Electric connection structure and electronic equipment

Abstract

The invention discloses an electric connection structure and electronic equipment, and belongs to the technical field of communication. The electric connection structure comprises an elastic supporting layer and a conductive layer which are connected, the elastic supporting layer surrounds to form a first deformation space, the conductive layer surrounds the elastic supporting layer, the surface, back to the elastic supporting layer, of the conductive layer comprises a first contact surface and a second contact surface, and the first contact surface and the second contact surface are back to back. And the first contact surface and the second contact surface are respectively used for electrically connecting the first component and the second component, so that the first component and the second component are electrically connected through the conductive layer. The electronic equipment comprises a first component, a second component and the electric connection structure, the electric connection structure is located between the first component and the second component, and the first component and the second component are electrically connected through the electric connection structure.

Description

Technical Field

[0001] The present application belongs to the field of communication technology, and specifically relates to an electrical connection structure and an electronic device. Background Art

[0002] In the field of communication technology, an electrical connection structure such as conductive foam is provided between a display screen and a metal frame of an electronic device. The electrical connection structure in a compressed state is electrically connected to the display screen and the metal frame respectively, and the metal frame is grounded.

[0003] However, with the development of electronic devices becoming thinner and lighter, the working gap between the display screen and the metal frame is reduced, and higher compression performance and resilience performance of the electrical connection structure are required. The existing electrical connection structure is difficult to meet this requirement. Summary of the invention

[0004] The purpose of the embodiments of the present application is to provide an electrical connection structure and an electronic device, which can solve the problem in the related art that the electrical connection structure has poor compression performance and rebound performance, which easily leads to electrical connection failure.

[0005] In a first aspect, an embodiment of the present application provides an electrical connection structure, comprising an elastic support layer and a conductive layer connected to each other, wherein the elastic support layer surrounds to form a first deformation space, and the conductive layer surrounds the elastic support layer. The surface of the conductive layer facing away from the elastic supporting layer includes a first contact surface and a second contact surface, the first contact surface and the second contact surface are opposite to each other, and the first contact surface and the second contact surface are respectively used to electrically connect the first component and the second component so that the first component and the second component are electrically connected through the conductive layer.

[0006] In a second aspect, an embodiment of the present application further provides an electronic device, comprising a first component, a second component and the above-mentioned electrical connection structure, wherein the electrical connection structure is located between the first component and the second component, and the first component and the second component are electrically connected through the electrical connection structure.

[0007] In the embodiment of the present application, an electrical connection structure formed by an elastic support layer and a conductive layer is used to replace the existing conductive foam, and the first component and the second component are electrically connected through the conductive layer. At the same time, the elastic support layer surrounds to form a first deformation space. The first deformation space makes the electrical connection structure a hollow structure. Therefore, when the electrical connection structure is compressed, the electrical connection structure is more likely to deform. Since the elastic support layer has elastic properties, the electrical connection structure is also easier to restore elastic deformation. Therefore, in order to meet the needs of thinning electronic equipment, even if the working gap between the first component and the second component is reduced, the electrical connection structure improves the elastic deformation capacity through the first deformation space, ensures the compression performance and rebound performance, avoids the problem of poor rebound effect due to increased compression of the conductive foam with a solid structure, and ensures the stability of the electrical connection state.

[0008] Moreover, when the first component is a display screen, since the elastic deformation capacity and resilience performance of the electrical connection structure are improved, the electrical connection structure is easier to produce elastic deformation. Therefore, when the display screen is pre-pressed, in order to trigger the corresponding function, the pre-pressure applied to the display screen can be smaller, avoiding problems such as top printing and white spots on part of the display screen. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 It is a schematic diagram of the structure of the elastic support layer, the conductive layer and the second connecting glue disclosed in the embodiment of the present application; Figure 2 It is a schematic diagram of the structure of the elastic support layer, the conductive layer, the first connecting glue, the second connecting glue and the insulating connecting glue disclosed in the embodiment of the present application; Figure 3 yes Figure 2 a top view of the structure shown; Figure 4 This is a schematic diagram of the structure of the electrical connection structure wrapped around the support rod disclosed in the embodiment of the present application; Figure 5 is a schematic diagram of the structure after the electrical connection structure disclosed in the embodiment of the present application is separated from the support rod; Figure 6 It is a schematic diagram of the cooperation between the electrical connection structure and the metal frame in an uncompressed state disclosed in the embodiment of the present application; Figure 7 It is a schematic diagram of the cooperation between the electrical connection structure in a compressed state and the metal frame disclosed in the embodiment of the present application; Figure 8 is a cross-sectional view of an electronic device disclosed in an embodiment of the present application; Fig. 9 yes Figure 8 The enlarged view of point A in the middle; Fig.10 It is a cross-sectional view of the electronic device disclosed in the embodiment of the present application.

