Side-wettable package element with edge-constricted pads

Abstract

A side-surface-wettable packaging element with an edge-contracted bonding pad is characterized in that a composite substrate of the packaging element is covered with a plastic packaging layer, a top redistribution layer is formed on the plastic packaging layer, the top redistribution layer is covered with an insulating protection layer, and a part of the top redistribution layer is exposed to form at least one surface bonding pad; an anti-oxidation conducting layer is formed on the surface of each surface welding pad, and the side face of each surface welding pad is shrunk inwards relative to the side face of the plastic packaging layer; according to the invention, a side wetting structure is not formed by cutting the top rewiring layer, the service life of the cutter wheel is prolonged, the stability of the whole packaging structure is improved, and the contact area of soldering tin and each surface welding pad can be increased by the antioxidant conductive layer, so that the welding condition of the packaging element and another element can be conveniently judged by an automatic optical inspection instrument.

Description

Technical Field

[0001] The present invention relates to a side wettable semiconductor packaging technology, and more particularly to a side wettable packaging component with an edge shrink pad. Background Art

[0002] Existing packaging components mainly include two installation methods: through-hole insertion technology or surface mount technology (SMT). Usually, packaging components using through-hole insertion technology have pins, while packaging components using surface mount technology do not have pins. Common packaging components without pins include quad flat no-lead (QFN) and double flat no-lead (DFN). Such packaging components are connected and fixed to the circuit board through the solder pads formed on their bottom surfaces, and their sides often have side wettable structures. The side wettable structures can be used for solder attachment, so that the automatic optical inspection (AOI) instrument can judge whether such packaging components are well soldered to the circuit board based on the solder attachment status on the sides of such packaging components.

[0003] The bottom pad of such a package component is usually formed by a lead frame or a metal layer, and the side wetting structure is formed by processing the lead frame or the metal layer, such as forming a depression on the lead frame or cutting the metal layer multiple times to form a depression. For example, see Figure 7 A package component 80 has a bottom solder pad 81, and the bottom solder pad 81 is cut multiple times to form a recessed area 82, and the recessed area 82 can be used for solder to climb and form a side wetted structure; however, after the lead frame or metal layer is cut, there will be fine burrs on the surface, which will affect the subsequent solder adhesion, and the process of cutting the lead frame or metal layer may cause it to loosen and affect the stability of the overall package component structure. Therefore, it is necessary to improve the existing side wettable package components. Summary of the invention

[0004] To achieve the above-mentioned object, the present invention provides a side-wettable package component with an edge-shrink solder pad, comprising:

[0005] A composite substrate having a conductive layer on the outside and a containing space on the inside respectively;

[0006] A die is disposed in the accommodation space;

[0007] A plastic packaging layer covers the composite substrate and fills the accommodation space to encapsulate the die;

[0008] a top redistribution layer, disposed on the plastic packaging layer, and the top redistribution layer is electrically connected to the die and the conductive layer of the composite substrate; and

[0009] an insulating protection layer, covering the top redistribution layer and exposing a portion of the top redistribution layer to form at least one surface pad;

[0010] At least one side surface of at least one of the surface welding pads is indented relative to the side surface of the plastic packaging layer, and an anti-oxidation conductive layer is provided on the top surface and at least one of the side surfaces of each of the surface welding pads.

[0011] The present invention has a side wettable packaging component with an edge-retracted solder pad, and defines the exposed area of ​​the top rewiring layer through the insulating protection layer to form at least one surface solder pad, and the side of each surface solder pad is retracted relative to the side of the plastic packaging layer, and then the anti-oxidation conductive layer is formed on the surface of each surface solder pad for solder to climb onto; since the top rewiring layer is formed of metal, the present invention does not form a side wetting structure by cutting the top rewiring layer, which will reduce the wear of the cutting wheel and thus increase its service life, and since the top rewiring layer is not in contact with the cutting wheel, the influence of the stress generated by cutting on the top rewiring layer can be reduced, or the stress generated by cutting can be reduced to remain in the top rewiring layer, thereby reducing the top rewiring layer from falling off due to the stress during cutting or the residual stress, thereby increasing the stability of the overall packaging structure.

