Circuit board multifunctional pilot plant test manufacturing device and method

Abstract

The invention provides a circuit board multifunctional pilot plant test manufacturing device and method, and relates to the technical field of circuit board intelligent manufacturing. The device is used for pilot test of circuit board cleaning liquid medicine and comprises a first preparation group providing module used for manufacturing, and the first preparation group providing module comprises a plurality of first preparation group sub-modules; the preparation receiving module is used for receiving the preparations provided by the first preparation group providing module and conveying and moving the received preparations to a required place; the preparation receiving module comprises a plurality of preparation receiving sub-modules; an auxiliary manufacturing equipment module; the pipe orifice flange sleeve and the pipe orifice flange sleeve control device are used for connecting and disconnecting all the modules.

Description

Technical Field

[0001] The present invention relates to the field of intelligent manufacturing technology of circuit boards, and in particular to a multifunctional pilot manufacturing device and method for circuit boards, which belongs to H01L21 / 00 in the field of IPC (method or apparatus specially adapted for manufacturing or processing semiconductor or solid devices or components thereof). Background Art

[0002] In the production and processing of circuit boards, in order to improve the welding effect of the circuits and components on the circuit boards, it is generally necessary to dip an appropriate amount of flux during welding and then perform welding on the circuit boards. After welding, there will be flux residue on the surface of the circuit board, and the flux residue will cause problems such as electrical performance, reliability, thermal resistance, appearance, safety and signal interference on the circuit board.

[0003] Impact on electrical performance: Certain components in the flux may penetrate into the tiny holes on the circuit board, causing the circuit board to short-circuit or open-circuit, directly affecting the electrical performance of the circuit board, and may cause the product to malfunction or intermittent failure.

[0004] Reduced reliability: Flux residue may attract dust and contaminants, forming a conductive path that reduces the long-term reliability of the board. In addition, residual flux may chemically change over time, causing corrosion, further affecting the reliability of the board.

[0005] Increased thermal resistance: Flux residue will increase the thermal resistance of the circuit board and affect the heat dissipation function of electronic components. In a high temperature environment, it may cause the temperature of components to rise, affecting the stability and service life of the components.

[0006] Appearance impact: Flux residue may cause poor appearance of the circuit board and affect the packaging and appearance quality of the product.

[0007] Safety issues: If the flux residue contains hazardous substances, such as heavy metals or harmful volatile organic compounds (VOCs), it will cause long-term harm to human health and the environment.

[0008] Signal interference: In high-speed signal transmission applications, flux residue may cause signal interference or electromagnetic compatibility (EMC) problems, affecting product performance and stability.

[0009] Therefore, after the welding work of the circuit board, the circuit board needs to be cleaned to remove the residual flux on the circuit board to avoid the flux affecting the performance of the circuit board. The existing cleaning process is generally: first, the circuit board is cleaned multiple times with a cleaning solution, then the circuit board is rinsed with clean water, and finally the circuit board is sent out after drying to complete the whole cleaning process. Therefore, in the current prior art, although the cleaning process is relatively mature, the cleaning solution of the circuit board is less studied in the pilot manufacturing process of the circuit board. Therefore, the prior art urgently needs to develop a multifunctional pilot manufacturing device for circuit boards, especially a pilot manufacturing device for circuit board cleaning solution. Summary of the invention

[0010] The present invention provides a multifunctional pilot manufacturing device and method for circuit boards, which are used for pilot manufacturing of circuit board cleaning solutions, including a first preparation group providing module A for manufacturing circuit board cleaning solutions, wherein the first preparation group providing module includes a plurality of first preparation group sub-modules 10; a preparation receiving module B, which is used to receive each preparation provided by the first preparation group providing module A and transport and move the received preparation to a required location; the preparation receiving module B includes a plurality of preparation receiving sub-modules 20; an auxiliary manufacturing equipment module C; and a pipe orifice flange sleeve and a pipe orifice flange sleeve control device for connecting and disconnecting each module.