[0010] Description of reference numerals: 10-electrical connection structure, 10a-first deformation space, 10b-second deformation space, 100-elastic supporting layer, 100a-first edge, 100b-second edge, 100c-opening, 101-first opening, 200 - conductive layer, 200a - first contact surface, 200b - second contact surface, 210 - first end, 220 - second end, 201 - second opening, 300-first connection glue, 400-Insulation joint glue, 500-second connecting glue, S-support rod, A-first direction, B-second direction, 20-second component, 21-gold-plated sheet, 30 - first component, 31 - reinforcing sheet, 32 - second nickel plating layer. DETAILED DESCRIPTION

[0011] The following will be combined with the drawings in the embodiments of the present application to clearly describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments in the present application belong to the scope of protection of this application.

[0012] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0013] The electrical connection structure and the electronic device provided in the embodiments of the present application are described in detail below through specific embodiments and their application scenarios in conjunction with the accompanying drawings.

[0014] Please refer to Figure 1-Figure 10The electrical connection structure 10 disclosed in the embodiment of the present application is applied to electronic equipment, and is mainly used to electrically connect the first component 30 and the second component 20 inside the electronic equipment. When the first component 30 or the second component 20 is compressed, the electrical connection structure 10 can produce elastic deformation to ensure that the first component 30 and the second component 20 are continuously electrically connected. Among them, the first component 30 can be a display screen, and the second component 20 can be a metal frame, which is in a grounded state. Of course, the first component 30 and the second component 20 can also be other components other than the display screen and the metal frame.

[0015] Specifically, refer to Figure 1 and Figure 2 As shown, the electrical connection structure 10 includes a connected elastic support layer 100 and a conductive layer 200, the elastic support layer 100 and the conductive layer 200 are stacked, the elastic support layer 100 has elastic properties and is used to support the conductive layer 200, the conductive layer 200 is used to electrically connect the first component 30 and the second component 20, optionally, the conductive layer 200 can directly contact the first component 30 and the second component 20, or the conductive layer 200 is not in direct contact with the first component 30 and the second component 20, and the conductive layer 200 is electrically connected to the first component 30 and the second component 20 by contacting other components.

[0016] refer to Figure 8 and Fig. 9 As shown, the elastic supporting layer 100 surrounds to form the first deformation space 10a, and the conductive layer 200 surrounds the elastic supporting layer 100. Optionally, the elastic supporting layer 100 is an annular structure, the two ends of the elastic supporting layer 100 are in contact, and the elastic supporting layer 100 surrounds to form a closed first deformation space 10a, or there is a gap between the two ends of the elastic supporting layer 100, and the elastic supporting layer 100 surrounds to form an open first deformation space 10a; the conductive layer 200 can be an annular structure, the two edges of the conductive layer 200 are in contact, or there is a gap between the two edges of the conductive layer 200.

[0017] Optionally, the elastic support layer 100 can be a PI (polyimide) layer, which is an electrical insulation layer with excellent high temperature resistance, chemical stability and electrical insulation performance. Of course, the elastic support layer 100 can also be made of other materials; the conductive layer 200 is a metal structure, specifically a rolled copper foil, and copper has strong conductivity. Of course, the conductive layer 200 can also be made of other metal structures with conductive properties other than copper.

