Processing system, data structure, and processing method

Abstract

This processing system is provided with: a processing device which is provided with an irradiation optical system and a material supply unit and which models a molded object; a measuring device that acquires information relating to the size of the molten pool formed by irradiation of the processing beam; a recording device that records information relating to the size of the molten pool and information relating to the position of the molten pool in association with each other; and a control device. The control device controls the processing device such that the size of the molten pool formed by irradiation of the processing beam coincides with the size of the molten pool read from the recording device.

Description

Technical Field

[0001] The present invention relates to the technical field of a processing system, a data structure and a processing method for processing an object. Background Art

[0002] An example of a processing system for processing an object is described in Patent Document 1. One of the technical issues of such a processing system is to appropriately process the object.

[0003] Background Art Literature

[0004] Patent Literature

[0005] Patent Document 1: U.S. Patent No. 7043330 Summary of the invention

[0006] According to the first aspect, a processing system is provided, comprising: a processing device, comprising an irradiation optical system capable of irradiating a processing light beam, and a material supply portion capable of supplying a molding material to a portion where a molten pool is formed by irradiation of the processing light beam, and performing molding of a molding object; a measuring device, which acquires information related to the size of the molten pool formed by irradiation of the processing light beam; a recording device, which records the information related to the size of the molten pool acquired by the measuring device and the information related to the position of the molten pool in an associated manner; and a control device; and the control device reads the information related to the size of the molten pool from the recording device, and controls the processing device in such a manner that the size of the molten pool formed by irradiation of the processing light beam is consistent with the size of the molten pool read from the recording device.

[0007] According to the second aspect, a processing system is provided, comprising: a processing device, comprising an irradiation optical system capable of irradiating a processing light beam, a material supply portion capable of supplying a molding material to a portion where a molten pool is formed by the irradiation of the processing light beam, a moving device capable of moving the irradiation position of the processing light beam along a target trajectory based on a processing path, and a deflection optical system capable of deflecting the processing light beam in a direction intersecting the target trajectory, and performing molding of a molding object; a measuring device, which obtains information related to the size of the molten pool formed by the irradiation of the processing light beam; and a control device; and the control device controls the processing device based on the measurement result of the measuring device, and changes the measurement object area of ​​the molten pool by the measuring device based on the condition for deflecting the processing light beam, i.e., the deflection condition.

[0008] According to the third aspect, there is provided a processing system comprising: a processing device comprising an irradiation optical system capable of irradiating a processing light beam, and a material supply portion capable of supplying a molding material to a portion where a molten pool is formed by irradiation of the processing light beam, and performing molding of a molding object; a measuring device for acquiring information related to the molten pool formed by irradiation of the processing light beam; a recording device for recording the information related to the molten pool acquired by the measuring device and information related to the position of the molten pool in an associated manner; and a control device; and the control device reads the information related to the molten pool from the recording device, and controls the processing device in such a manner that the molten pool formed by irradiation of the processing light beam reproduces the molten pool read from the recording device.

[0009] According to the fourth aspect, there is provided a processing system comprising: a processing device having an irradiation optical system capable of irradiating a processing light beam and processing an object; a measuring device for acquiring information related to a molten pool formed by irradiation of the processing light beam; a recording device for recording the information related to the molten pool acquired by the measuring device and information related to the position of the molten pool in an associated manner; and a control device; and the control device controls the processing device based on the information related to the molten pool read from the recording device.

[0010] According to the fifth aspect, there is provided a processing system comprising: a processing device having an irradiation optical system capable of irradiating a processing light beam, a first moving device capable of moving the irradiation position of the processing light beam along a target trajectory based on a processing path, and a second moving device capable of moving the processing light beam in a direction intersecting the target trajectory, and processing an object; a measuring device for acquiring information related to a molten pool formed by the irradiation of the processing light beam; and a control device; and the control device determines a measurement object area of ​​the measuring device based on a condition for moving the processing light beam by the second moving device, i.e., a movement condition.

[0011] According to the sixth aspect, a data structure is provided for a processing device, and a correspondence is established between information related to the size of the molten pool formed by the processing device and the position where the molten pool is formed. The processing device includes an irradiation optical system capable of irradiating a processing light beam, and a material supply unit capable of supplying a molding material to a portion where the molten pool is formed by irradiating the processing light beam, and performs molding of a molding object.

[0012] According to the 7th state sample, a data structure is provided for a processing device, and a correspondence is established between the condition for deflecting the processing light beam, i.e., the deflection condition, and information related to the measurement object area measured by the measuring device. The processing device includes an irradiation optical system capable of irradiating the processing light beam, a material supply unit capable of supplying modeling material to a portion that is irradiated with the processing light beam to form a molten pool, a moving device capable of moving the irradiation position of the processing light beam along a target trajectory based on a processing path, and a deflection optical system capable of deflecting the processing light beam in a direction intersecting the target trajectory, and is capable of modeling a modeling object.

[0013] According to the 8th aspect, there is provided a processing method, comprising the following steps: irradiating an object with a processing beam; supplying a modeling material to a portion where a molten pool is formed by irradiation with the processing beam to perform modeling of a modeled object; acquiring information related to the size of the molten pool formed by irradiation with the processing beam; recording the acquired information related to the size of the molten pool and information related to the position of the molten pool in an associated manner; and reading out the information related to the size of the molten pool, and controlling the modeling in such a manner that the size of the molten pool formed by irradiation with the processing beam is consistent with the size of the molten pool read from the recording device.

[0014] According to the 9th aspect, there is provided a processing method, comprising the following steps: irradiating an object with a processing beam; moving the irradiation position of the processing beam along a target trajectory based on a processing path; deflecting the processing beam in a direction intersecting the target trajectory; supplying a modeling material to a portion where a molten pool is formed by irradiating the processing beam to perform modeling of a modeled object; acquiring information related to the size of the molten pool formed by irradiation with the processing beam; and controlling modeling based on the acquired information related to the size of the molten pool, and changing the measurement object area of ​​the molten pool for acquiring information related to the size of the molten pool based on a condition for deflecting the processing beam, i.e., a deflection condition.

[0015] According to the 10th aspect, a processing method is provided, comprising the following steps: irradiating an object with a processing beam; supplying a modeling material to a portion where a molten pool is formed by irradiating the processing beam to perform modeling of a modeled object; acquiring information related to the molten pool formed by irradiation with the processing beam; recording the acquired information related to the molten pool and information related to the position of the molten pool in an associated manner; and reading out the information related to the molten pool, and controlling the modeling in a manner that the molten pool formed by irradiation with the processing beam reproduces the read molten pool.

[0016] The effects and other advantages of the present invention will become apparent from the embodiments described below. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a cross-sectional view showing the structure of the processing system according to the present embodiment.

[0018] Figure 2 It is a system configuration diagram showing the system configuration of the processing system according to the present embodiment.

[0019] Figure 3 It is a perspective view showing the structure of the irradiation optical system.

[0020] Figure 4 (a) to (e) are cross-sectional views showing the situation when a certain area on a workpiece is irradiated with processing light and a modeling material is supplied.

[0021] Figure 5 (a) to (c) are cross-sectional views showing the process of forming a three-dimensional structure.

[0022] Figure 6 (a) is a top view showing the moving trajectory of the target irradiation area within the modeling unit area. Figure 6 (b) is a top view showing an example of an operation in which the movement of the target irradiation area and the movement of the processing head / stage device are combined. Figure 6 (c) means to carry out Figure 6 Schematic diagram of the area where the object is formed during the action shown in (b).

[0023] Figure 7 An example of a workpiece image is shown.

[0024] Figure 8 (a) is a top view showing the moving trajectory of the target irradiation area when the width of the modeling unit area is changed. Figure 8 (b) is a plan view showing an example of moving the processing head / stage device while changing the size of the modeling unit area. Figure 8 (c) means to carry out Figure 8 Schematic diagram of the area where the object is formed during the action shown in (b).

[0025] Fig. 9 (a) is a top view showing the moving trajectory of the target irradiation area when the moving speed of the target irradiation area is sufficiently fast relative to the moving speed of the processing head / stage device. Fig. 9 (b) is a plan view showing the movement trajectory of the target irradiation area when the movement speed of the target irradiation area is moderately fast relative to the movement speed of the processing head / stage device. Fig. 9 (c) is a top view showing the moving trajectory of the target irradiation area when the moving speed of the target irradiation area is slower than the moving speed of the processing head / stage device.

[0026] Fig.10 It is a schematic diagram showing the trajectory of the laser beam irradiating the object.

[0027] Fig.11 It is a top view showing the movement trajectory of the modeling unit area on the modeling surface.

[0028] Fig.12 It is a top view showing an example of the movement trajectory of the target irradiation area in the formation unit area.

[0029] Fig.13 This is a top view showing another example of the movement trajectory of the target irradiation area within the formation unit area.

[0030] Fig.14 This is a top view showing another example of the movement trajectory of the target irradiation area within the formation unit area.

[0031] Fig.15 It is an explanatory diagram showing a method for detecting a molten pool from a workpiece image.

[0032] Fig.16 This is an explanatory diagram showing an example of a method for detecting a molten pool from a workpiece image.

[0033] Fig.17 (a) to (f) in FIG. 1 respectively represent image processing methods when multiple integration thresholds are set.

[0034] Fig.18 (a) and (b) in FIG. 1 represent workpiece images in the prior art. Fig.18 (c) and (d) in FIG. 1 show workpiece images in this embodiment.

[0035] Fig.19 This is an enlarged view showing the M layer and the N layer in one shaped object.

[0036] Fig. 20 It is an enlarged view showing the M layer and the N layer in the first shaped object, and the M#2 layer and the N#2 layer in the second shaped object.

[0037] Fig.21 This shows a workpiece image when the center and left and right widths of the molten pool are controlled to be constant.

[0038] Fig. 22 The following is a control method for keeping the center and left and right widths of the molten pool constant.

[0039] Fig.23 A control method for making the number of pixels on the left and right sides of the molten pool uniform is shown. DETAILED DESCRIPTION

[0040] Hereinafter, embodiments of a processing method, a processing system, a measuring method, and a measuring system will be described with reference to the accompanying drawings. Hereinafter, embodiments of a processing method, a processing system, a measuring method, and a measuring system will be described using a processing system SYS that performs additive processing on a workpiece W as an example of an object to form a modeling object BO on the workpiece W. In particular, embodiments of a processing method, a processing system, a measuring method, and a measuring system will be described below using a processing system SYS that performs additive processing based on a laser deposition welding method (LMD: Laser Metal Deposition). Additive processing based on a laser deposition welding method is an additive processing that melts a modeling material M supplied to the workpiece W using processing light EL (i.e., an energy beam in the form of light) to form a modeling object BO that is integrated with the workpiece W or can be separated from the workpiece W.

[0041] In addition, laser deposition welding (LMD) can also be called direct metal deposition, directed energy deposition, laser cladding, laser engineered net shaping, direct light manufacturing, laser solidification, shape deposition manufacturing, wire-fed laser deposition, gas threading, laser powder melting, laser metal forming, selective laser powder remelting, laser direct casting, laser powder deposition, laser additive manufacturing, and laser rapid prototyping.

[0042] In the following description, an XYZ orthogonal coordinate system defined by mutually orthogonal X-axis, Y-axis and Z-axis is used to describe the positional relationship of various components constituting the processing system SYS. In addition, in the following description, for the convenience of description, the X-axis direction and the Y-axis direction are respectively set as horizontal directions (i.e., specified directions in the horizontal plane), and the Z-axis direction is set as a vertical direction (i.e., a direction orthogonal to the horizontal plane, essentially an up and down direction). In addition, the rotation directions around the X-axis, Y-axis and Z-axis (in other words, the tilting directions) are respectively referred to as the θX direction, the θY direction and the θZ direction. Here, the Z-axis direction can also be set as the gravity direction. In addition, the XY plane can also be set as the horizontal direction.

[0043] (1) Structure of the processing system SYS

[0044] First, refer to Figure 1 and Figure 2 The configuration of the processing system SYS according to the present embodiment will be described. Figure 1 It is a cross-sectional view showing an example of the structure of the processing system SYS of this embodiment. Figure 2 1 is a system configuration diagram showing an example of the system configuration of the machining system SYS according to the present embodiment.

[0045] The processing system SYS is capable of shaping (in other words, forming) a shaping object BO. In addition, the shaping object BO in the present embodiment may refer to any object shaped by the processing system SYS. Typically, the shaping object BO is a three-dimensional object having a size in any of the three-dimensional directions (i.e., a solid object, in other words, an object having a size in the X-axis direction, the Y-axis direction, and the Z-axis direction). As an example of the shaping object BO, there can be cited a three-dimensional structure ST having a desired three-dimensional shape (see Figure 4 (c)). As an example of the object BO, a part of the three-dimensional structure ST can be cited. As an example of the object BO, any object shaped in the process of shaping the three-dimensional structure ST can be cited. As described below, the three-dimensional structure ST is composed of a plurality of structural layers SL (refer to Figure 4 (a) to Figure 4 In the case of the structure (c)), as an example of the shaped object BO, the structural layer SL can be cited. As an example of the shaped object BO, a part of the structural layer SL can be cited. As an example of the shaped object BO, any object shaped in the process of shaping the structural layer SL can be cited. However, the shaped object BO is not limited to the objects exemplified here.

[0046] The processing system SYS is capable of shaping an object BO on a workpiece W that serves as a basis (e.g., a base material) for shaping the object BO. That is, the processing system SYS performs shaping on the workpiece W. The processing system SYS is capable of shaping an object BO by additively processing the workpiece W. In the case where the workpiece W is the carrier 31 described below, the processing system SYS is capable of shaping an object BO on the carrier 31. In the case where the workpiece W is an object placed on the carrier 31, i.e., a carrier, the processing system SYS is capable of shaping an object BO on the carrier. In this case, the processing system SYS may also shape an object BO that is integrated with the carrier. The action of shaping an object BO that is integrated with the carrier is equivalent to the action of additively shaping a new structure on the carrier. In addition, the existing structure may be, for example, an object having a defective portion (e.g., a product to be repaired). Alternatively, the processing system SYS may also shape an object BO that can be separated from the carrier. The object placed on the stage 31 may also be another object BO formed by the processing system SYS (ie, an existing structure (a primary object, a first object)). Figure 1 The example in which the workpiece W is a conventional structure held by the stage 31 is shown. In addition, the example in which the workpiece W is a conventional structure held by the stage 31 is also described below.

[0047] As described above, the processing system SYS can shape the object BO by laser cladding. That is, the processing system SYS can also be said to be a 3D printer that uses the additive modeling technology to shape the object. In addition, the additive modeling technology can also be called rapid prototyping, rapid manufacturing, or additive manufacturing.

[0048] The processing system SYS performs the shaping of the object BO by processing the shaping material M using the processing light EL as the processing light beam. The shaping material M is a material that can be melted by irradiation with the processing light EL having a predetermined intensity or higher. As such a shaping material M, for example, at least one of a metallic material and a resin material can be used. However, as the shaping material M, other materials different from the metallic material and the resin material can also be used. In one example, the shaping material M is a powder material. That is, the shaping material M is a powder. In addition to the powder material, the powder can also include a granular material. The shaping material M can include, for example, a powder having a particle size in the range of 90 microns ± 40 microns. The average particle size of the powder constituting the shaping material M can be, for example, less than 75 microns, or in the range of 10 microns to 25 microns, or can be other sizes. For example, the average particle size of the powder may be about 200, 190, 180, 170, 160, 150, 140, 130, 120, 110, 100, 95, 90, 85, 80, 75, 70, 65, 60, 55, 50, 45, 40, 35, 30, 25, 20, 15, 10 microns or less. In other examples, the modeling material M may be a material other than powder. For example, as the modeling material M, at least one of a linear modeling material and a gaseous modeling material may also be used. The above numerical values ​​are examples, and the present invention is not limited thereto.

[0049] The type of the workpiece W may also be the same as the type of the modeling material M. For example, when a metallic material is used as the modeling material M, the workpiece W may also be the same type (or different type) of metal as the modeling material M. For example, when a resin material is used as the modeling material M, the workpiece W may also be the same type (or different type) of resin as the modeling material M.

[0050] In order to model the object BO, Figure 1 and Figure 2As shown, the processing system SYS includes a material supply device 1, a processing device 2, a stage device 3, a light source 4, a gas supply device 5, a housing 6, a measuring device 71, a recording device 72, and a control device 8. At least a portion of each of the processing device 2, the stage device 3, and the measuring device 71 is accommodated in the chamber space 63IN inside the housing 6. In this case, the processing system SYS can also perform additive processing in the chamber space 63IN. In addition, at least one of the processing device 2 and the stage device 3 may not be accommodated in the chamber space 63IN inside the housing 6.

[0051] The material supply device 1 supplies the modeling material M to the processing device 2. Specifically, the material supply device 1 is connected to the processing device 2 (especially, the material nozzle 212 described below) via the supply pipe 11. The material supply device 1 supplies the modeling material M to the processing device 2 via the supply pipe 11. At this time, the material supply device 1 may also supply the desired amount of modeling material M corresponding to the required amount in such a manner that the processing device 2 performs additive processing and supplies the required amount of modeling material M per unit time to the processing device 2. The material supply device 1 is an example of a "material supply unit".

[0052] The processing device 2 uses the modeling material M supplied from the material supply device 1 to shape the modeling object BO. In order to use the modeling material M to shape the modeling object BO, the processing device 2 includes a processing head 21 and a head drive system 22. The processing head 21 also includes an irradiation optical system 211 and a material nozzle (i.e., a supply system or supply device for supplying the modeling material M) 212. The processing head 21 and the head drive system 22 are accommodated in the chamber space 63IN. However, at least a portion of the processing head 21 and / or the head drive system 22 may also be arranged in a space outside the housing 6, i.e., an external space 64OUT. In addition, the external space 64OUT may also be a space that an operator of the processing system SYS can enter.

[0053] The irradiation optical system 211 is an optical system (for example, a focusing optical system) for emitting the processing light EL from the emitting section 213. Specifically, the irradiation optical system 211 is optically connected to the light source 4 that emits the processing light EL via an optical transmission component 41 such as an optical fiber or a light pipe. Figure 2 In the example shown, the modeling system SYS includes one light source 4, and the irradiation optical system 211 is optically connected to the light source 4 via the light transmission member 41. The irradiation optical system 211 emits the processing light EL transmitted from the light source 4 via the light transmission member 41. In addition, for example, a configuration including a plurality of irradiation optical systems 211 may be adopted.

[0054] The irradiation optical system 211 irradiates the processing light EL from the irradiation optical system 211 downward (i.e., -Z side). A stage 31 is arranged below the irradiation optical system 211. When the workpiece W is placed on the stage 31, the irradiation optical system 211 irradiates the emitted processing light EL onto the workpiece W (especially the surface of the workpiece W). Specifically, the irradiation optical system 211 can irradiate the processing light EL onto the target irradiation area (target irradiation position) EA, which is set on the workpiece W or in the vicinity of the workpiece W as an area where the processing light EL is irradiated (typically, focused). Furthermore, the state of the irradiation optical system 211 can be switched between a state where the processing light EL is irradiated onto the target irradiation area EA and a state where the processing light EL is not irradiated onto the target irradiation area EA under the control of the control device 8. In addition, the direction of the processing light EL emitted from the irradiation optical system 211 is not limited to directly below (i.e., in line with the -Z axis direction), and for example, it can also be a direction inclined at a predetermined angle relative to the Z axis.

[0055] exist Figure 3 An example of the structure of the irradiation optical system 211 is shown in FIG. Figure 3 As shown, the irradiation optical system 211 may include a state control optical system 2111 , a galvanometer mirror 2112 , and an fθ lens 2113 .

[0056] The state control optical system 2111 is an optical system capable of controlling the state of the processing light EL emitted by the irradiation optical system 211. For example, the state control optical system 2111 may also include a focus control optical system capable of controlling (for example, changing) the focusing position (i.e., the convergence position) of the processing light EL. The state control optical system 2111 may control the focusing position of the processing light EL, for example, by changing the distance (positional relationship) to the fθ lens 2113 in the direction of travel of the processing light EL; changing the distance (positional relationship) to the material nozzle 212; or changing the distance (positional relationship) to the powder supply position of the material nozzle 212. The focus control optical system may also include, for example, a plurality of lenses arranged along the direction of travel of the processing light EL. In this case, the focusing position of the processing light EL may also be changed by moving at least one of the plurality of lenses along the direction of its optical axis. In addition, the state control optical system 2111 may also include an intensity control optical system capable of controlling (for example, changing) the intensity of the processing light EL. The intensity control optical system may include a shutter capable of blocking at least a part of the processing light EL or a filter capable of reducing light, etc. However, the irradiation optical system may not include the state control optical system 2111 .