[0011] Each of the first preparation group submodules 10 includes a preparation funnel Va-Vl, a preparation delivery pipeline, and a preparation delivery pipe mouth flange sleeve Aa-Al. The lower end of the preparation funnel Va-Vl is connected to the preparation delivery pipeline, and the preparation delivery pipeline line segment is connected to the preparation delivery pipe mouth flange sleeve Aa-Al; each of the preparation submodules 10 is also individually or commonly provided with a drain pipe Vm and an exhaust pipe Vn, the lower end of the drain pipe Vm is connected to the drain pipe mouth flange sleeve Am, and the lower end of the exhaust pipe Vn is connected to the exhaust pipe mouth flange sleeve An; the preparation delivery pipe mouth flange sleeve Aa-Al, the drain pipe mouth flange sleeve Am, and the exhaust pipe mouth flange sleeve An are all provided with power equipment and guiding and fixing equipment for moving each pipe mouth flange sleeve, so that each pipe mouth flange sleeve can move parallel to the Y axis and be accurately guided, fixed, and connected with the subsequent pipe mouth flange sleeve to be connected.

[0012] The drain pipe Vm and the exhaust pipe Vn can be used to discharge the cleaning water or clean gas after the pilot preparation reaction.

[0013] Each of the preparation receiving submodules 20 includes a preparation receiving reaction tank Ra-Rm, a reaction auxiliary preparation pipeline, a temperature control water jacket 23, a stirring device 22, and several preparation receiving reaction tank pipe opening flange sleeves Ba1-Bm1, Ba2-Bm2; the preparation receiving reaction tank Ra-Rm is connected to the reaction auxiliary preparation pipeline; the temperature control water jacket 23 is provided on the outside of the preparation receiving reaction tank Ra-Rm for controlling the reaction temperature; the stirring device 22 is provided at the bottom of the preparation receiving reaction tank Ra-Rm for stirring and turbulent flow of the preparation; The top of the preparation receiving reaction tank Ra-Rm is provided with the preparation receiving reaction tank pipe mouth flange sleeves Ba1-Bm1 and Ba2-Bm2; the temperature control water jacket 23 is provided with a heating water inlet pipe and a water outlet pipe; the stirring device 22 is connected to the electrical cables; the preparation receiving reaction tanks Ra-Rm are provided with a power device and a guiding and fixing device that can move the preparation receiving reaction tank Ra-Rm, so that the preparation receiving reaction tank Ra-Rm can move parallel to the X-axis and be accurately guided, fixed and connected with the required preparation delivery pipe mouth flange sleeve Aa-Al.

[0014] It is clear to those skilled in the art that various sensors for monitoring the reaction status and the supply of the preparation may be provided as required in the present invention, and the signal cable may follow the movement of the preparation receiving reaction tank Ra-Rm parallel to the X-axis; in addition, corresponding control valves may be provided as required.

[0015] Each of the preparation receiving submodules 20 is also provided with a cleaning pipe Rn and a cleaning pipe orifice flange sleeve Bn individually or in common, and the cleaning pipe Rn and the cleaning pipe orifice flange sleeve Bn can also be moved or extended.

[0016] The auxiliary manufacturing equipment module C includes several auxiliary manufacturing sub-modules 30, the lower end of the auxiliary manufacturing sub-module 30 is connected to the auxiliary manufacturing sub-module pipeline, the auxiliary manufacturing sub-module pipeline is connected to the auxiliary pipeline pipe mouth flange sleeve Ca-Cd, and the auxiliary pipeline pipe mouth flange sleeve Ca-Cd can move parallel to the Y axis.

[0017] The auxiliary manufacturing submodule 30 may select a decompression device, a crystallization device or a distillation device, and may be appropriately selected and used according to the chemical and physical properties of the compound to be manufactured.

[0018] Those skilled in the art will appreciate that a motor and a lead screw can be used as a driving device and a guide and fixing device for each pipe orifice flange sleeve, which is a well-known technology in the art and will not be described in detail here.

