Laser cutting device for door and window machining

Abstract

The invention belongs to the technical field of laser cutting machining, and particularly relates to a door and window machining laser cutting device which comprises a base, first clamping equipment is slidably mounted at the top of the base, a mounting base is fixedly mounted at the top of the base, and second clamping equipment is fixedly mounted on the side, away from the first clamping equipment, of the mounting base; a limiting mechanism, a cutting positioning mechanism and a grinding mechanism are mounted on the mounting seat, and the clamping equipment I and the clamping equipment II are used for clamping and fixing a profile workpiece. Cutting and lineation of profiles are achieved in a laser cutting mode, through full-automatic matched machining of the auxiliary laser head and the main laser head, the machining efficiency and precision of the profiles are improved, cutting and lineation machining of all the profiles are achieved, cutting and lineation machining are conducted on the same machining station, and the machining efficiency is improved. The profile machining precision and the lineation position precision are improved, and therefore the profile machining efficiency and the follow-up assembly quality are improved.

Description

Technical Field

[0001] The invention relates to the technical field of laser cutting processing, and in particular to a laser cutting device for door and window processing. Background Art

[0002] For the processing of special-shaped profiles such as aluminum door and window profiles, it is often necessary to perform various types of hole processing on one side of the profile, such as corner holes, glue injection holes and corner cleaning, and marking processing is required on the other side for the later assembly of the profile. The traditional processing method usually uses special fixtures combined with manual marking to complete the processing. However, due to the different sizes, shapes (round, waist-shaped, rectangular, etc.) and positions of the through holes in the profiles, many fixtures are needed. At the same time, the door and window profiles are updated quickly, resulting in the need to frequently replace fixtures. In addition, manual marking is inefficient and has low precision, which restricts the assembly quality and production efficiency of aluminum door and window profiles.

[0003] Moreover, the cut surface of the profile after cutting is relatively rough, and the cut surface needs to be ground and polished during the subsequent processing. For this reason, a laser cutting device for door and window processing is proposed. Summary of the invention

[0004] In order to solve the shortcomings in the prior art, the present invention proposes a laser cutting device for door and window processing.

[0005] In order to achieve the above-mentioned purpose, the present invention adopts the following technical scheme: a laser cutting device for door and window processing, comprising a base, a clamping device 1 is slidably installed on the top of the base, a mounting seat is fixedly installed on the top of the base, a clamping device 2 is fixedly installed on the side of the mounting seat away from the clamping device 1, a limiting mechanism, a cutting positioning mechanism and a grinding mechanism are installed on the mounting seat, the clamping device 1 and the clamping device 2 are used to clamp and fix the profile workpiece, the limiting mechanism is used to limit the profile workpiece and make it move along the axis, and the cutting positioning mechanism is used to cut and truncate the profile workpiece from one side and to position and mark the profile workpiece from the other side.

[0006] Preferably, the limiting mechanism includes a frame fixedly mounted on the top of the mounting seat, the cutting positioning mechanism includes a linear module 1 vertically fixedly mounted on one side of the frame, a mounting plate is fixedly mounted on the slider of the linear module 1, and a secondary laser head and a main laser head are horizontally mounted on the mounting plate.

[0007] Preferably, a linear module two and a linear module three are horizontally fixedly installed with symmetrical distribution, a through opening for allowing the profile workpiece to pass through is opened on the mounting plate, support plates two and one are fixedly installed on the sliders of the linear module two and three, respectively, the auxiliary laser head and the main laser head are fixedly installed on support plate two and one, respectively, the grinding mechanism includes a linear module four vertically fixedly installed on the mounting plate, support plate three is fixedly installed on the slider of the linear module four, a grinding plate is installed on the support plate three, and the grinding plate can be adjusted in angle along the horizontal direction.

[0008] Preferably, a horizontally arranged cross plate one is fixedly mounted on the slider of the support plate three, a guide rail three is fixedly mounted on the bottom of the cross plate one, a displacement block three is slidingly sleeved on the guide rail three, a cross plate two is fixedly mounted on the bottom of the displacement block three, two vertically arranged columns are fixedly mounted on the bottom of the cross plate two, rectangular spring telescopic rods are fixedly mounted on the two columns, connecting plates are rotatably mounted on the sides of the two rectangular spring telescopic rods close to each other, the grinding plate is detachably mounted between the two connecting plates, and two symmetrically distributed telescopic cylinders are hinged between the connecting plate and the adjacent columns.

