Substrate processing apparatus

Abstract

In a substrate processing apparatus (1), a posture conversion region (R3) is provided between a transfer block (5) and a batch processing region (R1), a single substrate conveyance region (R4) is adjacent to the transfer block (5) and the posture conversion region (R3), and a single substrate processing region (R5) is adjacent to the single substrate conveyance region (R4). The center robot CR in the single substrate conveyance region R4 conveys the substrate among the second posture conversion mechanism 35 in the posture conversion region R3, the single processing chambers SW1 and SW2 in the single processing region R5, and the buffer part 27. The center robot CR is provided with: a horizontally movable hand 37A, and a substrate holding a horizontal posture; and a lifting table (41) that lifts and lowers the hand (37A) and is fixed at a position in the horizontal direction XY.

Description

Technical Field

[0001] The present invention relates to a substrate processing device for processing a substrate. Examples of the substrate include semiconductor substrates, substrates for FPD (flat panel display), glass substrates for photomasks, substrates for optical disks, substrates for magnetic disks, ceramic substrates, and substrates for solar cells. Examples of FPD include liquid crystal display devices, organic EL (electroluminescence) display devices, and the like. Background Art

[0002] As a conventional substrate processing apparatus, there is a hybrid substrate processing apparatus (see, for example, patent documents 1 and 2), which comprises: a batch processing module (batch processing unit) for processing a plurality of substrates at a time; and a single-wafer processing module (single-wafer processing unit) for processing substrates processed by the batch processing module one by one.

[0003] The substrate processing device of patent document 1 comprises: a load port for receiving a cassette; a first robot; two rotating mechanisms for rotating the wafer between a vertical position and a horizontal position; two slots arranged in a row between the two rotating mechanisms; a second robot capable of transporting the wafer in a vertical position between the two rotating mechanisms and the two slots; a plurality of single-wafer cleaning modules for cleaning and drying; and a third robot.

[0004] A plurality of single-wafer cleaning modules are arranged in a row. A first robot takes out five wafers from a cassette at a time and transports the five wafers to a first rotating mechanism. A third robot takes out a wafer from a second rotating mechanism and transports the wafer to a single-wafer cleaning module. The first robot takes out a wafer from a single-wafer cleaning module among a plurality of single-wafer cleaning modules and returns the wafer to the cassette.

[0005] The substrate processing apparatus of Patent Document 2 includes a loading and unloading section, a single-wafer processing section (area), an interface section, and a batch processing section (area). The loading and unloading section includes a cassette stage. The substrate processing apparatus of Patent Document 3 includes a posture conversion mechanism.

[0006] Prior art literature

[0007] Patent Literature

[0008] Patent Document 1: Japanese Patent Application No. 2016-502275

[0009] Patent Document 2: Japanese Patent Application Publication No. 2021-064652

[0010] Patent Document 3: Japanese Patent Application Publication No. 2018-056341 Summary of the invention

[0011] Problems to be solved by the invention

[0012] Conventional substrate processing devices have the following problems. For example, in the substrate processing device of Patent Document 1, the first robot moves along a plurality of single-wafer cleaning modules while taking out five wafers from the cassette at one time and transporting the five wafers to the first rotating mechanism. In addition, the first robot moves along a plurality of single-wafer cleaning modules while taking out a wafer from one of the plurality of single-wafer cleaning modules and returning the wafer to the cassette. Therefore, there is the possibility that the first robot is busy, thereby reducing the throughput of the substrate processing device.

[0013] In addition, in the substrate processing device of patent document 2, the loading and unloading section, the single-chip processing section, the interface section, and the batch processing section are arranged in sequence. The substrate taken out from the cassette is transported from the loading and unloading section to the interface section while passing through the single-chip processing section. Then, in order to process in the batch processing section, a batch (lot) consisting of a plurality of substrates in a vertical posture is formed in the interface section. That is, the batch is not directly transported from the loading and unloading section to the batch processing section. Therefore, there is a possibility of reducing the processing capacity of the substrate processing device.

[0014] The present invention has been made in view of such circumstances, and an object of the present invention is to provide a substrate processing apparatus capable of improving the processing throughput.

[0015] Means for solving problems

[0016] In order to achieve this purpose, the present invention adopts the following structure. That is, the substrate processing device of the present invention is used to continuously perform batch processing of processing a plurality of substrates at a time and single-wafer processing of processing substrates one by one, and is characterized in that the substrate processing device has: a carrier loading rack, which carries a carrier, and the carrier accommodates a plurality of substrates in a horizontal posture at predetermined intervals along a vertical direction; a transfer block, which is adjacent to the carrier loading rack; a processing block, which is adjacent to the transfer block; and a substrate loading section, which carries a substrate; the transfer block has: a first posture conversion mechanism, which converts the plurality of substrates taken out from the carrier from a horizontal posture to a vertical posture; and a substrate operating mechanism for conveying a plurality of substrates in a horizontal posture between the carrier mounted on the carrier mounting rack, the first posture conversion mechanism and the substrate mounting portion; the processing block comprises: a batch processing area extending in a direction away from the transfer block; a batch substrate conveying area arranged along the batch processing area, one end side extending to the transfer block, and the other end side extending in a direction away from the transfer block; a posture conversion area arranged between the transfer block and the batch processing area; a single-sheet substrate conveying area connected to the transfer block and the posture conversion mechanism. The single-wafer processing area is adjacent to the single-wafer substrate conveying area; in the batch processing area, a plurality of batch processing slots for processing a plurality of substrates in a vertical posture are arranged in the direction in which the batch processing area extends; a second posture conversion mechanism is provided in the posture conversion area, and the second posture conversion mechanism converts the plurality of substrates processed in batches from a vertical posture to a horizontal posture; a batch substrate conveying mechanism is provided in the batch substrate conveying area, and the batch substrate conveying mechanism is provided at the substrate handover position set in the transfer block, the plurality of batch processing slots and the A plurality of the substrates in a vertical posture are transported together between the second posture conversion mechanism; a plurality of single-wafer processing chambers for processing substrates in a horizontal posture one by one are provided in the single-wafer processing area; a horizontal substrate transport mechanism is provided in the single-wafer substrate transport area, and the horizontal substrate transport mechanism can transport substrates in a horizontal posture one by one between the second posture conversion mechanism, the plurality of the single-wafer processing chambers and the substrate loading part; the horizontal substrate transport mechanism comprises: a hand capable of moving horizontally to hold the substrate in a horizontal posture; and a lifting platform to lift and lower the hand, and fix the horizontal position.

[0017] According to the substrate processing device of the present invention, the posture conversion area (including the second posture conversion mechanism) is arranged between the transfer block and the batch processing area. In addition, the single-chip substrate conveying area is adjacent to the transfer block and the posture conversion area. Moreover, the single-chip processing area (including a plurality of single-chip processing chambers) is adjacent to the single-chip substrate conveying area. In addition, the horizontal position of the lifting platform of the horizontal substrate conveying mechanism arranged in the single-chip substrate conveying area is fixed. Therefore, the transfer block, the second posture conversion mechanism and the plurality of single-chip processing chambers can be arranged around the horizontal substrate conveying mechanism. Thus, the conveying distance of the substrate of the horizontal substrate conveying mechanism, for example, can be shortened, and therefore, the substrate can be efficiently conveyed. In addition, the batch substrate conveying mechanism can convey a plurality of substrates at a time between the substrate handover position in the transfer block, the plurality of batch processing tanks and the second posture conversion mechanism. As a result, the processing volume can be improved.

[0018] In addition, preferably, in the substrate processing device, the second posture conversion mechanism has a substrate waiting area and a posture conversion execution area arranged along the direction extending from the batch processing area; a substrate holding part is provided in the substrate waiting area, and the substrate holding part holds the plurality of substrates transported by the batch substrate transporting mechanism in a vertical posture; a posture conversion part is provided in the posture conversion execution area, and the posture conversion part has: two clamps for holding the plurality of substrates; a longitudinal rotating part for rotating the two clamps around a horizontal axis; and a horizontal moving part for moving the two clamps and the longitudinal rotating part between a position above the substrate holding part and a preset position in the posture conversion execution area; the posture conversion part uses the two clamps in the substrate waiting area to receive the plurality of substrates from the substrate holding part, and uses the longitudinal rotating part in the posture conversion execution area to convert the posture of the plurality of substrates from vertical to horizontal.

[0019] In the width direction perpendicular to the direction in which the batch processing area extends, the width of the posture conversion area where the second posture conversion mechanism is arranged becomes smaller. Therefore, the width of the substrate processing apparatus can be suppressed to be small.

[0020] In addition, preferably, in the substrate processing device, the horizontal substrate transport mechanism is suspended above the single-chip substrate transport area. This can prevent the horizontal substrate transport mechanism from being contaminated by droplets falling from the wet substrate. For example, it can prevent the horizontal substrate transport mechanism from malfunctioning due to contamination.

[0021] In addition, preferably, in the substrate processing device, the single-chip processing area is arranged on the opposite side of the transfer block across the single-chip substrate conveying area, and is arranged adjacent to the posture conversion area. The width of the transfer block is large in the width direction orthogonal to the direction in which the batch processing area extends. Since the single-chip substrate conveying area is arranged in a manner opposite to the transfer block, the width of the substrate processing device can be suppressed to be small.

[0022] In addition, preferably, in the substrate processing device, the processing block further has a second single-wafer processing area, and the second single-wafer processing area is arranged on the opposite side of the posture conversion area across the single-wafer substrate conveying area. Since the single-wafer processing area becomes larger, more single-wafer processing chambers can be configured. Therefore, the processing capacity of single-wafer processing can be increased.

[0023] In addition, the substrate processing device of the present invention is used for continuously performing batch processing of processing a plurality of substrates at a time and single-wafer processing of processing substrates one by one, and is characterized in that the substrate processing device comprises: a carrier loading rack, which carries a carrier, and the carrier accommodates a plurality of substrates in a horizontal posture at predetermined intervals along a vertical direction; a transfer block, which is adjacent to the carrier loading rack; and a processing block, which is adjacent to the transfer block; the transfer block comprises: a first posture conversion mechanism, which converts the plurality of substrates taken out from the carrier from a horizontal posture to a vertical posture A vertical posture; and a horizontal substrate transport mechanism for transporting substrates in a horizontal posture; the processing block comprises: a batch processing area extending in a direction away from the transfer block; a batch substrate transport area arranged along the batch processing area, one end side extending to the transfer block, and the other end side extending in a direction away from the transfer block; a posture conversion area arranged between the transfer block and the batch processing area; a single-chip substrate transport area adjacent to the transfer block and the posture conversion area; and a single-chip processing area adjacent to the single-chip substrate transport area The domains are adjacent; in the batch processing area, a plurality of batch processing slots for processing a plurality of substrates in a vertical posture are arranged in the direction in which the batch processing area extends; a second posture conversion mechanism is provided in the posture conversion area, and the second posture conversion mechanism converts the plurality of substrates processed in batches from a vertical posture to a horizontal posture; a batch substrate conveying mechanism is provided in the batch substrate conveying area, and the batch substrate conveying mechanism conveys a plurality of substrates in a vertical posture between a substrate handover position set in the transfer block, a plurality of batch processing slots and the second posture conversion mechanism; a plurality of single-wafer processing chambers are provided in the single-wafer processing area for processing substrates in a horizontal posture one by one; the horizontal substrate conveying mechanism can convey substrates in a horizontal posture between the carrier mounted on the carrier mounting shelf, the first posture conversion mechanism, the second posture conversion mechanism and the plurality of single-wafer processing chambers; the horizontal substrate conveying mechanism comprises: a hand capable of horizontal movement, a substrate maintaining a horizontal posture; and a lifting platform for lifting and lowering the hand, and fixing the horizontal position.

