Semiconductor chip mounting device and method for ultra-micro semiconductor refrigeration chip

Abstract

The present invention relates to the field of semiconductor refrigeration sheets, and specifically to a semiconductor grain mounting device and method for an ultra-micro semiconductor refrigeration sheet, the method comprising: preparing two ceramic substrates, each provided with the same positions to be mounted; adhering the semiconductor grains to be mounted to the downward surface of a transfer film, placing the transfer film above the first ceramic substrate, aligning the positions to be mounted with the semiconductor grains; pushing the transfer film downward, restoring the position of the transfer film after the semiconductor grains contact the aligned positions to be mounted. Moving the transfer film and the first ceramic substrate, aligning the next position to be mounted with the next semiconductor grain, repeating this step until all positions to be mounted are mounted with semiconductor grains; aligning all positions to be mounted on the second ceramic substrate with the semiconductor grains on the first ceramic substrate, obtaining a semiconductor refrigeration sheet, and then performing reflow soldering. The present invention has higher mounting accuracy and efficiency, meets the Micro TEC process requirements, solves the problem of manufacturing ultra-micro semiconductor refrigeration sheets, and improves efficiency.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor refrigeration chips, and in particular to a semiconductor crystal chip mounting device and method for an ultra-micro semiconductor refrigeration chip. Background Art

[0002] A thermal electric cooler (TEC) is a device based on the Peltier principle, absorbing and releasing heat through a galvanic couple of two different semiconductor materials connected in series. A TEC primarily consists of P-type semiconductor crystals, N-type semiconductor crystals, a ceramic substrate, and a thermally conductive sheet. The P-type and N-type semiconductor crystals are spaced apart and connected by electrodes. They are then sandwiched between the two ceramic substrates using cured solder paste, and the thermally conductive sheet is attached to the front exterior of the ceramic substrates.

[0003] Ultra-micro semiconductor refrigeration chips (Micro TECs) are the optimal solution for precise temperature control of optical components in 5G and high-end optical communications. Micro TECs typically have a die size less than 0.35mm, a height less than 0.4mm, and an overall size no larger than 3mm x 3mm. Compared to conventional semiconductor refrigeration chips, Micro TECs are smaller in size and can operate reliably and long-term in extremely small spaces and harsh environmental conditions. Therefore, Micro TECs are of great significance to the development of semiconductor refrigeration technology.

[0004] At present, there are two main manufacturing processes for semiconductor refrigerators: one is to use a semiconductor crystal screening mold with holes, manually knock or mechanically vibrate to make the semiconductor crystals fall into the mold holes one by one, then place the ceramic plate on the mold, and then flip the mold to make the semiconductor crystals fall on the ceramic substrate; the other is to use an SMT placement machine to suck up the semiconductor crystals through vacuum adsorption of a nozzle and place them on the ceramic substrate of the semiconductor refrigerator.

[0005] However, both methods present challenges. While using die screening molds improves production efficiency to a certain extent, it lacks guaranteed accuracy and cannot meet Micro TEC's process requirements. While using an SMT placement machine to vacuum-absorb semiconductor die and attach them to a ceramic substrate can mitigate the inefficiency and low precision of manual production, the placement efficiency remains low due to the long arm required to move the nozzle back and forth between the semiconductor die storage platform and the ceramic substrate. Summary of the Invention

[0006] In order to solve the above problems, the present invention provides a semiconductor die mounting device and method for an ultra-micro semiconductor refrigeration chip.

[0007] A semiconductor die mounting method for an ultra-micro semiconductor refrigeration chip includes:

[0008] Step 1: prepare a first ceramic substrate and a second ceramic substrate, set mounting positions on the ceramic substrates for placing semiconductor dies to be mounted, and the mounting positions on the two ceramic substrates are arranged in the same manner;

[0009] Step 2: Apply adhesive to the downward side of the transfer film to adhere the semiconductor die to be mounted on the film;

[0010] Step 3: Place the transfer film on the first ceramic substrate so that a certain position to be mounted on the first ceramic substrate is aligned with a certain semiconductor die to be mounted on the transfer film in the vertical direction and in the horizontal direction;

[0011] Step 4: Push the transfer film downward until the aligned semiconductor die to be mounted contacts the solder paste on the aligned mounting position, and return the transfer film to its starting position.

[0012] Step 5: Move the transfer film and the first ceramic substrate so that the next placement position on the first ceramic substrate is aligned with the next semiconductor die on the transfer film in the vertical direction and in the horizontal direction, and then execute step 4;

[0013] Step 6, repeatedly performing step 5 until all the positions to be mounted on the first ceramic substrate are mounted with semiconductor dies;

[0014] Step 7: Print solder paste on all the positions to be mounted on the second ceramic substrate and align them with the semiconductor crystal grains on the first ceramic substrate, and mount the semiconductor crystal grains on the first ceramic substrate on all the positions to be mounted on the second ceramic substrate to obtain semiconductor cooling sheets;

[0015] Step eight, reflow soldering the semiconductor refrigeration chip.

[0016] A semiconductor die mounting device for an ultra-micro semiconductor refrigeration chip is used to implement the semiconductor die mounting method for the ultra-micro semiconductor refrigeration chip, comprising:

[0017] A base, comprising a horizontal bearing platform and two vertically parallel side walls arranged at both ends of the horizontal bearing platform;

[0018] A substrate motion platform is provided on the horizontal bearing platform of the base, and a semiconductor refrigeration plate bearing platform is provided on the top surface of the substrate motion platform. The semiconductor refrigeration plate bearing platform can move in the horizontal plane along the length direction or the width direction of the base under the drive of the substrate motion platform;

[0019] A film transfer motion platform is provided between two vertical side walls of the base, the film transfer motion platform is located above the substrate motion platform and can move along the length direction of the base;

[0020] A pushing mechanism motion platform is provided on the top of the base. The pushing mechanism motion platform is located above the film transfer motion platform. The pushing mechanism motion platform is provided with a pushing mechanism. The pushing mechanism can move in the width direction and the vertical direction of the base.

[0021] A first ceramic substrate is arranged on the semiconductor refrigeration plate supporting platform, a waiting position is arranged on the surface of the first ceramic substrate, and solder paste is arranged in the waiting position;

[0022] A transfer film is horizontally arranged on the transfer film moving platform, and a semiconductor crystal grain is adhered to a side of the transfer film opposite to the substrate moving platform;

[0023] The pushing mechanism can move downward to push the semiconductor crystal grains on the transfer film downward to contact the solder paste in the position to be mounted. When the pushing mechanism moves upward, the transfer film can return to its original position.

