LED-based UV photocuring illumination intensity adjusting method, system and terminal

Abstract

The invention relates to an LED-based UV photocuring illumination intensity adjusting method, system and terminal, and relates to the technical field of UV photocuring, and the method comprises the following steps: obtaining the sample type of a to-be-irradiated sample; determining an illumination intensity value and illumination time according to the sample type; calculating the difference between the illumination intensity value and a preset reference illumination value as an illumination deviation value; determining whether the illumination intensity value is greater than a reference illumination value; if the illumination intensity value is not greater than the reference illumination value, determining adjustment power according to the illumination deviation value; calculating operation power according to the adjustment power and preset reference power, and irradiating at the operation power; if the illumination intensity value is larger than the reference illumination value, the lifting distance is determined according to the illumination deviation value, and lifting irradiation is conducted according to the lifting distance and preset reference power. The device has the effect of improving the curing quality during sample irradiation.

Description

Technical Field

[0001] The present invention relates to the technical field of UV light curing, and in particular to a method, system and terminal for adjusting light intensity of UV light curing based on LED. Background Art

[0002] UV light curing is a technology that uses ultraviolet light of a specific wavelength to instantly polymerize liquid prepolymers and monomers into solid forms. It is widely used in electronics, medical care, automobiles, printing, 3D printing, and daily necessities production.

[0003] When UV light curing is required for the sample, the sample to be irradiated is manually placed in the irradiation area, and the sample is analyzed to know the corresponding light intensity of UV light required for the sample. The light intensity corresponding to the UV light is manually set by manually rotating the adjustment knob or sliding rod to irradiate the sample.

[0004] When manually adjusting the corresponding light intensity of the UV light, there are inaccurate operations or operating errors in the manual adjustment, which leads to inaccurate light intensity corresponding to the UV light, thereby reducing the curing quality of the sample when it is irradiated. Summary of the invention

[0005] In order to improve the curing quality of a sample during irradiation, the present invention provides a method, system and terminal for adjusting the illumination intensity of UV light curing based on LED.

[0006] In a first aspect, the present invention provides a method for adjusting the light intensity of UV light curing based on LED, which adopts the following technical solution:

[0007] A method for adjusting light intensity of UV light curing based on LED, comprising:

[0008] Obtaining the sample type of the sample to be irradiated;

[0009] Determine the light intensity and illumination time according to the sample type;

[0010] Calculate the difference between the light intensity value and the preset reference light value as the light deviation value;

[0011] Determine whether the light intensity value is greater than the reference light value;

[0012] If the light intensity value is not greater than the reference light value, the adjustment power is determined according to the light deviation value;

[0013] The operating power is calculated according to the adjusted power and the preset reference power, and irradiation is performed at the operating power;

[0014] If the light intensity value is greater than the reference light value, the lifting distance is determined according to the light deviation value, and the lifting irradiation is performed according to the lifting distance and the preset reference power.

[0015] By adopting the above technical solution, the sample type is understood to obtain the light intensity value and the light deviation value, and then the light intensity value is compared with the reference light value. The irradiation power is adjusted or the sample is lifted according to the comparison result, so that the sample can be automatically cured, reducing the situation of inaccurate operation or operation errors caused by manual adjustment, so as to improve the curing quality of the sample during irradiation.

[0016] Optionally, the method after determining the lifting distance includes:

[0017] Get the number of placements for the sample type;

[0018] According to the sample type, the sample area can be retrieved;

[0019] Determine the detection illumination area according to the lifting distance and the preset reference illumination area;

[0020] Determine the maximum placement quantity based on the detection illumination area and sample area;

[0021] When the maximum placement quantity does not exceed the placement quantity, the total placement area is determined based on the placement quantity and the sample area;

[0022] Determine the number of light sources, the distance between light sources and the placement position of the distance between light sources according to the total placement area and the detection illumination area, and call the irradiation device with the number of light sources to move according to the distance between light sources and the placement position of the distance between light sources;

[0023] Determine the overlapping light intensity value according to the light intensity value and the number of light sources;

[0024] The overlapping illumination sample type is determined according to the overlapping illumination intensity value and illumination time, and the intersection area is determined according to the light source spacing and the detection illumination area;

[0025] The number of overlapping samples is determined based on the intersection area and the type of overlapping irradiation samples, and they are placed using a preset placement method and then lifted for irradiation.

[0026] By adopting the above technical solution, the detection illumination area and the maximum placement number are understood to obtain the overlapping illumination intensity value and the intersection area, and the overlapping irradiation sample type and the overlapping sample number are placed in the intersection area, so that other samples can be irradiated while completing the curing of the sample type, thereby improving the efficiency of sample curing.

[0027] Optional, preset placement methods include:

[0028] Update the detection illumination area according to the light source spacing, the light source spacing placement position and the intersection area;

[0029] Determine the placement position of the overlapping samples according to the number of overlapping samples, the intersection area and the preset center point of the placement plate, and place the overlapping irradiation sample types according to the overlapping sample placement position;

[0030] Calculate the average value based on the number of light sources and the number of placements;

[0031] Determine if the mean is an integer;

[0032] If the average value is an integer, the irradiation placement position is determined according to the average value, the sample area and the updated detection illumination area, and the sample type is placed according to the irradiation placement position;

[0033] If the average value is not an integer, the irradiation placement position is determined according to the placement quantity, the sample area and the updated detection illumination area, and the sample type is placed according to the irradiation placement position;

[0034] Determine the offset amount on both sides of the center point of the placement plate according to the irradiation placement position and the center point of the placement plate, and use the side corresponding to the maximum offset amount as the marked side;

[0035] According to the sample type, the sample weight value can be retrieved;

[0036] The tilting force and tilting direction of the preset placement plate are determined according to the sample weight value and the marked side, and the operation of the placement plate is controlled by the tilting force and tilting direction.

[0037] By adopting the above technical solution, the tilting force and tilting direction are obtained by understanding the average calculated by the number of light sources and the number of placements, and the placement plate is controlled to operate with the tilting force and tilting direction, so that the placement plate can be lifted in a balanced state.

[0038] Optionally, the method after determining the marked side further includes:

[0039] Determine the sample friction coefficient based on the sample type and the preset placement plate material specifications;

[0040] Determine the friction coefficient of overlapping samples according to the overlapping irradiation sample type and the preset placement plate material specifications;

[0041] According to the friction coefficient of the sample and the friction coefficient of the overlapping sample, the minimum friction coefficient is selected as the test friction coefficient;

[0042] Determine the maximum tilt angle by testing the friction coefficient;

[0043] Determine the placement tilt angle according to the sample weight value, the offset quantity and the irradiation placement position;

[0044] Determine the lifting force corresponding to each angle based on the maximum tilt angle and the marked side;

[0045] Determine whether the maximum tilt angle exceeds the placement tilt angle;

[0046] When the maximum tilt angle exceeds the placement tilt angle, the sample type and the overlapping irradiation sample type are continuously lifted and irradiated;

[0047] When the maximum tilt angle does not exceed the placement tilt angle, the difference between the maximum tilt angle and the placement tilt angle is calculated and used as the angle deviation value;

[0048] The remaining lifting force is determined according to the angle deviation value and the lifting force, and the placement plate is lifted.

