Full-automatic pressure grinding and polishing equipment and full-automatic control method thereof

Abstract

The invention discloses full-automatic pressure grinding and polishing equipment and a full-automatic control method thereof.The full-automatic pressure grinding and polishing equipment comprises a rack, a conveying device is arranged on the outer side of the rack and used for feeding and discharging embedded samples, a pressure grinding and polishing head is arranged in the rack and used for carrying and applying pressure to a sample carrying disc for grinding, and a grinding and cleaning device is arranged in the rack and used for cleaning the sample carrying disc; according to the full-automatic pressure grinding and polishing equipment and the full-automatic control system of the full-automatic pressure grinding and polishing equipment, the recognition module is arranged to automatically recognize key parameters such as sample hardness, adjacent hardness difference, plasticity, heat conductivity and material components; and the data processing module is combined to calculate the grinding pressure, the rotating speed, the time, the number of times and the grinding material replacement and cleaning frequency according to the recognition result, an optimal grinding plan is formed, and the problems that the manual operation process is troublesome and the precision is poor under the complex working condition of the multi-material inlaid sample are solved.

Description

Technical Field

[0001] The invention relates to the field of grinding and polishing equipment, in particular to a full-automatic pressure grinding and polishing equipment and a full-automatic control method thereof. Background Art

[0002] In the field of high-precision sample preparation such as microscopic analysis and component detection, in order to ensure that the surface of metal or non-metallic materials has high flatness and scratch-free characteristics, it is usually necessary to go through a complex grinding and polishing process. In the prior art, semi-automatic or manual grinding equipment is mostly used, and the grinding parameters are adjusted by manual experience during operation. It is difficult to accurately control a variety of materials with different hardness, plasticity and thermal conductivity. Especially in the preparation of multi-material inlaid samples, due to the large differences in material properties, surface scratches, insufficient or excessive grinding and other problems are prone to occur, which seriously affect the quality of sample preparation. At the same time, traditional equipment lacks the ability to automatically identify sample materials and intelligently generate grinding plans. There is a lack of temperature feedback regulation during the grinding process, which is easy to cause defects such as material softening and deformation caused by temperature rise. It is difficult to meet the needs of batch, precision, and high consistency preparation. In view of the above problems, a fully automatic pressure grinding and polishing equipment and a fully automatic control method thereof are proposed. Summary of the invention

[0003] The object of the present invention is to provide a fully automatic pressure grinding and polishing equipment and a fully automatic control method thereof to solve the problems raised in the above background technology.

[0004] To achieve the above object, the present invention provides the following technical solution: a fully automatic pressure grinding and polishing device, comprising a frame,

[0005] A conveying device is provided on the outside of the frame for loading and unloading the inlaid samples;

[0006] A pressure grinding and polishing head is provided in the frame, which is used to carry and apply pressure to the sample tray for grinding;

[0007] A grinding and cleaning device is provided in the frame, which is used to clean and grind the samples in the sample tray;

[0008] The frame includes a control box, which is internally provided with a motion control module, a data processing module and a power module;

[0009] The conveying device is provided with an identification module for detecting material parameters of the mounted sample;

[0010] The pressure grinding and polishing head includes a pressure shaft and a pressure sensor to achieve real-time monitoring and adjustment of the grinding pressure.

[0011] Preferably, the pressure grinding and polishing head comprises a bottom support plate, one side of the bottom support plate is equipped with a column jacket, the bottom of the column jacket is fixedly installed with the top of the control box, and a column motor is arranged inside the column jacket, which can rotate and drive the bottom support plate to flip;

[0012] An electric cylinder fixing seat is installed on the other side of the bottom support plate, and the pressure shaft is installed on the bottom end of the electric cylinder fixing seat through a connecting shaft. The pressure shaft is driven to rise and fall by the electric cylinder, and the pressure shaft is driven to rotate by the pressure shaft pulley and the pressure head belt. The bottom end of the pressure shaft is used for clamping and positioning with the sample loading tray.

[0013] Preferably, the unloading device comprises a sample tray and a lifting cylinder, wherein the lifting cylinder is connected to the sample tray to drive the sample tray to move upward and downward;

[0014] The sample tray is used to receive the sample tray located at the bottom of the pressure grinding and polishing head after the pressure grinding and polishing head is separated from the sample tray, and release the sample tray onto the conveying device after receiving the sample tray;

[0015] The positioning device includes a pressure plate bracket and a rotating cylinder. The rotating cylinder is connected to the pressure plate and is used to drive the pressure plate to flip and press or release the sample tray.

[0016] Preferably, the conveying device includes a conveying motor and two conveying belts, and the two conveying belts are respectively located below the two sides of the sample tray, and are used to support the lower surfaces of the two sides of the sample tray and drive it to move along the conveying direction to realize automatic transportation of the sample tray.

[0017] Preferably, the grinding and cleaning device includes a grinding and polishing spindle, a grinding and polishing disc, a cleaning water tank, a water spray nozzle and a vent nozzle, the grinding and polishing spindle drives the grinding and polishing disc to rotate to grind the sample on the sample carrier; the water spray nozzle is arranged in the cleaning water tank for spray cleaning, and the vent nozzle is used to blow dry the sample carrier.

[0018] Preferably, the control box includes a motion control module, a data processing module and a power module.

[0019] Among them, the action control module is used to control the operation steps and switching of the identification module, the pressure grinding and polishing head, the conveying device and the grinding and cleaning device;

[0020] The data processing module is used to receive the data transmitted by the identification module, including parameters such as hardness (H), adjacent hardness difference (ΔH), plasticity (δ), thermal conductivity (λ), material composition (C), etc., and generate a grinding plan based on the data;

[0021] The power module is used to provide energy supply for motion execution parts such as pressure grinding and polishing heads, conveying devices, grinding and cleaning devices, etc.

[0022] Preferably, the identification module is located below the conveying device and is integrated with a detection device, an identification sensor and an industrial camera;

[0023] Among them, the identification sensors include a small load Vickers hardness tester, a laser displacement sensor, a thin film heat flux meter and a micro heat source response device, which are used to detect the hardness (H), adjacent hardness difference (ΔH), plasticity (δ) and thermal conductivity (λ) of the embedded sample respectively;

[0024] Industrial cameras are used for image acquisition and material composition (C) analysis;

[0025] The detection device is used to receive data transmitted by the identification sensor and the industrial camera, integrate the hardness (H), adjacent hardness difference (ΔH), plasticity (δ), thermal conductivity (λ) and material composition (C) parameters of the sample, and send the integrated data to the data processing module for analysis and calculation.

