Semiconductor crystal grain mounting device and method for ultra-miniature semiconductor chilling plate

Abstract

The invention relates to the field of semiconductor chilling plates, in particular to a semiconductor crystal grain mounting device and method for an ultra-miniature semiconductor chilling plate, and the method comprises the steps: preparing two ceramic substrates which are provided with the same positions to be mounted; a to-be-mounted semiconductor crystal grain is adhered to the downward surface of the transfer film, and the transfer film is arranged above the first ceramic substrate, so that the to-be-mounted position is aligned with the semiconductor crystal grain; and the transfer film is pushed downwards, so that the semiconductor crystal grains are in contact with the aligned to-be-mounted positions and then the position of the transfer film is recovered. Moving the transfer film and the first ceramic substrate to enable the next to-be-mounted position to be aligned with the next semiconductor crystal grain, and repeating the step until all the to-be-mounted positions are mounted with the semiconductor crystal grains; and aligning all the to-be-mounted positions of the second ceramic substrate with the semiconductor crystal grains on the first ceramic substrate to obtain a semiconductor chilling plate, and then carrying out reflow soldering. The surface mounting precision and efficiency are higher, the Micro TEC process requirements are met, the problem of manufacturing the ultra-miniature semiconductor chilling plate is solved, and the efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor refrigeration chips, and in particular to a semiconductor crystal grain mounting device and method for an ultra-micro semiconductor refrigeration chip. Background Art

[0002] Thermo Electric Cooler (TEC) is a device based on the Peltier principle, which absorbs and releases heat in a series of two different semiconductor materials through direct current to achieve cooling. TEC is mainly composed of P-type semiconductor grains, N-type semiconductor grains, ceramic substrates and thermal conductive sheets. Among them, P-type and N-type semiconductor grains are arranged at intervals and connected through electrodes, connected to two ceramic substrates through solder paste curing and sandwiched between the two ceramic substrates, and the thermal conductive sheet is attached to the outer side of the front of the ceramic substrate.

[0003] Micro TEC is the optimal solution for precise temperature control of 5G and high-end optical communication optical devices. Micro TEC usually refers to TEC with a grain size of less than 0.35mm, a height of less than 0.4mm, and an overall size of no more than 3mm*3mm. Compared with conventional semiconductor refrigeration chips, Micro TEC has the characteristics of small size and can work reliably for a long time in extremely small spaces and harsh environmental conditions. Therefore, Micro TEC is of great significance to the development of semiconductor refrigeration technology.

[0004] At present, there are two main manufacturing processes for semiconductor refrigerators: one is to use a semiconductor grain screening mold with holes, manually knock or mechanically vibrate to make the semiconductor grains fall into the mold holes one by one, then place the ceramic plate on the mold, and then flip the mold to make the semiconductor grains fall on the ceramic substrate; the other is to use an SMT placement machine to suck up the semiconductor grains through vacuum adsorption by a nozzle and place them on the ceramic substrate of the semiconductor refrigerator.

[0005] However, both methods have some problems. Although the method of using a grain screening mold improves the production efficiency to a certain extent, the accuracy cannot be guaranteed and cannot meet the process requirements of Micro TEC. The method of using an SMT placement machine to vacuum absorb semiconductor grains and mount them on a ceramic substrate can make up for the shortcomings of low efficiency and low precision of manual production, but because the suction nozzle needs to move back and forth between the semiconductor grain storage table and the ceramic substrate through a long swing arm, its mounting efficiency is still low. Summary of the invention

[0006] In order to solve the above problems, the present invention provides a semiconductor die mounting device and method for an ultra-micro semiconductor refrigeration chip.

[0007] A semiconductor die mounting method for an ultra-micro semiconductor refrigeration chip comprises:

[0008] Step 1, preparing a first ceramic substrate and a second ceramic substrate, setting positions to be mounted on the ceramic substrates for placing semiconductor grains to be mounted, and the positions to be mounted on the two ceramic substrates are arranged in the same manner;

[0009] Step 2: Apply adhesive on the downward side of the transfer film to adhere the semiconductor die to be mounted on the film;

[0010] Step 3, placing the transfer film on the first ceramic substrate, aligning a certain position to be mounted on the first ceramic substrate with a certain semiconductor crystal grain to be mounted on the transfer film in the vertical direction and in the horizontal direction;

[0011] Step 4, pushing the film material of the transfer film downward until the aligned semiconductor die to be mounted contacts the solder paste set on the aligned mounting position, so that the transfer film returns to the starting position;

[0012] Step 5, moving the transfer film and the first ceramic substrate, aligning the next to-be-mounted position of the first ceramic substrate with the next to-be-mounted semiconductor grain on the transfer film in the vertical direction and in the horizontal direction, and then executing step 4;

[0013] Step 6, repeatedly performing step 5 until all the positions to be mounted on the first ceramic substrate are mounted with semiconductor grains;

[0014] Step 7, printing solder paste on all the positions to be mounted on the second ceramic substrate and aligning them with the semiconductor grains on the first ceramic substrate, mounting the semiconductor grains on the first ceramic substrate on all the positions to be mounted on the second ceramic substrate to obtain a semiconductor cooling sheet;

[0015] Step eight, reflow soldering the semiconductor cooling chip.

[0016] A semiconductor die mounting device for an ultra-micro semiconductor refrigeration chip is used to implement the semiconductor die mounting method for the ultra-micro semiconductor refrigeration chip, comprising:

[0017] A base, the base comprising a horizontal bearing platform and two vertical parallel side walls arranged at both ends of the horizontal bearing platform;

[0018] A substrate motion platform is arranged on the horizontal bearing platform of the base, and a semiconductor refrigeration plate bearing platform is arranged on the top surface of the substrate motion platform. The semiconductor refrigeration plate bearing platform can move along the length direction of the base or the width direction of the base in the horizontal plane under the drive of the substrate motion platform;

[0019] A film transfer motion platform is disposed between two vertical side walls of the base, the film transfer motion platform is located above the substrate motion platform and can move along the length direction of the base;

[0020] A push mechanism motion platform is arranged on the top of the base, the push mechanism motion platform is located above the film transfer motion platform, and a push mechanism is arranged on the push mechanism motion platform, and the push mechanism can move in the width direction and the vertical direction of the base;

[0021] A first ceramic substrate is arranged on the semiconductor refrigeration plate carrier, a position to be mounted is arranged on the surface of the first ceramic substrate, and solder paste is arranged in the position to be mounted;

[0022] A transfer film is horizontally arranged on the transfer film moving platform, and a semiconductor grain is adhered to a side of the transfer film opposite to the substrate moving platform;

[0023] The push mechanism can move downward to push the semiconductor crystal grains on the transfer film downward to contact the solder paste in the to-be-mounted position. When the push mechanism moves upward, the transfer film can return to its original position.

