Manufacturing method of flexible circuit board and laminated inductor circuit board

Abstract

The present invention discloses a method for manufacturing a flexible circuit board and a laminated inductor circuit board. First, a flexible copper-clad laminate is prepared to form a circuit pattern consisting of a first joint end, a head end connection section, a circuit distribution section, a tail end connection section and a second joint end in sequence; the circuit distribution section is composed of a plurality of upper coil sections, a plurality of bending sections and a plurality of lower coil sections in a cyclic and alternating manner; the upper coil sections and the lower coil sections are both open coil sections, and the openings are respectively connected to the bending sections; a covering film is attached to the flexible core board, and post-processing is performed to form a flexible circuit board; then the above-mentioned flexible circuit boards are used to stack and form a laminated inductor circuit board; the overall processing process forms effective coordination before and after, forming a process-oriented and batch-producible processing process from design to processing, thereby improving the processing efficiency and reliability of the inductor circuit board and extending the service life of the product. In addition, during the processing process, waste materials can be selected for recycling, effectively reducing the processing cost.

Description

Technical Field

[0001] The present invention relates to the field of flexible circuit board manufacturing and the field of inductive circuit board manufacturing, and in particular to a method for manufacturing a flexible circuit board and a laminated inductive circuit board. Background Art

[0002] In modern application areas such as intelligent connected vehicles and low-altitude aircraft, electronic modules need to have inductive characteristics to meet specific functional requirements. The current production methods for this characteristic include: one is to solder independent inductive components on the surface of the circuit board; the other is to directly design the inductive coil into a multi-layer structure and integrate it inside the circuit board. That is, first design a multi-layer circuit board, and then use through holes or stacked blind vias to connect the inductive coil lines of each layer.

[0003] The above-mentioned production method has the following defects:

[0004] (1) Soldering the inductor components separately as an additional production step will increase manufacturing costs and reduce the overall reliability of the equipment. More importantly, soldering the inductor components separately will take up a large space, which is not conducive to promoting the miniaturization of electronic equipment. In addition, as time goes by and the material ages, the separately soldered inductor components may attenuate, affecting the service life and performance of the equipment.

[0005] (2) A multi-layer structure is used to make a flat inductor circuit board. On the one hand, the process of making a multi-layer circuit board is not only complicated and time-consuming, but also uses more materials, resulting in increased costs. On the other hand, when connecting the inductor coils between different layers, through-hole or stacked blind hole technology is usually required. Strictly speaking, the coil circuit formed by the connection is not a single circuit, which will lead to the existence of cross-layer connection points. During the application process, there may be connection points that cause inductor interference problems and reduce inductor accuracy. If you hope to solve these problems by improving the processing accuracy of the circuit board, it will further increase the manufacturing difficulty and process.

[0006] Therefore, in order to solve the above-mentioned problems, it is necessary to provide a method for manufacturing a flexible circuit board and a laminated inductor circuit board. Summary of the Invention

[0007] The present invention aims to solve the complex processing and low inductance precision problems of the prior art laminated inductor circuit boards. First, a method for manufacturing a flexible circuit board and a laminated inductor circuit board is proposed. The manufacturing method includes the following steps:

[0008] S10: Take a flexible copper-clad laminate and form a circuit pattern to form a flexible core board; the circuit pattern is composed of a first connector end, a head end connection section, a circuit distribution section, a tail end connection section, and a second connector end in sequence; the circuit distribution section is composed of a plurality of upper coil sections, a plurality of bending sections, and a plurality of lower coil sections in a cyclic alternating manner; the upper coil sections and the lower coil sections are both open coil sections, and the openings are respectively connected to different bending sections;

[0009] S20: applying a cover film to the flexible core board and performing subsequent processing to form the flexible circuit board.

[0010] Furthermore, the flexible core board is formed by making the circuit pattern, then removing the insulating dielectric layer in some of the bending sections, the circuit pattern in the bending sections forms a first hollow circuit, and the entire board forms the flexible core board.

[0011] Furthermore, the flexible circuit board is formed by attaching the cover film to the flexible core board, and then laser milling the cover film corresponding to the first hollow circuit to form a second hollow circuit.

