Microphone and electronic device

Abstract

The invention discloses a microphone and an electronic device, and relates to the technical field of MEMS microphones, the microphone comprises a substrate, a housing and a chip assembly, the housing covers the substrate, and the housing and the substrate define an accommodating cavity; the chip assembly is located in the containing cavity and comprises a pickup module and a signal processing module which are in communication connection, and the pickup module is arranged on the substrate; a sound hole is formed in the side, facing the shell, of the substrate and faces the pickup module, and the size of the sound hole is increased in the direction perpendicular to the substrate and the direction close to the containing cavity. Under the condition that the air flow is certain, the flow speed of the air flow in the sound hole is gradually reduced, so that the occurrence probability of diaphragm breakage caused by too high flow speed of the air flow is effectively reduced, and the reliability of the microphone is improved; similarly, the size of the sound hole is increased along the direction perpendicular to the substrate towards the direction close to the accommodating cavity, so that the signal-to-noise ratio of the microphone is effectively improved, and the acoustic performance of the microphone is further improved.

Description

Technical Field

[0001] The present invention relates to the technical field of MEMS microphones, and in particular to a microphone and an electronic device. Background Art

[0002] MEMS microphones are an acoustic-to-electric conversion sensor that is widely used in the consumer electronics field. As the application terminal technology continues to change and upgrade, the requirements for the acoustic performance and reliability of MEMS microphones are becoming increasingly stringent.

[0003] However, the existing MEMS microphones are prone to diaphragm rupture when the external airflow is strong, which seriously affects the acoustic performance and reliability of the MEMS microphone. Summary of the invention

[0004] The main purpose of the present invention is to provide a microphone and an electronic device, aiming to improve the reliability and acoustic performance of the MEMS microphone.

[0005] To achieve the above object, the microphone provided by the present invention comprises:

[0006] substrate;

[0007] A housing, the housing is covered on the substrate and forms a receiving cavity with the substrate;

[0008] A chip assembly, the chip assembly is located in the accommodating cavity, the chip assembly includes a sound pickup module and a signal processing module that are communicatively connected, and the sound pickup module is arranged on the substrate;

[0009] A sound hole is arranged on a side of the substrate facing the shell, the sound hole is arranged toward the sound pickup module, and the size of the sound hole increases along a direction perpendicular to the substrate toward a direction close to the accommodating cavity.

[0010] In one embodiment, the sound hole includes a groove and a through hole that are interconnected, the substrate is provided with a groove on the side facing the shell, the notch of the groove is provided toward the pickup module, the bottom wall of the groove is provided with the through hole, and the area of ​​the bottom wall of the groove is larger than the area of ​​the radial cross-section of the through hole.

[0011] In one embodiment, the axial directions of the groove and the through hole are parallel to the direction perpendicular to the substrate, the substrate includes a plurality of structural layers stacked in sequence along a direction perpendicular to the substrate, the plurality of structural layers include a first copper layer, the shell is connected to the first copper layer, the through hole can extend in some of the plurality of structural layers, and the groove can extend in the remaining plurality of structural layers.

[0012] In one embodiment, the plurality of structural layers include a first solder resist layer, a first copper layer, a first base material layer, a second copper layer, and a second solder resist layer arranged in sequence along a direction perpendicular to the substrate, and the first solder resist layer is provided with an avoidance hole for exposing the first copper layer, so that the bottom of the shell can pass through the avoidance hole and be connected to the first copper layer.

[0013] In one embodiment, the plurality of structural layers further include a composite layer, wherein the composite layer is disposed between the first substrate layer and the second copper layer, and the composite layer includes a first composite copper layer, a buried capacitance layer, a second composite copper layer, and a composite substrate layer stacked in sequence along a direction perpendicular to the substrate.

[0014] In one embodiment, the plurality of structural layers further include a first integrated layer, the first integrated layer is disposed between the first substrate layer and the first composite copper layer, and the first integrated layer includes a first copper integrated layer and a first substrate integrated layer sequentially arranged in a direction perpendicular to the substrate;

[0015] And / or, the plurality of structural layers further include a second integrated layer, the second integrated layer is disposed between the composite substrate layer and the second copper layer, and the second integrated layer includes a second copper integrated layer and a second substrate integrated layer arranged in sequence along a direction perpendicular to the substrate.