[0018] refer to Fig. 9As shown, the surface of the conductive layer 200 facing away from the elastic supporting layer 100 includes a first contact surface 200a and a second contact surface 200b, the first contact surface 200a and the second contact surface 200b are opposite to each other, and the first contact surface 200a and the second contact surface 200b are respectively used to electrically connect the first component 30 and the second component 20, so that the first component 30 and the second component 20 are electrically connected through the conductive layer 200. Optionally, the first contact surface 200a is parallel to the second contact surface 200b, the first component 30 is a display screen, and the second component 20 is a metal frame, the first contact surface 200a can be in direct contact with the display screen to achieve electrical connection, and the second contact surface 200b can be in direct contact with the metal frame to achieve electrical connection. In the embodiment of the present application, an electrical connection structure 10 formed by an elastic support layer 100 and a conductive layer 200 is used to replace the existing conductive foam, and the first component 30 and the second component 20 are electrically connected through the conductive layer 200. At the same time, the elastic support layer 100 surrounds to form a first deformation space 10a. The first deformation space 10a makes the electrical connection structure 10 a hollow structure. Therefore, when the electrical connection structure 10 is under pressure, the electrical connection structure 10 is more likely to deform. Since the elastic support layer 100 has elastic properties, the electrical connection structure 10 is also easier to restore elastic deformation.

[0019] Therefore, in order to meet the need for thinner and lighter electronic devices, even if the working gap between the first component 30 and the second component 20 is reduced, the electrical connection structure 10 improves the elastic deformation capacity through the first deformation space 10a to ensure the compression performance and rebound performance, avoids the problem of poor rebound effect due to increased compression of the conductive foam with a solid structure, and ensures the stability of the electrical connection state.

[0020] In an alternative embodiment, reference Figure 6 As shown, when the electrical connection structure 10 is in an uncompressed state, the elastic support layer 100 surrounds and forms a second deformation space 10b; Figure 7-Figure 9 As shown, when the electrical connection structure 10 is in a compressed state, the elastic supporting layer 100 surrounds and forms a first deformation space 10a, and the height of the first deformation space 10a is smaller than the height of the second deformation space 10b.

[0021] That is to say, before the electrical connection structure 10 is installed in the working gap between the first component 30 and the second component 20, the electrical connection structure 10 is not compressed, and the height of the deformation space inside it is relatively large, so the space available for deformation is relatively large, and it is more convenient to design the combined structure of the conductive layer 200 and the elastic support layer 100; after further compression, the height of the deformation space inside the electrical connection structure 10 is reduced to adapt to the smaller working gap, ensuring that the electrical connection structure 10 is smoothly installed between the first component 30 and the second component 20, which is conducive to compensating for the design tolerance of the working gap and ensuring that the first component 30 and the second component 20 are smoothly electrically connected. At the same time, it does not affect the further elastic deformation of the electrical connection structure 10.

[0022] Of course, in other embodiments, the elastic supporting layer 100 may not be compressed, and the elastic supporting layer 100 directly surrounds and forms the first deformation space 10a.

[0023] In an optional embodiment, the elastic supporting layer 100 can be formed into an annular integrated structure by injection molding or other methods.

[0024] In another embodiment, reference Figure 1 and Figure 2 As shown, the elastic supporting layer 100 has a first edge 100a and a second edge 100b; Figure 8 and Fig. 9 As shown, the elastic supporting layer 100 is bent so that the first edge 100a and the second edge 100b are opposite to each other and an opening 100c is formed therebetween. The conductive layer 200 is located at the periphery of the elastic supporting layer 100 and closes the opening 100c.

[0025] Optionally, the first edge 100a and the second edge 100b are opposite to each other along a first direction A, and the first direction A is parallel to the first contact surface 200a. Further optionally, the first direction A may be the length direction of the elastic supporting layer 100 and the conductive layer 200, the first direction A may also be the width direction of the elastic supporting layer 100 and the conductive layer 200, and of course, the first direction A may also be other directions except the length direction and the width direction.

[0026] Optionally, the elastic supporting layer 100 can be a square structure, and the portion of the elastic supporting layer 100 with the first edge 100a is bent, and the portion of the elastic supporting layer 100 with the second edge 100b is also bent, so that the first edge 100a and the second edge 100b are relative to each other, and the first edge 100a and the second edge 100b form an opening 100c, so that the elastic supporting layer 100 is surrounded to form a first deformation space 10a.

[0027] According to this embodiment, the elastic supporting layer 100 can be formed into the first deformation space 10a by bending the sheet structure, without directly adopting an integrated ring structure in the initial stage, which is conducive to reducing the difficulty of the process.