[0049] By adopting the above technical solution, the friction coefficient of the sample type and the overlapping irradiation sample type is understood to obtain the maximum tilt angle and the placement tilt angle, and then the maximum tilt angle and the placement tilt angle are compared. The placement plate is lifted based on the remaining lifting force obtained according to the comparison result, thereby reducing the energy consumption during lifting while maintaining stable irradiation of the sample.

[0050] Optional, preset placement methods also include:

[0051] If the average value is not an integer, the type of remaining samples is determined based on the average value and the number of samples placed, and the weight value of the remaining samples is retrieved based on the type of remaining samples;

[0052] Determine the total weight of the overlapping samples based on the type of overlapping irradiated samples and the number of overlapping samples;

[0053] Determine different offset distances and the offset change weight values ​​corresponding to the offset distances according to the total weight of the overlapping samples, the intersection area and the center point of the placement plate;

[0054] determining whether the offset change weight value is less than the remaining sample weight value;

[0055] When the offset change weight value is not less than the remaining sample weight value, the offset distance corresponding to the offset change weight value that is greater than the remaining sample weight value and has the smallest value is selected as the mark offset distance according to the offset change weight value, and the overlapping irradiation sample type is moved by the mark offset distance;

[0056] When the offset change weight value is less than the remaining sample weight value, the number of overlapping samples is updated according to the remaining sample weight value and the offset change weight value, and the updated number of overlapping samples is used for placement.

[0057] By adopting the above technical solution, the total weight of the overlapping samples is understood to obtain the offset change weight value, and then the offset change weight value is compared with the remaining sample weight value. According to the comparison result, the overlapping irradiated sample type is controlled to move or the number of overlapping irradiated sample types is reduced and rearranged, so that the placement plate can be lifted in a balanced manner.

[0058] Optionally, the method for placing the updated number of overlapping samples includes:

[0059] Determine the maximum load-bearing weight based on the lifting distance;

[0060] The total weight of the overlapping samples is updated according to the updated number of overlapping samples and the type of overlapping irradiated samples;

[0061] Determine the total weight of the samples according to the placement quantity and the sample weight value, and calculate the sum of the total weight of the samples and the updated total weight of the overlapping samples as the total placement weight;

[0062] When the total weight exceeds the maximum load, the difference between the total weight and the maximum load is calculated and used as the weight deviation value;

[0063] Determine the remaining sample types and the remaining irradiation times corresponding to the remaining sample types according to the weight deviation value and the overlapping light intensity value, select the shortest remaining irradiation time from the different remaining irradiation times as the marked irradiation time, and use the remaining sample types corresponding to the marked irradiation time as new overlapping irradiation sample types;

[0064] Update the number of overlapping samples and place them according to the new overlapping irradiation sample type, intersection area and weight deviation value;

[0065] Determine the lifting speed according to the marked irradiation time and lifting distance, lift at the lifting speed, and continue irradiating at the reference power;

[0066] Get the focusing distance and detection lifting distance;

[0067] Determine focus adjustment parameters according to the overlapping illumination intensity value, the focus distance and the detection lift distance and output them to a preset dynamic focus device;

[0068] When the detection lifting distance is consistent with the lifting distance, the new overlapping irradiation sample type is removed and the dynamic focusing device is stopped.

[0069] By adopting the above technical solution, the total placement weight and the maximum bearing weight are understood to obtain the weight deviation value, and the weight deviation value and the overlapping light intensity value are used to obtain new overlapping irradiation sample types and overlapping sample quantities and place them. Then, the focusing distance and the detection lifting distance are used to obtain the focusing adjustment parameters and output them to the dynamic focusing device, so that the weight on the placement plate can be reduced during the lifting process of the placement plate.

[0070] Optionally, the method after lifting at the lifting speed includes:

[0071] Obtaining image detection information of a preset placement board;

[0072] Determine the curvature of the bend according to the image detection information and the preset reference image information;

[0073] Calculate the difference between the bending curvature and the preset reference bending curvature as the curvature deviation value;

[0074] Determine whether the bending arc exceeds the reference bending arc;

[0075] If the bending curvature exceeds the reference bending curvature, the maximum lifting weight is determined according to the curvature deviation value and the preset placement plate material specifications;

[0076] When the maximum lifting weight is less than the total placement weight, the placement plate is controlled to stop lifting and a preset prompt message is output;

[0077] If the bending arc does not exceed the reference bending arc, obtain the lifting weight value used in the placement plate history;

[0078] Determine the remaining estimated usage time based on the lifting weight value, arc deviation value and total placement weight;

[0079] Get the historical usage time of the placement board;

[0080] Determine the lifting time based on the lifting speed and lifting distance;

[0081] The detection usage time is determined by the preset lifting inspection method based on the historical usage time, lifting time, bending curvature and total placement weight;

[0082] When the detected usage time is consistent with the remaining estimated usage time, a preset warning message is output.

[0083] By adopting the above technical solution, the bending curvature is compared with the reference bending curvature to output prompt information or obtain the detected usage time and the remaining estimated usage time, and when the detected usage time is consistent with the remaining estimated usage time, a warning message is output, thereby prompting the operator to replace the placement plate in time.

[0084] Optional, pre-set jacking inspection methods include:

[0085] Determine the lifting force based on the bending arc and the total weight placed;

[0086] The total lifting weight is calculated based on the total placement weight and the preset placement plate weight value;

[0087] Determine the lifting reaction force based on the lifting speed and the total weight of the lift;

[0088] Update the lifting reaction force according to the detected lifting force and the preset lifting position;

[0089] The total usage time is determined based on the historical usage time, the updated lifting reaction force and the lifting time, and the difference between the total usage time and the preset benchmark usage time is calculated as the detection usage time.

[0090] By adopting the above technical solution, the detection usage time is obtained by detecting the lifting force, the lifting position, the historical usage time, the lifting time and the benchmark usage time, thereby improving the accuracy of the detection usage time of the placement plate.

[0091] In the second aspect, the present application provides a UV light curing light intensity adjustment system based on LED, which adopts the following technical solution:

[0092] A UV light curing light intensity adjustment system based on LED, comprising:

[0093] The acquisition module is used to obtain the sample type, placement quantity, focus distance, detection lifting distance, image detection information, lifting weight value and historical usage time;

[0094] A memory for storing a program of a method for adjusting light intensity of UV light curing based on LED;

[0095] The processor is used to load, execute and implement the program stored in the memory.

[0096] In a third aspect, the present application provides a smart terminal, which adopts the following technical solution:

[0097] An intelligent terminal comprises a memory and a processor. The memory stores a computer program for a method for adjusting the light intensity of UV light curing based on LED, which can be loaded and executed by the processor.

