5G signal coverage enhancement device

Abstract

The invention discloses a 5G signal coverage enhancement device, and relates to the technical field of telecommunication transmission, the 5G signal coverage enhancement device comprises a heat dissipation assembly, the heat dissipation assembly comprises a protective shell, the protective shell is made of a material with electromagnetic shielding performance, one inner wall of the protective shell is fixedly connected with a signal enhancement assembly, and the other inner wall of the protective shell is fixedly connected with the signal enhancement assembly. The signal enhancement assembly comprises a fixing plate, and a circuit board element is arranged in the middle of the outer surface of the fixing plate. According to the 5G signal coverage enhancing device, the connecting clamping frame is tightly inserted into the connecting clamping groove, so that external electromagnetic interference can be prevented from influencing the electronic element, electromagnetic radiation in the shielding cover is limited in the equipment, the shielding cover is good in shielding performance, high in magnetic permeability and good in conductivity, and the service life of the equipment is prolonged. The signal intensifier is a material prepared by compounding permalloy, metal copper and metal aluminum, the problem that an existing signal intensifier is affected by an external magnetic field is solved, and the accuracy of signal coverage data is improved.

Description

Technical Field

[0001] The present invention relates to the field of electrical communication transmission technology, and specifically to a 5G signal coverage enhancement device. Background Art

[0002] With the rapid development of 5G technology, it has been widely used in many fields, such as intelligent transportation, industrial Internet, telemedicine, and high-definition video streaming, due to its characteristics of high bandwidth, low latency, and large number of connections. However, in the actual application of 5G networks, the signal coverage problem is still a challenge that needs to be solved urgently. The frequency of 5G signals is higher, and compared with traditional 4G signals, their propagation loss is greater and their diffraction ability is weaker. This makes 5G signals more susceptible to obstruction by obstacles such as buildings and terrain during propagation, resulting in signal coverage blind spots and areas with weak signal strength.

[0003] However, in the prior art, when using a 5G signal enhancer, the external magnetic field will interfere with the internal part. Such interference will distort the waveform of the signal, causing errors or loss of the information carried by the signal. Moreover, when the interference signal is superimposed on the useful signal as noise, the signal-to-noise ratio will decrease, and the bit error rate will increase, affecting the accuracy of data transmission.

[0004] Therefore, we propose a 5G signal coverage enhancement device to solve the above problems. Summary of the invention

[0005] The purpose of the present invention is to provide a 5G signal coverage enhancement device to solve the problem proposed in the above background technology that the existing signal enhancer will be affected by the external magnetic field, thereby reducing the data accuracy.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a 5G signal coverage enhancement device, comprising a heat dissipation component, the heat dissipation component comprising a protective shell, and the protective shell is made of a material with electromagnetic shielding performance, one of the inner walls of the protective shell is fixedly connected with a signal enhancement component, the signal enhancement component comprises a fixing plate, a circuit board component is arranged in the middle of the outer surface of the fixing plate, and the function of the circuit board component is to install electronic components for enhancing the signal, a connection card slot is provided on the outer surface of the fixing plate near the edge, a connection card frame is plugged and connected inside the connection card slot, and the connection card frame is made of a hard rubber material A shielding cover is fixedly connected to the outer surface of the connection card frame, and the shielding cover is used to shield the circuit board components. The shielding cover includes Permalloy, metal copper and metal aluminum. The Permalloy has high magnetic permeability and is used to shield low-frequency magnetic field interference so that the electronic components installed on the circuit board components can be protected from the influence of external low-frequency electromagnetic signals. The metal copper has good conductivity and is used to shield high-frequency electromagnetic waves. It can reflect high-frequency electromagnetic signals and prevent high-frequency electromagnetic signals from entering the circuit board components. The metal aluminum is light in weight, low in cost, and corrosion-resistant. The metal aluminum has good conductivity and can be matched with metal copper to have the ability to shield high-frequency electromagnetic interference.

[0007] Preferably, a controller is disposed on the inner wall of the other side of the protective shell, and the controller is used for sending, receiving and controlling instructions.