[0028] In an optional embodiment, the conductive layer 200 is formed into a ring-shaped integrated structure by casting or other methods.

[0029] In another embodiment, the conductive layer 200 is provided with a first end 210 and a second end 220, the first end 210 extends from the first edge 100a to the side where the second edge 100b is located, and the second end 220 extends from the second edge 100b to the side where the first edge 100a is located, that is, along the first direction A, the size of the conductive layer 200 is larger than the size of the elastic support layer 100.

[0030] Optionally, the conductive layer 200 may be a square structure, and the conductive layer 200 is bent and wrapped around with the elastic supporting layer 100 as support, so that the first end 210 and the second end 220 can be connected.

[0031] refer to Figure 8 and Fig. 9 As shown, the surface of the first end 210 and the surface of the second end 220 are fitted and connected to close the opening 100c. That is, the two side edges of the elastic support layer 100 are bent and arranged to form an open first deformation space 10a, and the two ends of the conductive layer 200 are extended and connected to form a ring structure, and the conductive layer 200 closes the first deformation space 10a. Optionally, the surface of the first end 210 and the surface of the second end 220 can be fitted and connected by welding, bonding, etc.

[0032] With this embodiment, the conductive layer 200 can be formed into a ring structure by bending a sheet structure and connecting two ends. There is no need to directly adopt an integrated ring structure in the initial stage, which is beneficial to reducing the difficulty of the process. Moreover, bending the conductive layer 200 based on the elastic support layer 100 is beneficial to a higher fit between the conductive layer 200 and the elastic support layer 100. The two are smoothly fitted and connected, so that the elastic support layer 100 better supports the conductive layer 200 and avoids deformation of the conductive layer 200 relative to the elastic support layer 100.

[0033] In a further embodiment, the surface of the first end portion 210 facing away from the elastic support layer 100 is provided with a first connecting adhesive 300, and the surface of the first end portion 210 and the surface of the second end portion 220 are connected by the first connecting adhesive 300. Optionally, the first connecting adhesive 300 may be, but is not limited to, a hot melt adhesive; Figure 3As shown, the elastic support layer 100 and the first connecting adhesive 300 both extend along the second direction B, and the second direction B may be the length direction of the elastic support layer 100 . Thus, the connection area between the first end 210 and the second end 220 is increased, which is beneficial to improving the connection stability.

[0034] With this embodiment, the first end 210 and the second end 220 are softly connected by the first connecting glue 300, which is more conducive to adapting to the elastic deformation process of the electrical connection structure 10. There is no need to set up an installation base for the first end 210 and the second end 220, avoiding the use of welding, bolt connection, etc. to affect the elastic deformation process of the electrical connection structure 10.

[0035] Of course, in other embodiments, the surface of the first end portion 210 and the surface of the second end portion 220 may be connected in other ways.

[0036] In an alternative embodiment, reference Figure 1-Figure 2 as well as Figure 8-Figure 9 As shown, the electrical connection structure 10 further includes a second connection adhesive 500, and the surface of the elastic support layer 100 and the surface of the conductive layer 200 are connected by the second connection adhesive 500. Optionally, the second connection adhesive 500 may be, but is not limited to, a hot melt adhesive; the second connection adhesive 500 may extend along a second direction B, and the second direction B is the length direction of the elastic support layer 100, so that the connection area between the elastic support layer 100 and the conductive layer 200 is increased, which is conducive to improving the connection stability.

[0037] With this embodiment, the elastic support layer 100 and the conductive layer 200 are softly connected through the second connecting glue 500, which is more conducive to adapting to the elastic deformation process of the electrical connection structure 10. There is no need to set up an installation base for the elastic support layer 100 and the conductive layer 200, avoiding the use of welding, bolt connection and other methods to affect the elastic deformation process of the electrical connection structure 10.

[0038] Of course, in other embodiments, the surface of the elastic supporting layer 100 and the surface of the conductive layer 200 may be connected in other ways.

[0039] In an optional embodiment, a conductive connecting glue is provided on the surface of the second end portion 220 facing away from the elastic supporting layer 100, and the conductive connecting glue is used to connect the conductive layer 200 and the second component 20. Optionally, the second component 20 is a metal frame, and a gold-plated sheet 21 is provided on the surface of the metal frame, and the conductive connecting glue directly connects the gold-plated sheet 21 and the conductive layer 200.