[0098] In summary, the present application includes at least one of the following beneficial technical effects:

[0099] 1. By understanding the sample type to adjust the irradiation power or lift the sample, the sample can be automatically cured, reducing the inaccurate operation or operating errors caused by manual adjustment, so as to improve the curing quality of the sample during irradiation;

[0100] 2. By placing the overlapping irradiation sample types and the overlapping sample numbers in the intersection area, it is possible to irradiate other samples while completing the curing of the sample type, thereby improving the efficiency of sample curing;

[0101] 3. The weight deviation value and the overlapping light intensity value are used to obtain new overlapping irradiation sample types and overlapping sample quantities and place them, and then the dynamic focusing device is controlled to operate with the focusing adjustment parameters, so as to reduce the weight on the placement plate during the lifting process of the placement plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0102] Figure 1 This is a method flow chart of a method for adjusting light intensity of UV light curing based on LED according to an embodiment of the present invention;

[0103] Figure 2 is a flow chart of a method after determining a lifting distance according to an embodiment of the present invention;

[0104] Figure 3 is a method flow chart of a preset placement method according to an embodiment of the present invention;

[0105] Figure 4 It is a flow chart of the method after determining the marked side according to an embodiment of the present invention. DETAILED DESCRIPTION

[0106] The present invention is further described in detail below in conjunction with the accompanying drawings and embodiments.

[0107] Reference Figure 1 The present application discloses a method for adjusting the light intensity of UV light curing based on LED, comprising the following steps:

[0108] Step S100: obtaining the sample type of the sample to be irradiated.

[0109] The sample type refers to the type of sample that needs to be UV cured. The sample type includes the weight value of the sample and the area of ​​the sample that needs to be irradiated. The operator pre-enters the sample type. The UV light is irradiated and displayed by an irradiation device. In this embodiment, the irradiation device is an LED lamp.

[0110] Step S101: Determine the illumination intensity value and illumination time according to the sample type.

[0111] The light intensity value refers to the intensity value of UV light required by the sample type, and the light exposure time refers to the time required to irradiate the sample type with the light intensity value. The light intensity value and light exposure time are matched from the preset irradiation database according to the sample type. The irradiation database stores the intensity values ​​of UV light and the irradiation time corresponding to different sample types. The irradiation database is a manually set database and will not be described in detail here.

[0112] Step S102: Calculate the difference between the light intensity value and the preset reference light value as the light deviation value.

[0113] The reference illumination value is the reference intensity value of UV light irradiation corresponding to the irradiation device set in advance by the technician. The illumination deviation value refers to the deviation value between the illumination intensity value and the reference illumination value, and the difference between the illumination intensity value and the reference illumination value is calculated as the illumination deviation value.

[0114] Step S103: Determine whether the light intensity value is greater than a reference light value.

[0115] By determining whether the illumination intensity value is greater than the reference illumination value, it is determined whether it is necessary to adjust the power of the UV light irradiation or to adjust the distance between the sample and the irradiation device.

[0116] Step S1031: If the light intensity value is not greater than the reference light value, the adjustment power is determined according to the light deviation value.

[0117] Adjusting the power means that the power of the irradiation device needs to be adjusted. When the light intensity value is not greater than the reference light value, it means that the UV light intensity of the irradiation device corresponding to the preset reference power exceeds the sample requirement, so the adjustment power is matched from the irradiation database through the light deviation value. The irradiation database also stores the power or lifting distance corresponding to different light deviation values, which will not be described here. The reference power is the power corresponding to the start of the irradiation device set by the technician.

[0118] Step S104: Calculate the operating power according to the adjustment power and the preset reference power and perform irradiation with the operating power.

[0119] The operating power refers to the power of the irradiation device corresponding to the actual irradiation of the sample. The difference between the reference power and the adjusted power is calculated as the operating power, and the irradiation device is controlled to irradiate with the operating power.

[0120] Step S1032: If the light intensity value is greater than the reference light value, determine the lifting distance according to the light deviation value, and perform lifting illumination with the lifting distance and the preset reference power.

[0121] The lifting distance refers to the distance required to lift the sample. When the light intensity value is greater than the reference light value, it means that the UV light intensity of the irradiation device corresponding to the preset reference power does not meet the sample requirements, so the lifting distance is matched from the irradiation database through the light deviation value. The sample is light-cured by controlling a preset light-curing device. The light-curing device includes a light box, an irradiation device arranged in the box of the light box, a placement plate for placing the sample, and a lifting device for driving the placement plate to rise and fall to change the distance between the irradiation device and the sample. The lifting device is an electric lifting rod. The light box is provided with a slide rail for controlling the sliding of the irradiation device, and the slide rail on the light box can increase the number of irradiation devices according to the situation of the sample.

[0122] Reference Figure 2 , the methods after determining the lift distance include:

[0123] Step S200: Obtain the placement quantity of the sample type.

[0124] The placement quantity refers to the number of sample types placed on the placement plate. The operator pre-enters the sample type and retrieves the corresponding quantity from the system as the placement quantity.

[0125] Step S201: retrieve the sample area according to the sample type.

[0126] The sample area refers to the irradiated area corresponding to the sample type, and the sample area is retrieved from the sample type.

[0127] Step S202: determining the detection illumination area according to the lifting distance and a preset reference illumination area.

[0128] The reference illumination area is the reference area set by the technicians for the illumination device to illuminate the unraised placement board. The detection illumination area refers to the area of ​​the placement board illuminated by the illumination device after it is raised. The detection illumination area is matched from the illumination database by the lifting distance and the reference illumination area. The illumination database also stores the detection illumination areas corresponding to different lifting distances and reference illumination areas, which will not be described in detail here.

[0129] Step S203: Determine the maximum placement quantity according to the detected illumination area and the sample area.

[0130] The maximum placement quantity refers to the maximum number of sample types that can be illuminated on the raised placement plate. The maximum placement quantity is calculated by dividing the quotient of the detection illumination area and the sample area.

[0131] Step S204: When the maximum placement quantity does not exceed the placement quantity, the total placement area is determined according to the placement quantity and the sample area.

[0132] The total placement area refers to the total area that needs to be irradiated for the samples corresponding to the placement quantity. When the maximum placement quantity does not exceed the placement quantity, it means that when the irradiation device irradiates the placement plate at the lifting distance, it is not easy to irradiate all the sample types on the placement plate. Therefore, the product of the placement quantity and the sample area is calculated as the total placement area.

[0133] Step S205: Determine the number of light sources, the distance between light sources and the placement position of the distance between light sources according to the total placement area and the detected illumination area, and call the irradiation device of the number of light sources to move according to the distance between light sources and the placement position of the distance between light sources.

[0134] The number of light sources refers to the total number of irradiation devices required for the total area of ​​the irradiation devices, the light source spacing refers to the spacing between the irradiation devices of the same number of light sources, and the light source spacing placement position refers to the position where the irradiation devices corresponding to the number of light sources and the light source spacing are placed. The number of light sources, the light source spacing, and the light source spacing placement position are matched from the irradiation database by the total placement area and the detected illumination area. The corresponding relationship between the total placement area, the detected illumination area, the number of light sources, the light source spacing, and the light source spacing placement position is also stored in the irradiation database, which will not be elaborated here. In this embodiment, the number of light sources is 2.

