Electroplating tool for coating device

Abstract

The invention discloses an electroplating tool for a coating device, which relates to the technical field of wafer electroplating, and comprises an electroplating operation cavity groove which is arranged between a top edge cover and a bottom edge cover and is used for protecting during wafer electroplating operation and controlling the capacity of electroplating liquid entering the electroplating operation cavity groove, under the cooperation of the dynamic electroplating point uniform regulation and control assembly, it is ensured that the cathode end can keep a uniform electric field distribution relation with the surface of the wafer in all directions, overall uniform and stable electric field distribution is achieved, metal ions can be uniformly deposited on the surface of the wafer in the electroplating process, the thickness difference of a plating layer and the crystallization defect are effectively reduced, and the electroplating quality is improved. According to the method, the electroplating quality and the yield of the wafer are improved, the anode end forms a self-adaptive close to or away from a specific region of the wafer or the angle of the anode end relative to the wafer is changed, so that the electric field distribution on the surface of the wafer is optimized, the electric field intensity is kept uniform in each region of the wafer, and the electroplating efficiency and the coating uniformity are further improved.

Description

Technical Field

[0001] The invention relates to the technical field of wafer electroplating, and in particular to an electroplating tool for a film coating device. Background Art

[0002] Wafers need to be electroplated during production. During electroplating, a hanger is needed to suspend the wafer in the plating solution for electroplating. Electroplating is a process that uses the principle of electrolysis to coat a layer of metal film on the surface of metal or other materials. It can prevent oxidation or rust, improve wear resistance and conductivity, etc. With the vigorous development of the chip manufacturing industry, the requirements for electroplating of chip substrate wafers are getting higher and higher. Wafers are fragile, ultra-thin, and have high requirements for uniformity of the electroplating layer.

[0003] Currently, during wafer electroplating operations, the position of conventional electrodes is in a single state, resulting in that when the position of the wafer inside the electroplating tank shifts, the electric field lines connected to the electrodes will be concentrated in certain areas within the tooling, causing the current density in these areas to be too high, while the current density in other areas is too low. As a result, in this case, the surface of the workpiece being plated will have a partially thick coating, while other parts will be too thin or even unable to form a coating. The overall process cannot be effectively adjusted dynamically according to the electroplating effect of the wafer. Therefore, it is necessary to propose an electroplating tooling for a coating device. Summary of the invention

[0004] The object of the present invention is to provide an electroplating tool for a coating device to solve the problem proposed in the above background technology that during the wafer electroplating operation, the position of the conventional electrode is in a single state, resulting in that when the position of the wafer inside the electroplating tank is offset, the electric field lines connected to the electrodes will be concentrated in certain areas in the tooling, making the current density in these areas too high, while the current density in other areas is too low. As a result, in this case, the surface of the workpiece to be coated will have a locally thick coating, while the coating in other parts will be too thin or even unable to form a coating, and the overall problem cannot be effectively dynamically adjusted according to the electroplating effect of the wafer.

[0005] To achieve the above object, the present invention provides the following technical solution: an electroplating tool for a coating device, comprising: The electroplating operation chamber is installed between the top cover and the bottom cover, and is used to protect the wafer during electroplating and control the volume of the electroplating solution entering the chamber; Dynamic plating point uniformity control component, which is installed at the bottom of the tooling connecting rod frame, is used to control the cathode end of the front end according to the electroplating operation, so that it can move with the position changes of various points on the wafer surface, ensuring that the electric field strength between the cathode and anode is distributed as evenly as possible in various areas of the wafer; Ultrasonic control components, which form multiple groups and are installed inside the electroplating operation chamber, are used to make the ultrasonic waves form two modes of flat wave and concentrated wave according to different states of wafer electroplating, so as to improve the wafer electroplating efficiency; The positive electrode control component is located on the side of the top rotating ring slot plate. It is used to adaptively adjust the position of the anode terminal according to the electric field distribution on the wafer surface and the electroplating progress when the whole is in the electroplating tank, so that the distance and relative position between the anode terminal and the wafer are always maintained in the best state, thereby optimizing the electric field distribution; The wafer electroplating auxiliary component is located in the inner cavity of the electroplating operation chamber, and assists in the uniformity of the wafer electroplating according to the operating status of the wafer electroplating.

[0006] Preferably, the dynamic plating point uniformity control component includes: An annular guide rail, a propulsion guide rod, an angle-controlled forward and reverse motor and a waist connecting rod. The annular guide rail is fastened to the bottom of the tooling connecting rod frame, the propulsion guide rod is located inside the annular guide rail and is slidably connected. The angle-controlled forward and reverse motor is located at the bottom of the propulsion guide rod to drive the waist connecting rod to form an angle-controlled rotation, and a steering position plate is installed at the bottom of the waist connecting rod.