[0012] Furthermore, when the packaging component of the present invention is subsequently soldered onto another component, compared to the prior art, the top metal layer in the top rewiring layer of the present invention is not cut so that there will be no fine burrs on its surface, thereby improving the adhesion ability of the solder; in addition, the side surfaces of each surface solder pad of the present invention are retracted relative to the side surfaces of the plastic packaging layer, while the side surfaces of the bottom solder pads of the prior art are not retracted relative to the edge of the entire packaging component, so that the present invention can be provided with more solder compared to the prior art, thereby improving the quality of welding, and the anti-oxidation conductive layer can increase the contact area between the solder and each surface solder pad, thereby facilitating the automatic optical inspection instrument to determine the bonding condition between the packaging component and the other component, thereby stabilizing the automated production process. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The accompanying drawings described herein are only for explanation purposes and are not intended to limit the scope of the present invention in any way. In addition, the shapes and proportional dimensions of the various components in the figures are only schematic, used to help understand the present invention, and are not specifically limited to the shapes and proportional dimensions of the various components of the present invention. Those skilled in the art can select various possible shapes and proportional dimensions to implement the present invention according to the teachings of the present invention.

[0014] Figure 1 It is a side cross-sectional schematic diagram of the composite substrate in the packaging component of the present invention.

[0015] Figure 2A to Figure 2P FIG. 1 is a schematic diagram of the manufacturing process of the first embodiment of the manufacturing method of the present invention, wherein Figure 2N and Figure 2PPresented as a top-down plan.

[0016] Figure 3A to Figure 3N Schematic diagram of the manufacturing process of the second embodiment of the manufacturing method of the present invention.

[0017] Figure 4 FIG. 4 is a schematic top plan view of a third embodiment of a packaging component of the present invention.

[0018] Figure 5 FIG. 4 is a schematic top plan view of a fourth embodiment of a packaging component of the present invention.

[0019] Figure 6 FIG. 4 is a schematic top plan view of a fifth embodiment of a packaging component of the present invention.

[0020] Figure 7 It is a partial side cross-sectional schematic diagram of an existing packaging component. DETAILED DESCRIPTION

[0021] The details of the present invention can be more clearly understood with reference to the accompanying drawings and the description of the specific embodiments of the present invention. However, the specific embodiments of the present invention described herein are only used for the purpose of explaining the present invention and cannot be understood as limiting the present invention in any way. Under the guidance of the present invention, technicians can conceive of any possible variations based on the present invention, which should all be considered to belong to the scope of the present invention.

[0022] In order to understand the technical features and practical effects of the present invention in detail and to realize the present invention according to the present invention, the embodiments shown in the accompanying drawings are further described in detail as follows:

[0023] The present invention is a side wettable package component with an edge shrink pad and a method for making the same, wherein the package component may be a panel level package (PLP) component. Panel level package (PLP) refers to a process for packaging one or more dies (dies) made of an integrated circuit (Integrated circuit) using a substrate as a carrier. The following is a method for making a side wettable package component with an edge shrink pad and a structure thereof according to the present invention, with reference to the accompanying drawings.

[0024] See also Figure 1 , Figure 11 is a side cross-sectional view of a composite substrate 10. The composite substrate 10 is formed by disposing an upper metal sheet 11A and a lower metal sheet 11B on the top and bottom surfaces of a base layer 11, respectively. For example, the composite substrate 10 may be a copper clad laminate (CCL), that is, the upper metal sheet 11A and the lower metal sheet 11B are respectively copper foils, and the material of the base layer 11 may be resin.

[0025] Figures 2A to 2P FIG. 1 is a schematic diagram of a first embodiment of a process flow for manufacturing a side-wettable package component with an edge-shrinking solder pad according to the present invention. First, refer to FIG. Figure 2A , a receiving space 100 and at least one conductive through hole 110 (PTH) are formed on the composite substrate 10. Specifically, Figure 2A It is formed by multiple manufacturing procedures. First, a drilling process is performed on the composite substrate 10 to form at least one through-hole on the composite substrate 10. Then, metal deposition is performed on the composite substrate 10 so that an inner wall of at least one of the through-holes is provided with a deposited metal M to form at least one of the conductive through-holes 110. The deposited metal M can be, for example, copper.

