Thickness uniformity improvement accessory for thermal epitaxy processing
By using base accessories on the substrate support, the uneven temperature distribution and deposition problems during epitaxial treatment are solved, and uniform heating and efficient deposition of the substrate are achieved.
Patent Information
- Application Number
- CN202380065385.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2022-07-27
- Filing Date
- 2023-01-05
- Publication Date
- 2025-04-18
AI Technical Summary
During solid-state integrated circuit manufacturing, the shielding effect on the substrate support during epitaxial processing results in uneven temperature distribution and deposition.
Base accessories are used that include base support plates, multiple base support members and lift rod assembly. The base support plate has a plurality of lifting rod holes and a support hole, the base support is recessed in the support hole and supports the substrate support by a support pin, and the lifting rod assembly is received in the lifting rod hole to achieve uniform heating of the substrate.
By eliminating the shielding effect, uniform heating and deposition of the substrate is achieved, and the thickness uniformity range of the deposition is improved by less than 1%.
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Figure CN119856275A_ABST
Abstract
Description
[0001] background Technical Field
[0002] Embodiments of the present disclosure generally relate to thermal processing of thin films on substrates (eg, silicon wafers). More specifically, embodiments of the present disclosure relate to process kits for epitaxial deposition. Background Art
[0003] In solid-state integrated circuit manufacturing, epitaxial processing is typically performed in an epitaxial processing chamber. A substrate disposed on a substrate support in the epitaxial processing chamber is typically heated by lamps positioned above and / or below the substrate.
[0004] However, during processing, various chamber components can create shadowing on the substrate support. This shadowing blocks heat from the lamps used to heat the substrate support and substrate, causing uneven temperature distribution and, therefore, uneven deposition. Thus, there is a need for improved hardware for epitaxial deposition. Summary of the invention
[0005] The present disclosure generally relates to thermal processing of thin films on substrates (eg, silicon wafers). More specifically, embodiments of the present disclosure relate to process kits for epitaxial deposition.
[0006] In one embodiment, a susceptor assembly includes: a susceptor support plate, a plurality of susceptor support members, and a lifting rod assembly. The susceptor support plate includes: a plurality of susceptor lifting rod holes and a plurality of susceptor support holes. A plurality of susceptor support members are recessed in the plurality of susceptor support holes and coupled to the susceptor support plate. The plurality of susceptor support members each include two or more susceptor support pins to support a substrate support member. The susceptor lifting rod assembly is accommodated in the plurality of susceptor lifting rod holes.
[0007] In another embodiment, a susceptor assembly includes: a susceptor support plate, a plurality of susceptor support members, and a lifting rod assembly. The susceptor support plate includes: a plurality of susceptor lifting rod holes and a plurality of susceptor support holes. A plurality of susceptor support members are recessed in the plurality of susceptor support holes and coupled to the susceptor support plate. Each of the plurality of susceptor support members includes two or more susceptor support pins to support a substrate support member. The lifting rod assembly is received in the plurality of susceptor lifting rod holes.
[0008] In another embodiment, a base accessory includes: a base support plate, the base support plate including: a plurality of base lift rod holes and a plurality of base support holes, a plurality of base support members recessed in the plurality of base support holes and coupled to the base support plate, and a lift rod assembly. The plurality of base support members include: a support body and a support pin link. The support connector is received by a support anchor of the base support plate to secure the support body to the base support plate. The support pin link receives a plurality of base support pins. The support body supports the support pin link in a spaced relationship from the base support plate. The lift rod assembly is received in the plurality of base lift rod holes. The lift rod assembly includes: a lift rod cap and a base lift rod including a base stop plate. The base support plate stop can be received in the base lift rod hole. BRIEF DESCRIPTION OF THE DRAWINGS
[0009] In order that the manner in which the above-mentioned features of the present disclosure can be understood in detail, a more particular description of the present disclosure briefly summarized above may be obtained by reference to embodiments, some of which are illustrated in the accompanying drawings. It should be noted, however, that the drawings illustrate only exemplary embodiments and are not to be considered limiting of the scope (as the present disclosure may admit to other equally effective embodiments).