[0024] According to the substrate processing device of the present invention, the posture conversion area (including the second posture conversion mechanism) is arranged between the transfer block and the batch processing area. In addition, the single-chip substrate conveying area is adjacent to the transfer block and the posture conversion area. Moreover, the single-chip processing area (including a plurality of single-chip processing chambers) is adjacent to the single-chip substrate conveying area. In addition, the horizontal position of the lifting platform of the horizontal substrate conveying mechanism arranged in the transfer block is fixed. Therefore, the carrier, the first posture conversion mechanism, the second posture conversion mechanism and a plurality of single-chip processing chambers placed on the carrier loading shelf can be arranged around the horizontal substrate conveying mechanism. Thus, the conveying distance of the substrate of the horizontal substrate conveying mechanism, for example, can be shortened, so that the substrate can be efficiently conveyed. In addition, the batch substrate conveying mechanism can convey a plurality of substrates at a time between the substrate handover position in the transfer block, the plurality of batch processing tanks and the second posture conversion mechanism. In addition, in particular, the substrate taken out from the single-chip processing chamber can be directly conveyed to the carrier of the carrier loading shelf. As a result, the processing volume can be improved.

[0025] Effects of the Invention

[0026] According to the substrate processing apparatus of the present invention, it is possible to improve the processing throughput. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a top view showing a schematic structure of the substrate processing apparatus according to the first embodiment.

[0028] Figure 2 It is a side view showing the substrate operating mechanism.

[0029] Figure 3 (a) to (f) are side views for explaining the first posture conversion mechanism (posture changing section and pusher mechanism) of the transfer block.

[0030] Figure 4 (a) is a top view showing the second posture conversion mechanism, and (b) is a front view showing the second posture conversion mechanism.

[0031] Figure 5 It is a front view of two clamps (a horizontal holding part and a vertical holding part) for explaining the posture conversion part.

[0032] Figure 6 This is a flowchart for explaining the operation of the substrate processing apparatus.

[0033] Figure 7 This is a flowchart for explaining the operation of the second posture transition mechanism.

[0034] Figure 8 (a) to (c) are front views for explaining the operation of the front half of the second posture conversion mechanism.

[0035] Fig. 9 (a) to (c) are plan views for explaining the operation of the front half of the second posture conversion mechanism.

[0036] Fig.10 (a) to (c) are front views for explaining the operation of the second half of the second posture conversion mechanism.

[0037] Fig.11 (a) to (c) are plan views for explaining the operation of the second half of the second posture conversion mechanism.

[0038] Fig.12 (a) is a top view of the second posture conversion mechanism of the second embodiment, and (b) is a front view of the second posture conversion mechanism of the second embodiment.

[0039] Fig.13 It is a top view showing the schematic structure of the substrate processing apparatus of Example 3.

[0040] Fig.14 It is a plan view schematically showing the structure of a substrate processing apparatus according to a modified example.

[0041] Fig.15 It is a plan view schematically showing the structure of a substrate processing apparatus according to a modified example.

[0042] Fig.16 It is a side view of the center robot showing a modified example. DETAILED DESCRIPTION

[0043] Example 1

[0044] Hereinafter, Embodiment 1 of the present invention will be described with reference to the drawings. Figure 1 It is a plan view showing a schematic structure of the substrate processing apparatus 1 according to the first embodiment. Figure 2 It is a side view showing the substrate handling mechanism HTR.

[0045] <1. Overall structure>

[0046] Reference Figure 1 The substrate processing apparatus 1 includes a storage block 3, a transfer block 5, and a processing block 7. The storage block 3, the transfer block 5, and the processing block 7 are arranged in a row in this order in the horizontal direction.

[0047] The substrate processing device 1 performs, for example, chemical liquid processing, cleaning processing, and drying processing on the substrate W. The substrate processing device 1 continuously performs batch processing and single-wafer processing on the substrate W. That is, the substrate processing device 1 performs single-wafer processing on the substrate W after performing batch processing. Batch processing is a processing method for processing a plurality of substrates W at once. Single-wafer processing is a processing method for processing substrates W one by one.

[0048] For the sake of convenience in this specification, the direction in which the storage block 3, the transfer block 5, and the processing block 7 are arranged is referred to as the "front-to-back direction X". The front-to-back direction X is horizontal. The direction from the transfer block 5 toward the storage block 3 in the front-to-back direction X is referred to as the "front". The direction opposite to the front is referred to as the "rear". The horizontal direction perpendicular to the front-to-back direction X is referred to as the "width direction Y". One direction of the width direction Y is appropriately referred to as the "right". The direction opposite to the right is referred to as the "left". The direction perpendicular to the horizontal direction is referred to as the "vertical direction Z". For example, in Figure 1 , the front, rear, left, right, top, and bottom are appropriately shown as references.

[0049] <2. Storage Block>

[0050] The storage block 3 accommodates at least one carrier C. The storage block 3 is provided with one or more than two (for example, two) loading ports 9. The storage block 3 has a carrier transport mechanism (robot) 11 and a rack 13.

[0051] The carrier transport mechanism 11 transports the carrier C between the loading port 9 and the rack 13. The carrier transport mechanism 11 has a gripping portion or hand for gripping a protrusion on the upper surface of the carrier C, and the hand for supporting the carrier C while contacting the bottom surface of the carrier C. The rack 13 is classified into a rack 13A for taking out and storing substrates W, and a rack 13B for storage.

[0052] The shelf 13A is arranged adjacent to the transfer block 5. The shelf 13A may also be provided with a mechanism for loading and unloading a cover of the carrier C. At least one shelf 13A is provided. The shelf 13A carries the carrier C. The carrier C accommodates a plurality of substrates W (for example, twenty-five) in a horizontal posture at predetermined intervals (for example, 10 mm intervals) along the vertical direction Z. In addition, the substrates W are neatly arranged in the thickness direction of the substrate W. As the carrier C, for example, a FOUP (Front Opening Unify Pod; front-opening wafer transfer box) can be used. FOUP is a closed container. The carrier C may also be an open container, regardless of its type. In addition, the shelf 13A is equivalent to the carrier mounting shelf of the present invention.

[0053] <3. Transfer Block>

[0054] The transfer block 5 is disposed adjacent to the rear of the storage block 3. The transfer block 5 includes a substrate handling mechanism (robot) HTR and a first posture conversion mechanism 15. The substrate handling mechanism HTR corresponds to the substrate handling mechanism of the present invention.

[0055] The substrate handling mechanism HTR is provided on the right Y side in the transfer block 5. The substrate handling mechanism HTR can collectively transfer a plurality of (for example, twenty-five) substrates W in a horizontal posture between the carriers C mounted on the rack 13A, the first posture conversion mechanism 15, and the buffer 27 (described later).

[0056] Reference Figure 2 The substrate handling mechanism HTR has a plurality of (for example, twenty-five) hands 17. Figure 2 For ease of illustration, the substrate handling mechanism HTR is depicted as having three hands 17. Each hand 17 holds a substrate W.

[0057] In addition, the substrate handling mechanism HTR has a hand support part 19, an advance and retreat part 20, and a lifting and rotating part 21. The hand support part 19 supports a plurality of hands 17. Thus, the plurality of hands 17 move as a whole. The advance and retreat part 20 advances and retreats the plurality of hands 17 via the hand support part 19. The lifting and rotating part 21 rotates the advance and retreat part 20 around the vertical axis AX1, thereby rotating the plurality of hands 17 and the like around the vertical axis AX1. In addition, the lifting and rotating part 21 raises and lowers the advance and retreat part 20, thereby raising and lowering the plurality of hands 17 and the like. The lifting and rotating part 21 is fixed to the ground. That is, the lifting and rotating part 21 does not move in the horizontal direction. In addition, the advance and retreat part 20 and the lifting and rotating part 21 each have an electric motor. In addition, in addition to the hand 17 and the hand support part 19, the substrate handling mechanism HTR may also have a hand (not shown) for carrying a piece of substrate W.

[0058] Reference Figure 1 The first posture conversion mechanism 15 converts the plurality of substrates W taken out from the carrier C from a horizontal posture to a vertical posture. The first posture conversion mechanism 15 includes a posture conversion unit 23 and a pusher mechanism 25. Figure 1 In FIG. 2 , the substrate operation mechanism HTR, the posture conversion unit 23 and the pusher mechanism 25 are arranged in this order on the left side Y. As shown in FIG. Figure 3 (a) to Figure 3 (f) is a side view for explaining the first posture conversion mechanism 15 (the posture conversion unit 23 and the pusher mechanism 25 ) of the transfer block 5 .

[0059] like Figure 1 as well as Figure 3As shown in (a) in the figure, the posture conversion unit 23 has a support table 23A, a pair of horizontal holding units 23B, a pair of vertical holding units 23C, and a rotation drive unit 23D. The pair of horizontal holding units 23B and the pair of vertical holding units 23C are arranged on the support table 23A. The horizontal holding units 23B and the vertical holding units 23C receive a plurality of substrates W transported by the substrate handling mechanism HTR. When the substrate W is in a horizontal posture, the pair of horizontal holding units 23B supports the substrate W from below while contacting the lower surface of each substrate W. In addition, when the substrate W is in a vertical posture, the pair of vertical holding units 23C holds the substrate W.

[0060] The rotation drive unit 23D supports the support table 23A so that it can rotate around the horizontal axis AX2. The rotation drive unit 23D rotates the support table 23A around the horizontal axis AX2 to change the posture of the plurality of substrates W held by the holding units 23B and 23C from horizontal to vertical.

[0061] like Figure 1 as well as Figure 3 As shown in (f) in FIG. 1 , the pusher mechanism 25 includes a pusher 25A, a lifting and rotating part 25B, a horizontal moving part 25C, and a rail 25D. The pusher 25A supports the lower part of each of a plurality of (e.g., fifty) substrates W in a vertical posture. Figure 3 (a) to Figure 3 In (f) , for ease of illustration, the pusher 25A is configured to support six substrates W.

[0062] The lifting and rotating part 25B is connected to the lower surface of the pusher 25A. The lifting and rotating part 25B lifts the pusher 25A in the up-down direction by telescoping. In addition, the lifting and rotating part 25B rotates the pusher 25A around the vertical axis AX3. The horizontal moving part 25C supports the lifting and rotating part 25B. The horizontal moving part 25C moves the pusher 25A and the lifting and rotating part 25B horizontally along the track 25D. The track 25D is formed in a manner along the width direction Y. In addition, the rotation drive part 23D, the lifting and rotating part 25B and the horizontal moving part 25C each have an electric motor.

[0063] Here, the operation of the first posture conversion mechanism 15 is described. The batch processing tanks BT1 to BT6 described later in the processing block 7 process, for example, fifty substrates W of two carriers C at a time. The first posture conversion mechanism 15 converts the postures of the fifty substrates W twenty-five by twenty-five. In addition, the first posture conversion mechanism 15 arranges the plurality of substrates W in a face-to-face manner at a predetermined interval (half pitch). The half pitch is, for example, 5 mm interval. The pusher mechanism 25 transports the fifty substrates W to the transport mechanism WTR.

