Combined sensor and electronic equipment

Abstract

The invention discloses a combined sensor and electronic equipment. The combined sensor comprises a substrate, a signal isolation sheet, a shell, a first processing chip and a second processing chip, wherein the substrate is provided with a first surface and a second surface which are arranged back to back; the first surface of the substrate sinks towards the second surface to form an accommodating groove; the signal isolation sheet is connected with the first surface of the substrate and covers the accommodating groove; the shell is connected with the first surface of the substrate. The side, away from the containing groove, of the signal isolation piece, the substrate and the shell define a containing cavity. One of the first processing chip and the second processing chip is arranged in the accommodating groove, and the other one of the first processing chip and the second processing chip is arranged in the accommodating cavity.

Description

Technical Field

[0001] The present application relates to the technical field of electronic products, and more specifically, to a combined sensor and electronic device. Background Art

[0002] In some electronic products, a combination sensor consisting of two sensors with different functions is used. For example, a combination sensor including a microphone sensor and a pressure sensor is set in a smart watch. The combination sensor has both the function of voice call and the function of health monitoring. The combination sensor has the advantages of high integration and small space occupation; however, in the combination sensor, there will be signal crosstalk between processing chips with different functions, which will reduce the working accuracy of the combination sensor and further reduce the performance of the electronic product.

[0003] In view of this, it is necessary to propose a new technical solution to solve the above technical problems. Summary of the invention

[0004] One object of the present application is to provide a new technical solution for combining sensors and electronic devices.

[0005] According to a first aspect of the present application, a combined sensor is provided, the combined sensor comprising:

[0006] A substrate, the substrate having a first surface and a second surface disposed opposite to each other; the first surface of the substrate is recessed toward the second surface to form a receiving groove;

[0007] A signal isolation sheet connected to the first surface of the substrate and covering the receiving groove;

[0008] A housing, wherein the housing is connected to the first surface of the substrate, and a side of the signal isolation sheet facing away from the receiving groove is enclosed with the substrate and the housing to form a receiving cavity;

[0009] A first processing chip and a second processing chip, one of the first processing chip and the second processing chip is disposed in the receiving groove, and the other is disposed in the receiving cavity.

[0010] Optionally, the other of the first processing chip and the second processing chip is connected to a side of the signal isolation sheet facing away from the receiving groove.

[0011] Optionally, the substrate has a third surface arranged corresponding to the receiving groove, and the third surface is arranged opposite to the signal isolation plate; and one of the first processing chip and the second processing chip is connected to the third surface.

[0012] Optionally, the combined sensor includes a first sensing chip and a second sensing chip, the first sensing chip is electrically connected to the first processing chip; the second sensing chip is electrically connected to the second processing chip.

[0013] Optionally, the first sensing chip is used to sense sound signals; the first sensing chip is connected to the side of the signal isolation plate facing away from the accommodating groove, the substrate is provided with a first sound hole, and the signal isolation plate is provided with a second sound hole, and the first sound hole and the second sound hole are both arranged corresponding to the first sensing chip.

[0014] Optionally, the second processing chip is connected to the side of the signal isolation plate facing away from the receiving groove, and the second sensing chip and the second processing chip are stacked.

[0015] Optionally, the signal isolation plate is made of an integrated metal material.

[0016] Optionally, the signal isolation plate includes at least two sub-signal isolation plates, the sub-signal isolation plates are made of metal, and at least two of the sub-signal isolation plates are stacked.

[0017] Optionally, the signal isolation plate includes a protective film, and the protective film is sandwiched between two adjacent sub-signal isolation plates.

[0018] Optionally, the protective membrane is a waterproof and breathable membrane.

[0019] According to a second aspect of the present application, an electronic device is provided, wherein the electronic device includes the combined sensor as described in the first aspect.

[0020] In the combined sensor provided in the embodiment of the present application, one of the first processing chip and the second processing chip is arranged in the accommodating groove, and the other is arranged in the accommodating cavity; that is, the first processing chip and the second processing chip are respectively located in two spaces separated by the signal isolation plate, thereby effectively preventing signal crosstalk between the first processing chip and the second processing chip, thereby improving the working stability and accuracy of the combined sensor.