[0026] A control method for fully automatic pressure grinding and polishing equipment:

[0027] It includes material identification steps and grinding control steps, specifically:

[0028] Step 1, obtaining the hardness (H), adjacent hardness difference (ΔH), plasticity (δ), thermal conductivity (λ) and material type (M) of each material in the embedded sample through the recognition module;

[0029] Step 2: Generate a grinding plan based on the parameters, wherein the grinding plan includes grinding pressure (P), rotation speed (R), grinding time (T g )、Number of grinding times (N g ), abrasive replacement (A c ) and the number of cleaning times (N c );

[0030] Step 3: monitor the temperature (T) in real time during the grinding process, and when the temperature exceeds the set value (T( max )) , adjust the pressure, speed and cooling water flow; ΔH

[0031] Step 4: Perform multi-stage grinding operations according to the grinding plan and temperature adjustment to complete the fully automatic grinding and polishing of the mounted sample.

[0032] Preferably, the grinding time (T g ) is calculated according to the following formula: Among them, T g is the total grinding time;

[0033] k t is the time correction factor;

[0034] D is the characteristic size of the sample surface;

[0035] Ra1 is the target surface roughness;

[0036] Grinding times (N g ) is calculated according to the following formula: Among them, N g is the number of grinding times;

[0037] k n is the frequency correction factor;

[0038] ΔH is the hardness difference between adjacent materials;

[0039] H aνg is the average hardness of the entire material of the sample;

[0040] Abrasive selection (Ac) is determined by the following formula: Among them, A c Abrasive for selection;

[0041] A 1 , A 2 and A 3 They are coarse abrasive, medium abrasive and fine abrasive respectively;

[0042] H max is the maximum hardness value;

[0043] δ 1 is the plasticity percentage.

[0044] Preferably, the grinding pressure (P) is calculated according to the following formula: Among them, k p is the pressure correction factor;

[0045] H max It is the hardness value of the material with the highest hardness in the sample;

[0046] H avg is the average hardness value of the entire sample material;

[0047] D aνg is the average diameter or characteristic size of the sample surface;

[0048] The grinding speed (R) is calculated according to the following formula: R = R 0 -k r ·H aνg

[0049] Among them, R 0 is the default basic speed;

[0050] k r is the speed correction factor;

[0051] H aνg is the average hardness value of the entire sample material;

[0052] When the temperature (T) exceeds the set value (T( max )) When: Dynamically adjust the grinding parameters, including:

[0053] Reduce grinding pressure (P = P × 0.8)

[0054] Reduce grinding speed (R = R × 0.9)

[0055] Increase cooling water flow to reduce grinding temperature;

[0056] At the same time, the hardness parameters are corrected, and the hardness correction value (H adj ) is calculated according to the following formula:

[0057] H adj =Hk t ·(TT 0 );

[0058] Where H is the initial measured material hardness;

[0059] k t is the temperature effect correction factor;

[0060] T is the real-time monitoring temperature;

[0061] T 0 is the base temperature.

[0062] Compared with the prior art, the beneficial effects of the present invention are as follows: the fully automatic pressure grinding and polishing equipment and its fully automatic control system provided by the present invention automatically identify key parameters such as sample hardness (H), adjacent hardness difference (ΔH), plasticity (δ), thermal conductivity (λ) and material composition (C) by setting an identification module, and calculate the grinding pressure, rotation speed, time, number of times, abrasive replacement and cleaning frequency according to the identification results in combination with the data processing module to form an optimal grinding plan, solving the problem of difficult parameter matching under complex working conditions of multi-material inlaid samples. The equipment monitors the temperature in real time during the grinding process, dynamically corrects the hardness value, and automatically adjusts the grinding parameters to effectively avoid surface defects caused by temperature rise. The equipment has a compact structure and a high degree of automation. It can complete the preparation of samples with high consistency, high flatness and no scratches unattended, which significantly improves the efficiency and stability of sample preparation and is suitable for the high-standard grinding requirements of various materials and complex samples. BRIEF DESCRIPTION OF THE DRAWINGS

[0063] Figure 1 The stereoscopic view of the overall device of the present invention is shown in FIG. Figure 1 ;

[0064] Figure 2 The stereoscopic view of the overall device of the present invention is shown in FIG. Figure 2 ;

[0065] Figure 3 The stereoscopic view of the overall device of the present invention is shown in FIG. Figure 3 ;

[0066] Figure 4 It is a front view of the present invention;

[0067] Figure 5 It is a front view of the pressure grinding and polishing head of the present invention;

[0068] Figure 6 It is a cutaway schematic diagram of the blanking device of the present invention;

[0069] Figure 7 It is a front view of the positioning device of the present invention;

[0070] Figure 8 It is a right side view of the conveying device of the present invention;

[0071] Fig. 9 A top view of the power mechanism of the conveying device of the present invention;

[0072] Fig.10 is a cross-sectional schematic diagram of the grinding and cleaning device of the present invention;

[0073] Fig.11 It is a right view of the identification module 14 of the present invention;

[0074] Fig.12 for Figure 5 A partial enlarged view of the middle grabbing head;

[0075] Fig.13 for Figure 4 A partial enlarged view of the grabbing head in the middle.

