Non-contact button and button
By using a sensing part of a multi-layer body structure, including a support plate, a diaphragm and a conductive layer in the sensing module of the non-contact button, the problem that the sensing range in the prior art is affected by the shape of the frame is solved, and a higher sensing accuracy and sensing range are achieved.
Patent Information
- Application Number
- CN202411924982.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2024-10-17
- Filing Date
- 2024-12-25
- Publication Date
- 2025-04-18
AI Technical Summary
When setting up an optical sensor, the sensing range is easily affected by the shape of the frame, resulting in limited sensing accuracy.
A contactless button is designed, including a substrate, a frame and a sensing module. The sensing part of the sensing module is composed of a plurality of layers, including a support plate, a diaphragm and a conductive layer. The conductive layer completely covers the diaphragm and a support plate, and electrically connects the substrate to form a uniform sensing range.
With this design, the contactless button can improve the sensing accuracy and sensing range without the need for additional arrangement to accommodate sensing elements, so as to avoid the sensing range being affected by the shape of the frame.
Smart Images

Figure CN119853658A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a non-contact button and a button, in particular to a non-contact button capable of generating an optical suspension pattern and a contact button having the function of the non-contact button. Background Art
[0002] Existing contactless buttons include optical trigger buttons based on the difference in sensing methods. In order to improve the accuracy of the optical sensor, in addition to setting an opening on the surface of the button for the optical sensor to receive light, there is also a design in which the optical sensor is set on the outer frame of the button. However, in the design in which the optical sensor is set on the outer frame, the sensing range of the optical sensor will be easily affected by the shape of the outer frame. Since the sensing range factor needs to be considered, the shape of the outer frame is limited. Summary of the invention
[0003] The invention provides a non-contact button with good sensing accuracy.
[0004] The present invention also provides a button which has the functions of both a contact button and a non-contact button and has good sensing accuracy.
[0005] To achieve the above advantages, the present invention provides a contactless button, comprising: a substrate, a frame and a sensing module. The frame is arranged on the substrate, and the frame has an opening on a side away from the substrate. The sensing module is suitable for forming a sensing area. The sensing module has a sensing part covering the opening. The sensing part has a plurality of layers, and the layers include: a support plate, a diaphragm and a conductive layer. The diaphragm completely covers the side of the support plate away from the substrate. The conductive layer is located between the diaphragm and the support plate and completely covers the diaphragm, and the conductive layer is electrically connected to the substrate and is suitable for forming a sensing area.
[0006] The present invention further provides a button, comprising: a substrate, a frame, a contact switch and a sensing module. The frame is arranged on the substrate, and the frame has an opening on a side away from the substrate. The contact switch is arranged on the substrate, and is suitable for generating a first control signal. The sensing module is suitable for pushing the contact switch to generate the first control signal, and is suitable for forming a sensing area for generating a second control signal. The sensing module has a sensing part covering the opening, and the sensing part has a plurality of layers, and the layers include: a support plate, a diaphragm and a conductive layer. The diaphragm completely covers the surface of one side of the support plate away from the substrate. The conductive layer is located between the diaphragm and the support plate and completely covers the diaphragm. The conductive layer is electrically connected to the substrate and is suitable for forming a sensing area.
[0007] In one embodiment, the support plate, the membrane and the conductive layer are light-transmissive.
[0008] In one embodiment, the above-mentioned sensing module further includes an optical imaging component, which is located on a side of the support plate close to the substrate. The sensing module is suitable for converting the light beam provided by the light-emitting unit on the substrate into a suspended optical image through the optical imaging component, and is suitable for pushing the contact switch through the optical imaging component.
[0009] In one embodiment, the optical imaging assembly comprises a lens array, and the lens array and the support plate are integrally formed.
[0010] In one embodiment, the sensing module has a plurality of fixing portions, which extend from the support plate along a direction perpendicular to the surface of the substrate toward the substrate and are suitable for fixing the optical imaging component.
[0011] In one embodiment, the above-mentioned sensing module further has an outer flange and a step portion, the outer flange is extended from the support plate, the outer flange surrounds the sensing portion and is parallel to the substrate, the fixing portion is located at the outer periphery of the outer flange, in a direction of the sensing module toward the substrate, the thickness of the outer flange is less than the thickness of the sensing portion, the step portion is extended from the support plate and is located between the sensing portion and the outer flange.
[0012] In one embodiment, the membrane and the conductive layer completely cover the outer flange and the step portion.
[0013] In one embodiment, the membrane and the conductive layer partially cover the outer flange and the step portion.
