A semiconductor device processing clamping tool

Abstract

The present invention discloses a semiconductor device processing clamping tool, comprising a bottom box, two second fixed blocks fixedly mounted on the top of the bottom box, a first rotating shaft rotatably connected between the two second fixed blocks, an adjustment plate fixedly mounted on the outer side wall of the first rotating shaft, two mounting blocks fixedly mounted on the top of the adjustment plate, and a second rotating shaft rotatably connected on each side wall of the two mounting blocks adjacent to each other. The present invention achieves effective adsorption and collection of harmful gases during the welding process between the integrated chip and the chip pins by providing an adsorption component, thereby optimizing the working environment. At the same time, in combination with the positioning component, the first adjustment component and the second adjustment component, the reciprocating motion of the adsorption component is utilized to rotate the integrated chip around the first rotating shaft, or to rotate the integrated chip around the second rotating shaft, thereby being able to adjust the welding position between the integrated chip and the chip pins, thereby enhancing the processing flexibility and processing quality.

Description

Technical Field

[0001] The present invention relates to the technical field of clamping tooling, and in particular to a clamping tooling for processing semiconductor devices. Background Art

[0002] In the processing of semiconductor devices, clamping tooling is an indispensable and important tool. It is used to fix semiconductor devices to ensure their stability and accuracy during the processing. For example, in the manufacturing process of integrated circuit (IC) chips, the chips need to undergo welding, packaging, testing and other steps.

[0003] However, in the manufacturing process of integrated circuit (IC) chips, the existing clamping tooling still has some shortcomings, such as single functionality, inability to improve the working environment when welding semiconductor devices, and low flexibility and precision during processing. To this end, we propose a semiconductor device processing clamping tool to improve its functionality during use. Summary of the Invention

[0004] The purpose of the present invention is to solve the shortcomings of the prior art and to propose a semiconductor device processing clamping tool.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions:

[0006] The top of the adjusting device is installed with a toothed structure, and the guide rail is installed in the guide rail with a toothed structure, and the guide rail is connected with the toothed structure on the toothed structure to form a toothed structure.

[0007] Preferably, the adsorption assembly includes a second hydraulic cylinder fixedly mounted on the bottom of the bottom box, a long plate fixedly mounted on the telescopic end of the second hydraulic cylinder, two adsorption cylinders located below the long plate fixedly mounted on the inner bottom of the bottom box, both adsorption cylinders are provided with adsorption plugs slidably connected to their inner walls, adsorption rods are fixedly connected between the two adsorption plugs and the long plate, both adsorption cylinders are provided with adsorption inlet pipes and adsorption outlet pipes connected to their interiors, an adsorption box is provided on the outer wall of the bottom box, and the two adsorption outlet pipes are connected to the adsorption box at one end away from the adsorption cylinders where they are located.

[0008] Preferably, the positioning assembly includes three limit rods that are arranged on the top of the bottom box and are located directly above the long board. The three limit rods are fixedly installed with round blocks at one end outside the bottom box. The three round blocks are fixedly connected to the top of the bottom box with a first spring. Secondly, an inner cavity is provided in each of the two limit rods, and an inner plug is provided in each of the two inner cavities that is slidably connected to its inner wall. Thirdly, a round hole is opened at the bottom of each of the two limit rods that is connected to the two inner cavities. A connecting pipe that is connected to its interior is provided on each of the two inner cavities, and one end of the two connecting pipes that is connected to the inner cavity is located at the inner plug. Above the cam, there are tension springs fixedly connected between the two inner plugs and the inner bottom of the inner cavity where they are located, a square guide rod is fixedly connected between the inner walls on both sides of the bottom box, and an auxiliary plate located on one side of the three limit rods is slidably sleeved on the outer wall of the square guide rod, a second spring is fixedly connected between the auxiliary plate and the inner wall of one side of the bottom box, two support rods are fixedly installed on the top of the auxiliary plate, positioning blocks are fixedly installed on the top of the two support rods, a reset block is fixedly installed on the top of the auxiliary plate, and two push rods are fixedly installed on the top of the long plate, and the two push rods are respectively located directly below the two circular holes.

