Equipment for welding electronic components

Abstract

The invention provides equipment for welding electronic components. The equipment comprises a bearing table, a pressing airflow generating mechanism, a driver and an energy generating mechanism, the bearing table is provided with a bearing plane, and the bearing table is used for bearing a substrate to be welded on the bearing plane. The pressing airflow generating mechanism comprises a body and an air pump. An airflow guiding channel and a weight adjusting device are arranged on the body. The air pump can provide air flow to the air flow guide channel of the body. The driver can drive the body to move relative to the bearing platform along the bearing plane. The airflow guide channel can guide airflow provided by the air pump to the position between the body and the bearing table, the body is subjected to air floatation, and pressing airflow is generated between the body and the bearing table. The energy generating mechanism generates an energy light beam which passes through the pressing airflow and is emitted to the direction of the bearing platform.

Description

Technical Field

[0001] The present invention relates to a device for welding electronic components. Background Art

[0002] With the development of the technology of electronic components (such as microelectronic components, LEDs or microLEDs), a process of transferring a large number of electronic components, LEDs or microLEDs from one substrate to another substrate has been developed, which is conducive to the mass production of electronic components.

[0003] However, in the process of transferring electronic components, LEDs or micro LEDs from one substrate to another, the two substrates need to be placed face to face, and then laser processing is used to transfer the electronic components, LEDs or micro LEDs. At this time, whether the two substrates are bonded and whether the substrates remain flat during laser processing is crucial to the yield of the transfer process. Summary of the invention

[0004] The present invention provides a device for welding electronic components, which can effectively improve the process yield.

[0005] According to an embodiment of the present invention, a device for welding electronic components is proposed, which includes a carrier, a suppressed airflow generating mechanism, a driver, and an energy generating mechanism. The carrier has a carrier plane, and the carrier is used to carry a substrate to be welded on the carrier plane. The suppressed airflow generating mechanism includes a main body and an air pump. The main body is provided with an airflow guiding channel and a weight adjustment device thereon. The air pump can provide an airflow to the airflow guiding channel of the main body. The driver can drive the main body to move along the carrier plane relative to the carrier. Among them, the airflow guiding channel can guide the airflow provided by the air pump to between the main body and the carrier, float the main body, and generate a suppressed airflow between the main body and the carrier. The energy generating mechanism generates an energy beam that passes through the suppressed airflow and shoots in the direction of the carrier.

[0006] In the device for welding electronic components according to the embodiment of the present invention, since the compressed airflow generating mechanism uses an air pump to provide airflow to the airflow guiding channel of the body, and the airflow guiding channel can guide the airflow provided by the air pump to between the body and the carrier, float the body, and generate compressed airflow between the body and the carrier, the weight adjustment device can adjust the weight of the body by increasing or decreasing the number of the plurality of counterweight blocks, so that the body can be stably floated on the carrier. Therefore, the substrate can be leveled, thereby effectively improving the process yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1A FIG. 4 is a cross-sectional schematic diagram of an apparatus for soldering electronic components according to an embodiment of the present invention.

[0008] Figure 1B FIG. 4 is a top view of a device for soldering electronic components according to an embodiment of the present invention.

[0009] Figure 2 To illustrate Figure 1A A schematic top view of the path of movement of the energy generating mechanism relative to the supporting platform.

[0010] Figure 3A and Figure 3B A cross-sectional schematic diagram is shown of two steps in a process of a method for soldering electronic components according to an embodiment of the present invention.

[0011] Figure 4A FIG. 4 is a cross-sectional schematic diagram of an apparatus for soldering electronic components according to another embodiment of the present invention.

[0012] Figure 4B FIG. 4 is a top view of an apparatus for soldering electronic components according to another embodiment of the present invention.