[0012] Furthermore, a single side of the first hollow circuit is smaller than that of the second hollow circuit.

[0013] Furthermore, the forming of the flexible core board is to adhere a pure adhesive layer to the plurality of upper coil segments and the plurality of lower coil segments after manufacturing the circuit pattern.

[0014] Furthermore, the covering film is applied by cutting the first covering film corresponding to the bending section to form a pattern covering film, and then aligning and applying the pattern covering film to the bending section.

[0015] Furthermore, the pattern covering film extends into the upper coil segment and the lower coil segment.

[0016] A method for manufacturing a laminated inductor circuit board is also proposed. The laminated inductor circuit board is manufactured by laminating the above-mentioned flexible circuit board; the lamination is performed by folding a plurality of the bending segments in sequence and overlapping the coil segments to form concentric coils.

[0017] Furthermore, the lamination is: making a mold, the mold including a top mold and a bottom mold, the bottom mold is provided with a protrusion, the protrusion corresponds to the center of the concentric circle, the top mold has a window corresponding to the protrusion, the flexible circuit board is laminated using the mold, and then pressed to form a pressed plate.

[0018] Furthermore, the pressed plate is subjected to a potting glue treatment.

[0019] The beneficial effects of the technical solution of the present invention are:

[0020] (1) By designing a flexible printed circuit board with a circuit pattern consisting of a first connector end, a head end connection section, a circuit distribution section (including an upper coil section, a bending section and a lower coil section alternately connected), a tail end connection section and a second connector end, the entire inductor line forms the effect of a strictly identical circuit, thereby solving the problem that the existing technology of separately soldering inductor elements increases manufacturing complexity and cost, is not conducive to the miniaturization design of the equipment, and may cause the inductor elements to age and decay over time, affecting the service life and performance of the equipment.

[0021] (2) The flexible circuit board is made to be bendable and stacked to form a flat inductor circuit board. This solves the problem that the existing technology uses a multi-layer structure to form a flat inductor circuit board, the production process is complicated and time-consuming, and when connecting the inductor coils between different layers, the through-hole or stacked blind hole technology will bring inductor interference, further increasing the manufacturing difficulty and the number of steps.

[0022] (3) The overall processing process is effectively coordinated, and the process from design to processing is streamlined and batch-produced, which greatly improves the processing efficiency and reliability of the inductor circuit board and extends the service life of the product. In addition, during the processing, auxiliary processing tools can choose to use scrap materials for recycling, effectively reducing processing costs and reducing environmental pressure. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0024] Figure 1 Schematic diagram of the process flow of a flexible circuit board according to an embodiment of the present invention;

[0025] Figure 2 is a schematic plan view of a flexible circuit board according to an embodiment of the present invention;

[0026] Figure 3 for Figure 2 A partial enlarged schematic diagram of FD in the middle;

[0027] Figure 4 for Figure 3 AA cross-section diagram;

[0028] Figure 5 for Figure 3 BB cross-section diagram;

[0029] Figure 6Schematic cross-sectional view of a mold according to an embodiment of the present invention.

[0030] Explanation of the accompanying drawings: 10, flexible circuit board; 1010, first connector end; 1020, head end connecting section; 1030, line distribution section; 1030a, upper coil section; 1030b, bending section; 1030c, lower coil section; 1040, tail end connecting section; 1050, second connector end; FD, local enlarged schematic diagram; 1060, covering film; 1061, covering film PI layer; 1062, covering film adhesive layer; 1060a, first hollow circuit; 1060b, second hollow circuit; 1070, pure adhesive layer; 1080, flexible core board insulation layer; 20, mold; 2010, top mold; 2010a, window; 2020, bottom mold; 2020a, bump; 200, pressed laminated structure.

[0031] The purpose, features and advantages of the present invention will be further described with reference to the accompanying drawings and in conjunction with the embodiments. DETAILED DESCRIPTION

[0032] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0033] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, inside, outside, etc.) are only used to explain the relative position relationship and movement status between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0034] In addition, the terms "first," "second," and so on, used in this disclosure are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referenced. Thus, a feature specified as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of this disclosure, "plurality" means at least two, such as two or three, unless otherwise specifically defined.