[0008] Preferably, two sides of the protective shell away from the outer surface are fixedly connected with first heat dissipation fins, and the other two sides of the protective shell away from the outer surface are fixedly connected with second heat dissipation fins, and the first heat dissipation fins and the second heat dissipation fins are used to dissipate heat generated during the operation of the circuit board components to the outside, and adjacent edges of each of the first heat dissipation fins and each of the second heat dissipation fins are fixedly connected with connecting angle steels, and the connecting angle steels are used to strengthen the installation between the first heat dissipation fins and the second heat dissipation fins and the protective shell.

[0009] Preferably, a support plate is fixedly connected to the top of the protective shell near one of the corners, a drive motor is arranged on the outer surface of the support plate, and an output shaft of the drive motor is fixedly connected to a driving gear.

[0010] Preferably, a plurality of fixed ring plates are fixedly connected to the top of the protective shell, and the fixed ring plates are used for positioning and heat dissipation, the outer surface of each of the fixed ring plates is rotatably connected to a rotating shell, the outer surface of each of the rotating shells is fixedly connected to a heat dissipation ring plate, each of the heat dissipation ring plates is used to dissipate the heat conducted from the fixed ring plates, and the bottom of each of the rotating shells is fixedly connected to a driven gear.

[0011] Preferably, outer surfaces of the plurality of driven gears are meshingly connected, wherein the outer surface of one of the driven gears is meshingly connected to the outer surface of the driving gear, and the driving gear is used to drive the plurality of driven gears to rotate simultaneously.

[0012] Preferably, a fixing component is arranged at the bottom of the protective shell, and the fixing component includes a mounting base plate, two mounting holes are provided on both sides of the mounting base plate, and the mounting holes are used to complete the installation of the mounting base plate using screws, and fixing holes are provided on the outer surface of the mounting base plate near the four corners, and a mounting component is fixedly installed on the inner wall of each of the fixing holes.

[0013] Preferably, the mounting assembly comprises a fixing rod, a reinforcing screw is welded to the top end of the fixing rod, a butterfly nut is threadedly connected to the outer surface of the reinforcing screw, and a pressing block is fixedly connected to the bottom end of the fixing rod.

[0014] Preferably, the outside of the fixing rod is movably connected to a fixing tube, the bottom of the fixing tube is fixedly connected to a suction cup shell, a pressure regulating tube is movably installed on the outer surface of the fixing rod, one end of the pressure regulating tube is fixedly connected to an airbag, and the airbag is used to temporarily store the gas discharged from the rubber suction cup.

[0015] Preferably, a rubber suction cup is fixedly connected to the inner wall of one side of the suction cup shell, an air supply bin is opened inside the rubber suction cup, and the air supply bin is used to transport the gas to be discharged from the rubber suction cup, a plurality of air inlet holes are opened on the inner bottom surface of the air supply bin, and a plurality of connecting pipes are fixedly connected to the inner top surface of the air supply bin, and the top ends of the plurality of connecting pipes are movably penetrated through the suction cup shell and connected with the pressure regulating pipe.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] 1. When in use, by tightly inserting the connection card frame into the connection card slot, it is possible to prevent external electromagnetic interference from affecting electronic components, and at the same time limit the electromagnetic radiation inside the shielding cover to the inside of the device. The shielding cover has good shielding performance, high magnetic permeability and good conductivity. It is a composite material made of Permalloy, metal copper and metal aluminum, which solves the problem that the existing signal enhancer is affected by the external magnetic field and improves the accuracy of signal coverage data. Among them, Permalloy is a commonly used high magnetic permeability material with extremely high magnetic permeability, which can effectively shield low-frequency magnetic field interference and has a significant effect on protecting the signal amplifier from the influence of external low-frequency electromagnetic signals. Metal copper has good conductivity and has an excellent shielding effect on high-frequency electromagnetic waves. It can reflect high-frequency electromagnetic signals and prevent them from entering the inside of the shielding cover. In addition, it is matched with light-weight, low-cost and corrosion-resistant metal aluminum to enhance conductivity and has the benefit of enhanced shielding ability against high-frequency electromagnetic interference.

