A carrier structure and an integrated circuit packaging method

Abstract

The present invention provides a carrier structure and an integrated circuit packaging method. It relates to the technical field of integrated circuit packaging, aiming to avoid damage to the carrier structure during the temporary bonding and debonding processes and increase the service life of the carrier structure. The carrier structure includes a base, the base includes a first surface perpendicular to the thickness direction of the carrier structure; the first surface is provided with a groove extending along a first direction; the first direction is perpendicular to the thickness direction of the carrier structure; the groove includes a first side wall and a second side wall oppositely arranged in the first direction, the first side wall is provided with a first groove, the second side wall is provided with a second groove, the openings of the first groove and the second groove are located on the first surface and are oppositely arranged in a second direction; the second direction is perpendicular to the thickness direction of the carrier structure and perpendicular to the first direction; the depths of the first groove and the second groove are both smaller than the depth of the groove.

Description

Technical Field

[0001] The present invention relates to the technical field of integrated circuit packaging, and particularly relates to a carrier structure and an integrated circuit packaging method. Background Art

[0002] The temporary bonding and debonding process can form an array that matches an integrated circuit from individual structural members, and by using the wafer-level packaging process, the packaging efficiency can be significantly improved and the production cost can be reduced.

[0003] Currently, the traditional temporary bonding and debonding methods include mechanical peeling, wet chemical immersion, thermal sliding, and laser debonding. When using the above traditional temporary bonding and debonding processes to separate the structural members from the carrier plate used in the temporary bonding step, there will be many problems, such as high cost and easy damage to the structural members and the carrier plate. Summary of the Invention

[0004] Embodiments of the present invention provide a carrier structure and an integrated circuit packaging method, aiming to avoid damage to the carrier structure in the temporary bonding and debonding process and increase the service life of the carrier structure.

[0005] To achieve the above object, the embodiments of the present invention adopt the following technical solutions:

[0006] In a first aspect, the present application provides a carrier structure. The carrier structure includes a base, the base includes a first surface, and the first surface is perpendicular to the thickness direction of the carrier structure; a groove is provided on the first surface, and the groove extends along a first direction; the first direction is perpendicular to the thickness direction of the carrier structure; the groove includes a first side wall and a second side wall that are oppositely arranged in the first direction, a first groove is provided on the first side wall, a second groove is provided on the second side wall, the openings of the first groove and the second groove are located on the first surface and are oppositely arranged in a second direction; the second direction is perpendicular to the thickness direction of the carrier structure and perpendicular to the first direction; the depths of the first groove and the second groove are both smaller than the depth of the groove.

[0007] In the bearing structure provided by the embodiment of the present application, a groove extending in the first direction is provided on the first surface of the base. Since the groove has a certain depth, the groove will form opposite first side walls and second side walls on the first surface. The first side wall and the second side wall are respectively provided with a first groove and a second groove, and the openings of the first groove and the second groove are opposite to each other along the second direction for bearing structural members. Since the depths of both the first groove and the second groove are less than the depth of the groove, the bottoms of the first groove and the second groove are higher than the bottom of the groove. Place the two ends of the bottom of the structural member on the bottom groove surfaces of the first groove and the second groove respectively and fix them to achieve the temporary bonding of the structural member and the bearing structure; use a cutter to cut along the first side wall and the second side wall. When the structural member is completely separated from the bearing structure, the cutter is located in the plane where the bottoms of the first groove and the second groove are located, that is, only by cutting the depths of the first groove and the second groove can the complete separation of the structural member and the bearing structure be achieved. Since the depths of both the first groove and the second groove are less than the depth of the groove, the first surface of the bearing structure will not be damaged, nor will the first groove and the second groove be damaged. Therefore, damage to the bearing structure during the temporary bonding and debonding processes can be avoided, and the service life of the bearing structure can be increased.

[0008] As a possible implementation manner, a plurality of grooves are provided on the first surface of the base, and the plurality of grooves are spaced along the second direction.

