Display module

Abstract

The invention provides a display module which comprises an LED chip, a substrate assembly and a packaging adhesive layer, the packaging adhesive layer completely covers the LED chip, the substrate assembly further comprises a first heat dissipation layer arranged on the back face of a substrate body, the first heat dissipation layer is made of an insulating material, and the first heat dissipation layer covers a positive electrode circuit layer and a negative electrode circuit layer. The first heat dissipation layer is arranged on the back face of the substrate body to cover the positive electrode circuit layers and the negative electrode circuit layers, the first heat dissipation layer is made of insulation materials, short circuit of the positive electrode circuit layers and the negative electrode circuit layers can be avoided, protection can be formed on the positive electrode circuit layers and the negative electrode circuit layers, and the reliability is improved; and meanwhile, the heat transferred to the positive electrode circuit layer and the negative electrode circuit layer can be quickly dissipated outwards through the first heat dissipation layer, so that the heat dissipation efficiency can be further improved.

Description

[0001] This application is a divisional application of the invention patent application with application date of December 30, 2021, application number 202111652677.X, and invention name “A substrate assembly”. Technical Field

[0002] The present invention relates to the field of display, and in particular to a substrate assembly. Background Art

[0003] Micro LED technology and Mini LED technology have ultra-high display quality and stability, can support higher brightness, high dynamic range and wide color gamut, and have low power consumption and energy saving, making them widely used in mobile phones, laptops, TVs, car displays, indoor studios and large outdoor displays, etc., attracting the attention of major manufacturers and researchers, who have invested in research and development.

[0004] However, for current products, the circuit layer is basically set on the front of the substrate, and the main way to dissipate heat is through the front encapsulation layer, which leads to poor bonding with the surface encapsulation layer and poor heat dissipation, making it impossible to effectively dissipate the large amount of heat generated by the LED chip, affecting the life and quality of the product. Therefore, how to effectively dissipate the heat of the product and improve its bonding with the encapsulation layer is an urgent problem to be solved. Summary of the invention

[0005] In view of the deficiencies of the above-mentioned related technologies, an object of the present invention is to provide a substrate assembly, aiming to solve the problems of how to effectively dissipate heat for products in existing packaging products and how to improve the bonding between the substrate assembly and the packaging adhesive layer.

[0006] In order to solve the above technical problems, the present invention provides a substrate assembly for a display module, comprising:

[0007] A substrate body, wherein the substrate body is an insulating substrate body;

[0008] A plurality of pad groups are arranged on the front surface of the substrate body, wherein one pad group includes two pads corresponding to the positive electrode and the negative electrode of the LED chip respectively;

[0009] A positive electrode circuit layer and a negative electrode circuit layer are arranged on the back side of the substrate body;

[0010] A plurality of first through holes provided on the substrate body and conductive members provided in the first through holes, wherein two pads in the pad group are electrically connected to the positive electrode circuit layer and the negative electrode circuit layer respectively through the corresponding conductive members;

[0011] A first heat-conducting layer is disposed on the front surface of the substrate body, wherein the first heat-conducting layer has an opening for exposing the pad group and is insulated and isolated from the pads in the pad group.

[0012] It should be noted that, in the substrate assembly provided in the present invention, each pad on the front side of the substrate body corresponds to a first through hole, and the positive and negative circuit layers are changed from being set on the front side of the substrate body to being set on the back side of the substrate body, and the pad on the front side is conductively connected to the positive and negative circuit layers corresponding to the back side through the conductive member of the first through hole. In this way, part of the heat generated by the LED chip when working can be directly transferred to the first through hole and the conductive member through the pad, and part of the heat is quickly transferred to the first through hole and the conductive member through the first heat-conducting layer, and then quickly transferred to the back side of the substrate body through the first through hole and the conductive member for dissipation, which can improve the heat dissipation efficiency of the LED chip on the one hand, and avoid that most of the heat generated by the LED chip when working is dissipated from the front side of the substrate body and reduce the bonding between the encapsulation glue layer and the substrate body on the other hand. Thus, the problems of poor heat dissipation and poor bonding between the substrate and the encapsulation glue layer in the existing encapsulation products are solved, the bonding between the substrate body and the encapsulation glue layer is improved, and the heat dissipation efficiency and heat dissipation effect are improved, while the quality and service life of the product are improved.