[0021] Other features and advantages of the present application will become apparent from the following detailed description of exemplary embodiments of the present application with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the application and, together with the description, serve to explain the principles of the application.

[0023] Figure 1 is a schematic cross-sectional view of a combined sensor according to an embodiment of the present application Figure 1;

[0024] Figure 2 is a schematic cross-sectional view of a combined sensor according to an embodiment of the present application Figure 2 ;

[0025] Figure 3 is a schematic cross-sectional view of a combined sensor according to an embodiment of the present application Figure 3 .

[0026] Description of reference numerals:

[0027] 1. Combined sensor; 10. Shell; 100. Accommodating cavity; 11. Substrate; 110. Accommodating groove; 111. First sound hole; 12. Signal isolation plate; 120. Second sound hole; 121. Sub-signal isolation plate; 122. Protective film; 13. First processing chip; 14. Second processing chip; 15. First sensing chip; 16. Second sensing chip. DETAILED DESCRIPTION

[0028] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that unless otherwise specifically stated, the relative arrangement of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present application.

[0029] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the present application, its application, or uses.

[0030] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered as part of the specification.

[0031] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0032] It should be noted that like reference numerals and letters refer to similar items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0033] Reference Figure 1-Figure 3As shown, according to an embodiment of the present application, a combined sensor 1 is provided. The combined sensor 1 comprises a substrate 11, a signal isolation sheet 12, a housing 10, a first processing chip 13 and a second processing chip 14. The substrate 11 has a first surface and a second surface disposed opposite to each other; the first surface of the substrate 11 is recessed toward the second surface to form a receiving groove 110; the signal isolation sheet 12 is connected to the first surface of the substrate 11 and covers the receiving groove 110; the housing 10 is connected to the first surface of the substrate 11, and a side of the signal isolation sheet 12 that is away from the receiving groove 110 is enclosed with the substrate 11 and the housing 10 to form a receiving cavity 100;

[0034] One of the first processing chip 13 and the second processing chip 14 is disposed in the receiving groove 110 , and the other is disposed in the receiving cavity 100 .

[0035] In the combined sensor 1 provided in the embodiment of the present application, it includes two sensors with different functions; a first processing chip 13 is provided for the sensor corresponding to the first function, and a second processing chip 14 is provided for the sensor corresponding to the second function. In order to isolate the first processing chip 13 and the second processing chip 14, the substrate 11 of the combined sensor 1 is provided with a receiving groove 110, and the receiving groove 110 is formed by the first surface of the substrate 11 being recessed toward the second surface; the signal isolation plate 12 is connected to the first surface of the substrate 11 and covers the receiving groove 110, and the side of the signal isolation plate 12 facing away from the receiving groove 110 is enclosed with the substrate 11 and the housing 10 to form a receiving cavity 100; that is, corresponding to the receiving groove 110, the signal isolation plate 12 and the substrate 11 are enclosed to form an independent closed space, and the independent closed space is isolated from the receiving cavity 100.

[0036] One of the first processing chip 13 and the second processing chip 14 is disposed in the receiving groove 110, and the other is disposed in the receiving cavity 100; that is, the first processing chip 13 and the second processing chip 14 are respectively located in two spaces separated by the signal isolation plate 12, thereby effectively preventing signal crosstalk between the first processing chip 13 and the second processing chip 14, and improving the stability and accuracy of the combined sensor 1. In addition, the receiving groove 110 formed in the substrate 11 is used to install some processing chips, which can achieve reasonable use of space and compact layout of components. In addition, since there is no need to bury the processing chip in the substrate 11, it is beneficial to improve the yield rate and reduce the manufacturing cost.

[0037] Reference Figure 1-Figure 3 As shown, in one embodiment, the other of the first processing chip 13 and the second processing chip 14 is connected to the side of the signal isolation plate 12 facing away from the receiving groove 110 .