[0007] Preferably, a rotation control motor is installed at the top of the steering position plate, a vertical rod is fastened to the bottom of the steering position plate, a guide rail is fastened to the bottom side end of the vertical rod, a control motor is installed at the top of the guide rail, a sliding edge is installed on the side of the guide rail, a high-precision lead screw is connected to the bottom output end of the control motor, a photoelectric position displacement seat is slidably connected to the outside of the high-precision lead screw, and the photoelectric position displacement seat is composed of a photoelectric sensor and a displacement seat.

[0008] Preferably, the side end of the photoelectric position displacement seat is fastened with a rotation adjustment motor, the output end of the rotation adjustment motor is connected to a conduction rod, the side end of the rotation adjustment motor is installed with a side bending rod, the side end of the conduction rod is connected to a ball joint, the side end of the ball joint is connected to a distance adjustment guide rod, and the cathode end is located at the side end of the distance adjustment guide rod and is fastened.

[0009] Preferably, the ultrasonic control component comprises: A control seat, an array ultrasonic transducer, an ultrasonic generator, a focusing control structure and an ultrasonic control sensor are installed. The control seat drives the array ultrasonic transducer and related structures to form a surrounding arrangement inside the electroplating operation cavity. The array ultrasonic transducer drives the ultrasonic generator to adopt a plane wave emission mode in the early stage of electroplating to uniformly stir the plating solution as a whole. When high-precision electroplating is required for a specific area of ​​the wafer, the focusing control structure is used to switch to a focused wave emission mode to focus the ultrasonic energy on the area, thereby enhancing the local mass transfer and electroplating effects.

[0010] Preferably, the positive electrode regulating component includes: A control brushless motor, a transmission gear, an outer gear ring and an electrode guide rod, wherein the control brushless motor is installed in a surface protective shell of the top rotating ring groove plate, and the control brushless motor drives the transmission gear and the outer gear ring to form a meshing connection, and the outer gear ring is located in the side ring groove of the top rotating ring groove plate to form a rotating connection, and the inner ring diameter surface of the outer gear ring is tightly connected with an electrode guide rod, and the electrode guide rod is tightly connected to the anode end, and the anode end is located inside the electroplating operation cavity to form a ring-shaped adjustment operation.

[0011] Preferably, the wafer electroplating auxiliary component includes: A centrifugal electrode plate, a magnetic field generator, an electromagnetic control coil, a magnetic field sensor and a stirrer plate. The centrifugal electrode plate and the stirrer plate are connected via an electromagnetic clutch. The magnetic field generator forms multiple groups that are fastened to the outside of the centrifugal electrode plate. The electromagnetic control coil is installed inside the magnetic field generator.

[0012] Preferably, the tooling connecting rod frame is used to form a connection with the external electroplating rack at the top during electroplating, so that the entire device can be immersed in the electroplating tank with the cooperation of the external electroplating rack, and a centrifugal control motor is installed inside the tooling connecting rod frame, and the bottom output end of the centrifugal control motor is connected to a first fixed wire end.

[0013] Preferably, two ends of the bottom of the first fixed wire end are wrapped with ropes, the bottom of the rope passes through the agitator plate to connect with the second fixed wire end, and a connecting fixture is installed at the bottom of the second fixed wire end, and the connecting fixture is used to form an automatic connection with the docking piece at the bottom of the electroplating tank after the whole is immersed in the electroplating tank.

[0014] Preferably, an electrically controlled iris valve is installed inside the bottom end of the bottom edge cover, a liquid level sensor is installed on the surface of the electrically controlled iris valve, the bottom of the bottom edge cover is fastened with a fastener, and the central end of the fastener is connected to a wire core plug.

