Circuit board preparation laminating equipment based on continuous feeding structure

Abstract

The invention relates to the technical field of circuit board processing, and discloses a circuit board preparation laminating device based on a continuous feeding structure, which comprises a placing part, the placing part comprises a working table, and the working table is fixedly connected with a top plate through a stand column arranged on the upper surface of the working table; the workbench is slidably connected with two bearing plates which can be used for placing an external multilayer circuit board through a cavity formed in the workbench, and the number of the bearing plates is two. The circuit board preparation laminating equipment based on the continuous feeding structure can effectively solve the problems that in the prior art, after prepressing laminating equipment of a circuit board completes feeding operation of one circuit board, a pressing program is started, and the equipment enters a feeding preparation stage of the next circuit board until the pressing process of the multi-layer circuit board is completely finished; the problems that a large amount of time is lost due to accumulation of intermittent production operation, the productivity of a production line is seriously restricted, and the production efficiency is greatly reduced are solved.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board processing, and in particular to a circuit board preparation and bonding device based on a continuous feeding structure. Background Art

[0002] Circuit board, also known as printed circuit board or printed wiring board, is an indispensable and important component in electronic equipment. With the development of electronic technology, some high-end applications will use multi-layer boards composed of three or more conductive layers and insulating layers alternately stacked. It has higher integration and more complex circuit design capabilities, which can greatly reduce the size of the circuit board.

[0003] In the existing equipment, the pre-pressing and bonding equipment of the circuit board starts the pressing program after completing the loading operation of one circuit board. The equipment will not enter the loading preparation stage of the next circuit board until the pressing process of the multi-layer circuit board is completely completed. This intermittent production operation will cause a lot of time loss in accumulation, seriously restricting the production capacity of the production line and greatly reducing production efficiency. Summary of the invention

[0004] In view of the above-mentioned shortcomings of the prior art, the present invention provides a circuit board preparation and bonding equipment based on a continuous feeding structure, which can effectively solve the problem in the prior art that the circuit board pre-pressing and bonding equipment starts the pressing program after completing the loading operation of one circuit board, and the equipment will not enter the loading preparation stage of the next circuit board until the pressing process of the multi-layer circuit board is completely completed. This intermittent production operation will cause a lot of time loss in accumulation, seriously restricting the production capacity of the production line and greatly reducing production efficiency.

[0005] To achieve the above objectives, the present invention is implemented through the following technical solutions: The present invention provides a circuit board preparation and bonding device based on a continuous feeding structure, comprising: A placement part, the placement part includes a workbench, the workbench is fixedly connected to a top plate through a column arranged on its upper surface, the workbench is slidably connected to a carrier plate for placing an external multilayer circuit board through a cavity opened inside the workbench, two carrier plates are provided, one of the carrier plates near the top is slidably connected to the inside of the top plate through a hydraulic rod fixed on its upper surface, a guide groove connected to the inside of the cavity is opened inside the workbench, and a guide column slidably connected to the inner wall of the guide groove is fixedly connected to the lower surface of the carrier plate near the bottom end; A positioning part, used for fixing an external multi-layer circuit board; The positioning part includes positioning pins fixed on the upper surface of the carrier plate. The positioning pins are provided in two groups. The two groups of positioning pins are designed at a 90-degree angle. The interior of the carrier plate is provided with movable components that cooperate with the positioning pins to position the circuit board.

[0006] Furthermore, the circumferential outer surface of the guide column is sleeved with a spring connected to the bottom of a bearing plate near the bottom end, the bottom end of the spring is connected to the bottom of the inner wall of the cavity, and the movable component and the positioning pin are distributed on both sides of the bearing plate.

[0007] Furthermore, the movable component includes a slide groove opened on the upper surface of the carrier plate, the inner wall of the slide groove is slidably connected to a limiter that fits the side of the external circuit board, and the limiter is fixedly connected to a connecting rod through a connecting plate fixed on its outer surface.