[0013] In some embodiments, the substrate assembly further includes a first heat dissipation layer disposed on the back of the substrate body, the first heat dissipation layer is made of insulating material, and the first heat dissipation layer covers the positive circuit layer and the negative circuit layer. By disposing the first heat dissipation layer on the back of the substrate body to cover each positive circuit layer and the negative circuit layer, the first heat dissipation layer is made of insulating material, which can not only prevent the positive circuit layer and the negative circuit layer from short-circuiting, but also protect the positive circuit layer and the negative circuit layer, thereby improving their reliability; at the same time, the heat transferred to the positive circuit layer and the negative circuit layer can be quickly dissipated outward through the first heat dissipation layer, thereby further improving the heat dissipation efficiency.

[0014] In some embodiments, the substrate assembly further includes a second heat dissipation layer disposed on the back of the substrate body and covering the first heat dissipation layer, and the thermal conductivity of the second heat dissipation layer is greater than the thermal conductivity of the first heat dissipation layer. By covering the first heat dissipation layer with a second heat dissipation layer having a larger thermal conductivity, the heat dissipation is further quickly and effectively performed through the second heat dissipation layer with better heat dissipation performance, thereby further improving its heat dissipation efficiency.

[0015] In some embodiments, the area on the back side of the substrate body between the positive electrode circuit layer and the negative electrode circuit layer is exposed to the first heat dissipation layer and covered by the second heat dissipation layer. In this way, the heat transferred to the area on the back side of the substrate body between the positive electrode circuit layer and the negative electrode circuit layer can be directly transferred to the second heat dissipation layer, and quickly dissipated outward through the second heat dissipation layer. The second heat dissipation layer can protect the area, further improving the reliability of the product.

[0016] In some embodiments, the substrate assembly further includes a plurality of second through holes penetrating the substrate body, one of the second through holes being located between two of the solder pads in one of the solder pad groups, and connecting the corresponding LED chip to the second heat dissipation layer. In this way, when the LED chip is working, the heat transferred to the two solder pads at the bottom of the LED chip can be quickly transferred to the second heat-conducting layer through the second through holes, and quickly dissipated outward through the second heat dissipation layer, thereby further improving the heat dissipation efficiency of the LED chip.

[0017] In some embodiments, the substrate assembly also includes a heat conductive member disposed in the second through hole, and the heat conductive member is in contact with the second heat dissipation layer. Therefore, when the LED chip is working, the heat transferred to the two solder pads at the bottom of the LED chip is more quickly transferred to the second heat conductive layer through the heat conductive member in the second through hole, thereby further improving the heat dissipation efficiency of the LED chip.

[0018] In some embodiments, the first thermally conductive layer includes an insulating layer and a metal layer covering the insulating layer, the insulating layer is flush with or higher than the adjacent solder pad, thereby ensuring that the metal layer covering it is insulated and isolated from the solder pad, and the side of the metal layer away from the front of the substrate body is a mirror surface, thereby better reflecting the light on the front of the substrate body where the LED chip is set, thereby improving the light output efficiency, thereby improving its display brightness and display effect.

[0019] In some embodiments, the size of the opening is larger than the size of the LED chip. Thus, when a packaging glue layer is subsequently disposed on the front surface of the substrate body, the colloid of the packaging glue layer can penetrate into the gap between the LED chip and the first heat-conducting layer, thereby improving the bonding strength of the packaging glue layer.

[0020] In some embodiments, the distance between the pad group closest to the edge of the front side of the substrate body and the edge of the front side of the substrate body is less than or equal to one half of the spacing between adjacent pad groups. In this way, when the display module made by using the substrate assembly of the present invention needs to be spliced, the spacing between two adjacent columns of LED chips at the splicing of the substrate bodies of the two substrate assemblies is basically consistent with the spacing between two adjacent columns of LED chips in other areas, so as to prevent dark lines with lower brightness than other areas from appearing at the splicing, and further improve the display effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A schematic cross-sectional structure diagram of a substrate assembly provided in Embodiment 1 of the present invention;

[0022] Figure 2 A schematic cross-sectional structure diagram of another substrate assembly provided in Embodiment 1 of the present invention;

[0023] Figure 3 A schematic cross-sectional structure diagram of another substrate assembly provided in the first embodiment of the present invention;

[0024] Figure 4 A schematic diagram of the cross-sectional structure of a first heat-conducting layer provided in Embodiment 1 of the present invention;

[0025] Figure 5 A schematic diagram of the cross-sectional structure of another first heat-conducting layer provided in Embodiment 1 of the present invention;

[0026] Figure 6 A schematic diagram of another cross-sectional structure of a pad provided in the first embodiment of the present invention;

[0027] Figure 7 A schematic cross-sectional structure diagram of another substrate assembly provided in the first embodiment of the present invention;

[0028] Figure 8 A schematic diagram of the cross-sectional structure of a display module provided in the second embodiment of the present invention;

[0029] Fig. 9 This is a schematic diagram of the cross-sectional structure of a display module provided in Embodiment 3 of the present invention. DETAILED DESCRIPTION

[0030] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thoroughly understood.

