Thermal connector for improved electronic device cooling

Abstract

Thermal connector (1) for conducting heat from a heat-generating device (2) located in a housing (8) to a cooling module (3), the thermal connector (1) comprising a main body (4) comprising a support portion (5) and a heat transfer element (6) in contact with the support portion (5), where the main body (4) comprises a coupling interface (17) for removable coupling with the housing (8) of the device (2).

Description

Technical Field

[0001] The present invention relates to a thermal connector for conducting heat from a heat generating device located in a housing to a cooling module. In addition, the present invention relates to a cooling device comprising the thermal connector and a cooling module, and a system comprising the thermal connector or the cooling device. In addition, the present invention relates to a method for transferring heat to the outside of the housing of the heat generating device using the thermal connector or the cooling device. Background Art

[0002] Over the past few decades, the use of computing devices has increased, and these computing devices are employed in basically any field of technology, such as urban farming and video analysis applications. Despite the continuous demand for reducing size, the performance of these devices and the amount of data to be processed increase.

[0003] The computing device may be, for example, a data center, edge AI, high performance computing, a motor drive, edge AI computing including a microcontroller unit (MCU), a graphics processing unit (GPU), and a neural processing unit (NPU).

[0004] One problem associated with these devices is the generation of heat. In fact, MCUs, GPUs, and NPUs generate a lot of heat when calculating large amounts of data. Existing thermal management strategies include dissipating heat over a larger surface area. This heat dissipation usually occurs within the device enclosure, and a heat pipe or vapor chamber (sometimes also referred to as an evaporation chamber) is used to accelerate heat conduction so that heat is distributed to the rest of the device more quickly. Other forms of cooling systems use radiators and fans to cool the chipset. However, radiators and cooling fans take up space and increase the size of the product. In addition, vents and gaps are necessary for cooling the device by ventilation. Therefore, the housing of the device cannot be completely sealed, and dust and / or water particles can enter the housing, thereby damaging the device.

[0005] Other types of cooling configurations are known from the prior art. WO 2020 / 005175 A1 discloses, for example, a thermal connector for connecting a printed circuit board to a cooling structure such as a cold plate or a heat sink. The document relates to a permanent connection, which is fastened by screws to attach a thermal body for absorbing heat from the device. However, the connection arrangement is a bulky solution that is inflexible from a construction point of view in the event of replacement of components due to failure or damage. Summary of the invention

[0006] Examples of the present disclosure seek to solve or at least alleviate the above-mentioned problems.

[0007] In a first aspect, there is provided a thermal connector for conducting heat from a heat generating device located in a housing to a cooling module, the thermal connector comprising:

[0008] a body including a support portion and a heat transfer element in contact with the support portion,

[0009] The main body includes a connection interface for being connected to a housing of the device in a removable manner.

[0010] In a second aspect, there is provided a cooling device for transferring heat to an exterior of a housing of a heat generating device, the cooling device comprising:

[0011] The thermal connector according to the first aspect, and

[0012] A cooling module is located outside the housing of the device, and the cooling module is connected to the thermal connector at least through the heat transfer element of the thermal connector.

[0013] In a third aspect, there is provided a system comprising:

[0014] The thermal connector according to the first aspect or the cooling device according to the second aspect; and

[0015] A device for generating heat, the device being located inside the housing and connected to a thermal connector or cooling device through a heat collecting element,

[0016] Therein, the heat collecting element is in contact with the heat transfer element of the body of the thermal connector once the body is coupled to the housing.

[0017] In a fourth aspect, a method is provided for transferring heat to the outside of a housing of a heat generating device using a thermal connector according to the first aspect, a cooling device according to the second aspect, or a system according to the third aspect, the method comprising connecting a body to the housing, in particular to a receiving part of the thermal connector.

[0018] Further aspects and features are defined in the dependent claims.