[0076] In the figure: 1, frame, 11, control box, 12, equipment compartment, 13, cabinet door, 14, identification module, 15, panel, 16, abrasive feeder, 17, detection device, 18, identification sensor, 2, pressure grinding and polishing head, 21, bottom support plate, 22, electric cylinder fixing seat, 23, electric cylinder, 24, adapter shaft, 25, pressure shaft seat, 26, pressure shaft, 27, pressure sensor, 28, limit top bead, 29, sample tray, 210, pressure shaft pulley, 211, pressure head motor, 212, pressure head motor pulley, 213, pressure head belt, 214, column jacket, 215, column shaft, 216, column coupling, 217, column motor, 3, unloading device, 31, sample tray tray, 32, guide shaft, 33, guide shaft sleeve, 34, lifting cylinder , 35. Cylinder fixing plate, 4. Positioning device, 41. Press plate bracket, 42. Rotating cylinder, 43. Flip rod, 44. Flip connector, 44. Press plate, 5. Conveying device, 51. Bracket, 52. Conveying motor fixing plate, 53. Conveying motor, 54. Conveying motor pulley, 55. Conveying motor belt, 56. Conveying intermediate wheel, 57. Conveying support wheel, 58. Conveying belt, 59. Bracket fixing plate, 6. Grinding and cleaning device, 61. Platform plate, 62. Grinding and polishing spindle, 63. Grinding and polishing disc, 64. Positioning pin, 65. Waterproof groove, 66. Grinding and polishing spindle pulley, 67. Grinding and polishing motor bracket, 68. Grinding and polishing spindle motor, 69. Grinding and polishing motor pulley, 610. Grinding and polishing spindle belt, 611. Cleaning sink, 612. Ventilation nozzle, 613. Water spray nozzle. DETAILED DESCRIPTION

[0077] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0078] See also Figure 1-11 The present invention provides a technical solution: a fully automatic pressure grinding and polishing device, comprising a frame 1,

[0079] A conveying device 5 is provided outside the frame 1 for loading and unloading the inlaid samples;

[0080] A pressure grinding and polishing head 2 is arranged in the frame 1, which is used to carry and apply pressure to the sample loading plate 29 for grinding;

[0081] A grinding and cleaning device 6 is provided in the frame 1 for cleaning and grinding the sample in the sample tray 29;

[0082] The frame 1 includes a control box 11, and a motion control module, a data processing module and a power module are arranged inside the control box 11;

[0083] The conveying device 5 is provided with an identification module 14 for detecting material parameters of the mounted sample;

[0084] The pressure grinding and polishing head 2 includes a pressure shaft 26 and a pressure sensor 27 to achieve real-time monitoring and adjustment of the grinding pressure.

[0085] The top of the control box 11 is equipped with an equipment cabin 12, and the pressure grinding and polishing head 2 is installed in the middle of the equipment cabin 12. The proximal end of the conveying device 5 for unloading is provided with a unloading device 3 capable of vertically lifting and lifting the sample tray 29, and the outer side of the unloading device 3 is provided with a positioning device 4 for assisting in unloading the sample tray 29;

[0086] The pressure grinding and polishing head 2 includes a column motor 217, which is mounted on the top of the control box 11, and a bottom support plate 21 is mounted on the top of the column motor 217. A pressure shaft 26 is mounted on the outside of the bottom support plate 21 and can be raised and lowered. A sample tray 29 is detachably mounted on the bottom end of the pressure shaft 26, and a pressure sensor 27 is mounted between the pressure shaft 26 and a gripping device of the sample tray 29.

[0087] The grabbing device includes a sleeve joint arranged below the pressure sensor 27 and located at the bottom end of the pressure shaft 26. A vertical cavity is arranged inside the sleeve joint. A limit bead 28 is arranged horizontally on the inner wall of the vertical cavity. A vertical cylindrical structure is arranged on the top of the sample loading plate 29. A circular groove is opened on the top of the cylindrical structure. After the sleeve joint is sleeved downward on the outside of the cylindrical structure, the continuous downward pressure action will drive the limit bead 28 to jump over the top of the cylindrical structure, and finally clamp the inside of the groove of the original cylindrical structure, and the sample loading plate 29 is grabbed.

[0088] A circular hole is provided on the inner and outer sides of the sleeve joint, a spring is provided inside the circular hole, a telescopic column capable of lifting and lowering is provided at the bottom end of the spring, the spring can drive the telescopic column to lift and lower, a groove opening which is beneficial to weight reduction is provided on the top view surface of the sample loading plate 29, after the sample loading plate 29 is docked, the telescopic column pops up downward and is clamped inside the groove opening when encountering the groove opening or when the sample loading plate 29 and the grabbing head rotate relative to each other during grinding, thereby realizing a rotation restriction effect, which is beneficial for the pressure head motor 211 to drive the sample loading plate 29 to rotate through the pressure head belt 213, thereby realizing a rotating grinding state;

[0089] The column motor 217 can drive the bottom support plate 21 to rotate around the axis of the column motor 217 , and the centers of the working parts of the two sets of conveying devices 5 , the unloading device 3 and the grinding and cleaning device 6 coincide with the axis trajectory of the pressure shaft 26 .

[0090] A cabinet door 13 is provided on the outside of the equipment compartment 12 for easy repair and maintenance, and a transparent window is inlaid on the inside of the cabinet door 13 for easy observation and to prevent splashing liquid during grinding from falling to the outside of the equipment.

[0091] A panel 15 is mounted on the top of the control box 11 , and the pressure grinding and polishing head 2 , the unloading device 3 , the positioning device 4 , the end and receiving end of the conveying device 5 , and the grinding and cleaning device 6 are all mounted on the top of the panel 15 .

[0092] The upper surface of the panel 15 is located outside the grinding and cleaning device 6 and is equipped with an abrasive feeder 16. The abrasive feeder 16 can provide a variety of abrasives, which are dripped onto the upper surface of the grinding and polishing disc 63 in the form of a suspension using a transmission device such as a diaphragm pump and a pipeline.

[0093] Specifically, the pressure grinding and polishing head 2 includes a bottom support plate 21, one side of the bottom support plate 21 is equipped with a column sleeve 214, the bottom of the column sleeve 214 is fixedly installed on the top of the control box 11, and the interior of the column sleeve 214 is provided with a column motor 217, which can rotate and drive the bottom support plate 21 to flip; the other side of the bottom support plate 21 is equipped with an electric cylinder fixing plate 22, and the pressure shaft 26 is assembled to the bottom end of the electric cylinder fixing plate 22 through the adapter shaft 24. The pressure shaft 26 is driven to rise and fall by the electric cylinder 23, and the pressure shaft 26 is driven to rotate by the pressure shaft pulley 210 and the pressure head belt 213. The bottom end of the pressure shaft 26 is used to be clamped and positioned with the sample loading plate 29.