[0016] In one embodiment, the plurality of structural layers further include an intermediate layer, the intermediate layer is disposed between the first substrate layer and the second copper layer, and the intermediate layer includes a third copper layer and a third substrate layer sequentially arranged in a direction perpendicular to the substrate.

[0017] In one embodiment, there are multiple intermediate layers, and the multiple intermediate layers are stacked in sequence along a direction perpendicular to the substrate.

[0018] In one embodiment, the size of the acoustic hole is gradually expanded along a direction perpendicular to the substrate toward a direction close to the accommodating cavity.

[0019] In one embodiment, the microphone further includes a blocking member, the blocking member is disposed on the substrate, the sound hole is disposed toward the blocking member, the pickup module is disposed on a side of the blocking member away from the substrate, and the blocking member is provided with a connecting hole connecting to the sound hole.

[0020] In one embodiment, the blocking member cover is disposed on the substrate and forms a cavity with the substrate, the sound hole and the connecting hole are both connected to the cavity, and the cross-sectional area of ​​the cavity along the extension direction parallel to the substrate is larger than the radial cross-sectional area of ​​the sound hole.

[0021] In one embodiment, the communication hole and the acoustic hole are arranged at intervals along an extending direction of the substrate.

[0022] In one embodiment, there are multiple communicating holes, and the multiple communicating holes are arranged at intervals.

[0023] In one embodiment, the groove is a stepped groove, and the through hole is provided at the bottom of the stepped groove;

[0024] Alternatively, the cross-sectional area of ​​the groove is the cross-sectional area of ​​the groove along an extension direction parallel to the substrate, and the cross-sectional area of ​​the groove is gradually expanded along a direction perpendicular to the substrate toward a direction approaching the accommodating cavity.

[0025] The present invention further provides an electronic device, comprising the above-mentioned microphone.

[0026] The technical solution of the present invention is to set a sound hole on the substrate, and the size of the sound hole is set to increase along the direction perpendicular to the substrate toward the direction close to the accommodating cavity. Under the condition of a constant gas flow rate, the airflow entering the sound hole from the side of the substrate away from the shell will gradually decrease in the airflow velocity in the sound hole, thereby effectively reducing the probability of diaphragm rupture due to excessive airflow velocity and improving the reliability of the microphone; and because the size of the sound hole is set to increase along the direction perpendicular to the substrate toward the direction close to the accommodating cavity, the signal-to-noise ratio of the microphone is effectively improved, thereby improving the acoustic performance of the microphone. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0028] Figure 1 A schematic cross-sectional view of a microphone according to an embodiment of the present invention;

[0029] Figure 2 A schematic cross-sectional view of another embodiment of a microphone provided by the present invention;

[0030] Figure 3 A schematic cross-sectional view of an embodiment of a substrate provided by the present invention;

[0031] Figure 4 for Figure 3 A local enlarged schematic diagram at point A;

[0032] Figure 5A schematic cross-sectional view of another embodiment of a substrate provided by the present invention;

[0033] Figure 6 A schematic cross-sectional view of a partial structure of an embodiment of a substrate provided by the present invention;

[0034] Figure 7 A schematic cross-sectional view of another embodiment of a partial structure of a substrate provided by the present invention;

[0035] Figure 8 A schematic cross-sectional structural diagram of another embodiment of a substrate provided by the present invention;

[0036] Fig. 9 The present invention provides a cross-sectional structural schematic diagram of another embodiment of the microphone.