[0009] Preferably, the first adjustment assembly includes two first fixed blocks fixedly mounted on the top of the bottom box, a reciprocating screw is rotatably connected between the two first fixed blocks, a displacement block is threadedly mounted on the outer wall of the reciprocating screw, the displacement block is slidably connected to the top of the bottom box, the top of the displacement block is rotatably connected to one end of a connecting rod, and the other end of the connecting rod is fixedly connected to the bottom of the adjustment plate, one end of the reciprocating screw passes through one of the first fixed blocks and is fixedly mounted with the inner ring of the second one-way bearing, the outer ring of the second one-way bearing is fixedly mounted with an outer cylinder, a first cover box located on the outer side of the outer cylinder is fixedly mounted on one of the first fixed blocks, a first sliding plug is provided inside the first cover box and slides with the inner wall of the first cover box, a first matching rod is fixedly mounted on the side wall of the first sliding plug close to the outer cylinder, a first matching groove is provided on the outer wall of the first matching rod, and a first matching block is fixedly mounted on the inner wall of the outer cylinder, one end of the connecting pipe is connected with the first cover box, and the end of the connecting pipe connected with the first cover box is located on the side of the first sliding plug away from the outer cylinder.

[0010] Preferably, the second adjustment assembly includes two blocks fixedly mounted on the outer wall of one mounting block, a hollow worm meshing with a worm gear is rotatably connected between the two blocks, one end of the hollow worm passes through one block, a second cover box is fixedly mounted on the outer wall of one block, a second sliding plug is provided in the second cover box and is slidably connected to its inner wall, a second matching rod is fixedly mounted on a side wall of the second sliding plug close to the hollow worm, a second matching groove is provided on the outer side wall of the second matching rod, a second matching block is fixedly mounted on the inner wall of the hollow worm, one end of the other connecting pipe is connected to the second cover box, and the end of the other connecting pipe connected to the second cover box is located on the side of the second sliding plug away from the hollow worm.

[0011] Preferably, a one-way valve is provided in each of the adsorption inlet pipe and the adsorption outlet pipe, and one end of the adsorption inlet pipe and the adsorption outlet pipe connected to the adsorption cylinder is located below the adsorption plug.

[0012] Preferably, the cross sections of the three limiting rods are all square, the two positioning blocks are both hemispherical, and the push rod is adapted to the circular hole.

[0013] Preferably, the first mating groove and the second mating groove are both spiral-shaped, the first mating block is located in the first mating groove and is slidably connected to the first mating groove, and the second mating block is located in the second mating groove and is slidably connected to the second mating groove.

[0014] Beneficial effects of the present invention:

[0015] By setting up an adsorption component, the adsorption plug in the adsorption cylinder can be moved back and forth up and down, thereby adsorbing and collecting harmful gases generated during the welding process of the chip pins and the integrated chip, thereby improving the working environment.

[0016] By setting up a positioning component and a first adjustment component, the reciprocating screw can be rotated through the reciprocating motion of the long plate of the adsorption component process, so that the integrated chip to be welded with the chip pin can be rotated around the axis of the first rotating shaft to adjust the welding position.

[0017] By setting up a positioning component and a second adjustment component, the reciprocating motion of the long plate of the adsorption component process can realize the rotation of the reciprocating screw and the rotation of the worm gear, so that the integrated chip to be welded to the chip pin can be rotated around the axis of the second rotating shaft, so that the integrated chip can be adjusted in another direction.

[0018] The present invention utilizes an adsorption assembly to effectively absorb and collect harmful gases during the welding process between the integrated chip and the chip pins, thereby optimizing the working environment. Furthermore, by combining a positioning assembly, a first adjustment assembly, and a second adjustment assembly, the reciprocating motion of the adsorption assembly allows the integrated chip to rotate about the first axis or the second axis, thereby adjusting the welding position between the integrated chip and the chip pins and enhancing processing flexibility and quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a schematic diagram of the three-dimensional structure of one side of a semiconductor device processing clamping tool proposed by the present invention;

[0020] Figure 2 This is a schematic diagram of the three-dimensional structure of the other side of a semiconductor device processing clamping tool proposed by the present invention;

[0021] Figure 3 This is a schematic diagram of the three-dimensional structure of the present invention after being cut apart along the center line of the bottom box;

[0022] Figure 4 For the present invention Figure 4 Schematic diagram of the enlarged structure at A in the middle;

[0023] Figure 5 It is a schematic diagram of the three-dimensional structure of the hollow worm after being cut along the axis of the present invention;

[0024] Figure 6 For the present invention Figure 5 Schematic diagram of the enlarged structure at B in the middle;

[0025] Figure 7 It is a schematic diagram of the three-dimensional structure of the present invention after being cut apart along the center line of the limiting rod.

