Chip mounting method and chip process equipment

Abstract

The embodiment of the invention provides a chip mounting method and chip processing equipment, the method is applied to the chip processing equipment, the chip processing equipment comprises a mechanical arm and a solder furnace, the solder furnace comprises a power device, the power device is located at the bottom of the solder furnace, and the method comprises the following steps: heating a welding material to a molten state through the solder furnace; the welding material in the molten state in the welding flux furnace is driven to be in a surging state through a power device; the chip is grabbed through a mechanical arm, and the chip is controlled to enter the welding flux furnace so that the chip can dip welding flux from the welding material in the surging state; after the welding flux dipping is completed, the chip is controlled to complete chip mounting; through precise mechanical arm control, surging welding materials and an automatic chip feeding process, the chip feeding process precision and flexibility are improved, dependence on skills of operators is reduced, material waste is reduced, production efficiency is improved, and remarkable beneficial effects are brought to manufacturing of power electronic products.

Description

Technical Field

[0001] The present invention relates to the field of chip-on-chip technology, and in particular to a chip-on-chip method and chip process equipment. Background Art

[0002] In the manufacturing process of power electronic products, chip core loading is one of the key steps to ensure product performance and reliability. With the continuous development of packaging technology, especially the widespread application of stacked packaging technology, the connection between chips has become closer, which puts higher requirements on the process accuracy and efficiency of chip core loading. However, the traditional core loading method uses steel mesh for solder coating, which can meet production needs to a certain extent, but it also has many limitations.

[0003] First, high-quality steel meshes are expensive to manufacture and maintain, and their hole design is fixed, making it difficult to adapt to the needs of chips of different sizes and types. This limits production flexibility and the ability to quickly respond to market changes. Second, the effect of steel mesh printing is significantly affected by the skills and experience of the operator. Improper operation may lead to quality problems such as uneven solder distribution and position offset, which in turn affects the chip connection reliability and product performance.

[0004] More importantly, the traditional steel mesh core method is difficult to accurately control the amount of solder applied, which easily leads to material waste. At the same time, the multi-step printing process increases the complexity and time cost of the process, reducing production efficiency. Summary of the invention

[0005] In view of the above problems, embodiments of the present invention are proposed to provide a chip-on-chip method and chip process equipment that overcome the above problems or at least partially solve the above problems.

[0006] In order to solve the above problems, an embodiment of the present invention discloses a chip core-on-chip method, which is applied to a chip process equipment, wherein the chip process equipment includes a robot arm and a soldering furnace, wherein the soldering furnace includes a power device, and the power device is located at the bottom of the soldering furnace. The method includes:

[0007] The soldering material is heated to a molten state by the soldering furnace;

[0008] The power device is used to drive the molten welding material in the welding furnace to be in a surging state;

[0009] Grab the chip by the robot arm and control the chip to enter the solder furnace so that the chip can dip solder from the solder material in a surging state;

[0010] After the solder is dipped, the chip is controlled to complete the core mounting.

[0011] Optionally, the chip process equipment includes a controller, and heating the solder material to a molten state by the solder furnace includes:

[0012] Determining, by the controller, a heating temperature of the welding material according to the welding material;

[0013] The soldering furnace heats the material to be soldered to a molten state according to the heating temperature of the soldering material.

[0014] Optionally, the driving of the molten welding material in the soldering furnace into a surging state by the power device comprises:

[0015] Determining, by the controller, a target surge state required for the welding material according to the welding material;

[0016] According to the target surging state, a dynamic parameter adjustment rule is obtained;

[0017] adjusting the power parameters of the power device according to the power parameter adjustment rule;

[0018] The molten soldering material in the soldering furnace is driven to be in a target surging state by the adjusted power device.

[0019] Optionally, controlling the chip to enter the solder furnace so that the chip dips solder from the solder material in a surging state comprises:

[0020] Obtaining a chip handling strategy through the controller according to the chip and the welding material in the surging state;

[0021] The chip is controlled to enter the soldering furnace by the robot arm, and the chip is transported according to the chip transport strategy so that the chip can be dipped into the solder from the soldering material in a surging state.

[0022] Optionally, the chip process equipment includes a workbench, on which a frame is provided, and after the solder is dipped, the chip is controlled by the robot arm to complete the core loading, including:

[0023] After the solder is dipped, the controller determines the core position according to the chip and the frame;

[0024] The chip is controlled to move to the core loading position of the frame by the robot arm to complete the core loading.

[0025] Optionally, controlling the chip to move to the core loading position of the frame by the robot arm to complete the core loading includes:

[0026] The chip is controlled to move to the core loading position of the frame by the robot arm according to a preset chip control rule to complete the core loading.

[0027] On the other hand, an embodiment of the present invention further discloses a chip process equipment, the chip process equipment comprises a robot arm and a soldering furnace, the soldering furnace comprises a power device, and the power device is located at the bottom of the soldering furnace;

[0028] The soldering furnace is used to heat the soldering material to a molten state;

[0029] The power device is used to drive the molten welding material in the soldering furnace to be in a surging state;

[0030] The robot arm is used to grab the chip and control the chip to enter the solder furnace so that the chip can dip the solder from the solder material in a surging state; after the solder is dipped, the chip is controlled to complete the core loading.