[0064] In addition, the twenty-five substrates W in the first carrier C are described as substrates W1 of the first substrate group. The twenty-five substrates W in the second carrier C are described as substrates W2 of the second substrate group. Figure 3 (a) to Figure 3 For the convenience of illustration, (f) is illustrated by assuming that the number of substrates W1 in the first substrate group is three and the number of substrates W2 in the second substrate group is three. In addition, when substrates W1 and W2 are not specifically distinguished, substrates W1 and W2 are recorded as "substrates W".

[0065] Reference Figure 3 (a) in the figure. The posture conversion unit 23 receives the twenty-five substrates W1 of the first substrate group transported by the substrate handling mechanism HTR with the holding units 23B and 23C. At this time, the twenty-five substrates W1 are in a horizontal posture with the device side facing upward. The twenty-five substrates W1 are arranged at a predetermined interval (full pitch). The full pitch is, for example, 10 mm interval. The full pitch is also called a normal pitch.

[0066] In addition, the half pitch is the interval of half the full pitch. In addition, the device surface of the substrate W (W1, W2) refers to the surface on which the electronic circuit is formed, also referred to as the "front surface". In addition, the back surface of the substrate W refers to the surface on which the electronic circuit is not formed. The surface on the opposite side of the device surface is the back surface.

[0067] Reference Figure 3 (b) in FIG. 1. The posture conversion unit 23 rotates the holding units 23B and 23C by 90 degrees (angle) around the horizontal axis AX2, thereby converting the postures of the twenty-five substrates W1 from horizontal to vertical. Figure 3 (c) in the figure. The pusher mechanism 25 causes the pusher 25A to rise to a position higher than the holding parts 23B and 23C of the posture conversion part 23. As a result, the pusher 25A receives the twenty-five substrates W from the holding parts 23B and 23C. The twenty-five substrates W1 held by the pusher 25A face the left direction Y. In addition, Figure 3 (a) to Figure 3 In (f) of FIG. 8 , an arrow AR added to the substrate W indicates the direction of the device surface of the substrate W.

[0068] Reference Figure 3(d) in the figure. The pusher mechanism 25 rotates the twenty-five substrates W in the vertical posture 180 degrees around the vertical axis AX3. As a result, the twenty-five substrates W1 are flipped over and face the right direction Y. Moreover, the flipped twenty-five substrates W1 move half the pitch (for example, 5 mm) to the left direction Y from the position before the rotation. In addition, the holding parts 23B and 23C of the posture conversion part 23 are rotated -90 degrees around the horizontal axis AX2 to become a state capable of receiving the next substrate W2. Thereafter, the posture conversion part 23 receives the twenty-five substrates W2 of the second substrate group transported by the substrate operating mechanism HTR with the holding parts 23B and 23C. At this time, the twenty-five substrates W2 are in a horizontal posture with the device surface facing upward. In addition, the posture conversion part 23 and the pusher mechanism 25 operate in a manner that does not interfere with each other.

[0069] Reference Figure 3 (e) in the figure. The pusher mechanism 25 lowers the pusher 25A for holding the twenty-five substrates W1 of the first substrate group to the retracted position. Then, the posture conversion unit 23 converts the posture of the twenty-five substrates W2 from horizontal to vertical. The twenty-five substrates W2 after the posture conversion face the left direction Y. Figure 3 (f) in the figure. Then, the pusher mechanism 25 raises the pusher 25A for holding the twenty-five substrates W2 of the second substrate group. Thus, the pusher mechanism 25 further receives twenty-five substrates W2 from the posture conversion unit 23.

[0070] Thus, the pusher 25A holds fifty substrates W (W1, W2) of the first substrate group and the second substrate group. The fifty substrates W are configured such that twenty-five substrates W1 and twenty substrates W2 are arranged alternately one by one. The fifty substrates W are arranged at half pitch (e.g., 5 mm interval). Moreover, the twenty-five substrates W1 face the opposite direction to the twenty-five substrates W2. Therefore, the fifty substrates W are arranged face to face. That is, the two device surfaces (or two back surfaces) of the two adjacent substrates W1 and W2 are opposite to each other.

[0071] Thereafter, the pusher mechanism 25 moves the pushers 25A for holding the fifty substrates W along the rails 25D to the substrate taking-over position PP below the pair of clamps 29 and 30 of the transport mechanism WTR.

[0072] <4. Processing Block 7>

[0073] The processing block 7 is adjacent to the transfer block 5. The processing block 7 is arranged behind the transfer block 5. The processing block 7 has a batch processing area R1, a batch substrate conveying area R2, a posture conversion area R3, a single substrate conveying area R4, and a single processing area R5. In addition, the substrate processing device 1 has a buffer section 27 for placing the substrate W. In addition, the buffer section 27 is equivalent to the substrate placing section of the present invention.

[0074] <4-1. Batch processing area R1>

[0075] The batch processing region R1 is adjacent to the batch substrate transfer region R2, the posture conversion region R3, and the single wafer processing region R5. The batch processing region R1 extends in a direction away from the transfer block 5 (rearward X).

[0076] For example, six batch processing tanks BT1 to BT6 are provided in the batch processing region R1. The six batch processing tanks BT1 to BT6 are arranged in a row in the front-rear direction X in which the batch processing region R1 extends. The number of batch processing tanks is not limited to six, and may be a plurality.

[0077] The six batch processing tanks BT1 to BT6 respectively perform immersion processing on a plurality of substrates W in a vertical posture. For example, the six batch processing tanks BT1 to BT6 are composed of four liquid processing tanks BT1 to BT4 and two water washing processing tanks BT5 and BT6. Specifically, the two liquid processing tanks BT1 and BT2 and the water washing processing tank BT5 are used as a group. In addition, the two liquid processing tanks BT3 and BT4 and the water washing processing tank BT6 are used as another group.

[0078] The four chemical liquid treatment tanks BT1 to BT4 perform etching treatment using chemical liquid, respectively. As the chemical liquid, phosphoric acid, for example, can be used. The chemical liquid treatment tank BT1 stores the chemical liquid supplied from the chemical liquid discharge pipe not shown. The chemical liquid discharge pipe is provided on the inner wall of the chemical liquid treatment tank BT1. The three chemical liquid treatment tanks BT2 to BT4 are respectively configured to be the same as the chemical liquid treatment tank BT1.

[0079] The two water washing treatment tanks BT5 and BT6 respectively perform a pure water washing treatment for washing the chemical solution attached to the plurality of substrates W with pure water. As the pure water, for example, deionized water (DIW) can be used. The two water washing treatment tanks BT5 and BT6 respectively store pure water supplied from a washing liquid discharge pipe not shown. The washing liquid discharge pipe is provided on the inner wall of each of the water washing treatment tanks BT5 and BT6.

[0080] Six lifts LF1 to LF6 are provided in the six batch processing tanks BT1 to BT6, respectively. For example, lift LF1 holds a plurality of substrates W arranged in a vertical posture at a predetermined interval (half pitch). In addition, lift LF1 lifts and lowers a plurality of substrates W between a processing position inside the batch processing tank (chemical liquid processing tank) BT1 and a handover position above the batch processing tank BT1. The other five lifts LF2 to LF6 are configured in the same manner as lift LF1.

[0081] <4-2. Batch substrate transport area R2>

[0082] The batch substrate transfer area R2 is adjacent to the transfer block 5, the batch processing area R1, and the posture conversion area R3. The batch substrate transfer area R2 is provided along the batch processing area R1. One end side of the batch substrate transfer area R2 extends to the transfer block 5, and the other end side of the batch substrate transfer area R2 extends in a direction away from the transfer block 5 (rearward X). The batch substrate transfer area R2 extends in parallel with the batch processing area R1.

[0083] The batch substrate transport area R2 has a transport mechanism (robot) WTR. That is, the transport mechanism WTR is provided in the batch substrate transport area R2. The transport mechanism WTR transports a plurality of substrates W in a vertical posture (for example, fifty substrates) at a time between the substrate delivery position PP set in the transfer block 5, for example, six batch processing tanks BT1 to BT6, and the second posture conversion mechanism 35 (elevator LF9). In addition, when the transport mechanism WTR passes through the second posture conversion mechanism 35, the transport mechanism WTR moves above the horizontal moving part 95 of the posture conversion part 63 described later.

[0084] The transport mechanism WTR has a pair of clamps 29, 30 and a guide rail 33. The clamps 29, 30 each have, for example, fifty holding grooves for holding fifty substrates W. When viewed from above, the two clamps 29, 30 are respectively aligned with the Y direction ( Figure 1 ) extend in parallel. The transport mechanism WTR opens or closes the two clamps 29 and 30. The transport mechanism WTR moves the pair of clamps 29 and 30 along the guide rail 33. The transport mechanism WTR is driven by an electric motor.

[0085] <4-3. Posture Transition Area R3>

[0086] The posture conversion area R3 is provided between the transfer block 5 and the batch processing area R1. In addition, the posture conversion area R3 is arranged between the batch substrate conveying area R2, the single substrate conveying area R4 and the single processing area R5. Therefore, the posture conversion area R3 is adjacent to the transfer block 5, the batch processing area R1, the batch substrate conveying area R2, the single substrate conveying area R4 and the single processing area R5.

[0087] The posture conversion region R3 is provided with a second posture conversion mechanism 35. The second posture conversion mechanism 35 converts the plurality of substrates W processed in a batch from a vertical posture to a horizontal posture. The details of the second posture conversion mechanism 35 will be described later.

[0088] <4-4. Single-piece substrate transport area R4>

[0089] The single-substrate conveying region R4 is adjacent to the transfer block 5, the posture conversion region R3, and the single-substrate processing region R5. The single-substrate conveying region R4 is provided on the opposite side of the batch substrate conveying region R2 across the posture conversion region R3.

[0090] A central robot CR is provided in the single-wafer substrate transport region R4. The central robot CR can transport substrates W in a horizontal posture one by one between the second posture conversion mechanism 35, the single-wafer processing chambers SW1 and SW2 (described later), and the buffer section 27. In addition, the transfer block 5, the second posture conversion mechanism 35, and the single-wafer processing chambers SW1 and SW2 can be arranged around the central robot CR. Therefore, since the transport distance of the substrate W of the central robot CR can be shortened, the substrate W can be efficiently transported.

[0091] The central robot CR has two hands 37A, 37B, two multi-joint arms 39A, 39B and a lifting platform 41. The two hands 37A, 37B respectively hold a substrate W in a horizontal position. The two hands 37A, 37B can move horizontally. The two multi-joint arms 39A, 39B are respectively composed of, for example, SCARA (Selective Compliance Assembly Robot Arm: Selective Compliance Assembly Robot Arm) type. The top end of the multi-joint arm 39A supports the hand 37A, and the top end of the multi-joint arm 39B supports the hand 37B. The multi-joint arm 39A moves the hand 37A in the horizontal direction (front-back direction X and width direction Y), and the multi-joint arm 39B moves the hand 37B in the horizontal direction.

[0092] The lifting platform 41 supports the base end of each of the two multi-joint arms 39A and 39B. The lifting platform 41 is configured to be retractable in the vertical direction. Therefore, the lifting platform 41 raises and lowers the two hands 37A and 37B and the two multi-joint arms 39A and 39B. The horizontal position of the lifting platform 41 is fixed and does not move. Therefore, for example, the transport distance of the substrate W caused by the horizontal movement of the lifting platform 41 can be shortened. In addition, the movement of the lifting platform 41 can be omitted.