[0026] In the figure: 1 bottom box, 2 reciprocating screw, 3 displacement block, 4 first fixed block, 5 first cover box, 6 adjustment plate, 7 mounting block, 8 mounting seat, 9 first hydraulic cylinder, 10 chuck, 11 second cover box, 12 worm gear, 13 first one-way bearing, 14 hollow worm, 15 block, 16 second fixed block, 17 round block, 18 limit rod, 19 first spring, 20 adsorption box, 21 adsorption inlet pipe, 22 connecting pipe, 23 inner cavity, 24 positioning rod, 25 inner plug, 26 positioning block, 27 support rod, 28 auxiliary plate , 29 push rod, 30 second hydraulic cylinder, 31 adsorption cylinder, 32 long plate, 33 first rotating shaft, 34 connecting rod, 35 second one-way bearing, 36 outer cylinder, 37 first matching block, 38 first matching rod, 39 first matching groove, 40 first sliding plug, 41 round hole, 42 second rotating shaft, 43 second spring, 44 square guide rod, 45 reset block, 46 second sliding plug, 47 second matching rod, 48 second matching groove, 49 second matching block, 50 adsorption rod, 51 adsorption plug, 52 adsorption outlet pipe, 53 tension spring. DETAILED DESCRIPTION

[0027] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0028] Reference Figure 1-Figure 7 , a semiconductor device processing clamping tooling includes a bottom box 1, two second fixed blocks 16 are fixedly installed on the top of the bottom box 1, a first rotating shaft 33 is rotatably connected between the two second fixed blocks 16, an adjustment plate 6 is fixedly installed on the outer wall of the first rotating shaft 33, two mounting blocks 7 are fixedly installed on the top of the adjustment plate 6, the two mounting blocks 7 are rotatably connected to the side wall where the two mounting blocks 7 are close to each other, a mounting seat 8 is fixedly installed on the side wall where the two second rotating shafts 42 are close to each other, a first hydraulic cylinder 9 is fixedly installed on the side wall where the two mounting seats 8 are close to each other, a chuck 10 is fixedly installed on the telescopic end of the two first hydraulic cylinders 9, one end of one of the second rotating shafts 42 passes through one of the mounting seats 8 and is fixedly installed with the inner ring of the first one-way bearing 13, the outer ring of the first one-way bearing 13 is fixedly installed with a worm gear 12, and an adsorption component is provided on the bottom box 1.

[0029] The adsorption assembly includes a second hydraulic cylinder 30 fixedly mounted on the bottom of the bottom box 1, and a long plate 32 is fixedly mounted on the telescopic end of the second hydraulic cylinder 30. Two adsorption cylinders 31 located below the long plate 32 are fixedly mounted on the inner bottom of the bottom box 1. Adsorption plugs 51 slidably connected to the inner wall of the two adsorption cylinders 31 are provided. Adsorption rods 50 are fixedly connected between the two adsorption plugs 51 and the long plate 32. Adsorption inlet pipes 21 and adsorption outlet pipes 52 connected to the interior of the two adsorption cylinders 31 are provided. An adsorption box 20 is provided on the outer wall of the bottom box 1. The two adsorption outlet pipes 52 are connected to the adsorption box 20 at one end away from the adsorption cylinder 31. A one-way valve is provided in the adsorption inlet pipe 21 and the adsorption outlet pipe 52. The ends of the adsorption inlet pipe 21 and the adsorption outlet pipe 52 connected to the adsorption cylinder 31 are located below the adsorption plug 51. Through the adsorption assembly, harmful fumes generated during the welding process of semiconductor devices can be adsorbed and collected, thereby improving the working environment.