[0040] In another embodiment, reference Figure 8 and Fig. 9As shown, the surface of the second end portion 220 facing away from the elastic support layer 100 is provided with an insulating connecting glue 400, and the insulating connecting glue 400 is used to connect the conductive layer 200 and the second component 20. Optionally, the insulating connecting glue 400 directly connects the gold-plated sheet 21 and the conductive layer 200; Fig. 9 As shown, the second contact surface 200 b is divided into two parts, which are respectively adjacent to the first end 210 and the second end 220 , and the two parts are respectively connected to the second component 20 to achieve electrical connection between the conductive layer 200 and the second component 20 .

[0041] Although the conductive connecting glue can achieve conductive connection, the impedance of the connecting glue is relatively large, which is not conducive to the electrical connection between the second end 220 and the second component 20. Therefore, this embodiment directly insulates the second end 220 from the second component 20 through the insulating connecting glue 400 to avoid direct electrical connection between the second end 220 and the second component 20, thereby ensuring that the conductive layer 200 is fully electrically connected to the second component 20 through the second contact surface 200b, thereby improving the stability of the electrical connection.

[0042] In an optional embodiment, a plated layer is provided on the surface of the conductive layer 200, and the plated layer includes at least one of a gold plated layer and a nickel plated layer. Specifically, the surface of the conductive layer 200 may be provided with only a gold plated layer, or only a nickel plated layer, or both a gold plated layer and a nickel plated layer. Optionally, the surface of the conductive layer 200 may be provided with a nickel plated layer first, and then a gold plated layer.

[0043] By adopting this embodiment, the chemical properties of gold and nickel are more stable, and the oxidation resistance and corrosion resistance are stronger. It is not easy to be chemically corroded by salt spray and sweat. The gold-plated layer and the first nickel-plated layer are not easy to oxidize and fall off. It is more conducive to fully electrically connecting the conductive layer 200 with the metal frame, and also conducive to fully electrically connecting the conductive layer 200 with the display screen, which is conducive to improving the stability of the electrical connection.

[0044] Of course, in other embodiments, the surface of the conductive layer 200 may not be provided with a plating layer, and the conductive layer 200 is directly electrically connected to the metal frame, and the conductive layer 200 is directly electrically connected to the display screen.

[0045] In the scheme of this application, reference is made to Figure 3-Figure 6 As shown, the elastic support layer 100 is provided with a first opening 101, and at least a portion of the first opening 101 is also located between the first contact surface 200a and the second contact surface 200b. The conductive layer 200 is provided with a second opening 201, and at least a portion of the second opening 201 is located between the first contact surface 200a and the second contact surface 200b. The first opening 101 is opposite to and connected to the second opening 201.

[0046] Specifically, a portion of the first opening 101 and a portion of the second opening 201 may be located between the first contact surface 200a and the second contact surface 200b, in which case both ends of the second opening 201 extend to the first contact surface 200a and the second contact surface 200b, respectively; or, the entire first opening 101 and the entire second opening 201 are both located between the first contact surface 200a and the second contact surface 200b, in which case the second opening 201 is not provided on the first contact surface 200a and the second contact surface 200b.

[0047] Optionally, the first opening 101 and the second opening 201 can be opened by a die-cutting process or other processes. The first opening 101 and the second opening 201 can both be circular holes, square holes, bar holes, etc. The embodiment of the present application does not limit the specific structure of the first opening 101 and the second opening 201; the shapes and sizes of the first opening 101 and the second opening 201 can be the same or different.

[0048] In this embodiment, by providing the first opening 101 and the second opening 201, the area of ​​the elastic support layer 100 and the conductive layer 200 between the first contact surface 200a and the second contact surface 200b is reduced, so when the same force is applied to the electrical connection structure 10, the elastic support layer 100 is more likely to produce elastic deformation, which is beneficial to improving the elastic deformation performance of the elastic support layer 100, and then it is easier to restore the elastic deformation, which is beneficial to improving the resilience performance of the electrical connection structure 10. Moreover, by providing the first opening 101, it is beneficial to reduce the stress inside the elastic support layer 100; by providing the second opening 201, it is beneficial to reduce the stress inside the conductive layer 200.

