High-performance power supply module

Abstract

The high-performance power module comprises at least one voltage regulation unit, each voltage regulation unit comprises an SPS combination, a four-phase reverse coupling inductor, an output capacitor assembly, a first substrate and a second substrate, and the SPS combination and the four-phase reverse coupling inductor are arranged on the two opposite faces of the first substrate respectively. The SPS combination comprises four intelligent power stages, the four intelligent power stages are arranged in a four-blade windmill shape and are matched with a four-phase opposite coupling inductor structure, so that parasitic parameters of a circuit and the area and dynamic response speed of a voltage regulation unit are reduced; the output capacitor assembly is arranged on one surface of the second substrate; the bottom surface of the four-phase opposite coupling inductor is provided with a groove, and the groove is used for accommodating the output capacitor assembly, thereby further reducing the area of the voltage regulation unit.

Description

Technical Field

[0001] The invention belongs to the technical field of high-frequency power supply, and in particular relates to a high-performance power supply module. Background Art

[0002] In recent years, with the development of technologies in data centers, artificial intelligence, supercomputers, etc., more and more powerful ASICs have been applied, such as CPUs, GPUs, machine learning accelerator chips, network switch chips, server chips, etc. They consume a lot of current, such as thousands of amperes, and their power supply current needs to jump quickly. Traditionally, voltage regulator modules (VRM, Voltage Regulator Modules) composed of step-down circuits (Buck) are used to supply such loads.

[0003] With the advancement of semiconductor technology, the voltage of these loads is getting lower and lower, while the current of the load is continuously increasing. In the power module with low voltage and high current output, how to improve the conversion efficiency, how to reduce the parasitic parameters between the ASIC load, how to improve the dynamic response capability, and how to reduce the module size have become a key to meet the needs of ASIC power supply applications; it is also the core issue of power module design. Placing the power module on the back of the system board, facing the ASIC, and supplying power to the ASIC located on the front of the system board, that is, vertical power supply, can reduce the parasitic parameters between the power module and the ASIC load.

[0004] Therefore, how to reduce the area and volume of the power module used for vertical power supply and improve the dynamic response performance of the power module is an urgent problem to be solved. Summary of the invention

[0005] In view of this, one of the purposes of the present invention is to provide a high-performance power supply module, comprising at least one voltage regulating unit; the voltage regulating unit comprises an SPS combination, a quad-opposite coupled inductor, an output capacitor component, a first substrate and a second substrate; the first substrate comprises a first surface and a second surface opposite to each other, and the second substrate comprises a first surface and a second surface opposite to each other;

[0006] The SPS assembly is arranged on the first surface of the first substrate, the four oppositely coupled inductors are arranged between the second surface of the first substrate and the first surface of the second substrate; the output capacitor assembly is arranged on the second surface of the second substrate;

[0007] The SPS combination includes four smart power stages, the four smart power stages are arranged in a four-blade windmill shape, each of the smart power stages includes a jump pin, and each of the jump pins is arranged at the top of a corresponding windmill blade;

[0008] The quad-inversely coupled inductor comprises a magnetic core and an inductor frame, a groove space is provided between the surface of the magnetic core and the surface of the frame, and at least a part of the groove space is used to accommodate the output capacitor component.

[0009] Preferably, the smart power stage further comprises an input positive pin, a ground pin and a signal pin, and the jump pin, the input positive pin, the ground pin and the signal pin are arranged in sequence along the same direction.

[0010] Preferably, it also includes an input capacitor, which is arranged at both sides of the smart power stage and is arranged adjacent to the input positive pin and the ground pin.

[0011] Preferably, the inductor frame comprises four inductor windings, a grounding electrical connector, an input positive electrical connector, an output positive electrical connector and a jump electrical connector; one end of each of the inductor windings is respectively connected to the corresponding output positive electrical connector, and the other end of each of the inductor windings is respectively connected to the corresponding jump electrical connector;

[0012] Each of the output positive electrical connections is disposed adjacent to a jump electrical connection corresponding to another inductor winding.

[0013] Preferably, the inductor frame is a quadrilateral, and the inductor frame further comprises a ground pad, an input positive pad, an output positive pad and a jump pad; the four sides of the top surface of the inductor frame are sequentially provided with a ground pad, an input positive pad, an output positive pad, a jump pad, an input positive pad and a ground pad;

[0014] The four sides of the bottom surface of the inductor frame are sequentially provided with a ground pad, an input positive pad, an output positive pad, an input positive pad, and a ground pad.

[0015] Preferably, the smart power stage also includes an input positive pin, a ground pin and a signal pin, and the jump pin, input positive pin, ground pin and signal pin are arranged in sequence along the same direction; the projection of the jump pad on the first surface of the first substrate at least partially overlaps with the projection of the jump pin on the first surface of the first substrate.

[0016] Preferably, the high-performance power module further comprises a ball grid array, which is arranged on the second surface of the second substrate, and the ball grid array is electrically connected to the ground electrical connector, the input positive electrical connector, and the output positive electrical connector through the second substrate.

[0017] Preferably, the inductor windings corresponding to the respective voltage regulating units are all integrated into a third substrate; and the magnetic cores corresponding to the respective voltage regulating units are all buckled onto the third substrate.

[0018] Preferably, each of the SPS combinations is provided with four pulse width modulation signals, each of which is used to control one intelligent power level; the four pulse width modulation signals are sequentially staggered by 90 degrees, and the duty cycles of the four pulse width modulation signals are all within the range of 15%-35%.

[0019] Preferably, the voltage regulating unit is six voltage regulating units, namely the first voltage regulating unit to the sixth voltage regulating unit, the input ends of the six voltage regulating units are electrically connected in parallel, the output ends of the first voltage regulating unit to the fourth voltage regulating unit are electrically connected in parallel to form a first power supply path, the fifth voltage regulating unit constitutes a second power supply path, and the sixth voltage regulating unit constitutes a third power supply path.

[0020] Preferably, the high-performance power supply module includes a first side, a second side, a third side and a fourth side, the first side and the third side are opposite, and the second side and the fourth side are opposite; the first voltage regulating unit and the second voltage regulating unit are arranged adjacent to the first side; the third voltage regulating unit and the fourth regulating unit are arranged adjacent to the third side; the fifth voltage regulating unit is arranged between the first voltage regulating unit and the third voltage regulating unit, and adjacent to the second side; the sixth voltage regulating unit is arranged between the second voltage regulating unit and the fourth voltage regulating unit, and adjacent to the fourth side.

[0021] Preferably, the high-performance power module further includes a controller, and the controller is disposed in a groove space corresponding to the voltage regulating unit corresponding to the first power supply path.

[0022] Preferably, the high-performance power supply module also includes two single-phase step-down units; the single-phase step-down units each constitute a power supply path; the single-phase step-down units each include an intelligent power stage; the single-phase step-down units each include a single-phase inductor, or the single-phase step-down units share a two-phase inductor.

[0023] Preferably, the voltage regulating unit is five voltage regulating units, namely, the first voltage regulating unit to the fifth voltage regulating unit, the input ends of the five voltage regulating units are electrically connected in parallel, the output ends of the first voltage regulating unit to the fourth voltage regulating unit are electrically connected in parallel to form a first power supply path, and the fifth voltage regulating unit forms a second power supply path;

[0024] The high-performance power module also includes a two-phase parallel buck unit; the two-phase parallel buck unit constitutes a third power supply path, and the two-phase parallel buck unit includes two intelligent power stages and a two-phase reverse coupled inductor; the two intelligent power stages are provided with two pulse width modulation signals, and the two pulse width modulation signals are 180 degrees out of phase; the input ends of the two reverse coupled inductors are electrically connected to the two intelligent power stages respectively;

[0025] The high-performance power supply module also includes two single-phase buck units; the single-phase buck units each constitute a power supply path; the single-phase buck units each include an intelligent power stage; the single-phase buck units each include a single-phase inductor, or the single-phase buck units share a two-phase inductor.