[0014] In one embodiment, the diaphragm is a flexible diaphragm, and the sensing module further includes a connecting portion, which is connected to the outer flange and is composed of a diaphragm extending from the sensing portion and a conductive layer extending from the sensing portion, and the sensing portion is electrically connected to the substrate through the connecting portion.
[0015] Based on the above description, the contactless button of the present invention can form a uniform sensing range in front of the sensing part, improve the sensing accuracy, and does not require additional components (such as outer frames) to accommodate the sensing elements, because the layer (conductive layer) used to form the sensing area in the sensing part covering the opening is configured to completely cover another layer (support plate). In addition, by arranging the conductive layer between the diaphragm and the support plate, and also arranging the diaphragm on the outer surface of the sensing part (the outer surface of the contactless button, which is the side away from the substrate), the conductive layer can be protected by the diaphragm while providing sufficient support through the support plate. Since the diaphragm and the conductive layer are supported by the support plate, the thickness of the diaphragm can be thinned, so that the conductive layer is as close to the front of the contactless button as possible, avoiding the range of the sensing area being affected by the thickness of the support plate, and increasing the sensing range of the contactless button.
[0016] In addition, in some embodiments, the sensor module can form a fixing portion through the support plate when manufacturing the support plate to fix the optical imaging component that generates the suspended optical image. In some embodiments, because the connection portion that electrically connects the sensor portion to the substrate is formed by using a flexible membrane and a conductive layer, in addition to not requiring an additional connection line, the portion extending to the connection portion can be prevented from being damaged at the bend (step difference) of the sensor module, thereby increasing the freedom of the sensor module in terms of appearance design.
[0017] The button provided by the present invention has the same advantages as the non-contact button.
[0018] In order to make the above and other purposes, features and advantages of the present invention more clearly understood, embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 It is an exploded schematic diagram of a button according to an embodiment of the present invention;
[0020] Figure 2 for Figure 1 A three-dimensional schematic diagram of a sensing module of an embodiment;
[0021] Figure 3 for Figure 1 A partial cross-sectional schematic diagram of a sensing module of an embodiment;
[0022] Figure 4 for Figure 1 A schematic cross-sectional view of a button of the embodiment along line AA;
[0023] Figure 5 for Figure 1 A schematic diagram of generating a suspended optical image of a button of an embodiment;
[0024] Figure 6 , Figure 7 for Figure 1 A schematic diagram of the operation of the button of the embodiment along the AA section line;
[0025] Figure 8 It is an exploded schematic diagram of a button according to an embodiment of the present invention;
[0026] Fig. 9 for Figure 8 A three-dimensional schematic diagram of a sensing module according to an embodiment.
[0027] Wherein, the reference numerals are:
[0028] 1: Button
[0029] 1A: Contactless button
[0030] 2:Substrate
[0031] 21: Light-emitting unit
[0032] 22: Interface
[0033] 3: Frame
[0034] 31: Opening
[0035] 301: Gap
[0036] 4: Contact switch
[0037] 5.5': Sensing module
[0038] 51, 51': sensing part
[0039] 51A: Support plate
[0040] 51B: Diaphragm
[0041] 51C: Conductive layer
[0042] 51D: Pattern layer
[0043] 52: Outer flange
[0044] 53: Step difference department
[0045] 54: Fixed part
[0046] 54A: Guide rail
[0047] 54B:Claw
[0048] 55: Connection
[0049] 56: Optical imaging components
[0050] 56A: Imaging unit
[0051] 56B: Lens array
[0052] 56C: Optical path conversion unit
[0053] 6: Middle frame
[0054] 61: Elastic Arm
[0055] 7: Trim
[0056] 71: Opening
[0057] R: Sensing range
[0058] P: Suspended optical image
[0059] L: Beam
[0060] D: Direction
[0061] AA: Section Line DETAILED DESCRIPTION
[0062] In the following articles, the terms used in the description of the embodiments of the present invention, such as the description of the directions or positional relationships indicated by "upper", "lower", etc., are described according to the directions or positional relationships shown in the drawings used. The above terms are only for the convenience of describing the present invention and are not intended to limit the present invention, i.e., they do not indicate or imply that the elements mentioned must include a specific direction or be constructed in a specific direction. In addition, the terms "first", "second", etc. mentioned in this specification or the scope of the patent application are only used to name the element or distinguish different embodiments or scopes, and are not used to limit the upper or lower limit of the number of elements.