[0026] In the process of depositing metal, the deposited metal M is also deposited on the outside of the composite substrate 10 to form a conductive layer. Specifically, the conductive layer includes a top conductive layer 12 and a bottom conductive layer 13. The top conductive layer 12 is located on the front side of the composite substrate 10 and is formed by the upper metal sheet 11A of the composite substrate 10 and the deposited metal M. The bottom conductive layer 13 is located on the back side of the composite substrate 10 and is formed by the lower metal sheet 11B of the composite substrate 10 and the deposited metal M. The top conductive layer 12 and the bottom conductive layer 13 can be electrically connected through at least one of the conductive through holes 110.

[0027] Next, a drilling process is performed on the composite substrate 10 having at least one conductive through hole 110 to form a receiving space 100 penetrating the composite substrate 10. Figure 2B , a film 20 is attached to the bottom conductive layer 13 to seal the bottom of the accommodating space 100. Figure 2C A die 30 is disposed in the accommodating space 100 and on the adhesive film 20 . Specifically, the bottom surface of the die 30 is fixed on the adhesive film 20 , and the top surface and side surfaces of the die 30 are exposed in the accommodating space 100 .

[0028] See also Figure 2D An insulating material 40 is disposed on the composite substrate 10 and laminated (Lamination) on the insulating material 40, so as to Figure 2E As shown, a plastic encapsulation layer 41 is formed, and the plastic encapsulation layer 41 covers the composite substrate 10 and fills the accommodation space 100 to cover the die 30. Specifically, during the lamination process, the insulating material 40 is heated and melted, and becomes semi-solid and flows to cover the surface of the composite substrate 10, and fills the accommodation space 100 and at least one of the conductive through holes 110 of the composite substrate 10. When the heated insulating material 40 is cooled and solidified, the plastic encapsulation layer 41 is formed, and the die 30 is covered by the plastic encapsulation layer 41 and fixedly disposed in the accommodation space 100 of the composite substrate 10; in addition, as Figure 2D and Figure 2E As shown, a metal foil 42 may be disposed on the plastic layer 41. The metal foil 42 may be formed by electroplating, sputtering, etc., but is not limited thereto. The metal foil 42 may be a hard mask for a subsequent drilling process to shield laser energy made by drilling.

[0029] Next, a top redistribution layer is formed on the plastic encapsulation layer 41. The top redistribution layer is electrically connected to the die 30 and the conductive layer of the composite substrate 10. In the first embodiment of the present invention, the top redistribution layer includes the following: Figure 2F to Figure 2L The production steps are shown.

[0030] See also Figure 2F At least one first opening 410 and at least one second opening 411 are formed in the plastic layer 41. For example, the at least one first opening 410 and the at least one second opening 411 can be formed by laser drilling, and at least one first opening 410 exposes the top surface of the die 30, and at least one second opening 411 exposes the conductive layer of the composite substrate 10. Figure 2G , the debris remaining in at least one of the first openings 410 and at least one of the second openings 411 can be removed by plasma etching, and the metal foil 42 can be removed by etching. Figure 2H As shown, the adhesive film 20 attached to the bottom conductive layer 13 is removed to expose the bottom conductive layer 13 and the bottom of the accommodating space 100 (the bottom surface of the die 30 ).

[0031] See also Fig.2I A top seed layer 50 (Seed Layer) is formed on the plastic layer 41, in at least one of the first openings 410 and in at least one of the second openings 411. The top seed layer 50 can be formed by electroplating, sputtering, etc., but is not limited thereto. While forming the top seed layer 50, a bottom seed layer 51 can also be formed on the bottom conductive layer 13 and the bottom surface of the accommodating space 100 (the bottom surface of the grain 30).