[0024] Furthermore, the substrate motion platform includes:

[0025] A first workbench disposed on the upper surface of the horizontal bearing platform of the base;

[0026] A first linear motor module is arranged between the horizontal bearing platform of the base and the first workbench, and the first linear motor module can drive the first workbench to move along the length direction of the base;

[0027] A second workbench disposed on the upper surface of the first workbench;

[0028] A second linear motor module is arranged between the first workbench and the second workbench, and the second linear motor module can drive the second workbench to move along the width direction of the base;

[0029] A rotating mechanism disposed on the upper surface of the second workbench;

[0030] The semiconductor refrigeration plate carrier is arranged on a rotating mechanism, and the rotating mechanism can control the semiconductor refrigeration plate carrier to rotate in a horizontal plane.

[0031] Furthermore, a first stator groove is provided on the top surface of the horizontal bearing platform of the base, and the first stator groove is provided along the length direction of the base and is located at the center of the width direction of the base;

[0032] A first slider groove is provided on a side of the first workbench opposite to the horizontal bearing platform of the base, and the first slider groove is arranged along the length direction of the base; a second stator groove is provided on the top surface of the first workbench, and the second stator groove is arranged along the width direction of the base, and the second stator groove is located on the center line of the first workbench in the length direction of the base;

[0033] The first linear motor module includes: a first guide rail, a first slider, a first linear motor stator, and a first linear motor mover; the first linear motor stator is installed in a first stator groove, two first guide rails are installed on a horizontal bearing platform of a base and are symmetrically arranged on both sides of the first linear motor stator, the first linear motor mover is installed on the center line of a side of the first workbench opposite to the horizontal bearing platform of the base along the length direction of the base and is arranged opposite to the first linear motor stator, a plurality of first sliders are embedded in the first slider groove and are symmetrically arranged on both sides of the first linear motor mover, and the first sliders on both sides of the first workbench are embedded on the two first guide rails;

[0034] A second slider groove is provided at the bottom of the second workbench, and the second slider groove is arranged along the width direction of the base; a circular gear shaft receiving groove and a circular rotating motor receiving groove are provided at the top of the second workbench;

[0035] The second linear motor module includes: a second guide rail, a second slider, a second linear motor stator, and a second linear motor mover; the second linear motor stator is installed in the second stator groove, two second guide rails are installed on the top surface of the first workbench and are symmetrically arranged on both sides of the second linear motor stator, the second linear motor mover is installed on the center line of the bottom of the second workbench along the width direction of the base and is arranged opposite to the second linear motor stator, a plurality of second sliders are installed in the second slider groove at the bottom of the second workbench and are symmetrically arranged on both sides of the second linear motor mover, and the second sliders on both sides of the second workbench are embedded in the two second guide rails;

[0036] The rotating mechanism is installed on the top of the second workbench, and includes: a gear shaft, a synchronous belt, and a rotating motor; the gear shaft is installed in the gear shaft receiving groove, the rotating motor is installed in the rotating motor receiving groove, and the gear shaft and the rotating motor are connected through a synchronous belt;

[0037] The semiconductor refrigeration plate carrier is installed on the gear shaft, and the rotating motor drives the gear shaft to rotate through the transmission of the synchronous belt, thereby driving the semiconductor refrigeration plate carrier to rotate in the horizontal plane.

[0038] Further, the transfer film motion platform includes a third linear motor module and a transfer film bearing platform;

[0039] The transfer film carrying platform is provided with a circular through hole, the transfer film is mounted on the lower surface of the transfer film carrying platform and is coaxial with the circular through hole, and the opening area of ​​the circular through hole can completely contain the arrangement area of ​​the semiconductor grains in the transfer film; third slider grooves are provided on both sides of the transfer film carrying platform along the length direction of the base;

[0040] A third stator groove is provided on the inner side of each side wall of the base along the length direction of the base;

[0041] The third linear motor module includes: a third guide rail, a third slider, a third linear motor stator, and a third linear motor mover; two groups of third linear motor stators are respectively installed in the third stator groove, four third guide rails are respectively installed in groups of two on each side wall of the base and are symmetrically arranged on both sides of the third linear motor stator, two third linear motor movers are respectively installed on both sides of the transfer film bearing platform along the length direction of the base and are respectively arranged opposite to the third linear motor stator, a number of third sliders are installed in the third slider groove, and the third sliders on each side of the transfer film bearing platform are symmetrically arranged on both sides of the third linear motor mover, and the third sliders on both sides of the transfer film bearing platform are respectively embedded in the third guide rails on the corresponding side walls of the base.

[0042] Furthermore, the push mechanism motion platform includes: a fourth linear motor module, a fourth workbench, a push mechanism, and a crossbeam;

[0043] A crossbeam groove is provided on the top of each side wall of the base, and the crossbeam groove is located at the center of the length direction of the base;

[0044] The crossbeam is installed in the crossbeam groove, and a fourth stator groove is provided on one side of the crossbeam along the length direction of the crossbeam, and the fourth stator groove is located on the height center line of the crossbeam;

[0045] The fourth linear motor module comprises: a fourth guide rail, a fourth slider, a fourth linear motor stator, and a fourth linear motor mover; the fourth linear motor stator is installed in the fourth stator groove, two fourth guide rails are installed on the crossbeam and are symmetrically arranged on both sides of the fourth linear motor stator, the fourth linear motor mover is installed on the center line of the fourth workbench along the width direction of the base and is arranged opposite to the fourth linear motor stator, a plurality of fourth sliders are installed on the fourth workbench and are symmetrically arranged on both sides of the fourth linear motor mover, and the fourth sliders on both sides of the fourth workbench are embedded on the two fourth guide rails;

[0046] The pushing mechanism is installed on the fourth workbench, and the pushing mechanism can reciprocate in the vertical direction under external drive.

[0047] Furthermore, the transfer film includes a film material and a film material support ring;

[0048] The membrane material is an elastic membrane material;

[0049] The membrane support ring can tension the membrane to make the surface of the membrane flat; the downward side of the membrane is coated with adhesive, and the semiconductor grains are adhered to the membrane through the adhesive.

[0050] Furthermore, an imaging device is arranged on the fourth workbench; the imaging device has a driving mechanism so that it can realize reciprocating motion in the vertical direction on the fourth workbench.

[0051] Furthermore, it also includes a measuring tool to monitor the motion displacement of the first linear motor module, the second linear motor module, the third linear motor module and the fourth linear motor module.

[0052] Furthermore, a plurality of second vacuum adsorption holes are provided on the surface of the semiconductor refrigeration plate carrier platform;

[0053] The first ceramic substrate accommodating mold is adsorbed and fixed on the second vacuum adsorption hole. The first ceramic substrate accommodating mold has a plurality of first ceramic substrate accommodating grooves. The first ceramic substrate can be placed in the first ceramic substrate accommodating grooves.