[0009] As a possible implementation manner, a plurality of first grooves are provided on the first side wall of the groove, and a plurality of second grooves are provided on the second side wall of the groove. The plurality of first grooves are spaced along the first direction, the plurality of second grooves are spaced along the first direction, and the openings of one first groove and one second groove are opposite to each other in the second direction.

[0010] As a possible implementation manner, the first groove includes a first groove surface facing the second groove, and the second groove includes a second groove surface facing the first groove; the first groove and the second groove are configured to bear a structural member, and the distance between the first groove surface and the second groove surface along the second direction is greater than or equal to the dimension of the structural member along the second direction.

[0011] As a possible implementation manner, the first groove surface is perpendicular to the first surface, and / or the second groove surface is perpendicular to the first surface.

[0012] As a possible implementation manner, the structural member includes a functional area, and a first cutting reserved area and a second cutting reserved area respectively provided on opposite sides of the functional area; the dimension of the first groove along the second direction is less than or equal to the dimension of the first cutting reserved area along the second direction, and the dimension of the second groove along the second direction is less than or equal to the dimension of the second cutting reserved area along the second direction.

[0013] As a possible implementation, the depths of the first groove and the second groove are both less than or equal to the thickness of the structural member.

[0014] As a possible implementation, the dimension of the first groove in the second direction is equal to the dimension of the second groove in the second direction.

[0015] As a possible implementation, the depth of the first groove is equal to the depth of the second groove.

[0016] In a second aspect, the present application also provides an integrated circuit packaging method, which includes: fixing the structural member to be packaged on the aforementioned carrier structure; wherein, both ends of the structural member are respectively fixed in the first groove and the second groove of the carrier structure; bonding the wafer to the structural member to form a bonding structure; cutting the bonding structure along the first side wall and the second side wall of the groove of the carrier structure respectively to obtain a bonding structure unit separated from the carrier structure; wherein, the bonding structure unit includes the structural member and a plurality of integrated circuits bonded to the structural member.

[0017] As a possible implementation, both ends and / or side walls of the structural member are adhered to the first groove and the second groove of the carrier structure through a room-temperature curing adhesive layer.

[0018] As a possible implementation, when cutting along the first side wall of the groove, there is a gap between the cutting tool and the first side wall; when cutting along the second side wall of the groove, there is a gap between the cutting tool and the second side wall.

[0019] As a possible implementation, the gap between the cutting tool and the first side wall, and the gap between the cutting tool and the second side wall are greater than or equal to the width of the cutting trace of the cutting tool.

[0020] As a possible implementation, the bonding structure unit includes a plurality of structural members arranged at intervals along the length extension direction of the bonding structure unit; the integrated circuit packaging method further includes: cutting the bonding structure unit along a direction perpendicular to the length extension direction of the bonding structure unit to obtain a plurality of integrated circuit packaging structures; wherein, the integrated circuit packaging structure includes a structural member and a wafer part bonded to the structural member.

[0021] Among them, the beneficial effects of the second aspect and its specific implementation manners can refer to the beneficial effects of the first aspect, which will not be elaborated here. Description of the Drawings

[0022] Figure 1 It is a schematic diagram of a carrier structure from a perspective provided by an embodiment of the present application;

[0023] Figure 2 It is a schematic diagram of the carrier structure from another perspective provided by an embodiment of the present application;

[0024] Figure 3 An enlarged schematic diagram of the internal part composition of a carrier structure provided by an embodiment of the present application;

[0025] Figure 4 A schematic diagram of a structural member from a perspective provided by an embodiment of the present application;

[0026] Figure 5 A schematic diagram of a structural member from another perspective provided by an embodiment of the present application;

[0027] Figure 6 A flowchart of an integrated circuit packaging method provided by an embodiment of the present application;

[0028] Figure 7 A schematic diagram of temporary bonding and debonding provided by an embodiment of the present application;

[0029] Figure 8 Another schematic diagram of temporary bonding and debonding provided by an embodiment of the present application;

[0030] Figure 9 Another schematic diagram of temporary bonding and debonding provided by an embodiment of the present application;

[0031] Figure 10 Another schematic diagram of temporary bonding and debonding provided by an embodiment of the present application;

[0032] Figure 11 Another schematic diagram of temporary bonding and debonding provided by an embodiment of the present application. Detailed implementation manners

[0033] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0034] The terms "first" and "second" are only used for descriptive purposes, and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise specified, the meaning of "plurality" is two or more.