[0032] Next, a top metal layer 52 is formed on the top seed layer 50 by an additive process, that is, the top seed layer 50 and the top metal layer 52 are sequentially stacked on the plastic encapsulation layer 41. For how to form the top metal layer 52 by an additive process, please refer to Figure 2J , a patterned photoresist layer PP is disposed on the top seed layer 50, and the patterned photoresist layer PP covers the top surface edge of the top seed layer 50, and then Figure 2K As shown, the top metal layer 52 is formed by electroplating on the top seed layer 50 and in the area outside the patterned photoresist layer PP. The material of the top metal layer 52 may be copper, for example. Similarly, a bottom metal layer 53 may also be formed on the bottom seed layer 51 by an additive process. The formation method of the bottom metal layer 53 is the same as that of the top metal layer 52 mentioned above, and will not be repeated here.

[0033] See also Figure 2L , remove the patterned photoresist layer PP on the plastic encapsulation layer 41 and the top seed layer 50 under the patterned photoresist layer PP, and remove the patterned photoresist layer PP on the bottom surface of the composite substrate 10 and the bottom seed layer 51 under the patterned photoresist layer PP, wherein the top seed layer 50 and the top metal layer 52 together form the top rewiring layer, the bottom seed layer 51 and the bottom metal layer 53 together form a bottom rewiring layer, the side surfaces of the top rewiring layer and the side surfaces of the bottom rewiring layer are respectively inwardly contracted relative to the side surfaces of the composite substrate 10, and the top conductive layer 12 (conductive layer) of the composite substrate 10 can be electrically connected to the top surface of the grain 30 through the top rewiring layer, and the bottom conductive layer 13 (conductive layer) of the composite substrate 10 can be electrically connected to the bottom surface of the grain through the bottom rewiring layer.

[0034] See also Figure 2M , an insulating protection layer 60 is formed on the top rewiring layer, and at least one surface welding pad 54 is defined by the edge of the top metal layer 52 that is not covered by the insulating protection layer 60. Specifically, the top rewiring layer is covered with the insulating protection layer 60, and the peripheral portion of the top rewiring layer is exposed from the insulating protection layer 60 to form at least one surface welding pad 54, that is, at least one surface welding pad 54 is formed by the top metal layer 52 and the top seed layer 50, and the top surface 540 of at least one surface welding pad 54 is not covered by the insulating protection layer 60 and is exposed at the top of the packaging component, and the top surface 540 of at least one surface welding pad 54 is the top surface of the top metal layer 52.

[0035] The side wall of at least one of the surface pads 54 includes at least one side surface, and at least one of the side surfaces is formed by the side surfaces of the top metal layer 52 and the top seed layer 50. Figure 2N, at least one of the surface pads 54 can be, for example, a first surface pad 54A, the side of which is inwardly contracted relative to the side of the package element in one direction (the side of the plastic layer 41), that is, the first surface pad 54A is a surface pad 54 whose side wall includes a first side surface 541, such as Figure 2N As shown, the first side surface 541 exposes the side surface of the packaging element, and the first side surface 541 is retracted relative to the side surface of the plastic packaging layer 41 .

[0036] In the present embodiment, the top surface 540 and at least one of the side surfaces (the first side surface 541) of each of the first surface pads 54A are respectively a plane, and the angle between the top surface 540 and at least one of the side surfaces of each of the surface pads 54 may be less than, equal to or greater than 90 (degrees), depending on different etching methods (such as the composition of the etchant, the length of etching time, etc.), but is not limited thereto; in addition, there is a retracted distance d1 between the first side surface 541 and the side surface of the plastic encapsulation layer 41, and the top metal layer 52 has a thickness, and the retracted distance d1 is equal to the thickness. For example, the retracted distance d1 and the thickness may be between 50 microns and 200 microns, preferably between 100 microns and 150 microns, but is not limited thereto.

[0037] Please refer to Figure 2M The bottom metal layer 53 of the bottom redistribution layer may also be covered with the insulating protective layer 60, and because the side surface of the bottom redistribution layer is inwardly contracted relative to the side surface of the composite substrate 10, the insulating protective layer 60 will be filled between the side surface of the bottom redistribution layer and the side surface of the composite substrate 10. The insulating protective layer 60 has the functions of waterproofing and anti-oxidation. The insulating protective layer 60 is distributed between the lines of the top redistribution layer and between the lines of the bottom redistribution layer, and can be used as a solder mask to prevent short circuits between adjacent lines.