[0063] Figure 1 FIG. 4 is an exploded schematic diagram of a button according to an embodiment of the present invention. Figure 2 for Figure 1 A three-dimensional schematic diagram of a sensing module according to an embodiment. Figure 3 for Figure 1 A partial cross-sectional schematic diagram of a sensing module according to an embodiment. Figure 4 for Figure 1 A schematic cross-sectional view of a button of an embodiment along line AA. In order to clearly understand the combination relationship between the optical imaging component 56 and other components of the sensing module 5 (such as the fixing portion 54), Figure 1 Further separating the optical imaging component 56 from other components of the sensing module 5 , it can be understood from the following description of the function of generating a signal by pressing that when the button 1 is actually actuated, the optical imaging component 56 and other components of the sensing module 5 will be actuated together.
[0064] like Figures 1 to 4 As shown, an embodiment of the present invention provides a button 1, comprising: a substrate 2, a frame 3, a contact switch 4 and a sensing module 5. The frame 3 is disposed on the substrate 2, and the frame 3 has an opening 31 on a side away from the substrate 2. The contact switch 4 is disposed on the substrate 2, and is suitable for generating a first control signal. The sensing module 5 is suitable for pushing against the contact switch 4 to generate a first control signal, and is suitable for forming a sensing area R for generating a second control signal, and the sensing module 5 has a sensing portion 51 covering the opening 31. The sensing portion 51 has a plurality of layers, which include: a support plate 51A, a diaphragm 51B and a conductive layer 51C (see Figure 3 The diaphragm 51B completely covers the surface of the support plate 51A on the side away from the substrate 2. The conductive layer 51C is located between the diaphragm 51B and the support plate 51A and completely covers the diaphragm 51B. The conductive layer 51C is electrically connected to the substrate 2 and is suitable for forming a sensing area R (see Figure 4 ).
[0065] According to the present invention, the installation object of the button 1 is not limited, for example but not limited to an elevator. Figure 4As shown, during installation, the button 1 is installed on a device to which the button 1 is applied, such as a decorative panel 7 of an elevator, and only the sensing module 5 is exposed. Figure 4 In the illustrated embodiment, in the direction D from the substrate 2 to the sensing module 5 , the sensing module 5 is, for example, located at the front of the entire button 1 , and the surface of the sensing module 5 is flush with the surface of the decorative panel 7 , but not limited thereto.
[0066] According to the present invention, there is no limitation on the type of substrate 2. The substrate 2 is, for example, a printed circuit board (PCB). The shape and size of the substrate 2 may correspond to the opening size of the frame 3 and be slightly larger than the frame 3, or may be equal to the opening size of the frame 3, but is not limited thereto.
[0067] In the present embodiment, the substrate 2 is provided with a plurality of light-emitting units 21 on one side facing the sensing module 5, and an interface 22 suitable for being electrically connected to the sensing module 5 is provided on the other opposite side. The interface 22 is, for example, a flexible flat cable (FFC) connector, but is not limited thereto. In another embodiment (not shown), the interface 22 can be provided on the same side as the plurality of light-emitting units 21. The aforementioned light-emitting units 21 are provided on the substrate 2, for example, next to the contact switch 4. When the substrate 2 is combined with the frame 3, the light-emitting units 21 are, for example, surrounded by the frame 3. The interface 22 is, for example, located at the edge of the substrate 2, but is not limited thereto.
[0068] The light emitting unit 21 is suitable for projecting a light beam L toward the sensing module 5, and under the action of the sensing module 5, a suspended optical image P is formed in front of the button 1 (see Figure 5 , which will be described in detail later). The light emitting unit 21 is, for example, a light emitting diode (LED), but is not limited thereto. The wavelength of the light beam L generated by the light emitting unit 21 is not limited, and may be, for example, visible light.
[0069] According to this embodiment, the frame 3 is, for example, a rectangular frame. The shape of the frame 3 corresponds to, for example, the shape of the substrate 2 or the sensing module 5, but is not limited thereto. The size of the internal space surrounded by the frame 3 can be set according to requirements, for example, to be sufficient to accommodate components such as the contact switch 4, the sensing module 5, the middle frame 6, and the light-emitting unit 21. The size of the opening 31 of the frame 3 corresponds to, for example, the size of the sensing module 5 and is larger than the size of the opening 71 on the trim 7, but is not limited thereto. The material of the frame 3 is not limited and can be selected according to requirements.
