Capacitor and method for manufacturing capacitor

Abstract

A solid electrolytic capacitor (10) is provided with a main body (11) and an external electrode. The main body (11) is provided with: an element laminate in which a plurality of capacitor elements (20) are laminated; and an insulating resin (50) that covers the element laminate. The main body (11) has an end surface (111) from which the anode electrodes (21) of the plurality of capacitor elements (20) are exposed. The external electrode is formed on the end surface (111). In the end surface (111), a conductive anchoring member (61) is formed on the exposed surface of the anode electrode (21) of the capacitor element (20) and the surface of the insulating resin (50). The coating rate of the conductive anchor member (61) to the surface of the insulating resin (50) in the end surface (111) is 10% or more.

Description

Technical Field

[0001] The present invention relates to a capacitor including an external electrode on an end surface of a main body of a laminated body having a plurality of capacitor elements built therein. Background Art

[0002] Patent document 1 describes a chip-type solid electrolytic capacitor. The solid electrolytic capacitor of Patent document 1 has a component laminate having a first layer and a second layer laminated thereon. The first layer has a valve-acting metal substrate, a dielectric layer, and a solid electrolyte layer. The second layer is made of a metal foil. The component laminate is covered with an insulating resin. The main body of the solid electrolytic capacitor is formed by these component laminates and the insulating resin.

[0003] The first layer is exposed at the first end face of the main body. The second layer is exposed at the second end face of the main body. A first external electrode is formed on the first end face by plating or the like. A second external electrode is formed on the second end face by plating or the like. Thus, the first layer is electrically and physically connected to the first external electrode. The second layer is electrically and physically connected to the second external electrode.

[0004] Prior Art Literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Publication No. 2019-79866 Summary of the invention

[0007] Problem that the invention aims to solve

[0008] However, in the structure described in Patent Document 1, the adhesion strength between the first external electrode and the second external electrode and the main body may be insufficient.

[0009] Therefore, an object of the present invention is to obtain a high contact force between a main body and an external electrode, thereby realizing a capacitor with high reliability.

[0010] Technical solutions to solve problems

[0011] The capacitor of the present invention comprises a main body and external electrodes. The main body comprises an element stacked body in which a plurality of capacitor elements are stacked and an insulating resin covering the element stacked body. The external electrodes are formed on the main body.

[0012] The main body has a first end surface where electrodes of a plurality of capacitor elements are exposed. The external electrode is formed on the first end surface. In the first end surface, a conductive anchor member is formed on the exposed surface of the electrodes of the capacitor element and the surface of the insulating resin. The coverage of the conductive anchor member on the surface of the insulating resin in the first end surface is 10% or more.

[0013] In this structure, a conductive anchor member having high bonding strength with the external electrode is formed on the end surface of the main body forming the external electrode. The conductive anchor member is strongly attached to the surface of the insulating resin. Therefore, the adhesion between the insulating resin and the external electrode is improved.

[0014] Effects of the Invention

[0015] According to the present invention, a high contact strength can be obtained between the main body and the external electrode, and a highly reliable capacitor can be realized. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a perspective view of the appearance of a solid electrolytic capacitor according to an embodiment of the present invention.

[0017] Figure 2 It is a side cross-sectional view showing the structure of a solid electrolytic capacitor according to an embodiment of the present invention.

[0018] Figure 3 This is an enlarged view of a plan view of an end surface of a main body of a solid electrolytic capacitor where an anode electrode is exposed.

[0019] Figure 4 This is a table showing the relationship between the coverage and the adhesion strength.

[0020] Figure 5 This is a flowchart showing an example of a schematic flow of a method for manufacturing a solid electrolytic capacitor according to the present embodiment.

[0021] Figure 6 (A) Figure 6 (B) Figure 6 (C) is a side cross-sectional view of each step of the solid electrolytic capacitor according to the present embodiment.

[0022] Figure 7 It is a diagram of a formation apparatus of a conductive anchor member using the AD method.

[0023] Figure 8 This is a table showing the relationship between the Young's modulus of the insulating resin and the film-forming property of the conductive anchor member. DETAILED DESCRIPTION

[0024] [First embodiment]

[0025] The solid electrolytic capacitor and the method for manufacturing the solid electrolytic capacitor according to the first embodiment of the present invention are described with reference to the drawings. In addition, although the solid electrolytic capacitor is used as an example in the embodiments of the present invention, the structure of the present embodiment can be applied as long as it is a chip capacitor having an external electrode on the end face of the main body. For example, the chip capacitor has a main body containing an insulating resin. The chip capacitor forms a functional part of the capacitor inside the main body. In the chip capacitor, the electrode of the functional part of the capacitor is exposed from the end face of the main body, and has an external electrode formed on the exposed surface.

