Semiconductor cutting and forming equipment
By using straight conveyor lines and specialized punching and bending devices in semiconductor processing equipment, combined with image recognition modules, the problem of semiconductor position offset is solved, and high-precision and high-efficiency semiconductor processing is achieved.
Patent Information
- Application Number
- CN202510145460.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-10
- Publication Date
- 2025-09-30
- Estimated Expiration
- 2045-02-10
AI Technical Summary
In traditional semiconductor processing, semiconductors are prone to positional displacement after being cut off from the processing board, resulting in a loss of processing continuity, low production efficiency and inaccurate dimensional accuracy, affecting product quality.
It adopts a straight conveyor line design, with a processing window on the processing plate. The semiconductors are neatly arranged along the conveying direction. High-precision punching and bending are achieved through the first punching device and the punching and bending device. The receiving device collects the finished products to avoid position deviation and repositioning. The image recognition module and the material picking module are combined to improve the processing accuracy and efficiency.
It achieves high precision and high efficiency in semiconductor processing, ensures the dimensional accuracy of punching and bending processes, reduces the number of equipment operations, shortens processing time, and improves the continuity of the production process and product quality.
Smart Images
Figure CN119870282B_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of semiconductor processing technology, and in particular to a semiconductor cutting and forming device. Background Art
[0002] In the semiconductor manufacturing sector, with the rapid development of miniaturization and higher performance in electronic products, the production efficiency and precision requirements for semiconductor devices are becoming increasingly stringent. Traditional processes typically utilize a simple matrix layout for semiconductor placement on processing boards. These seemingly neatly arranged semiconductors lack effective guidance and positioning structures. During processing, especially after the connection between the semiconductor and the processing board is severed, the semiconductors are prone to positional shifts. This not only disrupts processing continuity, hindering subsequent process connections and significantly reducing production efficiency, but also leads to uncontrolled dimensional accuracy in subsequent punching and bending operations due to positional uncertainty, thus affecting product quality. Summary of the Invention
[0003] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application proposes a semiconductor cutting and forming device that can improve the processing accuracy and processing efficiency of the product.
[0004] The present application provides a semiconductor cutting and forming device, comprising:
[0005] A linear conveyor line, wherein a plurality of processing plates are placed on the linear conveyor line, the processing plates include a plurality of processing windows, the length direction of the processing windows is consistent with the conveying direction of the linear conveyor line, and a plurality of semiconductors are arranged along the conveying direction of the linear conveyor line in the processing windows; the semiconductors include injection-molded shells and lead frames, the lead frames extend from both sides of the injection-molded shells and are connected to both side edges of the processing windows, the injection-molded shells of adjacent semiconductors are connected by a first connector, and the injection-molded shells of the semiconductors near the ends of the processing windows are connected to the end edges of the processing windows by the first connector;
[0006] a first punching device, the first punching device being arranged beside the linear conveyor line and being used for sequentially cutting off all the first connectors and the connection between the lead frame and the processing window on one side of the injection-molded housing;
[0007] a punching and bending device, the punching and bending device being arranged beside the linear conveyor line and being located behind the first punching device along the conveying direction of the linear conveyor line, and being used for sequentially cutting off the connection between the lead frame on the other side of the injection-molded housing and the processing window, and bending the lead frames on both sides of the injection-molded housing;
[0008] The material receiving device is arranged at the rear end of the punching and bending device along the conveying direction of the straight conveyor line, and is used to receive the semiconductor that has completed cutting and forming.