[0094] The top of the panel 15 is equipped with a column sleeve 214, and the column motor 217 is installed at the bottom of the panel. The column motor 217 passes through the panel 15 and the column sleeve 214 upward and is installed at the bottom end of the bottom support plate 21. The bottom support plate 21 is rotatably installed between the column sleeves 214.

[0095] Specifically, the unloading device 3 includes a sample tray 31 and a lifting cylinder 34, and the lifting cylinder 34 is connected to the sample tray 31 to drive the sample tray 31 to move up and down;

[0096] The sample tray 31 is used to receive the sample tray 29 located at the bottom of the pressure polishing head 2 after the pressure polishing head 2 is separated from the sample tray 29, and release the sample tray 29 onto the conveying device 5 after receiving the sample tray 29;

[0097] The positioning device 4 includes a pressing plate bracket 41 and a rotating cylinder 42 . The rotating cylinder 42 is connected to a pressing plate 44 and is used to drive the pressing plate 44 to flip and press or release the sample tray 29 .

[0098] During unloading, the pressure grinding and polishing head 2 will first drive the ground sample loading plate 29 to rotate to the top of the sample loading plate tray 31, and then the sample loading plate tray 31 will be driven to rise by the lifting cylinder 34, and the sample loading plate tray 31 will contact the lower surface of the sample loading plate 29, and then the rotating cylinder 42 will drive the rotation, driving the four flip rods 43 to rotate, and the pressure plate 44 will flip and extend forward to press on the top edge of the sample loading plate 29, and then the pressure grinding and polishing head 2 will be pulled upward, and the limiting top bead 28 will passively pop out from the groove of the original column at the top of the sample loading plate 29, so that the sample loading plate 29 and the pressure grinding and polishing head 2 will be separated, and then the sample loading plate tray 31 will descend, and when the sample loading plate tray 31 descends to a height below the conveyor belt 55, the edge of the sample loading plate 29 will contact the conveyor belt 55 to achieve separation, and then the conveying device 5 responsible for unloading will move the completed sample loading plate 29 to unload the unloading.

[0099] Specifically, the conveying device 5 includes a conveying motor 53 and two conveying belts 58. The two conveying belts 58 are respectively located below the two sides of the sample tray 29, and are used to support the lower surfaces of the two sides of the sample tray 29 and drive it to move along the conveying direction, thereby realizing automatic transmission of the sample tray 29.

[0100] The conveying device 5 includes a bracket 51, a conveying motor fixing plate 52 is installed at the bottom end of the bracket 51, a conveying motor 53 is installed inside the conveying motor fixing plate 52, a conveying motor 53 is installed at the output end of the conveying motor 53, a conveying motor pulley 54 is installed on the outer side of the conveying motor pulley 54 through a conveying motor belt 55, conveying intermediate wheels 56 are installed on both sides of the top of the bracket 51, and a conveying belt 58 is installed on the outer side of the conveying support wheel 57, and the conveying intermediate wheel 56 is connected to the conveying belt 58 and drives the conveying belt 58 to rotate.

[0101] Specifically, the grinding and cleaning device 6 includes a grinding and polishing spindle 62, a grinding and polishing disc 63, a cleaning water tank 611, a water spray nozzle 613 and a vent nozzle 612. The grinding and polishing spindle 62 drives the grinding and polishing disc 63 to rotate to grind the sample on the sample loading disc 29;

[0102] The grinding and polishing disc 63 and the grinding and polishing spindle 62 are positioned by a positioning pin 64, so that the grinding and polishing disc 63 with different coarse and fine grains can be replaced and rotated and positioned;

[0103] The water spray nozzle 613 is arranged in the cleaning water tank 611 for spray cleaning, and the ventilation nozzle 612 is used for blowing dry the sample tray 29 .

[0104] The grinding and cleaning device 6 includes a platform plate 61, a waterproof groove 65 is installed on one side of the top of the platform plate 61, a grinding and polishing spindle 62 is rotatably installed at the inner center of the waterproof groove 65, a grinding and polishing disc 63 is installed on the top of the grinding and polishing spindle 62, and the bottom end of the grinding and polishing spindle 63 is connected to the grinding and polishing spindle motor 68 through a grinding and polishing motor belt 610;

[0105] A cleaning water tank 611 is installed on the other side of the platform plate 61 . A water spray nozzle 613 is provided at the bottom end of the cleaning water tank 611 , and a ventilation nozzle 612 is provided on the side wall of the cleaning water tank 611 .

[0106] Specifically, the control box 11 includes a motion control module, a data processing module and a power module.

[0107] Among them, the action control module is used to control the operation steps and switching of the identification module 14, the pressure grinding and polishing head 2, the conveying device 5 and the grinding and cleaning device 6;

[0108] The data processing module is used to receive the data transmitted by the identification module 14, including parameters such as hardness H, adjacent hardness difference ΔH, plasticity δ, thermal conductivity λ, material composition C, etc., and generate a grinding plan based on the data;

[0109] The power module is used to provide energy supply for motion execution components such as the pressure grinding and polishing head 2, the conveying device 5, the grinding and cleaning device 6, etc.

[0110] Specifically, the identification module 14 is located below the conveying device 5 and is integrated with a detection device 17, an identification sensor 18 and an industrial camera;

[0111] Among them, the identification sensor 18 includes a small load Vickers hardness tester, a laser displacement sensor, a thin film heat flow meter and a micro heat source response device, which are used to detect the hardness (H), adjacent hardness difference (ΔH), plasticity (δ) and thermal conductivity (λ) of the embedded sample respectively;

[0112] Industrial cameras are used for image acquisition and material composition (C) analysis;

[0113] The detection device 17 is used to receive the data transmitted by the identification sensor 18 and the industrial camera, integrate the hardness (H), adjacent hardness difference (ΔH), plasticity (δ), thermal conductivity (λ) and material composition (C) parameters of the sample, and send the integrated data to the data processing module for analysis and calculation.

