Novel direct display COB module display screen surface packaging technology

Abstract

The invention relates to a novel direct display COB module display screen surface packaging technology, and belongs to the technical field of COB module display screen production, the novel direct display COB module display screen surface packaging technology comprises a packaging machine main body, a COB direct display lamp panel and a glue supply system, the packaging machine main body is provided with a conveyor, a conveying belt of the conveyor is uniformly provided with positioning magnetic blocks, the positioning magnetic blocks are magnetically connected with limiting blocks, and the limiting blocks are connected with the COB direct display lamp panel. And the packaging machine main body is fixedly provided with a glue sealing frame, a cooling air box, a tunnel furnace and a waste gas discharge box. According to the invention, the glue sealing frame, the waste gas exhaust box, the tunnel furnace and the cooling air box are arranged in sequence, so that the COB direct display lamp panel can be subjected to glue spreading, drying and cooling treatment in sequence, the surface of the COB direct display lamp panel can be quickly packaged, a glue dispensing technology form is changed into a glue spraying technology form with higher precision during glue packaging, and the packaging efficiency is improved. The thickness range of the colloid can be kept within the range of 10 + / -3 microns, so that the surface of the direct display COB module display screen has a stable and controllable colloid packaging thickness, and the COB direct display lamp panel has a more uniform display light color effect.

Description

Technical Field

[0001] The present invention relates to the technical field of COB module display screen production, and in particular to a novel direct display COB module display screen surface packaging process. Background Art

[0002] COB technology is an emerging LED packaging technology. Different from the traditional SMD surface mount packaging, it integrates the light-emitting chip into the PCB board instead of soldering it one by one. The packaged display screen has the advantages of improving the color rendering and visual consistency of the light source, a wider viewing angle, higher brightness, more uniform light spot, lower bad lamp rate, improved heat dissipation, reduced thickness, and avoiding spot light and glare. In addition, using COB packaging technology to manufacture display screens can better avoid cold solder joints and short solder joints in welding, reduce manufacturing processes, simplify the manufacturing process, and reduce manufacturing costs.

[0003] When encapsulating the existing COB bare crystal light board, the surface of the display chip is covered by piezoelectric valve dispensing, and then the optical film is covered on the surface of the colloid to complete the encapsulation process, as shown in the attached manual. Figure 6 As shown in the figure, in the actual surface packaging process, the piezoelectric valve dispensing is prone to cause uneven glue coverage, and the glue thickness ranges from 20-70um, resulting in poor flatness of the display light board and different display effects and gloss colors. For this reason, a new direct display COB module display screen surface packaging process is proposed, which changes the piezoelectric valve dispensing form to a full-surface spraying technology process, which can strictly control the glue thickness within the range of 10±3um, so that the display effect is uniform and controllable, and the surface packaging can be quickly formed. Summary of the invention

[0004] The present invention provides a novel direct display COB module display screen surface packaging process, which solves the problems raised by the existing background technology mentioned above. The colloid packaging is changed from the dispensing technology to the spraying technology with higher precision, so that the colloid thickness range can be maintained in the range of 10±3, so that the surface of the direct display COB module display screen has a stable and controllable colloid packaging thickness, and the COB direct display light board has a more uniform display light color effect.

[0005] The solution of the present invention to solve the above technical problems is as follows: a new type of direct display COB module display screen surface packaging process, including a packaging machine main body, a COB direct display light board and a glue supply system, characterized in that: the packaging machine main body is provided with a conveyor, the conveyor belt of the conveyor is evenly installed with positioning magnetic blocks, the positioning magnetic blocks are magnetically connected to the limit block, the packaging machine main body is fixedly installed with a sealing frame, a cooling air box, a tunnel furnace and an exhaust gas discharge box, the sealing frame is installed with an inkjet valve, the inkjet valve is fixedly connected to an ink pump, the ink pump is connected to the glue supply system, the packaging machine main body is provided with a CCD positioning camera module, the exhaust gas discharge box is fixedly connected to an exhaust fan, and the cooling air box is fixedly connected to a cooling fan;

[0006] The surface of the COB direct display light board is evenly provided with soldering pads, red light display chips, green light display chips and blue light display chips, the red light display chips, green light display chips and blue light display chips are installed at the soldering pads, and the surface of the COB direct display light board is sprayed with a colloid layer;

[0007] The packaging process includes the following steps:

[0008] S1: COB direct display light boards can be evenly placed on the conveyor of the packaging machine body for loading. Positioning magnetic blocks are set on the surface of the conveyor belt to position the COB direct display light boards, so that the COB direct display light boards can be evenly arranged for loading and moved to the sealing frame. The CCD positioning camera module can check the position of the COB direct display light boards. The ink pump can draw the colloid in the glue supply system to the inkjet valve for uniform spraying. During the movement of the conveyor, the colloid can be evenly sprayed on the surface of the COB direct display light board, thereby encapsulating the red light display chip, green light display chip and blue light display chip connected to the packaging machine body and its pads. The spraying thickness is set to 7-13um;