[0009] According to the semiconductor rib forming equipment of the embodiment of the present application, there are at least the following beneficial effects: in the present application, the unique processing window design on the processing plate becomes the key layout basis of the entire process, the length direction of the processing window is consistent with the conveying direction of the linear conveyor line, and the semiconductors are neatly arranged in the window along this direction, the semiconductors include an injection molded shell and a lead frame, the lead frame extends from both sides of the injection molded shell and is connected to the two side edges of the processing window, the injection molded shells of adjacent semiconductors are connected by a first connector, and the injection molded shell of the semiconductor near the end of the processing window is connected to the end edge of the processing window by the first connector. During production, the linear conveyor line is started and the tray with several processing plates placed thereon is smoothly conveyed forward. When the processing plate moves to the bottom of the first punching device, the first punching device sequentially cuts off all the first connectors and the connection between the lead frame on one side of the injection molded shell and the processing window. Since the semiconductor is confined within the processing window, there will be no positional offset during the punching process, ensuring a high-precision punching effect. Next, the processing plate continues to move along the straight conveyor line and arrives at the punching and bending device. The punching and bending device first cuts off the connection between the lead frame on the other side of the injection molded shell and the processing window. At this time, although the semiconductor no longer has a direct connection with the processing plate, because the semiconductor is still in the processing window, the end of the processing window pushes the semiconductor inside to move, ensuring that the semiconductor can move in an orderly manner along the processing window and ensure that it enters the bending process smoothly. The punching and bending device then bends the lead frames on both sides of the injection molded shell. The precise positioning of the processing window on the semiconductor greatly guarantees the dimensional accuracy of the punching, bending and other processes. At the same time, due to the function of the processing window, there is no need to reposition during punching and bending, which improves the processing efficiency of the product. Finally, the semiconductor that has completed the cutting and forming is moved to the receiving device position along with the processing plate. The finished semiconductor will naturally fall into the receiving device, thus completing the entire production process. In addition, the present application also adopts a straight conveyor line method to avoid processing pauses and position adjustments caused by turning and transferring, greatly shortening the processing time of each semiconductor and improving the overall processing efficiency.
[0010] According to some embodiments of the present application, the linear conveyor line includes two linear guide rails and several transmission wheels, the spacing between the two linear guide rails is smaller than the width of the processing plate, and the several transmission wheels are spaced apart on one of the linear guide rails, and the spacing between two adjacent transmission wheels is smaller than the length of the processing plate.
[0011] According to some embodiments of the present application, the first punching device includes a first punching die head, and the bottom of the first punching die head is provided with at least a first cutting head and a second cutting head in sequence along the conveying direction of the straight conveyor line. The first cutting head is used to cut off all the first connecting parts, and the second cutting head is used to cut off the connection between the lead frame and the processing window on one side of the injection-molded shell.
[0012] According to some embodiments of the present application, the punching and bending device includes a punching and bending die and a base plate, the base plate is located below the two linear guide rails, and the punching and bending die is located above the base plate. The punching and bending die is used to sequentially cut off the connection between the lead frame on the other side of the injection-molded shell and the processing window, and to bend the lead frames on both sides of the injection-molded shell. The base plate is used to support the semiconductor that falls from the processing plate, and the upper surface of the fallen semiconductor is higher than the position of the processing window, so that as the linear conveyor line is driven, the end of the processing window can push the semiconductor to move.
[0013] According to some embodiments of the present application, a third cutting head and several bending heads are provided in sequence at the bottom of the punching and bending die head along the conveying direction of the straight conveyor line, the third cutting head is used to cut off the connection between the lead frame on the other side of the injection-molded shell and the processing window, and the several bending heads are used to bend the lead frames on both sides of the injection-molded shell to different degrees, and the bottom plate is provided with avoidance grooves at the cutting position of the third cutting head and the bending position of the bending head.
[0014] According to some embodiments of the present application, before punching, the distance between the punching and bending die head and the base plate is a first spacing, the first spacing is greater than the height of the semiconductor before bending, and the first spacing is less than twice the height of the semiconductor before bending.
[0015] According to some embodiments of the present application, the material receiving device is arranged at the rear end of the base plate along the conveying direction of the straight conveyor line, and is used to receive the bent semiconductors that fall from the base plate.