[0018] 2. When in use, the first heat dissipation fins and the second heat dissipation fins which are arranged in an arc shape as a whole can achieve the purpose of improving the heat dissipation efficiency. When the operating temperature is not very high, the drive motor is not started. When the noise caused by the operating temperature is too high, the drive motor can be started by the controller. The output shaft of the drive motor rotates, which will drive the driving gear to rotate. Since all the driven gears are meshed with each other, the driving gear can drive all the driven gears to rotate. The direction of rotation of the driven gears can refer to the figure. At this time, the rotating shell is rotated outside the fixed ring piece, so that the heat dissipation ring piece can be rotated, and the hot air between the multiple sets of heat dissipation ring pieces flows, which has the benefit of accelerating heat dissipation and reducing the noise caused by signal enhancement.

[0019] 3. When in use, there are two ways to install the base plate, which can be selected according to needs. By using suction to suck the installation base plate onto a smooth surface, seamless installation is completed, and this method has the advantage of free installation position. By passing the fixing rod through the fixing hole, the four suction cup shells and the rubber suction cup are pressed against the smooth plane, and by rotating the butterfly nut, the pressing block continuously squeezes the rubber suction cup toward the smooth plane. Then the gas between the rubber suction cup and the smooth plane will enter the gas transmission bin through the air inlet hole, and then reach the pressure regulating pipe through the connecting pipe, and finally collected inside the air bag. Therefore, the space between the rubber suction cup and the smooth plane forms a negative pressure, which can achieve the effect of increasing suction. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a first-perspective stereoscopic image of a 5G signal coverage enhancement device of the present invention;

[0021] Figure 2 A second perspective stereogram of a 5G signal coverage enhancement device according to the present invention;

[0022] Figure 3 This is a cross-sectional stereoscopic diagram of a partial structure of a heat dissipation component of a 5G signal coverage enhancement device of the present invention;

[0023] Figure 4 This is a schematic diagram of the rotation of the rotating casing part of a 5G signal coverage enhancement device of the present invention;

[0024] Figure 5 This is a cross-sectional stereoscopic diagram of a partial structure of a signal enhancement component of a 5G signal coverage enhancement device of the present invention;

[0025] Figure 6 This is a partially cutaway stereoscopic view of a shielding cover of a 5G signal coverage enhancement device of the present invention;

[0026] Figure 7 This is a schematic diagram of the structure of a shielding cover portion of a 5G signal coverage enhancement device of the present invention;

[0027] Figure 8 This is a top perspective view of the installation component portion of a 5G signal coverage enhancement device of the present invention;

[0028] Fig. 9 This is a partially cutaway stereoscopic view of an installation component of a 5G signal coverage enhancement device of the present invention;

[0029] Fig.10 This is a sectional stereoscopic diagram of the partial structure of the installation component of a 5G signal coverage enhancement device of the present invention.

[0030] In the figure:

[0031] 1. Fixing assembly; 101. Mounting base plate; 102. Mounting hole; 103. Fixing hole; 2. Controller; 3. Mounting assembly; 301. Butterfly nut; 302. Strengthening screw; 303. Fixing rod; 304. Pressing block; 305. Air bag; 306. Pressure regulating pipe; 307. Fixing pipe; 308. Suction cup shell; 309. Connecting pipe; 310. Air delivery chamber; 311. Air inlet hole; 312. Rubber suction cup; 4. Heat dissipation assembly; 401. Support plate; 402. Active Gear; 403, driving motor; 404, driven gear; 405, rotating shell; 406, first heat sink fin; 407, connecting angle steel; 408, heat sink ring; 409, fixing ring; 410, protective shell; 411, second heat sink fin; 5, signal enhancement component; 501, shielding cover; 502, connecting card frame; 503, circuit board component; 504, fixing plate; 505, connecting card slot; 511, Permalloy; 512, metal copper; 513, metal aluminum. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the implementation regulations described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0033] Example 1: Reference Figure 1-Figure 10As shown, the present invention provides a technical solution: a 5G signal coverage enhancement device, including a heat dissipation component 4, the heat dissipation component 4 includes a protective shell 410, and the protective shell 410 is made of a material with electromagnetic shielding performance, one of the inner walls of the protective shell 410 is fixedly connected with a signal enhancement component 5, the signal enhancement component 5 includes a fixing plate 504, a circuit board component 503 is arranged in the middle of the outer surface of the fixing plate 504, and the function of the circuit board component 503 is to install electronic components for enhancing signals, and a connection card slot 505 is opened near the edge of the outer surface of the fixing plate 504, and the interior of the connection card slot 505 The plug-in connection is provided with a connection card frame 502, and the connection card frame 502 is made of a hard rubber material. A shielding cover 501 is fixedly connected to the outer surface of the connection card frame 502, and the shielding cover 501 is used to shield the circuit board component 503. The shielding cover 501 includes a permalloy 511, a metal copper 512 and a metal aluminum 513. The permalloy 511 has a high magnetic permeability and is used to shield low-frequency magnetic field interference so that the electronic components installed on the circuit board component 503 are protected from the influence of external low-frequency electromagnetic signals. The metal copper 512 has good conductivity and is used to shield high-frequency electromagnetic waves. It can reflect high-frequency electromagnetic signals to prevent Prevent high-frequency electromagnetic signals from entering the circuit board component 503. The metal aluminum 513 is light in weight, low in cost, and corrosion-resistant. The metal aluminum 513 has good conductivity. It is matched with the metal copper 512 to have the ability to shield high-frequency electromagnetic interference. A controller 2 is set on the inner wall of the other side of the protective shell 410. The controller 2 is used for sending and receiving instructions and controlling. The two sides of the protective shell 410 that are away from the outer surface are fixedly connected with the first heat dissipation fins 406, and the other two sides of the protective shell 410 that are away from the outer surface are fixedly connected with the second heat dissipation fins 411. The top of the protective shell 410 is fixedly connected with a plurality of fixed ring pieces 409, and the fixed ring pieces 409 are fixedly connected to the top of the protective shell 410. The sheet 409 is used for positioning and heat dissipation. The outer surface of each fixed ring sheet 409 is rotatably connected to the rotating shell 405. The outer surface of each rotating shell 405 is fixedly connected to the heat dissipation ring sheet 408. A fixing component 1 is set at the bottom of the protective shell 410. The fixing component 1 includes a mounting base plate 101. Two mounting holes 102 are provided on both sides of the mounting base plate 101, and the mounting holes 102 are used to complete the installation of the mounting base plate 101 using screws. The outer surface of the mounting base plate 101 is provided with fixing holes 103 near the four corners, and the inner wall of each fixing hole 103 is fixedly installed with a mounting component 3.

[0034] In this embodiment, when in use, first, the installation of the installation base plate 101 is completed to achieve the installation of the entire 5G signal coverage enhancement device. During operation, the heat generated by the operation of the device will be effectively dissipated through the heat dissipation component 4, and the installation inside the protective shell 410 is achieved by fixing the fixing plate 504 on the inner wall of the protective shell 410. The circuit board element 503 contains electronic components for 5G signal coverage enhancement, which are installed on the surface of the fixing plate 504 for use. During installation, the connection card frame 502 is tightly inserted into the inside of the connection card slot 505 so that the two are closely connected, thereby preventing external electromagnetic interference from affecting the electronic components, and also limiting the electromagnetic radiation inside the shielding cover 501 to the inside of the device. The shielding cover 5 01 has good shielding performance, high magnetic permeability and good electrical conductivity. It is a composite material made of Permalloy 511, metal copper 512 and metal aluminum 513. Among them, Permalloy 511 is a commonly used high magnetic permeability material with extremely high magnetic permeability. It can effectively shield low-frequency magnetic field interference and has a significant effect on protecting the signal amplifier from the influence of external low-frequency electromagnetic signals. Metal copper 512 has good electrical conductivity and has an excellent shielding effect on high-frequency electromagnetic waves. It can reflect high-frequency electromagnetic signals and prevent them from entering the interior of the shielding cover 501. In addition, it is matched with light-weight, low-cost and corrosion-resistant metal aluminum 513 to enhance electrical conductivity and has the benefit of enhanced shielding ability against high-frequency electromagnetic interference, solving the problem of existing signal enhancers being affected by external magnetic fields and improving the accuracy of signal coverage data.