[0031] Optionally, the chip process equipment includes a controller; the controller is used to determine the heating temperature of the welding material according to the welding material;

[0032] The soldering furnace is used to heat the material to be soldered to a molten state in the soldering furnace according to the heating temperature of the soldering material.

[0033] Optionally, the controller is used to determine the target surge state required by the welding material according to the welding material; obtain a power parameter adjustment rule according to the target surge state; and adjust the power parameter of the power device according to the power parameter adjustment rule;

[0034] The power device is used to drive the molten soldering material in the soldering furnace to a target surging state.

[0035] Optionally, the controller is used to obtain a chip handling strategy according to the chip and the welding material in the surging state;

[0036] The robot arm is used to control the chip to enter the solder furnace through the robot arm, and to transport the chip according to the chip transport strategy so that the chip can dip the solder from the soldering material in a surging state.

[0037] Optionally, the chip process equipment includes a workbench, and a frame is provided on the workbench;

[0038] The controller is used to determine the upper core position according to the chip and the frame after the solder is dipped;

[0039] The robot arm is used to control the chip to move to the core loading position of the frame to complete the core loading.

[0040] Optionally, the robot arm is used to control the chip to move to the core loading position of the frame according to a preset chip control rule to complete the core loading.

[0041] The embodiments of the present invention include the following advantages: the chip is accurately controlled to enter the solder furnace by a robotic arm, and is dipped into the solder from the solder material in a surging state, thereby achieving precise control of the amount of solder applied and greatly improving the process accuracy of core loading. At the same time, this method is more flexible and can easily cope with the core loading requirements of chips of different specifications, thereby improving the flexibility of production and the ability to quickly respond to market changes. The use of automated robotic arms for chip grabbing and core loading reduces human intervention and reduces dependence on operator skills, thereby improving the consistency and stability of production. The solder material is heated to a molten state by a solder furnace, and is driven into a surging state by a power device, so that the chip can be dipped into the solder evenly and in an appropriate amount, effectively reducing material waste. In addition, the entire core loading process is automatically completed by the robotic arm, which simplifies the process flow and significantly improves production efficiency.

[0042] In summary, the embodiments of the present invention not only improve the process accuracy and flexibility of core loading and reduce the dependence on operator skills, but also reduce material waste and improve production efficiency through precise robotic arm control, surging welding materials and automated core loading process, thereby bringing significant beneficial effects to the manufacture of power electronic products. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] Figure 1 is a flowchart of a chip-on-chip method embodiment of the present invention;

[0044] Figure 2 is a step diagram of an embodiment of a chip-on-chip method of the present invention;

[0045] Figure 3 It is a step diagram of dipping a chip into solder according to an embodiment of a chip-on-chip method of the present invention;

[0046] Figure 4 It is a structural block diagram of a chip process equipment embodiment of the present invention. DETAILED DESCRIPTION

[0047] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0048] Chip loading is an important step in the chip manufacturing process. Chip-level packaging is developed from semiconductor packaging technology, mainly including chip loading, pressure welding and capping. Chip loading refers to the process of placing a single chip, also known as a bare die, on a tube shell.

[0049] Chip, also a specific implementation or product form of integrated circuit (IC), is a microelectronic circuit that integrates a large number of tiny electronic components (such as transistors, resistors, capacitors, etc.) on a single semiconductor substrate. It is the core component of modern electronic devices and computing systems.

[0050] An integrated circuit is a circuit composed of many electronic components that are integrated on a small silicon chip or other semiconductor material. Integrated circuits realize the miniaturization and integration of electronic components, making circuits smaller, more reliable and more efficient. It is a technical implementation of an electronic circuit.

[0051] One of the core concepts of the embodiment of the present invention is to use a power device to drive the molten solder into a surging state to ensure uniform solder dipping and thus complete the core loading.

[0052] Reference Figure 1 , shows a flow chart of steps of a chip-on-chip method embodiment of the present invention, the method embodiment is applied to chip process equipment, the chip process equipment includes a robot arm and a soldering furnace, the soldering furnace includes a power device, and specifically may include the following steps:

[0053] Step 101, heating the soldering material to a molten state by a soldering furnace;

[0054] Heating the solder material to a molten state through a solder furnace is an important step in the chip core or packaging process, which is directly related to the soldering quality and chip reliability.

[0055] In the chip-on-chip or packaging process, step 101 is a key step, which involves the process of solder changing from solid to liquid so that it can be used for chip fixation and connection in subsequent processes. The following is a detailed explanation of this step:

[0056] A solder furnace is a device specially designed to heat solder. It provides a controlled heating environment so that the solder can evenly and quickly reach the desired molten state. A solder furnace is usually made of high temperature resistant materials with good heat preservation properties to ensure the stability and consistency of the solder during the heating process.

[0057] The selection of solder is crucial to the welding quality and chip reliability. Different solders have different characteristics such as melting point, fluidity, wettability and mechanical strength. When selecting solder, factors such as chip material, packaging requirements, working environment and cost need to be considered. Common solders include tin-lead solder, lead-free solder (such as tin-silver-copper solder), etc.