[0035] In addition, the technical solutions between the various embodiments of the present invention can be combined with each other, but it must be based on the fact that ordinary technicians in this field can implement it. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0036] See also Figure 1, Figure 1 Schematic diagram of the process flow of an embodiment of the present invention.

[0037] The embodiment of the present invention first provides a method for manufacturing a flexible circuit board, comprising: Figure 1 The following will implement the various steps in the process Figure 1 Each step in the process is further explained step by step.

[0038] See also Figure 2 、 Figure 3 、 Figure 4 and Figure 5 , Figure 2 is a schematic plan view of a flexible circuit board according to an embodiment of the present invention; Figure 3 for Figure 2 A partial enlarged schematic diagram of FD in the middle; Figure 4 for Figure 3 AA cross-section diagram; Figure 5 for Figure 3 BB cross-section diagram.

[0039] Step S10: Take a flexible copper-clad laminate, make a circuit pattern, and form a flexible core board; the circuit pattern is composed of a first connector end 1010, a head end connecting section 1020, a circuit distribution section 1030, a tail end connecting section 1040, and a second connector end 1050 in sequence; the circuit distribution section 1030 is composed of a plurality of upper coil sections 1030a, a plurality of bending sections 1030b, and a plurality of lower coil sections 1030c in a cyclic alternating manner; the upper coil section 1030a and the lower coil section 1030c are both open coil sections, and the openings are respectively connected to different bending sections 1030b.

[0040] Step S20 : ​​applying a cover film 1060 to the flexible core board and performing subsequent processing to form the flexible circuit board 10 .

[0041] First, the circuit pattern of the flexible core board is designed to include a first connector end 1010, a head end connecting section 1020, a circuit distribution section 1030 (including an upper coil section 1030a, a bending section 1030b and a lower coil section 1030c), a tail end connecting section 1040 and a second connector end 1050, wherein the upper coil section 1030a and the lower coil section 1030c are both open coil sections, and are respectively connected to different bending sections 1030b to form a "snake-shaped" circuit pattern as a whole. Then, the flexible core board with the completed circuit pattern is covered with a film 1060 to protect the internal circuit from the influence of the external environment, providing a processing basis for subsequent processes.

[0042] It is worth noting that the shapes of the head end connecting section 1020 and the bending section 1030b are both straight lines. On the one hand, it can reduce the complexity of processing, and on the other hand, it is more conducive to the subsequent lamination process, effectively avoiding irregular graphic lamination, which is prone to problems such as gluing or cracking at the edges.

[0043] For further information, see Figure 3 , partially enlarged schematic diagram FD; forming a flexible core board, making a circuit pattern, and then removing the insulating dielectric layer in several bending segments 1030b, the circuit pattern in the bending segment 1030b forms a first hollow circuit 1060a, including a flexible core board insulation layer 1080, and the entire board forms a flexible core board.

[0044] By forming the circuit of the bending section 1030b into a first hollow circuit 1060a, the region has better bending performance when being bent and folded in the subsequent process, thereby preventing the covering film 1060 in the region from wrinkling or delamination due to a large area, and preventing excessive bending from affecting the transmission of electrical signals.

[0045] Furthermore, the flexible circuit board 10 is formed by attaching a covering film 1060 (including a covering film adhesive layer 1062 and a covering film PI layer 1061) (Note: PI in this application refers to polyimide) to the flexible core board, and then laser milling the covering film 1060 corresponding to the first hollow circuit 1060a to form a second hollow circuit 1060b.

[0046] By forming the first hollowed-out circuit 1060a in the bent section 1030b of the flexible core, then applying the cover film 1060, and finally forming the second hollowed-out circuit 1060b, the adhesive layer of the cover film 1060 "wrappes" the first hollowed-out circuit 1060a. This design effectively strengthens the bonding between the layers, as the edges are free of the flexible core's insulating layer, allowing the adhesive layer to better adhere to the circuit pattern.

[0047] Furthermore, the first hollow circuit 1060a is manufactured first and then subsequent steps are designed so that the first hollow circuit 1060a is tightly wrapped by the adhesive layer of the covering film 1060, thereby enhancing the stability of the first hollow circuit 1060a and improving the ability of the first hollow circuit 1060a to resist the influence of the external environment, thereby improving the reliability and service life of the entire circuit board.