[0135] Step S206: determining overlapping light intensity values ​​according to the light intensity values ​​and the number of light sources.

[0136] The overlapping illumination intensity value refers to the intensity value of illumination overlap when the illumination devices with the same number of light sources illuminate. The overlapping illumination intensity value is matched from the illumination database by the illumination intensity value and the number of light sources. The illumination database also stores overlapping illumination intensity values ​​corresponding to different illumination intensity values ​​and the number of light sources, which will not be described in detail here.

[0137] Step S207: determining the overlapping illumination sample type according to the overlapping illumination intensity value and the illumination time, and determining the intersection area according to the light source spacing and the detected illumination area.

[0138] Overlapping irradiation sample types refer to sample types that require overlapping illumination intensity values ​​and illumination times for irradiation. Overlapping irradiation sample types are matched from a preset sample database by overlapping illumination intensity values ​​and illumination times. The sample database stores sample types corresponding to different illumination values ​​and illumination times. The sample database is a manually set database and will not be described in detail here. The intersection area refers to the irradiated area corresponding to the overlapping illumination intensity values. The intersection area is matched from the irradiation database by the light source spacing and the detected illumination area. The irradiation database also stores the intersection areas corresponding to different light source spacings and detected illumination areas, which will not be described in detail here.

[0139] Step S208: Determine the number of overlapping samples according to the intersection area and the type of overlapping irradiation samples, and place them using a preset placement method and then continue lifting and irradiating.

[0140] The number of overlapping samples refers to the number of overlapping irradiation sample types that can be irradiated by the intersection area. The area is retrieved from the overlapping irradiation sample type, and the quotient of the intersection area and the retrieved area is calculated as the number of overlapping samples. The placement method refers to the method of placing the sample type and the overlapping irradiation sample type on the placement board. The specific steps refer to steps S300 to S609. After the sample type and the overlapping irradiation sample type are placed by the placement method, the irradiation device and the placement board are continuously controlled to perform lifting irradiation at the reference power and lifting distance.

[0141] Reference Figure 3 , the preset placement methods include:

[0142] Step S300: updating the detected illumination area according to the light source spacing, the light source spacing placement position and the intersection area.

[0143] The illuminated area is matched from the illumination database by the light source spacing and the light source spacing placement position, and the difference between the illuminated area and the intersection area is calculated as the new detected illumination area. The illumination database also stores the illuminated areas corresponding to different light source spacings and light source spacing placement positions at the lifting distance, which will not be described here.

[0144] Step S301: Determine the overlapping sample placement position according to the number of overlapping samples, the intersection area and the preset center point of the placement plate, and place the overlapping irradiation sample types at the overlapping sample placement position.

[0145] The center point of the placement plate is the center position point of the placement plate set by the technician. The overlapping sample placement position is matched from the preset placement database through the number of overlapping samples, the intersection area and the center point of the placement plate. The placement database stores the overlapping sample placement positions corresponding to different numbers of overlapping samples that are symmetrically placed with the center point of the placement plate within the intersection area. The placement database is a database set manually and will not be described in detail here. In this embodiment, when the number of overlapping samples is an odd number, the center of an overlapping irradiated sample type coincides with the center point of the placement plate. When the number of overlapping samples is an even number, the overlapping irradiated sample types are symmetrically placed around the center point of the placement plate within the intersection area.

[0146] Step S302: Calculate an average value according to the number of light sources and the number of placements.

[0147] The average value refers to the average number of samples of the same type placed in the corresponding irradiation device, and is calculated as the quotient of the number of placements and the number of light sources.

[0148] Step S303: Determine whether the average value is an integer.

[0149] The system determines whether the average value is an integer by identifying whether there is a preset symbol in the average value, thereby determining whether the sample type is placed to balance the placement plate. The preset symbol is a decimal point.

[0150] Step S3031: If the average value is an integer, the irradiation placement position is determined according to the average value, the sample area and the updated detection illumination area, and the sample type is placed according to the irradiation placement position.

[0151] The irradiation placement position refers to the position of the sample type on the placement board corresponding to the updated detection illumination area. If the average value is an integer, it means that the placement of the sample type can balance the placement board. Therefore, the irradiation placement position is matched from the placement database through the average value, sample area and updated detection illumination area. The placement database also stores the placement positions corresponding to different average values, sample areas and detection illumination areas, which will not be described here.

[0152] Step S3032: If the average value is not an integer, determine the irradiation placement position according to the placement quantity, the sample area and the updated detection illumination area, and place the sample type according to the irradiation placement position.

[0153] The irradiation placement position refers to the position where the sample type is placed within the updated detection illumination area. If the average value is not an integer, it means that the placement of the sample type cannot balance the placement plate. Therefore, the irradiation placement position is matched from the placement database by the placement quantity, sample area and updated detection illumination area, and the preset clamping device is controlled to place the sample type at the irradiation placement position. The clamping device is a mechanical arm that clamps the sample.

[0154] Step S304: Determine the offset amount on both sides of the center point of the placement plate according to the irradiation placement position and the center point of the placement plate, and use the side corresponding to the maximum offset amount as the marked side.

[0155] The offset number refers to the number of detection illumination areas placed on both sides of the center point of the placement board. The irradiation placement positions within the detection illumination area on both sides of the center point of the placement board are counted, and the count results are used as the offset number. The marked side refers to the side corresponding to the offset number on the placement board. The side corresponding to the maximum offset number on the placement board is used as the marked side.

[0156] Step S305: Retrieve the sample weight value according to the sample type.

[0157] The sample weight value refers to the weight value corresponding to the sample type, and the sample weight value is retrieved from the sample type.

[0158] Step S306: Determine the preset tilting force and tilting direction of the placement plate according to the sample weight value and the marked side, and control the operation of the placement plate according to the tilting force and tilting direction.

[0159] Tilt force refers to the force value for controlling the tilt of the placement plate, and the value corresponding to the sample weight is used as the tilt force. Tilt direction refers to the direction in which the placement plate needs to be tilted, and the relative direction corresponding to the marked side and the placement plate center point is used as the tilt direction. The electric angle controller preset at the placement plate center point on the side away from the placement plate where the sample type is placed operates with tilt force and tilt direction.

[0160] Reference Figure 4 , the method after determining the marked side also includes:

[0161] Step S400: Determine the friction coefficient of the sample according to the sample type and the preset material specifications of the placement plate.

[0162] The material specifications of the placement plate are the friction coefficient and load-bearing weight corresponding to the material of the placement plate set by the technician. The sample friction coefficient refers to the friction coefficient of the sample type on the placement plate. The friction coefficient of the placement plate is retrieved from the material specifications of the placement plate, and the friction coefficient of the placement plate and the sample type are input into the friction database to match the sample friction coefficient. The friction database stores the sample friction coefficients corresponding to different friction coefficients of the placement plate and sample types. The friction database is a manually set database and will not be described in detail here.

[0163] Step S401: determining the overlapping sample friction coefficient according to the overlapping irradiation sample type and the preset placement plate material specification.