[0024] Furthermore, the substrate motion platform includes:

[0025] A first workbench provided on the upper surface of the horizontal bearing platform of the base;

[0026] A first linear motor module is provided between the horizontal bearing platform of the base and the first workbench, and the first linear motor module is capable of driving the first workbench to move along the length direction of the base;

[0027] a second workbench disposed on the upper surface of the first workbench;

[0028] a second linear motor module disposed between the first workbench and the second workbench, the second linear motor module being capable of driving the second workbench to move along a width direction of the base;

[0029] A rotating mechanism provided on the upper surface of the second workbench;

[0030] The semiconductor refrigeration plate supporting platform is arranged on the rotating mechanism, and the rotating mechanism can control the semiconductor refrigeration plate supporting platform to rotate in a horizontal plane.

[0031] Furthermore, a first stator groove is formed on the top surface of the horizontal bearing platform of the base, and the first stator groove is formed along the length direction of the base and is located at the center of the width direction of the base;

[0032] A first slider groove is formed on a side of the first workbench opposite to the horizontal bearing platform of the base, and the first slider groove is arranged along the length direction of the base; a second stator groove is formed on the top surface of the first workbench, and the second stator groove is arranged along the width direction of the base, and the second stator groove is located on the center line of the first workbench in the length direction of the base;

[0033] The first linear motor module includes: a first guide rail, a first slider, a first linear motor stator, and a first linear motor mover; the first linear motor stator is installed in the first stator groove, the two first guide rails are installed on the horizontal bearing platform of the base and are symmetrically arranged on both sides of the first linear motor stator, the first linear motor mover is installed along the length direction of the base on the center line of the side of the first workbench opposite to the horizontal bearing platform of the base and is arranged opposite to the first linear motor stator, a plurality of first sliders are embedded in the first slider grooves and are symmetrically arranged on both sides of the first linear motor mover, and the first sliders on both sides of the first workbench are embedded on the two first guide rails;

[0034] A second slider groove is provided at the bottom of the second workbench and is arranged along the width direction of the base; a circular gear shaft receiving groove and a circular rotating motor receiving groove are provided at the top of the second workbench;

[0035] The second linear motor module includes: a second guide rail, a second slider, a second linear motor stator, and a second linear motor mover; the second linear motor stator is installed in the second stator groove, the two second guide rails are installed on the top surface of the first workbench and are symmetrically arranged on both sides of the second linear motor stator, the second linear motor mover is installed on the center line of the bottom of the second workbench along the width direction of the base and is arranged opposite to the second linear motor stator, a plurality of second sliders are installed in the second slider groove at the bottom of the second workbench and are symmetrically arranged on both sides of the second linear motor mover, and the second sliders on both sides of the second workbench are embedded in the two second guide rails;

[0036] The rotating mechanism is installed on the top of the second workbench, and includes: a gear shaft, a synchronous belt, and a rotating motor; the gear shaft is installed in the gear shaft receiving groove, the rotating motor is installed in the rotating motor receiving groove, and the gear shaft and the rotating motor are connected by a synchronous belt;

[0037] The semiconductor refrigeration plate carrier is installed on the gear shaft. The rotating motor rotates the gear shaft through the transmission of the synchronous belt, thereby driving the semiconductor refrigeration plate carrier to rotate in the horizontal plane.

[0038] Furthermore, the transfer film motion platform includes a third linear motor module and a transfer film bearing platform;

[0039] The transfer film carrying platform is provided with a circular through hole. The transfer film is mounted on the lower surface of the transfer film carrying platform and is coaxial with the circular through hole. The opening area of ​​the circular through hole can completely contain the arrangement area of ​​the semiconductor grains in the transfer film. Third slider grooves are provided on both sides of the transfer film carrying platform along the length direction of the base.

[0040] A third stator groove is provided on the inner side of each side wall of the base along the length direction of the base;

[0041] The third linear motor module includes: a third guide rail, a third slider, a third linear motor stator, and a third linear motor mover; two groups of third linear motor stators are respectively installed in the third stator groove, four third guide rails are respectively installed in groups of two on each side wall of the base and are symmetrically arranged on both sides of the third linear motor stator, two third linear motor movers are respectively installed on both sides of the transfer film bearing platform along the length direction of the base and are respectively arranged opposite to the third linear motor stator, several third sliders are installed in the third slider groove, and the third sliders on each side of the transfer film bearing platform are respectively arranged symmetrically on both sides of the third linear motor mover, and the third sliders on both sides of the transfer film bearing platform are respectively embedded in the third guide rails on the corresponding side walls of the base.

[0042] Furthermore, the push mechanism motion platform includes: a fourth linear motor module, a fourth workbench, a push mechanism, and a crossbeam;

[0043] A crossbeam groove is provided on the top of each side wall of the base, and the crossbeam groove is located at the center of the length direction of the base;

[0044] The crossbeam is installed in the crossbeam groove, and a fourth stator groove is opened on one side of the crossbeam along the length direction of the crossbeam, and the fourth stator groove is located on the height center line of the crossbeam;

[0045] The fourth linear motor module includes: a fourth guide rail, a fourth slider, a fourth linear motor stator, and a fourth linear motor mover; the fourth linear motor stator is installed in the fourth stator groove, the two fourth guide rails are installed on the crossbeam and are symmetrically arranged on both sides of the fourth linear motor stator, the fourth linear motor mover is installed on the center line of the fourth workbench along the width direction of the base and is arranged opposite to the fourth linear motor stator, a plurality of fourth sliders are installed on the fourth workbench and are symmetrically arranged on both sides of the fourth linear motor mover, and the fourth sliders on both sides of the fourth workbench are embedded on the two fourth guide rails;

[0046] The pushing mechanism is installed on the fourth workbench, and the pushing mechanism can reciprocate in the vertical direction under external drive.

[0047] Furthermore, the transfer film includes a film material and a film material support ring;

[0048] The membrane material is an elastic membrane material;

[0049] The membrane support ring can tension the membrane to make the surface of the membrane flat; the downward side of the membrane is coated with adhesive, and the semiconductor grains are adhered to the membrane through the adhesive.

[0050] Furthermore, an imaging device is provided on the fourth workbench; the imaging device has a driving mechanism so that it can realize reciprocating motion in the vertical direction on the fourth workbench.

[0051] Furthermore, it also includes a measuring tool for monitoring the motion displacement of the first linear motor module, the second linear motor module, the third linear motor module and the fourth linear motor module.

[0052] Furthermore, a plurality of second vacuum adsorption holes are provided on the surface of the semiconductor refrigeration plate supporting platform;

[0053] The first ceramic substrate accommodating mold is adsorbed and fixed on the second vacuum adsorption hole. The first ceramic substrate accommodating mold has a plurality of first ceramic substrate accommodating grooves. The first ceramic substrate can be placed in the first ceramic substrate accommodating grooves.

[0054] One or more technical solutions provided in the embodiments of this application have at least the following technical effects or advantages:

[0055] The push-pushing technology employed in this application directly positions the push-pushing mechanism, semiconductor die, and semiconductor cooling plate ceramic substrate relative to each other, significantly reducing the distance the semiconductor die must travel during placement. This arrangement not only significantly improves the placement efficiency of semiconductor die within the ultra-micro semiconductor cooling plate, but also meets high placement precision requirements, effectively preventing uneven placement, tilting, cracking, and damage to the semiconductor die.