[0070] like Figure 1 As shown, in this embodiment, the button 1 includes, for example, a middle frame 6, which is adapted to be pushed by the sensing module 5 and contact the contact switch 4 when the button 1 is pressed (see Figure 6 , Figure 7). The middle frame 6 is disposed between the substrate 2 and the sensing module 5. The shape of the middle frame 6 is not limited, and for example, it corresponds to the shape of the frame body 3. For example, a plurality of elastic arms 61 are disposed on the outer periphery of the middle frame 6. The elastic arms 61 extend obliquely from the middle frame 6 toward the substrate 2, so that when the middle frame 6 is not subjected to an external force, there is a gap between the middle frame 6 and the contact switch 4 (see Figure 6 The interval between the middle contact switch 4 and the inverted T-shaped middle frame 6 above it, where some lines are deleted for the convenience of indicating the interval).
[0071] In this embodiment, the contact switch 4 is, for example, a tactile switch (or touch switch, Tactile Switches), which is suitable for generating a first control signal when being touched by the sensing module 5 or the middle frame 6, but the contact object is not limited thereto.
[0072] In another embodiment not shown in the figure, the contact switch 4 is, for example, a limit switch and includes, for example, a cap member (not shown) for contacting the sensing module 5. The cap member is adapted to move and generate a first control signal when pushed by the sensing module 5 or the middle frame 6. In some embodiments where the contact switch 4 is a limit switch, when the contact switch 4 is combined with the substrate 2, the cap member can be pushed away from the substrate 2 by an elastic member (not shown) in the contact switch 4. Therefore, in some embodiments of this type of embodiment, when the button 1 is not subjected to an external force, the contact switch 4 can directly contact the sensing module 5 or the middle frame 6. As long as the contact switch 4 moves to the bottom of its movable stroke when the cap member approaches the substrate 2, the first control signal is generated. It should be understood that in other embodiments, when the button 1 is not subjected to an external force, the limit switch as the contact switch 4 may not contact the sensing module 5 or the middle frame 6 until the button 1 is subjected to an external force and contacts the sensing module 5 or the middle frame 6.
[0073] The difference between the first control signal generated by the contact switch 4 and the second control signal generated by the conductive layer 51C is that the sources of the generated signals are different. However, for the device equipped with the button 1, the first control signal and the second control signal can be instructions for executing the same function, but not limited to this.
[0074] Figure 6 , Figure 7 for Figure 1 The schematic diagram of the operation of the button of the embodiment along the AA section line. Figure 6 , Figure 7 As shown, the middle frame 6 is suitable for changing the shape of the elastic arm 61 when the sensing module 5 is pushed by the user, more specifically, when it is pushed by the optical imaging component 56 at the bottom of the sensing module 5, thereby moving toward the substrate 2 and contacting or pushing the contact switch 4 on the substrate 2.
[0075] like Figure 1and Figure 4 As shown, in this embodiment, the sensing module 5 is suitable for receiving induction to generate the second control signal, and is suitable for cooperating with the contact switch 4 to generate the first control signal. The sensing module 5, for example, roughly corresponds to the shape of the opening 31 and covers the entire opening 31, but is not limited thereto. In this embodiment, the sensing module 5, for example, includes a sensing portion 51 suitable for forming a sensing area R and an optical imaging component 56.
[0076] In this embodiment, the sensing module 5 has a sensing portion 51. The sensing portion 51 is suitable for forming the sensing region R of the sensing module 5. In this embodiment, the sensing portion 51 is the portion where the sensing module 5 is exposed to the trim panel 7 (see FIG. Figure 4 ) and can sense the approach of a finger and the part that can be touched by the finger, but is not limited to this. The sensing portion 51 corresponds to the shape of the opening 71 on the decorative plate 7 and is, for example, cylindrical, but can be set according to needs (see below for details). Figure 8 , Fig. 9 Please refer to Figure 2 and Figure 3 The sensing portion 51 is composed of a plurality of layers. In the following, since these layers not only constitute the sensing portion 51 but also constitute other parts of the sensing module 5 in this embodiment, these layers will be described first.
[0077] In this embodiment, the layer body includes, for example, a support plate 51A, a membrane 51B, and a conductive layer 51C.
[0078] like Figures 1 to 4 As shown, in the present embodiment, the support plate 51A is, for example, located below the conductive layer 51C and the diaphragm 51B, and is suitable for providing support when the sensing module 5 is pressed, which helps to improve the durability of the conductive layer 51C and the diaphragm 51B. Since the support plate 51A is located below the diaphragm 51B and the conductive layer 51C, the thickness of the support plate 51A does not affect the range of the sensing area R formed by the conductive layer 51C. In the case of being able to provide support, the thickness or shape of the support plate 51A can be designed according to functional requirements. The material of the support plate 51A is, for example, acrylic resin, and is light-transmissive, but is not limited thereto. The support plate 51A is, for example, formed by placing the assembly of the diaphragm 51B and the conductive layer 51C into a mold (not shown) and then performing plastic injection, but is not limited thereto.