[0009] Preferably, the sides of the support plate 1 and the support plate 2 close to each other are respectively provided with T-slot 1 and T-slot 2, and the sides of the two columns away from each other are fixedly installed with T-slots, and the two T-slots are respectively adapted to T-slot 1 and T-slot 2.

[0010] Preferably, a plurality of round rollers 1 distributed linearly are rotatably mounted on the top of the frame, a double-axis cylinder is fixedly mounted on one side of the frame, a round roller 2 is rotatably mounted on the end of the piston rod of the double-axis cylinder, a vertically arranged guide rail 1 is fixedly mounted on the top of the mounting seat, a displacement block 1 is slidably sleeved on the guide rail 1, a round roller 3 is rotatably mounted on the displacement block 1, a cylinder 2 is fixedly mounted on the mounting seat, the piston rod end of the cylinder 2 is hinged to the displacement block 1, and the round roller 3, round roller 2 and a plurality of cylinders 1 are horizontally arranged.

[0011] Preferably, the limiting mechanism also includes a round roller four rotatably mounted on the top of the mounting seat, a guide rail two fixedly mounted on the top of the mounting seat, and a cylinder one, a displacement block two is slidingly sleeved on the guide rail two, a round roller five is rotatably mounted on the top of the displacement block two, the piston rod end of the cylinder one is hinged to the displacement block two, and the round roller four and the round roller five are both vertically arranged.

[0012] Preferably, a chip removal opening is provided on the mounting seat.

[0013] Compared with the prior art, the present invention has the following beneficial effects: The present invention uses laser cutting to achieve cutting and marking of profiles. The fully automatic cooperation of the auxiliary laser head and the main laser head is beneficial to improving the processing efficiency and accuracy of profiles, and realizing cutting and marking of various types of profiles. Moreover, the cutting and marking are performed at the same processing station, which is beneficial to improving the processing accuracy of profiles and the position accuracy of marking, thereby improving the processing efficiency of profiles and the subsequent assembly quality. The cutting and positioning mechanism can be used to grind and polish various sections of the profile workpiece, so that the cutting and section grinding of the profile workpiece can be carried out at the same workstation, which is beneficial to improving the processing accuracy and processing efficiency of the profile. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic diagram of the overall structure of a laser cutting device for door and window processing proposed by the present invention; Figure 2 This is a schematic diagram of the structure of the mounting seat, the limiting mechanism, the cutting positioning mechanism and the grinding mechanism in the laser cutting device for door and window processing proposed by the present invention. Figure 1 ; Figure 3 This is a schematic structural diagram of a mounting seat and a limiting mechanism in a laser cutting device for door and window processing proposed by the present invention; Figure 4 This is a schematic diagram of the structure of the mounting seat, the limiting mechanism, the cutting positioning mechanism and the grinding mechanism in the laser cutting device for door and window processing proposed by the present invention. Figure 2 ; Figure 5 This is a schematic structural diagram of a frame, a cutting positioning mechanism and a grinding mechanism in a laser cutting device for door and window processing proposed by the present invention; Figure 6 for Figure 5 A schematic diagram of the enlarged structure of part A; Figure 7 A schematic diagram of a state of a laser cutting device for door and window processing and a mechanical arm cutting a profile workpiece a proposed by the present invention; Figure 8 A schematic diagram of a grinding plate grinding a vertical cut end face of a profile workpiece a in a laser cutting device for door and window processing proposed by the present invention; Fig. 9 This is a schematic diagram of a grinding plate grinding a 45-degree groove end face of a profile workpiece a in a laser cutting device for door and window processing proposed by the present invention; Fig.10 This is a schematic diagram of a grinding plate grinding the inner walls of both sides of a right-angle groove of a profile workpiece a in a laser cutting device for door and window processing proposed by the present invention; Fig.11 This is a schematic diagram of a grinding plate grinding a right-angle groove end face of a profile workpiece a in a laser cutting device for door and window processing proposed by the present invention.