[0016] According to some embodiments of the present application, a first image recognition module and a first material picking module are also included. The length of the base plate is greater than the length of the punching and bending die head. The first image recognition module and the first material picking module are arranged on the rear side of the punching and bending die head along the conveying direction of the straight conveyor line, and are located above the base plate; the first image recognition module is used to collect the first image information of the semiconductor transmitted from the punching and bending die head, and the first material picking module is used to remove the semiconductor that does not meet the standards transmitted from the punching and bending die head according to the first image information.
[0017] According to some embodiments of the present application, a loading device is further included, which is arranged on the side of the straight conveyor line and is located in front of the first punching device along the conveying direction of the straight conveyor line, and is used to transfer the processed boards that have completed lead welding and plastic sealing to the straight conveyor line.
[0018] According to some embodiments of the present application, the loading device includes a second image recognition module and a second material picking module, the second material picking module is used to grab the processing board that has completed lead welding and plastic sealing, the second image recognition module is used to collect second image information of the processing board grabbed by the second material picking module, and the second material picking module is also used to guide the grabbed processing board according to the second image information and transfer it to the straight conveyor line.
[0019] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become obvious from the description below, or will be learned through practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] Additional aspects and advantages of the present application will become apparent and readily understood from the following description of the embodiments with reference to the accompanying drawings, in which:
[0021] Figure 1 A front view of a semiconductor cutting and forming device provided in one embodiment of the present application;
[0022] Figure 2 A top view of a semiconductor cutting and forming device provided in one embodiment of the present application;
[0023] Figure 3 A schematic diagram of a processed plate before punching provided in one embodiment of the present application;
[0024] Figure 4 A schematic diagram of a processing plate in the process of moving after punching provided by one embodiment of the present application;
[0025] Figure 5 A simplified structural diagram of a semiconductor cutting and forming device provided in one embodiment of the present application;
[0026] Figure 6 This is a schematic front structural diagram of a punching and bending device provided in one embodiment of the present application.
[0027] The accompanying figures are as follows:
[0028] Straight conveyor line 100; linear guide rail 110; transmission wheel 120; first punching device 200; first punching die 210; punching and bending device 300; base plate 310; punching and bending die 320; material receiving device 400; first image recognition module 510; first material picking module 520; loading device 600; processing plate 700; processing window 710; injection molded shell 721; lead frame 722; first connecting part 723. DETAILED DESCRIPTION
[0029] The following describes in detail embodiments of the present application. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application and are not to be construed as limiting the present application.
[0030] In the description of this application, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on this application.
[0031] In the description of this application, if there is a description of first or second, it is only for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.
[0032] In the description of this application, unless otherwise clearly defined, terms such as setting, installing, and connecting should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in this application based on the specific content of the technical solution.
[0033] In the semiconductor manufacturing sector, with the rapid development of miniaturization and higher performance in electronic products, the production efficiency and precision requirements for semiconductor devices are becoming increasingly stringent. Traditional processes typically utilize a simple matrix layout for semiconductor placement on processing boards. These seemingly neatly arranged semiconductors lack effective guidance and positioning structures. During processing, especially after the connection between the semiconductor and the processing board is severed, the semiconductors are prone to positional shifts. This not only disrupts processing continuity, hindering subsequent process connections and significantly reducing production efficiency, but also leads to uncontrolled dimensional accuracy in subsequent punching and bending operations due to positional uncertainty, thus affecting product quality.