[0164] The overlapped sample friction coefficient refers to the friction coefficient of the overlapped irradiated sample type on the placement plate. Step S400 is re-executed according to the overlapped sample friction coefficient and the material specification of the placement plate to obtain the overlapped sample friction coefficient.

[0165] Step S402: selecting the minimum friction coefficient as the detection friction coefficient according to the friction coefficient of the sample and the friction coefficient of the overlapping samples.

[0166] The detection friction coefficient refers to the friction coefficient with the smallest value between the sample friction coefficient and the overlapping sample friction coefficient. The smallest friction coefficient is selected from the sample friction coefficient and the overlapping sample friction coefficient as the detection friction coefficient.

[0167] Step S403: Determine the maximum tilt angle according to the detected friction coefficient.

[0168] The maximum tilt angle refers to the maximum tilt angle allowed for the placement plate, and the maximum tilt angle is matched from a preset friction database by detecting the friction coefficient. The friction database also stores the maximum tilt angles corresponding to different detected friction coefficients, which will not be described in detail here.

[0169] Step S404: Determine the placement tilt angle according to the sample weight value, the offset amount, and the irradiation placement position.

[0170] The placement tilt angle refers to the minimum tilt angle of the placement board corresponding to the marked side. The irradiation placement position that does not overlap with the irradiation placement position is selected from the two offset quantities for marking, and the distance between the marked position and the placement center point is calculated. The distance and the sample weight value are input into the friction database to match the placement tilt angle. The friction database also stores the placement tilt angles on the placement board corresponding to the sample weight value at different distances, which will not be described here.

[0171] Step S405: Determine the lifting force corresponding to each angle according to the maximum tilt angle and the marked side.

[0172] The lifting force refers to the lifting force value required when the placement plate is tilted at various angles. The lifting force corresponding to each angle is matched from the preset lifting database through the maximum tilt angle and the marked side. The lifting database stores the lifting forces required for each angle corresponding to different maximum tilt angles and marked sides. The lifting database is a database set manually and will not be described here.

[0173] Step S406: Determine whether the maximum tilt angle exceeds the placement tilt angle.

[0174] By determining whether the maximum tilt angle exceeds the placement tilt angle, it is determined whether the placement plate needs to be lifted.

[0175] Step S4061: When the maximum tilt angle exceeds the placement tilt angle, continue to lift and irradiate the sample type and the overlapping irradiation sample type.

[0176] When the maximum tilt angle exceeds the placement tilt angle, it indicates that there is no need to lift the placement plate, so step S208 is continued to perform lifting and irradiation.

[0177] Step S4062: When the maximum tilt angle does not exceed the placement tilt angle, the difference between the maximum tilt angle and the placement tilt angle is calculated and used as the angle deviation value.

[0178] The angle deviation value refers to the deviation between the maximum tilt angle and the placement tilt angle. When the maximum tilt angle does not exceed the placement tilt angle, it means that the placement plate needs to be lifted. Therefore, the difference between the maximum tilt angle and the placement tilt angle is calculated as the angle deviation value.

[0179] Step S407: determining the remaining lifting force according to the angle deviation value and the lifting force and lifting the placement plate.

[0180] The remaining lifting force refers to the force value required to lift the placement board with an inclined angle to the maximum tilt angle. The product of the angle deviation value and the lifting force is calculated as the remaining lifting force, and the preset lifting device is controlled by the remaining lifting force to lift the placement board. The lifting device is set on both sides of the center point of the placement board, and lifts the electric lifting rods on both sides of the placement board. In this embodiment, both sides of the center point of the placement board are the irradiation devices with the number of light sources to irradiate the two sides of the center point of the placement board.

[0181] The preset placement methods also include:

[0182] Step S500: If the average value is not an integer, the type of remaining samples is determined according to the average value and the number of samples placed, and the weight value of the remaining samples is retrieved according to the type of remaining samples.

[0183] The remaining sample type refers to the sample type that is tilted to the placement plate. The remaining sample type is obtained by analyzing the average value and the placement number to obtain the excess sample type. The remaining sample weight value refers to the weight value corresponding to the remaining sample type. The sample weight value corresponding to the remaining sample type is used as the remaining sample weight value.

[0184] Step S501: Determine the total weight of the overlapping samples according to the types of overlapping irradiated samples and the number of overlapping samples.

[0185] The total weight of overlapping samples refers to the total weight value corresponding to the overlapping irradiated sample type, which is obtained by taking the sample weight value corresponding to the overlapping irradiated sample type and calculating the product of the corresponding sample weight value and the number of overlapping samples as the total weight of overlapping samples.

[0186] Step S502: Determine different offset distances and offset change weight values ​​corresponding to the offset distances according to the total weight of the overlapping samples, the intersection area, and the center point of the placement plate.

[0187] The offset distance refers to the distance that the overlapping irradiation sample type can be offset within the intersection area based on the center point of the placement plate. The offset change weight value refers to the change weight value of the overlapping irradiation sample type carried by the placement plate corresponding to the offset distance. The offset distance and the offset change weight value are matched from the preset offset database through the total weight of the overlapping samples, the intersection area, and the center point of the placement plate. The offset database stores the correspondence between the total weight of the overlapping samples, the intersection area, the center point of the placement plate, the offset distance, and the offset change weight value. The offset database is a manually set database and will not be described in detail here.

[0188] Step S503: Determine whether the offset change weight value is less than the remaining sample weight value.

[0189] By determining whether the offset change weight value is less than the remaining sample weight value, it is determined whether the overlapping irradiation sample type can be moved to balance the placement plate.

[0190] Step S5031: When the offset change weight value is not less than the remaining sample weight value, the offset distance corresponding to the offset change weight value that is greater than the remaining sample weight value and has the smallest value is selected as the marked offset distance according to the offset change weight value, and the overlapping irradiation sample type is moved by the marked offset distance.

[0191] The marking offset distance refers to the distance that the overlapping irradiation sample type moves. When the offset change weight value is not less than the remaining sample weight value, it means that the overlapping irradiation sample type can be moved to balance the placement plate. Therefore, the offset distance corresponding to the offset change weight value that is greater than the remaining sample weight value and has the smallest value is selected from the offset change weight value as the marking offset distance, and the clamping device is controlled to move the overlapping irradiation sample type by the marking offset distance.

[0192] Step S5032: When the offset change weight value is less than the remaining sample weight value, the number of overlapping samples is updated according to the remaining sample weight value and the offset change weight value, and the updated number of overlapping samples is used for placement.

[0193] When the offset change weight value is less than the remaining sample weight value, it means that the overlapping irradiation sample type cannot be moved to balance the placement plate, so the offset distance whose offset change weight value is consistent with the remaining sample weight value is selected for marking, and the marked offset distance is input into the placement database to match the new number of overlapping samples. The placement database also stores the number of overlapping samples corresponding to the offset distances of different marks, which will not be described in detail here. Steps S501 to S5031 are re-executed with the updated number of overlapping samples.

[0194] The previous methods for placing with updated number of overlapping samples include:

[0195] Step S600: Determine the maximum bearing weight according to the lifting distance.

