Punching and cutting equipment and method for hardware storage box

Abstract

The invention discloses punching and cutting equipment and method for a hardware storage box, and belongs to the technical field of storage box machining equipment. The invention discloses punching and cutting equipment for a hardware storage box. The punching and cutting equipment comprises a frame body, a supporting plate mechanism, a drilling mechanism, a cutting mechanism and a polishing mechanism. According to the punching and cutting equipment for the hardware storage box, by arranging the frame body, the supporting plate mechanism, the drilling mechanism, the cutting mechanism and the polishing mechanism, multiple functions of drilling, cutting and polishing are integrated, and multiple requirements in the machining process of the hardware storage box can be met; and the supporting plate mechanism can support the base plate through the supporting plate hopper and clamp the base plate through the clamping assembly, so that the stability of the base plate in the machining process is ensured, and machining errors caused by shaking of the base plate are avoided.

Description

Technical Field

[0001] The invention belongs to the technical field of storage box processing equipment, and in particular relates to a punching and cutting device and method for a hardware storage box. Background Art

[0002] Hardware products are auxiliary and accessory products used in daily life and industrial production. In the early days, they were mostly made of metal materials such as gold, silver, copper, iron, and tin, hence the name. In the field of hardware production and processing, storage boxes are a common storage tool, and their manufacturing process requires multiple processes, among which punching and cutting are two crucial links.

[0003] The punching and cutting of traditional hardware storage boxes are mostly done manually or with semi-automatic equipment. This method is not only inefficient, but also difficult to ensure processing accuracy, making it difficult to meet the dual demands of modern industry for product quality and production efficiency. Summary of the invention

[0004] The purpose of the present invention is to provide a punching and cutting device and method for a hardware storage box, which is used to solve the technical problem that the punching and cutting of hardware storage boxes in the prior art are mostly completed by manual operation or semi-automatic equipment. This method is not only inefficient, but also difficult to ensure the processing accuracy, and it is difficult to meet the dual demands of modern industry for product quality and production efficiency.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions: A punching and cutting device for a hardware storage box comprises: a frame; a support plate mechanism for supporting a substrate and driving the substrate to rotate, and comprises: a first motor mounted on the inner bottom surface of the frame; a support plate bucket mounted on the power output shaft of the first motor and used to support the substrate; a clamping assembly for clamping the substrate placed on the support plate bucket; a drilling mechanism mounted on the inner top surface of the frame and used to punch holes in the substrate; a cutting mechanism mounted on the inner top surface of the frame and used to cooperate with the support plate mechanism to cut the substrate into a cross shape; and a grinding mechanism mounted on the inner top surface of the frame and used to grind the cut portion of the substrate.

[0006] Preferably, the clamping assembly includes: two hangers, both installed on the pallet bucket; two slide bars, respectively installed on the two hangers; a cross plate, installed on the pallet bucket; two brackets, respectively slidably connected to the two hangers; two first racks, respectively installed on the two brackets; two slide grooves, respectively opened on the bottom surfaces of the two brackets, respectively slidably connected to the two slide bars; a gear ring, rotatably sleeved on the pallet bucket, meshingly connected to the two first racks; a second motor, installed on the bottom surface of the cross plate; a first gear, installed on the power output shaft of the second motor, meshingly connected to the gear ring.

[0007] Preferably, the drilling mechanism includes: a first hydraulic cylinder mounted on the inner top surface of the frame; a mounting frame mounted on the extended end of the first hydraulic cylinder; three drill rods, all rotatably connected to the mounting frame; three first driven gears, respectively fixedly mounted on the three drill rods, the three first driven gears being meshed and connected in sequence; a third motor mounted in the mounting frame; a first driving gear mounted on the power output shaft of the third motor, meshed and connected with any of the first driven gears; and a clamping assembly, cooperating with the pallet bucket to clamp and fix the base plate.

[0008] Preferably, the clamping assembly includes: a telescopic rod installed on the mounting frame; a pressure plate installed on the extended end of the telescopic rod; and a spring, one end of which is fixedly connected to the pressure plate and the other end of which is fixedly connected to the mounting frame.

[0009] Preferably, the cutting mechanism includes: a mounting plate; a linear drive assembly, used to drive the mounting plate to move reciprocatingly horizontally; two suspension rods, one end of which is fixedly connected to the linear drive assembly, and the other end of which is fixedly connected to the inner top surface of the frame; a laser cutter, mounted on the top surface of the linear drive assembly; two laser cutting heads, both mounted on the mounting plate and connected to the laser cutter.

[0010] Preferably, the grinding mechanism includes: a second hydraulic cylinder mounted on the inner top surface of the frame; a fixed frame mounted on the extended end of the second hydraulic cylinder; two second racks, both mounted on the bottom surface of the fixed frame; a movable frame, slidably connected to the fixed frame; two rotating rods, both rotatably connected to the bottom surface of the movable frame; a second driven gear, fixedly sleeved on any of the rotating rods; two grinding discs, respectively mounted on the two rotating rods; a chain, sleeved on the two rotating rods; a driving assembly, used to drive the movable frame to move and drive the rotating rod to rotate, which includes: a reducer mounted on the movable frame; an incomplete gear, mounted on the output end of the reducer, meshing with the two second racks; a dual-axis motor, mounted on the bottom surface of the movable frame, comprising two power output shafts, the upper power output shaft being connected to the input end of the reducer; a second driving gear, mounted on the lower power output shaft of the dual-axis motor, meshing with the second driven gear.

[0011] Preferably, the punching and cutting equipment of the hardware storage box also includes a control system, which includes: a data acquisition and entry module, which is used to collect comprehensive data information of the punching and cutting equipment, wherein the comprehensive data information includes the temperature of the substrate, the ambient humidity, the thermal conductivity of the substrate and the thickness of the substrate; a data analysis module, which is used to receive the threshold range of the power influence coefficient preset by the user, generate the power influence coefficient according to the comprehensive data information, and then compare the power influence coefficient with the threshold range of the preset power influence coefficient to determine and generate a corresponding power level; a data acquisition module, which is used to collect a historical training data set of the punching and cutting equipment, and the historical training data set includes cutting comprehensive influence data and cutting speed; wherein the cutting comprehensive influence data includes comprehensive data information and output power data of the laser cutter; a speed prediction module, which trains a machine learning model for predicting the cutting speed based on the historical training data set, collects real-time cutting comprehensive influence data, and inputs it into the trained machine learning model to predict the cutting speed.