[0034] Reference Figures 1 to 5The present application provides a semiconductor cutting and forming device, comprising: a straight conveyor line 100, a first punching device 200, a punching and bending device 300 and a material receiving device 400, a plurality of processing plates 700 are placed on the straight conveyor line 100, the processing plates 700 include a plurality of processing windows 710, the length direction of the processing windows 710 is consistent with the conveying direction of the straight conveyor line 100, and a plurality of semiconductors arranged along the conveying direction of the straight conveyor line 100 are arranged in the processing windows 710; the semiconductor includes an injection molded shell 721 and a lead frame 722, the lead frame 722 extends from both sides of the injection molded shell 721 and is connected to the two side edges of the processing window 710, the injection molded shells 721 of adjacent semiconductors are connected by a first connecting member 723, and the injection molded shell of the semiconductor near the end of the processing window 710 is connected to the first connecting member 723. 721 is connected to the end edge of the processing window 710 through the first connecting piece 723; the first punching device 200 is arranged on the side of the straight conveyor line 100, and is used to cut off all the first connecting pieces 723 in sequence, and the connection between the lead frame 722 on one side of the injection molding shell 721 and the processing window 710; the punching and bending device 300 is arranged on the side of the straight conveyor line 100, and is located on the rear side of the first punching device 200 along the conveying direction of the straight conveyor line 100, and is used to cut off the connection between the lead frame 722 on the other side of the injection molding shell 721 and the processing window 710 in sequence, and bend the lead frames 722 on both sides of the injection molding shell 721; the receiving device 400 is arranged at the rear end of the punching and bending device 300 along the conveying direction of the straight conveyor line 100, and is used to receive the semiconductors that have completed the cutting and forming.
[0035] In this application, the unique processing window 710 design on the processing plate 700 becomes the key layout basis of the entire process. The length direction of the processing window 710 is consistent with the conveying direction of the straight conveyor line 100, and the semiconductors are neatly arranged in the window along this direction. The semiconductor includes an injection-molded shell 721 and a lead frame 722. The lead frame 722 extends from both sides of the injection-molded shell 721 and is connected to the two side edges of the processing window 710. The injection-molded shells 721 of adjacent semiconductors are connected by a first connecting member 723. The injection-molded shell 721 of the semiconductor near the end of the processing window 710 is connected to the end edge of the processing window 710 through the first connecting member 723. During production, the linear conveyor line 100 is activated, steadily conveying a tray containing several processing boards 700 forward. As the processing boards 700 move below the first punching device 200, the first punching device 200 sequentially cuts off all first connectors 723 and the connection between the lead frame 722 on one side of the injection molded housing 721 and the processing window 710. Because the semiconductor is confined within the processing window 710, positional offset does not occur during the punching process, ensuring high-precision punching. Subsequently, the processing boards 700 continue to advance along the linear conveyor line 100 until they reach the punching and bending device 300. The punching and bending device 300 first cuts off the connection between the lead frame 722 on the other side of the injection molded housing 721 and the processing window 710. Although the semiconductor no longer has a direct connection with the processing board 700, it remains within the processing window 710, and the end of the processing window 710 pushes the semiconductor inside, ensuring that the semiconductor moves in an orderly manner along the processing window 710, ensuring that it enters the bending process smoothly. Then, the punching and bending device 300 bends the lead frame 722 on both sides of the injection molded shell 721. The precise positioning of the semiconductor by the processing window 710 greatly guarantees the dimensional accuracy of the punching, bending and other processes. At the same time, due to the function of the processing window 710, there is no need to reposition during punching and bending, which improves the processing efficiency of the product. Finally, the semiconductor that has completed the cutting and forming is moved to the position of the material receiving device 400 along with the processing plate 700, and the finished semiconductor will naturally fall into the material receiving device 400, thereby completing the entire production process. In addition, the present application also adopts the method of a straight conveyor line 100, which avoids processing pauses and position adjustments caused by turning and transferring, greatly shortens the processing time of each semiconductor, and improves the overall processing efficiency.
