Rapid wafer heat treatment equipment

Abstract

The invention relates to the technical field of wafer heat treatment, in particular to wafer rapid heat treatment equipment which comprises a heat treatment equipment body, the side face of the heat treatment equipment body is concaved inwards to form a machining cavity, and the upper end of the machining cavity of the heat treatment equipment body is concaved upwards to form a circular cavity. A circular cavity is formed in the feeding area, a heating cover is installed in the circular cavity in an up-down sliding mode, a first tension spring is fixedly connected to the upper end of the heating cover, the upper end of the first tension spring is fixedly connected with the upper end of an inner cavity of the circular cavity, and a heating assembly is fixedly installed at the upper end of an inner cavity of the heating cover. A bearing disc with a wafer body is clamped into a placement groove of a placement table, an output shaft of a stepping motor rotates by a quarter of a circle, a rotary circular table drives the bearing disc and the wafer body to rotate by the quarter of the circle through the placement table, and the bearing disc with the wafer body rotates from a feeding area to a heat treatment area.

Description

Technical Field

[0001] The invention relates to the technical field of wafer heat treatment, in particular to a wafer rapid heat treatment device. Background Art

[0002] Wafer heat treatment is a very important processing technology in the semiconductor wafer production process. Wafer heat treatment equipment is needed in the process of heat treatment of wafers. The wafer is heat treated to improve its electrical properties, structural characteristics and surface quality. The working principle of wafer heat treatment equipment is usually based on heat transfer methods such as conduction, convection and radiation.

[0003] Existing wafer heat treatment equipment has certain defects in the process of processing. During the heating process of the wafer, the wafer is first placed on a carrier plate, and then the carrier plate and the wafer are placed in the heat treatment equipment together. During the heating process, the wafer is stationary, and the heating component is also fixed. This will cause uneven heating effects on various parts of the wafer, which will reduce the heat treatment effect and affect the quality of wafer heat treatment. Existing wafer heat treatment equipment needs to heat and cool the previous wafer before it can be taken out and a new wafer can be placed in for processing. Other operations cannot be performed while waiting for cooling, which greatly reduces work efficiency. Summary of the invention

[0004] The object of the present invention is to provide a wafer rapid thermal processing device to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a wafer rapid heat treatment equipment, comprising a heat treatment equipment body, the side of the heat treatment equipment body is recessed inward to open a processing cavity, the upper end of the processing cavity of the heat treatment equipment body is recessed upward to open a circular cavity, a heating cover is installed in the circular cavity so as to slide up and down, the upper end of the heating cover is fixedly connected to a first tension spring, the upper end of the first tension spring is fixedly connected to the upper end of the inner cavity of the circular cavity, a heating component is fixedly installed at the upper end of the inner cavity of the heating cover, a rotating support platform is installed on the side of the heat treatment equipment body, and a rotating circular support platform is rotatably installed on the upper end of the rotating support platform The rotating table is driven by the output shaft of a stepper motor fixedly installed at the lower end of the rotating support table, the upper end of the rotating table is provided with four circular grooves penetrating downward in a circular array, the side of the rotating table is fixedly connected with four extrusion blocks in a circular array, a placing table is rotatably installed in each circular groove, the upper end of the placing table is provided with a placing groove, a carrying plate is clamped in the placing groove, a wafer body is placed on the upper end of the carrying plate, a pushing mechanism is symmetrically installed on the lower end of the placing table, a lifting mechanism is installed on the side of the processing cavity of the main body of the heat treatment equipment, and a rotating transmission mechanism is installed at the lower end of the lifting mechanism at the bottom of the processing cavity of the main body of the heat treatment equipment.

[0006] Preferably, a lifting groove is symmetrically provided on the inner side of the circular cavity, and a lifting block is symmetrically fixedly connected to the outer side of the heating cover, and the lifting block is slidably connected to the lifting groove up and down.

[0007] Preferably, the upper end of the rotating support platform is recessed downward to form an annular limiting groove, and the lower end of the rotating truncated table is fixedly connected with an annular plate, and the annular plate is rotatably connected to the annular limiting groove.

[0008] Preferably, an annular rotating groove is opened on the inner side of the circular groove, the placing platform is a circular plate, and a plurality of fan-shaped plates are fixedly connected to the side surface of the placing platform in an annular array, and the fan-shaped plates are rotatably connected to the annular rotating groove.