[0058] During the heating process, the solder furnace gradually increases the temperature until the solder reaches its melting point and begins to melt. This process requires precise control of the heating rate and temperature to avoid problems caused by overheating or overcooling the solder. Overheating may cause the solder to oxidize, evaporate, or produce bubbles, while overcooling may not allow the solder to melt completely.

[0059] Once the solder reaches a molten state, the solder furnace needs to maintain a certain temperature range to ensure that the solder maintains good fluidity and wetting properties during subsequent dipping, coating or soldering. This temperature range is usually determined by the type and characteristics of the solder and needs to remain stable throughout the process.

[0060] In one embodiment, the chip process equipment includes a controller, and step 101 may include the following sub-steps:

[0061] Sub-step S11, determining the heating temperature of the welding material according to the welding material through the controller;

[0062] The controller first needs to determine a suitable heating temperature based on the type and characteristics of the selected welding material. This heating temperature must be higher than the melting point of the welding material to ensure that the welding material can be completely melted. At the same time, the heating temperature cannot be too high to avoid overheating, oxidation or other adverse reactions of the welding material. Because different welding materials have different melting points and thermal characteristics. Therefore, when selecting the heating temperature, factors such as the composition, purity and shape of the welding material must be fully considered.

[0063] Sub-step S12, heating the material to be welded in the solder furnace to a molten state according to the heating temperature of the welding material by means of the solder furnace;

[0064] In one example, the solder material may be Pb95.5Sn2Ag2.5, and the heating temperature may be the temperature range where the solder material liquid is converted into gas, that is, the lowest temperature is the melting point of the solder, and the highest temperature is the boiling point of the solder. Within the temperature range limited here, the solder state is relatively stable, and the higher the temperature, the lower the solder viscosity, and the chip dipping amount will also be reduced.

[0065] Pb95.5Sn2Ag2.5 is a high-lead solder alloy consisting of 95.5% lead (Pb), 2% tin (Sn) and 2.5% silver (Ag);

[0066] For example, when the welding material is Pb95.5Sn2Ag2.5, the heating temperature is between 270 degrees and 320 degrees. By precisely controlling the heating temperature and heating process, it can be ensured that the welding material can accurately and efficiently reach the required melting state, providing a good foundation for subsequent welding operations.

[0067] Step 102, driving the molten welding material in the welding furnace to be in a surging state by a power device;

[0068] The power device is a device that provides driving force. It can be a motor, an air pump, a hydraulic pump, etc. The specific type selected may depend on the design of the soldering furnace, the requirements of the welding materials, and the process design requirements.

[0069] The power device can apply force to the molten welding material in the soldering furnace through mechanical, pneumatic or hydraulic means to make it surge. The surge state helps the welding material to be more evenly distributed in the soldering furnace, avoiding local overheating or cooling, thereby improving the welding quality. Through surge, the welding material can better wet the surface to be welded, forming a stronger and more uniform weld joint. The surge helps bubbles and inclusions in the welding material float up and be discharged, reducing welding defects.

[0070] The implementation method can be mechanical stirring, air flow or liquid flow drive, electromagnetic stirring, etc., which is not limited by the present invention. The molten welding material in the soldering furnace is driven by a power device to be in a surging state, which can not only improve the welding quality, but also adapt to different welding materials and process requirements, ensuring the stability and reliability of the welding process.

[0071] In one embodiment, step 102 may include the following sub-steps:

[0072] Sub-step S21, determining, by the controller, a target surge state required by the welding material according to the welding material;

[0073] Based on the relevant information of the welding material, the controller can intelligently determine the target surge state required for the welding material in the molten state. The target surge state may include key parameters such as the speed, frequency, and amplitude of the specified surge. The selection of these parameters may depend on the characteristics of the welding material, the quality requirements of the weld joint, and the subsequent process requirements.

[0074] Sub-step S22, obtaining a power parameter adjustment rule according to the target surge state;

[0075] The power parameters of the power unit, such as motor speed, air pump pressure, hydraulic pump flow, etc., directly affect the surge state of the welding material. Therefore, it is necessary to determine how the power parameters should be adjusted according to the target surge state. A set of power parameter adjustment rules can be formulated based on historical data, experimental results or mathematical models. These rules can guide how to adjust the power parameters of the power unit according to the target surge state.

[0076] This rule can reflect the different surge parameters required for the chip to evenly dip the solder when different solders correspond to different chips under different process requirements;

[0077] Sub-step S23, adjusting the power parameters of the power device according to the power parameter adjustment rule;

[0078] According to the adjustment rules established in the previous step, the controller will send instructions to the power device to adjust the power parameters. The power device will make corresponding adjustments according to the instructions to ensure that the welding material can reach the target surge state.

[0079] In one example, the power device may be a water pump device, the surging state may be a fountain state, and the corresponding change in the power parameter of the power device may also be a change in the radius of the pump port and the operating power;

[0080] By changing the radius of the pump mouth and the operating power, fountains of different heights and different spraying ranges can be created. The pump diameter is between 0.6 and 3 mm, and the water delivery per unit time is controlled at 0.2 to 1 cm. 3 / s, by changing these two parameters, various forms of fountains can be obtained.

