A manufacturing method for a thin circuit board of a precision high-density interconnect LED lamp group

Abstract

The invention discloses a manufacturing method of a precision high-density interconnect LED lamp group thin circuit board. A circuit board with inner-layer circuits is formed through previous processes. Blind holes connected to the inner-layer circuits are designed on the first surface of the circuit board. An electroplating support plate with conductive circuits distributed on the surface is manufactured. A first opening window is made corresponding to the effective area of the circuit board on the electroplating support plate and fixed, and then electroplating is carried out to form an electroplated board. An etching fixture with an isosceles triangle cross-section is manufactured. A second opening window is made on the inclined plane corresponding to the isosceles side and corresponding to the effective area. The electroplated board is correspondingly installed on the inclined plane and etched to form a thin circuit board. The technical solution of the invention fixes the electroplating support plate and the circuit board through electroplating to form circuit conduction, and processes with two-sided differential electroplating parameters; and then designs an etching fixture. The inclined plane effectively guides the flow direction of the etching solution, reduces the "pool effect", and forms an effective cooperative effect before and after the overall process, effectively solving the problems of difficult-to-balance electroplating effect and etching accuracy.

Description

Technical Field

[0001] The present invention relates to the field of manufacturing printed circuit boards, and particularly to a manufacturing method for a precision high-density interconnect LED lamp group thin circuit board. Background Art

[0002] With the development of display technologies, LED displays are evolving towards higher definition. Especially in the application of high-precision LED matrix lamp groups, the manufacturing of the circuit boards used in mini-LED lamp groups also faces challenges.

[0003] For the circuit boards used in such high-precision LED matrix lamp groups, since a large number of LED beads need to be integrated in a limited space, the pad design is small and dense, and the board body of the applied circuit board is usually thin, with a thickness generally between 0.1 mm and 0.5 mm.

[0004] During the processing of such circuit boards, the following main problems will be faced:

[0005] Firstly, during blind via filling electroplating, since the blind via surface requires a large electroplating area, the electroplating amount required for this surface is large, while the electroplating amount required for the side without blind vias is small, which easily causes the problem that it is difficult to balance the electroplating effects on both sides. The currently adopted solution is to electroplate the two sides of the circuit board separately in two times. Although this method can solve the electroplating quality problem, the process is long, the cost is high, and the impact on the environment is large. Secondly, in the etching stage, due to the very fine pad and circuit patterns, the "pool effect" will have a significant impact on the etching quality. Although there are currently two methods, vacuum etching and two-fluid etching, available for selection, they each have problems such as poor improvement effect, high cost, and difficult control.

[0006] Therefore, to solve the above-mentioned problems, a manufacturing method for a precision high-density interconnect LED lamp group thin circuit board is needed. Summary of the Invention

[0007] The present invention aims to solve the main problems in the prior art, mainly to solve the comprehensive problems such as during double-sided electroplating in the manufacturing process of traditional thin circuit boards, due to the existence of blind vias on one side, the electroplating amounts required on both sides are inconsistent, it is difficult to achieve balanced electroplating, and the "pool effect" in the etching stage affects the etching quality of the circuit patterns. A manufacturing method for a precision high-density interconnect LED lamp group thin circuit board is proposed. The thin circuit board is designed and processed in a panelized manner. The panel is designed with a forming line, and the area enclosed by the forming line is the effective area, and other areas are invalid areas. The manufacturing method includes the following steps:

[0008] S10: Fabricate a circuit board with inner-layer circuits through previous processes. Blind vias connected to the inner-layer circuits are designed on the first side of the circuit board. S20: Fabricate an electroplating support plate with conductive circuits distributed on its surface. Make a first opening corresponding to the effective area on the electroplating support plate, and then fix it to the circuit board to form a fixed plate. Electroplate the fixed plate, and the circuit board forms an electroplated board. The conductive circuits are in contact with the electroplating chuck and the circuit board. S30: Fabricate an etching jig. A cross-section of the etching jig is an isosceles triangle, and second openings are made on the inclined surfaces corresponding to the two equal sides of the isosceles triangle. The second openings correspond to the effective area. S40: Mount the electroplated board correspondingly on the inclined surface, and then etch to form the thin circuit board.

[0009] Further, the single side of the first opening is larger than the effective area and smaller than the ineffective area.

[0010] Further, the current density used for electroplating is that the current density corresponding to the first side is greater than the current density corresponding to the other side.