[0008] Furthermore, a cylinder is embedded inside the workbench, an output end of the cylinder is fixedly connected to a buckle block, and an end of the connecting rod away from the limiting member is provided with a slot that fits with the outer surface of the buckle block.

[0009] Furthermore, a mechanical arm that can be used for continuous loading is fixedly connected above the workbench, and the outer surface of the buckle block adopts a sloped design.

[0010] Further, the limiter comprises a sliding seat, the outer surface of the sliding seat is fixedly connected to the side of the connecting plate away from the cylinder, the sliding seat, the circumferential inner wall of the sliding seat is slidably connected to the limit column, and the bottom end of the sliding seat is rotatably connected to a magnetic plate magnetically connected to the lower surface of the limit column; Wherein, the upper surface of the sliding seat is lower than the upper surface of the carrying plate.

[0011] Furthermore, a magnetic plate 1 is fixedly connected to the bottom of the inner wall of the slide and is magnetically connected to the lower surface of the magnetic plate. A placement groove connected to the inside of the slide is opened inside the workbench. A magnetic plate 2 is fixedly connected to the bottom of the inner wall of the placement groove and is magnetically connected to the lower surface of the magnetic plate. The upper surface of the magnetic plate 2 adopts a magnetic design with opposite magnetism to the upper surface of the magnetic plate 1, and the magnetic plate 1 adopts a magnetic design with the same magnetism as the lower surface of the limit column.

[0012] Furthermore, a limiting block is arranged at the bottom end of the sliding seat, a side of the limiting block close to the placement slot adopts an arc surface design, and a bottom edge of the magnetic plate adopts an arc edge design.

[0013] Compared with the prior art, the technical solution provided by the present invention has the following beneficial effects: The present invention is provided with two supporting plates, the upper supporting plate is slidably connected to the inside of the top plate through a hydraulic rod, and the lower supporting plate is slidably connected to the inside of the cavity. The upper surfaces of the two supporting plates are provided with positioning pins and movable components that can position the multi-layer circuit board. When the upper supporting plate is moved upward by the hydraulic rod, the multi-layer circuit board between the supporting plate and the top plate can be pressed, and the lower supporting plate can perform unloading and loading operations at this time; when the upper supporting plate is moved down to be almost parallel to the upper surface of the workbench by the hydraulic rod, the lower surface of the upper supporting plate is tightly fitted with the upper surface of the lower supporting plate, so that the multi-layer circuit board between the two supporting plates is pressed, and the upper surface of the upper supporting plate can complete the unloading and loading process. The upper and lower carrier plates are alternately pressed and loaded and unloaded. The equipment does not need to wait for a complete pressing to loading and unloading cycle before starting a new work. The rising and falling actions of the carrier plate can be completed in a short time, making the connection between the pressing and loading and unloading processes closer, further shortening a single production cycle, improving the production rhythm, greatly reducing the idle time of the equipment, realizing a continuous and uninterrupted production process, and significantly increasing the number of circuit board bonding per unit time, thereby improving the overall production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the prior art descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0015] Figure 1 It is a schematic diagram of the three-dimensional structure of an embodiment of the present invention; Figure 2 Schematic diagram of the cross-sectional structure of a workbench according to an embodiment of the present invention; Figure 3 This is a schematic diagram of the separation structure of the top plate, the carrying plate and the workbench according to an embodiment of the present invention; Figure 4 This is a schematic diagram of the structure of the load-bearing plate, the positioning pin and the slide groove according to an embodiment of the present invention; Figure 5 It is a schematic diagram of the structure of the active components of an embodiment of the present invention; Figure 6 is a schematic diagram of the cross-sectional structure of a load-bearing plate according to an embodiment of the present invention; Figure 7 It is a schematic diagram of the structure of a position limiting member according to an embodiment of the present invention; Figure 8 This is a state transformation diagram of the limiting member according to an embodiment of the present invention.