[0015] Compared with the prior art, the present invention has the following beneficial effects: 1. In the present invention, with the cooperation of the dynamic plating point uniform control component, when the plating operation starts, the photoelectric sensor in the photoelectric position displacement seat is used to monitor the position information of the wafer surface in real time, so that the relative distance and angle relationship between each point on the wafer surface and the cathode end are determined by emitting light and receiving reflected light. When a change in the wafer position is detected (such as displacement or rotation caused by the flow of plating liquid or other external forces), the photoelectric sensor transmits a position change signal to the built-in logic controller, so that the built-in logic controller analyzes and determines the displacement amount and direction required to adjust the cathode end in different azimuth directions according to the position change signal fed back by the photoelectric sensor, compensates for the horizontal position deviation of the wafer, ensures that the relative position of the cathode end and the wafer in the horizontal direction remains stable, and when the wafer changes in position in the vertical direction (such as an up and down position change), the position of the wafer changes in the vertical direction. When the wafer is rotated or tilted, the overall tilt angle of the cathode end is adjusted to keep it parallel to the wafer surface or at the best electroplating angle relationship. At the same time, the rotating adjustment motor can further fine-tune the local angle of the cathode end as needed, so that the rotating adjustment motor drives the conduction rod to rotate, and through the flexible connection of the ball joint, the distance adjustment guide rod and the cathode end are driven to make precise adjustments at small angles to ensure that the cathode end can maintain a uniform electric field distribution relationship with the wafer surface in all directions. The overall uniform and stable electric field distribution allows metal ions to be evenly deposited on the wafer surface during the electroplating process, avoiding electric field distortion and uneven coating caused by position changes, effectively reducing coating thickness differences and crystal defects, and improving the quality and yield of wafer electroplating.

[0016] 2. In the present invention, by cooperating with the ultrasonic control component, the positive electrode control component and the wafer electroplating auxiliary component, the wafer entering is subjected to the action of the ultrasonic generator and the driving array ultrasonic transducer, and a frequency force that can make the wafer in the electroplating solution suspend is applied to the wafer, so that the wafer forms a non-resonant stable non-contact suspension state in the electroplating solution. At the same time, when the internal controller judges that high-precision electroplating is required for a specific area of ​​the wafer based on the information fed back by the ultrasonic control sensor, if it is detected that the coating in a local area of ​​the wafer grows slowly or there are small defects that need to be repaired, the focusing control structure During the electroplating process, the electric field monitoring sensor monitors the electric field strength distribution and electroplating progress information on the wafer surface in real time, so that the anode end can adaptively approach or move away from a specific area of ​​the wafer or change its angle relative to the wafer to optimize the electric field distribution on the wafer surface and keep the electric field strength uniform in all areas of the wafer. Secondly, stirring is performed in the electroplating solution to force convection of the electroplating solution. Metal ions can reach the wafer surface faster under the combined action of convection and diffusion, and a more uniform ion concentration distribution is formed around the wafer, thereby improving the electroplating efficiency and coating uniformity. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the main structure of an electroplating tool for a film coating device of the present invention; Figure 2 It is a schematic structural diagram of a side view of an electroplating tool for a film coating device of the present invention; Figure 3 It is a schematic diagram of the separation structure of the main body in an electroplating tool for a film coating device of the present invention; Figure 4 It is a schematic diagram of the installation position structure of a dynamic electroplating point uniformity control component in an electroplating tool for a film coating device of the present invention; Figure 5 The present invention is a kind of electroplating tool for coating device Figure 4 A schematic diagram of the enlarged structure at point A; Figure 6 It is a schematic structural diagram of an ultrasonic control component in an electroplating tool for a film coating device of the present invention; Figure 7 It is a schematic diagram of the installation position structure of a wafer electroplating auxiliary component in an electroplating tool for a film coating device of the present invention; Figure 8 It is a structural schematic diagram of a wafer electroplating auxiliary component in an electroplating tool for a film coating device of the present invention; Fig. 9 It is a structural schematic diagram of a dynamic electroplating point uniformity control component in an electroplating tool for a film coating device of the present invention; Fig.10 The present invention is a kind of electroplating tool for coating device Fig. 9 Schematic diagram of the enlarged structure at B.