[0009] S2: The packaged COB direct display light board is transported to the exhaust gas discharge box, the exhaust fan can extract the exhaust gas, and the tunnel furnace can quickly dry the colloid layer on the surface of the COB direct display light board;

[0010] S3: The COB direct display light board with the colloid layer dried is transported to the cooling air box. The cooling fan can draw in the air from the outer wall, thereby cooling the colloid layer dried on the surface of the COB direct display light board, so that the surface of the COB direct display light board can be quickly encapsulated by the colloid layer;

[0011] S4: Remove the limit block from the positioning magnetic block so that the COB direct display light board can be removed from the conveyor for unloading.

[0012] Based on the above technical solution, the present invention can also be improved as follows.

[0013] Furthermore, limiting holes are provided at the four corner edges of the COB direct display light board corresponding to the positioning magnetic blocks, so that the positioning magnetic blocks can limit the COB direct display light board, so that the COB direct display light board can be evenly arranged on the conveyor belt of the conveyor.

[0014] Furthermore, two tunnel furnaces are provided, and the sealing rack, exhaust gas exhaust box, tunnel furnace and cooling wind box are arranged in sequence, so that the COB direct display light board can be glued, dried and cooled in sequence, so that the surface of the COB direct display light board can be quickly packaged.

[0015] Furthermore, the exhaust gas discharge box and the cooling air box are both provided with ventilation holes, and dust filters are fixedly installed in the ventilation holes to prevent dust from being introduced and affecting the effect of the finished product.

[0016] Furthermore, the inner walls of the exhaust gas discharge box and the cooling wind box are both configured as conical structures.

[0017] Furthermore, the sealing frame is provided with a mounting hole corresponding to the inkjet valve, and the inner wall of the mounting hole is fixedly connected to the inkjet valve.

[0018] The beneficial effects of the present invention are as follows: the present invention provides a novel direct display COB module display screen surface packaging process, which has the following advantages:

[0019] 1. The conveyor belt of the conveyor is evenly installed with positioning magnetic blocks, which are magnetically connected to the limited position blocks, so that the COB direct display light board can be evenly placed on the conveyor of the packaging machine body for loading. The CCD positioning camera module can check the position of the COB direct display light board. The ink pump can draw the colloid in the glue supply system to the inkjet valve for uniform spraying. During the movement of the conveyor, the colloid can be evenly sprayed on the surface of the COB direct display light board, thereby encapsulating the red light display chip, green light display chip and blue light display chip connected to the packaging machine body and its pads. The spraying thickness is set to 7-13um;

[0020] 2. The sealing rack, exhaust gas exhaust box, tunnel furnace and cooling air box are arranged in sequence, so that the COB direct display light board can be glued, dried and cooled in sequence, so that the surface of the COB direct display light board can be quickly packaged;

[0021] 3. When packaging the colloid, the dispensing technology is changed to a more precise spraying technology, so that the colloid thickness range can be maintained within the range of 10±3um, so that the surface of the direct display COB module display screen has a stable and controllable colloid packaging thickness, and the COB direct display light board has a more uniform display light color effect.

[0022] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the present invention in conjunction with the accompanying drawings. The specific implementation of the present invention is given in detail by the following embodiments and their accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of this application. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0024] Figure 1 A schematic diagram of a novel direct display COB module display screen surface packaging process provided by an embodiment of the present invention;

[0025] Figure 2 A schematic diagram of the structure of a sealing frame in a novel direct display COB module display screen surface packaging process provided by an embodiment of the present invention;

[0026] Figure 3 A schematic diagram of the structure of a COB direct display light board in a novel direct display COB module display screen surface packaging process provided by an embodiment of the present invention;

[0027] Figure 4 A schematic diagram of the structure of a positioning magnetic block in a novel direct display COB module display screen surface packaging process provided by an embodiment of the present invention;

[0028] Figure 5 A front view of a novel direct display COB module display screen surface packaging process provided by an embodiment of the present invention;

[0029] Figure 6 This is a schematic diagram of the structure of the glue dispensing colloid layer of the COB direct display light board.