[0030] The bottom box 1 is provided with a positioning assembly, which includes three limit rods 18 that are arranged on the top of the bottom box 1 and directly above the long plate 32. The three limit rods 18 are fixedly installed with a round block 17 at one end outside the bottom box 1. The three round blocks 17 are fixedly connected to the top of the bottom box 1 with a first spring 19. The two limit rods 18 are each provided with an inner cavity 23, and the two inner cavities 23 are each provided with an inner plug 25 that is slidably connected to its inner wall. The bottoms of the two limit rods 18 are each provided with a circular hole 41 that is connected to the two inner cavities 23. The two inner cavities 23 are each provided with a connecting pipe 22 that is connected to their interior. The ends of the two connecting pipes 22 that are connected to the inner cavity 23 are both located above the inner plug 25. The two inner plugs 25 are fixedly connected to the inner bottom of the inner cavity 23 with a tension spring 53. A square guide rod 44 is fixedly connected between the inner walls on both sides, and an auxiliary plate 28 located on one side of the three limit rods 18 is slidably sleeved on the outer wall of the square guide rod 44. A second spring 43 is fixedly connected between the auxiliary plate 28 and the inner wall of one side of the bottom box 1. Two support rods 27 are fixedly installed on the top of the auxiliary plate 28, and positioning blocks 26 are fixedly installed on the top of the two support rods 27. A reset block 45 is fixedly installed on the top of the auxiliary plate 28. Two push rods 29 are fixedly installed on the top of the long plate 32. The two push rods 29 are respectively located directly below the two circular holes 41. The cross-sections of the three limit rods 18 are all square, and the two positioning blocks 26 are both hemispherical. The push rods 29 are adapted to the circular holes 41. Through the positioning assembly, the two limit rods 18 can be limited and fixed after downward movement, and can be reset by upward movement after limit and fixation.

[0031] The bottom box 1 is provided with a first adjustment assembly connected to the positioning assembly and the adjustment plate 6. The first adjustment assembly includes two first fixed blocks 4 fixedly mounted on the top of the bottom box 1. A reciprocating screw 2 is rotatably connected between the two first fixed blocks 4. A displacement block 3 is threadedly sleeved on the outer wall of the reciprocating screw 2. The displacement block 3 is slidably connected to the top of the bottom box 1. The top of the displacement block 3 is rotatably connected to one end of a connecting rod 34. The other end of the connecting rod 34 is fixedly connected to the bottom of the adjustment plate 6. One end of the reciprocating screw 2 passes through one of the first fixed blocks 4 and is fixedly mounted with the inner ring of a second one-way bearing 35. The outer ring of the second one-way bearing 35 is fixedly mounted with an outer cylinder 36. One of the first fixed blocks 4 A first cover box 5 is fixedly mounted on the outer side of the outer cylinder 36. A first sliding plug 40 is provided inside the first cover box 5 to slide with the inner wall thereof. A first matching rod 38 is fixedly mounted on a side wall of the first sliding plug 40 close to the outer cylinder 36. A first matching groove 39 is provided on the outer side wall of the first matching rod 38. A first matching block 37 is fixedly mounted on the inner wall of the outer cylinder 36. One end of a connecting tube 22 is connected to the first cover box 5. The end of the connecting tube 22 connected to the first cover box 5 is located on the side of the first sliding plug 40 away from the outer cylinder 36. By providing a first adjustment component, the semiconductor device to be processed can be rotated around the first rotating shaft 33 to adjust the processing position.

[0032] A second adjustment assembly connected to the positioning assembly is provided on one mounting block 7. The second adjustment assembly includes two blocks 15 fixedly mounted on the outer wall of one mounting block 7. A hollow worm 14 meshing with the worm gear 12 is rotatably connected between the two blocks 15. One end of the hollow worm 14 passes through one block 15. A second cover box 11 is fixedly mounted on the outer wall of one block 15. A second sliding plug 46 is provided in the second cover box 11 for sliding connection with its inner wall. A second matching rod 47 is fixedly mounted on the side wall of the second sliding plug 46 close to the hollow worm 14. A second matching groove 48 is provided on the outer wall of the second matching rod 47. The hollow worm A second mating block 49 is fixedly mounted on the inner wall of 14, one end of the other connecting tube 22 is communicated with the second cover box 11, and the end of the other connecting tube 22 communicated with the second cover box 11 is located on the side of the second slide 46 away from the hollow worm 14, the first mating groove 39 and the second mating groove 48 are both spiral, the first mating block 37 is located in the first mating groove 39 and is slidably connected to the first mating groove 39, the second mating block 49 is located in the second mating groove 48 and is slidably connected to the second mating groove 48, and the second adjustment component can make the semiconductor device to be processed rotate around the second rotating shaft 42, so that the processing position can be adjusted in another direction.

