Diamond grinding device for metal target material and working method of diamond grinding device

Abstract

The invention discloses a diamond grinding device for a metal target material and a working method of the diamond grinding device, and relates to the technical field of metal target material grinding devices.The diamond grinding device comprises a workbench, a first mounting frame is arranged on the workbench, and a grinder with a grinding head is mounted on the first mounting frame; the first mounting frame and the polisher are provided with driving parts, and the driving parts are used for driving the polishing head to rotate so as to adjust the polishing angle of the base material, so that the grinding material on the side face of the polishing head can be evenly consumed by the base material. By arranging the driving piece and the positioning mechanism, the driving piece controls the grinding head on the grinder to rotate and adjust the angle of the grinding head, so that the axis of the grinding head and the surface of a base material form a proper inclined angle, the contact area of the side face of the grinding head and the base material is allowed to be increased, and it is ensured that grinding materials are evenly abraded in the using process; and therefore, the grinding quality and efficiency of the base material can be guaranteed, the stability of the base material in the grinding process is guaranteed, and the base material is prevented from being damaged.

Description

Technical Field

[0001] The invention relates to the technical field of metal target grinding devices, and in particular to a diamond grinding device for metal targets and a working method thereof. Background Art

[0002] In the field of semiconductor manufacturing, silicon wafers are usually used as substrate materials. Metal atoms or molecules are deposited on the surface of the silicon wafers through advanced processes such as physical vapor deposition (PVD) or sputtering coating to form metal targets. Subsequently, the deposited metal layer is finely polished using the polishing device of the present invention to ensure that its surface quality and accuracy meet high standards.

[0003] In the prior art, a diamond grinding head is generally used to grind metal targets. When grinding thin plate-type metal targets such as silicon wafers, traditional grinding equipment is designed to keep the disc-shaped grinding head in parallel contact with the substrate for grinding.

[0004] However, the above-mentioned diamond grinding device still has the following defects in the process of grinding the metal target:

[0005] During the grinding process of metal targets, the grinding head used is usually thicker than the substrate. As the abrasive gradually wears out during use, not all of it can maintain continuous contact with the side of the substrate. This can cause subtle dents on the grinding head, which can affect the grinding quality as the grinding process continues. Especially for thin and fragile substrate materials like silicon wafers, uneven abrasive wear can cause uneven pressure distribution during grinding, thereby reducing the grinding effect and may even cause damage to the substrate. Summary of the invention

[0006] In order to overcome the above-mentioned technical problems, the purpose of the present invention is to provide a diamond grinding device for metal targets and a working method thereof, so as to solve the problem that the existing diamond grinding device for metal targets proposed in the above-mentioned background technology is prone to uneven abrasive loss, which will cause uneven pressure distribution on the substrate during grinding, thereby reducing the grinding effect.

[0007] The purpose of the present invention can be achieved by the following technical solutions:

[0008] A diamond grinding device for a metal target material comprises a workbench, on which a first mounting frame is arranged, on which a grinder with a grinding head is mounted; the first mounting frame and the grinder are provided with a driving member; the driving member is used to drive the grinding head to rotate to adjust the grinding angle of the substrate so that the abrasive on the side of the grinding head can be evenly consumed by the substrate;

[0009] The workbench is provided with a positioning mechanism; the positioning mechanism comprises a suction control mechanism and a plurality of suction cups, and is used for locking the position of the substrate.

[0010] Preferably, the suction control mechanism is disposed above the workbench, and a plurality of the suction cups are disposed between the substrate and the suction control mechanism; the suction control mechanism is used to control the suction cups to adsorb or detach from the substrate.

[0011] Preferably, the suction control mechanism includes an elastic airbag and a squeezing mechanism; the elastic airbag is arranged above the workbench, and the interior of the elastic airbag is connected to the suction cup; the squeezing mechanism is arranged above the workbench and is used to control the pressure inside the elastic airbag.

[0012] Preferably, the extrusion mechanism includes a mounting block, a third slider, a pressure plate, a pair of rotating rods and a first slider; the mounting block is arranged on the workbench, the third slider is slidably connected to the mounting block, a compression spring is arranged between the mounting block and the third slider, the pressure plate is arranged between the elastic airbag and the third slider, one end of the pair of rotating rods are hinged to the pressure plate, and a torsion spring is arranged between the rotating rod and the pressure plate; the first slider is arranged on the rotating rod, an annular groove is opened on the third slider, and the first slider is slidably connected to the annular groove.