[0056] Compared to the previously mentioned die screening mold method, the push-up technique offers greater precision and can meet the process requirements of Micro TEC, resolving the issue of die screening molds being unable to meet the manufacturing requirements for ultra-micro semiconductor cooling chips. Compared to the vacuum adsorption method used in SMT placement machines, the push-up technique offers greater efficiency, significantly reducing the distance the swing arm must travel between the semiconductor die storage platform and the ceramic substrate. This improves production efficiency and addresses the low placement efficiency of SMT placement machines' vacuum adsorption method. BRIEF DESCRIPTION OF THE DRAWINGS

[0057] Figure 1 A structural diagram of a semiconductor die mounting device for an ultra-micro semiconductor refrigeration chip provided by an embodiment of the present invention;

[0058] Figure 2 A diagram of the base structure provided in an embodiment of the present invention;

[0059] Figure 3 A structural diagram of a substrate motion platform provided in an embodiment of the present invention;

[0060] Figure 4 A structural diagram of a first workbench provided in an embodiment of the present invention;

[0061] Figure 5 A structural diagram of a second workbench provided in an embodiment of the present invention;

[0062] Figure 6A structural diagram of a semiconductor refrigeration plate carrier provided in an embodiment of the present invention;

[0063] Figure 7 A structural diagram of a first ceramic substrate accommodating mold provided in an embodiment of the present invention;

[0064] Figure 8 A structural diagram of a film transfer motion platform provided in an embodiment of the present invention;

[0065] Figure 9 A structural diagram of a motion platform of a pushing mechanism provided in an embodiment of the present invention;

[0066] Figure 10 A diagram of a beam structure provided by an embodiment of the present invention;

[0067] Figure 11 A schematic plan view of a transfer film provided in an embodiment of the present invention;

[0068] Figure 12 A three-dimensional schematic diagram of a transfer film provided in an embodiment of the present invention;

[0069] Figure 13 A schematic diagram of the process of attaching a semiconductor die to a first ceramic substrate according to an embodiment of the present invention;

[0070] Figure 14 A schematic diagram of a first mounting process flow for a P-type semiconductor die provided by an embodiment of the present invention;

[0071] Figure 15 A schematic diagram of a second mounting process flow for P-type semiconductor dies provided by an embodiment of the present invention;

[0072] Figure 16 A schematic diagram of a first mounting process flow for N-type semiconductor die provided by an embodiment of the present invention;

[0073] Figure 17 A schematic diagram of a second mounting process flow for N-type semiconductor die provided by an embodiment of the present invention;

[0074] Figure 18 A schematic structural diagram of a first ceramic substrate with semiconductor crystal grains mounted thereon provided in an embodiment of the present invention;

[0075] Figure 19 A schematic structural diagram of a semiconductor refrigeration plate provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0076] The present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments. Before describing in detail the technical solutions of each embodiment of the present invention, the nouns and terms involved are explained. In this specification, components with the same name or the same number represent similar or identical structures and are for illustrative purposes only.

[0077] The structure of the semiconductor die mounting device for the ultra-micro semiconductor refrigeration chip proposed by the present invention is as follows: Figure 1 As shown, it includes: a base 1, a substrate motion platform 2, a film transfer motion platform 3, a push mechanism motion platform 4, and an imaging device 5.

[0078] 1. Base

[0079] like Figure 2 As shown, base 1 has a horizontal support platform and two vertical side walls. The side walls support the film transfer platform 3 and the push mechanism platform 4, while the horizontal support platform of base 1 supports the substrate platform 2. Base 1 is made of granite or other materials with low vibration amplitude and high stability. Base 1 can be integrally formed or designed with the horizontal support platform and two side walls as separate components.

[0080] The top surface of the horizontal support platform of the base 1 defines a first stator slot 11, extending along the length of the base 1 and located at the center of its width. A crossbeam slot 12 is defined at the top of each sidewall of the base 1 and located at the center of its length. A third stator slot 13 is defined along the inner side of each sidewall of the base 1, extending along its length.

[0081] 2. Substrate motion platform

[0082] like Figure 3 As shown, the substrate motion platform 2 includes a first linear motor module 21, a first worktable 22, a second linear motor module 23, a second worktable 24, a semiconductor cooling plate support platform 25, and a rotation mechanism 26. Through the movement of the first linear motor module 21, the second linear motor module 23, and the rotation mechanism 26, the semiconductor cooling plate support platform 25 can achieve two-dimensional motion in the horizontal plane and rotation at a certain angle.

[0083] like Figure 4 As shown, the first workbench 22 has a first slider groove 221 defined on a surface opposite the horizontal support platform of the base 1. The first slider groove 221 is arranged along the length of the base 1. A second stator groove 222 is defined on the top surface of the first workbench 22. The second stator groove 222 is arranged along the width of the base 1 and is located on the centerline of the first workbench 22 along the length of the base 1.

[0084] like Figure 3As shown, the first linear motor module 21 includes: a first guide rail 211, a first slider 212, a first linear motor stator 213, a first linear motor mover 214, and a first limit buffer mechanism 215. The first linear motor stator 213 is installed in the first stator groove 11, and the two first guide rails 211 are installed on the horizontal bearing platform of the base 1 and are symmetrically arranged on both sides of the first linear motor stator 213. The first linear motor mover 214 is installed on the center line of the side of the first workbench 22 opposite to the horizontal bearing platform of the base 1 along the length direction of the base 1 and is arranged opposite to the first linear motor stator 213. A plurality of first sliders 212 are embedded in the first slider groove 221 and are symmetrically arranged on both sides of the first linear motor mover 214. The sliders 212 on both sides of the first workbench 22 are embedded on the two first guide rails 211, so that the first workbench 22 can achieve reciprocating motion in the length direction of the base 1 under the drive of the first linear motor module 21. A first position limiting buffer mechanism 215 is provided at the end of each first guide rail 211. The first position limiting buffer mechanism 215 is installed on the side of the base 1. When the first workbench 22 moves close to the end of the first guide rail 211, the first position limiting buffer mechanism 215 is used to provide a buffering braking force to the first workbench 22 and prevent the first workbench 22 from sliding out of the first guide rail 211.

[0085] like Figure 3 and Figure 5 As shown, the second workbench 24 is disposed above the first workbench 22. A second slider groove 241 is defined at the bottom of the second workbench 24 and extends along the width of the base 1. A gear shaft receiving groove 242 and a rotary motor receiving groove 243 are defined at the top of the second workbench 24. Both the gear shaft receiving groove 242 and the rotary motor receiving groove 243 are circular, with the gear shaft receiving groove 242 located in the center of the top of the second workbench 24.