[0026] (Description of Structure of Solid Electrolytic Capacitor 10)

[0027] Figure 1 It is a perspective view of the appearance of a solid electrolytic capacitor according to an embodiment of the present invention. Figure 2 It is a side cross-sectional view showing the structure of a solid electrolytic capacitor according to an embodiment of the present invention. Figure 2 This is a cross-sectional view formed by planes perpendicular to the top surface, bottom surface, and end surface of the main body of the solid electrolytic capacitor. Figure 2 In order to describe the structure in an easily understandable manner, the dimensions in various directions are appropriately emphasized, and in particular, the dimension in the height direction (z-axis direction in the figure) is emphasized. Figure 3 This is an enlarged view of a plan view of an end surface of a main body of a solid electrolytic capacitor where an anode electrode is exposed.

[0028] like Figure 1 , Figure 2 As shown, the solid electrolytic capacitor 10 includes a main body 11 , a conductive anchor member 61 , a conductive anchor member 62 , a resin electrode 71 , a resin electrode 72 , an external electrode 81 , and an external electrode 82 .

[0029] The main body 11 is in the shape of a rectangular parallelepiped and has a top surface, a bottom surface, an end surface 111, an end surface 112, and two side surfaces. The end surface 111 corresponds to the "first end surface" of the present invention, and the end surface 112 corresponds to the "second end surface" of the present invention. In addition, the top surface and the bottom surface are used for convenience of explanation. When the solid electrolytic capacitor is mounted on a circuit substrate, it does not matter which surface faces the circuit substrate side.

[0030] The main body 11 includes a plurality of capacitor elements 20 , a plurality of cathode electrodes 30 , a plurality of connection layers 40 , an insulating resin 50 , and an insulator layer 500 .

[0031] Capacitor element 20 includes an anode electrode 21 , a dielectric layer 210 , and a CP layer (solid electrolyte layer) 22 .

[0032] The anode electrode 21 is in the form of a flat film, and has a first end face, a second end face, and a flat film surface. The anode electrode 21 is made of aluminum, for example. The anode electrode 21 has an etching layer 21E including a plurality of holes recessed from the flat film surface. Thus, a portion of a given thickness near the flat film surface in the anode electrode 21 is a porous body in a porous state. The thickness ratio of the porous body on one side of the anode electrode 21, the core bone portion, and the porous body on the other side is about 1:1:1.

[0033] The dielectric layer 210 covers the etching layer 21E of the anode electrode 21. The dielectric layer 210 is preferably composed of an oxide film of the anode electrode 21. For example, when aluminum foil is used for the anode electrode 21, the dielectric layer 210 is formed by oxidizing the anode electrode 21 in an aqueous solution containing boric acid, phosphoric acid, adipic acid, or their sodium salts, ammonium salts, etc. The thickness of the dielectric layer 210 is preferably not less than 10 nm and not more than 100 nm. Figure 2 In the figure, the detailed structure of the anode electrode 21 is omitted, so the dielectric layer 210 is schematically illustrated as covering the macroscopic surface (flat film surface) of the anode electrode 21. However, in reality, the dielectric layer 210 not only covers the macroscopic surface (flat film surface) of the anode electrode 21, but also covers the inner surfaces of many holes in the etching layer 21E of the anode electrode 21.

[0034] The CP layer 22 covers the surface of the dielectric layer 210. An insulator layer 500 is formed in a region on the side of the end face 211 in the flat film surface of the anode electrode 21. The formation region of the CP layer 22 is limited by the insulator layer 500. More specifically, the CP layer 22 is in a shape that does not reach the end face 211 in the anode electrode 21.

[0035] With such a structure, the anode electrode 21 and the CP layer 22 face each other with the dielectric layer 210 interposed therebetween, and the capacitor element 20 functions as a capacitor having a predetermined electrostatic capacitance.