[0026] Preferably, the fifth voltage regulating unit is arranged in the middle of the high-performance power supply module, and the first to fourth voltage regulating units are arranged around the fifth voltage regulating unit.

[0027] Preferably, the high-performance power module further includes two controllers, which are respectively arranged on two sides of the first substrate, and the projection positions of the two controllers on the surface of the first substrate coincide or partially overlap.

[0028] Preferably, the two controllers, the fifth voltage regulating unit and the two-phase parallel buck unit are arranged along the center line of the high-performance power module, and the first to fourth voltage regulating units and the two single-phase buck units are symmetrically arranged on both sides of the center line.

[0029] Preferably, the inductors corresponding to the voltage regulating unit, the two-phase parallel buck unit and the single-phase buck unit respectively include inductor windings and magnetic cores, the windings are all integrated in a third substrate, and the magnetic cores are all buckled on the third substrate.

[0030] Preferably, the high-performance power module further includes a signal electrical connector, which is disposed between the first substrate and the second substrate and is electrically connected to the first substrate and the second substrate, and is used to transmit signals.

[0031] The beneficial effects of the present invention are:

[0032] (1) The present invention proposes a high-performance power module structure, which realizes a small area, small volume and high dynamic response performance of the power module through the layout of four smart power stages SPS, combined with the structure of four reverse coupled inductors and the setting of output capacitors. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0034] Figure 1A A circuit block diagram of a voltage regulating unit formed by connecting multiple phase buck circuits in parallel;

[0035] Figure 1B A circuit block diagram of a power module composed of a plurality of voltage regulating units;

[0036] Figure 2A It is a schematic diagram of the TOP three-dimensional structure of the high-performance power module 1a;

[0037] Figure 2B It is a schematic diagram of the 3D structure of the BOTTOM surface of the high-performance power module 1a;

[0038] Figure 2C The pinout of the smart power stage SPS and the settings of related external capacitors;

[0039] Figure 2D The internal layout of the SPS combination;

[0040] Figure 3A It is a schematic diagram of the TOP surface three-dimensional structure decomposition of the high-performance power module 1a;

[0041] Figure 3B It is a schematic diagram of the 3D structure of the BOTTOM surface of the high-performance power module 1a;

[0042] Figure 4A Layout of top pads for quad-phase reverse coupled inductors;

[0043] Figure 4B It is a three-dimensional decomposition diagram of four-phase reverse coupled inductors;

[0044] Figure 4C This is the internal structure diagram of the inductor frame;

[0045] Figure 5A A circuit block diagram of a power module composed of another plurality of voltage regulating units;

[0046] Figure 5B It is a schematic diagram of the TOP surface three-dimensional structure of the high-performance power module 1b;

[0047] Figure 5C It is a schematic diagram of the TOP surface three-dimensional structure decomposition of the high-performance power module 1b;

[0048] Figure 5D It is a schematic diagram of the TOP surface three-dimensional structure of the magnetic component 200;

[0049] Figure 5E It is a schematic diagram of the three-dimensional structure of the BOTTOM surface of the magnetic component 200;

[0050] Fig. 5F It is a schematic diagram of the exploded three-dimensional structure of the TOP surface of the magnetic component 200;

[0051] Figure 5G It is a schematic diagram of the layout of the second surface of the first substrate.

[0052] Fig. 6A It is a schematic diagram of the TOP three-dimensional structure of another high-performance power module 1c;

[0053] Figure 6B This is a bottom view of the first substrate.

[0054] Figure 6C A top view of the PCB of the third substrate;

[0055] in:

[0056] 1a / 1b / 1c high-performance power module; 10 first substrate; 11 / 12 / 13 / 14 inductor winding; 20 second substrate; 30 third substrate; 41 first side; 42 second side; 43 third side; 44 fourth side; 101 / 201 / 341 first side; 102 / 202 / 342 second side; 111 / 112 / 113 / 114 / 115 / 116 SPS; 121 / 122 / 221 / 222 connection hole; 131 first side; 132 second side; 133 third side; 134 fourth side; 141 / 143 pad; 151 / 152 / 153 / 154 / 155 input voltage Capacitor assembly; 211 / 212 controller; 232 / 234 pad; 241 / 243 / 245 / 246 output capacitor assembly; 301 / 302 / 303 / 304 / 305 / 306 four-phase reverse coupled inductor; 307 two-phase inductor; 308 / 309 single-phase inductor; 310 inductor frame; 311 upper magnetic substrate; 312 lower magnetic substrate; 313 middle column; 314 / 315 / 316 / 317 side column; 318 groove; 323 / 324 / 325 / 326 / 327 hole; 331 / 333 top pad; 332 bottom pad; 335 side electrical connector; AGND signal ground pin; Buck 1 / Buck 2 single-phase buck unit; Buck 3 two-phase buck unit; Cin input capacitor; Connector 1 / Connector 2 / Connector 3 connectors; G ground pin; GND ground terminal; GND1 internal ground terminal; GNDa / GNDc ground pad; GNDb ground electrical connector; L1 / L2 / L3 / L4 inductors; Lk1 / Lk2 series filter inductors; In input pin; Isensex current detection pin; PWMx pulse width modulation pin; Rail1 first power supply path; Rail2 second power supply path; Rail3 third power supply path; Rail4 fourth power supply path; Rail5 fifth power supply path; Signal signal pin; SPS1 / SPS2 / SPS3 / S PS4 smart power stage; SW / SW1 / SW2 / SW3 / SW4 jump pin; SWx jump terminal; SWxa / SWxc jump pad; SWxb jump electrical connector; TMON temperature detection pin; Vcc auxiliary power supply pin; Vin+ input positive terminal; Vin+1 internal input positive terminal; Vin+1a / Vin+1c input positive pad; Vin+1b input positive electrical connector; Vo+1 / Vo+2 / Vo+3 / Vo+4 / Vo+5 output positive terminal; Vo+a / Vo+c output positive pad; Vo+b output positive electrical connector; VRCell 1 / VRCell 2 / VRCell 3 / VRCell 4 voltage regulation unit; x is a natural number from 1 to 4; DETAILED DESCRIPTION

[0057] One of the cores of the present invention is to provide a high-performance power supply module, which includes a plurality of voltage regulating units formed by multi-phase step-down circuits connected in parallel; and the high-performance power supply module is used in vertical power supply occasions.

[0058] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0059] Embodiment 1

[0060] like Figure 1A and Figure 1B As shown, Figure 1A The circuit block diagram of the voltage regulating unit formed by connecting multiple phase buck circuits in parallel is disclosed; Figure 1B The circuit block diagram of a power module composed of multiple voltage regulation units. Figure 1B The high-performance power module shown includes five power supply paths, namely a first power supply path Rail1 to a fifth power supply path Rail5 (hereinafter, the power supply paths are referred to as Rail for short). Figure 1B The high-performance power module shown also includes an input positive terminal Vin+, an output positive terminal Vo+ and a ground terminal GND. The input end of the first power supply path Rail1 is electrically connected to the input positive terminal Vin+ and the ground terminal GND, and the output ends are the output positive terminal Vo+1 and the ground terminal GND respectively; the first power supply path Rail1 includes four voltage regulator cells VRCell 1 to VRCell 4 (VoltageRegulatorCell, hereinafter referred to as VRCell) connected in parallel. The input end of the second power supply path Rail2 is electrically connected to the input positive terminal Vin+ and the ground terminal GND, and the output ends are the output positive terminal Vo+2 and the ground terminal GND respectively; the second power supply path Rail2 includes VRcell 5. The input end of the third power supply path Rail3 is electrically connected to the input positive terminal Vin+ and the ground terminal GND, and the output ends are the output positive terminal Vo+3 and the ground terminal GND; Rail3 includes VRcell 6; the input end of the fourth power supply path Rail4 is electrically connected to the input positive terminal Vin+ and the ground terminal GND, and the output ends are the output positive terminal Vo+4 and the ground terminal GND; the fourth power supply path Rail4 includes a single-phase buck unit Buck 1. The input end of the fifth power supply path Rail5 is electrically connected to the input positive terminal Vin+ and the ground terminal GND, and the output ends are the output positive terminal Vo+5 and the ground terminal GND; the fifth power supply path Rail5 includes a single-phase buck unit Buck 2.