[0196] The maximum bearing weight refers to the maximum weight that the placement plate can bear in the lifting distance. The maximum bearing weight is matched from the preset lifting database according to the lifting distance. The lifting database stores the maximum bearing weights corresponding to different lifting distances. The lifting database is a manually set database and will not be described here.

[0197] Step S601: updating the total weight of overlapping samples according to the updated number of overlapping samples and the type of overlapping irradiated samples.

[0198] The new total weight of the overlapping samples is calculated by calculating the product of the sample weight value retrieved by the overlapping irradiation sample type and the updated number of overlapping samples.

[0199] Step S602: Determine the total weight of the samples according to the placement quantity and the sample weight value, and calculate the sum of the total weight of the samples and the updated total weight of the overlapping samples as the total placement weight.

[0200] The total weight of the sample refers to the total weight corresponding to the sample type, which is calculated by multiplying the sample weight value by the number of samples placed. The total placement weight refers to the total weight borne by the placement board, which is calculated by summing the total weight of the sample and the total weight of the updated overlapping samples.

[0201] Step S603: When the total weight placed exceeds the maximum bearing weight, the difference between the total weight placed and the maximum bearing weight is calculated and used as the weight deviation value.

[0202] The weight deviation value refers to the deviation between the total placement weight and the maximum bearing weight. When the total placement weight exceeds the maximum bearing weight, it means that the sample cannot be irradiated at the lifting distance. Therefore, the difference between the total placement weight and the maximum bearing weight is calculated as the weight deviation value.

[0203] Step S604: Determine the remaining sample types and the remaining irradiation times corresponding to the remaining sample types according to the weight deviation value and the overlapping light intensity value, and select the shortest remaining irradiation time from the different remaining irradiation times as the marked irradiation time, and use the remaining sample types corresponding to the marked irradiation time as new overlapping irradiation sample types.

[0204] The remaining sample types refer to the sample types that are irradiated within the weight deviation value and with overlapping illumination intensity values. The remaining illumination time refers to the time required for the remaining sample types to be irradiated at the overlapping illumination intensity values. The remaining sample types and the remaining illumination times are matched from the sample database through the weight deviation value and the overlapping illumination intensity value. The sample database also stores sample types and illumination times corresponding to different weight deviation values ​​and overlapping illumination intensity values, which will not be elaborated here. The marked illumination time refers to the shortest remaining illumination time. The shortest remaining illumination time is selected from different remaining illumination times as the marked illumination time, and the remaining sample types corresponding to the marked illumination time are used as new overlapping illumination sample types.

[0205] Step S605: Update the number of overlapping samples and arrange them according to the new overlapping irradiation sample type, intersection area and weight deviation value.

[0206] The weight value and area are retrieved through the new overlapping irradiation sample type, the quotient of the weight deviation value and the weight value is calculated, and the quotient of the intersection area and the area is calculated, the smallest quotient value is used as the new overlapping sample quantity, and the clamping device is controlled to clamp the new overlapping irradiation sample type with the new overlapping sample quantity for placement.

[0207] Step S606: Determine the lifting speed according to the marked irradiation time and the lifting distance, lift at the lifting speed, and continue to irradiate at the reference power.

[0208] The lifting speed refers to the speed at which the placement plate is lifted. The lifting speed is calculated by dividing the marked irradiation time by the lifting distance, and the placement plate is controlled to be lifted at the lifting speed. The irradiation device is continuously controlled to irradiate at the reference power.

[0209] Step S607: Acquire the focusing distance and the detection lifting distance.

[0210] The focusing distance refers to the distance between the dynamic focusing device preset on the irradiation device and the placement plate, and the distance between the dynamic focusing device and the placement plate is detected by the infrared sensor preset on the dynamic focusing device as the focusing distance. The detection lifting distance refers to the distance that the placement plate is lifted in real time, and the distance of the placement plate away from the irradiation device is detected by the infrared sensor preset on the placement plate as the detection lifting distance. The dynamic focusing device can be a liquid lens dynamic focusing device.

[0211] Step S608: Determine focus adjustment parameters according to the overlapping light intensity value, the focus distance and the detection lift distance and output them to a preset dynamic focus device.

[0212] The focus adjustment parameters refer to the parameters of the dynamic focusing device for focusing and irradiating the intersection area. The focus adjustment parameters are matched by inputting the overlapping illumination intensity value, the focusing distance and the detection lift distance into the preset focus database. The focus database stores the focus adjustment parameters corresponding to different overlapping illumination intensity values, the focusing distance and the detection lift distance. The focus database is a manually set database and will not be described in detail here.

[0213] Step S609: When the detected lifting distance is consistent with the lifting distance, remove the new overlapping irradiation sample type and stop the dynamic focusing device.

[0214] When the detection lifting distance is consistent with the lifting distance, it means that the sample in the intersection area has completed irradiation, so the new overlapping irradiation sample type is removed and the dynamic focusing device is stopped.

[0215] Methods after lifting at lifting speed include:

[0216] Step S700: Obtaining image detection information of a preset placement board.

[0217] The image detection information refers to the image of the placement board, and the image of the placement board is captured by a camera preset in the light box as the image detection information.

[0218] Step S701: determining the curvature according to the image detection information and the preset reference image information.

[0219] The reference image information is a normal image of the placement board set by the technician. The curvature refers to the curvature of the placement board, and the curvature of the line is obtained by comparing the image detection information with the line of the placement board corresponding to the reference image information.

[0220] Step S702: Calculate the difference between the bending curvature and the preset reference bending curvature as the curvature deviation value.

[0221] The reference bending curvature is the maximum curvature value set by the technicians that does not affect the normal use of the placement plate. The curvature deviation value refers to the deviation value between the bending curvature and the reference bending curvature. The difference between the bending curvature and the reference bending curvature is calculated as the curvature deviation value.

[0222] Step S703: Determine whether the bending curvature exceeds the reference bending curvature.

[0223] By determining whether the bending arc exceeds the reference bending arc, it is determined whether the placement plate can be used normally.

[0224] Step S7031: If the bending curvature exceeds the reference bending curvature, the maximum lifting weight is determined according to the curvature deviation value and the preset placement plate material specification.

[0225] The maximum lifting weight refers to the maximum weight that the curved placement plate can lift. The maximum lifting weight is matched from the lifting database through the curvature deviation value and the placement plate material specification. The lifting database also stores the maximum lifting weights corresponding to different curvature deviation values ​​and placement plate material specifications, which will not be described here.

[0226] Step S704: When the maximum lifting weight is less than the total placement weight, the placement plate is controlled to stop lifting and a preset prompt message is output.

[0227] The prompt message is set by the technician to remind the operator of abnormal placement of the plate. When the maximum lifting weight is less than the total placement weight, it means that the placement plate cannot lift the current batch of samples, so the placement plate is controlled to stop lifting and the prompt message is output.

[0228] Step S7032: If the bending radius does not exceed the reference bending radius, obtain the lifting weight value used historically for the placement plate.

[0229] The lifting weight value refers to the weight value lifted by the placement board during its historical use. When the bending arc does not exceed the reference bending arc, it means that the placement board can lift the current batch of samples normally. Therefore, the total weight corresponding to the samples lifted by the placement board during its historical use is retrieved from the system as the lifting weight value.