[0037] Description of Figure Numbers:

[0038] 100. microphone; 1. substrate; 11. first solder resist layer; 12. first copper layer; 13. first base material layer; 14. second copper layer; 15. second solder resist layer; 16. composite layer; 161. first composite copper layer; 162. buried capacity layer; 163. second composite copper layer; 164. composite base material layer; 17. first integrated layer; 171. first copper integrated layer; 172. first base material integrated layer; 18. second integrated layer; 181. second copper integrated layer; 182. second base material integrated layer; 19. intermediate layer; 191. third copper layer; 192. third base material layer; 2. housing; 21. accommodating cavity; 3. chip assembly; 31. pickup module; 32. signal processing module; 4. sound hole; 41. groove; 411. stepped groove; 42. through hole; 5. blocking member; 51. connecting hole; 52. cavity.

[0039] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0040] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0041] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0042] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0043] MEMS microphones are an acoustic-to-electric conversion sensor that is widely used in the consumer electronics field. As the application terminal technology continues to change and upgrade, the requirements for the acoustic performance and reliability of MEMS microphones are becoming increasingly stringent.

[0044] However, the existing MEMS microphones are prone to diaphragm rupture when the external airflow is strong, which seriously affects the acoustic performance and reliability of the MEMS microphone.

[0045] The inventors have found that the common MEMS microphone design generally includes a substrate (carrying components and realizing circuit connection, with holes opened inside the substrate for sound signals to enter from the outside and be picked up by the acoustic sensor), a connecting piece (to improve the reliability of the acoustic sensor against blowing), an acoustic sensor (to realize the conversion of sound signals to electrical signals), a gold wire (circuit connection), a signal processor (signal processing, power supply for the acoustic sensor, etc.), and a shielding cover (to protect internal components, electromagnetic shielding). When a conventional MEMS microphone structure is hit by a strong external airflow from the through hole, due to the small aperture of the through hole and the high airflow velocity, it is easy to cause significant damage to the acoustic sensor and even cause the diaphragm to rupture. At the same time, for this type of bottom-input MEMS microphone, the aperture size of the through hole will also have an impact on the microphone's signal-to-noise ratio performance. Generally, the larger the through hole aperture, the higher the microphone's signal-to-noise ratio performance, that is, the better the acoustic performance.

[0046] In view of this, the present invention proposes a microphone, aiming to improve the reliability and acoustic performance of the MEMS microphone.

[0047] See also Figure 1 and Figure 2In one embodiment of the present invention, the microphone 100 includes a substrate 1, a shell 2 and a chip assembly 3. The shell 2 is covered on the substrate 1 and forms a receiving cavity 21 with the substrate 1. The chip assembly 3 is located in the receiving cavity 21. The chip assembly 3 includes a sound pickup module 31 and a signal processing module 32 that are communicatively connected. The sound pickup module 31 is arranged on the substrate 1. A sound hole 4 is arranged on one side of the substrate 1 facing the shell 2. The sound hole 4 is arranged toward the sound pickup module 31. The size of the sound hole 4 is arranged to increase along a direction perpendicular to the substrate 1 toward the direction close to the receiving cavity 21.

[0048] Compared with the existing design, the technical solution of the present invention is that, under the condition that the thickness of the substrate 1 is the same, the present embodiment sets a sound hole 4 on the substrate 1, and the size of the sound hole 4 increases along the direction perpendicular to the substrate 1 toward the direction close to the accommodating cavity 21. Under the condition that the gas flow rate is constant, the airflow entering the sound hole 4 from the side of the substrate 1 away from the housing 2 moves in the sound hole 4 toward the pickup module 31. As the size of the sound hole 4 increases, the flow rate of the airflow in the sound hole 4 will gradually decrease, thereby effectively reducing the probability of diaphragm rupture caused by excessive airflow velocity, and improving the reliability of the microphone 100; when the size of the end of the sound hole 4 away from the accommodating cavity 21 is consistent with the size of the hole on the existing substrate 1, since the size of the sound hole 4 increases along the direction perpendicular to the substrate 1 toward the direction close to the accommodating cavity 21, the signal-to-noise ratio of the microphone 100 is effectively improved, thereby improving the acoustic performance of the microphone 100. It should be noted that the cross-section of the sound hole 4 in the extension direction parallel to the substrate 1 can be circular or elliptical, and no specific restrictions are made here.