[0054] One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:

[0055] The push-up technology adopted in this application directly arranges the push-up mechanism, semiconductor crystal grains and semiconductor cooling plate ceramic substrates relative to each other, greatly reducing the moving distance of semiconductor crystal grains during mounting. This arrangement can not only greatly improve the mounting efficiency of semiconductor crystal grains of ultra-micro semiconductor cooling plates, but also meet higher mounting accuracy requirements, effectively avoiding problems such as uneven arrangement, tilt, cracks and damage of semiconductor crystal grains.

[0056] Compared with the aforementioned grain screening mold method, the push-up technology has higher precision and can meet the process requirements of Micro TEC, solving the problem that the grain screening mold method cannot meet the process requirements of ultra-micro semiconductor cooling sheet manufacturing. Compared with the vacuum adsorption method of SMT placement machine, the push-up technology has higher efficiency, greatly reducing the moving distance of the swing arm between the semiconductor grain storage table and the ceramic substrate, improving the production efficiency, and solving the problem of low mounting efficiency of the vacuum adsorption method of SMT placement machine. BRIEF DESCRIPTION OF THE DRAWINGS

[0057] Figure 1 A structural diagram of a semiconductor die mounting device for an ultra-micro semiconductor refrigeration chip provided by an embodiment of the present invention;

[0058] Figure 2 A diagram of a base structure provided for an embodiment of the present invention;

[0059] Figure 3 A structural diagram of a substrate motion platform provided in an embodiment of the present invention;

[0060] Figure 4 A structural diagram of a first workbench provided in an embodiment of the present invention;

[0061] Figure 5 A structural diagram of a second workbench provided in an embodiment of the present invention;

[0062] Figure 6A structural diagram of a semiconductor refrigeration plate carrier provided in an embodiment of the present invention;

[0063] Figure 7 A structural diagram of a first ceramic substrate accommodating mold provided in an embodiment of the present invention;

[0064] Figure 8 A structural diagram of a film transfer motion platform provided in an embodiment of the present invention;

[0065] Fig. 9 A structural diagram of a motion platform of a push mechanism provided in an embodiment of the present invention;

[0066] Fig.10 A crossbeam structure diagram provided for an embodiment of the present invention;

[0067] Fig.11 A schematic plan view of a transfer film provided by an embodiment of the present invention;

[0068] Fig.12 A three-dimensional schematic diagram of a transfer film provided by an embodiment of the present invention;

[0069] Fig.13 A schematic diagram of the process of attaching a semiconductor die to a first ceramic substrate according to an embodiment of the present invention;

[0070] Fig.14 A schematic diagram of a first mounting process flow for a P-type semiconductor crystal grain provided by an embodiment of the present invention;

[0071] Fig.15 A schematic diagram of a second mounting process flow for a P-type semiconductor die provided by an embodiment of the present invention;

[0072] Fig.16 A schematic diagram of a first mounting process flow for N-type semiconductor grains provided by an embodiment of the present invention;

[0073] Fig.17 A schematic diagram of a second mounting process flow for N-type semiconductor crystal grains provided by an embodiment of the present invention;

[0074] Fig.18 A schematic diagram of the structure of a first ceramic substrate with semiconductor crystal grains mounted thereon provided in an embodiment of the present invention;

[0075] Fig.19 A schematic diagram of the structure of a semiconductor refrigeration plate provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0076] The present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments. Before describing in detail the technical solutions of each embodiment of the present invention, the nouns and terms involved are explained. In this specification, components with the same name or the same number represent similar or identical structures and are only for illustrative purposes.

[0077] The semiconductor die mounting device structure of the ultra-micro semiconductor refrigeration chip proposed by the present invention is as follows: Figure 1 As shown, it includes: a base 1, a substrate motion platform 2, a film transfer motion platform 3, a push mechanism motion platform 4, and an imaging device 5.

[0078] 1. Base

[0079] like Figure 2 As shown, the base 1 has a horizontal bearing platform and two vertical side walls, wherein the side walls on both sides of the base are used to bear the film transfer motion platform 3 and the push mechanism motion platform 4, and the horizontal bearing platform of the base 1 is used to bear the substrate motion platform 2. The base 1 is made of granite or other materials with small vibration amplitude and high stability. The base 1 can be integrally formed, or the horizontal bearing platform and the two side walls can be designed separately.

[0080] The top surface of the horizontal bearing platform of the base 1 is provided with a first stator groove 11, which is provided along the length direction of the base 1 and is located at the center of the width direction of the base 1. The top of each side wall of the base 1 is provided with a crossbeam groove 12, which is located at the center of the length direction of the base 1. The inner side of each side wall of the base 1 is provided with a third stator groove 13 along the length direction of the base 1.

[0081] 2. Substrate motion platform

[0082] like Figure 3 As shown, the substrate motion platform 2 includes a first linear motor module 21, a first workbench 22, a second linear motor module 23, a second workbench 24, a semiconductor cooling plate carrier 25, and a rotating mechanism 26. Through the movement of the first linear motor module 21, the second linear motor module 23 and the rotating mechanism 26, the semiconductor cooling plate carrier 25 can achieve two-dimensional movement and a certain angle of rotation in a horizontal plane.

[0083] like Figure 4 As shown, a first slider groove 221 is provided on a side of the first workbench 22 opposite to the horizontal bearing platform of the base 1, and the first slider groove 221 is arranged along the length direction of the base 1. A second stator groove 222 is provided on the top surface of the first workbench 22, and the second stator groove 222 is arranged along the width direction of the base 1. The second stator groove 222 is located on the center line of the first workbench 22 in the length direction of the base 1.

[0084] like Figure 3As shown, the first linear motor module 21 includes: a first guide rail 211, a first slider 212, a first linear motor stator 213, a first linear motor mover 214, and a first limit buffer mechanism 215. The first linear motor stator 213 is installed in the first stator groove 11, two first guide rails 211 are installed on the horizontal bearing platform of the base 1 and are symmetrically arranged on both sides of the first linear motor stator 213, the first linear motor mover 214 is installed on the center line of the side of the first workbench 22 opposite to the horizontal bearing platform of the base 1 along the length direction of the base 1 and is arranged opposite to the first linear motor stator 213, a plurality of first sliders 212 are embedded in the first slider groove 221 and are symmetrically arranged on both sides of the first linear motor mover 214, and the sliders 212 on both sides of the first workbench 22 are embedded on the two first guide rails 211, so that the first workbench 22 can realize the reciprocating motion in the length direction of the base 1 under the drive of the first linear motor module 21. A first position limiting buffer mechanism 215 is provided at the end of each first guide rail 211. The first position limiting buffer mechanism 215 is installed on the side of the base 1. When the first workbench 22 moves to the end close to the first guide rail 211, the first position limiting buffer mechanism 215 is used to provide a buffering braking force to the first workbench 22 and prevent the first workbench 22 from sliding out of the first guide rail 211.