[0015] In the figure: 1, base; 2, clamping device 1; 3, clamping device 2; 4, mounting seat; 41, chip removal port; 5, limit mechanism; 51, frame; 52, roller 1; 53, double-axis cylinder; 54, roller 2; 55, cylinder 1; 56, guide rail 1; 57, displacement block 1; 58, roller 3; 59, cylinder 2; 510, roller 4; 511, guide rail 2; 512, displacement block 2; 513, roller 5; 6, cutting positioning mechanism; 61, linear module 1; 62, mounting plate; 63, linear Linear module group two; 64, linear module group three; 65, support plate one; 651, T-slot one; 66, support plate two; 661, T-slot two; 67, auxiliary laser head; 68, main laser head; 7, grinding mechanism; 71, linear module group four; 72, support plate three; 73, horizontal plate one; 74, guide rail three; 75, displacement block three; 76, horizontal plate two; 77, column; 78, T-bar; 79, rectangular spring telescopic rod; 710, connecting plate; 711, grinding plate; 712, telescopic cylinder; 8, robotic arm. DETAILED DESCRIPTION

[0016] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0017] Please refer to Figure 1-Figure 11 The present invention provides a technical solution: a laser cutting device for door and window processing, comprising a base 1, a clamping device 2 is slidably installed on the top of the base 1, a mounting seat 4 is fixedly installed on the top of the base 1, a clamping device 2 3 is fixedly installed on the side of the mounting seat 4 away from the clamping device 2, a limiting mechanism 5, a cutting positioning mechanism 6 and a grinding mechanism 7 are installed on the mounting seat 4, the clamping device 2 and the clamping device 2 3 are used to clamp and fix the profile workpiece a, the limiting mechanism 5 is used to limit the profile workpiece a and make it move along the axis, and the cutting positioning mechanism 6 is used to cut and truncate the profile workpiece a from one side and to position and mark the profile workpiece a from the other side.

[0018] like Figure 7 As shown, a mechanical arm 8 is provided on the side of the clamping device 2 away from the mounting seat 4, and the mechanical arm 8 is used to clamp the profile workpiece a and to push and pull the profile workpiece a to move along its own axis.

[0019] The limiting mechanism 5 includes a frame 51 fixedly installed on the top of the mounting seat 4, and the cutting positioning mechanism 6 includes a linear module 61 vertically fixedly installed on one side of the frame 51. A mounting plate 62 is fixedly installed on the slider of the linear module 61, and a secondary laser head 67 and a main laser head 68 are horizontally installed on the mounting plate 62.

[0020] A linear module two 63 and a linear module three 64 are horizontally fixedly installed with symmetrical distribution, and a through hole for the profile workpiece a to pass through is opened on the mounting plate 62. Support plates two 66 and one 65 are fixedly installed on the sliders of the linear module two 63 and the linear module three 64 respectively, and a secondary laser head 67 and a main laser head 68 are fixedly installed on the support plate two 66 and the support plate one 65 respectively. The grinding mechanism 7 includes a linear module four 71 vertically fixedly installed on the mounting plate 62, a support plate three 72 is fixedly installed on the slider of the linear module four 71, a grinding plate 711 is installed on the support plate three 72, and the grinding plate 711 can be adjusted in angle along the horizontal direction.

[0021] A horizontally arranged cross plate 1 73 is fixedly installed on the slider of the support plate 3 72, a guide rail 3 74 is fixedly installed on the bottom of the cross plate 1 73, a displacement block 3 75 is slidably sleeved on the guide rail 3 74, a cross plate 2 76 is fixedly installed on the bottom of the displacement block 3 75, two vertically arranged columns 77 are fixedly installed on the bottom of the cross plate 2 76, rectangular spring telescopic rods 79 are fixedly installed on the two columns 77, a connecting plate 710 is rotatably installed on the side where the two rectangular spring telescopic rods 79 are close to each other, a grinding plate 711 is detachably installed between the two connecting plates 710, and two symmetrically distributed telescopic cylinders 712 are hinged between the connecting plate 710 and the adjacent columns 77.

[0022] The sides of the support plate 1 65 and the support plate 2 66 that are close to each other are respectively provided with a T-slot 1 651 and a T-slot 2 661 , and the sides of the two columns 77 that are away from each other are fixedly installed with a T-strip 78 , and the two T-strips 78 are respectively adapted to the T-slot 1 651 and the T-slot 2 661 .