[0010] Figure 1 is a schematic cross-section of an epitaxial system according to an embodiment of the present disclosure.
[0011] Figure 2 is a schematic cross-section of a base assembly according to an embodiment of the present disclosure.
[0012] Figure 3A is a schematic cross-section of a base assembly at cutting line AA according to an embodiment of the present disclosure.
[0013] Figure 3B is a schematic cross-section of a base assembly at cutting line BB according to an embodiment of the present disclosure.
[0014] Figure 3C is a schematic cross-section of a base support plate at cutting line CC according to an embodiment of the present disclosure.
[0015] Figure 4 is a schematic cross-section of a lift mast assembly according to an embodiment of the present disclosure.
[0016] Figure 5 is a schematic cross-section of an alternative lifter cap and an alternative base lifter according to an embodiment of the present disclosure.
[0017] Fig. 6A is a schematic cross-section of a base support according to an embodiment of the present disclosure.
[0018] Figure 6B is a schematic cross-section of a base support at cut line DD according to an embodiment of the present disclosure.
[0019] Figure 6C is a schematic cross-section of a base support at cutting line EE according to an embodiment of the present disclosure.
[0020] To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures. It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation. DETAILED DESCRIPTION
[0021] The present disclosure generally relates to thermal processing of thin films on substrates (eg, silicon wafers). More specifically, embodiments of the present disclosure relate to susceptor assemblies for thermally sensitive epitaxial deposition.
[0022] Figure 1 1 is a schematic cross-section of an epitaxy system 100 according to one embodiment of the present disclosure. The epitaxy system 100 is used to grow an epitaxial film on a substrate, such as substrate 102. The epitaxy system 100 generates a cross-flow of precursors across a top surface 150 of the substrate 102.
[0023] The epitaxial system 100 includes an upper body 156, a lower body 148 disposed below the upper body 156, and a flow module 112 disposed between the upper body 156 and the lower body 148. The upper body 156, the flow module 112, and the lower body 148 form a chamber body. Disposed within the chamber body are a substrate support 106 (e.g., a susceptor), an upper window 108 (e.g., a dome), a lower window 110 (e.g., a dome), a plurality of upper lamps 141, and a plurality of lower lamps 143.
[0024] Controller 120 communicates with epitaxial system 100 and is used to control processes (e.g., those described herein). Controller 120 is configured to receive data or input from epitaxial system 100 as sensor readings. Controller 120 is equipped with a system model of epitaxial system 100 or communicates with a system model of epitaxial system 100. The system model includes: epitaxial deposition model. The system model is a program configured to monitor the deposition process within epitaxial system 100 throughout the deposition process. Epitaxial system 100 is further configured to store the readings and calculations in memory 135.
[0025] The readings and calculations include: previous sensor readings, and any other previous sensor readings within the epitaxial system 100. The readings and calculations further include: stored calculation values after the sensor readings are measured by the sensors 153 within the epitaxial system 100 and run through the system model. Thus, the controller 120 is configured to retrieve the stored readings and calculations, and save the readings and calculations in the memory 135 for future use. Maintaining previous readings and calculations in the memory 135 enables the controller 120 to adjust the system model over time to reflect a more accurate version of the epitaxial system 100.
[0026] In the embodiments described herein, the controller 120 includes: a programmable central processing unit (CPU) 155, which operates in conjunction with a memory 135 and a display unit (not shown). The controller 120 monitors deposition, gas flow, temperature, and actuation of the axis 118 within the epitaxy system 100. Support circuits 158 are coupled to the CPU 155 to support the processor in a conventional manner. In some embodiments, the controller 120 includes: a plurality of controllers 120, so that stored readings and calculations, and system models are stored in a controller 120 separate from the controller 120 operating the epitaxy system 100. In other embodiments, the system model and the stored readings, and the owner of the calculations are all saved in the controller 120.