[0085] like Figure 3 and Figure 5 As shown, the second workbench 24 is arranged on the first workbench 22. The second workbench 24 has a second slider groove 241 at the bottom, and the second slider groove 241 is arranged along the width direction of the base 1. The second workbench 24 has a gear shaft receiving groove 242 and a rotating motor receiving groove 243 at the top, both of which are circular, and the gear shaft receiving groove 242 is located in the middle of the top of the second workbench 24.

[0086] The second linear motor module 23 includes: a second guide rail 231, a second slider 232, a second linear motor stator 233, a second linear motor mover 234, and a second limit buffer mechanism 235. The second linear motor stator 233 is installed in the second stator groove 222 on the top surface of the first workbench 22, two second guide rails 231 are installed on the top surface of the first workbench 22 and are symmetrically arranged on both sides of the second linear motor stator 233, the second linear motor mover 234 is installed on the center line of the bottom of the second workbench 24 along the width direction of the base 1 and is arranged opposite to the second linear motor stator 233, a plurality of second sliders 232 are installed in the second slider groove 241 at the bottom of the second workbench 24 and are symmetrically arranged on both sides of the second linear motor mover 234, and the second sliders 232 on both sides of the second workbench 24 are embedded on the two second guide rails 231, so that the second workbench 24 can realize reciprocating motion in the width direction of the base 1 under the drive of the second linear motor module 23. A second position limiting buffer mechanism 235 is provided at the end of each second guide rail 231. The second position limiting buffer mechanism 235 is installed on the side of the first workbench 22. When the second workbench 24 moves to the end close to the second guide rail 231, the second position limiting buffer mechanism 235 is used to provide a buffering braking force to the second workbench 24 and prevent the second workbench 24 from sliding out of the second guide rail 231.

[0087] like Figure 3 As shown, the rotating mechanism 26 is installed on the top of the second workbench 24, and includes: a gear shaft 261, a synchronous belt 262, and a rotating motor 263. The gear shaft 261 is installed in the gear shaft receiving groove 242 on the top of the second workbench 24, and the rotating motor 263 is installed in the rotating motor receiving groove 243 on the top of the second workbench 24. The gear shaft 261 and the rotating motor 263 are connected through the synchronous belt 262. The semiconductor refrigeration plate carrier 25 is installed on the gear shaft 261, and the rotating motor 263 drives the gear shaft 261 to rotate through the transmission of the synchronous belt 262, thereby driving the semiconductor refrigeration plate carrier 25 to rotate.

[0088] like Figure 6 and Figure 7 As shown, the semiconductor cooling sheet carrier 25 is used to place the first ceramic substrate accommodating mold 251. The surface of the semiconductor cooling sheet carrier 25 has a plurality of second vacuum adsorption holes 255 for adsorbing and fixing the first ceramic substrate accommodating mold 251. The first ceramic substrate accommodating mold 251 has a plurality of first ceramic substrate accommodating grooves 252, and the semiconductor cooling sheet 253 is placed in the first ceramic substrate accommodating grooves 252.

[0089] Semiconductor cooling sheet 253 Fig.18 and Fig.19As shown, the semiconductor cooling sheet 253 includes a first ceramic substrate 2531, a second ceramic substrate 2532 and solder paste 2533. The first ceramic substrate 2531 and the second ceramic substrate 2532 each have a plurality of positions to be mounted, and the solder paste 2533 is printed on the positions to be mounted. The semiconductor grains to be mounted are adhered to the positions to be mounted of the first ceramic substrate 2531 and the second ceramic substrate 2532 through the solder paste 2533.

[0090] Each first ceramic substrate accommodating groove 252 has a first vacuum adsorption hole 254 at the bottom thereof for adsorbing and fixing the first ceramic substrate 2531 .

[0091] 3. Film transfer platform

[0092] like Figure 8 As shown, the film transfer motion platform 3 includes: a third linear motor module 31 and a film transfer bearing platform 32 .

[0093] The transfer film carrying platform 32 has a circular through hole 321. The transfer film 6 is detachably mounted on the lower surface of the transfer film carrying platform 32 and is coaxial with the circular through hole 321. The opening area of ​​the circular through hole 321 can completely contain the arrangement area of ​​the semiconductor grains in the transfer film 6. The third slider grooves 322 are provided on both sides of the transfer film carrying platform 32 along the length direction of the base 1.

[0094] The third linear motor module 31 includes: a third guide rail 311 , a third slider 312 , a third linear motor stator 313 , a third linear motor mover 314 , and a third limit buffer mechanism 315 . Two groups of third linear motor stators 313 are respectively installed in the third stator grooves 13 on the two side walls of the base 1, four third guide rails 311 are respectively installed on each side wall of the base 1 in groups of two and are symmetrically arranged on both sides of the third linear motor stator 313, two third linear motor movers 314 are respectively installed on both sides of the transfer film bearing platform 32 along the length direction of the base 1 and are respectively arranged opposite to the third linear motor stator 313, a plurality of third sliders 312 are installed in the third slider grooves 322 on both sides of the transfer film bearing platform 32, and the third sliders 312 on each side of the transfer film bearing platform 32 are respectively symmetrically arranged on both sides of the third linear motor movers 314, and the third sliders 312 on both sides of the transfer film bearing platform 32 are respectively embedded in the third guide rails 311 on the corresponding side walls of the base 1, so that the transfer film bearing platform 32 can realize reciprocating motion in the length direction of the base 1 under the drive of the third linear motor module 31. A third position limiting buffer mechanism 315 is provided at the end of each third guide rail 311, and the third position limiting buffer mechanism 315 is installed on the side of the base 1. When the transfer film carrying platform 32 moves to the end close to the third guide rail 311, the third position limiting buffer mechanism 315 is used to provide a buffering braking force to the transfer film carrying platform 32, and prevent the transfer film carrying platform 32 from sliding out of the third guide rail 311.

[0095] 4. Push mechanism motion platform

[0096] like Fig. 9 As shown, the pushing mechanism motion platform 4 includes: a fourth linear motor module 41 , a fourth workbench 42 , a pushing mechanism 43 , and a crossbeam 44 .

[0097] like Fig.10 As shown, the crossbeam 44 spans over the two side walls of the base 1 and is installed in the crossbeam groove 12. A fourth stator groove 441 is formed on one side of the crossbeam 44 along the length direction of the crossbeam, and the fourth stator groove 441 is located on the height center line of the crossbeam 44.

[0098] The fourth linear motor module 41 includes: a fourth guide rail 411, a fourth slider 412, a fourth linear motor stator 413, a fourth linear motor mover 414, and a fourth limit buffer mechanism 415. The fourth linear motor stator 413 is installed in a fourth stator groove 441 on the side of the beam, two fourth guide rails 411 are installed on the beam 44 and are symmetrically arranged on both sides of the fourth linear motor stator 413, the fourth linear motor mover 414 is installed on the center line of the fourth workbench 42 along the width direction of the base 1 and is arranged opposite to the fourth linear motor stator 413, a plurality of fourth sliders 412 are installed on the fourth workbench 42 and are symmetrically arranged on both sides of the fourth linear motor mover 414, and the fourth sliders 412 on both sides of the fourth workbench 42 are embedded on the two fourth guide rails 411, so that the fourth workbench 42 can realize reciprocating motion in the width direction of the base 1 under the drive of the fourth linear motor module 41. A fourth position limiting buffer mechanism 415 is provided at the end of each fourth guide rail 411, and the fourth position limiting buffer mechanism 415 is installed on the side of the cross beam 44. When the fourth workbench 42 moves to the end close to the fourth guide rail 411, the fourth position limiting buffer mechanism 415 is used to provide a buffering braking force to the fourth workbench 42 and prevent the fourth workbench 42 from sliding out of the fourth guide rail 411.

