Flip LED lamp bead, packaging method thereof and display screen

Abstract

The invention discloses a flip LED lamp bead, a packaging method thereof and a display screen, and relates to the field of semiconductor photoelectric devices. The packaging method comprises the following steps: fixing a flip LED chip on a first substrate to obtain a first intermediate; forming white glue salient points on a second substrate to obtain a second intermediate; compounding the first intermediate and the second intermediate, and forming a packaging adhesive layer in a gap between the first intermediate and the second intermediate to obtain a third intermediate; and removing the first substrate and the second substrate on the third intermediate. The flip LED chip comprises a substrate, an epitaxial layer and an electrode, wherein the epitaxial layer and the electrode are sequentially arranged on the substrate. The width of the bottom of the white glue salient point is greater than that of the top of the white glue salient point, and the width of the bottom of the white glue salient point is greater than that of the flip LED chip; the white glue salient points can reflect light rays; the side, where the flip LED chip is located, of the first intermediate body faces the white glue protruding points, and the flip LED chip and the white glue protruding points are arranged correspondingly. According to the invention, the light-emitting angle of the lamp bead can be increased.

Description

Technical Field

[0001] The invention relates to the field of semiconductor optoelectronic devices, and in particular to a flip-chip LED lamp bead and a packaging method thereof, and a display screen. Background Art

[0002] The backlight module used in common display screens at present includes PCB substrate, LED lamp beads, lens and diffuser. Since conventional LED lamp beads have good directionality, the central light is strong and the surrounding light intensity is small, so the light-emitting angle is small, so it is generally necessary to introduce a lens for refraction to increase the light-emitting angle. The diffuser can disperse the light emitted by the LED lamp beads so that it is more evenly distributed on the display plane. The smaller the light-emitting angle of the LED lamp beads, the greater the distance between the diffuser and the LED lamp beads, and the greater the thickness of the backlight module. Therefore, it is necessary to increase the light-emitting angle of the LED. Summary of the invention

[0003] The technical problem to be solved by the present invention is to provide a packaging method for a flip-chip LED lamp bead, which can increase the light-emitting angle of the flip-chip LED lamp bead.

[0004] Another technical problem to be solved by the present invention is to provide a flip-chip LED lamp bead.

[0005] Another technical problem to be solved by the present invention is to provide a display screen.

[0006] In order to solve the above problems, the present invention discloses a packaging method for flip-chip LED lamp beads, which comprises: Fixing a flip-chip LED chip on a first substrate to obtain a first intermediate; wherein the flip-chip LED chip comprises a substrate and an epitaxial layer and an electrode sequentially arranged on the substrate; one side of the electrode of the flip-chip LED chip is fixed on the first substrate, and the flip-chip LED chip can be separated from the first substrate; Forming white glue bumps on the second substrate to obtain a second intermediate; wherein the width of the bottom of the white glue bumps is greater than the width of the top thereof, and the width of the bottom of the white glue bumps is greater than the width of the flip-chip LED chip; and the white glue bumps can reflect light; The first intermediate is compounded with the second intermediate, and a packaging glue layer is formed in the gap between the first intermediate and the second intermediate to obtain a third intermediate; wherein the side where the flip-chip LED chip in the first intermediate is located faces the white glue convex point, and the flip-chip LED chip is arranged corresponding to the white glue convex point; The first substrate and the second substrate on the third intermediate are removed.

[0007] As an improvement of the above technical solution, the step of compounding the first intermediate with the second intermediate and forming a packaging glue layer in the gap between the first intermediate and the second intermediate to obtain the third intermediate includes: Providing a mold with an opening at the top, and fixing the side where the second substrate of the second intermediate is located on the bottom wall of the mold; Filling packaging glue in the mold; Before the encapsulation glue is cured, the first intermediate is loaded into the mold, and the flip-chip LED chip is arranged corresponding to the white glue bumps; curing the encapsulation adhesive to form an encapsulation adhesive layer to obtain a third intermediate; The third intermediate body is demolded from the mold.