[0027] The controller 120 is configured to control deposition, gas flow, temperature, and actuation of the axis 118 within the epitaxy system 100. The controller 120 is configured to adjust aspects of the epitaxy system 100 based on sensor readings, system models, and stored readings and calculations. The controller 120 includes embedded software and compensation algorithms to calibrate deposition, gas flow, temperature, and actuation of the axis 118 within the epitaxy system 100. The controller 120 may include: a machine learning algorithm, and may use regression or clustering techniques. The algorithm is an unsupervised algorithm or a supervised algorithm.
[0028] The substrate support 106 is disposed between the upper window 108 and the window 110. A plurality of upper lamps 141 are disposed between the upper window 108 and the cover 154. The cover 154 includes a plurality of sensors 153 disposed therein to measure the temperature within the epitaxial system 100. A plurality of lower lamps 143 are disposed between the lower window 110 and the bottom plate 152. The plurality of lower lamps 143 form a lower lamp assembly 145.
[0029] A processing volume 136 is formed between the upper window 108 and the lower window 110. The processing volume 136 has a substrate support 106 disposed in the processing volume 136. The substrate support 106 includes: a top surface on which the substrate 102 is disposed. The substrate support 106 is attached to the shaft 118. The shaft 118 is connected to the motion assembly 121. The motion assembly 121 includes: one or more actuators and / or adjustment devices that provide movement and / or adjustment of the shaft 118 and / or the substrate support 106 within the processing volume 136. The motion assembly 121 includes: a rotary actuator 122 that rotates the shaft 118 and / or the substrate support 106 about the longitudinal axis A of the epitaxy system 100. The motion assembly 121 further includes a vertical actuator 124 to raise and lower the substrate support 106 in the z direction. The motion assembly 121 includes a tilt adjustment 126 for adjusting the planar orientation of the substrate support 106 and a lateral adjustment 128 for adjusting the position of the shaft 118 and the substrate support 106 from side to side within the processing volume 136 .
[0030] The substrate support 106 may include a lift pin hole 107 disposed in the substrate support 106. The lift pin hole 107 is sized to accommodate lift pins 132 to lift the substrate 102 from the substrate support 106 before or after performing a deposition process. The lift pins 132 may rest on lift pin stops 134 when the substrate support 106 is lowered from the processing position to the transfer position.
[0031] The flow module 112 includes: a plurality of process gas inlets 114, a plurality of purge gas inlets 164, and one or more exhaust gas outlets 116. The plurality of process gas inlets 114 and the plurality of purge gas inlets 164 are disposed on a side of the flow module 112 opposite to the one or more exhaust gas outlets 116. One or more flow guides 146 are disposed below the plurality of process gas inlets 114 and the one or more exhaust gas outlets 116. The flow guide 146 is disposed above the purge gas inlet 164. A liner 163 is disposed on an inner surface of the flow module 112 and protects the flow module 112 from the reactive gas used during the deposition process. The process gas inlet 114 and the purge gas inlet 164 are positioned so that the gas flows parallel to the top surface 150 of the substrate 102 disposed in the processing volume 136. The process gas inlet 114 is fluidically connected to a process gas source 151. The purge gas inlet 164 is fluidically connected to a purge gas source 162. The one or more exhaust gas outlets 116 are fluidly connected to an exhaust pump 157 . Each of the process gas source 151 and the purge gas source 162 may be configured to supply one or more precursors or process gases into the processing volume 136 .