[0093] The buffer section 27 is arranged across the transfer block 5 and the single-chip substrate conveying area R4. That is, it is arranged at the boundary between the transfer block 5 and the single-chip substrate conveying area R4. In addition, the buffer section 27 can also be arranged only in the transfer block 5 or the single-chip substrate conveying area R4. Therefore, the buffer section 27 only needs to be fixedly arranged at the boundary between the transfer block 5 and the single-chip substrate conveying area R4, the transfer block 5 and the single-chip substrate conveying area R4. In addition, although the central robot CR has two sets of hands 37A, 37B and multi-joint arms 39A, 39B, the central robot CR can also have one set or more than three sets of hands and multi-joint arms.

[0094] The buffer section 27 has a plurality of loading racks. The plurality of loading racks are in a horizontal posture. The plurality of loading racks can respectively carry a substrate W. The buffer section 27 carries the plurality of substrates W in a horizontal posture at a predetermined interval (full pitch) along the vertical direction Z. That is, the plurality of loading racks are arranged at a predetermined interval (full pitch) and along the vertical direction Z. The buffer section 27 is configured to carry at least twenty-five substrates W that can be transported by the substrate handling mechanism HTR, for example. The buffer section 27 is configured to carry fifty substrates W, for example. As needed, the number of loading racks of the buffer section 27 may be more than two and less than twenty-four.

[0095] <4-5. Single chip processing area R5>

[0096] The single-wafer processing region R5 is adjacent to the batch processing region R1 , the posture conversion region R3 , and the single-wafer substrate conveying region R4 . The single-wafer processing region R5 is provided on the opposite side of the transfer block 5 across the single-wafer substrate conveying region R4 .

[0097] A plurality of (e.g., two) single-wafer processing chambers SW1 and SW2 are provided in the single-wafer processing region R5. The two single-wafer processing chambers SW1 and SW2 are arranged along a width direction Y orthogonal to the front-rear direction X extending in the batch processing region R1. Each of the single-wafer processing chambers SW1 and SW2 processes substrates W in a horizontal posture one by one. The first single-wafer processing chamber SW1 is arranged at the right Y of the posture conversion region R3. The second single-wafer processing chamber SW2 is arranged at the right Y of the first single-wafer processing chamber SW1.

[0098] In addition, the single-wafer processing chambers SW1 and SW2 may also be configured in a plurality of stages. For example, six single-wafer processing chambers SW1 and SW2 may be configured with two in the width direction Y (horizontal direction) and three in the vertical direction Z. In addition, the number of single-wafer processing chambers is not limited to two or six.

[0099] For example, the first single-wafer processing chamber SW1 includes a rotating processing unit 45 and a nozzle 47. The rotating processing unit 45 includes: a rotating fixture that holds a substrate W in a horizontal position; and an electric motor that rotates the rotating fixture around a vertical axis passing through the center of the substrate W. The rotating fixture may also hold the lower surface of the substrate W by vacuum adsorption. In addition, the rotating fixture may also have three or more fixture pins that clamp the outer edge of the substrate W.

[0100] The nozzle 47 supplies the processing liquid to the substrate W held by the rotating processing unit 45. The nozzle 47 moves between a standby position which is a position separated from the rotating processing unit 45 and a supply position which is a position above the rotating processing unit 45. As the processing liquid, for example, pure water (DIW) and IPA (isopropyl alcohol) can be used. For example, the single-wafer processing chamber SW1 can also be configured such that after the substrate W is cleaned with pure water, a liquid film of IPA is formed on the upper surface of the substrate W.

[0101] The single-wafer processing chamber SW2 performs a drying process using a supercritical fluid, for example. As the fluid, carbon dioxide can be used, for example. The single-wafer processing chamber SW2 has a chamber body (container) 48, a support tray, and a cover. The chamber body 48 has a processing space provided inside the chamber body 48, an opening for placing the substrate W into the processing space, a supply port, and an exhaust port. The substrate W is supported by the support tray and accommodated in the processing space. The cover blocks the opening of the chamber body 48. For example, the single-wafer processing chamber SW2 changes the fluid into a supercritical state, and supplies the supercritical fluid from the supply port to the processing space in the chamber body 48. At this time, the processing space in the chamber body 48 is exhausted from the exhaust port. The substrate W is dried by the supercritical fluid supplied to the processing space.

[0102] The supercritical state can be obtained by changing the fluid to a specific critical temperature and critical pressure. Specifically, when the fluid is carbon dioxide, the critical temperature is 31°C and the critical pressure is 7.38 MPa. By drying the substrate W with the supercritical fluid, the pattern formed on the substrate W can be suppressed from collapsing.

[0103] <5. Control Unit>

[0104] The substrate processing apparatus 1 includes a control unit 59 and a storage unit (not shown). The control unit 59 controls various structures of the substrate processing apparatus 1. The control unit 59 includes one or more processors such as a central processing unit (CPU (Central Processing Unit)). The storage unit includes at least one of a ROM (Read Only Memory), a RAM (Random Access Memory) and a hard disk. The storage unit stores computer programs required for controlling various structures of the substrate processing apparatus 1.

[0105] <6. Second posture conversion mechanism>

[0106] Figure 4 (a) is a top view of the second posture conversion mechanism 35 . Figure 4(b) is a front view of the second posture conversion mechanism 35 . Figure 5 It is a front view for explaining two clamps 71 and 72 (horizontal holding parts 79 and 81 and vertical holding parts 80 and 82 ) of the posture conversion unit 63 .

[0107] The second posture conversion mechanism 35 includes a substrate standby region R31 and a posture conversion execution region R32. The substrate standby region R31 and the posture conversion execution region R32 are arranged along the front-rear direction X in which the batch processing region R1 or the six batch processing tanks BT1 to BT6 extend.

[0108] The second posture conversion mechanism 35 includes a lifter LF9 and a posture conversion unit 63. The lifter LF9 is provided in the substrate standby region R31. On the other hand, the posture conversion unit 63 is provided in the posture conversion execution region R32. Next, the lifter LF9 and the posture conversion unit 63 will be described in detail.

[0109] <6-1. Lift LF9>

[0110] The lifter LF9 holds a plurality of (for example, fifty) substrates W transported by the transport mechanism WTR in a vertical posture. The lifter LF9 includes a substrate holding portion 65 and a lifting portion 67 that lifts the substrate holding portion 65 in the vertical direction Z. The substrate holding portion 65 corresponds to the substrate holding portion of the present invention.

[0111] The substrate holding portion 65 holds, for example, fifty substrates W arranged at a predetermined interval (for example, half pitch) from below. The substrate holding portion 65 has, for example, three holding members 68 extending in the Y direction. The three holding members 68 each have the same number of holding grooves 68A as the number of substrates W (for example, fifty) to hold fifty substrates W. The depth of each holding groove 68A is formed in a V shape. The lifting portion 67 lifts the substrate holding portion 65. The lifting portion 67 has, for example, an electric motor or a cylinder.

[0112] Furthermore, the lift LF9 (substrate holding portion 65 ) and the six batch processing tanks BT1 to BT6 are arranged linearly in the front-rear direction X so that the transport mechanism WTR can transport fifty substrates W linearly.

[0113] <6-2. Posture conversion unit>

[0114] The posture conversion unit 63 receives the plurality of substrates W from the substrate holding unit 65 and converts the postures of the plurality of substrates W from vertical to horizontal. The posture conversion unit 63 includes two clamps 71 and 72 , two arms 75 and 76 , and an arm support unit 78 .

[0115] The posture conversion unit 63 receives a plurality of (e.g., twenty-five) substrates W from the substrate holding unit 65 using two clamps 71 and 72 in the substrate standby region R31, and converts the postures of the plurality of substrates W from vertical to horizontal using the longitudinal rotation unit 94 in the posture conversion execution region R32.

[0116] The two clamps 71 and 72 hold a plurality of (e.g., twenty-five) substrates W. The first clamp 71 includes a first horizontal holding portion 79 and a first vertical holding portion 80. In addition, the second clamp 72 includes a second horizontal holding portion 81 and a second vertical holding portion 82. The two horizontal holding portions 79 and 81 and the two vertical holding portions 80 and 82 are formed so as to extend in the direction in which the plurality of substrates W are aligned.

[0117] The two horizontal holding parts 79 and 81 accommodate two side portions of each substrate W included in the plurality of substrates W that are opposite in the radial direction. When the plurality of substrates W are in a horizontal posture, the two horizontal holding parts 79 and 81 place the plurality of substrates W at a predetermined interval (for example, half pitch). The two vertical holding parts 80 and 82 accommodate two side portions of each substrate W included in the plurality of substrates W. When the plurality of substrates W are in a vertical posture, the two vertical holding parts 80 and 82 are arranged below the horizontal holding parts 79 and 81. In addition, when the plurality of substrates W are in a vertical posture, the two vertical holding parts 80 and 82 hold the plurality of substrates W in a vertical posture. In addition, when the plurality of substrates W held by the two vertical holding parts 80 and 82 are in a vertical posture, the two horizontal holding parts 79 and 81 sandwich the plurality of substrates W and are arranged along the horizontal direction XY. Similarly, when the substrate W is in the vertical posture, the two vertical holding portions 80 and 82 are arranged in the horizontal direction XY with the plurality of substrates W interposed therebetween.

[0118] Reference Figure 5 . The two horizontal holding parts 79, 81 have a plurality of pairs (for example, fifty pairs) of horizontal loading guide grooves 85, 86. Fifty first horizontal loading guide grooves 85 are provided in the horizontal holding part 79. Fifty second horizontal loading guide grooves 86 are provided in the horizontal holding part 81. For example, two horizontal loading guide grooves 85A, 86A are arranged opposite to each other. In addition, when the plurality of sheets of substrates W are in a vertical posture, the plurality of pairs of horizontal loading guide grooves 85, 86 respectively have the same functions as the through grooves 91, 92 described later.

[0119] In addition, the two horizontal holding portions 79 and 81 may have, for example, twenty-five pairs of horizontal placement guide grooves 85 and 86. In addition, the number of pairs of horizontal placement guide grooves 85 and 86 is not limited to fifty pairs or twenty-five pairs. The number of pairs of holding grooves 89 and 90 and passing grooves 91 and 92 described later is also not limited to twenty-five pairs.

[0120] The two vertical holding parts 80 and 82 have a plurality of pairs (for example, twenty-five pairs) of holding grooves 89 and 90 and a plurality of pairs (twenty-five pairs) of passing grooves 91 and 92. The plurality of pairs of holding grooves 89 and 90 each hold a substrate W. The plurality of pairs of passing grooves 91 and 92 each allow a substrate W to pass. The plurality of pairs of holding grooves 89 and 90 and the plurality of pairs of passing grooves 91 and 92 are alternately arranged one by one. In addition, the two holding grooves 89A and 90A are arranged opposite to each other.

