Circuit board processing equipment and tool changing control method

Abstract

The invention provides circuit board processing equipment, which comprises a workbench, a plurality of cutter head areas, a plurality of cutter head positioning devices, a plurality of cutter head positioning devices and a plurality of cutter head positioning devices, and is characterized in that each cutter head area is used for storing a cutter head; a first cache assembly and a second cache assembly are arranged on the two sides of the workbench in the first direction; and the multiple main shaft assemblies are connected to the portion, above the workbench, of the cross beam in a sliding mode, and the main shaft assemblies are configured to carry the cutterheads among the first temporary storage assembly, the cutterhead area and the second temporary storage assembly. The invention further provides a tool changing control method. According to the circuit board machining equipment and the tool changing control method, full-automatic tool disc changing is achieved, cost is reduced, space is saved, and the tool disc changing efficiency is improved.

Description

Technical Field

[0001] The present disclosure relates to the technical field of equipment or methods for processing printed circuit boards, and more specifically, to a circuit board processing equipment and a tool changing control method. Background Art

[0002] At present, in order to improve the production efficiency of circuit board processing equipment, circuit board processing equipment is developing in the direction of automation and intelligence. During the operation of circuit board processing equipment, circuit boards and tools need to be replaced. Transfer equipment and AGV equipment can be used to realize automatic replacement of circuit boards. The cutter disc for loading the tool is fixedly set on the cutter disc area of ​​the workbench. How to realize the fully automatic replacement of the cutter disc is a technical problem that technicians in this field urgently need to solve.

[0003] Public Content

[0004] In order to solve the problems existing in the prior art, the present disclosure provides a circuit board processing device and a tool changing control method.

[0005] According to a first aspect of the present disclosure, there is provided a circuit board processing device, comprising: a workbench, the workbench comprising a plurality of cutter disc areas, each cutter disc area being used to store a cutter disc; a first cache assembly and a second cache assembly being arranged in a first direction on both sides of the workbench; and a spindle assembly, a plurality of spindle assemblies being slidably connected to a crossbeam above the workbench, the spindle assembly being configured to transport the cutter disc between the first cache assembly, the cutter disc area, and the second cache assembly.

[0006] In some embodiments of the present disclosure, the first cache assembly and the second cache assembly include a plurality of cache areas for placing tool discs arranged along a second direction; at least a portion of the first cache assembly or the second cache assembly overlaps with a projection portion of the spindle assembly on the base.

[0007] In some embodiments of the present disclosure, the first cache component is provided with a first cache area, the second cache component is provided with a second cache area, the first cache area, the second cache area and a plurality of tool disc areas are linearly arranged along a first direction, and the spindle component is controlled to move the tool disc between the first cache area, the tool disc area and the second cache area.

[0008] In some embodiments of the present disclosure, the first cache component and the second cache component include a transfer member and at least two layers of cache portions stacked along the height direction, each layer of cache portion includes multiple cache areas; the transfer member is raised and lowered along the height direction to align each layer of cache portion.

[0009] In some embodiments of the present disclosure, the spindle assembly transports the cutter head from the transfer member to the cutter head area.

[0010] In some embodiments of the present disclosure, at least one spindle assembly is used to transport the cutter disc along a first direction between two adjacent cutter disc areas; alternatively, a plurality of spindle assemblies synchronously transport a plurality of cutter discs along the first direction.

[0011] In some embodiments of the present disclosure, at least one cutter disc is relayed by multiple spindle assemblies, stays in multiple adjacent cutter disc areas in sequence, and moves from a first cache assembly to a second cache assembly.

[0012] In some embodiments of the present disclosure, in at least one cutterhead zone, cutterheads in the cutterhead zone are first unloaded to the second cache assembly, and then cutterheads transported from an adjacent cutterhead zone or the first cache assembly are received;

[0013] Alternatively, in at least one cutter disc area, the cutter discs in the cutter disc area are first unloaded to an adjacent cutter disc area or a second cache component, and then the cutter discs transported from the first cache component are received.

[0014] In some embodiments of the present disclosure, the tool disc includes a lifting portion, the spindle assembly includes a first robot arm and a spindle clamp, and the spindle assembly picks up the lifting portion through the first robot arm or the spindle clamp to carry the tool disc.

[0015] In some embodiments of the present disclosure, the tool disc includes two lifting parts, and the spindle assembly synchronously picks up the lifting parts through two robotic arms to synchronously transport the tool disc.

[0016] In some embodiments of the present disclosure, the spindle assembly is provided with a first robotic arm and a second robotic arm, and the first robotic arm and the second robotic arm synchronously pick up the lifting portion to transport the tool disc; or, a third robotic arm is slidably connected to the crossbeam, and the third robotic arm is located close to the first cache assembly, and is used to transport the tool disc in the first cache assembly to the tool disc area; or, the third robotic arm is located close to the second cache assembly, and is used to transport the tool disc in the tool disc area to the second cache assembly.

[0017] In some embodiments of the present disclosure, the first cache assembly and the second cache assembly include a driving member, which drives the cutter disc to move along the second direction between the plurality of cache areas.

[0018] According to a second aspect of the present disclosure, a tool changing control method is provided, which is applied to circuit board processing equipment, including: controlling at least one spindle component to transfer multiple old tool discs between a tool disc area and a second cache component; moving the old tool discs in the tool disc area to the second cache component in sequence, and cache the multiple old tool discs on the second cache component; cache the multiple new tool discs on the first cache component; controlling at least one spindle component to transfer multiple new tool discs between the first cache component and the tool disc area, and moving the multiple new tool discs in the first cache component to the tool disc area.

[0019] In some embodiments of the present disclosure, in the first cache assembly and the second cache assembly, a plurality of cutter discs move along the second direction; between a plurality of adjacent cutter disc areas, the cutter discs move along the first direction, and the first direction is perpendicular to the second direction.

[0020] According to a third aspect of the present disclosure, there is provided a circuit board processing device, comprising: a workbench, the workbench comprising a plurality of cutter disc areas, each cutter disc area being used to store the cutter disc; a first cache assembly being arranged in a first direction on one side of the workbench; and a spindle assembly, a plurality of spindle assemblies being slidably connected to a crossbeam above the workbench, the spindle assembly being configured to transport the cutter disc between the first cache assembly and the cutter disc area.

[0021] The above-mentioned cutter disc, circuit board processing equipment and tool change control method disclosed in the present invention have the following technical effects: (1) Through the first cache component and the second cache component, on the transport path formed by the cutter disc area, the spindle component transmits and transfers the cutter disc laterally along the first direction, so that the cutter disc can be raised and lowered from the left and right sides of the workbench, providing a solution for fully automatic cutter disc replacement. (2) A lifting part is set on the cutter disc, and the spindle assembly is used to pick up the cutter disc, providing a technical solution for replacing the cutter disc from the front side, saving equipment and workshop space and lowering the cost. (3) This circuit board processing equipment saves space on the workbench, improves tool change efficiency, and provides the most cost-effective solution for fully automatic cutter disc replacement of circuit board processing equipment.

[0022] Other features and advantages of the present disclosure will become apparent from the following detailed description of exemplary embodiments of the present disclosure with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0024] Figure 1 It is a partial structural schematic diagram of replacing a circuit board and a cutter disc in a circuit board processing device provided by an embodiment of the present disclosure;

[0025] Figure 2 It is a partial structural schematic diagram of a circuit board processing device provided by an embodiment of the present disclosure;

[0026] Figure 3 It is a partial structural schematic diagram of a circuit board processing device provided by an embodiment of the present disclosure;

[0027] Figure 4 It is a partial structural schematic diagram of a circuit board processing device provided by an embodiment of the present disclosure;

[0028] Figure 5 It is a partial structural schematic diagram of a circuit board processing device provided by an embodiment of the present disclosure;

[0029] Figure 6 is a partial structural diagram of a first cache component provided by an embodiment of the present disclosure;

[0030] Figure 7 is a partial structural diagram of a first cache component provided by an embodiment of the present disclosure;

[0031] Figure 8 It is a schematic diagram of the structure of a cutter disc provided in an embodiment of the present disclosure;

[0032] Fig. 9 It is a schematic diagram of the structure of a cutter disc provided in an embodiment of the present disclosure;

[0033] Fig.10 It is a partial structural schematic diagram of a circuit board processing device provided by an embodiment of the present disclosure;

[0034] Fig.11 It is a partial structural schematic diagram of a circuit board processing device provided by an embodiment of the present disclosure;

[0035] Fig.12 It is a partial structural schematic diagram of a circuit board processing device provided by an embodiment of the present disclosure;

[0036] Fig.13 It is a partial structural schematic diagram of a circuit board processing device provided by an embodiment of the present disclosure;

[0037] Fig.14 It is a partial structural schematic diagram of a circuit board processing device provided by an embodiment of the present disclosure;

[0038] Fig.15 It is a partial structural schematic diagram of a circuit board processing device provided by an embodiment of the present disclosure;

[0039] Figures 1 to 15 The one-to-one correspondence between the component names and the reference numerals is as follows: 100, circuit board processing equipment; 200, cutter head transfer equipment; 300, circuit board transfer equipment; 400, transfer equipment;

[0040] 10. Workbench; 20. Spindle assembly; 30. Crossbeam; 40. Base; 11. Processing area; 12. Cutter disc area; 121. First Cutter disc area; 122. Second Cutter disc area; 123. Third Cutter disc area; 124. Fourth Cutter disc area; 13. First cache assembly; 130. Cache part; 131. First cache area; 132. Transfer part; 133. Drive part; 134. Guide groove; 14. Second cache assembly; 141. Second cache area; 21. Spindle clamp; 22. First robot arm; 23. Second robot arm; 24. Third robot arm; 201. First spindle assembly; 204. Fourth spindle assembly; 50. Cutter disc; 51. Main body; 52. Middle area; 53. Grid groove; 54. Cutter hole; 55. Lifting part. DETAILED DESCRIPTION

[0041] Various exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings. It should be noted that unless otherwise specifically stated, the relative arrangement of the components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present disclosure. The following description of at least one exemplary embodiment is actually merely illustrative and is by no means intended to limit the present disclosure and its application or use. Techniques, methods and equipment known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the techniques, methods and equipment should be considered part of the specification. It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0042] The specific embodiments of the present disclosure are described below in conjunction with the accompanying drawings. In this article, "upper", "lower", "front", "back", "left", "right", etc. are only used to indicate the relative position relationship between the relevant parts, rather than to limit the absolute positions of these relevant parts. In this article, "first", "second", "third", "fourth", etc. are only used to distinguish each other, rather than to indicate the importance and order, as well as the premise of mutual existence, etc. In this article, "equal", "same", "aligned", "vertical", "horizontal", "back side", "front side", "synchronous", "sequentially", "overlap", "symmetric", "center of gravity", etc. are not strict mathematical and / or geometric limitations, but also include errors that can be understood by those skilled in the art and allowed by manufacturing or use.