[0013] Preferably, the annular slide groove includes a protrusion, a recessed portion and a guide portion; the hinge point between the rotating rod and the pressure plate, the first slider and the recessed point of the recessed portion are on the same straight line, and the protrusion and the guide portion are on the same side of the straight line, so that the first slider can continue to slide in the same direction of the annular slide groove.

[0014] Preferably, the suction control mechanism also includes a driving mechanism, which includes a cylinder, a push plate, a connecting shaft and a push block; one end of the connecting shaft is fixed to the third slider, the push block is fixed to the other end of the connecting shaft, and the connecting shaft is slidably connected to the mounting block along its axis; the cylinder is installed on the workbench, the push plate is fixed to the output end of the cylinder, and the push plate and the push block are arranged in alignment.

[0015] Preferably, a position adjustment mechanism is provided on the workbench; the position adjustment mechanism is used to adjust the positions of a plurality of suction cups so that the suction cups can be adsorbed on different positions of the substrate.

[0016] Preferably, the position adjustment mechanism includes a second mounting frame, a turntable, a plurality of connecting rods and a second slider; the second mounting frame is arranged on the workbench, the turntable rotates around its center and is connected to the second mounting frame, the plurality of connecting rods are slidably connected to the turntable along their length direction, the second slider is arranged on the connecting rod, the turntable is provided with an arc-shaped groove, and the second slider is slidably connected to the arc-shaped groove; the suction cup, elastic airbag and mounting block are all arranged on the connecting rod, the connecting rod is provided with a through hole, and the interior of the elastic airbag is connected to the suction cup through the through hole.

[0017] Preferably, the second mounting frame is rotatably connected to the workbench around the center of the turntable, a motor is installed at the bottom end of the workbench, and an output end of the motor is connected to the second mounting frame.

[0018] A working method of a diamond grinding device for a metal target comprises the following steps:

[0019] Step 1: Positioning: The substrate is positioned and fixed by the positioning mechanism so that the position where the positioning mechanism is adsorbed on the substrate is close to the edge of the substrate;

[0020] Step 2: Angle adjustment: After the substrate is positioned, the grinding head on the grinder is driven to rotate by the driving member to adjust the grinding angle of the substrate.

[0021] Beneficial effects of the present invention:

[0022] 1. By setting a driving part and a positioning mechanism, the driving part controls the grinding head on the grinder to rotate, and the angle of the grinding head is adjusted so that its axis forms an appropriate inclination angle with the surface of the substrate, thereby allowing the contact area between the side of the grinding head and the substrate to increase, ensuring uniform wear of the abrasive during use; thereby ensuring the quality and efficiency of the substrate grinding in order to ensure the stability of the substrate during the grinding process and avoid damage to it;

[0023] 2. By setting up a suction cup and a suction control mechanism, and using a squeezing mechanism to control the elastic airbag, a negative pressure is formed inside the elastic airbag, which is then converted into a firm adsorption force of the suction cup on the substrate; when the adsorption needs to be released, the squeezing mechanism is used again to act on the elastic airbag to destroy the vacuum state between it and the substrate, so that the substrate can be easily removed. The whole process can not only ensure the stable fixation of the substrate during the grinding operation, but also flexibly adjust the position of each suction cup according to the actual grinding needs, optimize the fixation effect of the substrate, and improve work efficiency;

[0024] 3. By setting a position adjustment mechanism, the suction position of the suction cup on the substrate is adjusted so that the suction point is closer to the edge of the substrate, thereby enhancing the stability of the substrate when subjected to force and reducing the risk of damage caused by angle grinding;

[0025] 4. The second mounting frame is driven to rotate synchronously by the motor, so that the substrate can rotate synchronously while the grinding head is rotating and grinding. This design ensures that the side of the substrate can receive comprehensive and uniform grinding treatment, which not only improves the quality and efficiency of grinding, but also ensures the consistency of the surface treatment of the substrate. This method effectively improves the accuracy and effect of the entire grinding process, ensuring that every part can receive uniform and consistent treatment;

[0026] 5. By setting up a linear module, in order to ensure the quality and efficiency of grinding, during the process of the grinding head processing the substrate, as the grinding degree gradually deepens and the abrasive is continuously consumed, the linear module drives the grinding head on the first mounting frame to gradually approach the substrate and implement precise feeding. This can compensate for the distance change caused by abrasive wear and maintain a constant contact pressure, thereby ensuring the consistency and efficiency of the entire grinding process. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The present invention will be further described below in conjunction with the accompanying drawings.