[0009] Preferably, the bottom of the placement groove is symmetrically provided with contraction grooves, the bottom of the contraction groove is downwardly penetrated with a rectangular groove, the pushing mechanism includes a lifting seat slidably installed in the rectangular groove, the upper end of the lifting seat is fixedly connected with a push plate, the push plate is clamped in the contraction groove, the lower end of the lifting seat is embedded with a ball, the ball is rollingly connected to the lifting seat, the side of the rotating support platform is fixedly connected with a resistance plate, and the two sides of the resistance plate are sloped.

[0010] Preferably, a guide groove is provided on the side of the processing cavity of the main body of the heat treatment equipment, and the lifting mechanism includes a guide plate which is slidably inserted in the guide groove left and right, and the end of the guide plate close to the rotating table is fixedly connected to a trapezoidal block, and the end of the guide plate close to the rotating table is symmetrically connected to a movable plate for rotation up and down, the upper end of the movable plate above the guide plate is rotatably connected to an adjacent lifting block through a hinge, and the lower end of the movable plate below the guide plate is rotatably connected to the lifting plate through a hinge, and a circular hole is provided downwardly through the upper end of the lifting plate, and a light rod is symmetrically inserted downwardly through the upper end of the lifting plate, and the lower end of the light rod is sleeved with a second tension spring.

[0011] Preferably, the lifting plate is slidably connected to the polished rod up and down, and the upper and lower ends of the second tension spring are fixedly connected to the bottom end of the lifting plate and the bottom of the processing cavity of the heat treatment equipment body respectively.

[0012] Preferably, the rotary transmission mechanism comprises a cylinder inserted into the circular hole, a regular polygonal groove is formed on the upper end of the cylinder from top to bottom, a sliding groove is formed symmetrically on the upper end of the side surface of the cylinder, two limit rings are fixedly sleeved on the lower end of the cylinder, a regular polygonal rod is inserted into the regular polygonal groove, and the regular polygonal rod is driven by the motor shaft of a servo motor fixedly mounted at the lower end of the main body of the heat treatment equipment; The upper end of the cylinder is movably sleeved with a docking ring, and a slider is symmetrically fixedly connected to the inner side of the docking ring. The slider is slidably connected to the slide groove up and down, and a plurality of clamping blocks are fixedly connected to the upper end of the docking ring in an annular array. A docking spring is sleeved on the cylinder, and the two ends of the docking spring are respectively abutted against the docking ring and the limit ring. A transmission ring is fixedly connected to the lower end of the placement table, and a plurality of clamping grooves are arranged in an annular shape at the lower end of the transmission ring, and the clamping blocks are clamped in the corresponding clamping grooves at the upper end.

[0013] Preferably, the cylinder is rotatably connected to the circular hole, two limit rings are symmetrically distributed on the upper and lower sides of the lifting plate, the two limit rings are rotatably connected to the upper and lower sides of the lifting plate respectively, and the regular polygonal groove on the inner side of the cylinder is slidably connected to the regular polygonal rod up and down.

[0014] Compared with the prior art, the invention has the following advantages: 1. During operation, in the loading area, first insert the carrier plate with the wafer body into the placement slot of the placement table, and rotate the output shaft of the stepper motor by a quarter of a circle. The rotating table drives the carrier plate and the wafer body to rotate a quarter of a circle through the placement table, so that the carrier plate with the wafer body is rotated from the loading area to the heat treatment area. During the rotation of the rotating table, the extrusion block is driven to rotate synchronously, and the lifting mechanism is pushed to move by the extrusion block, so that the heating cover moves downward, and the lifting plate moves upward along the optical rod. The lifting plate drives the rotating transmission mechanism to move upward, so that the card block in the rotating transmission mechanism is engaged with the card slot at the lower end of the transmission ring above it.

[0015] 2. The carrier plate and wafer body in the heat treatment area are located below the inner cavity of the heating hood. The heating hood, the rotating round table and the placement table cooperate to form a sealed cavity. At this time, the wafer body is in the sealed cavity, and the heating component can heat the wafer body well. The motor shaft of the servo motor drives the regular polygonal rod to rotate, so that the rotating transmission mechanism drives the transmission ring to rotate, and the transmission ring drives the placement table to rotate. When the placement table rotates, the wafer body is driven to rotate synchronously through the carrier plate. At this time, the wafer body below the inner cavity of the heating hood rotates, so that the heating component can heat the wafer evenly, greatly improving the efficiency and effect of the heat treatment.

[0016] 3. The rotating table drives the pushing mechanism to rotate to the unloading area through the placement table. The lower end of the pushing mechanism rolls upward along the slope of the resistance plate. The two pushing plates in the two pushing mechanisms cooperate to enable the carrier plate to move upward stably along the placement groove. The carrier plate drives the wafer body to move upward, so that the carrier plate and the wafer body can be easily removed from the rotating table.

