Method for manufacturing thin circuit board of precise high-density interconnected LED (light-emitting diode) lamp group

Abstract

The invention discloses a method for manufacturing a thin circuit board of a precise high-density interconnected LED (light-emitting diode) lamp group, which comprises the following steps of: manufacturing and forming a circuit board with an inner-layer circuit through a previous process, and designing a blind hole connected with the inner-layer circuit on a first surface of the circuit board; manufacturing an electroplating support plate with conductive circuits distributed on the surface, manufacturing a first window on the electroplating support plate corresponding to the effective area of the circuit board, fixing, and electroplating to form an electroplating plate; manufacturing an etching jig of which the cross section is an isosceles triangle, and manufacturing a second window in the effective area corresponding to the inclined surface corresponding to the isosceles edge; correspondingly mounting the electroplated plate on the inclined surface and etching to form a thin circuit board; according to the technical scheme, the electroplating supporting plate and the circuit board are fixed to form circuit conduction, and two-side differential electroplating parameter processing is carried out; the etching jig is designed, the inclined plane effectively guides the flow direction of the etching liquid, the pool effect is reduced, an effective cooperation effect is formed before and after the whole process, and the problems that the electroplating effect is difficult to balance and the etching precision is poor are effectively solved.

Description

Technical Field

[0001] The invention relates to the field of printed circuit board manufacturing, and in particular to a method for manufacturing a precision high-density interconnected LED lamp group thin circuit board. Background Art

[0002] With the development of display technology, LED displays are moving towards higher definition. Especially in the application of high-precision LED matrix light groups, the manufacturing of circuit boards used in mini-LED light groups also faces challenges.

[0003] For the circuit boards used in this type of high-precision LED matrix light groups, since a large number of LED lamp beads need to be integrated in a limited space, the solder pads are designed to be small and dense, and the circuit boards themselves are usually thin, with a thickness generally between 0.1mm and 0.5mm.

[0004] In the processing of this type of circuit board, the following main problems will be faced: First, when performing blind hole filling and electroplating, since the blind hole surface requires a larger electroplating area, the electroplating amount required on this side is large, while the electroplating amount required on the side without blind holes is small, which easily leads to the problem of difficult to balance the electroplating effect on both sides. The current solution is to electroplate both sides of the circuit board twice. Although this method can solve the problem of electroplating quality, the process is long, the cost is high, and the impact on the environment is large; secondly, in the etching stage, since the pads and circuit patterns are very fine, the "pool effect" will have a significant impact on the etching quality. Although there are currently two methods available, vacuum etching and two-fluid etching, they each have the problem of poor improvement effect or high cost and difficult control.

[0005] Therefore, in order to solve the above-mentioned problems, it is necessary to provide a method for manufacturing a precision high-density interconnected LED lamp group thin circuit board. Summary of the invention

[0006] The present invention aims to solve the problems of the prior art, mainly to solve the problems that during the manufacturing process of traditional thin circuit boards, during double-sided electroplating, the electroplating amount requirements on both sides are inconsistent due to the presence of blind holes on one side, making it difficult to achieve balanced electroplating, and the "pool effect" in the etching stage affects the etching quality of the circuit pattern. A method for manufacturing a precision high-density interconnected LED light group thin circuit board is proposed. The thin circuit board is designed and processed in a paneling manner. The paneling is designed with a molding line. The area surrounded by the molding line is an effective area, and the other areas are invalid areas. The manufacturing method comprises the following steps: S10: A circuit board with an inner layer circuit is formed through the previous process, and a blind hole connected to the inner layer circuit is designed on the first surface of the circuit board; S20: A plating support plate with a conductive circuit distributed on the surface is manufactured, and a first window is made on the plating support plate corresponding to the effective area, and then the plate is fixed to the circuit board to form a fixed plate, and the fixed plate is electroplated to form a plated plate; the conductive circuit is in contact with the plating chuck and the circuit board; S30: An etching jig is manufactured, and a cross-section of the etching jig is an isosceles triangle, and the inclined surfaces corresponding to the two isosceles sides of the isosceles triangle are both made with second windows, and the second windows correspond to the effective area; S40: The plating board is mounted on the inclined surface accordingly, and then etched to form the thin circuit board.

[0007] Furthermore, a single side of the first window is larger than the effective area, and a single side is smaller than the invalid area.