[0086] The second linear motor module 23 includes: a second guide rail 231, a second slider 232, a second linear motor stator 233, a second linear motor mover 234, and a second limit buffer mechanism 235. The second linear motor stator 233 is mounted in the second stator groove 222 on the top surface of the first workbench 22. Two second guide rails 231 are mounted on the top surface of the first workbench 22 and are symmetrically arranged on both sides of the second linear motor stator 233. The second linear motor mover 234 is mounted on the center line of the bottom of the second workbench 24 along the width direction of the base 1 and is arranged opposite to the second linear motor stator 233. Multiple second sliders 232 are mounted in the second slider groove 241 at the bottom of the second workbench 24 and are symmetrically arranged on both sides of the second linear motor mover 234. The second sliders 232 on both sides of the second workbench 24 are embedded in the two second guide rails 231, so that the second workbench 24 can achieve reciprocating motion in the width direction of the base 1 under the drive of the second linear motor module 23. A second position limiting buffer mechanism 235 is provided at the end of each second guide rail 231. The second position limiting buffer mechanism 235 is installed on the side of the first workbench 22. When the second workbench 24 moves close to the end of the second guide rail 231, the second position limiting buffer mechanism 235 is used to provide a buffering braking force to the second workbench 24 and prevent the second workbench 24 from sliding out of the second guide rail 231.

[0087] like Figure 3 As shown, the rotating mechanism 26 is mounted on top of the second workbench 24 and includes a gear shaft 261, a synchronous belt 262, and a rotating motor 263. The gear shaft 261 is mounted within the gear shaft receiving slot 242 at the top of the second workbench 24. The rotating motor 263 is mounted within the rotating motor receiving slot 243 at the top of the second workbench 24. The gear shaft 261 and the rotating motor 263 are connected via the synchronous belt 262. The semiconductor cooling plate support platform 25 is mounted on the gear shaft 261. The rotating motor 263 rotates the gear shaft 261 via the synchronous belt 262, thereby driving the semiconductor cooling plate support platform 25 to rotate.

[0088] like Figure 6 and Figure 7 As shown, the semiconductor cooling chip support platform 25 is used to place the first ceramic substrate receiving mold 251. The surface of the semiconductor cooling chip support platform 25 has multiple second vacuum suction holes 255 for sucking and fixing the first ceramic substrate receiving mold 251. The first ceramic substrate receiving mold 251 has multiple first ceramic substrate receiving grooves 252, and the semiconductor cooling chip 253 is placed in the first ceramic substrate receiving grooves 252.

[0089] Semiconductor refrigeration sheet 253 Figure 18 and Figure 19As shown, the semiconductor cooling plate 253 includes a first ceramic substrate 2531, a second ceramic substrate 2532, and solder paste 2533. The first ceramic substrate 2531 and the second ceramic substrate 2532 each have multiple mounting locations, on which solder paste 2533 is printed. The semiconductor dies to be mounted are adhered to the mounting locations of the first ceramic substrate 2531 and the second ceramic substrate 2532 through the solder paste 2533.

[0090] Each first ceramic substrate receiving groove 252 has a first vacuum adsorption hole 254 at the bottom thereof for adsorbing and fixing the first ceramic substrate 2531 .

[0091] 3. Film transfer platform

[0092] like Figure 8 As shown, the film transfer motion platform 3 includes: a third linear motor module 31 and a film transfer carrying platform 32 .

[0093] The transfer film support platform 32 has a circular through-hole 321. The transfer film 6 is removably mounted on its lower surface, coaxially with the circular through-hole 321. The opening area of ​​the circular through-hole 321 completely encompasses the area where the semiconductor die are placed in the transfer film 6. Third slider grooves 322 are defined on both sides of the transfer film support platform 32 along the length of the base 1.

[0094] The third linear motor module 31 includes a third guide rail 311 , a third slider 312 , a third linear motor stator 313 , a third linear motor mover 314 , and a third position-limiting buffer mechanism 315 . Two groups of third linear motor stators 313 are respectively installed in the third stator grooves 13 on the two side walls of the base 1, and four third guide rails 311 are respectively installed on each side wall of the base 1 in groups of two and are symmetrically arranged on both sides of the third linear motor stator 313. Two third linear motor movers 314 are respectively installed on both sides of the transfer film carrying platform 32 along the length direction of the base 1 and are respectively arranged opposite to the third linear motor stator 313. Multiple third sliders 312 are installed in the third slider grooves 322 on both sides of the transfer film carrying platform 32, and the third sliders 312 on each side of the transfer film carrying platform 32 are respectively arranged symmetrically on both sides of the third linear motor mover 314. The third sliders 312 on both sides of the transfer film carrying platform 32 are respectively embedded in the third guide rails 311 on the corresponding side walls of the base 1, so that the transfer film carrying platform 32 can realize reciprocating motion in the length direction of the base 1 under the drive of the third linear motor module 31. A third position-limiting buffer mechanism 315 is provided at the end of each third guide rail 311. The third position-limiting buffer mechanism 315 is installed on the side of the base 1. When the transfer film carrying platform 32 moves close to the end of the third guide rail 311, the third position-limiting buffer mechanism 315 is used to provide a buffering braking force to the transfer film carrying platform 32 and prevent the transfer film carrying platform 32 from sliding out of the third guide rail 311.

[0095] 4. Push mechanism motion platform

[0096] like Figure 9 As shown, the pushing mechanism motion platform 4 includes: a fourth linear motor module 41 , a fourth workbench 42 , a pushing mechanism 43 , and a crossbeam 44 .

[0097] like Figure 10 As shown, the crossbeam 44 spans the two side walls of the base 1 and is installed in the crossbeam groove 12. A fourth stator groove 441 is opened on one side of the crossbeam 44 along the length direction of the crossbeam, and the fourth stator groove 441 is located on the height center line of the crossbeam 44.

[0098] The fourth linear motor module 41 includes: a fourth guide rail 411, a fourth slider 412, a fourth linear motor stator 413, a fourth linear motor mover 414, and a fourth limit buffer mechanism 415. The fourth linear motor stator 413 is installed in a fourth stator groove 441 on the side of the beam. Two fourth guide rails 411 are installed on the beam 44 and are symmetrically arranged on both sides of the fourth linear motor stator 413. The fourth linear motor mover 414 is installed on the center line of the fourth worktable 42 along the width direction of the base 1 and is arranged opposite to the fourth linear motor stator 413. Multiple fourth sliders 412 are installed on the fourth worktable 42 and are symmetrically arranged on both sides of the fourth linear motor mover 414. The fourth sliders 412 on both sides of the fourth worktable 42 are embedded in the two fourth guide rails 411, so that the fourth worktable 42 can achieve reciprocating motion in the width direction of the base 1 under the drive of the fourth linear motor module 41. A fourth position limiting buffer mechanism 415 is provided at the end of each fourth guide rail 411. The fourth position limiting buffer mechanism 415 is installed on the side of the crossbeam 44. When the fourth workbench 42 moves close to the end of the fourth guide rail 411, the fourth position limiting buffer mechanism 415 is used to provide a buffering braking force to the fourth workbench 42 and prevent the fourth workbench 42 from sliding out of the fourth guide rail 411.