[0008] As an improvement of the above technical solution, the step of compounding the first intermediate with the second intermediate and forming a packaging glue layer in the gap between the first intermediate and the second intermediate to obtain the third intermediate includes: Providing a mold with an opening at the top, and fixing one side of the second substrate of the second intermediate body on the bottom wall of the mold; Before the packaging glue is cured, the first intermediate is loaded into the mold, and the flip-chip LED chip is arranged corresponding to the white glue bumps; Injecting packaging glue into the gap between the first intermediate body and the second intermediate body; curing the encapsulation adhesive to form an encapsulation adhesive layer to obtain a third intermediate; The third intermediate body is demolded from the mold.

[0009] As an improvement of the above technical solution, at least one air hole is opened on the bottom wall of the mold, and the second intermediate is fixed on the bottom wall of the mold by adsorption through the negative pressure formed by the air hole; After the encapsulation adhesive is cured, air is blown through the air holes to demould the third intermediate from the mold.

[0010] As an improvement of the above technical solution, the gap between the first intermediate body and the second intermediate body is filled with fluorescent glue and packaging glue, and are cured to form a fluorescent glue layer and a packaging glue layer respectively; wherein the fluorescent glue layer is arranged close to the second intermediate body, and the packaging glue layer is arranged close to the first intermediate body.

[0011] As an improvement of the above technical solution, the first substrate is a steel substrate, and the flip-chip LED chip is bonded to the first substrate by means of an adhesive tape; The first intermediate body includes a plurality of flip-chip LED chips distributed in an array on the first substrate.

[0012] As an improvement of the above technical solution, the second substrate is a PET substrate; The second intermediate body comprises a plurality of white glue bumps distributed in an array on the second substrate; In the third intermediate, the white glue bumps are arranged in one-to-one correspondence with the flip-chip LED chips.

[0013] As an improvement of the above technical solution, the white glue convex point is dome-shaped; In the third intermediate, the geometric center of the white glue bump and the center of the flip-chip LED chip are located on the same straight line.

[0014] Correspondingly, the present invention further discloses a flip-chip LED lamp bead, which is a flip-chip LED chip packaged by the above-mentioned flip-chip LED lamp bead packaging method.

[0015] Correspondingly, the present invention also discloses a display screen, which includes a backlight module, wherein the backlight module includes a PCB substrate, the above-mentioned flip-chip LED lamp beads and a diffusion sheet, and the flip-chip LED lamp beads are electrically connected to the PCB substrate.

[0016] The implementation of the present invention has the following beneficial effects: In the packaging method of the flip-chip LED lamp bead in one embodiment of the present invention, the flip-chip LED chip is first fixed on the first substrate to form a first intermediate; white glue bumps are formed on the second substrate; then the first intermediate and the second intermediate are compounded to form a packaging glue layer, and finally the first substrate and the second substrate are removed. Based on the above packaging method, the flip-chip LED chip is wrapped with a packaging glue layer formed by curing the packaging glue on all sides except the electrode side, and white glue bumps that can reflect light are formed on the top of the packaging glue layer. The white glue bumps have a structure with a wide bottom and a narrow top, that is, the white glue bumps form a reflective side with a large area, which makes the light emitted by the flip-chip LED chip reflect through the white glue bumps and then emit from the transparent packaging glue layer, greatly improving the light-emitting angle of the flip-chip LED lamp bead. Specifically, the light-emitting angle in the present invention can be increased to 170°, thereby greatly improving the light mixing effect of the backlight module based on the lamp bead, and eliminating the phenomenon of uneven brightness. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a flow chart of a packaging method of a flip-chip LED lamp bead in one embodiment of the present invention; Figure 2 is a schematic structural diagram of a first intermediate in one embodiment of the present invention; Figure 3 is a schematic structural diagram of a second intermediate in one embodiment of the present invention; Figure 4 is a schematic structural diagram of a mold in one embodiment of the present invention; Figure 5 is a schematic structural diagram of the mold and the second intermediate after step S131 in one embodiment of the present invention; Figure 6 is a schematic structural diagram of the mold and the third intermediate after step S134 in one embodiment of the present invention; Figure 7 is a schematic structural diagram of a third intermediate in one embodiment of the present invention; Figure 8 This is a schematic diagram of the structure of a flip-chip LED lamp bead in one embodiment of the present invention; Fig. 9 It is a schematic diagram of the structure of a flip-chip LED lamp bead in another embodiment of the present invention; Fig.10 is a schematic diagram of the composition of a display screen in one embodiment of the present invention; Fig.11 It is the light intensity distribution curve of the flip-chip LED lamp bead in one embodiment of the present invention.