[0035] Embodiment 2: Figure 1-Figure 10As shown, two sides of the protective shell 410 away from the outer surface are fixedly connected with the first heat dissipation fins 406, and the other two sides of the protective shell 410 away from the outer surface are fixedly connected with the second heat dissipation fins 411, and the first heat dissipation fins 406 and the second heat dissipation fins 411 are used to dissipate the heat generated by the circuit board element 503 during operation. The adjacent edges of each first heat dissipation fin 406 and each second heat dissipation fin 411 are fixedly connected with a connecting angle steel 407, and the connecting angle steel 407 is used to strengthen the installation between the first heat dissipation fin 406 and the second heat dissipation fin 411 and the protective shell 410. A support plate 401 is fixedly connected to the top of the protective shell 410 near one of the corners, and a driving motor 403 is arranged on the outer surface of the support plate 401. The output shaft of the driving motor 403 is fixedly connected with a driving gear 402. A plurality of fixed ring pieces 409 are fixedly connected to the top of the protective shell 410, and the fixed ring pieces 409 are used for positioning and heat dissipation. Each fixed ring piece The outer surface of 409 is rotatably connected with a rotating shell 405, and the outer surface of each rotating shell 405 is fixedly connected with a heat dissipation ring sheet 408, and each heat dissipation ring sheet 408 is used to dissipate the heat conducted by the fixed ring sheet 409. The bottom of each rotating shell 405 is fixedly connected with a driven gear 404, and the outer surfaces of multiple driven gears 404 are meshedly connected. The outer surface of one driven gear 404 is meshedly connected with the outer surface of the driving gear 402, and the driving gear 402 is used to drive multiple driven gears 404 to rotate simultaneously. A fixing component 1 is set at the bottom of the protective shell 410, and the fixing component 1 includes a mounting base plate 101. Two mounting holes 102 are provided on both sides of the mounting base plate 101, and the mounting holes 102 are used to complete the installation of the mounting base plate 101 using screws. Fixing holes 103 are provided on the outer surface of the mounting base plate 101 near the four corners, and the inner wall of each fixing hole 103 is fixedly installed with a mounting component 3.

[0036] In this embodiment, when in use, the signal enhancer generates heat when it is working, and excessively high temperature will cause loud noise. Therefore, the heat can be dissipated through the first heat dissipation fin 406 and the second heat dissipation fin 411, wherein the first heat dissipation fin 406 and the second heat dissipation fin 411 are arc-shaped as a whole, so as to achieve the purpose of improving the heat dissipation efficiency. Since the heat on the side where the circuit board component 503 is installed is the highest, the required heat dissipation performance should also be the best. When the operating temperature is not very high, the drive motor 403 is not started. When the noise caused by excessively high operating temperature is too loud, the drive motor 403 can be started by the controller 2. The output shaft of the drive motor 403 rotates, which will drive the driving gear 402 to rotate. Since all the driven gears 404 are meshed with each other, the driving gear 402 can drive all the driven gears 404 to rotate. The direction of rotation of the driven gear 404 can refer to Figure 4At this time, by rotating the housing 405 outside the fixed ring 409, the heat dissipation ring 408 can be rotated, and the hot air between the multiple groups of heat dissipation rings 408 can flow, which has the benefit of accelerating heat dissipation and reducing noise caused by signal enhancement.