[0081] Sub-step S24, driving the molten welding material in the soldering furnace to a target surging state through the adjusted power device.

[0082] The adjusted power device will operate according to the set power parameters. Under the action of the power device, the molten welding material in the solder furnace will be driven to the target surge state. By accurately controlling the power parameters of the power device, it can be ensured that the welding material reaches and maintains the required target surge state in the molten state, thereby improving the welding quality and process stability.

[0083] Step 103, grabbing the chip by a robot arm and controlling the chip to enter a soldering furnace so that the chip can be dipped into solder from the soldering material in a surging state;

[0084] After the soldering material has been heated to a molten state and its physical form has been adjusted to a surging state, a robotic arm is needed to grab the chip to complete the solder dipping. This process requires ensuring that the chip is dipped in an appropriate amount of solder.

[0085] In one embodiment, step 103 may include the following sub-steps:

[0086] Sub-step S31, obtaining a chip transport strategy according to the chip and the welding material in a surging state through a controller;

[0087] The controller comprehensively considers the chip size, shape, material, as well as the surging state and temperature of the solder in the solder furnace. Based on these parameters, the controller calculates the optimal chip handling strategy, including the chip grabbing point, moving path, speed of entering the solder furnace, angle and depth of dipping solder, etc., to ensure that each chip can be dipped into the same and appropriate amount of solder under a constant fountain shape.

[0088] Sub-step S32, controlling the chip to enter the soldering furnace through the robot arm, and transporting the chip according to the chip transporting strategy, so that the chip can dip the solder from the soldering material in a surging state.

[0089] The robot arm accurately grabs the chip according to the handling strategy set by the controller and moves it into the solder furnace according to the predetermined path and speed. The robot arm ensures that the chip moves to a fixed spatial position each time when dipping solder. This position is determined based on previous calculations and experiments, which can ensure that the chip's dipping amount remains constant under the same fountain shape. During the solder dipping process, the robot arm maintains a stable moving speed and dipping depth to ensure that the chip can evenly dip solder from the surging solder and the dipping amount is moderate.

[0090] Step 104, after the solder is dipped, the control chip is mounted.

[0091] The chip that has been dipped in solder is accurately placed in a predetermined position, usually on a frame or substrate, to complete subsequent soldering or assembly work.

[0092] In one embodiment, the chip process equipment includes a workbench, and a frame is provided on the workbench. Step 104 may include the following sub-steps:

[0093] Sub-step S41, after the solder is dipped, the core position is determined according to the chip and the frame by the controller;

[0094] The controller receives and analyzes information about the chip and the frame, including the chip's size, shape, amount of solder dipped, and the precise position of the frame. Based on this information, the controller calculates the specific position on the frame where the chip should be placed. The accuracy of this position is critical to the subsequent soldering quality and the functionality of the entire chip assembly.

[0095] Sub-step S42, controlling the chip to move to the core loading position of the frame by the robot arm, and completing the core loading.

[0096] The robot arm is the actual device that performs this step. It is responsible for removing the chip dipped in solder from the solder pot and placing it accurately on the upper core position of the frame. According to the instructions given by the controller, the robot arm moves the chip to the upper core position according to the predetermined path and speed. This process requires extremely high precision and stability to ensure that the chip can be accurately placed on the frame without causing a decrease in welding quality due to vibration or deviation during movement.

[0097] In one embodiment, sub-step S42 may include the following sub-steps:

[0098] Sub-step S421, using a robot arm, according to a preset chip control rule, controls the chip to move to the core loading position of the frame to complete the core loading.

[0099] The preset chip control rules are a set of pre-set rules and algorithms that guide the robot arm on how to accurately control the movement of the chip. These rules may include the chip's movement speed, acceleration, deceleration, shape and length of the movement path, etc., all to ensure that the chip can be moved smoothly and accurately to the core loading position. The robot arm will strictly control the movement of the chip according to these preset rules. Through precise calculation and control, the robot arm can ensure that the chip will not be subjected to unnecessary vibration or deviation during movement, thereby ensuring the accuracy of core loading and the quality of welding.

[0100] In one example, the process may be to identify the precise position on the circuit board through a camera system or an optical alignment system, and then accurately place the chip at a specified position on the frame after positioning.

[0101] The specific process can be: directly move the chip from the lifted position after dipping it in solder by the shortest distance to the lowest position point required for the chip to fall, which can be 3cm. Pause for a while, which can be 0.5s to 1s, wait until the liquid solder is in a vertical falling state, and then drop it vertically to make the chip fit the frame.

[0102] The chip is accurately controlled by the robotic arm to enter the solder furnace, and the chip is dipped into the solder from the surging solder material, which achieves precise control of the amount of solder applied and greatly improves the process accuracy of the core. At the same time, this method is more flexible and can easily meet the core requirements of chips of different specifications, improving the flexibility of production and the ability to quickly respond to market changes. The use of automated robotic arms for chip grabbing and core loading reduces human intervention and reduces dependence on operator skills, thereby improving production consistency and stability. The solder material is heated to a molten state in a solder furnace and driven into a surging state by a power device, so that the chip can be dipped into the solder evenly and in an appropriate amount, effectively reducing material waste. In addition, the entire core loading process is automatically completed by the robotic arm, which simplifies the process flow and significantly improves production efficiency.