[0036] The plurality of capacitor elements 20 and the plurality of cathode electrodes 30 are in the form of flat films. The plurality of capacitor elements 20 and the plurality of cathode electrodes 30 are arranged so that their respective flat film surfaces are substantially parallel to the top and bottom surfaces of the main body 11. The plurality of capacitor elements 20 and the plurality of cathode electrodes 30 are alternately arranged in a direction orthogonal to the top and bottom surfaces (the height direction of the main body 11 (the z-axis direction in the figure)). Figure 2 In the embodiment, the number of the plurality of capacitor elements 20 is 3, and the number of the plurality of cathode electrodes 30 is 4, but the present invention is not limited thereto.

[0037] A connection layer 40 is disposed between adjacent capacitor elements 20 and cathode electrodes 30. The connection layer 40 has conductivity, so that the CP layer 22 of the capacitor element 20 and the cathode electrode 30 are electrically connected.

[0038] In such a stacked state, the end faces 211 (see Figure 2 ) are in substantially the same position when viewed from the side. The end faces 311 of the plurality of cathode electrodes 30 are in substantially the same position when viewed from the side. Moreover, the end faces 211 of the plurality of capacitor elements 20 protrude more than the end faces 312 of the plurality of cathode electrodes 30. In addition, the end faces 311 of the plurality of cathode electrodes 30 protrude more than the end faces 212 of the plurality of capacitor elements 20.

[0039] The capacitor laminate in which the plurality of capacitor elements 20 and the plurality of cathode electrodes 30 are laminated is sealed by the insulating resin 50. More specifically, the insulating resin 50 covers the capacitor laminate so that the end faces 211 of the plurality of capacitor elements 20 and the end faces 311 of the plurality of cathode electrodes 30 are exposed, and the other parts are enclosed. As for the insulating resin 50, for example, epoxy resin, phenolic resin, polyimide resin, silicone resin, polyamide resin, liquid crystal polymer, etc. are preferably used.

[0040] Thus, end faces 211 of capacitor elements 20 are exposed from end face 111 of body 11 to the outside of body 11. Also, end faces 311 of cathode electrodes 30 are exposed from end face 112 of body 11 to the outside of body 11.

[0041] The conductive anchor members 61 and 62 are a group of particles made of a conductive material. From the viewpoint of conductivity and a formation method described below, the conductive anchor members 61 and 62 are preferably metal, and more preferably contain at least one of copper, nickel, tin, and zinc.

[0042] like Figure 3 As shown, the conductive anchor member 61 is formed on the end surface 111 of the main body 11. More specifically, the conductive anchor member 61 is formed on the end surface 211 of the anode electrode 21 of the plurality of capacitor elements 20. The conductive anchor member 61 is formed with a given thickness (height) from the end surface 211. That is, the conductive anchor member 61 protrudes outward from the end surface 111 of the main body 11.

[0043] Furthermore, the conductive anchor member 61 is formed at a given coverage (described in detail later) on the surface of the insulating resin 50 at the end surface 111 of the main body 11. Here, the coverage can be represented by the ratio (percentage) of the area of ​​the surface of the insulating resin 50 at the end surface 111 of the main body 11 covered by the conductive anchor member 61 relative to the surface area.

[0044] In addition, the coverage rate is calculated as follows. First, Figure 2In the solid electrolytic capacitor 10 shown, the end face 111 of the insulating resin 50 on which the conductive anchor member 61 is formed is exposed. Then, by observing with an optical microscope and analyzing the obtained image, it is possible to obtain. That is, by binarizing the obtained image and distinguishing the two, the area of ​​the portion of the insulating resin 50 and the area of ​​the portion of the conductive anchor member 61 can be calculated. Then, the ratio of the area of ​​the portion of the conductive anchor member 61 to the sum of the area of ​​the portion of the insulating resin 50 and the area of ​​the portion of the conductive anchor member 61 can be calculated as the coverage rate.

[0045] At this time, the conductive anchor member 61 preferably has a portion protruding from the surface of the insulating resin 50. Furthermore, the surface formed by the conductive anchor member 61 preferably has projections and depressions.

[0046] The conductive anchor member 62 is formed on the end surface 112 of the main body 11. More specifically, the conductive anchor member 62 is formed on the end surface 311 of the cathode electrode 30 of the plurality of capacitor elements 20. The conductive anchor member 62 is formed with a given thickness (height) from the end surface 311. That is, the conductive anchor member 62 protrudes outward from the end surface 112 of the main body 11.