[0038] See also Fig.2O and Figure 2P , an anti-oxidation conductive layer 70 is formed on the top surface 540 and at least one of the side surfaces of each of the surface solder pads 54. The anti-oxidation conductive layer 70 is a wettable side flank, and its material can be tin, gold and other metals, but is not limited to this. When the package component is soldered to a circuit board (not shown), the anti-oxidation conductive layer 70 can be adsorbed by the solder, so that each of the surface solder pads 54 can be set on the circuit board through the solder and electrically connected to the circuit board. The structure of the anti-oxidation conductive layer 70 increases the contact area between the solder and each of the surface solder pads 54, so that an automatic optical inspection (AOI) instrument can capture the bonding condition between the package component and the circuit board to determine whether the package component is firmly soldered to the circuit board.

[0039] According to the aforementioned Figure 2A to Figure 2P After the process is completed, the side-wettable package component with edge shrink pads of the present invention is formed (see Fig.2O and Figure 2P ), the packaging component of the present invention also has a second embodiment, and the second embodiment of the packaging component is also as follows Figure 1 The composite substrate 10 shown is manufactured and formed, see FIG. 3A to FIG. 3N , is a schematic diagram of a second embodiment of a process for manufacturing a side-wettable package component with an edge-shrinking solder pad according to the present invention, wherein: Figure 3A to Figure 3I The process and Figure 2A to Figure 2I The process in is exactly the same and will not be repeated here. The difference between the second embodiment of the manufacturing process of the side wettable package component with edge shrinkage pad of the present invention and the first embodiment is that, Figure 3J to Figure 3K The process step is to form the top metal layer 52 by a subtractive method.

[0040] See also Figure 3J After the top seed layer 50 is formed on the plastic encapsulation layer 41, in at least one of the first openings 410 and in at least one of the second openings 411, the top metal layer 52 is formed on the top seed layer 50, for example, by a masking method. Similarly, the bottom metal layer 53 is formed on the bottom seed layer 51.

[0041] See also Figure 3K , the patterned photoresist layer PP is respectively arranged on the top metal layer 52 and the bottom metal layer 53, and the patterned photoresist layer PP does not cover the top surface edge of the top metal layer 52, and then the top seed layer 50, the top metal layer 52, the bottom seed layer 51 and the bottom metal layer 53 not covered by the patterned photoresist layer PP are etched, so that the side surfaces of the top seed layer 50 and the top metal layer 52 are retracted relative to the side surfaces of the composite substrate 10, and the side surfaces of the bottom seed layer 51 and the bottom metal layer 53 are also retracted relative to the side surfaces of the composite substrate 10, wherein the side surfaces of the top seed layer 50 and the top metal layer 52 jointly form at least one side surface of the surface pad 54, and since at least one side surface is formed by etching, at least one side surface (at least one of the first side surface 541, the second side surface 542 and the third side surface 543) is an arc surface, and similarly, the side surfaces of the bottom seed layer 51 and the bottom metal layer 53 are also an arc surface.

[0042] See also Figure 3L , remove the patterned photoresist layer PP on the top metal layer 52 and the bottom metal layer 53 to expose the top surface of the top metal layer 52 and the bottom surface of the bottom metal layer 53. Figure 3M, the insulating protective layer 60 is covered on the top metal layer 52 (the top rewiring layer) and a portion of the top rewiring layer is exposed to form at least one surface pad 54, and the top surface 540 and at least one side surface of each surface pad 54 are respectively a plane and an arc surface, wherein at least one surface pad 54 is like the first embodiment of the packaging component of the present invention, and at least one side surface of at least one surface pad 54 is retracted relative to the side surface of at least one direction of the packaging component (the side surface of the plastic layer 41); the bottom metal layer 53 of the bottom rewiring layer can also be covered with the insulating protective layer 60, and the insulating protective layer 60 fills the space between the side surface of the bottom rewiring layer and the side surface of the composite substrate 10.