[0017] 4. While a wafer body is being loaded in the loading area, the heat treatment area heats a wafer body through a heating component, the cooling area cools down a wafer body, and the unloading area unloads a processed wafer body. The four areas can operate simultaneously, greatly improving work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the structure of the wafer rapid thermal processing equipment of the present invention; Figure 2 This is a cross-sectional view of the structure of the wafer rapid thermal processing equipment of the present invention; Figure 3 for Figure 2 A schematic diagram of the structure enlargement in the middle; Figure 4 It is a cross-sectional view of the rotating truncated table structure of the present invention; Figure 5 It is a partial structural cross-sectional view of the wafer rapid thermal processing equipment of the present invention; Figure 6 for Figure 5 A magnified schematic diagram of the structure at B in the middle; Figure 7 It is an exploded view of the rotating support table, rotating round table, placing table and pushing mechanism structure of the present invention; Figure 8 It is an exploded view of the heat treatment equipment body, heating cover, lifting mechanism and rotating transmission mechanism of the present invention; Fig. 9 It is an exploded view of the lifting plate and the rotary transmission mechanism structure of the present invention.

[0019] In the figure: 1. heat treatment equipment body; 11. circular cavity; 12. lifting groove; 13. guide groove; 2. rotating support platform; 21. annular limit groove; 22. contact plate; 3. heating cover; 31. lifting block; 32. first tension spring; 33. heating assembly; 4. rotating circular table; 41. annular plate; 42. circular groove; 43. annular rotating groove; 44. extrusion block; 5. placing platform; 51. fan-shaped plate; 52. placing groove; 53. contraction groove; 54. rectangular groove ; 55. carrier plate; 56. wafer body; 57. transmission ring; 58. slot; 6. lifting seat; 61. push plate; 62. ball bearing; 7. guide plate; 71. trapezoidal block; 72. movable plate; 73. lifting plate; 74. circular hole; 75. light rod; 76. second tension spring; 8. cylinder; 81. regular polygonal groove; 82. slide groove; 83. limit ring; 84. regular polygonal rod; 9. docking ring; 91. slider; 92. block; 93. docking spring. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0021] See also Figures 1 to 9 The present invention provides a technical solution: a wafer rapid heat treatment equipment, comprising a heat treatment equipment body 1, the side of the heat treatment equipment body 1 is recessed inward to open a processing cavity, the upper end of the processing cavity of the heat treatment equipment body 1 is recessed upward to open a circular cavity 11, a heating cover 3 is installed in the circular cavity 11 to slide up and down, the upper end of the heating cover 3 is fixedly connected with a first tension spring 32, the upper end of the first tension spring 32 is fixedly connected to the upper end of the inner cavity of the circular cavity 11, the first tension spring 32 applies an upward pulling force to the heating cover 3, the upper end of the inner cavity of the heating cover 3 is fixedly installed with a heating component 33, a rotating support table 2 is installed on the side of the heat treatment equipment body 1, a rotating round table 4 is rotatably installed on the upper end of the rotating support table 2, and the rotating round table 4 is fixedly installed at the lower end of the rotating support table 2 Stepper Driven by the output shaft of the motor, the upper end of the rotating truncated table 4 is provided with four circular grooves 42 penetrating downward in a circular array, and the side of the rotating truncated table 4 is fixedly connected with four extrusion blocks 44 in a circular array, and each extrusion block 44 corresponds to the position of each circular groove 42 one by one, and the extrusion block 44 is arranged in a triangular shape, and the end of the extrusion block 44 is arranged with a chamfered corner, and a placement table 5 is rotatably installed in each circular groove 42, and a placement groove 52 is provided at the upper end of the placement table 5, and a carrier plate 55 is clamped in the placement groove 52, and a wafer body 56 is placed on the upper end of the carrier plate 55, and a push-up mechanism is symmetrically installed at the lower end of the placement table 5, and a lifting mechanism is installed on the side of the processing chamber of the heat treatment equipment main body 1, and a rotating transmission mechanism is installed at the lower end of the lifting mechanism at the bottom of the processing chamber of the heat treatment equipment main body 1.

[0022] See also Figure 2 and Figure 8 A lifting groove 12 is symmetrically provided on the inner side of the circular cavity 11, and a lifting block 31 is symmetrically fixedly connected to the outer side of the heating cover 3, and the lifting block 31 is slidably connected to the lifting groove 12 up and down.

[0023] When the heating cover 3 slides up and down along the circular cavity 11 , the heating cover 3 drives the lifting block 31 to slide up and down along the lifting slot 12 , so that the heating cover 3 can move up and down stably.