[0032] Figure 2 1 is a schematic cross-section of a susceptor assembly 200 coupled to a substrate support 106. The susceptor assembly 200 includes a susceptor support plate 202 attached to the shaft 118 between the shaft 118 and the substrate support 106. The susceptor support plate 202 is disposed within the processing volume 136 of the epitaxial system 100 (eg, Figure 1 ) supports the substrate support 106. A distance D1 from the top surface of the susceptor support plate 202 to the bottom surface of the susceptor support 106 is between about 20 mm and about 40 mm. The susceptor assembly 200 further includes: a plurality of susceptor supports 204 and a lift rod assembly 205. The susceptor supports 204 are received in a plurality of susceptor support holes 208 of the susceptor support plate 202. The susceptor supports 204 couple the susceptor support plate 202 to the substrate support 106. The lift rod assembly 205 further includes: a susceptor lift rod 212, the susceptor lift rod 212 including a lift rod cap 214 and a susceptor support plate stop 216. In one embodiment, the lift rod cap 214 and the susceptor support plate stop 216 have an inverted frustoconical shape. The lift pin caps 214 are received within the plurality of base lift pin holes 107 of the base support 106, and the base support plate stoppers 216 are received within the plurality of base lift pin holes 206 of the base support plate 202. The lift pin holes 107 have a corresponding inverted truncated cone shape to receive the inverted truncated cone shape of the lift pin caps 214. The base support plate lift pin holes 206 have a corresponding inverted truncated cone shape to receive the base lift pins 212. The base support plate 202 has a thickness t between about 2 mm and about 5 mm. The base support plate 202 further comprises: a diameter d1 between about 200 mm and about 500 mm. The diameter d1 of the base support plate 202 is approximately equal to the diameter d2 of the substrate support. In one embodiment, the base support plate 202 comprises: a material having a high UV light transmittance (T) (e.g., a material through which UV light can effectively travel). In one embodiment, the material has T>80%. In one embodiment, the material having high UV transmittance comprises: a quartz material.
[0033] Figure 3A 2 is a schematic cross-section of the base assembly 200 at the cutting line AA. The base support member 204 includes: a plurality of base support pins 302. The base support pins 302 are radially positioned around the periphery of the base support plate 202 from the center of the base support plate 202 (e.g., Figure 3B and Figure 3C ) to contact the edge of the substrate support 106. In the illustrated embodiment, each susceptor support 204 (as shown in Figure 2) comprises: two susceptor support pins 302, and the susceptor support pins 302 are positioned radially approximately every 60°. The six contact points help to spread the thermal contact with the substrate support 106 and help to position (e.g., center) the substrate support 106 within the processing volume 136. In the illustrated embodiment, the lift rod holes 107 are positioned radially approximately every 120°, so that the lift rod holes 107 are between every other susceptor support pin 302. However, the present disclosure contemplates other radial spacings. The radial distance R1 of the lift rod hole 107 from the center of the substrate support 106 is between about 100 mm and about 120 mm. The susceptor support pins 302 comprise: silicon carbide material; however, other materials are also contemplated.
[0034] Figure 3B is a schematic cross-section of the base accessory 200 at the cutting line BB. The base support 204 further comprises: a support pin link 304. Figure 6A-6C As shown in FIG. 1 , the support pin link 304 spans between the two base support pins 302 of each base support 204 and receives the base support pins 302. FIG. 6A to FIG. 6C As shown in FIG. 1 , the base support 204 further includes a support body 604 . The support body 604 supports the support pin link 304 in a spaced relationship from the base support plate 202 .
[0035] Figure 3C is a schematic cross-section of the base support plate 202 at the cutting line CC. The base support plate 202 further includes: a base support hole 208 that accommodates the base support member 204. In the illustrated embodiment, the base support hole 208 and the base support plate lifting rod hole 210 are radially aligned and radially positioned approximately every 120°. However, the present disclosure contemplates other radial spacings. The radial distance R2 of the base support hole 208 from the center of the base support plate 202 is between about 165 mm and about 185 mm. The radial distance R3 of the base lifting rod hole 206 from the center of the base support plate 202 is between about 100 mm and about 120 mm. The radial distances R1 and R3 are substantially the same, for example, + / - about 1 mm.