[0114] Control method of fully automatic pressure grinding and polishing equipment:

[0115] It includes material identification steps and grinding control steps, specifically:

[0116] Step 1, obtaining the hardness (H), adjacent hardness difference (ΔH), plasticity (δ), thermal conductivity (λ) and material type (M) of each material in the embedded sample through the identification module 14;

[0117] Step 2: Generate a grinding plan based on the parameters, wherein the grinding plan includes grinding pressure (P), rotation speed (R), grinding time (T g )、Number of grinding times (Ng ), abrasive replacement (A c ) and the number of cleaning times (N c );

[0118] Step 3: monitor the temperature (T) in real time during the grinding process, and when the temperature exceeds the set value (T( max )) , adjust the pressure, speed and cooling water flow; ΔH

[0119] Step 4: Perform multi-stage grinding operations according to the grinding plan and temperature adjustment to complete the fully automatic grinding and polishing of the mounted sample.

[0120] Specifically, the grinding pressure (P) is calculated according to the following formula:

[0121] Among them, k p is the pressure correction factor;

[0122] H max It is the hardness value of the material with the highest hardness in the sample;

[0123] H avg is the average hardness value of the entire sample material;

[0124] D aνg is the average diameter or characteristic size of the sample surface;

[0125] The grinding speed (R) is calculated according to the following formula: R = R 0 -k r ·H aνg

[0126] Among them, R 0 is the default basic speed;

[0127] k r is the speed correction factor;

[0128] H aνg is the average hardness value of the entire sample material;

[0129] When the temperature (T) exceeds the set value (T( max )) When: Dynamically adjust the grinding parameters, including:

[0130] Reduce grinding pressure (P = P × 0.8)

[0131] Reduce grinding speed (R = R × 0.9)

[0132] Increase cooling water flow to reduce grinding temperature;

[0133] At the same time, the hardness parameters are corrected, and the hardness correction value (H adj ) is calculated according to the following formula:

[0134] H adj =Hk t ·(TT 0 );

[0135] Where H is the initial measured material hardness;

[0136] k t is the temperature effect correction factor;

[0137] T is the real-time monitoring temperature;

[0138] T 0 is the base temperature.

[0139] The accumulation of grinding time correction coefficient kt comes from long-term tests using semi-automatic and manual grinding equipment in the early stage. Through the grinding data records of samples with different hardness, size and target surface roughness Ra, the time required in the actual grinding process is counted and compared with the theoretical calculated value for correction, so as to optimize the value range of kt. kt is mainly affected by material hardness, sample size and target surface roughness. In the actual processing process, it is continuously optimized through parameter adjustment and data feedback to improve the accuracy of grinding time prediction.

[0140] The determination of the grinding times correction factor kn is based on the grinding test of multi-material inlaid samples, especially for the case where the hardness difference ΔH of adjacent materials is large. In the early stage, the grinding test was carried out on samples with different hardness differences by semi-automatic equipment, and the relationship between the grinding times and the average hardness H average was recorded. Combined with microscopic observation and surface quality analysis, the value of kn was gradually adjusted to make it suitable for the grinding needs under different hardness combinations.

[0141] The grinding pressure correction coefficient kp is obtained by applying pressure to samples of different hardness and size in the early stage. Manual or semi-automatic grinding equipment is used to grind under different pressure conditions, and key parameters such as removal rate, surface quality and flatness are measured to establish the corresponding relationship between hardness, pressure and grinding effect. kp is closely related to the maximum hardness, average hardness and characteristic size of the sample. The grinding pressure control strategy is optimized through data analysis to ensure uniform grinding and avoid material damage.

[0142] The grinding speed correction coefficient kr is accumulated by conducting multiple batches of grinding tests on materials of different hardness, adjusting the speed and recording the grinding temperature rise, surface scratches and micro deformation, and summarizing the influence of the average hardness H on the speed. Harder materials are prone to overheating and surface damage at high speeds, so the adjustment of kr is mainly used to optimize grinding stability and ensure that different materials run within the appropriate speed range.

[0143] The determination of the temperature correction coefficient kt temperature is based on the previous testing of the material hardness under different temperature conditions, recording the initial hardness value, real-time temperature and hardness change under the reference temperature, and combining the heat treatment theory analysis to fit the relationship between temperature and material hardness. The optimization of kt temperature enables real-time compensation of hardness changes caused by temperature rise during the grinding process, thereby improving the accuracy of grinding parameter calculation.

[0144] The setting direction of the identification sensor 18 is as follows Fig.11 As shown, it includes sensors on both sides for tilt recognition and observation and recognition sensors for forward detection. When in use, by correcting the recognition parameters at different angles, they can be compared in the background to make the results more accurate. This method is suitable for scanning-type concealed devices, such as visual concealed devices, electronic scanning sensors, spectrometers, laser scanners, etc., except for hardness sensors that require vertical contact and have requirements for detection methods.

[0145] The identification module 14 can use a variety of solutions, and the following are two examples of preferred solutions that can be implemented:

[0146] Option 1:

[0147] The identification module 14 is disposed below the conveying device 5 , and includes a detection device 17 , an identification sensor 18 and an industrial camera.

[0148] The detection device 17 and the identification sensor 18 are configured as follows:

[0149] Small load Vickers hardness tester, used to directly apply load to the sample surface and measure the indentation size to obtain the local hardness H;

[0150] Laser displacement sensor, used to scan the small height difference of the sample surface and assist in calculating the hardness difference ΔH between adjacent areas;

[0151] Thin film heat flow meter and micro heat source response unit detect the heat flow response of the sample surface after heating and estimate the thermal conductivity λ;

[0152] The identification sensor 18 is used to synchronously collect the data signals of the above detection devices and perform preliminary data integration and transmission.

[0153] The industrial camera is responsible for capturing the overall image of the sample surface, and uses grayscale distribution, color contrast and other algorithms to analyze changes in surface features in different areas of the sample. This is used to make preliminary judgments on the material interface and to assist in material identification and surface contamination detection.

[0154] The data processing module completes the identification of hardness H, adjacent hardness difference ΔH, plasticity δ (estimated based on the change in hardness and height difference), thermal conductivity λ, material feature C, and generates basic grinding parameters based on the comprehensive data of the detection device 17 and the industrial camera.

[0155] The above solutions have low equipment cost and moderate recognition accuracy, which are suitable for hardness testing and simple material analysis of batch samples or conventional materials. They have fast response speed and are suitable for production scenarios with general requirements for process accuracy and priority for economy.

[0156] Option 2:

[0157] The recognition module 14 is disposed below the conveying device 5 and also includes a detection device 17 , a recognition sensor 18 and an industrial camera, but is configured with a detection device with higher accuracy.