[0057] The processing light EL that has passed through the state control optical system 2111 is incident on the galvanometer mirror 2112. The galvanometer mirror 2112 changes the emission direction of the processing light EL from the galvanometer mirror 2112 by deflecting the processing light EL (that is, changing the deflection angle (emission angle) of the processing light EL). Therefore, the galvanometer mirror 2112 can also be called a deflection component or a deflection optical system. When the emission direction of the processing light EL from the galvanometer mirror 2112 is changed, the position where the processing light EL is emitted from the processing head 21 is changed. When the position where the processing light EL is emitted from the processing head 21 is changed, the target irradiation area EA on the surface of the workpiece W (more specifically, the modeling surface MS described below where additive processing is performed) irradiated with the processing light EL moves. That is, the irradiation position on the modeling surface MS where the processing light EL is irradiated moves. In other words, the processing light EL moves on the modeling surface MS.

[0058] The galvanometer mirror 2112 includes, for example, an X scanning mirror 2112X and a Y scanning mirror 2112Y. In addition, each of the X scanning mirror 2112X and the Y scanning mirror 2112Y may also be referred to as a galvanometer mirror 2112. The X scanning mirror 2112X and the Y scanning mirror 2112Y are respectively tilt angle variable mirrors whose angles relative to the optical path of the processing light EL incident on each mirror can be changed. The X scanning mirror 2112X reflects the processing light EL toward the Y scanning mirror 2112Y. The X scanning mirror 2112X can swing or rotate around a rotation axis along the Y axis. By swinging or rotating the X scanning mirror 2112X, the processing light EL scans the modeling surface MS along the X-axis direction. For example, when only the X scanning mirror 2112X is operated, the target irradiation area EA moves along the X-axis direction on the modeling surface MS by swinging or rotating the X scanning mirror 2112X. The Y scanning mirror 2112Y reflects the processing light EL toward the fθ lens 2113. The Y scanning mirror 2112Y can swing or rotate around a rotation axis along the X axis. By swinging or rotating the Y scanning mirror 2112Y, the processing light EL scans the modeling surface MS along the Y axis direction. For example, when only the Y scanning mirror 2112Y is operated, the target irradiation area EA moves along the Y axis direction on the modeling surface MS by swinging or rotating the Y scanning mirror 2112Y. Furthermore, by operating the X scanning mirror 2112X and the Y scanning mirror 2112Y at the same time, the target irradiation area EA can be moved two-dimensionally on the modeling surface MS.

[0059] Through this galvanometer mirror 2112, the processing light EL can be scanned in the modeling projection area ESA. The irradiation optical system 211 can irradiate the processing light EL to the modeling projection area ESA determined based on the irradiation optical system 211. The target irradiation area EA can move in the modeling projection area ESA determined based on the irradiation optical system 211. In addition, for example, in the case of having multiple irradiation optical systems 211, the modeling projection areas ESA in each irradiation optical system 211 can be consistent, and each modeling projection area ESA can also be partially different. In the case where the multiple modeling projection areas ESA are consistent or partially overlap with each other, the direction of the processing light EL emitted from the multiple irradiation optical systems 211 can be a direction inclined at a predetermined angle relative to the Z axis, and the optical axes of the modeling surface MS side of each irradiation optical system 211 (typically, the optical axis of the focusing optical system (fθ lens 2113) of the irradiation optical system 211) can also intersect each other on the modeling surface MS or on a surface near it.

[0060] The target irradiation area EA can be moved along the X-axis direction in the modeling projection area ESA by the X-scanning mirror 2112X. Furthermore, the target irradiation area EA can be moved along the Y-axis direction in the modeling projection area ESA by the Y-scanning mirror 2112Y. Furthermore, as described above, the focusing position of the processing light EL can be changed along the Z-axis direction by the state control optical system 2111. Therefore, the irradiation optical system 211 can move the irradiation position of the processing light EL in the modeling projection area ESA (specifically, the position of the target irradiation area EA in each direction of the X-axis and Y-axis directions and the focusing position in the Z-axis direction) along each direction of the X-axis direction, the Y-axis direction, and the Z-axis direction. More specifically, the target irradiation area EA can be moved two-dimensionally on the XY plane by the X-scanning mirror 2112X and the Y-scanning mirror 2112Y, and the focusing position can be moved in the Z-axis direction. That is, the irradiation optical system 211 can set the irradiation position of the processing light EL in the three-dimensional space on the modeling projection area ESA side of the irradiation optical system 211 to an arbitrary position. In addition, the irradiation optical system 211 can move the processing light EL in each of the X-axis direction, the Y-axis direction, and the Z-axis direction within the modeling projection area ESA.

[0061] The modeling projection area ESA represents the maximum area (in other words, the maximum range) in which the processing head 21 can perform additive processing using the processing light EL when the positional relationship between the irradiation optical system 211 and the modeling surface MS is fixed. Typically, the modeling projection area ESA may also be consistent with the maximum scanning range of the processing light EL deflected by the galvanometer mirror 2112 when the positional relationship between the irradiation optical system 211 and the modeling surface MS is fixed. In other words, the modeling projection area ESA may also be an area determined based on the effective range of the galvanometer mirror 2112. In addition, the modeling projection area ESA may also be an area determined based on the optical effective range of the fθ lens 2113 by irradiating the modeling surface MS with the processing light EL via the fθ lens 2113.

[0062] The modeling projection area ESA may also be defined within a plane perpendicular to the optical axis AX of the irradiation optical system 211. The optical axis AX of the irradiation optical system 211 is an axis along the direction of travel of the processing light EL irradiated onto the modeling surface MS. The optical axis AX of the irradiation optical system 211 may also be the optical axis of the fθ lens 2113. Alternatively, when the direction of travel of the processing light EL is changed by a deflection component such as a reflector after the processing light EL is emitted from the fθ lens 2113, the optical axis AX of the irradiation optical system 211 may also be different from the optical axis of the fθ lens 2113. In the following description, an example in which the optical axis AX is an axis along the Z axis is described.

[0063] The processing head 21 can perform additive processing in the modeling unit area BSA set in the modeling projection area ESA. In addition, similarly to the modeling projection area ESA, for example, in the case of having multiple irradiation optical systems 211, the modeling unit areas BSA in each irradiation optical system 211 can be consistent, or each modeling unit area BSA can be partially different.

[0064] The modeling unit area BSA represents the area (in other words, the range) where the processing head 21 actually performs additive processing using the processing light EL when the positional relationship between the irradiation optical system 211 and the modeling surface MS is fixed. That is, the processing head 21 can also perform additive processing on the entire surface of the modeling unit area BSA. The modeling unit area BSA represents the area (in other words, the range) where the processing head 21 actually scans using the processing light EL when the positional relationship between the irradiation optical system 211 and the modeling surface MS is fixed. The modeling unit area BSA represents the area where the target irradiation area EA actually moves when the positional relationship between the irradiation optical system 211 and the modeling surface MS is fixed. This modeling unit area BSA is consistent with at least a portion of the modeling projection area ESA. For example, the modeling unit area BSA may also be consistent with the modeling projection area ESA. Alternatively, the modeling unit area BSA may also be consistent with a portion of the modeling projection area ESA. That is, the modeling unit area BSA may also be smaller than the modeling projection area ESA. In this case, the smaller the rotation amount of the galvanometer mirror 2112 (that is, the smaller the rotation angle of the galvanometer mirror 2112), the smaller the area scanned by the processing light EL, and therefore, the smaller the modeling unit area BSA. Therefore, the irradiation optical system 211 can also set a modeling unit area BSA of a desired size within the modeling projection area ESA by controlling the rotation amount of the galvanometer mirror 2112 (more specifically, the rotation amount of the X scanning mirror 2112X and the Y scanning mirror 2112Y) under the control of the control device 8.

[0065] exist Figure 3 In the example shown, the shape of the modeling unit area BSA is a rectangle. However, the shape of the modeling unit area BSA may be a shape different from a rectangle (for example, a circle, an ellipse, or a polygon). In addition, when a rectangle is used as the shape of the modeling unit area BSA, the corners of the rectangle may be rounded. The size of the modeling unit area BSA in the X-axis direction and the size in the Y-axis direction may be several millimeters. However, the size of the modeling unit area BSA is not limited to several millimeters. For example, the size of the modeling unit area BSA may be approximately 10, 9, 8, 7, 6, 5, 4, 3, 2, 1 millimeters or less. The same can be said about the shape of the modeling projection area ESA. The numerical value described is an example, and the present invention is not limited to this.

[0066] When the processing light EL is irradiated onto the molding surface MS in units of molding unit areas BSA, the molding unit areas BSA are scanned by the processing light EL through the galvanometer mirror 2112. Therefore, compared with the case where the processing light EL is irradiated onto the molding surface MS without using the galvanometer mirror 2112, the possibility of the distribution of the amount of heat transferred from the processing light EL to the molding unit area BSA being deviated within the molding unit area BSA becomes lower. In other words, the amount of heat transferred from the processing light EL to the molding unit area BSA can be made uniform. As a result, the molding system SYS can mold the molding object on the molding surface MS with relatively high molding accuracy.

[0067] However, the modeling system SYS may not irradiate the processing light EL onto the modeling surface MS in units of the modeling unit area BSA. The modeling system SYS may irradiate the processing light EL onto the modeling surface MS without using the galvanometer mirror 2112. In this case, the target irradiation area EA may also move on the modeling surface MS as at least one of the processing head 21 and the stage 31 moves.

[0068] The fθ lens 2113 is an optical system for emitting the processing light EL from the galvanometer mirror 2112 toward the modeling surface MS. In particular, the fθ lens 2113 is an optical element capable of focusing the processing light EL from the galvanometer mirror 2112 onto a focusing surface. Therefore, the fθ lens 2113 may also be referred to as a focusing component. The focusing surface of the fθ lens 2113 may be set, for example, on the modeling surface MS. In addition, the irradiation optical system 211 may also include a focusing component (focusing optical system) different from the fθ lens 2113.

[0069] Furthermore, the machining head 21 may include a part of the irradiation optical system 211 , while the other part of the irradiation optical system 211 may be arranged outside the machining head 21 .

[0070] Return to Figure 1 and Figure 2A supply outlet 214 is formed in the material nozzle 212. The material nozzle 212 supplies (e.g., ejects, sprays, ejects or blows) the modeling material M from the supply outlet 214. Therefore, the material nozzle 212 can also be called a material supply component. The material nozzle 212 is physically connected to the material supply device 1, which is the supply source of the modeling material M, via the supply pipe 11 and the mixing device 12. The material nozzle 212 supplies the modeling material M supplied from the material supply device 1 via the supply pipe 11 and the mixing device 12. The material nozzle 212 can also pressure-feed the modeling material M supplied from the material supply device 1 via the supply pipe 11. That is, the modeling material M from the material supply device 1 and the conveying gas (i.e., a pressurized gas, for example, an inert gas such as nitrogen or argon) can also be mixed by the mixing device 12 and then pressure-fed to the material nozzle 212 via the supply pipe 11. As a result, the material nozzle 212 supplies the modeling material M together with the conveying gas. As the conveying gas, for example, a flushing gas supplied from the gas supply device 5 can be used. However, as the transport gas, a gas supplied from a gas supply device different from the gas supply device 5 may be used. Figure 1 , the material nozzle 212 is depicted as a tube, but the shape of the material nozzle 212 is not limited to this shape. The material nozzle 212 supplies the modeling material M toward a target or target area in the chamber space 63IN. The material nozzle 212 supplies the modeling material M from the material nozzle 212 toward the bottom (i.e., the -Z side). A carrier 31 is arranged below the material nozzle 212. When a workpiece W is mounted on the carrier 31, the material nozzle 212 supplies the modeling material M toward the workpiece W or the vicinity of the workpiece W. In addition, the traveling direction of the modeling material M supplied from the material nozzle 212 is a direction inclined at a predetermined angle (as an example, an acute angle) relative to the Z-axis direction, but may also be the -Z side (i.e., directly below). The inclination of the material nozzle 212 is not limited to the above angle and may be set arbitrarily.

[0071] The material nozzle 212 supplies the modeling material M to the portion irradiated with the processing light EL from the irradiation optical system 211. That is, the material nozzle 212 supplies the modeling material M to the target irradiation area EA irradiated with the processing light EL by the irradiation optical system 211. Therefore, the material nozzle 212 is aligned with the irradiation optical system 211 so that the target supply area MA set on the workpiece W or in the vicinity of the workpiece W as the area where the material nozzle 212 supplies the modeling material M coincides with (or at least partially overlaps with) the target irradiation area EA. In one example, the material nozzle 212 may also supply the modeling material M to the molten pool MP formed by the processing light EL emitted from the irradiation optical system 211 (see below). Figure 4In addition, the target supply area MA and the target irradiation area EA may be different in size, for example, the target supply area MA may be a larger area than the target irradiation area EA. In addition, the target supply area MA may be a smaller area than the target irradiation area EA. In other examples, the material nozzle 212 may not supply the modeling material M to the molten pool MP. For example, the processing system SYS may also melt the modeling material M using the processing light EL before the modeling material M from the material nozzle 212 reaches the workpiece W, so that the molten modeling material M adheres to the workpiece W.

[0072] As described above, in the present embodiment, the processing system SYS uses the irradiation optical system 211 provided in the processing head 21 to irradiate the processing light EL from the light source 4 onto the workpiece W, and uses the material nozzle 212 provided in the processing head 21 to supply the molding material M from the material supply device 1 to the workpiece W, thereby molding the molding object BO. Therefore, a device including the processing head 21 (i.e., the irradiation optical system 211 and the material nozzle 212) mainly used for molding the molding object BO, the material supply device 1, and at least one of the light source 4 may also be referred to as a processing device 2.

[0073] The head drive system 22 moves the processing head 21. The head drive system 22, for example, moves the processing head 21 in the chamber space 63IN. The head drive system 22 moves the processing head 21 along at least one of the X-axis, the Y-axis, and the Z-axis. When the processing head 21 moves along at least one of the X-axis and the Y-axis, the target irradiation area EA and the target supply area MA move along at least one of the X-axis and the Y-axis to any position on the workpiece W or in the chamber space 63IN. Furthermore, the head drive system 22 may also move the processing head 21 along at least one rotation direction of the θX direction, the θY direction, and the θZ direction in addition to or instead of at least one of the X-axis, the Y-axis, and the Z-axis. In other words, the head drive system 22 may also rotate the processing head 21 around at least one of the X-axis, the Y-axis, and the Z-axis. The head drive system 22 may also change the posture of the processing head 21 around at least one of the X-axis, the Y-axis, and the Z-axis. The head drive system 22 may include an actuator such as a motor, for example.

[0074] If the head driving system 22 moves the processing head 21, the relative position of the processing head 21, the stage 31, and each of the workpieces W supported by the stage 31 changes. That is, the relative position of each of the irradiation optical system 211 and the material nozzle 212 (supply outlet 214), the stage 31, and each of the workpieces W changes. Therefore, the head driving system 22 can also function as a position changing device for changing the relative positional relationship between each of the irradiation optical system 211 and the material nozzle 212 (supply outlet 214), the stage 31, and each of the workpieces W. Furthermore, if the relative position of the processing head 21, the stage 31, and each of the workpieces W changes, the relative position of the target irradiation area EA of the processing light EL irradiated from the processing head 21, the stage 31, and each of the workpieces W changes. Therefore, the head driving system 22 can also function as a position changing device for changing the relative positional relationship between the target irradiation area EA, the stage 31, and each of the workpieces W. Furthermore, if the relative positions of the processing head 21, the stage 31, and the workpiece W are changed, the target irradiation area EA and the target supply area MA (and further, the molten pool MP) are relatively moved with respect to the workpiece W. Therefore, the head driving system 22 can also function as a moving device that moves the target irradiation area EA and the target supply area MA (and further, the molten pool MP) with respect to the workpiece W.

[0075] The stage device 3 includes a stage 31. An object, namely, a workpiece W, is placed on the stage 31. Specifically, the workpiece W is placed on a placement surface 311, which is at least a portion of the upper surface of the stage 31. The stage 31 may be capable of holding the workpiece W placed on the stage 31. In this case, the stage 31 may include at least one of a mechanical suction cup, an electrostatic suction cup, and a vacuum suction cup to hold the workpiece W. Alternatively, the stage 31 may not be able to hold the workpiece W placed on the stage 31. In this case, the workpiece W may be placed on the stage 31 without being clamped. The irradiation optical system 211 emits the processing light EL during at least a portion of the period during which the workpiece W is placed on the stage 31. Furthermore, the material nozzle 212 supplies the molding material M during at least a portion of the period during which the workpiece W is placed on the stage 31.

[0076] The stage device 3 also includes a stage driving system 32. The stage driving system 32 moves the stage 31. The stage driving system 32, for example, moves the stage 31 along at least one of the X-axis, the Y-axis, the Z-axis, the θX direction, the θY direction, and the θZ direction. When the stage driving system 32 moves the stage 31, the relative position of the processing head 21, the stage 31, and each of the workpieces W mounted on the stage 31 changes. Therefore, the stage driving system 32 can also function as a position changing device for changing the relative position relationship between the processing head 21, the stage 31, and each of the workpieces W. Furthermore, when the relative position of the processing head 21, the stage 31, and each of the workpieces W changes, the target irradiation area EA and the target supply area MA (and then the molten pool MP) move relative to the workpiece W.

[0077] The light source 4 emits, for example, at least one of infrared light, visible light and ultraviolet light as the processing light EL. However, other types of light may also be used as the processing light EL. The processing light EL may also include a plurality of pulsed lights (i.e., a plurality of pulse beams). The processing light EL may also be a laser beam. In this case, the light source 4 may also include a laser light source (for example, a semiconductor laser such as a laser diode (LD: Laser Diode). As a laser light source, it may also be a fiber laser, a CO2 laser, a YAG laser, an excimer laser, etc. However, the processing light EL may not be a laser beam. The light source 4 may include any light source (for example, at least one of an LED (Light Emitting Diode) and a discharge lamp, etc.).

[0078] The gas supply device 5 is a supply source of flushing gas for flushing the chamber space 63IN. The flushing gas contains an inert gas. As an example of an inert gas, nitrogen or argon can be cited. The gas supply device 5 is connected to the chamber space 63IN via a supply port 62 formed in a partition wall component 61 of the shell 6 and a supply pipe 51 connecting the gas supply device 5 and the supply port 62. The gas supply device 5 supplies flushing gas to the chamber space 63IN via the supply pipe 51 and the supply port 62. As a result, the chamber space 63IN becomes a space flushed with the flushing gas. The flushing gas supplied to the chamber space 63IN can also be discharged from an exhaust port (not shown) formed in the partition wall component 61. In addition, the gas supply device 5 can also be a gas cylinder storing an inert gas such as nitrogen or argon. In the case where the inert gas is nitrogen, the gas supply device 5 can also be a nitrogen generator that generates nitrogen using the atmosphere as a raw material.

[0079] When the material nozzle 212 supplies the molding material M together with the flushing gas as described above, the gas supply device 5 may supply the flushing gas to the mixing device 12 supplied with the molding material M from the material supply device 1 in addition to the chamber space 63IN. Specifically, the gas supply device 5 may be connected to the mixing device 12 via the supply pipe 52 connecting the gas supply device 5 and the mixing device 12. As a result, the gas supply device 5 supplies the flushing gas to the mixing device 12 via the supply pipe 52. In this case, the molding material M from the material supply device 1 may be supplied (specifically, pressure-fed) toward the material nozzle 212 through the supply pipe 11 by the flushing gas supplied from the gas supply device 5 via the supply pipe 52. That is, the gas supply device 5 may be connected to the material nozzle 212 via the supply pipe 52, the mixing device 12, and the supply pipe 11. In this case, the material nozzle 212 supplies the molding material M together with the flushing gas for pressure-fed molding material M from the supply outlet 214.

[0080] The housing 6 is a receiving device that receives at least a portion of each of the processing device 2, the stage device 3 and the measuring device 71 in the internal space of the housing 6, i.e., the chamber space 63IN. The housing 6 includes a partition wall component 61 that defines the chamber space 63IN. The partition wall component 61 is a component that separates the chamber space 63IN from the external space 64OUT of the housing 6. The partition wall component 61 faces the chamber space 63IN via its inner wall 611, and faces the external space 64OUT via its outer wall 612. In this case, the space surrounded by the partition wall component 61 (specifically, the space surrounded by the inner wall 611 of the partition wall component 61) becomes the chamber space 63IN. In addition, a door that can be opened and closed can also be provided on the partition wall component 61. The door can be opened when the workpiece W is placed on the stage 31. The door can also be opened when the workpiece W and / or the molded object BO are taken out from the stage 31. The door can also be closed during processing (i.e., during additive processing or bonding processing). In addition, an observation window (not shown) for visually viewing the chamber space 63IN from the external space 64OUT of the housing 6 may be provided in the partition wall member 61 .