[0036] Figure 44 is a schematic cross-section of the lift pin assembly 205. The lift pin cap 214 is an inverted truncated cone and includes: a bottom surface 411 and a top surface 413. The top surface of the lift pin cap 214 is substantially flat to promote uniform contact with the substrate 102. The bottom surface 411 includes a lift pin alignment hole 415 to accommodate the base lift pin 212. In one embodiment, the lift pin alignment hole 415 has a tapered design, wherein the sidewall 417 of the lift pin alignment hole 415 tapers outwardly away from the top 418 of the lift pin alignment hole 415 toward the bottom surface 411 of the lift pin alignment hole 415. The tapered design of the lift pin alignment hole 415 allows the base lift pin 212 to be easily aligned with the lift pin alignment hole 415. The lift pin cap 214 further includes: an expanded sidewall 419. The flared sidewalls 419 flare outwardly from the bottom surface 411 toward the top surface 413 such that the diameter of the lifter cap 214 increases from the bottom surface 411 to the top surface 413. The flared sidewalls 419 align the lifter cap 214 with the lifter pin holes 107 and prevent the lifter cap 214 from passing through the lifter pin holes 107 of the substrate support 106. In one embodiment, the lifter cap 214 comprises a material that is thermally matched to the material of the substrate support 106 (e.g., the material of the lifter cap 214 comprises silicon carbide or silicon carbide coated graphite).
[0037] The first end 420 of the base lift rod 212 is received in the lift rod alignment hole 415. The second end 422 of the base lift rod 212 is opposite to the first end 420 of the base lift rod 212. The base support plate stopper 216 is disposed between the first end 420 and the second end 422 of the base lift rod 212. The base support plate stopper 216 further includes: an expansion portion 424 and a stop portion 426. The expansion portion 424 is oriented toward the second end 422 of the base lift rod 212, and the stop portion 426 is oriented toward the first end 420 of the base lift rod 212. The expansion portion 424 expands outward toward the stop portion 426 of the base lift rod 212. The expansion portion 424 of the base support plate stopper 216 aligns the base support plate stopper 216 with the plurality of base lift rod holes 206. The stop portions 426 of the base support plate stop 216 prevent the base lift pins 212 from passing through the plurality of base lift pin holes 206 .
[0038] As the susceptor support plate 202 is lowered from the processing position to the transfer position within the processing volume 136, the second ends 422 of the susceptor lift pins 212 are engaged by the lift pin stops 134. As the susceptor support plate continues to be lowered within the processing volume, the first ends 420 of the susceptor lift pins 212 are received in the lift pin alignment holes 415 and engage the tops 418 of the lift pin alignment holes 415. The susceptor lift pins 212 force the top surfaces 413 of the lift pin caps 214 to engage the substrate 102, thereby moving the substrate 102 away from the substrate support 106. When the lift pin caps 214 are engaged by the susceptor lift pins 212, the lift pin caps 214 can lift the substrate 102 from the substrate support 106 prior to a deposition process to facilitate alignment of the substrate 102 by a robot on the substrate support 106. The lift pin caps 214 may also lift the substrate 102 from the substrate support 106 after a deposition process to position the processed substrate for removal by the robot from the processing volume 136 and replacement by a substrate to be processed within the processing volume when the lift pin caps 214 are engaged by the pedestal lift pins 212. The pedestal lift pins 212 may rest on the lift pin stops 134 when the substrate support 106 is lowered from the processing position to the transfer position. When in the processing position, the pedestal lift pins 212 are not engaged with the lift pin caps 214. When in the processing position, the lift pin caps 214 are recessed within the lift pin holes 107 such that the lift pin caps 214 are not in contact with the substrate 102.