[0158] The detection device 17 and the identification sensor 18 are configured as follows:

[0159] Laser Raman spectrometer, used for contactless spectral scanning of sample surfaces, identifying the specific component C of metal or non-metal materials through characteristic peaks, achieving accurate material classification and content estimation;

[0160] ·Three-dimensional confocal microscope, through micron-level surface morphology measurement and micro-indentation tracking analysis, calculates the sample surface hardness H, adjacent hardness difference ΔH, and can analyze micro-area plasticity δ;

[0161] Thermal imaging sensor, which captures the heat flow distribution state of the sample surface under different temperature control environments in real time, and inversely calculates the thermal conductivity λ of the sample through the heat diffusion characteristic curve;

[0162] The identification sensor 18 integrates the data streams output by each device to form a complete material mechanical and thermal performance profile, and transmits it to the data processing module synchronously.

[0163] Industrial cameras use high-resolution imaging equipment to perform high-definition image scanning of the entire area of ​​the sample, superimpose spectral analysis layers, accurately distinguish multi-material interfaces, detect material transition areas, and correct morphological data errors.

[0164] The data processing module intelligently analyzes the correlation between various parameters based on the complete data set, optimizes the multi-stage control curve of the grinding plan, and ensures that the best grinding effect is achieved in different material areas.

[0165] The above solutions have excellent recognition accuracy and are suitable for full-parameter precise detection of complex samples of multiple materials. They can greatly improve the grinding quality control level and automatic matching capabilities, and are suitable for high-end sample preparation, scientific research samples or high-consistency industrial needs.

[0166] Working principle:

[0167] The sample to be ground and polished is bonded to the sample tray 9, and then the sample tray 9 is placed on the conveyor belt 58. The sample is automatically identified by the identification module 14, and the hardness H, adjacent hardness difference ΔH, plasticity δ, thermal conductivity λ and material composition C of each material area are detected, and the identified data are transmitted to the data processing module. The data processing module generates a grinding plan according to the following calculation steps based on the identification parameters:

[0168] ①Calculate the total grinding time;

[0169] ② Calculate the grinding times Ng;

[0170] ③Determine the abrasive selection Ac

[0171] ④Calculate the grinding pressure P;

[0172] ⑤Calculate the grinding speed R;

[0173] ⑥Temperature adjustment control;

[0174] After completing the above calculations, the parameters are automatically loaded into the PLC control system and the equipment starts to run automatically.

[0175] The conveying motor 53 drives the conveying motor belt through the conveying motor pulley to rotate the conveying intermediate wheel, and drives the conveying support wheel to drive the conveying belt 58 to make the sample loading tray 9 start to move. When it reaches the sample loading tray 31, the column motor drives the column shaft through the column coupling, so that the bottom support plate 21 drives the pressure shaft 26 in the pressure shaft seat to rotate above the sample loading tray 31.

[0176] At this time, the lifting cylinder 34 drives the sample tray 31 to rise, and at the same time, the electric cylinder 23 drives the pressure shaft 26 to move downward through the adapter shaft 24. Due to the relative force, the sample tray 9 and the pressure shaft 26 are connected together, and the limit top bead fixes the sample tray 9 on the pressure shaft 26. Then, the column motor drives the column shaft through the column coupling, so that the bottom support plate 21 drives the sample tray 9 on the pressure shaft 26 in the pressure shaft seat to rotate to the top of the grinding and polishing plate 63 and stop. The electric cylinder 23 drives the pressure shaft 26, the pressure sensor 27 and the sample tray 9 to move downward through the adapter shaft 24 to contact the grinding and polishing plate 63, and stops pressurizing after the set pressure value is fed back by the pressure sensor 27.

[0177] At this time, the pressure head motor drives the pressure head belt 213 to the pressure shaft pulley 210 through the pressure head motor pulley, and drives the sample loading plate 9 on the pressure shaft 26 to start rotating. At the same time, the grinding and polishing spindle motor 62 drives the spindle pulley on the grinding and polishing spindle through the grinding and polishing spindle belt on the grinding and polishing motor pulley, and the grinding and polishing spindle drives the grinding and polishing disc 63 to start rotating through the positioning pin, thereby grinding and polishing the sample on the sample loading plate 9.

[0178] After reaching the preset time, the electric cylinder 23 drives the sample tray 9 on the pressure shaft 26 to move upward. After stopping, the column motor drives the bottom support plate 21 and the sample tray 9 on the pressure shaft 26 to rotate to the top of the cleaning tank through the column shaft. After reaching the top, the electric cylinder 23 drives the sample tray 9 on the pressure shaft 26 to begin to descend into the cleaning tank. At this time, the water nozzle 613 starts to spray water to clean the sample tray 9. After a certain period of time, the ventilation nozzle 612 starts to blow natural wind to dry the sample tray 9.

[0179] After a certain period of time, the electric cylinder 23 drives the sample loading plate 9 on the pressure shaft 26 to move upward. After stopping, the column motor drives the bottom support plate 21 together with the sample loading plate 9 on the pressure shaft 26 to rotate again onto the grinding and polishing plate 63, and repeats the previous operation mode. The sample loading plate 9 grinds and polishes the sample on the grinding and polishing plate 63.

[0180] After the preset time is reached, the column motor drives the bottom support plate 21 and the sample tray 9 on the pressure shaft 26 to rotate to the top of the cleaning tank through the column shaft. After reaching the top, the electric cylinder 23 drives the sample tray 9 on the pressure shaft 26 to begin to descend into the cleaning tank. At this time, the water nozzle 613 starts to spray water to clean the sample tray 9. After a certain period of time, the ventilation nozzle 612 starts to blow natural wind to dry the sample tray 9.

[0181] After a certain period of time, the electric cylinder 23 drives the sample tray 9 on the pressure shaft 26 to move upward. After stopping, the column motor drives the bottom support plate 21 together with the sample tray 9 on the pressure shaft 26 to rotate to the top of the sample tray tray 31. After reaching the top, the electric cylinder 23 drives the sample tray 9 on the pressure shaft 26 to start descending and contacting the sample tray tray 31. At the same time, the rotating cylinder 42 drives the pressure plate 44 to move, so that the pressure plate 44 presses on the sample tray 9.