[0019] Examples of the present disclosure may provide an efficient and easy-to-implement connector for transferring heat from a heat-generating device to a cooling element. In particular, examples of the present disclosure may provide a thermal connector between a heat-generating device and a cooling system that may be easily installed and removed in the field. In addition, examples of the present disclosure may provide a thermal connector for transferring heat to the outside of a housing of a device, thereby maintaining the housing dust-free and waterproof. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Examples of the present disclosure will now be described, by way of example only, with reference to the accompanying drawings, in which like reference numerals refer to like parts, and in which:

[0021] Figure 1 is a schematic representation of a thermal connector according to an example;

[0022] Figure 2A is a schematic representation of a thermal connector in an uncoupled configuration according to an example;

[0023] Figure 2B is a schematic representation of a thermal connector in a coupled configuration according to an example;

[0024] Figure 3 is a schematic representation of a cooling device and system according to an example;

[0025] Figure 4A is a side view of a thermal connector in an uncoupled configuration according to an example;

[0026] Figure 4B is a side view of a thermal connector in a coupled configuration according to an example;

[0027] Figure 5A is a top view of a thermal connector in an uncoupled configuration according to an example; and

[0028] Figure 5B is a top view of a thermal connector in a coupled configuration according to an example. DETAILED DESCRIPTION

[0029] Some of the figures contain simplified schematic representations. In some cases, identical reference numerals are used for identical but possibly not identical elements. Different views of the same element may be drawn to different scales. Directions such as "left", "right", "up", and "down" are to be understood with respect to the corresponding figures and may vary in individual representations compared to the depicted objects.

[0030] Disclosed are thermal connectors, cooling devices, systems and methods for transferring heat to the exterior of a housing of a device generating heat. In the following description, many specific details are presented in order to provide a thorough understanding of the examples of the present disclosure. However, it will be apparent to those skilled in the art that these specific details do not need to be adopted in order to practice the examples of the present disclosure. On the contrary, when presenting examples, specific details known to those skilled in the art are omitted for the purpose of clarity.

[0031] Figure 1A thermal connector 1 for extracting heat from a device 2 and conducting the extracted heat to a cooling module 3 is schematically illustrated. Note that the device 2 is located inside a housing 8 or device enclosure, and the cooling module 3 is located outside the housing 8. In other words, the thermal connector 1 is configured to provide a thermal path from the inside to the outside of the housing 8. The direction of heat transfer is schematically illustrated in the figure by arrows. In a basic configuration, the thermal connector 1 includes a body 4, wherein the body 4 includes a support portion 5 and a heat transfer element 6 in contact with the support portion 5. In addition, the body 4 includes a coupling interface 17, which is configured to be coupled to the housing 8 of the device 2 in a removable manner.

[0032] Advantageously, the thermal connector 1 can be attached to and removed from the housing 8 without much effort. For example, the coupling interface 17 can be configured so that the coupling mechanism between the thermal connector 1 (or a component of the thermal connector 1) and the housing 8 occurs by an insertion / extraction mechanism, without the need to permanently fix the thermal connector 1 to the housing 8, for example, using screws or other fastening devices. The thermal connector 1 (or a component of the thermal connector 1) can be a plug element, which can be inserted into the housing 8 for extracting heat from the device 2 located inside the housing 8. Therefore, the coupling interface 17 may include a plug-in coupling portion, a snap-fit ​​coupling portion, or another type of coupling portion that allows easy attachment to and removal from the housing 8 without the need for fixing elements, such as screws. For this purpose, the coupling interface 17 includes a coupling element (not shown in the figure). In a simple configuration, the coupling interface includes at least a protrusion that can be inserted into the housing 8. The coupling element may include a pin, a clip, a clamp, etc.

[0033] Note that the body 4 of the thermal connector 1 may be directly coupled to the housing 8. Alternatively, as will be described later, the body 4 may be indirectly coupled to the housing 8, ie, using an intervening element that may be fixed to the housing 8.

[0034] In one example, the coupling interface 17 is at least an outer wall of the body 4. The body 4 may have a first wall 18 at one side of the body 4 configured to be coupled to the cooling module 3 and a second wall 19 (ie, the outermost wall at the other side) corresponding to the coupling interface 17. Figure 1 As shown in FIG. 1 , the main body 4 may have an elongated shape, wherein one side of the elongated shape is a coupling interface 17 .