[0081] The measuring device 71 is arranged in the chamber space 63IN. The measuring device 71 can measure at least a portion of the workpiece W placed on the stage 31 in the chamber space 63IN. In one example, the measuring device 71 includes a detector for detecting parameters related to the measurement object, a sensor for acquiring information related to the parameters of the measurement object, and / or a sensor for acquiring an image of the measurement object. In particular, the measuring device 71 can measure the molten pool MP formed on the workpiece W by the processing light EL (that is, formed on the workpiece W by the processing head 21). In this case, the measurement result of the measuring device 71 includes at least information related to the size of the molten pool MP. Therefore, the measuring device 71 can also function as a device that can acquire information related to the molten pool MP (at least one physical parameter or shape parameter of the molten pool MP). In addition, the measuring device 71 can also be a device for coaxial measurement, such as TTL (Through The Lens), etc., which observes from the same axis as the processing optical axis. In this case, for example, it is also possible to Figure 3 A half mirror is provided between the fθ lens 2113 and the Y scanning mirror 2112Y to observe the molten pool MP from the side.

[0082] In the present embodiment, the measuring device 71 may also be capable of measuring the size (i.e., the size) of the molten pool MP formed by the irradiation of the processing light EL. For example, the measuring device 71 may also be capable of measuring the size (i.e., the length) of the molten pool MP in the direction along the surface of the workpiece W (or the following molding surface MS forming the molten pool MP). The measuring device 71 may also be capable of measuring the size (i.e., the length or the width, etc.) of the molten pool MP in at least one direction of the X-axis direction and the Y-axis direction. In this case, the measurement result of the measuring device 71 includes information related to the size of the molten pool MP. Therefore, the measuring device 71 may also function as a device capable of obtaining information related to the size of the molten pool MP.

[0083] Furthermore, the measuring device 71 can also function as a device capable of obtaining shape information (e.g., physical parameters, shape parameters) related to the molten pool MP formed at different positions by the processing light EL deflected by the deflection optical system (galvanometer mirror 2112) and continuously moving. In this case, the measurement result of the measuring device 71 also includes information related to the size of the molten pool MP. The control device 8 can also control the shaping performed by the processing system SYS based on the shape information of the molten pool MP measured by the measuring device 71.

[0084] The measurement result of the measuring device 71 (for example, information on the size of the melt pool MP) is output to the control device 8. The control device 8 can also calculate the characteristics of the melt pool MP (for example, the size of the melt pool MP) based on the measurement result of the measuring device 71.

[0085] The measuring device 71 may be any type of measuring device as long as it can measure the workpiece W (especially the molten pool MP). For example, the measuring device 71 may also be a measuring device that can optically measure the workpiece W (especially the molten pool MP). The measuring device 71 may also be a measuring device that can measure the workpiece W (especially the molten pool MP) without contacting the workpiece W. As an example of a measuring device that can optically measure the workpiece W (especially the molten pool MP) without contacting the workpiece W, a camera that can photograph the workpiece W can be cited. In the following description, an example in which the measuring device 71 is a camera is described. In this case, the measuring device 71 generates an image of the workpiece W by photographing the workpiece W (especially, an image of the molten pool MP (including the photographed image of the molten pool MP), hereinafter referred to as a "workpiece image IW"). The workpiece image IW is output to the control device 8 as a measurement result of the measuring device 71 (that is, information related to the molten pool MP).

[0086] In addition, there may be excess material in the chamber space 63IN, including a portion of the molding material M supplied from the material nozzle 212 that is not used for molding the molded object BO. Furthermore, there may be excess material in the chamber space 63IN, including vapor (so-called smoke) of metal or the like evaporated by irradiation with the processing light EL. If such excess material adheres to the measuring device 71 disposed in the chamber space 63IN, the measuring device 71 may not be able to properly measure the molten pool MP. Therefore, the measuring device 71 may also be contained in a housing for preventing excess material from adhering to the measuring device 71, and disposed in the chamber space 63IN.

[0087] The recording device 72 is arranged in an external space 64OUT different from the chamber space 63IN. In detail, the recording device 72 is connected to the following control device. The recording device 72 can record various information input (for example, measured parameters and / or calculated parameters). The recording device 72 records at least information related to the molten pool MP. In the present embodiment, the recording device 72 can also record information related to the size of the molten pool MP and information related to the position of the molten pool MP measured by the measuring device 71 in association. The recording device 72 can also record information related to the target size of the molten pool MP in association with the deflection conditions of the processing light EL by the galvanometer mirror 2112 and the target irradiation position (target irradiation area EA). In addition to the deflection trajectory shape (swing shape), the deflection conditions of the processing light EL also include the amplitude and deflection speed of the processing light EL, the amplitude direction, etc. The recording device 72 can also record information related to the measurement object area of ​​the molten pool MP in association with the deflection conditions of the processing light EL by the galvanometer mirror 2112. The recording device 72 may also record information related to the measurement target area of ​​the molten pool MP in association with the moving direction of the irradiation position of the processing light beam by the first moving device (stage 31 and head drive system 22). The recording device 72 may also function as a storage device capable of outputting information related to the molten pool MP input in advance according to an output signal.

[0088] The recording result of the recording device 72 (for example, information on the molten pool MP) is output to the control device 8. The control device 8 may also change the control mode of the processing system SYS based on the measurement result of the measuring device 71 and the output result from the recording device 72.

[0089] The control device 8 controls the operation of the processing system SYS. For example, the control device 8 may also control the processing device 2 (for example, at least one of the processing head 21 and the head driving system 22) provided in the processing system SYS. For example, the control device 8 may also control the material supply device 1 provided in the processing system SYS. For example, the control device 8 may also control the light source 4 provided in the processing system SYS. As a result, the control device 8 may also control at least one of the processing device 2, the material supply device 1, and the light source 4 to perform the molding of the molded object BO. That is, the control device 8 may also control the molding performed by using at least one of the processing device 2, the material supply device 1, and the light source 4. The control device 8 may also control at least one of the processing device 2, the material supply device 1, and the light source 4 so that the processing device 2 performs the desired molding (specifically, performs the molding of the desired molded object BO) using the molding material M supplied from the material supply device 1 and the processing light EL supplied from the light source 4.

[0090] The control device 8 may also control the operation of the modeling system SYS based on modeling condition information (modeling parameters) that specifies the modeling conditions of the modeling system SYS for the modeling object. The modeling condition information may also be input to the control device 8 via an input device (not shown) provided by the modeling system SYS. The input device may include an operating device (for example, at least one of a keyboard, a mouse, and a touch screen) that can be operated by an operator of the modeling system SYS to input the modeling condition information. The input device may include a communication device that can receive the modeling condition information sent by a device outside the modeling system SYS. The input device may include a recording medium reading device that can read the modeling condition information recorded in a recording medium that can be externally connected to the modeling system SYS.

[0091] The control device 8 may include, for example, a computing device and a storage device. The computing device may include, for example, at least one of a CPU (Central Processing Unit) and a GPU (Graphics Processing Unit). The storage device may include, for example, a memory. The control device 8 functions as a device that controls the actions of the machining system SYS by executing a computer program through the computing device. The computer program is a computer program for causing the computing device to perform (i.e., execute) the following actions to be performed by the control device 8. In other words, the computer program is a computer program for causing the control device 8 to function so that the machining system SYS performs the following actions. The computer program executed by the computing device may be recorded in a storage device (i.e., a recording medium) provided by the control device 8, or may be recorded in any storage medium (e.g., a hard disk or a semiconductor memory) that is built into the control device 8 or can be externally connected to the control device 8. Alternatively, the computing device may also download the computer program to be executed from a device outside the control device 8 via a network interface.

[0092] The control device 8 may also control the emission pattern of the processing light EL by the irradiation optical system 211. The emission pattern may include, for example, at least one of the intensity of the processing light EL and the emission timing of the processing light EL. In the case where the processing light EL is a pulse light, the emission pattern may include, for example, at least one of the emission time of the pulse light, the emission period of the pulse light, and the ratio of the length of the emission time of the pulse light to the emission period of the pulse light (the so-called duty cycle). In addition, the emission pattern of the processing light EL by the irradiation optical system 211 is mainly determined by the emission pattern of the processing light EL by the light source 4. Therefore, controlling the emission pattern of the processing light EL by the irradiation optical system 211 may also be regarded as equivalent to controlling the emission pattern of the processing light EL by the irradiation optical system 211. That is, the control device 8 may also control the emission pattern of the processing light EL by the irradiation optical system 211 by controlling the emission pattern of the processing light EL by the light source 4. Furthermore, the control device 8 may also control the movement pattern of the processing head 21 by the head drive system 22. Furthermore, the control device 8 may also control the movement pattern of the carrier 31 by the carrier driving system 32. The movement pattern may include, for example, at least one of the movement amount, the movement speed, the movement direction, and the movement timing. Furthermore, the control device 8 may also control the supply pattern of the material nozzle 212 to the modeling material M. The supply pattern may include, for example, at least one of the supply amount (especially, the supply amount per unit time) and the supply timing. In addition, the supply pattern of the material nozzle 212 to the modeling material M is mainly determined by the supply pattern of the material supply device 1 to the modeling material M. Therefore, controlling the supply pattern of the modeling material M by the material supply device 1 may also be regarded as equivalent to controlling the supply pattern of the modeling material M by the material nozzle 212. That is to say, the control device 8 may also control the supply pattern of the modeling material M by the material nozzle 212 by controlling the supply pattern of the modeling material M by the material supply device 1.

[0093] In the present embodiment, in particular, the control device 8 may also control the operation of the processing system SYS based on the measurement result of the measuring device 71 and the recording result of the recording device 72. For example, the control device 8 may also control at least one of the processing device 2, the material supply device 1, and the light source 4 based on the measurement result of the measuring device 71 and the recording result of the recording device 72. In addition, the details of controlling the operation of the processing system SYS based on the measurement result of the measuring device 71 and the recording result of the recording device 72 will be described in detail below.

[0094] The control device 8 may not be arranged inside the processing system SYS. For example, the control device 8 may be arranged outside the processing system SYS as a server or the like. In this case, the control device 8 and the processing system SYS may be connected using a wired and / or wireless network (or a data bus and / or a communication line). As a wired network, for example, a network using an interface of a serial bus represented by at least one of IEEE1394, RS-232x, RS-422, RS-423, RS-485 and USB may be used. As a wired network, a network using an interface of a parallel bus may also be used. As a wired network, a network using an interface based on Ethernet (registered trademark) represented by at least one of 10BASE-T, 100BASE-TX and 1000BASE-T may also be used. As a wireless network, a network using radio waves may be used. As an example of a network using radio waves, a network based on IEEE802.1x (for example, at least one of wireless LAN and Bluetooth (registered trademark)) may be cited. As a wireless network, a network using infrared rays may also be used. As a wireless network, a network using optical communication may also be used. In this case, the control device 8 and the processing system SYS may also be configured to be able to send and receive various information via the network. In addition, the control device 8 may also be able to send information such as instructions or control parameters to the processing system SYS via the network. The processing system SYS may include a receiving device that receives information such as instructions or control parameters from the control device 8 via the network. The processing system SYS may also include a sending device that sends information such as instructions or control parameters to the control device 8 via the network (that is, an output device that outputs information to the control device 8). Alternatively, a first control device that performs a part of the processing performed by the control device 8 may be provided inside the processing system SYS, and on the other hand, a second control device that performs another part of the processing performed by the control device 8 may be provided outside the processing system SYS.

[0095] As a recording medium for recording the computer program executed by the control device 8, at least one of CD-ROM, CD-R, CD-RW or floppy disk, MO, DVD-ROM, DVD-RAM, DVD-R, DVD+R, DVDRW, DVD+RW and Blu-ray (registered trademark) and other optical disks, magnetic media such as magnetic tapes, magneto-optical disks, semiconductor memories such as USB memories, and other arbitrary media capable of storing programs can be used. The recording medium may include a device capable of recording a computer program (for example, a general-purpose device or a dedicated device in which a computer program is installed in a state that can be executed in at least one form such as software and firmware). Furthermore, each process or function included in the computer program can be implemented by a logic processing block implemented in the control device 8 by executing the computer program by the control device 8 (i.e., computer), or by hardware such as a predetermined gate array (FPGA, ASIC) possessed by the control device 8, or in the form of a mixture of a logic processing block and a partial hardware module that implements a part of the elements of the hardware.

[0096] (2) Operation of the machining system SYS of this embodiment

[0097] Next, the operation of the processing system SYS will be described. As described above, the processing system SYS performs a molding operation for molding the molding object BO (i.e., molding the molding object BO) by performing additive machining on the workpiece W. Furthermore, during at least a portion of the molding operation, the processing system SYS performs a molten pool information acquisition operation, which generates and records the molten pool information SI obtained by associating information related to the size of the molten pool MP and information related to the position of the molten pool MP from the recording device 72. Furthermore, the processing system SYS performs a processing light control operation, which controls the processing operation in the current processing (e.g., the intensity of the processing light EL or the processing path, etc.) based on the information related to the size of the molten pool MP read out and recorded. In addition, before performing the processing light control operation, the processing system SYS performs a control signal generation operation for generating a control signal for controlling the processing light EL. Therefore, the molding operation, the molten pool information acquisition operation, the processing light control operation, and the control signal generation operation are described in sequence below.

[0098] (2-1) Modeling Action

[0099] First, the shaping action for shaping the shaped object BO is described. As described above, the processing system SYS performs the shaping action by the laser cladding method. Therefore, the processing system SYS can also shape the shaped object BO by performing the existing additive processing action based on the laser cladding method. Hereinafter, an example of the additive processing action for shaping a three-dimensional structure ST as an example of the shaped object BO using the laser cladding method is briefly described.

[0100] The processing system SYS performs modeling of a three-dimensional structure ST on the workpiece W based on three-dimensional model data (e.g., CAD (Computer Aided Design) data) of the three-dimensional structure ST to be modeled. As the three-dimensional model data, measurement data of a solid object measured by at least one of a measuring device (e.g., measuring device 71) provided in the processing system SYS and a three-dimensional shape measuring machine provided separately from the processing system SYS can be used. The processing system SYS, for example, sequentially models a plurality of layered partial structures (hereinafter referred to as "structure layers") SL arranged along the Z-axis direction to model the three-dimensional structure ST. In addition, as described above, the structure layer SL (and further, an object constituting a part of the structure layer SL modeled in the process of modeling the structure layer SL) also corresponds to the modeled object BO. For example, the processing system SYS sequentially models a plurality of structure layers SL obtained by cutting the three-dimensional structure ST into discs along the Z-axis direction, layer by layer. As a result, a layered structure formed by stacking a plurality of structure layers SL, i.e., a three-dimensional structure ST, is modeled. The following describes the operation flow of forming the three-dimensional structure ST by sequentially forming a plurality of structure layers SL layer by layer.

[0101] First, refer to Figure 4 (a) to (e) in the figure illustrate the actions of shaping each structural layer SL. Under the control of the control device 8, the processing system SYS moves at least one of the processing head 21 and the stage 31 to set the target irradiation area EA in the desired area on the shaping surface MS corresponding to the surface of the workpiece W or the surface of the formed structural layer SL. Then, the processing system SYS irradiates the processing light EL from the irradiation optical system 211 to the target irradiation area EA. At this time, the focusing position (i.e., the focusing position) of the processing light EL can be consistent with the shaping surface MS. Alternatively, the focusing surface can also deviate from the shaping surface MS in the Z-axis direction. As a result, as shown in FIG. Figure 4 As shown in (a) of FIG. 1 , a molten pool (i.e., a pool of metal or the like melted by the processing light EL) MP is formed on the modeling surface MS irradiated with the processing light EL. Figure 4As shown in (b), the processing system SYS supplies the modeling material M from the material nozzle 212 under the control of the control device 8. As a result, the modeling material M is supplied to the molten pool MP. The modeling material M supplied to the molten pool MP is melted by the processing light EL irradiated on the molten pool MP. Alternatively, the modeling material M supplied from the material nozzle 212 may be melted by the processing light EL before reaching the molten pool MP, and the melted modeling material M is supplied to the molten pool MP.

[0102] Furthermore, the irradiation optical system 211 uses the galvanometer mirror 2112 to move the target irradiation area EA within the modeling unit area BSA. That is, the irradiation optical system 211 uses the galvanometer mirror 2112 to scan the modeling unit area BSA with the processing light EL. When the processing light EL no longer irradiates the molten pool MP as the target irradiation area EA moves, the molten modeling material M in the molten pool MP is cooled and solidified (i.e., solidified). Furthermore, as the target irradiation area EA moves, the molten pool MP also moves. As a result, as shown in FIG. Figure 4 As shown in (c), the molded object BO composed of the solidified molding material M is deposited on the molding surface MS. In addition, the molten pool MP may be formed over substantially the entire molding unit area BSA.

[0103] While the target irradiation area EA moves within the modeling unit area BSA, the modeling system SYS may also move at least one of the processing head 21 and the stage 31 so that the modeling unit area BSA moves on the modeling surface MS. In other words, the modeling system SYS may also perform the movement of the target irradiation area EA within the modeling unit area BSA and the movement of the modeling unit area BSA on the modeling surface MS in parallel.

[0104] Alternatively, during the period when the target irradiation area EA moves within the modeling unit area BSA, the modeling system SYS may not move the processing head 21 and the stage 31, so that the modeling unit area BSA does not move on the modeling surface MS. In this case, after the additive processing (i.e., modeling) within the modeling unit area BSA is completed, the modeling system SYS may also move at least one of the processing head 21 and the stage 31 to set the modeling unit area BSA in a different area on the modeling surface MS. That is, the modeling system SYS may also move at least one of the processing head 21 and the stage 31, so that the modeling unit area BSA moves on the modeling surface MS. In this case, the modeling system SYS may also move at least one of the processing head 21 and the stage 31, so that the area on the modeling surface MS where the modeling unit area BSA has been set (i.e., the area where the additive processing has been performed) is adjacent to the area on the modeling surface MS where the modeling unit area BSA is newly set (i.e., the area where the additive processing will be performed from now on). In one example, the molding system SYS may also move at least one of the processing head 21 and the stage 31 so that the area on the molding surface MS where the molding unit area BSA has been set does not overlap with the area on the molding surface MS where the molding unit area BSA is newly set. In other examples, the molding system SYS may also move at least one of the processing head 21 and the stage 31 so that the area on the molding surface MS where the molding unit area BSA has been set partially overlaps with the area on the molding surface MS where the molding unit area BSA is newly set.

[0105] like Figure 4As shown in (d), the processing system SYS moves the processing head 21 relative to the modeling surface MS in at least one of the X-axis direction and the Y-axis direction, while repeating a series of modeling processes, including forming a molten pool MP by irradiating the processing light EL, supplying the modeling material M to the molten pool MP, melting the supplied modeling material M, and solidifying the molten modeling material M. Typically, the processing system SYS repeats a scanning action, wherein the processing head 21 is moved relative to the modeling surface MS in at least one of the X-axis direction and the Y-axis direction while irradiating the processing light EL to the modeling surface MS at a desired timing, and a stepping action, wherein the processing head 21 is moved relative to the modeling surface MS in any other direction of the X-axis direction and the Y-axis direction without irradiating the processing light EL to the modeling surface MS. These actions are sometimes referred to as swinging. At this time, the processing system SYS irradiates the processing light EL to the area on the modeling surface MS where the modeling object BO is desired to be shaped during the scanning action, and on the other hand, does not irradiate the processing light EL to the area on the modeling surface MS where the modeling object BO is not desired to be shaped. That is, the processing system SYS moves the target irradiation area EA on the modeling surface MS along a prescribed moving trajectory, while irradiating the processing light EL onto the modeling surface MS at a timing corresponding to the distribution pattern of the area where the modeling object BO is to be modeled. Typically, the processing system SYS repeats a scanning action and a stepping action, wherein the scanning action irradiates the target irradiation area EA at a desired timing while moving the target irradiation area EA relative to the modeling surface MS along any one of the X-axis direction and the Y-axis direction; and the stepping action moves the target irradiation area EA relative to the modeling surface MS along any other of the X-axis direction and the Y-axis direction without irradiating the processing light EL onto the target irradiation area EA. As a result, the molten pool MP also moves on the modeling surface MS along a moving trajectory corresponding to the moving trajectory of the target irradiation area EA. Specifically, the molten pool MP is sequentially formed on the modeling surface MS in the portion irradiated with the processing light EL in the area along the moving trajectory of the target irradiation area EA. As a result, as Figure 4As shown in (e), a structural layer SL corresponding to the aggregate of the molding material M that is melted and solidified, that is, the molding object BO, is molded on the molding surface MS. That is, a structural layer SL corresponding to the aggregate of the molding object BO molded on the molding surface MS in a pattern corresponding to the moving trajectory of the molding unit area BSA is molded (that is, a structural layer SL having a shape corresponding to the moving trajectory of the molding unit area BSA when viewed from above). In addition, when the target irradiation area EA is set in an area where the molding object BO is not desired to be molded, the processing system SYS may also irradiate the target irradiation area EA with the processing light EL and stop supplying the molding material M. In addition, when the target irradiation area EA is set in an area where the molding object BO is not desired to be molded, the processing system SYS may also supply the molding material M to the target irradiation area EA and irradiate the target irradiation area EA with the processing light EL of an intensity that cannot form a molten pool MP.