[0182] At this time, the electric cylinder 23 drives the sample tray 9 on the pressure shaft 26 to move upward, so that the sample tray 9 falls on the sample tray tray 31. Then, the conveying motor 53 drives the conveying motor belt through the conveying motor pulley to rotate the conveying intermediate wheel, and drives the conveying support wheel to drive the conveying belt 58 to make the sample tray 9 start to move to the unloading area.

[0183] At the same time, the column motor drives the bottom support plate 21 and the pressure shaft 26 through the column shaft to return to the loading area to continue to grab the next sample tray 9, and execute the above fully automatic grinding and polishing process of loading - grinding and polishing - cleaning (blow drying) - grinding and polishing - cleaning (blow drying) - unloading. The entire automation process is controlled by the program. The equipment runs automatically according to the recognition results and calculation parameters. No personnel are required to be on duty, and the sample grinding and polishing is completed efficiently and accurately.

[0184] Experiment 1:

[0185] Several copper (T2) inlaid samples are inlaid at the bottom of the sample tray 29 and placed in the device for testing:

[0186] The identification module 14 performs parameter identification on the copper (T2) inlay sample, and the test results are: sample hardness H = 50HV, adjacent hardness difference ΔH = 20HV, plasticity δ = 30%, thermal conductivity λ = 390W / (m·K), characteristic size D = 30mm, target surface roughness Ratarget = 0.05μm, inlay material is thermosetting resin, hardness 30HV, plasticity 10%, thermal conductivity 0.3W / (m·K), real-time temperature Tcurrent = 45°C, reference temperature Treference = 25°C. The data processing module determines the correction parameters according to the historical grinding data: time correction coefficient kt = 0.12, number correction coefficient kn = 1.1, pressure correction coefficient kp = 2, speed correction coefficient kr = 2, temperature correction coefficient kttemperature = 0.3.

[0187] The system automatically completes the parameter calculation: grinding time Tg = 0.12×(50×30) / 0.05 = 3,600s (1h), grinding times Ng = 1.1×(1+20 / 40) = 1.65 times (take 2 times), abrasive selection is A fine grinding, grinding pressure P = 2×(50 / 40)×30 = 75N, grinding speed R = 300-2×40 = 220rpm, temperature correction hardness H correction = 50-0.3×(45-25) = 44HV.

[0188] The equipment automatically runs according to the grinding plan. The sample carrier moves to the bottom of the pressure grinding and polishing head. The electric cylinder applies pressure to 75N, and the pressure sensor monitors in real time. The power module controls the grinding and polishing disc and the sample carrier to grind relative to each other at 220rpm, while monitoring the temperature. When it exceeds 50℃, the pressure is reduced to 60N, the speed is reduced to 198rpm, and the cooling water flow is increased. The hardness is corrected in real time. After the grinding is completed, it is cleaned and dried, and the material is unloaded after the second grinding is completed to achieve fully automated polishing, and finally a high-flatness, scratch-free surface is obtained.

[0189] Experiment 2:

[0190] Several steel (GCr15) embedded samples are embedded at the bottom of the sample tray 29 and placed in the equipment for testing:

[0191] The parameters of the steel (GCr15) inlay sample are identified by the identification module 14, and the test results are: sample hardness H = 62HV, adjacent hardness difference ΔH = 32HV, plasticity δ = 10%, thermal conductivity λ = 46W / (m·K), characteristic size D = 25mm, target surface roughness Ratarget = 0.02μm, inlay material is cold inlay acrylic resin, hardness 30HV, plasticity 5%, thermal conductivity 0.25W / (m·K), real-time temperature Tcurrent = 50°C, reference temperature Treference = 25°C. The data processing module calls the correction parameters: time correction coefficient kt = 0.1, number correction coefficient kn = 1.2, pressure correction coefficient kp = 2.5, speed correction coefficient kr = 2.5, temperature correction coefficient kttemperature = 0.4.

[0192] The system completes the parameter calculation: grinding time Tg = 0.1×(62×25) / 0.02 = 7,750s (about 2.15h), grinding times Ng = 1.2×(1+32 / 50) = 1.97 times (take 2 times), abrasive selection is A coarse grinding, grinding pressure P = 2.5×(62 / 50)×25 = 77.5N, grinding speed R = 300-2.5×50 = 175rpm, temperature corrected hardness H correction = 62-0.4×(50-25) = 52HV.

[0193] The control system automatically performs the grinding task according to the parameters. The sample tray moves to the grinding and polishing station, applies a pressure of 77.5N, and runs at a speed of 175rpm. After the temperature monitoring exceeds 50°C, the pressure is reduced to 62N, the speed is reduced to 157.5rpm, and the cooling water flow is increased. The hardness is dynamically corrected and the subsequent grinding parameters are adjusted. After two grinding and two cleaning cycles, the task is completed, the sample is unloaded, and a scratch-free, high-flatness precision surface is obtained.

[0194] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A fully automatic pressure grinding and polishing device, comprising a frame (1), characterized in that: A conveying device (5) is arranged outside the frame (1) for loading and unloading the inlaid samples; A pressure grinding and polishing head (2) is arranged in the frame (1) for carrying and applying pressure to the sample loading plate (29) for grinding; A grinding and cleaning device (6) is arranged in the frame (1) for cleaning and grinding the sample in the sample loading plate (29); The frame (1) comprises a control box (11), wherein a motion control module, a data processing module and a power module are arranged inside the control box (11); The conveying device (5) is provided with an identification module (14) for detecting material parameters of the embedded sample; The pressure grinding and polishing head (2) comprises a pressure shaft (26) and a pressure sensor (27) to achieve real-time monitoring and adjustment of grinding pressure.

2. The fully automatic pressure grinding and polishing equipment according to claim 1 is characterized in that: The pressure grinding and polishing head (2) comprises a bottom support plate (21), one side of the bottom support plate (21) is equipped with a column sleeve (214), the bottom of the column sleeve (214) is fixedly mounted on the top of the control box (11), and a column motor (217) is arranged inside the column sleeve (214) and can rotate to drive the bottom support plate (21) to flip; The other side of the bottom support plate (21) is equipped with an electric cylinder fixing seat (22), and the pressure shaft (26) is assembled on the bottom end of the electric cylinder fixing seat (22) through a transfer shaft (24). The pressure shaft (26) is driven to rise and fall by the electric cylinder (23), and the pressure shaft (26) is driven to rotate by a pressure shaft pulley (210) and a pressure head belt (213). The bottom end of the pressure shaft (26) is used for clamping and positioning with a sample loading plate (29).

