CNC high-precision electroplating grinding rod

By distributing two abrasives on CNC high-precision electroplating grinding rods and using different plating solutions and process parameters, the problem of low functional concentration of traditional electroplating grinding rods is solved, and the efficiency of multi-process processing is achieved.

CN119858119APending Publication Date: 2025-04-22SAIER TECH (RUDONG) CO LTD
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Patent Information

Application Number
CN202411917200.3
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-24
Publication Date
2025-04-22

AI Technical Summary

Technical Problem

The traditional electroplating grinding rod has a low functional concentration, resulting in the need of at least two grinding rods to complete for multiple different processing processes, and the efficiency is affected.

Method used

CNC high-precision electroplating grinding rod is used to distribute two different abrasives on the grinding rod. One of the abrasives is located around the electroplating substrate and the other is located at the bottom of the electroplating substrate. The grinding rod is prepared by different plating solutions and process parameters (such as current, plating time and temperature).

Benefits of technology

A grinding rod can perform two different processing processes, which improves functional concentration and thus improves processing efficiency.

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Abstract

The CNC high-precision electroplating grinding rod comprises an electroplating base body, a first grinding material and a second grinding material. The first grinding material is located around the electroplating base body, and the second grinding material is located at the bottom end of the electroplating base body. When the electroplating grinding rod is prepared, different electroplating systems are used, two kinds of grinding materials at different positions are formed, the two kinds of different grinding materials are adopted and distributed at the different positions of the grinding rod, the different grinding materials are selected for machining at the different positions of the grinding rod, and one grinding rod can conduct two different machining procedures; and the function centrality is improved, so that the processing efficiency is improved.
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Description

Technical Field

[0001] The invention relates to the technical field of electroplated grinding rods, and in particular to a CNC high-precision electroplated grinding rod. Background Art

[0002] Electroplated grinding rods are generally used in deep processing industries such as optical glass, sapphire glass, touch screen glass, precision ceramics, automotive parts, medical equipment, cemented carbide, semiconductors, etc. Their main functions are drilling, edge grinding or trimming.

[0003] Traditional electroplated grinding rods are mostly single-abrasive grinding rods or double-abrasive grinding rods. Generally, at least two types of grinding rods are required to complete multiple different processing procedures. The functional concentration is relatively low, which affects the working efficiency.

[0004] Therefore, how to provide a CNC high-precision electroplated grinding rod to solve the problems existing in the prior art is of great significance to its application. Summary of the invention

[0005] In view of this, the purpose of this application is to provide a CNC high-precision electroplated grinding rod to solve the problem that traditional electroplated grinding rods are mostly single-abrasive grinding rods or double-abrasive grinding rods, and generally require at least two types of grinding rods to complete multiple different processing procedures, and the functional concentration is low, which affects the working efficiency.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] A CNC high-precision electroplated grinding rod, comprising an electroplated substrate, a first abrasive and a second abrasive; the first abrasive is located around the electroplated substrate, and the second abrasive is located at the bottom end of the electroplated substrate;

[0008] The preparation method of the electroplated grinding rod comprises the following steps:

[0009] S1: preparing two electroplating solutions, wherein the abrasive concentration and particle size of the two electroplating solutions are different;

[0010] S2: shielding the bottom end of the electroplated substrate and then electroplating the abrasive 1;

[0011] S3: After shielding the electroplated substrate from the abrasive one, electroplating the abrasive two is performed.

[0012] Preferably, the two electroplating solutions both adopt a nickel sulfate electroplating system, which is divided into an electroplating system one and an electroplating system two.

[0013] Preferably, in the electroplating system 1: 30-55 g / L of nickel chloride hexahydrate, 15-20 g / L of cobalt sulfate, 220-400 g / L of nickel sulfate heptahydrate, 0.2-0.5 g / L of sodium dodecyl sulfate, 20-60 g / L of boric acid, 0.5-1.1 g / L of saccharin, 0.3-0.7 g / L of 1,4-butanediol, and the rest is water.

[0014] Preferably, in the electroplating system 1: 25-30 g / L of nickel chloride hexahydrate, 20-30 g / L of cobalt sulfate, 110-220 g / L of nickel sulfate heptahydrate, 0.1-0.2 g / L of sodium dodecyl sulfate, 18-20 g / L of boric acid, 0.5 g / L of saccharin, 0.3 / L of 1,4-butanediol, and the rest is water.

[0015] Preferably, the electroplating solution 1 contains 0.36-18 g abrasive and 2-4 g silicon carbide per 100 L of electroplating system; the electroplating solution 2 contains 0.1-10 g abrasive and 1-3 g silicon carbide per 100 L of electroplating system.

[0016] Preferably, the temperature during S2 electroplating is 23-65°C; the temperature during S3 electroplating is 30-40°C.

[0017] Preferably, the particle size of the abrasive in the first electroplating solution is 80-150 mesh; the particle size of the abrasive in the second electroplating solution is 120-130 mesh.

[0018] Preferably, the current in S2 is 0.5-4 A / dm 2, and the electroplating time is 2-4 hours; the current in S3 is 1-2 A / dm 2, and the electroplating time is 0.5-1 hour.