[0043] like Figure 1As shown, the tool change management system in the present disclosure includes a circuit board processing device 100 and a cutter disc transfer device 200. Under the control of the tool change management system, the cutter disc transfer device 200 moves to the front side of the circuit board processing device 100 and exchanges the cutter disc with the circuit board processing device 100. During the loading process, the cutter disc transfer device 200 loads a new cutter disc from the cutter disc warehouse and moves to the first cache component 13 aligned with the front side of the circuit board processing device 100, and then transfers the new cutter disc to the first cache component 13. During the unloading process, the second cache component 14 of the circuit board processing equipment 100 transfers the old cutter disc to the cutter disc transfer device 200, and the cutter disc transfer device 200 then transfers the old cutter disc to the cutter disc warehouse. In actual application scenarios, in order to improve the tool change efficiency and save the time of changing the cutter disc, the old cutter discs are unloaded in sequence, and the new cutter discs are loaded in sequence. The new cutter disc is transferred first and then the old cutter disc, or the old cutter disc is transferred first and then the new cutter disc. For example, the cutter disc transfer device 200 first moves to align with the second buffer component 14, and the circuit board processing equipment 100 first transfers the old cutter disc to the cutter disc transfer device 200; then, the cutter disc transfer device 200 moves to align with the first buffer component 13, and the cutter disc transfer device 200 transfers the new cutter disc to the circuit board processing equipment 100, and the two processes are performed in sequence to improve the efficiency of tool change. Alternatively, the cutter disc transfer device 200 first transfers the new cutter disc to the circuit board processing equipment 100, and the normal processing of the circuit board processing equipment is not affected during the transfer process; then, the circuit board processing equipment 100 transfers the old cutter disc to the cutter disc transfer device 200, and the two processes are performed in sequence to improve the efficiency of tool change.

[0044] In the upper and lower embodiments of the present disclosure, in the cutter disc warehouse, the cutters in the old cutter disc are processed by milling, grinding and other processes, and then inspected, sorted and sorted into new cutter discs, and then transported to the circuit board processing equipment for continued use. On the circuit board processing equipment, the new cutter is used to the preset life and then retracted into the cutter disc, and then transported to the cutter disc warehouse for processing and continued use. This reciprocating cycle is carried out until the cutter does not meet the parameter requirements of the processing technology and is scrapped. Therefore, the cutter disc includes a new cutter disc and an old cutter disc, and the new cutter disc and the old cutter disc, the new cutter and the old cutter disc are relative. The new cutter disc includes unused new cutters that have not reached their lifespan, and the old cutter disc includes old cutters that have reached their preset lifespan and have been used. For the cutter disc replacement system of the circuit board processing equipment, loading refers to transferring the new cutter disc from the cutter disc transfer device 200 through the first buffer component 13 to the cutter disc area on the workbench for the corresponding spindle assembly to select and use; unloading refers to transferring the old cutter disc from the cutter disc area on the workbench through the second buffer component 14 to the cutter disc transfer device 200, and retracting the cutter to the cutter disc warehouse.

[0045] The circuit board processing equipment also includes a front baffle, a safety door and a human-machine interaction component. With the crossbeam 30 as a reference, the spindle assembly 20, the front baffle, the safety door and the human-machine interaction component are arranged on the front side, and an opening for exchanging circuit boards with the transfer equipment 400 is arranged on the rear side. Figure 1 As shown, the circuit board processing equipment layer 100 replaces the cutter disc with the cutter disc transfer device 200 from the front side, and replaces the circuit board with the transfer device 400 and the circuit board transfer device 300 from the back side. The workbench 10 is below the crossbeam 30 and reciprocates between the front side and the back side to achieve displacement in the second direction. The cutter disc area 12 is arranged on the front side of the workbench 10, and is located on the front side of the crossbeam 30 together with the front baffle, the safety door, and the human-computer interaction component. In the upper and lower embodiments of the present disclosure, the human-computer interaction component includes a display screen, a keyboard, a mouse, etc., which are used by technicians to monitor and manage the parameters of the circuit board processing equipment; the front baffle and the safety door constitute the guardrail and isolation wall on the front side, which play a role in safety protection.

[0046] Circuit board processing equipment, such as Figure 1 , Figure 2 , Figure 3 As shown, before processing the circuit board, the first step is loading, and the loading here includes transferring a new cutter disc and a new circuit board to the circuit board processing equipment. The cutter disc transfer equipment 200 transfers multiple cutter discs to the cutter disc area 12 through the first cache component 13 on the left side of the workbench, and a cutter disc is placed in each cutter disc area 12. The circuit board is then transferred to the processing area 11 through the transportation component on the workbench, and a circuit board is placed in each processing area 11. The cutter disc is loaded with multiple tools for processing the circuit board. In the process of the first cache component 13 transferring the cutter disc to the cutter disc area 12, the spindle clamp 21 of the spindle assembly 20 or the first robot arm 22 picks up the lifting part 55 on the cutter disc, and the multiple cutter discs are transferred from the first cache component 13 to the cutter disc area 12 in sequence.

[0047] The second is tool grabbing. The spindle assembly 20 and the workbench 10 move relative to each other. The first mechanical arm 22 of the spindle assembly 20 picks up the tool in the tool disk corresponding to the spindle assembly and transfers the tool to the tool holder. The spindle clamp 21 of the spindle assembly picks up the tool on the tool holder and moves along the third direction to process the circuit board carried on the processing area 11 of the workbench 10. After the tool has completed processing or reached the end of its life, the tool is first retracted. The spindle assembly 20 and the workbench 10 move relative to each other. The spindle clamp 21 retracts the clamped tool to the tool holder in the tool disk area. The first mechanical arm 22 picks up the tool on the tool holder and unloads it into the tool disk corresponding to the tool disk area 12.

[0048] The last step is unloading, which includes the circuit board processing equipment 100 transferring the cutter disc to the second cache assembly 14, and transferring the circuit board to the transfer equipment 400 and the circuit board transfer equipment 300 through the transportation assembly. After the transportation assembly rises, it lifts the circuit board and transfers the processed circuit board outward. The first robot arm 22 of the spindle assembly 20 picks up the lifting part 55 of the cutter disc, transfers the cutter disc from the cutter disc area 12 to the second cache assembly 14, and transfers the cutter disc to the cutter disc transfer equipment 200 through the second cache assembly 14. Finally, the cutter disc transfer equipment 200 transfers the cutter disc to the cutter disc warehouse.

[0049] In the upper and lower embodiments of the present disclosure, the frequency of changing the cutter disc is less than the frequency of changing the circuit board. That is to say, the circuit board must be replaced when the cutter disc is replaced, but the cutter disc does not necessarily need to be replaced when the circuit board is replaced, because each cutter disc has multiple types of cutting tools built in to meet the needs of processing at least one circuit board. Therefore, on the workbench 10, the circuit board also needs to be replaced when the cutter disc is replaced. At the same time, the circuit boards carried by the workbench are transferred from the front side of the circuit board processing equipment to the back side, and the circuit boards are exchanged with the transfer equipment 400 from the opening on the back side. The cutter disc is loaded from the first cache component 13 on the left side of the workbench, and transferred to the second cache component 14 on the right side for unloading. As shown Figure 3 , Figure 4 , Figure 5 As shown, the cutter disc is located in the cutter disc area 12, and the circuit board is located in the processing area 11. The cutter disc area 12 and the processing area 11 on the workbench 10 do not conflict or overlap with each other. Including but not limited to the following three methods: one is that the workbench replaces the cutter disc and the circuit board at the same time, the processing area exchanges the new circuit board and the old circuit board, and the cutter disc area exchanges the new cutter disc and the old cutter disc. This method can improve the efficiency of tool and material change. The second is that the workbench replaces the circuit board first and then the cutter disc, the processing area first exchanges the new circuit board and the old circuit board, and then the cutter disc area exchanges the new cutter disc and the old cutter disc. The third is that the workbench replaces the cutter disc first and then the circuit board, the cutter disc area first exchanges the new cutter disc and the old cutter disc, and then the processing area exchanges the new circuit board and the old circuit board. The second and third methods, although they take too long, can avoid the interference, occupation and congestion of the cutter disc and the circuit board in the workbench space, the equipment changes are small, the cost is saved, and the feasibility is high.

[0050] like Figures 2 to 5As shown, the circuit board processing equipment 100 disclosed in the present invention includes a base 40, a crossbeam 30, a spindle assembly 20, a workbench 10, etc. The workbench 10 is arranged on the base 40 and moves along the second direction. The crossbeam 30 is mounted above the workbench 10, and at least one spindle assembly 20 is slidably connected to the crossbeam 30. At least one spindle assembly 20 moves along the first direction on the crossbeam 30. Each spindle assembly 20 clamps a tool at the bottom end, and the tool moves along the third direction to process the circuit board carried on the workbench 10. At least one processing area 11 and a cutter disc area 12 are arranged on the workbench 10. Each processing area 11 carries a circuit board. A corresponding cutter disc area 12 is arranged outside each processing area 11. The spindle assembly 20 picks up the tool in the cutter disc area 12 to process the circuit board in the corresponding processing area 11. The first direction, the second direction, and the third direction are perpendicular to each other. In the upper and lower embodiments of the present disclosure, the direction along the crossbeam is the first direction, the direction of movement of the workbench is the second direction, and the height direction is the third direction. These three directions are perpendicular to each other and will not be repeated here. In the contextual embodiments of the present disclosure, the circuit board processing equipment can be implemented as drilling equipment, forming equipment, gong machine equipment, drilling and gong integrated equipment, etc., which are not limited here. The number of spindle assemblies of the circuit board processing equipment can be one, two, three, four, five, six, ten, twelve, etc. The processing area and the cutter head area on the workbench correspond to the spindle assemblies one by one, and the number of the processing area, the cutter head area and the spindle assemblies is the same.