[0230] Step S705: Determine the remaining estimated usage time according to the lifting weight value, the arc deviation value and the total placement weight.

[0231] The remaining estimated usage time refers to the estimated time that the placement board can be lifted. The remaining estimated usage time is matched from the preset placement board database through the lifting weight value, arc deviation value and placement total weight. The placement board database stores the corresponding relationship between different lifting weight values, arc deviation values, placement total weight and remaining estimated usage time. The placement board database is a manually set database and will not be described in detail here.

[0232] Step S706: Obtain the historical usage time of the placement board.

[0233] The historical usage time refers to the total time that the placement plate has historically lifted samples. The irradiation time corresponding to the samples lifted when the placement plate was historically used is obtained from the system, and the sum of all irradiation times is calculated as the historical usage time.

[0234] Step S707: Determine the lifting time according to the lifting speed and the lifting distance.

[0235] The lifting time refers to the time required to lift the sample type and overlap the irradiation sample type by placing the plate. The lifting time is calculated as the quotient of the lifting speed and the lifting distance.

[0236] Step S708: Determine the inspection usage time through a preset lifting inspection method according to the historical usage time, lifting time, bending curvature and total placement weight.

[0237] The detection use time refers to the reduced use time of the bent placement plate when it is lifted. The detection use time is obtained by analyzing the historical use time, lifting time, bending curvature and total placement weight through a preset lifting inspection method. The lifting inspection method refers to the method used to inspect and lift the placement plate. For specific steps, refer to steps S800 to S804.

[0238] Step S709: When the detected usage time is consistent with the remaining estimated usage time, output a preset warning message.

[0239] The warning message is set by the technician to remind the operator to replace the placement board. When the detected usage time is consistent with the remaining estimated usage time, it means that the placement board is about to be damaged, and the warning message is output to the terminal held by the operator.

[0240] The preset jacking inspection methods include:

[0241] Step S800: Determine the lifting force according to the bending curvature and the total weight placed.

[0242] The detection lifting force refers to the lifting force of the curved placement plate. The detection lifting force is matched from the lifting database through the bending curvature and the total placement weight. The lifting database also stores the detection lifting forces corresponding to different bending curvatures and total placement weights, which will not be described here.

[0243] Step S801: Calculate the total lifting weight value according to the total placement weight and the preset placement plate weight value.

[0244] The placement plate weight value is the weight value of the placement plate set by the technician. The total lifting weight value refers to the total weight value required to be lifted when the lifting device lifts the placement plate. The total lifting weight value is calculated by calculating the sum of the total placement weight and the placement plate weight value.

[0245] Step S802: Determine the lifting reaction force according to the lifting speed and the total lifting weight value.

[0246] The lifting reaction force refers to the reaction force received by the placement plate when it is lifted. The lifting reaction force is matched from the lifting database by the lifting speed and the total lifting weight value. The lifting database also stores the lifting reaction forces corresponding to different lifting speeds and total lifting weight values, which will not be described here.

[0247] Step S803: updating the lifting reaction force according to the detected lifting force and the preset lifting position.

[0248] The lifting position is the position where the lifting device is installed set by the technician. The distance between the lifting position and the center point of the placement plate is calculated, and then the distance and the detected lifting force are input into the lifting database to obtain the correction coefficient, and the product of the correction coefficient and the lifting reaction force is calculated as the new lifting reaction force. The lifting database also stores the correction coefficients of the lifting reaction force corresponding to different distances and detected lifting forces, which will not be described here.

[0249] Step S804: Determine the total usage time according to the historical usage time, the updated lifting reaction force and the lifting time, and calculate the difference between the total usage time and the preset benchmark usage time as the detection usage time.

[0250] The total usage time refers to the total usage time of the placement board. The updated lifting reaction force is input into the placement board database to match the usage time, and then the sum of the usage time, historical usage time and lifting time is calculated to get the total usage time. The difference between the total usage time and the benchmark usage time is calculated as the detection usage time. The benchmark usage time is the minimum usage time of the placement board set by the technician.

[0251] Based on the same inventive concept, an embodiment of the present invention provides a UV light curing light intensity adjustment system based on LED, comprising:

[0252] The acquisition module is used to obtain the sample type, placement quantity, focus distance, detection lifting distance, image detection information, lifting weight value and historical usage time;

[0253] A memory for storing a program of a method for adjusting light intensity of UV light curing based on LED;

[0254] The processor is used to load, execute and implement the program stored in the memory.

[0255] Based on the same inventive concept, an embodiment of the present invention provides an intelligent terminal, including a memory and a processor, wherein the memory stores a computer program that can be loaded by the processor and executes a method for adjusting the light intensity of UV light curing based on LED.

[0256] Those skilled in the art can clearly understand that for the convenience and simplicity of description, only the division of the above-mentioned functional modules is used as an example. In actual applications, the above-mentioned functions can be assigned to different functional modules as needed, that is, the internal structure of the device is divided into different functional modules to complete all or part of the functions described above. The specific working process of the system, device and unit described above can refer to the corresponding process in the aforementioned method embodiment, and will not be repeated here.

[0257] The above is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above embodiments. All technical solutions under the concept of the present invention belong to the protection scope of the present invention. It should be pointed out that for ordinary technicians in this technical field, some improvements and modifications without departing from the principle of the present invention should also be regarded as the protection scope of the present invention.

Claims

1. A method for adjusting light intensity of UV light curing based on LED, characterized in that: include: Obtaining the sample type of the sample to be irradiated; Determine the light intensity and illumination time according to the sample type; Calculate the difference between the light intensity value and the preset reference light value as the light deviation value; Determine whether the light intensity value is greater than the reference light value; If the light intensity value is not greater than the reference light value, the adjustment power is determined according to the light deviation value; The operating power is calculated according to the adjusted power and the preset reference power, and irradiation is performed at the operating power; If the light intensity value is greater than the reference light value, the lifting distance is determined according to the light deviation value, and the lifting irradiation is performed according to the lifting distance and the preset reference power.

2. The method for adjusting light intensity of UV light curing based on LED according to claim 1, characterized in that: Methods for determining lift distance include: Get the number of placements for the sample type; According to the sample type, the sample area can be retrieved; Determine the detection illumination area according to the lifting distance and the preset reference illumination area; Determine the maximum placement quantity based on the detection illumination area and sample area; When the maximum placement quantity does not exceed the placement quantity, the total placement area is determined based on the placement quantity and the sample area; Determine the number of light sources, the distance between light sources and the placement position of the distance between light sources according to the total placement area and the detection illumination area, and call the irradiation device with the number of light sources to move according to the distance between light sources and the placement position of the distance between light sources; Determine the overlapping light intensity value according to the light intensity value and the number of light sources; The overlapping illumination sample type is determined according to the overlapping illumination intensity value and illumination time, and the intersection area is determined according to the light source spacing and the detection illumination area; The number of overlapping samples is determined based on the intersection area and the type of overlapping irradiation samples, and they are placed using a preset placement method and then lifted for irradiation.