[0035] The heat transfer element 6 is used to conduct heat through the body 4 of the thermal connector 1, for example from the second wall 19 at the coupling interface 17 to the first wall 18 which can be connected to the cooling module 3. For this purpose, the heat transfer element 6 can be made of a material with high thermal conductivity. For example, the heat transfer element 6 can include copper or aluminum. The heat transfer element 6 advantageously extends along the body 4. The heat transfer element 6 can be completely contained in the body 1 of the thermal connector 1, or can extend outside the body 4. Figure 1An example is shown in which the heat transport element 6 extends outside the body 4 in the direction of the cooling module 3 .

[0036] To facilitate heat transfer, the heat transfer element 6 may include at least a heat pipe and / or a vapor chamber. For example, the heat pipe may extend along the body 4 and be supported by the support portion 5. The heat transfer element 6 may also be configured as a cold plate or cooling plate having channels or pipes that meander or at least extend through the plate.

[0037] In the example, the body 4 comprises a recessed area 11 extending along the heat transfer element 6. Figure 1 As shown in FIG, the recessed area 11 is located below the heat transfer element 6 and is configured to receive a corresponding element for collecting heat from the device 2 once the thermal connector is coupled to the housing 8 of the device 2. Note that the recessed area 11 may alternatively be located above or to the side of the heat transfer element 6, as long as there is a contact area between the heat transfer element 6 and the recessed area 11.

[0038] As already mentioned, the body 4 can be coupled to the housing 8 indirectly, ie using intervening elements that can be fixed to the housing 8. Figure 2A and Figure 2B Shown in.

[0039] According to this example, the thermal connector 1 further comprises a receiving part 7 fixable or secured to a housing 8 of the device 2 , the receiving part 7 being physically separable from the body 4 and comprising a housing 10 having a heat transfer area 9 . Figure 2A An uncoupled configuration is shown, in which the body 4 is separated from the receiving part 7, and Figure 2B A coupled configuration is shown, wherein the main body 4 is coupled to the receiving part 7 .

[0040] In an example, the body 4 may form a protrusion and the receiving part 7 may form a recess into which the body 4 may be inserted. Figure 2A and Figure 2B An example is shown in which the body 4 can be fully inserted into the receiving part 7, i.e. into the housing 10 of the receiving part 7. For example, the housing 10 of the receiving part 7 may include a cavity 13 for fully receiving the body 4, in particular the support portion 5, once the body 4 is coupled to the housing 8, in particular to the receiving part 7. However, according to an alternative configuration, the body 4 can be only partially inserted into the receiving part 7, i.e. into the cavity 13 of the receiving part 7.

[0041] In such Figure 2A and Figure 2BIn the configuration shown in FIG. 1 , in which the thermal connector 1 is coupled to the housing 8 of the device 2 using the receiving component 7, the coupling interface 17 is used to couple the body 4 to the receiving component 7 and indirectly to the housing 8. Advantageously, the coupling interface 17 of the thermal connector 1 may be provided along more than one outer wall of the body 4 (e.g., three walls in direct contact with the housing 10 of the receiving component 7, such as Figure 2A According to other configurations, in addition to the coupling interface 17 of the body 4, further coupling interface areas may be used. For example, one or more walls of the cooling module 3 may be provided with coupling interfaces to improve the fastening between the thermal connector 1 and the housing 8, i.e. the fastening between the body 4 and the receiving part 7.

[0042] In the example, the heat transfer area 9 of the receiving part 7 is configured to receive a heat collecting element 12 for collecting heat generated by the device 2, wherein the heat transfer element 6 of the main body 4 is in contact with said heat collecting element 12 once the main body 4 is coupled to the housing 8, in particular to the receiving part 7. For this purpose, the heat transfer area 9 may comprise a rear opening 20 through which the heat collecting element 12, such as a heat pipe, is inserted. Since the heat transfer area 9 overlaps with the recessed area 11 of the main body 4 once the main body 4 is coupled to the receiving part 7, any element, such as the heat collecting element 12, inserted into the rear opening 20 will touch the heat transfer element 6 of the thermal connector 1 in the coupled configuration.