[0121] Twenty-five holding grooves 89 and two through grooves 91 are provided in the first vertical holding portion 80. Twenty-five holding grooves 89 and twenty-five through grooves 91 are arranged alternately one by one. Twenty-five holding grooves 90 and twenty-five through grooves 92 are provided in the second vertical holding portion 82. Twenty-five holding grooves 90 and twenty-five through grooves 92 are arranged alternately one by one. The depth of each holding groove 89, 90 is formed into a V-shaped cross section. Therefore, each holding groove 89, 90 can hold a substrate W in a vertical posture. As a result, the substrate W will not fall to the adjacent substrate W.

[0122] like Figure 4 As shown in (b) of FIG. 1 , the first arm 75 supports the first horizontal holding portion 79 and the first vertical holding portion 80. The second arm 76 supports the second horizontal holding portion 81 and the second vertical holding portion 82. The arm support portion 78 supports the upper end portion (base end portion) of each of the two arms 75 and 76. The arm support portion 78 and the two arms 75 and 76 are formed in a C-shape or a U-shape.

[0123] The arm support portion 78 is disposed on the opposite side of the two vertical holding portions 80, 82 via the two horizontal holding portions 79, 81. Therefore, the arm support portion 78 etc. supports the two horizontal holding portions 79, 81 and the two vertical holding portions 80, 82 from the opposite side of the two vertical holding portions 80, 82 via the two horizontal holding portions 79, 81.

[0124] In addition, if Figure 5 As shown by the solid line and the dashed line in FIG. 1 , the two vertical holding parts 80 and 82 are configured to open and close in the horizontal direction. That is, the posture conversion part 63 has an opening and closing part 87 (see FIG. 1 ). Figure 4 The opening and closing section 87 has, for example, an electric motor or a cylinder. The opening and closing section 87 moves the two vertical holding sections 80 and 82 linearly between a holding position PP2 where the interval between the two vertical holding sections 80 and 82 is narrowed so that the substrate W is held by the two vertical holding sections 80 and 82, and a passing position PP3 where the interval between the two vertical holding sections 80 and 82 is widened so that each substrate W passes between the two vertical holding sections 80 and 82.

[0125] When the two vertical holding parts 80 and 82 are located at the holding position PP2, the two vertical holding parts 80 and 82 are in a closed state. For example, when the plurality of substrates W are in a vertical posture, the interval between the two vertical holding parts 80 and 82 is narrowed. The two vertical holding parts 80 and 82 are moved to the holding position PP2 by the opening and closing part 87, thereby holding the plurality of substrates W in a vertical posture held by the substrate holding part 65, and the two horizontal holding parts 79 and 81 accommodate the plurality of substrates W held by the two vertical holding parts 80 and 82. In addition, when the two vertical holding parts 80 and 82 are located at the passing position PP3, the two vertical holding parts 80 and 82 are in an open state. For example, when the longitudinal rotating part 94 described later has rotated the posture of the substrate W from vertical to horizontal, the opening and closing part 87 moves the two vertical holding parts 80 and 82 to the passing position PP3. That is, when the plurality of substrates W are in the horizontal posture, the interval between the two vertical holding portions 80 and 82 is widened.

[0126] In addition, the posture conversion unit 63 includes a lateral rotation unit 93, a longitudinal rotation unit 94, a horizontal moving unit 95, a rotation axis 97, and a vertical arm 98. The lateral rotation unit 93 supports the arm support unit 78 so that it can rotate. When the two vertical holding units 80 and 82 hold the substrate W in a vertical posture, the lateral rotation unit 93 rotates the two clamps 71 and 72 and the arm support unit 78 around the rotation axis (vertical axis) AX4, which is orthogonal to the direction in which the substrates W are arranged. The lateral rotation unit 93 and the longitudinal rotation unit 94 each include, for example, an electric motor.

[0127] The top end of the rotating shaft 97 is connected to the lateral rotating part 93. The base end of the rotating shaft 97 is connected to the longitudinal rotating part 94 in a rotatable manner. The rotating shaft 97 extends in the horizontal direction (front-back direction X). Therefore, the central axis of the rotating shaft 97 is the horizontal axis AX5. The horizontal axis (central axis) AX5 is set at a position higher than the substrate W in the vertical posture held by the two vertical holding parts 80 and 82. In order to rotate the posture of the substrate W from vertical to horizontal, the longitudinal rotating part 94 rotates the two clamps 71, 72 and the arm support part 78 around the horizontal axis AX5. The longitudinal rotating part 94 is supported by the lower end of the vertical arm 98.

[0128] The horizontal moving section 95 moves the two clamps 71 and 72, the arm support section 78, the opening and closing section 87, the lateral rotation section 93, and the longitudinal rotation section 94 in the horizontal direction. In addition, the horizontal moving section 95 moves the arm support section 78 and the longitudinal rotation section 94 in the horizontal direction over the substrate standby area R31 where the substrate holding section 65 is arranged and the posture conversion execution area R32 for converting the plurality of substrates W from the vertical posture to the horizontal posture.

[0129] The horizontal moving part 95 is provided at a position higher than each substrate W in the vertical posture held by the two vertical holding parts 80 and 82. Thus, the two clamps 71 and 72 are in a suspended state. Therefore, it is prevented that the droplets attached to the substrate W fall and contaminate the moving part and the rotating part. Thus, it is prevented that the moving part and the rotating part fail due to the contamination of the droplets.

[0130] The horizontal moving part 95 includes an X-direction moving part 101 and a Y-direction moving part 102. The X-direction moving part 101 moves the two clamps 71, 72 and the arm support part 78 along the front-rear direction X. The Y-direction moving part 102 moves the two clamps 71, 72 and the arm support part 78 along the width direction Y. The two moving parts 101, 102 each include a linear actuator including an electric motor. Figure 4 In (a) of FIG. 8 , the upper end of the vertical arm 98 is movably connected to the Y-direction moving portion 102. The Y-direction moving portion 102 moves the vertical arm 98 along the width direction Y.

[0131] <7. Action Description>

[0132] Next, refer to Figure 6 as well as Figure 7 The operation of the substrate processing apparatus 1 is described in the flowchart. Figure 1 The external transport robot (not shown) transports the two carriers C to the loading port 9 in sequence.

[0133] [Step S01] Transferring a substrate from a carrier

[0134] The carrier transport mechanism 11 of the storage block 3 transports the first carrier C from the loading port 9 to the rack 13A. The substrate handling mechanism HTR of the transfer block 5 takes out 25 substrates W1 in a horizontal posture from the first carrier C placed on the rack 13A and transports them to the posture conversion unit 23. Then, the carrier transport mechanism 11 transports the empty first carrier C to the rack 13B. Then, the carrier transport mechanism 11 transports the second carrier C from the loading port 9 to the rack 13A. The substrate handling mechanism HTR takes out 25 substrates W2 in a horizontal posture from the second carrier C placed on the rack 13A and transports them to the posture conversion unit 23.

[0135] [Step S02] Posture transition to vertical posture

[0136] The fifty substrates W (W1, W2) on the two carriers C are transported to the posture conversion unit 23. Figure 3 (a) to Figure 3As shown in (f) in FIG. 5 , the posture conversion unit 23 and the pusher mechanism 25 arrange the fifty substrates W in a face-to-face manner and at a half pitch (5 mm), and convert the posture of the fifty substrates W from a horizontal posture to a vertical posture. The pusher mechanism 25 transports the fifty substrates W in the vertical posture to the substrate transfer position PP set in the transfer block 5.

[0137] [Step S03] Chemical solution processing (batch processing)

[0138] The transport mechanism WTR receives fifty substrates W in a vertical posture from the pusher mechanism 25 at the substrate transfer position PP, and transports the fifty substrates W to any one of the four lifts LF1 to LF4 of the four liquid treatment tanks BT1 to BT4. In addition, when the transport mechanism WTR passes through the posture conversion area R3, the transport mechanism WTR passes, for example, above the second posture conversion mechanism 35 in a manner that does not interfere with the second posture conversion mechanism 35.

[0139] For example, the transport mechanism WTR transports fifty substrates W to the elevator LF1 of the chemical liquid treatment tank BT1. The elevator LF1 receives the fifty substrates W at a position above the chemical liquid treatment tank BT1. The elevator LF1 immerses the fifty substrates W in phosphoric acid as a treatment liquid in the chemical liquid treatment tank BT1. Thus, the fifty substrates W are etched. After the etching, the elevator LF1 picks up the fifty substrates W from the phosphoric acid in the chemical liquid treatment tank BT1. In addition, when the fifty substrates W are transported to each of the elevators LF2 to LF4 of other chemical liquid treatment tanks BT2 to BT4, the same treatment as that of the chemical liquid treatment tank BT1 is also performed.

[0140] [Step S04] Pure water cleaning process (batch process)

[0141] The transport mechanism WTR receives fifty substrates W in a vertical position from, for example, the lift LF1 (or lift LF2), and transports the fifty substrates W to the lift LF5 of the water washing treatment tank BT5. The lift LF5 receives the fifty substrates W at a position above the water washing treatment tank BT5. The lift LF5 immerses the fifty substrates W in the pure water in the water washing treatment tank BT5. Thus, the fifty substrates W are cleaned.

[0142] Furthermore, when the transport mechanism WTR receives fifty substrates W in a vertical position from one of the lifts LF3 and LF4, the transport mechanism WTR transports the fifty substrates W to the lift LF6 of the water washing treatment tank BT6. The lift LF6 receives the fifty substrates W at a position above the water washing treatment tank BT6. The lift LF6 immerses the fifty substrates W in the pure water in the water washing treatment tank BT6.

[0143] [Step S05] Posture transition to horizontal posture

[0144] The second posture conversion mechanism 35 converts the posture of the substrate W that has been cleaned from vertical to horizontal. Here, there is the following problem. That is, when the postures of fifty substrates W arranged at half pitch (5 mm interval) are converted at once, the hands 37A and 37B of the central robot CR cannot properly enter the gap between two adjacent substrates W among the fifty substrates W.

[0145] Furthermore, when the substrates W are arranged face to face, the substrates W converted to a horizontal posture may have their device surfaces facing upward or downward. For example, it is not preferred that the hands 37A and 37B of the central robot CR contact the device surfaces of the substrates W. Furthermore, it is not preferred that the substrates W with their device surfaces facing different directions are transported to the individual single-wafer processing chambers SW1 and SW2.

[0146] Therefore, in this embodiment, the interval between two adjacent substrates W is widened and the orientations of the device surfaces of the fifty substrates W are made consistent with each other. Figure 7 Flowchart of Figure 1 , Figure 8 (a) to Fig.11 (c) in the figure is described in detail.

[0147] also, Figure 8 (a) to Figure 8 (c) and Fig.10 (a) to Fig.10 (c) is a front view of the second posture conversion mechanism 35 . Fig. 9 (a) to Fig. 9 (c) and Fig.11 (a) to Fig.11 (c) is a top view of the second posture conversion mechanism 35. For example, Fig. 9 (a) and Figure 8 In addition, Fig.11 (b) and Fig.10 corresponds to (b) in .

[0148] [Step S11] Transporting the substrate to the lift LF9

[0149] Reference Figure 1 The transport mechanism WTR transports fifty substrates W from one of the elevators LF5 and LF6 to the substrate holding portion 65 of the elevator LF9 of the second posture conversion mechanism 35. The substrate holding portion 65 of the elevator LF9 holds the fifty substrates W in a vertical posture arranged at half pitch and in a face-to-face manner. In addition, the fifty substrates W are neatly arranged along the width direction Y.