3. The fully automatic pressure grinding and polishing equipment according to claim 1 is characterized in that: The unloading device (3) comprises a sample tray (31) and a lifting cylinder (34), wherein the lifting cylinder (34) is connected to the sample tray (31) to drive the sample tray (31) to move upward and downward; The sample tray (31) is used to receive the sample tray (29) located at the bottom of the pressure polishing head (2) after the pressure polishing head (2) is separated from the sample tray (29), and release the sample tray (29) onto the conveying device (5) after receiving the sample tray (29). The positioning device (4) comprises a pressure plate bracket (41) and a rotating cylinder (42). The rotating cylinder (42) is connected to the pressure plate (44) and is used to drive the pressure plate (44) to flip and press or release the sample loading plate (29).

4. The fully automatic pressure grinding and polishing equipment according to claim 1 is characterized in that: The conveying device (5) comprises a conveying motor (53) and two conveying belts (58), wherein the two conveying belts (58) are respectively located below the two sides of the sample loading tray (29), and are used to support the lower surfaces of the two sides of the sample loading tray (29) and drive it to move along the conveying direction, thereby realizing automatic transmission of the sample loading tray (29).

5. The fully automatic pressure grinding and polishing equipment according to claim 1 is characterized in that: The grinding and cleaning device (6) comprises a grinding and polishing spindle (62), a grinding and polishing disc (63), a cleaning water tank (611), a water spray nozzle (613) and a vent nozzle (612); the grinding and polishing spindle (62) drives the grinding and polishing disc (63) to rotate to grind the sample on the sample loading disc (29); The water spray nozzle (613) is arranged in the cleaning water tank (611) for spray cleaning, and the ventilation nozzle (612) is used for blowing dry the sample loading plate (29).

6. The fully automatic pressure grinding and polishing equipment according to claim 1 is characterized in that: The control box (11) comprises a motion control module, a data processing module and a power module. The action control module is used to control the operation steps and switching of the identification module (14), the pressure grinding and polishing head (2), the conveying device (5) and the grinding and cleaning device (6); The data processing module is used to receive data transmitted by the identification module (14), including parameters such as hardness (H), adjacent hardness difference (ΔH), plasticity (δ), thermal conductivity (λ), material composition (C), etc., and generate a grinding plan based on the data; The power module is used to provide energy supply for motion execution components such as the pressure grinding and polishing head (2), the conveying device (5), the grinding and cleaning device (6), etc.

7. The fully automatic pressure grinding and polishing equipment according to claim 1 is characterized in that: The identification module (14) is located below the conveying device (5) and is integrated with a detection device (17), an identification sensor (18) and an industrial camera; The identification sensor (18) includes a small load Vickers hardness tester, a laser displacement sensor, a thin film heat flux meter and a micro heat source response device, which are respectively used to detect the hardness (H), adjacent hardness difference (ΔH), plasticity (δ) and thermal conductivity (λ) of the embedded sample; Industrial cameras are used for image acquisition and material composition (C) analysis; The detection device (17) is used to receive data transmitted by the identification sensor (18) and the industrial camera, integrate the hardness (H), adjacent hardness difference (ΔH), plasticity (δ), thermal conductivity (λ) and material composition (C) parameters of the sample, and send the integrated data to the data processing module for analysis and calculation.

8. The control method of the fully automatic pressure grinding and polishing equipment according to claim 1: It includes material identification steps and grinding control steps, specifically: Step 1, obtaining the hardness (H), adjacent hardness difference (ΔH), plasticity (δ), thermal conductivity (λ) and material type (M) of each material in the embedded sample through the identification module (14); Step 2: Generate a grinding plan based on the parameters, wherein the grinding plan includes grinding pressure (P), rotation speed (R), grinding time (T g )、Number of grinding times (N g ), abrasive replacement (A c ) and the number of cleaning times (N c ); Step 3: monitor the temperature (T) in real time during the grinding process. When the temperature exceeds the set value (T (max) ), adjust the pressure, speed and cooling water flow; ΔH Step 4: Perform multi-stage grinding operations according to the grinding plan and temperature adjustment to complete the fully automatic grinding and polishing of the mounted sample.

9. The control method of the fully automatic pressure grinding and polishing equipment according to claim 8 is characterized in that: Grinding time (T g ) is calculated according to the following formula: Among them, T g is the total grinding time; k t is the time correction factor; D is the characteristic size of the sample surface; Ra1 is the target surface roughness; Grinding times (N g ) is calculated according to the following formula: Among them, N g is the number of grinding times; k n is the frequency correction factor; ΔH is the hardness difference between adjacent materials; H avg is the average hardness of the entire material of the sample; Abrasive selection (Ac) is determined by the following formula: Among them, A c Abrasive for selection; A1, A2 and A3 are coarse abrasive, medium abrasive and fine abrasive respectively; H max is the maximum hardness value; δ1 is the plasticity percentage.

10. The control method of the fully automatic pressure grinding and polishing equipment according to claim 8, characterized in that: The grinding pressure (P) is calculated according to the following formula: Among them, k p is the pressure correction factor; H max It is the hardness value of the material with the highest hardness in the sample; H avg is the average hardness value of the entire sample material; D avg is the average diameter or characteristic size of the sample surface; The grinding speed (R) is calculated according to the following formula: R = R0-k r ·H avg Among them, R0 is the default basic speed; k r is the speed correction factor; H avg is the average hardness value of the entire sample material; When the temperature (T) exceeds the set value (T (max) ): Dynamically adjust the grinding parameters, including: Reduce grinding pressure (P = P × 0.8) Reduce grinding speed (R = R × 0.9) Increase cooling water flow to reduce grinding temperature; At the same time, the hardness parameters are corrected, and the hardness correction value (H adj ) is calculated according to the following formula: H adj =H-k t ·(T-T0); Where H is the initial measured material hardness; k t is the temperature effect correction factor; T is the real-time monitoring temperature; T0 is the reference temperature.

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