[0037] Embodiment three: Figure 1-Figure 10 As shown, a fixing component 1 is arranged at the bottom of the protective shell 410, and the fixing component 1 includes a mounting base plate 101, two mounting holes 102 are arranged on both sides of the mounting base plate 101, and the mounting holes 102 are used to complete the installation of the mounting base plate 101 using screws, and the outer surface of the mounting base plate 101 is provided with fixing holes 103 near the four corners, and the inner wall of each fixing hole 103 is fixedly installed with a mounting component 3, and the mounting component 3 includes a fixing rod 303, a reinforcing screw rod 302 is welded to the top of the fixing rod 303, and a butterfly nut 301 is threadedly connected to the outer surface of the reinforcing screw rod 302, and a pressing block 304 is fixedly connected to the bottom end of the fixing rod 303, and a fixing pipe 304 is movably connected to the outside of the fixing rod 303 7. A suction cup shell 308 is fixedly connected to the bottom of the fixed tube 307, a pressure regulating tube 306 is movably installed on the outer surface of the fixed rod 303, one end of the pressure regulating tube 306 is fixedly connected to an air bag 305, and the air bag 305 is used to temporarily store the gas discharged from the rubber suction cup 312, a rubber suction cup 312 is fixedly connected to the inner wall of one side of the suction cup shell 308, an air delivery bin 310 is opened inside the rubber suction cup 312, and the air delivery bin 310 is used to deliver the gas to be discharged from the rubber suction cup 312, a plurality of air inlet holes 311 are opened on the inner bottom surface of the air delivery bin 310, a plurality of connecting tubes 309 are fixedly connected to the inner top surface of the air delivery bin 310, and the top ends of the plurality of connecting tubes 309 are all movably penetrated through the suction cup shell 308 and connected with the pressure regulating tube 306.

[0038] In this embodiment, when in use, the mounting base plate 101 needs to be fixed on a platform for easy use. There are two installation methods, which can be selected according to needs. One is to fix the installation nails on the platform according to the positions of the four mounting holes 102, and then put the nails on the parts with larger inner diameters of the four mounting holes 102, and then move the mounting base plate 101 downward as a whole, so that the nails are stuck on the parts with smaller inner diameters of the four mounting holes 102, thereby completing the installation of the mounting base plate 101. Another installation method is a suction cup type, which uses suction to suck the mounting base plate 101 on a smooth surface, thereby completing a traceless installation, and this method has the advantage of free installation position. The installation steps are: first, fix the base plate 101 on the platform, and then fix the base plate 101 on the platform. The fixed rod 303 passes through the fixing hole 103, and then the butterfly nut 301 is put on the outside of the reinforcing screw 302, and the four suction cup shells 308 and the rubber suction cup 312 are pressed tightly against the smooth plane. By rotating the butterfly nut 301, the pressing block 304 continuously squeezes the rubber suction cup 312 toward the smooth plane, so that the gas between the rubber suction cup 312 and the smooth plane will enter the inside of the gas transmission warehouse 310 through the air inlet hole 311, and then reach the inside of the pressure regulating pipe 306 through the connecting pipe 309, and finally be collected in the inside of the airbag 305. Therefore, the space between the rubber suction cup 312 and the smooth plane forms a negative pressure, which can achieve the effect of increasing the suction force, wherein the role of the suction cup shell 308 is to protect the rubber suction cup 312.