[0038] In this specific example, the signal isolation plate 12 provides support and installation for the processing chip disposed in the accommodating cavity 100, so that the space in the accommodating cavity 100 can be more reasonably utilized to arrange electronic components. Optionally, along the direction perpendicular to the first surface, the projection of the first processing chip 13 and the projection of the second processing chip 14 are staggered, which can further ensure the signal isolation effect between the first processing chip 13 and the second processing chip 14. Optionally, the processing chip disposed on the signal isolation plate 12 and the side of the signal isolation plate 12 facing away from the accommodating groove 110 can be connected by gluing. According to the stress requirements of the processing chip, epoxy glue, DAF glue, silicone glue or other types of glue can be selected, and this application does not make specific restrictions on this.

[0039] Reference Figure 1-Figure 3 As shown, in one embodiment, the substrate 11 has a third surface arranged corresponding to the receiving groove 110, and the third surface is arranged opposite to the signal isolation plate 12; one of the first processing chip 13 and the second processing chip 14 is connected to the third surface.

[0040] In this specific example, the substrate 11 has a third surface corresponding to the receiving groove 110, which is also the bottom of the receiving groove 110. The third surface provides support and installation for the processing chip disposed in the receiving groove 110, improves the stability of the processing chip, and facilitates electrical conduction between the processing chip and the substrate 11. Optionally, the processing chip disposed in the receiving groove 110 can be connected to the third surface by gluing. According to the stress requirements of the processing chip, epoxy glue, DAF glue, silicone glue or other types of glue can be selected, and this application does not make specific restrictions on this.

[0041] Reference Figure 1-Figure 3 As shown, in one embodiment, the combined sensor includes a first sensing chip 15 and a second sensing chip 16 , wherein the first sensing chip 15 is electrically connected to the first processing chip 13 ; and the second sensing chip 16 is electrically connected to the second processing chip 14 .

[0042] In this specific example, the first sensing chip 15 and the first processing chip 13 form a sensor with a first function; the second sensing chip 16 and the second processing chip 14 form a sensor with a second function; thereby, the combined sensor 1 has both the first function and the second function, for example, the first function is the conversion and processing function of the sound signal, and the second function is the conversion and processing function of the pressure signal.

[0043] Reference Figure 1-Figure 3As shown, in one embodiment, the first sensing chip 15 is used to sense sound signals; the first sensing chip 15 is connected to the side of the signal isolation plate 12 facing away from the accommodating groove 110, the substrate 11 is provided with a first sound hole 111, and the signal isolation plate 12 is provided with a second sound hole 120, and the first sound hole 111 and the second sound hole 120 are both arranged corresponding to the first sensing chip 15.

[0044] In this specific example, the first sensing chip 15 is used to sense sound signals. For example, the first sensing chip 15 is a microphone MEMS chip, and correspondingly, the first processing chip 13 is a microphone ASIC chip. The signal isolation plate 12 provides installation and support for the first sensing chip 15. The first sound hole 111 opened in the substrate 11 and the second sound hole 120 opened in the signal isolation plate 12 provide a propagation path for the external sound signal to be transmitted to the sensing diaphragm of the first sensing chip 15. The first sound hole 111 and the second sound hole 120 are both connected to the receiving groove 110. The external sound waves first pass through the first sound hole 111, then through the receiving groove 110, and finally through the second sound hole 120 to reach the sensing diaphragm of the first sensing chip 15. This can provide a buffer and protection for the sensing diaphragm of the first sensing chip 15, and prevent the external sound waves from directly reaching the first sensing chip 15 and causing damage to the sensing diaphragm of the first sensing chip 15.

[0045] Reference Figure 2-Figure 3 As shown, in one embodiment, the second processing chip 14 is connected to the side of the signal isolation plate 12 away from the receiving groove 110, and the second sensing chip 16 and the second processing chip 14 are stacked.

[0046] In this specific example, the second sensing chip 16 and the second processing chip 14 are stacked on the side of the signal isolation plate 12 away from the accommodating groove 110, which can save space and help reduce the size of the combined sensor 1, thereby facilitating the miniaturization design of electronic products.

