Light emitting device

Abstract

The present invention addresses the problem of improving the production efficiency of a light-emitting device. The light-emitting device includes: a base having a base portion having a first upper surface and a frame portion having a second upper surface surrounding the first upper surface; a cover body having an upper surface and a lower surface joined to the second upper surface of the base body; one or more light-emitting elements disposed on the first upper surface; and a lens member having a lower surface joined to the upper surface of the cover body, the outer edge shape of the second upper surface of the base body is a rectangle having a first side and a second side parallel to the first side, and the outer edge shape of the lower surface of the cover body is a rectangle having a first side and a second side parallel to the first side of the cover body. The distance between the second side of the base body and the second side of the cover body is greater than the distance between the first side of the base body and the first side of the cover body, and the lens member has a lens portion having a lens surface, and a non-lens portion not overlapping the lens surface in plan view, and not overlapping the lens surface in plan view. A distance from the first side of the cover to the one or more lens surfaces is smaller than a distance from the second side of the cover to the one or more lens surfaces.

Description

Technical Field

[0001] The present invention relates to a light emitting device. Background Art

[0002] Japanese Patent Application Laid-Open No. 2021-97216 discloses a light emitting device including: a package having a base and a cover member joined to the base; a semiconductor laser element; and an optical member joined to the cover member.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2021-97216 Summary of the invention

[0006] Technical problem to be solved by the invention

[0007] Disclosed is an invention for solving the problem of improving the production efficiency of a light emitting device.

[0008] Alternatively, an invention is disclosed that solves the problem of achieving weight reduction of a light emitting device instead of the above-mentioned problem.

[0009] Alternatively, an invention is disclosed that solves the problem of achieving packaging with a balanced and stable bonding between a base body and a lid body instead of solving the above-mentioned problems.

[0010] Alternatively, an invention is disclosed that solves the problem of achieving a stable bonding process in the manufacture of a light-emitting device instead of the above-mentioned problems.

[0011] In addition, this specification also discloses inventions that comprehensively solve multiple problems among the above-mentioned problems.

[0012] Technical solutions for solving technical problems

[0013] The light-emitting device disclosed in the embodiment comprises: a substrate, which has a base and a frame, the base having a first upper surface, the frame being located above the first upper surface and having a second upper surface surrounding the first upper surface when viewed from above; a cover, which has an upper surface and a lower surface joined to the second upper surface of the substrate; one or more light-emitting elements arranged on the first upper surface; and a lens component having a lower surface joined to the upper surface of the cover, the outer edge shape of the second upper surface of the substrate is a rectangle having a first side and a second side parallel to the first side, the outer edge shape of the lower surface of the cover is a rectangle having a first side parallel to the first side of the substrate and a second side parallel to the first side of the cover, the first side of the cover being arranged closer to the first side than the second side of the cover The first side of the base is positioned, the second side of the cover is arranged at a position closer to the second side of the base than the first side of the cover, when viewed from above, the shortest distance from the second side of the base to the second side of the cover is larger than the shortest distance from the first side of the base to the first side of the cover, the lens component has a lens portion and a non-lens portion, the lens portion has one or more lens surfaces, the non-lens portion does not overlap with the one or more lens surfaces when viewed from above, when viewed from above, the shortest distance from the first side of the cover to the one or more lens surfaces is smaller than the shortest distance from the second side of the cover to the one or more lens surfaces, and when viewed from above, in a direction perpendicular to the first side of the base, the maximum width of the one or more lens surfaces is more than 65% of the maximum width of the lens component.

[0014] In at least one of the one or more inventions disclosed in the embodiments, the production efficiency of the light emitting device can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a perspective view of a light emitting device according to an embodiment.

[0016] Figure 2 It is a side view of the light emitting device according to the embodiment as viewed from the positive direction of Y.

[0017] Figure 3 It is a side view of the light emitting device according to the embodiment as viewed from the positive direction of X.

[0018] Figure 4 It is a top view of the light emitting device according to the embodiment.

[0019] Figure 5 yes Figure 4 Sectional view of the VV section line.

[0020] Figure 6 It is a plan view for explaining the bonding state of the bonding components of the light emitting device according to the embodiment.

[0021] Figure 7 It is a perspective view for explaining components arranged in the internal space of the light emitting device according to the embodiment.

[0022] Figure 8 It is a plan view for explaining components arranged in the internal space of the light emitting device according to the embodiment.

[0023] Fig. 9 It is a perspective view of a package according to an embodiment.

[0024] Fig.10 is a top view of a package according to an embodiment.

[0025] Fig.11 yes Fig.10 A cross-sectional view taken along section line XI-XI.

[0026] Fig.12 It is a top view of the base body of the embodiment.

[0027] Fig.13 It is a bottom view of the base body of the embodiment.

[0028] Fig.14 yes Fig.12 Section view along section line XIV-XIV.

[0029] Fig.15 This is a perspective view of the cover body according to the embodiment as viewed from the bottom surface side.

[0030] Fig.16 It is a bottom view of the cover body of the embodiment.

[0031] Fig.17 It is a plan view for explaining a state where a light emitting element and the like are mounted on a base according to an embodiment.

[0032] Fig.18 It is a side view for explaining a state where a light emitting element and the like are mounted on a base according to an embodiment. DETAILED DESCRIPTION

[0033] In this specification and claims, polygons such as triangles and quadrilaterals are also referred to as polygons, including shapes in which the corners of polygons are processed by rounding, chamfering, corner chamfering, rounding, etc. Not limited to corners (ends of sides), shapes in which the middle part of the sides is processed are also referred to as polygons. That is, shapes in which a polygon is retained and partially processed are included in the interpretation of "polygon" recorded in this specification and claims.

[0034] The same applies to words that represent specific shapes, such as trapezoid, circle, concave and convex, etc., not limited to polygons. The same applies to the processing of the sides that form the shape. In other words, even if the diagonal or middle part of a side is processed, the processed part is also included in the interpretation of "side". In addition, in the case of distinguishing a "polygon" or "side" without local processing from the processed shape, it is marked as "strict", for example, it is recorded as "strict quadrilateral" etc.

[0035] In this specification or claims, records such as up and down (above / below), left and right, front and back, front and back (in front / back), front and back, etc. merely describe the relationship of relative position, orientation, direction, etc., and may not be consistent with the relationship during use.

[0036] In the drawings, arrows are sometimes used to indicate directions such as the X direction, the Y direction, and the Z direction. The directions of the arrows are matched between multiple drawings of the same embodiment. In the drawings, the directions of the arrows marked with X, Y, and Z are set as positive directions, and the directions opposite thereto are set as negative directions. For example, the direction marked with X at the front end of the arrow is the X direction, and is the positive direction. In addition, in this specification, the direction that is the X direction and is the positive direction is referred to as the "positive direction of X", and the direction opposite thereto is referred to as the "negative direction of X". When referred to as the "X direction", it is assumed to include any direction of the positive direction and the negative direction. The same is true for the Y direction and the Z direction.

[0037] In this specification, when a certain object is identified as "one or more" to describe the object, each of the ways in which the object is one and the ways in which the object is multiple are collectively described. Therefore, by the description identified as "one or more", any of the embodiments including one or more objects, the embodiments including at least one object, and the embodiments including multiple objects are supported.

[0038] In this specification, the description of "one or each" object is a summary of the description of one object in an embodiment with one object, the description of one object in an embodiment with multiple objects, and the description of each of multiple objects in an embodiment with multiple objects. Therefore, by describing "one or each" object, it is supported that in an embodiment with one object, the one object has description content, in an embodiment with multiple objects, at least one of the objects has description content, in an embodiment with multiple objects, the multiple objects each have description content, and in an embodiment with one or more objects, all objects have description content.

[0039] In this specification, for example, when describing constituent elements, it is sometimes described as "component" or "portion". "Component" refers to an object that is physically handled as a single unit. An object that is physically handled as a single unit may also be referred to as an object that is handled as a single unit in a manufacturing process. On the other hand, "portion" refers to an object that may not be handled as a single unit physically. For example, "portion" is used when extracting a part of a component locally or when extracting a plurality of components collectively as one object.

[0040] In addition, the distinction between "component" and "portion" mentioned above does not mean that the scope of rights is intentionally limited in the interpretation of the doctrine of equalization. In other words, even if there is a component described as a "component" in the claims, the applicant does not believe that it is necessary to treat the component as a single body in the application of the present invention based on this circumstance alone.

[0041] In this specification or claims, when there are multiple constituent elements and they are expressed separately, sometimes the first word "first" or "second" is marked at the beginning of the constituent element to distinguish them. The objects distinguished between this specification and the claims may be different. Therefore, even if the claims record constituent elements marked with the same notes as in this specification, the objects determined by the constituent elements may be inconsistent between this specification and the claims.

[0042] For example, in this specification, there are constituent elements marked as "first", "second", and "third" to distinguish them. When the constituent elements marked as "first" and "third" in this specification are recorded in the claims, for the sake of easy understanding, they are sometimes marked as "first" and "second" in the claims to distinguish them. In this case, the constituent elements marked as "first" and "second" in the claims refer to the constituent elements marked as "first" and "third" in this specification, respectively. In addition, the applicable objects of this rule are not limited to constituent elements, and it is also reasonably and flexibly applicable to other objects.

[0043] Hereinafter, the mode for implementing the present invention will be described. The specific mode for implementing the present invention will be described while referring to the accompanying drawings. The mode for implementing the present invention is not limited to the specific mode. That is, the illustrated embodiment is not the only mode for implementing the present invention. The size and positional relationship of the components shown in the drawings are sometimes exaggerated for ease of understanding.