[0033] When the present invention is used, in the initial position, the three limiting rods 18 are as shown in the attached Figure 7In the state shown, by starting the first hydraulic cylinder 9, the two chucks 10 can be brought closer to each other, so that the workpiece to be processed can be clamped and fixed. By starting the second hydraulic cylinder 30, the long plate 32 and the two push rods 29 can be reciprocated up and down for a distance. When the long plate 32 reciprocates up and down, the adsorption rod 50 and the adsorption plug 51 are set, so that the harmful smoke generated during the workpiece welding process can be intermittently sucked into the adsorption cylinder 31 through the adsorption inlet pipe 21 and then squeezed into the adsorption box 20 through the adsorption outlet pipe 52 (in this process, the reciprocating push rod 29 cannot move into the inner cavity 23), and the limit rod provided with the inner cavity 23 is pressed by the round block 17. 18, which can compress the first spring 19. When the limit rod 18 moves downward, the positioning rod 24 moves downward accordingly. When the positioning rod 24 moves downward, the positioning rod 24 contacts the curved surface of the hemispherical positioning block 26. As the positioning rod 24 continues to move downward, the auxiliary plate 28 moves to one side, and the second spring 43 is compressed, thereby causing the positioning rod 24 to move from above the positioning block 26 to below the positioning block 26. When the positioning rod 24 moves to below the positioning block 26, the elastic force generated by the compression of the second spring 43 causes the auxiliary plate 28 to reset, thereby preventing the positioning rod 24 and the pressed limit rod 18 from resetting upward.

[0034] After the limit rod 18 is pressed and cannot be reset, the long plate 32 and the push rod 29 continue to move back and forth, and the push rod 29 will intermittently pass through the circular hole 41 to be inserted into the inner cavity 23 and contact the inner plug 25 to make it move upward for a distance. The tension spring 53 is reciprocally stretched, and the tension generated by the stretching of the tension spring 53 can make the inner plug 25 move up and down accordingly, so that the oil in the inner cavity 23 can be reciprocated through the connecting tube 22 and squeezed into the first cover box 5 or the second cover box 11, and then the oil in the first cover box 5 or the second cover box 11 is sucked back to the inner cavity 23 through the connecting tube 22, so that the first sliding plug 40 in the first cover box 5 can slide back and forth or the second sliding plug in the second cover box 11 can slide back and forth. 46 reciprocatingly slides. When the first sliding plug 40 reciprocates, the first matching rod 38 is provided to enable the first matching block 37 to slide in the spiral first matching groove 39, thereby enabling the outer cylinder 36 to reciprocate clockwise and counterclockwise. When the outer cylinder 36 rotates clockwise, the outer ring and inner ring of the second one-way bearing 35 rotate idly, and its reciprocating screw rod 2 does not rotate. When the outer cylinder 36 rotates counterclockwise, the outer ring and inner ring of the second one-way bearing 35 are locked, and its reciprocating screw rod 2 rotates accordingly, thereby enabling the displacement block 3 to reciprocate. When the displacement block 3 reciprocates, the connecting rod 34 is provided to enable the adjustment plate 6 to rotate around the first rotating shaft 33, thereby adjusting the position of the workpiece to be processed.