[0013] Description of Reference Numerals

[0014] 50:Substrate

[0015] 51, 58, 59: Surface

[0016] 52: Transfer substrate

[0017] 53: Adhesive layer

[0018] 54: Target substrate

[0019] 55: Pad

[0020] 56: Solder

[0021] 57: welding surface

[0022] 60: Electronic components

[0023] 62: Electrode

[0024] 100, 100': Equipment for soldering electronic components

[0025] 110: Energy generating mechanism

[0026] 112: Energy Beam

[0027] 200: Device for locally leveling a substrate

[0028] 210: Loading platform

[0029] 212: Bearing plane

[0030] 300: Suppressing airflow generating mechanism

[0031] 310:Ontology

[0032] 312: air flow guide channel

[0033] 314: Optical Channel

[0034] 317, 317': Base

[0035] 318, 318': Weight adjustment device

[0036] 318a, 318a': counterweight

[0037] 319, 319': Positioning piece

[0038] 320: Driver

[0039] 330: Air Pump

[0040] 332: Airflow

[0041] 334: Suppressing airflow

[0042] 350: Translucent board

[0043] P1: Path

[0044] O:hole DETAILED DESCRIPTION

[0045] Reference will now be made in detail to exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Whenever possible, the same reference numerals are used in the drawings and the description to refer to the same or like parts.

[0046] Figure 1A FIG. 4 is a cross-sectional schematic diagram of an apparatus for soldering electronic components according to an embodiment of the present invention. Figure 1B FIG. 1 is a top view of a device for soldering electronic components according to an embodiment of the present invention. Figure 1A and Figure 1B , the equipment 100 for soldering electronic components of the present embodiment includes a device 200 for locally flattening a substrate and an energy generating mechanism 110. The device 200 for locally flattening a substrate includes a carrier 210, a compressed airflow generating mechanism 300, a driver 320 and an energy generating mechanism 110. The carrier 210 has a carrier plane 212. In the present embodiment, the carrier plane 212 is, for example, the upper surface of the carrier 210. The carrier 210 is used to carry a substrate 50 to be flattened on the carrier plane 212. In the present embodiment, the substrate 50 to be flattened includes a combination of a transfer substrate 52 on which electronic components 60 to be soldered are carried and a target substrate 54. In one embodiment, the transfer substrate 52 is, for example, a temporary substrate, and the target substrate 54 is, for example, a circuit substrate. In the present embodiment, there are a plurality of electronic components 60 to be soldered on the transfer substrate 52, and Figure 1AAn electronic component 60 is shown in the enlarged view as an example.

[0047] The compressed air flow generating mechanism 300 includes a body 310 and an air pump 330. The body 310 is provided with an air flow guiding channel 312 and a weight adjusting device 318. The driver 320 can drive the body 310 to move relative to the carrier 210 along the carrier plane 212. For example, the driver 320 can drive the carrier 210 or the body 310 to move relative to the carrier 210 along the carrier plane 212. In this embodiment, the driver 320 is, for example, a motor or other suitable actuator.

[0048] The air pump 330 can provide an airflow 332 to the airflow guide channel 312 of the body 310. The airflow guide channel 312 can guide the airflow 332 provided by the air pump 330 to between the body 310 and the carrier 210, so as to float the body 310 and generate a compressed airflow 334 between the body 310 and the carrier 210.

[0049] The energy generating mechanism 110 is disposed adjacent to the carrier 210 of the device 200 for locally flattening a substrate, and is used to generate an energy beam 112 that passes through the pressing airflow 334 and is emitted in the direction of the carrier 210. In the present embodiment, the energy beam 112 is a laser beam, and the energy generating mechanism 110 is, for example, a laser source. In addition, in the present embodiment, the body 310 includes a light channel 314 penetrating therein, and the energy beam 112 generated by the energy generating mechanism 110 can be guided to the pressing airflow 334 through the light channel 314 and emitted in the direction of the carrier 210. In the present embodiment, a light-transmitting plate 350 (for example, a quartz plate) can be disposed on the top of the body 310 (i.e., the top of the light channel 314), and the energy beam 112 passes through the light-transmitting plate 350 and enters the light channel 314. The light-transmitting plate 350 can seal the top of the airflow guiding channel 312 to facilitate the generation of the pressing airflow 334. In another embodiment, the top of the body 310 is made of a light-transmitting material, or the body 310 is made of a light-transmitting material, such as light-transmitting quartz, glass, sapphire, diamond or plastic.