[0061] Reference Figure 1A As shown, each VRCell includes four smart power stages SPS1 to SPS4 (SmartPowerStage, hereinafter referred to as SPS), four inductors L1 to L4 and four input capacitors Cin. Each VRCell includes three power terminals, namely the input positive terminal Vin+, the output positive terminal Vo+ and the ground terminal GND. Each SPS includes an internal input positive terminal Vin+1, an internal ground terminal GND1 and a jump terminal SW; a filter inductor Lk1 is connected in series between the input positive terminal Vin+ and the internal input positive terminal Vin+1 of the VRCell, and a filter inductor Lk2 is connected in series between the ground terminal GND of the VRCell and the internal ground terminal GND1; here, the filter inductors Lk1 and Lk2 are parasitic inductances on the VRCell pins. In the same VRCell, the internal input positive terminals Vin+1 of the four SPS are short-circuited together, the internal ground terminals GND1 of the four SPS are also short-circuited together, and the jump terminals of the four SPS are SW1 to SW4 respectively. One end of the inductors L1 to L4 is electrically connected to the jump terminals SW1 to SW4 respectively, and the other ends of the inductors L1 to L4 are electrically connected to the output positive terminal Vo+ of VRCell; the capacitor Cin is connected across the internal input positive terminal Vin+1 and the internal ground terminal GND1.

[0062] Each smart power stage SPS includes a half-bridge arm, which is connected between the internal input positive terminal Vin+1 and the internal ground terminal GND1, and the midpoint of the half-bridge arm is electrically connected to the jump terminals SW1 to SW4 respectively. Each smart power stage SPS also includes an auxiliary power supply pin Vcc, a signal ground pin AGND, a pulse width modulation pin PWMx, a current detection pin Isensex and a temperature detection pin TMON, where x is a natural number from 1 to 4, corresponding to the four SPS1 to SPS4 one by one. In the same VRCell, the auxiliary power supply pins Vcc of the four SPSs are short-circuited together, and further form the auxiliary power supply pin Vcc of the VRCell; the signal ground pins AGND of the four SPSs are short-circuited together, and further form the signal ground pin AGND of the VRCell; the temperature detection pins TMON of the four SPSs are short-circuited together, and further form the temperature detection pin TMON of the VRCell, which is used to output the temperature detection signal of the SPS with the highest temperature among the four SPSs. The pulse width modulation pin PWMx further forms four pulse width modulation pins PWM1 to PWM4 in VRCell, which receive pulse width modulation signals and are used to control the on and off time of the half-bridge arm switches in the corresponding SPS; wherein PWM1 to PWM4 are sequentially staggered by 90 degrees. The current detection pins Isensex of the four SPS further form the four current detection pins Isense1 to Isense4 of VRCell, which are used to output the internal detection current of each SPS.

[0063] The four inductors L1 to L4 are coupled on the same magnetic core to form a four-phase oppositely coupled inductor Lcp; the magnetic core of the four-phase oppositely coupled inductor Lcp has at least one common magnetic circuit for closing the magnetic lines of force of the four inductors L1 to L4, and the DC magnetic flux of the inductors L1 to L4 is superimposed on the common magnetic circuit. Because the pulse width control signals PWM1 to PWM4 in the same VRCell are successively staggered by 90 degrees, the inductors L1 to L4 of the VRCell have the characteristics of large steady-state inductance and small dynamic inductance. When the duty cycle D of the pulse width modulation signals PWM1 to PWM4 is closer to 25%, the ratio of the steady-state inductance to the dynamic inductance of each inductor is larger, so that the steady-state characteristics and dynamic characteristics of the VRCell are more optimized. In a traditional buck circuit, the duty cycle of the pulse width modulation signal usually falls between 10% and 90%. In order to obtain better steady-state characteristics and dynamic characteristics, the embodiment of the present invention controls the duty cycle D of the four pulse width modulation signals PWM1 to PWM4 to operate within the range of 15%-35%. Furthermore, the duty cycle D can be made to operate within the range of 20%-30%. The specific means of implementing the above duty cycle include: 1) setting the output voltage amplitude of the power supply front stage of VRCell according to the output voltage amplitude of VRCell; or 2) for applications where the input voltage amplitude or output voltage amplitude of VRCell is determined, a buck converter circuit topology including a flying capacitor is used.

[0064] Figure 2A and Figure 2B is a schematic diagram of the three-dimensional structure of the high-performance power module 1a. Figure 2A It is a schematic diagram of the three-dimensional structure of the TOP surface of the high-performance power module 1a. Figure 2B The 3D schematic diagram of the BOTTOM surface of the high-performance power module 1a. The high-performance power module 1a disclosed in the present invention adopts Figure 1A and Figure 1B The voltage regulation unit shown is formed by connecting multiple phase buck circuits in parallel.

[0065] Also refer to Figure 1A and Figure 1B The high-performance power module 1a further includes a first substrate 10 and a second substrate 20. The first substrate 10 includes a first surface 101 and a second surface 102 opposite to each other. The second substrate 20 includes a first surface 201 and a second surface 202 opposite to each other. Here, the first surface 101 is also referred to as the top surface 101; the second surface 102 is also referred to as the bottom surface 102; similarly, the first surface 201 is also referred to as the top surface 201; the second surface 202 is also referred to as the bottom surface 202. The high-performance power module 1a further includes a first side surface 41, a second side surface 42, a third side surface 43 and a fourth side surface 44.

[0066] Each voltage regulation unit VRCell includes an SPS combination, refer to Figure 1B and Figure 2AAs shown, VRCell 1 to VRCell 6 include SPS assemblies 111, 112, 113, 114, 115 and 116 respectively. Six SPS assemblies 111 to 116, single-phase buck units Buck 1 and Buck 2, and input capacitor Cin are arranged on the first surface 101 of the first substrate 10. SPS assemblies 111 and SPS assemblies 112 are arranged adjacent to the first side surface 41, SPS assemblies 113 and SPS assemblies 114 are arranged adjacent to the third side surface 43, SPS assemblies 112, 116 and 114 are arranged adjacent to the second side surface 42 in sequence, that is, SPS assemblies 116 are arranged between SPS assemblies 112 and SPS assemblies 114, and SPS assemblies 111, 115 and 113 are arranged adjacent to the fourth side surface 44 in sequence, that is, SPS assemblies 115 are arranged between SPS assemblies 111 and SPS assemblies 113. The first substrate 10 further includes connection holes 121 and 122. The connection hole 121 is disposed adjacent to the first side surface 41 and the fourth side surface 44, and the connection hole 122 is disposed adjacent to the third side surface 43 and the fourth side surface 44. The single-phase buck units Buck1 and Buck2 are disposed adjacent to the fourth side surface 44 and disposed between the connection holes 121 and 122. Figure 2B As shown, a ball grid array package (BGA for short) is arranged on the second surface 202 of the second substrate 20, and is used as the pins of VRCell or high-performance power module, and these pins include input positive pin Vin+, output positive pin Vo+, ground pin GND, auxiliary power supply pin Vcc, signal ground pin AGND, pulse width modulation pin PWMx, current detection pin Isensex and temperature detection pin TMON. When the high-performance power module is fixedly electrically connected to the system board, these pins are used to transmit power or signals.