[0047] Furthermore, the conductive anchor member 62 is formed at a given coverage (described in detail later) on the surface of the insulating resin 50 in the end face 112 of the main body 11. Here, the coverage can be represented by the ratio (percentage) of the area of ​​the surface of the insulating resin 50 in the end face 112 of the main body 11 covered by the conductive anchor member 62 relative to the surface area.

[0048] In addition, the coverage can be obtained in the same manner as in the case of the conductive anchor member 61 .

[0049] At this time, the conductive anchor member 62 preferably has a portion protruding from the surface of the insulating resin 50. Furthermore, the surface formed by the conductive anchor member 62 preferably has irregularities.

[0050] The specific formation method and specific shape of the conductive anchor members 61 and 62 will be described later.

[0051] The resin electrode 71 contacts and covers the end face 111 of the body 11 and the conductive anchor member 61. The resin electrode 72 contacts and covers the end face 112 of the body 11 and the conductive anchor member 62.

[0052] The external electrode 81 is a laminated structure of an electrode film 811 and an electrode film 812. The electrode film 811 covers the outer surface of the resin electrode 71. The electrode film 812 covers the outer surface of the electrode film 811. The external electrode 82 is a laminated structure of an electrode film 821 and an electrode film 822. The electrode film 821 covers the outer surface of the resin electrode 72. The electrode film 822 covers the outer surface of the electrode film 821.

[0053] The resin electrode 71 and the external electrode 81 constitute the “first external electrode” of the present invention. The resin electrode 72 and the external electrode 82 constitute the “second external electrode” of the present invention.

[0054] With the above-described structure, the solid electrolytic capacitor 10 is realized.

[0055] (Relationship between coverage and close contact)

[0056] Figure 4 This is a table showing the relationship between the coverage and the adhesion strength. Figure 4 The adhesion strength shown is the adhesion strength between the main body 11 and the resin electrode 71. The adhesion strength NL shows a state with a certain degree of adhesion. The adhesion strength GD shows a state with adhesion that can reliably obtain the desired reliability in actual use. The adhesion strength VG shows a state with a higher adhesion than the adhesion strength GD.

[0057] Figure 4 1 is a table showing the relationship between the aforementioned coverage and adhesion strength. As mentioned above, the coverage is the ratio of the surface area of ​​the insulating resin 50 in the end surface 111 of the main body 11 covered by the conductive anchor member 61. In addition, the adhesion strength shows the degree of adhesion between the main body 11 and the resin electrode 71. Figure 4 NL, GD, and VG in the figure qualitatively indicate the degree of close contact. That is, NL indicates a state with a certain degree of close contact. GD indicates a state with a close contact that can reliably obtain the desired reliability in actual use. VG indicates a state with a higher close contact than the state of GD.

[0058] like Figure 4 As shown in FIG. 1 , if the coverage is 10% or more, the desired reliability can be reliably obtained in actual use, and if the coverage is 20% or more, a higher adhesion can be achieved more reliably.

[0059] The same relationship can be obtained in the main body 11 and the resin electrode 72.

[0060] Therefore, in the solid electrolytic capacitor 10 , the coverage is set to 10% or more, and more preferably, the coverage is set to 20% or more. Thus, the solid electrolytic capacitor 10 can obtain high adhesion between the body and the external electrodes, and can achieve high reliability.

[0061] (Method of Manufacturing Solid Electrolytic Capacitor 10)

[0062] Solid electrolytic capacitor 10 having the above-described structure is manufactured, for example, as follows. Figure 5 This is a flowchart showing an example of a schematic flow of a method for manufacturing a solid electrolytic capacitor according to the present embodiment. Figure 6 (A) Figure 6 (B) Figure 6 (C) is a side cross-sectional view of each step of the solid electrolytic capacitor according to the present embodiment. Figure 7 It is a diagram of a formation apparatus of a conductive anchor member using the AD method.

[0063] The main body 11 is formed (S11). Specifically, Figure 6 As shown in (A), a plurality of capacitor elements 20 and a plurality of cathode electrodes 30 are stacked in sequence with a connection layer 40 sandwiched therebetween to form a stacked body. The stacked body is sealed with an insulating resin 50 to form a main body 11. The anode electrodes 21 of the plurality of capacitor elements 20 and the plurality of cathode electrodes 30 include, for example, aluminum. The solid electrolyte layer of the plurality of capacitor elements 20 includes, for example, a conductive polymer. The insulating resin 50 is obtained by applying a given insulating resin material and curing it.