[0035] In the description of the present invention, it should be noted that unless otherwise clearly specified and defined, the terms "connected" and "coupled" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances. In addition, when describing pipelines, the terms "connected" and "coupled" used in the present invention have the meaning of conducting. The specific meaning needs to be understood in combination with the context.

[0036] In the embodiments of the present invention, words such as "exemplary" or "for example" are used to indicate examples, illustrations, or explanations. Any embodiment or design described as "exemplary" or "for example" in the embodiments of the present invention should not be construed as being more preferred or having more advantages than other embodiments or designs. Rather, the use of words such as "exemplary" or "for example" is intended to present related concepts in a specific manner.

[0037] The wafer-level packaging (WLP) of microelectromechanical system integrated circuits is a packaging technology completed at the wafer level, which allows the entire wafer to be packaged before the wafer is diced into individual integrated circuits. This packaging method has many advantages, including smaller package size, higher performance, lower cost, and better reliability.

[0038] To achieve the wafer-level packaging of microelectromechanical system integrated circuits, a temporary bonding and debonding process is introduced. Temporary bonding refers to temporarily bonding two wafers or structural components to a carrier structure using a reversible adhesive or bonding technique, and performing necessary processing steps such as etching and filling after the temporary bonding. Debonding refers to separating the two wafers or structural components from the carrier structure by heating, mechanical force, or other methods after the processing is completed.

[0039] Currently, traditional temporary bonding and debonding methods include mechanical peeling, wet chemical immersion, thermal slip, and laser debonding. When using the above traditional temporary bonding and debonding processes, there will be many problems during the process of separating the structural components from the carrier plate used in the temporary bonding step, such as high cost and easy damage to the structural components and the carrier plate.

[0040] In view of this, an embodiment of the present application provides a carrier structure. Exemplarily, such as Figure 1As shown in the figure. The carrier structure 100 includes a base 1. The base 1 includes a first surface 11 which is perpendicular to the thickness direction of the carrier structure 100, that is, perpendicular to the Z direction. The first surface 11 is provided with a groove 12 which extends along a first direction, that is, the Y direction. The first direction is perpendicular to the thickness direction of the carrier structure 100. The groove 12 includes a first side wall 121 and a second side wall 122 which are oppositely arranged in the first direction. The first side wall 121 is provided with a first groove 13, and the second side wall 122 is provided with a second groove 14. The openings of the first groove 13 and the second groove 14 are located on the first surface 11 and are oppositely arranged in a second direction, that is, the X direction. The second direction is perpendicular to the thickness direction of the carrier structure 100 and perpendicular to the first direction. The depths h1 of the first groove 13 and the second groove 14 are both smaller than the depth h2 of the groove 12.

[0041] In the carrier structure 100 provided by the embodiment of the present application, the first surface 11 of the base 1 is provided with a groove 12 extending along the first direction. Since the groove 12 has a certain depth, the groove 12 will form opposite first side wall 121 and second side wall 122 on the first surface 11. The first side wall 121 and the second side wall 122 are respectively provided with a first groove 13 and a second groove 14. The openings of the first groove 13 and the second groove 14 are oppositely arranged along the second direction and are used for the carrier structure member.

[0042] Among them, a partial area of the first surface 11 connected to the first side wall 121 is recessed downward, and a partial area of the first side wall 121 connected to the first surface 11 is recessed away from the second side wall 122 to form the first groove 13. A partial area of the first surface 11 connected to the second side wall 122 is recessed downward, and a partial area of the second side wall 122 connected to the first surface 11 is recessed away from the first side wall 121 to form the second groove 14.