[0019] During use, the pilot test can be carried out in one or several preparation receiving reaction tanks. For example, the required preparation delivery pipe mouth flange sleeve (Aa-Al) is moved to the designated interconnected position, and the preparation delivery pipe mouth flange sleeve (Aa-Al) is connected to the required preparation receiving reaction tank pipe mouth flange sleeve (Ba1-Bm1) through the driving device. At this time, the public power cable and wiring connected to the preparation receiving reaction tank are cut off; the preparation is discharged from the required preparation funnel (Va-Vl) through the pressurizing device equipped with each preparation, and the pressurization is stopped when the specified amount is delivered to the preparation receiving reaction tank.

[0020] For example, taking a preparation receiving reaction tank Rb as an example, the change in the weight of the preparation receiving reaction tank Rb can be used to determine whether the predetermined amount has been sent to the preparation receiving reaction tank Rb. Similar operations are performed on preparations b and c to transfer all reaction raw materials to the preparation receiving reaction tank Rb. After all the predetermined preparations are transferred to the preparation receiving reaction tank Rb, return to Figure 1 The starting position shown, with cables and wiring for the utility supply connected, followed by agitation and heating.

[0021] In the practical application of the present invention, a control program is designed based on a step control design method. The step control design method refers to dividing the action of the actuator within a production cycle into a number of simple "steps", and then designing the switching instructions for each "step". This instruction can be time, system status, or a switch signal, and then the execution method of the actuator for each "step" is designed. The PLC controller can use the SCR instruction to program the control system. The key to the SCR instruction (sequential control relay instruction) is "step" and "conversion". When the conditions for the conversion are not met, it will remain in the current step. "Conversion" is to enter another step from one step. There are two common step control flows: sequential control flow and distributed control flow. The present invention uses distributed control flow for control.

[0022] First, the real-time flow rate of each preparation of the present invention is expressed by a transfer function with a delayed first-order object:

[0023]

[0024] Among them G (s) is the transfer function; K is the amplification factor; T is the inertia time constant; τ is the delay time, which refers to the lag time of flow change after the valve opening changes; when the regulating valve opening changes, the pipeline flow area decreases, and the pipeline flow changes accordingly; because the amplification factor, inertia time constant and delay time are closely related to the system structure, working environment, etc., through multiple experiments, the step response of the opening and flow is obtained, and the transfer function parameters are obtained through the step response curve method. The specific operation process is as follows:

[0025] When the system starts to work as required, adjust the valve opening from 0% to 100%. After the flow rate stabilizes, adjust the valve opening to 60% at 20s, record the value of the pipeline flow rate every 0.5s, and after the flow rate stabilizes, adjust the valve opening to 20% at 30s, and record the flow rate change data. Finally, T = 2.74, K = 3.75, τ = 0.76 are obtained, and the empirical fitting formula of the transfer function of each preparation flow rate and valve opening is:

[0026]

[0027] Secondly, the reaction temperature in the present invention is also expressed by the above transfer function, and the temperature at constant temperature is measured with a step length of 20% of the maximum power each time. After many experiments, the empirical fitting formula of the transfer function of temperature and heating power is obtained as follows:

[0028] BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a schematic diagram of a multifunctional pilot manufacturing device for a circuit board of the present invention;

[0030] Figure 2 This is a physical picture of the control cabinet of the multifunctional pilot manufacturing device for circuit boards of the present invention;

[0031] Figure 3 It is a histogram of the global sensitivity coefficients when four parameters are selected in the multifunctional pilot manufacturing device for circuit boards of the present invention. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0033] In this application, each pipe flange sleeve refers to an interface sleeve that can be connected by bolts or threads or by bayonet or falcon connection; the guide stop means that it stops at the correct position after moving the guide; it should be noted that the various installation methods and technical terms mentioned in the present invention are technical terms that have long been clearly known in the relevant technical field, so no further explanation will be given. In addition, the same figure marks are used for the same parts, but this does not affect and should not constitute the accurate understanding of the technical solution by those skilled in the art.