[0067] Figure 2CThe pin diagram of the smart power stage SPS and the positional relationship with the related input capacitor Cin are shown. The pin diagram of the SPS includes a first side 131, a second side 132, a third side 133 and a fourth side 134. The first side 131 is opposite to the third side 133, and the second side 132 is opposite to the fourth side 134. The SPS pin diagram also includes a jump pin SW, a ground pin G, an input pin In and a signal pin Signal. The jump pin SW is set on the first side 131 of the SPS pin diagram, and the signal pin Signal is set on the third side 113 of the SPS pin diagram. The jump pin SW, the ground pin G, the input pin In and the signal pin Signal are arranged in sequence from the first side 131 to the third side 133. When the SPS is applied to a VRCell or a power module, the input capacitor Cin is respectively arranged adjacent to and close to the second side 132 and the fourth side 134, that is, adjacent to the ground pin G and the input pin In, so that the loop formed by the input capacitor Cin and the half-bridge arm in the SPS is minimized. In the smart power stage SPS, the jump pin SW is the jump terminal SWx of the SPS in the VR Cell, the ground pin G is the ground terminal GND1 of the SPS in the VR Cell, and the input pin In is the input positive terminal Vin+1 of the SPS in the VR Cell.

[0068] Figure 2D The internal layout of each SPS assembly on the first surface 101 of the first substrate 10 is disclosed. The internal layout of the SPS assemblies 111 to 116 is basically the same. Here, the SPS assembly 112 is used as an example. The SPS assembly 112 includes four SPSs, corresponding to SPS1 to SPS4 respectively; the jump pins of SPS1 to SPS4 are respectively as follows Figure 2D SW1 to SW4 shown. The transition pin of each SPS is adjacent to the first side 131 of the SPS. In the SPS combination 112, the four SPSs are arranged in a four-leaf windmill shape, and each SPS is a blade of the windmill. Each SPS is arranged vertically with the adjacent SPS, for example, SPS1 is arranged vertically with SPS2 and SPS4. The input capacitor Cin is also arranged adjacent to the second side 132 and the fourth side 134 of each SPS, so that the input capacitor and the half-bridge arm form a minimum loop. The transition pin SW of each SPS is at the top of the blade; and in the same VRCell, the transition pins SW1, SW2, SW3 and SW4 are arranged in sequence in a clockwise direction.

[0069] Reference Figure 3A and Figure 3BThe TOP and BOTTOM surfaces of the high-performance power module 1a are shown in a three-dimensional exploded diagram. The high-performance power module 1a also includes six four-phase reverse coupled inductors 301 / 302 / 303 / 304 / 305 / 306, a two-phase inductor 307, an output capacitor Co, connectors Connector 1 and Connector 2, and controllers 211 / 212.

[0070] The six four-phase reverse coupled inductors 301 / 302 / 303 / 304 / 305 / 306 and the two-phase inductor 307 are all arranged between the first substrate 10 and the second substrate 20; further, the six four-phase reverse coupled inductors 301 / 302 / 303 / 304 / 305 / 306 and the two-phase inductor 307 are all arranged between the second surface 102 of the first substrate 10 and the first surface 201 of the second substrate 20. The six four-phase reverse coupled inductors 301 / 302 / 303 / 304 / 305 / 306 are fixed and electrically connected to the pads 141 on the second surface 102 of the first substrate 10 through the top surface pads 331, and are fixed and electrically connected to the pads 232 on the first surface 201 of the second substrate 20 through the bottom surface pads 332. The six quadruple reverse coupled inductors 301 / 302 / 303 / 304 / 305 / 306 are connected to the six SPS combinations 111, 112, 113, 114, 115 and 116 in a one-to-one correspondence, forming six Figure 1A The two-phase inductor 307 is fixed and electrically connected to the pad 143 on the second side 102 of the first substrate 10 through the top pad 333, and is fixed and electrically connected to the pad 234 on the first side 201 of the second substrate 20 through the bottom pad 334 (not shown), and the pad 234 is the output positive terminal of the single-phase buck unit Buck 1 and Buck 2.

[0071] The second substrate 20 includes connection holes 221 and 222, and the connection hole 221 is arranged adjacent to the first side 41 and the fourth side 44 of the high-performance power module 1a; the connection hole 222 is arranged adjacent to the third side 43 and the fourth side 44 of the high-performance power module 1a. The two ends of Connector 1 are respectively inserted into the connection holes 121 and 221, and the two ends of Connector 2 are respectively inserted into the connection holes 122 and 222, and are fixed and electrically connected by welding; the first substrate 10 and the second substrate 20 realize multiple power and multiple signal transmission through Connector 1 and Connector 2; the pins or conductors in Connector 1 and Connector 2 are signal electrical connectors between the first substrate 10 and the second substrate 20. Furthermore, the connection holes 121 / 122 on the first substrate 10 are through holes, which provide mechanical limits for Connector 1 and Connector 2; the connection holes 221 / 222 on the second substrate 20 are blind holes, which can provide mechanical limits for Connector 1 and Connector 2 to prevent displacement between the first substrate 10 and the second substrate 20 during reflow soldering, and do not occupy the area of ​​the second surface 202 of the second substrate 20, and do not affect the number and area of ​​BGA settings. In other embodiments, surface mount pads can also be used to replace the connection holes 121 / 122 / 221 / 222; in this case, Connector 1 and Connector 2 are bonded to the side surfaces of the corresponding four oppositely coupled inductors by side to achieve mechanical limits; and Connector 1 and Connector 2 are fixed by welding the two ends to the corresponding pads to achieve electrical connection between the first substrate 10 and the second substrate 20, so the position where the connection holes 121 / 122 are set on the first surface 101 of the first substrate 10 can be used to set other surface mount components.

[0072] The controllers 211 and 212 are arranged on the first surface 201 of the second substrate 20, and are used to control the voltage regulated output of at least four power supply paths from the first power supply path Rail1 to the fifth power supply path Rail5. The controllers 211 and 212 generate corresponding pulse width modulation PWMx by detecting the output voltage Vo+x of each power supply path, and are used to control the corresponding voltage regulation unit VRCell or the single-phase buck unit Buck. Compared with setting the controllers 211 and 212 outside the high-performance power module, the present invention builds the controllers 211 and 212 into the high-performance power module 1a, and sets them on the second substrate 20, so that the functional integration of the high-performance power module 1a is greatly improved, and the second substrate 20 only needs to transmit the signal related to the smart power stage SPS to the first substrate 10; for applications with a small number of SPS on the first substrate 10, the number of signal electrical connectors between the first substrate 10 and the second substrate 20 is reduced. The controllers 211 and 212 can be disposed on the second substrate 20 as well as on the first substrate 10. For applications where there are a large number of SPSs on the first substrate 10, the controllers 211 and 212 are directly electrically connected to signals related to the smart power stage SPS through the first substrate 10. This has the advantage of reducing the number of signal electrical connectors between the first substrate 10 and the second substrate 20.

[0073] The output capacitor Co is arranged on the first surface 201 of the second substrate 20, and is respectively connected between the output positive terminal Vo+x and the ground terminal GND. Part of the output capacitor Co respectively forms a first capacitor component 241, a third capacitor component 243, a fifth capacitor component 245 and a sixth capacitor component 246. The first capacitor component 241, the third capacitor component 243, the fifth capacitor component 245, the sixth capacitor component 246, the controllers 121 and 122 are respectively located below the corresponding six quad reverse coupled inductors, and the positions are arranged directly opposite.