[0011] Further, the fixing method is: make circuit board fixing holes in the ineffective area, make corresponding support plate fixing holes in the electroplating support plate, and then use pins to fix the circuit board and the electroplating support plate through the circuit board fixing holes and the support plate fixing holes.

[0012] Further, the fixing method is: paste the ineffective area and the electroplating support plate with conductive glue.

[0013] Further, the base angle of the isosceles triangle is 3° to 10°.

[0014] Further, the spray pressure for etching is 1.5 kg / cm² to 2.5 kg / cm², preferably 1.8 kg / cm², 2.0 kg / cm² or 2.2 kg / cm². The spray traveling speed for etching is: 1.5 m / min to 6.0 m / min, preferably 2.0 m / min, 2.8 m / min, 3.0 m / min, 4.0 m / min, 5.0 m / min or 5.5 m / min.

[0015] Further, the etching process is: first perform the first spray etching on the electroplated board, then horizontally rotate the electroplated board by 180°, and then perform the second spray etching on the electroplated board.

[0016] Further, the spraying pressure of the first spray etching is 1.0 kg / cm² to 1.5 kg / cm², and the traveling speed of the first spray etching is 4.5 m / min to 6.0 m / min; the spraying pressure of the second spray etching is 1.0 kg / cm² to 1.5 kg / cm², and the traveling speed of the second spray etching is 4.5 m / min to 6.0 m / min.

[0017] Further, a plurality of diversion grooves are formed in the etching jig, and the plurality of diversion grooves are parallel to the isosceles side and are evenly distributed on the inclined surface.

[0018] The technical solution of the present invention fixes the circuit board by using an electroplating support plate with a conductive circuit, and then connects the electroplating chuck and the circuit board through the conductive circuit to form a good electrical connection. At the same time, the electroplating support plate can give good support to the circuit board to prevent the problems of swinging and impact of the circuit board during electroplating. Moreover, the electroplating support plate increases the area of the circuit board to be electroplated, which can effectively improve the uniformity of the action of the power lines on the surface of the circuit board during electroplating, and prevent the problem of poor electroplating uniformity caused by the excessive density of the power lines at the upper and lower ends of the plate body resulting in too thick electroplated copper thickness at this position (while the middle area is relatively thin); during electroplating, two-sided differential electroplating parameters are used for processing, so as to achieve a more uniform current distribution and electroplating effect, and solve the problems of the prior art that the two sides of the circuit board are electroplated separately in two times, although the electroplating quality can be improved, but the process is long, the cost is high, and the impact on the environment is large; in the etching process, an etching jig with an isosceles triangle cross-section is designed, and windows are opened on the inclined surface corresponding to the effective area. The inclined surface effectively guides the flow direction of the etching solution, improves the fluidity of the etching solution during the etching process, reduces the "pool effect", thereby improving the etching accuracy and uniformity, and solving the problem that the "pool effect" in the prior art etching has a significant impact on the etching quality; the overall process forms an effective cooperation before and after, forming a flowing and mutually related effect, effectively solving the problems of uneven electroplating thickness and etching accuracy, reducing costs and reducing the impact on the environment, and realizing more efficient and environmentally friendly production. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on the structures shown in these drawings.

[0020] Figure 1 It is a process flow diagram of an embodiment of the present invention;

[0021] Figure 2Cross-sectional schematic diagram of the circuit board according to an embodiment of the present invention;

[0022] Figure 3 Planar schematic diagram of the electroplating support plate according to an embodiment of the present invention;

[0023] Figure 4 Cross-sectional schematic diagram of the fixing plate according to an embodiment of the present invention;

[0024] Figure 5 is Figure 4 A-A cross-sectional schematic diagram of

[0025] Figure 6 Planar schematic diagram of the etching jig according to an embodiment of the present invention;

[0026] Figure 7 Schematic diagram of the etching process according to an embodiment of the present invention.

[0027] Explanation of the reference numerals in the drawings: 100 - forming line; 200 - effective area; 300 - ineffective area; 10 - circuit board; 1010 - blind hole; 1020 - inner layer circuit; 20 - electroplating support plate; 2010 - first opening; 2020 - conductive circuit; 2030 - electroplating chuck; 30 - fixing plate; 3010 - pin; 40 - electroplating plate; 50 - etching jig; 5010 - second opening; 5020 - fixing bump; 5030 - nozzle; 5040 - transfer roller.