[0012] Preferably, the power influence coefficient is generated as follows: ; In the formula, is the power influence coefficient, is the temperature of the substrate, is the ambient humidity, is the thermal conductivity of the substrate, is the thickness of the substrate, , , and are weight coefficients, , , and Both are greater than 0.

[0013] Preferably, the power levels include level 1 power, level 2 power and level 3 power, wherein level 1 power, level 2 power and level 3 power increase in sequence; the threshold range of the preset power influence coefficient is , , < ;like , at this time, the data analysis module generates the first-level power; if , at this time, the data analysis module generates secondary power; if ,At this time, the data analysis module generates level 3 power.

[0014] A method for using a punching and cutting device for a hardware storage box, comprising the following steps: Step 1, clamping and fixing: placing a substrate to be processed on the top surface of a pallet bucket; starting a second motor to drive two brackets to move in opposite directions, so that the two brackets clamp and fix the substrate; Step 2, drilling processing: starting a third motor to drive three drill rods to rotate, and then starting a first hydraulic cylinder to drive a mounting frame to move downward, thereby driving a clamping assembly and three rotating drill rods to move downward, so that the three rotating drill rods contact the substrate and drill holes on the substrate; Step 3, cutting processing: starting a laser cutter, cutting the substrate through two laser cutting heads, and then starting a linear drive assembly to drive two laser cutting heads to move, so that the laser cutting heads move while cutting the substrate; Step 4, adjusting the position: drilling and cutting at one time After completion, start the first hydraulic cylinder to separate the clamping assembly from the substrate; then start the first motor to drive the pallet bucket and the two brackets to move, and then drive the substrate to rotate 90°; step five, repeat drilling and cutting: repeat the operations of steps two to four, and drill and cut the substrate four times in total until the substrate is cross-shaped after cutting; step six, grinding: start the drive assembly to drive the movable frame to move, and also drive the two rotating grinding discs to move, and then start the second hydraulic cylinder to drive the fixed frame to move downward, and then drive the rotating grinding disc to move downward, so that the grinding disc grinds the cut part of the substrate; after each grinding is completed, the substrate is driven to rotate 90° through the pallet mechanism to facilitate the grinding mechanism to grind other cut parts of the substrate until all cut parts of the substrate are fully polished.

[0015] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are: 1. The punching and cutting equipment for the hardware storage box of the present invention integrates multiple functions of drilling, cutting and grinding by arranging a frame, a support plate mechanism, a drilling mechanism, a cutting mechanism and a grinding mechanism, and can meet various needs in the processing of the hardware storage box; and the support plate mechanism can support the substrate through the support plate bucket, and clamp the substrate through the clamping assembly, thereby ensuring the stability of the substrate during the processing and avoiding processing errors caused by the shaking of the substrate. The first motor in the support plate mechanism can also drive the support plate bucket and the substrate to rotate 90° each time, which is convenient for the drilling mechanism, the cutting mechanism and the grinding mechanism to process different positions of the substrate, thereby improving the processing flexibility and automation.

[0016] 2. The driving assembly in the present invention is provided with a reducer, an incomplete gear, a dual-axis motor and a second driving gear. The driving assembly can drive the two rotating rods to rotate synchronously through the meshing of the second driving gear and the second driven gear, thereby realizing the synchronous rotation of the two grinding discs, thereby improving the grinding efficiency; the meshing of the incomplete gear in the driving assembly with the two second racks can drive the movable frame and the grinding disc to move back and forth, so that the grinding disc can cover the cutting surface of the substrate, thereby improving the grinding effect.

[0017] 3. The punching and cutting equipment for the hardware storage box in the present invention is equipped with a control system, which can automatically and accurately adjust the output power of the laser cutter according to the comprehensive data information of the substrate, thereby avoiding unnecessary energy waste and reducing the energy consumption of the equipment; and the control system also uses a machine learning model to predict the optimal cutting speed based on historical training data, and adjusts the moving speed of the laser cutting head in real time, making the cutting more efficient and avoiding quality problems caused by too fast or too slow. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 A three-dimensional diagram of a punching and cutting device for a hardware storage box in the present invention; Figure 2 It is a schematic diagram of the assembly structure of the support plate mechanism and the base plate in the present invention; Figure 3 It is a three-dimensional diagram of the support plate mechanism in the present invention; Figure 4 It is a schematic diagram of the assembly structure of the second motor, the first gear and the gear ring in the present invention; Figure 5 A three-dimensional diagram of the drilling mechanism of the present invention; Figure 6 is a schematic diagram of the interior of the mounting frame of the present invention; Figure 7 is a three-dimensional diagram of the cutting mechanism in the present invention; Figure 8 It is a three-dimensional diagram of the grinding mechanism in the present invention; Fig. 9 An exploded view of the grinding mechanism of the present invention; Fig.10 This is a diagram showing the morphological changes of the substrate during processing in the present invention; Fig.11It is a module diagram of the control system in the present invention; Figure numerals: 100, frame; 110, support plate mechanism; 111, first motor; 112, support plate bucket; 1121, discharge chute; 1122, hanger; 1123, slide bar; 1124, cross plate; 113, bracket; 114, first rack; 115, slide chute; 116, gear ring; 117, second motor; 118, first gear; 120, drilling mechanism; 121, first hydraulic cylinder; 122, mounting frame; 123, telescopic rod; 124, pressure plate; 125, spring; 126, drill rod; 127, first driven gear; 128, third motor; 129, first main Drive gear; 130, cutting mechanism; 131, mounting plate; 132, linear drive assembly; 133, suspension rod; 134, laser cutter; 135, laser cutting head; 140, grinding mechanism; 141, second hydraulic cylinder; 142, fixed frame; 143, through slot; 144, second rack; 145, movable frame; 146, rotating rod; 1461, second driven gear; 147, grinding disc; 148, chain; 149, driving assembly; 1491, reducer; 1492, incomplete gear; 1493, dual-axis motor; 1494, second driving gear; 200, substrate. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0021] Example 1: Figure 1 As shown, a punching and cutting device for a hardware storage box includes a frame 100, a support plate mechanism 110, a drilling mechanism 120, a cutting mechanism 130 and a grinding mechanism 140.

