pad 120. It should be noted that in the embodiment of the present application, the specific number of the surface mount pad 120 is not limited, and it can be set according to actual product requirements without violating the inventive concept of the present application. For example, in some specific embodiments, the surface mount pad 120 includes at least two.

[0030] In some specific embodiments, the surface mount pad 120 is a gold-plated pad; In some other specific embodiments, the surface mount pad 120 is a tin-plated pad.

[0031] Reference Figures 6 to 8 As shown, the prepackaged die 200 includes a die pad 210 and a semiconductor die 220. The die pad 210 is disposed on the surface of the prepackaged die 200, and the semiconductor die 220 is disposed inside the prepackaged die 200, and the semiconductor die 220 is electrically connected to the die pad 210. The number of semiconductor die 220 and die pad 210 can be set according to actual product requirements, and is not specifically limited here.

[0032] It is understandable that the electrical connection between the pre-packaged die 200 and the circuit board 100 can be achieved through the electrical connection between the die pad 210 and the surface mount pad 120 .

[0033] The die pad 210 may be disposed on any surface of the prepackaged die 200. For example, in some specific embodiments, the die pad 210 is disposed on one surface of the semiconductor die 220; in other specific embodiments, the die pad 210 is disposed on one or more surfaces of the semiconductor die 220.

[0034] In some specific embodiments, the semiconductor die 220 is embedded in the pre-packaged die 200 by 3D packaging technology. In specific implementation, a first carrier board may be provided first, a component body may be constructed on the first carrier board, and multiple encapsulation-thinning punching-RDL wiring process processes may be performed on the component body to form multiple encapsulation layers and wiring layers alternately superimposed, and devices (including but not limited to the semiconductor die 220) may be mounted on the top wiring layer, and a complete encapsulation process may be performed to form a first package body, and the first carrier board may be removed, and a second carrier board may be mounted on the upper surface of the package body, and RDL wiring may be performed on the lower surface to form a second package body, and the second carrier board may be removed, and the second package body may be stacked and packaged with other devices to form a final package body. It can be understood that the pre-packaged die 200 may be packaged in this manner, which may reduce the production cost and processing difficulty, improve the thermal conductivity, and perform encapsulation-wiring multi-layer stacking packaging and the wiring layer on the lower surface, so that the chip and the device may be directly connected to the metal heat dissipation surface, effectively shortening the heat dissipation path, and the design of the wiring layer may reduce the parasitic parameters of the capacitor and the inductor, thereby improving the heat dissipation performance of the final package body.

[0035] In some specific embodiments, the heat dissipation layer 310 includes a material with a high thermal conductivity, which may be a conductive material or a non-conductive material. The material of the heat dissipation shell 320 may be diamond, ceramic, a combination of diamond and ceramic, or other applicable materials, etc. No specific limitation is made here. Without violating the inventive concept of the present application, the selection can be made according to actual product requirements.

[0036] In specific implementation, the heat dissipation layer 310 is located between the pre-packaged tube core 200 and the heat dissipation shell 320, and the heat dissipation layer 310 realizes a good heat dissipation channel between the pre-packaged tube core and the heat dissipation shell. In the embodiment of the present application, the specific connection method between the heat dissipation layer 310 and the pre-packaged tube core 200 and the heat dissipation shell 320 is not specifically limited, and it is only required that it can realize good heat dissipation between the pre-packaged tube core and the heat dissipation shell. For example, in some specific embodiments, the heat dissipation layer 310 and the pre-packaged tube core 200 and the heat dissipation shell 320 can be directly in contact, welded, or bonded by heat conductive materials, etc., which are not listed here one by one.

[0037] In some specific embodiments, the shape and size of the heat dissipation shell 320 can be set to match the circuit board 100 according to actual product requirements. For example, the heat dissipation shell 320 can be set to be an overall plate-shaped structure. Figure 3 As shown, as a preferred implementation, in the embodiment of the present application, a receiving groove 321 is opened on the heat dissipation tube shell 320, and the receiving groove 321 is located on the surface of the heat dissipation tube shell 320 facing the circuit board 100, and the receiving groove 321 is used to accommodate the pre-packaged tube core 200 and the heat dissipation layer 310.

[0038] It should be noted that in the embodiment of the present application, the shape and size of the receiving groove 321 are not specifically limited, and can be set according to actual product requirements without violating the inventive concept of the present application. For example, as an exemplary and non-restrictive description, the receiving groove 321 can be a square groove or a circular groove.