[0051] like Figure 2 , Fig.10 , Fig.11 , Fig.12 , Fig.13 As shown, the circuit board processing equipment 100 includes a workbench 10, and the workbench 10 includes a cutter disc area 12 and a processing area 11. The cutter disc area 12 and the processing area 11 are arranged in staggered layers, and the height of the cutter disc area 12 is slightly lower than the height of the processing area 11. The cutter disc area 12 can store a cutter disc 50; the processing area 11 can carry a circuit board. The circuit board is fixed on the processing area 11 of the workbench 10 by air clamping, adsorption, etc., and the cutter disc is fixed in the cutter disc area 12 by magnetic attraction, etc.

[0052] In order to realize automatic replacement of the cutter disc, the present disclosure provides a circuit board processing device 100, comprising: a workbench 10, the workbench 10 includes a plurality of cutter disc areas 12, each cutter disc area 12 is used to store the cutter disc; a first cache component 13 and a second cache component 14 are arranged in a first direction on both sides of the workbench 10; a spindle component 20, a plurality of spindle components 20 are slidably connected on a crossbeam 30 above the workbench 10, and the spindle component 20 is configured to transport the cutter disc between the first cache component 13, the cutter disc area 12, and the second cache component 14. In this circuit board processing device, the spindle component 20 transmits and transfers the cutter disc laterally along the first direction on the transport path formed by the cutter disc area 12 through the first cache component 13 and the second cache component 14, so as to realize the removal of the cutter disc from the left and right sides of the workbench 10, and provide a method for fully automatic replacement of the cutter disc.

[0053] In some embodiments of the present disclosure, Figure 2 , Figure 3 , Figure 4 , Figure 5 As shown, a first cache assembly 13 is arranged on the left side of the workbench 10, and a second cache assembly 14 is arranged on the right side. The first cache assembly 13 and the second cache assembly 14 are fixed on the base 40, or on the pad between the base 40 and the crossbeam 30. The first cache assembly 13 and the second cache assembly 14 include a plurality of cache areas arranged along the second direction for placing the cutter discs. The plurality of cache areas are arranged linearly along the second direction, and each cache area can accommodate a cutter disc. Figure 6 As shown, the first cache component 13 includes a driving member 133, and the driving member 133 drives the cutter disc to move along the second direction between multiple cache areas. A guide groove 134 is provided in the middle area of ​​the first cache component 13 along the second direction, and the guide groove 134 is used to cooperate with the pin on the top of the cutter disc to position and guide the cutter disc. In some preferred embodiments, the driving member 133 can be a pulley assembly. It should be noted that the second cache component 14 has the same structure as the first cache component 13, and also includes a driving member, a guide groove, etc. The structure and function are similar and will not be repeated here.

[0054] like Figure 3 , Figure 4 , Figure 5 As shown, the first cache assembly 13 and the second cache assembly 14 extend along the second direction on both sides of the workbench 10 and extend to below the spindle assembly 20 on the crossbeam 30, so that at least a portion of the first cache assembly 13 or the second cache assembly 14 overlaps at least partially with the projection of the spindle assembly 20 on the base. A plurality of spindle assemblies 20 are slidably connected to the crossbeam 30 along the first direction, and each spindle assembly 20 can independently move along the first direction on the crossbeam 30, such as Figure 3As shown, the spindle assembly 20 can move to the left to above the first cache assembly 13 or to the right to above the second cache assembly 14 on the crossbeam 30. The first spindle assembly 20 includes a first spindle assembly 201 on the far left and a fourth spindle assembly 204 on the far right. The first cache assembly includes a first cache area 131 at the front end, and the second cache assembly includes a second cache area 141 at the front end. During the loading process, the spindle assembly 20 moves toward the first cache assembly 13, and the first spindle assembly 201 moves to above the first cache area 131, so as to pick up the new cutter disc in the first cache area 131 and transport it to the adjacent first cutter disc area 121. Figure 4 As shown, the first cache area 131 of the first cache assembly 13 partially overlaps with the projection of the first spindle assembly 201 on the base, so that the first spindle assembly 201 can carry the cutter disc in the first cache area 131. Similarly, during the unloading process, the spindle assembly 20 moves toward the second cache assembly 14, and the fourth spindle assembly 204 moves to the top of the second cache area 141, so as to facilitate the carrying of the old cutter disc from the fourth cutter disc area 124 to the second cache area 141. Figure 5 As shown, the second cache area 141 of the second cache assembly 14 overlaps with the projection of the fourth spindle assembly 204 on the base, so that the fourth spindle assembly 204 can carry the cutter disc of the fourth cutter disc area 124 to the second cache area 141. This configuration and structure uses the spindle assembly 20 to transfer the cutter disc laterally along the first direction, which is conducive to saving space and cost, and provides a new circuit board processing equipment for replacing the cutter disc from the front side. As a preferred embodiment, the spindle assembly 20, the cutter disc area 12 and the first cache assembly 13 and the second cache assembly 14 are located on the same side of the crossbeam 30: the front side, or in other words, on the operating side of the circuit board processing equipment 100.

[0055] In some embodiments of the present disclosure, the first cache component is provided with a first cache area, the second cache component is provided with a second cache area, the first cache area, the second cache area and the plurality of cutter disc areas are linearly arranged along a first direction, and the spindle component is controlled to transport the cutter disc between the first cache area, the cutter disc area and the second cache area. Figure 3 , Figure 4 , Figure 5As shown, the first cache assembly 13 includes a plurality of cache areas, each of which can accommodate a cutter disc. When the first cache assembly 13 extends to below the spindle assembly 201 on the crossbeam 30, the spindle assembly on the crossbeam can only move in the first direction and cannot move in the second direction. Therefore, the first cache area 131 on the first cache assembly 13 that is closest to the crossbeam is located directly below the first spindle assembly 201, so that the first spindle assembly 201 is aligned with the lifting portion of the cutter disc of the first cache area 131. When the cutter disc is transported, the spindle assembly 201 can just pick up the cutter disc in the first cache area 131, so that the spindle assembly can transport the cutter disc from the first cache assembly to the cutter disc area. In this embodiment, the first cache area 131 is the cache area closest to the spindle assembly 20 in the second direction. In the second direction, the first cache area 131 is located directly below the first spindle assembly 201. Similarly, the second cache area 141 of the second cache assembly 14 is located directly below the fourth spindle assembly 204 . After the cutter disc is transported from the cutter disc area 12 to the second cache assembly 14 , the fourth spindle assembly 204 is aligned with the lifting portion of the cutter disc in the second cache area 141 .

[0056] like Figure 2 , Figure 3 , Figure 4 , Figure 5 As shown, the first cache area 131 is the area on the first cache component 13 where the cutter disc is stored, and the second cache area 141 is the area on the second cache component 14 where the cutter disc is stored. In the second direction, the first cache area 131 is the frontmost area of ​​the first cache component 13, and the second cache area 141 is the frontmost area of ​​the second cache component 14. In the first direction, the first cache area 131, multiple cutter disc areas 12, and the second cache area 141 form a linearly arranged transmission path, all of which are located below the multiple spindle components 20, and the multiple spindle components 20 are controlled to transport the cutter discs between the first cache area 131, multiple cutter disc areas 12, and the second cache area 141, thereby realizing the automated circulation of the cutter discs.

[0057] Specifically, for the four cutterhead areas, correspondingly, Figure 2 , Figure 3 As shown, there are four spindle assemblies from left to right in the first direction of the crossbeam 30, and the four cutter disc areas and the first buffer area and the second buffer area constitute a transmission path, and the four spindle assemblies are relayed or carried simultaneously in sequence. The following describes in detail the process of transferring the cutter discs of the first buffer area, the second buffer area and the four cutter disc areas.

[0058] The first step is to cut the material, such as Figure 2 , Figure 3 , Figure 5As shown, the four spindle assemblies 20 align the old cutter discs in the four cutter disc areas 12, pick up the lifting parts on the corresponding old cutter discs respectively, and move synchronously or relay along the first direction to transport the cutter discs. For the spindle assembly 20, the four spindle assemblies 20 synchronously transport the four old cutter discs along the first direction, or the four spindle assemblies 20 relay transport the four old cutter discs along the first direction. For the first cutter disc in the first cutter disc area 121, it is first transported synchronously by the four spindle assemblies 20, and then relayed by the other three spindle assemblies 20, and then stays in four adjacent cutter disc areas 12 in sequence, and moves from the cutter disc area 12 to the second cache assembly 14. For the cutter disc area 12, the cutter disc in the fourth cutter disc area is first unloaded by the fourth spindle assembly 204 to the second cache area 141 of the second cache assembly, and then receives the cutter discs transported from the adjacent third cutter disc area 123, the second cutter disc area 122, and the first cutter disc area 121 in sequence. The cutter disc area 12 on the workbench is unloaded first and then loaded. After the old cutter discs are unloaded to the second cache assembly 14 according to the predetermined path and sequence, the drive member in the second cache assembly 14 sequentially transfers the cutter discs along the second direction, and the four old cutter discs are arranged along the second direction in the four cache areas of the second cache assembly 14. The four old cutter discs on the second cache assembly 14 are transferred to the cutter disc warehouse by the cutter disc transfer device 200.

[0059] Next, the cutter disc transfer device 200 transfers the new cutter disc to the first buffer assembly 13, and the first buffer assembly 13 receives four new cutter discs in sequence through the driving member. Figure 2 , Figure 3 , Figure 4 As shown, after receiving the control information of loading, the first new cutter disc in the first buffer area 131 is in the frontmost stack position, and the adjacent first spindle assembly 201 picks up the lifting part of the first new cutter disc, and transfers it from the first buffer area 131 to the first cutter disc area 121, and then passes through the second cutter disc area 122 and the third cutter disc area 123 and transfers it to the fourth cutter disc area 124 through the relay transportation of multiple spindle assemblies 20. On the first buffer assembly 13, the second new cutter disc in the second stack is pushed to the first buffer area 131 by the driving member, and then transferred to the third cutter disc area 123 through the relay transportation of three spindle assemblies. Similarly, the other two new cutter discs are transferred to the corresponding first cutter disc area 121 and second cutter disc area 122 in sequence through the pushing of the driving member and the picking and lifting part transfer of multiple spindle assemblies 20. It should be noted that four new tool discs are transmitted in sequence inside the first cache assembly 13 through a driving member, and the four spindle assemblies 20 pick up the lifting portion 55 of the new tool disc in sequence through the first robot arm 22 or the spindle clamp 21, thereby realizing transportation between multiple tool disc areas until they are transferred to the target tool disc area.