[0106] The moving path (in other words, the moving trajectory) of the modeling unit area BSA can also be called a processing path (in other words, a tool path). Processing path information (processing path parameters) related to the processing path can also be included in the modeling condition information (modeling condition parameters). The processing path information can also include information (for example, coordinate information) related to the sequential setting of multiple positions of at least one of the modeling unit areas BSA. In this case, each position of at least one of the modeling unit areas BSA is also called a unit processing path. The control device 8 can also move at least one of the processing head 21 and the carrier 31 so that the modeling unit area BSA moves along the moving path specified by the processing path information. In addition, since additive processing (i.e., modeling) is performed within the modeling unit area BSA, the processing path can also refer to the path of the processing device 2 for modeling on the modeling surface MS.

[0107] The molding condition information may also include molding dimension information related to the size of the molding unit area BSA. For example, the molding dimension information may also include information related to the size of the molding unit area BSA in the X-axis direction. For example, the molding dimension information may also include information related to the size of the molding unit area BSA in the Y-axis direction. In the case where the processing path information includes information related to each position (i.e., unit processing path) for setting the molding unit area BSA as described above, the molding dimension information may also include information related to the size of the molding unit area BSA at each position (i.e., the size of each unit processing path) for setting the molding unit area BSA. In the case where the molding unit area BSA moves with the movement of at least one of the processing head 21 and the stage 31 as described above, the size of the molding unit area BSA along the moving direction of the molding unit area BSA may also be referred to as the length of the molding unit area BSA. On the other hand, the size of the molding unit area BSA along the direction intersecting the moving direction of the molding unit area BSA may also be referred to as the width of the molding unit area BSA. Since molding is performed in the molding unit area BSA, the width of the molding unit area BSA may also be referred to as the molding width. In addition, since the modeling unit area BSA moves with the movement of at least one of the processing head 21 and the stage 31, the moving direction of the modeling unit area BSA may also refer to the moving direction of at least one of the processing head 21 and the stage 31. The moving direction of the modeling unit area BSA may also be regarded as equivalent to the moving direction realized by at least one of the head driving system 22 and the stage driving system 32. The control device 8 may also control the galvanometer mirror 2112 of the irradiation optical system 211 so that the target irradiation area EA moves within the modeling unit area BSA having the size specified by the modeling size information. In addition, since additive processing (i.e., modeling) is performed within the modeling unit area BSA, the processing path may also refer to the path of the processing device 2 for modeling on the modeling surface MS. In addition, the modeling condition information may also include a modeling unit area shape related to the shape of the modeling unit area BSA.

[0108] In addition, as software capable of creating a general processing path (tool path), there is known software capable of inputting the molding width of one line. In this case, the control device 8 may also obtain information related to the molding width input using such software, and control the galvanometer mirror 2112 based on the acquired information related to the molding width. The control device 8 may also obtain information related to the molding width input using such software, and control the galvanometer mirror 2112 based on the acquired information related to the molding width so that each dimension of the molding unit area BSA (especially, the dimension in the direction intersecting the moving direction of the molding unit area BSA) is consistent with the molding width. The control device 8 may also obtain information related to the molding width input using such software, and control the galvanometer mirror 2112 based on the acquired information related to the molding width so that each dimension of the molding unit area BSA (especially, the dimension in the direction intersecting the moving direction of the molding unit area BSA) is consistent with the dimension determined according to the molding width.

[0109] The processing system SYS, under the control of the control device 8, repeatedly performs the operation for shaping the structure layer SL based on the three-dimensional model data. Specifically, first, before performing the operation for shaping the structure layer SL, the control device 8 slices the three-dimensional model data at the layer pitch to create slice data. The processing system SYS performs the operation for shaping the first structure layer SL#1 on the shaping surface MS corresponding to the surface of the workpiece W based on the slice data corresponding to the structure layer SL#1. As a result, on the shaping surface MS, for example, Figure 5 As shown in (a), the structure layer SL#1 is shaped. Then, after the processing system SYS sets the surface (i.e., the upper surface) of the structure layer SL#1 as the new modeling surface MS, the second structure layer SL#2 is shaped on the new modeling surface MS. In order to shape the structure layer SL#2, the control device 8 first controls at least one of the head drive system 22 and the stage drive system 32 so that the processing head 21 moves along the Z axis relative to the stage 31. Specifically, the control device 8 controls at least one of the head drive system 22 and the stage drive system 32 to move the processing head 21 toward the +Z side and / or to move the stage 31 toward the -Z side so as to set the target irradiation area EA on the surface (i.e., the new modeling surface MS) of the structure layer SL#1. Then, under the control of the control device 8, the processing system SYS shapes the structure layer SL#2 on the structure layer SL#1 based on the slice data corresponding to the structure layer SL#2 through the same action as that for shaping the structure layer SL#1. As a result, for example, Figure 5 As shown in (b), the structure layer SL#2 is formed. After that, the same operation is repeated until all the structure layers SL constituting the three-dimensional structure ST to be formed on the workpiece W are formed. As a result, for example, Figure 5 As shown in (c), a three-dimensional structure ST is formed by stacking a plurality of structural layers SL. In addition, the plurality of structural layers SL may be integrated with each other when forming the three-dimensional structure ST (in other words, there may be no boundaries between the plurality of structural layers SL in the three-dimensional structure).

[0110] Next, the processing path during the shaping of the present embodiment is described. In the present embodiment, as an example, the following situation is described: Figure 6 (c) or Figure 8 (c) Fig.10 As shown in FIG. 1 and FIG. 2 , the structural layer SL having a shape long in the Y-axis direction is formed. Figure 6 (a) is a plan view showing the moving trajectory of the target irradiation area EA in the formation unit area BSA. Figure 6 (b) is a plan view showing an example of combining the movement of the target irradiation area EA and the movement of the processing head 21 / stage 31 to perform operations. Figure 6 (c) means to carry out Figure 6 Schematic diagram of the area where the object BO is formed during the operation shown in (b). When performing the shaping, the control device 8, for example, Figure 6 (a) or Fig.10 As shown in the figure, at least one of the processing head 21 and the stage 31 is moved in such a way that the moving trajectory MT0 of the modeling unit area BSA on the modeling surface MS becomes a linear moving trajectory along the Y-axis of the modeling surface MS. In addition, the control device 8 controls the galvanometer mirror 2112 of the irradiation optical system 211 so that within the modeling unit area BSA, the target irradiation area EA moves at least in a direction intersecting with the moving direction of the modeling unit area BSA. At this time, the width of the modeling unit area BSA becomes the weld bead width. The galvanometer mirror 2112, which functions as a deflection optical system, can move the irradiation position of the processing light EL on the modeling surface MS on the modeling surface MS by deflecting the processing light EL. In other words, the control device 8 can also control the galvanometer mirror 2112 so that within the modeling unit area BSA, the target irradiation area EA moves at least in a direction intersecting with the moving trajectory MT0 of the modeling unit area BSA. In this case, the shape of the modeling unit area BSA can also be a rectangular shape with the moving direction of the target irradiation area EA (i.e., the direction intersecting with the moving trajectory MT0) as the length direction. In addition, Figure 6 (a) shows an example in which the shaping unit area BSA is a rectangular area. In this case, the size of the shaping unit area BSA in the X-axis direction (i.e., the moving direction of the shaping unit area BSA) can be the same as the spot width of the processing light EL, and the size of the shaping unit area BSA in the moving direction can also be regarded as substantially zero.

[0111] Furthermore, if Figure 6 As shown in (b), by moving at least one of the processing head 21 and the stage 31, the molding unit area BSA is linear (in Figure 6 In the example shown in (b), the Figure 6 In the example shown, the molding unit area BSA has the same pattern (period, amplitude). Therefore, by the relative movement of the galvanometer mirror 2112 and at least one of the processing head 21 and the stage 31, it is ideal that the movement of the target irradiation area EA based on the movement of the galvanometer mirror 2112 is sufficiently faster than the speed of moving at least one of the processing head 21 and the stage 31, such as Figure 6 As shown in (c), the molten pool MP is uniformly formed in a rectangular area having a width equal to the width dimension of the modeling unit area BSA in the X direction from position P1 to position P2 (molten pools are formed sequentially). Figure 6 The shaped object BO is formed in the rectangular area shown in (c). At this time, the wavy trajectory of the molten pool MP can also be formed in the XY plane by controlling the speed or increasing or decreasing the speed. The wavy trajectory can be a triangle wave, a cosine wave, a sine wave, etc.

[0112] Figure 7 An example of a workpiece image is shown. Figure 7 The width of the molten pool MP is equivalent to Figure 6 The width of the modeling unit area BSA (weld bead width) in (b). That is, Figure 7 The image is a captured image of a workpiece image when an amplitude action is performed with the width of the modeling unit area BSA (weld bead width). In the following description, the amplitude refers to the amplitude along the X direction. In the processing system SYS, a measuring device 71 is used to obtain the image of the workpiece. Figure 7 Information on the size of the melt pool MP and the like (melt pool information) is acquired from the image shown. A method of acquiring the melt pool information using the measuring device 71 will be described below.

[0113] As another example, a processing path when processing is performed while changing the width of the formation unit area BSA in the formation of this embodiment using the galvanometer mirror 2112 will be described. Figure 8 (a) is a plan view showing the movement trajectory of the target irradiation area EA when the width of the formation unit area BSA in the X direction is changed. Figure 8 Each figure of (a) shows, for example, the movement trajectory of the target irradiation area EA at different positions in the Y direction. That is, it shows that when the processing head 21 / stage 31 is moved in the Y direction, the width in the X direction changes with the passage of time. Figure 8(b) is a plan view showing an example of moving the processing head 21 / stage 31 in the Y direction while changing the width of the formation unit area BSA in the X direction. Figure 8 (c) means to carry out Figure 8 Schematic diagram of the area where the object BO is formed during the operation shown in (b). In addition, when the processing head 21 / stage 31 is moved in the Y direction while changing the width in the X direction, the Figure 8 It can be changed continuously as shown in (c) or in stages. Figure 6 Similarly, when shaping, the control device 8 controls the galvanometer mirror 2112 of the irradiation optical system 211 so that Figure 8 As shown in (a), within the modeling unit area BSA, the target irradiation area EA moves at least in a direction intersecting the moving direction of the modeling unit area BSA. At this time, the width (weld bead width) of the target irradiation area EA can also be changed. In other words, the width (weld bead width) of the modeling unit area BSA in the X direction can be set to change. In this case, the width (weld bead width) of the target irradiation area EA at each time during modeling changes sequentially, so the shape of the modeling object BO can also be Figure 6 Shapes other than the rectangle shown.

[0114] like Figure 8 As shown in (b), by moving at least one of the processing head 21 and the stage 31, the molding unit area BSA is linear (in Figure 8 In the example shown in (b), the Figure 8 In the example shown, while the target irradiation area EA is relatively moved in the Y direction by at least one of the processing head 21 and the stage 31, the pattern ( Figure 8 In the example, the amplitude) changes sequentially. As an example, for example, Figure 8 As shown in (b), the bead width can be gradually increased from position P1 toward position P2, and the bead width can be gradually decreased from position P2 toward position P3. Figure 8 As shown in (c), it is ideal that (when the moving speed of the target irradiation area EA based on the galvanometer mirror 2112 is sufficiently faster than the speed of moving at least one of the processing head 21 and the stage 31), the molten pool MP is uniformly formed from the position P1 to the position P3 (the molten pools MP are formed sequentially). Figure 8 As shown in (c), the object BO can be formed in a region having arc-shaped sides with smoothly changing width dimensions, for example, by cutting off both ends of an elliptical shape. Figure 8 In the description, an example is given of continuously changing the bead width during modeling, but the bead width may also be changed in a stepwise (stage-wise) manner.

[0115] Fig. 9 (a) is a top view showing the moving trajectory of the target irradiation area EA when the moving speed of the target irradiation area EA is sufficiently fast relative to the moving speed of the processing head 21 / stage 31. In addition, Fig. 9 The multiple circular marks in each figure represent the target irradiation area EA. Fig. 9 In each of the figures, it is shown that the position of the target irradiation area EA changes from right to left (X direction) as time passes. Fig. 9 (b) is a plan view showing the moving trajectory of the target irradiation area EA when the moving speed of the target irradiation area EA is moderately faster than the moving speed of the processing head 21 / stage 31 . Fig. 9 (c) is a top view showing the moving trajectory of the target irradiation area EA when the moving speed of the target irradiation area EA is slower than the moving speed of the processing head 21 / stage 31. Fig. 9 Compared with (a), Fig. 9 In (b) and (c) of FIG. 1 , the trajectory of the galvanometer mirror 2112 in one outward path when it moves back and forth in the X direction once contains more Y-direction components. As described above, the target irradiation area EA moves in the molding unit area BSA while at least one of the processing head 21 and the stage 31 is moved. Therefore, when the moving speed of the target irradiation area EA based on the galvanometer mirror 2112 is sufficiently faster than the speed of moving at least one of the processing head 21 and the stage 31 (refer to Fig. 9 (a)), the target irradiation area EA can be regarded as moving along the X direction. On the other hand, if the moving speed of the target irradiation area EA based on the galvanometer mirror 2112 is close to the speed of moving at least one of the processing head 21 and the stage 31 (refer to Fig. 9 If (b) or (c) is used in the figure, the trajectory of the galvanometer mirror 2112 in the outward path during one round trip in the X direction contains more Y-direction components. By adjusting (setting) the relative moving speed of the target irradiation area EA relative to the moving speed of at least one of the processing head 21 and the stage 31 in this way, the molten pool MP in the area where the molded object BO is formed can be made uniform. For example, by making the target irradiation area EA Fig. 9 The moderate relative speed movement shown in (b) can form Fig.10 The molten pool MP (molded object BO) of the shape shown, Fig.10 Schematic diagram showing the trajectory of the laser beam irradiating the object BO.

[0116] As described above, the control device 8 can move at least one of the processing head 21 and the stage 31 while the target irradiation area EA is moved within the molding unit area BSA using the galvanometer mirror 2112, so that the molding unit area BSA moves on the molding surface MS. As a result, the target irradiation area EA moves along the molding unit area BSA and the molding unit area BSA itself on the molding surface MS. Fig.11 The target irradiation area EA moves along the moving trajectory MT shown. Specifically, the target irradiation area EA moves along the moving trajectory MT0 of the modeling unit area BSA while moving along the direction intersecting the moving trajectory MT0. That is, the target irradiation area EA moves along the moving trajectory MT of the waveform that vibrates around the moving trajectory MT0. In the following description, the shape of the trajectory of the processing light EL deflected and scanned by the galvanometer mirror 2112 is sometimes referred to as a swinging shape. The recording device 72 can also record the swinging shape. In addition, in the example described, the case where the swinging shape is a waveform is described, but for example, modeling can also be performed by scanning the processing light EL in a manner that the swinging shape becomes a circle. In addition, the action of deflecting and scanning the processing light EL on the modeling surface MS by the galvanometer mirror 2112 can also be referred to as swinging.

[0117] For example, Fig.12 is a top view showing an example of the moving trajectory of the target irradiation area EA within the modeling unit area BSA, and can also be shown as Fig.12 As shown, at least a portion of the moving trajectory of the target irradiation area EA in the formation unit area BSA is located between two adjacent partial trajectories constituting the moving trajectory of the target irradiation area EA in the formation unit area BSA. Fig.12 In the embodiment, the control device 8 gradually changes the moving trajectory of the target irradiation area EA while repeating the action of moving the target irradiation area EA back and forth once along the X-axis direction for multiple times. As a result, the target irradiation area EA moves back and forth for multiple times along the X-axis direction, and the shape of the modeling unit area BSA where the target irradiation area EA moves is as follows: Fig.12 As shown, it can also be considered as the same as a rectangular shape. In this way, by adjusting the movement trajectory of the target irradiation area EA, the control device 8 can make the shape of the formation unit area BSA a desired shape.

[0118] in addition, Fig.13 FIG. 1 is a top view showing another example of the moving trajectory of the target irradiation area EA within the modeling unit area BSA. Fig.13As shown, the control device 8 may also control the galvanometer mirror 2112 so that the target irradiation area EA moves in a single direction within the modeling unit area BSA. In particular, the control device 8 may also control the galvanometer mirror 2112 so that the target irradiation area EA moves back and forth at least once (or repeatedly in some cases) in a single direction within the modeling unit area BSA. In this case, the shape of the modeling unit area BSA to which the target irradiation area EA moves may also be a rectangular shape in which the moving direction of the target irradiation area EA becomes the length direction. Fig.13 In the example shown, the target irradiation area EA repeatedly moves back and forth along the X-axis direction. In this case, the shape of the formation unit area BSA may be a rectangular shape with the X-axis direction as the longitudinal direction.

[0119] As another example, Fig.14 FIG. 1 is a top view showing another example of the moving trajectory of the target irradiation area EA within the modeling unit area BSA. Fig.14 As shown, the control device 8 may also move the target irradiation area EA in multiple directions so that the moving trajectory of the target irradiation area EA in the molding unit area BSA becomes a circular moving trajectory. In this case, the control device 8 may also control the galvanometer mirror 2112 so that in the coordinate system with the center of the molding unit area BSA as the origin, the X coordinate X of the target irradiation area EA at time t is expressed by the formula "X = A × sin (2π × f × t + α)", and the Y coordinate Y of the target irradiation area EA at time t is expressed by the formula "Y = A × cos (2π × f × t + α)". In addition, "f" in the formula represents the number of round trips of the target irradiation area EA (i.e., frequency), "A" represents the amplitude equivalent to half the amount of round trip movement of the target irradiation area EA, and "α" represents the phase amount, which represents the initial position of the target irradiation area EA in each direction of the X-axis direction and the Y-axis direction. At least one of f, A and α may also be specified by the operator of the molding system SYS.

[0120] The recording device 72 may also record the scanning direction and scanning position of the processing light EL. In this case, for example, the swing shape or the change in the scanning direction and scanning position may be recorded in correspondence with the current position of the object (which may include the current irradiation position and position coordinates of the processing light EL) or the elapsed time from the start of the formation.

[0121] As another example, the control device 8 moves at least one of the processing head 21 and the stage 31 so that Fig.11 As shown in FIG. 1 , the movement trajectory MT0 of the modeling unit area BSA on the modeling surface MS becomes a curved movement trajectory along the modeling surface MS. Fig.11The moving trajectory MT0 of the molding unit area BSA on the molding surface MS is shown. In this case as well, the galvanometer mirror 2112 can be controlled so that the target irradiation area EA moves at least in a direction intersecting the moving direction of the molding unit area BSA within the molding unit area BSA. In addition, the target irradiation area EA can also move along the moving trajectory MT of the waveform that vibrates around the moving trajectory MT0.

[0122] In addition, the movement trajectory MT0 can also be a tool path created by slicing software. Fig.11 The amplitude, frequency, pattern, etc. of the movement trajectory MT shown may also be input by the operator. These may also be automatically determined based on the formation width information input by the operator.

[0123] In addition, the moving center MTC1 of the target irradiation area EA may also refer to the amplitude center of the moving trajectory MT of the waveform of the target irradiation area EA on the modeling surface MS. In other words, the moving center MTC1 of the target irradiation area EA may also refer to the center of the vibration when the moving trajectory MT of the target irradiation area EA on the modeling surface MS is assumed to be a vibration.

[0124] In the case where the moving center MTC1 moves outwardly away from the moving center MTC0, the control device 8 may also shorten the period of the moving trajectory of the processing light EL corresponding to the moving center MTC1 moving outwardly away from the moving center MTC0, compared with the case where the moving center MTC1 is consistent with the moving center MTC0. That is, the control device 8 may also shorten the period of the moving trajectory MT of the target irradiation area EA corresponding to the moving center MTC1 moving outwardly away from the moving center MTC0. In addition, when the processing light EL periodically moves back and forth within the modeling unit area BSA (that is, the target irradiation area EA periodically moves back and forth), the period of the moving trajectory of the processing light EL (that is, the period of the moving trajectory MT of the target irradiation area EA) may also be regarded as equivalent to the time required for the processing light EL to make one round trip (that is, the time required for the target irradiation area EA to make one round trip).