[0023] Further, after the clamping device 1 2 and the clamping device 2 3 clamp and fix the profile workpiece a, as the main laser head 68 cuts and cuts the profile workpiece a, the clamping device 1 2 is released from fixing one section of the profile workpiece a, and then the robot arm 8 pulls the section of the profile workpiece a away from the mounting seat 4, and then the linear module 4 71 is controlled to drive the support plate 3 72 to move downward, so that the grinding plate 711 falls between the two sections of the profile workpiece a, and the two T-shaped bars 78 are respectively inserted into the T-shaped slot 1 651 and the T-shaped slot 2 661; When the cutting section of the profile workpiece a is Figure 8As shown, it is only necessary to make the grinding plate 711 in a vertical state and make the grinding plate 711 fall between the cross sections of the two sections of the profile workpiece a, and then control the robot arm 8 to push the profile workpiece a in the clamping device 1 2 to move toward the profile workpiece a fixed on the clamping device 2 3. When the robot arm 8 pushes the profile workpiece a against the grinding plate 711, it will drive the four telescopic cylinders 712 and the two rectangular spring telescopic rods 79 to shrink synchronously and make the grinding plate 711 move toward the profile workpiece a fixed on the clamping device 2 3. The two sections of the profile workpiece a clamp the grinding plate 711, and then control the linear module 2 63 and the linear module 3 64 to drive the support plate 1 65 and the support plate 2 66 to move back and forth synchronously, and the support plate 1 65 and the support plate 2 66 then drive the two columns 77 to move back and forth synchronously, and the two rectangular spring telescopic rods 79 then drive the grinding plate 711 to move back and forth synchronously, and the grinding plate 711 that moves back and forth can grind the vertical cut end faces of the two sections of the profile workpiece a that are cut and truncated; On the basis of the above, when the cutting section of the profile workpiece a is as follows Fig. 9 As shown, if the cross section of the two-section profile workpiece a is a 45-degree groove, it is only necessary to control the four telescopic cylinders 712 to extend and retract to different degrees, so that the grinding plate 711 rotates with the connection between the two rectangular spring telescopic rods 79 and the connecting plate 710 as the center of the circle, so that the grinding plate 711 and the 45-degree groove of the two-section profile workpiece a are kept horizontal, and then after the two-section profile workpiece a clamp the grinding plate 711, the grinding plate 711 is reciprocated left and right to grind the 45-degree groove of the two-section profile workpiece a; On the basis of the above, when the cutting section of the profile workpiece a is as follows Figure 10-11 As shown, if the profile workpiece a is cut with a right-angle groove or a right-angle groove by the main laser head 68, the extension and retraction of the four telescopic cylinders 712 are controlled to make the grinding plate 711 tilted at forty-five degrees, and at the same time, the height of the grinding plate 711 is adjusted in conjunction with the linear module 1 61, and then the linear module 2 63 and the linear module 3 64 drive the grinding plate 711 to move back and forth left and right to grind the two cutting surfaces of the right-angle groove or the right-angle groove of the profile workpiece a.

[0024] A plurality of linearly distributed round rollers 52 are rotatably mounted on the top of the frame 51, a double-axis cylinder 53 is fixedly mounted on one side of the frame 51, a round roller 2 54 is rotatably mounted on the piston rod end of the double-axis cylinder 53, a vertically arranged guide rail 1 56 is fixedly mounted on the top of the mounting seat 4, a displacement block 1 57 is slidably sleeved on the guide rail 1 56, a round roller 3 58 is rotatably mounted on the displacement block 1 57, a cylinder 2 59 is fixedly mounted on the mounting seat 4, the piston rod end of the cylinder 2 59 is hinged to the displacement block 1 57, and the round roller 3 58, the round roller 2 54 and a plurality of cylinders 1 55 are horizontally arranged.

[0025] The limiting mechanism 5 also includes a round roller four 510 rotatably mounted on the top of the mounting seat 4, a guide rail two 511 fixedly mounted on the top of the mounting seat 4, and a cylinder one 55, a displacement block two 512 is slidably sleeved on the guide rail two 511, a round roller five 513 is rotatably mounted on the top of the displacement block two 512, the piston rod end of the cylinder one 55 is hinged to the displacement block two 512, and the round roller four 510 and the round roller five 513 are both vertically arranged.