[0060] In some embodiments of the present disclosure, Figure 7As shown, the first cache component 13 and the second cache component 14 include a transfer member 132 and at least two layers of cache sections 130 stacked in the height direction, each layer of the cache section 130 includes a plurality of cache areas; the transfer member 132 is raised and lowered in the height direction to align each layer of the cache section 130. The cache section 130 is a loading cache mechanism. In order not to affect the processing of the circuit board processing equipment and to cache a plurality of new tool discs to be replaced, at least two layers of cache sections 130 stacked in the height direction are arranged on the first cache component 13. Each layer of the cache section 130 includes a plurality of cache areas, and each cache area can cache a tool disc. The first cache component 13 also includes a transfer member 132. The driving mechanism drives the transfer member 132 to rise and fall to align each layer of the cache section 130, so as to cache the new tool disc into the plurality of cache areas of each layer of the cache section 130. In the upper and lower embodiments of the present disclosure, the transfer member 132 is raised and lowered in the height direction to align the cache area of ​​each layer of the cache section 130, and the new cutter disc on the transfer member 132 is transferred to the cache area on the cache section 130, or, a new cutter disc in the cache area on the cache section 130 is received. In some preferred embodiments, each layer of the cache section 130 includes a middle guide groove 134 and driving members 133 on both sides, and the driving members 133 can be implemented as a pulley assembly. In the upper and lower embodiments of the present disclosure, the second cache assembly 14 has the same structure as the first cache assembly 13. When the first cache assembly 13 is a two-layer cache section 130, the corresponding second cache assembly 14 is also a two-layer cache section. The cache section is a material unloading cache mechanism, and each layer of the cache section has the same Figure 7 The structure of the cache unit 130 is the same as that of the cache unit 130 in FIG.

[0061] In some embodiments of the present disclosure, at least one spindle assembly is used to transport a cutter disc between two adjacent cutter disc areas along a first direction; or, multiple spindle assemblies synchronously transport multiple cutter discs along the first direction. Figure 5 As shown, in the first step of the unloading process, the four spindle assemblies 20 synchronously pick up four old cutter discs, translate along the first direction, and synchronously transport the four old cutter discs, which can improve the transport efficiency. Figure 4 As shown, during the loading process, the spindle assembly 20 transports new cutter discs one by one, and transports the cutter discs along the first direction between two adjacent cutter disc areas 12.

[0062] In some embodiments of the present disclosure, at least one cutter disc is relayed by multiple spindle assemblies, and sequentially stays in multiple adjacent cutter disc areas, moving from the first cache assembly to the second cache assembly. Figure 3 , Figure 4 , Figure 5As shown, on the transmission path composed of the first buffer area 131, the four cutter disc areas 12 and the second buffer area 141, the transmission is relayed one by one without any cross-area or jump. In other words, the old cutter discs are transferred one by one from the cutter disc area 12 to the second buffer area 141, and the new cutter discs are transferred one by one from the first buffer area 131 to the cutter disc area 12.

[0063] In some embodiments of the present disclosure, in at least one blade disc zone, the blade discs in the blade disc zone are first unloaded to the second cache component, and then the blade discs transported from the adjacent blade disc zone or the first cache component are received; or, in at least one blade disc zone, the blade discs in the blade disc zone are first unloaded to the adjacent blade disc zone or the second cache component, and then the blade discs transported from the first cache component are received. Specifically, Figure 3 , Figure 4 , Figure 5 As shown, for the cutter disc area 12, there are four cutter disc areas arranged along the first direction and adapted to the four spindle assemblies: the first cutter disc area 121, the second cutter disc area 122, the third cutter disc area 123 and the fourth cutter disc area 124. The fourth cutter disc area first unloads the old cutter disc to the second buffer area 141 of the second buffer assembly, and then receives the new cutter disc transported from the adjacent cutter disc area or the buffer area of ​​the first buffer assembly 13. For other cutter disc areas, such as the first cutter disc area 121, the old cutter disc in the first cutter disc area 121 is first unloaded to the adjacent second cutter disc area 122, and then receives the new cutter disc transported from the first buffer area 131 of the first buffer assembly.

[0064] In some embodiments of the present disclosure, Fig.13 As shown, a third robot arm is slidably connected to the crossbeam, and the third robot arm 24 moves along the first direction with the spindle assembly 20. The third robot arm 24 is close to the first cache assembly 13, and is used to move the tool disc in the first cache assembly 13 to the adjacent tool disc area 12. Alternatively, the third robot arm 24 is close to the second cache assembly 14, and is used to move the tool disc in the adjacent tool disc area to the second cache assembly 14. For the circuit board processing equipment 100, the stroke of the four spindle assemblies 20 in the first direction is a predetermined range. Beyond this stroke, the spindle assembly 20 cannot perform the corresponding task of moving the tool disc. The crossbeam 30 has a predetermined length in the first direction, and this length will affect the stroke of the spindle assembly. When the spindle assembly (for example) adjacent to the first cache assembly 13 is Figure 4 of the first spindle assembly 201) or a spindle assembly adjacent to the second cache assembly 14 (e.g. Figure 5When the fourth spindle assembly 204 is unable to perform the corresponding task of transporting the cutter disc in the first direction due to travel limitations, the third robotic arm 24 can be slidably connected on the crossbeam. The third robotic arm 24 is located above the first cache assembly and is used to transport the new cutter disc in the first cache area 131 of the first cache assembly 13 to the adjacent first cutter disc area 121. Alternatively, the third robotic arm 24 is located above the second cache assembly 14 and is used to transport the cutter disc in the fourth cutter disc area to the second cache area 141 in the second cache assembly. The third robotic arm 24 can be separately provided above the first cache assembly 13 or the second cache assembly 14, or a third robotic arm 24 can be provided above each of the first cache assembly 13 and the second cache assembly 14 for transporting the cutter disc, which is not limited here.

[0065] In some embodiments of the present disclosure, Figure 2 and Figure 8 As shown, the cutter disc 50 includes a lifting portion 55, and the spindle assembly 20 includes a first mechanical arm 22 and a spindle clamp 21. The spindle assembly 20 picks up the lifting portion 55 through the first mechanical arm 22 or the spindle clamp 21 to carry the cutter disc 50. In the upper and lower embodiments of the present disclosure, each cutter disc 50 includes a lifting portion 55. Regardless of whether it is a new cutter disc or an old cutter disc, a lifting portion 55 is set up in the middle area of ​​each cutter disc. The spindle assembly 20 picks up the lifting portion 55 through the first mechanical arm 22 or the spindle clamp 21, first lifts the cutter disc 50 as a whole from the third direction, that is, the height direction, and then moves the cutter disc 50 horizontally, so as to achieve the technical effect of the spindle assembly 20 carrying the cutter disc after picking up the lifting portion 55 through the first mechanical arm 22 or the spindle clamp 21.

[0066] In some embodiments of the present disclosure, the spindle assembly is provided with a first robot arm and a second robot arm, and the first robot arm and the second robot arm synchronously pick up the lifting portion to carry the cutter disc. Specifically, in addition to the first robot arm of the spindle assembly, the spindle assembly can also be equipped with a second robot arm, and the first robot arm and the second robot arm cooperate to synchronously carry a cutter disc, thereby realizing stable and reliable transportation of the cutter disc. Fig.11 and Fig.12As shown, the cutter disc 50 includes two lifting parts 55, each spindle assembly 20 is equipped with a second mechanical arm 23, and the spindle assembly 20 includes a first mechanical arm 21. The spindle assembly 20 synchronously picks up the lifting part 55 through the first mechanical arm 21 and the second mechanical arm 22, and synchronously transports the cutter disc 50. For the cutter disc 50, in order to improve stability, two lifting parts 55 can be set, and the two lifting parts 55 are respectively located at symmetrical positions on the outer side of the cutter disc. Two mechanical arms are set in the direction of the spindle assembly 20: the first mechanical arm 22 and the second mechanical arm 23, and the spacing between the two mechanical arms is the same as the spacing between the two lifting parts 55. The spindle assembly 20 and the workbench 10 move relatively until the first mechanical arm 22 and the second mechanical arm 23 align with the two lifting parts 55 of any cutter disc, and the first mechanical arm 22 and the second mechanical arm 23 respectively pick up the lifting part 55 of the cutter disc from the third direction, and then move horizontally to transport the cutter disc to the corresponding cutter disc area 12. It should be noted here that in the upper and lower embodiments of the present disclosure, the first robotic arm 22, the second robotic arm 23, and the third robotic arm 24 have basically the same structure and all include clamps, which clamp the lifting portion 55 by clamping and releasing the tool disc 50, thereby achieving the purpose of clamping and releasing the tool disc 50.

[0067] In some embodiments of the present disclosure, the first cache assembly 13 and the second cache assembly 14 include a driving member, which drives the cutter disc to move along the second direction between the plurality of cache areas. Figures 2 to 7 As shown, the first cache assembly 13 includes a plurality of cache areas arranged along the second direction and a driving member 133 extending along the second direction, each cache area can accommodate a cutter disc, and the first cache assembly 13 also includes a driving member 133, the driving member 133 drives the cutter disc to move between the plurality of cache areas along the second direction; a guide groove 134 is provided between the two driving members 133, the guide groove 134 cooperates with the pin at the bottom of the cutter disc 50, and positions and guides the cutter disc 50 to move linearly along the second direction on the first cache assembly 13. In some preferred embodiments, the driving member 133 is preferably a pulley assembly, which can transport the cutter disc between the plurality of cache areas. Similarly, the second cache assembly 14 includes a plurality of cache areas arranged along the second direction and a driving member extending along the second direction, the driving member is preferably a pulley assembly, which can realize the transport of the cutter disc between the plurality of cache areas, which will not be described in detail here.