[0008] Furthermore, the current density used in the electroplating is: the current density corresponding to the first surface is greater than the current density corresponding to the other surface.

[0009] Furthermore, the fixing is: making a circuit board fixing hole for the invalid area, making a corresponding support plate fixing hole for the electroplating support plate, and then using pins to fix the circuit board and the electroplating support plate through the circuit board fixing hole and the support plate fixing hole.

[0010] Furthermore, the fixing is: using conductive glue to stick the ineffective area to the electroplating support plate.

[0011] Furthermore, the base angle of the isosceles triangle is 3° to 10°.

[0012] Furthermore, the etching spray pressure is 1.5kg / cm² to 2.5kg / cm², preferably 1.8kg / cm², 2.0kg / cm² or 2.2kg / cm², and the etching spray travel speed is: 1.5m / min to 6.0m / min, preferably 2.0m / min, 2.8m / min, 3.0m / min, 4.0m / min, 5.0m / min or 5.5m / min.

[0013] Furthermore, the etching is: firstly, the electroplating plate is subjected to a first spray etching, then the electroplating plate is horizontally rotated 180°, and then the electroplating plate is subjected to a second spray etching.

[0014] Furthermore, the spray pressure of the first spray etching is 1.0kg / cm² to 1.5kg / cm², and the travel speed of the first spray etching is 4.5m / min to 6.0m / min; the spray pressure of the second spray etching is 1.0kg / cm² to 1.5kg / cm², and the travel speed of the second spray etching is 4.5m / min to 6.0m / min.

[0015] Furthermore, the etching jig is manufactured with a plurality of guide grooves, and the plurality of guide grooves are parallel to the isosceles edge and evenly distributed on the inclined surface.

[0016] The technical solution of the present invention forms a good electrical connection by fixing a plating support plate with a conductive circuit to a circuit board, and then connecting the plating chuck and the circuit board through the conductive circuit. At the same time, the plating support plate can provide a good supporting force to the circuit board to prevent the circuit board from swinging and colliding during electroplating. The plating support plate increases the area of ​​the circuit board to be electroplated, and can effectively improve the uniformity of the electric force lines acting on the surface of the circuit board during electroplating, and prevent the electric force lines from being too dense at the upper and lower ends of the board body, resulting in the problem of poor electroplating uniformity due to excessive thickness of the electroplated copper at this position (while the middle area is relatively thin); during electroplating, two-sided differentiated electroplating parameter processing is used to achieve more uniform current distribution and electroplating effect, which solves the problem of the prior art of performing two-stage electroplating. Electroplating on both sides of the circuit board can improve the quality of electroplating, but the process is long, the cost is high, and the impact on the environment is large. In the etching process, an etching fixture with an isosceles triangle cross-section is designed, and windows are opened on its inclined surface corresponding to the effective area. The inclined surface effectively guides the flow of the etching liquid, improves the fluidity of the etching liquid during the etching process, and reduces the "pool effect", thereby improving the etching accuracy and uniformity, and solving the problem of the "pool effect" in the prior art etching that significantly affects the etching quality. The overall process forms an effective coordination effect before and after, forming an interrelated effect of fluidity before and after, effectively solving the problems of uneven electroplating thickness and etching accuracy, reducing costs and reducing impact on the environment, and achieving more efficient and environmentally friendly production. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0018] Figure 1 Schematic diagram of the process flow of an embodiment of the present invention; Figure 2 is a schematic cross-sectional view of a circuit board according to an embodiment of the present invention; Figure 3 Schematic diagram of a plan view of an electroplating support plate according to an embodiment of the present invention; Figure 4 is a schematic cross-sectional view of a fixing plate according to an embodiment of the present invention; Figure 5 for Figure 4 AA cross-sectional diagram of ; Figure 6 A schematic plan view of an etching jig according to an embodiment of the present invention; Figure 7 Schematic diagram of etching process according to an embodiment of the present invention.

[0019] Explanation of the accompanying drawings: 100-forming line; 200-effective area; 300-ineffective area; 10-circuit board; 1010-blind hole; 1020-inner layer circuit; 20-plating support plate; 2010-first window; 2020-conductive circuit; 2030-plating chuck; 30-fixing plate; 3010-pin; 40-plating board; 50-etching jig; 5010-second window; 5020-fixing bump; 5030-nozzle; 5040-transmission roller.