[0043] See also Figure 3N , the anti-oxidation conductive layer 70 is formed on the top surface 540 and at least one of the side surfaces of each of the surface solder pads 54, thereby completing the formation of the second embodiment of the side wettable packaging component with edge-shrinking solder pads of the present invention. Since at least one of the side surfaces of each of the surface solder pads in the first embodiment and the second embodiment of the packaging component is a plane and an arc surface, respectively, the structure of the anti-oxidation conductive layer 70 of the first embodiment of the packaging component will be different from the structure of the anti-oxidation conductive layer 70 in the second embodiment of the packaging component.

[0044] Regarding the number of sides included in at least one of the surface pads 54, since at least one of the surface pads 54 in the present invention is defined by the insulating protection layer 60, at least one of the surface pads 54 with different numbers of exposed sides can be formed according to the coverage of the top rewiring layer by the insulating protection layer 60. In addition to the first surface pad 54A (exposing one side) mentioned above, the following lists three forms of at least one of the surface pads 54 that can be included in the packaging component of the present invention. Please refer to Figures 4 to 6 The side surfaces of the three surface welding pads 54 are retracted relative to the side surfaces of at least one direction of the packaging component (the side surfaces of the plastic packaging layer 41 ).

[0045] 1. A second surface pad 54B: Figure 4 As shown, the second surface solder pad 54B is a surface solder pad 54 whose side wall includes a first side surface 541 and a second side surface 542, and the first side surface 541 is connected to the second side surface 542. In the X-axis direction of the packaging component, the first side surface 541 is retracted relative to the side surface of the plastic packaging layer 41, and in the Y-axis direction of the packaging component, the second side surface 542 is also retracted relative to the side surface of the plastic packaging layer 41. As for whether the first side surface 541 is retracted along the positive direction of the X-axis or along the negative direction of the X-axis, and whether the second side surface 542 is retracted along the positive direction of the Y-axis or along the negative direction of the Y-axis, it is not limited to this.

[0046] Among them, the X-axis and the Y-axis are used to illustrate that the first side surface 541 and the second side surface 542 are respectively retracted along two different directions and relative to the side surface of the plastic packaging layer 41, and it is not limited that the first side surface 541 can only be retracted along the X-axis direction of the packaging element, and the second side surface 542 can only be retracted along the Y-axis direction. That is, the first side surface 541 can be retracted relative to the side surface of the plastic packaging layer 41 along the Y-axis direction of the packaging element, and the second side surface 542 can be retracted relative to the side surface of the plastic packaging layer 41 along the X-axis direction of the packaging element.

[0047] 2. A third surface pad 54C: Figure 5 As shown, the third surface pad 54C is a surface pad 54 whose side wall includes a first side surface 541, a second side surface 542 and a third side surface 543. The first side surface 541 of the third surface pad 54C is retracted relative to the side surface of the plastic encapsulation layer 41 in the X-axis direction, and the second side surface 542 and the third side surface 543 are located on opposite sides of the third surface pad 54C. In the Y-axis direction, the second side surface 542 and the third side surface 543 are respectively retracted relative to the edge of the insulating protection layer 60; for example, the third surface pad 5 The first side surface 541 of 4C is retracted along the positive direction of the X-axis (relative to the side surface of the plastic packaging layer 41), and the second side surface 542 and the third side surface 543 are retracted along the negative direction of the Y-axis and the positive direction of the Y-axis respectively (relative to the edge of the insulating protective layer 60), which means that there is a spacing distance d2 between the second side surface 542 and the third side surface 543 and the edge of the insulating protective layer 60 respectively. For example, the spacing distance d2 can be between 50 microns and 200 microns, preferably between 100 microns and 150 microns, but it is not limited to this.

[0048] It should be particularly noted that the first side surface 541 of the third surface welding pad 54C is retracted along one axis and relative to the edge of the plastic encapsulation layer 41, and the second side surface 542 and the third side surface 543 are retracted along another axis different from the aforementioned one and relative to the edge of the insulating protection layer 60, and it is not limited that the first side surface 541 can only be retracted along the X-axis direction of the package component, and the second side surface 542 and the third side surface 543 can only be retracted along the Y-axis direction of the package component, and the first side surface 541 is relative to the plastic encapsulation layer 4 1 is retracted, and the second side surface 542 and the third side surface 543 are retracted relative to the edge of the insulating protection layer 60, that is, the first side surface 541 can also be retracted relative to the side surface of the plastic layer 41 along the Y-axis direction of the packaging element, and the second side surface 542 and the third side surface 543 can be retracted relative to the edge of the insulating protection layer 60 along the X-axis direction of the packaging element, and the second side surface 542 and the third side surface 543 are respectively retracted along two opposite directions of the X-axis and relative to the edge of the insulating protection layer 60.