[0016] The numbers in the figure represent respectively: 1. placement part; 11. workbench; 111. guide groove; 112. guide column; 113. spring; 12. top plate; 13. load-bearing plate; 14. mechanical arm; 15. placement groove; 2. positioning part; 21. positioning pin; 22. movable component; 221. slide groove; 222. limit piece; 2221. sliding seat; 2222. limit column; 2223. magnetic plate; 2224. magnetic plate one; 2225. magnetic plate two; 223. connecting plate; 224. connecting rod; 225. cylinder; 226. snap block; 227. slot. DETAILED DESCRIPTION

[0017] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0018] The present invention will be further described below in conjunction with the embodiments.

[0019] Example:

[0020] See also Figure 1-Figure 8 The present invention provides a technical solution: a circuit board preparation and bonding device based on a continuous feeding structure, comprising: The placing part 1 comprises a workbench 11, the workbench 11 is fixedly connected with a top plate 12 through a column arranged on its upper surface, the workbench 11 is slidably connected with a carrier plate 13 for placing an external multilayer circuit board through a cavity opened inside the workbench 11, two carrier plates 13 are provided, one carrier plate 13 near the top is slidably connected with the inside of the top plate 12 through a hydraulic rod fixed on its upper surface, a guide groove 111 connected with the inside of the cavity is opened inside the workbench 11, a guide column 112 slidably connected with the inner wall of the guide groove 111 is fixedly connected with the lower surface of a carrier plate 13 near the bottom end, and a spring 113 connected with the bottom of a carrier plate 13 near the bottom end is sleeved on the circumferential outer surface of the guide column 112, and the bottom end of the spring 113 is connected with the bottom of the inner wall of the cavity; The positioning portion 2 is used to fix the external multi-layer circuit board.

[0021] The positioning portion 2 includes positioning pins 21 fixed on the upper surface of the carrier plate 13. Two groups of positioning pins 21 are provided. The two groups of positioning pins 21 are designed to be at a ninety-degree angle. The interior of the carrier plate 13 is provided with movable components 22 that cooperate with the positioning pins 21 to position the circuit board. The movable components 22 and the positioning pins 21 are distributed on both sides of the carrier plate 13.

[0022] The movable component 22 includes a slide groove 221 opened on the upper surface of the carrier plate 13. The inner wall of the slide groove 221 is slidably connected to a limiter 222 that fits the side of the external circuit board. The limiter 222 is fixedly connected to a connecting rod 224 through a connecting plate 223 fixed on its outer surface.

[0023] A cylinder 225 is embedded inside the workbench 11, and a snap block 226 is fixedly connected to the output end of the cylinder 225. A slot 227 that fits with the outer surface of the snap block 226 is formed at one end of the connecting rod 224 away from the limiting member 222, and the side of the connecting rod 224 away from the limiting member 222 extends to the inside of the workbench 11 to form the slot 227.

[0024] A robotic arm 14 that can be used for continuous loading is fixedly connected above the workbench 11. The outer surface of the snap block 226 adopts a bevel design. The snap block 226 has a certain thickness and can adapt to the pressing of different circuit boards. At the same time, the bevel design of the outer surface can guide the slot 227 on the outer surface of the connecting rod 224.

[0025] The limiting member 222 includes a sliding seat 2221, the outer surface of the sliding seat 2221 is fixedly connected to the side of the connecting plate 223 away from the cylinder 225, the sliding seat 2221, the circumferential inner wall of the sliding seat 2221 is slidably connected to the limiting column 2222, and the bottom end of the sliding seat 2221 is rotatably connected to a magnetic plate 2223 that is magnetically connected to the lower surface of the limiting column 2222; The upper surface of the sliding seat 2221 is lower than the upper surface of the carrying plate 13 .

[0026] A magnetic plate 1 2224 magnetically connected to the lower surface of the magnetic plate 2223 is fixedly connected to the bottom of the inner wall of the slide groove 221, and a placement groove 15 connected to the inside of the slide groove 221 is opened inside the workbench 11. A magnetic plate 2 2225 magnetically connected to the lower surface of the magnetic plate 2223 is fixedly connected to the bottom of the inner wall of the placement groove 15, and the upper surface of the magnetic plate 2225 adopts a magnetic design with opposite magnetic properties to the upper surface of the magnetic plate 1 2224, and the magnetic plate 1 2224 adopts a magnetic design with the same magnetic properties as the lower surface of the limit column 2222.