[0103] In summary, the embodiments of the present invention not only improve the process accuracy and flexibility of core loading and reduce the dependence on operator skills, but also reduce material waste and improve production efficiency through precise robotic arm control, surging welding materials and automated core loading process, thereby bringing significant beneficial effects to the manufacture of power electronic products.

[0104] Reference Figure 2 , showing a step diagram of a chip-on-chip method embodiment of the present invention:

[0105] In the figure, 1 represents the heating furnace, which is responsible for heating the solder, changing its physical state, and accurately controlling the temperature of the solder to ensure that the solder reaches the best state suitable for welding; 2 represents the solder, which is heated to a suitable temperature by the heating equipment and is ready for welding; 3 represents the robotic arm, which has a high-precision grasping function, used to grasp the chip, dip the heated solder, and accurately mount the chip on the frame / DBC board (Direct Bonding Copper, direct copper-clad ceramic substrate); 4 represents the chip, the core target of this operation, the chip is accurately grasped by the robotic arm and placed on the frame / DBC board; 5 frame or DBC board. DBC board is a composite material made by directly bonding a highly insulating ceramic substrate such as alumina Al2O3 or aluminum nitride AlN with copper foil at high temperature. Due to its excellent performance, DBC board is widely used in power electronics, high-power modules, aerospace and other fields.

[0106] First, the robot arm places the grabbed chip into the solder in the surging state of the furnace according to the predetermined trajectory, takes it out after dipping it in an appropriate amount of solder, and places it on the frame or DBC board according to the preset placement rules to complete the core loading.

[0107] Reference Figure 3 , showing a step diagram of dipping a chip into solder according to an embodiment of a chip-on-chip method of the present invention:

[0108] Among them, 1 represents the chip position; 2 represents the solder pool fountain; 3 represents the horizontal line;

[0109] The chip will be moved to the same position at the red dot by the robot arm every time; according to the different solder dipping amounts required by the process, different fountain shapes and sizes must be dynamically adjusted to ensure that the chips move on the same horizontal line.

[0110] It should be noted that, for the sake of simplicity, the method embodiments are described as a series of action combinations, but those skilled in the art should be aware that the embodiments of the present invention are not limited by the order of the actions described, because according to the embodiments of the present invention, certain steps can be performed in other orders or simultaneously. Secondly, those skilled in the art should also be aware that the embodiments described in the specification are all preferred embodiments, and the actions involved are not necessarily required by the embodiments of the present invention.

[0111] Reference Figure 4 , shows a structural block diagram of a chip process equipment 20 embodiment of the present invention, which may specifically include the following components:

[0112] The chip processing equipment 20 includes a robot arm 201 and a soldering furnace 202. The soldering furnace 202 includes a power device 2021. The power device 2021 is located at the bottom of the soldering furnace 202.

[0113] The soldering furnace 202 is used to heat the soldering material to a molten state;

[0114] Heating the solder material to a molten state by the solder furnace 202 is an important step in the chip core or packaging process, which is directly related to the soldering quality and chip reliability.

[0115] In the chip-on-chip or packaging process, heating the solder material to a molten state is a key step, which involves the process of solder changing from solid to liquid so that it can be used for chip fixation and connection in subsequent processes. The following is a detailed explanation of this step:

[0116] The soldering furnace 202 is a device specially designed for heating solder. It provides a controllable heating environment so that the solder can evenly and quickly reach the desired molten state. The soldering furnace 202 is usually made of high temperature resistant materials with good heat preservation performance to ensure the stability and consistency of the solder during the heating process.

[0117] The selection of solder is crucial to the welding quality and chip reliability. Different solders have different characteristics such as melting point, fluidity, wettability and mechanical strength. When selecting solder, factors such as chip material, packaging requirements, working environment and cost need to be considered. Common solders include tin-lead solder, lead-free solder (such as tin-silver-copper solder), etc.

[0118] During the heating process, the solder furnace 202 gradually increases the temperature until the solder reaches its melting point and begins to melt. This process requires precise control of the heating rate and temperature to avoid problems caused by overheating or overcooling the solder. Overheating may cause the solder to oxidize, evaporate, or generate bubbles, while overcooling may not completely melt the solder.

[0119] Once the solder reaches a molten state, the solder furnace 202 needs to maintain a certain temperature range to ensure that the solder maintains good fluidity and wettability during subsequent dipping, coating or welding. This temperature range is usually determined according to the type and characteristics of the solder and needs to remain stable throughout the process.

[0120] The power device 2021 is used to drive the molten welding material in the welding furnace 202 to be in a surging state;

[0121] The power device 2021 is a device that provides driving force. It can be a motor, an air pump, a hydraulic pump, etc. The specific type selected can depend on the design of the soldering furnace 202 and the requirements of the welding materials and the process design requirements.

[0122] The power device 2021 can apply force to the molten welding material in the soldering furnace 202 by mechanical, air pressure or hydraulic means to make it surge. The surge state helps the welding material to be more evenly distributed in the soldering furnace 202, avoiding local overheating or cooling, thereby improving the welding quality. Through the surge, the welding material can better wet the surface to be welded, forming a stronger and more uniform welded joint. The surge helps bubbles and inclusions in the welding material float up and be discharged, reducing welding defects.