[0049] In one embodiment, the sound hole 4 includes a groove 41 and a through hole 42 that are interconnected. The groove 41 is provided on the side of the substrate 1 facing the housing 2, and the notch of the groove 41 is provided toward the pickup module 31. The bottom wall of the groove 41 is provided with a through hole 42, and the area of ​​the bottom wall of the groove 41 is greater than the area of ​​the radial cross section of the through hole 42. In this embodiment, by providing a groove 41 on the substrate 1 located in the accommodating cavity 21, and then providing a through hole 42 at the bottom of the groove 41, the external airflow passes through the through hole 42 and enters the groove 41, and then enters the rear cavity of the pickup module 31 through the groove 41; wherein the cross section of the through hole 42 in the extension direction parallel to the substrate 1 can be circular or elliptical, which is not specifically limited here, and the cross section of the groove 41 in the extension direction parallel to the substrate 1 can be circular or square, which is also not specifically limited here. Among them, taking the circular cross-section of the through hole 42 and the groove 41 as an example, under the condition of a constant gas flow rate, and when the aperture of the through hole 42 is the same as the inner diameter of the hole on the existing substrate 1, in this embodiment, since the inner diameter of the groove 41 is larger than the aperture of the through hole 42, the flow rate of the airflow from the through hole 42 into the groove 41 will decrease. After the airflow velocity decreases, the impact of the airflow on the diaphragm will also be weakened accordingly, thereby effectively reducing the probability of diaphragm rupture due to excessive airflow velocity and improving the reliability of the microphone 100; at the same time, since the inner diameter of the groove 41 is larger than the aperture of the through hole 42, the signal-to-noise ratio of the microphone 100 is effectively improved, thereby improving the acoustic performance of the microphone 100. It should be noted that the pickup module 31 is used to convert sound signals into electrical signals, and the signal processing module 32 is used for signal processing and powering the pickup module 31. It should be noted that the extension direction of the substrate 1 is Figure 1 The left and right directions shown are perpendicular to the direction of the substrate 1. Figure 1 Up and down directions shown.

[0050] See also Figure 3 and Figure 5In one embodiment, the axial directions of the groove 41 and the through hole 42 are perpendicular to the substrate 1, the through hole 42 is arranged at the bottom of the groove 41, the substrate 1 includes a plurality of structural layers stacked in sequence along a direction perpendicular to the substrate 1, the plurality of structural layers include a first copper layer 12, the shell 2 is connected to the first copper layer 12, the through hole 42 can extend in some of the plurality of structural layers, and the groove 41 can extend in the remaining structural layers of the plurality of structural layers. Wherein, under the premise that the microphone 100 can be used normally, this embodiment does not limit the number of structural layers of the substrate 1; for example, if the substrate 1 has a structural layers, the through hole 42 can extend in b structural layers, and the groove 41 can extend in c structural layers, b+c=a, taking a=5 as an example, then the value range of b can be 0<b<5, and b can take any value within this range, for example b=1, that is, the through hole 42 penetrates 1 structural layer from the bottom of the substrate 1 to the top of the substrate 1, and the groove 41 penetrates 4 structural layers from the top of the substrate 1 to the bottom of the substrate 1, thereby realizing the connection between the through hole 42 and the groove 41; wherein, as Figure 3 As shown, the groove 41 passes through the first solder resist layer 11, the first copper layer 12, and the first substrate layer 13, and the through hole 42 passes through the first composite copper layer 161, the buried layer 162, the second composite copper layer 163, the composite substrate layer 164, the second copper layer 14, and the second solder resist layer 15; Figure 5 As shown, the groove 41 passes through the first solder resist layer 11, the first copper layer 12, the first substrate layer 13, the first composite copper layer 161, the buried layer 162, and the second composite copper layer 163, and the through hole 42 passes through the composite substrate layer 164, the second copper layer 14 and the second solder resist layer 15; within the value range of b, the through hole 42 can extend from the bottom of the substrate 1 to the top of the substrate 1 to any structural layer, without limitation here.