[0068] In order to realize automatic replacement of the cutter disc, a tool change control method is provided during the working process of the above-mentioned circuit board processing equipment, including the following steps: S10: control at least one spindle assembly to pick up the cutter disc in the cutter disc area and transfer it to the second cache assembly; S20: control at least one spindle assembly to transfer the cutter disc between the first cache assembly, the cutter disc area, and the second cache assembly; S30: control at least one spindle assembly to transfer the cutter disc in the first cache assembly to the cutter disc area. This tool change control method uses the spindle assembly to transfer the tool, and then continues to use the spindle assembly to pick up the lifting part of the cutter disc, transfer the cutter disc between the first cache assembly, the cutter disc area, and the second cache assembly, and finally transfers the cutter disc to the cutter disc transfer device through the second cache assembly. This tool change control method realizes the full automatic replacement of the tool and the cutter disc, and provides a new method for horizontally replacing the cutter disc from the front side of the workbench. The spindle assembly picks up the lifting part, transfers the cutter disc, and then transfers the cutter disc through the first cache assembly and the second cache assembly, thereby realizing the full automatic transfer and transmission of the cutter disc from the front side of the workbench. It provides a simpler and lower-cost method for automatic tool change of circuit board processing equipment.

[0069] In order to realize automatic replacement of the cutter disc, a cutter replacement control method is provided during the working process of the above-mentioned circuit board processing equipment, comprising the following steps:

[0070] S10: Control at least one spindle assembly to transfer multiple old cutter discs between the cutter disc area and the second cache assembly; so as to transport the old cutter discs in the cutter disc area to the second cache assembly in turn, and multiple old cutter discs are cached on the second cache assembly. On the workbench 10 of the circuit board processing equipment, the spindle assembly 20 moves relatively to the top of the cutter disc area 12, and the first cache area 131 of the first cache assembly, the four cutter disc areas 12, and the second cache area 141 of the second cache assembly are arranged along the first direction, forming a cutter disc transportation path on the workbench. For the four cutter discs in the cutter disc area 12 on the workbench, the old cutter discs must be unloaded first and then the new cutter discs must be loaded to complete a complete process of replacing the cutter discs. Therefore, the old cutter discs that have been used on the workbench are unloaded first, and the spindle assembly is controlled to transfer multiple old cutter discs between the cutter disc area 12 and the second cache assembly 14. There are two methods for unloading old cutter discs. The first method is that the spindle assembly 20 picks up four cutter discs and transfers them to the second cache assembly 14 one by one. The second method is that the four spindle assemblies pick up four old cutter discs at the same time and transfer them to the second cache assembly 14 synchronously until all four old cutter discs are transferred to the second cache area. In order to improve the tool changing efficiency, the second method for unloading old cutter discs is preferably used to transfer the old cutter discs in the cutter disc area to the second cache assembly 14 in sequence. Specifically, Figure 3 and Figure 5As shown, the four spindle assemblies 20 synchronously pick up four cutter discs and move them toward the second cache area 141 for the first time, and the three spindle assemblies 20 synchronously pick up three cutter discs and move them toward the second cache area 141 for the second time, until finally the fourth spindle assembly 204 picks up the fourth cutter disc and moves it toward the second cache area 141, the four old cutter discs are cached on the second cache assembly, and the four cutter disc areas 12 complete unloading of the old cutter discs.

[0071] S20: Multiple new cutter discs are cached on the first cache component; at least one spindle component is controlled to transfer multiple new cutter discs between the first cache component and the cutter disc area to transport the new cutter discs in the first cache component to the cutter disc area. On the workbench 10 of the circuit board processing equipment, the spindle component 20 on the crossbeam 30 moves relatively to the top of the cutter disc area 12, and the first cache area 131 of the first cache component 13, the four cutter disc areas 12, and the second cache area 141 of the second cache component are arranged along the first direction to form a cutter disc transport path on the workbench. For the inner cutter discs of the four cutter disc areas on the workbench, the old cutter discs are first unloaded and then the new cutter discs are loaded to complete a complete process of replacing the cutter disc. Therefore, after unloading the old cutter discs, multiple new cutter discs have already been cached on the first cache component 13, and new cutter discs need to be loaded to the cutter disc area 12. The spindle component is controlled to transfer multiple new cutter discs between the first cache component 13 and the cutter disc area 12 to transport the new cutter discs in the first cache component 13 to the cutter disc area 12. This embodiment adopts a method of sequential relay transport to transport the new cutter disc in the first cache component 13 to the cutter disc area 12. The first spindle component 201 picks up the first new cutter disc in the first cache area 131 and transports it to the first cutter disc area 121. The second spindle component relays the new cutter disc until the new cutter disc is transported to the fourth cutter disc area 124 by the fourth spindle component 204. Similarly, the first spindle component 201 picks up the second new cutter disc in the first cache area 131, and transports it to the third cutter disc area 123 through the relay transport of the second, third, and fourth spindle components. Until finally, the first spindle component 201 transports the fourth new cutter disc from the first cache area 131 to the first cutter disc area 121. At this point, the four new cutter discs are sequentially relayed by the spindle component 20 to the four cutter disc areas 12, and the four new cutter disc areas 12 complete the loading of new cutter discs.

[0072] In some embodiments of the present disclosure, in the first cache assembly 13 and the second cache assembly 14, a plurality of cutter discs move along the second direction; between a plurality of adjacent cutter disc areas, the cutter disc moves along the first direction, and the first direction is perpendicular to the second direction. Specifically, in the first cache assembly 13, the driving member 133 drives the plurality of cutter discs to move along the second direction until they move to the first cache area 131. In the second cache assembly 14, the driving member drives the plurality of cutter discs to move along the second direction from the second cache area. In the cutter disc area 12 on the workbench 10, a plurality of cutter discs move along the first direction between the cutter disc areas 12 until they move from the first cache area 131 to the second cache area 141. The blade disc can be replaced only when it is in motion. However, the direction of the blade disc changes during the motion. In the first buffer assembly 13, the blade disc moves toward the first buffer area 131 along the second direction. In the blade area 12, the blade disc moves toward the second buffer area 141 along the first direction from the first buffer area 131 through multiple blade areas 12. In the second buffer assembly 14, the blade disc moves away from the second buffer area 141 along the second direction. The first direction and the second direction are perpendicular, and the motion path of the blade disc forms a U-shaped path.

[0073] In the present disclosure, the circuit board processing equipment adopts the above-mentioned cutter disc, and applies the tool changing control method to realize the fully automatic replacement of the cutter disc from the front workbench of the circuit board processing equipment, saving workshop and equipment space, low cost, high efficiency and high stability. It should be noted that in the upper and lower embodiments of the present disclosure, the transfer device 400 is fixedly arranged on the rear side of the circuit board processing equipment 100, and the circuit board passes through the opening, and is transferred by the transfer device 400 to realize loading and unloading with the circuit board transfer device 300. The cutter disc transfer device 200 is arranged on the front side of the circuit board processing equipment, and directly exchanges the cutter disc with the first cache component 13 and the second cache component 14 to realize the fully automatic replacement of the cutter disc.

[0074] Application scenario 1

[0075] This embodiment takes a circuit board processing device that includes a four-axis drilling device, a layer of a buffer unit, and a single lifting unit as an example, and describes in detail the structure of the cutter disc, the structure of the circuit board processing device, and the tool change control method.

[0076] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 8As shown, the circuit board processing equipment 100 of this embodiment includes a base 40, a beam 30, a spindle assembly 20, a workbench 10, etc. The workbench 10 is arranged on the base 40 and moves along the second direction. The beam 30 is mounted above the workbench 10, and four spindle assemblies 20 are slidably connected on the beam 30. Each spindle assembly 20 moves along the first direction on the beam; the spindle clamp 21 at the bottom of each spindle assembly 20 clamps a tool, and the tool moves along the third direction to process the circuit board carried on the processing area 11 of the workbench 10. Figure 2 and Figure 3 As shown, four processing areas 11 and corresponding four cutter disc areas 12 are arranged on the workbench 10, each processing area 11 carries a circuit board, a corresponding cutter disc area 12 is arranged outside each processing area 11, a cutter disc 50 can be placed in each cutter disc area 12, and the spindle assembly 20 picks up the tool in the cutter disc to process the circuit board in the processing area 11. The first direction, the second direction, and the third direction are perpendicular to each other.

[0077] To achieve automatic replacement of the cutter head and circuit board, such as Figure 1 As shown, the circuit board processing equipment of this embodiment includes a workbench 10 and a spindle assembly 20. The workbench 10 is provided with a cutter disc area 12 and a processing area 11. The cutter disc area 12 includes a cutter disc 50. The processing area 11 is provided with a transport assembly that can be raised and lowered. The workbench 10 transfers the circuit board to the rear side through the transport assembly to exchange the circuit board with the transfer equipment 400 and the circuit board transfer equipment 300. In the process of replacing the cutter disc 50, as shown in FIG. Figure 2 As shown, the spindle assembly 20 picks up the lifting portion 55 of the cutter disc 50, transports the cutter disc between the first cache assembly 13, the cutter disc area 12 and the second cache assembly 14, changes the position of the cutter disc 50, transports and exchanges the cutter disc at the front side, and exchanges the old and new cutter discs with the cutter disc transfer equipment 200.

[0078] In this embodiment, if Figure 8 As shown, the cutter disc 50 includes a body 51, and a middle area 52 is formed in the middle of the body 51. A plurality of groups of slots 53 are arranged in the middle area 52. Each group of slots 53 is provided with a plurality of knife holes 54 arranged in a matrix, and each knife hole 54 can accommodate a knife. A cylindrical lifting portion 55 is provided on the inner side surface of the bottom of the body 51. The lifting portion 55 extends toward the opening direction of the middle area 52 to transport the cutter disc 50 on the workbench 10. In this embodiment, the lifting portion 55 passes through the center of gravity of the cutter disc 50. Figure 8 As shown, five groups of slots are arranged inside the cutter disc 50, each group of slots can accommodate 100 cutters, and the five groups of slots are arranged along the long side direction of the rectangular cutter disc, wherein the lifting portion 55 passes through the middlemost tool hole 54 of the third group of slots 53. This facilitates the first robot arm 22 or the clamping claw of the spindle clamp 21 to pick up the lifting portion 55 of the cutter disc 50, thereby picking up, clamping and transporting the cutter disc 50.