[0022] A plurality of diagonal braces are installed on the frame 100. The support plate mechanism 110 is used to support the substrate 200 and drive the substrate 200 to rotate. The support plate mechanism 110 includes a first motor 111, a support plate bucket 112 and a clamping assembly. The first motor 111 is installed on the inner bottom surface of the frame 100; the support plate bucket 112 is installed on the power output shaft of the first motor 111, and the support plate bucket 112 is used to support the substrate 200; the clamping assembly is used to clamp the substrate 200 placed on the support plate bucket 112; wherein, the first motor 111 is a stepping motor, and each time the first motor 111 rotates, it will drive the support plate bucket 112 to rotate 90°. A discharge trough 1121 is provided on the side of the support plate bucket 112, and by providing the discharge trough 1121, it is convenient to remove the debris collected in the support plate bucket 112.

[0023] The drilling mechanism 120 is installed on the inner top surface of the frame 100, and the drilling mechanism 120 is used to drill holes in the substrate 200; the cutting mechanism 130 is installed on the inner top surface of the frame 100, and the cutting mechanism 130 is used to cooperate with the support mechanism 110 to cut the substrate 200 into a cross shape; the grinding mechanism 140 is installed on the inner top surface of the frame 100, and the grinding mechanism 140 is used to grind the cut part of the substrate 200.

[0024] Specifically, the substrate 200 to be processed is placed on the top surface of the plate supporting bucket 112, and then the substrate 200 is clamped by a clamping assembly.

[0025] Then, the substrate 200 is drilled by the drilling mechanism 120, and the substrate 200 is cut by the cutting mechanism 130. After the drilling and cutting are completed, the substrate 200 is rotated 90° by the support mechanism 110, and then other positions of the substrate 200 are drilled and cut by the drilling mechanism 120 and the cutting mechanism 130. Then, the above steps are repeated twice to complete the drilling and cutting of the substrate 200. The substrate 200 after cutting is in a cross shape.

[0026] Then, the cutting part of the substrate 200 is polished by the polishing mechanism 140 . After each polishing is completed, the substrate 200 is rotated 90° by the support plate mechanism 110 to facilitate the polishing mechanism 140 to polish other cutting parts of the substrate 200 .

[0027] After all the cut parts of the substrate 200 are polished, the substrate 200 is released by the clamping assembly to facilitate the removal of the substrate 200. Then, the substrate 200 is bent into a box body with an opening at the top by using a bending device, and finally, the four sides of the box body are welded together by using a welding device, thereby obtaining a hardware storage box with multiple through holes at the bottom.

[0028] like Figure 2-Figure 4 As shown, the clamping assembly includes two hangers 1122 , two slide bars 1123 , a cross plate 1124 , two brackets 113 , two first racks 114 , two slide grooves 115 , a gear ring 116 , a second motor 117 and a first gear 118 .

[0029] The two hangers 1122 are both installed on the pallet bucket 112; the two slide bars 1123 are respectively installed on the two hangers 1122; the cross plate 1124 is installed on the pallet bucket 112; the two brackets 113 are respectively slidably connected to the two hangers 1122, and the end of the bracket 113 away from the pallet bucket 112 is bent upward so that the substrate 200 can be clamped.

[0030] The two first racks 114 are respectively mounted on the two brackets 113; the two slide grooves 115 are respectively opened on the bottom surfaces of the two brackets 113, and the two slide grooves 115 are respectively slidably connected with the two slide bars 1123; the gear ring 116 is rotatably sleeved on the pallet bucket 112, and the gear ring 116 is meshingly connected with the two first racks 114; the second motor 117 is mounted on the bottom surface of the cross plate 1124; the first gear 118 is mounted on the power output shaft of the second motor 117, and the first gear 118 is meshingly connected with the gear ring 116.

[0031] Specifically, when the substrate 200 placed on the pallet bucket 112 needs to be clamped and fixed, the second motor 117 is started, so that the power output shaft of the second motor 117 drives the first gear 118 to rotate, and then the gear ring 116 is driven to rotate by meshing, and the rotating gear ring 116 drives the two first racks 114 to move, and then drives the two brackets 113 to move in opposite directions along the hanger 1122, so that the two brackets 113 clamp and fix the substrate 200. The slide bar 1123 and the slide groove 115 are provided to improve the stability of the bracket 113 when it moves in the hanger 1122.

[0032] like Figure 5 and Figure 6 As shown, the drilling mechanism 120 includes a first hydraulic cylinder 121, a mounting frame 122, three drill rods 126, three first driven gears 127, a third motor 128, a first driving gear 129 and a clamping assembly.

[0033] The first hydraulic cylinder 121 is installed on the inner top surface of the frame 100; the mounting frame 122 is installed on the extended end of the first hydraulic cylinder 121; the three drill rods 126 are rotatably connected to the mounting frame 122; the three first driven gears 127 are respectively fixedly mounted on the three drill rods 126, and the three first driven gears 127 are meshed and connected in sequence; the third motor 128 is installed in the mounting frame 122; the first driving gear 129 is installed on the power output shaft of the third motor 128, and the first driving gear 129 is meshed and connected with any first driven gear 127; the clamping assembly cooperates with the pallet bucket 112 to clamp and fix the base plate 200.