[0047] Reference Figure 1As shown, in a specific example, the first sensing chip 15 is a microphone MEMS chip, and the first processing chip 13 is a microphone ASIC chip. Both are connected to the side of the signal isolation plate 12 away from the receiving groove 110 by gluing. Epoxy glue, DAF glue, silicone glue or other types of glue can be selected according to the stress requirements of the two. The first sensing chip 15 and the first processing chip 13 are connected by gold wire, and the first processing chip 13 is connected to the PAD of the substrate 11 by gold wire. The second sensing chip 16 is a pressure MEMS chip, and the second processing chip 14 is a pressure ASIC chip; the second processing chip 14 is connected to the third surface of the substrate 11 in the receiving groove 110 by gluing. According to the stress requirements of the second processing chip 14, epoxy glue, DAF glue, silicone glue or other types of glue can be selected, and the second processing chip 14 is connected to the PAD of the substrate 11 by gold wire; the second sensing chip 16 is connected to the side of the signal isolation plate 12 away from the receiving groove 110 by gluing. According to the stress requirements of the second sensing chip 16, epoxy glue, DAF glue, silicone glue or other types of glue can be selected, and the second sensing chip 16 is connected to the PAD of the substrate 11 by gold wire. At the same time, the circuit inside the substrate 11 can enable the second sensing chip 16 to be electrically connected to the second processing chip 14.

[0048] Reference Figure 2 As shown, in another specific example, the first sensing chip 15 is a microphone MEMS chip, and the first processing chip 13 is a microphone ASIC chip. The first sensing chip 15 is connected to the side of the signal isolation plate 12 away from the receiving groove 110 by gluing. According to the stress requirements of the first sensing chip 15, epoxy glue, DAF glue, silicone glue or other types of glue can be selected, and the first sensing chip 15 is connected to the PAD of the substrate 11 by gold wire; the first processing chip 13 is connected to the third surface of the substrate 11 in the receiving groove 110 by gluing. According to the stress requirements of the first processing chip 13, epoxy glue, DAF glue, silicone glue or other types of glue can be selected, and the first processing chip 13 is connected to the PAD of the substrate 11 by gold wire. At the same time, the circuit inside the substrate 11 can enable the first sensing chip 15 to be electrically connected to the first processing chip 13. The second sensing chip 16 is a pressure MEMS chip, and the second processing chip 14 is a pressure ASIC chip. The two are stacked and connected to the side of the signal isolation plate 12 that is away from the accommodating groove 110. According to the stress requirements of the two, epoxy glue, DAF glue, silicone glue or other types of glue can be selected to bond the two. The second sensing chip 16 and the second processing chip 14 are connected by gold wire, and the second processing chip 14 is connected to the PAD of the substrate 11 by gold wire.

[0049] Reference Figure 1-Figure 2As shown, in one embodiment, the signal isolation plate 12 is made of an integrated metal material.

[0050] In this specific example, the signal isolation plate 12 is made of metal and is an integrated structure, for example, the signal isolation plate 12 is a stainless steel sheet; the integrated signal isolation plate 12 has a simple structure and is easy to manufacture. Optionally, the signal isolation plate 12 is bonded to the first surface of the substrate 11 using epoxy glue or solder paste.

[0051] Reference Figure 3 As shown, in one embodiment, the signal isolation sheet 12 includes at least two sub-signal isolation sheets 121 , the sub-signal isolation sheets 121 are made of metal, and at least two of the sub-signal isolation sheets 121 are stacked.

[0052] In this specific example, the signal isolation plate 12 includes at least two stacked sub-signal isolation plates 121, and the sub-signal isolation plates 121 are made of metal, such as stainless steel. The signal isolation plate 12 with a multi-layer structure can further improve the signal shielding effect.

[0053] Reference Figure 3 As shown, in one embodiment, the signal isolation sheet 12 includes a protective film 122 , and the protective film 122 is sandwiched between two adjacent sub-signal isolation sheets 121 .