[0051] According to one embodiment of the present invention, b may not be an integer, for example, b=1.5, that is, the through hole 42 penetrates one structural layer from the bottom of the substrate 1 to the top of the substrate 1 and then continues to extend upward to a position halfway up the structural layer above the penetrated structural layer. Correspondingly, c=3.5, that is, the groove 41 extends 3.5 structural layers from the top of the substrate 1 to the bottom of the substrate 1, thereby realizing the connection between the groove 41 and the through hole 42.

[0052] See also Figure 3In one embodiment, the plurality of structural layers include a first solder resist layer 11, a first copper layer 12, a first base material layer 13, a second copper layer 14, and a second solder resist layer 15 arranged in sequence in a direction perpendicular to the substrate 1, and the first solder resist layer 11 is provided with an avoidance hole for exposing the first copper layer 12, so that the bottom of the housing 2 can pass through the avoidance hole and connect with the first copper layer 12. In this embodiment, the substrate 1 is formed by the first solder resist layer 11, the first copper layer 12, the first base material layer 13, the second copper layer 14, and the second solder resist layer 15 stacked in sequence in a direction perpendicular to the substrate 1, which provides a guarantee for the normal operation of the chip assembly 3. It should be noted that, under the condition of ensuring that the chip assembly 3 can operate normally, the number and type of structural layers are not limited here.

[0053] See also Figures 3 to 5 In one embodiment, the plurality of structural layers further include a composite layer 16, the composite layer 16 is disposed between the first substrate layer 13 and the second copper layer 14, and the composite layer 16 includes a first composite copper layer 161, a buried capacitance layer 162, a second composite copper layer 163 and a composite substrate layer 164 which are sequentially stacked in a direction perpendicular to the substrate 1. In this embodiment, the substrate 1 is composed of a first solder resist layer 11, a first copper layer 12, a first substrate layer 13, a first composite copper layer 161, a buried capacitance layer 162, a second composite copper layer 163, a composite substrate layer 164, a second copper layer 14 and a second solder resist layer 15 which are sequentially stacked in a direction perpendicular to the substrate 1. By adding the buried capacitance layer 162 for tiling the capacitor, the space originally used for setting the capacitor is vacated on the substrate 1, thereby reducing the size of the substrate 1, and further reducing the size of the entire microphone 100, which is conducive to the development trend of miniaturization of the microphone 100.

[0054] See also Figure 6 In one embodiment, the multiple structural layers also include a first integrated layer 17, the first integrated layer 17 is arranged between the first substrate layer 13 and the first composite copper layer 161, and the first integrated layer 17 includes a first copper integrated layer 171 and a first substrate integrated layer 172 arranged in sequence along a direction perpendicular to the substrate 1; in this embodiment, the substrate 1 is composed of a first solder resist layer 11, a first copper layer 12, a first substrate layer 13, a first copper integrated layer 171, a first substrate integrated layer 172, a first composite copper layer 161, a buried layer 162, a second composite copper layer 163, a composite substrate layer 164, a second copper layer 14 and a second solder resist layer 15, which are stacked in sequence along a direction perpendicular to the substrate 1. By adding the first integrated layer 17, it is beneficial to perform various circuit designs on the substrate 1.

[0055] See also Figure 7In one embodiment, the plurality of structural layers further include a second integrated layer 18, the second integrated layer 18 is disposed between the composite substrate layer 164 and the second copper layer 14, and the second integrated layer 18 includes a second copper integrated layer 181 and a second substrate integrated layer 182 sequentially arranged in a direction perpendicular to the substrate 1. In this embodiment, the substrate 1 is composed of a first solder resist layer 11, a first copper layer 12, a first substrate layer 13, a first composite copper layer 161, a buried capacity layer 162, a second composite copper layer 163, a composite substrate layer 164, a second copper integrated layer 181, a second substrate integrated layer 182, a second copper layer 14 and a second solder resist layer 15 sequentially stacked in a direction perpendicular to the substrate 1. By adding the second integrated layer 18, it is beneficial for the substrate 1 to carry out various circuit designs.