[0125] (2-2) Molten pool information acquisition operation

[0126] Next, refer to Figure 7 and Figures 15 to 20 , the molten pool information acquisition operation performed by the processing system SYS during at least a portion of the period of the modeling operation is described. In addition, typically, the processing system SYS performs the molten pool information acquisition operation in parallel with the modeling operation. If roughly divided, the molten pool information acquisition operation includes a photographing operation and an image processing operation of performing image processing on the photographed workpiece image IW. The following describes them one by one.

[0127] (2-2-1) Shooting Action

[0128] The measuring device 71 includes a camera 80 (see Figure 1 ). The camera 80 is arranged at a position away from the optical path of the processing light EL irradiated from the processing head 21 (especially, the irradiation optical system 211) to the workpiece W. As a result, even if the camera 80 is installed in the processing head 21, the processing light EL will not be blocked by the camera 80. That is, even if the camera 80 is installed in the processing head 21, the processing light EL can be properly irradiated to the workpiece W. In addition, the camera 80 is arranged at a position away from the supply path of the molding material M supplied from the processing head 21 (especially, the material nozzle 212) to the workpiece W. As a result, even if the camera 80 is installed in the processing head 21, the molding material M will not be blocked by the camera 80. That is, even if the camera 80 is installed in the processing head 21, the molding material M is properly supplied to the workpiece W. The camera 80 can be installed in the processing head 21 at any position. In addition, the optical path of the camera 80 (measuring device 71) may overlap with a portion of the optical path of the processing light EL, and may overlap with a portion of the supply path of the molding material M.

[0129] In addition, the state of "the camera 80 is mounted on the processing head 21" in this embodiment may also include the state of "the camera 80 is aligned with respect to the processing head 21 in a manner that the camera 80 is in physical contact with the processing head 21". The state of "the camera 80 is mounted on the processing head 21" may also include the state of "the camera 80 is aligned with respect to the processing head 21 in a manner that the camera 80 is not in physical contact with the processing head 21". The same is true for the state of "the control device 8 is mounted on the processing system SYS".

[0130] The camera 80 is used to photograph the molten pool MP formed on the workpiece W. Here, when the camera 80 is mounted on the processing head 21 as described above, the camera 80 and the processing head 21 may be aligned in the following manner, that is, when the camera 80 is mounted on the processing head 21, at least a portion of the workpiece W (especially, at least a portion of the molten pool MP formed on the workpiece W) is included in the photographing range of the camera 80. In this case, the camera 80 moves together with the processing head 21, so even if the head driving system 22 moves the processing head 21, at least a portion of the molten pool MP formed on the workpiece W is included in the photographing range of the camera 80. That is, the photographing range of the camera 80 can substantially follow at least a portion of the molten pool MP that the camera 80 should photograph. In order to photograph at least a portion of the molten pool MP, the camera 80 may also be provided with a camera device, a reflector, a housing, etc. In addition, the photographing range may include a molding projection area or a molding unit area BSA, etc.

[0131] The camera 80 is a camera capable of photographing the molten pool MP. Specifically, the camera 80 includes an imaging element that receives light from at least a portion of the molten pool MP. In the following description, the light from at least a portion of the workpiece W is referred to as "workpiece light WL". The camera 80 photographs at least a portion of the workpiece W (in particular, at least a portion of the molten pool MP) by receiving (i.e., detecting) the workpiece light WL using the imaging element. As a result, the measuring device 71 generates a workpiece image WI in which the molten pool MP is photographed.

[0132] The camera 80 captures at least a portion of the workpiece W (particularly, at least a portion of the molten pool MP). Figure 7 As shown, at least a portion of the workpiece W (especially, at least a portion of the molten pool MP) is captured in the workpiece image WI. Here, typically, the intensity of the workpiece light WL from the portion of the workpiece W where the molten pool MP is formed is higher than the intensity of the workpiece light WL from the portion of the workpiece W where the molten pool MP is not formed. Therefore, the intensity difference of the workpiece light WL appears as a brightness difference (typically a grayscale difference) on the workpiece image WI, for example. Therefore, the control device 8 can relatively easily identify the portion of the workpiece image WI where the molten pool MP is captured (the molten pool MPI on the image) based on the brightness (grayscale) of the workpiece image WI.

[0133] For example, the control device 8 can specify the image portion in the workpiece image WI where the brightness is higher than a predetermined threshold as the portion in the workpiece image WI where the molten pool MP is photographed. Then, the control device 8 calculates information related to the size of the molten pool MP based on the size (e.g., number of pixels) of the image of the portion in the workpiece image WI where the molten pool MP is photographed. In addition, sometimes the size of the molten pool MP actually formed on the workpiece is not necessarily the same as the measurement result. In this case, the matching of the measurement result (i.e., the molten pool MPI on the image) and the actual molten pool MP can also be obtained by adding appropriate corrections.

[0134] As the size of the molten pool MP, the number of pixels constituting the workpiece image WI (or a value determined according to the number of pixels (for example, a value proportional to the number of pixels), the same applies hereinafter). For example, in the case where the size of the molten pool MP along a specified direction is used as the information related to the size of the molten pool MP as described above, the number of pixels (the number of pixels) in the workpiece image WI whose brightness is higher than a specified threshold and arranged along a specified direction may be used as the information related to the size of the molten pool MP. In the case where the area of ​​the molten pool MP is used as the size of the molten pool MP as described above, the number of pixels in the workpiece image WI whose brightness is higher than a specified threshold may be used as the information related to the size of the molten pool MP.

[0135] Furthermore, when the workpiece image WI is a color image, information on the size of the melt pool MP may be measured using color differences. Furthermore, when the workpiece image WI is a color temperature image, information on the size of the melt pool MP may be measured using color temperature differences.

[0136] In addition, as described above, the processing light EL is irradiated onto the workpiece W. Therefore, the processing light EL (for example, the processing light EL reflected by the workpiece W) passing through the workpiece W may be incident on the imaging element of the camera 80. Here, the intensity of the processing light EL is set to an intensity that can melt the workpiece W. Therefore, if the processing light EL passing through the workpiece W is incident on the imaging element of the camera 80, there is a possibility that the imaging element will malfunction due to the processing light EL. Therefore, the camera 80 may also be configured to prevent the processing light EL from the workpiece W from being incident on the imaging element. For example, the camera 80 may also be provided with an optical element that prevents the processing light EL from the workpiece W from being incident on the imaging element. As an example of such an optical element, a filter having a relatively low transmittance for the processing light EL but a relatively high transmittance for the workpiece light WL can be cited. As an example of such an optical element, a filter having a relatively high absorptivity for the processing light EL but a relatively low absorptivity for the workpiece light WL can be cited.

[0137] The camera 80 may further include a cooling device for cooling the camera 80 , a removal mechanism for preventing excess matter from being attached and removing excess matter, and the like.

[0138] The control device 8 controls the operation of the machining system SYS based on the workpiece image WI generated by the measuring device 71. For example, the control device 8 may generate characteristic information related to the characteristics of the molten pool MP based on the workpiece image WI, and control the operation of the machining system SYS based on the characteristic information. In this case, the control device 8 may also function as a characteristic information generating device capable of generating characteristic information.

[0139] Specifically, the control device 8 may also measure the size of the molten pool MP captured in the workpiece image WI, and control the operation of the processing system SYS based on the measurement result and the target size of the molten pool MP formed by the processing system SYS. In this case, the measured size of the molten pool MP may be set as the target size. Alternatively, the target size of the molten pool MP may be set based on the condition for deflecting the processing light EL, that is, the deflection condition of the galvanometer mirror 2112. The target size of the molten pool MP may also be changed whenever the deflection condition changes. Then, the control device 8 may also set the target intensity of the processing light EL generated by the light source 4 based on the set size of the molten pool MP. In this case, the control device 8 may also set content other than the target intensity of the processing light EL generated by the light source 4.

[0140] For example, when the calculated size of the molten pool MP is smaller than the target size (that is, the size of the molten pool MP already recorded in the recording device 72), the control device 8 may also reset the target intensity greater than the target intensity of the processing light EL. In this case, the intensity of the processing light EL irradiated onto the workpiece W becomes greater than before the new target intensity is set, and therefore, the amount of the melted modeling material M becomes greater. As a result, the measured size of the molten pool MP becomes larger in a manner close to the target size than before the new target intensity is set.

[0141] For example, when the calculated size of the molten pool MP is larger than the target size, the control device 8 may reset the target intensity to be smaller than the reference value of the target intensity. In this case, the intensity of the processing light EL irradiated on the workpiece W becomes smaller than before the new target intensity is set, and thus the amount of the melted modeling material M becomes smaller. As a result, the size of the molten pool MP becomes smaller in a manner close to the target size than before the new target intensity is set.

[0142] For example, when the calculated size of the molten pool MP is consistent with the target size, the target intensity may be maintained as the reference value. That is, the control device 8 may continue to directly set the reference value of the target intensity as the target intensity. In this case, the intensity of the processing light EL irradiated on the workpiece W can be maintained, so the amount of the melted modeling material M does not change. As a result, the size of the molten pool MP consistent with the target size can be maintained.

[0143] The control device 8 may also change the target size of the molten pool MP based on the information related to the target size of the molten pool MP associated with the deflection condition of the processing light EL by the galvanometer mirror 2112 recorded in the recording device 72. In addition, the control device 8 may also record the target size of the molten pool MP corresponding to each swing shape of the processing light EL generated by the galvanometer mirror 2112 recorded by the recording device 72. In this case, the target size of the molten pool MP may also be changed according to the change of the swing shape. In addition, the control device 8 may also record the target size of the molten pool MP corresponding to each scanning direction or each scanning position of the processing light EL recorded by the recording device 72. In this case, the target size of the molten pool MP may also be changed according to the change of the scanning direction or scanning position of the processing light EL.

[0144] The control device 8 may also refer to the information recorded in the recording device 72 (including information related to the size of the molten pool MP or polarization information, position information, etc. of the processing light EL), and determine the change amount of at least one of the swing shape of the processing light EL, the scanning direction of the processing light EL, and the scanning position of the processing light EL based on the information recorded in the recording device 72 and the processing information of the object being molded. Determining the change amount includes calculating the information difference between the information recorded in the recording device 72 and the processing information of the object being molded, and comparing the size of the calculated difference with a threshold. The threshold may be set in advance by the user, or may be automatically generated based on a learning model obtained by, for example, machine learning. When these changes exceed the threshold, the control device 8 may also update the target size of the molten pool MP. In this case, the determination of the change amount of at least one of the swing shape of the processing light EL, the scanning direction of the processing light EL, and the scanning position of the processing light EL may also be performed automatically by the control device 8. That is to say, the control device 8 can also automatically determine the change in at least one of the swing shape of the processing light EL, the scanning direction of the processing light EL, and the scanning position of the processing light EL based on the information recorded in the recording device 72 and the processing information of the object being molded, and update the target size of the molten pool MP based on the determined change.

[0145] (2-2-2) Image processing operations

[0146] The operation of performing image processing on the workpiece image WI captured by the camera 80 when measuring the size of the molten pool MP will be described in detail. Figure 7 As shown, in the captured workpiece image WI, in addition to the captured object, namely the molten pool MP, a plurality of spatters SP generated by the continuous switching action of the galvanometer mirror 2112 are also captured. The spatters SP are formed by irradiating the flying powder before reaching the molten pool MP with laser light, so that the flying powder is melted and emits light, or the molten metal that rebounds and splashes from the molten pool MP is observed to be formed in a portion other than the molding surface. For example, when the powder or laser is irradiated in the downward direction of the Z direction, the spatters SP are observed above the molten pool MP in the Z direction. The shape of the molten pool MP and the shape of the spatters SP change at any time depending on the processing conditions. Since the information of the spatters SP is not required when measuring the size of the molten pool MP, the control device 8 performs image processing for detecting only the molten pool MP from the captured workpiece image WI. In the present embodiment, the following image processing is performed, that is, a plurality of workpiece images WI captured at different times (that is, different shutter frames of the camera) are added together, and the portion whose brightness is displayed higher than the specified threshold is regarded as the molten pool MP. Specifically, in Fig.15In the example shown, four workpiece images WI (frames 1 to 4) taken continuously under the same or close processing conditions (layers of the object or characteristics of the processing light EL, scanning direction, etc.) can also be added. In this case, frames 1 to 4 can be, for example, continuous frames taken in a short period of time, or workpiece images WI in non-continuous frames can be used. The number of workpiece images WI to be added is not limited to 4. Then, the added image ( Fig.15 The control device 8 can also measure the size of the melt pool MP by measuring the number of pixels in the high brightness area, that is, the area judged as the melt pool MP in the added image.

[0147] In addition, "addition" may also refer to adding the signal values ​​at the same position of different frames. In addition, "addition" may also refer to "arithmetic mean". In this case, the value obtained by dividing the pixel value of each frame by the number of frames (appropriately increased or decreased) may be added, or the pixel value of each frame may be added and then divided by the number of frames (appropriately increased or decreased). In the case of 10 frames, 1 / 10 of the pixel value may be added, or it may be added and then divided by 10. The molten pool MP may also be obtained by moving average. For example, in the case of adding 10 frames, the frames may be buffered in sequence in advance, and the frames may be added in a manner such that the first frame is the 1st to 10th frames, the second frame is the 2nd to 11th frames, and the third frame is the 3rd to 12th frames, instead of adding frames 1 to 10 for the first frame and frames 11 to 20 for the next second frame.

[0148] In addition, for example, Fig.16 1 is an explanatory diagram showing an example of a method for detecting a molten pool MP (MPI) from a workpiece image WI. Fig.16 As shown, the addition can also be performed in a manner that the frame rate remains unchanged. For example, when 10 frames are added at 60fps, the added value of frames 1 to 10 can be obtained as the first data (refer to Fig.16 ), the sum of frames 2 to 11 is obtained as the second data (refer to Fig.16 The sum of frames 3 to 12 is obtained as the third data (refer to Fig.16 In this case, the interval between the first data and the second data is every 1 / 60 second, and the interval between the second data and the third data is also every 1 / 60 second, so the frame rate does not change.

[0149] As an image processing method for detecting only the melt pool MP from the captured workpiece image WI, for example, image processing may be performed to detect only the melt pool MP by removing the spatter SP from the captured workpiece image WI.

[0150] Furthermore, it is also possible to effectively utilize the information removed in the above-mentioned image processing method (the information of the sputtered matter SP in the added image) to perform more accurate processing control. Fig.17 (a) to (c) in the figure show that in the present embodiment where the swing shape is a waveform, a plurality of added images ( Fig.15 Image processing method when the cumulative threshold of the frame sum (i.e., the brightness threshold when the image is added) is set. Fig.17 In each of the graphs (a) to (c), the horizontal axis of the curve graph represents the grayscale of the image. The grayscale is lower as it moves to the left (closer to black), and higher as it moves to the right (closer to white). The vertical axis represents the number of pixels corresponding to the grayscale. Fig.17 (a) shows the relationship between the gray level and the number of pixels before modeling. Fig.17 (b) shows the relationship between the gray level and the number of pixels during modeling. Fig.17 (c) shows the relationship between the gray level and the number of pixels after the cumulative threshold of the molten pool MP is shifted. Fig.17 As shown in (a), the cumulative threshold 81 of the molten pool when the swing shape is set to a waveform can be pre-set. In this case, image processing (feedback processing) can be performed so that the peak value PK1 of the number of pixels during molding is consistent with the set cumulative threshold 81. At this time, the range of the cumulative threshold that can be molded (hereinafter referred to as the moldable range 82) can be set on both sides of the cumulative threshold 81. In this embodiment, the moldable range 82 is set on both sides of the cumulative threshold 81, but the moldable range 82 can also be set only on one side of the cumulative threshold 81. The size of the moldable range 82 can also be different on one side and the other side of the cumulative threshold 81.

[0151] When you start styling, Fig.17 As shown in (b), in the region where the gray level is lower than the cumulative threshold 81, the second peak PK2 appears due to the increase of sputtering SP. Fig.17 When the processing conditions shown in (b) are used, the intensity of the processing light EL is high enough to generate sputtering. Fig.17 As shown in (c), a new offset cumulative threshold 84 can be reset on the side with a lower grayscale level relative to the initially set cumulative threshold 81 and within the moldable range 82. In this case, according to the new offset cumulative threshold 84, the peak PK1 is shifted to the side with a lower grayscale level as a whole. As a result, the influence of the sputtering material SP can be suppressed to a lower level and only the molten pool MP can be detected. In addition, in this case, the generation information of the sputtering material SP can also be fed back to the processing conditions. For example, the control device 8 can also be changed to a processing condition that generates less sputtering material SP.

[0152] As another example, Fig.17(d) to (f) in FIG. 1 represent the image processing method when the swing shape is set to a circle. The basic image processing method is the same as that described above. Fig.17 The image processing is the same when the swing shape shown in (a) to (c) is a waveform. Fig.17 (d) represents the relationship between the gray level and the number of pixels before modeling. Fig.17 (e) represents the relationship between the gray level and the number of pixels during modeling. Fig.17 (f) shows the relationship between the gray level and the number of pixels after the cumulative threshold of the molten pool MP is shifted. Fig.17 As shown in (d), in this case, image processing (feedback processing) can be performed so that the peak PK11 coincides with the side where the grayscale level is reduced by a predetermined value relative to the preset cumulative threshold 85. In addition, at this time, the range of the cumulative threshold that can be shaped (hereinafter referred to as the shapeable range 86) can be set on both sides of the cumulative threshold 85. The shapeable range 86 can also be set only on one side of the cumulative threshold 85. The size of the shapeable range 86 can also be different on one side of the cumulative threshold 85 and the other side.

[0153] When you start styling, Fig.17 As shown in (e), in the region where the gray level is lower than the cumulative threshold 85, the second peak PK12 appears due to the increase of sputtering SP. Fig.17 When the processing conditions shown in (e) are used, the intensity of the processing light EL is high enough to generate sputtering. Fig.17 As shown in (f), a new offset cumulative threshold 88 can be reset to a lower gray level side relative to the initially set cumulative threshold 85 and within the moldable range 86. In this case, the peak PK11 is shifted to a lower gray level side as a whole according to the new offset cumulative threshold 88. Thus, the influence of the sputtering SP can be suppressed to a low level and only the molten pool MP can be detected.

[0154] Furthermore, processing for speeding up image processing may also be performed simultaneously. The control device 8 may control the processing (molding) of the processing system SYS based on the measurement result of the measuring device 71, and change the measurement target area 100 of the molten pool MP by the measuring device 71 based on the deflection condition, i.e., the condition for deflecting the processing light EL. The control device 8 may also measure the size of the molten pool MP based on the image information of the molten pool MP located in the measurement target area 100.

[0155] Fig.18 (a) and Fig.18 (b) shows a workpiece image in the prior art. Fig.18 (a) and Fig.18In (b), the case where the molten pool MP is photographed obliquely relative to the molded object is used as an example for explanation. Specifically, when the molding direction is set to the first direction, the camera 80 (camera) can photograph the molten pool MP along the second direction opposite to the first direction. In other words, the molten pool MP can be photographed from an oblique direction opposite to the molding direction. Fig.18 (a) shows a workpiece image IW of a central portion (midway portion of a straight line) in a series of machining paths along the first direction. Fig.18 (b) shows a workpiece image IW of a corner (the last part of a straight line) in a series of processing paths along the first direction. When photographed from an oblique direction like this, the size and shape of the photographed molten pool MP changes depending on the molding position. Specifically, Fig.18 In the central part shown in (a), the lower part of the processing light EL is covered by the lower shaped layer, so the size of the molten pool MP is captured relatively small. Fig.18 The corner shown in (b) is open at the bottom, so the size of the molten pool MP is photographed larger than the central part. In other words, the depth direction of the molten pool MP affects the size (number of pixels) of the molten pool MP and is measured to be larger.

[0156] Therefore, if Fig.18 (c) and Fig.18 As shown in (d) of FIG. 1 , in the present embodiment, the measurement target region 100 may be set in a part of the workpiece image IW. The measurement target region 100 may be set, for example, by performing binarization processing to obtain the measurement target region 100. Fig.18 The upper end, lower end, left end, and right end of the molten pool MP are detected in the image captured in the center of the molding direction shown in (c). Specifically, a first line extending laterally can be set on the workpiece image IW with the point of the detected upper end of the molten pool MP as a reference. Similarly, a second line extending laterally can be set on the workpiece image IW with the point of the lower end of the molten pool MP as a reference, a third line extending longitudinally can be set on the workpiece image IW with the point of the left end of the molten pool MP as a reference, and a fourth line extending longitudinally can be set on the workpiece image IW with the point of the right end of the molten pool MP as a reference, thereby setting a rectangular measurement object area 100. In addition, the shape of the measurement object area 100 is not limited to a rectangle, and can be set to any shape, such as an ellipse or a rhombus.