[0018] In the figure, 100 is a flip-chip LED lamp bead, 110 is a flip-chip LED chip, 111 is a substrate, 112 is an electrode, 120 is a packaging glue layer, 130 is a fluorescent glue layer, 200 is a diffuser, 300 is a PCB substrate, 400 is a first intermediate, 410 is a first substrate, 420 is a tape, 500 is a second intermediate, 510 is a second substrate, 520 is a white glue bump, 600 is a mold, 610 is a bottom wall, 620 is a side wall, 630 is an air hole, and 700 is a third intermediate. DETAILED DESCRIPTION

[0019] In order to make the purpose, technical solutions and advantages of the present application clearer, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be construed as limiting the present application. In addition, it should be understood that the specific embodiments described herein are only used to explain the present application and are not intended to limit the present application.

[0020] In the description of the present application, it should be understood that the terms "length", "width", "up", "down", "left", "right", "horizontal", "top", "bottom", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0021] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0022] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0023] See also Figure 1 The present invention provides a packaging method for a flip-chip LED lamp bead, which comprises the following steps: S1: fixing a flip-chip LED chip on a first substrate to obtain a first intermediate; S2: forming white glue bumps on the second substrate to obtain a second intermediate; S3: compounding the first intermediate and the second intermediate, and forming a packaging adhesive layer in the gap between the first intermediate and the second intermediate to obtain a third intermediate; S4: removing the first substrate and the second substrate on the third intermediate.

[0024] Among them, in step S1, see Fig. 9 The flip-chip LED chip 110 includes a substrate 111 and an epitaxial layer (not shown in the figure) and an electrode 112 sequentially arranged on the substrate. One side of the electrode 112 is fixed on the first substrate 410, and the flip-chip LED chip 110 can be separated from the first substrate 410.

[0025] In step S2, see Figure 3 , Figure 8 and Fig. 9The width of the bottom of the white glue bump 520 (the side close to the second substrate 510) is greater than the width of the top (the side away from the second substrate 510), and the width of the bottom is greater than the width of the flip-chip LED chip 110, so that the projection of the bottom of the white glue bump 520 on the surface where the substrate 111 of the flip-chip LED chip 110 is located covers the substrate 111, and the substrate 111 is the main light-emitting surface of the flip-chip LED chip 110. By controlling the projection of the white glue bump 520 on the surface where the substrate 111 is located to cover the substrate 111, the light emitted by the flip-chip LED chip 110 can be completely reflected by the white glue bump 520.

[0026] In step S3, see Figure 6 When the first intermediate body 400 and the second intermediate body 500 are combined, the side of the first intermediate body 400 where the flip-chip LED chip 110 is located faces the white glue bump 520, and the flip-chip LED chip 110 and the white glue bump 520 are arranged correspondingly. The gap between the first intermediate body 400 and the second intermediate body 500 is filled with a packaging glue layer 120 formed by curing the packaging glue.