[0027] A limit block is provided at the bottom of the sliding seat 2221, and a side of the limit block close to the placement slot 15 is designed with an arc surface, and the bottom edge of the magnetic plate 2223 is designed with an arc edge. The limit block with an arc surface design avoids damage caused by collision when the magnetic plate 2223 rotates.

[0028] Before the multi-layer circuit board is pressed at high temperature and high pressure, it will be pressed at room temperature and low pressure by pre-pressing equipment. Its main purpose is to ensure the alignment accuracy between the layers of the multi-layer circuit board during the high temperature and high pressure pressing process. By quickly pressing at room temperature and low pressure, the position of each layer can be initially fixed, reducing the inter-layer offset that may occur during the subsequent high temperature and high pressure process. The pre-pressing and laminating step can help improve the smoothness of the production line, reduce the adjustment time and scrap rate during the high temperature and high pressure pressing stage, and thus improve the overall production efficiency.

[0029] When the limiting member 222 is in the slide groove 221, the magnetic plate 2223 is parallel to the upper surface of the supporting plate 13. Taking the upper surface of the magnetic plate 2223 in this state as an example, the lower surface of the magnetic plate 2223 is the N pole, the upper surface of the magnetic plate 1 2224 is the S pole, the upper surface of the magnetic plate 2 2225 is the N pole, and the bottom end of the limiting column 2222 is the S pole.

[0030] In the initial state, the upper surface of the upper carrier plate 13 is tightly close to the lower surface of the top plate 12, and a multilayer circuit board is placed between the carrier plate 13 and the top plate 12, and a pressing process is performed. The carrier plate 13 at the bottom is slidably connected inside the cavity, and under the action of the spring 113, its upper surface is almost flush with the upper surface of the workbench 11. The positioning pins 21 and the movable components 22 are symmetrically distributed with the carrier plate 13 as the center, and two groups of positioning pins 21 and movable components 22 are provided. Among them, the two groups of positioning pins 21 are distributed on the adjacent two sides of the upper surface of the carrier plate 13, and the angle between the two groups of positioning pins 21 is ninety degrees, and the overall distribution is L-shaped. The two groups of movable components 22 are distributed on the other two sides of the upper surface of the carrier plate 13, and the overall distribution is L-shaped. The two groups of positioning pins 21 and the two groups of movable components 22 are diagonally distributed above the carrier plate 13.

[0031] The process of loading multi-layer circuit boards: The cylinder 225 is initially in a contracted state, and the stopper 222 is inside the placement slot 15. Since there is a certain gap between the bottom of the stopper 222 and the bottom of the inner wall of the placement slot 15, the magnetic plate 2223 can rotate at the bottom of the sliding seat 2221. Since the lower surface of the inner wall of the placement slot 15 is fixedly connected with the second magnetic plate 2225 whose upper surface is the N magnetic pole, the side of the S magnetic pole of the magnetic plate 2223 is connected by the magnetic force of the second magnetic plate 2225, and the sliding seat 2221 rotates inside and is in an inclined state. At this time, the S magnetic pole side of the magnetic plate 2223 is on the lower surface, and the N magnetic pole side is on the upper surface. The S magnetic pole at the lower end of the stopper 2222 is at the bottom of the inner wall of the sliding seat 2221 under the magnetic attraction of the N magnetic pole on the upper surface of the magnetic plate 2223. At this time, the upper surface of the stopper 2222 is lower than the upper surface of the carrier plate 13, which does not affect the loading and unloading of the circuit board.