[0024] See also Figure 2 and Figure 7The upper end of the rotating support platform 2 is recessed downward and is provided with an annular limiting groove 21 . The lower end of the rotating truncated table 4 is fixedly connected with an annular plate 41 , and the annular plate 41 is rotatably connected with the annular limiting groove 21 .

[0025] The output shaft of the stepper motor rotates a quarter of a circle each time. After each rotation, the output shaft of the stepper motor will stop for a period of time and then rotate again, and so on. The output shaft of the stepper motor drives the rotating table 4 to rotate along the upper end of the rotating support table 2, and the rotating table 4 drives the annular plate 41 to rotate along the annular limit groove 21, so that the rotating table 4 can rotate stably.

[0026] See also Figure 4 and Figure 7 An annular rotating groove 43 is provided on the inner side of the circular groove 42 . The placing platform 5 is a circular plate. A plurality of fan-shaped plates 51 are fixedly connected to the side of the placing platform 5 in an annular array. The fan-shaped plates 51 are rotatably connected to the annular rotating groove 43 .

[0027] When the placement table 5 rotates along the circular groove 42 , the placement table 5 drives the sector plate 51 to rotate along the annular rotating groove 43 , so that the placement table 5 can rotate stably. When the placement table 5 rotates, the wafer body 56 is driven to rotate through the carrier plate 55 .

[0028] See also Figure 2 , Figure 3 and Figure 7 The bottom of the placement groove 52 is symmetrically provided with a contraction groove 53, and the bottom of the contraction groove 53 is downwardly penetrated with a rectangular groove 54. The push-up mechanism includes a lifting seat 6 slidably installed in the rectangular groove 54, and the upper end of the lifting seat 6 is fixedly connected with a push plate 61, and the push plate 61 is clamped in the contraction groove 53. The lower end of the lifting seat 6 is embedded with a ball 62, and the ball 62 is rollingly connected to the lifting seat 6. The side of the rotating support platform 2 is fixedly connected with a contact plate 22, and both sides of the contact plate 22 are sloped.

[0029] The side surface of the rotating support platform 2 is divided into a heat treatment area, a cooling area, a material unloading area and a material loading area in a counterclockwise direction, wherein the heat treatment equipment body 1 is located in the heat treatment area, and the abutment plate 22 is arranged in the material unloading area.

[0030] A cooling device may be installed above the cooling area as needed, thereby accelerating the cooling of the wafer body 56 .

[0031] When the rotating round table 4 drives the placing table 5 to rotate to the unloading area, and the placing table 5 drives the pushing mechanism to rotate to the unloading area, the ball 62 at the lower end of the lifting seat 6 first contacts the slope of one side of the contact plate 22, and the rotating round table 4 continues to rotate, so that the ball 62 at the lower end of the lifting seat 6 rolls upward along the slope of the contact plate 22 until the ball 62 rotates to the uppermost end of the contact plate 22, and the rotating round table 4 stops rotating; As the ball 62 rolls upward along the slope of the resistance plate 22, the ball 62 pushes the lifting seat 6 to slide upward along the rectangular groove 54, and the lifting seat 6 drives the push plate 61 to move upward out of the shrinkage groove 53, and the push plate 61 drives the carrying plate 55 to move upward. Through the cooperation of the two push plates 61 in the two pushing mechanisms, the carrying plate 55 can be stably moved upward along the placement groove 52, and the carrying plate 55 drives the wafer body 56 to move upward, so that the carrying plate 55 and the wafer body 56 can be conveniently removed from the rotating table 4.

[0032] See also Figure 2 , Figure 5 and Figure 8 A guide groove 13 is provided on the side of the processing cavity of the heat treatment equipment body 1, and the lifting mechanism includes a guide plate 7 that is slidably inserted in the guide groove 13 left and right. The end of the guide plate 7 close to the rotating table 4 is fixedly connected to a trapezoidal block 71, and the end of the guide plate 7 close to the rotating table 4 is symmetrically connected to a movable plate 72 for rotation up and down. The two movable plates 72 are distributed in an eight-shaped shape, and the two movable plates 72 are rotatably connected to the guide plate 7 through hinges. The upper end of the movable plate 72 above the guide plate 7 is rotatably connected to an adjacent lifting block 31 through a hinge, and the lower end of the movable plate 72 below the guide plate 7 is rotatably connected to a lifting plate 73 through a hinge. A circular hole 74 is penetrated downward at the upper end of the lifting plate 73, and a light rod 75 is symmetrically penetrated and inserted downward at the upper end of the lifting plate 73. The circular hole 74 is located between the two light rods 75, and the lower end of the light rod 75 is sleeved with a second tension spring 76.