[0099] The push mechanism 43 is mounted on the fourth workbench 42 and is driven by a motor or cylinder to achieve reciprocating motion in the vertical direction. Driven by the fourth linear motor module 41 and the push mechanism 43 itself, the push mechanism 43 can achieve two-dimensional motion within a vertical plane perpendicular to the length of the base 1.

[0100] The motion displacement of the first linear motor module 21, the second linear motor module 23, the third linear motor module 31, and the fourth linear motor module 41 is monitored by installing a grating scale in a direction parallel to the first guide rail 211, the second guide rail 231, the third guide rail 311, and the fourth guide rail 411, and installing a reading head on the first workbench 22, the second workbench 24, the transfer film support platform 32, and the fourth workbench 42 relative to the grating scale. Alternatively, a laser displacement sensor, a capacitive sensor, or other measuring tool may be used to monitor the motion displacement of the first linear motor module 21, the second linear motor module 23, the third linear motor module 31, and the fourth linear motor module 41. Using a measuring tool to monitor motion displacement is common knowledge in the art, and the present invention does not elaborate on how to set up the measuring tool.

[0101] 5. Other device modules

[0102] like Figure 11 、 Figure 12 As shown, the transfer film 6 includes a film material 61, a film material support ring 62, and multiple semiconductor grains 63 adhesively attached to the film material 61. The film material 61 can be, but is not limited to, an elastic film material such as a blue film or a UV film. The film material support ring 62 is used to tension the film material 61 to ensure a smooth surface. One side of the film material 61 is coated with adhesive to adhere the multiple semiconductor grains 63 to the film material 61. The multiple semiconductor grains 63 are arranged in a matrix on the transfer film 6 at equal spacing. The spacing between the multiple semiconductor grains 63 can be adjusted by a wafer expander according to actual production needs. The transfer film 6 is arranged horizontally above the first ceramic substrate 2531 and is spaced a certain distance apart from the first ceramic substrate 2531. The spacing between the transfer film 6 and the first ceramic substrate 2531 refers to the distance between the lower surface of the semiconductor grain 63 and the upper surface of the first ceramic substrate 2531. It should be no less than the sum of the thickness of the semiconductor grain 63 and the thickness of the solder paste 2533. This prevents the pushing mechanism from pushing a semiconductor grain 63 to the first ceramic substrate 2531 to be mounted and adhering to the solder paste 2533. This could cause interference and adhesion between adjacent semiconductor grains 63 and the solder paste 2533, thus affecting subsequent mounting operations. The pushing mechanism 43 is located above the transfer film 6 and is spaced a certain distance apart from the transfer film 6. The spacing between the pushing mechanism 43 and the transfer film 6 refers to the distance between the lower surface of the pushing mechanism 43's end and the upper surface of the film material 61. It can be set to no less than 0.05 mm to prevent the end of the pushing mechanism 43 from interfering with the film material 61 and scratching the film material 61 when the pushing mechanism 43 and the transfer film motion platform 3 move horizontally.

[0103] The imaging device 5 is installed on the fourth workbench 42 and arranged parallel to the pushing mechanism 43. The imaging device 5 has a driving mechanism that can realize reciprocating motion in the vertical direction on the fourth workbench 42. The imaging device 5 captures the semiconductor grains 63 on the transfer film 6 and the positions to be mounted on the first ceramic substrate 2531 to generate two-dimensional coordinate data of the semiconductor grains 63 and the positions to be mounted in the horizontal plane.

[0104] 6. Semiconductor die mounting method

[0105] The method for performing semiconductor die placement using the semiconductor die placement device of the ultra-micro semiconductor refrigeration sheet provided by the present invention specifically includes:

[0106] Step 1: Before semiconductor die placement, the transfer film motion platform 3, the push mechanism motion platform 4, and the driving mechanism of the imaging device 5 are combined to allow the imaging device 5 to capture images of all semiconductor die 63 on the transfer film 6 and establish two-dimensional coordinate data for each semiconductor die 63.

[0107] Step 2: Through the combined movement of the substrate motion platform 2, the push mechanism motion platform 4, and the driving mechanism of the imaging device 5, the imaging device 5 captures the positions to be mounted of the first ceramic substrate 2531 on the semiconductor refrigeration plate carrier 25, and establishes two-dimensional coordinate data of each position to be mounted;

[0108] Step 3: Through the combined movement of the substrate motion platform 2, the transfer film motion platform 3, and the push mechanism motion platform 4, the push mechanism 43 is vertically aligned with a semiconductor die 63 on the transfer film 6 and a corresponding location to be mounted on the first ceramic substrate 2531. Furthermore, the location to be mounted on the first ceramic substrate 2531 is horizontally aligned with the corresponding semiconductor die 63 on the transfer film 6.

[0109] In step 4, the pushing mechanism 43 moves in the vertical direction to push the semiconductor die 63 away from the transfer film 6 and finally fixes the semiconductor die 63 on the corresponding position to be mounted on the first ceramic substrate 2531 .

[0110] The specific process of step 4 is as follows Figure 13As shown, during the placement operation of the semiconductor die 63, the pushing mechanism 43 pushes the film material 61 of the carrier film 6, driving the semiconductor die 63 to move downward in the vertical direction and slightly pushing the semiconductor die 63 away from the film material 61, thereby reducing the adhesion area between the semiconductor die 63 and the film material 61. The pushing mechanism 43 continues to push the film material 61 until the semiconductor die 63 contacts the solder paste 2533 at the location to be placed on the first ceramic substrate 2531. Then, the pushing mechanism 43 returns to the starting position. Because the adhesion force between the solder paste 2533 and the semiconductor die 63 is greater than the adhesion force between the film material 61 and the semiconductor die 63, during the process of the pushing mechanism 43 returning to the starting position, the film material 61 returns to its original position due to the elastic restoring force, and the semiconductor die 63 separates from the film material 61 and remains at the location to be placed on the first ceramic substrate 2533.

[0111] like Figure 14 、 Figure 15 、 Figure 16 and Figure 17 As shown, semiconductor die 63 are mounted on first ceramic substrate 2531 in a P-type-N-P-N or N-type-P-N-P arrangement, where the ratio of P-type semiconductor die 631 to N-type semiconductor die 632 is 1:1. The method for mounting semiconductor die 63 in the P-type-N-P-N arrangement will now be described. The method for mounting semiconductor die 63 in the N-type-P-N-P arrangement follows the same principles as the P-type-N-P-N arrangement, and will not be further described here.

[0112] The following describes in detail the method for placing semiconductor chips using the semiconductor chip placement device for the ultra-micro semiconductor refrigeration chip provided by the present invention in conjunction with two embodiments.