[0049] 3. A fourth surface pad 54D: Figure 6 As shown, the fourth surface pad 54D is also a surface pad 54 whose side wall includes a first side surface 541, a second side surface 542 and a third side surface 543. The first side surface 541 of the fourth surface pad 54D is retracted relative to the side surface of the plastic encapsulation layer 41 in the Y-axis direction, and the second side surface 542 and the third side surface 543 are located on opposite sides of the fourth surface pad 54D. In the X-axis direction, one of the second side surface 542 and the third side surface 543 is retracted relative to the edge of the insulating protection layer 60, and the other of the second side surface 542 and the third side surface 543 is retracted relative to the edge of the insulating protection layer 60. It is retracted relative to the edge of the plastic layer 41; for example, the first side 541 of the fourth surface welding pad 54D is retracted along the negative direction of the Y axis (relative to the side of the plastic layer 41), the second side 542 is retracted along the positive direction of the X axis (relative to the side of the plastic layer 41), and the third side 543 is retracted along the negative direction of the X axis (relative to the edge of the insulating protective layer 60), and there is a retracted distance d1 between the first side 541 and the second side 542 and the plastic layer 41, and there is a spacing distance d2 between the third side 543 and the edge of the insulating protective layer 60.

[0050] It should be particularly noted that the first side surface 541 of the fourth surface welding pad 54D is retracted along an axis relative to the edge of the plastic packaging layer 41, and one of the second side surface 542 and the third side surface 543 is retracted along another axis different from the aforementioned and relative to the edge of the plastic packaging layer 41, and the other of the second side surface 542 and the third side surface 543 is retracted along the other axis and relative to the edge of the insulating protective layer 60. Therefore, the first side surface 541 can also be retracted along the X-axis direction of the packaging component, and the second side surface 542 and the third side surface 543 can only be retracted along the Y-axis direction of the packaging component.

[0051] The present invention has a side surface of a solder pad with an inwardly shrunk edge that can wet the package component. The exposed area of ​​the top rewiring layer is defined by the insulating protective layer 60 to form at least one surface solder pad 54, and the side surface of each surface solder pad 54 is inwardly shrunk relative to the side surface of at least one direction of the package component (the side surface of the plastic packaging layer 41), and then the anti-oxidation conductive layer 70 is formed on the surface of each surface solder pad 54 (the top surface 540 and at least one of the side surfaces) for solder to climb onto. Since the top rewiring layer is formed by metal (the top metal layer and the bottom metal layer), the present invention does not form a side wetting structure by cutting the top rewiring layer, which will reduce the wear of the cutting wheel and increase the service life of the cutting wheel. Since the top rewiring layer is not in contact with the cutting wheel, the influence of the stress generated by cutting on the top rewiring layer can be reduced, or the stress generated by cutting can be reduced to remain in the top rewiring layer, thereby reducing the top rewiring layer from falling off due to the stress during cutting or the residual stress, thereby increasing the stability of the overall package structure.

[0052] Furthermore, when the packaged component of the present invention is subsequently soldered to another component, compared to the prior art, the top metal layer 52 of the present invention is not cut so that there will be no fine burrs on its surface, thereby improving the adhesion of the solder; in addition, at least one side surface of each surface solder pad 54 of the present invention is retracted relative to the side surface of the plastic packaging layer 41. Figure 7 The side surface 810 of the bottom pad 81 of the prior art is not retracted relative to the edge 800 of the entire package component 80. In other words, Figure 2P As shown, each of the surface pads 54 of the present invention shrinks inwardly so that the plastic sealing layer 41 is exposed. Figure 7 The packaging component 80 is not exposed due to the obstruction of the bottom solder pad 81, so the present invention has more space for solder settings compared to the prior art, thereby improving the quality of welding. As mentioned above, the anti-oxidation conductive layer 70 can increase the contact area between the solder and each of the surface solder pads 54, thereby improving the instrument's interpretation ability when the packaging component is subjected to automatic optical inspection, thereby stabilizing the automated production process.