[0043] This is Figure 3 It is clearly shown in Figure 3 The system 16 including the thermal connector 1, the device 2 generating heat and the cooling module 3 is shown. In particular, the device 2 is located inside the housing 8 and is connected to the thermal connector 1 through a heat collecting element 12 (e.g., a heat pipe). Note that once the thermal connector 1 is coupled to the housing 8 of the device 2, the heat collecting element 12 is in contact with the heat transfer element 6 of the body 4 of the thermal connector 1 to determine a heat path from the device 2 through the thermal connector 1 to the outside of the housing 8 and ultimately to the cooling module 3. According to Figure 3 It is clear that in the coupled configuration, the heat transfer element 6 and at least one end of the heat collecting element 12 are completely enclosed in the housing 10 of the receiving part 7 and / or in the casing 8. While both ends of the heat collecting element 12 are located inside the casing 8, one end of the heat transfer element 6 is located outside the casing 8 and is connected to the cooling module 3.

[0044] Note that the system 16 is designed so that the heat transfer element 6 and the heat collecting element 12 can be mechanically disconnected in such a way that externally applied pressure or movement on the cooling module 3 or body 4 does not cause misalignment or delamination of the heat collecting element 12 and the device 2 (i.e., the heat source). In other words, external forces applied on the cooling module 3 or body 4 do not affect the connection between the heat collecting element 12 and the device 2. This is to avoid a cantilever effect that causes a poor connection between the heat collecting element 12 and the device 2.

[0045] Figure 3 The following configuration is shown: wherein the system 16 includes Figure 2A-2B , the thermal connector 1 shown in the figure comprises a receiving part 7 inserted into the interior of the housing 8 of the device 2. In this case, the thermal connector will have an external part, namely the body 4, and an internal part, namely the receiving part 7. However, this is only an illustrative example. In fact, the receiving part 7 may be only partially inserted into the housing 8, or may be located outside the housing 8, but with a contact surface between the housing 10 and the housing 8.

[0046] Alternatively, the system 16 may include Figure 1 The thermal connector 1 shown in FIG. 8 is without the receiving component 7 , the thermal connector 1 (ie the coupling interface 17 ) being in direct contact with the housing 8 .

[0047] In an example, the heat generating device 2 is at least one of:

[0048] a.Data center server;

[0049] b. Edge AI devices;

[0050] c.Industrial computer;

[0051] d. High performance computing devices;

[0052] e. Motor drive; and / or

[0053] f. Programmable logic controller.

[0054] Note that the receiving part 7 of the thermal connector 1 may be insertable into the housing 8 of the device 2, which means that the housing 8 is provided with a recessed portion, inside which the receiving part 7 may be inserted, for example, in a removable manner. Alternatively, the receiving part 7 is integrated into the housing 8 of the device 2, i.e. the receiving part 7 is an integral part of the housing.

[0055] Figure 3 Also shown is a cooling device 15 for transferring heat to the outside of the housing 8 of the heat generating device 2. The cooling device 15 comprises a cooling module 3 located outside the housing 8 and a Figure 1 The thermal connector 1 described in (ie without the receiving part 7) or as Figure 2Aand Figure 2B The thermal connector 1 described in (ie having a receiving part 7).

[0056] In an example, the cooling module 3 comprises a passive cooling unit, in particular a heat sink with heat pipes or radiative cooling elements. Alternatively or additionally, the cooling module 3 is an active cooling unit, in particular a heat sink with a fan, a liquid cooling element or a Peltier module.

[0057] like Figure 3 As shown in FIG, the cooling module 3 is connected to the thermal connector 1 at least via its heat transfer element 6 and the cooling module 3 touches the heat transfer element 6. To increase the heat transfer, the heat transfer element 6 of the thermal connector 1 may extend at least partially inside the cooling module 3.

[0058] Advantageously, the cooling device 15 can be attached to and detached from the housing 8 of the device 2 in an easy manner, for example by simply inserting the cooling module 3 (i.e. the body 4 of the thermal connector 1) directly into the housing 8 or into a receiving part 7 that can be fixed to the housing 8. This can be extremely useful in the event that the cooling module 15 needs to be replaced, for example due to a malfunction or damage of the cooling module 3. In fact, the thermal connector 1 (or part of the thermal connector 1) connected to the cooling module 3 can be detached from the housing 8 or from the receiving part 7 at the coupling interface 17, and another cooling device 15 with a different or repaired cooling module 3 can be attached to the housing 8 or to the receiving part 7.

[0059] In an additional advantage, the cooling device 15 is designed to minimize and prevent external forces or pressures on the cooling module 3 or on the body 4 from displacing the connection between the heat collecting element 12 and the device 2 (ie, the heat source).