[0099] The push mechanism 43 is installed on the fourth workbench 42. The push mechanism 43 is driven by a motor or a cylinder, etc., and can realize reciprocating motion in the vertical direction. Through the drive of the fourth linear motor module 41 and the push mechanism 43 itself, the push mechanism 43 can realize two-dimensional motion in a vertical plane perpendicular to the length direction of the base 1.

[0100] The motion displacement monitoring of the first linear motor module 21, the second linear motor module 23, the third linear motor module 31 and the fourth linear motor module 41 is realized by installing the grating ruler in the direction parallel to the first guide rail 211, the second guide rail 231, the third guide rail 311 and the fourth guide rail 411 and installing the reading head on the first workbench 22, the second workbench 24, the transfer film bearing platform 32 and the fourth workbench 42 relative to the position of the grating ruler. The motion displacement monitoring of the first linear motor module 21, the second linear motor module 23, the third linear motor module 31 and the fourth linear motor module 41 can also be realized by using measuring tools such as laser displacement sensors and capacitive sensors. It is common knowledge in the art to monitor the motion displacement by measuring tools, and the present invention does not elaborate on how to set the measuring tools.

[0101] 5. Other device modules

[0102] like Fig.11 , Fig.12 As shown, the transfer film 6 includes a film material 61, a film material support ring 62, and a plurality of semiconductor grains 63 adhesively attached to the film material 61. The film material 61 can be a blue film, UV film or other elastic film material, but is not limited thereto; the film material support ring 62 is used to tension the film material 61 to ensure that the surface of the film material 61 is flat; one side of the film material 61 is coated with adhesive to adhere the plurality of semiconductor grains 63 to the film material 61; the plurality of semiconductor grains 63 are arranged in a matrix with the same spacing on the transfer film 6, and the spacing between the plurality of semiconductor grains 63 can be adjusted by the crystal expander according to actual production needs. The transfer film 6 is horizontally arranged above the first ceramic substrate 2531 and has a certain spacing with the first ceramic substrate 2531. The distance between the transfer film 6 and the first ceramic substrate 2531 refers to the distance between the lower surface of the semiconductor grain 63 and the upper surface of the first ceramic substrate 2531, which should be no less than the sum of the thickness of the semiconductor grain 63 and the thickness of the solder paste 2533, so as to prevent the semiconductor grain 63 adjacent to the semiconductor grain 63 from interfering with the solder paste 2533 when the push mechanism pushes a semiconductor grain 63 to the first ceramic substrate 2531 to be mounted and adheres to the solder paste 2533, thereby affecting the subsequent mounting operation. The push mechanism 43 is located above the transfer film 6 and has a certain distance from the transfer film 6. The distance between the push mechanism 43 and the transfer film 6 refers to the distance between the lower surface of the end of the push mechanism 43 and the upper surface of the film material 61, which can be set to be no less than 0.05 mm, so as to prevent the end of the push mechanism 43 from interfering with the film material 61 and scratching the film material 61 when the push mechanism 43 and the transfer film moving platform 3 move in the horizontal direction.

[0103] The imaging device 5 is installed on the fourth workbench 42 and arranged in parallel with the pushing mechanism 43. The imaging device 5 has a driving mechanism and can realize reciprocating motion in the vertical direction on the fourth workbench 42. The imaging device 5 photographs the semiconductor grains 63 on the transfer film 6 and the positions to be mounted on the first ceramic substrate 2531 to generate two-dimensional coordinate data of the semiconductor grains 63 and the positions to be mounted in the horizontal plane.

[0104] 6. Semiconductor die mounting method

[0105] The method for performing semiconductor die placement using the semiconductor die placement device of the ultra-micro semiconductor refrigeration sheet provided by the present invention specifically comprises:

[0106] Step 1: before mounting semiconductor dies, the combined movement of the transfer film motion platform 3, the push mechanism motion platform 4, and the driving mechanism of the imaging device 5 enables the imaging device 5 to photograph all semiconductor dies 63 on the transfer film 6 and establish two-dimensional coordinate data of each semiconductor dies 63;

[0107] Step 2: Through the combined movement of the substrate motion platform 2, the push mechanism motion platform 4, and the driving mechanism of the imaging device 5, the imaging device 5 photographs the position to be mounted of the first ceramic substrate 2531 on the semiconductor refrigeration plate carrier 25, and establishes two-dimensional coordinate data of each position to be mounted;

[0108] Step 3: Through the combined movement of the substrate moving platform 2, the transfer film moving platform 3, and the push mechanism moving platform 4, the push mechanism 43 is aligned with a semiconductor grain 63 on the transfer film 6 and a corresponding position to be mounted on the first ceramic substrate 2531 in the vertical direction, and the angle of a position to be mounted on the first ceramic substrate 2531 and the corresponding semiconductor grain 63 on the transfer film 6 are aligned in the horizontal direction;

[0109] Step 4: The pushing mechanism 43 moves in the vertical direction to push the semiconductor crystal grain 63 away from the transfer film 6 and finally fixes it on the corresponding position to be mounted on the first ceramic substrate 2531 .

[0110] The specific process of step 4 is as follows Fig.13As shown, when the semiconductor crystal grain 63 is mounted, the pushing mechanism 43 pushes the film material 61 of the carrier film 6, drives the semiconductor crystal grain 63 to move downward in the vertical direction and slightly pushes the semiconductor crystal grain 63 away from the film material 61, thereby reducing the adhesion area between the semiconductor crystal grain 63 and the film material 61. The pushing mechanism 43 continues to push the film material 61 until the semiconductor crystal grain 63 contacts the solder paste 2533 at the position to be mounted on the first ceramic substrate 2531. Then, the pushing mechanism 43 returns to the starting position. Since the bonding force between the solder paste 2533 and the semiconductor crystal grain 63 is greater than the bonding force between the film material 61 and the semiconductor crystal grain 63, during the process of the pushing mechanism 43 returning to the starting position, the film material 61 returns to its initial position due to the elastic restoring force, and the semiconductor crystal grain 63 is separated from the film material 61 and remains at the position to be mounted on the first ceramic substrate 2533.