[0026] Furthermore, the bottom of the profile workpiece a falls between the tops of multiple round rollers 52, and the double-axis cylinder 53 controls the round roller 2 54 to move downward and press the profile workpiece a, and then the cylinder 2 59 drives the displacement block 1 57 and the round roller 3 58 to move downward and press the profile workpiece a, and then the cylinder 1 55 pushes the round roller 5 513 to move to the round roller 4 510 and clamps the profile workpiece a from both sides, so that the profile workpiece a can be clamped and positioned from four directions, ensuring that the profile workpiece a can only be displaced along the axis without the clamping and fixing of the clamping device 1 2 and the clamping device 2 3.

[0027] The mounting seat 4 is provided with a chip discharge opening 41 .

[0028] Furthermore, the residues cut from the profile workpiece a and the chips generated during grinding will fall into the top opening of the chip discharge port 41 and be discharged from the bottom opening of the chip discharge port 41 located on one side of the mounting seat 4 along the inclined inner wall of the chip discharge port 41.

[0029] In this embodiment: by controlling the linear module four 71, the mounting plate 62 can drive the linear module two 63 and the linear module three 64 to move up and down synchronously, and the linear module two 63 and the linear module three 64 can respectively drive the support plate two 66 and the support plate one 65 to move horizontally, and the support plate two 66 and the support plate one 65 can respectively drive the main laser head 68 and the auxiliary laser head 67 to move horizontally, so that the distance between the auxiliary laser head 67 and the main laser head 68 and the profile workpiece a can be adjusted; When laser cutting or laser marking is performed on the profile workpiece a, the robot arm 8 clamps one end of the profile workpiece a and pushes the profile workpiece a through the clamping device 1 2 and the frame 51, and then the profile workpiece a is positioned by the limit mechanism 5, so as to ensure that the robot arm 8 can push the profile workpiece a to move only along its own axis as the center of the circle. When the profile workpiece a reaches the target position, the profile workpiece a is clamped and fixed by the clamping device 2 3 and the clamping device 1 2; Then, the linear module 1 61 is controlled to drive the auxiliary laser head 67 to move vertically up and down, so that the laser beam emitted by the auxiliary laser head 67 can move from top to bottom or from bottom to top on one side of the profile workpiece a and mark it, and the linear module 2 63 can drive the auxiliary laser head 67 to move in the horizontal direction to ensure that the focus of the laser beam emitted by the auxiliary laser head 67 can fall on the side of the profile workpiece a to be marked; Then, the main laser head 68 is driven to move vertically up and down by controlling the linear module 1 61, so that the laser beam emitted by the main laser head 68 can move from top to bottom or from bottom to top on the other side of the profile workpiece a and cut and cut it, and the linear module 2 63 can drive the auxiliary laser head 67 to move horizontally to ensure that the focus of the laser beam emitted by the auxiliary laser head 67 can fall on the part of the profile workpiece a to be cut; By releasing the fixation of the clamping device 1 2 and the clamping device 2 3 on the profile workpiece a, when the profile workpiece a is marked by the auxiliary laser head 67 or cut and truncated by the main laser head 68, the profile workpiece a is moved axially in cooperation with the robot arm 8, and the auxiliary laser head 67 and the main laser head 68 are driven to move up and down in cooperation with the linear module 1 61, thereby completing the forty-five-degree cutting, truncating / marking of the profile workpiece a, or the right-angle cutting, truncating / marking of the profile workpiece a.

[0030] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A laser cutting device for door and window processing, comprising a base (1), characterized in that: A clamping device (2) is slidably mounted on the top of the base (1); a mounting seat (4) is fixedly mounted on the top of the base (1); a clamping device (3) is fixedly mounted on a side of the mounting seat (4) away from the clamping device (2); a limiting mechanism (5), a cutting positioning mechanism (6) and a grinding mechanism (7) are mounted on the mounting seat (4); the clamping device (2) and the clamping device (3) are used to clamp and fix the profile workpiece; the limiting mechanism (5) is used to limit the profile workpiece and enable it to move along the axis; the cutting positioning mechanism (6) is used to cut and truncate the profile workpiece from one side and to position and mark the profile workpiece from the other side.