[0043] Since the depths of both the first groove 13 and the second groove 14 are less than the depth of the groove 12, the bottoms of the first groove 13 and the second groove 14 are higher than the bottom of the groove 12. Place the two ends of the bottom of the structural member on the bottom groove surfaces of the first groove 13 and the second groove 14 respectively and fix them to achieve the temporary bonding of the structural member and the carrier structure 100; use a cutter to cut along the first side wall 121 and the second side wall 122. When the structural member is completely separated from the carrier structure 100, the cutter is located in the plane where the bottom of the first groove 13 and the bottom of the second groove 14 are located, that is, only by cutting the depths of the first groove 13 and the second groove 14 can the complete separation of the structural member and the carrier structure 100 be achieved. Since the depths of both the first groove 13 and the second groove 14 are less than the depth of the groove 12, the first surface 11 of the carrier structure 100 will not be damaged, nor will the first groove 13 and the second groove 14 be damaged. Therefore, damage to the carrier structure 100 during the temporary bonding and debonding processes can be avoided, and the service life of the carrier structure 100 can be increased.

[0044] As a possible implementation, exemplarily, such as Figure 1 and Figure 2 shown, a plurality of grooves 12 are provided on the first surface 11 of the base, and the plurality of grooves 12 are arranged at intervals in the second direction. For example, Figure 2 the first surface 11 of the base shown in

[0045] has 6 grooves 12 provided.

[0046] As a possible implementation, exemplarily, such as Figure 1 and Figure 2 shown. A plurality of first grooves 13 are provided on the first side wall 121 of the groove 12, and a plurality of second grooves 14 are provided on the second side wall 122 of the groove 12. The plurality of first grooves 13 are arranged at intervals in the first direction, the plurality of second grooves 14 are arranged at intervals in the first direction, and the openings of one first groove 13 and one second groove 14 are oppositely arranged in the second direction.

[0047] In some embodiments, a plurality of first grooves 13 are arranged at equal intervals in the first direction, and a plurality of second grooves 14 are arranged at equal intervals in the first direction. The equally spaced first grooves 13 and second grooves 14 simplify the process of manufacturing the bearing structure, saving manufacturing costs and time. The bearing structure 100 has a plurality of grooves 12, and each groove 12 includes a plurality of first grooves 13 and corresponding second grooves 14, which means that for each additional first groove 13 and corresponding second groove 14, one more structural member can be bonded to the bearing structure 100, contributing to improving production efficiency.

[0048] As a possible implementation, as Figure 3 shown, the first groove 13 includes a first groove surface 131 facing the second groove 14, and the second groove 14 includes a second groove surface 141 facing the first groove 13. The first groove 13 and the second groove 14 are configured to carry a structural member, and the distance L1 between the first groove surface 131 and the second groove surface 141 in the second direction is greater than or equal to the dimension of the structural member in the second direction.

[0049] Exemplarily, a schematic diagram of the structural member 2 is as Figure 4 and Figure 5 shown, Figure 4 and Figure 5 are schematic diagrams of the structural member 2 from different perspectives respectively. Referring to Figures 3 - 5 , the distance L1 between the first groove surface 131 and the second groove surface 141 in the second direction is greater than the dimension of the structural member in the second direction, or the distance L1 between the first groove surface 131 and the second groove surface 141 in the second direction is equal to the dimension of the structural member in the second direction, which means that enough accommodation space can be formed between the first groove surface 131 and the second groove surface 141 to support the structural member 2.

[0050] In some embodiments, in combination with Figure 1 and Figure 3 , the first groove surface 131 is perpendicular to the first surface 11, the second groove surface 141 is perpendicular to the first surface 11, and the distance L1 between the first groove surface 131 and the second groove surface 141 in the second direction is equal to the dimension of the structural member in the second direction. In other embodiments, the first groove surface 131 is perpendicular to the first surface 11, and the distance L1 between the first groove surface 131 and the second groove surface 141 in the second direction is greater than the dimension of the structural member in the second direction. In still other embodiments, the second groove surface 141 is perpendicular to the first surface 11, and the distance L1 between the first groove surface 131 and the second groove surface 141 in the second direction is greater than the dimension of the structural member in the second direction.