[0044] <Implementation Method>

[0045] A light emitting device 1 according to an embodiment will be described. Figures 1 to 18 This is a diagram for explaining one exemplary embodiment of the light emitting device 1 . Figure 1 It is a perspective view of the light emitting device 1 . Figure 2This is a side view of the light emitting device 1 as viewed from the positive Y direction. Figure 3 This is a side view of the light emitting device 1 as viewed from the positive direction of X. Figure 4 is a top view of the light emitting device 1. Figure 4 In FIG. 1 , a region where the bonding member 80 is formed is indicated by hatching surrounded by a dotted line. An inner frame of the second upper surface 11C of the base body 11 is indicated by a dotted line. Figure 5 yes Figure 4 2 is a cross-sectional view of the light emitting device 1 taken along the VV cross-sectional line. Figure 6 FIG. 1 is a top view for explaining the bonding state of the bonding member 80 of the light emitting device 1. Figure 6 In FIG. 1 , the first to fourth regions R1 to R4 are indicated by hatching in a direction different from that of the first to fourth bonding members 81 to 84. The outer edge of the upper surface 14A of the cover 14 and the portion overlapping the optical member 70 in a plan view are indicated by a dotted line. Figure 7 as well as Figure 8 1 is a perspective view and a plan view for explaining components arranged in the internal space of the light emitting device 1. Figure 8 In the Figure 7 The wiring 60 is marked in FIG. Fig. 9 is a perspective view of the package 10 . Fig.10 FIG. 1 is a top view of package 10. Fig.10 In FIG. 1 , the inner frame of the second upper surface 11C of the base 11 is marked with a dotted line, and the bonding pattern 14D and the buffer line pattern 14E of the cover 14 are marked with a dotted line. Fig.11 yes Fig.10 A cross-sectional view of the package 10 taken along the XI-XI section line. Fig.12 It is a top view of the base body 11. Fig.13 It is a bottom view of the base body 11. Fig.14 yes Fig.12 A cross-sectional view of the substrate 11 taken along the XIV-XIV section line. Fig.15 This is a perspective view as viewed from the lower surface 14B side of the cover body 14 . Fig.16 14 is a bottom view of the cover body 14. Fig.16 Buffer line 14E1 is marked with hatching. Fig.17 as well as Fig.18 These are a plan view and a side view for explaining a state where the light emitting element 20 and the like are mounted on the base 30 .

[0046] The light emitting device 1 includes a plurality of components including a package 10 , one or more light emitting elements 20 , one or more bases 30 , one or more reflective members 40 , one or more protective elements 50 , a plurality of wirings 60 , an optical member 70 , and one or more bonding members 80 .

[0047] The light emitting device 1 may include other components. For example, the light emitting device 1 may include a light emitting element separately from the one or more light emitting elements 20. The light emitting device 1 may not include some of the components listed here.

[0048] First, each component will be described.

[0049] (Package 10)

[0050] The package 10 includes a base 11 and a cover 14. The cover 14 is bonded to the base 11 to form the package 10. The package 10 includes an internal space where other components are arranged. The internal space is a closed space surrounded by the base 11 and the cover 14. The internal space may be a space sealed in a vacuum or airtight state.

[0051] When viewed from above, the outer edge shape of the package 10 is a rectangle. The rectangle may be a rectangle having a long side and a short side. In the package 10 shown in the figure, the long side direction of the rectangle is the same direction as the X direction, and the short side direction is the same direction as the Y direction. When viewed from above, the outer edge shape of the package 10 may not be a rectangle.

[0052] An internal space in which other components are arranged is formed in the package 10. The first upper surface 11A of the package 10 is a part of a region that defines the internal space. The inner side surfaces 11E and the lower surface 14B of the package 10 are a part of a region that defines the internal space.

[0053] The base 11 has a first upper surface 11A and a lower surface 11B. The base 11 has a second upper surface 11C. The base 11 has one or more outer side surfaces 11D. The base 11 has one or more inner side surfaces 11E. One or more outer side surfaces 11D intersect with the second upper surface 11C. One or more outer side surfaces 11D intersect with the lower surface 11B. One or more inner side surfaces 11E intersect with the second upper surface 11C.

[0054] When viewed from above, the outer edge shape of the base 11 is a rectangle. When viewed from above, the outer edge shape of the base 11 is the outer edge shape of the package 10. When viewed from above, the outer edge shape of the first upper surface 11A is a rectangle. The rectangle may be a rectangle having long sides and short sides. The long side direction of the first upper surface 11A is parallel to the long side direction of the outer edge shape of the base 11. When viewed from above, the outer edge shape of the first upper surface 11A may not be a rectangle.

[0055] When viewed from above, the first upper surface 11A is surrounded by the second upper surface 11C. The second upper surface 11C is an annular surface surrounding the first upper surface 11A when viewed from above. The second upper surface 11C is a rectangular annular surface. Here, the frame divided by the inner edge of the second upper surface 11C is referred to as the inner frame of the second upper surface 11C, and the frame divided by the outer edge of the second upper surface 11C is referred to as the outer frame of the second upper surface 11C.

[0056] The outer edge shape of the second upper surface 11C is a rectangle. The rectangle may have a long side and a short side. The rectangle has a first side 11C1, a second side 11C2, a third side 11C3 and a fourth side 11C4. The second side 11C2 is parallel to the first side 11C1. The third side 11C3 is perpendicular to the first side 11C1. The fourth side 11C4 is parallel to the third side 11C3. The first side 11C1 is the long side of the rectangle.

[0057] The inner edge shape of the second upper surface 11C is a rectangle. The rectangle may have a long side and a short side. The rectangle has a first side 11C5, a second side 11C6, a third side 11C7 and a fourth side 11C8. The second side 11C6 is parallel to the first side 11C5. The third side 11C7 is perpendicular to the first side 11C5. The fourth side 11C8 is parallel to the third side 11C7. The first side 11C5 is the long side of the rectangle. For convenience, the sides of the rectangle with an outer edge shape and the sides of the rectangle with an inner edge shape are respectively referred to as the sides of the outer edge and the sides of the inner edge to distinguish them.

[0058] The base 11 has a recessed portion surrounded by a frame formed by the second upper surface 11C. The recessed portion defines a portion in the base 11 that is recessed downward from the second upper surface 11C. The first upper surface 11A is a portion of the recessed portion. One or more inner side surfaces 11E are a portion of the recessed portion. The second upper surface 11C is located above the first upper surface 11A.

[0059] The base 11 has one or more step portions 11F. The step portion 11F has an upper surface 11G and a side surface 11H intersecting the upper surface 11G and extending downward from the upper surface 11G. Here, it is assumed that the surface of one step portion 11F is only one upper surface 11G and one side surface 11H. The upper surface 11G intersects with the inner side surface 11E. The side surface 11H intersects with the first upper surface 11A.

[0060] One or each step portion 11F is provided inside the inner frame of the second upper surface 11C when viewed from above. One or each step portion 11F is formed along a part or the whole of the inner side surface 11E when viewed from above. In the base 11, the side surface 11H is the inner side surface, but the side surface 11H and the inner side surface 11E are different surfaces. One or each inner side surface 11E and one or each side surface 11H are perpendicular to the first upper surface 11A. The perpendicularity here allows a difference of ±3 degrees.

[0061] The one or more step portions 11F may include a first step portion 11F1 and a second step portion 11F2. The first step portion 11F1 and the second step portion 11F2 are provided at positions opposite to the respective side surfaces 11H. The first step portion 11F1 and the second step portion 11F2 are provided at the short side of the inner frame of the second upper surface 11C.

[0062] The base 11 includes a base portion 11M and a frame portion 11N. The base portion 11M and the frame portion 11N may be members made of different materials. The base 11 may be configured to include a base member corresponding to the base portion 11M and a frame member corresponding to the frame portion 11N.

[0063] The base 11M includes a first upper surface 11A. The frame 11N includes a second upper surface 11C. The frame 11N includes one or more outer side surfaces 11D and one or more inner side surfaces 11E. The frame 11N includes one or more step portions 11F.

[0064] The lower surface of base 11M constitutes part or all of lower surface 11B of base 11. When the lower surface of base 11M constitutes part of lower surface 11B of base 11, the lower surface of frame 11N constitutes the remaining area of ​​lower surface 11B of base.

[0065] The base 11 has a plurality of wiring portions 12A. The plurality of wiring portions 12A include one or more first wiring portions 12A1 arranged in the internal space of the package 10 and one or more second wiring portions 12A2 provided on the outer surface of the package 10.

[0066] One or each first wiring portion 12A1 is provided on the upper surface 11G of the step portion 11F. The base 11 has one or more first wiring portions 12A1 provided on the upper surface 11G of the first step portion 11F1. The base 11 has one or more first wiring portions 12A1 provided on the upper surface 11G of the second step portion 11F2.

[0067] One or each second wiring portion 12A2 is provided on the lower surface 11B of the package 10. One or each second wiring portion 12A2 is provided on the lower surface of the frame portion 11N. The second wiring portion 12A2 may be provided on an outer surface of the package 10 different from the lower surface 11B.

[0068] Regarding the substrate 11, when the substrate 11 is divided into two regions by a virtual line passing through the side surface 11H of the first step portion 11F1 and parallel to the side surface 11H when viewed from above, the area including the upper surface 11G of the first step portion 11F1 has one or more second wiring portions 12A2 arranged on the lower surface 11B of the substrate 11.

[0069] Regarding the substrate 11, when the substrate 11 is divided into two areas by a virtual line passing through the side surface 11H of the second step portion 11F2 and parallel to the side surface 11H when viewed from above, the area including the upper surface 11G of the second step portion 11F2 has one or more second wiring portions 12A2 arranged on the lower surface 11B of the substrate 11.

[0070] In the base body 11, one or each of the first wiring portions 12A1 is electrically connected to the second wiring portion 12A2. One or more first wiring portions 12A1 are electrically connected to different second wiring portions 12A2.

[0071] The base 11 has a bonding pattern 13A. The bonding pattern 13A is provided on the second upper surface 11C. The bonding pattern 13A is provided in a ring shape. The bonding pattern 13A is provided in a rectangular ring shape. In a plan view, the first upper surface 11A is surrounded by the bonding pattern 13A.

[0072] The base 11 can be formed by using ceramics as a main material, for example. Examples of the ceramics used as a main material of the base 11 include aluminum nitride, silicon nitride, aluminum oxide, or silicon carbide.

[0073] Here, the main material refers to the material that accounts for the largest proportion by mass or volume in the object to be formed. In the case where the object to be formed is formed by one material, the material is the main material. That is, a certain material is the main material, including the proportion of the material can be 100%.