[0111] like Fig.14 , Fig.15 , Fig.16 and Fig.17 As shown, semiconductor grains 63 are mounted on the first ceramic substrate 2531 in a P-type-N-type-P-type or N-type-P-type-N-type arrangement, wherein the ratio of the number of P-type semiconductor grains 631 to the number of N-type semiconductor grains 632 is 1:1. The method of mounting semiconductor grains 63 in a P-type-N-type-P-type arrangement is now described. The method of mounting semiconductor grains 63 in an N-type-P-type-N-P-type arrangement is the same as the principle of mounting in the aforementioned P-type-N-P-type-N-type arrangement, and will not be repeated here.

[0112] The following is a detailed explanation of the method for mounting semiconductor chips by the semiconductor chip mounting device for the ultra-micro semiconductor cooling chip provided by the present invention in combination with two embodiments.

[0113] 6.1 Place semiconductor chips one by one along the length of the base

[0114] The mounting process flow of the P-type semiconductor grain 631 on the first ceramic substrate 2531 along the length direction of the base is as follows: Fig.14 As shown, the process flow of mounting the N-type semiconductor grain 632 on the first ceramic substrate 2531 along the length direction of the base is as follows: Fig.16 shown.

[0115] Here, the mounting process of the P-type semiconductor grain 631 on the first ceramic substrate 2531 is taken as an example, which specifically includes:

[0116] The semiconductor crystal grain 63 and the position to be mounted on the first ceramic substrate 2531 are photographed by the imaging device 5 and two-dimensional coordinate data of the semiconductor crystal grain 63 and the position to be mounted in the horizontal plane are established;

[0117] The push mechanism 43 is fixed at a certain position in the width direction of the crossbeam 44, and a certain P-type semiconductor crystal grain 631 on the transfer film 6 and a certain position to be mounted on the first ceramic substrate 2531 are aligned with the push mechanism 43 in the vertical direction through the movement of the transfer film moving platform 3, the substrate moving platform 2 and the rotating mechanism 26, and the angle of the P-type semiconductor crystal grain 631 and the position to be mounted are aligned in the horizontal direction;

[0118] The pushing mechanism 43 moves in the vertical direction to push the P-type semiconductor grain 631 from the transfer film 6 to the waiting mounting position of the first ceramic substrate 2531 and fix it at the waiting mounting position.

[0119] L1 is defined as twice the distance between the centers of two adjacent positions to be mounted on the first ceramic substrate 2531 in the length direction of the base 1, and L2 is defined as the distance between the centers of adjacent P-type semiconductor grains 631 on the transfer film 6 in the length direction of the base 1. The substrate moving platform 2 drives the first ceramic substrate 2531 to move a distance L1 along the length direction of the base 1 in the direction to be mounted, and the transfer film moving platform 3 moves a distance L2 along the length direction of the base 1 in the direction to be mounted, so as to align the next P-type semiconductor grain 631 and the next position to be mounted on the first ceramic substrate 2531 with the push mechanism 43 in the vertical direction, and at the same time, the P-type semiconductor grain 631 and the position to be mounted are aligned in the horizontal direction through the movement of the rotating mechanism 26;

[0120] The push mechanism 43 moves in the vertical direction, pushes the P-type semiconductor grains 631 from the transfer film 6 to the mounting position of the first ceramic substrate 2531 and fixes them at the mounting position. In the above process flow, the P-type semiconductor grains 631 are mounted one by one on the first ceramic substrate 2531 along the length direction of the base 1.

[0121] When all the P-type semiconductor grains 631 in a row on the transfer film 6 are mounted on the first ceramic substrate 2531, the push mechanism moving platform 4 and the substrate moving platform 2 are moved along the width direction of the base 1 to align with the next row of P-type semiconductor grains 631; or when all the positions to be mounted in a row on the first ceramic substrate 2531 are mounted with P-type semiconductor grains 631, the substrate moving platform 2 is moved along the width direction of the base 1 to align the positions to be mounted in the next row of the first ceramic substrate 2531 with the P-type semiconductor grains 631 on the transfer film 6; finally, the P-type semiconductor grains 631 and the positions to be mounted are aligned in the horizontal direction by the movement of the rotating mechanism 26;

[0122] The above steps are repeated until all the positions to be mounted on the first ceramic substrate 2531 are mounted with semiconductor grains 63 .

[0123] 6.2 Place semiconductor chips one by one along the width of the base

[0124] The mounting process flow of the P-type semiconductor grain 631 on the first ceramic substrate 2531 along the width direction of the base 1 is as follows: Fig.15 As shown, the mounting process flow of the N-type semiconductor grain 632 on the first ceramic substrate 2531 along the width direction of the base 1 is as follows: Fig.17 shown.

[0125] Here, the mounting process of the P-type semiconductor grain 631 on the first ceramic substrate 2531 is taken as an example, which specifically includes:

[0126] The semiconductor crystal grain 63 and the position to be mounted on the first ceramic substrate 2531 are photographed by the imaging device 5 and two-dimensional coordinate data of the semiconductor crystal grain 63 and the position to be mounted in the horizontal plane are established;

[0127] The transfer film moving platform 3 is moved to a certain position below the crossbeam in the length direction of the base 1 and fixed thereto, and a certain P-type semiconductor crystal grain 631 on the transfer film 6 and a certain position to be mounted on the first ceramic substrate 2531 are aligned with the pushing mechanism 43 in the vertical direction through the movement of the pushing mechanism moving platform 4, the substrate moving platform 2 and the rotating mechanism 26, and the angles of the aforementioned P-type semiconductor crystal grain 631 and the position to be mounted are aligned in the horizontal direction;

[0128] The pushing mechanism 43 moves in the vertical direction to push the P-type semiconductor grain 631 from the transfer film 6 to the mounting position of the first ceramic substrate 2531 and fix it at the mounting position;

[0129] The spacing between the centers of two adjacent P-type semiconductor grains 631 on the transfer film 6 in the width direction of the base 1 is defined as L3, and the spacing between the center of the next position to be mounted on the first ceramic substrate 2531 and the center of the next P-type semiconductor grain 631 to be mounted on the transfer film 6 is defined as L4. The substrate moving platform 2 drives the first ceramic substrate 2531 to move a distance L4 along the width direction of the base 1 in the direction to be mounted, and the push mechanism moving platform 4 moves a distance L3 in the opposite direction of the direction to be mounted along the width direction of the base 1, so as to align the push mechanism 43 and the next position to be mounted on the first ceramic substrate 2531 with the next P-type semiconductor grain 631 in the vertical direction, and at the same time, the P-type semiconductor grain 631 and the position to be mounted are aligned in the horizontal direction by the movement of the rotating mechanism 26;

[0130] The push mechanism 43 moves in the vertical direction to push the P-type semiconductor grains 631 from the transfer film 6 to the mounting position of the first ceramic substrate 2531 and fix them at the mounting position. In the above process flow, the P-type semiconductor grains 631 are mounted one by one on the first ceramic substrate 2531 along the width direction of the base 1.