[0051] Exemplarily, referring to Figure 3 and Figure 4, the structural member 2 includes a functional area 21, and a first cutting reserved area 22 and a second cutting reserved area 23 respectively provided on opposite sides of the functional area 21. The dimension of the first groove 13 in the second direction is less than or equal to the dimension of the first cutting reserved area 22 in the second direction, and the dimension of the second groove 14 in the second direction is less than or equal to the dimension of the second cutting reserved area 23 in the second direction.

[0052] The space formed between the first groove surface of the first groove 13 and the second groove surface of the second groove 14 is used to carry the structural member 2. Specifically, it means that the first cutting reserved area 22 of the structural member 2 is placed on the inner part of the groove of the first groove 13 opposite to the second groove 14 in the second direction. The second cutting reserved area 23 of the structural member 2 is placed on the inner part of the groove of the second groove 14 opposite to the first groove 13 in the second direction.

[0053] Exemplarily, the functional area 21 of the structural member 2 refers to the circuit part that performs specific functions in an integrated circuit device or an integrated circuit (IC). The functional area 21 is the basic unit when designing an integrated circuit. Each functional area 21 has its unique electrical characteristics, and they work together to realize the functions of the entire integrated circuit. The first cutting reserved area 22 and the second cutting reserved area 23 do not have a structure similar to that of the functional area 21. That is to say, during the process of debonding the structural member 2 from the carrier structure, cutting the areas where the first cutting reserved area 22 and the second cutting reserved area 23 are located does not affect the functions or characteristics of the structural member 2 itself.

[0054] The dimension of the first groove 13 in the second direction being less than or equal to the dimension of the first cutting reserved area 22 in the second direction includes that the dimension of the first groove 13 in the second direction is less than the dimension of the first cutting reserved area 22 in the second direction, and that the dimension of the first groove 13 in the second direction is equal to the dimension of the first cutting reserved area 22 in the second direction. Such a design enables the cutter not to damage the functional area 21 on the side of the first cutting reserved area 22 during the process of cutting along the first side wall to separate the structural member 2 from the carrier structure, thus ensuring the integrity of the structural member 2 during peeling.

[0055] Similarly, the dimension of the second groove 14 in the second direction being less than or equal to the dimension of the second cutting reserved area 23 in the second direction includes that the dimension of the second groove 14 in the second direction is less than the dimension of the second cutting reserved area 23 in the second direction, and that the dimension of the second groove 14 in the second direction is equal to the dimension of the second cutting reserved area 23 in the second direction. Such a design enables the cutter not to damage the functional area 21 on the side of the second cutting reserved area 23 during the process of cutting along the second side wall to separate the structural member 2 from the carrier structure, thus ensuring the integrity of the structural member 2 during peeling.

[0056] As a possible implementation, refer to Figure 3, the depths of the first groove 13 and the second groove 14, that is, the dimensions in the third direction, are both less than or equal to the thickness of the structural member. The depths of the first groove 13 and the second groove 14 being less than or equal to the thickness of the structural member enables the upper surface of the structural member carried on the carrier structure to be flush with or protrude from the upper surfaces of the first groove 13 and the second groove 14. Since it is necessary to bring the wafer into contact with the upper surface of the structural member when transferring the structural member temporarily bonded on the carrier structure to the wafer, the depths of the first groove 13 and the second groove 14 are set to facilitate the transfer of the structural member temporarily bonded on the carrier structure to the wafer.

[0057] In some embodiments, as Figure 3 shown, the dimension of the first groove 13 in the second direction is equal to the dimension of the second groove 14 in the second direction. This setting of the same dimension enables the carrier structure to be fabricated using the same mold during manufacturing production, simplifies the steps in the process manufacturing, and saves manufacturing costs and time. In addition, the dimension of the first groove 13 in the second direction being equal to the dimension of the second groove 14 in the second direction makes the force on the structural member more uniform, and helps to better disperse the pressure when the structural member is transferred to the wafer for bonding, thereby protecting the structural member.