[0027] In the flip-chip LED lamp bead 100 packaged based on the above-mentioned packaging method, the other sides of the flip-chip LED chip 110 except the electrode 112 side are wrapped with a packaging glue layer 120 formed by curing the packaging glue, and white glue bumps 520 that can reflect light are formed on the top of the packaging glue layer 120. The white glue bumps 520 have a structure with a wide bottom and a narrow top, that is, the white glue bumps 520 form a reflective side with a large area, so that the light emitted by the flip-chip LED chip 110 is reflected by the white glue bumps 520 and then emitted from the transparent packaging glue layer 120, which greatly improves the light-emitting angle of the flip-chip LED lamp bead 100.

[0028] Specifically, see Figure 3 , Figure 8 , Fig. 9 The cross-section of the white glue bump 520 is V-shaped, dome-shaped, trapezoidal, or dome-shaped, but not limited thereto. The ratio of the bottom width of the white glue bump 520 to its height is 1:(1.5-3) to increase the side area of ​​the white glue bump 520, thereby increasing the light-emitting angle of the flip-chip LED lamp bead 100. Preferably, in one embodiment, the white glue bump 520 is dome-shaped, and the ratio of its bottom width (i.e., bottom diameter) to its height is 1:(2-3). This structure can further increase the light-emitting angle of the flip-chip LED lamp bead 100.

[0029] Specifically, in step S1, the first substrate 410 may be a steel substrate, a copper substrate, a PET substrate or other polymer substrate, but is not limited thereto. The first substrate 410 needs to have a certain rigidity to carry the flip-chip LED chip 110, and when the encapsulation glue is injected and cured, the encapsulation glue can maintain a certain shape to form an encapsulation glue layer 120. Preferably, in one embodiment of the present invention, the first substrate 410 is a steel substrate, which is not only low in cost and easy to separate later, but also has good thermal conductivity, which facilitates the curing of the encapsulation glue later.

[0030] Specifically, in one embodiment, in step S1, a groove adapted to the electrode 112 of the flip-chip LED chip 110 may be provided on the first substrate 410, and then the flip-chip LED chip 110 may be clamped on the first substrate 410, but the present invention is not limited thereto. Figure 2 In one embodiment, the flip-chip LED chip 110 is bonded to the first substrate 410 by means of the adhesive tape 420. The operation is simple and it is convenient to separate the encapsulation adhesive layer 120, the flip-chip LED chip 110 and the first substrate 410 later.

[0031] Specifically, one or more flip-chip LED chips 110 may be disposed on the first substrate 410. Preferably, in one embodiment, the first intermediate body 400 includes a plurality of flip-chip LED chips 110 distributed in an array on the first substrate 410. Based on this configuration, packaging efficiency can be improved.

[0032] Specifically, in step S2, the second substrate 510 can be a PET substrate, a polyimide substrate, or a BT glass substrate, but is not limited thereto. The second substrate 510 has a certain affinity with the white glue, so that the white glue and the second substrate 510 have a suitable contact angle, and then white glue bumps 520 of a specific shape are formed by dispensing. Preferably, the second substrate 510 is a PET substrate.

[0033] Specifically, one or more white glue bumps 520 may be disposed on the second substrate 510. Preferably, in one embodiment, see Figure 3 The second intermediate body 500 includes a plurality of white glue bumps 520 disposed on the second substrate 510 , which are arranged one-to-one corresponding to the flip-chip LED chips 110 on the first substrate 410 .

[0034] Specifically, in one embodiment, in step S2, white glue may be printed on the second substrate 510, but is not limited thereto. Preferably, in one embodiment, in step S2, white glue bumps 520 are formed by a glue dispensing process and then cured. Specifically, the curing temperature is 100° C. to 150° C., and the curing time is 30 min to 60 min.