[0050] Specifically, in one embodiment, the electronic component 60 to be welded can be attached to the transfer substrate 52 by the adhesive layer 53, and the electronic component 60 has an electrode 62. In addition, the target substrate 54 has a pad 55, and the pad 55 can be provided with a solder 56. The energy beam 112 can be irradiated on the solder 56 to melt the solder 56. At this time, the electrode 62 is aligned with the pad 55, so when the solder 56 is cooled and solidified, the electrode 62 and the pad 55 can be bonded. At this time, the bonding force between the solder 56 and the electrode 62 is greater than the bonding force between the adhesive layer 53 and the electronic component 60, so when the transfer substrate 52 and the target substrate 54 are separated, the electronic component 60 will remain on the target substrate 54 and be separated from the transfer substrate 52. In this way, the electronic component 60 can be transferred from the transfer substrate 52 to the target substrate 54. In this embodiment, the electronic component 60 to be welded is, for example, a light emitting diode chip or other electronic components.

[0051] In the device 200 for locally leveling a substrate and the equipment 100 for soldering electronic components of the present embodiment, since the compressed airflow generating mechanism 300 uses the air pump 330 to provide the airflow 332 to the airflow guiding channel 312 of the body 310, and the airflow guiding channel 312 can guide the airflow 332 provided by the air pump 330 to between the body 310 and the carrier 210, the body 310 is air-floated, and a compressed airflow 334 is generated between the body 310 and the carrier 210, so that the substrate 50 can be leveled. In this way, when the energy beam 112 is used for processing, the transfer substrate 52 can be closely attached to the target substrate 54, thereby effectively improving the process yield. In addition, the body 310 is air-floated on the carrier 210 to achieve the effect of local pressure equalization, so as to improve the yield of the transferred electronic components 60. In addition, the body 310 is air-floated on the carrier 210, reducing the friction between the body 310 and the carrier 210, making the relative movement between the body 310 and the carrier 210 smoother. Similarly, the compressed air flow 334 makes the body 310 air-floated on the substrate 50, preventing the body 310 from directly contacting the substrate 50, avoiding damage to the substrate 50 during movement, and reducing the yield rate of the transferred electronic components 60.

[0052] In this embodiment, the compressed air flow generating mechanism 300 may include a weight adjustment device 318. The weight adjustment device 318 is located on the light-transmitting plate 350. The weight adjustment device 318 may include a base 317, a plurality of counterweights 318a, and a hole O. The plurality of counterweights 318a are, for example, rectangular counterweights. The weight adjustment device 318 has a positioning member 319 arranged around the hole O. The positioning member 319 is arranged on the base 317, and the positioning member 319 is, for example, a positioning column, and the plurality of counterweights 318a are arranged to be passed through by the positioning column, so as to achieve a positioning effect on the plurality of counterweights 318a. The energy beam 112 can penetrate the hole O and the light-transmitting plate 350 and enter the light channel 314.

[0053] When the air pump 330 guides the airflow 332 provided to between the body 310 and the carrier 210 through the airflow guide channel 312, the weight adjustment device 318 can adjust the weight of the body 310 by increasing or decreasing the number of the plurality of counterweights 318a, so that the body 310 can be stably floated on the carrier 210, thereby effectively improving the process yield. In addition, by adjusting the weight of the body 310, the pressure generated by the pressing airflow 334 on the substrate 50 to be leveled can be adjusted. When facing substrates 50 or electronic components 60 of different sizes or materials, the corresponding pressure generated by the pressing airflow 334 is provided to achieve the effect of leveling the substrate 50, effectively improving the process yield.