[0060] Figure 4A-4B and Figure 5A-5B The process of attaching the thermal connector 1 or the cooling device 15 to the housing 8 is shown. In particular, Figure 4A A side view showing an uncoupled configuration is shown, while Figure 4B A side view of the coupling configuration is shown. Figure 5A and Figure 5B Diagram Figure 4A and Figure 4B The same attachment process of Figure 5A A top view showing an uncoupled configuration is shown, and Figure 5B A top view of the coupling configuration is shown.

[0061] The device 2 is located inside the housing 8 and positioned on a printed circuit board 14. The device 2 generates heat and contacts a heat collecting element 12 to collect the heat and transport the heat away from the device 2. The heat collecting element 12 is an elongated element, such as a heat pipe, which extends from the device 2 to the edge of the housing 8, thereby passing through the housing 10 of the receiving part 7 of the thermal connector 1. In the uncoupled configuration ( Figure 4A ), the main body 4 of the thermal connector 1 and the cooling module 3 (forming the cooling device 15 here) are separated from the housing 8. On the other hand, in the connection structure ( Figure 4B ), the thermal connector 1 or the cooling device 15 is connected to the housing 8, and the body 4 is inserted into the receiving part 7. In particular, the support part 5 is inserted into the cavity 13 of the housing 10, and the thermal cooling element 12 is inserted into the recessed area 11 of the body 4, so that the heat transfer element 6 is in contact with the thermal cooling element 12. As long as the thermal connector 1 or the cooling device 15 is connected to the housing 8, the heat generated at the device 2 is conducted to the outside of the housing 8 through the thermal connector 1 to the cooling module 3. In particular, the heat transfer element 6 is used to conduct heat through the body 4 of the thermal connector 1, for example, from the surface in contact with the heat collecting element 12, through the heat transfer area 9, which can be connected to the cooling module 3.

[0062] This type of thermal connector 1 is configured to cool device 2 by transferring heat from device 2 and PCB 14 to the outside of housing 8. The heat can then be dissipated outside housing 8 using cooling module 3 such as a heat sink, radiation cooling, thermal convection, and other means.

[0063] Figure 5A and Figure 5B The same connection process is shown in a top view. From these figures, it is clear that the contact between the heat collecting element 12 and the heat transfer element 6 occurs over a contact surface that should be wide enough to improve the heat transfer. The area of ​​the contact surface can be calculated as a function of the heat transfer power; the larger the contact area, the higher the heat transfer.

[0064] The portions of the heat collecting element 12 and / or the heat transfer element 6 that join and form the contact surface may be configured in any other shape, such as square, circular, oval, or a combination thereof, although they have been illustrated as rectangular shapes. This may apply to any other embodiment disclosed herein. Additionally, and as previously mentioned, the heat transfer element 6 may be configured as a cold plate. However, it is preferred that the heat transfer element 6 be configured with a heat pipe or a vapor chamber.

[0065] By using the present thermal connector 1 and cooling device 15, it is possible to dissipate heat outside the enclosure of the device. This results in more efficient cooling using external cooling solutions, as a smaller and simpler device design (enclosure) can be made, increased device water resistance due to complete sealing, a more energy-efficient cooling system using the external ambient temperature outside the enclosure that is cooler than the recirculated hot air inside the enclosure, more dynamic cooling options when power is connected, and longer electronic device life and less thermal aging.

[0066] The present thermal connector 1, cooling device 15 or system 16 can be advantageously used at least in data center servers, edge AI devices, industrial PCs, high performance computing, and heat generating motors.

[0067] Although various techniques and examples of such techniques have been described herein, these are provided by way of example only and many variations and modifications to such examples will be apparent to the skilled person and fall within the spirit and scope of the invention as defined by the appended claims and their equivalents.

[0068] Reference mark

[0069] 1. Thermal connector

[0070] 2. Device for generating heat

[0071] 3. Cooling module

[0072] 4. First component

[0073] 5. Support part

[0074] 6. Heat transfer element

[0075] 7. Second component

[0076] 8. Housing

[0077] 9. Heat transfer area

[0078] 10. Housing

[0079] 11. Concave area

[0080] 12. Heat collection element

[0081] 13. Cavity

[0082] 14. Printed Circuit Board

[0083] 15. Cooling equipment

[0084] 16. System

[0085] 17.Connection interface

[0086] 18. First Wall

[0087] 19. Second Wall

[0088] 20. Open at the back.