[0020] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0022] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, inside, outside...) are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0023] In addition, in the present invention, descriptions such as "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0024] In addition, the technical solutions between the various embodiments of the present invention can be combined with each other, but it must be based on the fact that ordinary technicians in the field can implement it. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0025] See also Figure 1 , Figure 1 It is a schematic diagram of the process flow of an embodiment of the present invention.

[0026] The manufacturing process of the embodiment of the present invention includes using Figure 1 The following will implement the various steps in the process Figure 1 Each step in the process is further explained step by step.

[0027] The thin circuit board of this embodiment is designed and processed by a panelization method. The panelization design has a molding line 100. The area surrounded by the molding line 100 is an effective area 200, and the other area is an ineffective area 300.

[0028] See also Figure 2 , Figure 2 Schematic cross-sectional view of a circuit board according to an embodiment of the present invention.

[0029] S10: The circuit board 10 having the inner layer circuit 1020 is formed through the previous process. The first surface of the circuit board 10 is designed with a blind hole 1010 connected to the inner layer circuit 1020, which provides a basis for the subsequent process.

[0030] Optionally, the invalid area 300 is extended on one side to reserve a sufficient operating area for fixing the circuit board 10 and the electroplating support plate 20 in the subsequent process, thereby avoiding damage to the effective area 200 of the circuit board 10 and enhancing the operational convenience in the production process. It is worth noting that the extension area of ​​the invalid area 300 should not be too large to waste materials, but should be large enough to ensure the stability of the fixation between the circuit board 10 and the electroplating support plate 20. Preferably, the invalid area 300 is extended on one side by 5 mm to 20 mm.

[0031] See also Figure 3 , Figure 4 and Figure 5 , Figure 3 Schematic diagram of a plan view of an electroplating support plate according to an embodiment of the present invention; Figure 4 is a schematic cross-sectional view of a fixing plate according to an embodiment of the present invention; Figure 5 for Figure 4 Schematic diagram of the AA section.

[0032] S20: Make a plating support plate 20 with a conductive circuit 2020 distributed on the surface, make a first window 2010 in the plating support plate 20 corresponding to the effective area 200, and then fix it to the circuit board 10 to form a fixed plate 30, electroplate the fixed plate 30, and form a plating plate 40 on the circuit board 10; the conductive circuit 2020 is in contact with the plating chuck 2030 and the circuit board 10.

[0033] Since the circuit board 10 itself is relatively thin, the electroplating support plate 20 can provide supporting force, and a first window 2010 is made in the area of ​​the electroplating support plate 20 corresponding to the effective area 200, so that when the circuit board 10 is fixed to the electroplating support plate 20 in the subsequent process, the effective area 200 to be electroplated can be completely exposed without affecting the smooth progress of the electroplating process.

[0034] Optionally, the thickness of the electroplating support plate 20 is 1.0 mm to 2.0 mm, which not only enhances the overall load-bearing capacity of the circuit board 10 , but also facilitates operations in subsequent processing.

[0035] Optionally, the size of the plating support plate 20 is 2 cm to 5 cm larger than the size of the circuit board 10 on one side, which helps to ensure that the circuit board 10 can form a stable fixed structure with the plating support plate 20, while ensuring that the electroplating solution can smoothly contact the effective area 200 of the circuit board 10 to complete the electroplating.

[0036] Furthermore, since the electric field (electric lines) will be attracted by the surface of the circuit board 10 to be electroplated during electroplating, and the adsorption is more dense at the edge of the circuit board 10, the uneven distribution makes the upper and lower ends of the circuit board 10 act more strongly during the electroplating process, resulting in a larger amount of electroplating at the upper and lower ends, resulting in thicker electroplated copper thickness at the upper and lower ends, and uneven copper plating on the entire board surface (since the circuit board 10 is continuously or clamped for electroplating, the unevenness of the electric field at the left and right ends is less affected). Therefore, the provision of the electroplating support plate 20 can also play a role in balancing the uniformity of the electric field, that is, the upper and lower ends of the electroplating support plate 20 are used to form the upper and lower ends in the actual electroplating process.