[0018] In the figure: 1. Tooling connecting rod frame; 2. Centrifugal control motor; 3. First fixed wire end; 4. Wire rope; 5. Dynamic electroplating point uniform control component; 51. Annular guide rail; 52. Propelling guide rod; 53. Angle control forward and reverse motor; 54. Waist connecting rod; 55. Steering position plate; 56. Rotation control motor; 57. Vertical rod; 58. Guide rail; 59. Control motor; 590. Rotation adjustment motor; 591. Side bending rod; 592. Conducting rod; 593. Ball joint; 594. Distance adjustment guide rod; 595. Cathode end; 596. Sliding edge; 597. High-precision screw rod; 598. Photoelectric position displacement seat; 6. Electroplating operation cavity; 7. Top edge cover; 8. Bottom edge cover; 9. Fasteners; 10. Wire core plug; 11. Electric-controlled iris valve; 12. Second fixed wire end; 13. Connecting fixture; 14. Top swivel ring groove plate; 15. Ultrasonic control assembly; 151. Mounting control seat; 152. Array ultrasonic transducer; 153. Ultrasonic generator; 154. Focusing control structure; 155. Ultrasonic control sensor; 17. Positive electrode control assembly; 171. Control brushless motor; 172. Transmission gear; 173. External gear ring; 174. Electrode guide rod; 175. Anode end; 18. Wafer electroplating auxiliary assembly; 181. Centrifugal electrode plate; 182. Magnetic field generator; 183. Electromagnetic control coil; 184. Magnetic field sensor; 185. Stirrer plate. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the implementation regulations described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0020] Embodiment 1: In the present invention, referring to Figure 1 - Fig.10 As shown: An electroplating tool for a coating device, comprising: The electroplating operation chamber 6 is installed between the top cover 7 and the bottom cover 8, and is used for protecting the wafer during electroplating operation and controlling the volume of the electroplating solution entering the chamber; Dynamic plating point uniformity control component 5, which is installed at the bottom of the tooling connecting rod frame 1, is used to control the cathode end 595 at the front end according to the electroplating operation, so that it can move with the position change of each point on the wafer surface, ensuring that the electric field strength between the cathode and anode is as evenly distributed as possible in each area of ​​the wafer; Ultrasonic control components 15, which form multiple groups and are installed inside the electroplating operation chamber 6, are used to make the ultrasonic wave form two modes of flat wave and concentrated wave according to different states of wafer electroplating, so as to improve the wafer electroplating efficiency; The positive electrode regulating component 17 is located on the side of the top rotating ring groove plate 14 and is used to adaptively adjust the position of the anode terminal 175 according to the electric field distribution on the wafer surface and the electroplating progress when the whole is in the electroplating tank, so that the distance and relative position between the anode terminal 175 and the wafer are always maintained in the optimal state, thereby optimizing the electric field distribution; The wafer electroplating auxiliary component 18 is located in the inner cavity of the electroplating operation chamber 6 and assists in improving the uniformity of the wafer electroplating according to the operation status of the wafer electroplating.

[0021] Embodiment 2: In the present invention, according to Figure 1 , Figure 3 , Figure 7 , Fig. 9 and Fig.10 As shown, the dynamic plating point uniformity control component 5 includes: The annular guide rail 51, the propulsion guide rod 52, the angle control forward and reverse motor 53 and the waist connecting rod 54, the annular guide rail 51 is fastened to the bottom of the tooling connecting rod frame 1, the propulsion guide rod 52 is located inside the annular guide rail 51 and is slidably connected, the angle control forward and reverse motor 53 is located at the bottom of the propulsion guide rod 52 and drives the waist connecting rod 54 to form an angle controlled rotation, and a steering position plate 55 is installed at the bottom of the waist connecting rod 54.

[0022] A rotation control motor 56 is installed at the top of the steering position disk 55, and a vertical rod 57 is fastened to the bottom of the steering position disk 55. A guide rail 58 is fastened to the bottom side end of the vertical rod 57. A control motor 59 is installed at the top of the guide rail 58. A sliding edge 596 is installed on the side of the guide rail 58. A high-precision lead screw 597 is connected to the bottom output end of the control motor 59. A photoelectric position displacement seat 598 is slidably connected to the outside of the high-precision lead screw 597. The photoelectric position displacement seat 598 consists of a photoelectric sensor and a displacement seat.

[0023] The side end of the photoelectric position displacement seat 598 is fastened with a rotation adjustment motor 590, the output end of the rotation adjustment motor 590 is connected to a conduction rod 592, the side end of the rotation adjustment motor 590 is installed with a side bending rod 591, the side end of the conduction rod 592 is connected to a ball joint 593, the side end of the ball joint 593 is connected to a distance adjustment guide rod 594, and the cathode end 595 is located at the side end of the distance adjustment guide rod 594 and is fastened thereto.