[0034] Specifically, when it is necessary to drill a hole in the substrate 200, the third motor 128 is started so that the power output shaft of the third motor 128 drives the first driving gear 129 to rotate, and then engages and drives the first driven gear 127 to rotate. When one first driven gear 127 rotates, it will drive the other two first driven gears 127 to rotate synchronously. When the three first driven gears 127 rotate, they will drive the three drill rods 126 to rotate at the same time.

[0035] Then, by starting the first hydraulic cylinder 121, the mounting frame 122 is driven to move downward, thereby driving the clamping assembly and the three rotating drill rods 126 to move downward. The clamping assembly will first contact and squeeze the substrate 200, and then the three rotating drill rods 126 will contact and drill holes in the substrate 200.

[0036] like Figure 5 As shown, the clamping assembly includes a telescopic rod 123, a pressing plate 124 and a spring 125. The telescopic rod 123 is mounted on the mounting frame 122; the pressing plate 124 is mounted on the extended end of the telescopic rod 123; one end of the spring 125 is fixedly connected to the pressing plate 124, and the other end of the spring 125 is fixedly connected to the mounting frame 122.

[0037] Specifically, under normal conditions, the position of the pressing plate 124 is lower than the drill rod 126. When the mounting frame 122 moves downward, the pressing plate 124 will first contact the base plate 200, thereby squeezing the telescopic rod 123 and the spring 125, and then the drill rod 126 will contact the base plate 200.

[0038] The resilience of the squeezed spring 125 will continue to push the pressing plate 124 , so that the pressing plate 124 cooperates with the plate supporting bucket 112 to clamp the substrate 200 , thereby improving the stability of the substrate during processing.

[0039] like Figure 7 As shown, the cutting mechanism 130 includes a mounting plate 131 , a linear drive assembly 132 , two suspension rods 133 , a laser cutter 134 and two laser cutting heads 135 .

[0040] The linear drive assembly 132 is used to drive the mounting plate 131 to move back and forth horizontally. The linear drive assembly 132 includes a box body with an opening at the bottom, a drive motor is installed on one side of the box body, a reciprocating screw is installed on the power output shaft of the drive motor, the reciprocating screw extends into the box body and is rotatably connected to the box body, a moving seat is installed on the reciprocating screw, the moving seat is slidably connected to the box body, and the mounting plate 131 is fixedly connected to the moving seat. When the drive motor is running, it will drive the reciprocating screw to rotate, thereby causing the moving seat to reciprocate horizontally along the reciprocating screw, thereby driving the mounting plate 131 to move.

[0041] One end of the two suspension rods 133 is fixedly connected to the linear drive assembly 132, and the other end of the two suspension rods 133 is fixedly connected to the inner top surface of the frame 100; the laser cutter 134 is installed on the top surface of the linear drive assembly 132; the two laser cutting heads 135 are installed on the mounting plate 131, and the two laser cutting heads 135 are connected to the laser cutter 134.

[0042] Specifically, when the substrate 200 needs to be cut, the laser cutter 134 is started, and the substrate 200 is cut by two laser cutting heads 135. During cutting, the linear drive assembly 132 is started to drive the mounting plate 131 to move, and then drive the two laser cutting heads 135 to move, so that the two laser cutting heads 135 cut the substrate 200 while moving.

[0043] like Figure 8 and Fig. 9 As shown, the grinding mechanism 140 includes a second hydraulic cylinder 141 , a fixed frame 142 , two second racks 144 , a movable frame 145 , two rotating rods 146 , a second driven gear 1461 , two grinding discs 147 , a chain 148 and a driving assembly 149 .

[0044] The second hydraulic cylinder 141 is installed on the inner top surface of the frame 100; the fixed frame 142 is installed on the extended end of the second hydraulic cylinder 141; the two second racks 144 are installed on the bottom surface of the fixed frame 142; the movable frame 145 is slidably connected to the fixed frame 142; a through groove 143 is opened on the side of the fixed frame 142, and the top of the movable frame 145 is bent inward, and the bent part passes through the through groove 143 and is slidably connected to the through groove 143, which also allows the movable frame 145 to move along the fixed frame 142.

[0045] The two rotating rods 146 are both rotatably connected to the bottom surface of the movable frame 145, and sprockets are installed on the two rotating rods 146; the second driven gear 1461 is fixedly mounted on any rotating rod 146; the two grinding discs 147 are respectively mounted on the two rotating rods 146; the chain 148 is mounted on the two sprockets; the driving assembly 149 is used to drive the movable frame 145 to move and drive the rotating rod 146 to rotate.

[0046] Specifically, when the driving assembly 149 is running, it will drive a rotating rod 146 to move. Since the two rotating rods 146 are connected by a sprocket and a chain 148, when one rotating rod 146 rotates, the other rotating rod 146 will also rotate synchronously. When the two rotating rods 146 rotate, they will drive the two grinding discs 147 to rotate.

[0047] When the driving assembly 149 is running, it will drive the movable frame 145 to move, and then drive the two rotating grinding discs 147 to move.

[0048] like Fig. 9 As shown, the driving assembly 149 includes a reducer 1491 , an incomplete gear 1492 , a dual-axis motor 1493 and a second driving gear 1494 .

[0049] The reducer 1491 is installed on the movable frame 145; the incomplete gear 1492 is installed at the output end of the reducer 1491 and meshes with the two second racks 144; the dual-axis motor 1493 is installed on the bottom surface of the movable frame 145, and the dual-axis motor 1493 includes two power output shafts, namely an upper power output shaft and a lower power output shaft, and the upper power output shaft is connected to the input end of the reducer 1491; the second driving gear 1494 is installed on the lower power output shaft of the dual-axis motor 1493, and the second driving gear 1494 is meshed and connected with the second driven gear 1461.

[0050] Specifically, when the dual-axis motor 1493 is running, the upper power output shaft and the lower power output shaft will rotate. The lower power output shaft will drive the second driving gear 1494 to rotate, and then mesh with the second driven gear 1461 to rotate, and then drive a rotating rod 146 to rotate.