[0035] Specifically, in one embodiment, step S3 includes: S131: providing a mold with an opening at the top, and fixing the side where the second substrate of the second intermediate is located on the bottom wall of the mold; Specifically, in one embodiment, see Figure 4 The mold 600 includes a bottom wall 610 and a side wall 620, and an opening is formed on the top of the bottom wall 610. The second intermediate body 500 and the first intermediate body 400 can be loaded into the mold 600 through the opening.

[0036] Specifically, in one embodiment, a groove adapted to the first intermediate body 400 may be provided on the bottom wall 610 of the mold 600, and the first intermediate body 400 may be clamped in the mold 600. In another embodiment, the first intermediate body 400 may be bonded to the bottom wall 610 of the mold 600. Preferably, in one embodiment, a plurality of air holes 630 are provided at the bottom of the mold 600, and the second intermediate body 500 is fixed to the bottom wall 610 of the mold 600 by negative pressure adsorption formed by the air holes 630.

[0037] Specifically, see Figure 5 One or more second intermediate bodies 500 are fixed in the mold 600, preferably one. When a solution of fixing one second intermediate body 500 is adopted, the edge of the second substrate 510 can be closely attached to the side wall 620 of the mold 600, and then the air is sucked through the air hole 630 at the bottom to achieve fixation, and the packaging glue can also be prevented from penetrating.

[0038] Specifically, in one embodiment, in order to prevent the packaging glue from adhering to the side wall 620 of the mold 600 and making it difficult to demold later, a release film may be provided on the side wall 620 or a release agent may be applied, but the present invention is not limited thereto.

[0039] S132: Filling the mold with packaging glue; Specifically, the packaging glue can be dotted into the mold 600 through the opening, and a closable glue injection port can be provided on the side wall 620 of the mold 600, and the packaging glue is injected through the glue injection port, but the present invention is not limited thereto.

[0040] Preferably, in one embodiment, before filling the packaging glue, a fluorescent glue is filled on the first intermediate body 400 and cured to form a fluorescent glue layer 130 , and the fluorescent glue layer 130 can realize light color conversion.

[0041] S133: before the encapsulation glue is cured, the first intermediate is loaded into the mold, and the flip-chip LED chip is arranged correspondingly to the white glue bumps; Specifically, when loading the first intermediate body 400, it should be ensured that the white glue bumps 520 are arranged in one-to-one correspondence with the flip-chip LED chips 110. Preferably, the center of the flip-chip LED chip 110 and the geometric center of the white glue bumps should be located on the same straight line.

[0042] Furthermore, after loading is completed, the suction pressure of the air hole 630 can be increased to exhaust the packaging glue. Alternatively, the packaging glue can be exhausted through the closable air hole provided on the side wall 620.

[0043] S134: curing the encapsulation adhesive to form an encapsulation adhesive layer to obtain a third intermediate; Specifically, curing can be performed by heating, with the heating temperature being 100° C. to 150° C. and the heating time being 3 min to 5 min.

[0044] S135: Demolding the third intermediate from the mold.

[0045] Specifically, in one embodiment, the demolding of the third intermediate body can be achieved by blowing air through the air holes 630 , but the present invention is not limited thereto.

[0046] Preferably, in another embodiment, step S3 includes: S231: providing a mold with an opening at the top, and fixing one side of the second substrate of the second intermediate body on the bottom wall of the mold; Specifically, in one embodiment, see Figure 4 The mold 600 includes a bottom wall 610 and a side wall 620, and an opening is formed on the top of the bottom wall 610. The second intermediate body 500 and the first intermediate body 400 can be loaded into the mold 600 through the opening.

[0047] Specifically, in one embodiment, a groove adapted to the first intermediate body 400 may be provided on the bottom wall 610 of the mold 600, and the first intermediate body 400 may be clamped in the mold 600. In another embodiment, the first intermediate body 400 may be bonded to the bottom wall 610 of the mold 600. Preferably, in one embodiment, a plurality of air holes 630 are provided at the bottom of the mold 600, and the second intermediate body 500 is fixed to the bottom wall 610 of the mold 600 by negative pressure adsorption formed by the air holes 630.