[0039] In one embodiment, the base lift rod 212 and lift rod stop 134 include: a material with high UV light transmittance (T) (e.g., a material through which UV light can efficiently travel). In one embodiment, the material has T>80%. In one embodiment, the material with high UV transmittance includes: a quartz material.
[0040] Figure 55 is a schematic cross-section of an alternative lift rod cap 514 and an alternative base lift rod 512. The lift rod cap 514 can be used in place of the lift rod cap 214, and the base lift rod 512 can be used in place of the base lift rod 212. The lift rod cap 514 includes: a side wall 519, a top surface 513, and a bottom surface 511. The bottom surface 511 has a lift rod alignment hole 515 to accommodate the base lift rod 512. The lift rod alignment hole is defined by a top 518 of the lift rod alignment hole 515, a side wall 517 of the lift rod alignment hole 515, and a bottom lip 527 of the lift rod alignment hole 515. The side wall 517, the top 518, and the bottom lip 527 form a generally circular cavity. The base lift rod 512 further includes: a first end cap 528 at a first end 520 of the base lift rod 512. The first end cap 528 is received in the lifter alignment hole 515 to engage the top 518 of the lifter cap 514. The diameter d3 of the first end cap 528 is substantially the same as the diameter d4 of the lifter alignment hole 515 (e.g., + / - 0.1 mm). When the first end cap 528 is aligned with the lifter alignment hole 515, the first end cap 528 can be inserted into the lifter alignment hole 515. If the first end cap 528 and the lifter alignment hole 515 are not aligned, the first end cap 528 will not fit into the lifter alignment hole 515. When the alternative base lifter 512 is in the processing position (e.g., when the lifter cap 514 is recessed in the lifter hole 107), the base lifter is retained within the lifter cap 514 by the first end cap 528. In this embodiment, the base support plate stop 216 is not used.
[0041] The first end caps 528 of the pedestal lift pins 512 force the top surface 513 of the lift pin caps 514 to engage the substrate 102, thereby moving the substrate 102 away from the substrate support 106. The pedestal lift pins 512 can lift the substrate 102 from the substrate support 106 before a deposition process to align the substrate 102 on the substrate support 106. The pedestal lift pins 512 can also lift the substrate 102 from the substrate support 106 after a deposition process to position the processed substrate 102 to be removed from the processing volume 136 by the robot and replaced by a substrate to be processed within the processing volume 136.
[0042] In one embodiment, the pedestal lift pins 512 comprise a material with high UV transmittance (T) (e.g., a material through which UV light can efficiently travel). In one embodiment, the material has T>80%. In one embodiment, the material with high UV transmittance comprises a quartz material. In one embodiment, the lift pin caps 514 comprise a material that is thermally matched to the material of the substrate support 106 (e.g., the material of the lift pin caps 514 comprises silicon carbide or silicon carbide coated graphite).
[0043] Fig. 6Ais a schematic cross-section of the base support 204 . Figure 6B is a schematic cross-section of the base support 204 at the cutting line DD. Figure 6C EE is a schematic cross-section of the base support 204 at the cutting line EE. The base support 204 includes: a base support pin 302, a support pin link 304, a support connector 602, and a support body 604. The support body 604 is partially recessed in the base support hole 208 and is fixed to the base support plate 202 with a support connector 602 (i.e., a pin). The support connector 602 passes through the support body 604 above the base support hole 208. The base support plate 202 further includes: a plurality of support anchors 606 located on the inner side and the outer side of the base support hole 208. The inner side of the base support hole 208 is the side of the base support hole 208 closest to the center of the base support plate 202, and the outer side of the base support hole 208 is the side of the base support hole 208 farthest from the center of the base support plate 202. The support anchor 606 receives the exposed end of the support connector 602 in a pivot connection to secure the base support 204 to the base support plate 202. The support anchor 606 includes a cavity for receiving the support connector 602. The support body 604 is sized relative to the base support hole 208 to allow the base support 204 to pivot within the base support hole 208. The base support 204 pivots about the axis A between approximately + / - 5°. The ability of the base support 204 to pivot allows the base support pin 302 to maintain six-point contact with the substrate support 106. The width W1 of the support body 604 (as shown in FIG. Figure 6C ) is between about 10 mm and about 30 mm. The width W2 of the base support hole 208 is between about 12 mm and about 32 mm. The difference between the width W2 and the width W1 should be about + / - 2 mm.