[0039] The method of using the device and the working principle: When in use, first complete the installation of the installation base plate 101 to achieve the installation of the entire 5G signal coverage enhancement device. During operation, the heat generated by the operation of the device will be effectively dissipated through the heat dissipation component 4, and the installation inside the protective shell 410 is achieved by fixing the fixing plate 504 on the inner wall of the protective shell 410. The circuit board element 503 contains electronic components for 5G signal coverage enhancement, which are installed on the surface of the fixing plate 504 for use. When installing, connect the card frame 502 It is tightly inserted into the connection card slot 505 so that the two are closely connected, thereby preventing external electromagnetic interference from affecting the electronic components, and also limiting the electromagnetic radiation inside the shielding cover 501 to the inside of the device. The shielding cover 501 has good shielding performance, high magnetic permeability and good conductivity. It is made of a composite material of Permalloy 511, metal copper 512 and metal aluminum 513. Among them, Permalloy 511 is a commonly used high magnetic permeability material with extremely high magnetic permeability. It can effectively shield low-frequency magnetic field interference and has a significant effect on protecting the signal amplifier from the influence of external low-frequency electromagnetic signals. The metal copper 512 has good electrical conductivity and has an excellent shielding effect on high-frequency electromagnetic waves. It can reflect high-frequency electromagnetic signals and prevent them from entering the interior of the shielding cover 501. In addition, it is matched with the metal aluminum 513, which is light, low-cost and corrosion-resistant, to enhance electrical conductivity. When in use, the signal enhancer will generate heat when working. Excessive temperature will cause greater noise. Then, the heat can be dissipated through the first heat sink fin 406 and the second heat sink fin 411. The first heat sink fin 406 and the second heat sink fin 411 are arc-shaped as a whole, so as to achieve the purpose of improving heat dissipation efficiency. Since the heat on the side where the circuit board component 503 is installed is the highest, the required heat dissipation performance should also be the best. When the operating temperature is not very high, the drive motor 403 is not started. When the noise caused by the operating temperature is too high, the drive motor 403 can be started by the controller 2. The output shaft of the drive motor 403 rotates, which will drive the driving gear 402 to rotate. Since all the driven gears 404 are meshed with each other, the driving gear 402 can drive all the driven gears 404 to rotate. The direction of rotation of the driven gear 404 can refer to Figure 4At this time, by rotating the casing 405 outside the fixed ring sheet 409, the heat dissipation ring sheet 408 can be rotated, and the hot air between the multiple sets of heat dissipation ring sheets 408 can flow, which has the benefit of accelerating heat dissipation. When in use, the mounting base plate 101 needs to be fixed on a platform for easy use. There are two installation methods, which can be selected according to needs. One is to fix the installation nails on the platform according to the positions of the four mounting holes 102, and then put the parts with larger inner diameters of the four mounting holes 102 on the nails, and then move the mounting base plate 101 downward as a whole, so that the parts with smaller inner diameters of the four mounting holes 102 are stuck with the nails, thereby completing the installation of the mounting base plate 101. Another installation method is a suction cup type, which uses suction to suck the mounting base plate 101 onto a smooth surface , thereby completing a traceless installation, and this method has the advantage of free installation position. The installation steps are: first, pass the fixing rod 303 through the fixing hole 103, and then put the butterfly nut 301 on the outside of the reinforcing screw 302, and put the four suction cup shells 308 and the rubber suction cup 312 close to the smooth plane. By rotating the butterfly nut 301, the pressing block 304 continuously squeezes the rubber suction cup 312 toward the smooth plane, then the gas between the rubber suction cup 312 and the smooth plane will enter the inside of the gas delivery warehouse 310 through the air inlet hole 311, and then reach the inside of the pressure regulating pipe 306 through the connecting pipe 309, and finally collected in the inside of the air bag 305, so the space between the rubber suction cup 312 and the smooth plane forms a negative pressure, and the role of the suction cup shell 308 is to protect the rubber suction cup 312.

[0040] The wiring diagram of the controller 2 and the drive motor 403 in the present invention is common knowledge in the art, and its working principle is a known technology. The model is selected according to the actual use, so the control method and wiring layout of the controller 2 and the drive motor 403 are no longer explained in detail.

[0041] Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A 5G signal coverage enhancement device, comprising a heat dissipation component (4), wherein the heat dissipation component (4) comprises a protective shell (410), and the protective shell (410) is made of a material having electromagnetic shielding performance, and one inner wall of the protective shell (410) is fixedly connected to a signal enhancement component (5), characterized in that: The signal enhancement component (5) comprises a fixing plate (504), a circuit board component (503) is arranged in the middle of the outer surface of the fixing plate (504), and the function of the circuit board component (503) is to install electronic components for enhancing the signal, a connection card slot (505) is provided on the outer surface of the fixing plate (504) near the edge, a connection card frame (502) is plugged and connected inside the connection card slot (505), and the connection card frame (502) is made of hard rubber material, a shielding cover (501) is fixedly connected to the outer surface of the connection card frame (502), and the shielding cover (501) is used to shield the circuit board component (503), and the shielding cover (501) includes Permalloy (511), metal copper (512) and metal aluminum (513). The Permalloy (511) has high magnetic permeability and is used to shield low-frequency magnetic field interference, thereby protecting the electronic components installed on the circuit board component (503) from the influence of external low-frequency electromagnetic signals. The metal copper (512) has good electrical conductivity and is used to shield high-frequency electromagnetic waves. It can reflect high-frequency electromagnetic signals and prevent high-frequency electromagnetic signals from entering the circuit board component (503). The metal aluminum (513) is light in weight, low in cost and corrosion-resistant. The metal aluminum (513) has good electrical conductivity and can shield high-frequency electromagnetic interference when combined with the metal copper (512).