[0113] 6.1 Place semiconductor chips sequentially along the length of the base

[0114] The process flow of mounting the P-type semiconductor crystal grain 631 on the first ceramic substrate 2531 along the length direction of the base is as follows: Figure 14 As shown, the process flow of mounting the N-type semiconductor grain 632 on the first ceramic substrate 2531 along the length direction of the base is as follows: Figure 16 shown.

[0115] Here, the mounting process of the P-type semiconductor die 631 on the first ceramic substrate 2531 is taken as an example, which specifically includes:

[0116] Using the imaging device 5 to photograph the semiconductor die 63 and the position to be mounted on the first ceramic substrate 2531 and to establish two-dimensional coordinate data of the semiconductor die 63 and the position to be mounted in a horizontal plane;

[0117] The pushing mechanism 43 is fixed at a certain position in the width direction of the crossbeam 44. Through the movement of the transfer film motion platform 3, the substrate motion platform 2, and the rotating mechanism 26, a certain P-type semiconductor crystal grain 631 on the transfer film 6 and a certain position to be mounted on the first ceramic substrate 2531 are aligned with the pushing mechanism 43 in the vertical direction, and the angle of the P-type semiconductor crystal grain 631 and the position to be mounted are aligned in the horizontal direction.

[0118] The pushing mechanism 43 moves in the vertical direction, pushing the P-type semiconductor crystal grain 631 from the transfer film 6 to the waiting mounting position of the first ceramic substrate 2531 and fixing it at the waiting mounting position.

[0119] Define L1 as twice the distance between the centers of two adjacent locations to be mounted on the first ceramic substrate 2531 along the length of the base 1, and define L2 as the distance between the centers of adjacent P-type semiconductor grains 631 on the transfer film 6 along the length of the base 1. The substrate motion platform 2 moves the first ceramic substrate 2531 along the length of the base 1 toward the location to be mounted by a distance L1, and the transfer film motion platform 3 moves along the length of the base 1 toward the location to be mounted by a distance L2, so as to vertically align the next P-type semiconductor grain 631 with the next location to be mounted on the first ceramic substrate 2531 and the push mechanism 43. Simultaneously, the movement of the rotation mechanism 26 aligns the P-type semiconductor grain 631 with the location to be mounted horizontally.

[0120] The push mechanism 43 moves vertically, pushing the P-type semiconductor die 631 from the transfer film 6 to the mounting position of the first ceramic substrate 2531 and securing it there. In the above process flow, the P-type semiconductor die 631 are mounted one by one along the length of the base 1 onto the first ceramic substrate 2531.

[0121] When all the P-type semiconductor dies 631 in a row on the transfer film 6 have been mounted on the first ceramic substrate 2531, the push mechanism motion platform 4 and the substrate motion platform 2 are moved along the width direction of the base 1 to align with the next row of P-type semiconductor dies 631. Alternatively, when all the positions to be mounted in a row on the first ceramic substrate 2531 are mounted with P-type semiconductor dies 631, the substrate motion platform 2 is moved along the width direction of the base 1 to align the positions to be mounted in the next row on the first ceramic substrate 2531 with the P-type semiconductor dies 631 on the transfer film 6. Finally, the rotation mechanism 26 is moved to align the P-type semiconductor dies 631 and the positions to be mounted in the horizontal direction.

[0122] The above steps are repeated until all the positions to be mounted on the first ceramic substrate 2531 are mounted with semiconductor dies 63 .

[0123] 6.2 Place semiconductor chips sequentially along the width of the base

[0124] The mounting process of the P-type semiconductor crystal grain 631 on the first ceramic substrate 2531 along the width direction of the base 1 is as follows: Figure 15 As shown, the process flow of mounting the N-type semiconductor crystal grain 632 on the first ceramic substrate 2531 along the width direction of the base 1 is as follows: Figure 17 shown.

[0125] Here, the mounting process of the P-type semiconductor die 631 on the first ceramic substrate 2531 is taken as an example, which specifically includes:

[0126] Using the imaging device 5 to photograph the semiconductor die 63 and the position to be mounted on the first ceramic substrate 2531 and to establish two-dimensional coordinate data of the semiconductor die 63 and the position to be mounted in a horizontal plane;

[0127] The transfer film motion platform 3 is moved in the longitudinal direction of the base 1 to a position below the crossbeam and fixed thereto. Through the movement of the push mechanism motion platform 4, the substrate motion platform 2, and the rotation mechanism 26, a P-type semiconductor crystal grain 631 on the transfer film 6 and a position to be mounted on the first ceramic substrate 2531 are aligned with the push mechanism 43 in the vertical direction, and the angle between the P-type semiconductor crystal grain 631 and the position to be mounted is also aligned in the horizontal direction.

[0128] The pushing mechanism 43 moves in the vertical direction, pushing the P-type semiconductor grain 631 from the transfer film 6 to the waiting mounting position of the first ceramic substrate 2531 and fixing it at the waiting mounting position;

[0129] The spacing between the centers of two adjacent P-type semiconductor grains 631 on the transfer film 6 along the width of the base 1 is defined as L3, and the spacing between the center of the next position to be mounted on the first ceramic substrate 2531 and the center of the next P-type semiconductor grain 631 to be mounted on the transfer film 6 is defined as L4. The substrate motion platform 2 drives the first ceramic substrate 2531 to move a distance L4 along the width of the base 1 in the direction to be mounted, and the push mechanism motion platform 4 moves a distance L3 along the width of the base 1 in the direction opposite to the direction to be mounted, so as to vertically align the push mechanism 43 and the next position to be mounted on the first ceramic substrate 2531 with the next P-type semiconductor grain 631. Simultaneously, the movement of the rotation mechanism 26 aligns the P-type semiconductor grain 631 and the position to be mounted horizontally.

[0130] The pushing mechanism 43 moves vertically, pushing the P-type semiconductor die 631 from the transfer film 6 to the mounting position of the first ceramic substrate 2531 and fixing it there. In the above process flow, the P-type semiconductor die 631 are mounted one by one along the width direction of the base 1 onto the first ceramic substrate 2531.

[0131] When all the P-type semiconductor dies 631 in a row on the transfer film 6 have been mounted on the first ceramic substrate 2531, the transfer film motion platform 3 is moved along the length direction of the base 1 to align the next row of P-type semiconductor dies 631 on the transfer film 6 with the positions to be mounted on the first ceramic substrate 2531. Alternatively, when all the positions to be mounted in a row on the first ceramic substrate 2531 have been mounted with P-type semiconductor dies 631, the substrate motion platform 2 is moved along the length direction of the base 1 to align the next row of positions to be mounted on the first ceramic substrate 2531 with the P-type semiconductor dies 631 on the transfer film 6. Finally, the rotation mechanism 26 is moved to align the P-type semiconductor dies 631 with the positions to be mounted in the horizontal direction.