[0051] The upper power output shaft will drive the incomplete gear 1492 to rotate through the reducer 1491. When the incomplete gear 1492 rotates, it will alternately mesh with the two second racks 144. When the rotating incomplete gear 1492 is meshed with the second racks 144, it will drive the reducer 1491 to move, and then drive the movable frame 145 to move; and when the rotating incomplete gear 1492 is alternately meshed with the two second racks 144, the reducer 1491 and the movable frame 145 will move back and forth.

[0052] Working principle: When in use, the substrate 200 to be processed is placed on the top surface of the pallet bucket 112, and then the second motor 117 is started, so that the power output shaft of the second motor 117 drives the first gear 118 to rotate, and then the gear ring 116 is driven to rotate by meshing. The rotating gear ring 116 drives the two first racks 114 to move, and then drives the two brackets 113 to move in opposite directions along the hanger 1122, so that the two brackets 113 clamp and fix the substrate 200.

[0053] Then, by starting the third motor 128, the power output shaft of the third motor 128 drives the first driving gear 129 to rotate, and then engages and drives the first driven gear 127 to rotate. When one first driven gear 127 rotates, it will drive the other two first driven gears 127 to rotate synchronously. When the three first driven gears 127 rotate, they will drive the three drill rods 126 to rotate at the same time.

[0054] Then, by starting the first hydraulic cylinder 121, the mounting frame 122 is driven to move downward, and then the clamping assembly and the three rotating drill rods 126 are driven to move downward. The pressing plate 124 will first contact the substrate 200, so that the pressing plate 124 cooperates with the pallet bucket 112 to squeeze and fix the substrate 200; then, as the first hydraulic cylinder 121 continues to extend downward, the rotating drill rod 126 contacts the substrate 200 and drills holes in the substrate 200.

[0055] Then, by starting the laser cutter 134, the substrate 200 is cut by two laser cutting heads 135. During cutting, by starting the linear drive assembly 132, the mounting plate 131 is driven to move, and then the two laser cutting heads 135 are driven to move, so that the two laser cutting heads 135 cut the substrate 200 while moving.

[0056] After one drilling and cutting is completed, the first hydraulic cylinder 121 is started to drive the drill rod 126 and the clamping assembly to move upward, so that the clamping assembly is separated from the substrate 200, and then the first motor 111 is started so that the power output shaft of the first motor 111 drives the pallet bucket 112 and the two brackets 113 to move, thereby driving the substrate 200 to rotate 90°, and then repeat the above steps to drill and cut the substrate 200 using the drilling mechanism 120 and the cutting mechanism 130.

[0057] Then, the above steps are repeated twice to complete the drilling and cutting of the substrate 200 (a total of four drilling and cutting are performed on the substrate 200 ). After the cutting, the substrate 200 is in a cross shape.

[0058] Then, the upper power output shaft and the lower power output shaft of the dual-axis motor 1493 are rotated simultaneously through the dual-axis motor 1493; the lower power output shaft will drive the second driving gear 1494 to rotate, and then mesh and drive the second driven gear 1461 to rotate, and then drive a rotating rod 146 to rotate. Since the two rotating rods 146 are connected by a sprocket and a chain 148, when one rotating rod 146 rotates, the other rotating rod 146 will also rotate synchronously. When the two rotating rods 146 rotate, they will drive the two grinding discs 147 to rotate.

[0059] The upper power output shaft will drive the incomplete gear 1492 to rotate through the reducer 1491. When the incomplete gear 1492 rotates, it will alternately mesh with the two second racks 144. When the rotating incomplete gear 1492 is meshed with the second racks 144, it will drive the reducer 1491 to move, and then drive the movable frame 145 to move; and when the rotating incomplete gear 1492 is alternately meshed with the two second racks 144, the reducer 1491 and the movable frame 145 will move back and forth.

[0060] Then, the second hydraulic cylinder 141 is started to drive the fixed frame to move downward, thereby driving the movable frame 145 and the rotating grinding disc 147 to move downward, so that the grinding disc 147 grinds the cut portion of the substrate 200. Since the fixed frame will move back and forth left and right, it will also drive the rotating grinding disc 147 to move while grinding the substrate 200.

[0061] After each grinding is completed, the substrate 200 is driven to rotate 90° by the support plate mechanism 110 to facilitate the grinding mechanism 140 to grind other cut portions of the substrate 200 .

[0062] When the cut portion of the substrate 200 is polished, the substrate 200 can be pressed and fixed by a pressing assembly.

[0063] After all the cut parts of the substrate 200 are polished, the substrate 200 is released by the clamping assembly to facilitate the removal of the substrate 200. Then, the substrate 200 is bent into a box body with an opening at the top by using a bending device, and finally, the four sides of the box body are welded together by using a welding device, thereby obtaining a hardware storage box with multiple through holes at the bottom.

[0064] The processing of the substrate 200 is as follows Fig.10 As shown, there is the initial state, the state after the first drilling and cutting, the state after the second drilling and cutting, the state after the third drilling and cutting, the state after the fourth drilling and cutting, and the state after bending and welding.

[0065] Example 2: Figure 1 , Figure 7 and Fig.11 As shown, when other parts are the same as those in Example 1, the difference between this embodiment and Example 1 is that a punching and cutting device for a hardware storage box also includes a control system. The control system includes: a data collection and input module, a data analysis module, a data acquisition module and a speed prediction module, and the modules are connected by wired / wireless means to realize data transmission.

[0066] The data collection and input module is used to collect comprehensive data information of the punching and cutting equipment, wherein the comprehensive data information includes the temperature of the substrate 200 , the ambient humidity, the thermal conductivity of the substrate 200 , and the thickness of the substrate 200 .

[0067] Specifically, the temperature of the substrate 200 can be measured by an infrared thermometer or a temperature sensor, and the temperature of the substrate 200 is real-time measurement data; The ambient humidity is the ambient humidity of the workshop where the substrate 200 is processed. The ambient humidity can be measured using a humidity sensor. The ambient humidity is real-time measurement data. The thermal conductivity of the substrate 200 is user-entered data. By using a steady-state thermal conductivity test instrument (such as a laser flash analyzer), a sample thermal conductivity performance test is performed on the substrates 200 of the same batch, and data is obtained. Then, the obtained data is uploaded to the data acquisition and input module, and the data is used as the common data of the thermal conductivity of the processed substrates 200 of this batch; The thickness of the substrate 200 can be measured by a laser rangefinder, and the thickness of the substrate 200 is real-time data.