[0079] At the same time, in the present embodiment, the lifting portion 55 is made of a rigid material, which can be aluminum alloy, hard plastic or the same tungsten steel material as the tool, and is not limited here. A connecting hole is provided at the connection between the lifting portion 55 and the cutter disc body 51, and an elastic member 57 is provided in the connecting hole. The connecting hole enables the lifting portion 55 to be fixedly connected to the body 51 in the axial direction, and in the radial direction, an elastic member 57 is provided around the lifting portion 55, so that the lifting portion 55 is movably connected to the connecting hole. The elastic deformation of the elastic member 57 allows a certain amount of activity surplus between the cutter disc 50 and the lifting portion 55, making it easier for the cutter disc 50 to align with the circular hole in the cutter disc area 12, thereby improving the stability and alignment accuracy of the cutter disc when being carried.

[0080] In order to realize fully automatic transport of the cutter disc 50, the circuit board processing equipment includes: a workbench 10, the workbench 10 includes multiple cutter disc areas 12, each cutter disc area 12 is used to store the cutter disc 50; a first cache component 13 and a second cache component 14 are arranged in the first direction on the left and right sides of the workbench 10; a spindle assembly 20, multiple spindle assemblies 20 are slidably connected on the crossbeam above the workbench 10, and the spindle assembly 20 is configured to transport the cutter disc between the first cache component 13, the cutter disc area 12, and the second cache component 14.

[0081] like Figures 2 to 5 As shown, the workbench 10 and the spindle assembly 20 move relative to each other until the cutter disc area 12 is located below the spindle assembly 20 sliding on the beam 30, and the spindle assembly 20 can pick up and carry the cutter disc 50 in the cutter disc area 12. When the workbench 10 moves until the cutter disc area 12 is located below the spindle assembly 20, at least a portion of the first cache assembly 13 and the second cache assembly 14 are also located below the beam. The first cache assembly 13 and the second cache assembly 14 include a plurality of cache areas, each of which contains a cutter disc. The first cache assembly 13 includes a first cache area 131, and the second cache assembly includes a second cache area 141. The first cache area 131 and the second cache area 141 form a linear conveying path along a first direction with the plurality of cutter disc areas, as shown in FIG. Figure 3 As shown, the entire transmission path is located directly below the plurality of spindle assemblies 20. When taking a new cutter disc for loading, as shown in FIG. Figure 4 As shown, the first buffer area 131 is located directly below the first spindle assembly 201, and the first buffer area 131 at least partially overlaps with the projection of the first spindle assembly 201 on the base 40. Figure 5 As shown, the second buffer area 141 is located directly below the fourth spindle assembly 204, and the second buffer area 141 at least partially overlaps with the projection of the fourth spindle assembly 204 on the base 40. The positions of the first buffer assembly 13 and the second buffer assembly 14 can ensure that the spindle assembly 20 can carry a new cutter disc and an old cutter disc within the travel range, thereby realizing fully automatic replacement of the cutter disc.

[0082] In the circuit board processing equipment of this embodiment, a U-shaped linear transmission path consisting of a first cache component 13, a cutter disc area 12, and a second cache component 14 is formed on the workbench 10. The cutter disc transfer device 200 transmits a new cutter disc to the first cache component 13 and receives an old cutter disc transmitted by the second cache component 14, forming a closed loop of automatic cutter disc replacement of the circuit board processing equipment. In the entire process of automatic cutter disc replacement, for the spindle component 20, during the unloading process, the four spindle components synchronously transport the four cutter discs 50 along the first direction to improve the efficiency of transportation and tool change. During the loading process, the four spindle components 20 relay the new cutter disc in turn, that is, at least one spindle component 20 is used to transport the cutter disc 50 between two adjacent cutter disc areas along the first direction. For the cutter disc 50 itself, whether it is a new cutter disc or an old cutter disc, it is relayed and transported by picking up the lifting part 55 through the spindle component 20, and stays in multiple adjacent cutter disc areas 12 in turn, and moves from the first cache component 13 to the second cache component 14. For the cutter disc area 12 on the workbench, the cutter discs in the first cutter disc area 121 are transported to the adjacent second cutter disc area 122, and then receive the cutter discs transported from the first buffer assembly 13. The cutter discs in the fourth cutter disc area 124 are first transported to the second buffer assembly 14, and then receive the cutter discs transported from the adjacent third cutter disc area.

[0083] In this embodiment, if Figure 6 As shown, the first cache assembly 13 includes a cache portion 130, and the cache portion 130 includes a driving member 133. The driving member 133 is preferably a pulley assembly, and a guide groove 134 for limiting and guiding the cutter disc 50 is also provided between the two driving members 133. The second cache assembly 14 has a cache portion identical to the first cache assembly 13, and the driving member and guide groove structures are also identical, which will not be described in detail here. The driving member drives the cutter disc to move between multiple cache areas of the first cache assembly 13 or the second cache assembly 14, realizing the position change of the cutter disc between the multiple cache areas, thereby realizing the movement of the cutter disc and achieving the technical effect of automatically replacing the cutter disc.

[0084] In this embodiment, the tool change control method is described in detail below in combination with the tool disc and the circuit board processing equipment. In this embodiment, the tool disc 50 is transported horizontally on the workbench 10. The fully automatic tool change control method includes the following steps:

[0085] S10: Control at least one spindle assembly to transfer multiple old cutter discs between the cutter disc area and the second cache assembly; so as to transport the old cutter discs in the cutter disc area to the second cache assembly in turn, and multiple old cutter discs are cached on the second cache assembly. On the workbench 10 of the circuit board processing equipment, the spindle assembly 20 moves relatively to the top of the cutter disc area 12, and the first cache area 131 of the first cache assembly 13, the four cutter disc areas 12, and the second cache area 141 of the second cache assembly are arranged along the first direction, forming a linear cutter disc transport path on the workbench. For the 12 cutter discs in the cutter disc area on the workbench, the old cutter discs must be unloaded first and then the new cutter discs must be loaded to complete a complete process of replacing the cutter discs. Therefore, the old cutter discs that have been used in the cutter disc area 12 are unloaded first, and the spindle assembly 20 is controlled to transfer multiple old cutter discs between the cutter disc area 12 and the second cache assembly 14. Figure 5 As shown, there are two methods for unloading the old cutter discs. The first method is that the spindle assembly 20 picks up four cutter discs and relays them to the second cache assembly 14 one by one. The second method is that the four spindle assemblies 20 pick up four old cutter discs at the same time and synchronously transfer them to the second cache assembly 14 until the four old cutter discs are transferred to the second cache area 141. In order to improve the tool changing efficiency, this embodiment adopts the second method for unloading the old cutter discs to transport the old cutter discs in the cutter disc area to the second cache assembly 14 in sequence. The first time, the four spindle assemblies 20 synchronously pick up the four cutter discs and move them to the second cache area 141 to synchronously transport the four old cutter discs. The second time, the three spindle assemblies 20 synchronously pick up the three cutter discs and move them to the second cache area 141, until the fourth spindle assembly picks up the fourth cutter disc and moves it to the second cache area. The four old cutter discs are sequentially cached on the second cache assembly, and the four cutter disc areas complete unloading.

[0086] S20: A plurality of new cutter discs are cached on the first cache component; at least one spindle component is controlled to transfer a plurality of new cutter discs between the first cache component and the cutter disc area, so as to transport the new cutter discs in the first cache component to the cutter disc area. On the workbench 10 of the circuit board processing equipment, the spindle component 20 on the crossbeam 30 moves relatively to the top of the cutter disc area 12, and the first cache area 131 of the first cache component 13, the four cutter disc areas 12, and the second cache area 141 of the second cache component 14 are arranged along the first direction to form a linear cutter disc transport path on the workbench. For the inner cutter disc of the cutter disc area 12 on the workbench, the old cutter disc is first unloaded and then the new cutter disc is loaded to complete a complete process of replacing the cutter disc. Therefore, after unloading the old cutter disc, a plurality of new cutter discs have been cached on the first cache component 13, and it is necessary to load the new cutter disc to the cutter disc area 12, and the spindle component 20 is controlled to transfer a plurality of new cutter discs between the first cache component 20 and the cutter disc area 12, so as to transport the new cutter disc in the first cache component 13 to the cutter disc area 12. This embodiment adopts a sequential relay method to transport the new cutter disc in the first buffer assembly 13 to the cutter disc area 12. Figure 4As shown, the first spindle assembly 201 picks up the first new cutter disc in the first buffer area 131 and transfers it to the first cutter disc area 121, and the second spindle assembly relays the first new cutter disc until the new cutter disc is transferred to the fourth cutter disc area 124 by the fourth spindle assembly 204. Similarly, the first spindle assembly 201 picks up the second new cutter disc in the first buffer area 131, and transfers it to the third cutter disc area 123 through the relay transfer of the second, third, and fourth spindle assemblies. Finally, the first spindle assembly 201 transfers the fourth new cutter disc from the first buffer area 131 to the first cutter disc area 121. So far, the four new cutter discs are relayed by the spindle assembly 20 to the four cutter disc areas in turn, and the four new cutter disc areas are loaded.

[0087] In this embodiment, the driving member of the first cache component 13 drives the new cutter disc to move in the second direction, and the four new cutter discs move to the first cache area 131 in turn, and are picked up and transported in turn by the spindle assembly 20. The driving member of the second cache component 14 drives the old cutter disc to move in the second direction, and the four old cutter discs move outward from the second cache area in turn until they leave the circuit board processing equipment 100 and reach the cutter disc transfer equipment 200. That is to say, on the first cache component 13 and the second cache component 14, multiple cutter discs move in the second direction; on the workbench, between multiple adjacent cutter disc areas, multiple cutter discs move in the first direction, and the first direction is perpendicular to the second direction, together forming a U-shaped handling and transmission path, thereby realizing the replacement of the cutter disc from the front side of the circuit board processing equipment.

[0088] In this embodiment, the frequency of replacing the cutter disc is lower than the frequency of replacing the circuit board. Even if there are multiple holes to be processed on a circuit board, each cutter disc can accommodate a sufficient number of cutters, and these cutters can meet the processing of at least one circuit board. Therefore, after processing a circuit board, the cutter disc does not necessarily need to be replaced when the circuit board is replaced, but in order to improve efficiency, the circuit board must be replaced when the cutter disc is replaced. In this embodiment, due to travel limitations, it may not be possible to replace the cutter disc or the circuit board at the same time. Therefore, when the cycle of replacing the circuit board and the cutter disc in sequence is reached, it is necessary to replace the cutter disc after replacing the circuit board; or replace the circuit board after replacing the cutter disc. In this embodiment, the action of replacing the cutter disc is completed after unloading the old circuit board and loading the new circuit board.