[0074] The substrate 11 may be formed by using a base member and a frame member formed using different main materials. The base member may be formed by using a material having excellent heat dissipation properties such as metal or a composite material containing metal, graphite, diamond, etc. as the main material. Examples of metals that are the main material of the base member include copper, aluminum, or iron. Examples of composite materials that are the main material of the base member include copper-molybdenum or copper-tungsten. The frame member may be formed by using ceramics listed as the main material of the substrate 11 as the main material.

[0075] The wiring portion 12A may be formed by using a metal material as a main material, for example. Examples of the metal material used as the main material of the wiring portion 12A include single metals such as Cu, Ag, Ni, Au, Ti, Pt, Pd, Cr, and W, or alloys containing these metals. The wiring portion 12A may be composed of one or more metal layers, for example.

[0076] The bonding pattern 13A can be formed by using a metal material as a main material, for example. As the metal material that is the main material of the bonding pattern 13A, for example, single metals such as Cu, Ag, Ni, Au, Sn, Ti, Pd, or alloys containing these metals can be listed. The bonding pattern 13A can be composed of one or more metal layers, for example.

[0077] The cover 14 has an upper surface 14A and a lower surface 14B. The cover 14 has one or more side surfaces 14C. The cover 14 is formed of a cubic flat plate. The shape of the cover 14 may not be a cubic shape.

[0078] The outer edge shape of the upper surface 14A of the cover body 14 is a rectangle. The rectangle may have a long side and a short side. The rectangle has a first side 14A1, a second side 14A2, a third side 14A3 and a fourth side 14A4. The second side 14A2 is parallel to the first side 14A1. The third side 14A3 is perpendicular to the first side 14A1. The fourth side 14A4 is parallel to the third side 14A3. The first side 14A1 is the long side of the rectangle.

[0079] The outer edge shape of the lower surface 14B of the cover body 14 is a rectangle. The rectangle may have a long side and a short side. The rectangle has a first side 14B1, a second side 14B2, a third side 14B3 and a fourth side 14B4. The second side 14B2 is parallel to the first side 14B1. The third side 14B3 is perpendicular to the first side 14B1. The fourth side 14B4 is parallel to the third side 14B3. The first side 14B1 is parallel to the long side of the rectangle.

[0080] The first side 14A1 of the upper surface 14A and the first side 14B1 of the lower surface 14B form the upper side and the lower side of the common side surface 14C. The outer edge shape of the upper surface 14A and the inner edge shape of the lower surface 14B are the same shape. The "same shape" here includes a difference within ±25 μm.

[0081] The cover 14 is bonded to the base 11. The lower surface 14B of the cover 14 is bonded to the second upper surface 11C of the base 11. The cover 14 is bonded to the bonding pattern 13A of the base 11. The cover 14 is bonded to the base 11 via an adhesive.

[0082] The cover 14 has a bonding pattern 14D. The bonding pattern 14D is provided on the lower surface 14B of the cover 14. The bonding pattern 14D has a rectangular ring shape. The bonding pattern 14D of the cover 14 and the bonding pattern 13A of the base 11 are bonded to the base 11 via an adhesive. For example, AuSn solder can be used as the adhesive.

[0083] The outer edge shape of the lower surface of the cover body 14 is smaller than the outer frame of the second upper surface 11C of the base body 11 and larger than the inner frame of the second upper surface 11C. The outer edge shape of the rectangular ring-shaped area of ​​the bonding pattern 14D is smaller than the outer frame of the second upper surface 11C of the base body 11 and larger than the inner frame of the second upper surface 11C. The inner edge shape of the rectangular ring-shaped area of ​​the bonding pattern 14D is the same as or smaller than the inner frame of the second upper surface 11C.

[0084] The outer edge shape of the bonding pattern 14D is a rectangle. The rectangle has a first side 14D1, a second side 14D2, a third side 14D3, and a fourth side 14D4 as the outer edge. The second side 14D2 is parallel to the first side 14D1. The third side 14D3 is perpendicular to the first side 14D1. The fourth side 14D4 is parallel to the third side 14D3.

[0085] The first side 14D1 of the joining pattern 14D is located closer to the first side 14B1 of the lower surface 14B than the second side 14D2. The second side 14D2 of the joining pattern 14D is located closer to the second side 14B2 of the lower surface 14B than the first side 14D1. The third side 14D3 of the joining pattern 14D is located closer to the third side 14B3 of the lower surface 14B than the fourth side 14D4. The fourth side 14D4 of the joining pattern 14D is located closer to the fourth side 14B4 of the lower surface 14B than the third side 14D3.

[0086] The inner edge shape of the bonding pattern 14D is a rectangle. The edges in the rectangle as edges include a first edge 14D5, a second edge 14D6, a third edge 14D7, and a fourth edge 14D8. The second edge 14D6 is parallel to the first edge 14D5. The third edge 14D7 is perpendicular to the first edge 14D5. The fourth edge 14D8 is parallel to the third edge 14D7.

[0087] The first side 14D5 of the joining pattern 14D is located closer to the first side 14B1 of the lower surface 14B than the second side 14D6. The second side 14D6 of the joining pattern 14D is located closer to the second side 14B2 of the lower surface 14B than the first side 14D5. The third side 14D7 of the joining pattern 14D is located closer to the third side 14B3 of the lower surface 14B than the fourth side 14D8. The fourth side 14D8 of the joining pattern 14D is located closer to the fourth side 14B4 of the lower surface 14B than the third side 14D7.

[0088] The distance from the first side 14D1 of the outer edge to the first side 14D5 of the inner edge of the bonding pattern 14D is the same as the distance from the second side 14D2 of the outer edge to the second side 14D6 of the inner edge. The "same" here includes a difference within ±20 μm. When referred to as "distance" in this specification, it means the shortest distance unless it is clearly stated that it means another meaning.

[0089] The distance from the third side 14D3 of the outer edge to the third side 14D7 of the inner edge of the bonding pattern 14D is the same as the distance from the fourth side 14D4 of the outer edge to the fourth side 14D8 of the inner edge. The “same” here includes a difference within ±20 μm.

[0090] The distance from the outer edge first side 14D1 to the inner edge first side 14D5 of the bonding pattern 14D is the same as the distance from the outer edge third side 14D3 to the inner edge third side 14D7. The "same" here includes a difference within ±20 μm.

[0091] When viewed from above, a virtual straight line passing through the center of the first side 14B1 of the lower surface 14B of the cover body 14 and perpendicular to the first side 14B1 includes a first line segment and a second line segment overlapping the bonding pattern 14D. The lengths of the first line segment and the second line segment are the same. Thus, a balance can be achieved between the bonding force on the first side 14D1 side and the bonding force on the second side 14D2 side when the cover body 14 is bonded to the base body 11, and a stable bonding process can be performed.

[0092] The outer edge shape of the joint pattern 14D is smaller than the outer frame of the base 11. The joint pattern 14D of the cover 14 is provided to match the inner frame rather than the outer frame of the base 11. Thus, the outer edge shape of the cover 14 can be easily adjusted.

[0093] When viewed from above, the distance from the rectangular annular area in the bonding pattern 14D to the first side 14B1 of the lower surface 14B is greater than the distance from the area to the second side 14B2 of the lower surface 14B. When viewed from above, the distance from the first side 14D1 of the outer edge of the bonding pattern 14D to the first side 14B1 of the lower surface 14B is greater than the distance from the second side 14D2 of the outer edge of the bonding pattern 14D to the second side 14B2 of the lower surface 14B. Thus, even if the configuration position of the cover body 14 on the first side 14D1 side and the configuration position on the second side 14D2 side relative to the base body 11 are asymmetric, a bonding pattern 14D that achieves a balance between the bonding on the first side 14D1 side and the bonding on the second side 14D2 side corresponding to the asymmetry can be achieved.

[0094] When viewed from above, the distance from the rectangular annular region in the bonding pattern 14D to the first side 14B1 of the lower surface 14B is greater than the distance from the region to the third side 14B3 of the lower surface 14B. When viewed from above, the distance from the first side 14D1 of the outer edge of the bonding pattern 14D to the first side 14B1 of the lower surface 14B is greater than the distance from the third side 14D3 of the outer edge of the bonding pattern 14D to the third side 14B3 of the lower surface 14B.

[0095] When viewed from above, the distance from the rectangular annular region in the bonding pattern 14D to the first side 14B1 of the lower surface 14B is greater than the distance from the region to the fourth side 14B4 of the lower surface 14B. When viewed from above, the distance from the first side 14D1 of the outer edge of the bonding pattern 14D to the first side 14B1 of the lower surface 14B is greater than the distance from the fourth side 14D4 of the outer edge of the bonding pattern 14D to the fourth side 14B4 of the lower surface 14B.

[0096] When viewed from above, the distance from the first side 14D1 of the outer edge of the bonding pattern 14D to the first side 14B1 of the lower surface 14B is greater than 300 μm and less than 800 μm. When viewed from above, the distance from the second side 14D2 of the outer edge of the bonding pattern 14D to the second side 14B2 of the lower surface 14B exceeds 0 μm and is less than 200 μm. When viewed from above, the distance from the first side 14D1 of the outer edge of the bonding pattern 14D to the first side 14B1 of the lower surface 14B is greater than 3 times and less than 10 times the distance from the second side 14D2 of the outer edge of the bonding pattern 14D to the second side 14B2 of the lower surface 14B.

[0097] The cover body 14 has a buffer line pattern 14E. The buffer line pattern 14E is provided on the lower surface 14B of the cover body 14. The buffer line pattern 14E has a buffer line 14E1 which is a straight line at a predetermined distance from the first side 14D1 of the outer edge of the bonding pattern 14D. The buffer line pattern 14E is provided between the first side 14B1 of the lower surface 14B and the first side 14D1 of the outer edge of the bonding pattern 14D. Thus, it can be confirmed that the outer edge of the lower surface 14B of the cover body 14, i.e., the first side 14B1, is more than a predetermined distance away from the outer edge of the bonding pattern 14D, i.e., the first side 14D1.