[0074] Reference Figure 3B , the four-phase reverse coupled inductor also includes a magnetic core component and an inductor frame 310, and the inductor frame 310 includes a top pad 331, a bottom pad 332 and a sidewall electrical connector 335. There is a height difference between the surface of the lower magnetic substrate 312 and the bottom pad 332, forming a bottom groove 318. When the high-performance power module 1a is assembled, the first capacitor component 241, the third capacitor component 243, the fifth capacitor component 245, the sixth capacitor component 246, the controllers 121 and 122 are respectively accommodated in the grooves 318 of the six four-phase reverse coupled inductors, thereby improving the integration of the high-performance power module 1a, and reducing the loop parasitic parameters formed by the output capacitor Co and the output positive pin Vo+x and the ground pin GND (i.e., the BGA set on the second surface 202 of the second substrate 20) of the corresponding power supply path, reducing the power loss of the high-performance power module and improving the dynamic response characteristics of the high-performance power module.

[0075] Figure 4A , Figure 4B and Figure 4C shows the detailed structure of the four-phase reverse coupled inductor, Figure 4A The layout of the top pad 331 of the quadruple reverse coupled inductor is shown in FIG. Figure 4B It is a three-dimensional decomposition diagram of four-phase reverse coupled inductors. Figure 4C This is the internal structure diagram of the inductor frame. Figure 4C As shown, the side electrical connector 335 includes a ground connector GNDb, an input positive connector Vin+1b, an output positive connector Vo+b, and a jump connector SWxb to realize the conductive function with the first substrate or the second substrate. The corresponding top surface pads of the ground connector GNDb, the input positive connector Vin+1b, and the output positive connector Vo+b on the top surface of the inductor frame 310 are the ground pad GNDa, the input positive pad Vin+1a, and the output positive pad Vo+a respectively; the corresponding bottom surface pads of the ground connector GNDb, the input positive connector Vin+1b, and the output positive connector Vo+b on the bottom surface of the inductor frame 310 are the ground pad GNDc, the input positive pad Vin+1c, and the output positive pad Vo+c (not shown). The corresponding top surface pad of the jump connector SWxb on the top surface of the inductor frame 310 is SWxa. The ground pad GNDa and the input positive pad Vin+1a are electrically connected to the corresponding pins of the SPS disposed on the first surface 101 of the first substrate 10 through the first substrate 10. The ground pad GNDa, the input positive pad Vin+1a, and the output positive pad Vo+a are electrically connected to the corresponding BGA disposed on the second surface 202 of the second substrate 20 through the second substrate 20. The ground connector GNDb and the input positive connector Vin+1b are used to realize the electrical connection between the SPS on the first substrate 10 and the corresponding BGA on the second substrate 20, respectively.

[0076] exist Figure 4AIn the top view of the four reverse coupled inductors shown, the outer frame of the inductor frame 310 is a quadrilateral, and the top pads 331 are respectively arranged along the four sides of the quadrilateral. On each side of the quadrilateral, there is a jump pad SWxa (i.e., SW1a, SW2a, SW3a, and SW4a), and the projection of each jump pad SWxa on the first surface 101 of the first substrate 10 is at least partially overlapped with the projection of the jump pin SW of the corresponding SPS on the first surface 101 of the first substrate 10, and the jump pad SWxa is electrically connected to the jump pin SW of the corresponding SPS through the first substrate. The advantage of this is that the short-circuit distance between the jump pad SWxa and the jump pin SW of the corresponding SPS is the shortest. Further, on each side of the top surface of the inductor frame 310, the top pads are arranged in the order of the ground pad GNDa, the input positive pad Vin+1a, the output positive pad Vo+a, the jump pad SWxa, the input positive pad Vin+1a, and the ground pad GNDa. On each side of the bottom surface of the inductor frame 310, the bottom surface pads are arranged in the order of ground pad GNDc, input positive pad Vin+1c, output positive pad Vo+c, input positive pad Vin+1c and ground pad GNDc (not shown); in other embodiments, the top surface pad 331 may not include the output positive pad Vo+a.

[0077] like Figure 4BAs shown, the magnetic core assembly includes an upper magnetic substrate 311, a lower magnetic substrate 312, a middle column 313 and four side columns 314 / 315 / 316 / 317. The four side columns 314 / 315 / 316 / 317 are arranged around the middle column 313. The inductor frame 310 also includes holes 323 / 324 / 325 / 326 / 327, and the middle column 313 and the four side columns 314 / 315 / 316 / 317 pass through the corresponding holes 323 / 324 / 325 / 326 / 327 respectively; the upper magnetic substrate 311 is buckled with the middle column and the four side columns from the top surface of the inductor frame 310, and the lower magnetic substrate 312 is buckled with the middle column and the four side columns from the bottom surface of the inductor frame 310. The inductor frame 310 also includes inductor windings 11 / 12 / 13 / 14, and the four inductor windings have the same structure, and one end (i.e., the jump end SWx) of each inductor winding is connected to the corresponding jump connector SWxb, and the other end (i.e., the output positive terminal Vo+) is electrically connected to the corresponding output positive connector Vo+b. The four inductor windings reach the output positive terminal Vo+ from the jump end SWx in the same direction, i.e., in the same clockwise direction or the same counterclockwise direction; in this embodiment, the same direction is the clockwise direction. The jump end SWx and the output positive terminal Vo+ of each inductor winding are located on two adjacent sides of the inductor frame, and the jump end SWx of each inductor winding is adjacent to the output positive terminal Vo+ of the previous inductor winding, and the output positive terminal Vo+ of each inductor winding is adjacent to the jump end SWx of the next inductor winding; so that the four inductor windings are adjacent to each other. A ground connection GNDb and two input positive connections Vin+1b are surrounded between the jump terminal SWx and the output positive terminal Vo+ of each inductor winding, and the two input positive connections Vin+1b are located on both sides of the ground connection GNDb, so that the parasitic inductance of the loop formed by the input positive connection Vin+1b and the ground connection GNDb is minimized. The inductor component 301 also includes insulating materials, and the side electrical connector 335 and the inductor winding 11 / 12 / 13 / 14 are formed by plastic sealing or pressing to form the inductor component 301. The voltages at both ends of the four inductor windings are out of phase by 90 degrees.

[0078] The high-performance power module disclosed in the present invention may also include only one voltage regulation unit VRCell. The layout of the SPS inside the VRCell, the structure of the four oppositely coupled inductors, and the setting of the output capacitor all have the technical features and benefits described in the aforementioned embodiments, which will not be repeated here.

[0079] Embodiment 2

[0080] like Figure 5A The circuit block diagram of the power module composed of multiple voltage regulation units shown in FIG. Figure 1B The difference between the circuit block diagram of the power module shown in FIG. 1 is that the voltage regulating unit VRCell 6 is replaced by a two-phase parallel buck circuit Buck3. Figure 5A The structural layout of the high-performance power module 1b of the circuit block diagram shown; Figure 5B It is a schematic diagram of the three-dimensional structure of the TOP surface of the high-performance power module 1b. Figure 5C It is a three-dimensional exploded schematic diagram of the high-performance power module 1b.