[0039] Further references Figure 3 As shown, as a preferred implementation, in the embodiment of the present application, the semiconductor packaging structure further includes a positioning assembly 500. The positioning assembly 500 includes a first positioning member 510 and a second positioning member 520, wherein the first positioning member 510 is disposed on the circuit board 100, and the second positioning member 520 is disposed on the heat dissipation shell 320. It can be understood that the position of the first positioning member 510 on the circuit board 100 corresponds to the position of the second positioning member 520 on the heat dissipation shell 320, for example, the centers of the first positioning member 510 and the second positioning member 520 coincide. When the circuit board 100 and the heat dissipation shell 320 are connected together, the first positioning member 510 and the second positioning member 520 are used to realize the alignment of the two, so as to improve the packaging accuracy.

[0040] In the embodiment of the present application, the shapes and sizes of the first positioning member 510 and the second positioning member 520 are not specifically limited, and can be set according to actual product requirements without violating the inventive concept of the present application. For example, as an exemplary but not restrictive description, the first positioning member 510 and the second positioning member 520 can be positioning holes or positioning grooves.

[0041] In some specific embodiments, the connection between the circuit board 100 and the heat dissipation shell 320 can be achieved by the connection between the first positioning member 510 and the second positioning member 520. Taking the first positioning member 510 and the second positioning member 520 as positioning holes, the first positioning member 510 is a through hole opened on the circuit board 100, and the second positioning member 520 is a through hole opened on the heat dissipation shell 320. The positioning assembly 500 also includes a connecting member 530, and the first positioning member 510 and the second positioning member 520 are connected to each other through the connecting member 530, wherein the connecting member 530 includes but is not limited to bolts, etc. It should be noted that the connection between the first positioning member 510 and the second positioning member 520, in addition to the above-mentioned method, can also be achieved by welding or conductive material bonding, etc., which is not specifically limited here.

[0042] Embodiment 2 The difference from the first embodiment is that, in the embodiment of the present application, further reference is made to Fig. 9 As a preferred implementation, in the embodiment of the present application, the semiconductor package structure further includes a buffer 400, and the buffer 400 is disposed between the circuit board 100 and the heat dissipation assembly 300. In some specific embodiments, the buffer 400 is an elastic material, so as to buffer the stress during fastening when the circuit board 100 and the heat dissipation assembly 300 are connected by screws or the like.

[0043] Further references Fig. 9 As shown, the buffer 400 is disposed around the heat dissipation layer 310 and the pre-packaged tube core 200. In some specific embodiments, the buffer 400 is an annular structure, and the heat dissipation layer 310 and the pre-packaged tube core 200 are located at the through hole of the annular structure.

[0044] In the embodiment of the present application, other parts of the semiconductor packaging structure are the same as those in the first embodiment and will not be described in detail here.

[0045] Embodiment 3 The difference from the second embodiment is that, in the embodiment of the present application, further reference is made to Fig.10As a preferred implementation, in the embodiment of the present application, the heat dissipation assembly 300' is composed of a heat dissipation layer 310' and a heat dissipation shell 320', wherein the heat dissipation shell 320' is not provided with a receiving groove. In specific implementation, the buffer 400 is arranged between the circuit board 100 and the heat dissipation assembly 300', and the buffer 400 is an annular structure, and the heat dissipation layer 310' and the pre-packaged tube core 200 are located at the through hole of the annular structure.

[0046] In the embodiment of the present application, other parts of the semiconductor packaging structure are the same as those in the second embodiment and will not be described in detail here.

[0047] Embodiment 4 The difference from the first embodiment is that, in the embodiment of the present application, further reference is made to Fig.11 As a preferred implementation, in the embodiment of the present application, the semiconductor packaging structure does not include a positioning component, and the circuit board 100 and the heat dissipation shell 320 are connected by welding. For example, a welding pattern 600 is provided between the circuit board 100 and the heat dissipation shell 320, and the connection between the circuit board 100 and the heat dissipation shell 320 is achieved by the welding pattern 600.

[0048] In the embodiment of the present application, other parts of the semiconductor packaging structure are the same as those in the first embodiment and will not be described in detail here.

[0049] Embodiment 5 Corresponding to the semiconductor packaging structure described in any one of the above embodiments 1 to 4, the present application further provides a radio frequency system, comprising at least the semiconductor packaging structure described in any one of the above embodiments 1 to 4. In this embodiment, the same or similar contents as those in the above embodiments 1 to 4 can be referred to the above introduction and will not be repeated later.