[0098] By ensuring a specified distance based on the buffer line pattern 14E, for example, it can be confirmed that in order to ensure the application area of ​​the adhesive in the bonding of the cover body 14 and the optical component 70, the required buffer is ensured between the outer edge of the bonding pattern 14D and the outer edge of the lower surface 14B of the cover body 14, thereby achieving a stable bonding process.

[0099] In the cover body 14, the buffer line pattern 14E is not provided between the second side 14B2 of the lower surface 14B and the second side 14D2 of the outer edge of the joining pattern 14D. When viewed from above, the distance from the second side 14B2 of the lower surface 14B to the second side 14D2 of the outer edge of the joining pattern 14D is smaller than the prescribed distance from the first side 14D1 of the outer edge of the joining pattern 14D to the buffer line 14E1.

[0100] The cover 14 is joined to the base 11 in a manner that the first side 14B1 of the lower surface 14B of the cover 14 is arranged at a position closer to the first side 11C1 of the outer edge of the base 11 than the second side 14B2 of the lower surface 14B. The cover 14 is joined to the base 11 in a manner that the second side 14B2 of the lower surface 14B of the cover 14 is arranged at a position closer to the second side 11C2 of the outer edge of the base 11 than the first side 14B1 of the lower surface 14B.

[0101] The cover 14 is joined to the base 11 in such a manner that the distance from the second side 11C2 of the outer edge of the base 11 to the second side 14B2 of the lower surface 14B of the cover 14 is greater than the distance from the first side 11C1 of the outer edge of the base 11 to the first side 14B1 of the lower surface 14B of the cover 14 when viewed from above. By adopting the cover 14 that satisfies this requirement, the size of the cover 14 can be miniaturized, and production efficiency can be improved. The miniaturization of the cover 14 also reduces the weight of the cover 14, and the light-emitting device 1 can be made lighter.

[0102] The difference between the distance from the second side 11C2 of the outer edge of the base 11 to the second side 14B2 of the lower surface 14B of the cover 14 and the distance from the first side 11C1 of the outer edge of the base 11 to the first side 14B1 of the lower surface 14B of the cover 14 is 300 μm or more. Alternatively, the difference may be 500 μm or more. Alternatively, the difference may be 600 μm or more. The larger the difference, the more it contributes to the miniaturization of the cover 14.

[0103] In a plan view, the outer edge of the lower surface 14B of the cover 14 is located on the second upper surface 11C of the base 11. Thus, by bonding the cover 14 to the base 11, a closed space is formed inside the package 10. The distance from the second side 11C2 of the outer edge of the base 11 to the second side 14B2 of the lower surface 14B of the cover 14 can be said to be smaller than the distance from the second side 11C2 of the outer edge of the base 11 to the second side 11C6 of the inner edge of the base 11.

[0104] The cover 14 is joined to the base 11 in such a manner that, in a plan view, the distance from the third side 11C3 of the outer edge of the base 11 to the third side 14B3 of the lower surface 14B of the cover 14 is greater than the distance from the first side 11C1 of the outer edge of the base 11 to the first side 14B1 of the lower surface 14B of the cover 14. By adopting the cover 14 that satisfies this requirement, the size of the cover 14 can be miniaturized.

[0105] The cover 14 is joined to the base 11 in such a manner that, in a plan view, the distance from the fourth side 11C4 of the outer edge of the base 11 to the fourth side 14B4 of the lower surface 14B of the cover 14 is greater than the distance from the first side 11C1 of the outer edge of the base 11 to the first side 14B1 of the lower surface 14B of the cover 14. By adopting the cover 14 that satisfies this requirement, the size of the cover 14 can be miniaturized.

[0106] The cover 14 has light-transmitting properties. Here, light-transmitting properties refer to a transmittance of 80% or more with respect to light incident on the cover 14. The cover 14 may have a non-light-transmitting region (region without light-transmitting properties) in part.

[0107] The cover 14 can be formed using glass as a main material, for example. The cover 14 can be formed using sapphire as a main material, for example. The cover 14 can be formed by providing the bonding pattern 14D and the buffer line pattern 14E on a light-transmitting member formed using a main material.

[0108] The bonding pattern 14D may be formed by using a metal material as a main material, for example. Examples of the metal material that is the main material of the bonding pattern 13A include single metals such as Cu, Ag, Ni, Au, Sn, Ti, and Pd, or alloys containing these metals. The bonding pattern 14D may be composed of one or more metal layers, for example. The buffer line pattern 14E may be formed using the same material as the bonding pattern 14D.

[0109] (Light emitting element 20)

[0110] The light emitting element 20 has an upper surface 21A, a lower surface 21B, and a plurality of side surfaces 21C. The shape of the upper surface 21A is a rectangle. The rectangle is a rectangle having a long side and a short side. The outer shape of the light emitting element 20 when viewed from above is a rectangle. In addition, the rectangle is a rectangle having a long side and a short side. The shape of the upper surface 21A and the outer shape of the light emitting element 20 when viewed from above are not limited thereto.

[0111] The light emitting element 20 has a light emitting surface 22 for emitting light. For example, the side surface 21C can be the light emitting surface 22. The side surface 21C that becomes the light emitting surface 22 intersects with the short side of the upper surface 21A. In addition, for example, the upper surface 21A can be the light emitting surface 22. The light emitting element 20 has one or more light emitting surfaces 22.

[0112] For example, a light emitting element that emits blue light can be used as the light emitting element 20. For example, a light emitting element that emits green light can be used as the light emitting element 20. For example, a light emitting element that emits red light can be used as the light emitting element 20. A light emitting element that emits light of other colors or wavelengths can also be used as the light emitting element 20.

[0113] Here, blue light refers to light whose emission peak wavelength is within the range of 420nm to 494nm. Green light refers to light whose emission peak wavelength is within the range of 495nm to 570nm. Red light refers to light whose emission peak wavelength is within the range of 605nm to 750nm.

[0114] As the light emitting element 20 emitting blue light or the light emitting element 20 emitting green light, a light emitting element including a nitride semiconductor can be cited. As the nitride semiconductor, for example, GaN, InGaN, AlGaN and other GaN-based semiconductors can be used. As the light emitting element 20 emitting red light, a light emitting element including an InAlGaP-based, GaInP-based, GaAs, AlGaAs and other GaAs-based semiconductors can be cited.

[0115] For example, a semiconductor laser element can be used in the light emitting element 20. A single-emitter semiconductor laser element composed of one emitter can be used in the light emitting element 20. A multi-emitter semiconductor laser element composed of a plurality of emitters can be used in the light emitting element 20. The light emitting element 20 is not limited to a semiconductor laser element, and a light emitting diode or the like can also be used.

[0116] Here, a semiconductor laser element will be described as an example of the light emitting element 20 .

[0117] The semiconductor laser element emits a directional laser. The diffused divergent light is emitted from the light exit surface 22 of the semiconductor laser element. The light emitted from the semiconductor laser element forms an elliptical far field pattern (hereinafter referred to as "FFP") on a surface parallel to the light exit surface 22. FFP refers to the shape and light intensity distribution of the emitted light at a position away from the light exit surface of the semiconductor laser element.

[0118] Here, light passing through the center of the elliptical shape of the FFP, in other words, light with peak intensity in the light intensity distribution of the FFP, is referred to as light traveling along the optical axis or light passing through the optical axis. 2 Light with an intensity above this is called main light.

[0119] The shape of the FFP of the light emitted from the semiconductor laser element is an elliptical shape in which the stacking direction is longer than the direction perpendicular to the stacking direction on the plane parallel to the light emitting surface 22. The stacking direction refers to the direction in which multiple semiconductor layers including the active layer in the semiconductor laser element are stacked. The direction perpendicular to the stacking direction can also be called the surface direction of the semiconductor layer. The long axis direction of the elliptical shape of the FFP can also be called the fast axis direction of the semiconductor laser element, and the short axis direction can be called the slow axis direction of the semiconductor laser element.

[0120] Based on the light intensity distribution of FFP, 1 / e of the peak light intensity 2 The angle at which the light intensity of the semiconductor laser element spreads is defined as the spread angle of the light. Here, the spread angle of the light is the ratio of the peak light intensity (the light passing through the optical axis) to 1 / e of the peak light intensity. 2The spread angle of light is expressed as the angle of the light intensity. The spread angle of light is 1 / e of the peak light intensity. 2 In addition to the light intensity of the peak light intensity, it is sometimes also calculated based on the light intensity at half the peak light intensity. In the description of this specification, when simply referring to the "light spread angle", it means 1 / e of the peak light intensity. 2 The spread angle of light under the light intensity.

[0121] The spread angle of the fast axis direction of the light emitted from the semiconductor laser element may be greater than 15 degrees and less than 40 degrees. The spread angle of the slow axis direction of the light may be greater than 0 degrees and less than 10 degrees. The spread angle of the fast axis direction of the light is greater than the spread angle of the slow axis direction.

[0122] For example, the spread angle of the fast axis direction of the blue light emitted from the semiconductor laser element may be greater than 15 degrees and less than 30 degrees, and the spread angle of the slow axis direction may be greater than 0 degrees and less than 10 degrees. For example, the spread angle of the fast axis direction of the green light emitted from the semiconductor laser element may be greater than 15 degrees and less than 30 degrees, and the spread angle of the slow axis direction may be greater than 0 degrees and less than 10 degrees. For example, the spread angle of the fast axis direction of the red light emitted from the semiconductor laser element may be greater than 20 degrees and less than 40 degrees, and the spread angle of the slow axis direction may be greater than 0 degrees and less than 10 degrees.

[0123] (Abutment 30)

[0124] The base 30 has an upper surface 31A, a lower surface 31B, and one or more side surfaces 31C. The upper surface 31A can be said to be a mounting surface for mounting other components. The shape of the upper surface 31A is a rectangle. The rectangle of the upper surface 31A can have a short side and a long side. The shape of the upper surface 31A may not be a rectangle.

[0125] The outer shape of the base 30 when viewed from above is a rectangle. The rectangle of the base 30 may have a short side and a long side. The outer shape of the base 30 when viewed from above may not be a rectangle. The base 30 may have an outer shape in which the length in one direction (hereinafter, this direction is referred to as the short side direction of the base 30) when viewed from above is smaller than the length in the direction perpendicular to it (hereinafter, this direction is referred to as the long side direction of the base 30). In the illustrated base 30, the short side direction is the same direction as the X direction, and the long side direction is the same direction as the Y direction.