[0064] Then, if Figure 6 As shown in (B), the conductive anchor member 61 is formed on the end surface 211 of the anode electrode 21 of the plurality of capacitor elements 20 in the body 11 by using the AD method (S12).

[0065] More specifically, if Figure 7 As shown, a plurality of bodies 11 are fixed on a stage 92 and arranged in a cavity 91. At least the front end (discharging end) of an aerosol generator 93 is inserted into the cavity 91. The aerosol generator 93 generates aerosol by introducing copper powder (Cu powder) 600 into a carrier gas, and sprays the aerosol toward the end surface 111 of the body 11.

[0066] At this time, by appropriately setting the specifications of the aerosol (for example, the volume ratio of the copper powder 600 contained in the carrying gas, etc.) and the blowing conditions (for example, the number of blowings, the blowing intensity, etc.), the copper powder 600 hits the end surface 111 of the main body 11 and is stacked at a given height (given thickness).

[0067] Thus, the conductive anchor member 61 is formed on the end surface 211 of the anode electrode 21 and the surface of the insulating resin 50 in the end surface 111 of the main body 11 (see Figure 6 (B)). In this case, the particle size of the copper powder 600 is, for example, about 3 μm, but may be 2 μm or less.

[0068] Furthermore, by using the AD method, a part of the copper powder forming the conductive anchor member 61 is embedded in the surface of the insulating resin 50, and a given anchoring effect can be achieved. In addition, by using the AD method, it is easy to stack more copper powder on the copper powder embedded in the surface of the insulating resin 50. Furthermore, by using the AD method, the thickness of the conductive anchor member 61 can be controlled, and it is possible to form unevenness on the surface. As a result, the anchoring effect is further improved.

[0069] Next, the conductive anchor member 62 is formed on the end surface 311 of the plurality of cathode electrodes 30 in the main body 11 by using the AD method (S13). The method for forming the conductive anchor member 62 is the same as the method for forming the conductive anchor member 61, and the description thereof is omitted (refer to Figure 6 (B)).

[0070] Next, the resin electrode 71 is formed so as to cover the end face 111 of the main body 11 and the conductive anchor member 61. In addition, the resin electrode 72 is formed so as to cover the end face 112 of the main body 11 and the conductive anchor member 62 (S15). Specifically, the resin electrode 71 is formed of a paste material in which conductive particles such as silver (Ag) are kneaded into a resin. The paste material is applied so as to cover the end face 111 of the main body 11 and the conductive anchor member 61, and then cured, thereby forming the resin electrode 71 (see Figure 6 The resin electrode 72 is also formed by the same method as the resin electrode 71, so the description thereof is omitted (see Figure 6 (C)).

[0071] Next, an external electrode 81 is formed on the surface of the resin electrode 71, and an external electrode 82 is formed on the surface of the resin electrode 72 (S15). Specifically, the external electrode 81 includes an electrode film 811 and an electrode film 812, and is formed by plating. For example, the electrode film 811 is a nickel (Ni) plating layer, and the electrode film 812 is a tin (Sn) plating layer. The external electrode 82 is also formed by plating in the same manner as the external electrode 81. For example, the electrode film 821 is a nickel (Ni) plating layer, and the electrode film 822 is a tin (Sn) plating layer. In addition, the thickness of the terminal electrode including the resin electrode 71 and the external electrode 81 and the thickness of the terminal electrode including the resin electrode 72 and the external electrode 82 are preferably greater than 8μm and less than 20μm.

[0072] By using the above-described manufacturing method, the solid electrolytic capacitor 10 having the above-described structure can be manufactured easily and more reliably.

[0073] [Second embodiment]

[0074] A solid electrolytic capacitor according to a second embodiment of the present invention will be described with reference to the drawings. The solid electrolytic capacitor according to the second embodiment is the same as the solid electrolytic capacitor 10 according to the first embodiment in that the material of the insulating resin 50 is specified. The other structures of the solid electrolytic capacitor according to the second embodiment are the same as those of the solid electrolytic capacitor according to the first embodiment, and descriptions of the same parts are omitted.