[0079] like Figure 3 As shown, the membrane 51B is, for example, a layer covering one side of the support plate 51A. The membrane 51B is, for example, a flexible membrane 51B, and is, for example, an electronic soft board such as a flexible printed circuit board (Flexible Printed Circuit Board) or a flexible flat cable (Flexible Flat Cable, FFC), and is, for example, a light-transmitting element, but is not limited thereto.
[0080] The conductive layer 51C is suitable for forming the sensing region R. The conductive layer 51C of the sensing portion 51 is, for example, a layer that completely covers the surface of one side of the diaphragm 51B, and the conductive layer 51C can be a light-transmitting layer composed of metal wires that are difficult to see with the naked eye, and can form a transparent conducting film together with the diaphragm 51B. The material of the conductive layer 51C includes, for example, indium tin oxide (ITO), graphene, aluminum-doped zinc oxide (Al-doped ZnO), carbon nanotubes (CNT) or other conductive polymer materials or a combination thereof. In some embodiments, in addition to the conductive layer 51C, another conductive line (not shown) may also be provided on the diaphragm 51B.
[0081] like Figure 3 and Figure 4 As shown, in this embodiment, the conductive layer 51C and the diaphragm 51B constituting the sensing portion 51 are covered on the side of the support plate 51A away from the substrate 2, and the sensing portion 51 is covered on the opening 31 of the frame 3. Therefore, the range of the sensing area R formed by the sensing portion 51 is in the space in front of the sensing module 5 ( Figure 4 In other words, in the space in front of the portion exposed in the trim panel 7, the button 1 will not have different sensing distances due to different positions.
[0082] like Figure 2 and Figure 3 As shown, in this embodiment, the layer of the sensing portion 51 further includes a pattern layer 51D. The pattern layer 51D is, for example, located between the diaphragm 51B and the conductive layer 51C, but is not limited thereto. The pattern layer 51D is, for example, a layer formed by light-transmissive ink or light-opaque ink, and is suitable for forming a pattern 510 presented on the sensing portion 51. The pattern 510 is, for example, arranged according to the shape of the sensing portion 51, but is not limited thereto. In an embodiment not shown in the figure, the pattern layer 51D may be provided with a light-transmissive opening, for example.
[0083] like Figure 1 and Figure 2 As shown, in this embodiment, the sensing module 5 further includes an outer flange 52. The outer flange 52 is suitable for adjusting the outer contour of the sensing module 5 so that the sensing portion 51 is not limited by the contour shape of the opening 31. Figure 2As shown, the outer flange 52 is formed by extending the support plate 51A, and the outer flange 52 surrounds the sensing portion 51 and extends parallel to the substrate 2 (the surface of the sensing portion 51), and is located on the side of the sensing portion 51 close to the substrate 2 on the extension line of the direction D, so that the sensing portion 51 presents a convex block protruding toward the side away from the substrate 2. The outer flange 52 is suitable for covering the opening 31 of the frame 3 together with the sensing portion 51, and is covered by the decorative plate 7 during assembly and is not exposed to the opening 71 of the decorative plate 7. In the direction of the sensing module 5 toward the substrate 2 (opposite to Figure 1 In the direction D in the middle), the thickness of the outer flange 52 is, for example, smaller than the thickness of the sensing portion 51.
[0084] In this embodiment, because the thickness of the outer flange 52 is different from the thickness of the sensing portion 51, the sensing module 5 further forms a step portion 53 between the outer flange 52 and the sensing portion 51, but the invention is not limited thereto. The height of the step portion 53 may correspond to the thickness of the decorative plate 7, so that the surface of the sensing portion 51 is flush with the surface of the decorative plate 7, but the invention is not limited thereto. The step portion 53 is, for example, formed by extending the support plate 51A and is located between the sensing portion 51 and the outer flange 52.