[0028] The realization, functional features and advantages of the object of the present invention will be further described in conjunction with the embodiments and with reference to the accompanying drawings. Specific embodiments

[0029] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0030] It should be noted that all the directional indications (such as up, down, left, right, front, back, inside, outside, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement conditions between components in a specific posture (as shown in the drawings). If the specific posture changes, the directional indications will also change accordingly.

[0031] In addition, in the present invention, descriptions such as "first", "second", etc. are only for descriptive purposes and should not be construed as indicating or implying their relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0032] In addition, the technical solutions between various embodiments of the present invention can be combined with each other, but it must be based on the fact that those of ordinary skill in the art can implement it. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0033] Please refer to Figure 1 , Figure 1 , which is a schematic process flow diagram of an embodiment of the present invention.

[0034] The manufacturing process of the embodiment of the present invention includes implementing each step process in Figure 1 . The following will further illustrate each step process in Figure 1 step by step.

[0035] The thin circuit board of this embodiment is designed and processed in a panelized manner. The panel has a forming line 100, and the area enclosed by the forming line 100 is the effective area 200, and other areas are the invalid areas 300.

[0036] Please refer to Figure 2 , Figure 2 , which is a cross-sectional schematic diagram of the circuit board of an embodiment of the present invention.

[0037] S10: A circuit board 10 with an inner layer circuit 1020 is formed through previous processes. Blind vias 1010 connected to the inner layer circuit 1020 are designed on the first side of the circuit board 10, providing a basis for subsequent processes.

[0038] Optionally, the invalid area 300 is extended unilaterally, reserving enough operating area for fixing the circuit board 10 to the electroplating support plate 20 in subsequent processes, avoiding damage to the effective area 200 of the circuit board 10, and at the same time enhancing the operational convenience during production. It is worth noting that the extended area of the invalid area 300 should not be too large to waste materials, but should be large enough to ensure the stability of the fixation between the circuit board 10 and the electroplating support plate 20. Preferably, the invalid area 300 is extended unilaterally by 5 mm to 20 mm.

[0039] Please refer to Figure 3 , Figure 4 and Figure 5 , Figure 3Schematic diagram of a plan view of an electroplating support plate according to an embodiment of the present invention; Figure 4 is a schematic cross-sectional view of a fixing plate according to an embodiment of the present invention; Figure 5 for Figure 4 Schematic diagram of the AA section.

[0040] S20: Make a plating support plate 20 with a conductive circuit 2020 distributed on the surface, make a first window 2010 in the plating support plate 20 corresponding to the effective area 200, and then fix it to the circuit board 10 to form a fixed plate 30, electroplate the fixed plate 30, and form a plating plate 40 on the circuit board 10; the conductive circuit 2020 is in contact with the plating chuck 2030 and the circuit board 10.

[0041] Since the circuit board 10 itself is relatively thin, the electroplating support plate 20 can provide supporting force, and a first window 2010 is made in the area of ​​the electroplating support plate 20 corresponding to the effective area 200, so that when the circuit board 10 is fixed to the electroplating support plate 20 in the subsequent process, the effective area 200 to be electroplated can be completely exposed without affecting the smooth progress of the electroplating process.

[0042] Optionally, the thickness of the electroplating support plate 20 is 1.0 mm to 2.0 mm, which not only enhances the overall load-bearing capacity of the circuit board 10 , but also facilitates operations in subsequent processing.

[0043] Optionally, the size of the plating support plate 20 is 2 cm to 5 cm larger than the size of the circuit board 10 on one side, which helps to ensure that the circuit board 10 can form a stable fixed structure with the plating support plate 20, while ensuring that the electroplating solution can smoothly contact the effective area 200 of the circuit board 10 to complete the electroplating.

[0044] Furthermore, since the electric field (electric lines) will be attracted by the surface of the circuit board 10 to be electroplated during electroplating, and the adsorption is more dense at the edge of the circuit board 10, the uneven distribution makes the upper and lower ends of the circuit board 10 act more strongly during the electroplating process, resulting in a larger amount of electroplating at the upper and lower ends, resulting in thicker electroplated copper thickness at the upper and lower ends, and uneven copper plating on the entire board surface (since the circuit board 10 is continuously or clamped for electroplating, the unevenness of the electric field at the left and right ends is less affected). Therefore, the provision of the electroplating support plate 20 can also play a role in balancing the uniformity of the electric field, that is, the upper and lower ends of the electroplating support plate 20 are used to form the upper and lower ends in the actual electroplating process.