[0037] Furthermore, since the board surface needs to be conductive during the electroplating process, a conductive circuit 2020 is distributed on the surface of the electroplating support plate 20. Optionally, the conductive circuit 2020 is only arranged to contact the electroplating chuck 2030 and the circuit board 10, thereby ensuring electrical connectivity during the electroplating process. Optionally, a uniformly distributed conductive circuit 2020 is completely made on the surface of the electroplating support plate 20 to improve the uniformity of current density distribution of the fixed plate 30 during the electroplating process. In this case, preferably, the line width of the conductive circuit 2020 is 20μm to 75μm, and a mesh line distribution can be used with a mesh mesh number of 20 to 60 meshes. The line width is fine and the mesh number is small, which can ensure conductivity while reducing the thickness of copper plated on the surface of the electroplating support plate 20, thereby saving material usage.

[0038] Furthermore, if it is necessary to fine-tune the electric field effect, the conductive circuit 2020 can be designed in a targeted manner. For example, the density of the conductive circuit 2020 can be higher, so that the electric field lines are more applied to the surface of the electroplating support plate 20, thereby reducing the effect on the surface of the circuit board 10 and reducing the thickness of the electroplated copper. That is, the electroplating support plate 20 has the effect of adjusting the electroplating parameters and the electroplating effect.

[0039] In this embodiment, a single side of the first window 2010 is larger than the effective area 200, and a single side is smaller than the ineffective area 300. On the one hand, it can ensure that the size of the first window 2010 does not hinder the smooth progress of the electroplating process in the effective area 200. On the other hand, it provides an operable area for fixing the circuit board 10 and the electroplating support plate 20.

[0040] Optionally, if the finished unit board is smaller in size, the panelization method is to assemble multiple unit boards into one panel, and there are several first windows 2010. Then, each first window 2010 has a single side larger than the effective area 200 and a single side smaller than the invalid area 300.

[0041] Optionally, if the finished unit board is larger in size, the panelization method is to assemble one unit board into one panel, and there is one first window 2010, and one side of the first window 2010 is larger than the effective area 200 and smaller than the size of the panel.

[0042] In this embodiment, the fixing plate 30 is formed by making a circuit board fixing hole in the invalid area 300, making a corresponding support plate fixing hole in the electroplating support plate 20, and then using a pin 3010 to fix the circuit board 10 and the electroplating support plate 20 through the circuit board fixing hole and the support plate fixing hole.

[0043] Optionally, a circuit board fixing hole is made in the ineffective area 300 , and a protrusion corresponding to the fixing hole is made in the electroplating support plate 20 . The protrusion is engaged with the fixing hole to fix the circuit board 10 and the electroplating support plate 20 .

[0044] Optionally, conductive adhesive is used to adhere the ineffective area 300 to the electroplating support plate 20 .

[0045] The electroplating in this embodiment adopts a method of realizing surface-differentiated parameter electroplating on the same electroplating support plate 20. This method can optimize the electroplating process parameters, mainly optimizing the anode current density, thereby adjusting the electric field lines of the anode and reducing the proportion of factors affecting the electroplating quality caused by the chemical disturbance. While ensuring the electroplating quality, it can shorten the process and effectively reduce the production cost.

[0046] Therefore, the current density used in electroplating is: the current density corresponding to the first surface is greater than the current density corresponding to the other surface.

[0047] Optionally, the first side is electroplated using a current density of 1.5ASD to 3.0ASD, preferably 1.8ASD, 2.0ASD or 2.5ASD, and the other side is electroplated using a current density of 1.0ASD to 2.0ASD, preferably 1.2ASD or 1.5ASD; the electroplating time is controlled between 50min and 90min, preferably 60min, 70min or 75min.

[0048] Different current densities can be controlled by setting separate power supplies (rectifiers) for the corresponding anodes on both sides.

[0049] See also Figure 6 and Figure 7 , Figure 6 A schematic plan view of an etching jig according to an embodiment of the present invention; Figure 7 Schematic diagram of etching process according to an embodiment of the present invention.

[0050] Please refer to S30 : manufacturing an etching jig 50 , a cross section of the etching jig 50 is an isosceles triangle, and the inclined surfaces corresponding to the two isosceles sides of the isosceles triangle are both manufactured with second windows 5010 , and the second windows 5010 correspond to the effective area 200 .