[0157] The measurement target region 100 may be set slightly larger than the molten pool MP. For example, the upper end, lower end, left end, and right end of the molten pool MP may be detected by the binarization process, and then the center position of the measurement target region 100 may be determined. The measurement target region 100 may be enlarged while maintaining the aspect ratio of the vertical and horizontal directions, using the center position of the measurement target region 100 as the center.

[0158] The control device 8 may take only the molten pool MP located inside the measurement object area 100 in the workpiece image IW as the measurement object. In other words, the information of the image located outside the measurement object area 100 in the workpiece image IW may not be used for measurement. Thus, the spatter SP and the like outside the measurement object area 100 may also be removed. The control device 8 may also measure the size of the molten pool MP in the molding by measuring the number of pixels of the molten pool MP located in the measurement object area 100. Furthermore, the control device 8 may apply the measurement object area 100 set in the central portion to the corner. That is to say, Fig.18 As shown in (d), only the melt pool MP located in the measurement target area 100 in the workpiece image IW obtained by shooting the corner portion may be used as the measurement target. In this case, a part of the captured melt pool MP (strictly speaking, the area exceeding the specified brightness threshold in the added image) may deviate from the measurement target area 100. The control device 8 may also determine that the area located in the measurement target area 100 and exceeding the specified brightness threshold in the added image is the melt pool MP. For example, Fig.18 As shown in (d), by detecting the boundary portion between the area exceeding the prescribed brightness threshold and the area not exceeding the brightness threshold in the measurement object area 100, the upper end, left end, and right end of the molten pool MP are detected, but when the lower end of the molten pool MP (located below the measurement object area 100) is not detected, the lower horizontal line (second line) of the measurement object area 100 can be used as the lower end of the molten pool MP. In this case, the longitudinal size of the molten pool in the workpiece image IW can be consistent with the distance between the detected upper end of the molten pool MP and the second line of the measurement object area 100. In addition, as another example, the upper end, lower end, left end, and right end of the molten pool MP (or the outer edge shape of the molten pool MP) can be detected by comparison with the brightness threshold, and then the portion located outside the measurement object area 100 is updated in a manner consistent with the outer edge of the measurement object area 100, thereby measuring the size of the molten pool MP.

[0159] The control device 8 may set the measurement target area 100 or update the measurement target area 100 every time the processing conditions are changed. The control device 8 may change the measurement target area 100 of the molten pool MP based on the information related to the measurement target area 100 of the molten pool MP recorded in the recording device 72, and the information related to the measurement target area 100 of the molten pool MP is associated with the deflection condition. In this case, the deflection condition may include the swing shape of the processing light EL. In this case, the control device 8 may set the measurement target area 100 for each swing shape of the processing light EL. The control device 8 may set the corresponding measurement target area 100 for each scanning direction of the processing light EL. The control device 8 may set the corresponding measurement target area 100 for each scanning position of the processing light EL. The control device 8 may determine the amount of change of at least one of the swing shape of the processing light EL, the scanning direction of the processing light EL, and the scanning position of the processing light EL based on the processing information of the object BO, and update the setting of the measurement target area 100 when the determined amount of change exceeds a predetermined threshold. In this case, the control device 8 may also automatically determine the amount of change in at least one of the swing shape of the processing light EL, the scanning direction of the processing light EL, and the scanning position of the processing light EL. When automatically determining, the amount of change may also be automatically determined based on the workpiece image IW based on a learning model obtained by machine learning. The measurement object area 100 may also be manually set by the user based on the measurement result of the measuring device 71. In addition, the change of the measurement object area 100 of the molten pool MP by the measuring device 71 may include changing the measurement object area 100 of the image processing related to the molten pool MP. That is, not limited to the case of measuring the size of the molten pool MP, the area for performing other image processing (such as spatter removal, etc.) or image processing when performing feedback may also be limited to the measurement object area 100.

[0160] As the size of the molten pool MP to be measured, the larger of the size of the molten pool MP along a prescribed direction (for example, any one of the X-axis direction, the Y-axis direction, and the Z-axis direction) and the size of the molten pool MP in a direction intersecting (typically orthogonal to) the prescribed direction can be used. As the size of the molten pool MP, the smaller of the size of the molten pool MP along a prescribed direction and the size of the molten pool MP in a direction intersecting (typically orthogonal to) the prescribed direction can be used. As the size of the molten pool MP, the average of the size of the molten pool MP along a prescribed direction and the size of the molten pool MP in a direction intersecting (typically orthogonal to) the prescribed direction can be used. As the size of the molten pool MP, the area of ​​the molten pool MP can be used.

[0161] (2-3) Processing light control action

[0162] Next, refer to Fig.19 and Fig. 20 The processing light control operation performed by the processing system SYS during at least a part of the period of performing the modeling operation will be described. Fig.19 It is an enlarged view showing the M layer and the N layer in one shaped object BO. Fig. 20 1 is an enlarged view showing the M layer and the N layer in the first molded object BO1, and the M#2 layer and the N#2 layer in the second molded object BO2. In addition, typically, the processing system SYS performs a processing light control action in parallel with the molding action. In the present embodiment, as an example, the following example is described, that is, the control device 8 calculates information related to the size of the molten pool MP based on the workpiece image WI (that is, generates characteristic information related to the size of the molten pool MP), and records the calculated information related to the size of the molten pool MP in the recording device, so as to control the action of the processing system SYS in a manner that satisfies the condition that the size of the molten pool MP formed by the irradiation of the processing light EL is consistent with the size of the molten pool read from the recording device (that is, the size of the molten pool MP is consistent with the target size). However, the control device 8 can also control any device of the processing system SYS (for example, at least one of the material supply device 1, the processing device 2, the stage device, and the gas supply device 5) in a manner that satisfies any condition based on the workpiece image WI.

[0163] The control device 8 first sets the target size of the molten pool MP. The reason is that, as described above, the processing light control action is an action for controlling the processing light EL so that the size of the molten pool MP formed on the workpiece W is consistent with the target size. Here, the "target size" in the present embodiment is the size of the specified molten pool MP recorded in the recording device 72. Therefore, "setting the target size of the molten pool MP" can be explained as follows. That is, the control device 8 first reads out the information related to the size of the molten pool MP recorded in the recording device 72. The processing light control action is an action for controlling the processing light EL so that the size of the molten pool MP formed on the workpiece W is consistent with the size of the molten pool MP read from the recording device 72.

[0164] As an example, refer to Fig.19 The details of the processing light control operation are explained. Fig.19 It is an enlarged view showing the M layer and the N layer in one shaped object BO. Fig.19 In the figure, the up-down direction is the Z direction as the lamination direction, the left-right direction is the X direction, and the direction perpendicular to the Z direction and the X direction is the Y direction. First, the recording device 72 records information related to the size of the molten pool MP in the molding of the Mth layer (M>0 natural number) of one molding object BO. Fig.10As shown, the information related to the size of the molten pool MP in the formation of the Mth layer may include information related to the position of the molten pool MP, information related to the characteristics of the processing light EL (including the scanning direction or scanning position, scanning speed, light intensity, etc.), and information related to the size of the molten pool MP. The information related to the position of the molten pool MP may include any one of position information and time information. In other words, the recording device 72 can record information related to the size of the molten pool MP at a specified position coordinate or a specified time as reference information. For example, in Fig.10 In the example shown, information obtained by associating the size MPS1 of the molten pool MP in a specific first processing path constituting a straight line in a waveform swing shape with the position coordinates (X1, Y1, Z1) at which the size MPS1 of the molten pool MP is measured is recorded as reference information. In this case, the time T1 (for example, the time from the start of molding) at which the size MPS1 of the molten pool MP is measured may be recorded in association with the size MPS1 of the molten pool MP instead of the position coordinates (X1, Y1, Z1). Furthermore, the recording device 72 may also record information obtained by associating the size MPS2 of the molten pool MP in a second processing path having at least molding conditions different from those of the first processing path with the position coordinates (X2, Y2, Z2) at which the size MPS2 of the molten pool MP is measured as reference information. In this case, the time T2 (for example, the time from the start of molding) at which the size MPS2 of the molten pool MP is measured may be recorded in association with the size MPS2 of the molten pool MP instead of the position coordinates (X2, Y2, Z2). In this way, the recording device 72 records the information related to the size of the molten pool MP in the molding of the Mth layer of a molded object BO in association with at least one of the position coordinates and the time. In addition, the recording device 72 may also update the reference information whenever the scanning direction of the processing light EL changes. The recording device 72 may also update the reference information whenever the deflection condition of the processing light EL changes. In addition, the recording device 72 may also update the reference information when at least one of the following conditions is met, that is, when the current molding position changes by more than a threshold value relative to the specified position coordinates, and when the current molding time changes by more than a threshold value relative to the specified time.

[0165] Return to Fig.19Next, the control device 8 controls the molten pool MP formed in the Nth layer (N is a natural number and N>M) of the same molded object BO by the processing system SYS based on the information related to the size of the molten pool MP of the Mth layer. The molding shape of the Nth layer can be set to be the same as the molding shape of the Mth layer, for example. The control device 8 can control the molding of the Nth layer in a manner that reproduces the size of the molten pool MP in the Mth layer with the same X coordinate and Y coordinate. In other words, the control device 8 controls the processing performed by the processing system SYS in a coordinate system defined by the mutually orthogonal first axis (X axis in this embodiment), second axis (Y axis in this embodiment), and third axis (Z axis in this embodiment). When the control device 8 performs the processing of the upper layer, it can use the reference information in the reference layer, which is at least the layer processed before this processing and is the reference of the processing. It can be performed at a coordinate position different from the reference layer in the third axis direction and the same as the reference layer in the first axis direction and the second axis direction. In this case, the Mth layer is set as the reference layer, and the information including the size of the molten pool MP in the Mth layer can be recorded as the reference information. The control device 8 controls the processing in other layers in a manner that reproduces the size of the molten pool MP in the reference layer based on the reference information. In addition, the reference layer may be a plurality of layers such as the Mth layer, the Oth layer, and the Pth layer, and a plurality of reference information may be recorded in association with the layer numbers of the plurality of layers. For example, when the Nth layer is modeled, the operator may decide which reference information of the M, O, and P layers to use, or the decision may be made automatically. The Nth layer may also be modeled using a plurality of information (e.g., averaged).

[0166] In addition, the reference layer can be a layer predetermined by the user. For example, the reference layer can be the first layer of the object BO. In other words, M=1. The control device can use the reference information in the reference layer to control the processing in the layer above the reference layer. The Nth layer can be any layer above the Mth layer, for example, it can be a layer more than 2 layers away from the Mth layer.

[0167] As another example, refer to Fig. 20 To explain, Fig. 20It is an enlarged view showing the M layer and the N layer in the first molded object (first object) BO1, and the M#2 layer and the N#2 layer in the second molded object (second object) BO2 different from the first molded object BO1. In this case, the recording device 72 can record information related to the size of the molten pool MP in the molding of the Mth layer of the first molded object BO1 as reference information. At this time, the Mth layer of the first molded object BO1 is the reference layer. The control device 8 can also control the molten pool MP formed in the Mth layer of the second molded object BO2 different from the first molded object BO1 by the processing system SYS based on the information related to the size of the molten pool MP in the Mth layer of the first molded object BO1. The molding shape of the first molded object BO1 and the molding shape of the second molded object BO2 can be the same. The control device 8 can control the molding of the M#2 layer in a manner that reproduces the size of the molten pool MP in the Mth layer that is consistent with the time from the start of molding. Similarly, the control device 8 can control the molding of the N#2 layer in a manner that reproduces the size of the molten pool MP in the Nth layer that is consistent with the time from the start of molding. The control device 8 controls the processing in the second layer of the second molded object BO2 in a manner that reproduces the size of the molten pool MP in the reference layer based on the information in the Mth layer of the first molded object BO1, that is, the reference information. The same is true for the relationship between the Nth layer and the N#2th layer. It is also possible to use one reference information to perform more than two copies.

[0168] Furthermore, when manufacturing objects 1, 2, 3, ..., N, the reference information recorded in object 1 may be used to perform the molding of objects 2 to N. In this case, information on the molten pools of objects 2 to N may not be recorded.

[0169] In the processing light control operation, the control device 8 may also calculate the deviation between the set target size (the size of the molten pool MP recorded in the recording device 72) and the size of the molten pool MP actually measured. Then, the control device 8 may also control the intensity of the processing light EL based on the calculated deviation. As described above, the control device 8 controls the intensity of the processing light EL so that the size of the molten pool MP actually measured is consistent with the target size. Therefore, the control device 8 may also control the intensity of the processing light EL so that the deviation becomes zero (close to zero). In addition, at this time, the control device 8 may also control the intensity of the processing light EL so that the deviation is within the allowable range of the deviation.

[0170] As an example, when the size of the molten pool MP actually measured is larger than the target size, in order to make the molten pool MP consistent with the target size, the molten pool MP actually measured must be reduced. Here, the smaller the intensity of the processing light EL, the smaller the amount of energy transmitted from the processing light EL to the modeling surface MS. The smaller the amount of energy transmitted from the processing light EL to the modeling surface MS, the smaller the amount of the modeling material M melted on the modeling surface MS. The smaller the amount of the modeling material M melted on the modeling surface MS, the smaller the size of the molten pool MP formed on the modeling surface MS. Therefore, when the size of the molten pool MP actually measured is larger than the target size, the intensity of the processing light EL can also be controlled so that the intensity of the processing light EL weakens the component based on the deviation.

[0171] As another example, when the size of the molten pool MP actually measured is smaller than the target size, in order to make the size of the molten pool MP consistent with the target size, the molten pool MP actually measured must be increased. Here, the greater the intensity of the processing light EL, the greater the amount of energy transmitted from the processing light EL to the modeling surface MS. The greater the amount of energy transmitted from the processing light EL to the modeling surface MS, the greater the amount of the modeling material M melted on the modeling surface MS. The greater the amount of the modeling material M melted on the modeling surface MS, the larger the size of the molten pool MP formed on the modeling surface MS. Therefore, when the size of the molten pool MP actually measured is smaller than the target size, the intensity of the processing light EL can also be controlled so that the intensity of the processing light EL is enhanced by the component based on the deviation.

[0172] The action of controlling the intensity of the processing light EL based on the deviation can also be regarded as an action of performing feedback control on the intensity of the processing light EL based on the deviation. The reason is that the action of controlling the intensity of the processing light EL based on the deviation is an action of controlling the intensity of the processing light EL that affects the size of the molten pool MP in such a way that the size of the molten pool MP actually measured calculated based on the measurement result of the measuring device 71 is consistent with (i.e., close to) the target size.

[0173] When feedback control is performed on the intensity of the processing light EL, the control device 8 may also perform feedback control including P control (Proportional control). The control device 8 may also perform feedback control including PI control (Proportional Integral control). The control device 8 may also perform feedback control including PID control (Proportional Integral Differential control). When feedback control including P control is performed, the behavior of the feedback control is determined by the proportional gain Kp. When feedback control including PI control is performed, the behavior of the feedback control is determined by the proportional gain Kp and the integral gain Ki. When feedback control including PID control is performed, the behavior of the feedback control is determined by the proportional gain Kp, the integral gain Ki, and the differential gain Kd.

[0174] The proportional gain Kp, the integral gain Ki, and the differential gain Kd are examples of control parameters K that specify the behavior of the processing light control action. Therefore, at least one of the proportional gain Kp, the integral gain Ki, and the differential gain Kd may be generated in advance before the light intensity control action is performed. Therefore, the control device 8 may also use the control parameter K (for example, at least one of the proportional gain Kp, the integral gain Ki, and the differential gain Kd) generated in advance before the light intensity control action is performed to perform the processing light control action.

[0175] The control device 8 also controls the intensity of the processing light EL by controlling the light source 4. Alternatively, when the irradiation optical system 211 of the processing head 21 has an optical element capable of controlling the intensity of the processing light EL, the control device 8 may control the intensity of the processing light EL by controlling the irradiation optical system 211 in addition to or instead of controlling the light source 4.

[0176] In addition, the control device 8 may control the irradiation time of the processing light EL instead of or in addition to controlling the intensity of the processing light EL. As an example, when the processing light EL is pulsed light, the control device 8 may change the amount of energy delivered to a predetermined point on the modeling surface MS by controlling the time interval of the pulsed light or the luminous time of each pulsed light. In addition, the amount of energy delivered to a predetermined point on the modeling surface MS may be changed by controlling the speed of the scanning action (for example, the moving speed of the target irradiation area EA based on the scanning action).

[0177] Next, refer to Fig.21 and Fig. 22 The feedback in the line width direction of the melt pool MP will be described. Fig.21In the example of observing the XY plane, for example, it is shown, but it is not limited to this. It can also be set as the result obtained by observing the XZ plane, or it can be set as the result obtained by observing these planes from an inclined direction. Here, in the case of feedback control by observing only the size of the molten pool MP, when the molten pool MP is within the viewing angle of the workpiece image IW, even if the center position is offset, only the same feedback can be performed. In order to solve this problem, the control device 8 can also record the information of the position of the molten pool, for example, record the positions of the two ends (hereinafter, the left and right ends) of the measured molten pool MP in the line width direction in the reference layer, and perform feedback control so that the center position and the left and right width of the molten pool MP in the layer after the reference layer are constant. Specifically, the measuring device 71 can also obtain the center position information, which is related to the center position of the area formed by the molten pool MP, and the molten pool MP is formed at different positions by the processing light EL deflected by the galvanometer mirror 2112 as a deflection optical system. Furthermore, the control device 8 can also control the shaping performed by the processing system SYS based on the center position information read from the measuring device 71. In this case, the control device 8 may also perform high-speed laser modulation based on the measurement result of the center position of the molten pool MP to control at least one of the laser intensity and the heat input. The control device 8 may also operate the galvanometer mirror 2112 based on the measurement result of the center position of the molten pool MP to control the track speed of the processing light EL.

[0178] In this case, the measuring device 71 can measure the center position of the molten pool MP based on the captured image (workpiece image IW), and the control device 8 can also measure the center position of the molten pool MP based on the captured image (workpiece image IW). Fig.21 As shown in the left figure, the width and center position of the molten pool MP are offset to control the shape, so that Fig.21 As shown in the right figure of , the center position of the melt pool MP is located at the center of the workpiece image IW, and the center position of the melt pool MP in the width direction also coincides with the center of the workpiece image IW.

[0179] Furthermore, the control device 8 may also control the shaping action in the processing system SYS so as to approach the ideal shape 90 of the molten pool MP that is preset or stored. For example, a device capable of measuring a three-dimensional shape, such as a 3D scanner, may be connected to the control device 8 (or a recording device 72 capable of communicating with the control device 8) to preset the shape of the molten pool MP according to the measurement result. Fig. 22 The ideal shape of the molten pool MP is shown as 90. Fig. 22In the example shown, the ideal shape 90 is recorded as a cube, but the shape of the ideal shape 90 is not limited to a cube. The ideal shape 90 may be a shape that is bilaterally symmetrical in the width direction of the molten pool MP. A plurality of ideal shapes 90 may be recorded in the recording device 72. The control device 8 may also automatically select the best ideal shape 90 from the plurality of recorded ideal shapes based on a learning model obtained by performing machine learning. The ideal shape may also be manually selected by the user based on, for example, processing conditions, etc.

[0180] The control device 8 may also control the operation of the galvanometer mirror 2112 so that the shape of the observed molten pool MP does not overlap with the abnormal area 101 which is a region deviating from the ideal shape 90. In other words, the control device 8 may also control the operation of the galvanometer mirror 2112 so that the shape of the observed molten pool MP overlaps with the normal area 102 which is a region consistent with the ideal shape 90. In order to make the molten pool MP close to the ideal shape 90, the control device 8 may also calculate the difference between the shape of the molten pool MP actually measured by the measuring device 71 and the ideal shape 90, and control the molding by offsetting the difference so that the shape of the molten pool MP actually measured approaches the ideal shape 90. In this case, the best ideal shape 90 may also be selected from a plurality of ideal shapes based on at least one of the swing shape of the processing light EL, the scanning direction of the processing light EL, the scanning position of the processing light EL, and the shape of the molten pool MP actually measured.