[0035] When the second sliding plug 46 slides back and forth, the second matching block 49 can slide in the second matching groove 48 through the second matching rod 47, so that the hollow worm 14 can rotate reciprocatingly clockwise and counterclockwise, and the meshing connection between the hollow worm 14 and the worm wheel 12 can make the worm wheel 12 rotate clockwise and counterclockwise. When the worm wheel 12 rotates clockwise, the outer ring and the inner ring of the first one-way bearing 13 rotate idly, and its second rotating shaft 42 does not rotate. When the worm wheel 12 rotates counterclockwise, the outer ring and the inner ring of the first one-way bearing 13 are locked, and its second rotating shaft 42 rotates accordingly, so that the workpiece to be processed can be rotated, and the position of the workpiece to be processed can be further adjusted. By pressing the round block 17, the limit rod 18 without the inner cavity 23 is moved downward. When the second spring 43 is compressed again, the auxiliary plate 28 moves to one side, and the previously stuck positioning rod 24 cannot be stuck. The elastic force generated by the compression of the first spring 19 will cause the previously stuck limiting rod 18 to move upward and reset. After the previously stuck limiting rod 18 moves upward and resets, the positioning rod 24 on the limiting rod 18 without the inner cavity 23 will not be stuck. At this time, the round block 17 is released, so that the limiting rod 18 without the inner cavity 23 moves upward and resets.

[0036] The above description is only a preferred specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any technician familiar with the technical field, within the technical scope disclosed by the present invention, who makes equivalent replacements or changes based on the technical solution and inventive concept of the present invention, should be covered by the scope of protection of the present invention.

Claims

1. A semiconductor device processing clamping tool, comprising a bottom box (1), characterized in that: Two second fixed blocks (16) are fixedly installed on the top of the bottom box (1), a first rotating shaft (33) is rotatably connected between the two second fixed blocks (16), an adjustment plate (6) is fixedly installed on the outer wall of the first rotating shaft (33), two mounting blocks (7) are fixedly installed on the top of the adjustment plate (6), a second rotating shaft (42) is rotatably connected on the side wall of the two mounting blocks (7) close to each other, a mounting seat (8) is fixedly installed on the side wall of the two second rotating shafts (42) close to each other, a first hydraulic cylinder (9) is fixedly installed on the side wall of the two mounting seats (8) close to each other, a clamping disc (10) is fixedly installed on the telescopic end of the two first hydraulic cylinders (9), and one of the second rotating shafts (42) is fixedly installed on the telescopic end of the two first hydraulic cylinders (9). ) one end of which passes through a mounting seat (8) and is fixedly mounted with the inner ring of a first one-way bearing (13), the outer ring of the first one-way bearing (13) is fixedly mounted with a worm gear (12), an adsorption assembly is provided on the bottom box (1), the adsorption assembly comprises a second hydraulic cylinder (30) fixedly mounted on the bottom of the bottom box (1), a long plate (32) is fixedly mounted on the telescopic end of the second hydraulic cylinder (30), two adsorption cylinders (31) located below the long plate (32) are fixedly mounted on the inner bottom of the bottom box (1), both of the two adsorption cylinders (31) are provided with adsorption plugs (51) slidably connected to the inner wall thereof, adsorption rods (50) are fixedly connected between the two adsorption plugs (51) and the long plate (32), and the two adsorption cylinders (3 1) are provided with an adsorption inlet pipe (21) and an adsorption outlet pipe (52) connected to the interior thereof, an adsorption box (20) is provided on the outer wall of the bottom box (1), and one end of the two adsorption outlet pipes (52) away from the adsorption cylinder (31) is connected to the adsorption box (20), and a positioning assembly is provided on the bottom box (1), and the positioning assembly includes three limiting rods (18) penetrating and arranged on the top of the bottom box (1) and located directly above the long plate (32), and a round block (17) is fixedly installed on one end of the three limiting rods (18) located outside the bottom box (1), and a first spring (19) is fixedly connected between the three round blocks (17) and the top of the bottom box (1), and an inner cavity (23) is provided in each of the two limiting rods (18). The two inner cavities (23) are each provided with an inner plug (25) slidably connected to the inner wall thereof, the bottoms of the two limit rods (18) are each provided with a circular hole (41) connected to the two inner cavities (23), the two inner cavities (23) are each provided with a connecting pipe (22) connected to the interior thereof, one end of the two connecting pipes (22) connected to the inner cavity (23) is located above the inner plug (25), and a tension spring (53) is fixedly connected between the two inner plugs (25) and the inner bottom of the inner cavity (23), a square guide rod (44) is fixedly connected between the inner walls on both sides of the bottom box (1), and an auxiliary plate (28) located on one side of the three limit rods (18) is slidably sleeved on the outer wall of the square guide rod (44).A second spring (43) is fixedly connected between the auxiliary plate (28) and the inner wall of one side of the bottom box (1). Two support rods (27) are fixedly installed on the top of the auxiliary plate (28). Positioning blocks (26) are fixedly installed on the tops of the two support rods (27). A reset block (45) is fixedly installed on the top of the auxiliary plate (28). Two push rods (29) are fixedly installed on the top of the long plate (32). The two push rods (29) are respectively located directly below the two circular holes (41). A first adjustment component connected to the positioning component and the adjustment plate (6) is provided on the bottom box (1), and a second adjustment component connected to the positioning component is provided on one of the mounting blocks (7).