[0058] In some embodiments, as Figure 3 shown, the depth of the first groove 13, that is, the dimension in the third direction, is equal to the depth of the second groove 14. The equality of the depth of the first groove 13 and the depth of the second groove 14 ensures the support of the structural member while keeping the structural member in a horizontal state all the time and making the force more uniform. Similarly, when transferring the structural member and bonding the structural member to the wafer, it can better disperse the pressure, thereby protecting the structural member.

[0059] As a possible implementation, the material of the carrier structure includes at least one of silicon, glass, metal, and ceramic materials.

[0060] As a possible implementation, the material of the structural member includes at least one of silicon, glass, metal, and ceramic materials. The present application also does not limit the shape of the structural member.

[0061] The present application also provides an integrated circuit packaging method. Exemplarily, as Figure 6 shown, the integrated circuit packaging method includes:

[0062] S1: Fix the structural member to be packaged on the carrier structure as described above.

[0063] Referring to Figure 3 and Figure 5, wherein fixing the structural member 2 to be encapsulated on the aforementioned bearing structure means fixing both ends of the structural member to the first groove 13 and the second groove 14 of the bearing structure respectively.

[0064] As a possible implementation, both ends of the structural member 2 are bonded to the first groove 13 and the second groove 14 of the bearing structure through a room-temperature curing adhesive layer; or the side walls of the structural member 2 are bonded to the first groove 13 and the second groove 14 of the bearing structure through a room-temperature curing adhesive layer; or both ends and the side walls of the structural member 2 are bonded to the first groove 13 and the second groove 14 of the bearing structure through a room-temperature curing adhesive layer. Exemplarily, glue is applied (temporary spacer glue is smeared) at the corner position of the bottom of the first groove 13 away from the first groove surface, as shown by the black dots in Figure 3 . Glue is applied at the corner position of the bottom of the second groove 14 away from the second groove surface. Glue is applied at the four corners of the first cutting reserved area 22 and the second cutting reserved area 23 of the structural member 2, as shown by the black dots in Figure 4 .

[0065] The structural member 2 is placed into the space formed between the first groove 13 and the second groove 14, so that the first cutting reserved area 22 of the structural member 2 is in contact with the bottom of the first groove 13, and the second cutting reserved area 23 of the structural member 2 is in contact with the bottom of the second groove 14.

[0066] The present application does not limit the way of applying glue, the shape, position and quantity of the applied glue. According to the actual processing conditions, the way of applying glue can be automatic glue application by machine or manual glue application. The shape of the applied glue can be circular, square or other shapes. The quantity of the applied glue can be more or less. However, it is necessary to ensure that the amount of glue at each point of glue application is consistent under the condition that the bonding force is satisfied, so as to ensure that the structural member is always in a horizontal state on the bearing structure, and the surface parallelism after the temporary bonding of the structural member and the bearing structure meets the subsequent process requirements, such as the parallelism requirement is less than 0.01 mm.

[0067] As a possible implementation, the type of the bonding glue is a room-temperature curing glue, which can be cured without heating but only by ultraviolet irradiation, preventing the structural member and the bearing structural member from being affected by thermal stress during the curing process of the bonding glue.

[0068] As a possible implementation, a slot can be opened inward on the first groove surface of the first groove, and a slot can be opened inward on the second groove surface of the second groove. Glue is applied inside these two slots and at the same time on the two side surfaces of the structural member.

[0069] Refer to Figure 7, with the aid of manual or automatic equipment, such as an automatic chip mounter, the structural member 2 is placed on the dispensing-bearing structure 100. Pressure is applied to the structural member 2 to ensure that the structural member 2 is always parallel to the surface of the bearing structure 100. The transfer of the structural member 2 can be achieved by vacuum suction or clamping. After placing the structural member 2 in each cavity formed by the first and second grooves of the bearing structure 100, the structure shown in Figure 7 is formed.

[0070] S2: Bond the wafer to the structural member to form a bonded structure.