[0024] In a specific scheme, before the electroplating operation begins, based on the initial position information of the wafer, the control motor 59 drives the high-precision lead screw 597 to drive the photoelectric position displacement seat 598 to move to an initial position roughly corresponding to the center position of the wafer. At the same time, the angle control forward and reverse motor 53 adjusts the angle of the waist connecting rod 54 to make the entire structure in a suitable initial posture to ensure that the cathode end 595 can cover the electroplating area of ​​the wafer. The rotation control motor 56 can fine-tune the angle of the steering position disk 55 to further accurately determine the initial direction of the cathode end 595. Then, when the electroplating operation begins, the photoelectric sensor in the photoelectric position displacement seat 598 is used to monitor the position information of the wafer surface in real time, so that the wafer is determined by emitting light and receiving reflected light. The relative distance and angle relationship between each point on the surface and the cathode end 595. When a change in the wafer position is detected (such as displacement or rotation caused by the flow of electroplating liquid or other external forces), the photoelectric sensor transmits the position change signal to the built-in logic controller, so that the built-in logic controller analyzes and determines the displacement amount and direction that the cathode end 595 needs to be adjusted in different azimuth directions based on the position change signal fed back by the photoelectric sensor. Secondly, the control motor 59 drives the high-precision screw 597 to make the photoelectric position displacement seat 598 slide horizontally on the guide rail 58. Since the cathode end 595 is tightly connected to the photoelectric position displacement seat 598, the cathode end 595 also moves in the horizontal direction, thereby compensating for the horizontal position offset of the wafer and ensuring the cathode end The relative position of 595 and the wafer in the horizontal direction remains stable. When the wafer changes position in the vertical direction (such as when it changes up and down), the photoelectric sensor will also detect this change and feed back to the built-in logic controller, so that the built-in logic controller drives the propulsion guide rod 52 to slide up and down in the annular guide rail 51 according to the signal, and drives the related structures it carries (including the cathode end 595) to move in the vertical direction, so that the vertical distance between the cathode end 595 and the wafer is maintained within a suitable electroplating range. When the wafer rotates or tilts, the photoelectric sensor detects the angle change information between different points on the wafer surface and the cathode end 595, and synchronously transmits it to the built-in logic controller, which again enables the built-in logic controller to control the angle positive or negative. The counter motor 53 works to drive the waist connecting rod 54 to rotate, adjust the overall tilt angle of the cathode end 595, so that it remains parallel to the wafer surface or is in the best electroplating angle relationship. At the same time, the rotating adjustment motor 590 further fine-tunes the local angle of the cathode end 595 as needed, so that the rotating adjustment motor 590 drives the conduction rod 592 to rotate, and through the flexible connection of the ball joint 593, drives the distance adjustment guide rod 594 and the cathode end 595 to make precise adjustments at a small angle, ensuring that the cathode end 595 can maintain a uniform electric field distribution relationship with the wafer surface in all directions. The overall uniform and stable electric field distribution allows metal ions to be evenly deposited on the wafer surface during the electroplating process, avoiding electric field distortion and uneven coating problems caused by position changes.Effectively reduce the difference in coating thickness and crystal defects, and improve the quality and yield of wafer electroplating.

[0025] Embodiment 3: In the present invention, according to Figure 1 - Figure 8 As shown, the ultrasonic control component 15 includes: A control seat 151, an array ultrasonic transducer 152, an ultrasonic generator 153, a focusing control structure 154 and an ultrasonic control sensor 155 are installed. The control seat 151 is installed to drive the array ultrasonic transducer 152 and related structures to form a surrounding arrangement inside the electroplating operation chamber 6. In the early stage of electroplating, the array ultrasonic transducer 152 drives the ultrasonic generator 153 to adopt a plane wave emission mode to uniformly stir the plating solution as a whole. When high-precision electroplating is required for a specific area of ​​the wafer, the focusing control structure 154 is used to switch to the focused wave emission mode to focus the ultrasonic energy on the area, thereby enhancing the local mass transfer and electroplating effects.

[0026] The positive electrode control component 17 includes: Control the brushless motor 171, the transmission gear 172, the outer gear ring 173 and the electrode guide rod 174. The control brushless motor 171 is installed in the surface protective shell of the top rotating ring groove plate 14. The control brushless motor 171 drives the transmission gear 172 and the outer gear ring 173 to form a meshing connection. The outer gear ring 173 is located in the side ring groove of the top rotating ring groove plate 14 to form a rotating connection. The inner ring diameter surface of the outer gear ring 173 is surrounded and fastened with the electrode guide rod 174. The electrode guide rod 174 and the anode terminal 175 are fastened. The anode terminal 175 is located inside the electroplating operation chamber 6 to form a ring-shaped adjustment operation.

[0027] The wafer electroplating auxiliary component 18 includes: The centrifugal electrode plate 181, the magnetic field generator 182, the electromagnetic control coil 183, the magnetic field sensor 184 and the agitator plate 185 are connected by an electromagnetic clutch, the magnetic field generator 182 forms multiple groups of fastening connections to the outside of the centrifugal electrode plate 181, and the electromagnetic control coil 183 is installed inside the magnetic field generator 182.

[0028] The tooling connecting rod frame 1 is used to form a connection with the external electroplating rack at the top during electroplating, so that the entire device can be immersed in the electroplating tank with the cooperation of the external electroplating rack. The internal structure of the tooling connecting rod frame 1 is equipped with a centrifugal control motor 2, and the bottom output end of the centrifugal control motor 2 is connected to a first fixed wire end 3.