[0081] The high-performance power module 1b includes a first substrate 10, a second substrate 20 and a third substrate 30, wherein the third substrate 30 is disposed between the first substrate 10 and the second substrate 20. The first substrate 10 includes a first surface 101 and a second surface 102 opposite to each other, and the high-performance power module 1b also includes a first side surface 41, a second side surface 42, a third side surface 43 and a fourth side surface 44, wherein the first side surface 41 and the third side surface 43 are opposite to each other, and the second side surface 42 and the fourth side surface 44 are opposite to each other. Figure 5B and Figure 2A As shown, the difference in the layout on the first surface 101 is that the position where the SPS combination 116 was originally set is used to set the SPS combination 114, and the position where the SPS combination 114 was originally set is used to set the two intelligent power levels of the two-phase parallel buck circuit Buck 3; correspondingly, the position where the voltage regulating unit VRCell 6 was originally set is used to set the voltage regulating unit VRCell 4, and the position where the voltage regulating unit VRCell 4 was originally set is used to set the two-phase parallel buck circuit Buck 3. The controller 211 is set on the first surface 101 of the first substrate 10. The input capacitor Cin is adjacent to and close to the second side 132 and the fourth side 134 of each SPS, and the setting principle is the same as that of the first embodiment, which will not be repeated here.

[0082] The second substrate 20 includes a first surface 201 and a second surface 202 opposite to each other. The same as the first embodiment is that the output capacitor Co is arranged on the first surface 201 of the second substrate, and is respectively connected between the output positive terminal Vo+x and the ground terminal GND. Part of the output capacitor Co respectively constitutes a first output capacitor component 241, a second output capacitor component 242, a third output capacitor component 243, a fourth output capacitor component 244, a fifth output capacitor component 245 and a seventh output capacitor component 247. The output capacitor components 241 / 242 / 243 / 244 / 245 / 247 are respectively located directly below the five four-phase reverse coupling inductors 301 / 302 / 303 / 304 / 305 and the two-phase inductors 307 of the two-phase parallel buck circuit Buck 3. The pads 141 are respectively arranged around the output capacitor components 241 / 242 / 243 / 244 / 245 / 247.

[0083] Figure 5D is a top view of the magnetic assembly 200; Figure 5E is a bottom view of the magnetic assembly 200; Fig. 5F is a top exploded view of the magnetic assembly; Figure 5G is a bottom view of the first substrate 10. FIG. 5D to FIG. 5F The magnetic assembly 200 includes five quad-opposite coupled inductors 301 / 302 / 303 / 304 / 305, a two-phase inductor 307 and two single-phase inductors 308 / 309; the five quad-opposite coupled inductors 301 / 302 / 303 / 304 / 305 are respectively located directly below the SPS combination in VRCell 1 to VRCell 5; a two-phase inductor 307 is located directly below the two SPSs in the two-phase parallel buck circuit Buck 3, or the two positions at least partially overlap; the two single-phase inductors 308 / 309 are respectively located directly below the SPSs in the two single-phase buck units Buck1 and Buck2, or the above positions at least partially overlap. The magnetic assembly 200 also includes a third substrate 30, which includes a first surface 341 and a second surface 342 opposite to each other, a built-in inductor winding and a hole. Taking the holes 323 / 324 / 325 / 326 / 327 of the four oppositely coupled inductors 301 as an example, the holes 323 / 324 / 325 / 326 / 327 allow the middle column 313 and the side columns 314 / 315 / 316 / 317 to pass through, and the upper magnetic substrate 311 and the lower magnetic substrate 312 respectively engage the middle column and the four side columns from the first surface 341 and the second surface 342. There are four inductor windings disposed in the third substrate 30, which respectively surround the four side columns 314 / 315 / 316 / 317. The shape of the inductor windings is as follows: Figure 4C In addition, the structures of the two-phase inductor 307 and the single-phase inductor 308 / 309 are similar to the structures of the four-phase reverse coupled inductor in this embodiment, and will not be described in detail here.

[0084] The magnetic assembly 200 further includes a ground connection GNDb, an input positive connection Vin+1b, and a jump connection SWxb disposed on the first surface 341 of the third substrate 30; these connections are used to achieve electrical connection with the first substrate. Figure 5DAs shown, taking the four-phase reverse coupled inductor 302 as an example, the connector includes four jump connectors SW1b / SW2b / SW3b / SW4b, three ground connectors GNDb and one input positive connector Vin+1b arranged around the upper magnetic substrate 311, and divided into four groups; SW1b and Vin+1b are arranged in one group, SW2b and GNDb are arranged in one group, SW3b and GNDb are arranged in one group, and SW4b and GNDb are arranged in one group. The two connectors in each group of connectors are arranged adjacent to each other. The four jump connectors SW1b / SW2b / SW3b / SW4b here are respectively arranged near and electrically connected to the jump pins SW of the four smart power stages, and are also respectively arranged near and electrically connected to the input ends of the four windings in the four-phase reverse coupled inductor. The three ground connectors GNDb are used to realize the electrical connection between the ground position G of the smart power stage and the third substrate. An input positive connector Vin+1b is used to realize the electrical connection between the input pin In of the smart power stage and the third substrate. Taking the upper magnetic substrate 311 shown in this embodiment as a quadrilateral as an example, three grounding connectors GNDb and one input positive connector Vin+1b are respectively arranged adjacent to the four corners of the upper magnetic substrate 311, but this is not limited to this. There is a gap between two adjacent groups of connectors. The end surface of each connector is the corresponding pad, namely the grounding pad GNDa, the input positive pad Vin+1a and the jump pad SWxa. Figure 5G As shown, the ground pad GNDa, the input positive pad Vin+1a and the jump pad SWxa are respectively welded and fixed to the corresponding pads (not shown) arranged on the second surface 102 of the first substrate 10 and electrically connected. And after the magnetic component 200 is fixedly connected to the first substrate 10, the gap between each group of connecting parts can be used to set more input capacitors Cin, increase the number of input capacitors Cin, and improve the capacity of input capacitors Cin. Figure 5G The corresponding input capacitors Cin and pads (not shown) on the second surface 102 of the first substrate 10 form input capacitor components 151 / 152 / 153 / 154 / 155.

[0085] refer to Figure 5E As shown, similar Figure 5D, the output positive connector Vo+b, the ground connector GNDb and the input positive connector Vin+1b are arranged on the second surface 342 of the third substrate 30; these connectors are used to realize the electrical connection with the BGA ball of the corresponding electrical network on the second substrate 20. Also taking the four-way reverse coupling inductor 302 as an example, the connectors include four output positive connectors Vo+b, three ground connectors GNDb and one input positive connector Vin+1b arranged around the lower magnetic substrate 312, and divided into four groups; three combinations of Vo+b and GNDb and one combination of Vin+1b and Vo+b. The two connectors in each connector combination are arranged adjacent to each other. The output positive connector Vo+b here is respectively arranged close to and electrically connected to the output ends of the four windings in the four-way reverse coupling inductor. Taking the lower magnetic substrate 312 shown in this embodiment as a quadrilateral as an example, three grounding connectors GNDb and one input positive connector Vin+1b are respectively arranged adjacent to the four corners of the lower magnetic substrate 312, and are directly opposite and electrically connected to the connectors with the same network name on the first surface 341 of the third substrate; or at least the upper and lower parts of the positions overlap, but it is not limited to this. There is a gap between two adjacent groups of connectors to accommodate part of the output capacitor on the first surface 201 of the second substrate 20. The end face of each connector is the corresponding pad, namely the grounding pad GNDc, the input positive pad Vin+1c and the output positive pad Vo+c. The grounding pad GNDc, the input positive pad Vin+1c and the output positive pad Vo+c are respectively welded and fixed to the pad 141 arranged on the first surface 201 of the second substrate 20 and electrically connected. In this embodiment, the connector can be a copper block. The thickness of the copper block on the first surface 341 of the third substrate 30 is close to or greater than the thickness of the upper magnetic substrate 311; the thickness of the copper block on the second surface 342 of the third substrate 30 is close to or greater than the sum of the thickness of the lower magnetic substrate 312 and the output capacitor Co. The advantage of this is that the output capacitor Co can be placed directly below the lower magnetic substrate 312, thereby increasing the capacity of the output capacitor Co. In addition, on the first surface 341 of the third substrate 30, according to the top view of the third substrate, the jump connector SW1b / SW2b / SW3b / SW4b is placed adjacent to the right side of the ground connector GNDb or the input positive connector Vin+1b in each group. On the second surface 342 of the third substrate 30, according to the bottom view of the third substrate, the output positive connector Vo+b is placed adjacent to the right side of the ground connector GNDb or the input positive connector Vin+1b in each group. The advantage of this is that the parasitic resistance of each winding in the magnetic component 200 is minimized, the parasitic resistance of each connector is minimized, and the surface area occupied by the connector is minimized.