[0048] Specifically, one or more second intermediate bodies 500, preferably one, are fixed in the mold 600. When a solution of fixing one second intermediate body 500 is adopted, the edge of the second substrate 510 can be closely attached to the side wall 620 of the mold 600, and then fixed by evacuating air through the air hole 630 at the bottom, which can also prevent the packaging glue from penetrating.

[0049] Specifically, in one embodiment, in order to prevent the encapsulation glue from adhering to the side wall 620 of the mold 600 and making it difficult to demold the mold later, a release film may be provided on the side wall 620 or a release agent may be used to form a release layer.

[0050] S232: before the encapsulation glue is cured, the first intermediate is loaded into the mold, and the flip-chip LED chip is arranged correspondingly to the white glue bumps; S233: injecting packaging glue into the gap between the first intermediate body and the second intermediate body; Specifically, a sealable glue injection port may be provided on the side wall 620 of the mold 600 , and the packaging glue is injected through the glue injection port, but the present invention is not limited thereto.

[0051] Preferably, in one embodiment, before filling the packaging glue, a fluorescent glue is filled on the first intermediate body 400 and cured to form a fluorescent glue layer 130 to achieve light color conversion.

[0052] S234: curing the encapsulation adhesive to form an encapsulation adhesive layer to obtain a third intermediate; Specifically, curing can be performed by heating, with the heating temperature being 100° C. to 150° C. and the heating time being 3 min to 5 min.

[0053] S235: demolding the third intermediate from the mold.

[0054] Specifically, in one embodiment, the demolding of the third intermediate body can be achieved by blowing air through the air holes 630 , but the present invention is not limited thereto.

[0055] Specifically, in step S4, the first substrate 410 and the second substrate 510 may be removed, or may be separated by tearing off the tape, but is not limited thereto. Preferably, in one embodiment, in step S4, when a plurality of flip-chip LED chips 110 are disposed on the first substrate 410, step S4 further includes the step of cutting the third intermediate to obtain a single lamp bead. When cutting is required, the first substrate 410 is removed first, then cut, and finally the second substrate 510 is removed.

[0056] Based on the above-mentioned packaging method of the flip-chip LED lamp bead 100, the light-emitting angle can be greatly improved. Fig.11 , in the present invention, the light emitting angle can be increased to 170°.

[0057] Accordingly, see Figure 8 In one embodiment of the present invention, a flip-chip LED lamp bead 100 is also disclosed, which includes a flip-chip LED chip 110, a packaging glue layer 120, and white glue bumps 520. In another embodiment of the present invention, the flip-chip LED lamp bead 100 also includes a fluorescent glue layer 130 disposed between the packaging glue layer 120 and the white glue bumps 520.

[0058] Accordingly, see Fig.10In one embodiment of the present invention, a display screen is also disclosed, which includes a backlight module, the backlight module includes a PCB substrate 300, a flip-chip LED lamp bead 100 and a diffuser 200, and the flip-chip LED lamp bead 100 is electrically connected to the PCB substrate 300. Based on the flip-chip LED lamp bead 100 of the above embodiment, not only can the lens in the traditional backlight module be eliminated, the number of flip-chip LED lamp beads 100 can be reduced, and the manufacturing cost can be reduced; but also the light mixing distance can be shortened, making the display screen thinner and lighter.

[0059] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0060] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. A method for packaging a flip-chip LED lamp bead, characterized in that: include: Fixing a flip-chip LED chip on a first substrate to obtain a first intermediate; wherein the flip-chip LED chip comprises a substrate and an epitaxial layer and an electrode sequentially arranged on the substrate; one side of the electrode of the flip-chip LED chip is fixed on the first substrate, and the flip-chip LED chip can be separated from the first substrate; Forming white glue bumps on the second substrate to obtain a second intermediate; wherein the width of the bottom of the white glue bumps is greater than the width of the top thereof, and the width of the bottom of the white glue bumps is greater than the width of the flip-chip LED chip; and the white glue bumps can reflect light; The first intermediate is compounded with the second intermediate, and a packaging glue layer is formed in the gap between the first intermediate and the second intermediate to obtain a third intermediate; wherein the side where the flip-chip LED chip in the first intermediate is located faces the white glue convex point, and the flip-chip LED chip is arranged corresponding to the white glue convex point; The first substrate and the second substrate on the third intermediate are removed.