[0049] In this embodiment, the first opening 101 and the second opening 201 are both strip holes. The first opening 101 can extend along the length direction of the elastic support layer 100, and the second opening 201 can extend along the length direction of the conductive layer 200, or the first opening 101 can extend along the width direction of the elastic support layer 100, and the second opening 201 can extend along the width direction of the conductive layer 200; the first opening 101 and the second opening 201 have the same shape and are equal in size, and the edge of the first opening 101 is opposite to the edge of the second opening 201.

[0050] Of course, in other embodiments, the elastic supporting layer 100 may not be provided with the first opening 101 , and the conductive layer 200 may not be provided with the second opening 201 .

[0051] In an optional embodiment, the number of the first opening 101 and the number of the second opening 201 may both be one.

[0052] In another embodiment, a plurality of first openings 101 and second openings 201 are arranged at intervals, the first openings 101 and second openings 201 correspond to each other one by one, and each first opening 101 is opposite to and connected with the corresponding second opening 201. Optionally, the first openings 101 and second openings 201 may be evenly distributed or unevenly distributed, and the shapes of the first openings 101 and the second openings 201 may be the same and the sizes may be equal; the first openings 101 and second openings 201 may also be arranged at intervals in a plurality along only one direction, or may be arranged at intervals in a plurality along different directions.

[0053] By adopting this embodiment, the number of the first openings 101 and the second openings 201 is increased, which is beneficial to further reduce the stress inside the elastic support layer 100 and the conductive layer 200, and the elastic support layer 100 is more likely to produce elastic deformation, which is beneficial to further improve the elastic deformation performance and resilience performance of the elastic support layer 100.

[0054] In a further embodiment, reference Figure 5 and Figure 6 As shown, the first opening 101 and the second opening 201 are arranged in at least two directions, including an intersecting first direction A and a second direction B. The first direction A and the second direction B are parallel to the first contact surface 200a, respectively, and the first direction A and the second direction B are also parallel to the second contact surface 200b, respectively. Optionally, the first direction A and the second direction B may be perpendicular to each other, or the first direction A and the second direction B may intersect but not be perpendicular to each other.

[0055] Further optionally, the first direction A can be the width direction of the electrical connection structure 10, and the second direction B can be the length direction of the electrical connection structure 10. Along the first direction A, the elastic support layer 100 is provided with two rows of first openings 101, and each row of first openings 101 is distributed at intervals along the second direction B, and the conductive layer 200 is provided with two rows of second openings 201, and each row of second openings 201 is distributed at intervals along the second direction B.

[0056] In this way, the first opening 101 and the second opening 201 are spaced apart along different directions, which is beneficial to further increase the number of the first opening 101 and the second opening 201, further reduce the stress inside the elastic support layer 100 and the conductive layer 200, and also beneficial to further improve the elastic deformation performance and resilience performance of the electrical connection structure 10.

[0057] Of course, in other embodiments, the first opening 101 and the second opening 201 are spaced apart in only one direction, and the first opening 101 and the second opening 201 are spaced apart along the first direction A or the second direction B, respectively.

[0058] In this embodiment, reference Figure 6As shown, along the first direction A, the elastic support layer 100 is provided with two rows of first openings 101, each row of first openings 101 includes a plurality of first openings 101 spaced apart along the second direction B, the number of the two rows of first openings 101 is equal and corresponds one to one, wherein each first opening 101 in one row is respectively opposite to the corresponding first opening 101 in the other row through the first deformation space 10a, that is, two first openings 101 are spaced apart along the first direction A; along the first direction A, the conductive layer 200 is provided with two rows of second openings 201, each row of second openings 201 includes a plurality of second openings 201 spaced apart along the second direction B, the number of the two rows of second openings 201 is equal and corresponds one to one, wherein each second opening 201 in one row is respectively opposite to the corresponding second opening 201 in the other row through the first deformation space 10a, that is, two second openings 201 are spaced apart along the first direction A.

[0059] Based on the electrical connection structure 10 disclosed in the present application, the present application also discloses an electronic device, which includes the electrical connection structure 10 in the above embodiment. The electrical connection structure 10 is located between the first component 30 and the second component 20, and the first component 30 and the second component 20 are electrically connected through the electrical connection structure 10.