[0123] The implementation method can be mechanical stirring, air flow or liquid flow drive, electromagnetic stirring, etc., which is not limited in the present invention. The power device 2021 drives the molten welding material in the soldering furnace 202 to be in a surging state, which can not only improve the welding quality, but also adapt to different welding materials and process requirements, ensuring the stability and reliability of the welding process.

[0124] The robot arm 201 is used to grab the chip and control the chip to enter the solder furnace 202 so that the chip can dip the solder from the solder material in a surging state; after the chip is dipped in the solder, the chip is controlled to complete the core loading.

[0125] After the solder material has been heated to a molten state and its physical form has been adjusted to a surging state, the robot arm 201 needs to grab the chip to complete the solder dipping. This process needs to ensure that the chip is dipped in an appropriate amount of solder. The chip that has been dipped in solder is accurately placed in a predetermined position, usually on a frame or substrate, to complete subsequent welding or assembly work.

[0126] In one embodiment, the chip process equipment 20 includes a controller 203; the controller 203 is used to determine the heating temperature of the welding material according to the welding material;

[0127] The controller 203 first needs to determine a suitable heating temperature according to the type and characteristics of the selected welding material. This heating temperature must be higher than the melting point of the welding material to ensure that the welding material can be completely melted. At the same time, the heating temperature cannot be too high to avoid overheating, oxidation or other adverse reactions of the welding material. Because different welding materials have different melting points and thermal properties. Therefore, when selecting the heating temperature, factors such as the composition, purity and shape of the welding material must be fully considered.

[0128] The soldering furnace 202 is used to heat the material to be soldered to a molten state in the soldering furnace 202 according to the heating temperature of the soldering material.

[0129] In one example, the solder material may be Pb95.5Sn2Ag2.5, and the heating temperature may be the temperature range where the solder material liquid is converted into gas, that is, the lowest temperature is the melting point of the solder, and the highest temperature is the boiling point of the solder. Within the temperature range limited here, the solder state is relatively stable, and the higher the temperature, the lower the solder viscosity, and the chip dipping amount will also be reduced.

[0130] Pb95.5Sn2Ag2.5 is a high-lead solder alloy consisting of 95.5% lead (Pb), 2% tin (Sn) and 2.5% silver (Ag);

[0131] For example, when the welding material is Pb95.5Sn2Ag2.5, the heating temperature is between 270 degrees and 320 degrees. By precisely controlling the heating temperature and heating process, it can be ensured that the welding material can accurately and efficiently reach the required melting state, providing a good foundation for subsequent welding operations.

[0132] In one embodiment, the controller 203 is used to determine the target surge state required by the welding material according to the welding material; obtain a power parameter adjustment rule according to the target surge state; and adjust the power parameters of the power device 2021 according to the power parameter adjustment rule;

[0133] Based on the relevant information of the welding material, the controller 203 can intelligently determine the target surge state required for the welding material in the molten state. The target surge state may include key parameters such as the speed, frequency, and amplitude of the specified surge. The selection of these parameters may depend on the characteristics of the welding material, the quality requirements of the welded joint, and the subsequent process requirements.

[0134] The power parameters of the power device 2021, such as motor speed, air pump pressure, hydraulic pump flow, etc., directly affect the surging state of the welding material. Therefore, it is necessary to determine how the power parameters should be adjusted according to the target surging state. A set of power parameter adjustment rules can be formulated based on historical data, experimental results or mathematical models. These rules can guide how to adjust the power parameters of the power device 2021 according to the target surging state.

[0135] This rule can reflect the different surge parameters required for the chip to evenly dip the solder when different solders correspond to different chips under different process requirements;

[0136] According to the adjustment rules formulated in the previous step, the controller 203 will send instructions to the power device 2021, requiring it to adjust the power parameters. The power device 2021 will make corresponding adjustments according to the instructions to ensure that the welding material can reach the target surge state.

[0137] In one example, the power device 2021 may be a water pump device, the surging state may be a fountain state, and the corresponding change in the power parameter of the power device 2021 may also be to change the radius size of the pump port and the operating power;

[0138] By changing the radius of the pump and the operating power, fountains of different heights and spraying ranges can be created. The pump diameter is between 0.6 and 3 mm, and the water delivery per unit time is controlled at 0.2 to 1 cm. 3 / s, by changing these two parameters, various forms of fountains can be obtained.

[0139] The power device 2021 is used to drive the molten soldering material in the soldering furnace 202 to be in a target surging state.

[0140] The adjusted power device 2021 will operate according to the set power parameters. Under the action of the power device 2021, the molten welding material in the soldering furnace 202 will be driven to the target surge state. By accurately controlling the power parameters of the power device 2021, it can be ensured that the welding material reaches and maintains the required target surge state in the molten state, thereby improving the welding quality and process stability.