2. A semiconductor device processing clamping tool according to claim 1, characterized in that: The first adjustment assembly includes two first fixed blocks (4) fixedly mounted on the top of the bottom box (1), a reciprocating screw (2) is rotatably connected between the two first fixed blocks (4), a displacement block (3) is threadedly sleeved on the outer wall of the reciprocating screw (2), the displacement block (3) is slidably connected to the top of the bottom box (1), the top of the displacement block (3) is rotatably connected to one end of a connecting rod (34), the other end of the connecting rod (34) is fixedly connected to the bottom of the adjustment plate (6), one end of the reciprocating screw (2) passes through one of the first fixed blocks (4) and is fixedly mounted with the inner ring of a second one-way bearing (35), and the outer ring of the second one-way bearing (35) is fixedly mounted with an outer cylinder (36) A first cover box (5) located outside the outer cylinder (36) is fixedly mounted on the first fixed block (4), a first sliding plug (40) sliding on the inner wall of the first cover box (5) is provided inside the first cover box (5), a first matching rod (38) is fixedly mounted on a side wall of the first sliding plug (40) close to the outer cylinder (36), a first matching groove (39) is provided on the outer wall of the first matching rod (38), a first matching block (37) is fixedly mounted on the inner wall of the outer cylinder (36), one end of the connecting pipe (22) is connected to the first cover box (5), and one end of the connecting pipe (22) connected to the first cover box (5) is located on a side of the first sliding plug (40) away from the outer cylinder (36).

3. A semiconductor device processing clamping tool according to claim 2, characterized in that: The second adjustment assembly comprises two blocks (15) fixedly mounted on the outer wall of one mounting block (7), a hollow worm (14) meshing with the worm wheel (12) is rotatably connected between the two blocks (15), one end of the hollow worm (14) passes through one block (15), a second cover box (11) is fixedly mounted on the outer wall of one block (15), a second sliding plug (46) is provided in the second cover box (11) and is slidably connected to the inner wall thereof, and the second sliding plug (46) is rotatably connected to the inner wall thereof. 6) A second matching rod (47) is fixedly mounted on a side wall close to the hollow worm (14), a second matching groove (48) is provided on an outer side wall of the second matching rod (47), a second matching block (49) is fixedly mounted on an inner wall of the hollow worm (14), one end of the other connecting tube (22) is connected to the second cover box (11), and the other end of the connecting tube (22) connected to the second cover box (11) is located on a side of the second sliding plug (46) away from the hollow worm (14).

4. A semiconductor device processing clamping tool according to claim 3, characterized in that: One-way valves are provided in the adsorption inlet pipe (21) and the adsorption outlet pipe (52), and the ends of the adsorption inlet pipe (21) and the adsorption outlet pipe (52) connected to the adsorption cylinder (31) are both located below the adsorption plug (51).

5. A semiconductor device processing clamping tool according to claim 4, characterized in that: The cross sections of the three limiting rods (18) are all square, the two positioning blocks (26) are both hemispherical, and the push rod (29) is adapted to the circular hole (41).

6. A semiconductor device processing clamping tool according to claim 5, characterized in that: The first mating groove (39) and the second mating groove (48) are both spiral-shaped, the first mating block (37) is located in the first mating groove (39) and is slidably connected to the first mating groove (39), and the second mating block (49) is located in the second mating groove (48) and is slidably connected to the second mating groove (48).

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