[0056] See also Figure 8 In one embodiment, the plurality of structural layers further include an intermediate layer 19, the intermediate layer 19 is disposed between the first substrate layer 13 and the second copper layer 14, and the intermediate layer 19 includes a third copper layer 191 and a third substrate layer 192 sequentially arranged in a direction perpendicular to the substrate 1. In this embodiment, the substrate 1 is formed by a first solder resist layer 11, a first copper layer 12, a first substrate layer 13, a third copper layer 191, a third substrate layer 192, a second copper layer 14, and a second solder resist layer 15 sequentially stacked in a direction perpendicular to the substrate 1. By adding the intermediate layer 19, it is beneficial for the substrate 1 to perform various circuit designs.

[0057] In one embodiment, there are multiple intermediate layers 19, and the multiple intermediate layers 19 are stacked in sequence along a direction perpendicular to the substrate 1. The number of intermediate layers 19 is multiple, and the provision of multiple intermediate layers 19 is also conducive to the substrate 1 to perform various circuit designs.

[0058] See also Fig. 9 In one embodiment, the size of the sound hole 4 is gradually expanded along the direction perpendicular to the substrate 1 toward the direction close to the accommodating cavity 21. Taking the case where the cross section of the sound hole 4 in the direction parallel to the extension of the substrate 1 is a circle as an example, the inner diameter of the sound hole 4 is gradually expanded along the direction perpendicular to the substrate 1 toward the direction close to the accommodating cavity 21. Through this arrangement, when the gas flow rate is constant, the airflow moves in the sound hole 4 toward the direction of the pickup module 31. As the inner diameter of the sound hole 4 gradually increases, the flow rate of the airflow in the sound hole 4 will gradually decrease, thereby effectively reducing the probability of diaphragm rupture caused by excessive airflow velocity, and improving the reliability of the microphone 100; and because the inner diameter of the sound hole 4 is gradually expanded along the direction perpendicular to the substrate 1 toward the direction close to the accommodating cavity 21, the signal-to-noise ratio of the microphone 100 is effectively improved, thereby improving the acoustic performance of the microphone 100.

[0059] See also Figure 1 and Figure 2In one embodiment, the microphone 100 further includes a blocking member 5, which is disposed on the substrate 1, the sound hole 4 is disposed toward the blocking member 5, the pickup module 31 is disposed on the side of the blocking member 5 away from the substrate 1, and the blocking member 5 is provided with a connecting hole 51 connected to the sound hole 4; wherein, the blocking member 5 is disposed on the substrate 1, the notch of the groove 41 is disposed toward the blocking member 5, the pickup module 31 is disposed on the side of the blocking member 5 away from the substrate 1, and the blocking member 5 is provided with a connecting hole 51 connecting the back cavity of the pickup module 31 and the groove 41. The blocking member 5 is provided to block the airflow to a certain extent, and the flow rate of the airflow after blocking will be reduced, thereby further reducing the probability of the diaphragm rupture caused by the excessive flow rate of the airflow, and improving the stability of the microphone 100; the connecting hole 51 is provided on the blocking member 5 to enable the airflow to enter the back cavity of the pickup module 31 from the groove 41. It should be noted that the blocking member 5 can be a plate-shaped structural member, or a structural member of other shapes, which is not limited here.

[0060] In one embodiment, the blocking member 5 is covered on the substrate 1 and forms a cavity 52 with the substrate 1, the sound hole 4 and the communication hole 51 are both connected to the cavity 52, and the cross-sectional area of ​​the cavity 52 along the direction parallel to the extension of the substrate 1 is larger than the area of ​​the radial cross-sectional area of ​​the sound hole 4; wherein, the blocking member 5 is covered on the substrate 1 and forms a cavity 52 with the substrate 1, the groove 41 and the communication hole 51 are both connected to the cavity 52, and the inner diameter of the cavity 52 is larger than the inner diameter of the groove 41. The blocking member 5 and the substrate 1 form a cavity 52, so that the airflow can flow out from the notch of the groove 41 to the cavity 52. ​​Since the inner diameter of the cavity 52 is larger than the inner diameter of the groove 41, when the flow rate is constant, after the airflow flows from the groove 41 into the cavity 52, the flow rate will decrease, thereby further reducing the probability of the diaphragm rupture caused by the excessive flow rate of the airflow, and improving the stability of the microphone 100.