[0031] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0032] How to effectively dissipate heat in existing packaging products while improving their bonding with the packaging adhesive layer is an urgent problem to be solved.

[0033] Based on this, the present invention hopes to provide a solution that can solve the above-mentioned technical problems, and its details will be described in the subsequent embodiments.

[0034] Embodiment 1:

[0035] In order to solve the problem of poor heat dissipation in existing packaging products and poor bonding with the packaging adhesive layer, this embodiment provides a substrate assembly, such as Figure 1 The figure shows a schematic diagram of the cross-sectional structure of a substrate assembly. The substrate assembly of this embodiment includes a substrate body 1, a light-emitting area 2 provided on the front of the substrate body 1, a plurality of pad groups 3 provided in the light-emitting area 2, and one pad group 3 includes two pads 4 corresponding to the positive electrode and the negative electrode of the LED chip, respectively. The substrate assembly also includes a circuit layer 5 provided on the back of the substrate body 1, a plurality of positive circuit layers 6 and negative circuit layers 7 are provided in the area corresponding to the light-emitting area 2 of the circuit layer 5, and a pair of positive circuit layers 6 and negative circuit layers 7 correspond to two pads 4 in one pad group 3. In this embodiment, the substrate assembly also includes a plurality of first through holes 8 provided on the substrate body 1 and a conductive member (not shown in the figure) provided in the first through hole 8, a first through hole 8 connects a pad 4 with the positive circuit layer 6 or the negative circuit layer 7 corresponding to the pad 4, and the pad 4 is electrically connected to the positive circuit layer 6 or the negative circuit layer 7 corresponding to the pad 4 through the conductive member in the first through hole 8. In this way, the heat generated by the LED chip when working can be transferred to the pad 4 connected to the electrode through its electrode, and then transferred to the first through hole 8 and the conductive member in the first through hole 8 through the pad 4, and then transferred to the back side of the substrate body 1 through the conductive member, and dissipated from the back side of the substrate body, see Figure 1 The L1 heat dissipation path in the LED chip can improve the heat dissipation efficiency of the LED chip on the one hand, and on the other hand, avoid the problem that the heat generated by the LED chip when working is concentrated and dissipated from the front of the substrate body, thereby reducing the bonding between the packaging glue layer and the substrate body. This solves the problem of poor heat dissipation and poor bonding between the substrate and the packaging glue layer in existing packaging products, and improves the quality and service life of the product.

[0036] It should be understood that the substrate body 1 in this embodiment can be made of various insulating materials, such as but not limited to glass substrates, ceramic substrates, plastic substrates, etc. The conductive member in this embodiment can be but not limited to a conductive layer disposed on the side wall of the first through hole 8, or a conductive column disposed in the first through hole 8 to fill the first through hole 8. The conductive layer and the conductive column in this embodiment can be made of metal materials, such as but not limited to at least one of gold, silver, copper, iron, and aluminum. The use of metal materials has both good electrical conductivity and good thermal conductivity. While realizing the electrical connection between the pad 4 and the positive circuit layer 6 or the negative circuit layer 7, it can further improve the heat dissipation efficiency. Of course, in this embodiment, the conductive layer or the conductive column can also be equivalently replaced with a conductive glue with good thermal conductivity, which will not be repeated here.