[0019] Compared with the prior art, the present invention has the following beneficial effects:

[0020] The present invention adopts two different abrasives, and the two abrasives are distributed at different positions of the grinding rod. Different abrasives are selected for processing at different positions of the grinding rod. One grinding rod can be used for two different processing steps, and the functional concentration is improved, thereby improving the processing efficiency.

[0021] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application so that it can be implemented in accordance with the contents of the specification, and to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the following is a detailed description of the preferred embodiments of the present application in conjunction with the accompanying drawings as follows.

[0022] Based on the detailed description of the specific embodiments of the present application in combination with the accompanying drawings below, those skilled in the art will become more aware of the above and other objects, advantages and features of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings required for use in the embodiments or the prior art descriptions are briefly introduced below. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can also be obtained based on these drawings without creative work. In all drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, each element or part is not necessarily drawn according to the actual scale.

[0024] Figure 1 It is a schematic diagram of the structure of the present invention.

[0025] In the figure: 100, electroplated substrate; 200, abrasive 1; 300, abrasive 2. DETAILED DESCRIPTION

[0026] To make the purpose, technical scheme and advantages of the embodiment of the present application clearer, the technical scheme in the embodiment of the present application will be clearly and completely described below in conjunction with the accompanying drawings in the embodiment of the present application. Obviously, the described embodiment is a part of the embodiment of the present application, rather than all of the embodiments. In the following description, specific details such as specific configuration and components are provided only to help fully understand the embodiments of the present application. Therefore, it should be clear to those skilled in the art that various changes and modifications can be made to the embodiments described herein without departing from the scope and spirit of the present application. In addition, for clarity and brevity, the description of known functions and structures is omitted in the embodiment.

[0027] In addition, the present application may repeat reference numerals and / or letters in different examples. This repetition is for the purpose of simplicity and clarity, and does not in itself indicate the relationship between the various embodiments and / or settings discussed.

[0028] The term "and / or" in this article is only a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can mean: A exists alone, B exists alone, and A and B exist at the same time. The term " / and" in this article describes another type of association object relationship, indicating that there can be two relationships. For example, A / and B can mean: A exists alone, and A and B exist alone. In addition, the character " / " in this article generally indicates that the previous and next associated objects are in an "or" relationship.

[0029] It should also be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusions.

[0030] See also Figure 1 The present invention provides a technical solution for a CNC high-precision electroplated grinding rod: comprising an electroplated substrate 100, an abrasive 1 200 and an abrasive 2 300; the abrasive 1 200 is located around the electroplated substrate 100, and the abrasive 2 300 is located at the bottom end of the electroplated substrate 100;

[0031] The preparation method of the electroplated grinding rod comprises the following steps:

[0032] S1: two electroplating solutions are prepared, and the abrasive concentration and particle size of the two electroplating solutions are different;

[0033] S2: shielding the bottom end of the electroplated substrate and then electroplating the abrasive 1;

[0034] S3: After shielding the electroplated substrate from the abrasive one, electroplating the abrasive two is performed.

[0035] The nickel sulfate electroplating system adopted by the two electroplating solutions is divided into electroplating system one and electroplating system two.

[0036] In electroplating system 1: nickel chloride hexahydrate 30-55 g / L, cobalt sulfate 15-20 g / L, nickel sulfate heptahydrate 220-400 g / L, sodium dodecyl sulfate 0.2-0.5 g / L, boric acid 20-60 g / L, saccharin 0.5-1.1 g / L, 1,4-butanediol 0.3-0.7 g / L, and the rest is water.

[0037] In electroplating system 2: nickel chloride hexahydrate 25-30 g / L, cobalt sulfate 20-30 g / L, nickel sulfate heptahydrate 110-220 g / L, sodium dodecyl sulfate 0.1-0.2 g / L, boric acid 18-20 g / L, saccharin 0.5 g / L, 1,4-butanediol 0.3 / L, and the rest is water.

[0038] The first electroplating solution contains 0.36-18 g of abrasive and 2-4 g of silicon carbide per 100 L of the electroplating system; the second electroplating solution contains 0.1-10 g of abrasive and 1-3 g of silicon carbide per 100 L of the electroplating system.

[0039] The temperature during S2 electroplating is 23-65°C; the temperature during S3 electroplating is 30-40°C.

[0040] The particle size of the abrasive in the first electroplating solution is 80-150 mesh; the particle size of the abrasive in the second electroplating solution is 120-130 mesh.

[0041] The current in S2 is 0.5-4A / dm2, and the electroplating time is 2-4 hours. The current in S3 is 1-2A / dm2, and the electroplating time is 0.5-1 hour.