[0036] Reference Figure 1 and Figure 2It is understood that the linear conveyor line 100 includes two linear guide rails 110 and a plurality of transmission wheels 120. The spacing between the two linear guide rails 110 is less than the width of the processing plate 700. The plurality of transmission wheels 120 are spaced apart on one of the linear guide rails 110, and the spacing between two adjacent transmission wheels 120 is less than the length of the processing plate 700. The spacing between the two linear guide rails 110 is less than the width of the processing plate 700, so that the processing plate 700 can be placed stably on the linear guide rails 110. Furthermore, transmission wheels 120 are spaced apart on one side of the linear guide rail 110, and the spacing between two adjacent transmission wheels 120 is less than the length of the processing plate 700. This ensures that at all times, at least one transmission wheel 120 is in contact with the processing plate 700 and provides power, ensuring that the processing plate 700 receives continuous and stable power without power interruption. Furthermore, the transmission wheels 120 act on top of the processing plate 700, thereby providing a pressure to the processing plate 700. It should be noted that the distance between the two linear guide rails 110 is adjustable, and the position of each transmission wheel 120 on the linear guide rail 110 is also adjustable, so as to adapt to processing plates 700 of different sizes.
[0037] Reference Figure 5 It can be understood that the first punching device 200 includes a first punching die head 210. The bottom of the first punching die head 210 is provided with at least a first cutting head and a second cutting head in sequence along the conveying direction of the linear conveyor line. The first cutting head is used to cut off all first connectors 723, and the second cutting head is used to cut off the connection between the lead frame 722 on one side of the injection-molded housing 721 and the processing window 710. The first cutting head and the second cutting head provided at the bottom of the first punching die head 210 are arranged in sequence according to the conveying direction. First, the first cutting head cuts off all first connectors 723 to separate the injection-molded housings 721 of adjacent semiconductors. Then, the second cutting head immediately cuts off the connection between the lead frame 722 on one side of the injection-molded housing 721 and the processing window 710. This integrated design reduces the number of equipment movements and processing time during the processing, thereby improving production efficiency. In addition, although there is a hollow area between the two linear guide rails 110, the punching range of the first punching device 200 is the connection between all the first connecting parts 723 and the lead frame 722 on one side of the injection-molded shell 721 and the processing window 710, and the lead frame 722 on the other side of the semiconductor still remains connected to the processing window 710. Therefore, the semiconductor will not fall from the hollow part between the two linear guide rails 110 after the processing plate 700 passes through the first punching device 200.
[0038] Reference Figure 5It can be understood that the punching and bending device 300 includes a punching and bending die 320 and a base plate 310. The base plate 310 is located below the two linear guide rails 110, and the punching and bending die 320 is located above the base plate 310. The punching and bending die 320 is used to sequentially cut the connection between the lead frame 722 on the other side of the injection molded shell 721 and the processing window 710, and bend the lead frames 722 on both sides of the injection molded shell 721. The base plate 310 is used to support the semiconductor that falls from the processing plate 700, and the upper surface of the fallen semiconductor is higher than the position of the processing window 710, so that as the linear conveyor line 100 is driven, the end of the processing window 710 can push the semiconductor to move. The punching and bending die 320 can sequentially complete the operations of cutting the connection between the lead frame 722 on the other side of the injection molded shell 721 and the processing window 710 and bending the lead frame 722 in the same device, reducing the number of equipment and the conversion time between processing steps, and greatly improving production efficiency. At the same time, the base plate 310 is located below the two linear guide rails 110. When the punching and bending device 300 is in operation, the semiconductor will fall onto the base plate 310 after the last connection with the processing plate 700 is severed. The presence of the base plate 310 prevents the semiconductor from falling directly onto the ground or other equipment components, which may cause damage, and also facilitates the subsequent bending process. In addition, the upper surface of the fallen semiconductor is higher than the position of the processing window 710, so that the semiconductor can maintain contact with the end of the processing window 710 on the base plate 310. When the linear conveyor line 100 continues to transmit, the end of the processing window 710 can push the semiconductor to move. Through the support of the base plate 310 and the push of the end of the processing window 710, the subsequent bending process continues in an orderly manner, ensuring the continuity of the processing flow and the stability of the semiconductor position.