2. The 5G signal coverage enhancement device according to claim 1, characterized in that: A controller (2) is arranged on the inner wall of the other side of the protective shell (410), and the controller (2) is used for sending, receiving and controlling instructions.

3. The 5G signal coverage enhancement device according to claim 2, characterized in that: Two sides of the protective shell (410) away from the outer surface are fixedly connected with first heat dissipation fins (406), and the other two sides of the protective shell (410) away from the outer surface are fixedly connected with second heat dissipation fins (411), and the first heat dissipation fins (406) and the second heat dissipation fins (411) are used to dissipate heat generated by the circuit board element (503) during operation to the outside, and the adjacent edges of each of the first heat dissipation fins (406) and each of the second heat dissipation fins (411) are fixedly connected with connecting angle steels (407), and the connecting angle steels (407) are used to strengthen the installation between the first heat dissipation fins (406) and the second heat dissipation fins (411) and the protective shell (410).

4. The 5G signal coverage enhancement device according to claim 3, characterized in that: A support plate (401) is fixedly connected to the top of the protective shell (410) near one of the corners, a drive motor (403) is arranged on the outer surface of the support plate (401), and an output shaft of the drive motor (403) is fixedly connected to a driving gear (402).

5. The 5G signal coverage enhancement device according to claim 4, characterized in that: The top of the protective shell (410) is fixedly connected with a plurality of fixed ring pieces (409), and the fixed ring pieces (409) are used for positioning and heat dissipation. The outer surface of each fixed ring piece (409) is rotatably connected with a rotating casing (405). The outer surface of each rotating casing (405) is fixedly connected with a heat dissipation ring piece (408), and each heat dissipation ring piece (408) is used to dissipate the heat conducted from the fixed ring piece (409). The bottom of each rotating casing (405) is fixedly connected with a driven gear (404).

6. The 5G signal coverage enhancement device according to claim 5, characterized in that: The outer surfaces of the plurality of driven gears (404) are meshedly connected to each other, the outer surface of one of the driven gears (404) is meshedly connected to the outer surface of the driving gear (402), and the driving gear (402) is used to drive the plurality of driven gears (404) to rotate simultaneously.

7. The 5G signal coverage enhancement device according to claim 6, characterized in that: A fixing component (1) is arranged at the bottom of the protective shell (410), and the fixing component (1) comprises a mounting base plate (101), two mounting holes (102) are provided on both sides of the mounting base plate (101), and the mounting holes (102) are used to install the mounting base plate (101) using screws, and fixing holes (103) are provided on the outer surface of the mounting base plate (101) near the four corners, and a mounting component (3) is fixedly installed on the inner wall of each fixing hole (103).

8. The 5G signal coverage enhancement device according to claim 7, characterized in that: The mounting assembly (3) comprises a fixing rod (303), a reinforcing screw rod (302) is welded to the top end of the fixing rod (303), a butterfly nut (301) is threadedly connected to the outer surface of the reinforcing screw rod (302), and a pressing block (304) is fixedly connected to the bottom end of the fixing rod (303).

9. The 5G signal coverage enhancement device according to claim 8, characterized in that: The outside of the fixing rod (303) is movably connected to a fixing tube (307), the bottom of the fixing tube (307) is fixedly connected to a suction cup shell (308), the outer surface of the fixing rod (303) is movably mounted with a pressure regulating tube (306), one end of the pressure regulating tube (306) is fixedly connected to an air bag (305), and the air bag (305) is used to temporarily store gas discharged from the rubber suction cup (312).

10. The 5G signal coverage enhancement device according to claim 9, characterized in that: A rubber suction cup (312) is fixedly connected to the inner wall of one side of the suction cup shell (308), and a gas delivery chamber (310) is provided inside the rubber suction cup (312). The gas delivery chamber (310) is used to deliver the gas to be discharged from the rubber suction cup (312). A plurality of air inlet holes (311) are provided on the inner bottom surface of the gas delivery chamber (310), and a plurality of connecting pipes (309) are fixedly connected to the inner top surface of the gas delivery chamber (310), and the top ends of the plurality of connecting pipes (309) are movably penetrated through the suction cup shell (308) and are connected to the pressure regulating pipe (306).

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