[0042] When used specifically, first prepare the plating solution according to the ratio of 30-55 g / L nickel chloride hexahydrate, 15-20 g / L cobalt sulfate, 220-400 g / L nickel sulfate heptahydrate, 0.2-0.5 g / L sodium dodecyl sulfate, 20-60 g / L boric acid, 0.5-1.1 g / L saccharin, 0.3-0.7 g / L 1,4-butanediol, and the rest water; each 100 L of the plating system contains 0.36-18 g abrasive and 2-4 g silicon carbide; then prepare the plating solution according to the ratio of 25-30 g / L nickel chloride hexahydrate, 0.2-0.5 g / L sodium dodecyl sulfate, 20-60 g / L boric acid, 0.5-1.1 g / L saccharin, 0.3-0.7 g / L 1,4-butanediol, and the rest water; prepare the plating solution according to the ratio of 0.36-18 g abrasive and 2-4 g silicon carbide; then prepare the plating solution according to the ratio of 25-30 g / L nickel chloride hexahydrate, 0.2-0.5 g / L sodium dodecyl sulfate, 0.2-0.5 g / L sodium dodecyl sulfate, 0.5-1.1 g / L boric acid, 0.3-0.7 g / L 1,4-butanediol, and the rest water; prepare the plating solution according to the ratio of 0.36-18 g abrasive and 2-4 g silicon carbide; , cobalt sulfate 20-30 g / L, nickel sulfate heptahydrate 110-220 g / L, sodium dodecyl sulfate 0.1-0.2 g / L, boric acid 18-20 g / L, saccharin 0.5 g / L, 1,4-butanediol 0.3 / L, and the rest is water; each 100L of the electroplating system contains 0.1-10 g of abrasive and 1-3 g of silicon carbide to prepare the electroplating solution 2, then shield the bottom of the electroplated substrate 100, and place the electroplated substrate 100 in the electroplating solution 1 according to the current of 0.5-4 A / dm in S2 2. Electroplating is performed for 2 to 4 hours at a temperature of 23 to 65°C to form abrasive 1 200, and then abrasive 1 is shielded. According to S3, the temperature during electroplating is 30 to 40°C, the current is 1 to 2A / dm2, and the electroplating time is 0.5 to 1 hour to obtain abrasive 2 300.

[0043] The above description is only the preferred embodiment of the present invention, which does not limit the protection scope of the present invention. For those skilled in the art, the present invention can be modified and varied in various ways. Within the spirit and principle of the present invention, any change, modification, replacement, integration and parameter change of these embodiments by conventional substitution or capable of achieving the same function without departing from the principle and spirit of the present invention shall fall within the protection scope of the present invention.

Claims

1. A CNC high-precision electroplated grinding rod, characterized in that: It comprises an electroplating substrate (100), abrasive one (200) and abrasive two (300); the abrasive one (200) is located around the electroplating substrate (100), and the abrasive two (300) is located at the bottom end of the electroplating substrate (100); The preparation method of the electroplated grinding rod comprises the following steps: S1: preparing two electroplating solutions, wherein the abrasive concentration and particle size of the two electroplating solutions are different; S2: shielding the bottom end of the electroplated substrate and then electroplating the abrasive 1; S3: After shielding the electroplated substrate from the abrasive one, electroplating the abrasive two is performed.

2. A CNC high-precision electroplated grinding rod as claimed in claim 1, characterized in that: The two electroplating solutions both adopt a nickel sulfate electroplating system, which is divided into an electroplating system one and an electroplating system two.

3. A CNC high-precision electroplated grinding rod according to claim 2, characterized in that: In the electroplating system 1: 30-55 g / L of nickel chloride hexahydrate, 15-20 g / L of cobalt sulfate, 220-400 g / L of nickel sulfate heptahydrate, 0.2-0.5 g / L of sodium dodecyl sulfate, 20-60 g / L of boric acid, 0.5-1.1 g / L of saccharin, 0.3-0.7 g / L of 1,4-butanediol, and the rest is water.

4. A CNC high-precision electroplated grinding rod according to claim 3, characterized in that: In the electroplating system 1: 25-30 g / L of nickel chloride hexahydrate, 20-30 g / L of cobalt sulfate, 110-220 g / L of nickel sulfate heptahydrate, 0.1-0.2 g / L of sodium dodecyl sulfate, 18-20 g / L of boric acid, 0.5 g / L of saccharin, 0.3 / L of 1,4-butanediol, and the rest is water.

5. A CNC high-precision electroplated grinding rod according to claim 4, characterized in that: The first electroplating solution contains 0.36-18 g of abrasive and 2-4 g of silicon carbide per 100 L of electroplating system; the second electroplating solution contains 0.1-10 g of abrasive and 1-3 g of silicon carbide per 100 L of electroplating system.

6. The CNC high-precision electroplated grinding rod according to claim 5, characterized in that: The temperature of S2 during electroplating is 23-65°C; the temperature of S3 during electroplating is 30-40°C.

7. A CNC high-precision electroplated grinding rod according to claim 6, characterized in that: The particle size of the abrasive in the first electroplating solution is 80-150 meshes; the particle size of the abrasive in the second electroplating solution is 120-130 meshes.

8. The CNC high-precision electroplated grinding rod according to claim 7, characterized in that: The current in S2 is 0.5-4A / dm2, and the electroplating time is 2-4 hours. The current in S3 is 1-2A / dm2, and the electroplating time is 0.5-1 hour.

Citation Information

Patent Citations

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