[0032] In actual application, the mechanical arm 14 in the placement part 1 is used to place the multi-layer circuit board to be processed on the surface of the lower carrier plate 13, and the cylinders 225 on both sides are activated by the driving base. The connecting rod 224 in the lower carrier plate 13 is engaged with the buckle block 226 at the output end of the cylinder 225 through the groove 227 on its outer surface, and the cylinder 225 drives the connecting rod 224 to move toward the side close to the positioning pin 21. The end of the connecting rod 224 away from the cylinder 225 is connected to the limiter 222 through the connecting plate 223, driving the limiter 222 to move away from the cylinder 225.

[0033] Since the square side of the magnetic plate 2223 is blocked by the stopper on the lower surface of the sliding seat 2221, the magnetic plate 2223 is in an inclined state. At this time, the arc edge of the magnetic plate 2223 is lower than the lower surface of the inner wall of the slide slot 221, and the connection between the slide slot 221 and the placement slot 15 forms a step shape. When the stopper 222 moves away from the cylinder 225, the sliding seat 2221 moves relatively, and the lower surface of the magnetic plate 2223 is briefly paused by the step and completes the rotation inside the sliding seat 2221. At this time, the magnetic plate 2223 is in a horizontal state, the lower surface of the magnetic plate 2223 is an N magnetic pole, which is attracted to the upper surface of the magnetic plate 1 2224; the upper surface of the magnetic plate 2223 is an S magnetic pole, and the bottom end of the stopper 2222 is also an S magnetic pole. The same poles repel each other, and the stopper 2222 is in a protruding state extending out of the sliding seat 2221.

[0034] The upper surface of the sliding seat 2221 is lower than the height of the upper surface of the carrier plate 13, and the height of the limiting column 2222 protruding from the upper surface of the carrier plate 13 is greater than the thickness of the multilayer circuit board, which can move one side of the multilayer circuit board toward the positioning pin 21 at the same time, while the other set of limiting members 222 moves the other side of the multilayer circuit board toward the positioning pin 21 on the other side. The cylinder 225 continues to drive the limiting member 222 to move until two sides of the circuit board are in contact with the circumferential outer surface of the positioning pin 21, and the other two adjacent sides are in contact with the circumferential outer surface of the limiting column 2222. The cylinder 225 stops outputting and maintains the current state. At this time, the four sides of the multilayer circuit board are fixed by the positioning part 2, which can prevent the circuit board from being offset in the lateral, longitudinal and horizontal rotation directions during the lamination pre-pressing process, so that the circuit elements and circuits on the circuit board can be accurately docked, avoiding problems such as circuit misalignment, short circuit or open circuit, thereby improving the product yield.

[0035] The process of pressing the circuit board: After the multi-layer circuit board is fixed, the hydraulic rod inside the top plate 12 is started, driving the upper supporting plate 13 to move downward. The upper supporting plate 13 gradually moves downward, and the distance between the upper and lower supporting plates 13 becomes smaller until the positioning pin 21 on the upper surface of the lower supporting plate 13 enters the positioning groove on the lower surface of the upper supporting plate 13. As it continues to move downward, the lower surface of the upper supporting plate 13 fits into the upper surface of the limiting column 2222. The pressure applied by the hydraulic rod to the limiting column 2222 is greater than the magnetic force that repels the limiting column 2222 from the upper surface of the magnetic plate 2223. The limiting column 2222 is inside the sliding seat 2221 and moves downward, so that the lower surface of the upper supporting plate 13 contacts the upper surface of the multi-layer circuit board.

[0036] Under the action of the hydraulic rod, the upper carrier plate 13 continues to squeeze the lower carrier plate 13 and continue to move downward, the distance between the lower carrier plate 13 and the lower surface of the inner wall of the cavity decreases, the spring 113 undergoes elastic deformation, and the length of the guide column 112 in the guide groove 111 gradually increases. At the same time, the card slot 227 at the outer end of the connecting rod 224 in the lower carrier plate 13 is separated from the buckle block 226 at the output end of the cylinder 225, and the connecting rod 224 maintains this state gradually (the limiter 222 is magnetically attracted to the upper surface of the magnetic plate 2223 and the magnetic plate 2224, and is in a fixed state, which ensures the stability of the circuit board during pressing and avoids the displacement of the connecting rod 224 position), and stably moves to the bottom of the through slot opened on the upper surface of the workbench 11. Until the spring 113 is compressed to the extreme, the upper carrier plate 13 continues to give a certain pressure to the lower carrier plate 13, and the multi-layer circuit board is pre-pressed.