[0068] The data analysis module receives the threshold range of the power impact coefficient preset by the user, generates the power impact coefficient according to the comprehensive data information, and then compares the power impact coefficient with the threshold range of the preset power impact coefficient to determine and generate the corresponding power level; The power influence factor is generated as follows: ; In the formula, is the power influence coefficient, is the temperature of the substrate 200, is the ambient humidity, is the thermal conductivity of the substrate 200, is the thickness of the substrate 200, , , and are weight coefficients, , , and All are greater than 0; , , and It is determined by those skilled in the art according to specific application requirements.

[0069] The higher the temperature of the substrate 200, the closer its surface is to the melting point or evaporation point, the less energy the laser needs, and thus the easier it is to cut. Therefore, the lower the power of the laser cutter 134 is. On the contrary, the lower the temperature of the substrate 200, the faster the heat conduction and loss, making cutting more difficult. Therefore, the higher the power of the laser cutter 134 is.

[0070] The higher the ambient humidity, the more moisture in the air will enter the cutting area, and the moisture will absorb the laser energy and cause the beam to attenuate, thereby increasing the difficulty of cutting. Therefore, the required power of the laser cutter 134 will be higher. In addition, when the ambient humidity is too high, it will cause condensation on the surface of the substrate 200, further affecting the effect of the laser and further increasing the difficulty of cutting. Conversely, when the ambient humidity is low, the difficulty of cutting will decrease, so the required power of the laser cutter 134 will be lower.

[0071] The higher the thermal conductivity of the substrate 200, the faster the substrate 200 will dissipate the heat in the cutting area, making it impossible for the laser energy to be concentrated in the local area, resulting in increased difficulty in cutting. Therefore, the required power of the laser cutter 134 is higher; conversely, the lower the thermal conductivity of the substrate 200, the better it can concentrate heat, the higher the melting efficiency, and the relatively easier the cutting. Therefore, the required power of the laser cutter 134 is lower.

[0072] The thicker the substrate 200 is, the longer the path the laser needs to penetrate the substrate 200 is, the larger the heat dissipation area is, and the thicker the substrate 200 is, the more difficult it is to cut, so the required power of the laser cutter 134 is higher; conversely, the thinner the substrate 200 is, the faster the laser energy can penetrate during cutting, and the difficulty is lower, so the required power of the laser cutter 134 is lower.

[0073] It should be noted that the formulas involved in the above-mentioned are all calculated by removing dimensions and taking numerical values. They are a formula that is closest to the actual situation obtained by collecting a large amount of data and performing software simulation. The weight coefficients in the formulas and the various preset thresholds in the analysis process are set by technical personnel in this field according to actual conditions or obtained by simulating a large amount of data; the size of the weight coefficient is to quantify each parameter to obtain a specific value for subsequent comparison. The size of the weight coefficient depends on the amount of sample data and the corresponding processing coefficients initially set by technical personnel in this field for each group of sample data; as long as it does not affect the proportional relationship between the parameters and the quantized values.

[0074] The power levels are generated as follows: The power levels include level 1 power, level 2 power and level 3 power, where level 1 power, level 2 power and level 3 power increase in sequence, and level 1 power, level 2 power and level 3 power are all output powers of the laser welder; The threshold range of the preset power influence coefficient is , , < ; like , indicating that the cutting difficulty is relatively low, at this time, the data analysis module generates the first-level power; like ,At this time, the data analysis module generates secondary power; like , indicating that the cutting difficulty is high. At this time, the data analysis module generates level 3 power.

[0075] in, and It is determined by those skilled in the art according to specific application requirements.

[0076] According to the corresponding power level, the data analysis module generates a corresponding power level control signal. For example, when the power level is level one, the data analysis module generates a level one power control signal, and then sends the level one power control signal to the controller of the laser cutter 134, thereby controlling and adjusting the output power of the laser cutter 134.

[0077] A data acquisition module is used to collect a historical training data set of the punching and cutting equipment, wherein the historical training data set includes cutting comprehensive impact data and cutting speed; wherein the cutting comprehensive impact data includes comprehensive data information and output power data of the laser cutter 134, and the output power data of the laser cutter 134 can be obtained by measuring with a power meter; The cutting speed refers to the moving speed of the laser cutting head 135 , and the moving speed of the laser cutting head 135 can be measured and obtained by a displacement sensor.

[0078] The speed prediction module trains a machine learning model to predict the cutting speed based on the historical training data set, collects real-time cutting comprehensive impact data, and inputs it into the trained machine learning model to predict the cutting speed; The training method of the machine learning model to predict cutting speed includes: Convert the collected cutting comprehensive impact data into a corresponding set of feature vectors; Each group of feature vectors is used as the input of the machine learning model. The machine learning model takes the cutting speed corresponding to each group of cutting comprehensive impact data as the output, the cutting speed actually corresponding to each group of cutting comprehensive impact data is used as the prediction target, and minimizing the loss function value of the machine learning model is used as the training target; training is stopped when the loss function value of the machine learning model is less than or equal to the preset target loss value.

[0079] The machine learning model can be one of the models such as SVM regression, random forest regression or neural network regression.

[0080] The machine learning model loss function value is the mean square error; Mean square error is one of the commonly used loss functions. Minimization is used as the goal to train the model so that the machine learning model better fits the data, thereby improving the performance and accuracy of the model; In the loss function is the loss function value of the machine learning model, x is the feature vector group number; m is the number of feature vector groups; is the cutting speed predicted by the x-th group of feature vectors, is the actual cutting speed corresponding to the xth group of eigenvectors; Other model parameters of the machine learning model, target loss value, optimization algorithm, training set test set validation set ratio, and loss function optimization are all achieved through actual engineering implementation and continuous experimental tuning.