[0085] It should be understood that, because the outer flange 52 and the step portion 53 are only used to adjust the contours and surfaces between the sensing part 51, the opening 31 on the frame 3 and the opening 71 on the decorative plate 7 in this embodiment, the sensing module 5 may not have the outer flange 52 and the step portion 53, or only have the outer flange 52 in the embodiment not shown in the figure. In addition, although the outer flange 52 and the step portion 53 are mainly formed by extending the support plate 51A, the relationship between the two and other layers such as the diaphragm 51B and the conductive layer 51C is not particularly limited. In other words, in some embodiments of the present invention, the diaphragm 51B and the conductive layer 51C can completely cover the outer flange 52 and the step portion 53 and change the size and shape of the sensing range R, but in other embodiments, the conductive layer 51C and the diaphragm 51B can also partially cover the outer flange 52 and the step portion 53 (see the connecting portion 55 described later) and make the sensing range R mainly only affected by the sensing part 51.
[0086] like Figure 2 As shown in FIG. 1 , in this embodiment, the sensing module 5 has a plurality of fixing portions 54. The fixing portions 54 are suitable for fixing the optical imaging component 56 in the sensing module 5 described later. The fixing portions 54 are, for example, formed by the support plate 51A along a direction perpendicular to the surface of the substrate 2 ( Figure 1 The fixing portion 54 is a member extending toward the substrate 2 (in the opposite direction of the center direction D). In this embodiment, the fixing portion 54 is, for example, extending from the outer flange 52 toward the substrate 2, but the invention is not limited thereto. During manufacturing, the fixing portion 54 is, for example, integrally formed with the sensing portion 51 and the outer flange 52, but the invention is not limited thereto.
[0087] like Figure 2As shown, in this embodiment, the fixing portion 54 is provided with a guide rail 54A extending along the direction D, for example, but the present invention is not limited thereto. The guide rail 54A is suitable for slidingly connecting to the inner wall surface of the frame 3 and guiding the sensing module 5 to slide relative to the inner wall surface of the frame 3. In some embodiments, since the guide rail 54A is a protrusion that slides on the frame 3, the top surface or bottom surface of the guide rail 54A can be pushed against by the wall surface of the frame 3 (please refer to Figure 2 The sensing module 5 is prevented from being separated from the frame 3 along the direction D, but the detailed design is not limited thereto.
[0088] like Figure 2 As shown, in this embodiment, the fixing portion 54 has a claw 54B at one end away from the sensing portion 51. The claw 54B is, for example, a block protruding toward the center of the support plate 51A. The claw 54B is suitable for hooking the optical imaging component 56 described later when assembled, but the detailed design of how the fixing portion 54 fixes the optical imaging component 56 is not limited thereto.
[0089] like Figure 1 , Figure 3 and Figure 4 As shown, in this embodiment. The sensing module 5, for example, has a connecting portion 55, and the sensing portion 51 can be electrically connected to the interface 22 of the substrate 2 through the connecting portion 55. The connecting portion 55, for example, is composed of a diaphragm 51B extending from the sensing portion 51 and a conductive layer 51C extending from the sensing portion 51, but is not limited thereto. Specifically, in this embodiment, the connecting portion 55 extends from the surface of the sensing portion 51 through the step portion 53 and the surface of the outer flange 52 to the outside of the outer flange 52. During assembly, the connecting portion 55, for example, passes through the notch 301 located on one side of the opening 31 of the frame 3, and crosses the frame 3 to connect to the interface 22 of the substrate 2, but is not limited thereto.
[0090] Through the above structure, since the connection part 55 is directly formed by the diaphragm 51B and the conductive layer 51C extending from the sensing part 51, the sensing module 5 can be electrically connected to the substrate 2 through the conductive layer 51C on the connection part 55, and no additional conductive line is required. Since the connection part 55 passes through the space surrounded by the frame 3, there can be a large space for gradual bending to prevent the connection part 55 from breaking due to excessive bending. It should be understood that in some embodiments, the diaphragm 51B constituting the connection part 55 may also have a thicker and non-translucent line electrically connected to the conductive layer 51C of the sensing part 51, so that the connection part 55 does not necessarily need to have a conductive layer 51C.
[0091] There is no restriction on the connection method between the connecting portion 55 and the substrate 2. In the embodiment in which the support plate 51A not shown in the figure is manufactured by injection molding, because the extension direction of the diaphragm 51B that subsequently constitutes the connecting portion 55 can be adjusted before the support plate 51A is manufactured, in the embodiment not shown in the figure, the connecting portion 55 can be a component that passes through the outer flange 52 on an axis that is the same as the direction D, and is connected to the substrate 2 in the space surrounded by the middle frame 6 or the frame body 3, and does not necessarily have to be connected to the substrate 2 from the outside of the frame body 3.