[0037] In some embodiments, for example, Figure 2 The figure shows a schematic diagram of the cross-sectional structure of another substrate assembly, wherein the substrate assembly further comprises a first heat dissipation layer 10 disposed on the back of the substrate body 1, wherein the first heat dissipation layer 10 is made of an insulating material and covers each positive electrode circuit layer 6 or negative electrode circuit layer 7. It should be noted that the first heat dissipation layer 10 is made of an insulating material, which can not only prevent the positive electrode circuit layer 6 or the negative electrode circuit layer 7 from short circuiting, but also protect the positive electrode circuit layer 6 or the negative electrode circuit layer 7 by covering the positive electrode circuit layer 6 or the negative electrode circuit layer 7, thereby improving its protective performance. At the same time, the heat transferred to the positive electrode circuit layer 6 or the negative electrode circuit layer 7 through the first through hole 8 and the conductive member therein can be quickly dissipated through the first heat dissipation layer 10, thereby further improving the heat dissipation efficiency. In some examples, it should be understood that the first heat dissipation layer 10 in this embodiment can be made of various insulating materials with good thermal conductivity, for example, the first heat dissipation layer 10 can be set to, but not limited to, an inorganic layer with good heat dissipation performance, and the thickness can be, but not limited to, 5 um -10um. In this embodiment, the first heat dissipation layer 10 may be arranged in a manner including but not limited to molding or hot pressing. Those skilled in the art may arrange it according to actual conditions and requirements, and this embodiment does not limit it. It should be understood that in this embodiment, the first heat dissipation layer 10 may be arranged on the back of the substrate body 1, covering only the positive electrode circuit layer 6 and the negative electrode circuit layer 7, and the back of the substrate body 1 between the positive electrode circuit layer 6 and the negative electrode circuit layer 7 is exposed to the first heat dissipation layer 10, for example, see Figure 2 In some other application scenarios of this embodiment, the first heat dissipation layer 10 can also be arranged on the back side of the substrate body 1 to cover the positive circuit layer 6 and the negative circuit layer 7, as well as all other areas or parts thereof outside the positive circuit layer 6 and the negative circuit layer 7. The specific setting can be flexibly made according to the application requirements, and will not be described in detail here.

[0038] In some embodiments, see Figure 3 As shown, in order to further improve the heat dissipation efficiency, the substrate assembly further includes a second heat dissipation layer 11 disposed on the back of the substrate body 1 and covering the first heat dissipation layer 10, and the thermal conductivity of the second heat dissipation layer 11 is higher than that of the first heat dissipation layer 10. In this example, by covering the first heat dissipation layer 10 with the second heat dissipation layer 11 having a larger thermal conductivity, the heat dissipation speed is further improved through the second heat dissipation layer 11 having better heat dissipation performance, so as to further improve its heat dissipation efficiency.

[0039] It should be understood that, in this embodiment, the second heat dissipation layer 11 can be disposed on the back of the substrate body 1, covering only the first heat dissipation layer 10, and the back of the substrate body 1 outside the first heat dissipation layer 10 is exposed to the second heat dissipation layer 11. In other application scenarios of this embodiment, the second heat dissipation layer 11 can also be disposed on the back of the substrate body 1, covering the first heat dissipation layer 10 and all other areas or a part thereof outside the positive first heat dissipation layer 10, so that the heat in this area is directly transferred to the second heat dissipation layer 11, and quickly dissipated outward through the second heat dissipation layer 11, further improving the heat dissipation efficiency. For example, see Figure 3 As shown, in this example, the area S1 between the positive circuit layer 6 and the negative circuit layer 7 on the back of the substrate body 1 is exposed to the first heat dissipation layer 10 and covered by the second heat dissipation layer 11. In this way, the heat transferred to the area S1 between the positive circuit layer 6 and the negative circuit layer 7 on the back of the substrate body 1 can be directly transferred to the second heat dissipation layer 11. In this example, the area S2 between the adjacent pairs of positive circuit layers 6 and negative circuit layers 7 is also exposed to the first heat dissipation layer 10 and covered by the second heat dissipation layer 11, so that the heat transferred to the areas S1 and S2 is quickly dissipated outward through the second heat dissipation layer 11, and the second heat dissipation layer 11 covers the area to form a protection, further improving the reliability of the product. It should be noted that the second heat dissipation layer 11 can be set in a manner including but not limited to molding, hot pressing, etc. As long as it can be set correctly, those skilled in the art can set it according to actual conditions and needs, and this embodiment does not limit it. In order to achieve rapid and effective heat dissipation, in practical applications, the thermal conductivity of the second heat dissipation layer 11 needs to be better than that of the first heat dissipation layer 10. Preferably, the first heat dissipation layer 10 may include but is not limited to inorganic insulating materials such as plastic and rubber, and the second heat dissipation layer 11 may include but is not limited to materials such as graphite or graphene. Graphite or graphene has good thermal conductivity and high versatility, which can further improve the heat dissipation efficiency.