[0181] The control device 8 may control to reduce the left-right difference in the number of pixels of the workpiece image IW with respect to the coincident center position, in addition to controlling to match the center position and width of the molten pool MP with the center position of the workpiece image IW. Fig.23 The upper stage shows the workpiece image IW when the difference in the number of pixels to the left and right of the center position is large (that is, when the line width of the molten pool MP is non-uniform). Fig.23 The lower part of shows the workpiece image IW when the difference in the number of pixels to the left and right of the center position is made uniform (that is, when the line width of the molten pool MP is uniform). Fig.23 As shown in the upper part of , when the difference in the number of pixels on the left and right is large, the accuracy of the object BO may be affected due to the different heights of the left and right objects in the object BO, or the different rounded angles (angles R) of the left and right corners in the object BO. Therefore, the control device 8 can also perform high-speed laser modulation of the galvanometer mirror 2112 based on the measurement results of the shape of the molten pool MP, thereby controlling at least one of the laser intensity and the heat input. Thus, as Fig.23As shown in the lower section of , a workpiece image IW with a small difference in the number of pixels on the left and right can be obtained. By reducing the difference in the number of pixels on the left and right in the workpiece image IW, the molding height or the roundness (angle R) of the corner in the molding object BO can be made uniform on the left and right. In addition, the control device 8 can also operate, for example, the galvanometer mirror 2112 based on the measurement result of the shape of the molten pool MP, thereby controlling the track speed of the processing light EL.

[0182] When the control device 8 determines that the molding operation has been completed, the control device 8 ends the processing light control operation. After the molding operation is completed, the control device 8 can output the information obtained by associating the recorded information related to the size of the molten pool MP with the information related to the position or molding time in the form of a file. It is also possible to reproduce the last molding in the next molding by using the output file in the next molding.

[0183] (2-4) Control signal generation action

[0184] Next, the control signal generating action is described. The control device 8 may also obtain information related to the reference value of the target intensity from the control device 8 of the processing system SYS. The control device 8 may generate a control signal SG1, which is used to control the light source 4 so that the intensity of the processing light EL generated by the light source 4 becomes the set target intensity (that is, the reference value of the target intensity). In this case, the control device 8 may also obtain the control signal SG1 as information related to the reference value of the target intensity. In this case, it can also be regarded that the control device 8 sets the target intensity of the processing light EL based on the workpiece image WI and the control signal SG1. Furthermore, the control device 8 may generate a control signal SG2, which is used to control the intensity (that is, the characteristic) of the processing light EL generated by the light source 4 so that the intensity of the processing light EL generated by the light source 4 becomes the controlled and set target intensity. In this case, the control device 8 may generate a control signal SG2 for controlling the light source 4 based on the size of the molten pool MP measured by the measuring device 71 from the workpiece image IW. Specifically, the control device 8 sets the target intensity of the processing light EL generated by the light source 4 based on the measured size of the molten pool MP and the control signal SG1 obtained from the control device 8. Then, the control device 8 generates a control signal SG2 for controlling the light source 4 so that the intensity of the processing light EL generated by the light source 4 becomes the set target intensity. As a result, the light source 4 is driven based on the control signal SG2 generated by the control device 8 instead of the control signal SG1 generated by the control device 8. That is, the light source 4 generates the processing light EL of the desired intensity so that the size of the molten pool MP is consistent with the target size.

[0185] Furthermore, the control device 8 may not perform the molten pool information acquisition operation during at least a portion of the period during which the light source 4 does not generate the processing light EL. In order to determine whether the light source 4 is generating the processing light EL, the control device 8 may also acquire the control signal SG1 from the control device 8, and determine whether the light source 4 is generating the processing light EL based on the acquired control signal SG1. Alternatively, the control device 8 may also acquire light on / off information indicating whether the light source 4 is generating the processing light EL from the control device 8, and determine whether the light source 4 is generating the processing light EL based on the acquired information. Furthermore, as described above, the light on / off information may also be input to the control device 8 using, for example, a signal pin such as an input / output connector not shown.

[0186] (3) Technical Effects of the Processing System SYS of the Embodiment

[0187] As described above, in the present embodiment, the processing system SYS includes: a measuring device 71 for acquiring information related to the size of the molten pool MP; and a recording device 72 for recording the information related to the size of the molten pool MP acquired by the measuring device 71 and the information related to the position of the molten pool MP in a manner associated with each other. By providing the recording device 72 for recording the molten pool MP in this way, the size of the molten pool MP for the position coordinates or time in the reference layer can be recorded. In addition, the control device 8 controls the processing system SYS so that the size of the molten pool MP formed by the irradiation of the processing light EL is consistent with the size of the molten pool MP read from the recording device 72. Thus, the size of the molten pool MP of the reference layer can be reproduced in the next layer and the subsequent layers. Furthermore, by outputting the recorded information in the form of a file, the output file information can be applied to the next molding (a molding different from the molding with the reference layer) to reproduce the molding with the reference layer.

[0188] In the present embodiment, the control device 8 controls the processing system SYS based on the measurement result of the measuring device 71, and changes the measurement object area 100 of the molten pool MP by the measuring device 71 based on the condition for deflecting the processing light EL, i.e., the deflection condition. As a result, image processing is performed only on the area required for feedback in the workpiece image IW, so that high-speed image processing can be achieved. Furthermore, by narrowing the image processing range, in addition to achieving high speed, the area value of the displayed molten pool MP can also be detected with high precision. In other words, the size of the molten pool MP can be measured with high precision. Furthermore, by limiting the image area used for feedback to only the measurement object area 100, spatters can be removed at the same time. Furthermore, for example, the influence of the number of pixels that changes on the workpiece image IW according to the positional relationship between the camera 80 (camera) and the modeling object can be suppressed, thereby suppressing the collapse of the modeling caused by the reduction of the laser output.

[0189] In this embodiment, the ideal shape 90 of the molten pool MP is pre-set in the recording device 72, and the control device 8 calculates the difference between the shape of the molten pool MP actually measured by the measuring device 71 and the ideal shape 90, and controls the molding by offsetting the difference so that the shape of the molten pool MP actually measured is close to the ideal shape 90. The ideal shape 90 is set to be a shape that is symmetrical in the width direction. The control device 8 controls so that the center position and the left and right widths of the molten pool MP in the reference layer are constant, so that the line width on one line of the molded object BO can be uniform. In this way, the change in line width caused by repeated molding can be suppressed. Furthermore, the control device 8 controls so that the left and right difference in the number of pixels on the workpiece image IW relative to the center position of the molten pool MP becomes smaller. By making the number of pixels consistent (reducing the left and right difference), the left and right molding heights and angles R in the molded object BO can be made uniform.

[0190] In addition, the structure of the processing system SYS can be changed to the following. That is, the processing system SYS includes: a processing device 2, which includes an irradiation optical system 211 capable of irradiating a processing light beam (processing light EL), and a material supply unit (material supply device 1) capable of supplying a molding material M to a portion where a molten pool MP is formed by irradiation of the processing light beam, and performs molding of a molding object BO; a measuring device 71, which obtains information related to the size of the molten pool MP formed by irradiation of the processing light beam; a recording device 72, which records the information related to the size of the molten pool MP obtained by the measuring device 71 and the information related to the position of the molten pool MP in a manner associated with each other; and a control device 8; the recording device 72 records the information related to the size of the molten pool MP in molding the Mth layer of the first molding object BO1, and the control device 8 controls the molten pool MP formed in the Mth layer of the second molding object BO2 different from the first molding object BO1 by the processing device 2 based on the information related to the size of the molten pool MP of the Mth layer of the first molding object BO1.

[0191] Alternatively, it can be described as follows. That is, the processing system SYS comprises: a processing device 2, which comprises an irradiation optical system 211 capable of irradiating a processing light beam (processing light EL), and a material supply unit (material supply device 1) capable of supplying a molding material M to a portion where a molten pool MP is formed by irradiation of the processing light beam, and performs molding of a molding object BO; a measuring device 71, which acquires information related to the size of the molten pool MP formed by irradiation of the processing light beam; a recording device 72, which records the information related to the size of the molten pool MP acquired by the measuring device 71 and the information related to the position of the molten pool MP in a manner associated with each other; and a control device 8; the recording device 72 records information related to the size of the molten pool MP in molding of the Mth layer (M>0 natural number) of the molding object, and the control device 8 controls the molten pool MP formed in the Nth layer (N is a natural number and N>M) of the molding object by the processing device 2 based on the information related to the size of the molten pool MP of the Mth layer.

[0192] Alternatively, it can be described as follows. That is, the processing system SYS includes: a processing device 2 including an irradiation optical system capable of irradiating a processing light beam (processing light EL), a first moving device (for example, the stage 31 in this embodiment) capable of moving the irradiation position of the processing light beam along a target trajectory based on a processing path, and a second moving device (for example, the galvanometer mirror 2112 in this embodiment) capable of moving the processing light beam in a direction intersecting the target trajectory, and processing an object; a measuring device 71 for acquiring information related to a molten pool MP formed by irradiation of the processing light beam; and a control device 8; and the control device 8 determines a measurement target area 100 of the measuring device 71 based on a condition for moving the processing light beam by the second moving device, i.e., a moving condition.

[0193] Alternatively, it can be described as follows. That is, the processing system SYS includes: a processing device 2 including an irradiation optical system 211 capable of irradiating a processing light beam (processing light EL), and a material supply unit (material supply device 1) capable of supplying a molding material to a portion where a molten pool MP is formed by irradiation of the processing light beam, and molding a molding object BO; a measuring device 71 for acquiring information related to a molten pool formed on a first object by irradiation of the processing light beam; a recording device 72 for recording information related to the molten pool MP acquired by the measuring device 71 and information related to the position of the molten pool MP in association; and a control device 8; the control device 8 can read the information related to the molten pool MP from the recording device 72, and control the processing device 2 so that the molten pool MP formed on a second object by irradiation of the processing light beam reproduces the molten pool MP read from the recording device 72. In this case, the control device 8 can also control the processing device 2 based on the information related to the molten pool MP read from the recording device 72 corresponding to the position on the second object irradiated with the processing light beam, so that the molten pool MP formed on the first object reproduces on the second object. The molten pool MP formed on the first object may be a molten pool formed for molding the Mth layer (M is a natural number greater than 0) of the first molded object, and the molten pool MP formed on the second object may be a molten pool formed for molding the Mth layer of the second molded object different from the first object. The molten pool MP formed on the first object may be a molten pool formed for molding the Mth layer (M is a natural number greater than 0) of the molded object BO, and the molten pool MP formed on the second object may be a molten pool formed for molding the Nth layer (N is a natural number and N is greater than M) of the molded object BO.

[0194] Furthermore, it can be explained that the structure of the processing system SYS is that the control device 8 has a data structure having the following structure. That is, the data structure of the control device 8 is a data structure for the processing device 2, and the information related to the size of the molten pool MP formed by the processing device 2 and the position where the molten pool MP is formed are associated, and the processing device 2 has an irradiation optical system 211 that can irradiate the processing light beam (processing light EL) and a material supply unit (material supply device 1) that can supply the molding material to the part where the molten pool MP is formed by irradiating the processing light beam, and performs molding of the molding object BO.

[0195] The data structure of the control device 8 may also be a data structure for the processing device 2, and the conditions for deflecting the processing light beam, i.e., the deflection conditions, may be associated with information related to the measurement target area 100 measured by the measuring device 71, and the processing device 2 includes an irradiation optical system 211 capable of irradiating the processing light beam (processing light EL), a material supply unit (material supply device 1) capable of supplying molding material to a portion where the molten pool MP is formed by irradiating the processing light beam, a moving device (e.g., the stage 31 in this embodiment) capable of moving the irradiation position of the processing light beam along a target trajectory based on the processing path, and a deflection optical system (galvanometer mirror 2112) capable of deflecting the processing light beam in a direction intersecting the target trajectory, and can perform molding of the molding object BO. In addition, the data structure may also be provided outside the control device 8 (e.g., an externally connected device, etc.).

[0196] In addition, it can be explained that the structure of the processing system SYS is a processing method of a molded object BO having the following structure. That is, the processing method of the molded object BO includes the following steps: irradiating a processing light beam (processing light EL) to an object; supplying a molding material to a portion where a molten pool MP is formed by irradiating the processing light beam to mold the molded object BO; acquiring information related to the size of the molten pool MP formed by irradiation with the processing light beam; recording the acquired information related to the size of the molten pool MP and information related to the position of the molten pool MP in association; and reading out the information related to the size of the molten pool MP and controlling the molding so that the size of the molten pool MP formed by irradiation with the processing light beam is consistent with the size of the molten pool MP read from the recording device 72.

[0197] The processing method of the shaped object BO may also include the following steps: irradiating a processing light beam (processing light EL) on the object; moving the irradiation position of the processing light beam along a target trajectory based on a processing path; deflecting the processing light beam in a direction intersecting the target trajectory; supplying a modeling material to a portion where a molten pool MP is formed by irradiating the processing light beam to shape the shaped object; acquiring information related to the size of the molten pool MP formed by the irradiation of the processing light beam; and controlling the modeling based on the acquired information related to the size of the molten pool MP, and changing the measurement object area 100 of the molten pool MP used to acquire information related to the size of the molten pool MP based on the condition for deflecting the processing light beam, i.e., the deflection condition.

[0198] The processing method of the shaped object BO may also include the following steps: irradiating the object with a processing light beam (processing light EL); supplying a modeling material to a portion where a molten pool MP is formed by irradiation with the processing light beam to shape the shaped object; acquiring information related to the molten pool MP formed by irradiation with the processing light beam; recording the acquired information related to the molten pool MP and information related to the position of the molten pool MP in an associated manner; and reading out the information related to the molten pool MP to control the shaping in such a manner that the molten pool MP formed by irradiation with the processing light beam reproduces the read molten pool MP.

[0199] (4) Modification

[0200] Next, a modification of the machining system SYS, the data structure, and the machining method will be described. In addition, the following description will be given as a modification of the machining system SYS, but these configurations can also be applied to the data structure and the machining method.

[0201] In the embodiment, the camera 80 can be mounted on the processing head 21. However, the camera 80 can also be mounted on a component different from the processing head 21. For example, the camera 80 can also be mounted on at least a portion of the processing device 2. For example, the camera 80 can also be mounted on at least a portion of the stage device 3 (for example, at least a portion of the stage 31). For example, the camera 80 can also be mounted on at least a portion of the housing 6. Alternatively, the camera 80 can also be integrated with a component different from the processing head 21.

[0202] In the above-described embodiment, the machining system SYS includes a reflector as an optical component for guiding the workpiece light WL from the workpiece W to the camera 80. However, an optical component other than the reflector may be used as the optical component for guiding the workpiece light WL from the workpiece W to the camera 80. For example, a prism may be used as the optical component for guiding the workpiece light WL from the workpiece W to the camera 80.

[0203] The machining system SYS may not include a reflective mirror. In other words, the control device 8 may not include an optical component for guiding the work light WL from the work W to the camera 80. In this case, the camera 80 may receive the work light WL without the use of a reflective mirror.

[0204] In the above-described embodiment, the camera 80 receives the workpiece light WL including the light emitted by the workpiece W (for example, the workpiece light WL including the light emitted by the molten pool MP formed on the workpiece W). However, the lighting device may irradiate the lighting light onto the workpiece W, and the camera 80 may receive the workpiece light WL including the lighting light passing through the workpiece W (for example, the reflected light reflected by the workpiece W). The lighting device may be provided in the control device 8. The lighting device may also be provided outside the control device 8. In addition, the camera 80 may also receive the workpiece light WL passing through at least a portion of the irradiation optical system 211.

[0205] The camera 80 may also receive workpiece light WL from at least a portion of the workpiece W (particularly, at least a portion of the molten pool MP) via a prescribed optical filter. As an example of a prescribed optical filter, there may be cited a filter that allows infrared light (for example, light having a wavelength in the range of about 700 nm to 1 mm) to pass but does not allow light different from infrared light (for example, light having a wavelength not in the range of about 700 nm to 1 mm, such as visible light) to pass. In this case, the workpiece image WI generated by the camera 80 receiving the workpiece light WL may be used as an image (so-called temperature map) representing the temperature distribution of at least a portion of the workpiece W. That is, the camera 80 may also generate a workpiece image WI representing the temperature distribution of at least a portion of the workpiece W (that is, capable of being used as a temperature map). The camera 80 may also be used as a temperature measuring device for acquiring information related to the temperature of at least a portion of the workpiece W.

[0206] In the embodiment, the camera 80 generates a workpiece image WI in which the molten pool MP is captured by capturing at least a portion of the workpiece W (especially, at least a portion of the molten pool MP). However, the camera 80 may also generate a workpiece image WI in which the molten pool MP and the surrounding shaped objects are captured by capturing at least a portion of the molten pool MP and the solidified metal (that is, the shaped objects, hereinafter referred to as "the surrounding shaped objects") distributed around the molten pool MP. The camera 80 may also generate a workpiece image WI in which the molten pool MP is not captured but the surrounding shaped objects are captured by capturing the surrounding shaped objects. In this case, the control device 8 may also control the operation of the processing system SYS based on the workpiece image WI in which the surrounding shaped objects are captured. For example, the control device 8 may also calculate the position of the surrounding shaped objects constituting a structural layer SL (for example, the position in the Z-axis direction, which is essentially the height) based on the workpiece image WI, and control the operation of the processing system SYS based on the calculated position of the surrounding shaped objects to form the rest of the structural layer SL. For example, the control device 8 can also calculate the position of the peripheral shaped objects constituting a structural layer SL (for example, the position in the Z-axis direction, which is essentially the height) based on the workpiece image WI, and control the operation of the processing system SYS based on the calculated position of the peripheral shaped objects to form other structural layers SL formed on the one structural layer SL.

[0207] The camera 80 may also photograph an object different from the workpiece W. For example, the camera 80 may also photograph at least a portion of the stage 31. For example, the camera 80 may also photograph at least a portion of the processing head 21. For example, the camera 80 may also photograph at least a portion of the material nozzle 212. For example, the camera 80 may also photograph at least a portion of the molding material M supplied from the material nozzle 212. For example, the camera 80 may also photograph at least a portion of the chamber space. In this case, the control device 8 may also control the operation of the processing system SYS based on the image generated by the camera 80.

[0208] In the above description, the camera 80 is accommodated in the housing 6. However, the camera 80 may not be accommodated in the housing 6. In this case, the camera 80 may not have the housing 6. In the above description, the measuring device 71 (camera 80) measures (photographs) the molten pool MP at an angle relative to the object. However, the measuring device 71 (camera 80) may also measure (photograph) the molten pool MP from directly above the object (from the direction along the optical axis of the irradiation optical system 211).

[0209] In the above embodiment, the measuring device 71 of the processing system SYS is arranged in the chamber space 63IN. However, the measuring device 71 may be arranged in a position different from the chamber space 63IN. For example, the measuring device 71 may be arranged in the external space 64OUT. The measuring device 71 may also be able to measure the workpiece W (especially, the molten pool MP formed in the workpiece W) from the external space 64OUT.

[0210] In the above embodiment, the processing system SYS includes a measuring device 71 capable of measuring the size of the molten pool MP formed on the workpiece W. However, the processing system SYS may also include a first measuring device capable of measuring the molten pool MP formed on the workpiece W, and a second measuring device capable of measuring a molded object molded on the workpiece W. In other words, the function of measuring the molten pool MP and the function of measuring the molded object BO may be separately provided.

[0211] In the embodiment, both the shooting action and the image processing action are performed in the molten pool information acquisition action. However, the image processing action may not be performed in its entirety in the molten pool information acquisition action. That is, only a portion of the image processing action may be performed. Specifically, only any portion of the processing may be performed: (1) adding the workpiece image IW and removing spatter; (2) removing spatter by setting a new offset cumulative threshold 84 within the moldable range 82 for the initially set cumulative threshold 81; (3) setting a measurement object area 100 in a portion of the workpiece image IW, and measuring the size of the molten pool MP based on the image information of the molten pool MP located in the measurement object area 100, thereby speeding up the image processing.

[0212] In the embodiment, the processing system SYS includes a head drive system 22. That is, the processing head 21 can move. However, the processing system SYS may not include the head drive system 22. That is, the processing head 21 may not move. In addition, in the description, the processing system SYS includes a stage drive system 32. That is, the stage 31 can move. However, the processing system SYS may not include the stage drive system 32. That is, the stage 31 may not move.

[0213] In the above-described embodiment, the processing device 2 melts the molding material M by irradiating the processing light EL to the molding material M. However, the processing device 2 may melt the molding material M by irradiating the molding material M with an arbitrary energy beam. In this case, the processing device 2 may also include a beam irradiation device capable of irradiating an arbitrary energy beam in addition to or instead of the irradiation optical system 211. As an example of the arbitrary energy beam, at least one of a charged particle beam (for example, at least one of an electron beam and an ion beam) and an electromagnetic wave may be cited.

[0214] The control device 8 may also change the target size of the molten pool MP when the type of the molding material M used in the molding action changes. When the type of the molding material M used in the molding action changes, even when the molding conditions (for example, the light intensity conditions and the scanning speed conditions) remain unchanged, the relationship between the line width of the molded object BO and the target size of the molten pool MP may change. For example, when the main molding action is performed using the processing light EL having the first intensity and moving at the first scanning speed and the first type of molding material M, if a molten pool MP of the first size is formed, a molded object BO of the first line width is molded. On the other hand, when the main molding action is performed using the processing light EL having the first intensity and moving at the first scanning speed and the second type of molding material M different from the first type, if a molten pool MP of the first size is formed, it is possible to mold a molded object BO of the second line width different from the first line width. Therefore, the control device 8 may also set the target size of the molten pool MP based on the type of the molding material M.