[0060] According to the present embodiment, the electrical connection structure 10 of the electronic device includes a conductive layer 200 and an elastic support layer 100. The electrical connection structure 10 replaces the existing solid conductive foam. The interior of the electrical connection structure 10 is a hollow structure. When the first component 30 is under pressure, the electrical connection structure 10 is more likely to deform. Since the elastic support layer 100 has elastic properties, the electrical connection structure 10 is also easier to restore elastic deformation. The rebound performance is improved, thereby ensuring the stability of the electrical connection state of the electronic device.

[0061] In an alternative embodiment, reference Fig.10 As shown, the first component 30 is a display screen, and a reinforcing sheet 31 is provided on the surface of the display screen. The reinforcing sheet 31 can be a steel sheet, and the first contact surface 200a is in direct contact with the reinforcing sheet 31, and the conductive layer 200 is electrically connected to the display screen through the reinforcing sheet 31, and the second component 20 is a metal frame. Optionally, the reinforcing sheet 31 is provided with a second nickel-plated layer 32, and the first contact surface 200a is in contact with the second nickel-plated layer 32; the surface of the metal frame is provided with a gold-plated sheet 21, and the gold-plated sheet 21 is in direct contact with the second contact surface 200b, and the conductive layer 200 is electrically connected to the metal frame through the gold-plated sheet 21, or the electronic device is not provided with a gold-plated sheet 21, and the surface of the metal frame is directly gold-plated, and the second contact surface 200b is in direct contact with the gold-plated position of the metal frame. In this way, the electrical connection structure 10 is compressed between the display screen and the metal frame, and the display screen and the metal frame are electrically connected through the electrical connection structure 10 in this application.

[0062] With such arrangement, since the elastic deformation ability and rebound performance of the electrical connection structure 10 are improved, the electrical connection structure 10 is easier to produce elastic deformation. Therefore, when the display screen is pre-pressed, in order to trigger the corresponding function, the pre-pressure applied to the display screen can be smaller, avoiding problems such as top printing and white spots on the local part of the display screen.

[0063] In summary, in order to achieve the thinness and lightness of electronic devices, reference Fig.10 As shown, the working gap D between the reinforcing sheet 31 and the metal frame can be 0.15mm-0.25mm. The process of designing the electrical connection structure 10 is as follows: a PI layer is used as the elastic support layer 100, a copper foil with a thickness of 4um is used as the conductive layer 200, and the copper foil is nickel-plated and gold-plated in sequence, the nickel plating thickness is 1um-3um, and the gold plating thickness is 0.05 um-0.1um, and then the PI layer and the copper foil are bonded and connected by hot melt adhesive (i.e., the second connecting adhesive 500), and the thickness of the hot melt adhesive is 4um, refer to Figure 1 As shown; when laminating, the first part, i.e., the first end 210 and the second end 220, are reserved on both sides of the copper foil, and then a hot melt adhesive (i.e., the second connecting adhesive 500) is set on the surface of the first end 210 facing away from the PI layer, and an insulating connecting adhesive 400 is set on the surface of the second end 220 facing away from the PI layer, refer to Figure 2 As shown, the thickness of the hot melt adhesive is 1 um, and it has strong bonding and shearing capabilities, and the thickness of the insulating connecting adhesive 400 is 10 um.

[0064] Will Figure 2 The laminated coil shown in the figure is provided with a plurality of openings by a die-cutting process, that is, a first opening 101 is provided on the PI layer, and a second opening 201 is provided on the copper foil. Figure 3 Then use the support rod S as a support, the laminated coil wraps the support rod S, so that the first end 210 and the second end 220 are connected by hot melt adhesive, the electrical connection structure 10 forms a ring structure, and surrounds the second deformation space 10b, reference Figure 4 As shown, at this time, the height of the electrical connection structure 10 is greater than or equal to 0.6 mm. Optionally, the height of the electrical connection structure 10 is 1 mm. After the bonding is finalized, the support rod S is pulled out and the support rod S is separated from the electrical connection structure 10. Figure 5 shown.