[0126] The base 30 may be composed of a substrate 32A and an upper metal component 32B. The base 30 may be composed of a lower metal component 32C. The upper metal component 32B is provided on the upper surface side of the substrate 32A. The lower metal component 32C is provided on the lower surface side of the substrate 32A. The base 30 further includes a wiring layer 33. The wiring layer 33 is provided on the upper metal component 32B.

[0127] The substrate 32A has insulating properties. The substrate 32A is formed of, for example, silicon nitride, aluminum nitride, or silicon carbide. A ceramic having relatively good heat dissipation properties (high thermal conductivity) can be selected as the main material of the substrate 32A.

[0128] The upper metal component 32B is mainly made of metals such as copper and aluminum. The upper metal component 32B has one or more metal layers. The upper metal component 32B may have a plurality of metal layers mainly made of different metals.

[0129] The lower metal component 32C is mainly made of metals such as copper and aluminum. The lower metal component 32C has one or more metal layers. The lower metal component 32C may have a plurality of metal layers mainly made of different metals.

[0130] The wiring layer 33 can be formed using metal. For example, the wiring layer 33 can be formed using AuSn solder (AuSn metal layer).

[0131] (Reflection member 40)

[0132] The reflecting member 40 has a lower surface 41A and a light reflecting surface 41B for reflecting light. The light reflecting surface 41B is inclined relative to the lower surface 41A. The straight line connecting the lower end and the upper end of the light reflecting surface 41B is inclined relative to the lower surface 41A. The angle at which the light reflecting surface 41B is inclined relative to the lower surface 41A is referred to as the inclination angle of the light reflecting surface 41B.

[0133] The light reflecting surface 41B is a flat surface. The light reflecting surface 41B may also be a curved surface. The inclination angle of the light reflecting surface 41B is 45 degrees. The inclination angle of the light reflecting surface 41B may not be 45 degrees.

[0134] Glass, metal, etc. can be used as the main material of the reflector 40. It is better to use a highly heat-resistant material as the main material of the reflector 40. For example, glass such as quartz or BK7 (borosilicate glass), and metal such as Al can be used as the main material. The reflector 40 can also be formed by using Si as the main material.

[0135] If the main material is a reflective material such as Al, the light reflecting surface 41B can be formed by the main material. Instead of forming the light reflecting surface 41B by the main material, the main material can be used to form the approximate shape of the reflective member 40, and the light reflecting surface 41B can be formed on the surface of the approximate shape. In this case, the light reflecting surface 41B can be formed using, for example, a metal layer such as Ag or Al, or a dielectric multilayer film such as Ta2O5 / SiO2, TiO2 / SiO2, or Nb2O5 / SiO2.

[0136] The reflectivity of the light reflecting surface 41B for the peak wavelength of the light irradiated to the light reflecting surface 41B is 90% or more. The reflectivity may be 95% or more. The reflectivity may be 99% or more. The light reflectivity is 100% or less or less than 100%.

[0137] (Protective element 50)

[0138] The protection element 50 has an upper surface 51A, a lower surface 51B, and one or more side surfaces 51C. The shape of the protection element 50 is a cube. The shape of the protection element 50 may not be a cube.

[0139] The protection element 50 is used to prevent a specific element (for example, a semiconductor laser element) from being damaged by excessive current flowing therethrough. As the protection element 50, for example, a Zener diode can be cited. As the Zener diode, a Zener diode formed of Si can be used.

[0140] (Wiring 60)

[0141] Wiring 60 is a linear conductive material with two ends as a junction. The junctions at the two ends become the junctions that are joined to other components. Wiring 60 is used for electrical connection between two components. Wiring 60 is, for example, a metal wire. Metals such as gold, aluminum, silver, and copper can be used.

[0142] (Optical component 70)

[0143] The optical component 70 has an upper surface 71A, a lower surface 71B, and one or more side surfaces 71C. The optical component 70 imparts an optical effect to light incident on the optical component 70. The optical effects imparted to the light by the optical component 70 include, for example, focusing, collimation, diffusion, polarization, diffraction, combining, guiding, reflection, and wavelength conversion.

[0144] The optical component 70 has an optical action surface that imparts an optical effect. The upper surface 71A, the lower surface 71B, or the side surface 71C can be the optical action surface. Alternatively, the optical action surface can be provided at a position different from the upper surface 71A, the lower surface 71B, and the side surface 71C. For example, the optical action surface can be formed inside the optical component 70 instead of on the surface.

[0145] The optical component 70 may have one or more lens surfaces 71D. The lens surface 71D is an optical action surface of the optical component 70. The optical component 70 having the lens surface 71D may also be referred to as a lens component. The optical component 70 is used to impart an optical effect of focusing, diffusing, or collimating light emitted from the optical component 70 through the lens surface 71D. For example, the optical component 70 is a collimating lens that causes light incident on the optical component 70 to be collimated light and then emitted.

[0146] One or each lens surface 71D is provided on the upper surface 71A side. The lens surface 71D may also be provided on the lower surface 71B side. The upper surface 71A and the lower surface 71B are planes. One or each lens surface 71D intersects with the upper surface 71A. When viewed from above, one or each lens surface 71D is surrounded by the upper surface 71A.

[0147] The outer shape of the optical component 70 in a plan view is a rectangle. The outer shape of the optical component 70 in a plan view may not be a rectangle. The lower surface 71B is a flat surface. The lens surface 71D is not formed on the lower surface 71B side of the optical component 70.

[0148] The outer edge shape of the lower surface 71B of the optical component 70 is a rectangle. The rectangle may have a long side and a short side. The rectangle has a first side 71B1, a second side 71B2, a third side 71B3 and a fourth side 71B4. The second side 71B2 is parallel to the first side 71B1. The third side 71B3 is perpendicular to the first side 71B1. The fourth side 71B4 is parallel to the third side 71B3. The first side 71B1 is the long side of the rectangle.

[0149] In the optical component 70, in a plan view, the distance from the first side 71B1 of the optical component 70 to one or more lens surfaces 71D is the same as the distance from the second side 71B2 of the optical component 70 to one or more lens surfaces 71D. The same here includes a difference within ±60 μm.

[0150] In the optical component 70, in a plan view, the distance from the third side 71B3 of the optical component 70 to one or more lens surfaces 71D is the same as the distance from the fourth side 71B4 of the optical component 70 to one or more lens surfaces 71D. The same here includes a difference within ±60 μm.

[0151] In the optical component 70, when viewed from above, in a direction perpendicular to the first side 71B1 of the optical component 70, the maximum width of one or more lens surfaces 71D is more than 65% of the maximum width of the optical component 70. Alternatively, the maximum width of the former is more than 70% of the maximum width of the latter. Alternatively, the maximum width of the former is more than 75% of the maximum width of the latter. In the optical component 70, the larger the proportion of the width occupied by the lens surface 71D, the smaller the proportion of the blank space outside the lens, which helps to miniaturize or lighten the optical component 70.

[0152] In the optical component 70, the portion overlapping with the lens surface 71D when viewed from above is the lens portion 72A. In the optical component 70, the portion overlapping with the upper surface 71A when viewed from above is the non-lens portion 72B. The lens portion 72A overlaps with one or more lens surfaces 71D when viewed from above. The non-lens portion 72B does not overlap with one or more lens surfaces 71D when viewed from above. The lower surface 71B has an area constituting the lower surface of one or each lens portion 72A and an area constituting the lower surface of the non-lens portion 72B.

[0153] The optical component 70 may include a plurality of lens surfaces 71D formed continuously in one direction. The direction in which the plurality of lens surfaces 71D are arranged in a plan view is referred to as a lens connection direction. In the illustrated optical component 70, the connection direction is the same direction as the X direction.

[0154] The plurality of lens surfaces 71D are formed so that the vertices of the lens surfaces 71D are arranged on a straight line. The virtual straight line connecting the vertices is parallel to the lower surface 71B of the optical member 70. The parallelism here includes a difference within ±5 degrees.

[0155] The curvatures of part or all of the plurality of lens surfaces 71D, or two or more lens surfaces 71D, may be the same. The plurality of lens surfaces 71D may all have the same curvature.

[0156] The optical component 70 is light-transmissive. The transmittance of the optical component 70 to the peak wavelength of the light incident on the optical component 70 is 80% or more. The optical component 70 may also include a light-transmissive region and a light-transmissive region (hereinafter referred to as a non-light-transmissive region). In the non-light-transmissive region, the transmittance to the peak wavelength of the light incident on the optical component 70 is 50% or less. The optical component 70 may be formed using glass such as BK7, for example.

[0157] (Jointing member 80)

[0158] The joining component 80 is formed by curing an adhesive. The adhesive is used to join a plurality of components. For example, an ultraviolet curing resin adhesive can be used as the adhesive. For example, a thermosetting resin adhesive can be used as the adhesive. As the ultraviolet curing resin adhesive, an epoxy resin or an acrylate resin adhesive can be used. As the thermosetting resin adhesive, an epoxy resin or a silicone resin adhesive can be used.

[0159] Next, the light emitting device 1 will be described.

[0160] (Light-emitting device 1)

[0161] In the light emitting device 1, one or more light emitting elements 20 are arranged in the internal space of the package 10. One or more light emitting elements 20 are arranged on the first upper surface 11A of the base 11. One or each light emitting element 20 is arranged on the first upper surface 11A via the base 30.

[0162] One or each light emitting element 20 emits light in a predetermined direction from the light emitting surface 22. Light passing through the optical axis travels in the predetermined direction from the light emitting surface 22 of one or each light emitting element 20. The predetermined direction is, for example, the positive direction of Y in the light emitting device 1 shown in the figure.

[0163] The first side 11C5 of the inner edge of the base 11 is located away from the light emitting element 20 in the positive direction of Y. The second side 11C6 of the inner edge of the base 11 is located away from the light emitting element 20 in the negative direction of Y. The third side 11C7 of the inner edge of the base 11 is located away from the light emitting element 20 in the negative direction of X. The fourth side 11C8 of the inner edge of the base 11 is located away from the light emitting element 20 in the positive direction of X.