[0029] The two ends of the bottom of the first fixed wire end 3 are wrapped with a rope 4, the bottom of the rope 4 passes through the agitator plate 185 to connect with the second fixed wire end 12, and the bottom of the second fixed wire end 12 is installed with a connecting fixture 13, which is used to form an automatic connection with the docking piece at the bottom of the electroplating tank after the whole is immersed in the electroplating tank.

[0030] An electrically controlled iris valve 11 is installed inside the bottom end of the bottom cover 8, a liquid level sensor is installed on the surface of the electrically controlled iris valve 11, a fastener 9 is fastened to the bottom of the bottom cover 8, and a wire core plug 10 is connected to the center end of the fastener 9.

[0031] In a specific scheme, during the electroplating operation, that is, at the initial stage of electroplating, the ultrasonic generator 153 receives the controller instruction inside the installation control seat 151, and drives the array ultrasonic transducer 152 to work in the plane wave emission mode. At this time, the array ultrasonic transducer 152 evenly emits ultrasonic waves into the electroplating solution, so that the electroplating solution produces overall uniform weak vibrations, forming a liquid flow condition similar to uniform stirring. After the electroplating solution enters the electroplating operation chamber 6, the electroplating solution forms an upward pressure distribution under the wafer, increasing the buoyancy compensation, and the wafer that enters is subjected to the action of the ultrasonic generator 153 and the driving array ultrasonic transducer 152, and a frequency force that can cause it to suspend is applied to the wafer in the electroplating solution, so that the wafer is in the electroplating solution. A non-resonant, stable, non-contact suspension state is formed, and the ultrasonic control sensor 155 monitors the flow state of the plating solution, the ion concentration distribution, and the initial plating condition of the wafer surface in real time, and feeds back to the internal controller. When the internal controller determines that high-precision plating is required for a specific area of ​​the wafer based on the information fed back by the ultrasonic control sensor 155, such as when it is detected that the plating growth in a certain local area of ​​the wafer is slow or there are tiny defects that need to be repaired, the focusing control structure 154 is started, so that the focusing control structure 154 adjusts the working parameters of the array ultrasonic transducer 152 according to the position information of the target area, and focuses the ultrasonic energy to the specific area, so that in the focused wave emission mode, the ultrasonic control sensor 155 continuously monitors the focus area The electroplating conditions in the domain, such as the deposition rate of metal ions, the microstructure changes on the wafer surface, etc., are fed back to the internal controller so as to adjust the focusing parameters or switch the ultrasonic mode in time. At the same time, during the electroplating process, the electric field monitoring sensor (located in the electroplating operation chamber 6) monitors the electric field intensity distribution and electroplating progress information on the wafer surface in real time, and transmits the data to the built-in logic controller, so that the built-in logic controller analyzes and determines the position and angle information that need to be adjusted at the anode end 175, and then controls the brushless motor 171 to start according to the instruction of the built-in logic controller, driving the transmission gear 172 to rotate. Since the transmission gear 172 is meshed with the outer gear ring 173, the outer gear ring 173 rotates in the side ring groove of the top rotating ring groove plate 14, thereby driving the electrode conductor The rod 174 and the anode terminal 175 perform a circular adjustment operation. During the adjustment process, the anode terminal 175 changes its position in the electroplating operation chamber 6, so as to adaptively approach or move away from a specific area of ​​the wafer, or change its angle relative to the wafer, so as to optimize the electric field distribution on the wafer surface and keep the electric field strength uniform in various areas of the wafer. Secondly, after the electroplating starts, the electromagnetic control coil 183 generates a changing magnetic field according to the instructions of the built-in logic controller, and the magnetic field generator 182 applies the magnetic field to the centrifugal electrode plate 181. When the electroplating solution needs to be stirred to promote ion diffusion, the electromagnetic clutch connects the centrifugal electrode plate 181 and the agitator plate 185. The agitator plate 185 rotates in cooperation with the wire rope 4 to force convection of the electroplating solution.The diffusion of metal ions in the electroplating solution and their uniform deposition on the surface of the wafer are promoted, and the magnetic field sensor 184 monitors the magnetic field strength, direction, and flow state of the electroplating solution in real time, so that the built-in logic controller can adjust the electromagnetic control coil 183 according to the actual situation to optimize the stirring effect, and as a whole, it is convenient to use centrifugal force to assist the deposition of metal ions or remove impurities on the surface of the wafer during the electroplating process. The built-in logic controller can adjust the state of the electromagnetic clutch so that the centrifugal electrode plate 181 works alone or cooperates with the agitator plate 185 in different ways, so that when the centrifugal force is needed to make the metal ions more inclined to deposit on the edge area of ​​the wafer, the electromagnetic clutch can make the centrifugal electrode plate 181 rotate at a high speed to generate a larger centrifugal force, and at the same time the agitator plate 185 stops rotating or rotates slowly, changing the distribution and movement trajectory of the metal ions in the electroplating solution. Before the electroplating operation, the tooling connecting rod frame 1 is firmly connected to the external electroplating rack at the top to ensure the stability and conductivity of the connection part (the external power supply is connected to the anode end 175 and the cathode end 175, respectively). Then, when the whole device is immersed in the electroplating tank with the cooperation of the external electroplating rack, the tooling connecting rod rack 1 descends with the rack, driving the whole device connected below it to enter the working position in the electroplating tank, so that the connecting fixture 13 is automatically connected to the docking piece at the bottom of the electroplating tank, ensuring the stability of the position of the whole device in the electroplating tank. During the immersion process, the electric-controlled iris valve 11 inside the bottom end of the bottom cover 8 is in a closed state to prevent the electroplating solution from entering the bottom cover 8 too early. The liquid level sensor is in real time Monitor the liquid level in the electroplating tank. When the device is completely immersed in the electroplating tank and reaches the preset electroplating operation liquid level, the electric-controlled iris valve 11 automatically opens according to the signal of the liquid level sensor, allowing the electroplating liquid to slowly flow into the bottom cover 8 and the electroplating operation chamber 6. If the centrifugal electrode plate 181 in the wafer electroplating auxiliary component 18 needs to work, the centrifugal control motor 2 starts according to the command of the built-in logic controller, and drives the centrifugal electrode plate 181 or the agitator plate 185 to rotate through the first fixed wire end 3 and the wire rope 4 to achieve stirring of the electroplating liquid.