[0089] In this embodiment, the circuit board processing equipment and tool change control method can achieve the following technical effects: through the first cache component and the second cache component, on the transport path formed by the cutter disc area, the spindle assembly transmits and transfers the cutter disc laterally along the first direction, so as to realize the upper and lower cutter discs from the left and right sides of the workbench, and provide a solution for fully automatic replacement of the cutter disc. A lifting part is set on the cutter disc, and the spindle assembly is used to pick up the cutter disc, which provides a technical solution for replacing the cutter disc from the front side, saving equipment and workshop space and lowering the cost. In addition, only one cutter disc needs to be set in the cutter disc area to realize the fully automatic replacement of the old and new cutter discs, saving space on the workbench, improving the tool change efficiency, and providing the most cost-effective solution for fully automatic replacement of cutter discs for circuit board processing equipment.

[0090] Application scenario 2

[0091] This embodiment takes a circuit board processing device that includes a four-axis drilling device, a two-layer buffer unit, and two lifting units as an example, and describes in detail the structure of the cutter disc, the structure of the circuit board processing device, and the tool change control method.

[0092] In this embodiment, the structure of the circuit board processing equipment is basically the same as that of the first embodiment, except that: the first cache component includes two layers of cache parts 130 stacked up and down, and the second cache component includes two layers of cache parts stacked up and down. At the same time, two lifting parts are provided on the cutter disc, and two mechanical arms synchronously carry one cutter disc. The structure and tool change control method of other circuit board processing equipment are the same as those of the application scenario 1 or are adaptively adjusted, and will not be repeated here.

[0093] In this embodiment, if Figure 7 As shown, the first cache assembly 13 includes two layers of cache sections 130 stacked up and down, and the transfer member 132 can be raised and lowered to align with each layer of the cache section 130, and each layer of the cache section 130 includes a driving member 133 and a guide groove 134. The driving member 133 drives multiple cutter discs to move on the cache section 130 along the second direction to achieve the loading action of the new cutter disc. The guide groove 134 extends along the second direction and cooperates with the pin at the bottom of the cutter disc 50 to guide and limit the multiple cutter discs on the cache section 130. During the lifting and lowering process of the transfer member 132, the two layers of the cache section 130 can cache more cutter discs, which can save space and can also adapt to more spindles, such as six-spindle and 12-spindle circuit board processing equipment.

[0094] In this implementation, if Fig. 9As shown, the cutter disc 50 is provided with two lifting parts 55. The cutter disc 50 includes a main body 51 and a middle area 52 surrounded by two sides of the main body 51. Two lifting parts 55 are symmetrically arranged at both ends of the middle area 52, and the two lifting parts 55 are symmetrical about the center of gravity of the cutter disc. The lifting parts 55 extend from the upper surface of the main body 51 in the height direction, and the height thereof is less than or equal to the height of the tool in the cutter disc. When the spindle assembly 20 and / or the robot arm pick up the two lifting parts at the same time, the posture of the cutter disc is in a horizontal state, and no tilting or shaking occurs, so as to ensure safe and stable handling and transmission of the cutter disc.

[0095] like Fig.10 As shown, the circuit board processing equipment 100 includes a base 40, a crossbeam 30, a spindle assembly 20, a workbench 10, etc. The workbench 10 is arranged on the base 40 and moves along the second direction. The crossbeam 30 is mounted above the workbench 10, and four spindle assemblies 20 are slidably connected on the crossbeam 30. Each spindle assembly 20 moves along the first direction on the crossbeam; the spindle clamp 21 at the bottom of each spindle assembly 20 clamps a tool, and the tool moves along the third direction to process the circuit board carried on the processing area 11 of the workbench 10. Fig.10 and Figure 3 As shown, four processing areas 11 and four cutter disc areas 12 are arranged on the workbench 10, each processing area 11 carries a circuit board, a corresponding cutter disc area 12 is arranged outside each processing area 11, a cutter disc 50 can be placed in each cutter disc area 12, and the spindle assembly 20 picks up the tool in the cutter disc to process the circuit board in the processing area 11. The first direction, the second direction, and the third direction are perpendicular to each other.

[0096] In this embodiment, if Fig.10 , Figure 7 As shown, the first robot arms 22 of two adjacent spindle assemblies 20 synchronously pick up a cutter disc, and move the cutter disc between the first cache assembly 13, the cutter disc area 12, and the second cache assembly 14, so as to realize automatic replacement of the cutter disc. Specifically, during the unloading process, the first robot arms 22 of the third spindle assembly and the fourth spindle assembly synchronously pick up the old cutter disc in the fourth cutter disc area 124, move it to the transfer piece of the second cache assembly 14, and then transfer it from the transfer piece to the cache section of each layer. During the loading process, the first robot arms 22 of the first spindle assembly and the second spindle assembly synchronously pick up the new cutter disc on the transfer piece of the first cache assembly 13, and move it directly to the first cutter disc area. In this embodiment, the tool changing control method includes: controlling at least one spindle component to transfer multiple old tool discs between the tool disc area and the second cache component; moving the old tool discs in the tool disc area to the second cache component in sequence, and cache the multiple old tool discs on the second cache component; cache the multiple new tool discs on the first cache component; controlling at least one spindle component to transfer multiple new tool discs between the first cache component and the tool disc area, and moving the multiple new tool discs in the first cache component to the tool disc area.

[0097] This circuit board processing equipment and tool change control method can also achieve the following technical effects: through the first cache component and the second cache component, on the transport path formed by the cutter disc area, the spindle assembly transmits and transfers the cutter disc laterally along the first direction, so that the cutter disc can be put up and down from the left and right sides of the workbench, providing a solution for fully automatic replacement of the cutter disc. A lifting part is set on the cutter disc, and the spindle assembly is used to pick up the cutter disc, providing a technical solution for replacing the cutter disc from the front side, saving equipment and workshop space, and lowering the cost. In addition, only one cutter disc needs to be set in the cutter disc area to realize the fully automatic replacement of the old and new cutter discs, saving space on the workbench, improving tool change efficiency, and providing the most cost-effective solution for fully automatic replacement of cutter discs for circuit board processing equipment.

[0098] Application scenario three

[0099] This embodiment takes a circuit board processing device that includes a two-axis drilling device, a layer of a buffer unit, and two lifting units as an example, and describes in detail the structure of the cutter disc, the structure of the circuit board processing device, and the tool change control method.

[0100] In this embodiment, the structure of the circuit board processing equipment is basically the same as that of the first embodiment, except that each spindle assembly is equipped with a first robotic arm and a second robotic arm, and two lifting parts are provided on the cutter disc, and the first robotic arm and the second robotic arm synchronously carry a cutter disc. The structure and tool change control method of other circuit board processing equipment are the same as those of the application scenario 1 or are adaptively adjusted, and will not be repeated here. The first cache component 13 and the second cache component 14 of this embodiment are as shown in FIG. Figure 6 As shown, the cache component structure is the same as that in application scenario 1. Fig. 9 As shown, the structure of the cutter head is the same as that in application scenario 2. No further description will be given here.

[0101] In this embodiment, if Fig.11 As shown, the circuit board processing equipment 100 includes a base 40, a crossbeam 30, a spindle assembly 20, a workbench 10, etc. The workbench 10 is arranged on the base 40 and moves along the second direction. The crossbeam 30 is mounted above the workbench 10, and two spindle assemblies 20 are slidably connected on the crossbeam 30. Each spindle assembly 20 moves along the first direction on the crossbeam; the spindle clamp 21 at the bottom of each spindle assembly 20 clamps a tool, and the tool moves along the third direction to process the circuit board carried on the processing area 11 of the workbench 10. Fig.11As shown, two processing areas 11 and two cutter disc areas 12 are arranged on the workbench 10, each processing area 11 carries a circuit board, a corresponding cutter disc area 12 is arranged outside each processing area 11, a cutter disc 50 can be placed in each cutter disc area 12, and the spindle assembly 20 picks up the tool in the cutter disc to process the circuit board in the processing area 11. The first direction, the second direction, and the third direction are perpendicular to each other. The second mechanical arm 23 and the spindle assembly 20 are slidably connected to the crossbeam 30, and the second mechanical arm 23 and the first mechanical arm 22 are located on the same side of the spindle assembly 20.

[0102] In this embodiment, if Fig.11 , Figure 6 As shown, each spindle assembly is equipped with a second robot arm 23, which cooperates with the first robot arm 22 of the spindle assembly. The two robots synchronously carry a cutter disc, and carry the cutter disc between the first cache assembly 13, the cutter disc area 12, and the second cache assembly 14, so as to realize automatic replacement of the cutter disc. Specifically, during the unloading process, the first robot arm 22 and the second robot arm 23 of the second spindle assembly synchronously pick up the old cutter disc in the second cutter disc area, transport it to the second cache area 141 of the second cache assembly 14, and then transport it to the cutter disc transporting equipment 200. During the loading process, the first robot arm 22 and the second robot arm 23 of the first spindle assembly synchronously pick up the new cutter disc in the first cache area 131 of the first cache assembly 13, and directly transport it to the first cutter disc area. In this embodiment, the tool changing control method includes: controlling at least one spindle component to transfer multiple old tool discs between the tool disc area and the second cache component; moving the old tool discs in the tool disc area to the second cache component in sequence, and cache the multiple old tool discs on the second cache component; cache the multiple new tool discs on the first cache component; controlling at least one spindle component to transfer multiple new tool discs between the first cache component and the tool disc area, and moving the multiple new tool discs in the first cache component to the tool disc area.

[0103] This circuit board processing equipment and tool change control method can also achieve the following technical effects: through the first cache component and the second cache component, on the transport path formed by the cutter disc area, the spindle assembly transmits and transfers the cutter disc laterally along the first direction, so that the cutter disc can be put up and down from the left and right sides of the workbench, providing a solution for fully automatic replacement of the cutter disc. A lifting part is set on the cutter disc, and the spindle assembly is used to pick up the cutter disc, providing a technical solution for replacing the cutter disc from the front side, saving equipment and workshop space, and lowering the cost. In addition, only one cutter disc needs to be set in the cutter disc area to realize the fully automatic replacement of the old and new cutter discs, saving space on the workbench, improving tool change efficiency, and providing the most cost-effective solution for fully automatic replacement of cutter discs for circuit board processing equipment.