[0039] Reference Figures 3 to 5It is understood that the bottom of the punching and bending die 320 is sequentially provided with a third cutting head and several bending heads along the conveying direction of the linear conveyor line 100. The third cutting head is used to cut the connection between the lead frame 722 on the other side of the injection molded housing 721 and the processing window 710. The several bending heads are used to bend the lead frames 722 on both sides of the injection molded housing 721 to varying degrees. The bottom plate 310 is provided with avoidance grooves at the cutting position of the third cutting head and the bending position of the bending heads. The bottom plate 310 is provided with avoidance grooves at the cutting position of the third cutting head and the bending position of the bending heads to avoid interference between the punching and bending die 320 and the bottom plate 310. Among them, there are multiple bending heads, each bending head is used to bend the lead frame 722 on both sides of the injection molded shell 721 to different degrees. For example, if you want to achieve a precise 180-degree bend of the lead frame 722, the first bending head is installed at the front end of the punching and bending die 320 close to the third cutting head. When the semiconductor is pushed under the punching and bending device 300 and the third cutting head completes the cutting of the connection between the lead frame 722 on the other side of the injection molded shell 721 and the processing window 710, the first bending head bends the lead frame 722 from the initial horizontal state to 40 degrees. After the first bending head completes the action, the second bending head further bends the lead frame 722 that has been bent 40 degrees to 90 degrees. At this time, the lead frame 722 presents a right angle state. Subsequently, the third bending head bends the lead frame 722, which is at 90 degrees, another 45 degrees, bringing it to 135 degrees. Finally, the fourth bending head, as the finishing step, precisely bends the 135-degree lead frame 722 to 180 degrees, completing the molding of the entire lead frame 722. Throughout the entire process, the four bending heads work closely together, gradually and methodically bending the lead frame 722 to the ideal 180-degree angle based on the semiconductor conveying speed, the precise positioning of the processing window 710, and the preset bending program, achieving an efficient and high-precision processing process.
[0040] Reference Figure 6It is understood that before punching, the distance between the punching and bending die 320 and the base plate 310 is a first spacing, which is greater than the height of the semiconductor before bending and less than twice the height of the semiconductor before bending. Since the processing plate 700 needs to pass between the punching and bending die 320 and the base plate 310, setting the first spacing greater than the height of the semiconductor before bending reserves sufficient space for the movement of the processing plate 700, allowing it to move unimpeded along the straight conveyor line 100, avoiding scratches or collisions between the processing plate 700 and the punching and bending die 320 or the base plate 310, thereby ensuring the continuity of the entire processing process. At the same time, when passing through the punching and bending die 320, the connection between the lead frame 722 on the other side of the injection molded shell 721 and the processing window 710 will be cut off first. After the cutting is completed, there is no direct connection between the semiconductor and the processing plate 700, that is, the semiconductor is mainly supported by the base plate 310, and the movement of the semiconductor requires the processing window 710 on the processing plate 700 to push it to move. During the pushing process of the processing window 710, some semiconductors may be stacked together. Therefore, the first spacing between the punching and bending die 320 and the base plate 310 is less than twice the height of the semiconductor before bending. When the processing window 710 pushes the semiconductor, the semiconductor will not get out of control due to too loose space, thereby effectively preventing the stacking of semiconductors, ensuring that each semiconductor can enter the subsequent bending process in an orderly state under the guidance of the processing window 710, maintaining the efficiency and accuracy of the processing process.
[0041] Reference Figure 1 and Figure 5 As can be understood, the receiving device 400 is located at the rear end of the base plate 310 along the conveying direction of the linear conveyor line 100 and is used to receive bent semiconductors that fall from the base plate 310. After being bent in the punching and bending device 300, the semiconductors fall directly into the receiving device 400, eliminating manual handling or additional transfer steps, greatly improving production efficiency, and ensuring continuous and smooth production.