[0081] The speed at which the linear drive assembly 132 drives the mounting plate to move is controlled according to the predicted cutting speed; when the speed at which the linear drive assembly 132 drives the mounting plate to move is the same as the predicted cutting speed, the speed at which the linear drive assembly 132 drives the mounting plate to move is maintained at this moment.

[0082] In summary, the control system can automatically and accurately adjust the output power of the laser cutter 134 according to the comprehensive data information of the substrate 200, thereby avoiding unnecessary energy waste and reducing the energy consumption of the equipment.

[0083] The control system also uses a machine learning model to predict the optimal cutting speed based on historical training data, and adjusts the moving speed of the laser cutting head 135 in real time, making the cutting more efficient and avoiding quality problems caused by too fast or too slow.

[0084] Example 3: Figure 1-Figure 10 As shown, a working method of a punching and cutting device for a hardware storage box comprises the following steps: Step 1: clamping and fixing: place the substrate 200 to be processed on the top surface of the support plate bucket 112 of the support plate mechanism 110; start the second motor 117 so that its power output shaft drives the first gear 118 to rotate; the first gear 118 is meshed and connected with the gear ring 116, and the rotating gear ring 116 drives the two first racks 114 to move in opposite directions; and then drives the two brackets 113 to move in opposite directions, so that the two brackets 113 clamp and fix the substrate 200; Step 2: Drilling: Start the drilling mechanism 120, the first hydraulic cylinder 121 drives the mounting frame 122 to move downward, and then drives the clamping assembly and the three rotating drill rods 126 to move downward; the clamping assembly first contacts the substrate 200 and squeezes and fixes the substrate 200, and then the three rotating drill rods 126 contact the substrate 200 and drill holes on the substrate 200; Step 3: Cutting: Start the laser cutter 134, and cut the substrate 200 through the two laser cutting heads 135, then start the linear drive assembly 132 to drive the mounting plate 131 to move, and then drive the two laser cutting heads 135 to move, so that the laser cutting heads 135 move while cutting the substrate; Step 4: Adjust the position: After drilling and cutting are completed, start the first hydraulic cylinder 121 to drive the drill rod 126 and the clamping assembly to move upward, so that the clamping assembly is separated from the substrate 200; start the first motor 111, so that its power output shaft drives the pallet bucket 112 and the two brackets 113 to move, thereby driving the substrate 200 to rotate 90°; Step 5, repeat drilling and cutting: repeat the operations of step 2 to step 4, and perform drilling and cutting on the substrate 200 four times in total, until the substrate 200 is in a cross shape after cutting; Step 6: Grinding: Start the driving assembly 149 to drive the movable frame 145 to move and the two grinding discs 147 to rotate, and then start the second hydraulic cylinder 141 to drive the fixed frame to move downward, thereby driving the movable frame 145 and the rotating grinding discs 147 to move downward, so that the grinding discs 147 grind the cut portion of the substrate 200; After each grinding is completed, the substrate 200 is rotated 90° by the support plate mechanism 110, so that the grinding mechanism 140 can grind other cut portions of the substrate 200, until all cut portions of the substrate 200 are completely ground. Step 7: Removing the material: After polishing is completed, the substrate 200 is released by the clamping assembly to facilitate the removal of the substrate 200; Step 8, bending and welding: Finally, use a bending device to bend the substrate 200 into a box body with an opening at the top; then use a welding device to weld the four sides of the box body together, thereby obtaining a hardware storage box with multiple through holes at the bottom.

[0085] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

[0086] The preferred embodiments of the present invention disclosed above are only used to help explain the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to only specific implementation methods. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can understand and use the present invention well. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A punching and cutting device for a hardware storage box, characterized in that: include: Frame (100); The support plate mechanism (110) is used to support the substrate (200) and drive the substrate (200) to rotate, and comprises: A first motor (111) is mounted on the inner bottom surface of the frame (100); A plate supporting bucket (112), mounted on the power output shaft of the first motor (111), and used for supporting a base plate (200); A clamping assembly, used for clamping a base plate (200) placed on the plate supporting bucket (112); A drilling mechanism (120) is installed on the inner top surface of the frame (100) and is used to drill holes in the substrate (200); A cutting mechanism (130) is mounted on the inner top surface of the frame (100) and is used to cooperate with the support plate mechanism (110) to cut the base plate into a cross shape; A grinding mechanism (140) is installed on the inner top surface of the frame (100) and is used to grind the cut portion of the substrate (200).

2. The punching and cutting device for a hardware storage box according to claim 1, characterized in that: The clamping assembly comprises: Two hangers (1122), both mounted on the pallet bucket (112); Two slide bars (1123) are respectively mounted on the two hangers (1122); A transverse plate (1124) mounted on the plate supporting bucket (112); Two brackets (113) are slidably connected to the two hangers (1122) respectively; Two first racks (114) are respectively mounted on the two brackets (113); Two slide grooves (115) are respectively provided on the bottom surfaces of the two brackets (113) and are respectively slidably connected to the two slide bars (1123); A gear ring (116) is rotatably sleeved on the pallet bucket (112) and meshedly connected with the two first racks (114); A second motor (117) is mounted on the bottom surface of the horizontal plate (1124); The first gear (118) is mounted on the power output shaft of the second motor (117) and is meshingly connected with the gear ring (116).

3. The punching and cutting device for a hardware storage box according to claim 1, characterized in that: The drilling mechanism (120) comprises: A first hydraulic cylinder (121) is mounted on the inner top surface of the frame (100); A mounting frame (122) mounted on an extended end of the first hydraulic cylinder (121); Three drill rods (126), all rotatably connected to the mounting frame (122); Three first driven gears (127) are respectively fixedly sleeved on the three drill rods (126), and the three first driven gears (127) are meshed and connected in sequence; A third motor (128) is mounted in the mounting frame (122); A first driving gear (129) is mounted on the power output shaft of the third motor (128) and is meshedly connected with any one of the first driven gears (127); A pressing assembly cooperates with the plate supporting bucket (112) to press and fix the base plate (200).