2. The packaging method of flip-chip LED lamp beads according to claim 1, characterized in that: The step of compounding the first intermediate with the second intermediate and forming a packaging adhesive layer in the gap between the first intermediate and the second intermediate to obtain the third intermediate comprises: Providing a mold with an opening at the top, and fixing the side where the second substrate of the second intermediate is located on the bottom wall of the mold; Filling packaging glue in the mold; Before the encapsulation glue is cured, the first intermediate is loaded into the mold, and the flip-chip LED chip is arranged corresponding to the white glue bumps; curing the encapsulation adhesive to form an encapsulation adhesive layer to obtain a third intermediate; The third intermediate body is demolded from the mold.

3. The packaging method of flip-chip LED lamp beads according to claim 1, characterized in that: The step of compounding the first intermediate with the second intermediate and forming a packaging adhesive layer in the gap between the first intermediate and the second intermediate to obtain the third intermediate comprises: Providing a mold with an opening at the top, and fixing one side of the second substrate of the second intermediate body on the bottom wall of the mold; Before the encapsulation glue is cured, the first intermediate is loaded into the mold, and the flip-chip LED chip is arranged corresponding to the white glue bumps; Injecting packaging glue into the gap between the first intermediate body and the second intermediate body; curing the encapsulating adhesive to form an encapsulating adhesive layer to obtain a third intermediate; The third intermediate body is demolded from the mold.

4. The packaging method of flip-chip LED lamp beads according to claim 2 or 3, characterized in that: At least one air hole is formed on the bottom wall of the mold, and the second intermediate is fixed on the bottom wall of the mold by adsorption through the negative pressure formed by the air hole; After the encapsulation adhesive is cured, air is blown through the air holes to demould the third intermediate from the mold.

5. The packaging method of flip-chip LED lamp beads according to claim 1, characterized in that: The gap between the first intermediate body and the second intermediate body is filled with fluorescent glue and packaging glue, and is cured to form a fluorescent glue layer and a packaging glue layer respectively; wherein the fluorescent glue layer is arranged close to the second intermediate body, and the packaging glue layer is arranged close to the first intermediate body.

6. The packaging method of flip-chip LED lamp beads according to claim 1, characterized in that: The first substrate is a steel substrate, and the flip-chip LED chip is bonded to the first substrate by means of an adhesive tape; The first intermediate body includes a plurality of flip-chip LED chips distributed in an array on the first substrate.

7. The packaging method of flip-chip LED lamp beads according to claim 1, characterized in that: The second substrate is a PET substrate; The second intermediate body comprises a plurality of white glue bumps distributed in an array on the second substrate; In the third intermediate, the white glue bumps are arranged in one-to-one correspondence with the flip-chip LED chips.

8. The packaging method of flip-chip LED lamp beads according to claim 1, characterized in that: The white glue convex points are in the shape of domes; In the third intermediate, the geometric center of the white glue bump and the center of the flip-chip LED chip are located on the same straight line.

9. A flip-chip LED lamp bead, characterized in that: The flip-chip LED chip is packaged by the packaging method of the flip-chip LED lamp bead as described in any one of claims 1 to 8.

10. A display screen, characterized in that: It comprises a backlight module, the backlight module comprises a PCB substrate, the flip-chip LED lamp bead and the diffusion sheet as claimed in claim 9, the flip-chip LED lamp bead is electrically connected to the PCB substrate.

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