[0042] Reference Figure 5It can be understood that the semiconductor cutting and forming equipment provided by the present application also includes a first image recognition module 510 and a first material picking module 520. The length of the base plate 310 is greater than the length of the punching and bending die 320. The first image recognition module 510 and the first material picking module 520 are arranged on the rear side of the punching and bending die along the conveying direction of the straight conveyor line 100, and are located above the base plate 310; the first image recognition module 510 is used to collect the first image information of the semiconductor transmitted from the punching and bending die, and the first material picking module 520 is used to remove the semiconductors that do not meet the standards transmitted from the punching and bending die according to the first image information. The first image recognition module 510 can collect the first image information of the semiconductor transmitted from the punching and bending die head, and determine whether the punching of the semiconductor in the previous process is qualified and whether the bending is in place by performing image recognition on the first image information. The first material picking module 520 can accurately remove substandard semiconductors from the final product flow based on the information provided by the first image recognition module 510, thereby preventing defective products from mixing into qualified products and ensuring the quality stability of the delivered products.
[0043] Reference Figure 1 、 Figure 2 and Figure 5 It is understood that the semiconductor cutting and forming equipment provided in the present application further includes a loading device 600, which is disposed to the side of the linear conveyor line 100 and in front of the first punching device 200 along the conveying direction of the linear conveyor line 100. The loading device 600 is used to transfer the processed boards 700 that have completed lead welding and plastic sealing to the linear conveyor line 100. The loading device 600 is located to the side of the linear conveyor line 100 and in front of the first punching device 200. It can automatically transfer the processed boards 700 that have completed lead welding and plastic sealing to the linear conveyor line 100, making the production process of the entire semiconductor cutting and forming equipment more coherent, avoiding the time delay and position error that may be caused by manual handling of the processed boards 700, and effectively improving production efficiency.
[0044] It is understood that the loading device 600 includes a second image recognition module and a second picking module. The second picking module is used to grab the processing board 700 that has completed lead welding and plastic sealing. The second image recognition module is used to collect second image information of the processing board 700 grabbed by the second picking module. The second picking module is also used to guide the grabbed processing board 700 based on the second image information and transfer it to the linear conveyor line 100. By collecting the second image information of the processing board 700, the second picking module can detect the position deviation of the processing board 700 and then perform precise guiding operations to ensure that the processing board 700 is transferred to the linear conveyor line 100 in the correct posture and position, providing a precise starting position for subsequent processing links such as the first punching device 200, thereby improving the accuracy of the entire processing flow.
[0045] The embodiments of the present application are described in detail above in conjunction with the accompanying drawings, but the present application is not limited to the above embodiments. Various changes can be made within the scope of knowledge possessed by ordinary technicians in the relevant technical field without departing from the purpose of the present application.
Claims
1. A semiconductor cutting and forming device, characterized in that: include: A linear conveyor line, wherein a plurality of processing plates are placed on the linear conveyor line, the processing plates include a plurality of processing windows, the length direction of the processing windows is consistent with the conveying direction of the linear conveyor line, and a plurality of semiconductors are arranged along the conveying direction of the linear conveyor line in the processing windows; the semiconductors include injection-molded shells and lead frames, the lead frames extend from both sides of the injection-molded shells and are connected to both side edges of the processing windows, the injection-molded shells of adjacent semiconductors are connected by a first connector, and the injection-molded shells of the semiconductors near the ends of the processing windows are connected to the end edges of the processing windows by the first connector; a first punching device, the first punching device being arranged beside the linear conveyor line and being used for sequentially cutting off all the first connectors and the connection between the lead frame and the processing window on one side of the injection-molded housing; A punching and bending device is provided beside the linear conveyor line and is located behind the first punching device along the conveying direction of the linear conveyor line, and is used to sequentially cut off the connection between the lead frame on the other side of the injection-molded housing and the processing window, and bend the lead frames on both sides of the injection-molded housing; wherein, after the processing plate passes through the punching and bending device, the semiconductor and the processing plate no longer have a direct connection, but the end of the processing window can push the semiconductor inside to move in an orderly manner; The material receiving device is arranged at the rear end of the punching and bending device along the conveying direction of the straight conveyor line, and is used to receive the semiconductor that has completed cutting and forming.