[0028] Figure 1 It is a schematic diagram of the overall first-view stereoscopic structure of the present invention;

[0029] Figure 2 is a schematic diagram of the overall second viewing angle stereoscopic structure of the present invention;

[0030] Figure 3 It is a three-dimensional structural schematic diagram of a metal target material in a grinding state using a diamond grinding device;

[0031] Figure 4 It is a schematic diagram of the three-dimensional structure of the present invention after removing the substrate;

[0032] Figure 5 It is a three-dimensional enlarged structural schematic diagram of the positioning mechanism of the present invention;

[0033] Figure 6 It is a schematic diagram of the three-dimensional exploded structure of the positioning mechanism of the present invention;

[0034] Figure 7 It is a three-dimensional enlarged structural schematic diagram of the extrusion mechanism of the present invention;

[0035] Figure 8 It is a schematic diagram of a three-dimensional exploded and enlarged structure of the extrusion mechanism of the present invention;

[0036] Fig. 9 This is a schematic diagram of the main-view enlarged structure of the third slider of the present invention;

[0037] Fig.10 It is a flow chart of the method of the present invention.

[0038] In the figure: 1. workbench; 2. first mounting frame; 3. grinder; 4. grinding head; 5. driving member; 6. positioning mechanism; 61. suction cup; 62. suction control mechanism; 621. elastic airbag; 622. extrusion mechanism; 6221. mounting block; 6222. third slider; 6223. annular slide groove; 62231. raised portion; 62232. recessed portion; 62233. guide portion; 6224. pressing plate; 6225. rotating rod; 6226. first slider; 6227. connecting shaft; 6228. push block; 623. driving mechanism; 6231. cylinder; 6232. push plate; 63. position adjustment mechanism; 631. second mounting frame; 632. turntable; 633. arc slide groove; 634. connecting rod; 635. second slider; 7. substrate; 8. motor. DETAILED DESCRIPTION

[0039] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0040] See also Figure 1-Figure 9 , a diamond grinding device for metal targets, such as Figure 1-Figure 4 As shown, it includes a workbench 1, on which a first mounting frame 2 is arranged, and a sander 3 with a sanding head 4 is installed on the first mounting frame 2; the first mounting frame 2 and the sander 3 are provided with a driving member 5; the driving member 5 is used to drive the sanding head 4 to rotate, so as to adjust the sanding angle of the substrate 7, so that the abrasive on the side of the sanding head 4 can be evenly consumed by the substrate 7; a positioning mechanism 6 is arranged on the workbench 1; the positioning mechanism 6 includes a suction control mechanism 62 and a plurality of suction cups 61, and is used to lock the position of the substrate 7; the suction control mechanism 62 is arranged above the workbench 1, and the plurality of suction cups 61 are arranged between the substrate 7 and the suction control mechanism 62; the suction control mechanism 62 is used to control the suction cup 61 to adsorb or detach from the substrate 7.

[0041] It should be noted that, in order to ensure the stability of the substrate 7 during the grinding process and avoid damage to the substrate 7, the substrate 7 is first fixed on the workbench 1 using the positioning mechanism 6. On this basis, the suction control mechanism 62 is activated to cause the multiple suction cups 61 located at the edge of the substrate 7 to be tightly adsorbed, thereby enhancing the stability of the substrate 7 when subjected to force.

[0042] Next, under the premise that the substrate 7 has been securely fixed, the grinding head 4 on the grinder 3 is controlled to rotate by the driving member 5 (such as the existing technical components such as the rotating cylinder shown in the figure), and the angle of the grinding head 4 is adjusted so that its axis forms a proper inclination angle with the surface of the substrate 7; such a design allows the contact area between the side of the grinding head 4 and the substrate 7 to be increased, ensuring uniform wear of the abrasive during use. This not only helps to maintain the integrity of the shape of the grinding head 4 and prevent dents caused by local excessive wear, but also ensures the quality and efficiency of grinding the substrate 7.