[0164] In the illustrated light emitting device 1, a first side 11C1 of the outer edge of the substrate 11 is parallel to the X direction. A first side 11C5 of the inner edge of the substrate 11 is parallel to the X direction. A third side 11C3 of the outer edge of the substrate 11 is parallel to the Y direction. A third side 11C7 of the inner edge of the substrate 11 is parallel to the Y direction. The parallelism here includes a difference of ±3 degrees.

[0165] In the illustrated light emitting device 1, the first side 14A1 of the upper surface 14A of the cover 14 is parallel to the X direction. The first side 14B1 of the lower surface 14B of the cover 14 is parallel to the X direction. The third side 14A3 of the upper surface 14A of the cover 14 is parallel to the Y direction. The third side 14B3 of the lower surface 14B of the cover 14 is parallel to the Y direction. The parallelism here includes a difference of ±3 degrees.

[0166] In the illustrated light emitting device 1, the first side 11D1 of the outer edge of the joining pattern 14D is parallel to the X direction. The first side 11D5 of the inner edge of the joining pattern 14D is parallel to the X direction. The third side 11D3 of the outer edge of the joining pattern 14D is parallel to the Y direction. The third side 11D7 of the inner edge of the joining pattern 14D is parallel to the Y direction. The buffer line 14E1 is parallel to the X direction. The parallelism here includes a difference of ±3 degrees.

[0167] The light emitting device 1 may include a plurality of light emitting elements 20. The plurality of light emitting elements 20 are arranged in a row in one direction. The plurality of light emitting elements 20 are arranged in a row in a second direction perpendicular to the first direction when viewed from above. The plurality of light emitting elements 20 emit light in the first direction from the light emitting surface 22, respectively. The plurality of light emitting elements 20 are arranged at equal intervals in the second direction.

[0168] In the light emitting device 1, one or more bases 30 are arranged in the internal space of the package 10. One or more bases 30 are arranged on the first upper surface 11A of the base 11. The width of the base 30 in the first direction is larger than the width in the second direction.

[0169] The light emitting device 1 may include a plurality of bases 30. In the light emitting device 1, one base 30 corresponds to one light emitting element 20. The plurality of bases 30 are arranged in a row along the second direction.

[0170] In the light emitting device 1, one or more reflective components 40 are arranged in the internal space of the package 10. One or more reflective components 40 are arranged on the first upper surface 11A of the base 11. One or more reflective components 40 are arranged at a position away from one or more light emitting elements 20 in a first direction. When viewed from above, one or more reflective components 40 are arranged between one or more light emitting elements 20 and the first side 11C5 of the inner edge of the base 11.

[0171] One or more reflecting members 40 reflect light emitted from one or more light emitting elements 20. One or each reflecting member 40 reflects more than 90% of the light from the light emitting element 20 irradiated toward the light reflecting surface 41B. Light traveling in the first direction from the light emitting surface 22 of the light emitting element 20 is reflected upward by the light reflecting surface 41B.

[0172] The light emitting device 1 may include a plurality of reflective members 40. In the light emitting device 1, one reflective member 40 corresponds to one light emitting element 20. The plurality of reflective members 40 are arranged in a row along the second direction.

[0173] In the light emitting device 1 , one or more protection elements 50 are disposed in the internal space of the package 10 . One or more protection elements 50 are disposed on the first upper surface 11A of the base 11 . One or each protection element 50 is disposed on the first upper surface 11A via the base 30 . One or each protection element 50 protects the light emitting element 20 .

[0174] In one or each base 30, a light emitting element 20 and a protective element 50 are mounted on the upper surface 31A of the base 30. The light emitting element 20 is arranged on the wiring layer 33 of the base 30. The protective element 50 is arranged on the wiring layer 33 of the base 30. The protective element 50 can be arranged on the same wiring layer 33 as the wiring layer 33 on which the light emitting element 20 is arranged. That is, a region for arranging the light emitting element 20 and a region for arranging the protective element 50 can be provided on one wiring layer 33.

[0175] In the light emitting device 1, one or more light emitting elements 20 are provided in the internal space of the package 10. The plurality of wirings 60 include wirings 60 joined to the first wiring portion 12A1. The plurality of wirings 60 include wirings 60 joined to the first wiring portion 12A1 provided on the upper surface 11G of the first step portion 11F1 and wirings 60 joined to the first wiring portion 12A1 provided on the upper surface 11G of the second step portion 11F2.

[0176] The plurality of wirings 60 included in the light emitting device 1 include two or more wirings 60 provided to electrically connect one or more light emitting elements 20 to the package 10 . Thus, the one or more light emitting elements 20 are electrically connected to the package 10 .

[0177] The plurality of wirings 60 included in the light emitting device 1 include two or more wirings 60 provided to electrically connect the one or more protection elements 50 to the package 10 . Thus, the one or more protection elements 50 are electrically connected to the package 10 .

[0178] In the light emitting device 1, the optical component 70 is fixed to the package 10. The optical component 70 is bonded to the cover 14. The lower surface 71B of the optical component 70 is bonded to the upper surface 14A of the cover 14. The optical component 70 is bonded to the cover 14 via an adhesive. The adhesive is sandwiched between the upper surface 14A of the cover 14 and the lower surface 71B of the optical component 70. The adhesive is cured to form a bonding component 80. One or more bonding components 80 bond the cover 14 to the optical component 70.

[0179] The light emitted from the upper surface of the cover 14 is incident on the optical member 70. The light emitted from the upper surface of the cover 14 is incident on the optical action surface 71D and is given an optical action. The light given an optical action is emitted from the optical member 70.

[0180] Light emitted from one or more light emitting elements 20 passes through one or more lens surfaces 71D. By passing through one or more lens surfaces 71D, for example, collimated light is emitted from optical component 70. Light emitted from optical component 70 may be referred to as light emitted from light emitting device 1.

[0181] The optical component 70 is bonded to the base 11 in such a manner that the first side 71B1 of the lower surface 71B is arranged closer to the first side 11C1 of the outer edge of the base 11 than the second side 71B2 of the lower surface 71B. The optical component 70 is bonded to the base 11 in such a manner that the second side 71B2 of the lower surface 71B is arranged closer to the second side 11C2 of the outer edge of the base 11 than the first side 71B1 of the lower surface 71B.

[0182] In the illustrated light emitting device 1 , the first side 71B1 of the optical component 70 is parallel to the X direction. The third side 71B3 of the optical component 70 is parallel to the Y direction. The parallelism here includes a difference of ±3 degrees.

[0183] One or more bonding members 80 are provided in the region near the four corners of the outer edge of the rectangle in the lower surface 71B of the optical member 70 when viewed from above. Thus, the adhesive is mainly provided for the non-lens portion 72B, so that the bonding member 80 can be prevented from becoming an obstacle to the light passing through the lens surface 71D.

[0184] It can be said that one or more joining components 80 are arranged on the lower surface 71B of the optical component 70 in a first area R1 near the first corner E1 including the corner where the first side 71B1 and the third side 71B3 intersect, a second area R2 near the second corner E2 including the corner where the second side 71B2 and the third side 71B3 intersect, a third area R3 near the third corner E3 including the corner where the first side 71B1 and the fourth side 71B4 intersect, and a fourth area R4 near the fourth corner E4 including the corner where the second side 71B2 and the fourth side 71B4 intersect.

[0185] Here, "the area near the corner" does not need to include the corner. In the illustrated light emitting device 1, one or more joining components 80 may not overlap with the first corner E1, the second corner E2, the third corner E3, and the fourth corner E4. Alternatively, one or more joining components 80 may overlap with some of the first corner E1, the second corner E2, the third corner E3, and the fourth corner E4.

[0186] When the corner of the lower surface 71B of the optical component 70 is processed so that the sides do not directly intersect, the point where the extended lines of the sides intersect each other is defined as the corner, and the area including the vicinity thereof is defined as the “area including the vicinity of the corner”.

[0187] Here, the "near corner" on the lower surface 71B of the optical component 70 can be defined as the area of ​​the portion overlapping with the lower surface 71B in a circular area with the corner as the center and the maximum length that does not overlap with one or more lens surfaces 71D when viewed from above as the radius. The interpretation of "near the corner" may also not be limited to this definition. For example, the "near corner" may also be defined as the area of ​​the portion overlapping with the lower surface 71B in a circular area with a length of 1 / 2 of the maximum length as the radius. In addition, the "near corner" may also be defined based on a radius smaller than 1 / 2 of the maximum length.

[0188] One or more bonding members 80 have a first bonding portion provided in the first region R1, a second bonding portion provided in the second region R2, a third bonding portion provided in the third region R3, and a fourth bonding portion provided in the fourth region R4. In these bonding portions, the bonding members 80 forming each bonding portion can be separated from each other.

[0189] One or more engaging components 80 include a first engaging component 81 including a first engaging portion. One or more engaging components 80 include a second engaging component 82 including a second engaging portion. One or more engaging components 80 include a third engaging component 83 including a third engaging portion. One or more engaging components 80 include a fourth engaging component 84 including a fourth engaging portion.

[0190] The first bonding member 81 , the second bonding member 82 , the third bonding member 83 , and the fourth bonding member 84 may be extended to the outside of the first region R1 , the second region R2 , the third region R3 , and the fourth region R4 , respectively, in a plan view.

[0191] When viewed from above, the first bonding component 81 may overlap with a portion of the lens surface 71D. When viewed from above, the second bonding component 82 may overlap with a portion of the lens surface 71D. When viewed from above, the third bonding component 83 may overlap with a portion of the lens surface 71D. When viewed from above, the fourth bonding component 84 may overlap with a portion of the lens surface 71D. When viewed from above, the first bonding component 81, the second bonding component 82, the third bonding component 83, and the fourth bonding component 84 each overlap only a portion of one lens surface 71D.

[0192] The lens surface 71D overlapping with the first bonding member 81 when viewed from above and the lens surface 71D overlapping with the second bonding member 82 when viewed from above are the same lens surface 71D. The lens surface 71D overlapping with the third bonding member 83 when viewed from above and the lens surface 71D overlapping with the fourth bonding member 84 when viewed from above are the same lens surface 71D. The lens surface 71D overlapping with the first bonding member 81 when viewed from above and the lens surface 71D overlapping with the third bonding member 83 when viewed from above may be different lens surfaces 71D.