[0075] Figure 8 TABLE 1 is a table showing the relationship between the Young's modulus of the insulating resin and the film-forming property of the conductive anchor member. Figure 8 In the figure, the film forming property NG indicates a state where the conductive anchor members 61 and 62 can hardly be formed into a film on the surface of the insulating resin 50. The film forming property GD indicates a state where the conductive anchor members 61 and 62 can be formed into a film on the surface of the insulating resin 50. The film forming property VG indicates a state where the conductive anchor members 61 and 62 can be formed into a film more reliably than the film forming property GD.

[0076] In addition, the Young's modulus of the insulating resin 50 is a value obtained from a test piece made of the same material prepared separately. In this case, the Young's modulus is calculated by measuring the test piece using a method and apparatus in accordance with the JIS standard for plastic bending (JIS K 7171) or plastic tensile (JIS K 7161) and analyzing the obtained data.

[0077] like Figure 8 As shown, if the Young's modulus is 9.0 or more, the desired film-forming property of the conductive anchor members 61 and 62 on the surface of the insulating resin 50 can be reliably ensured. Furthermore, if the Young's modulus is 12 or more, the desired film-forming property of the conductive anchor members 61 and 62 on the surface of the insulating resin 50 can be more reliably ensured.

[0078] Thus, by setting the Young's modulus of the insulating resin 50 to 9.0 or more, the bonding strength between the main body 11 and the resin electrodes 71 and 72 is improved. That is, the solid electrolytic capacitor 10 can achieve high reliability. Furthermore, by setting the Young's modulus of the insulating resin 50 to 12.0 or more, the bonding strength between the main body 11 and the resin electrodes 71 and 72 is further improved, and the solid electrolytic capacitor 10 can achieve higher reliability.

[0079] In addition, this table shows the film-forming property for the insulating resin, and does not depend on the Young's modulus of the insulating resin shown below. The conductive anchor members 61 and 62 can be formed at a desired height on the end surface 211 of the anode electrode 21 and the end surface 311 of the cathode electrode 30. As a result, the electrical connection and physical connection between the anode electrode 21 and the resin electrode 71, and the electrical connection and physical connection between the cathode electrode 30 and the resin electrode 72 can be ensured to a great extent.

[0080] In addition, although the cathode electrode 30 is used in the above-mentioned embodiments, the cathode electrode 30 may be omitted. In this case, the solid electrolytic capacitor only needs to have the above-mentioned structure at least on the end surface 111 (the surface where the anode electrode 21 is exposed).

[0081] The resin electrodes 71 and 72 may be omitted. In this case, the external electrode 81 is formed directly after the conductive anchor member 61 is formed on the end surface 111 of the body 11. The external electrode 82 is formed directly after the conductive anchor member 62 is formed on the end surface 112.

[0082] <1>

[0083] A capacitor having:

[0084] A main body including an element stack having a plurality of capacitor elements stacked thereon and an insulating resin covering the element stack; and

[0085] External electrodes, formed on the body,

[0086] The main body has a first end surface exposing electrodes of the plurality of capacitor elements,

[0087] The external electrode is formed on the first end surface,

[0088] A conductive anchor member is formed on the first end surface at an exposed surface of the electrode of the capacitor element and on a surface of the insulating resin.

[0089] The coverage rate of the conductive anchor member on the surface of the insulating resin at the first end surface is 10% or more.

[0090] <2>

[0091] According to the capacitor of <1>,

[0092] The coverage rate is above 20%.

[0093] <3>

[0094] A capacitor according to <1> or <2>, wherein

[0095] The plurality of capacitor elements include:

[0096] The anode electrode is composed of a flat film-shaped valve-acting metal body;

[0097] A dielectric layer formed on the anode electrode; and

[0098] A solid electrolyte layer covers the dielectric layer.

[0099] <4>

[0100] According to the capacitor of <3>, wherein,

[0101] comprising: a plurality of cathode electrodes disposed between the plurality of capacitor elements and connected to the solid electrolyte layer,

[0102] The main body has a second end surface, facing the first end surface, and exposing the plurality of cathode electrodes.

[0103] The external electrode includes: a first external electrode formed on the first end surface; and a second external electrode formed on the second end surface.

[0104] In the second end surface, a conductive anchor member is formed on an exposed surface of the cathode electrode and a surface of the insulating resin.

[0105] The coverage rate of the conductive anchor member on the surface of the insulating resin at the second end surface is 10% or more.

[0106] <5>

[0107] According to the capacitor of <4>, wherein,

[0108] The coverage rate is above 20%.