[0033] The lifting plate 73 is slidably connected to the polished rod 75 up and down. The upper and lower ends of the second tension spring 76 are fixedly connected to the bottom end of the lifting plate 73 and the bottom of the processing cavity of the heat treatment equipment body 1 respectively. The second tension spring 76 applies a downward pulling force to the lifting plate 73.

[0034] The extrusion block 44 is driven to rotate into the heat treatment area by the rotating truncated table 4. At this time, the extrusion block 44 rotates into the processing cavity of the heat treatment equipment body 1. The side of the extrusion block 44 first contacts the oblique side of the trapezoidal block 71. At this time, the rotating truncated table 4 continues to rotate to drive the extrusion block 44 to continue to rotate. The side of the extrusion block 44 slides along the oblique side of the trapezoidal block 71, and at the same time, the extrusion block 44 pushes the trapezoidal block 71 to move toward the inner side of the processing cavity of the heat treatment equipment body 1, and the trapezoidal block 71 drives the guide plate 7 to be inserted downward along the guide groove 13; At this time, the guide plate 7 drives the two movable plates 72 to rotate, so that the two movable plates 72 rotate close to each other, the movable plate 72 above the guide plate 7 drives the lifting block 31 to move downward, and the lifting block 31 drives the heating cover 3 to move downward, so that the lower end of the heating cover 3 is tightly fitted with the upper end of the rotating table 4. At this time, the movable plate 72 under the other guide plate 7 drives the lifting plate 73 to move upward along the light rod 75, and the lifting plate 73 drives the rotating transmission mechanism to move upward. When the lifting plate 73 moves upward, the second tension spring 76 is stretched.

[0035] When the lifting plate 73 moves up and down, it slides along the light rod 75, so that the lifting plate 73 can move up and down stably.

[0036] When the heating hood 3 moves downward, the first tension spring 32 is stretched, and at the same time, the heating hood 3 drives the heating component 33 to move downward, so that the heating hood 3 covers the circular groove 42 below the circular cavity 11. At this time, the carrier plate 55 and the wafer body 56 in the heat treatment area are located below the inner cavity of the heating hood 3. The heating hood 3, the rotating round table 4 and the placement table 5 cooperate to form a sealed cavity. At this time, the wafer body 56 is in the sealed cavity, and the heating component 33 can heat the wafer body 56 well.

[0037] See also Figure 2 , Figure 5 , Figure 6 , Figure 8 and Fig. 9 The rotary transmission mechanism includes a cylinder 8 inserted into the circular hole 74, a regular polygonal groove 81 is formed on the upper end of the cylinder 8 from top to bottom, a slide groove 82 is symmetrically formed on the upper end of the side surface of the cylinder 8, two limit rings 83 are fixedly sleeved on the lower end of the cylinder 8, a regular polygonal rod 84 is inserted into the regular polygonal groove 81, and the regular polygonal rod 84 is driven by the motor shaft of the servo motor fixedly installed at the lower end of the heat treatment equipment body 1; A docking ring 9 is movably sleeved on the upper end of the cylinder 8, and a slider 91 is symmetrically fixedly connected to the inner side of the docking ring 9. The slider 91 is slidably connected to the slide groove 82 up and down. A plurality of clamping blocks 92 are fixedly connected to the upper end of the docking ring 9 in an annular array. A docking spring 93 is sleeved on the cylinder 8, and the two ends of the docking spring 93 are respectively abutted against the docking ring 9 and the limit ring 83. A transmission ring 57 is fixedly connected to the lower end of the placement table 5. A plurality of clamping grooves 58 are arranged in an annular manner at the lower end of the transmission ring 57, and the clamping blocks 92 are clamped with the corresponding clamping grooves 58 at the upper end.

[0038] The cylinder 8 is rotatably connected to the circular hole 74, and two limit rings 83 are symmetrically distributed on the upper and lower sides of the lifting plate 73. The two limit rings 83 are rotatably connected to the upper and lower sides of the lifting plate 73 respectively, and the regular polygonal groove 81 on the inner side of the cylinder 8 is slidably connected to the regular polygonal rod 84 up and down.

[0039] When a placement platform 5 is located directly above the rotating transmission mechanism, the placement platform 5 drives the transmission ring 57 to rotate to directly above the rotating transmission mechanism, and the clamping block 92 in the rotating transmission mechanism is clamped with the clamping slot 58 .