[0131] When all the P-type semiconductor grains 631 in a row on the transfer film 6 are mounted on the first ceramic substrate 2531, the transfer film moving platform 3 is moved along the length direction of the base 1 to align the next row of P-type semiconductor grains 631 on the transfer film 6 with the positions to be mounted on the first ceramic substrate 2531; or when all the positions to be mounted in a row on the first ceramic substrate 2531 are mounted with P-type semiconductor grains 631, the substrate moving platform 2 is moved along the length direction of the base 1 to align the next row of positions to be mounted on the first ceramic substrate 2531 with the P-type semiconductor grains 631 on the transfer film 6; finally, the P-type semiconductor grains 631 and the positions to be mounted are aligned in the horizontal direction by the movement of the rotating mechanism 26;

[0132] The above steps are repeated until all the positions to be mounted on the first ceramic substrate 2531 are mounted with semiconductor grains 63 .

[0133] When all the P-type semiconductor grains 631 and N-type semiconductor grains 632 are mounted on the first ceramic substrate 2531, the solder paste 2533 is printed on the positions to be mounted on the second ceramic substrate 2532, and then the positions to be mounted on the second ceramic substrate 2532 are aligned with the P-type semiconductor grains 631 and N-type semiconductor grains 632 on the first ceramic substrate 2531 and adhered together through the solder paste 2533 to obtain a semiconductor refrigeration plate 253. Finally, the semiconductor refrigeration plate 253 is reflowed, and the semiconductor grains 63 are fixedly connected to the first ceramic substrate 2531 and the second ceramic substrate 2532 through the solidification of the solder paste 2533.

[0134] The above-described embodiments are merely descriptions of preferred embodiments of the present invention and are not intended to limit the scope of the present invention. Without departing from the design spirit of the present invention, various modifications and improvements made to the technical solutions of the present invention by ordinary technicians in this field should all fall within the protection scope determined by the claims of the present invention.

Claims

1. A semiconductor die mounting method for an ultra-micro semiconductor refrigeration chip, characterized in that: include: Step 1, preparing a first ceramic substrate and a second ceramic substrate, setting positions to be mounted on the ceramic substrates for placing semiconductor grains to be mounted, and the positions to be mounted on the two ceramic substrates are arranged in the same manner; Step 2: Apply adhesive on the downward side of the transfer film to adhere the semiconductor die to be mounted on the film; Step 3, placing the transfer film on the first ceramic substrate, aligning a certain position to be mounted on the first ceramic substrate with a certain semiconductor grain to be mounted on the transfer film in the vertical direction and in the horizontal direction; Step 4, pushing the film material of the transfer film downward until the aligned semiconductor die to be mounted contacts the solder paste set on the aligned mounting position, so that the transfer film returns to the starting position; Step 5, moving the transfer film and the first ceramic substrate, aligning the next to-be-mounted position of the first ceramic substrate with the next to-be-mounted semiconductor grain on the transfer film in the vertical direction and in the horizontal direction, and then executing step 4; Step 6, repeatedly performing step 5 until all the positions to be mounted on the first ceramic substrate are mounted with semiconductor grains; Step 7, printing solder paste on all the positions to be mounted on the second ceramic substrate and aligning them with the semiconductor grains on the first ceramic substrate, mounting the semiconductor grains on the first ceramic substrate on all the positions to be mounted on the second ceramic substrate to obtain a semiconductor cooling sheet; Step eight, reflow soldering the semiconductor cooling chip.

2. A semiconductor die mounting device for an ultra-micro semiconductor refrigeration chip, used to implement the method as claimed in claim 1, characterized in that: include: A base (1), the base (1) comprising a horizontal bearing platform and two vertical parallel side walls arranged at both ends of the horizontal bearing platform; A substrate moving platform (2) is arranged on the horizontal bearing platform of the base (1), and a semiconductor cooling plate bearing platform (25) is arranged on the top surface of the substrate moving platform. The semiconductor cooling plate bearing platform (25) can move in a horizontal plane along the length direction of the base (1) or the width direction of the base (1) under the drive of the substrate moving platform; A film transfer motion platform (3) disposed between two vertical side walls of the base (1), the film transfer motion platform (3) being located above the substrate motion platform and being movable along the length direction of the base (1); A pushing mechanism motion platform (4) is arranged on the top of the base (1), the pushing mechanism motion platform (4) is located above the film transfer motion platform (3), and a pushing mechanism (43) is arranged on the pushing mechanism motion platform (4), and the pushing mechanism (43) can move in the width direction and vertical direction of the base (1); A first ceramic substrate (2531) is arranged on the semiconductor refrigeration plate carrier platform (25), a mounting position is arranged on the surface of the first ceramic substrate (2531), and solder paste (2533) is arranged in the mounting position; A transfer film (6) is horizontally arranged on the transfer film moving platform (3), and a semiconductor crystal grain (63) is adhered to a side of the transfer film (6) opposite to the substrate moving platform (2); The pushing mechanism (43) can move downward to push the semiconductor crystal grain (63) on the transfer film (6) to move downward to contact the solder paste (2533) in the position to be mounted; when the pushing mechanism (43) moves upward, the transfer film (6) can return to its original position.

3. The semiconductor die mounting device for an ultra-micro semiconductor refrigeration chip according to claim 2, characterized in that: The substrate motion platform (2) comprises: A first workbench (22) disposed on the upper surface of the horizontal bearing platform of the base (1); A first linear motor module (21) is arranged between the horizontal bearing platform of the base (1) and the first workbench (22), wherein the first linear motor module (21) is capable of driving the first workbench (22) to move along the length direction of the base (1); a second workbench (24) disposed on the upper surface of the first workbench (22); a second linear motor module (23) arranged between the first workbench (22) and the second workbench (24), wherein the second linear motor module (23) is capable of driving the second workbench (24) to move along the width direction of the base (1); A rotating mechanism (26) disposed on the upper surface of the second workbench (24); The semiconductor refrigeration plate carrier platform (25) is arranged on the rotating mechanism (26), and the rotating mechanism (26) can control the semiconductor refrigeration plate carrier platform (25) to rotate on a horizontal plane.