[0071] Exemplarily, as shown in Figure 8 . With the aid of an alignment device, the bearing structure 100 carrying the structural member is aligned with the matching wafer 3, the structural member is corresponding to the pre-planned position on the wafer 3, and the wafer 3 and the structural member are bonded through a bonding device to form a bonded structure.

[0072] S3: Cut the bonded structure along the first side wall and the second side wall of the groove of the bearing structure respectively to obtain bonded structure units separated from the bearing structure.

[0073] Exemplarily, as shown in Figure 9 . The cutter 4 cuts the bonded structure along the first side wall 121 and the second side wall 122 of the groove, cuts off at least a part of the first cutting reserved area and the second cutting reserved area of the structural member temporarily bonded on the bearing structure, and realizes the separation of the structural member and the bonded wafer from the bearing structure. The number of the obtained bonded structure units 300 is the same as the number of the grooves of the bearing structure. Among them, the bonded structure unit 300 includes a structural member and a plurality of integrated circuits bonded to the structural member.

[0074] As a possible implementation manner, exemplarily, as shown in Figure 10 . Figure 10 The latter two figures in are enlarged schematic views before and after cutting in the dashed box of the first figure. When cutting along the first side wall 121 of the groove, there is a gap between the cutter 4 and the first side wall 121; when cutting along the second side wall 122 of the groove, there is a gap between the cutter 4 and the second side wall 122. Since the cutter 4 itself has a thickness and is in a wedge-shaped structure as a whole from the blade upwards as shown in Figure 10 , when cutting, the cutter 4 is horizontally moved a little in the direction close to the second groove surface along the first side wall 121, so that there is a gap between the cutter 4 and the first side wall 121. When cutting, the cutter 4 is horizontally moved a little in the direction close to the first groove surface along the second side wall 122, so that there is a gap between the cutter 4 and the second side wall 122. This avoids damaging the lower part of the openings of the first and second grooves during cutting and improves the service life of the bearing structure 100.

[0075] As a possible implementation, the intervals between the cutting tool 4 and the first side wall 121, and between the cutting tool 4 and the second side wall 122 are greater than or equal to the width of the cutting trace of the cutting tool. The width of the cutting trace is also the widest dimension of the cross-section of the cutting tool 4 along the second direction when the cutting tool 4 completes the separation of the wafer 3, the structural member 2 and the carrier structure.

[0076] As a possible implementation, by way of example, in combination with Figure 9 and Figure 11 . The bonding structure unit 300 includes a plurality of structural members 2 spaced along the length extension direction of the bonding structure unit 300, that is, the Y direction in Figure 11 . The integrated circuit packaging method further includes: cutting the bonding structure unit 300 along a direction perpendicular to the length extension direction of the bonding structure unit, that is, the X direction, to obtain a plurality of integrated circuit packaging structures 400. Among them, the integrated circuit packaging structure 400 includes a structural member and an integrated circuit bonded to the structural member.

[0077] The dicing process (Sawing or Dicing Process) is a key step in integrated circuit manufacturing. It involves cutting a complete wafer into individual integrated circuits (dies). The wafer is the basis for the production of integrated circuit devices. Hundreds of tiny circuits are formed on the wafer through a series of complex process steps. After all these process steps are completed, each integrated circuit on the wafer needs to be separated for packaging and final testing. In the integrated circuit packaging method provided in this application, the dicing process and the debonding process are combined into one, simplifying the overall process flow and improving the efficiency.

[0078] Those skilled in the art will readily think of other embodiments of this application after considering the specification and practicing the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of this application, which follow the general principles of this application and include common general knowledge or conventional technical means in the technical field not disclosed in this application.

[0079] Finally, it should be noted that the above are only specific embodiments of this application, but the protection scope of this application is not limited thereto. Any changes or substitutions within the technical scope disclosed in this application should be covered within the protection scope of this application. Therefore, the protection scope of this application should be subject to the protection scope of the claims.