[0065] The electrical connection structure 10 is mounted on the metal frame, and the second end portion 220 is connected to the metal frame by an insulating connection adhesive 400. Figure 6 After installation, apply force to the electrical connection to compress it to a height of 0.2mm-0.25mm. Figure 7As shown, at this time, the electrical connection structure 10 is surrounded by a first deformation space 10a, and finally the display screen and the reinforcing sheet 31 are installed to the metal frame so that the electrical connection structure 10 is in direct contact with the reinforcing sheet 31. During this process, the electrical connection structure 10 can also produce a certain degree of elastic deformation to meet the design tolerance requirements of the working gap D, thereby ensuring that the display screen and the metal frame are smoothly electrically connected through the electrical connection structure 10 and improving the reliability of the electrical connection. The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. An electrical connection structure, characterized in that: The invention comprises a connected elastic support layer (100) and a conductive layer (200), wherein the elastic support layer (100) surrounds to form a first deformation space (10a), and the conductive layer (200) is arranged around the elastic support layer (100). The surface of the conductive layer (200) facing away from the elastic support layer (100) comprises a first contact surface (200a) and a second contact surface (200b), the first contact surface (200a) and the second contact surface (200b) being opposite to each other, and the first contact surface (200a) and the second contact surface (200b) being respectively used for electrically connecting a first component (30) and a second component (20), so that the first component (30) and the second component (20) are electrically connected via the conductive layer (200).

2. The electrical connection structure according to claim 1, characterized in that: The elastic supporting layer (100) is provided with a first edge (100a) and a second edge (100b); the elastic supporting layer (100) is bent so that the first edge (100a) and the second edge (100b) are opposite to each other and an opening (100c) is formed therebetween; the conductive layer (200) is located at the periphery of the elastic supporting layer (100), and the conductive layer (200) closes the opening (100c).

3. The electrical connection structure according to claim 2, characterized in that: The conductive layer (200) is provided with a first end (210) and a second end (220), the first end (210) extending from the first edge (100a) to the side where the second edge (100b) is located, the second end (220) extending from the second edge (100b) to the side where the first edge (100a) is located, and the surface of the first end (210) and the surface of the second end (220) are fitted and connected to close the opening (100c).

4. The electrical connection structure according to claim 3, characterized in that: A first connecting adhesive (300) is provided on the surface of the first end portion (210) facing away from the elastic supporting layer (100), and the surface of the first end portion (210) and the surface of the second end portion (220) are connected via the first connecting adhesive (300); And / or, a surface of the second end portion (220) facing away from the elastic supporting layer (100) is provided with an insulating connecting adhesive (400), and the insulating connecting adhesive (400) is used to connect the conductive layer (200) and the second component (20).

5. The electrical connection structure according to claim 1, characterized in that: A plating layer is provided on the surface of the conductive layer (200), and the plating layer comprises at least one of a gold plating layer and a nickel plating layer.

6. The electrical connection structure according to claim 1, characterized in that: The elastic support layer (100) is provided with a first opening (101), and at least a portion of the first opening (101) is located between a first contact surface (200a) and a second contact surface (200b); the conductive layer (200) is provided with a second opening (201), and at least a portion of the second opening (201) is located between the first contact surface (200a) and the second contact surface (200b); the first opening (101) and the second opening (201) are opposite to each other and are connected.

7. The electrical connection structure according to claim 6, characterized in that: A plurality of the first openings (101) and the second openings (201) are arranged at intervals, the first openings (101) and the second openings (201) correspond to each other one by one, and each of the first openings (101) is opposite to and communicates with the corresponding second opening (201).

8. The electrical connection structure according to claim 7, characterized in that: The first openings (101) and the second openings (201) are spaced apart in at least two directions, including a first direction (A) and a second direction (B) that intersect, and the first direction (A) and the second direction (B) are respectively parallel to the first contact surface (200a).

9. The electrical connection structure according to claim 1, characterized in that: The electrical connection structure (10) further comprises a second connection adhesive (500), and the surface of the elastic support layer (100) and the surface of the conductive layer (200) are connected via the second connection adhesive (500).

10. An electronic device, characterized in that: The invention comprises a first component (30), a second component (20), and an electrical connection structure (10) according to any one of claims 1 to 9, wherein the electrical connection structure (10) is located between the first component (30) and the second component (20), and the first component (30) and the second component (20) are electrically connected via the electrical connection structure (10).

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