[0034] like Figure 1As shown, the multifunctional pilot manufacturing device for circuit boards includes a first preparation group providing module A for manufacturing, wherein the first preparation group providing module includes a plurality of first preparation group sub-modules 10; a preparation receiving module B, which is used to receive each preparation provided by the first preparation group providing module A and transport and move the received preparation to a required location; the preparation receiving module B includes a plurality of preparation receiving sub-modules 20; an auxiliary manufacturing equipment module C; and a pipe nozzle flange sleeve and a pipe nozzle flange sleeve control device for connecting and disconnecting each module.

[0035] Each of the first preparation group submodules 10 includes a preparation funnel Va-Vl, a preparation delivery pipeline, and a preparation delivery pipe mouth flange sleeve Aa-Al. The lower end of the preparation funnel Va-Vl is connected to the preparation delivery pipeline, and the preparation delivery pipeline line segment is connected to the preparation delivery pipe mouth flange sleeve Aa-Al; each of the preparation submodules 10 is also individually or commonly provided with a drain pipe Vm and an exhaust pipe Vn, the lower end of the drain pipe Vm is connected to the drain pipe mouth flange sleeve Am, and the lower end of the exhaust pipe Vn is connected to the exhaust pipe mouth flange sleeve An; the preparation delivery pipe mouth flange sleeve Aa-Al, the drain pipe mouth flange sleeve Am, and the exhaust pipe mouth flange sleeve An are all provided with power equipment and guiding and fixing equipment for moving each pipe mouth flange sleeve, so that each pipe mouth flange sleeve can move parallel to the Y axis and be accurately guided, fixed, and connected with the subsequent pipe mouth flange sleeve to be connected.

[0036] The drain pipe Vm and the exhaust pipe Vn can be used to discharge the cleaning water or clean gas after the pilot preparation reaction.

[0037] Each of the preparation receiving submodules 20 includes a preparation receiving reaction tank Ra-Rm, a reaction auxiliary preparation pipeline, a temperature control water jacket 23, a stirring device 22, and several preparation receiving reaction tank pipe opening flange sleeves Ba1-Bm1, Ba2-Bm2; the preparation receiving reaction tank Ra-Rm is connected to the reaction auxiliary preparation pipeline; the temperature control water jacket 23 is provided on the outside of the preparation receiving reaction tank Ra-Rm for controlling the reaction temperature; the stirring device 22 is provided at the bottom of the preparation receiving reaction tank Ra-Rm for stirring and turbulent flow of the preparation; The top of the preparation receiving reaction tank Ra-Rm is provided with the preparation receiving reaction tank pipe mouth flange sleeves Ba1-Bm1 and Ba2-Bm2; the temperature control water jacket 23 is provided with a heating water inlet pipe and a water outlet pipe; the stirring device 22 is connected to the electrical cables; the preparation receiving reaction tanks Ra-Rm are provided with a power device and a guiding and fixing device that can move the preparation receiving reaction tank Ra-Rm, so that the preparation receiving reaction tank Ra-Rm can move parallel to the X-axis and be accurately guided, fixed and connected with the required preparation delivery pipe mouth flange sleeve Aa-Al.

[0038] It is clear to those skilled in the art that various sensors for monitoring the reaction status and the supply of the preparation may be provided as required in the present invention, and the signal cable may follow the movement of the preparation receiving reaction tank Ra-Rm parallel to the X-axis; in addition, an influencing control valve may be provided as required.

[0039] Each of the preparation receiving submodules 20 is also provided with a cleaning pipe Rn and a cleaning pipe orifice flange sleeve Bn individually or in common, and the cleaning pipe Rn and the cleaning pipe orifice flange sleeve Bn can also be moved or extended.

[0040] The auxiliary manufacturing equipment module C includes several auxiliary manufacturing sub-modules 30, the lower end of the auxiliary manufacturing sub-module 30 is connected to the auxiliary manufacturing sub-module pipeline, the auxiliary manufacturing sub-module pipeline is connected to the auxiliary pipeline pipe mouth flange sleeve Ca-Cd, and the auxiliary pipeline pipe mouth flange sleeve Ca-Cd can move parallel to the Y axis.