[0043] See also Figure 1-Figure 3 and Figure 7 In an optional embodiment, the suction control mechanism 62 includes an elastic airbag 621 and a squeezing mechanism 622; the elastic airbag 621 is arranged above the workbench 1, and the interior of the elastic airbag 621 is connected to the suction cup 61; the squeezing mechanism 622 is arranged above the workbench 1 and is used to control the pressure inside the elastic airbag 621.

[0044] It should be noted that in order to achieve stable adsorption and rapid positioning of the substrate 7, a system of using a suction cup 61 and an elastic airbag 621 in combination is designed. The specific operation process is as follows: first, use the squeezing mechanism 622 to apply pressure to the elastic airbag 621 to expel the air therein; then, make the suction cup 61 fit closely to the surface of the substrate 7; then, release the squeezing mechanism 622 to allow the elastic airbag 621 to rebound naturally, during which negative pressure is formed inside the elastic airbag 621, and then the negative pressure is converted into a firm adsorption force of the suction cup 61 on the substrate 7.

[0045] When it is necessary to release the adsorption, the squeezing mechanism 622 is used again to act on the elastic airbag 621. At this time, the positive pressure generated by the inward squeezing will be transmitted to the suction cup 61, destroying the vacuum state between it and the substrate 7, so that the substrate 7 can be easily removed. The whole process can not only ensure the stable fixation of the substrate 7 during the grinding operation, but also can flexibly adjust the position of each suction cup 61 according to the actual grinding needs, optimize the fixing effect of the substrate 7, and improve the work efficiency.

[0046] See also Figure 1-Figure 3 and Figure 7-Figure 9In an optional embodiment, the extrusion mechanism 622 includes a mounting block 6221, a third slider 6222, a pressure plate 6224, a pair of rotating rods 6225 and a first slider 6226; the mounting block 6221 is arranged on the workbench 1, the third slider 6222 is slidably connected to the mounting block 6221, a compression spring is arranged between the mounting block 6221 and the third slider 6222, the pressure plate 6224 is arranged between the elastic airbag 621 and the third slider 6222, one end of the pair of rotating rods 6225 are both hinged to the pressure plate 6224, and the rotating rods 6225 are respectively connected to the first slider 6226. A torsion spring is arranged between the movable rod 6225 and the pressure plate 6224; the first slider 6226 is arranged on the rotating rod 6225, and the third slider 6222 is provided with an annular groove 6223, and the first slider 6226 is slidably connected to the annular groove 6223; the annular groove 6223 includes a protruding portion 62231, a recessed portion 62232 and a guide portion 62233; the hinge point between the rotating rod 6225 and the pressure plate 6224, the first slider 6226 and the recessed point of the recessed portion 62232 are on the same straight line (the straight line is Fig. 9 The protrusion 62231 and the guide portion 62233 are on the same side of the straight line, so that the first slider 6226 can continue to slide in the same direction of the annular groove 6223, that is, the first slider 6226 can be driven to slide clockwise on the annular groove 6223 in the figure.

[0047] It should be noted that, in order to achieve the suction and positioning of the substrate 7 by the suction cup 61, the third slider 6222 is first pushed to move forward, so that the compression spring is compressed, and the first slider 6226 connected to the rotating rod 6225 is driven to slide along a predetermined path in the annular groove 6223. During the sliding process, the first slider 6226 is guided by the protrusion 62231 on the annular groove 6223, and the torsion spring is compressed. When the first slider 6226 approaches the recessed portion 62232 on the annular groove 6223, the pressure on the third slider 6222 is released. At this time, the compressed torsion spring releases energy, and the first slider 6226 is accurately pushed into the recessed portion 62232. At the same time, the compression spring pushes the third slider 6222 to move in the opposite direction, ensuring that the first slider 6226 stays stably in the recessed portion 62232. This action triggers the rotating rod 6225 to pull the elastic airbag 621, and the elastic airbag 621 is stretched by the action of the pressure plate 6224, so that it expands and generates internal negative pressure. The generated negative pressure forms suction and is transmitted to the suction cup 61 through the connection mechanism, and finally the suction cup 61 firmly adsorbs the substrate 7 to complete the positioning process. The entire system relies on the coordinated work between mechanical components to achieve precise control and efficient operation, ensuring the stability of the substrate 7 during grinding or other processing procedures;