[0086] In this embodiment, in a voltage regulation unit, the SPS combination, input capacitor component, magnetic component and output capacitor component are stacked in sequence from top to bottom, which not only reduces the loop parasitic parameters of the high-performance power module, but also reduces the footprint of the high-performance power module on the system board.

[0087] In this embodiment, the controller 211 is arranged on the first surface 101 of the first substrate 10, and the controller 212 is arranged on the second surface 102 of the first substrate 10; the projection of the controller 212 on the first surface 101 overlaps or at least partially overlaps with the projection of the controller 211 on the first surface 101. The controllers 211 and 212 are arranged on the first substrate 10, so that the controllers 211 and 212 can be electrically connected to the pins related to the smart power stage SPS through the first substrate 10, which not only reduces the number of signal connectors between the first substrate 10 and the second substrate 20, but also reduces the area occupied by the controllers 211 and 212 on the first surface 101 and the second surface 102 of the first substrate 10; so that there is more area on the first surface 101 of the first substrate 10 to place the smart power stage SPS, and also so that there is more area on the second surface 102 of the first substrate 10 to place the inductor; and the space utilization and conversion efficiency of the high-performance power module are improved.

[0088] refer to Figure 5G In this embodiment, Connector 1 / 2 / 3 is a surface mount component mounted on the first surface 201 of the second substrate 20 and the second surface 102 of the first substrate 10, so as to realize the electrical signal connection between the first substrate 10 and the second substrate 20; so that other devices can be placed on the first surface 101 of the first substrate 10, directly opposite to connector 1 / 2 / 3, thereby further improving the space utilization of the power module.

[0089] Similarly, the high-performance power supply module disclosed in this embodiment may also include only one voltage regulation unit VRCell. The layout of the SPS inside the VRCell, the structure of the four oppositely coupled inductors, and the setting of the output capacitor all have the technical features and benefits described in the aforementioned embodiments, which will not be repeated here.

[0090] Embodiment 3

[0091] Fig. 6A is a schematic diagram of the three-dimensional structure of the TOP surface of another high-performance power module 1c; Figure 6B is a bottom view of the first substrate 10 of this embodiment; Figure 6C FIG. 3 is a top view of the third substrate 30 of this embodiment. Fig. 6A , this embodiment and Figure 2AThe difference is that the original voltage regulating unit VRCell 6 is replaced by a two-phase parallel buck circuit Buck 3, thereby obtaining the benefit of space saving; the two single-phase buck units Buck 1 and Buck 2 are placed adjacent to the first side 41 and the third side 43 of the power module respectively; the controller 211 is moved from the top surface of the second substrate 20 to the top surface of the first substrate 10, and the controller 211 is located between the two single-phase buck units Buck 1 and Buck 2; the controller 211 is adjacent to the fourth side 44 of the power module and is located on the center line 45 perpendicular to the fourth side 44. Because the reference vertical center line 45, the layout of VRCell 1 to VRCell 5 on the top surface 101 of the first substrate 10 approximately satisfies a symmetrical relationship; and the layout of the two single-phase buck units Buck 1 and Buck 2 on the top surface 101 of the first substrate 10 also approximately satisfies a symmetrical relationship; the advantage of this is that the signal pins of the controller 211 are symmetrically and equidistantly connected to the smart power stages in VRCell 1 to VRCell 4; thereby greatly reducing the complexity of the internal wiring of the first substrate 10. Similarly, the signal pins of the controller 211 can also be symmetrically and equidistantly connected to the smart power stages in VRCell 5; or symmetrically and equidistantly connected to the smart power stages in the single-phase buck units Buck1 and Buck2.

[0092] refer to Figure 6B , the controller 212 is located on the bottom surface 102 of the first substrate 10, and the position is opposite to the position of the controller 211, or at least partially overlaps; the advantage is that the position of the controller 211 and the controller 212 is minimized, and the position of the inductor is minimized at the same time. Connector 1 is also placed adjacent to and parallel to the first side surface 44, and is located on the center line 45 perpendicular to the fourth side surface 44, so that the signal pins of the controller 211 and the controller 212 can be connected to the connector 1 in the shortest distance, thereby realizing the shortest distance electrical connection of the signal pins of the controller 211 and the controller 212 to the third substrate 30 and the second substrate 20.

[0093] If 6A has Figure 5C A similar magnetic assembly 200; Figure 6CIt is a top view of the third substrate 30 in the magnetic component 200. The third substrate 30 includes five holes corresponding to the four-phase reverse coupled inductors 301 / 302 / 303 / 304 / 305, a hole corresponding to the two-phase inductor 307, and two holes corresponding to the single-phase inductors 308 / 309; the above holes are for the magnetic core column to pass through, thereby forming the corresponding inductor. The hole corresponding to the two-phase inductor 307 is placed close to the third side of the third substrate 30, so that one of the holes can be replaced by a recess at the edge of the board, thereby improving the space utilization of the third substrate 30; similarly, the holes corresponding to the two single-phase inductors 308 / 309 are placed close to the fourth side of the third substrate 30, so that one of the holes can be replaced by a recess at the edge of the board. Taking the layout of the position of the four-phase reverse coupling inductor 302 as an example, the pad SWxa for welding the jump connection and the pad GNDa for welding the ground connection appear in pairs, totaling four pairs; the first pair in the counterclockwise direction is SW1a and GNDa, the second pair is SW2a and GNDa, the third pair is SW3a and GNDa, and the fourth pair is SW4a and GNDa; they are respectively located at the four corners of the quadrilateral formed by the upper magnetic substrate 311 of the four-phase reverse coupling inductor 302, and the pad for welding the jump connection SWxa is located on the right side of the pad for welding the ground connection GNDa. A pad Vin+1a for welding the input positive connection is placed adjacent to GNDa, so that the parasitic loop between the input positive connection and the ground connection is minimized. Reference Figure 6C , the winding channel of the two-phase inductor 307 is parallel to the second side surface 42, and the pads of the two welding jumper connectors SWxa, that is, the input ends of the two windings of the two-phase inductor 307 are located on both sides of the winding channel of the two-phase inductor 307, so that the two-phase inductor 307 forms two reverse coupled inductors; here, the winding channel refers to the PCB located between the holes of the two-phase inductor 307. Fig. 6A The two jump pins SW of the two smart power stages SPS in Buck 3 are also parallel to the second side surface 42, and the two jump pins SW of the two smart power stages SPS in Buck 3 are arranged opposite to each other, so that the two jump pins SW of the two smart power stages SPS are connected to the input end of the two-phase input inductor 307 by the shortest distance. Because the PWM phase difference of the two smart power stages SPS satisfies 180 degrees, the two smart power stages SPS in Buck 3 and the two-phase inductor 307 also form a two-phase parallel buck circuit with two oppositely coupled inductors in a limited space, thereby obtaining the advantages of large steady-state inductance and small dynamic inductance; thus, the number of output capacitors can be reduced.

[0094] The power module described in the above embodiment may also be a part of an electronic device, and can meet the technical features and benefits disclosed by the present invention.