[0045] Further, since the board surface needs to be conductive during the electroplating process, conductive lines 2020 are distributed on the surface of the electroplating support plate 20. Optionally, only the conductive lines 2020 are set to be in contact with the electroplating chuck 2030 and the circuit board 10, ensuring the electrical connectivity during the electroplating process. Additionally, optionally, conductive lines 2020 are uniformly fabricated on the entire surface of the electroplating support plate 20 to improve the uniformity of the current density distribution on the fixing plate 30 during the electroplating process. In this case, preferably, the line width of the conductive lines 2020 is 20 μm to 75 μm, and a mesh line distribution can be used, with a mesh count of 20 to 60. The line width is relatively thin and the mesh count is relatively small, which can ensure conductivity while reducing the thickness of the copper electroplated on the surface of the electroplating support plate 20, thereby saving the use of materials.

[0046] Further, if fine adjustment of the electric field effect is required, the conductive lines 2020 can be designed specifically. For example, the density of the conductive lines 2020 can be increased, so that more electric field lines act on the surface of the electroplating support plate 20, thereby reducing the amount of electric field lines acting on the surface of the circuit board 10 and decreasing the electroplated copper thickness. That is, the electroplating support plate 20 functions to adjust the electroplating parameters and electroplating effect.

[0047] In this embodiment, the single side of the first opening 2010 is larger than the effective area 200 and smaller than the ineffective area 300. On the one hand, this can ensure that the size of the first opening 2010 does not hinder the smooth progress of the electroplating process in the effective area 200. On the other hand, it provides an operable area for fixing the circuit board 10 and the electroplating support plate 20.

[0048] Optionally, if the size of the finished unit board is small, the panel splicing method is that multiple unit boards are spliced into one panel. If there are several first openings 2010, then the single side of each first opening 2010 is larger than the effective area 200 and smaller than the ineffective area 300.

[0049] Optionally, if the size of the finished unit board is large, the panel splicing method is that one unit board is spliced into one panel. If there is one first opening 2010, the single side of the first opening 2010 is larger than the effective area 200 and smaller than the size of the panel.

[0050] In this embodiment, the fixing plate 30 is formed by making circuit board fixing holes in the ineffective area 300, making corresponding support plate fixing holes in the electroplating support plate 20, and then using the pin 3010 to fix the circuit board 10 and the electroplating support plate 20 through the circuit board fixing holes and the support plate fixing holes.

[0051] Optionally, circuit board fixing holes are made in the ineffective area 300, and protrusions corresponding to the fixing holes are made on the electroplating support plate 20. The protrusions are engaged with the fixing holes correspondingly to fix the circuit board 10 and the electroplating support plate 20.

[0052] Optionally, use conductive adhesive to paste the ineffective area 300 to the electroplating support plate 20.

[0053] In this embodiment, electroplating is performed by a method of achieving differential parameters electroplating on different faces of the same electroplating support plate 20. This method can optimize the electroplating process parameters, mainly by optimizing the anode current density, so as to adjust the electric field lines of the anode and reduce the proportion of factors affecting the electroplating quality caused by the chemical solution disturbance. While ensuring the electroplating quality, the process can be shortened and the production cost can be effectively reduced.

[0054] Therefore, the current density used for electroplating is: the current density corresponding to the first face is greater than the current density corresponding to the other face.

[0055] Optionally, electroplate the first face with a current density of 1.5 ASD to 3.0 ASD, preferably 1.8 ASD, 2.0 ASD or 2.5 ASD, and electroplate the other face with a current density of 1.0 ASD to 2.0 ASD, preferably 1.2 ASD or 1.5 ASD; the electroplating time is controlled between 50 min and 90 min, preferably 60 min, 70 min or 75 min.

[0056] Separate power supplies (rectifiers) can be set for the anodes corresponding to the two faces respectively to control different current densities.

[0057] Please refer to Figure 6 and Figure 7 , Figure 6 is a plan view of the etching jig of the embodiment of the present invention; Figure 7 is a schematic diagram of the etching process of the embodiment of the present invention.

[0058] Please refer to S30: Fabricate the etching jig 50. A cross-section of the etching jig 50 is an isosceles triangle, and second openings 5010 are made on the inclined surfaces corresponding to the two equal sides of the isosceles triangle. The second openings 5010 correspond to the effective area 200.