2. A laser cutting device for door and window processing according to claim 1, characterized in that: The limiting mechanism (5) comprises a frame (51) fixedly mounted on the top of the mounting seat (4), and the cutting positioning mechanism (6) comprises a linear module (61) vertically fixedly mounted on one side of the frame (51), a mounting plate (62) fixedly mounted on a slider of the linear module (61), and a secondary laser head (67) and a main laser head (68) horizontally mounted on the mounting plate (62).

3. A laser cutting device for door and window processing according to claim 2, characterized in that: A linear module 2 (63) and a linear module 3 (64) are horizontally fixedly mounted on the mounting plate (62) and are symmetrically distributed. A through hole is opened on the mounting plate (62) for allowing the profile workpiece to pass through. A support plate 2 (66) and a support plate 1 (65) are fixedly mounted on the sliders of the linear module 2 (63) and the linear module 3 (64) respectively. The auxiliary laser head (67) and the main laser head (68) are fixedly mounted on the support plate 2 (66) and the support plate 1 (65) respectively. The grinding mechanism (7) comprises a linear module 4 (71) fixedly mounted on the mounting plate (62). A support plate 3 (72) is fixedly mounted on the slider of the linear module 4 (71). A grinding plate (711) is mounted on the support plate 3 (72). The grinding plate (711) can be adjusted in angle along the horizontal direction.

4. A laser cutting device for door and window processing according to claim 3, characterized in that: A horizontally arranged transverse plate 1 (73) is fixedly mounted on the slider of the support plate 3 (72), a guide rail 3 (74) is fixedly mounted on the bottom of the transverse plate 1 (73), a displacement block 3 (75) is slidably sleeved on the guide rail 3 (74), a transverse plate 2 (76) is fixedly mounted on the bottom of the displacement block 3 (75), two vertically arranged columns (77) are fixedly mounted on the bottom of the transverse plate 2 (76), a rectangular spring telescopic rod (79) is fixedly mounted on both columns (77), a connecting plate (710) is rotatably mounted on the sides of the two rectangular spring telescopic rods (79) close to each other, the grinding plate (711) is detachably mounted between the two connecting plates (710), and two symmetrically distributed telescopic cylinders (712) are hingedly connected between the connecting plate (710) and the adjacent columns (77).

5. A laser cutting device for door and window processing according to claim 4, characterized in that: The support plate 1 (65) and the support plate 2 (66) are respectively provided with a T-shaped slot 1 (651) and a T-shaped slot 2 (661) on the sides close to each other, and the two uprights (77) are respectively fixedly provided with a T-shaped bar (78) on the sides away from each other, and the two T-shaped bars (78) are respectively adapted to the T-shaped slot 1 (651) and the T-shaped slot 2 (661).

6. The laser cutting device for door and window processing according to claim 2, characterized in that: A plurality of linearly distributed round rollers (52) are rotatably mounted on the top of the frame (51); a double-axis cylinder (53) is fixedly mounted on one side of the frame (51); a round roller (54) is rotatably mounted on the end of the piston rod of the double-axis cylinder (53); a vertically arranged guide rail (56) is fixedly mounted on the top of the mounting seat (4); a displacement block (57) is slidably sleeved on the guide rail (56); a round roller (58) is rotatably mounted on the displacement block (57); a cylinder (59) is fixedly mounted on the top of the mounting seat (4); the piston rod end of the cylinder (59) is hinged to the displacement block (57); and the round roller (58), the round roller (54) and the plurality of cylinders (55) are horizontally arranged.

7. The laser cutting device for door and window processing according to claim 2, characterized in that: The limiting mechanism (5) further comprises a round roller four (510) rotatably mounted on the top of the mounting seat (4), a guide rail two (511) fixedly mounted on the top of the mounting seat (4), and a cylinder one (55); a displacement block two (512) is slidably sleeved on the guide rail two (511); a round roller five (513) is rotatably mounted on the top of the displacement block two (512); the piston rod end of the cylinder one (55) is hinged to the displacement block two (512); and the round roller four (510) and the round roller five (513) are both vertically arranged.

8. The laser cutting device for door and window processing according to claim 1, characterized in that: The mounting seat (4) is provided with a chip removal opening (41).

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