[0150] [Step S12] Movement of the posture conversion unit to the substrate standby area

[0151] Reference Figure 8 (a) and Fig. 9 (a) in the figure. When fifty substrates W in a vertical posture are held by the substrate holding portion 65, the horizontal moving portion 95 (mainly the X-direction moving portion 101) of the posture conversion portion 63 moves the two clamps 71, 72 and the arm support portion 78 from the posture conversion execution area R32 to above the substrate holding portion 65 in the substrate standby area R31. In addition, the Y-direction moving portion 102 of the horizontal moving portion 95 moves the two clamps 71, 72 and the arm support portion 78 to the first substrate holding position. In addition, the first substrate holding position is a position where twenty-five pairs of holding grooves 89, 90 can hold twenty-five substrates W1 of the first substrate group.

[0152] The opening and closing portion 87 of the posture conversion portion 63 moves the two vertical holding portions 80 and 82 horizontally in a direction away from each other to open the vertical holding portions 80 and 82 (see FIG. Figure 5 through position PP3).

[0153] [Step S13] The posture conversion unit receives the first substrate group.

[0154] The two vertical holding parts 80 and 82 are moved to the holding position PP2 by the opening and closing part 87, so that the first divided substrate group (twenty-five substrates W1) in which every other substrate among the fifty substrates W held in the vertical posture by the substrate holding part 65 is held by the twenty-five pairs of holding grooves 89 and 90, and the two horizontal holding parts 79 and 81 accommodate the first divided substrate group (twenty-five substrates W1). The following will be described in detail.

[0155] The substrate holding part 65 is in a state of holding fifty substrates W (W1, W2) in a vertical posture. The lifting part 67 of the lift LF9 raises the substrate holding part 65 to an upper position for transferring the substrates W. At this time, the fifty substrates W pass between the two vertical holding parts 80, 82 and are respectively accommodated in the fifty pairs of horizontal mounting guide grooves 85, 86 of the two horizontal holding parts 79, 81.

[0156] Then, the opening and closing portion 87 moves the two vertical holding portions 80 and 82 horizontally toward each other to be in a closed state (see Figure 5 Thus, if Figure 5 As shown in the two frames at the lower side of , fifty substrates W held in a vertical posture by the substrate holding portion 65 are accommodated by twenty-five pairs of holding grooves 89 and 90 and twenty-five pairs of passing grooves 91 and 92 that are alternately arranged in pairs.

[0157] After that, the lifting part 67 of the lift LF9 lowers the substrate holding part 65 to the lower standby position. As a result, the twenty-five substrates W1 of the first substrate group are transferred to the posture conversion part 63, while the twenty-five substrates W2 of the second substrate group remain in the substrate holding part 65. That is, the posture conversion part 63 holds and extracts the twenty-five substrates W1 of the first substrate group, which are neatly arranged every other one of the fifty substrates W, from the substrate holding part 65 with twenty-five pairs of holding grooves 89 and 90. In addition, the plurality of substrates W1 of the first substrate group is referred to as the first split substrate group. In addition, the plurality of substrates W2 of the second substrate group is referred to as the second split substrate group.

[0158] The twenty-five substrates W1 extracted every other substrate are arranged at full pitch. The twenty-five substrates W2 remaining on the substrate holder 65 are also arranged at full pitch. The twenty-five substrates W2 remaining on the substrate holder 65 are in a standby state.

[0159] [Step S14] Movement to the Posture Transformation Execution Area

[0160] Reference Figure 8 (b) and Fig. 9 (b) in the figure. With the twenty-five substrates W1 held by the two vertical holding parts 80 and 82, the horizontal moving part 95 (the X-direction moving part 101 and the Y-direction moving part 102) moves the two clamps 71 and 72 and the arm support part 78 from above the substrate holding part 65 in the substrate standby area R31 to a predetermined position in the posture conversion execution area R32. That is, the posture conversion part 63 conveys the twenty-five substrates W1 of the first substrate group in the vertical posture to the posture conversion execution area R32.

[0161] [Step S15] The horizontal posture conversion of the first substrate group by the posture conversion unit

[0162] Reference Figure 8 (c) and Fig. 9 (c) in the posture conversion execution area R32. Then, the posture conversion unit 63 converts the posture of the extracted twenty-five substrates W1 into a horizontal posture. Specifically, the longitudinal rotation unit 94 of the posture conversion unit 63 is oriented with the two vertical holding units 80 and 82 toward the center robot CR (refer to Figure 1 ) to rotate the substrate W1, the two clamps 71, 72 and the arm support portion 78 90 degrees around the horizontal axis AX5.

[0163] In this state, the central robot CR does not take out the substrate W1 from the posture conversion unit 63. Therefore, the opening and closing unit 87 of the posture conversion unit 63 moves the two vertical holding units 80 and 82 horizontally in a direction away from each other, thereby changing to an open state. That is, when the twenty-five substrates W1 converted to a horizontal posture are placed on the two horizontal holding units 79 and 81, the opening and closing unit 87 moves the two vertical holding units 80 and 82 to the passing position PP3. Thus, the substrate W1 can pass between the two vertical holding units 80 and 82. In addition, the twenty-five substrates W1 are placed on the twenty-five horizontal placement guide grooves 85 and 86, respectively. Since the twenty-five substrates W1 are neatly arranged at full pitch, the central robot CR can easily take out the substrates W.

[0164] Afterwards, the central robot CR uses two hands 37A and 37B to take out substrates W1 one by one from the twenty-five substrates W1 in a horizontal position while passing between the two vertical holding parts 80 and 82 that have moved to the passing position PP3, and transports the taken-out substrates W1 to the single-wafer processing chamber SW1.

[0165] [Step S16] Movement of the posture conversion unit to the substrate standby area

[0166] Reference Fig.10 (a) and Fig.11 (a) in the figure. After all the twenty-five substrates W1 are conveyed from the posture conversion section 63, the horizontal moving section 95 (mainly the X-direction moving section 101) moves the two clamps 71, 72 and the arm support section 78 etc. from the posture conversion execution area R32 to above the substrate holding section 65 in the substrate standby area R31. In addition, the Y-direction moving section 102 of the horizontal moving section 95 moves the two clamps 71, 72 and the arm support section 78 etc. to the second substrate holding position. In addition, the second substrate holding position is a position where the twenty-five pairs of holding grooves 89, 90 can hold the twenty-five substrates W2 of the second substrate group.

[0167] The opening and closing portion 87 of the posture conversion portion 63 moves the two vertical holding portions 80 and 82 horizontally in a direction away from each other to open the vertical holding portions 80 and 82 (see FIG. Figure 5 through position PP3).

[0168] [Step S17] The posture conversion unit receives the second substrate group.

[0169] The substrate holding part 65 holds the twenty-five substrates W2 of the second substrate group in a vertical posture. The lifting part 67 of the lift LF9 raises the substrate holding part 65 to an upper position for transferring the substrates W2. At this time, the twenty-five substrates W2 pass between the two vertical holding parts 80 and 82 and are respectively accommodated in the twenty-five pairs of horizontal mounting guide grooves 85 and 86 among the fifty pairs of horizontal mounting guide grooves 85 and 86.

[0170] After that, the opening and closing portion 87 moves the two vertical holding portions 80 and 82 horizontally toward each other to be in a closed state (see Figure 5 Thus, the twenty-five substrates W2 held in the vertical position by the substrate holding portion 65 are accommodated in the twenty-five pairs of holding grooves 89 and 90.

[0171] Then, the lifting unit 67 of the lift LF9 lowers the substrate holding unit 65 to the lower standby position. As a result, the twenty-five substrates W2 of the second substrate group are transferred to the posture conversion unit 63. That is, the posture conversion unit 63 holds and receives the twenty-five substrates W2 of the second substrate group from the substrate holding unit 65 with the twenty-five pairs of holding grooves 89 and 90.

[0172] [Step S18] Movement to the Posture Transition Execution Area

[0173] Reference Fig.10 (b) and Fig.11 (b) in the figure. With the twenty-five substrates W2 held by the two vertical holding parts 80 and 82, the horizontal moving part 95 (the X-direction moving part 101 and the Y-direction moving part 102) moves the two clamps 71 and 72 and the arm support part 78 from above the substrate holding part 65 in the substrate standby area R31 to a predetermined position in the posture conversion execution area R32. That is, the posture conversion part 63 transports the twenty-five substrates W2 in the vertical posture to the posture conversion execution area R32.

[0174] [Step S19] The 180-degree rotation of the second substrate group by the lateral rotation unit

[0175] Furthermore, in the posture conversion execution region R32, the horizontal rotation section 93 of the posture conversion section 63 rotates the substrate W2 and the arm support section 78 in the vertical posture by 180 degrees around the rotation axis AX4. As a result, the orientation of the device surface indicated by the arrow AR rotates by 180 degrees from the left direction Y to the right direction Y. Therefore, after the horizontal posture conversion, the orientation of the device surface of each substrate W2 can be changed to face upward.

[0176] [Step S20] The horizontal posture conversion of the second substrate group by the posture conversion unit

[0177] Reference Fig.10(c) and Fig.11 (c) in the figure. After that, the posture conversion unit 63 converts the posture of the twenty-five substrates W2 held thereinto into a horizontal posture. Specifically, the longitudinal rotation unit 94 of the posture conversion unit 63 is oriented with the two vertical holding units 80 and 82 toward the center robot CR (refer to Figure 1 ) to rotate the substrate W2, the two clamps 71, 72 and the arm support portion 78 90 degrees around the horizontal axis AX5.

[0178] Then, the opening and closing section 87 of the posture conversion section 63 moves the two vertical holding sections 80 and 82 horizontally in the direction of separating from each other to open the vertical holding sections 80 and 82 (see FIG. Figure 5 Thus, the substrate W2 can pass between the two vertical holding portions 80 and 82. In addition, the twenty-five substrates W2 are placed on the twenty-five horizontal placement guide grooves 85 and 86, respectively.

[0179] Then, the central robot CR uses the two hands 37A and 37B to take out the substrates W2 one by one from the twenty-five substrates W2 in the horizontal position while passing between the two vertical holding parts 80 and 82 that have moved to the passing position PP3, and transports the taken-out substrates W2 to the single-wafer processing chamber SW1. Fig.10 (c) and Fig.11 As shown in (c) in FIG. 1 , the next batch of fifty substrates W are transported to the substrate holding portion 65 of the elevator LF9 by the transport mechanism WTR.

[0180] [Step S06] First Single-Way Processing

[0181] Back to Figure 6 For example, the central robot CR carries the substrates W (W1, W2) one by one from the posture conversion unit 63 to the first single-wafer processing chamber SW1. The first single-wafer processing chamber SW1, for example, rotates the substrate W with the device surface facing upward by the rotating processing unit 45 while supplying pure water to the device surface from the nozzle 47. Thereafter, the first single-wafer processing chamber SW1 supplies IPA to the device surface (upper surface) of the substrate W from the nozzle 47 and replaces the pure water of the substrate W with IPA.

[0182] [Step S07] Second single-wafer process (drying process)

[0183] Afterwards, the central robot CR takes out the substrate W wetted with IPA from the first single-wafer processing chamber SW1 and transports the substrate W to the second single-wafer processing chamber SW2. The second single-wafer processing chamber SW2 uses supercritical carbon dioxide (supercritical fluid) to dry the substrate W. The pattern collapse of the pattern surface (device surface) of the substrate W is suppressed by the drying process using the supercritical fluid.