[0054] In this specific example, a protective film 122 is sandwiched between two adjacent sub-signal isolation sheets 121. The protective film 122 is, for example, a waterproof and breathable film, which can improve the waterproof and foreign body-proof capabilities of the signal isolation sheet 12, thereby improving the reliability of the combined sensor 1. Optionally, epoxy glue or solder paste is used to bond the sub-signal isolation sheet 121 and the protective film 122, as well as the signal isolation sheet 12 and the first surface of the substrate 11. In particular, the signal isolation sheet 12 with the protective film 122 can further provide buffering and protection for the sensing film of the first sensing chip 15, thereby improving the wind resistance of the electronic product.

[0055] According to another embodiment of the present application, an electronic device is provided, wherein the electronic device includes the combined sensor 1 as described above; the electronic device is, for example, a smart watch.

[0056] The above embodiments focus on the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the simplicity of the text, they will not be repeated here.

[0057] Although some specific embodiments of the present application have been described in detail by way of example, it should be understood by those skilled in the art that the above examples are only for illustration, not for limiting the scope of the present application. It should be understood by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the present application. The scope of the present application is defined by the appended claims.

Claims

1. A combined sensor, characterized in that: The combined sensor comprises: A substrate (11), the substrate (11) having a first surface and a second surface disposed opposite to each other; the first surface of the substrate (11) is recessed toward the second surface to form a receiving groove (110); A signal isolation sheet (12), the signal isolation sheet (12) being connected to the first surface of the substrate (11) and covering the receiving groove (110); A housing (10), the housing (10) being connected to a first surface of the substrate (11), and a side of the signal isolation sheet (12) facing away from the receiving groove (110) being enclosed with the substrate (11) and the housing (10) to form a receiving cavity (100); A first processing chip (13) and a second processing chip (14), one of the first processing chip (13) and the second processing chip (14) is arranged in the receiving groove (110), and the other is arranged in the receiving cavity (100).

2. The combined sensor according to claim 1, characterized in that: The other of the first processing chip (13) and the second processing chip (14) is connected to a side surface of the signal isolation plate (12) that is away from the receiving groove (110).

3. The combined sensor according to claim 1, characterized in that: The substrate (11) has a third surface arranged corresponding to the receiving groove (110), and the third surface is arranged opposite to the signal isolation plate (12); one of the first processing chip (13) and the second processing chip (14) is connected to the third surface.

4. The combined sensor according to claim 1, characterized in that: The combined sensor comprises a first sensing chip (15) and a second sensing chip (16); the first sensing chip (15) is electrically connected to the first processing chip (13); and the second sensing chip (16) is electrically connected to the second processing chip (14).

5. The combined sensor according to claim 4, characterized in that: The first sensing chip (15) is used to sense sound signals; the first sensing chip (15) is connected to the side of the signal isolation plate (12) facing away from the receiving groove (110); the substrate (11) is provided with a first sound hole (111); the signal isolation plate (12) is provided with a second sound hole (120); the first sound hole (111) and the second sound hole (120) are both arranged corresponding to the first sensing chip (15).

6. The combined sensor according to claim 5, characterized in that: The second processing chip (14) is connected to the side of the signal isolation plate (12) facing away from the receiving groove (110), and the second sensing chip (16) and the second processing chip (14) are stacked.

7. The combined sensor according to any one of claims 1 to 6, characterized in that: The signal isolation plate (12) is made of an integrated metal material.

8. The combined sensor according to any one of claims 1 to 6, characterized in that: The signal isolation plate (12) comprises at least two sub-signal isolation plates (121), the sub-signal isolation plates (121) are made of metal, and at least two of the sub-signal isolation plates (121) are stacked.

9. The combined sensor according to claim 8, characterized in that: The signal isolation plate (12) comprises a protective film (122), and the protective film (122) is sandwiched between two adjacent sub-signal isolation plates (121).

10. The combined sensor according to claim 9, characterized in that: The protective film (122) is a waterproof and breathable film.

11. An electronic device, characterized in that: The electronic device comprises a combined sensor (1) as claimed in any one of claims 1 to 10.

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