[0061] In one embodiment, the communication hole 51 and the sound hole 4 are arranged at intervals along the extension direction of the substrate 1. By staggering the communication hole 51 and the groove 41 in the left-right direction, the airflow flowing out of the groove 41 will not flow directly into the communication hole 51, but will be blocked by the blocking member 5 to reduce the flow rate, thereby reducing the probability of the diaphragm rupture caused by the excessive flow rate of the airflow, and improving the stability of the microphone 100.

[0062] In one embodiment, there are multiple communicating holes 51 , and the multiple communicating holes 51 are arranged at intervals. The multiple communicating holes 51 are arranged to ensure the efficiency of slowing down the airflow entering the rear cavity of the pickup module 31 .

[0063] See also Figure 1In one embodiment, the groove 41 is a stepped groove 411, and a through hole 42 is provided at the bottom of the stepped groove 411; wherein the groove 41 is provided as a stepped groove 411, so that the velocity of the airflow flowing out of the through hole 42 can be gradually reduced when flowing in the stepped groove 411. It should be noted that the stepped groove 411 is formed by a plurality of grooves arranged in sequence in a direction perpendicular to the substrate 1, and for any two adjacent grooves, the inner diameter of the groove located above is larger than the inner diameter of the groove located below, thereby forming a step, and the airflow flowing out of the through hole 42 will decrease in velocity after passing through each groove in sequence, thereby reducing the probability of the diaphragm rupture caused by the excessive velocity of the airflow, and improving the stability of the microphone 100.

[0064] See also Figure 2 In one embodiment, the cross-sectional area of ​​the groove 41 is the cross-sectional area of ​​the groove 41 along the extension direction parallel to the substrate 1, and the cross-sectional area of ​​the groove 41 is gradually expanded in the direction perpendicular to the substrate 1 toward the direction close to the accommodating cavity 21; taking the cross-sectional area of ​​the groove 41 as a circle as an example, the inner diameter of the groove 41 is gradually contracted in the direction perpendicular to the substrate 1 toward the direction away from the accommodating cavity 21, so that the groove 41 forms a bell-shaped shape, and the airflow flowing out of the through hole 42 flows in the groove 41. Along the flow direction of the airflow, the inner diameter of the groove 41 gradually increases, so that the flow rate of the airflow flowing in the groove 41 will gradually decrease, thereby reducing the probability of the diaphragm rupture caused by the excessively fast flow rate of the airflow, and improving the stability of the microphone 100. The present invention also provides an electronic device, and the electronic device includes the above-mentioned microphone 100.

[0065] According to an embodiment of the present invention, the sound pickup module 31 includes a MEMS chip, the signal processing module 32 includes an ASIC chip, and the MEMS chip and the ASIC chip are electrically connected via a gold wire.

[0066] Since the electronic device adopts all the technical solutions of all the above embodiments, it at least has all the beneficial effects brought by the technical solutions of the above embodiments, which will not be described one by one here. Among them, the electronic device can be a mobile phone, a tablet, a smart watch, a bracelet, etc.

[0067] The above are only exemplary embodiments of the present invention, and are not intended to limit the patent scope of the present invention. All equivalent structural changes made using the contents of the present invention's specification and drawings, or directly / indirectly applied in other related technical fields, are included in the patent protection scope of the present invention.

Claims

1. A microphone, characterized in that: include: substrate; A housing, the housing is covered on the substrate and forms a receiving cavity with the substrate; A chip assembly, the chip assembly is located in the accommodating cavity, the chip assembly includes a sound pickup module and a signal processing module that are communicatively connected, and the sound pickup module is arranged on the substrate; A sound hole is arranged on a side of the substrate facing the shell, the sound hole is arranged toward the sound pickup module, and the size of the sound hole increases along a direction perpendicular to the substrate toward a direction close to the accommodating cavity.