[0040] In this embodiment, in addition to the heat dissipation path L1 for dissipating heat to the back of the substrate body shown in the above examples, in order to further improve the heat dissipation efficiency and heat dissipation effect, in some examples of this embodiment, a heat dissipation path for dissipating heat to the back of the substrate body can be further added on this basis. For example, see Figure 4 As shown, the substrate assembly also includes a first heat-conducting layer 12 arranged on the front side of the substrate body 1. The first heat-conducting layer 12 has an opening for exposing the pad group 3, and is insulated and isolated from the pads 4 in the pad group 3. It can also be understood that the first heat-conducting layer 12 is arranged on the front side of the substrate body 1 in the area between adjacent pad groups 3. In this embodiment, the manner in which the first heat-conducting layer 12 is insulated and isolated from the pads 4 in the adjacent pad group 3 may include but is not limited to not contacting the pads 4, or the area in which the first heat-conducting layer 12 contacts the pads 4 is set to an insulating material. It should be noted that the manner in which the first heat-conducting layer 12 is set may include but is not limited to being set by molding, etching, etc. As long as it can be set correctly, those skilled in the art can set it according to actual conditions and needs, and this embodiment does not limit it. In this example, the first heat-conducting layer 12 and the pads 4 in the adjacent pad group 3 do not contact each other, so that the first heat-conducting layer 12 and the pads 4 are insulated and isolated. For another example, Figure 5 The figure shows another schematic diagram of the cross-sectional structure of the first heat-conducting layer 12, which includes an insulating layer 121 disposed on the front of the substrate body 1, and a metal layer 122 disposed on the insulating layer 121. The insulating layer 121 is flush with or higher than the pad 4 in the adjacent pad group 3 on the front of the substrate body 1, so as to ensure that the metal layer 122 disposed on the insulating layer 121 is insulated and isolated from the pad 4. It should be noted that the setting method of the insulating layer 121 may include but is not limited to the setting by molding, hot pressing, etc., and those skilled in the art may set it according to actual conditions and requirements, and this embodiment does not limit it. It should be noted that the insulating layer 121 may include but is not limited to inorganic insulating materials such as PI and low reflectivity ink. In practical applications, the thickness of the insulating layer 121 can be set to 1-5um. It should be noted that no matter what material the insulating layer 121 is, it cannot cover or contaminate the pad 4, so as to avoid the insulating layer covering the pad 4, which may cause the LED chip to be unable to be installed normally during installation, or cause the installed LED chip to have poor contact, etc.

[0041] It should be noted that the pad 4 in this embodiment may include but is not limited to being embedded in the substrate body 1 and flush with the front surface of the substrate body 1, for example, Figure 5 For example, Figure 6The figure shows another schematic diagram of the cross-sectional structure of the solder pad, which can also be arranged so that a part of the solder pad 4 is higher than the front side of the substrate body 1. Of course, the entire solder pad 4 can also be higher than the front side of the substrate body 1. The specific arrangement method can be arranged by those skilled in the art according to actual conditions and requirements, and the present invention does not limit it. Preferably, the solder pad 4 in this embodiment is arranged in a manner embedded in the substrate body 1.

[0042] In this embodiment, by setting the first heat-conducting layer 12, the heat generated by the LED chip can be transferred from the side of the LED chip to the first heat-conducting layer 12, and then transferred to the adjacent solder pad 4 through the first heat-conducting layer, and then transferred to the corresponding first through hole 8 and the conductive member in the first through hole 8 through the solder pad 4, and then transferred to the circuit layer and the first heat dissipation layer 10 on the back of the corresponding substrate body 1 through the first through hole 8 and the conductive member in the first through hole 8, and then dissipated outward through the second heat dissipation layer 11. The heat dissipation path is shown in FIG. Figures 4 to 6 As shown in L2.

[0043] exist Figure 5 and Figure 6 In the example shown, the side of the metal layer 122 away from the front of the substrate body 1 can be set as a mirror surface. In some examples, the metal layer 122 can include but is not limited to a bright nickel layer, and its thickness can be set to 10 um-20um. Because the bright nickel layer has a high reflectivity, and the side away from the front of the substrate body 1 is set as a mirror surface, its reflection efficiency can be further improved, thereby further improving its brightness and display effect. It should be noted that no matter what material the metal layer is made of, it cannot cover or contaminate the pad 4 to avoid problems such as short circuit caused by it. In this embodiment, the side of the metal layer 122 away from the front of the substrate body 1 can also be set as a rough surface or a concave-convex surface to further enrich the angle of reflected light.