[0044] The support body 604 extends away from the base support plate 202 and toward the base support member 106. The support pin link 304 further includes: a pin flange 608. The pin flange 608 extends vertically from the support pin link 304 and the support body 604 toward the center of the base support plate 202. The pin flange 608 further has a base support pin 302 (such as Figure 6B The distance D2 from the top surface of the base support plate 202 to the top of the pin flange 608 (as shown in Figure 6B ) is between about 20 mm and about 40 mm. The distance D3 between the midpoint of the support body 604 and the support pin hole 610 (as shown in Fig. 6A ) is between about 10 mm and about 15 mm.
[0045] In one embodiment, the components of the base support 204 and the support anchors 606 include: a material with high UV light transmittance (T) (e.g., a material through which UV light can efficiently travel). In one embodiment, the material has T>80%. In one embodiment, the material with high UV transmittance includes: a quartz material.
[0046] Using materials with high UV transmittance for components of the susceptor assembly 200 helps eliminate shadowing effects of components on the substrate support 106. More uniform heating of the substrate support 106 leads to more uniform heating of the substrate 102, allowing for more uniform deposition over the substrate (i.e., less than 1% thickness uniformity range).
[0047] In summary, the susceptor assembly includes: a susceptor support plate, a plurality of susceptor support members, and a lifting rod assembly. The susceptor support plate includes: a plurality of susceptor lifting rod holes and a plurality of susceptor support holes. A plurality of susceptor support members are recessed in the plurality of susceptor support holes and coupled to the susceptor support plate. The plurality of susceptor support members each include two or more susceptor support pins to support the substrate support member. The susceptor lifting rod assembly is accommodated in the plurality of susceptor lifting rod holes.
[0048] In another embodiment, a susceptor assembly includes: a susceptor support plate, a plurality of susceptor support members, and a lift rod assembly. The susceptor support plate includes: a plurality of susceptor lift rod holes and a plurality of susceptor support holes. The plurality of susceptor support members are recessed in the plurality of susceptor support holes and coupled to the susceptor support plate. Each of the plurality of susceptor support members includes two or more susceptor support pins supporting the substrate support member. The lift rod assembly is received in the plurality of susceptor lift rod holes.
[0049] In another embodiment, a base accessory includes: a base support plate, the base support plate including: a plurality of base lift rod holes and a plurality of base support holes, a plurality of base support members recessed in the plurality of base support holes and coupled to the base support plate, and a lift rod assembly. The plurality of base support members include: a support body and a support pin link. The support connector is received by a support anchor of the base support plate to secure the support body to the base support plate. The support pin link receives a plurality of base support pins. The support body supports the support pin link in a spaced relationship from the base support plate. The lift rod assembly is received in the plurality of base lift rod holes. The lift rod assembly includes: a lift rod cap and a base lift rod including a base stop plate. The base support plate stop can be received in the base lift rod hole.
[0050] While the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the present disclosure may be envisaged without departing from the basic scope of the present disclosure, and the scope of the present disclosure is determined by the claims that follow.
Claims
1. A base accessory, comprising: A base support plate, the base support plate comprising: a plurality of base lifting rod holes and a plurality of base support holes; a plurality of susceptor supports recessed within the plurality of susceptor support holes and coupled to the susceptor support plate, each of the plurality of susceptor supports comprising two or more susceptor support pins to support a substrate support; and A lift rod assembly is received in the plurality of base lift rod holes.