[0040] When the lifting plate 73 moves upward, the limit ring 83 moves upward, and the limit ring 83 drives the cylinder 8 to move upward. At this time, the regular polygonal groove 81 in the cylinder 8 slides upward along the regular polygonal rod 84, but the regular polygonal groove 81 and the regular polygonal rod 84 will not be separated; If the block 92 is aligned with the slot 58 at the lower end of the transmission ring 57, the cylinder 8 moves upward and drives the docking ring 9 to move upward, and the docking ring 9 drives the block 92 to engage with the slot 58 at the lower end of the transmission ring 57; if the block 92 is not aligned with the slot 58 at the lower end of the transmission ring 57, the block 92 cannot be inserted into the slot 58. At this time, the cylinder 8 moves upward and drives the docking ring 9 to move upward for a distance, and the upper end of the block 92 abuts against the lower end of the transmission ring 57, so that the docking ring 9 cannot Continue to move upward, and continue to drive the limit ring 83 and the cylinder 8 to move upward through the lifting plate 73. At this time, the upper end of the cylinder 8 slides upward along the inner side of the docking ring 9, and the slide groove 82 at the upper end of the cylinder 8 slides upward along the slider 91 inside the docking ring 9. At this time, the limit ring 83 pushes the docking spring 93 to move upward. The limit ring 83 and the docking ring 9 cooperate to squeeze the docking spring 93, so that the docking spring 93 applies an upward elastic force to the docking ring 9, so that the docking ring 9 maintains the trend of moving upward; The motor shaft of the servo motor drives the regular polygon rod 84 to rotate, the regular polygon rod 84 drives the cylinder 8 to rotate along the lifting plate 73, the cylinder 8 drives the docking ring 9 to rotate through the slider 91, and the docking ring 9 drives the clamping block 92 to rotate synchronously; At this time, if the clamping block 92 is engaged with the clamping slot 58, the clamping block 92 will drive the transmission ring 57 to rotate when it rotates, and the transmission ring 57 will drive the placement table 5 to rotate; At this time, if the upper end of the clamping block 92 is not engaged with the clamping slot 58, the clamping block 92 will slide along the lower end of the transmission ring 57 when it rotates. When the clamping block 92 rotates to the bottom of the clamping slot 58, the clamping block 92 and the clamping slot 58 are symmetrical up and down. Under the action of the elastic force of the docking spring 93, the docking ring 9 is pushed to slide upward along the cylinder 8, and the docking ring 9 drives the clamping block 92 to be engaged in the clamping slot 58. At this time, when the clamping block 92 continues to rotate, it will drive the transmission ring 57 to rotate synchronously, and the transmission ring 57 drives the placement table 5 to rotate. When the placement table 5 rotates, the wafer body 56 is driven to rotate synchronously through the carrier plate 55. At this time, the wafer body 56 under the inner cavity of the heating cover 3 rotates, so that the heating component 33 can heat the wafer evenly, greatly improving the efficiency and effect of the heat treatment.

[0041] Working principle: When working, in the loading area, first place the wafer body 56 on the carrier plate 55, and insert the carrier plate 55 into the placement groove 52 of the placement table 5. At this time, the output shaft of the stepper motor rotates a quarter of a circle, and the output shaft drives the rotating table 4 to rotate a quarter of a circle along the upper end of the rotating support table 2. The rotating table 4 drives the carrier plate 55 and the wafer body 56 to rotate a quarter of a circle through the placement table 5, so that the carrier plate 55 with the wafer body 56 is rotated from the loading area to the heat treatment area. At this time, the wafer body 56 is directly below the heating cover 3; During the rotation of the rotating truncated table 4, the extrusion block 44 is driven to rotate synchronously, and the extrusion block 44 pushes the trapezoidal block 71 to move toward the inner side of the processing cavity of the heat treatment equipment body 1. The trapezoidal block 71 drives the guide plate 7 to be inserted downward along the guide groove 13. At this time, the guide plate 7 drives the two movable plates 72 to rotate, so that the two movable plates 72 rotate close to each other, and the heating cover 3 is moved downward through the lifting mechanism, so that the lower end of the heating cover 3 is tightly fitted with the upper end of the rotating truncated table 4. At the same time, the lifting plate 73 in the lifting mechanism moves upward along the light rod 75, and the lifting plate 73 drives the rotating transmission mechanism to move upward, so that the card block 92 in the rotating transmission mechanism is engaged with the card groove 58 at the lower end of the transmission ring 57 above it.

[0042] At this time, the carrier plate 55 and the wafer body 56 in the heat treatment area are located below the inner cavity of the heating hood 3. The heating hood 3, the rotating table 4 and the placement table 5 cooperate to form a sealed cavity. At this time, the wafer body 56 is in the sealed cavity, and the heating component 33 can heat the wafer body 56 well.