[0109] <6>

[0110] The capacitor according to any one of <1> to <5>, wherein

[0111] The conductive anchor member is made of at least one of copper, nickel, tin, and zinc.

[0112] <7>

[0113] The capacitor according to any one of <1> to <6>, wherein

[0114] The insulating resin has a Young's modulus of 9.0 or more.

[0115] <8>

[0116] The capacitor according to any one of <1> to <7>, wherein

[0117] The external electrode comprises:

[0118] a resin electrode connected to the electrodes of the plurality of capacitor elements and the insulating resin via the conductive anchor member; and

[0119] A plating electrode is provided to cover the resin electrode.

[0120] <9>

[0121] A method for manufacturing a capacitor, comprising:

[0122] The step of stacking a plurality of capacitor elements to form an element stack;

[0123] The step of covering the element stack with an insulating resin to form a main body;

[0124] forming the conductive anchor member by an AD method on a first end surface of the main body where electrodes of the plurality of capacitor elements are exposed; and

[0125] forming an external electrode on the first end surface of the main body,

[0126] The coverage rate of the conductive anchor member on the surface of the insulating resin at the first end surface is 10% or more.

[0127] Description of Reference Numerals

[0128] 10: Solid electrolytic capacitor;

[0129] 11: Subject;

[0130] 20: Capacitor element;

[0131] 21: anode electrode;

[0132] 21E: Etching layer;

[0133] 22: CP layer;

[0134] 30: cathode electrode;

[0135] 40: connection layer;

[0136] 50: Insulating resin;

[0137] 61, 62: conductive anchoring member;

[0138] 71, 72: resin electrodes;

[0139] 81, 82: external electrodes;

[0140] 91: cavity;

[0141] 92: Taiwan;

[0142] 93: Aerosol generator;

[0143] 111, 112: end face;

[0144] 210: dielectric layer;

[0145] 211, 212, 311, 312: end face;

[0146] 500: insulator layer;

[0147] 600: copper powder;

[0148] 811, 812, 821, 822: electrode membrane.

Claims

1. A capacitor having: A main body including an element stack having a plurality of capacitor elements stacked thereon and an insulating resin covering the element stack; and External electrodes, formed on the body, The main body has a first end surface exposing electrodes of the plurality of capacitor elements, The external electrode is formed on the first end surface, A conductive anchor member is formed on the first end surface at an exposed surface of the electrode of the capacitor element and on a surface of the insulating resin. The coverage rate of the conductive anchor member on the surface of the insulating resin at the first end surface is 10% or more.

2. The capacitor according to claim 1, wherein: The coverage rate is above 20%.

3. The capacitor according to claim 1 or claim 2, wherein: The plurality of capacitor elements include: The anode electrode is composed of a flat film-shaped valve-acting metal body; A dielectric layer formed on the anode electrode; as well as A solid electrolyte layer covers the dielectric layer.

4. The capacitor according to claim 3, wherein: have: a plurality of cathode electrodes disposed between the plurality of capacitor elements and connected to the solid electrolyte layer; The subject has: The second end surface is opposite to the first end surface and exposes the plurality of cathode electrodes. The external electrode comprises: a first external electrode formed on the first end surface; and a second external electrode formed on the second end surface, In the second end surface, a conductive anchor member is formed on an exposed surface of the cathode electrode and a surface of the insulating resin. The coverage rate of the conductive anchor member on the surface of the insulating resin at the second end surface is 10% or more.

5. The capacitor according to claim 4, wherein: The coverage rate is above 20%.

6. The capacitor according to any one of claims 1 to 5, wherein: The conductive anchor member is made of at least one of copper, nickel, tin, and zinc.

7. The capacitor according to any one of claims 1 to 6, wherein: The insulating resin has a Young's modulus of 9.0 or more.

8. The capacitor according to any one of claims 1 to 7, wherein: The external electrode comprises: a resin electrode connected to the electrodes of the plurality of capacitor elements and the insulating resin via the conductive anchor member; and A plating electrode is provided to cover the resin electrode.

9. A method for manufacturing a capacitor, comprising: The step of stacking a plurality of capacitor elements to form an element stack; The step of covering the element stack with an insulating resin to form a main body; forming a conductive anchor member by an AD method on a first end surface of the main body where electrodes of the plurality of capacitor elements are exposed; as well as forming an external electrode on the first end surface of the main body, The coverage rate of the conductive anchor member on the surface of the insulating resin at the first end surface is 10% or more.

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