[0037] At the same time, the connecting rod 224 inside the upper carrier plate 13 is engaged with the buckle block 226 at the output end of the cylinder 225 through the clamping groove 227. The buckle block 226 has a certain thickness, which can well receive the clamping groove 227 at the outer end of the connecting rod 224. At the same time, it can adapt to the pressing of circuit boards of different thicknesses, so that the height difference between the upper surface of the upper carrier plate 13 and the upper surface of the workbench 11 is within a certain range, and the cylinder 225 can achieve the engagement with the upper connecting rod 224 (the multi-layer circuit board is slightly thicker, and the upper surface of the carrier plate 13 is slightly higher in this state; the multi-layer circuit board is slightly thinner, and the upper surface of the carrier plate 13 is slightly lower in this state).

[0038] The process of unloading the circuit board that has been pressed on the surface of the upper carrier plate 13: After the output end of the cylinder 225 embedded in the workbench 11 is engaged with the outer end of the connecting rod 224 above, the cylinder 225 is started, driving the connecting plate 223 and the stopper 222 to recover backward. The connecting rod 224 drives the stopper 222 to move away from the positioning pin 21, and the circumferential outer surface of the stopper 2222 is separated from the side of the multi-layer circuit board after pressing. As the sliding seat 2221 continues to slide and connect inside the slide groove 221, the lower surface of the inner wall of the slide groove 221 at this position no longer has the magnetic plate 1 2224. When the sliding seat 2221 enters the inside of the placement groove 15, the lower surface of the magnetic plate 2223 does not contact the object and is inside the placement groove 15. Under the action of the N-pole magnetism of the bottom magnetic plate 2225, the magnetic plate 2223 rotates rapidly, and its S-pole magnetic side approaches downward. The magnetic plate 2223 is in an inclined state, and its square side is blocked by the stopper on the lower surface of the sliding seat 2221.

[0039] At this time, the N pole of the magnetic plate 2223 is facing upward, and the bottom end of the limit column 2222 is quickly attracted and moves downward inside the sliding seat 2221. In this state, the bottom end of the limit column 2222 is lower than the upper surface of the carrier plate 13, so as to avoid hindering the mechanical arm 14 from unloading the pressed multi-layer circuit board. After unloading, the mechanical arm 14 places the raw materials of the multi-layer circuit board on the carrier plate 13 again, and continues to start the cylinder 225, driving the connecting plate 223 and the limit member 222 to move toward the positioning pin 21, and fixes the new round of multi-layer circuit boards in four directions. After the fixation is completed, the cylinder 225 stops moving.

[0040] The top plate 12 drives the hydraulic rod to move the upper supporting plate 13 upward, driving a new round of multi-layer circuit boards to approach the lower surface of the top plate 12. After the supporting plate 13 below is released from the pressing, it moves upward under the action of the spring 113 until its upper surface is almost in the same plane with the upper surface of the workbench 11, and repeats the above actions. After the cylinder 225 drives the limiter 222 to recover, the robotic arm 14 loads the pressed circuit boards and performs the next round of loading again.