[0184] [Step S08] Transferring the substrate from the buffer to the carrier

[0185] The central robot CR transfers the substrate W after drying from the second single-wafer processing chamber SW2 to any of the loading racks in the buffer 27. When a batch of substrates W1 (25 substrates) are transferred to the buffer 27, the substrate handling mechanism HTR transfers the 25 substrates W1 from the buffer 27 to the first empty carrier C placed on the rack 13A. After that, the carrier transfer mechanism 11 in the storage block 3 transfers the first carrier C to the loading port 9.

[0186] Furthermore, when a batch of substrates W2 is placed in the buffer 27, the substrate handling mechanism HTR transfers 25 substrates W2 from the buffer 27 to the second empty carrier C placed on the shelf 13A. After that, the carrier transfer mechanism 11 in the storage block 3 transfers the second carrier C to the loading port 9. An external transfer robot (not shown) sequentially transfers the two carriers C to the next destination.

[0187] According to the present embodiment, the posture conversion area R3 (including the second posture conversion mechanism 35) is provided between the transfer block 5 and the batch processing area R1. In addition, the single-chip substrate conveying area R4 is adjacent to the transfer block 5 and the posture conversion area R3. Moreover, the single-chip processing area R5 (including a plurality of single-chip processing chambers SW1 and SW2) is adjacent to the single-chip substrate conveying area R4. In addition, the position of the lifting platform 41 of the central robot CR provided in the single-chip substrate conveying area R4 in the horizontal direction XY is fixed. Therefore, the transfer block 5, the second posture conversion mechanism 35, and the plurality of single-chip processing chambers SW1 and SW2 can be arranged around the central robot CR. Thus, for example, the conveying distance of the substrate W of the central robot CR can be shortened, and therefore, the substrate W can be efficiently conveyed. In addition, the conveying mechanism WTR can convey a plurality of substrates W at a time between the substrate handover position PP in the transfer block 5, the six batch processing tanks BT1 to BT6, and the second posture conversion mechanism 35. As a result, the processing volume can be improved.

[0188] In addition, the second posture conversion mechanism 35 has a substrate standby area R31 and a posture conversion execution area R32 arranged along the front-back direction X extending from the batch processing area R1. A substrate holding portion 65 is provided in the substrate standby area R31, and the substrate holding portion 65 holds the plurality of substrates W transported by the transport mechanism WTR in a vertical posture. A posture conversion portion 63 is provided in the posture conversion execution area R32. The posture conversion portion 63 has: two clamps 71, 72 for holding the plurality of substrates W; a longitudinal rotation portion 94 for rotating the two clamps 71, 72 around the horizontal axis AX5; and a horizontal moving portion 95 for moving the two clamps 71, 72 and the longitudinal rotation portion 94 between the upper side of the substrate holding portion 65 and a pre-set position in the posture conversion execution area R32.

[0189] The posture conversion unit 63 receives the plurality of substrates W from the substrate holding unit 65 using the two clamps 71 and 72 in the substrate waiting area R31 , and converts the postures of the plurality of substrates W from vertical to horizontal using the longitudinal rotation unit 94 in the posture conversion execution area R32 .

[0190] Thus, the width of the posture conversion region R3 where the second posture conversion mechanism 35 is arranged is reduced in the width direction Y orthogonal to the front-rear direction X in which the batch processing region R1 extends. Therefore, the width of the substrate processing apparatus 1 can be suppressed to be small.

[0191] In addition, the single-wafer processing region R5 is provided on the opposite side of the transfer block 5 across the single-wafer conveying region R4. The transfer block 5 has a large width in the width direction Y orthogonal to the front-rear direction X in which the batch processing region R1 extends. Since the single-wafer processing region R5 is arranged to face the transfer block 5, the width of the substrate processing apparatus 1 can be suppressed to be small.

[0192] Example 2

[0193] Next, a second embodiment of the present invention will be described with reference to the drawings. Note that descriptions overlapping with those of the first embodiment will be omitted. Fig.12 (a) is a plan view showing the second posture conversion mechanism 35 of the second embodiment. Fig.12 (b) in the Fig.12 Front view of (a).

[0194] In the first embodiment, the second posture conversion mechanism 35 has the lifter LF9 and the posture conversion unit 63 having the lateral rotation unit 93. In contrast, the second posture conversion mechanism 35 of the second embodiment has the pusher mechanism 105 and the posture conversion unit 63 without the lateral rotation unit 93.

[0195] The pusher mechanism 105 holds a plurality of (eg, fifty) substrates W conveyed by the conveying mechanism WTR in a vertical posture. The pusher mechanism 105 includes a pusher 107 and an elevating and rotating unit 109. The pusher 107 corresponds to a substrate holding unit of the present invention.

[0196] The pusher 107 holds, for example, fifty substrates W arranged at a predetermined interval (for example, half pitch) from below. The pusher 107 has holding grooves (not shown) the same number (fifty) as the number of substrates W, so as to hold fifty substrates W. The depth of each holding groove of the pusher 107 is formed in a V shape. The lifting and rotating unit 109 lifts and lowers the pusher 107, and rotates the pusher 107 around the vertical axis AX6. The lifting and rotating unit 109 has, for example, one or more electric motors.

[0197] In addition, if Fig.12 As shown in (b), the posture conversion unit 63 of the second embodiment does not have Figure 4 Therefore, the top end of the rotating shaft 97 is fixed to the arm support part 78.

[0198] Next, refer to Figure 7 The flowchart of the second posture conversion mechanism 35 of the second embodiment illustrates the operation of the second posture conversion mechanism 35. The operation of the second posture conversion mechanism 35 is basically as follows Figure 7 However, since the second posture conversion mechanism 35 of the second embodiment does not have the lateral rotation part 93, no lateral rotation part 93 is performed. Figure 7 Instead, the pusher mechanism 105 rotates the twenty-five substrates W2 of the second substrate group about the vertical axis AX6.

[0199] exist Figure 7 In step S13 , the posture conversion section 63 holds and extracts twenty-five substrates W1 arranged in a straight line among the fifty substrates W from the substrate holding section 65 by means of the two vertical holding sections 80 , 82 (twenty-five pairs of holding grooves 89 , 90 ).

[0200] Afterwards, the lifting and rotating part 109 of the pusher mechanism 105 rotates the twenty-five substrates W2 held by the pusher 107 by 180 degrees (angle) around the vertical axis AX6. Thus, similarly to the substrate W1 of the first substrate group, when the posture of the substrate W2 of the second substrate group is changed, the device surface can be turned upward. In addition, when viewed from above, the vertical axis AX6 is set at the center of the fifty substrates W held by the pusher 107. Therefore, by rotating 180 degrees, the position of the substrate W2 is offset by half the pitch in the direction of the neat arrangement of the substrates W. Therefore, the two vertical holding parts 80, 82 can hold the substrate W1 of the second substrate group at the same position as the first substrate holding position, which is a position where the substrate W1 of the first substrate group can be held by twenty-five pairs of holding grooves 89, 90. In addition, the horizontal moving part 95 can also move the two vertical holding parts 80, 82, etc. to the first substrate holding position and the second substrate holding position, respectively.

[0201] Afterwards, in Figure 7 In step S17, the posture conversion unit 63 holds and conveys the twenty-five substrates W2 that have been rotated 180 degrees. Figure 7 Step S19.

[0202] According to this embodiment, the lifting and rotating part 109 of the pusher mechanism 105 rotates the pusher 107 around the vertical axis AX6. Therefore, even if the posture conversion part 63 does not include the lateral rotating part 93 of the first embodiment, the orientation of the front and back surfaces of the substrate W can be changed on the pusher 107 side, so the structure of the posture conversion part 63 can be simplified.

[0203] Example 3

[0204] Next, a third embodiment of the present invention will be described with reference to the drawings. Note that descriptions overlapping with those of the first and second embodiments will be omitted. Fig.13 It is a plan view showing a schematic structure of a substrate processing apparatus 1 according to a third embodiment.

[0205] In the first embodiment, the substrate processing apparatus 1 includes a substrate handling mechanism HTR, a central robot CR, and a buffer unit 27 (see Figure 1 ). In contrast, in the third embodiment, the substrate processing apparatus 1 does not include the substrate handling mechanism HTR and the buffer unit 27. That is, the central robot CR2 also functions as the substrate handling mechanism HTR.

[0206] Reference Fig.13The transfer block 5 has a central robot CR2. The single-wafer substrate transfer area R4 does not have a transfer robot including the central robot CR2. The central robot CR2 of the transfer block 5 is configured to be substantially the same as the central robot CR of Example 1. The central robot CR2 transfers the substrate W between the carrier C mounted on the shelf 13A, the first posture conversion mechanism 15, the second posture conversion mechanism 35 (posture conversion unit 63), and the plurality of single-wafer processing chambers SW1 and SW2.

[0207] For example, the central robot CR2 uses the hands 37A and 37B to take out a substrate W from the carrier C placed on the shelf 13A, and transfers the substrate W to the first posture conversion mechanism 15. In addition, the central robot CR2 uses the hands 37A and 37B to take out a substrate W from the second posture conversion mechanism 35, and transfers the substrate W to the first single-wafer processing chamber SW1.

[0208] In addition, the central robot CR2 takes out a substrate W from the first single-wafer processing chamber SW1 and transfers the substrate W to the second single-wafer processing chamber SW2. In addition, the central robot CR2 takes out a substrate W from the second single-wafer processing chamber SW2 and returns the substrate W to the carrier C placed on the shelf 13A.

[0209] According to the present embodiment, the posture conversion area R3 (including the second posture conversion mechanism 35) is provided between the transfer block 5 and the batch processing area R1. In addition, the single-wafer substrate conveying area R4 is adjacent to the transfer block 5 and the posture conversion area R3. Moreover, the single-wafer processing area R5 (including a plurality of single-wafer processing chambers SW1 and SW2) is adjacent to the single-wafer substrate conveying area R4. In addition, the position of the lifting platform 41 of the central robot CR2 provided in the transfer block 5 in the horizontal direction XY is fixed. Therefore, the carrier C placed on the shelf 13A, the first posture conversion mechanism 15, the second posture conversion mechanism 35, and the plurality of single-wafer processing chambers SW1 and SW2 can be arranged around the central robot CR2. Thus, for example, the conveying distance of the substrate W of the central robot CR2 can be shortened, and therefore, the substrate W can be efficiently conveyed. In addition, the conveying mechanism WTR can convey a plurality of substrates W at once between the substrate handover position PP in the transfer block 5, for example, the six batch processing tanks BT1 to BT6, and the second posture conversion mechanism 35. Furthermore, in particular, the substrate W taken out from the single-wafer processing chamber SW2 can be directly transferred to the carrier C of the shelf 13A. As a result, the processing throughput can be improved.

[0210] The present invention is not limited to the above-described embodiment, and can be implemented in the following modified forms.

[0211] (1) In the above embodiments, for example, Figure 1In the embodiment, the substrate standby area R31 of the second posture conversion mechanism 35 is adjacent to the batch processing area R1, and the posture conversion execution area R32 is adjacent to the transfer block 5. That is, the substrate standby area R31 and the posture conversion execution area R32 of the second posture conversion mechanism 35 are arranged in the front-back direction X. In contrast, Fig.14 As shown in FIG. 1 , the substrate waiting area R31 and the posture change execution area R32 may be arranged in the width direction Y. As shown in FIG.