Claims

1. A thermal connector (1) for conducting heat from a heat generating device (2) located in a housing (8) to a cooling module (3), the thermal connector (1) comprising: a body (4) comprising a support portion (5) and a heat transfer element (6) in contact with the support portion (5), The main body (4) comprises a connection interface (17) for being connected to the housing (8) of the device (2) in a removable manner.

2. The thermal connector (1) according to claim 1, wherein: The connection interface (17) is at least the outer wall of the main body (4).

3. The thermal connector (1) according to claim 1 or 2, wherein: a. The heat transfer element (6) is made of a material having a high thermal conductivity, in particular copper or aluminum; and / or b. The heat transfer element (6) comprises at least a heat pipe, a heat spreader and / or a cold plate.

4. The thermal connector (1) according to claim 1 or 2, wherein: The body (4) comprises a recessed region (11) extending along the heat transfer element (6).

5. The thermal connector (1) according to claim 1 or 2 further comprises a receiving part (7) that can be fixed to or secured to the housing (8) of the device (2), the receiving part (7) being physically separable from the body (4) and comprising a housing (10) having a heat transfer area (9).

6. The thermal connector (1) according to claim 5, the main body (4) forms a protrusion, and the receiving part (7) forms a recess, and the main body (4) can be inserted into the receiving part (7).

7. The thermal connector (1) according to claim 5 or 6, wherein: The housing (10) of the receiving part (7) comprises a cavity (13) for fully receiving the body (4), in particular the support portion (5), once the body (4) is coupled to the casing (8), in particular to the receiving part (7).

8. The thermal connector (1) according to claim 5 or 6, wherein: The heat transfer area (9) of the receiving part (7) is configured to receive a heat collecting element (12) for collecting heat generated by the device (2), wherein the heat transfer element (6) of the body (4) is in contact with the heat collecting element (12) once the body (4) is coupled to the housing (8), in particular to the receiving part (7).

9. A cooling device (15) for transferring heat to the outside of the housing (8) of the heat generating device (2), the cooling device (15) comprising: The thermal connector (1) according to claim 1 or 2 or the thermal connector (1) according to claim 5 or 6, and A cooling module (3) is located outside the housing (8) of the device (2), the cooling module (3) being connected to the thermal connector (1) at least via the heat transfer element (6) of the thermal connector (1).

10. The cooling device (15) according to claim 9, wherein a. The cooling module (3) comprises a passive cooling unit, in particular a radiator having a heat pipe or a radiant cooling element, and / or b. The cooling module (3) is an active cooling unit, in particular a heat sink with a fan, a liquid cooling element or a Peltier module.

11. The cooling device (15) according to claim 9 or 10, wherein: The heat transfer element (6) of the thermal connector (1) extends at least partially inside the cooling module (3).

12. A system (16), comprising: The thermal connector (1) according to claim 1 or 2, or the cooling device (15) according to claim 9 or 10; and a heat generating device (2), said device (2) being located inside the housing (8) and connected to said thermal connector (1) or to said cooling device (15) via a heat collecting element (12), Therein, the heat collecting element (12) is in contact with the heat transfer element (6) of the body (4) of the thermal connector (1) once the body (4) is coupled to the housing (8).

13. The system (16) of claim 12, wherein: The heat generating device (2) is at least one of: a.Data center server; b. Edge AI devices; c.Industrial computer; d. High performance computing devices; e. Motor drive; and / or f. Programmable logic controller.

14. The system (16) according to claim 12 or 13, wherein: The receiving part (7) of the thermal connector (1) can be inserted or integrated into the housing (8) of the device (2).

15. A method for transferring heat to the outside of a housing (8) of a heat generating device (2) using a thermal connector (1) according to claim 1 or 2, a cooling device (15) according to claim 9 or 10, or a system (16) according to claim 12 or 13, the method comprising connecting the body (4) to the housing (8), in particular to the receiving part (7) of the thermal connector (1).

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