[0141] In one embodiment, the controller 203 is used to obtain a chip handling strategy according to the chip and the welding material in the surging state;

[0142] The controller 203 comprehensively considers the size, shape, material of the chip, as well as the surging state and temperature of the solder in the solder furnace 202. Based on these parameters, the controller 203 calculates the optimal chip handling strategy, including the chip grabbing point, moving path, speed of entering the solder furnace 202, angle and depth of dipping solder, etc., to ensure that each chip can be dipped into the same and appropriate amount of solder under a constant fountain shape.

[0143] The robot arm 201 is used to control the chip to enter the soldering furnace 202 through the robot arm 201, and to transport the chip according to the chip transport strategy, so that the chip can dip the solder from the soldering material in a surging state.

[0144] The robot arm 201 accurately grabs the chip according to the handling strategy formulated by the controller 203, and moves it into the solder furnace 202 according to the predetermined path and speed. The robot arm 201 ensures that the chip moves to a fixed spatial position each time when dipping the solder. This position is determined based on previous calculations and experiments, and can ensure that the amount of the chip dipped remains constant under the same fountain shape. During the process of dipping the solder, the robot arm 201 maintains a stable moving speed and dipping depth to ensure that the chip can be dipped into the solder evenly from the surging solder and the amount of dipping is moderate.

[0145] In one embodiment, the chip processing equipment 20 includes a workbench, and a frame is provided on the workbench;

[0146] The controller 203 is used to determine the core upper position according to the chip and the frame after the solder is dipped;

[0147] The controller 203 receives and analyzes information about the chip and the frame, including the chip's size, shape, amount of solder dipped, and the precise position of the frame. Based on this information, the controller 203 calculates the specific position on the frame where the chip should be placed. The accuracy of this position is critical to the subsequent soldering quality and the function of the entire chip assembly.

[0148] The robot arm 201 is used to control the chip to move to the core loading position of the frame to complete the core loading.

[0149] The robot arm 201 is the actual device that performs this step. It is responsible for removing the chip dipped in solder from the solder pot 202 and accurately placing it on the upper core position of the frame. The robot arm 201 will move the chip to the upper core position according to the instructions given by the controller 203, following a predetermined path and speed. This process requires extremely high precision and stability to ensure that the chip can be accurately placed on the frame and that the welding quality will not be reduced due to vibration or deviation during the movement.

[0150] In one embodiment, the robot arm 201 is used to control the chip to move to the core loading position of the frame according to a preset chip control rule to complete the core loading.

[0151] The preset chip control rules are a set of pre-set rules and algorithms that guide the robot 201 on how to accurately control the movement of the chip. These rules may include the chip's moving speed, acceleration, deceleration, shape and length of the moving path, etc., all to ensure that the chip can be moved smoothly and accurately to the core-loading position. The robot 201 will strictly control the movement of the chip in accordance with these preset rules. Through precise calculation and control, the robot 201 can ensure that the chip will not be subjected to unnecessary vibration or deviation during movement, thereby ensuring the accuracy of the core loading and the quality of welding.

[0152] In one example, the process may be to identify the precise position on the circuit board through a camera system or an optical alignment system, and then accurately place the chip at a specified position on the frame after positioning.

[0153] The specific process can be: directly move the chip from the lifted position after dipping it in solder by the shortest distance to the lowest position point required for the chip to fall, which can be 3cm. Pause for a while, which can be 0.5s to 1s, wait until the liquid solder is in a vertical falling state, and then drop it vertically to make the chip fit the frame.

[0154] The chip is accurately controlled by the robot arm 201 to enter the solder furnace 202, and the chip is dipped into the solder from the solder material in a surging state, so that the amount of solder applied can be accurately controlled, which greatly improves the process accuracy of the core. At the same time, this method is more flexible and can easily meet the core requirements of chips of different specifications, improving the flexibility of production and the ability to quickly respond to market changes. The use of an automated robot arm 201 for chip grabbing and core loading reduces human intervention and reduces dependence on operator skills, thereby improving the consistency and stability of production. The solder material is heated to a molten state by the solder furnace 202, and is driven in a surging state by the power device 2021, so that the chip can be dipped into the solder evenly and in an appropriate amount, effectively reducing the waste of materials. In addition, the entire core loading process is automatically completed by the robot arm 201, which simplifies the process flow and significantly improves production efficiency.

[0155] In summary, the embodiment of the present invention not only improves the process accuracy and flexibility of core loading, reduces the dependence on operator skills, but also reduces material waste and improves production efficiency through precise control of the robotic arm 201, surging welding materials and automated core loading process, thereby bringing significant beneficial effects to the manufacture of power electronic products.

[0156] As for the device embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and the relevant parts can be referred to the partial description of the method embodiment.

[0157] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0158] It will be appreciated by those skilled in the art that the embodiments of the present invention may be provided as methods, devices, or computer program products. Therefore, the embodiments of the present invention may take the form of a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware. Moreover, the embodiments of the present invention may take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program codes.

[0159] The embodiments of the present invention are described with reference to the flowcharts and / or block diagrams of the methods, terminal devices (systems), and computer program products according to the embodiments of the present invention. It should be understood that each process and / or block in the flowchart and / or block diagram, as well as the combination of the processes and / or blocks in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing terminal device to generate a machine, so that the instructions executed by the processor of the computer or other programmable data processing terminal device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 A process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0160] These computer program instructions may also be stored in a computer-readable memory capable of directing a computer or other programmable data processing terminal device to operate in a specific manner, so that the instructions stored in the computer-readable memory produce a manufactured product including an instruction device, which implements the process Figure 1 A process or multiple processes and / or boxes Figure 1 A function specified in one or more boxes.