[0044] When the LED chip is working, the heat generated by it is mainly concentrated in the projection area of ​​the LED chip on the front surface of the substrate body 1. Therefore, in order to further improve the heat dissipation efficiency of the LED chip, see Figure 7 As shown, the substrate assembly also includes a plurality of second through holes 14 penetrating the substrate body 1, and the second through holes 14 are located between two pads 4 in a pad group 3, that is, the second through holes 14 are located below the LED chip 15, and connect the corresponding LED chip with the second heat dissipation layer 11. In this way, when the LED chip is working, the heat transferred to the two pads at the bottom of the LED chip can be quickly transferred to the second heat-conducting layer 11 through the second through holes 14, and quickly dissipated outward through the second heat dissipation layer 11, thereby further improving the heat dissipation efficiency of the LED chip. It can further avoid the problem of poor bonding of the encapsulation glue layer due to heat accumulation.

[0045] Optionally, the substrate assembly further includes a heat-conducting member (not shown in the figure) with good thermal conductivity and arranged in the second through hole 14. The heat-conducting member 14 contacts the second heat dissipation layer 11, so that when the LED chip is working, the heat transferred to the two pads at the bottom of the LED chip is transferred to the second heat-conducting layer more quickly through the heat-conducting member in the second through hole 8. Figure 7 As shown in L3 in the figure, the heat dissipation efficiency of the LED chip is further improved. In this embodiment, the heat conducting member may be, but is not limited to, a heat conducting column arranged in the second through hole 8 and the second heat conducting layer arranged around the inner wall thereof is filled in the second through hole 8 to fill it up, and the two ends of the heat conducting member may be arranged to contact the second heat dissipation layer 11 and the LED chip respectively. Of course, the second heat conducting layer or the heat conducting column may also only contact the second heat dissipation layer without contacting the LED chip. This embodiment does not limit this, and those skilled in the art may set it according to actual conditions and needs. The diameter of the heat conducting column may be the same as that of the second through hole 14, or may be smaller than that of the second through hole 14. The specific setting method may be set by those skilled in the art according to actual conditions and needs, and this embodiment does not limit this.

[0046] In some examples of this embodiment, it can be set Figures 4 to 7 The size of the opening C shown in the figure is larger than the size of the LED chip. Thus, when a packaging glue layer is subsequently provided on the front surface of the substrate body 1, the colloid of the packaging glue layer can penetrate into the gap between the LED chip and the first heat-conducting layer 12, thereby further improving the bonding strength of the packaging glue layer.

[0047] In some other examples of this embodiment, see Figure 7 As shown, the distance h1 between the pad group 3 closest to the edge of the front surface of the substrate body 1 and the edge of the front surface of the substrate body 1 is less than or equal to half of the spacing h2 between adjacent pad groups 3. In this way, when it is necessary to splice the display module made using the substrate assembly in this embodiment, the spacing between two adjacent columns of LED chips at the splicing of the substrate bodies of the two substrate assemblies is basically consistent with the spacing between two adjacent columns of LEDs in other areas, so as to prevent dark patterns with lower brightness than other areas from appearing at the splicing, and further improve the display effect.

[0048] It can be seen that the substrate assembly provided in this embodiment is provided with a first through hole and a second through hole on the substrate body, the two ends of the first through hole are respectively in contact with the soldering pad and the circuit layer, the second through hole is respectively connected with the LED chip and the second heat dissipation layer, and the first heat dissipation layer and the second heat dissipation layer are provided on the back side of the substrate body, so that the heat around the soldering pad and the heat around the LED chip can be quickly and effectively dissipated through the first through hole and the second through hole, thereby improving its heat dissipation efficiency, and also solving the problem of poor bonding with the packaging glue layer due to heat accumulation, and providing an insulating layer and a first thermal conductive layer on the front side of the substrate body, thereby further improving its heat dissipation efficiency and bonding with the packaging glue layer, and also improving its reflection efficiency, thereby improving the display brightness and display effect of the product, thereby further improving the quality, life span and user satisfaction of the product.

[0049] Embodiment 2

[0050] This embodiment provides a display module, such as Figure 8 The figure shows a schematic diagram of the cross-sectional structure of a display module. In order to more clearly express the structure of the display screen, the encapsulation glue layer is made transparent in the figure.

[0051] In some embodiments, the display module includes an LED chip 15 and the above-mentioned substrate assembly. It should be noted that the display module also includes a packaging glue layer 16, such as Figure 8 As shown, the encapsulation glue layer 16 is arranged on the front side of the substrate body 1, which completely covers the LED chip 15. The positive electrode and the negative electrode of the LED chip 15 are electrically connected to the corresponding pads 4 respectively. It should be noted that it can be electrically connected by including but not limited to using solder paste, conductive glue, etc. As long as the two can be correctly connected, technical personnel in this field can set it according to actual conditions and needs, and the present invention does not limit it.