[0030] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0031] 1. Packaging machine body; 2. COB direct display light board; 3. Solder pad; 4. Red light display chip; 5. Green light display chip; 6. Blue light display chip; 7. Colloid layer; 8. Conveyor; 9. Positioning magnetic block; 10. Limit block; 11. Sealing frame; 12. Exhaust gas discharge box; 13. Tunnel furnace; 14. Cooling bellows; 15. Inkjet valve; 16. Ink pump; 17. Glue supply system; 18. CCD positioning camera module; 19. Exhaust fan; 20. Cooling fan; 21. Dust filter. DETAILED DESCRIPTION

[0032] The following is combined with Figure 1-5The principles and features of the present invention are described, and the examples are only used to explain the present invention and are not used to limit the scope of the present invention. In the following paragraphs, the present invention is described in more detail by way of example with reference to the accompanying drawings. The advantages and features of the present invention will become clearer according to the following description and claims. It should be noted that the drawings are all in a very simplified form and are not in precise proportions, and are only used to facilitate and clearly assist in explaining the purpose of the embodiments of the present invention.

[0033] It should be noted that when a component is referred to as being "fixed to" another component, it may be directly on the other component or there may also be a component centered. When a component is considered to be "connected to" another component, it may be directly connected to the other component or there may also be a component centered. When a component is considered to be "set on" another component, it may be directly set on the other component or there may also be a component centered. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0034] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0035] like Figure 1-5 As shown, the present invention provides a novel direct display COB module display screen surface packaging process, including a packaging machine body 1, a COB direct display light board 2 and a glue supply system 17, the packaging machine body 1 is provided with a conveyor 8, the conveyor belt of the conveyor 8 is evenly installed with positioning magnetic blocks 9, the positioning magnetic blocks 9 are magnetically connected to the limited position block 10, the packaging machine body 1 is fixedly installed with a sealing frame 11, a cooling air box 14, a tunnel furnace 13 and an exhaust gas discharge box 12, the sealing frame 11 is installed with an inkjet valve 15, the inkjet valve 15 is fixedly connected with an ink pump 16, and the ink pump 16 is connected with the glue supply system 17, the packaging machine body 1 is provided with a CCD positioning camera module 18, the exhaust gas discharge box 12 is fixedly connected with an exhaust fan 19, and the cooling air box 14 is fixedly connected with a cooling fan 20;

[0036] The surface of the COB direct display light board 2 is evenly provided with soldering pads 3, red light display chips 4, green light display chips 5 and blue light display chips 6. The red light display chips 4, green light display chips 5 and blue light display chips 6 are installed at the soldering pads 3, and the surface of the COB direct display light board 2 is sprayed with a colloid layer 7.

[0037] Preferably, limiting holes are opened at the four corner edges of the COB direct display light board 2 corresponding to the positioning magnetic blocks 9, so that the positioning magnetic blocks 9 can limit the COB direct display light board 2, so that the COB direct display light board 2 can be evenly arranged on the conveyor belt of the conveyor 8.

[0038] Preferably, two tunnel furnaces 13 are provided, and the sealing rack 11, the exhaust gas exhaust box 12, the tunnel furnace 13 and the cooling wind box 14 are arranged in sequence, so that the COB direct display light board 2 can be glued, dried and cooled in sequence, so that the surface of the COB direct display light board 2 can be quickly packaged.

[0039] Preferably, both the exhaust gas discharge box 12 and the cooling air box 14 are provided with ventilation holes, and a dust filter 21 is fixedly installed in the ventilation holes to prevent dust from being introduced and affecting the effect of the finished product.

[0040] Preferably, the inner walls of the exhaust gas discharge box 12 and the cooling air box 14 are both configured as conical structures.

[0041] Preferably, the sealing frame 11 is provided with a mounting hole corresponding to the inkjet valve 15 , and the inner wall of the mounting hole is fixedly connected to the inkjet valve 15 .

[0042] The specific working principle and use method of the present invention are:

[0043] S1: The COB direct display light board 2 can be evenly placed on the conveyor 8 of the packaging machine body 1 for loading. The surface of the conveyor belt of the conveyor 8 is provided with a positioning magnetic block 9 to position the COB direct display light board 2, so that the COB direct display light board 2 can be evenly arranged for loading and moved to the sealing frame 11. The CCD positioning camera module 18 can check the position of the COB direct display light board 2. The ink pump 16 can draw the colloid in the glue supply system 17 to the inkjet valve 15 for uniform spraying. During the movement of the conveyor 8, the colloid can be evenly sprayed on the surface of the COB direct display light board 2, thereby packaging the red light display chip 4, the green light display chip 5 and the blue light display chip 6 connected to the packaging machine body 1 and its pad 3, and the spraying thickness is set to 7-13um;

[0044] S2: The packaged COB direct display light board 2 is transported to the exhaust gas discharge box 12, the exhaust fan 19 can extract the exhaust gas, and the tunnel furnace 13 can quickly dry the colloid layer 7 on the surface of the COB direct display light board 2;

[0045] S3: The COB direct display light board 2 dried by the colloid layer 7 is transported to the cooling air box 14, and the cooling fan 20 can draw in the outer wall air, so as to cool the colloid layer 7 dried on the surface of the COB direct display light board 2, so that the surface of the COB direct display light board 2 can be quickly encapsulated by the colloid layer 7;

[0046] S4: Remove the limit block 10 from the positioning magnetic block 9 so that the COB direct display light board 2 can be removed from the conveyor 8 for unloading processing.