[0041] In summary, this equipment has the following advantages when laminating and pressing multi-layer circuit boards: Advantage 1: Two carrying plates 13 are provided, and the upper surface of the carrying plate 13 is provided with positioning pins 21 and movable components 22 that can position the multi-layer circuit board. When the upper carrying plate 13 is moved upward by the hydraulic rod, the multi-layer circuit board between the carrying plate 13 and the top plate 12 can be pressed, and the lower carrying plate 13 can perform unloading and loading operations at this time; when the upper carrying plate 13 is moved down by the hydraulic rod to be almost parallel to the upper surface of the workbench 11, the lower surface of the upper carrying plate 13 is tightly fitted with the upper surface of the lower carrying plate 13, so that the multi-layer circuit board between the two carrying plates 13 is pressed, and the upper surface of the upper carrying plate 13 can complete the unloading and loading process. The upper and lower carrier plates 13 are alternately pressed and loaded and unloaded. The equipment does not need to wait for a complete pressing to loading and unloading cycle to start a new work. The rising and falling actions of the carrier plate 13 can be completed in a short time, making the connection between the pressing and loading and unloading processes closer, further shortening a single production cycle, improving the production rhythm, greatly reducing the idle time of the equipment, realizing a continuous and uninterrupted production process, and significantly increasing the number of circuit board bonding per unit time, thereby improving the overall production efficiency.

[0042] Advantage 2: When fixing the multi-layer substrate, the positioning pin 21 does not move, and the limit member 222 slides inside the slide groove 221 through the cylinder 225, which can adapt to the pressing of multi-layer circuit boards of different sizes within a certain range, improve production flexibility, and meet the needs of diversified orders.

[0043] Advantage three: two adjacent sides of the carrier plate 13 are fixed with positioning pins 21, and the multi-layer circuit substrate in the middle is stably placed by moving the limiting members 222 on the other two sides. It is only necessary to adjust the mortgage position of the limiting member 222 through the connecting rod 224, and there is no need to manually replace the fixture, which improves the convenience of the equipment.

[0044] Advantage 4: After the multi-layer circuit board is fixed by the limit piece 222, the magnetic plate 2223 of the limit piece 222 in the slide groove 221 has opposite magnetic poles to the upper surface of the magnetic plate 2224, and attracts each other, thereby ensuring the stability of the magnetic plate 2223 during the pressing process, ensuring the precise positioning of the multi-layer circuit board during the pressing process, reducing deviation, improving the accuracy and quality of the product, and correspondingly reducing the adjustment time and scrap rate in the subsequent high temperature and high pressure pressing stage, thereby improving the smoothness and overall efficiency of the production line.

[0045] Advantage 5. During the positioning process of the circuit board, the limiting column 2222 is affected by the opposite magnetic poles of the magnetic plate 2223, protruding from the outer surface of the carrier plate 13, and the distance between the top end of the limiting column 2222 and the upper surface of the carrier plate 13 is greater than the thickness of the multi-layer circuit board. During pressing, the limiting column 2222 contacts the lower surface of the carrier plate 13 or the top plate 12 above it, and can adapt to the remaining thickness of the circuit board under compression and always maintain the limit. The limiting column 2222 can be compressed during pressing by the design of magnetic repulsion with the upper surface of the magnetic plate 2223, and can adapt to multi-layer circuit boards of different thicknesses within a certain range, thereby improving the production flexibility of the equipment and being able to quickly adapt to different production needs.

[0046] Advantage six: when the cylinder 225 drives the limit piece 222 to move into the placement slot 15, the magnetic plate 2223 is magnetically connected to the upper surface of the magnetic plate 2225, rotates instantly, and drives the limit column 2222 to quickly shrink inside the sliding seat 2221. At this time, the upper surface of the limit column 2222 is lower than the height of the upper surface of the supporting plate 13, avoiding possible obstructions during the loading and unloading process, allowing the robotic arm 14 to operate more smoothly.

[0047] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements will not cause the essence of the corresponding technical solutions to deviate from the protection scope of the technical solutions of the embodiments of the present invention.