2. The base assembly of claim 1, wherein the plurality of base support holes and the base support member are radially spaced 120 degrees apart.
3. The susceptor assembly of claim 1, wherein the plurality of susceptor support pins are radially spaced 60 degrees apart.
4. The susceptor assembly of claim 1 wherein the susceptor support pin comprises silicon carbide.
5. The susceptor assembly of claim 1, wherein the susceptor support plate, the susceptor support member, and the lift rod assembly comprise a material having a UV transmittance greater than 80%.
6. The susceptor assembly of claim 5, wherein the material of the susceptor support plate, the susceptor support member, and the lift rod assembly is quartz.
7. A base accessory as described in claim 1, wherein the base support further includes: a support body and a support pin link, wherein a support connector is received by a support anchor of the base support plate to fix the support body to the base support plate, and wherein the support pin link receives the base support pin, and the support body supports the support pin link in a spaced relationship with the base support plate.
8. The base accessory of claim 7, wherein a width W1 of the support body is between 10 mm and 30 mm, and a width W2 of the base support hole is between 12 mm and 32 mm.
9. The base accessory of claim 1, wherein the base support member pivots within the base support aperture about an axis aligned with the base support aperture between + / - 5°.
10. A base accessory, comprising: A base support plate, the base support plate comprising: a plurality of base lifting rod holes and a plurality of base support holes; a plurality of susceptor supports recessed within the plurality of susceptor support holes and coupled to the susceptor support plate, each of the plurality of susceptor supports comprising two or more susceptor support pins to support a substrate support; and A lift rod assembly is received in the plurality of base lift rod holes.
11. The base accessory of claim 10, wherein the lifting rod assembly further comprises: a lifting rod cap and a base lifting rod, the base lifting rod comprises: a base stop plate, wherein the base support plate stopper further comprises: an expansion portion and a stop portion, the expansion portion having a side wall that expands outwardly toward the stop portion.
12. The base assembly of claim 11, wherein the lift rod cap has a top surface and a bottom surface, the bottom surface having a lift rod alignment hole.
13. The base assembly of claim 11, wherein the lift stem cap is comprised of silicon carbide.
14. The base assembly of claim 10, wherein the base support plate, the base support member, and the base lift rod comprise a material having a UV transmittance greater than 80%.
15. The susceptor assembly of claim 10, wherein the plurality of susceptor support holes and the susceptor support member are radially spaced 120 degrees apart, and the plurality of susceptor support pins are radially spaced 60 degrees apart.
16. A base accessory, comprising: A base support plate, the base support plate comprising: a plurality of base lifting rod holes and a plurality of base support holes; a plurality of base supports recessed within the plurality of base support holes and coupled to the base support plate, the plurality of base supports each comprising: a support body and a support pin link, wherein a support connector is received by a support anchor of the base support plate to secure the support body to the base support plate, and wherein the support pin link receives a plurality of base support pins, the support body supporting the support pin link in a spaced relationship from the base support plate, and A lifting rod assembly is accommodated in the plurality of base lifting rod holes, wherein the lifting rod assembly further comprises: a lifting rod cap and a base lifting rod, wherein the base lifting rod comprises: a base stop plate, wherein the base support plate stopper can be accommodated in the base lifting rod hole.
17. The base accessory of claim 16, wherein a width W1 of the support body is between 10 mm and 30 mm, and a width W2 of the base support hole is between 12 mm and 32 mm.
18. The base accessory of claim 16, wherein the base support member pivots within the base support aperture about an axis aligned with the base support aperture between + / - 5°.
19. The base assembly of claim 16, wherein the base support plate, the base support member, and the base lift rod comprise a material having a UV transmittance greater than 80%.
20. The susceptor assembly of claim 16, wherein the plurality of susceptor support holes and the susceptor support member are radially spaced 120 degrees apart, and the plurality of susceptor support pins are radially spaced 60 degrees apart.