[0053] The detailed explanation of the above-mentioned embodiments is only intended to explain the present invention so as to facilitate a better understanding of the present invention. However, these descriptions cannot be interpreted as limitations on the present invention for any reason. In particular, the various features described in different embodiments may also be arbitrarily combined with each other to form other embodiments. Unless there is a clear description to the contrary, these features should be understood to be applicable to any embodiment and are not limited to the described embodiments.

Claims

1. A side wettable package component with an edge shrink pad, characterized in that: The side wettable package component with edge shrink pads comprises: A composite substrate having a conductive layer on the outside and a containing space on the inside respectively; A die is disposed in the accommodation space; A plastic packaging layer covers the composite substrate and fills the accommodation space to encapsulate the die; a top redistribution layer, disposed on the plastic packaging layer, and the top redistribution layer is electrically connected to the die and the conductive layer of the composite substrate; and an insulating protection layer, covering the top redistribution layer and exposing a portion of the top redistribution layer to form at least one surface pad; At least one side surface of at least one of the surface welding pads is indented relative to the side surface of the plastic packaging layer, and an anti-oxidation conductive layer is provided on the top surface and at least one of the side surfaces of each of the surface welding pads.

2. The side wettable package component with edge shrink pad as claimed in claim 1, characterized in that: At least one of the surface pads includes a first side surface and a second side surface. The first side surface and the second side surface are respectively along two different directions and are indented relative to the side surface of the plastic packaging layer.

3. The side wettable package component with edge shrink pad as claimed in claim 1, characterized in that: At least one of the surface pads includes a first side, a second side and a third side. The first side is indented along an axis relative to the side of the plastic layer, and the second side and the third side are respectively indented along two opposite directions of another axis relative to the edge of the insulating protection layer.

4. The side wettable package component with edge shrink pad as claimed in claim 1, characterized in that: At least one of the surface welding pads includes a first side, a second side and a third side, the first side is retracted along an axis and relative to the side of the plastic encapsulation layer, one of the second side and the third side is retracted along another axis and relative to the edge of the insulating protection layer, and the other of the second side and the third side is retracted along the other axis and relative to the side of the plastic encapsulation layer.

5. The side wettable package component with edge shrink pad as claimed in claim 1, characterized in that: The top surface and at least one of the side surfaces of each of the surface pads are respectively a plane.

6. The side wettable package component with edge shrink pad as claimed in claim 1, characterized in that: The top surface and at least one of the side surfaces of each of the surface pads are respectively a plane and an arc surface.

7. The side wettable package component with edge shrink pad as claimed in claim 1, characterized in that: There is a shrinkage distance between at least one side surface of each surface welding pad and the side surface of the plastic packaging layer, and the shrinkage distance is between 50 micrometers and 200 micrometers.

8. The side wettable package component with edge shrink pad as claimed in claim 7, characterized in that: The top redistribution layer includes a top seed layer and a top metal layer. The top seed layer and the top metal layer are sequentially stacked on the plastic packaging layer. The top metal layer has a thickness that is equal to the shrinking distance.

9. The side wettable package component with edge shrink pad as claimed in claim 1, characterized in that: The conductive layer of the composite substrate includes a top conductive layer and a bottom conductive layer, the top conductive layer and the bottom conductive layer are respectively located on the front and back sides of the composite substrate, and the top conductive layer and the bottom conductive layer are electrically connected through at least one conductive through hole in the composite substrate.

10. The side wettable package component with edge shrink pads as claimed in claim 9, characterized in that: A bottom redistribution layer is formed on the bottom conductive layer of the composite substrate and the bottom surface of the crystal grain, and the side surface of the bottom redistribution layer is inwardly contracted relative to the side surface of the composite substrate.

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