Claims

1. A circuit board preparation and bonding device based on a continuous feeding structure, characterized in that: include: A placement portion (1), the placement portion (1) comprising a workbench (11), the workbench (11) being fixedly connected to a top plate (12) via a column arranged on its upper surface, the workbench (11) being slidably connected to a carrier plate (13) for placing an external multilayer circuit board via a cavity provided inside the workbench (11), two carrier plates (13) being provided, one of the carrier plates (13) near the top being slidably connected to the inside of the top plate (12) via a hydraulic rod fixed on its upper surface, the inside of the workbench (11) being provided with a guide groove (111) communicating with the inside of the cavity, and the lower surface of one of the carrier plates (13) near the bottom being fixedly connected to a guide column (112) slidably connected to the inner wall of the guide groove (111); A positioning portion (2), used for fixing an external multi-layer circuit board; The positioning portion (2) comprises positioning pins (21) fixed on the upper surface of the carrier plate (13), two groups of positioning pins (21) are provided, and the two groups of positioning pins (21) are designed to be at an angle of ninety degrees. The interior of the carrier plate (13) is provided with movable components (22) that can cooperate with the positioning pins (21) to position the external circuit board.

2. The circuit board preparation and bonding equipment based on a continuous feeding structure according to claim 1, characterized in that: The outer circumferential surface of the guide column (112) is sleeved with a spring (113) connected to the bottom of a bearing plate (13) near the bottom end, the bottom end of the spring (113) is connected to the bottom of the inner wall of the cavity, and the movable component (22) and the positioning pin (21) are distributed on both sides of the bearing plate (13).

3. The circuit board preparation and bonding equipment based on a continuous feeding structure according to claim 2, characterized in that: The movable component (22) comprises a slide groove (221) formed on the upper surface of the carrier plate (13); the inner wall of the slide groove (221) is slidably connected to a stopper (222) that fits the side surface of the external circuit board; the stopper (222) is fixedly connected to a connecting rod (224) via a connecting plate (223) fixed to its outer surface.

4. The circuit board preparation and bonding equipment based on a continuous feeding structure according to claim 3, characterized in that: A cylinder (225) is embedded inside the workbench (11), an output end of the cylinder (225) is fixedly connected to a buckle block (226), and an end of the connecting rod (224) away from the limiting member (222) is provided with a clamping groove (227) that fits with the outer surface of the buckle block (226).

5. The circuit board preparation and bonding equipment based on a continuous feeding structure according to claim 4, characterized in that: A mechanical arm (14) that can be used for continuous loading is fixedly connected above the workbench (11), and the outer surface of the buckle block (226) adopts a sloped design.

6. The circuit board preparation and bonding equipment based on a continuous feeding structure according to claim 4, characterized in that: The limiting member (222) comprises a sliding seat (2221), the outer surface of the sliding seat (2221) being fixedly connected to a side of the connecting plate (223) away from the cylinder (225), the circumferential inner wall of the sliding seat (2221) being slidably connected to the limiting column (2222), and the bottom end of the sliding seat (2221) being rotatably connected to a magnetic plate (2223) magnetically connected to the lower surface of the limiting column (2222); Wherein, the upper surface of the sliding seat (2221) is lower than the upper surface of the bearing plate (13).

7. The circuit board preparation and bonding equipment based on a continuous feeding structure according to claim 6, characterized in that: The bottom of the inner wall of the slide groove (221) is fixedly connected to a magnetic plate 1 (2224) magnetically connected to the lower surface of the magnetic plate (2223); the interior of the workbench (11) is provided with a placement groove (15) connected to the interior of the slide groove (221); the bottom of the inner wall of the placement groove (15) is fixedly connected to a magnetic plate 2 (2225) magnetically connected to the lower surface of the magnetic plate (2223); the upper surface of the magnetic plate 2 (2225) is designed with a magnetic force opposite to that of the upper surface of the magnetic plate 1 (2224); and the magnetic plate 1 (2224) is designed with a magnetic force identical to that of the lower surface of the limiting column (2222).

8. The circuit board preparation and bonding equipment based on a continuous feeding structure according to claim 7, characterized in that: A limit block is provided at the bottom end of the sliding seat (2221), and a side of the limit block close to the placement slot (15) adopts a curved surface design, and the bottom edge of the magnetic plate (2223) adopts a curved edge design.

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