2. The microphone according to claim 1, wherein The sound hole includes a groove and a through hole connected to each other. The substrate is provided with a groove on the side facing the shell, the notch of the groove is arranged toward the pickup module, the bottom wall of the groove is provided with the through hole, and the area of ​​the bottom wall of the groove is larger than the area of ​​the radial cross section of the through hole.

3. The microphone according to claim 2, characterized in that The axial directions of the groove and the through hole are both perpendicular to the substrate. The substrate includes a plurality of structural layers stacked in sequence along a direction perpendicular to the substrate. The plurality of structural layers include a first copper layer. The shell is connected to the first copper layer. The through hole can extend in some of the plurality of structural layers, and the groove can extend in the remaining structural layers.

4. The microphone according to claim 3, characterized in that The multiple structural layers include a first solder resist layer, a first copper layer, a first base material layer, a second copper layer and a second solder resist layer arranged in sequence along a direction perpendicular to the substrate, and the first solder resist layer is provided with an avoidance hole for exposing the first copper layer, so that the bottom of the shell can pass through the avoidance hole and be connected to the first copper layer.

5. The microphone according to claim 4, characterized in that The multiple structural layers also include a composite layer, which is arranged between the first substrate layer and the second copper layer. The composite layer includes a first composite copper layer, a buried layer, a second composite copper layer and a composite substrate layer which are stacked in sequence along a direction perpendicular to the substrate.

6. The microphone according to claim 5, characterized in that The plurality of structural layers further include a first integrated layer, the first integrated layer is disposed between the first substrate layer and the first composite copper layer, and the first integrated layer includes a first copper integrated layer and a first substrate integrated layer sequentially arranged in a direction perpendicular to the substrate; And / or, the plurality of structural layers further include a second integrated layer, the second integrated layer is disposed between the composite substrate layer and the second copper layer, and the second integrated layer includes a second copper integrated layer and a second substrate integrated layer arranged in sequence along a direction perpendicular to the substrate.

7. The microphone according to claim 4, characterized in that The plurality of structural layers further include an intermediate layer, the intermediate layer being disposed between the first substrate layer and the second copper layer, and the intermediate layer including a third copper layer and a third substrate layer sequentially arranged in a direction perpendicular to the substrate.

8. The microphone according to claim 7, characterized in that There are multiple intermediate layers, and the multiple intermediate layers are stacked in sequence along a direction perpendicular to the substrate.

9. The microphone according to claim 1, wherein: The size of the sound hole is gradually expanded along a direction perpendicular to the substrate toward a direction close to the accommodating cavity.

10. The microphone according to any one of claims 1 to 9, characterized in that The microphone further comprises a blocking member, which is arranged on the substrate, the sound hole is arranged towards the blocking member, the sound pickup module is arranged on a side of the blocking member away from the substrate, and the blocking member is provided with a connecting hole connecting with the sound hole.

11. The microphone according to claim 10, wherein: The blocking member cover is disposed on the substrate and forms a cavity with the substrate. The sound hole and the connecting hole are both connected to the cavity. The cross-sectional area of ​​the cavity along the direction parallel to the extension of the substrate is larger than the radial cross-sectional area of ​​the sound hole.

12. The microphone according to claim 11, wherein The communication hole and the sound hole are arranged at intervals along an extending direction of the substrate.

13. The microphone according to claim 10, characterized in that There are multiple communicating holes, and the multiple communicating holes are arranged at intervals.

14. The microphone according to any one of claims 2 to 8, characterized in that The groove is a stepped groove, and the through hole is provided at the bottom of the stepped groove; Alternatively, the cross-sectional area of ​​the groove is the cross-sectional area of ​​the groove along an extension direction parallel to the substrate, and the cross-sectional area of ​​the groove is gradually expanded along a direction perpendicular to the substrate toward a direction approaching the accommodating cavity.

15. An electronic device, characterized in that: The electronic device comprises the microphone according to any one of claims 1 to 14.

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