[0043] Then, the motor shaft of the servo motor drives the regular polygon rod 84 to rotate, and the regular polygon rod 84 drives the cylinder 8 to rotate along the lifting plate 73. The cylinder 8 drives the docking ring 9 to rotate through the slider 91, and the docking ring 9 drives the clamping block 92 to rotate synchronously. The clamping block 92 drives the placement table 5 to rotate through the transmission ring 57. When the placement table 5 rotates, it drives the wafer body 56 to rotate synchronously through the supporting plate 55. At this time, the wafer body 56 under the inner cavity of the heating cover 3 rotates, so that the heating component 33 can heat the wafer evenly, which greatly improves the efficiency and effect of the heat treatment.

[0044] When the heat treatment process of the wafer body 56 is completed, the output shaft of the stepper motor is rotated by a quarter of a circle, so that the rotating table 4 drives the wafer body 56 after the heat treatment process to rotate from the heat treatment area to the cooling area; When the extrusion block 44 is separated from the trapezoidal block 71, under the action of the tension of the first tension spring 32 and the second tension spring 76, the heating cover 3 moves upward and the lifting plate 73 moves downward, so that the lifting mechanism, the heating cover 3 and the heating assembly 33 are reset and wait for the next processing.

[0045] After the wafer body 56 is cooled in the cooling area, the rotating table 4 is rotated by another quarter of a circle, and the rotating table 4 drives the cooled wafer body 56 to rotate from the cooling area to the unloading area; The rotating table 4 drives the placement table 5 to rotate. When the placement table 5 drives the pushing mechanism to rotate to the unloading area, the ball 62 at the lower end of the lifting seat 6 rolls upward along the slope of the contact plate 22 until the ball 62 rotates to the uppermost end of the contact plate 22. The ball 62 pushes the lifting seat 6 to slide upward along the rectangular groove 54. The lifting seat 6 drives the push plate 61 to move upward out of the shrinkage groove 53. The push plate 61 drives the carrying plate 55 to move upward. Through the cooperation of the two push plates 61 in the two pushing mechanisms, the carrying plate 55 can be stably moved upward along the placement groove 52. The carrying plate 55 drives the wafer body 56 to move upward, so that the carrying plate 55 and the wafer body 56 can be conveniently taken out from the rotating table 4.

[0046] The rotating circular table 4 drives the empty placement table 5 to rotate to the loading area, and then the carrier plate 55 with the wafer body 56 to be heated is placed in the placement groove 52 at the upper end of the placement table 5, and the process repeats itself.

[0047] While a wafer body 56 is being loaded in the loading area, the heat treatment area heats a wafer body 56 through the heating component 33, the cooling area cools down a wafer body 56, and the unloading area unloads a processed wafer body 56. The four areas can operate simultaneously, greatly improving work efficiency.

[0048] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A wafer rapid thermal processing device, comprising a thermal processing device body (1), wherein the side surface of the thermal processing device body (1) is inwardly recessed to form a processing cavity, and is characterized in that: The upper end of the processing cavity of the heat treatment equipment body (1) is recessed upward to form a circular cavity (11), a heating cover (3) is slidably installed in the circular cavity (11), the upper end of the heating cover (3) is fixedly connected to a first tension spring (32), the upper end of the first tension spring (32) is fixedly connected to the upper end of the inner cavity of the circular cavity (11), the upper end of the inner cavity of the heating cover (3) is fixedly installed with a heating component (33), a rotating support table (2) is installed on the side of the heat treatment equipment body (1), a rotating round table (4) is rotatably installed on the upper end of the rotating support table (2), and the rotating round table (4) is driven by the output shaft of a stepping motor fixedly installed at the lower end of the rotating support table (2), The upper end of the rotating truncated table (4) is provided with four circular grooves (42) penetrating downward in a circular array, and the side of the rotating truncated table (4) is fixedly connected with four extrusion blocks (44) in a circular array. A placement table (5) is rotatably installed in each circular groove (42). The upper end of the placement table (5) is provided with a placement groove (52), and a carrier plate (55) is clamped in the placement groove (52). A wafer body (56) is placed on the upper end of the carrier plate (55). A push-up mechanism is symmetrically installed at the lower end of the placement table (5). A lifting mechanism is installed on the side of the processing chamber of the heat treatment equipment body (1), and a rotating transmission mechanism is installed at the lower end of the lifting mechanism at the bottom of the processing chamber of the heat treatment equipment body (1).

2. The wafer rapid thermal processing equipment according to claim 1, characterized in that: A lifting groove (12) is symmetrically provided on the inner side of the circular cavity (11), and a lifting block (31) is symmetrically fixedly connected to the outer side surface of the heating cover (3), and the lifting block (31) is slidably connected to the lifting groove (12) in an up-and-down manner.