[0132] The above steps are repeated until all the positions to be mounted on the first ceramic substrate 2531 are mounted with semiconductor dies 63 .

[0133] When all the P-type semiconductor grains 631 and N-type semiconductor grains 632 are mounted on the first ceramic substrate 2531, the solder paste 2533 is printed on the position to be mounted on the second ceramic substrate 2532, and then the position to be mounted on the second ceramic substrate 2532 is aligned with the P-type semiconductor grains 631 and N-type semiconductor grains 632 on the first ceramic substrate 2531 and adhered together through the solder paste 2533 to obtain a semiconductor refrigeration plate 253. Finally, the semiconductor refrigeration plate 253 is reflowed, and the semiconductor grains 63 are fixedly connected to the first ceramic substrate 2531 and the second ceramic substrate 2532 through the solidification of the solder paste 2533.

[0134] The above-described embodiments are merely descriptions of preferred embodiments of the present invention and are not intended to limit the scope of the present invention. Without departing from the design spirit of the present invention, various modifications and improvements made to the technical solutions of the present invention by ordinary technicians in this field should fall within the scope of protection determined by the claims of the present invention.

Claims

1. A semiconductor die mounting method for an ultra-micro semiconductor refrigeration chip, characterized in that: include: Step 1: prepare a first ceramic substrate and a second ceramic substrate, set mounting positions on the ceramic substrates for placing semiconductor dies to be mounted, and the mounting positions on the two ceramic substrates are arranged in the same manner; Step 2: Apply adhesive to the downward side of the transfer film to adhere the semiconductor die to be mounted on the film; Before semiconductor crystal grains are mounted, the combined movement of the transfer film motion platform (3), the push mechanism motion platform (4), and the driving mechanism of the imaging device (5) causes the imaging device (5) to photograph all semiconductor crystal grains (63) on the transfer film (6) and establish two-dimensional coordinate data of each semiconductor crystal grain (63); Through the combined movement of the substrate motion platform (2), the push mechanism motion platform (4), and the driving mechanism of the imaging device (5), the imaging device (5) is enabled to photograph the positions to be mounted of the first ceramic substrate (2531) on the semiconductor refrigeration plate carrier (25), and to establish two-dimensional coordinate data of each position to be mounted; Step 3: Place the transfer film on the first ceramic substrate so that a certain position to be mounted on the first ceramic substrate is aligned with a certain semiconductor die to be mounted on the transfer film in the vertical direction and in the horizontal direction; Step 4: the pushing mechanism (43) pushes the film material of the transfer film downward until the aligned semiconductor die to be mounted contacts the solder paste set on the aligned mounting position, so that the transfer film returns to the starting position; Step 5: Move the transfer film and the first ceramic substrate so that the next placement position on the first ceramic substrate is aligned with the next semiconductor die on the transfer film in the vertical direction and in the horizontal direction, and then execute step 4; Step 6, repeatedly performing step 5 until all the positions to be mounted on the first ceramic substrate are mounted with semiconductor dies; Step 7: Print solder paste on all the positions to be mounted on the second ceramic substrate and align them with the semiconductor crystal grains on the first ceramic substrate, and mount the semiconductor crystal grains on the first ceramic substrate on all the positions to be mounted on the second ceramic substrate to obtain semiconductor cooling sheets; Step eight, reflow soldering the semiconductor refrigeration chip.

2. A semiconductor die mounting device for an ultra-micro semiconductor refrigeration chip, used to implement the method according to claim 1, characterized in that: include: A base (1), the base (1) comprising a horizontal bearing platform and two vertically parallel side walls arranged at both ends of the horizontal bearing platform; A substrate motion platform (2) is provided on the horizontal bearing platform of the base (1), and a semiconductor refrigeration plate bearing platform (25) is provided on the top surface of the substrate motion platform. The semiconductor refrigeration plate bearing platform (25) is capable of moving in a horizontal plane along the length direction of the base (1) or the width direction of the base (1) under the drive of the substrate motion platform; A film transfer motion platform (3) is provided between two vertical side walls of the base (1), the film transfer motion platform (3) is located above the substrate motion platform and is movable along the length direction of the base (1); A pushing mechanism motion platform (4) is provided on the top of the base (1), the pushing mechanism motion platform (4) is located above the film transfer motion platform (3), a pushing mechanism (43) and an imaging device (5) are provided on the pushing mechanism motion platform (4), and the pushing mechanism (43) can move in the width direction and the vertical direction of the base (1); A first ceramic substrate (2531) is provided on the semiconductor refrigeration plate carrier (25), a surface of the first ceramic substrate (2531) is provided with a position to be mounted, and solder paste (2533) is provided in the position to be mounted; A transfer film (6) is horizontally arranged on the transfer film motion platform (3), and a semiconductor crystal grain (63) is adhered to a side of the transfer film (6) opposite to the substrate motion platform (2); The pushing mechanism (43) can move downward to push the semiconductor grains (63) on the transfer film (6) downward to contact the solder paste (2533) in the position to be mounted. When the pushing mechanism (43) moves upward, the transfer film (6) can return to its original position.

3. The semiconductor die mounting device for an ultra-micro semiconductor refrigeration chip according to claim 2, characterized in that: The substrate motion platform (2) comprises: A first workbench (22) provided on the upper surface of the horizontal bearing platform of the base (1); a first linear motor module (21) disposed between the horizontal bearing platform of the base (1) and the first workbench (22), the first linear motor module (21) being capable of driving the first workbench (22) to move along the length direction of the base (1); a second workbench (24) disposed on an upper surface of the first workbench (22); a second linear motor module (23) disposed between the first workbench (22) and the second workbench (24), wherein the second linear motor module (23) is capable of driving the second workbench (24) to move along the width direction of the base (1); a rotating mechanism (26) provided on the upper surface of the second workbench (24); The semiconductor refrigeration plate carrier platform (25) is arranged on the rotating mechanism (26), and the rotating mechanism (26) can control the semiconductor refrigeration plate carrier platform (25) to rotate in a horizontal plane.