4. The semiconductor die mounting device for an ultra-micro semiconductor refrigeration chip according to claim 3, characterized in that: A first stator groove (11) is provided on the top surface of the horizontal bearing platform of the base (1), and the first stator groove (11) is provided along the length direction of the base (1) and is located at the center of the width direction of the base (1); A first slider groove (221) is provided on a side of the first workbench (22) opposite to the horizontal bearing platform of the base (1), and the first slider groove (221) is arranged along the length direction of the base (1); a second stator groove (222) is provided on the top surface of the first workbench (22), and the second stator groove (222) is arranged along the width direction of the base (1), and the second stator groove (222) is located on the center line of the first workbench (22) in the length direction of the base (1); The first linear motor module (21) comprises: a first guide rail (211), a first slider (212), a first linear motor stator (213), and a first linear motor mover (214); the first linear motor stator (213) is installed in the first stator groove (11); two first guide rails (211) are installed on the horizontal bearing platform of the base (1) and are symmetrically arranged on both sides of the first linear motor stator (213); the first linear motor mover (214) is installed on the center line of a side of the first workbench (22) opposite to the horizontal bearing platform of the base (1) along the length direction of the base (1) and is arranged opposite to the first linear motor stator (213); a plurality of first sliders (212) are embedded in the first slider groove (221) and are symmetrically arranged on both sides of the first linear motor mover (214); the first sliders (212) on both sides of the first workbench (22) are embedded on the two first guide rails (211); A second slider groove (241) is provided at the bottom of the second workbench (24), and the second slider groove (241) is arranged along the width direction of the base (1); a circular gear shaft receiving groove (242) and a circular rotating motor receiving groove (243) are provided at the top of the second workbench (24); The second linear motor module (23) comprises: a second guide rail (231), a second slider (232), a second linear motor stator (233), and a second linear motor mover (234); the second linear motor stator (233) is installed in the second stator groove (222); two second guide rails (231) are installed on the top surface of the first workbench (22) and are symmetrically arranged on both sides of the second linear motor stator (233); the second linear motor mover (234) is installed on the bottom center line of the second workbench (24) along the width direction of the base (1) and is arranged opposite to the second linear motor stator (233); a plurality of second sliders (232) are installed in the second slider groove (241) at the bottom of the second workbench (24) and are symmetrically arranged on both sides of the second linear motor mover (234); the second sliders (232) on both sides of the second workbench (24) are embedded in the two second guide rails (231); The rotating mechanism (26) is installed on the top of the second workbench (24), and comprises: a gear shaft (261), a synchronous belt (262), and a rotating motor (263); the gear shaft (261) is installed in the gear shaft receiving groove (242), the rotating motor (263) is installed in the rotating motor receiving groove (243), and the gear shaft (261) and the rotating motor (263) are connected via the synchronous belt (262); The semiconductor refrigeration plate carrier platform (25) is mounted on the gear shaft (261), and the rotating motor (263) drives the gear shaft (261) through the transmission of the synchronous belt (262), thereby driving the semiconductor refrigeration plate carrier platform (25) to rotate in a horizontal plane.

5. The semiconductor die mounting device for an ultra-micro semiconductor refrigeration chip according to claim 2, characterized in that: The film transfer motion platform (3) comprises a third linear motor module (31) and a film transfer bearing platform (32); The transfer film bearing platform (32) is provided with a circular through hole (321); the transfer film (6) is mounted on the lower surface of the transfer film bearing platform (32) and is coaxial with the circular through hole (321); the opening area of ​​the circular through hole (321) can completely contain the arrangement area of ​​the semiconductor grains (63) in the transfer film (6); third slider grooves (322) are provided on both sides of the transfer film bearing platform (32) along the length direction of the base (1); A third stator groove (13) is provided on the inner side of each side wall of the base (1) along the length direction of the base (1); The third linear motor module (31) comprises: a third guide rail (311), a third slider (312), a third linear motor stator (313), and a third linear motor mover (314); two groups of the third linear motor stators (313) are respectively installed in the third stator groove (13); four third guide rails (311) are respectively installed on each side wall of the base (1) in groups of two and are symmetrically arranged on both sides of the third linear motor stator (313); and two third linear motor movers (314) are arranged along the length of the base (1). The third sliders (312) are respectively installed on both sides of the transfer film bearing platform (32) and are respectively arranged opposite to the third linear motor stator (313); a plurality of the third sliders (312) are installed in the third slider grooves (322); and the third sliders (312) on each side of the transfer film bearing platform (32) are respectively arranged symmetrically on both sides of the third linear motor mover (314); the third sliders (312) on both sides of the transfer film bearing platform (32) are respectively embedded in the third guide rails (311) on the corresponding side walls of the base (1).

6. The semiconductor die mounting device for an ultra-micro semiconductor refrigeration chip according to claim 2, characterized in that: The pushing mechanism motion platform (4) comprises: a fourth linear motor module (41), a fourth workbench (42), the pushing mechanism (43), and the crossbeam (44); A crossbeam groove (12) is provided at the top of each side wall of the base (1), and the crossbeam groove (12) is located at the center of the length direction of the base (1); The crossbeam (44) is installed in the crossbeam groove (12), a fourth stator groove (441) is provided on one side of the crossbeam (44) along the length direction of the crossbeam (44), and the fourth stator groove (441) is located on the height center line of the crossbeam (44); The fourth linear motor module (41) comprises: a fourth guide rail (411), a fourth slider (412), a fourth linear motor stator (413), and a fourth linear motor mover (414); the fourth linear motor stator (413) is installed in the fourth stator groove (441), two fourth guide rails (411) are installed on the crossbeam (44) and are symmetrically arranged on both sides of the fourth linear motor stator (413), the fourth linear motor mover (414) is installed on the center line of the fourth workbench (42) along the width direction of the base (1) and is arranged opposite to the fourth linear motor stator (413), a plurality of fourth sliders (412) are installed on the fourth workbench (42) and are symmetrically arranged on both sides of the fourth linear motor mover (414), and the fourth sliders (412) on both sides of the fourth workbench (42) are embedded on the two fourth guide rails (411); The pushing mechanism (43) is installed on the fourth workbench (42), and the pushing mechanism (43) can reciprocate in the vertical direction under external drive.

7. The semiconductor die mounting device for an ultra-micro semiconductor refrigeration chip according to claim 2, characterized in that: The transfer film (6) comprises a film material (61) and a film material support ring (62); The membrane material (61) is a membrane material having elasticity; The film material support ring (62) can tension the film material (61) to make the surface of the film material (61) flat; the downward side of the film material (61) is coated with adhesive, and the semiconductor grains (63) are adhered to the film material (61) by the adhesive.

8. The semiconductor die mounting device for an ultra-micro semiconductor refrigeration chip according to claim 2, characterized in that: An imaging device (5) is arranged on the fourth workbench (42); the imaging device (5) has a driving mechanism so that it can realize reciprocating motion in the vertical direction on the fourth workbench (42).

9. The semiconductor die mounting device for an ultra-micro semiconductor refrigeration chip according to claim 2, characterized in that: It also includes a measuring tool for monitoring the movement displacement of the first linear motor module (21), the second linear motor module (23), the third linear motor module (31) and the fourth linear motor module (41).

10. The semiconductor die mounting device for an ultra-micro semiconductor refrigeration chip according to claim 2, characterized in that: The surface of the semiconductor refrigeration plate carrier platform (25) is provided with a plurality of second vacuum adsorption holes (255); The second vacuum adsorption hole (255) adsorbs and fixes a first ceramic substrate accommodating mold (251), wherein the first ceramic substrate accommodating mold (251) has a plurality of first ceramic substrate accommodating grooves (252); and the first ceramic substrate (2531) can be placed in the first ceramic substrate accommodating grooves (252).

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