4. The punching and cutting device for a hardware storage box according to claim 3, characterized in that: The clamping assembly comprises: A telescopic rod (123) mounted on the mounting frame (122); A pressing plate (124) mounted on the extended end of the telescopic rod (123); A spring (125) has one end fixedly connected to the pressing plate (124) and the other end fixedly connected to the mounting frame (122).

5. The punching and cutting device for a hardware storage box according to claim 1, characterized in that: The cutting mechanism (130) comprises: Mounting plate (131); A linear drive assembly (132) for driving the mounting plate (131) to move reciprocatingly horizontally; Two suspension rods (133), one end of each of which is fixedly connected to the linear drive assembly (132), and the other end of each of which is fixedly connected to the inner top surface of the frame (100); A laser cutter (134) mounted on the top surface of the linear drive assembly (132); Two laser cutting heads (135) are both mounted on the mounting plate (131) and are both connected to the laser cutter (134).

6. The punching and cutting device for a hardware storage box according to claim 5, characterized in that: The grinding mechanism (140) comprises: A second hydraulic cylinder (141) is mounted on the inner top surface of the frame (100); A fixing frame (142) mounted on an extended end of the second hydraulic cylinder (141); Two second racks (144) are both mounted on the bottom surface of the fixing frame (142); A movable frame (145) is slidably connected to the fixed frame (142); Two rotating rods (146) are both rotatably connected to the bottom surface of the movable frame (145); A second driven gear (1461) fixedly sleeved on any one of the rotating rods (146); Two grinding discs (147) are respectively mounted on the two rotating rods (146); A chain (148) sleeved on the two rotating rods (146); A driving assembly (149) is used to drive the movable frame (145) to move and drive the rotating rod (146) to rotate, and comprises: A reducer (1491) mounted on the movable frame (145); An incomplete gear (1492) is mounted at the output end of the reducer (1491) and meshes with the two second racks (144); A dual-axis motor (1493) is mounted on the bottom surface of the movable frame (145), comprising two power output shafts, wherein the upper power output shaft is connected to the input end of the reducer (1491); The second driving gear (1494) is mounted on the lower power output shaft of the dual-shaft motor (1493) and is meshedly connected with the second driven gear (1461).

7. The punching and cutting device for a hardware storage box according to claim 5, characterized in that: Also included is a control system, the control system comprising: A data collection and input module, used to collect comprehensive data information of the punching and cutting equipment, wherein the comprehensive data information includes the temperature of the substrate (200), the ambient humidity, the thermal conductivity of the substrate (200), and the thickness of the substrate (200); A data analysis module is used to receive a threshold range of a power impact coefficient preset by a user, generate a power impact coefficient according to the comprehensive data information, and then compare the power impact coefficient with the threshold range of a preset power impact coefficient to determine and generate a corresponding power level; A data acquisition module, used for collecting a historical training data set of the punching and cutting equipment, the historical training data set including cutting comprehensive impact data and cutting speed; wherein the cutting comprehensive impact data includes comprehensive data information and output power data of the laser cutter (134); The speed prediction module trains a machine learning model to predict the cutting speed based on a historical training data set, collects real-time cutting comprehensive impact data, and inputs it into the trained machine learning model to predict the cutting speed.

8. The punching and cutting device for a hardware storage box according to claim 7, characterized in that: The power influence coefficient is generated as follows: ； In the formula, is the power influence coefficient, is the temperature of the substrate (200), is the ambient humidity, is the thermal conductivity of the substrate (200), is the thickness of the substrate (200), , , and are weight coefficients, , , and Both are greater than 0.

9. The punching and cutting device for a hardware storage box according to claim 8, characterized in that: The power levels include primary power, secondary power and tertiary power, wherein primary power, secondary power and tertiary power increase in sequence; The threshold range of the preset power influence coefficient is , , < ; like ,At this time, the data analysis module generates the first-level power; like ,At this time, the data analysis module generates secondary power; like ,At this time, the data analysis module generates level 3 power.

10. A method for using the punching and cutting device for a hardware storage box according to claim 1, characterized in that: The following steps are involved: Step 1: clamping and fixing: placing the substrate (200) to be processed on the top surface of the support plate bucket (112); starting the second motor (117) to drive the two brackets (113) to move in opposite directions, so that the two brackets (113) clamp and fix the substrate (200); Step 2: drilling: starting the third motor (128) to drive the three drill rods (126) to rotate, then starting the first hydraulic cylinder (121) to drive the mounting frame (122) to move downward, thereby driving the clamping assembly and the three rotating drill rods (126) to move downward, so that the three rotating drill rods (126) contact the substrate (200) and drill holes on the substrate (200); Step 3: Cutting: Start the laser cutter (134) to cut the substrate (200) via the two laser cutting heads (135), and then start the linear drive assembly (132) to drive the two laser cutting heads (135) to move, so that the laser cutting heads (135) cut the substrate (200) while moving; Step 4: Adjusting the position: After drilling and cutting are completed, the first hydraulic cylinder (121) is started to separate the clamping assembly from the base plate (200); the first motor (111) is then started to drive the plate support bucket (112) and the two brackets (113) to move, thereby driving the base plate (200) to rotate 90 degrees; Step 5, repeat drilling and cutting: repeat the operations of step 2 to step 4, and perform drilling and cutting on the substrate (200) four times in total, until the substrate (200) is in a cross shape after cutting; Step 6: grinding: start the driving assembly (149) to drive the movable frame (145) to move, and also drive the two rotating grinding discs (147) to move, and then start the second hydraulic cylinder (141) to drive the fixed frame to move downward, thereby driving the rotating grinding disc (147) to move downward, and then the grinding disc (147) grinds the cut portion of the substrate (200); after each grinding is completed, the substrate (200) is driven to rotate 90 degrees through the support plate mechanism (110), so that the grinding mechanism (140) can grind other cut portions of the substrate (200), until all the cut portions of the substrate (200) are completely ground.

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