4. The semiconductor die mounting device for an ultra-micro semiconductor refrigeration chip according to claim 3, characterized in that: A first stator groove (11) is provided on the top surface of the horizontal bearing platform of the base (1), and the first stator groove (11) is provided along the length direction of the base (1) and is located at the center of the width direction of the base (1); A first slider groove (221) is provided on a side of the first workbench (22) opposite to the horizontal bearing platform of the base (1), and the first slider groove (221) is arranged along the length direction of the base (1); a second stator groove (222) is provided on the top surface of the first workbench (22), and the second stator groove (222) is arranged along the width direction of the base (1), and the second stator groove (222) is located on the center line of the first workbench (22) in the length direction of the base (1); The first linear motor module (21) includes: a first guide rail (211), a first slider (212), a first linear motor stator (213), and a first linear motor mover (214); the first linear motor stator (213) is installed in the first stator groove (11), two first guide rails (211) are installed on the horizontal bearing platform of the base (1) and are symmetrically arranged on both sides of the first linear motor stator (213), the first linear motor mover (214) is installed on the center line of the side of the first workbench (22) opposite to the horizontal bearing platform of the base (1) along the length direction of the base (1) and is arranged opposite to the first linear motor stator (213), a plurality of first sliders (212) are embedded in the first slider groove (221) and are symmetrically arranged on both sides of the first linear motor mover (214), and the first sliders (212) on both sides of the first workbench (22) are embedded on the two first guide rails (211); A second slider groove (241) is provided at the bottom of the second workbench (24), and the second slider groove (241) is arranged along the width direction of the base (1); a circular gear shaft accommodating groove (242) and a circular rotating motor accommodating groove (243) are provided at the top of the second workbench (24); The second linear motor module (23) includes: a second guide rail (231), a second slider (232), a second linear motor stator (233), and a second linear motor mover (234); the second linear motor stator (233) is installed in the second stator groove (222), two second guide rails (231) are installed on the top surface of the first workbench (22) and are symmetrically arranged on both sides of the second linear motor stator (233), the second linear motor mover (234) is installed on the bottom center line of the second workbench (24) along the width direction of the base (1) and is arranged opposite to the second linear motor stator (233), a plurality of second sliders (232) are installed in the second slider groove (241) at the bottom of the second workbench (24) and are symmetrically arranged on both sides of the second linear motor mover (234), and the second sliders (232) on both sides of the second workbench (24) are embedded in the two second guide rails (231); The rotating mechanism (26) is installed on the top of the second workbench (24), and comprises: a gear shaft (261), a synchronous belt (262), and a rotating motor (263); the gear shaft (261) is installed in the gear shaft receiving groove (242), the rotating motor (263) is installed in the rotating motor receiving groove (243), and the gear shaft (261) and the rotating motor (263) are connected via the synchronous belt (262); The semiconductor refrigeration plate carrier (25) is mounted on the gear shaft (261), and the rotating motor (263) drives the gear shaft (261) through the synchronous belt (262), thereby driving the semiconductor refrigeration plate carrier (25) to rotate in a horizontal plane.

5. The semiconductor die mounting device for an ultra-micro semiconductor refrigeration chip according to claim 2, characterized in that: The film transfer motion platform (3) comprises a third linear motor module (31) and a film transfer bearing platform (32); The transfer film carrying platform (32) is provided with a circular through hole (321), the transfer film (6) is mounted on the lower surface of the transfer film carrying platform (32) and is coaxial with the circular through hole (321), and the opening area of ​​the circular through hole (321) can completely contain the arrangement area of ​​the semiconductor grains (63) in the transfer film (6); third slider grooves (322) are provided on both sides of the transfer film carrying platform (32) along the length direction of the base (1); A third stator groove (13) is provided on the inner side of each side wall of the base (1) along the length direction of the base (1); The third linear motor module (31) includes: a third guide rail (311), a third slider (312), a third linear motor stator (313), and a third linear motor mover (314); two groups of the third linear motor stators (313) are respectively installed in the third stator groove (13); four third guide rails (311) are respectively installed on each side wall of the base (1) in pairs and are symmetrically arranged on both sides of the third linear motor stator (313); two third linear motor movers (314) are arranged along the length of the base (1). The third sliders (312) are respectively installed on both sides of the transfer film bearing platform (32) and are respectively arranged opposite to the third linear motor stator (313); a plurality of the third sliders (312) are installed in the third slider grooves (322); and the third sliders (312) on each side of the transfer film bearing platform (32) are respectively symmetrically arranged on both sides of the third linear motor mover (314); the third sliders (312) on both sides of the transfer film bearing platform (32) are respectively embedded in the third guide rails (311) on the corresponding side walls of the base (1).

6. The semiconductor die mounting device for an ultra-micro semiconductor refrigeration chip according to claim 2, characterized in that: The pushing mechanism motion platform (4) comprises: a fourth linear motor module (41), a fourth workbench (42), the pushing mechanism (43), and a crossbeam (44); A crossbeam groove (12) is provided at the top of each side wall of the base (1), and the crossbeam groove (12) is located at the center of the length direction of the base (1); The crossbeam (44) is installed in the crossbeam groove (12), and a fourth stator groove (441) is provided on one side of the crossbeam (44) along the length direction of the crossbeam (44), and the fourth stator groove (441) is located on the height center line of the crossbeam (44); The fourth linear motor module (41) includes: a fourth guide rail (411), a fourth slider (412), a fourth linear motor stator (413), and a fourth linear motor mover (414); the fourth linear motor stator (413) is installed in the fourth stator groove (441), two fourth guide rails (411) are installed on the crossbeam (44) and are symmetrically arranged on both sides of the fourth linear motor stator (413), the fourth linear motor mover (414) is installed on the center line of the fourth workbench (42) along the width direction of the base (1) and is arranged opposite to the fourth linear motor stator (413), a plurality of fourth sliders (412) are installed on the fourth workbench (42) and are symmetrically arranged on both sides of the fourth linear motor mover (414), and the fourth sliders (412) on both sides of the fourth workbench (42) are embedded on the two fourth guide rails (411); The pushing mechanism (43) is installed on the fourth workbench (42), and the pushing mechanism (43) can reciprocate in the vertical direction under external drive.

7. The semiconductor die mounting device for an ultra-micro semiconductor refrigeration chip according to claim 2, characterized in that: The transfer film (6) comprises a film material (61) and a film material support ring (62); The membrane material (61) is an elastic membrane material; The film material support ring (62) can tension the film material (61) to make the surface of the film material (61) flat; the downward side of the film material (61) is coated with adhesive, and the semiconductor grains (63) are adhered to the film material (61) through the adhesive.

8. The semiconductor die mounting device for an ultra-micro semiconductor refrigeration chip according to claim 6, characterized in that: An imaging device (5) is provided on the fourth workbench (42); the imaging device (5) has a driving mechanism enabling it to achieve reciprocating motion in a vertical direction on the fourth workbench (42).

9. The semiconductor die mounting device for an ultra-micro semiconductor refrigeration chip according to claim 2, characterized in that: It also includes a measuring tool for monitoring the motion displacement of the first linear motor module (21), the second linear motor module (23), the third linear motor module (31) and the fourth linear motor module (41).

10. The semiconductor die mounting device for an ultra-micro semiconductor refrigeration chip according to claim 2, characterized in that: The surface of the semiconductor refrigeration plate carrier (25) is provided with a plurality of second vacuum adsorption holes (255); The second vacuum adsorption hole (255) adsorbs and fixes a first ceramic substrate accommodating mold (251), wherein the first ceramic substrate accommodating mold (251) has a plurality of first ceramic substrate accommodating grooves (252); the first ceramic substrate (2531) can be placed in the first ceramic substrate accommodating grooves (252).

Images