[0212] In this case, the posture change execution area R32 is arranged on the left side Y of the single-piece substrate conveying area R4. The substrate standby area R31 is arranged on the left side Y of the posture change execution area R32.

[0213] (2) In each of the above-mentioned embodiments and modification (1), the single-wafer processing area R5 (single-wafer processing chambers SW1 and SW2) is arranged on the opposite side of the transfer block 5 across the single-wafer substrate transfer area R4 and is adjacent to the posture conversion area R3. Fig.15 As shown, the processing block 7 may also have a second single-wafer processing area R6, which is arranged on the opposite side of the posture conversion area R3 across the single-wafer substrate transfer area R4. A third single-wafer processing chamber SW3 is arranged in the second single-wafer processing area R6, and the third single-wafer processing chamber SW3 is configured to be the same as one of the single-wafer processing chambers SW1 and SW2. In addition, the second single-wafer processing area R6 may also have a plurality of third single-wafer processing chambers SW3 arranged in the vertical direction Z.

[0214] As a result, since the single-wafer processing area becomes larger, more single-wafer processing chambers can be configured. Fig.15 In the embodiment, since the single-wafer processing chamber SW3 is provided, the number of single-wafer processing chambers can be increased. Therefore, the processing throughput of single-wafer processing can be improved.

[0215] (3) In each of the above embodiments and variations, the lifting platform 41 of the central robot CR is set on the ground of the single-chip substrate conveying area R4. Alternatively, the central robot CR, i.e., the lifting platform 41, may be suspended above the single-chip substrate conveying area R4. At the position above the single-chip substrate conveying area R4, the position of the lifting platform 41 in the horizontal direction XY is fixed. Fig.16 As shown in the figure, the upper end (base end) of the lifting platform 41 does not move in the horizontal direction XY, but is fixed to the top support frame 120 above the single-piece substrate transfer area R4. The base ends of the multi-joint arms 39A and 39B are provided at the lower part of the lifting platform 41. The two hands 37A and 37B are provided at the top ends (and the lower sides) of the multi-joint arms 39A and 39B, respectively.

[0216] According to this modification, it is possible to prevent the central robot CR (CR2) from being contaminated by droplets falling from a wet substrate. For example, it is possible to prevent the central robot CR (CR2) from malfunctioning due to contamination.

[0217] (4) In each of the above-mentioned embodiments and each of the modified examples, each of the batch processing tanks BT1 to BT6 processes fifty substrates W arranged in a face-to-face manner at half pitch. In contrast, each of the batch processing tanks BT1 to BT6 may also process substrates W arranged in a face-to-back manner with the device surfaces of all substrates W facing the same direction. Each of the batch processing tanks BT1 to BT6 may also process twenty-five substrates W of one carrier C arranged in a full pitch. In addition, when fifty substrates W are arranged in a face-to-back manner in the substrate holding portion 65, the Y-direction moving portion 102 moves the two clamps 71 and 72 in the width direction Y in which the substrates W are neatly arranged. That is, the Y-direction moving portion 102 moves the two clamps 71 and 72 between the first substrate holding position and the second substrate holding position. Therefore, the posture conversion portion 63 can take out twenty-five substrates W1 or twenty-five substrates W2.

[0218] (5) In each of the above-mentioned embodiments and each of the modified examples, the single-wafer processing chamber SW2 uses a supercritical fluid to perform a drying process on the substrate W. In contrast, similarly to the single-wafer processing chamber SW1, the single-wafer processing chamber SW2 may also include a rotating processing unit 45 and a nozzle 47. In this case, the single-wafer processing chambers SW1 and SW2 (or the single-wafer processing chambers SW1 to SW3) respectively supply pure water and IPA to the substrate W in sequence, and then perform a drying process (spin drying) on ​​the substrate W.

[0219] (6) In the above-described embodiments and modifications, for example, in step S13, when the posture conversion unit 63 receives the substrate W from the substrate holding unit 65, the lifting unit 67 as the relative lifting unit lifts and lowers the substrate holding unit 65. On the other hand, the posture conversion unit 63 may include a lifting unit, and lift and lower the two clamps 71 and 72 and the arm support unit 78, etc., to receive the substrate W from the substrate holding unit 65. In addition, when the posture conversion unit 63 receives the substrate W from the substrate holding unit 65, the lifting unit of the posture conversion unit 63 and the lifting unit 67 may be lifted and lowered together.

[0220] Description of reference numerals:

[0221] 1: Substrate processing equipment

[0222] 3: Storage Block

[0223] 5: Move block

[0224] 7: Processing blocks

[0225] 13A: Shelf

[0226] HTR: Baseboard operating mechanism

[0227] 15: First posture conversion mechanism

[0228] PP: Substrate interface position

[0229] R1: Batch processing area

[0230] R2: Batch substrate handling area

[0231] R3: Posture Transition Area

[0232] R4: Single substrate handling area

[0233] R5: Monolithic processing area

[0234] 27: Buffer

[0235] BT1~BT6: Batch processing tank

[0236] WTR: Transport Agency

[0237] 35: Second posture conversion mechanism

[0238] CR, CR2: Central robot

[0239] 41: Lifting platform

[0240] 59: Control Department

[0241] R31: Substrate standby area

[0242] R32: Posture Transition Execution Area

[0243] LF9: Elevator

[0244] 63: Posture Transformation Department

[0245] 65: Substrate holding part

[0246] 71, 72: Chamber

[0247] 94: Longitudinal rotation part

[0248] 95: Horizontal moving part

[0249] AX5: Horizontal axis

Claims

1. A substrate processing device for continuously performing batch processing of processing a plurality of substrates at once and single processing of processing substrates one by one, characterized in that: The substrate processing device comprises: A carrier mounting frame for mounting a carrier, wherein the carrier accommodates a plurality of substrates in a horizontal posture at predetermined intervals in a vertical direction; a transfer block, adjacent to the carrier loading rack; a processing block, adjacent to the transfer block; as well as a substrate placing portion for placing the substrate; The transfer block has: A first posture conversion mechanism converts the plurality of substrates taken out from the carrier from a horizontal posture to a vertical posture; and a substrate handling mechanism for collectively conveying a plurality of substrates in a horizontal posture between the carrier mounted on the carrier mounting rack, the first posture conversion mechanism, and the substrate mounting portion; The processing block has: a batch processing area extending in a direction away from the transfer block; A batch substrate transport area is arranged along the batch processing area, one end side of which extends to the transfer block, and the other end side of which extends in a direction away from the transfer block; a posture conversion area, disposed between the transfer block and the batch processing area; a single-chip substrate transport area, adjacent to the transfer block and the posture conversion area; as well as a single-wafer processing area adjacent to the single-wafer substrate transport area; In the batch processing area, a plurality of batch processing tanks for collectively processing a plurality of substrates in a vertical posture are arranged in a direction in which the batch processing area extends; A second posture conversion mechanism is provided in the posture conversion area, and the second posture conversion mechanism converts the plurality of substrates processed in batches from a vertical posture to a horizontal posture; A batch substrate conveying mechanism is provided in the batch substrate conveying area, and the batch substrate conveying mechanism conveys a plurality of the substrates in a vertical posture between a substrate handover position set in the transfer block, a plurality of the batch processing tanks, and the second posture conversion mechanism; A plurality of single-wafer processing chambers for processing substrates in a horizontal position one by one are provided in the single-wafer processing area; A horizontal substrate conveying mechanism is provided in the single-wafer substrate conveying area, and the horizontal substrate conveying mechanism can convey substrates in a horizontal posture one by one between the second posture conversion mechanism, the plurality of single-wafer processing chambers and the substrate loading portion; The horizontal substrate transport mechanism comprises: A hand capable of horizontal movement, and a base plate for maintaining a horizontal posture; as well as The lifting platform enables the hand to be lifted and lowered, and the horizontal position is fixed.

2. The substrate processing apparatus according to claim 1, wherein: The second posture conversion mechanism has a substrate standby area and a posture conversion execution area arranged along the direction in which the batch processing area extends; A substrate holding portion is provided in the substrate standby area, and the substrate holding portion holds the plurality of substrates transported by the batch substrate transport mechanism in a vertical posture; A posture conversion unit is provided in the posture conversion execution area, and the posture conversion unit has: two clamps for holding the plurality of substrates; a longitudinal rotation unit for rotating the two clamps around a horizontal axis; and a horizontal moving portion for moving the two clamps and the longitudinal rotating portion between a position above the substrate holding portion and a preset position of the posture conversion execution area; The posture conversion unit receives the plurality of substrates from the substrate holding unit using the two clamps in the substrate standby area, and converts the postures of the plurality of substrates from vertical to horizontal using the longitudinal rotation unit in the posture conversion execution area.

3. The substrate processing device according to claim 1 or 2, characterized in that: The horizontal substrate transport mechanism is suspended at a position above the single substrate transport area.

4. The substrate processing apparatus according to claim 1 or 2, wherein: The single-wafer processing area is provided on the opposite side of the transfer block across the single-wafer conveying area, and is provided adjacent to the posture conversion area.

5. The substrate processing apparatus according to claim 4, wherein: The processing block further includes a second single-wafer processing area, which is disposed on the opposite side of the posture conversion area across the single-wafer substrate conveying area.

6. A substrate processing device for continuously performing batch processing of processing a plurality of substrates at once and single-wafer processing of processing substrates one by one, characterized in that: The substrate processing device comprises: A carrier mounting frame for mounting a carrier, wherein the carrier accommodates a plurality of substrates in a horizontal posture at predetermined intervals in a vertical direction; a transfer block, adjacent to the carrier loading rack; as well as a processing block, adjacent to the transfer block; The transfer block has: A first posture conversion mechanism converts the plurality of substrates taken out from the carrier from a horizontal posture to a vertical posture; and A horizontal substrate transport mechanism for transporting substrates in a horizontal position; The processing block has: a batch processing area extending in a direction away from the transfer block; A batch substrate transport area is arranged along the batch processing area, one end side of which extends to the transfer block, and the other end side of which extends in a direction away from the transfer block; a posture conversion area, disposed between the transfer block and the batch processing area; a single-chip substrate transport area, adjacent to the transfer block and the posture conversion area; as well as a single-wafer processing area adjacent to the single-wafer substrate transport area; In the batch processing area, a plurality of batch processing tanks for collectively processing a plurality of substrates in a vertical posture are arranged in a direction in which the batch processing area extends; A second posture conversion mechanism is provided in the posture conversion area, and the second posture conversion mechanism converts the plurality of substrates processed in batches from a vertical posture to a horizontal posture; A batch substrate conveying mechanism is provided in the batch substrate conveying area, and the batch substrate conveying mechanism conveys a plurality of the substrates in a vertical posture between a substrate handover position set in the transfer block, a plurality of the batch processing tanks, and the second posture conversion mechanism; A plurality of single-wafer processing chambers for processing substrates in a horizontal position one by one are provided in the single-wafer processing area; The horizontal substrate transport mechanism can transport the substrate in a horizontal posture between the carrier mounted on the carrier mounting shelf, the first posture conversion mechanism, the second posture conversion mechanism, and the plurality of single-wafer processing chambers; The horizontal substrate transport mechanism comprises: A hand capable of horizontal movement, and a base plate for maintaining a horizontal posture; as well as The lifting platform enables the hand to be lifted and lowered, and the horizontal position is fixed.

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