[0092] like Figures 1 to 4 As shown, in this embodiment, the sensing module 5 further includes an optical imaging component 56. The optical imaging component 56 is disposed on a side of the sensing portion 51 close to the substrate 2 through the fixing portion 54, for example. The support plate 51A, the membrane 51B and the conductive layer 51C are, for example, all light-transmissive members, so that the light beam L generated by the light-emitting unit 21 can pass through the support plate 51A, the membrane 51B and the conductive layer 51C after passing through the optical imaging component 56 and form a suspended optical image P in front of the button 1 (see FIG. Figure 4 ), in other words, the sensing module 5 in this embodiment is not only suitable for receiving induction to generate the second control signal and suitable for matching with the contact switch 4 to generate the first control signal, but also suitable for forming a suspended optical image P.
[0093] The shape of the optical imaging component 56 corresponds to the shape of the sensing unit 51, but is not limited thereto. The optical imaging component 56 includes, for example, a plurality of plate-shaped components, such as an imaging unit 56A, a lens array 56B, and an optical path transformation unit 56C.
[0094] The imaging unit 56A faces the substrate 2 relative to the lens array 56B. The imaging unit 56A is, for example, a negative film, a mask, or a layer film with a preset pattern, but is not limited thereto. The preset pattern on the imaging unit 56A corresponds to the suspended optical image P to be presented after the light beam L passes through the optical imaging component 56. The position of the suspended optical image P corresponds to the position of the sensing unit 51, for example. The image content of the suspended optical image P is not limited, for example, it corresponds to the pattern required by the device where the button 1 is installed, such as: a number indicating the elevator floor or a pattern indicating the intention of the operation instruction input through the button 1.
[0095] The lens array 56B is, for example, a double-sided convex lens array 56B, which is suitable for forming a three-dimensional image of the light beam L passing through. In other embodiments not shown in the figure, the lens array 56B can also be a single-sided convex lens array 56B, which can be set according to needs. The material of the lens array 56B is not limited, for example, it can be glass or transparent acrylic resin. In some embodiments, the lens array 56B and the support plate 51A can be manufactured at the same time and integrally formed, but it is not limited to this.
[0096] The optical path conversion unit 56C is disposed on one side of the imaging unit 56A and positions the imaging unit 56A between the lens array 56B and the optical path conversion unit 56C. The optical path conversion unit 56C is suitable for diffusing and / or converting the light beam L into a parallel light beam to improve the brightness of the suspended optical image P. The optical path conversion unit 56C is, for example, a Fresnel lens. The material of the optical path conversion unit 56C can refer to the description of the lens array 56B, but is not particularly limited.
[0097] pass Figure 6 , Figure 7 It should be understood from the above description that, although in this embodiment, the optical imaging component 56 pushes against the middle frame 6 to contact the contact switch 4, in an embodiment not shown in the figure, the sensing module 5 may not have the above optical imaging component 56. Alternatively, the contact position between the middle frame 6 and the sensing module 5 may be changed, such as the fixing portion 54 to indirectly trigger the contact switch 4 without the optical imaging component 56.
[0098] Through the above method, in addition to allowing the diaphragm 51B to be directly located on the surface of the sensing module 5 so that the conductive layer 51C is as close to the user's finger as possible while being covered and protected by the diaphragm 51B, the thickness or material of the support plate 51A can be adjusted so that the sensing module 5 provides sufficient support when it is an element pressed by the user's finger. When making the support plate 51A, a fixing element (fixing part 54) for fixing the optical imaging component 56 can also be made without the need to set up additional fixing elements. This can also avoid using glue or the like to assemble the optical imaging component 56 and affect the optical performance of the optical imaging component 56. At the same time, through such technology, the conductive structure formed by the diaphragm 51B and the conductive layer 51C can avoid the problem of circuit breakage caused by excessive bending angle at the step portion 53, and can make the diaphragm 51B and the conductive layer 51C as thin as possible.
[0099] Figure 8 is a schematic diagram of a contactless button according to an embodiment of the present invention, Fig. 9 for Figure 8 A three-dimensional schematic diagram of a sensing module of an embodiment. Figure 1 , Figure 8 and Fig. 9 As shown, the non-contact button 1A provided by the present invention is different from the aforementioned button 1 in that the shape of the sensing portion 51' of the sensing module 5' is different (changed to a rectangle), and the other difference is that the non-contact button 1A does not have the contact switch 4 and the middle frame 6. Therefore, the design of the non-contact button 1A can refer to the description of the aforementioned button 1.