[0050] In some specific embodiments, the pre-packaged die 200 includes four, forming a power synthesis radio frequency system on the circuit board 100, such as Figure 3 shown.

[0051] In some other specific embodiments, the pre-packaged die 200 includes N pieces, which are used to implement an N-stage amplifier, for example, Fig. 9 As shown, the pre-packaged tube core 200 includes two, which are used to realize a two-stage amplifier. The two pre-packaged tube cores 200 and the circuit board 100 constitute a multi-stage RF amplifier system. It can be understood that since the multi-stage high-power module has higher requirements for heat dissipation performance, the heat dissipation shell in this embodiment can be made of diamond material.

[0052] In some specific embodiments, Fig.11As shown, the circuit board 100 is a ceramic circuit board, and the pre-packaged tube core 200 includes four. The four pre-packaged tube cores 200 are mounted on the ceramic circuit board, and the heat dissipation tube shell 320 is also a ceramic tube shell. The circuit board 100 and the heat dissipation tube shell 320 have overlapping sealing welding patterns 600, and the sealing welding patterns 600 are used to achieve a sealed connection between the circuit board 100 and the heat dissipation tube shell 320, and they are packaged into an airtight module.

[0053] In the description of the present application, it should be understood that the terms "vertical", "parallel", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present application, unless otherwise specified, "multiple" means two or more.

[0054] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0055] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A semiconductor packaging structure, characterized in that: Including circuit board, pre-packaged die and heat dissipation assembly; The prepackaged tube die is electrically connected to the circuit board, and the prepackaged tube die is arranged between the circuit board and the heat dissipation component; The heat dissipation component comprises a heat dissipation layer and a heat dissipation shell, the heat dissipation shell is connected to the circuit board, and the heat dissipation layer is arranged between the pre-packaged tube core and the heat dissipation shell.

2. The semiconductor package structure according to claim 1, wherein: A receiving groove is arranged on a side of the heat dissipation tube shell facing the circuit board, and the pre-packaged tube core and the heat dissipation layer are arranged in the receiving groove.

3. The semiconductor package structure according to claim 1, wherein: The material of the heat dissipation shell includes one or more of diamond and ceramic.

4. The semiconductor package structure according to claim 1, wherein: The semiconductor packaging structure further includes: The buffer is made of elastic material and is arranged between the circuit board and the heat dissipation component.

5. The semiconductor package structure according to claim 4, characterized in that: The buffer is arranged around the heat dissipation layer and the pre-packaged tube core.

6. The semiconductor package structure according to any one of claims 1 to 5, characterized in that: The circuit board at least includes a signal port, a surface mount pad and a circuit structure; The circuit structure is manufactured inside or on the surface of the circuit board and connected to the signal port; The surface mount pad is located on the surface of the circuit board and is electrically connected to the circuit structure. The pre-packaged tube core is electrically connected to the circuit board through the surface mount pad.

7. The semiconductor package structure according to claim 6, characterized in that: The signal port includes at least one, and the at least one signal port is located on any surface or any side of the circuit board; And / or, the surface mount pads include at least two.

8. The semiconductor package structure according to any one of claims 1 to 5, characterized in that: The prepackaged die comprises a die pad located on the surface of the prepackaged die and a semiconductor die embedded in the prepackaged die by 3D packaging technology; The die pad is electrically connected to the semiconductor die, and the prepackaged die is electrically connected to the circuit board through the die pad.

9. The semiconductor package structure according to claim 8, characterized in that: The die pad is located on any surface of the prepackaged die.

10. The semiconductor package structure according to any one of claims 1 to 5, characterized in that: The heat dissipation layer is in direct contact with the pre-packaged tube core and the heat dissipation tube shell or is welded or bonded with a heat conductive material.

11. The semiconductor package structure according to any one of claims 1 to 5, characterized in that: The semiconductor packaging structure further includes a positioning component, which includes a first positioning member arranged on the circuit board and a second positioning member arranged on the heat dissipation shell. The circuit board and the heat dissipation shell are aligned through the first positioning member and the second positioning member.

12. The semiconductor package structure according to claim 11, characterized in that: The first positioning member and / or the second positioning member comprises a positioning hole or a positioning groove.

13. The semiconductor package structure according to any one of claims 1 to 5, characterized in that: The circuit board and the heat dissipation shell are sealed and connected.

14. A radio frequency system, characterized in that: At least comprising the semiconductor package structure according to any one of claims 1 to 13.

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