[0052] It should be noted that the encapsulation layer 16 may include, but is not limited to, materials such as silicone, silicone resin, epoxy resin, acrylic acid, and may be transparent. The encapsulation layer 16 may be formed on the substrate by methods including, but not limited to, injection molding, dispensing, molding, etc., so that it is tightly combined with the substrate body 1 and the LED chip 15. In some examples, the encapsulation layer 16 may only cover the entire LED chip 15 on the front of the substrate body 1, or may cover the LED chip 15 on the front of the substrate body 1 while covering all other areas on the front of the entire substrate body 1. It should be noted that the encapsulation layer 16 may include, but is not limited to, at least one of a transparent glue layer, a fluorescent glue layer, and a quantum dot glue layer, and may also add a certain proportion of diffusion particles as required to improve its light output effect.

[0053] It should be noted that in some embodiments, the LED chip 15 may be at least one of a red light chip, a green light chip, a blue light chip, etc. For example, in some examples, the LED chip 15 includes a blue light LED chip, a red light LED chip, and a green light LED chip. For example, the blue light LED chip and the green light LED chip may be gallium nitride-based LED chips, and the red light LED chip may be a gallium arsenide-based LED chip. In other examples, all LED chips may also be blue light LED chips. In order to allow some of the LED chips to emit green light and red light respectively, corresponding light conversion layers may be provided on the light-emitting surfaces of these LED chips, and the light conversion layers may include but are not limited to phosphor layers, quantum film layers, etc. It should be understood that in some examples, in addition to emitting red, green, and blue light, the LED chip may also emit cyan, white, or yellow light. Preferably, in this embodiment, the LED chip 15 emits white light.

[0054] The display module of this embodiment prevents the risk of LED chip failure caused by the intrusion of water vapor by arranging the LED chip and the packaging adhesive layer on the substrate assembly. At the same time, the above-mentioned substrate assembly is used to effectively dissipate the heat generated by the LED chip, so that its bonding with the packaging adhesive layer is greatly improved, solving the problems of poor heat dissipation of the LED chip and poor bonding with the packaging adhesive layer in existing packaging products, extending its service life, and improving product quality and user satisfaction.

[0055] Embodiment 3

[0056] This embodiment provides a display module, such as Fig. 9 The figure shows a schematic diagram of the cross-sectional structure of a display module. In order to more clearly express the structure of the display screen, the encapsulation glue layer is made transparent in the figure.

[0057] like Fig. 9As shown, the first heat dissipation layer 10 in the display module completely covers the back of the substrate body 1, which can be set on the back of the substrate body 1 by molding, hot pressing, etc. It should be noted that the thermal conductivity of the first heat dissipation layer 10 should be smaller than the thermal conductivity of the second heat dissipation layer 11, so that the heat can not be accumulated in the display module to cause poor heat dissipation. In this embodiment, preferably, the first heat dissipation layer 10 adopts a ceramic material, and the second heat dissipation layer 11 adopts a graphene material to increase the speed of heat dissipation. It should be noted that as long as the thermal conductivity of the second heat dissipation layer 11 is greater than the thermal conductivity of the first heat dissipation layer 10 and the first heat dissipation layer 10 is an insulating material, the technical personnel in this field can also set its material according to actual conditions and needs. At the same time, in this embodiment, preferably, the insulating layer 121 is set as a low-reflection ink layer to prevent the metal layer from contacting the pad and causing a short circuit. The metal layer 12 is set as a bright nickel layer to improve the reflection efficiency, thereby improving the display brightness and display effect.

[0058] It should be noted that covering the entire back side of the substrate body 1 with the first heat dissipation layer 10 can improve the heat dissipation effect. While dissipating the circuit layer 5, the substrate body 1 can also be dissipated, which greatly improves the heat dissipation efficiency of the display module and avoids the delamination problem caused by the poor bonding between the packaging glue layer 16 and the substrate body 1.

[0059] The display module of the present embodiment provides a first heat dissipation layer covering the back side and the conductive area of ​​the substrate body on the back side, and provides a second heat dissipation layer on the first heat dissipation layer, and the thermal conductivity of the second heat dissipation layer is greater than that of the first heat dissipation layer, so that the substrate body can be cooled and the poor bonding between the substrate body and the packaging adhesive layer can be avoided. The heat of the display module is dissipated from the back side through the heat dissipation of multiple heat dissipation paths, which solves the problems of poor heat dissipation of LED chips and poor bonding with the packaging adhesive layer in existing packaging products, prolongs their service life, and improves product quality and user satisfaction.