[0095] The “equal”, “same” or “equal” disclosed in the present invention must take into account the parameter distribution of the project, and the error distribution is within ±30%; the definition of two line segments or two straight lines being “parallel” is that the angle between the two line segments or two straight lines is less than or equal to 45 degrees; the definition of two line segments or two straight lines being “perpendicular” is that the angle between the two line segments or two straight lines is within the range of [60, 120] degrees; the definition of phase “misalignment” also needs to take into account the parameter distribution of the project, and the error distribution of the misalignment degree is within ±30%.

[0096] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0097] The above description of the disclosed embodiments enables one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A high-performance power module, characterized in that: The invention comprises at least one voltage regulating unit; the voltage regulating unit comprises an SPS combination, a quad reverse coupled inductor, an output capacitor component, a first substrate and a second substrate; the first substrate comprises a first surface and a second surface opposite to each other, and the second substrate comprises a first surface and a second surface opposite to each other; The SPS assembly is arranged on the first surface of the first substrate, the four oppositely coupled inductors are arranged between the second surface of the first substrate and the first surface of the second substrate; the output capacitor assembly is arranged on the second surface of the second substrate; The SPS combination includes four smart power stages, the four smart power stages are arranged in a four-blade windmill shape, each of the smart power stages includes a jump pin, and each of the jump pins is arranged at the top of a corresponding windmill blade; The quad-inversely coupled inductor comprises a magnetic core and an inductor frame, a groove space is provided between the surface of the magnetic core and the surface of the frame, and at least a part of the groove space is used to accommodate the output capacitor component.

2. The high performance power module according to claim 1, characterized in that: The smart power stage further comprises an input positive pin, a ground pin and a signal pin, and the jump pin, the input positive pin, the ground pin and the signal pin are arranged in sequence along the same direction.

3. The high performance power module according to claim 2, characterized in that: An input capacitor is also included. The input capacitor is arranged at two sides of the smart power stage and is arranged adjacent to the input positive pin and the ground pin.

4. The high performance power module according to claim 1, characterized in that: The inductor frame includes four inductor windings, a grounding electrical connector, an input positive electrical connector, an output positive electrical connector, and a jump electrical connector; one end of each of the inductor windings is respectively connected to the corresponding output positive electrical connector, and the other end of each of the inductor windings is respectively connected to the corresponding jump electrical connector; Each of the output positive electrical connections is disposed adjacent to a jump electrical connection corresponding to another inductor winding.

5. The high performance power module according to claim 4, characterized in that: The inductor frame is a quadrilateral, and further comprises a ground pad, an input positive pad, an output positive pad and a jump pad; the four sides of the top surface of the inductor frame are sequentially provided with a ground pad, an input positive pad, an output positive pad, a jump pad, an input positive pad and a ground pad; The four sides of the bottom surface of the inductor frame are sequentially provided with a ground pad, an input positive pad, an output positive pad, an input positive pad, and a ground pad.

6. The high performance power module according to claim 5, characterized in that: The smart power stage also includes an input positive pin, a ground pin and a signal pin, and the jump pin, input positive pin, ground pin and signal pin are arranged in sequence along the same direction; the projection of the jump pad on the first surface of the first substrate at least partially overlaps with the projection of the jump pin on the first surface of the first substrate.

7. The high performance power module according to claim 4, characterized in that: It also includes a ball grid array, which is arranged on the second surface of the second substrate. The ball grid array is electrically connected to the grounding electrical connector, the input positive electrical connector, and the output positive electrical connector through the second substrate.

8. The high performance power module according to claim 4, characterized in that: The inductor windings corresponding to the various voltage regulating units are all integrated in a third substrate; and the magnetic cores corresponding to the various voltage regulating units are all buckled on the third substrate.

9. The high performance power module according to claim 1, characterized in that: Each SPS combination is provided with four pulse width modulation signals, each of which is used for controlling an intelligent power level; the four pulse width modulation signals are sequentially staggered by 90 degrees, and the duty ratios of the four pulse width modulation signals are all within the range of 15%-35%.

10. The high performance power module according to claim 1, characterized in that: The voltage regulating unit consists of six voltage regulating units, namely the first voltage regulating unit to the sixth voltage regulating unit. The input ends of the six voltage regulating units are electrically connected in parallel, the output ends of the first voltage regulating unit to the fourth voltage regulating unit are electrically connected in parallel to form a first power supply path, the fifth voltage regulating unit constitutes a second power supply path, and the sixth voltage regulating unit constitutes a third power supply path.

11. The high performance power module according to claim 10, characterized in that: The high-performance power module comprises a first side surface, a second side surface, a third side surface and a fourth side surface, wherein the first side surface is opposite to the third side surface, and the second side surface is opposite to the fourth side surface; the first voltage regulating unit and the second voltage regulating unit are arranged adjacent to the first side surface; The third voltage regulating unit and the fourth regulating unit are arranged adjacent to the third side; the fifth voltage regulating unit is arranged between the first voltage regulating unit and the third voltage regulating unit, and adjacent to the second side; the sixth voltage regulating unit is arranged between the second voltage regulating unit and the fourth voltage regulating unit, and adjacent to the fourth side.

12. The high performance power module according to claim 10, characterized in that: The high-performance power module further includes a controller, which is disposed in a groove space corresponding to the voltage regulating unit corresponding to the first power supply path.

13. The high performance power module according to claim 10, characterized in that: The high-performance power supply module also includes two single-phase buck units; the single-phase buck units each constitute a power supply path; the single-phase buck units each include an intelligent power stage; the single-phase buck units each include a single-phase inductor, or the single-phase buck units share a two-phase inductor.

14. The high performance power module according to claim 1, characterized in that: The voltage regulating unit comprises five voltage regulating units, namely, a first voltage regulating unit to a fifth voltage regulating unit, the input ends of the five voltage regulating units are electrically connected in parallel, the output ends of the first voltage regulating unit to the fourth voltage regulating unit are electrically connected in parallel to form a first power supply path, and the fifth voltage regulating unit forms a second power supply path; The high-performance power module also includes a two-phase parallel buck unit; the two-phase parallel buck unit constitutes a third power supply path, and the two-phase parallel buck unit includes two intelligent power stages and a two-phase reverse coupled inductor; the two intelligent power stages are provided with two pulse width modulation signals, and the two pulse width modulation signals are 180 degrees out of phase; the input ends of the two reverse coupled inductors are electrically connected to the two intelligent power stages respectively; The high-performance power supply module also includes two single-phase buck units; the single-phase buck units each constitute a power supply path; the single-phase buck units each include an intelligent power stage; the single-phase buck units each include a single-phase inductor, or the single-phase buck units share a two-phase inductor.

15. The high performance power module according to claim 14, characterized in that: The fifth voltage regulating unit is arranged in the middle of the high-performance power supply module, and the first to fourth voltage regulating units are arranged around the fifth voltage regulating unit.

16. The high performance power module according to claim 14, characterized in that: The high-performance power module further includes two controllers, which are respectively arranged on two sides of the first substrate, and the projection positions of the two controllers on the upper surface of the first substrate coincide or partially overlap.

17. The high performance power module according to claim 16, characterized in that: The two controllers, the fifth voltage regulating unit and the two-phase parallel buck unit are arranged along the center line of the high-performance power module, and the first to fourth voltage regulating units and the two single-phase buck units are symmetrically arranged on both sides of the center line.

18. The high performance power module according to claim 14, characterized in that: The inductors corresponding to the voltage regulating unit, the two-phase parallel buck unit and the single-phase buck unit respectively include inductor windings and magnetic cores. The windings are all integrated in a third substrate, and the magnetic cores are all buckled on the third substrate.

19. The high performance power module according to claim 1, characterized in that: It also includes a signal electrical connector, which is disposed between the first substrate and the second substrate and is electrically connected to the first substrate and the second substrate, and is used to transmit signals.

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