[0051] The etching jig 50 with an isosceles triangle cross-section is provided with a second window 5010 on its inclined surface corresponding to the effective area 200 of the thin circuit board. This design can effectively guide the flow of etching liquid, improve the flow of etching liquid during the etching process, reduce the "pool effect", and thus improve etching accuracy and uniformity.

[0052] In this embodiment, the base angle of the isosceles triangle is 3° to 10°, ensuring that the electroplating plate 40 maintains a certain inclination during the etching process, so that the sprayed etching liquid presents a certain angle with the electroplating plate 40, which facilitates the smooth discharge of the etching liquid and reduces the "pool effect" formed by the retention of etching liquid.

[0053] Optionally, the etching jig 50 is made with a plurality of guide grooves, which are parallel to the isosceles sides and evenly distributed on the inclined surface. The design of the guide grooves is intended to enhance the fluidity of the etching liquid so that it can be discharged from the etching area more effectively, avoiding the formation of liquid accumulation on the surface of the electroplating plate 40, reducing the uneven etching phenomenon, and thus improving the etching quality and efficiency.

[0054] Optionally, the etching fixture 50 is made of an etching-resistant plastic material, preferably PC, PP, PET, PVC, ABS or PTFE.

[0055] Furthermore, the depth of the guide groove is 100μm to 500μm, and the width is 1mm to 5mm. The appropriate depth and width can optimize the flow path of the etching liquid and improve fluidity. If the guide groove is too narrow or too shallow, the solid particles carried by the etching waste liquid may clog the channel and affect the etching effect. On the contrary, if the design is too wide or too deep, its diversion effect may be weakened, reducing the effect of the original design and having a significant impact on the etching quality.

[0056] S40: Mount the electroplating plate 40 on the inclined surface accordingly, and then etch it to form a thin circuit board.

[0057] Since the entire etching process requires two rows of transmission rollers 5040 to drive the entire etching jig 50 and the electroplating plate 40 to move, in order to avoid the electroplating plate 40 being installed on the inclined surface with a large protrusion of the installation component, which will hinder the entire transmission process, in this embodiment, a fixed window is made in the invalid area 300, and a fixed protrusion 5020 corresponding to the fixed window is made at the position of the invalid area 300 of the etching jig 50. The fixed protrusion 5020 is engaged with the fixed window, so that the electroplating plate 40 and the etching jig 50 are fixed.

[0058] During the etching process, the etching liquid is sprayed onto the surface of the material to be etched through the nozzle 5030 at a certain pressure. Appropriate pressure can ensure that the etching liquid is evenly distributed and effectively removes unnecessary material layers, while avoiding excessive erosion or causing other defects. The specific spray volume and travel speed are determined according to the width of the circuit and the circuit gap. Since the thin circuit board circuit in this embodiment is relatively fine and the copper thickness is relatively thin, etching parameters with relatively small spray volume and relatively fast travel speed are selected.

[0059] Optionally, the etching spray pressure is 1.5kg / cm² to 2.5kg / cm², preferably 1.8kg / cm², 2.0kg / cm² or 2.2kg / cm², and the etching spray travel speed is: 1.5m / min to 6.0m / min, preferably 2.0m / min, 2.8m / min, 3.0m / min, 4.0m / min, 5.0m / min or 5.5m / min.

[0060] It is worth noting that due to the design characteristics of the commonly used conical nozzles, a "pool effect" is easily formed in the spraying area, which may cause uneven local etching. Therefore, the nozzle 5030 uses a fan-shaped nozzle. The fan-shaped design allows the etching liquid to be sprayed in a planar shape (rather than a cone), reducing the possibility of etching liquid accumulation, thereby avoiding the "pool effect" and helping to achieve a more uniform etching effect.

[0061] In this embodiment, since the etching jig 50 forms an oblique angle with the electroplating plate 40 (with the transmission plane of the transmission roller 5040), during the etching process, the etching liquid forms a flow pattern along the downward direction of the oblique surface on the surface of the electroplating plate 40. This directional flow will cause the contact time and concentration distribution of the etching liquid in different areas of the circuit board surface to be uneven, resulting in the etching amount of the etching liquid upstream being slightly larger than the etching amount downstream, resulting in the etching amount on one side of the circuit being larger than the other side, causing the circuit to tilt to one side.