[0100] Based on the above description, the contactless button of the present invention can form a uniform sensing range in front of the contactless button, improve the sensing accuracy, and does not require additional components (such as an outer frame) to accommodate the sensing element, because the conductive layer used to form the sensing area in the sensing part covering the opening is configured to completely cover the support plate of the sensing part. In addition, by arranging the conductive layer between the diaphragm and the support plate, and also arranging the diaphragm on the outer surface of the sensing part (the outer surface of the contactless button, which is the side away from the substrate), the conductive layer can be protected by the diaphragm while providing sufficient support through the support plate. Since the diaphragm and the conductive layer are supported by the support plate, the thickness of the diaphragm can be thinned, so that the conductive layer is as close to the front of the contactless button as possible, and the sensing range can be prevented from being affected by the thickness of the support plate, thereby increasing the sensing range of the contactless button.
[0101] In addition, in some embodiments, the sensing module can be integrated with an optical imaging component that generates a suspended optical image through a fixed portion formed by the support plate. In some embodiments, because a flexible membrane and a conductive layer are used to form a connection portion that electrically connects the sensing portion to the substrate, in addition to not requiring an additional connection line, the portion extending to the connection portion can be prevented from being damaged at the bend (step difference) of the sensing module, thereby increasing the freedom of the sensing module in terms of appearance design.
[0102] The button provided by the present invention has the same advantages as the non-contact button.
[0103] Although the present invention has been disclosed as above by way of embodiments, it is not intended to limit the present invention. Those skilled in the art, including those with ordinary knowledge, may make slight changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be determined by the scope of the attached patent application.
Claims
1. A non-contact button, characterized in that: include: a substrate; A frame body is disposed on the substrate, and the frame body has an opening on a side away from the substrate; as well as A sensing module is suitable for forming a sensing area. The sensing module has a sensing portion covering the opening. The sensing portion has a plurality of layers. The layers include: a support plate; a membrane covering a surface of the support plate away from the substrate; and A conductive layer is located between the diaphragm and the support plate and completely covers the diaphragm. The conductive layer is electrically connected to the substrate and is suitable for forming the sensing area.
2. A button, characterized in that: include: a substrate; A frame body is disposed on the substrate, and the frame body has an opening on a side away from the substrate; A contact switch, disposed on the substrate, adapted to generate a first control signal; as well as A sensing module, adapted to push against the contact switch to generate the first control signal, and adapted to form a sensing area for generating a second control signal, the sensing module having a sensing portion covering the opening, the sensing portion having a plurality of layers, the layers comprising: a support plate; a membrane completely covering a surface of the support plate away from the substrate; and A conductive layer is located between the diaphragm and the support plate and completely covers the diaphragm. The conductive layer is electrically connected to the substrate and is suitable for forming the sensing area.
3. The button according to claim 2, characterized in that The support plate, the membrane and the conductive layer are light-transmissive.
4. The button according to claim 3, characterized in that The sensing module further includes an optical imaging component, which is located on a side of the support plate close to the substrate. The sensing module is suitable for converting a light beam provided by a light-emitting unit on the substrate into a suspended optical image through the optical imaging component, and is suitable for pushing the contact switch through the optical imaging component.
5. The button according to claim 4, characterized in that The optical imaging component includes a lens array, and the lens array is integrally formed with the support plate.
6. The button according to claim 4, characterized in that The sensing module has a plurality of fixing parts, which extend from the supporting plate toward the substrate along a direction perpendicular to the surface of the substrate and are suitable for fixing the optical imaging component.
7. The button according to claim 6, characterized in that The sensing module further has an outer flange and a step portion, wherein the outer flange is extended from the support plate, surrounds the sensing portion and is parallel to the substrate, the fixing portion is located at the outer periphery of the outer flange, and in a direction of the sensing module toward the substrate, the thickness of the outer flange is less than the thickness of the sensing portion, and the step portion is extended from the support plate and is located between the sensing portion and the outer flange.
8. The button according to claim 7, characterized in that in, The diaphragm and the conductive layer completely cover the outer flange and the step portion.
9. The button according to claim 7, characterized in that The diaphragm and the conductive layer partially cover the outer flange and the step portion.
10. The button according to claim 7, characterized in that The membrane is a flexible membrane, and the sensing module further comprises a connecting portion, which is connected to the outer flange and is composed of the membrane extending from the sensing portion and the conductive layer extending from the sensing portion. The sensing portion is electrically connected to the substrate through the connecting portion.