[0048] In order to separate the suction cup 61 from the substrate 7, the operation process is as follows: first, the third slider 6222 is pushed forward, so that the first slider 6226 starts to slide in the annular groove 6223 from the recessed portion 62232 along the guide portion 62233. As the first slider 6226 continues to move under the guidance of the guide portion 62233, the pressure on the third slider 6222 is released, and the compression spring drives the third slider 6222 to reset, and further drives the first slider 6226 to continue to slide along the annular groove 6223. When the first slider 6226 completes a complete clockwise slide and approaches the protrusion 62231, it reaches the farthest position from the third slider 6222. At this position, the elastic airbag 621 is restored to its original state, and its internal pressure returns from negative pressure to normal pressure, thereby canceling the adsorption force applied to the substrate 7 by the suction cup 61. In this way, the suction cup 61 can be easily removed from the substrate 7.

[0049] See also Figure 1-Figure 6 In an optional embodiment, the suction control mechanism 62 also includes a driving mechanism 623. It can be understood that the present application does not limit the specific structure and installation method of the driving mechanism 623. Only a feasible technical solution is provided below; the driving mechanism 623 includes a cylinder 6231, a push plate 6232, a connecting shaft 6227 and a push block 6228; one end of the connecting shaft 6227 is fixed to the third slider 6222, the push block 6228 is fixed to the other end of the connecting shaft 6227, and the connecting shaft 6227 is slidably connected to the mounting block 6221 along its axis; the cylinder 6231 is installed on the workbench 1, the push plate 6232 is fixed to the output end of the cylinder 6231, and the push plate 6232 and the push block 6228 are arranged in alignment.

[0050] It should be noted that, in order to achieve synchronous control of the suction of multiple suction cups 61, so as to facilitate the rapid positioning and detachment of the substrate 7, specifically, the cylinder 6231 drives the push plate 6232 to move, so that the push plate 6232 contacts the push block 6228 and applies a thrust, thereby pushing the connecting shaft 6227 to move in a predetermined direction. The movement of the connecting shaft 6227 will drive the corresponding displacement of the third slider 6222, and this series of actions will eventually change the air pressure state in the elastic airbag 621.

[0051] When the suction force of the suction cup 61 needs to be adjusted, this system can ensure that all the associated suction cups 61 respond at the same time and achieve consistent actions: whether it is increasing the suction force to firmly adsorb the substrate 7, or releasing the suction force to facilitate the rapid detachment of the substrate 7, it can be completed efficiently. Through this mechanical transmission method, not only the operation process is simplified and the work efficiency is improved, but also the stability and safety of the substrate 7 during grinding or other processing are guaranteed.

[0052] See also Figure 1-Figure 6In an optional embodiment, a position adjustment mechanism 63 is provided on the workbench 1; the position adjustment mechanism 63 is used to adjust the positions of the plurality of suction cups 61 so that the suction cups 61 can be adsorbed on different positions of the substrate 7; the position adjustment mechanism 63 includes a second mounting frame 631, a turntable 632, a plurality of connecting rods 634 and a second slider 635; the second mounting frame 631 is provided on the workbench 1, the turntable 632 is connected to the second mounting frame 631 by rotating around its center of circle, a plurality of connecting rods 634 are connected to the turntable 632 by sliding along its length direction, the second slider 635 is provided on the connecting rod 634, an arc-shaped slide groove 633 is provided on the turntable 632, and the second slider 635 is connected to the arc-shaped slide groove 633 by sliding; the suction cup 61, the elastic airbag 621 and the mounting block 6221 are all provided on the connecting rod 634, a through hole is provided on the connecting rod 634, and the interior of the elastic airbag 621 is connected to the suction cup 61 through the through hole.

[0053] It should be noted that, in order to ensure the stability of the substrate 7 during the grinding process and reduce the risk of damage caused by angle grinding, a set of position adjustment mechanisms 63 are designed to optimize the suction position of the suction cup 61 on the substrate 7. Specifically, when it is necessary to form a certain angle between the grinding head 4 and the substrate 7 for grinding, in order to prevent the substrate 7 from being damaged due to the angle component force, the positions of the multiple suction cups 61 are adjusted by the position adjustment mechanism 63 so that the suction point is closer to the edge of the substrate 7, thereby enhancing the stability of the substrate 7 when subjected to force.