[0041] The auxiliary manufacturing submodule 30 may select a decompression device, a crystallization device or a distillation device, and may be appropriately selected and used according to the chemical and physical properties of the compound to be manufactured.

[0042] It is clear to those skilled in the art that a motor and a screw can be used as a driving device and a guide and fixing device for each pipe orifice flange sleeve, which is a well-known technology in the art and will not be described in detail here.

[0043] During use, for example, in the preparation receiving reaction tank Rb, preparations a, b and c are used for pilot testing. When the reaction is completed, they are transferred to the preparation receiving reaction tank in sequence while stirring, and the reaction is completed at a predetermined temperature. The required preparation delivery pipe mouth flange sleeve Aa-Al is moved to a designated interconnected position, and the preparation delivery pipe mouth flange sleeve Aa-Al is connected to the required preparation receiving reaction tank pipe mouth flange sleeve Ba1-Bm1 by a driving device. At this time, the public power cable and wiring connected to the preparation receiving reaction tank Rb are cut off. The preparation is discharged from the required preparation funnel Va-Vl by the pressurizing device possessed by each preparation, and the pressurization is stopped when the specified amount is delivered to the preparation receiving reaction tank Rb. Whether the predetermined amount has been sent to the preparation receiving reaction tank Rb can be judged by the change in the weight of the preparation receiving reaction tank Rb. Similar operations are performed on preparations b and c to transfer all reaction raw materials to the preparation receiving reaction tank Rb. After all the predetermined preparations are transferred to the preparation receiving reaction tank Rb, return to Figure 1 The starting position shown, with cables and wiring for the utility supply connected, followed by agitation and heating.

[0044] The present invention eliminates the complex state of pipelines and joints caused by traditional valve switching operations. Since the material transfer between devices can be carried out by switching the corresponding pipe flange sleeves, the control is simplified. A new control method is adopted, especially the intelligent control switching is very easy, which greatly improves the convenience and intelligence of the pilot equipment.

[0045] Figure 2 This is a physical picture of the control cabinet of the multifunctional pilot manufacturing device for circuit boards of the present invention. In the practical application of the present invention, the control program is designed based on the step control design method. The step control design method refers to dividing the action of the actuator within a production cycle into a number of simple "steps", and then designing the switching instruction for each "step". This instruction can be time, system status, or a switch signal, and then the execution method of the actuator for each "step" is designed. The PLC controller can use the SCR instruction to program the control system. The key to the SCR instruction (sequential control relay instruction) is "step" and "conversion". When the conditions for the conversion are not met, it will remain in the current step. "Conversion" is to enter another step from one step. There are two common step control flows: sequential control flow and distributed control flow. The present invention uses distributed control flow for control.

[0046] First, the real-time flow rate of each preparation of the present invention is expressed by a transfer function with a delayed first-order object:

[0047]

[0048] Among them G (s) is the transfer function; K is the amplification factor; T is the inertia time constant; τ is the delay time, which refers to the lag time of flow change after the valve opening changes; when the regulating valve opening changes, the pipeline flow area decreases, and the pipeline flow changes accordingly; because the amplification factor, inertia time constant and delay time are closely related to the system structure, working environment, etc., through multiple experiments, the step response of the opening and flow is obtained, and the transfer function parameters are obtained through the step response curve method. The specific operation process is as follows:

[0049] When the system starts to work as required, adjust the valve opening from 0% to 100%. After the flow rate stabilizes, adjust the valve opening to 60% at 20s, record the value of the pipeline flow rate every 0.5s, and after the flow rate stabilizes, adjust the valve opening to 20% at 30s, and record the flow rate change data. Finally, T = 2.74, K = 3.75, τ = 0.76 are obtained, and the empirical fitting formula of the transfer function of each preparation flow rate and valve opening is:

[0050]

[0051] Secondly, the reaction temperature in the present invention is also expressed by the above transfer function, and the temperature at constant temperature is measured with a step length of 20% of the maximum power each time. After many experiments, the empirical fitting formula of the transfer function of temperature and heating power is obtained as follows:

[0052]

[0053] In order to ensure the control accuracy, the present invention adopts the Sobol index method to analyze the input matrix and the output matrix, and the first-order global sensitivity coefficient and the overall global sensitivity coefficient of each operating parameter can be obtained, wherein the first-order global sensitivity coefficient is the specific embodiment of the influence of the change of a single coefficient on the overall system, and the overall global sensitivity coefficient not only reflects the influence caused by the change of a single parameter, but also reflects the influence of the change of this parameter and other parameters. In the result, if the difference between the first-order sensitivity and the overall sensitivity of a parameter is large, it indicates that there is a certain interaction between this parameter and other parameters. The Sobol index method model is adopted in the present invention, and its model assumption is:

[0054] y=f(x)=f(x1,x2,…,x p );

[0055] x=x1,x2,…,x P As input parameter, the variance A(y) of the decomposition objective function y is:

[0056]

[0057] Among them A i Represents the variance generated by each parameter; A ij A represents the variance generated when two parameters interact with each other; ijk represents the variance generated by the interaction of the three parameters i, j, and k; and so on, then A 1,2,…,p represents the variance caused by the interaction of p parameters.

[0058] The sensitivity of each parameter i can be expressed as:

[0059]

[0060] Among them, S i It represents the sensitivity of a single parameter i when other parameters are not considered, which can be called the main effect index of parameter i; S ij It represents the sensitivity when two parameters i and j interact with each other; S Ti It represents the influence of parameter i and the interaction between parameter i and other parameters on the output of the objective function, which is called the total effect index of parameter i; A ～irepresents the individual variance and interaction variance of the parameters other than parameter i.

[0061] In the present invention, x1, x2, x3, and x4 represent flow rate, operation time, control temperature, and preparation concentration, respectively, and y represents cleaning rate. The histogram of the global sensitivity coefficient is as follows: Figure 3 As shown. Figure 3 It can be seen that the first-order global sensitivity coefficients of flow rate (x1) and running time (x2) are relatively high, and when they change, they will have a certain impact on the cleaning efficiency.

[0062] By adopting the control method of the present invention, accurate control of the flow rate and temperature of the preparation is achieved during the pilot manufacturing process of the circuit board, and a good pilot cleaning effect is obtained.

[0063] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the invention may be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

[0064] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any slight modification, equivalent substitution and improvement made to the above embodiment based on the technical essence of the present invention should be included in the protection scope of the technical solution of the present invention.

Claims

1. A multifunctional pilot manufacturing device for circuit boards, used for pilot manufacturing of circuit board cleaning solutions, comprising a first formulation group providing module for manufacturing circuit board cleaning solutions, wherein the first formulation group providing module comprises a plurality of first formulation group sub-modules; a formulation receiving module, used for receiving each formulation provided by the first formulation group providing module, and transferring and moving the received formulation to a desired position; the formulation receiving module comprises a plurality of formulation receiving sub-modules; an auxiliary manufacturing equipment module; and a pipe nozzle flange sleeve and a pipe nozzle flange sleeve control device for connecting and disconnecting each module.

2. A multifunctional pilot manufacturing device for a circuit board as claimed in claim 1, characterized in that: Each of the first preparation group submodules includes a preparation funnel, a preparation delivery pipeline, and a preparation delivery pipe mouth flange sleeve, the lower end of the preparation funnel is connected to the preparation delivery pipeline, and the preparation delivery pipeline line segment is connected to the preparation delivery pipe mouth flange sleeve; each of the preparation submodules is also individually or commonly provided with a drain pipe and an exhaust pipe, the lower end of the drain pipe is connected to the drain pipe mouth flange sleeve, and the lower end of the exhaust pipe is connected to the exhaust pipe mouth flange sleeve; the preparation delivery pipe mouth flange sleeve, the drain pipe mouth flange sleeve, and the exhaust pipe mouth flange sleeve are all provided with power equipment and guiding and fixing equipment for moving each pipe mouth flange sleeve, so that each pipe mouth flange sleeve can move parallel to the X-axis or Y-axis and accurately guide and fix it with the subsequent pipe mouth flange sleeve to be connected and connect it.