[0048] Furthermore, the single side of the first hollow circuit 1060a is smaller than the second hollow circuit 1060b, ensuring that the bending area has better flexibility and adaptability without affecting the transmission of electrical signals, reducing problems such as wrinkles and delamination that may occur during bending, and can consolidate the "wrapping" effect of the glue formed by the second hollow circuit 1060b on the first hollow circuit 1060a, improve the bending performance of the bending area, and effectively prevent the side of the copper surface of the first hollow circuit 1060a from being exposed, and reduce the risks of oxidation and aging of the exposed copper surface of the first hollow circuit 1060a during application.

[0049] Preferably, the size of the first hollow circuit 1060a is smaller than that of the second hollow circuit 1060b by 20 μm to 75 μm.

[0050] Furthermore, the flexible core board is formed by forming a circuit pattern according to the design data, and then attaching a pure adhesive layer 1070 to the plurality of upper coil segments 1030a and the plurality of lower coil segments 1030c.

[0051] By attaching a pure adhesive layer 1070 to the area of ​​the upper coil segment 1030a and the lower coil segment 1030c, and then attaching a covering film 1060 to the bending segment 1030b, the subsequent bending segments 1030b can be stacked and directly pressed and adhered (no need to attach the adhesive layer 2030 separately), instead of uniformly coating the adhesive layer on the entire structure. This can significantly reduce the additional thickness increase and effectively reduce the overall thickness of the board. Furthermore, it can reduce the space occupied during application, which means that more functions or components can be integrated in a limited space, which is conducive to promoting the miniaturization of electronic devices, and can also improve production efficiency, reduce process steps, reduce the risk of errors caused by multi-step operations, and help improve the yield rate.

[0052] Preferably, the pure adhesive layer 1070 is an acrylic adhesive layer, an epoxy resin adhesive layer or a PET adhesive layer.

[0053] Furthermore, the covering film 1060 is applied by cutting the first covering film corresponding to the bending section 1030 b to form a pattern covering film, and then aligning and attaching the pattern covering film to the bending section 1030 b.

[0054] Furthermore, the graphic cover film extends into the upper coil segment 1030a and the lower coil segment 1030c to provide support and protection for the bending area, thereby avoiding excessive stress at the edges during the bending process, which may cause the graphic cover film to warp, break or be damaged. At the same time, it improves the overall flexibility and durability of the circuit board, ensuring that it can maintain good electrical performance after multiple bends.

[0055] Preferably, the patterned cover film extends into the upper coil segment 1030a and the lower coil segment 1030c by a distance of 20 μm to 75 μm.

[0056] See also Figure 6 , Figure 6 Schematic cross-sectional view of a mold according to an embodiment of the present invention.

[0057] This embodiment also provides a method for manufacturing a laminated inductor circuit board, which uses a previous process to prepare a flexible circuit board 10 for lamination, that is, folding a plurality of bending sections 1030b in sequence, and overlapping the upper coil section 1030a and the lower coil section 1030c to form concentric coils.

[0058] By optimizing the circuit design in the previous process, multiple bending segments 1030b are folded in sequence, so that the upper coil segment 1030a and the lower coil segment 1030c can be overlapped together in the form of concentric circles and then pressed together. The pure glue layer 1070 attached in the previous process forms a bonding effect between the upper coil segments 1030a and the lower coil segments 1030c to form an overall laminated structure. By enabling the upper coil segment 1030a and the lower coil segment 1030c to complete the interlayer connection without relying on through holes or laminated blind holes, this design avoids the through hole or laminated blind hole technology in traditional methods, thereby reducing the number of cross-layer connection points, reducing the possibility of inductance interference, and improving inductance accuracy.

[0059] Further, the lamination is as follows: a mold 20 is made ( Figure 6 The portion that does not contain the laminated structure 200 is the mold 20), the mold 20 includes a top mold 2010 and a bottom mold 2020, the bottom mold 2020 is provided with a bump 2020a, the bump 2020a corresponds to the center of the concentric circle, the top mold 2010 has a window 2010a corresponding to the bump 2020a, the mold 20 is used to laminate the flexible circuit board 10, and then press it to form a laminated plate.