[0054] Figure 2 To illustrate Figure 1A A top view of the path of movement of the energy generating mechanism relative to the carrier platform. Figure 1A and Figure 2 The energy generating mechanism 110 can move relative to the carrier 210, and the body 310 also moves with the energy generating mechanism 110 relative to the carrier 210, so that the energy beam 112 can process the multiple electronic components 60 on the substrate 50 in sequence, for example, Figure 2 In one embodiment, the carrier 210 can move relative to the energy generating mechanism 110. In this embodiment, the light-transmitting plate 350 (such as a quartz plate) only occupies a small area relative to the carrier 210, rather than covering most of the area of ​​the carrier 210, which can effectively reduce costs and has less risk of quartz plate breakage.

[0055] Figure 3A and Figure 3B A cross-sectional diagram showing two steps in the process of a method for soldering electronic components according to an embodiment of the present invention is shown. Figure 3A , Figure 3B and Figure 1A The method of welding electronic components of this embodiment can be used Figure 1A The method of soldering electronic components in this embodiment includes the following steps. First, Figure 3A As shown, a transfer substrate 52 is provided, and an electronic component 60 to be soldered is provided on a surface 51 of the transfer substrate 52. In addition, a target substrate 54 is provided, wherein the target substrate 54 includes a soldering surface 57. Then, the soldering surface 57 of the target substrate 54 is made to face the surface 51 of the transfer substrate 52 having the electronic component 60 to be soldered, and the electronic component 60 to be soldered is brought into contact with the soldering surface 57 of the target substrate 54.

[0056] Then, if Figure 3BAs shown, a compressed air flow 334 is applied to a surface 58 of the transfer substrate 52 where no electronic component 60 is to be welded (the transfer substrate 52 is disposed between the target substrate 54 and the body 310) or to a surface 59 of the target substrate 54 opposite to the welding surface 57 (the target substrate 54 is disposed between the transfer substrate and the body 310) at a position relative to the electronic component 60 to be welded. Figure 1A As shown, the energy beam 112 is applied to solder the electronic components 60 to be soldered on the transfer substrate 52 to the target substrate 54 through the suppressed air flow 334 .

[0057] In this embodiment, the compressed air flow 334 is generated by the body 310, between the body 310 and the transfer substrate 52 (in this case, the transfer substrate 52 is disposed between the target substrate 54 and the body 310) or the target substrate 54 (in this case, the target substrate 54 is disposed between the transfer substrate and the body 310), and the body 310 is floated. In addition, the energy beam 112 is applied to the transfer substrate 52 or the target substrate 54 through the compressed air flow 334, for example, applied to the solder 56 on the transfer substrate 52, or applied to the solder 56 on the target substrate 54, that is, the solder 56 can be disposed on the transfer substrate 52 or the target substrate 54.

[0058] After the solder 56 is melted by the energy beam 112 and cooled and solidified, the solder 56 can bond the electrode 62 and the pad 55. At this time, the bonding force between the solder 56 and the electrode 62 is greater than the bonding force between the adhesive layer 53 and the electronic component 60. Therefore, when the transfer substrate 52 and the target substrate 54 are separated, the electronic component 60 will remain on the target substrate 54 and separate from the transfer substrate 52. In this way, the electronic component 60 can be transferred from the transfer substrate 52 to the target substrate 54. One embodiment of the present invention provides a method for manufacturing a light-emitting diode display, which may include soldering a light-emitting diode chip using the above-mentioned method for soldering electronic components. Specifically, in the method for manufacturing a light-emitting diode display, the target substrate 54 is, for example, a display backplane, such as a thin film transistor (TFT) substrate, and the electronic component 60 is a light-emitting diode chip, such as a micro light-emitting diode chip. In this way, after the transfer substrate 52 and the target substrate 54 are separated, the electronic component 60 (light-emitting diode) remains on the target substrate 54 (display backplane) to form a light-emitting diode display.

[0059] In the method for welding electronic components and the method for manufacturing a light-emitting diode display of the present embodiment, since a surface 58 of the transfer substrate 52 where the electronic component 60 to be welded is not provided or a surface 59 of the target substrate 54 relative to the welding surface 57 is provided, a compressed airflow 334 is applied at a position relative to the electronic component 60 to be welded. Therefore, when the energy beam 112 is applied, the transfer substrate 52 and the target substrate 54 can be tightly fitted, thereby effectively improving the process yield.