3. A multifunctional pilot manufacturing device for circuit boards as claimed in claim 2, characterized in that: The liquid drain pipe and the exhaust pipe are respectively used to discharge the cleaning water and the clean gas after the pilot preparation reaction.

4. A multifunctional pilot manufacturing device for a circuit board as claimed in any one of claims 1 to 3, characterized in that: Each of the preparation receiving submodules includes a preparation receiving reaction tank, a reaction auxiliary preparation pipeline, a temperature control water jacket, a stirring device, and several preparation receiving reaction tank pipe mouth flange sleeves; the preparation receiving reaction tank is connected to the reaction auxiliary preparation pipeline; the temperature control water jacket is provided on the outside of the preparation receiving reaction tank to control the reaction temperature, the stirring device is provided at the bottom of the preparation receiving reaction tank to stir and turbulent the preparation, and the preparation receiving reaction tank pipe mouth flange sleeve is provided on the top of the preparation receiving reaction tank; the temperature control water jacket is provided with a heated water inlet pipe and a water outlet pipe; the stirring device is connected to electrical cables; the preparation receiving reaction tanks are all provided with power equipment and guiding and fixing equipment that can move the preparation receiving reaction tank, so that the preparation receiving reaction tank can move parallel to the X-axis and be accurately guided, fixed and connected to the required preparation delivery pipe mouth flange sleeve.

5. A multifunctional pilot manufacturing device for a circuit board as claimed in claim 4, characterized in that: Each of the preparation receiving submodules is also provided with a cleaning pipeline and a flange sleeve at the pipe mouth of the cleaning pipeline individually or in common, and the cleaning pipeline and the flange sleeve at the pipe mouth of the cleaning pipeline can also be moved or extended.

6. A multifunctional pilot manufacturing device for a circuit board as claimed in claim 5, characterized in that: The auxiliary manufacturing equipment module includes several auxiliary manufacturing sub-modules, the lower ends of the auxiliary manufacturing sub-modules are connected to the auxiliary manufacturing sub-module pipelines, the auxiliary manufacturing sub-module pipelines are connected to the auxiliary pipeline pipe orifice flange sleeves, and the auxiliary pipeline pipe orifice flange sleeves can move parallel to the Y-axis.

7. A pilot manufacturing method using the multifunctional pilot manufacturing device for a circuit board as claimed in any one of claims 1 to 6, characterized in that: During use, pilot testing is carried out in one or several preparation receiving reaction tanks.

8. The pilot production method according to claim 7, characterized in that: Move the required preparation delivery pipe mouth flange sleeve (Aa-Al) to the designated interconnected position, connect the preparation delivery pipe mouth flange sleeve (Aa-Al) with the required preparation receiving reaction tank pipe mouth flange sleeve (Ba1-Bm1) through the driving device, at this time, the public power cable and wiring connected to the preparation receiving reaction tank are cut off; discharge the preparation from the required preparation funnel (Va-Vl) through the pressurizing device equipped with each preparation, and stop pressurizing when the specified amount is delivered to the preparation receiving reaction tank.

9. A pilot production method using the method as claimed in claim 8, characterized in that: The distributed control flow is used for control; it includes the following steps: The real-time flow rate of each agent is expressed by a transfer function with a delayed first-order object: Among them G (s) is the transfer function; K is the amplification factor; T is the inertia time constant; τ is the delay time, which refers to the lag time of flow change after the valve opening changes.

10. A pilot production method using the method according to claim 9, characterized in that: The reaction temperature is expressed using the above transfer function.

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