[0215] The control device 8 may also correct the calculated size of the molten pool MP or the workpiece image IW itself based on the processing information. The control device 8 may also correct the workpiece image WI based on the processing information, and measure the size of the molten pool MP based on the corrected workpiece image WI. For example, the control device 8 may correct the workpiece image WI in a manner different from the method for correcting the workpiece image WI when the target irradiation area EA moves toward the first moving direction and the method for correcting the workpiece image WI when the target irradiation area EA moves toward the second moving direction. For example, the control device 8 may correct the workpiece image WI in a manner different from the method for correcting the workpiece image WI when the angle of the stage 31 becomes the first angle and the method for correcting the workpiece image WI when the angle of the stage 31 becomes the second angle. For example, the control device 8 may correct the workpiece image WI in a manner different from the method for correcting the workpiece image WI when the shape of the existing shaped object becomes the first shape and the method for correcting the workpiece image WI when the shape of the existing shaped object becomes the second shape.

[0216] Specifically, for example, in a situation where the apparent size of the molten pool MP captured in the workpiece image WI is smaller than the actual size of the molten pool MP, the control device 8 may also correct the workpiece image WI so that the molten pool MP captured in the workpiece image WI becomes larger. For example, in a situation where the apparent size of the molten pool MP captured in the workpiece image WI is larger than the actual size of the molten pool MP, the control device 8 may also correct the workpiece image WI so that the molten pool MP captured in the workpiece image WI becomes smaller. For example, in a situation where the apparent size of the molten pool MP captured in the workpiece image WI is consistent with the actual size of the molten pool MP, the control device 8 may not correct the workpiece image WI. That is, the control device 8 may also correct the workpiece image WI so that the apparent size of the molten pool MP captured in the workpiece image WI is close to or consistent with the actual size of the molten pool MP.

[0217] The processing system SYS may also include a display. The display functions as a display device capable of displaying a desired image under the control of the control device 8. The display may also include a display provided by the processing system SYS (that is, a display built into the processing system SYS). The display may also include a display that can be externally connected to the processing system SYS. Alternatively, a display provided by a device different from the processing system SYS may display the desired image under the control of the control device 8. For example, a display provided by at least one of a laptop computer and a tablet terminal may display the desired image under the control of the control device 8. In this case, the processing system SYS may not include a display.

[0218] In the above description, the processing system SYS performs additive processing by laser cladding. However, the processing system SYS may also form the object BO from the modeling material M by irradiating the processing light EL (or any energy beam) to the modeling material M in another way that can perform modeling of the object BO. Alternatively, the processing system SYS may also form the object BO by any method for additive processing that is different from the method of irradiating the processing light EL (or any energy beam) to the modeling material M.

[0219] As an example, the processing system SYS may also form a three-dimensional structure ST by performing additive processing using a powder bed fusion method (Powder Bed Fusion) such as a powder sintering layer modeling method (SLS: Selective Laser Sintering). That is, the processing system SYS may also form a three-dimensional structure ST by repeating the following actions, namely, spreading the powder used as the modeling material M evenly, and then irradiating the processing light EL to at least a portion of the powder spread evenly. In this case, the control device 8 may also regard the aggregate of the powder spread evenly as the workpiece W. That is, the control device 8 may also generate a workpiece image WI by photographing at least a portion of the workpiece W corresponding to the aggregate of the powder spread evenly, and control the operation of the processing system SYS based on the workpiece image WI. In addition, when the powder bed fusion method is used, a molten pool MP (that is, a molten pool MP formed by molten powder) is also formed in at least a portion of the powder spread evenly by irradiating the processing light EL. In this case, the control device 8 may generate the workpiece image WI by imaging at least a portion of the melt pool MP formed on at least a portion of the powder spread evenly, and control the operation of the machining system SYS based on the workpiece image WI.

[0220] Alternatively, the processing system SYS may perform removal processing in addition to or instead of additive processing, in which the processing light EL (or any energy beam) is irradiated to an object such as a workpiece W to remove at least a portion of the object. Alternatively, the processing system SYS may perform marking processing in addition to or instead of additive processing and / or removal processing, in which the processing light EL (or any energy beam) is irradiated to an object such as a workpiece W to form a mark (for example, letters, numbers, or figures) on at least a portion of the object.

[0221] The processing device 2 (especially the processing head 21) can also be installed on a robot (typically a multi-joint robot). For example, the processing device 2 (especially the processing head 21) can also be installed on a welding robot used for welding. For example, the processing device 2 (especially the processing head 21) can also be installed on a mobile robot that can move autonomously.

[0222] At least a part of the constituent elements of each embodiment described above can be appropriately combined with at least another part of the constituent elements of each embodiment described above. Some of the constituent elements of each embodiment described above may not be used.

[0223] The present invention is not limited to the embodiments described, and can be appropriately modified within the scope that does not violate the spirit or idea of ​​the invention that can be understood from the claims and the entire specification. The processing system, data structure and processing method accompanied by such changes are also included in the technical scope of the present invention.

[0224] [Explanation of Symbols]

[0225] 1 Material supply device (material supply unit)

[0226] 2 Processing equipment

[0227] 8 Control device

[0228] 22 Head drive system (moving device)

[0229] 31 stage (mobile device)

[0230] 71 Measuring device

[0231] 72 Recording Device

[0232] 90 Ideal shape

[0233] 100 Measurement target area

[0234] 211 Illumination Optical System

[0235] 2112 Galvanometer mirror (deflection optical system)

[0236] BO Modeling

[0237] BO1 The first object

[0238] BO2 Second Model (Second Object)

[0239] EL processing light

[0240] IW Workpiece Image

[0241] M Modeling Material

[0242] MP Melt Pool

[0243] SYS Processing System

Claims

1. A processing system comprising: A processing device, comprising an irradiation optical system capable of irradiating a processing light beam, and a material supplying section capable of supplying a molding material to a portion where a molten pool is formed by irradiation of the processing light beam, and molding a molding object; a measuring device for acquiring information related to the size of a molten pool formed by irradiation of the processing light beam; a recording device for recording information related to the size of the molten pool and information related to the position of the molten pool obtained by the measuring device in an associated manner; and Control devices; The recording device records information related to the size of the molten pool in the molding of the Mth layer of the first molding, and The control device controls the formation of the molten pool in the Mth layer of the second shaped object different from the first shaped object by the processing device based on the information related to the size of the molten pool in the Mth layer of the first shaped object.

2. A processing system comprising: A processing device, comprising an irradiation optical system capable of irradiating a processing light beam, and a material supplying section capable of supplying a molding material to a portion where a molten pool is formed by irradiation of the processing light beam, and molding a molding object; a measuring device for acquiring information related to the size of a molten pool formed by irradiation of the processing light beam; a recording device for recording information related to the size of the molten pool and information related to the position of the molten pool obtained by the measuring device in an associated manner; and Control devices; The recording device records information related to the size of the molten pool in the molding of the Mth layer (M>0, a natural number) of the molding, and The control device controls the formation of the molten pool in the Nth layer (N is a natural number and N>M) of the shaped object by the processing device based on the information related to the size of the molten pool in the Mth layer.

3. The processing system according to claim 1 or 2, wherein: The information on the position of the molten pool includes either position information or time information.

4. The processing system according to claim 3, wherein: The recording device records information related to the size of the molten pool at a predetermined position coordinate or a predetermined time as reference information, and updates the reference information every time the scanning direction of the processing light beam changes.

5. The processing system according to claim 3 or 4, wherein: The recording device records information related to the size of the molten pool at a predetermined position coordinate or a predetermined time as reference information, and updates the reference information every time a deflection condition of the processing beam changes.

6. The processing system according to any one of claims 3 to 5, wherein: The recording device records information related to the size of the molten pool at a specified position coordinate or a specified time as reference information, and The recording device updates the reference information when at least one of the following conditions is satisfied: when the current shaping position changes from the prescribed position coordinate by more than a threshold value, and when the current shaping time changes from the prescribed time by more than a threshold value.

7. The processing system according to any one of claims 3 to 6, wherein: The recording device records information related to the size of the molten pool of the reference layer set in the object as reference information, and The control device controls processing in other layers so as to reproduce the size of the molten pool in the reference layer based on the reference information.

8. The processing system according to claim 7, wherein: The reference layer is a layer predetermined by a user.

9. The processing system according to claim 7, wherein: The reference layer is a first layer of the object.

10. The processing system according to any one of claims 7 to 9, wherein: The control device controls processing in a layer higher than the reference layer using the reference information in the reference layer.

11. The processing system according to claim 10, wherein: The control device controls processing performed by the processing device in a coordinate system defined by a first axis, a second axis, and a third axis that are orthogonal to each other, and The control device uses the reference information in the reference layer to process the upper layer at a coordinate position different from that of the reference layer in the third-axis direction and the same as that of the reference layer in the first-axis direction and the second-axis direction.

12. A processing system comprising: A processing device, comprising an irradiation optical system capable of irradiating a processing light beam, a material supply unit capable of supplying a molding material to a portion where a molten pool is formed by irradiation of the processing light beam, a moving device capable of moving an irradiation position of the processing light beam along a target trajectory based on a processing path, and a deflection optical system capable of deflecting the processing light beam in a direction intersecting the target trajectory, and performing molding of a molding object; a measuring device for acquiring information related to the size of a molten pool formed by irradiation of the processing light beam; and control devices; and The control device controls the processing device based on the measurement result of the measuring device, and changes the measurement target area of ​​the molten pool by the measuring device based on the deflection condition, which is a condition for deflecting the processing beam.

13. The processing system according to claim 12, further comprising a recording device, The recording device records information related to the measurement target area of ​​the molten pool in association with the deflection condition, and The control device changes the measurement target region of the molten pool based on the information on the measurement target region of the molten pool associated with the deflection condition recorded in the recording device.

14. The processing system according to claim 12 or 13, wherein: The deflection optical system is capable of periodically moving the processing light beam along a scanning direction intersecting the target track.

15. The processing system according to any one of claims 12 to 14, wherein: The deflection optical system can move an irradiation position of the processing light beam on the surface of the object on the surface of the object by deflecting the processing light beam.

16. The processing system according to any one of claims 12 to 15, wherein: The deflection condition includes the swing shape of the processing beam, and The control device sets the measurement target area for each swing shape of the processing light beam.

17. A processing system according to any one of claims 12 to 16, wherein: The control device sets the corresponding measurement target area for each scanning direction of the processing light beam.

18. A processing system according to any one of claims 12 to 17, wherein: The control device sets the corresponding measurement target area for each scanning position of the processing light beam.

19. The processing system according to any one of claims 12 to 18, wherein: The control device determines the change in at least one of the swing shape of the processing light beam, the scanning direction of the processing light beam and the scanning position of the processing light beam based on the processing information of the object, and updates the setting of the measurement object area when the determined change exceeds a threshold.

20. The processing system according to any one of claims 12 to 19, wherein: The control device automatically determines a change amount of at least one of a swing shape of the processing beam, a scanning direction of the processing beam, and a scanning position of the processing beam based on the captured image, and updates the setting of the measurement target area based on the determined change amount.

21. The processing system according to claim 20, wherein: The control device automatically determines the amount of change from the image based on a learning model obtained by machine learning.

22. A processing system according to any one of claims 12 to 21, wherein: The user manually sets the measurement target area based on the measurement result of the measurement device.

23. A processing system according to any one of claims 12 to 22, wherein: The changing of the measurement target region of the melt pool by the measuring device includes changing the target region of the image processing related to the melt pool.

24. A processing system according to any one of claims 12 to 23, wherein: The control device controls the processing device based on the measurement result of the measuring device and the target size of the molten pool formed by the processing device, and The target size of the molten pool is changed based on a deflection condition, which is a condition for deflecting the processing beam.

25. The processing system according to claim 24, further comprising a recording device, The recording device records information related to the target size of the molten pool in association with the deflection condition, and The control device changes the target size of the molten pool based on the information on the target size of the molten pool associated with the deflection condition recorded in the recording device.

26. The processing system according to claim 25, wherein: The recording device also records the swinging shapes of the processing light beam, and records the corresponding target size for each of the swinging shapes.

27. The processing system according to claim 25 or 26, wherein: The recording device further records the scanning direction of the processing light beam, and records the corresponding target size for each of the scanning directions.

28. A processing system according to any one of claims 25 to 27, wherein: The recording device also records the scanning position of the processing light beam and records the corresponding target size for each of the scanning positions.

29. A processing system according to any one of claims 25 to 28, wherein: The recording device determines a change in at least one of a swing shape of the processing beam, a scanning direction of the processing beam, and a scanning position of the processing beam based on processing information of the object, and updates the target size when the determined change exceeds a threshold.

30. A processing system according to any one of claims 25 to 29, wherein: The recording device automatically determines a change amount of at least one of a swing shape of the processing beam, a scanning direction of the processing beam, and a scanning position of the processing beam based on the captured image, and updates the target size based on the determined change amount.

31. The processing system according to claim 30, wherein: The recording device automatically determines the amount of change from the image based on a learning model obtained by machine learning.

32. A processing system according to any one of claims 24 to 31, wherein: The deflection optical system is capable of periodically moving the processing light beam along a scanning direction intersecting the target track.

33. A processing system according to any one of claims 24 to 32, wherein: The deflection optical system can move an irradiation position of the processing light beam on the surface of the object on the surface of the object by deflecting the processing light beam.

34. A processing system according to any one of claims 1 to 33, wherein: The processing device further includes a moving device capable of moving the irradiation position of the processing light beam along a target trajectory based on the processing path, and a deflection optical system capable of deflecting the processing light beam in a direction intersecting the target trajectory. The measuring device is capable of acquiring shape information related to the molten pool formed by the processing light beam deflected by the deflection optical system and continuously moving the molten pools at different positions, and The control device controls shaping performed by the processing device based on the shape information.

35. The processing system of claim 34, wherein: The control device performs high-speed laser modulation based on the measurement result of the shape of the molten pool, thereby controlling at least one of laser intensity and heat input.

36. A processing system according to claim 34 or 35, wherein: The control device operates a galvanometer mirror based on the measurement result of the shape of the molten pool, thereby controlling the orbital speed of the processing beam.

37. A processing system according to any one of claims 34 to 36, wherein: The ideal shape of the molten pool is preset in the control device, and The control device calculates the difference between the shape of the molten pool actually measured by the measuring device and the ideal shape, and controls the molding by offsetting the difference, so that the shape of the molten pool actually measured is close to the ideal shape.

38. The processing system of claim 37, wherein: The ideal shape is a shape that is bilaterally symmetrical in the width direction of the molten pool.

39. A processing system according to claim 37 or 38, wherein: A plurality of the ideal shapes are stored in the control device, and the best ideal shape is selected from the plurality of the ideal shapes based on at least one of the swing shape of the processing beam, the scanning direction of the processing beam, the scanning position of the processing beam and the shape of the molten pool actually measured.

40. The processing system of claim 39, wherein: The control device automatically selects the best ideal shape from the plurality of ideal shapes based on a learning model obtained by machine learning.

41. A processing system according to any one of claims 1 to 40, wherein: The processing device further includes a moving device capable of moving the irradiation position of the processing light beam along a target trajectory based on the processing path, and a deflection optical system capable of deflecting the processing light beam in a direction intersecting the target trajectory. The measuring device acquires center position information related to the center position of an area formed by a molten pool, wherein the molten pool is formed at different positions by the processing light beam deflected by the deflection optical system, and The control device controls the shaping performed by the processing device based on the center position information.

42. The processing system according to claim 41, wherein: The control device performs high-speed laser modulation based on the measurement result of the center position of the molten pool, thereby controlling at least one of laser intensity and heat input.

43. The processing system of claim 42, wherein: The control device operates a galvanometer mirror based on the measurement result of the center position of the molten pool, thereby controlling the orbital speed of the processing beam.

44. A processing system according to any one of claims 41 to 43, wherein: The measuring device measures the center position based on the captured image, and The measuring device controls the molding in such a manner that the center position of the molten pool is located at the center of the image.

45. A processing system according to any one of claims 1 to 44, wherein the control device reads information related to the size of the molten pool from the recording device, and controls the processing device in a manner such that the size of the molten pool formed by irradiation of the processing light beam is consistent with the size of the molten pool read from the recording device.

46. ​​A processing system comprising: A processing device, comprising an irradiation optical system capable of irradiating a processing light beam, and a material supplying section capable of supplying a molding material to a portion where a molten pool is formed by irradiation of the processing light beam, and molding a molding object; a measuring device for acquiring information related to a molten pool formed on the first object by irradiation with the processing light beam; a recording device for recording information related to the molten pool and information related to the position of the molten pool acquired by the measuring device in an associated manner; and control devices; and The control device reads information related to the molten pool from the recording device, and controls the processing device so that the molten pool formed on the second object by irradiation with the processing light beam reproduces the molten pool read from the recording device.

47. The processing system of claim 46, wherein: The control device controls the processing device in such a manner as to reproduce the molten pool formed on the first object on the second object based on the information related to the molten pool corresponding to the position on the second object irradiated with the processing light beam and read from the recording device.

48. A processing system according to claim 46 or 47, wherein: The molten pool formed on the first object is a molten pool formed for molding the Mth layer (M>0, a natural number) of the first molded object, and The molten pool formed on the second object is a molten pool formed for molding the Mth layer of the second molded object different from the first object.

49. A processing system according to claim 46 or 47, wherein: The molten pool formed on the first object is a molten pool formed for molding the Mth layer (M>0, a natural number) of the molded object, and The molten pool formed on the second object is a molten pool formed to perform molding of an N-th layer (N is a natural number and N>M) of the molded object.

50. A processing system comprising: A processing device having an irradiation optical system capable of irradiating a processing light beam and processing an object; a measuring device for acquiring information related to a molten pool formed by irradiation of the processing light beam; a recording device for recording information related to the molten pool and information related to the position of the molten pool acquired by the measuring device in an associated manner; and control devices; and The control device controls the processing device based on the information related to the molten pool read out from the recording device.

51. A processing system comprising: A processing device comprising an irradiation optical system capable of irradiating a processing light beam, a first moving device capable of moving an irradiation position of the processing light beam along a target trajectory based on a processing path, and a second moving device capable of moving the processing light beam in a direction intersecting the target trajectory, and processing an object; a measuring device for acquiring information related to a molten pool formed by irradiation of the processing light beam; and control devices; and The control device determines a measurement target region of the measuring device based on a movement condition that is a condition for moving the processing light beam by the second moving device.

52. A processing method comprising the following steps: irradiating a processing beam to the object; Supplying a molding material to a portion where a molten pool is formed by irradiating the processing light beam to mold an object; acquiring information related to the size of a molten pool formed by irradiation of the processing light beam in molding of the Mth layer of the first molded object; recording the acquired information related to the size of the molten pool in the formation of the Mth layer of the first formation in association with the acquired information related to the position of the molten pool; and Based on the information on the size of the molten pool in the Mth layer of the first shaped object, the formation of the molten pool in the Mth layer of the second shaped object different from the first shaped object is controlled.

53. A processing method comprising the following steps: irradiating a processing beam to the object; Supplying a molding material to a portion where a molten pool is formed by irradiating the processing light beam to mold an object; acquiring information related to the size of a molten pool formed by irradiation of the processing light beam in the molding of an M-th layer (a natural number where M>0) of the molded object; recording the acquired information related to the size of the molten pool in the Mth layer of the molten object and the acquired information related to the position of the molten pool in association with each other; and The formation of the molten pool in the Nth layer (N is a natural number and N>M) of the object is controlled based on the information on the size of the molten pool in the Mth layer.

54. A processing method comprising the following steps: irradiating a processing beam to the object; Moving the irradiation position of the processing light beam along a target trajectory based on the processing path; deflecting the processing light beam in a direction intersecting the target trajectory; Supplying a molding material to a portion where a molten pool is formed by irradiating the processing light beam to mold an object; acquiring information related to the size of the molten pool formed by irradiation of the processing light beam; and Modeling is controlled based on the acquired information on the size of the molten pool, and a measurement target area of ​​the molten pool for acquiring the information on the size of the molten pool is changed based on a deflection condition, which is a condition for deflecting the processing beam.

55. A processing method comprising the following steps: irradiating a processing beam to the object; Supplying a molding material to a portion where a molten pool is formed by irradiating the processing light beam to mold an object; acquiring information related to a molten pool formed by irradiation of the processing light beam; recording the acquired information related to the molten pool and the information related to the position of the molten pool in association with each other; and Information related to the molten pool is read out, and molding is controlled so that a molten pool formed by irradiation with the processing light beam reproduces the read molten pool.

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