[0054] The specific implementation of this process is: by pushing the turntable 632 to rotate, the multiple arc-shaped slide grooves 633 on the turntable 632 move accordingly, causing the second slider 635 located in the slide groove to slide along the arc path. Under the guidance and restriction of the second mounting frame 631, the connecting rod 634 slides along its length direction, thereby driving the multiple suction cups 61 to slide from the center to the periphery of the substrate 7. In this way, the position of the suction cup 61 can be accurately controlled, so that its suction point is closer to the edge of the substrate 7, thereby improving the stability and grinding effect during grinding.

[0055] This system can not only flexibly adjust the position of the suction cup 61 to meet different grinding requirements, but also ensure the stability of the substrate 7 during the entire processing process, and ultimately ensure the quality and efficiency of the grinding operation. In this way, effective protection and efficient processing of the substrate 7 are achieved.

[0056] See also Figure 5-Figure 6In an optional embodiment, the second mounting frame 631 rotates around the center of the turntable 632 and is connected to the workbench 1. A motor 8 is installed at the bottom end of the workbench 1, and the output end of the motor 8 is connected to the second mounting frame 631. It should be noted that during the grinding process, in order to ensure that the side of the substrate 7 can obtain a uniform and efficient grinding effect, specifically, when the grinder 3 drives the grinding head 4 to rotate for grinding, the motor 8 synchronously drives the second mounting frame 631 to rotate. Since multiple suction cups 61 are fixed on the second mounting frame 631, as the mounting frame rotates, the suction cups 61 and the substrate 7 adsorbed thereon also rotate together.

[0057] The motor 8 synchronously drives the second mounting frame 631 to rotate, so that the substrate 7 can rotate itself while the grinding head 4 rotates and grinds, thereby ensuring that the side of the substrate 7 can be fully and evenly polished. In this way, not only the quality and efficiency of polishing are improved, but also the consistency of the surface treatment of the substrate 7 is ensured, and finally an ideal polishing effect is achieved;

[0058] It is understandable that a linear module is installed between the workbench 1 and the first mounting frame 2. As the grinding head 4 grinds the substrate 7 more deeply, the linear module drives the grinding head 4 on the first mounting frame 2 to feed closer to the substrate 7, ensuring continuous grinding quality and efficiency.

[0059] See also Figure 1-Figure 10 , a working method of a diamond grinding device for a metal target, comprising the following steps:

[0060] Step 1: Positioning: The substrate 7 is positioned and fixed by the positioning mechanism 6 so that the position where the positioning mechanism 6 is adsorbed on the substrate 7 is close to the edge of the substrate 7;

[0061] Step 2: Angle adjustment: After the substrate 7 is positioned, the grinding head 4 on the grinder 3 is driven to rotate by the driving member 5 to adjust the grinding angle of the substrate 7 .

[0062] In the description of the present invention, it should be understood that the terms "upper", "lower", "left", "right", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction and a specific direction structure and operation, and therefore, cannot be understood as a limitation on the present invention. In addition, "first" and "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0063] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", etc. should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0064] The above is a detailed description of an embodiment of the present invention, but the content is only a preferred embodiment of the present invention and cannot be considered to limit the scope of implementation of the present invention. All equivalent changes and improvements made within the scope of the present invention should still fall within the scope of the patent coverage of the present invention.

Claims

1. A diamond grinding device for a metal target, comprising a workbench (1), on which a first mounting frame (2) is arranged, on which a grinder (3) with a grinding head (4) is mounted; characterized in that: The first mounting frame (2) and the grinder (3) are provided with a driving member (5); the driving member (5) is used to drive the grinding head (4) to rotate so as to adjust the grinding angle of the substrate (7) so that the abrasive on the side of the grinding head (4) can be evenly consumed by the substrate (7); The workbench (1) is provided with a positioning mechanism (6); the positioning mechanism (6) comprises a suction control mechanism (62) and a plurality of suction cups (61), and is used to lock the position of the substrate (7).

2. A diamond grinding device for metal target according to claim 1, characterized in that: The suction control mechanism (62) is arranged above the workbench (1), and the plurality of suction cups (61) are arranged between the substrate (7) and the suction control mechanism (62); the suction control mechanism (62) is used to control the suction cups (61) to adsorb or detach from the substrate (7).