[0059] For the etching jig 50 with an isosceles triangle cross-section, the second openings 5010 are arranged on its inclined surface corresponding to the effective area 200 of the thin circuit board. This design can effectively guide the flow direction of the etching solution, improve the flow of the etching solution during the etching process, reduce the "pool effect", and thus improve the etching accuracy and uniformity.

[0060] In this embodiment, the base angle of the isosceles triangle is 3° to 10°, ensuring that the electroplated board 40 maintains a certain inclination during the etching process, so that the sprayed etching solution forms a certain angle with the electroplated board 40, facilitating the smooth discharge of the etching solution and reducing the "pool effect" caused by the retention of the etching solution.

[0061] Optionally, a plurality of diversion grooves are made on the etching fixture 50. The plurality of diversion grooves are parallel to the isosceles side and evenly distributed on the inclined surface. The design of the diversion grooves is aimed at enhancing the fluidity of the etching solution, enabling it to be discharged more effectively from the etching area, avoiding the formation of liquid accumulation on the surface of the electroplated board 40, reducing the phenomenon of uneven etching, and thus improving the etching quality and efficiency.

[0062] Optionally, the material of the etching fixture 50 is an anti-etching plastic material, preferably PC, PP, PET, PVC, ABS or PTFE.

[0063] Furthermore, the depth of the diversion groove is 100 μm to 500 μm, and the width is 1 mm to 5 mm. Appropriate depth and width can optimize the flow path of the etching solution and improve the fluidity. If the diversion groove is too narrow or too shallow, it may cause the solid particles carried by the etching waste liquid to block the channel, affecting the etching effect. On the contrary, if it is designed too wide or too deep, it may weaken its diversion effect and reduce the effect of the original design, having a significant impact on the etching quality.

[0064] S40: Mount the electroplated board 40 correspondingly on the inclined surface and then perform etching to form a thin circuit board.

[0065] Since the entire etching process requires the upper and lower rows of transmission rollers 5040 to drive the entire etching fixture 50 and the electroplated board 40 to move, in order to avoid that the protrusions of the mounting components where the electroplated board 40 is mounted on the inclined surface are too large and will hinder the entire transmission process, in this embodiment, a fixed opening is made in the invalid area 300, and a fixed convex block 5020 corresponding to the fixed opening is made at the position of the invalid area 300 of the etching fixture 50. By corresponding engagement of the fixed protrusion 5020 and the fixed opening, the electroplated board 40 and the etching fixture 50 are fixed.

[0066] During the etching process, the magnitude of the force with which the etching solution is sprayed onto the surface of the material to be etched through the nozzle 5030 at a certain pressure; appropriate pressure can ensure the uniform distribution of the etching solution and effectively remove the unnecessary material layer, while avoiding over-etching or causing other defects. The specific spraying amount and traveling speed are determined according to the width of the circuit and the circuit gap. Since the circuit of the thin circuit board in this embodiment is relatively fine and the copper thickness is relatively thin, etching parameters with a relatively small spraying amount and a relatively fast traveling speed are selected.

[0067] Optionally, the spraying pressure for etching is 1.5 kg / cm² to 2.5 kg / cm², preferably 1.8 kg / cm², 2.0 kg / cm² or 2.2 kg / cm², and the spraying traveling speed for etching is: 1.5 m / min to 6.0 m / min, preferably 2.0 m / min, 2.8 m / min, 3.0 m / min, 4.0 m / min, 5.0 m / min or 5.5 m / min.

[0068] It should be noted that due to the design characteristics of common conical nozzles, it is easy to form a "pool effect" in the spraying area, which may lead to uneven local etching. Therefore, the fan-shaped nozzle is selected for the nozzle 5030. The fan-shaped design makes the etching solution spray in a planar shape (instead of a conical shape), reducing the possibility of etching solution accumulation, thus avoiding the "pool effect" and helping to achieve a more uniform etching effect.

[0069] In this embodiment, since the etching jig 50 forms an oblique angle with the electroplated board 40 (the transmission plane of the transmission roller 5040), during the etching process, the etching solution forms a downward flow pattern along the inclined plane on the surface of the electroplated board 40. This directional flow will cause uneven contact time and concentration distribution of the etching solution in different areas of the circuit board surface, resulting in slightly more etching amount in the upstream of the etching solution than in the downstream, causing the etching amount on one side of the circuit to be larger than that on the other side, and forming the problem that the circuit tilts to one side.