[0060] The substrate assembly provided in the above-mentioned embodiment can be applied to various light-emitting and display fields. For example, it can be made into a display module for use in the display field (it can be a display module of a terminal such as a television, a display, a mobile phone, etc.). At this time, it can also be applied to a display backlight module. In addition to being applicable to the display backlight field, it can also be applied to the key backlight field, the shooting field, the home lighting field, the medical lighting field, the decoration field, the automotive field, the transportation field, etc. When applied to the key backlight field, it can be used as a key backlight light source for mobile phones, calculators, keyboards, etc. with key devices; when applied to the shooting field, it can be made into a camera flash; when applied to the home lighting field, it can be made into a floor lamp, a table lamp, a lighting lamp, a ceiling lamp, a downlight, a projection lamp, etc.; when applied to the medical lighting field, it can be made into a surgical lamp, a low electromagnetic lighting lamp, etc.; when applied to the decoration field, it can be made into various decorative lamps, such as various colored lights, landscape lighting lamps, and advertising lamps; when applied to the automotive field, it can be made into car lights, car indicator lights, etc.; when applied to the transportation field, it can be made into various traffic lights, and it can also be made into various street lights. The above applications are merely examples of applications in this embodiment. It should be understood that the application of the display module in this embodiment is not limited to the above examples.

[0061] It should be noted that the number, shape and size relationship of each element in the drawings do not represent the actual situation of the elements, but are only schematic diagrams for easy understanding. The embodiments of the present invention are described above in conjunction with the drawings, but the present invention is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are only illustrative and not restrictive. Under the enlightenment of the present invention, ordinary technicians in this field can also make many forms without departing from the scope of protection of the present invention and the claims, which are all within the protection of the present invention.

Claims

1. A display module, comprising an LED chip, a substrate assembly and an encapsulation layer, wherein the encapsulation layer completely covers the LED chip, characterized in that: The substrate assembly comprises: A substrate body, wherein the substrate body is an insulating substrate body; A plurality of pad groups are arranged on the front surface of the substrate body, wherein one pad group includes two pads corresponding to the positive electrode and the negative electrode of the LED chip respectively; A positive electrode circuit layer and a negative electrode circuit layer are arranged on the back side of the substrate body; A plurality of first through holes provided on the substrate body and conductive members provided in the first through holes, wherein two pads in the pad group are electrically connected to the positive electrode circuit layer and the negative electrode circuit layer respectively through the corresponding conductive members; A first heat dissipation layer is provided on the back of the substrate body and a second heat dissipation layer covers the first heat dissipation layer. The back of the substrate body is located between the positive electrode circuit layer and the negative electrode circuit layer. The area is exposed to the first heat dissipation layer and is covered by the second heat dissipation layer.

2. The display module according to claim 1, wherein: The thermal conductivity of the second heat dissipation layer is greater than the thermal conductivity of the first heat dissipation layer.

3. The display module according to claim 2, wherein: The second heat dissipation layer includes a graphite layer and / or a graphene layer.

4. The display module according to claim 1, wherein: The substrate assembly further includes a first heat-conducting layer disposed on the front surface of the substrate body, wherein the first heat-conducting layer has an opening for exposing the pad group and is insulated and isolated from the pads in the pad group.

5. The display module according to claim 4, characterized in that: The size of the opening is larger than the size of the LED chip.

6. The display module according to claim 4, characterized in that: The first heat-conducting layer includes an insulating layer and a metal layer covering the insulating layer. The insulating layer is flush with or higher than the adjacent pad. The side of the metal layer away from the front side of the substrate body is a mirror surface.

7. The display module according to claim 1, wherein: The substrate assembly further includes a plurality of second through holes penetrating the substrate body, wherein one of the second through holes is located between two of the solder pads in one of the solder pad groups and connects the corresponding LED chip to the second heat dissipation layer.

8. The display module according to claim 7, wherein: The substrate assembly further includes a heat conducting member disposed in the second through hole, and the heat conducting member is in contact with the second heat dissipation layer.

9. The display module according to claim 1, wherein: The distance between the pad group closest to the edge of the front surface of the substrate body and the edge of the front surface of the substrate body is less than or equal to one half of the spacing between adjacent pad groups.

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