[0060] Specifically, a mold 20 is manufactured according to product design requirements. The mold 20 includes a top mold 2010 and a bottom mold 2020. The bottom mold 2020 is provided with a protrusion 2020a whose position corresponds to the center of the concentric coil to be formed on the final circuit board. The top mold 2010 has a window 2010a at the corresponding position to leave space for the protrusion 2020a during the lamination process. The designed flexible circuit board 10 is stacked and arranged in layers. The prepared laminated board is accurately inserted into the protrusion 2020a on the bottom mold with its center hole, and the coil can form a concentric circle layout according to the predetermined design. The top mold 2010 is placed on the bottom mold 2020 so that the window 2010a on the top mold 2010 corresponds exactly to the protrusion 2020a on the bottom mold 2020, forming a laminated structure 200 as a whole. Then, a certain temperature and pressure are applied to the assembled laminated structure 200 by special equipment to promote close bonding between the layers of material to form a laminated board.

[0061] Furthermore, the size of the window 2010a on one side is larger than the size of the bump 2020a, preferably, larger than 20 μm to 100 μm.

[0062] Furthermore, the height of the bump 2020a is higher than the thickness of the pressing plate and smaller than the thickness of the top mold 2010. The thinner top mold 2010 and bottom mold 2020 help improve the thermal conductivity efficiency because they can reduce the resistance on the heat conduction path and effectively transfer heat from the heating source to the pressing plate to be pressurized, which helps to ensure uniform heating and avoid local overheating or insufficient cooling. In addition, a mold 20 of appropriate thickness can ensure a more uniform pressure distribution across the entire pressing plate. If the mold 20 is too thick, it may cause uneven pressure distribution and affect the pressing quality.

[0063] Optionally, the thickness of the top mold 2010 and the bottom mold 2020 are both 0.5 mm to 3.0 mm.

[0064] Optionally, the mold 20 can be made using scrapped circuit boards with smooth surfaces (preferably rigid circuit boards). For example, two scrapped circuit boards are taken, and a hole is opened on one of them according to the distribution and size of the center hole. The plate body removed after the hole opening is bonded to the surface of the other circuit board at the position corresponding to the center hole to form a bump 2020a, and the bottom mold 2020 is formed as a whole.

[0065] Optionally, the base mold 2020 can also be made by: designing the position of the bump 2020a on the surface of another circuit board, silk-screening water glue, or attaching pure glue, pressing, forming the bump 2020a, and forming the base mold 2020. Regardless of whether silk-screening water glue or attaching pure glue is used, it needs to be pressed after the glue material is applied to ensure that the glue layer is evenly distributed and firmly bonded to the circuit board, and at the same time form the required bump 2020a.

[0066] Optionally, the top mold 2010 and the bottom mold 2020 are also provided with alignment holes and alignment pins. After alignment through the alignment holes, they are fixed with pins to ensure that each component can be accurately aligned during the assembly process, thereby achieving precise positioning and fixation between components.

[0067] It is worth noting that the diameter of the alignment hole is slightly larger than the maximum diameter of the alignment pin, but should not be too large to avoid inaccurate or unstable positioning due to excessive clearance.

[0068] The pressing in this embodiment is preferably rapid pressing, and the pressing pressure is 10 kg / cm 2 Up to 30kg / cm 2 , preferably 15kg / cm 2 、18kg / cm 2 or 20kg / cm 2; Pressing time is 10min to 30min, preferably 20min or 25min; Pressing temperature is 100℃ to 160℃, preferably 120℃ or 150℃.

[0069] Since the presence of the mold 20 will have an obstructive effect on the lamination process, fast lamination is used in combination with a longer lamination time to distribute heat more evenly over the entire laminated board. This not only shortens the production cycle, but also ensures a strong bond between the layers, improves the quality and reliability of the final product, and helps reduce defects caused by uneven heating or pressurization. It is crucial for applications that require a good connection between each layer. Proper temperature control promotes the flow of resin, allowing it to fully fill the gaps while expelling air and other impurities that may affect electrical performance, thereby improving the consistency and reliability of the finished circuit board.