[0060] Figure 4A FIG. 4 is a cross-sectional schematic diagram of an apparatus for soldering electronic components according to another embodiment of the present invention. Figure 4B FIG. 1 is a top view of an apparatus for soldering electronic components according to another embodiment of the present invention. Figure 4A and Figure 4B The main difference between the device 100' for soldering electronic components and the device 100 for soldering electronic components is that the body 310 of the device 100' for soldering electronic components may include a weight adjustment device 318'. The weight adjustment device 318' is located on the light-transmitting plate 350. The weight adjustment device 318' may include a base 317', a plurality of counterweights 318a' and a hole O. The plurality of counterweights 318a' are, for example, ring-shaped counterweights. The weight adjustment device 318' has a positioning member 319' arranged around the hole O. The positioning member 319' is arranged on the base 317', and the positioning member 319' is, for example, a positioning column, and the plurality of counterweights 318a' are arranged to be passed through by the positioning column, so as to achieve a positioning effect on the plurality of counterweights 318a'. And the plurality of counterweights 318a' are arranged on the positioning member 319'. The energy beam 112 can penetrate the hole O and the light-transmitting plate 350 and enter the light channel 314. The weight of the counterweight block is, for example, 1 / 10-3 / 10 of the weight of the body. The weight of the body can be appropriately increased or decreased to adjust the pressure of the pressing airflow on the substrate to be leveled.

[0061] When the air pump 330 guides the airflow 332 provided to between the body 310 and the carrier 210 through the airflow guide channel 312, the weight adjustment device 318' can adjust the weight of the body 310 by increasing or decreasing the number of the annular counterweight blocks 318a', so that the body 310 can be stably floated on the carrier 210, thereby effectively improving the process yield. In addition, by adjusting the weight of the body 310, the pressure generated by the pressing airflow 334 on the substrate 50 to be leveled can be adjusted. When facing substrates 50 or electronic components 60 of different sizes or materials, the corresponding pressure generated by the pressing airflow 334 is provided to achieve the effect of leveling the substrate 50, effectively improving the process yield.

[0062] In summary, in the device for locally leveling a substrate and the equipment for welding electronic components in the embodiments of the present invention, the compressed airflow generating mechanism utilizes an air pump to provide airflow to the airflow guiding channel of the main body, and the airflow guiding channel can guide the airflow provided by the air pump to between the main body and the supporting platform, so as to float the main body and generate compressed airflow between the main body and the supporting platform. The main body includes a weight adjustment device, which can increase or decrease the number of counterweight blocks to make the main body stably float on the supporting platform, so that the substrate can be leveled, thereby effectively improving the process yield.

[0063] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. An apparatus for soldering electronic components, comprising: include: A carrier having a carrier plane, and the carrier is used to carry a substrate to be welded on the carrier plane; as well as A suppressed airflow generating mechanism, comprising: A main body, on which an airflow guide channel and a weight adjustment device are provided; and an air pump, which can provide air flow to the air flow guide channel of the body, The airflow guide channel can guide the airflow provided by the air pump to between the main body and the supporting platform, so as to float the main body and generate a compressed airflow between the main body and the supporting platform; A driver capable of driving the body to move along the carrying plane relative to the carrying platform; and The energy generating mechanism can generate an energy beam, which passes through the pressing airflow and shoots toward the supporting platform.

2. The device for soldering electronic components according to claim 1, characterized in that: The weight adjustment device includes a plurality of counterweight blocks, and the weight of the body is adjusted by increasing or decreasing the number of the counterweight blocks.

3. The device for soldering electronic components according to claim 1, characterized in that: The system has an optical channel, and the energy beam generated by the energy generating mechanism passes through the optical channel, through the suppressing airflow, and is emitted in the direction of the supporting platform.

4. The device for soldering electronic components according to claim 1, characterized in that: The energy beam is a laser beam.

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