3. A diamond grinding device for metal target according to claim 2, characterized in that: The suction control mechanism (62) comprises an elastic airbag (621) and a squeezing mechanism (622); the elastic airbag (621) is arranged above the workbench (1), and the interior of the elastic airbag (621) is connected to the suction cup (61); the squeezing mechanism (622) is arranged above the workbench (1) and is used to control the pressure inside the elastic airbag (621).

4. A diamond grinding device for metal target according to claim 3, characterized in that: The extrusion mechanism (622) comprises a mounting block (6221), a third slider (6222), a pressure plate (6224), a pair of rotating rods (6225) and a first slider (6226); the mounting block (6221) is arranged on the workbench (1); the third slider (6222) is slidably connected to the mounting block (6221); a compression spring is arranged between the mounting block (6221) and the third slider (6222); the pressure plate (6224) is arranged on the spring Between the airbag (621) and the third slider (6222), one end of a pair of rotating rods (6225) are hinged to the pressure plate (6224), and a torsion spring is arranged between the rotating rod (6225) and the pressure plate (6224); the first slider (6226) is arranged on the rotating rod (6225), the third slider (6222) is provided with an annular groove (6223), and the first slider (6226) is slidably connected to the annular groove (6223).

5. A diamond grinding device for metal target according to claim 4, characterized in that: The annular slide groove (6223) includes a protruding portion (62231), a recessed portion (62232) and a guiding portion (62233); the hinge point between the rotating rod (6225) and the pressure plate (6224), the first slider (6226) and the recessed point of the recessed portion (62232) are on the same straight line, and the protruding portion (62231) and the guiding portion (62233) are on the same side of the straight line, so that the first slider (6226) can continuously slide in the same direction of the annular slide groove (6223).

6. A diamond grinding device for metal target according to claim 2, characterized in that: The suction control mechanism (62) also includes a driving mechanism (623), which includes a cylinder (6231), a push plate (6232), a connecting shaft (6227) and a push block (6228); one end of the connecting shaft (6227) is fixed to the third slider (6222), the push block (6228) is fixed to the other end of the connecting shaft (6227), and the connecting shaft (6227) is slidably connected to the mounting block (6221) along its axis; the cylinder (6231) is installed on the workbench (1), the push plate (6232) is fixed to the output end of the cylinder (6231), and the push plate (6232) and the push block (6228) are arranged in a corresponding position.

7. A diamond grinding device for metal target according to claim 3, characterized in that: The workbench (1) is provided with a position adjustment mechanism (63); the position adjustment mechanism (63) is used to adjust the positions of the plurality of suction cups (61) so that the suction cups (61) can be adsorbed on different positions of the substrate (7).

8. A diamond grinding device for metal target according to claim 7, characterized in that: The position adjustment mechanism (63) comprises a second mounting frame (631), a rotating disk (632), a plurality of connecting rods (634) and a second sliding block (635); the second mounting frame (631) is arranged on the workbench (1); the rotating disk (632) is connected to the second mounting frame (631) by rotating around its center of circle; the plurality of connecting rods (634) are connected to the rotating disk (632) by sliding along their length direction; the second sliding block (635) is arranged on the connecting rod (634); an arc-shaped sliding groove (633) is provided on the rotating disk (632); the second sliding block (635) is connected to the arc-shaped sliding groove (633) by sliding; the suction cup (61), the elastic airbag (621) and the mounting block (6221) are all arranged on the connecting rod (634); a through hole is provided on the connecting rod (634); the interior of the elastic airbag (621) is connected to the suction cup (61) through the through hole.

9. A diamond grinding device for metal target according to claim 8, characterized in that: The second mounting frame (631) is connected to the workbench (1) so as to rotate around the center of the rotating disk (632); a motor (8) is installed at the bottom end of the workbench (1); and an output end of the motor (8) is connected to the second mounting frame (631).

10. A working method of a diamond grinding device for a metal target according to any one of claims 1 to 9, characterized in that: The following steps are involved: Step 1: Positioning: positioning and fixing the substrate (7) by means of a positioning mechanism (6), and fixing the positioning mechanism (6) at a position close to the edge of the substrate (7); Step 2: Angle adjustment: After the substrate (7) is positioned, the grinding head (4) on the grinder (3) is driven to rotate by the driving member (5) to adjust the angle of the grinding head (4) to ensure the grinding angle of the substrate (7).

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