[0047] It should be noted that, in this document, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Contents not described in detail in this specification belong to the prior art known to professionals in the field.

[0048] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Any ordinary technician in the industry can smoothly implement the present invention as shown in the drawings and described above. However, any equivalent changes, modifications and evolutions made by technicians familiar with the profession without departing from the scope of the technical solution of the present invention using the technical content disclosed above are all equivalent embodiments of the present invention. At the same time, any equivalent changes, modifications and evolutions made to the above embodiments based on the essential technology of the present invention are still within the protection scope of the technical solution of the present invention.

Claims

1. A novel direct display COB module display screen surface packaging process, comprising a packaging machine body (1), a COB direct display light board (2) and a glue supply system (17), characterized in that: The packaging machine body (1) is provided with a conveyor (8), the conveyor belt of the conveyor (8) is evenly installed with positioning magnetic blocks (9), the positioning magnetic blocks (9) are magnetically connected to the limit block (10), the packaging machine body (1) is fixedly installed with a sealing frame (11), a cooling wind box (14), a tunnel furnace (13) and an exhaust gas discharge box (12), the sealing frame (11) is installed with an inkjet valve (15), the inkjet valve (15) is fixedly connected to an ink pump (16), and the ink pump (16) is connected to a glue supply system (17), the packaging machine body (1) is provided with a CCD positioning camera module (18), the exhaust gas discharge box (12) is fixedly connected to an exhaust fan (19), and the cooling wind box (14) is fixedly connected to a cooling fan (20); The surface of the COB direct display light board (2) is evenly provided with a soldering pad (3), a red light display chip (4), a green light display chip (5) and a blue light display chip (6); the red light display chip (4), the green light display chip (5) and the blue light display chip (6) are mounted on the soldering pad (3); and the surface of the COB direct display light board (2) is sprayed with a colloid layer (7); The packaging process includes the following steps: S1: The COB direct display light board (2) can be evenly placed on the conveyor (8) of the packaging machine body (1) for loading. The surface of the conveyor belt of the conveyor (8) is provided with a positioning magnetic block (9) for positioning the COB direct display light board (2), so that the COB direct display light board (2) can be evenly arranged for loading and moved to the sealing frame (11). The CCD positioning camera module (18) can check the position of the COB direct display light board (2). The ink pump (16) can draw the colloid in the glue supply system (17) to the inkjet valve (15) for even spraying. During the movement of the conveyor (8), the colloid can be evenly sprayed on the surface of the COB direct display light board (2), thereby packaging the red light display chip (4), the green light display chip (5) and the blue light display chip (6) connected to the packaging machine body (1) and its pad (3). The spraying thickness is set to 3 to 10 um. S2: The packaged COB direct display light board (2) is transported to the exhaust gas exhaust box (12), the exhaust fan (19) can extract the exhaust gas, and the tunnel furnace (13) can quickly dry the colloid layer (7) on the surface of the COB direct display light board (2); S3: The COB direct display light board (2) dried by the colloid layer (7) is transported to the cooling air box (14), and the cooling fan (20) can draw in the air from the outer wall, thereby cooling the colloid layer (7) dried on the surface of the COB direct display light board (2), so that the surface of the COB direct display light board (2) can be quickly encapsulated by the colloid layer (7); S4: Remove the limit block (10) from the positioning magnetic block (9), so that the COB direct display light board (2) can be removed from the conveyor (8) for unloading.

2. According to claim 1, a novel direct display COB module display screen surface packaging process is characterized in that: Limiting holes are provided at the four corner edges of the COB direct display light board (2) corresponding to the positioning magnetic blocks (9).

3. According to the novel direct display COB module display screen surface packaging process of claim 1, it is characterized in that: Two tunnel furnaces (13) are provided, and the sealing frame (11), the exhaust gas discharge box (12), the tunnel furnace (13) and the cooling wind box (14) are provided in sequence.

4. According to the novel direct display COB module display screen surface packaging process of claim 1, it is characterized in that: The exhaust gas discharge box (12) and the cooling wind box (14) are both provided with ventilation holes, and a dust filter (21) is fixedly installed in the ventilation holes.

5. According to the novel direct display COB module display screen surface packaging process of claim 1, it is characterized in that: The inner walls of the exhaust gas discharge box (12) and the cooling wind box (14) are both configured as conical structures.

6. According to the novel direct display COB module display screen surface packaging process of claim 1, it is characterized in that: The sealing frame (11) is provided with a mounting hole corresponding to the inkjet valve (15), and the inner wall of the mounting hole is fixedly connected to the inkjet valve (15).

Images