3. The wafer rapid thermal processing equipment according to claim 1, characterized in that: The upper end of the rotating support platform (2) is recessed downwards and is provided with an annular limiting groove (21), and the lower end of the rotating truncated platform (4) is fixedly connected with an annular plate (41), and the annular plate (41) is rotatably connected to the annular limiting groove (21).

4. The wafer rapid thermal processing equipment according to claim 1, characterized in that: An annular rotating groove (43) is provided on the inner side of the circular groove (42); the placement platform (5) is a circular plate; a plurality of fan-shaped plates (51) are fixedly connected to the side of the placement platform (5) in a circular array; the fan-shaped plates (51) are rotatably connected to the annular rotating groove (43).

5. The wafer rapid thermal processing equipment according to claim 1, characterized in that: The bottom of the placement groove (52) is symmetrically provided with a contraction groove (53), and the bottom of the contraction groove (53) is penetrated downwardly with a rectangular groove (54). The push-up mechanism comprises a lifting seat (6) slidably installed in the rectangular groove (54) up and down, and the upper end of the lifting seat (6) is fixedly connected with a push plate (61), and the push plate (61) is clamped in the contraction groove (53). The lower end of the lifting seat (6) is embedded with a ball (62), and the ball (62) is rollingly connected to the lifting seat (6). The side of the rotating support platform (2) is fixedly connected with a contact plate (22), and the two sides of the contact plate (22) are sloped.

6. The wafer rapid thermal processing equipment according to claim 1, characterized in that: A guide groove (13) is provided on the side of the processing cavity of the heat treatment equipment body (1), and the lifting mechanism includes a guide plate (7) slidably inserted in the guide groove (13) left and right, and one end of the guide plate (7) close to the rotating table (4) is fixedly connected to a trapezoidal block (71), and one end of the guide plate (7) close to the rotating table (4) is symmetrically connected to a movable plate (72) for rotation up and down, and the upper end of the movable plate (72) above the guide plate (7) is rotationally connected to an adjacent lifting block (31) through a hinge, and the lower end of the movable plate (72) below the guide plate (7) is rotationally connected to a lifting plate (73) through a hinge, and the upper end of the lifting plate (73) is downwardly penetrated by a circular hole (74), and the upper end of the lifting plate (73) is symmetrically penetrated and inserted with a light rod (75) downwardly, and the lower end of the light rod (75) is sleeved with a second tension spring (76).

7. The wafer rapid thermal processing equipment according to claim 6, characterized in that: The lifting plate (73) is slidably connected to the polished rod (75) up and down, and the upper and lower ends of the second tension spring (76) are respectively fixedly connected to the bottom end of the lifting plate (73) and the bottom of the processing cavity of the heat treatment equipment body (1).

8. The wafer rapid thermal processing equipment according to claim 6, characterized in that: The rotary transmission mechanism comprises a cylinder (8) inserted into the circular hole (74), a regular polygonal groove (81) extending from top to bottom through the upper end of the cylinder (8), a sliding groove (82) symmetrically provided at the upper end of the side surface of the cylinder (8), two limit rings (83) fixedly sleeved on the lower end of the cylinder (8), a regular polygonal rod (84) inserted into the regular polygonal groove (81), and the regular polygonal rod (84) driven by a motor shaft of a servo motor fixedly mounted at the lower end of the heat treatment equipment body (1); The upper end of the cylinder (8) is movably sleeved with a docking ring (9), and a slider (91) is symmetrically fixedly connected to the inner side of the docking ring (9). The slider (91) is slidably connected to the slide groove (82) in an up-and-down manner. The upper end of the docking ring (9) is fixedly connected with a plurality of clamping blocks (92) in an annular array. A docking spring (93) is sleeved on the cylinder (8), and the two ends of the docking spring (93) are respectively in contact with the docking ring (9) and the limit ring (83). The lower end of the placement table (5) is fixedly connected with a transmission ring (57), and the lower end of the transmission ring (57) is provided with a plurality of clamping grooves (58) in an annular arrangement. The clamping blocks (92) are clamped with the corresponding clamping grooves (58) at their upper ends.

9. The wafer rapid thermal processing equipment according to claim 8, characterized in that: The cylinder (8) is rotatably connected to the circular hole (74); two limit rings (83) are symmetrically distributed on the upper and lower sides of the lifting plate (73); the two limit rings (83) are rotatably connected to the upper and lower sides of the lifting plate (73) respectively; and the regular polygonal groove (81) on the inner side of the cylinder (8) is slidably connected to the regular polygonal rod (84) up and down.

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