[0193] When viewed from above, the vertex of one or each lens surface 71D is located closer to the first side 11C1 than the second side 11C2 of the outer edge of the substrate 11. In other words, when viewed from above, the distance from the first side 11C1 of the outer edge of the substrate 11 to the vertex of the lens surface 71D is smaller than the distance from the second side 11C2 of the outer edge of the substrate 11 to the vertex of the lens surface 71D. In this way, the lens portion 72A of the optical component 70 is arranged closer to the first side 11C1 than the second side 11C2 of the substrate 11.

[0194] The first joining member 81 has an endpoint EP11 on the first side 14A1 and an endpoint EP12 on the third side 14A3. The first endpoint EP11 is a point located on the first side 14A1 of the cover body 14 and is farthest from the first corner E1 in the region where the cover body 14 and the first joining member 81 overlap when viewed from above. The second endpoint EP12 is a point located on the third side 14A3 of the cover body 14 and is farthest from the first corner E1 in the region where the cover body 14 and the first joining member 81 overlap when viewed from above.

[0195] In a plan view, the distance from the second end point EP12 to one or more lens surfaces 71D is smaller than the distance from the first end point EP11 to one or more lens surfaces 71D. Due to the miniaturization of the cover 14, the first bonding member 81 can be bonded in this manner.

[0196] The third joining member 83 has an endpoint EP31 on the first side 14A1 and an endpoint EP32 on the fourth side 14A4. The first endpoint EP31 is a point located on the first side 14A1 of the cover body 14 and is farthest from the third corner E3 in the region where the cover body 14 and the third joining member 83 overlap when viewed from above. The second endpoint EP32 is a point located on the fourth side 14A4 of the cover body 14 and is farthest from the third corner E3 in the region where the cover body 14 and the third joining member 83 overlap when viewed from above.

[0197] In a plan view, the distance from the second end point EP32 to one or more lens surfaces 71D is smaller than the distance from the first end point EP31 to one or more lens surfaces 71D. Due to the miniaturization of the cover 14, the third bonding member 83 can be bonded in this manner.

[0198] The second joining member 82 has endpoints on the third side 14A3, namely, a first endpoint EP21 and a second endpoint EP22. The first endpoint EP21 is a point located on the third side 14A3 of the cover body 14 and farthest from the second corner E2 in the area where the cover body 14 and the second joining member 82 overlap when viewed from above. The second endpoint EP22 is a point located on the third side 14A3 of the cover body 14 and closest to the second corner E2 in the area where the cover body 14 and the second joining member 82 overlap when viewed from above. The area where the cover body 14 and the second joining member 82 overlap does not overlap with the second side 14A2 of the cover body 14 when viewed from above.

[0199] The fourth joining member 84 has endpoints on the fourth side 14A4, namely, a first endpoint EP41 and a second endpoint EP42. The first endpoint EP41 is a point located on the fourth side 14A4 of the cover body 14 and farthest from the fourth corner E4 in the area where the cover body 14 and the fourth joining member 84 overlap when viewed from above. The second endpoint EP42 is a point located on the fourth side 14A4 of the cover body 14 and closest to the fourth corner E4 in the area where the cover body 14 and the fourth joining member 84 overlap when viewed from above. The area where the cover body 14 and the fourth joining member 84 overlap does not overlap with the second side 14A2 of the cover body 14 when viewed from above.

[0200] When viewed from above, the width from the first side 71B1 to the second side 71B2 of the optical component 70 is smaller than the width from the first side 11C1 to the second side 11C2 of the outer edge of the base 11. When viewed from above, the width from the first side 71B1 to the second side 71B2 of the optical component 70 is smaller than the width from the first side 14A1 to the second side 14A2 of the upper surface 14A of the cover 14.

[0201] When viewed from above, the width from the third side 71B3 to the fourth side 71B4 of the optical component 70 is smaller than the width from the third side 11C3 to the fourth side 11C4 of the outer edge of the base 11. When viewed from above, the width from the third side 71B3 to the fourth side 71B4 of the optical component 70 is larger than the width from the third side 14A3 to the fourth side 14A4 of the upper surface 14A of the cover 14.

[0202] In a plan view, one or more bonding members 80 are provided in a region sandwiched by a virtual straight line parallel to and passing through the first side 11C1 of the outer edge of the base 11 and a virtual straight line parallel to and passing through the second side 11C6 of the inner edge of the base 11. In addition, in a plan view, one or more bonding members 80 are not provided in a region sandwiched by a virtual straight line parallel to and passing through the second side 11C2 of the outer edge of the base 11 and a virtual straight line parallel to and passing through the second side 11C2 of the inner edge of the base 11.

[0203] When viewed from above, the ratio of the area of ​​the first bonding component 81 provided in the area sandwiched by the virtual straight line parallel to the third side 71B3 of the optical component 70 and passing through the third side 71B3 and the virtual straight line parallel to the third side 11C7 of the inner edge of the substrate 11 and passing through the third side 11C7 is 50% or more and 100% or less relative to the area where the first bonding component 81 is provided. In addition, the ratio is preferably 50% or more and 80% or less. If the ratio becomes smaller, the width of the optical component 70 in the direction parallel to the second side 71B2 tends to increase, and if the ratio becomes larger, the width of the optical component 70 in the direction parallel to the first side 71B1 tends to increase, so it is preferred to adjust the first bonding component 81 to an appropriate ratio.

[0204] In a plan view, the ratio of the area of ​​the third bonding member 83 provided in the region sandwiched by a virtual straight line parallel to and passing through the fourth side 71B4 of the optical member 70 and a virtual straight line parallel to and passing through the fourth side 11C8 of the inner edge of the base 11 is 50% to 100% with respect to the area where the third bonding member 83 is provided. Preferably, the ratio is 50% to 80%.

[0205] One or more bonding members 80 preferably do not obstruct the optical path of light passing through the lens portion 72A, so the area where one or more bonding members 80 overlap with the lens portion 72A is preferably small when viewed from above. When viewed from above, the distance from the end point EP12 to one or more lens surfaces 71D is smaller than the distance from the end point EP11 to one or more lens surfaces 71D, so by increasing the width from the third side 71B3 to the fourth side 71B4 of the optical component 70, the coating area of ​​the adhesive on the lower surface 71B of the optical component 70 can be increased, and the bonding balance is improved.

[0206] When viewed from above, the width from the first side 71B1 to the second side 71B2 of the optical component 70 is smaller than the width from the first side 14B1 to the second side 14B2 of the lower surface 14B of the cover body 14. When viewed from above, the width from the third side 71B3 to the fourth side 71B4 of the optical component 70 is larger than the width from the third side 14B3 to the fourth side 14B4 of the lower surface 14B of the cover body 14.

[0207] The optical component 70 is fixed to the package 10 in such a manner that the first side 71B1 of the optical component 70 is located between the first side 11C1 of the outer edge and the first side 11C5 of the inner edge of the base 11, and the second side 71B2 of the optical component 70 is located between the second side 11C2 of the outer edge and the second side 11C6 of the inner edge of the base 11 in a plan view.

[0208] The optical component 70 is fixed to the package 10 in such a manner that the third side 71B3 of the optical component 70 is located between the third side 11C3 of the outer edge and the third side 11C7 of the inner edge of the base 11, and the fourth side 71B4 of the optical component 70 is located between the fourth side 11C4 of the outer edge and the fourth side 11C8 of the inner edge of the base 11 when viewed from above.

[0209] In a plan view, the outer edge of the optical component 70 is included inside the outer edge of the outer frame of the base 11. By preventing the side surface 71C of the optical component 70 from protruding laterally from the package 10, the optical component 70 is less likely to be peeled off from the package 10 due to external force.

[0210] The optical component 70 is fixed to the package 10 in a manner that the first side 71B1 of the optical component 70 is located between the first side 14A1 of the cover 14 and the first side 11C5 of the inner edge of the base 11 when viewed from above. The optical component 70 is fixed to the package 10 in a manner that the first side 71B1 of the optical component 70 is located between the first side 14B1 of the cover 14 and the first side 11C5 of the inner edge of the base 11 when viewed from above. Thus, an area that can be applied to the first side 71B1 can be ensured, and stable bonding of the optical component 70 can be achieved.

[0211] The optical component 70 is fixed to the package 10 in a manner that the second side 71B2 of the optical component 70 is located between the second side 14A2 of the cover 14 and the second side 11C6 of the inner edge of the base 11 when viewed from above. The optical component 70 is fixed to the package 10 in a manner that the second side 71B2 of the optical component 70 is located between the first side 14B1 of the cover 14 and the first side 11C5 of the inner edge of the base 11 when viewed from above.

[0212] The optical component 70 is fixed to the package 10 in such a manner that the third side 71B3 of the optical component 70 is located between the third side 11C3 of the outer edge and the third side 11C7 of the inner edge of the base 11, and the fourth side 71B4 of the optical component 70 is located between the fourth side 11C4 of the outer edge and the fourth side 11C8 of the inner edge of the base 11 when viewed from above.

[0213] The optical component 70 is fixed to the package 10 in a manner that the third side 71B3 of the optical component 70 is located between the third side 14A3 of the cover 14 and the third side 11C3 of the outer edge of the base 11 when viewed from above. The optical component 70 is fixed to the package 10 in a manner that the third side 71B3 of the optical component 70 is located between the third side 14B3 of the cover 14 and the third side 11C3 of the outer edge of the base 11 when viewed from above.

[0214] The optical component 70 is fixed to the package 10 in a manner that the fourth side 71B4 of the optical component 70 is located between the fourth side 14A4 of the cover 14 and the fourth side 11C4 of the outer edge of the base 11 when viewed from above. The optical component 70 is fixed to the package 10 in a manner that the fourth side 71B4 of the optical component 70 is located between the fourth side 14B4 of the cover 14 and the fourth side 11C4 of the outer edge of the base 11 when viewed from above.