[0070] Furthermore, potting the laminate can effectively isolate moisture, dust and other pollutants in the external environment, thereby preventing these factors from damaging the internal circuits. At the same time, filling the gaps on the laminate and covering the components with potting glue can also provide additional mechanical support and reduce the risk of damage caused by vibration or impact.

[0071] Optionally, the potting compound can be made into a potting compound mold, and the potting compound is poured into the position of the press plate except the first joint end 1010 and the second joint end 1050. When it is then used, the first joint end 1010 and the second joint end 1050 are welded to other components. The purpose of this method is to make the press plate form a firm overall inductor circuit board structure; or, other components can be welded to the first joint end 1010 and the second joint end 1050 first, and then a potting compound mold is made, and the position of the overall press plate including the first joint end 1010 and the second joint end 1050 is potted with potting compound. The purpose of this method is to make the inductor circuit board as a whole form a sealed, firm and waterproof structure after welding.

[0072] Optionally, the potting compound is epoxy resin, polyurethane or silicone rubber.

[0073] It is worth noting that since the design and processing of the flexible circuit board 10 and the multilayer inductor circuit board in this embodiment are relatively precise, the structure of the actual processing process and the thickness of each layer, line width and other dimensions are all at the micron level. If the drawings are made according to the enlarged ratio of the actual structure, the problem of unclear illustrations will occur. Therefore, in order to more clearly and intuitively represent the implementation process of the manufacturing method of this embodiment, the drawings of this embodiment are all schematic diagrams that enlarge the technical features, which do not represent the dimensions of the actual structure, nor are they enlarged drawings of the actual structure in proportion.

[0074] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. All equivalent structural transformations made by using the contents of the present invention description and drawings under the inventive concept of the present invention, or direct / indirect application in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A method for manufacturing a flexible circuit board, characterized in that: The production method comprises the following steps: S10: Take the flexible copper clad board, make a circuit pattern, and form a flexible core board; The circuit pattern is composed of a first connector end, a head end connection section, a circuit distribution section, a tail end connection section and a second connector end in sequence; The line distribution section is composed of a plurality of upper coil sections, a plurality of bending sections and a plurality of lower coil sections in a cyclic alternating manner; The upper coil segment and the lower coil segment are both open coil segments, and the openings are respectively connected to the bent segments; The circuit pattern is formed as a whole in a "snake-like" shape; The flexible core board is formed by, after making the circuit pattern, attaching a pure adhesive layer to both the upper coil segment and the lower coil segment; S20: applying a cover film to the flexible core board and performing subsequent processing to form the flexible circuit board; The covering film is attached by cutting the first covering film corresponding to the bending section to form a pattern covering film, and then aligning and attaching the pattern covering film to the bending section.

2. The method for manufacturing a flexible circuit board according to claim 1, wherein: The flexible core board is formed by making the circuit pattern, then removing the insulating medium layer in several of the bending sections, the circuit pattern in the bending sections forms a first hollow circuit, and the entire board forms the flexible core board.

3. The method for manufacturing a flexible circuit board according to claim 2, wherein: The flexible circuit board is formed by attaching the cover film to the flexible core board, and then laser milling the cover film corresponding to the first hollow circuit to form a second hollow circuit.

4. The method for manufacturing a flexible circuit board according to claim 3, wherein: A single side of the first hollow circuit is smaller than that of the second hollow circuit.

5. The method for manufacturing a flexible circuit board according to claim 1, wherein: The pattern cover film extends into the upper coil segment and the lower coil segment.

6. A method for manufacturing a laminated inductor circuit board, characterized in that: The laminated inductor circuit board is manufactured by laminating the flexible circuit board formed by the method for manufacturing a flexible circuit board according to any one of claims 1 to 5; the lamination is performed by folding a plurality of the bending segments in sequence and overlapping the coil segments to form concentric coils; The lamination is as follows: a mold is made, the mold includes a top mold and a bottom mold, the bottom mold is provided with a protrusion, the protrusion corresponds to the center of the concentric circle, the top mold opens a window corresponding to the protrusion, the flexible circuit board is laminated using the mold, and then pressed to form a pressed plate.

7. The method for manufacturing a laminated inductor circuit board according to claim 6, wherein: The pressed plate is subjected to a potting glue treatment.

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