3. The method for adjusting light intensity of UV light curing based on LED according to claim 2, characterized in that: The preset placement methods include: Update the detection illumination area according to the light source spacing, the light source spacing placement position and the intersection area; Determine the placement position of the overlapping samples according to the number of overlapping samples, the intersection area and the preset center point of the placement plate, and place the overlapping irradiation sample types according to the overlapping sample placement position; Calculate the average value based on the number of light sources and the number of placements; Determine if the mean is an integer; If the average value is an integer, the irradiation placement position is determined according to the average value, the sample area and the updated detection illumination area, and the sample type is placed according to the irradiation placement position; If the average value is not an integer, the irradiation placement position is determined according to the placement quantity, the sample area and the updated detection illumination area, and the sample type is placed according to the irradiation placement position; Determine the offset amount on both sides of the center point of the placement plate according to the irradiation placement position and the center point of the placement plate, and use the side corresponding to the maximum offset amount as the marked side; According to the sample type, the sample weight value can be retrieved; The tilting force and tilting direction of the preset placement plate are determined according to the sample weight value and the marked side, and the operation of the placement plate is controlled by the tilting force and tilting direction.

4. The method for adjusting light intensity of UV light curing based on LED according to claim 3, characterized in that: The method after determining the marked side also includes: Determine the sample friction coefficient based on the sample type and the preset placement plate material specifications; Determine the friction coefficient of overlapping samples according to the overlapping irradiation sample type and the preset placement plate material specifications; According to the friction coefficient of the sample and the friction coefficient of the overlapping sample, the minimum friction coefficient is selected as the test friction coefficient; Determine the maximum tilt angle by testing the friction coefficient; Determine the placement tilt angle according to the sample weight value, the offset quantity and the irradiation placement position; Determine the lifting force corresponding to each angle based on the maximum tilt angle and the marked side; Determine whether the maximum tilt angle exceeds the placement tilt angle; When the maximum tilt angle exceeds the placement tilt angle, the sample type and the overlapping irradiation sample type are continuously lifted and irradiated; When the maximum tilt angle does not exceed the placement tilt angle, the difference between the maximum tilt angle and the placement tilt angle is calculated and used as the angle deviation value; The remaining lifting force is determined according to the angle deviation value and the lifting force, and the placement plate is lifted.

5. The method for adjusting light intensity of UV light curing based on LED according to claim 3, characterized in that: The preset placement methods also include: If the average value is not an integer, the type of remaining samples is determined based on the average value and the number of samples placed, and the weight value of the remaining samples is retrieved based on the type of remaining samples; Determine the total weight of the overlapping samples according to the type of overlapping irradiated samples and the number of overlapping samples; Determine different offset distances and the offset change weight values ​​corresponding to the offset distances according to the total weight of the overlapping samples, the intersection area and the center point of the placement plate; determining whether the offset change weight value is less than the remaining sample weight value; When the offset change weight value is not less than the remaining sample weight value, the offset distance corresponding to the offset change weight value that is greater than the remaining sample weight value and has the smallest value is selected as the mark offset distance according to the offset change weight value, and the overlapping irradiation sample type is moved by the mark offset distance; When the offset change weight value is less than the remaining sample weight value, the number of overlapping samples is updated according to the remaining sample weight value and the offset change weight value, and the updated number of overlapping samples is used for placement.

6. The method for adjusting light intensity of UV light curing based on LED according to claim 5, characterized in that: The previous methods for placing with updated number of overlapping samples include: Determine the maximum load-bearing weight based on the lifting distance; The total weight of the overlapping samples is updated according to the updated number of overlapping samples and the type of overlapping irradiated samples; Determine the total weight of the samples according to the placement quantity and the sample weight value, and calculate the sum of the total weight of the samples and the updated total weight of the overlapping samples as the total placement weight; When the total weight exceeds the maximum load, the difference between the total weight and the maximum load is calculated and used as the weight deviation value; Determine the remaining sample types and the remaining irradiation times corresponding to the remaining sample types according to the weight deviation value and the overlapping light intensity value, select the shortest remaining irradiation time from the different remaining irradiation times as the marked irradiation time, and use the remaining sample types corresponding to the marked irradiation time as new overlapping irradiation sample types; Update the number of overlapping samples and place them according to the new overlapping irradiation sample type, intersection area and weight deviation value; Determine the lifting speed according to the marked irradiation time and lifting distance, lift at the lifting speed, and continue irradiating at the reference power; Get the focusing distance and detection lifting distance; Determine focus adjustment parameters according to the overlapping illumination intensity value, the focus distance and the detection lift distance and output them to a preset dynamic focus device; When the detection lifting distance is consistent with the lifting distance, the new overlapping irradiation sample type is removed and the dynamic focusing device is stopped.

7. The method for adjusting light intensity of UV light curing based on LED according to claim 6, characterized in that: Methods after lifting at lifting speed include: Obtaining image detection information of a preset placement board; Determine the curvature of the bend according to the image detection information and the preset reference image information; Calculate the difference between the bending curvature and the preset reference bending curvature as the curvature deviation value; Determine whether the bending arc exceeds the reference bending arc; If the bending curvature exceeds the reference bending curvature, the maximum lifting weight is determined according to the curvature deviation value and the preset placement plate material specifications; When the maximum lifting weight is less than the total placement weight, the placement plate is controlled to stop lifting and a preset prompt message is output; If the bending arc does not exceed the reference bending arc, obtain the lifting weight value used in the placement plate history; Determine the remaining estimated usage time based on the lifting weight value, arc deviation value and total placement weight; Get the historical usage time of the placement board; Determine the lifting time based on the lifting speed and lifting distance; The detection usage time is determined by the preset lifting inspection method based on the historical usage time, lifting time, bending curvature and total placement weight; When the detected usage time is consistent with the remaining estimated usage time, a preset warning message is output.

8. The method for adjusting light intensity of UV light curing based on LED according to claim 7, characterized in that: The preset jacking inspection methods include: Determine the lifting force based on the bending arc and the total weight placed; The total lifting weight is calculated based on the total placement weight and the preset placement plate weight value; Determine the lifting reaction force based on the lifting speed and the total weight of the lift; Update the lifting reaction force according to the detected lifting force and the preset lifting position; The total usage time is determined based on the historical usage time, the updated lifting reaction force and the lifting time, and the difference between the total usage time and the preset benchmark usage time is calculated as the detection usage time.

9. A UV light curing light intensity adjustment system based on LED, characterized in that: include: The acquisition module is used to obtain the sample type, placement quantity, focus distance, detection lifting distance, image detection information, lifting weight value and historical usage time; A memory for storing a program of a method for adjusting light intensity of UV light curing based on LED according to any one of claims 1 to 8; The processor is used to load, execute and implement the program stored in the memory.

10. An intelligent terminal, characterized in that: The invention comprises a memory and a processor, wherein the memory stores a computer program which can be loaded by the processor and executes a method for adjusting light intensity of UV light curing based on LED as claimed in any one of claims 1 to 8.

Images