[0032] The wiring diagram of the centrifugal control motor 2, the angle control forward and reverse motor 53, the rotation control motor 56, the rotation adjustment motor 590, the photoelectric sensor, the ultrasonic control sensor 155, the control brushless motor 171, the magnetic field generator 182 and the magnetic field sensor 184 in the present invention is common knowledge in the field, and its working principle is a well-known technology. The model is selected according to the actual use. Therefore, the control method and wiring arrangement of the centrifugal control motor 2, the angle control forward and reverse motor 53, the rotation control motor 56, the rotation adjustment motor 590, the photoelectric sensor, the ultrasonic control sensor 155, the control brushless motor 171, the magnetic field generator 182 and the magnetic field sensor 184 will no longer be explained in detail.

[0033] Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An electroplating tool for a coating device, characterized in that: Included are: An electroplating operation chamber (6), which is installed between the top cover (7) and the bottom cover (8), and is used for protecting the wafer during electroplating operation and controlling the volume of the electroplating liquid entering the chamber; A dynamic electroplating point uniformity control component (5) is installed at the bottom of the tooling connecting rod frame (1) and is used to control the cathode end (595) at the front end during the electroplating operation so that it can move along with the position changes of various points on the surface of the wafer, thereby ensuring that the electric field strength between the cathode and anode is distributed as evenly as possible in various areas of the wafer; Ultrasonic control components (15) are formed into multiple groups and installed inside the electroplating operation chamber (6) to enable ultrasonic waves to form two modes, namely, flat wave and concentrated wave, according to different states of wafer electroplating, thereby improving wafer electroplating efficiency; A positive electrode control component (17) is located on the side of the top rotating ring groove plate (14) and is used to adaptively adjust the position of the anode terminal (175) according to the electric field distribution on the wafer surface and the electroplating progress when the whole is in the electroplating tank, so that the distance and relative position between the anode terminal (175) and the wafer are always maintained in an optimal state, thereby optimizing the electric field distribution; The wafer electroplating auxiliary component (18) is located in the inner cavity of the electroplating operation chamber (6) and assists in improving the uniformity of the wafer electroplating according to the operation status of the wafer electroplating.

2. The electroplating tool for a film coating device according to claim 1, characterized in that: The dynamic electroplating point uniformity control component (5) comprises: An annular guide rail (51), a propulsion guide rod (52), an angle control forward and reverse motor (53) and a waist connecting rod (54), wherein the annular guide rail (51) is fastened to the bottom of a tool connecting rod frame (1), the propulsion guide rod (52) is located inside the annular guide rail (51) and is slidably connected, the angle control forward and reverse motor (53) is located at the bottom of the propulsion guide rod (52) and drives the waist connecting rod (54) to form an angle controlled rotation, and a steering position plate (55) is installed at the bottom of the waist connecting rod (54).