2. The semiconductor cutting and forming equipment according to claim 1, characterized in that: The linear conveyor line includes two linear guide rails and several transmission wheels. The spacing between the two linear guide rails is smaller than the width of the processing plate. Several transmission wheels are arranged on one of the linear guide rails at intervals, and the spacing between two adjacent transmission wheels is smaller than the length of the processing plate.
3. The semiconductor cutting and forming equipment according to claim 2, characterized in that: The first punching device includes a first punching die head, and the bottom of the first punching die head is provided with at least a first cutting head and a second cutting head in sequence along the conveying direction of the straight conveyor line. The first cutting head is used to cut off all the first connecting parts, and the second cutting head is used to cut off the connection between the lead frame and the processing window on one side of the injection-molded shell.
4. The semiconductor cutting and forming equipment according to claim 2, characterized in that: The punching and bending device includes a punching and bending die and a base plate. The base plate is located below the two linear guide rails, and the punching and bending die is located above the base plate. The punching and bending die is used to sequentially cut off the connection between the lead frame on the other side of the injection-molded shell and the processing window, and to bend the lead frames on both sides of the injection-molded shell. The base plate is used to support the semiconductor that falls from the processing plate, and the upper surface of the fallen semiconductor is higher than the position of the processing window, so that as the linear conveyor line is driven, the end of the processing window can push the semiconductor to move.
5. The semiconductor cutting and forming equipment according to claim 4, characterized in that: The bottom of the punching and bending die head is provided with a third cutting head and several bending heads in sequence along the conveying direction of the straight conveyor line. The third cutting head is used to cut off the connection between the lead frame on the other side of the injection-molded shell and the processing window. The several bending heads are respectively used to bend the lead frames on both sides of the injection-molded shell to different degrees. The bottom plate is provided with avoidance grooves at the cutting position of the third cutting head and the bending position of the bending head.
6. The semiconductor cutting and forming equipment according to claim 4, characterized in that: Before punching, the distance between the punching and bending die head and the base plate is a first distance, which is greater than the height of the semiconductor before bending and less than twice the height of the semiconductor before bending.
7. The semiconductor cutting and forming equipment according to claim 4, characterized in that: The material receiving device is arranged at the rear end of the bottom plate along the conveying direction of the straight conveying line, and is used for receiving the bent semiconductors that fall from the bottom plate.
8. The semiconductor cutting and forming equipment according to claim 7, characterized in that: It also includes a first image recognition module and a first material picking module. The length of the base plate is greater than the length of the punching and bending die head. The first image recognition module and the first material picking module are arranged on the rear side of the punching and bending die head along the conveying direction of the straight conveyor line, and are located above the base plate; the first image recognition module is used to collect the first image information of the semiconductor transmitted from the punching and bending die head, and the first material picking module is used to remove the semiconductor that does not meet the standards transmitted from the punching and bending die head according to the first image information.
9. The semiconductor cutting and forming equipment according to claim 1, characterized in that: It also includes a loading device, which is arranged on the side of the straight conveyor line and is located in front of the first punching device along the conveying direction of the straight conveyor line, and is used to transfer the processed boards that have completed lead welding and plastic sealing to the straight conveyor line.
10. The semiconductor cutting and forming equipment according to claim 9, characterized in that: The loading device includes a second image recognition module and a second material picking module. The second material picking module is used to grab the processed board that has completed lead welding and plastic sealing. The second image recognition module is used to collect second image information of the processed board grabbed by the second material picking module. The second material picking module is also used to guide the grabbed processed board according to the second image information and transfer it to the straight conveyor line.