Claims

1. A load-bearing structure, characterized in that, It includes a base, and the base includes a first surface which is perpendicular to the thickness direction of the carrier structure; The first surface is provided with a groove which extends along a first direction; the first direction is perpendicular to the thickness direction of the carrier structure; The groove includes a first side wall and a second side wall which are oppositely arranged in the first direction, the first side wall is provided with a first groove, the second side wall is provided with a second groove, the openings of the first groove and the second groove are located on the first surface and are oppositely arranged in a second direction; the second direction is perpendicular to the thickness direction of the carrier structure and perpendicular to the first direction; The depths of both the first groove and the second groove are less than the depth of the groove; The first groove and the second groove are used for fixing the structural member to be bonded with the wafer; the first side wall and the second side wall are used for indicating the cutting positions of the bonding structure formed by bonding the wafer and the structural member.

2. The load-bearing structure according to claim 1, characterized in that, A plurality of the grooves are arranged on the first surface of the base at intervals in the second direction.

3. The load-bearing structure according to claim 1, characterized in that A plurality of the first grooves are arranged on the first side wall of the groove, a plurality of the second grooves are arranged on the second side wall of the groove, the plurality of the first grooves are arranged at intervals in the first direction, the plurality of the second grooves are arranged at intervals in the first direction, and the openings of one first groove and one second groove are oppositely arranged in the second direction.

4. The load-bearing structure according to claim 1, characterized in that, The first groove includes a first groove surface facing the second groove, and the second groove includes a second groove surface facing the first groove; The distance in the second direction between the first groove surface and the second groove surface is greater than or equal to the dimension of the structural member in the second direction.

5. The load-bearing structure according to claim 4, characterized in that, The first groove surface is perpendicular to the first surface, and / or the second groove surface is perpendicular to the first surface.

6. The load-bearing structure according to claim 4, wherein The structural member includes a functional area, and a first cutting reserved area and a second cutting reserved area respectively arranged on opposite sides of the functional area; The dimension of the first groove in the second direction is less than or equal to the dimension of the first cutting reserved area in the second direction, and the dimension of the second groove in the second direction is less than or equal to the dimension of the second cutting reserved area in the second direction.

7. The load-bearing structure according to claim 4, characterized in that, The depths of both the first groove and the second groove are less than or equal to the thickness of the structural member.

8. The load-bearing structure according to any one of claims 1 to 7, characterized in that, The dimension of the first groove in the second direction is equal to the dimension of the second groove in the second direction.

9. The load-bearing structure according to any one of claims 1 to 7, characterized in that The depth of the first groove is equal to the depth of the second groove.

10. An integrated circuit packaging method, characterized in that, It includes: Fixing the structural member to be encapsulated on the carrier structure according to any one of claims 1 to 9; wherein, both ends of the structural member are respectively fixed in the first groove and the second groove of the carrier structure; Bonding the wafer with the structural member to form a bonding structure; Cutting the bonding structure along the first side wall and the second side wall of the groove of the carrier structure respectively to obtain a bonding structure unit separated from the carrier structure; wherein, the bonding structure unit includes the structural member and a plurality of integrated circuits bonded to the structural member.

11. The integrated circuit packaging method according to claim 10, wherein, Both ends and / or side walls of the structural member are bonded to the first groove and the second groove of the load-bearing structure through a room-temperature curing adhesive layer.

12. The integrated circuit packaging method according to claim 10, wherein When cutting along the first side wall of the groove, there is a gap between the cutting tool and the first side wall; When cutting along the second side wall of the groove, there is a gap between the cutting tool and the second side wall.

13. The integrated circuit packaging method according to claim 12, wherein, The gap between the cutting tool and the first side wall, and the gap between the cutting tool and the second side wall, are greater than or equal to the width of the cutting trace of the cutting tool.

14. The integrated circuit packaging method according to any one of claims 10 to 13, characterized in that, The bonding structure unit includes a plurality of the structural members arranged at intervals along the length extension direction of the bonding structure unit; The integrated circuit packaging method further includes: Cutting the bonding structure unit along a direction perpendicular to the length extension direction of the bonding structure unit to obtain a plurality of integrated circuit packaging structures; wherein, the integrated circuit packaging structure includes one of the structural members and an integrated circuit bonded to the structural member.

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