3. The electroplating tool for a film coating device according to claim 2, characterized in that: A rotation control motor (56) is installed at the top of the steering position plate (55), a vertical rod (57) is fastened to the bottom of the steering position plate (55), a guide rail (58) is fastened to the bottom side of the vertical rod (57), a control motor (59) is installed at the top of the guide rail (58), a sliding edge (596) is installed on the side of the guide rail (58), a high-precision lead screw (597) is connected to the bottom output end of the control motor (59), and a photoelectric position displacement seat (598) is slidably connected to the outside of the high-precision lead screw (597), and the photoelectric position displacement seat (598) is composed of a photoelectric sensor and a displacement seat.

4. The electroplating tool for a film coating device according to claim 3, characterized in that: The side end of the photoelectric position displacement seat (598) is fastened with a rotation adjustment motor (590), the output end of the rotation adjustment motor (590) is connected to a conduction rod (592), the side end of the rotation adjustment motor (590) is installed with a side bending rod (591), the side end of the conduction rod (592) is connected to a ball joint (593), the side end of the ball joint (593) is connected to a distance adjustment guide rod (594), and the cathode end (595) is located at the side end of the distance adjustment guide rod (594) and is fastened.

5. The electroplating tool for a film coating device according to claim 1, characterized in that: The ultrasonic control component (15) comprises: A control seat (151), an array ultrasonic transducer (152), an ultrasonic generator (153), a focusing control structure (154), and an ultrasonic control sensor (155) are installed. The control seat (151) drives the array ultrasonic transducer (152) and related structures to be located inside the electroplating operation chamber (6) to form a surrounding arrangement. The array ultrasonic transducer (152) drives the ultrasonic generator (153) to adopt a plane wave emission mode in the early stage of electroplating to uniformly stir the plating solution as a whole. When high-precision electroplating is required for a specific area of ​​the wafer, the focusing control structure (154) is used to switch to a focused wave emission mode to focus ultrasonic energy on the area, thereby enhancing local mass transfer and electroplating effects.

6. The electroplating tool for a film coating device according to claim 1, characterized in that: The positive electrode regulating component (17) comprises: A control brushless motor (171), a transmission gear (172), an outer gear ring (173) and an electrode guide rod (174); the control brushless motor (171) is installed in a surface protective shell of a top rotating ring groove plate (14); the control brushless motor (171) drives the transmission gear (172) and the outer gear ring (173) to form a meshing connection; the outer gear ring (173) is located in a side ring groove of the top rotating ring groove plate (14) to form a rotational connection; the inner diameter surface of the outer gear ring (173) is surrounded and fastened with an electrode guide rod (174); the electrode guide rod (174) and an anode terminal (175) are fastened to each other; the anode terminal (175) is located inside the electroplating operation cavity groove (6) to form a ring-shaped adjustment operation.

7. The electroplating tool for a film coating device according to claim 1, characterized in that: The wafer electroplating auxiliary component (18) comprises: A centrifugal electrode plate (181), a magnetic field generator (182), an electromagnetic control coil (183), a magnetic field sensor (184) and a stirrer plate (185); the centrifugal electrode plate (181) and the stirrer plate (185) are connected via an electromagnetic clutch; the magnetic field generator (182) is formed into multiple groups and is fastened to the outside of the centrifugal electrode plate (181); and the electromagnetic control coil (183) is installed inside the magnetic field generator (182).

8. The electroplating tool for a film coating device according to claim 1, characterized in that: The tooling connecting rod frame (1) is used to form a connection with an external electroplating rack at the top when electroplating is performed, so that the entire device can be immersed in the electroplating tank with the cooperation of the external electroplating rack. A centrifugal control motor (2) is installed inside the tooling connecting rod frame (1), and the bottom output end of the centrifugal control motor (2) is connected to a first fixed line end (3).

9. The electroplating tool for a film coating device according to claim 8, characterized in that: The two ends of the bottom of the first fixed line end (3) are wound with a wire rope (4), the bottom of the wire rope (4) passes through the agitator plate (185) and is connected to the second fixed line end (12), and the bottom of the second fixed line end (12) is installed with a connecting fixture (13), and the connecting fixture (13) is used to form an automatic connection with the docking fixture at the bottom of the electroplating tank after the whole is immersed in the electroplating tank.

10. The electroplating tool for a film coating device according to claim 1, characterized in that: An electrically controlled iris valve (11) is installed inside the bottom end of the bottom cover (8), a liquid level sensor is installed on the surface of the electrically controlled iris valve (11), a fastener (9) is fastened to the bottom of the bottom cover (8), and a wire core plug (10) is connected to the center end of the fastener (9).

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