[0215] The optical component 70 is joined to the cover body 14 in such a manner that, when viewed from above, the distance from the first side 14A1 of the upper surface 14A of the cover body 14 to one or more lens surfaces 71D is smaller than the distance from the second side 14A2 of the upper surface 14A of the cover body 14 to one or more lens surfaces 71D. In this way, the optical component 70 is arranged closer to the first side 14A1 than the second side 14A2 of the upper surface 14A of the cover body 14.

[0216] The optical component 70 is joined to the cover body 14 in such a manner that the distance from the first side 14B1 of the lower surface 14B of the cover body 14 to one or more lens surfaces 71D is smaller than the distance from the second side 14B2 of the lower surface 14B of the cover body 14 to one or more lens surfaces 71D when viewed from above. In this way, the optical component 70 is arranged closer to the first side 14B1 than the second side 14B2 of the lower surface 14B of the cover body 14. By arranging in this way, in a small light emitting device 1, for example, the lens surface 71D can be arranged corresponding to the position of the reflective component 40.

[0217] When viewed from above, the second edge 71B2 of the optical component 70 is not located between a virtual straight line parallel to and passing through the second edge 11C2 of the outer edge of the substrate 11 and a virtual straight line parallel to and passing through the second edge 11C2 of the inner edge of the substrate 11, but is located between a virtual straight line parallel to and passing through the second edge 11C6 of the inner edge of the substrate 11 and a virtual straight line parallel to and passing through the first edge 11C5 of the inner edge of the substrate 11.

[0218] The above describes the embodiments of the present invention, but the light-emitting device of the present invention is not strictly limited to the light-emitting device of the embodiments. That is, the present invention is not impossible to implement without being limited to the appearance and structure of the light-emitting device disclosed by the embodiments. The present invention can be applied without having all the constituent elements. For example, when a part of the constituent elements of the light-emitting device disclosed by the embodiments is not recorded in the claims, the freedom of design of those skilled in the art such as substitution, omission, deformation of shape, change of material, etc. is recognized for the constituent elements of the part, and on this basis, the invention recorded in the applicable claims is determined.

[0219] Industrial Applicability

[0220] The light emitting device described in the embodiment can be used in a projector. That is, a projector can be said to be one use mode of applying the present invention. The present invention is not limited thereto, and can be used in various use modes such as lighting, exposure, vehicle headlights, head-mounted displays, and backlights of other displays.

[0221] Description of Reference Numerals

[0222] 1 Lighting device

[0223] 10 Packaging

[0224] 11 Matrix

[0225] 11A First upper surface

[0226] 11B Lower surface

[0227] 11C Second upper surface

[0228] 11C1, 11C5 first side

[0229] 11C2, 11C6 Second side

[0230] 11C3, 11C7 Third side

[0231] 11C4, 11C8 Fourth side

[0232] 11D Outer side

[0233] 11E Inside side

[0234] 11F Stairs

[0235] 11F1 First step

[0236] 11F2 Second step

[0237] 11G Top surface

[0238] 11H Side

[0239] 11M Base

[0240] 11N Frame

[0241] 12A Wiring Department

[0242] 12A1 First wiring section

[0243] 12A2 Second wiring section

[0244] 13A Bonding pattern

[0245] 14 Cover

[0246] 14A Upper surface

[0247] 14A1 First side

[0248] 14A2 Second side

[0249] 14A3 Third side

[0250] 14A4 The Fourth Side

[0251] 14B Lower surface

[0252] 14B1 First side

[0253] 14B2 Second side

[0254] 14B3 Third side

[0255] 14B4 Fourth side

[0256] 14C Side

[0257] 14D joint pattern

[0258] 14D1, 14D5 first side

[0259] 14D2, 14D6 Second side

[0260] 14D3, 14D7 Third side

[0261] 14D4, 14D8 Fourth side

[0262] 14E Buffer Line Pattern

[0263] 14E1 Buffer Line

[0264] 20 light emitting elements

[0265] 21A Upper surface

[0266] 21B Lower surface

[0267] 21C side view

[0268] 22 Light exit surface

[0269] 30 abutment

[0270] 31A Upper surface

[0271] 31B Lower surface

[0272] 31C side view

[0273] 32A base plate

[0274] 32B Upper metal parts

[0275] 32C lower side metal parts

[0276] 33 wiring layers

[0277] 40 reflective parts

[0278] 41A Lower surface

[0279] 41B Light reflecting surface

[0280] 50 protection elements

[0281] 51A Top surface

[0282] 51B Lower surface

[0283] 51C side view

[0284] 60 Wiring

[0285] 70Optical components (lens components)

[0286] 71A Top surface

[0287] 71B Lower surface

[0288] 71B1 First side

[0289] 71B2 Second side

[0290] 71B3 Third side

[0291] 71B4 The fourth side

[0292] 71C side view

[0293] 71D lens surface (optical action surface)

[0294] 72A Lens unit

[0295] 72B Non-lens part

[0296] 80 Joint parts

[0297] 81 first joint member

[0298] 82 second joint member

[0299] 83 third joint member

[0300] 84 fourth joint member

Claims

1. A light emitting device, characterized in that: have: A base having a base and a frame, wherein the base has a first upper surface, and the frame is located above the first upper surface and has a second upper surface surrounding the first upper surface in a plan view; a cover having an upper surface and a lower surface engaged with the second upper surface of the base; One or more light-emitting elements disposed on the first upper surface; as well as a lens member having a lower surface engaged with the upper surface of the cover body, The outer edge shape of the second upper surface of the base is a rectangle having a first side and a second side parallel to the first side. The outer edge shape of the lower surface of the cover is a rectangle having a first side parallel to the first side of the base and a second side parallel to the first side of the cover, The first side of the cover is arranged at a position closer to the first side of the base than the second side of the cover. The second side of the cover is arranged at a position closer to the second side of the base than the first side of the cover. In a plan view, the shortest distance from the second side of the base to the second side of the cover is greater than the shortest distance from the first side of the base to the first side of the cover. The lens component has a lens portion and a non-lens portion, the lens portion has one or more lens surfaces, and the non-lens portion does not overlap with the one or more lens surfaces when viewed from above. In a plan view, the shortest distance from the first side of the cover to the one or more lens surfaces is smaller than the shortest distance from the second side of the cover to the one or more lens surfaces. In a plan view, in a direction perpendicular to the first side of the base, a maximum width of the one or more lens surfaces is greater than or equal to 65% of a maximum width of the lens component.

2. The light emitting device according to claim 1, characterized in that: The cover body has a rectangular ring-shaped bonding pattern provided on the lower surface of the cover body, When viewed from below, the shortest distance from the rectangular ring-shaped region in the bonding pattern to the first side of the cover body is greater than the shortest distance from the region to the second side of the cover body.

3. The light emitting device according to claim 2, characterized in that: The outer edge shape of the second upper surface of the base is a rectangle having a third side perpendicular to the first side of the base and a fourth side parallel to the third side. The outer edge shape of the lower surface of the cover body is a rectangle having a third side perpendicular to the first side of the cover body and a fourth side parallel to the third side of the cover body, When viewed from below, the shortest distance from the rectangular ring-shaped region in the bonding pattern to the first side of the cover body is greater than the shortest distance from the region to the third side of the cover body.

4. The light emitting device according to claim 3, characterized in that: When viewed from below, the shortest distance from the rectangular ring-shaped region in the bonding pattern to the first side of the cover body is greater than the distance from the region to the fourth side of the cover body.

5. The light emitting device according to any one of claims 2 to 4, characterized in that: When viewed from above, a virtual straight line passing through the center of the first side of the cover body and perpendicular to the first side of the cover body includes a first line segment and a second line segment overlapping the bonding pattern, The first line segment and the second line segment have the same length.

6. The light emitting device according to any one of claims 1 to 5, characterized in that: further comprising one or more joining members for joining the cover body and the lens member, The outer edge shape of the second upper surface of the base is a rectangle having a third side perpendicular to the first side of the base and a fourth side parallel to the third side. The outer edge shape of the lower surface of the cover body is a rectangle having a third side perpendicular to the first side of the cover body and a fourth side parallel to the third side of the cover body, The lens component has a rectangular shape when viewed from above, The one or more bonding members are provided in the vicinity of the four corners of the rectangle including the lens member in a plan view, In a plan view, the shortest distance from the third side of the base to the third side of the cover is greater than the shortest distance from the first side of the base to the first side of the cover.

7. The light emitting device according to claim 6, characterized in that: In a plan view, the shortest distance from the fourth side of the base to the fourth side of the cover is greater than the shortest distance from the first side of the base to the first side of the cover.

8. The light emitting device according to any one of claims 1 to 7, characterized in that: The outer edge shape of the lower surface of the cover body is a rectangle having a third side perpendicular to the first side of the cover body and a fourth side parallel to the third side of the cover body, The outer edge shape of the lower surface of the lens component is a rectangle having a first side parallel to the first side of the cover body, a second side parallel to the first side of the lens component, a third side perpendicular to the first side of the lens component, and a fourth side parallel to the third side of the lens component. In a plan view, a width from the first side to the second side of the lens component is smaller than a width from the first side to the second side of the cover body. In a plan view, a width from the third side to the fourth side of the lens member is larger than a width from the third side to the fourth side of the cover.

9. The light emitting device according to any one of claims 1 to 8, characterized in that: further comprising one or more joining members for joining the cover body and the lens member, The one or more bonding members include a first bonding member, the first bonding member being provided in a region including a first corner where the first side and the third side of the lens member intersect, that is, a first corner near the region. The outer edge shape of the upper surface of the cover body is a rectangle having a first side parallel to the first side of the base, a second side parallel to the first side of the upper surface of the cover body, a third side perpendicular to the first side of the upper surface of the cover body, and a fourth side parallel to the third side of the upper surface of the cover body. The first joining component has a first end point and a second end point, the first end point being a point located on a first side of the upper surface of the cover body and farthest from the first corner in an area where the cover body and the first joining component overlap when viewed from above, and the second end point being a point located on a third side of the cover body and farthest from the first corner, In a plan view, a distance from the second end point to the one or more lens surfaces is smaller than a distance from the first end point to the one or more lens surfaces.

Images