[0062] Therefore, the etching method is to first perform a first spray etching on the electroplating plate 40, then rotate the electroplating plate 40 horizontally by 180 degrees, and then perform a second spray etching on the electroplating plate 40. The spray pressure of the first spray etching is 1.0kg / cm² to 1.5kg / cm², and the travel speed of the first spray etching is 4.5m / min to 6.0m / min; the spray pressure of the second spray etching is 1.0kg / cm² to 1.5kg / cm², and the travel speed of the second spray etching is 4.5m / min to 6.0m / min.

[0063] The etching process is performed twice, with the directions of the two etchings being rotated and exchanged respectively, and a smaller etching amount is used in both etching processes, which effectively balances the problem of line tilt during etching.

[0064] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A method for manufacturing a thin circuit board for a precision high-density interconnected LED lamp group, wherein the thin circuit board is designed and processed by a paneling method, wherein the paneling is designed with a molding line, wherein the area surrounded by the molding line is an effective area, and the other areas are invalid areas, wherein: The production method comprises the following steps: S10: a circuit board having an inner layer circuit is formed through the previous process, wherein a blind hole connected to the inner layer circuit is designed on the first surface of the circuit board; S20: manufacturing a plating support plate with conductive circuits distributed on its surface, manufacturing a first window on the plating support plate corresponding to the effective area, and then fixing the plating support plate with the circuit board to form a fixed plate, and electroplating the fixed plate to form a plating plate on the circuit board; The conductive circuit is in contact with the electroplating chuck and the circuit board; S30: manufacturing an etching jig, wherein a cross section of the etching jig is an isosceles triangle, and the inclined surfaces corresponding to two isosceles sides of the isosceles triangle are both manufactured with second windows, and the second windows correspond to the effective area; S40: Mounting the electroplating plate on the inclined surface accordingly, and then etching to form the thin circuit board.

2. The method for manufacturing a thin circuit board of a precision high-density interconnected LED lamp group as claimed in claim 1, characterized in that: A single side of the first window is larger than the effective area, and a single side is smaller than the invalid area.

3. The method for manufacturing a thin circuit board of a precision high-density interconnected LED lamp group as claimed in claim 1, characterized in that: The current density used in the electroplating is: the current density corresponding to the first surface is greater than the current density corresponding to the other surface.

4. The method for manufacturing a high-density interconnected LED light assembly thin circuit board according to claim 1, characterized in that: The fixing is: making a circuit board fixing hole for the invalid area, making a corresponding support plate fixing hole for the electroplating support plate, and then using pins to fix the circuit board and the electroplating support plate through the circuit board fixing hole and the support plate fixing hole.

5. The method for manufacturing a high-density interconnected LED light assembly thin circuit board according to claim 1, characterized in that: The fixing is: using conductive glue to stick the ineffective area to the electroplating support plate.

6. The method for manufacturing a high-density interconnected LED light assembly thin circuit board according to claim 1, characterized in that: The base angle of the isosceles triangle is 3° to 10°.

7. The method for manufacturing a high-density interconnected LED light assembly thin circuit board according to claim 1, characterized in that: The spray pressure of the etching is 1.5kg / cm² to 2.5kg / cm², and the spray travel speed of the etching is 1.5m / min to 6.0m / min.

8. The method for manufacturing a thin circuit board of a precision high-density interconnected LED lamp assembly as claimed in claim 1, characterized in that: The etching is as follows: firstly, the electroplating plate is subjected to a first spray etching, then the electroplating plate is horizontally rotated 180°, and then the electroplating plate is subjected to a second spray etching.

9. The method for manufacturing a high-density interconnected LED light assembly thin circuit board as claimed in claim 8, characterized in that: The spray pressure of the first spray etching is 1.0kg / cm² to 1.5kg / cm², and the travel speed of the first spray etching is 4.5m / min to 6.0m / min; the spray pressure of the second spray etching is 1.0kg / cm² to 1.5kg / cm², and the travel speed of the second spray etching is 4.5m / min to 6.0m / min.

10. The method for manufacturing a thin circuit board of a precision high-density interconnected LED lamp group as claimed in claim 1, characterized in that: The etching fixture is provided with a plurality of guide grooves, which are parallel to the isosceles edge and evenly distributed on the inclined surface.

Images