[0070] Therefore, the etching method is to first perform the first spray etching on the electroplated board 40, then horizontally rotate the electroplated board 40 by 180°, and then perform the second spray etching on the electroplated board 40. The spray pressure of the first spray etching is 1.0 kg / cm² to 1.5 kg / cm², and the traveling speed of the first spray etching is 4.5 m / min to 6.0 m / min; the spray pressure of the second spray etching is 1.0 kg / cm² to 1.5 kg / cm², and the traveling speed of the second spray etching is 4.5 m / min to 6.0 m / min.

[0071] By using two etching processes, rotating and swapping directions respectively twice, and adopting the processing method with a smaller etching amount both times, the problem of circuit tilt during etching is effectively balanced.

[0072] The above are only the preferred embodiments of the present invention, and do not limit the patent scope of the present invention accordingly. All equivalent structural transformations made under the inventive concept of the present invention by using the content of the specification and drawings of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A manufacturing method of a precision high-density interconnect LED lamp group thin circuit board, wherein the thin circuit board is designed and processed in a panelized manner, the panel is designed with a forming line, the area surrounded by the forming line is the effective area, and other areas are the ineffective areas, characterized in that, The manufacturing method includes the following steps: S10: A circuit board with an inner layer circuit is formed through a previous process. Blind vias connected to the inner layer circuit are designed on the first side of the circuit board. S20: An electroplating support plate with conductive circuits distributed on its surface is manufactured. A first opening window corresponding to the effective area is made on the electroplating support plate, and then it is fixed to the circuit board to form a fixed plate. The circuit board is electroplated to form an electroplated board. The current density used for electroplating is such that the current density corresponding to the first side is greater than the current density corresponding to the other side. The conductive circuits are in contact with the electroplating chuck and the circuit board. S30: An etching fixture is manufactured. A cross-section of the etching fixture is an isosceles triangle, and second opening windows corresponding to the effective area are made on the inclined surfaces corresponding to the two equal sides of the isosceles triangle. S40: The electroplated board is correspondingly installed on the inclined surface and then etched to form the thin circuit board.

2. The manufacturing method of a precision high-density interconnect LED lamp group thin circuit board according to claim 1, characterized in that, The single side of the first opening window is larger than the effective area and smaller than the ineffective area.

3. The manufacturing method of a precision high-density interconnect LED lamp group thin circuit board as described in claim 1, characterized in that, The fixing method is as follows: Circuit board fixing holes are made in the ineffective area, corresponding support plate fixing holes are made in the electroplating support plate, and then the circuit board and the electroplating support plate are fixed using pins through the circuit board fixing holes and the support plate fixing holes.

4. The manufacturing method of a precision high-density interconnect LED lamp group thin circuit board as described in claim 1, characterized in that, The fixing method is as follows: The ineffective area and the electroplating support plate are pasted using conductive adhesive.

5. The manufacturing method of a precision high-density interconnect LED lamp group thin circuit board as described in claim 1, characterized in that, The base angle of the isosceles triangle is 3° to 10°.

6. The manufacturing method of a precision high-density interconnect LED lamp group thin circuit board as described in claim 1, characterized in that The spray pressure of the etching is 1.5 kg / cm 2 to 2.5 kg / cm 2 , and the spray travel speed of the etching is 1.5 m / min to 6.0 m / min.

7. The manufacturing method of a precision high-density interconnect LED lamp group thin circuit board as described in claim 1, characterized in that, The etching process is as follows: First, the electroplated board is subjected to the first spray etching, then the electroplated board is horizontally rotated 180°, and then the electroplated board is subjected to the second spray etching.

8. The manufacturing method of a precision high-density interconnect LED lamp group thin circuit board according to claim 7, characterized in that, The spray pressure of the first spray etching is 1.0 kg / cm 2 to 1.5 kg / cm 2 , and the traveling speed of the first spray etching is 4.5 m / min to 6.0 m / min; the spray pressure of the second spray etching is 1.0 kg / cm 2 to 1.5 kg / cm 2 , and the traveling speed of the second spray etching is 4.5 m / min to 6.0 m / min.

9. The manufacturing method of a precision high-density interconnect LED lamp group thin circuit board according to claim 1, characterized in that, The etching fixture is provided with a plurality of flow guiding grooves, and the plurality of flow guiding grooves are parallel to the equal sides and evenly distributed on the inclined surface.

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