[0161] These computer program instructions can also be loaded onto a computer or other programmable data processing terminal device so that a series of operating steps are executed on the computer or other programmable terminal device to produce a computer-implemented process, thereby providing instructions for implementing the process in the computer or other programmable terminal device. Figure 1 A process or multiple processes and / or boxes Figure 1 The steps for the functions specified in one or more boxes.

[0162] Although the preferred embodiments of the present invention have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the embodiments of the present invention.

[0163] Finally, it should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or terminal device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or terminal device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or terminal device including the elements.

[0164] The above is a detailed introduction to a chip-on-chip method and chip process equipment provided by the present invention. Specific examples are used in this article to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea; at the same time, for general technical personnel in this field, according to the idea of ​​the present invention, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. A chip-on-chip method, characterized in that: Applied to chip process equipment, the chip process equipment includes a robot arm and a soldering furnace, the soldering furnace includes a power device, and the power device is located at the bottom of the soldering furnace. The method includes: The soldering material is heated to a molten state by the soldering furnace; The power device is used to drive the molten welding material in the welding furnace to be in a surging state; Grab the chip by the robot arm and control the chip to enter the solder furnace so that the chip can dip solder from the solder material in a surging state; After the solder is dipped, the chip is controlled to complete the core mounting.

2. The chip-on-chip method according to claim 1, characterized in that: The chip process equipment includes a controller, and the step of heating the solder material to a molten state through the solder furnace includes: Determining, by the controller, a heating temperature of the welding material according to the welding material; The soldering furnace heats the material to be soldered to a molten state according to the heating temperature of the soldering material.

3. The chip-on-chip method according to claim 2, characterized in that: The method of driving the molten welding material in the welding furnace to be in a surging state by the power device includes: Determining, by the controller, a target surge state required for the welding material according to the welding material; According to the target surging state, a dynamic parameter adjustment rule is obtained; adjusting the power parameters of the power device according to the power parameter adjustment rule; The molten soldering material in the soldering furnace is driven to be in a target surging state by the adjusted power device.

4. The chip-on-chip method according to claim 3, characterized in that: The step of controlling the chip to enter the solder furnace so that the chip can dip solder from the solder material in a surging state comprises: Obtaining a chip handling strategy through the controller according to the chip and the welding material in the surging state; The chip is controlled to enter the soldering furnace by the robot arm, and the chip is transported according to the chip transport strategy so that the chip can be dipped into the solder from the soldering material in a surging state.

5. The chip-on-chip method according to claim 1, characterized in that: The chip process equipment comprises a workbench, on which a frame is arranged, and after the solder is dipped, the chip is controlled by the mechanical arm to complete the core loading, including: After the solder is dipped, the controller determines the core position according to the chip and the frame; The chip is controlled to move to the core loading position of the frame by the robot arm to complete the core loading.

6. The chip-on-chip method according to claim 5, characterized in that: The step of controlling the chip to move to the core loading position of the frame by the robot arm to complete the core loading includes: The chip is controlled to move to the core loading position of the frame by the robot arm according to a preset chip control rule to complete the core loading.

7. A chip process equipment, characterized in that: The chip process equipment includes a robot arm and a soldering furnace, and the soldering furnace includes a power device, and the power device is located at the bottom of the soldering furnace; The soldering furnace is used to heat the soldering material to a molten state; The power device is used to drive the molten welding material in the soldering furnace to be in a surging state; The robot arm is used to grab the chip and control the chip to enter the solder furnace so that the chip can dip the solder from the solder material in a surging state; after the solder is dipped, the chip is controlled to complete the core loading.

8. The chip process equipment according to claim 7, characterized in that: The chip process equipment includes a controller; The controller is used to determine the heating temperature of the welding material according to the welding material; The soldering furnace is used to heat the material to be soldered to a molten state in the soldering furnace according to the heating temperature of the soldering material.

9. The chip process equipment according to claim 8, characterized in that: The controller is used to determine the target surge state required by the welding material according to the welding material; obtain a power parameter adjustment rule according to the target surge state; and adjust the power parameter of the power device according to the power parameter adjustment rule; The power device is used to drive the molten soldering material in the soldering furnace to a target surging state.

10. The chip process equipment according to claim 9, characterized in that: The controller is used to obtain a chip handling strategy according to the chip and the welding material in the surging state; The robot arm is used to control the chip to enter the solder furnace through the robot arm, and to transport the chip according to the chip transport strategy so that the chip can dip the solder from the soldering material in a surging state.

11. The chip process equipment according to claim 7, characterized in that: The chip process equipment comprises a workbench, on which a frame is arranged; The controller is used to determine the upper core position according to the chip and the frame after the solder is dipped; The robot arm is used to control the chip to move to the core loading position of the frame to complete the core loading.

12. The chip process equipment according to claim 11, characterized in that: The robot arm is used to control the chip to move to the core loading position of the frame according to a preset chip control rule to complete the core loading.

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