[0104] Application scenario 4

[0105] This embodiment takes a circuit board processing device that includes a two-axis drilling device, a layer of a buffer unit, and two lifting units as an example, and describes in detail the structure of the cutter disc, the structure of the circuit board processing device, and the tool change control method.

[0106] In this embodiment, the structure of the circuit board processing equipment is basically the same as that of application scenario three, except that a third robot arm 24 is added to the side of the first spindle assembly close to the first cache assembly 13. At the same time, two lifting parts are set on the tool disc, and the third robot arm and the second robot arm synchronously move a tool disc, or the third robot arm and the first robot arm synchronously move a tool disc. The structure and tool change control method of other circuit board processing equipment are the same as those of application scenario three or are adaptively adjusted, and will not be repeated here. The first cache assembly 13 and the second cache assembly 14 of this embodiment are as shown in FIG. Figure 6 As shown, the cache component structure is the same as that in application scenario 1. Fig. 9 As shown, the structure of the cutter head is the same as that in application scenario 2. No further description will be given here.

[0107] like Fig.12 As shown, the circuit board processing equipment of this embodiment includes: a base 40, a crossbeam 30, a spindle assembly 20, a workbench 10, etc. The workbench 10 is arranged on the base 40 and moves along the second direction. The crossbeam 30 is mounted above the workbench 10. Two spindle assemblies 20 are slidably connected on the crossbeam 30. Each spindle assembly 20 moves along the first direction on the crossbeam. The spindle clamp 21 at the bottom of each spindle assembly 20 clamps a tool, and the tool moves along the third direction to process the circuit board carried on the processing area 11 of the workbench 10. Fig.11 As shown, two processing areas 11 and two cutter disc areas 12 are arranged on the workbench 10, each processing area 11 carries a circuit board, a corresponding cutter disc area 12 is arranged outside each processing area 11, a cutter disc 50 can be placed in each cutter disc area 12, and the spindle assembly 20 picks up the tool in the cutter disc to process the circuit board in the processing area 11. The first direction, the second direction, and the third direction are perpendicular to each other.

[0108] In this embodiment, if Fig.12As shown, the second mechanical arm 23, the third mechanical arm 24 and the spindle assembly 20 are slidably connected to the crossbeam 30, the second mechanical arm 23 and the first mechanical arm 22 are located on the same side of the spindle assembly 20, and the third mechanical arm 24 and the second mechanical arm 23 are located on both sides of the spindle assembly 20. At the same time, the third mechanical arm 24 is close to the first cache assembly 13. The third mechanical arm 24 can alleviate the travel limitation of the spindle assembly 20. On the crossbeam 30, in order to avoid collision between adjacent spindle assemblies and travel safety, each spindle assembly has a predetermined travel range in the first direction. The first mechanical arm 22 of the first spindle assembly is located on the side away from the first cache assembly 13. When the travel of the first mechanical arm 22 is limited, the third mechanical arm 24 can be added to the side of the first spindle assembly close to the first cache assembly 13, thereby solving the problem of insufficient travel of the first mechanical arm 22 and the second mechanical arm 23, and avoiding the first spindle assembly from being unable to pick up and carry the tool disc in the first cache area 131.

[0109] In this embodiment, if Fig.12 , Figure 6 As shown, in addition to the first robotic arm 22 of the spindle assembly 20, each spindle assembly 20 is equipped with a second robotic arm 23. On the side close to the first cache assembly 13, a third robotic arm 24 is slidably connected to the crossbeam 30, and the third robotic arm 24 can move to the top of the first cache assembly 13. In this embodiment, the third robotic arm 24 and the second robotic arm 23 cooperate with each other, and the two robotic arms synchronously transport a cutter disc, and transport the cutter disc between the first cache assembly 13, the cutter disc area 12, and the second cache assembly 14, so as to realize automatic replacement of the cutter disc. Specifically, during the unloading process, the second robotic arm 23 of the first spindle assembly and the second robotic arm 23 of the second spindle assembly synchronously pick up the old cutter disc in the second cutter disc area, transport it to the second cache area 141 of the second cache assembly 14, and then transport it to the cutter disc transporting equipment 200. During the loading process, the third robot arm 24 and the second robot arm 23 of the first spindle assembly synchronously pick up the new cutter disc in the first cache area 131 of the first cache assembly 13, and directly transport it to the first cutter disc area, or transport it to the second cutter disc area after being transported and transferred in the first cutter disc area. In this embodiment, the tool change control method includes: controlling at least one spindle assembly to transport multiple old cutter discs between the cutter disc area and the second cache assembly; transporting the old cutter discs in the cutter disc area to the second cache assembly in turn, and the multiple old cutter discs are cached on the second cache assembly; multiple new cutter discs are cached on the first cache assembly; controlling at least one spindle assembly to transport multiple new cutter discs between the first cache assembly and the cutter disc area, so as to transport the multiple new cutter discs in the first cache assembly to the cutter disc area.

[0110] This circuit board processing equipment and tool change control method can also achieve the following technical effects: through the first cache component and the second cache component, on the transport path formed by the cutter disc area, the spindle assembly transmits and transfers the cutter disc laterally along the first direction, so that the cutter disc can be put up and down from the left and right sides of the workbench, providing a solution for fully automatic replacement of the cutter disc. A lifting part is set on the cutter disc, and the spindle assembly is used to pick up the cutter disc, providing a technical solution for replacing the cutter disc from the front side, saving equipment and workshop space, and lowering the cost. In addition, only one cutter disc needs to be set in the cutter disc area to realize the fully automatic replacement of the old and new cutter discs, saving space on the workbench, improving tool change efficiency, and providing the most cost-effective solution for fully automatic replacement of cutter discs for circuit board processing equipment.

[0111] Application Scenario 5

[0112] This embodiment takes a circuit board processing device that includes a four-axis drilling device, a layer of a buffer unit, and two lifting units as an example, and describes in detail the structure of the cutter disc, the structure of the circuit board processing device, and the tool change control method.

[0113] In this embodiment, the structure of the circuit board processing equipment is basically the same as that of the application scenario 1, except that a third mechanical arm 24 is added to the side of the first spindle assembly close to the first cache assembly 13. Two lifting parts are provided on the cutter disc, and two mechanical arms synchronously carry one cutter disc. The structure and tool change control method of other circuit board processing equipment are the same as those of the application scenario 1 or are adaptively adjusted, and will not be repeated here.

[0114] like Fig.13 , Figure 3 , Figure 4 , Figure 5 , Figure 6 and Fig. 9 As shown, the third robot arm 24 and the spindle assembly 20 are slidably connected on the crossbeam 30, and the third robot arm 24 and the first robot arm 22 are located on both sides of the spindle assembly 20. At the same time, the third robot arm 24 is close to the first cache assembly 13. The third robot arm 24 can alleviate the travel limitation of the spindle assembly 20. On the crossbeam 30, in order to avoid collision between adjacent spindle assemblies and travel safety, each spindle assembly has a predetermined travel range in the first direction. The first robot arm 22 of the first spindle assembly 201 is located on the side away from the first cache assembly 13. When the travel of the first robot arm 22 is limited, the third robot arm 24 can be added to the side of the first spindle assembly 201 close to the first cache assembly 13, thereby solving the problem of insufficient travel of the first robot arm 22 and preventing the first spindle assembly 201 from being unable to pick up and carry the tool disc in the first cache area 131.

[0115] In this embodiment, if Fig.13 , Figure 3 , Figure 4 , Figure 5As shown, four spindle assemblies 20 are slidably connected on the crossbeam, including four first robotic arms 22, and one third robotic arm 24, with a total of five robotic arms linearly arranged in the first direction. Two adjacent robotic arms synchronously pick up a cutter disc, and move the cutter disc between the first cache assembly 13, the cutter disc area 12, and the second cache assembly 14, so as to realize automatic replacement of the cutter disc. Specifically, during the unloading process, the first robotic arms 22 of the third spindle assembly and the fourth spindle assembly synchronously pick up the old cutter disc in the fourth cutter disc area 124, move it to the second cache area 141 of the second cache assembly 14, and then transfer it from the second cache area 141 to the cutter disc transfer device 200. During the loading process, the third robotic arm 24 and the first robotic arm 22 of the first spindle assembly synchronously pick up the new cutter disc on the first cache area 131 of the first cache assembly 13, and move it to the first cutter disc area 121. In this embodiment, the tool changing control method includes: controlling at least one spindle component to transfer multiple old tool discs between the tool disc area and the second cache component; moving the old tool discs in the tool disc area to the second cache component in sequence, and cache the multiple old tool discs on the second cache component; cache the multiple new tool discs on the first cache component; controlling at least one spindle component to transfer multiple new tool discs between the first cache component and the tool disc area, and moving the multiple new tool discs in the first cache component to the tool disc area.

[0116] This circuit board processing equipment and tool change control method can also achieve the following technical effects: through the first cache component and the second cache component, on the transport path formed by the cutter disc area, the spindle assembly transmits and transfers the cutter disc laterally along the first direction, so that the cutter disc can be put up and down from the left and right sides of the workbench, providing a solution for fully automatic replacement of the cutter disc. A lifting part is set on the cutter disc, and the spindle assembly is used to pick up the cutter disc, providing a technical solution for replacing the cutter disc from the front side, saving equipment and workshop space, and lowering the cost. In addition, only one cutter disc needs to be set in the cutter disc area to realize the fully automatic replacement of the old and new cutter discs, saving space on the workbench, improving tool change efficiency, and providing the most cost-effective solution for fully automatic replacement of cutter discs for circuit board processing equipment.

[0117] Application Scenario 6

[0118] This embodiment takes a circuit board processing device that is a four-axis drilling device, a buffer component, a two-layer buffer part, and a lifting part as an example, and describes in detail the structure of the tool disk, the structure of the circuit board processing device, and the tool change control method.

[0119] In this embodiment, the structure of the circuit board processing equipment is basically the same as that of the first embodiment, except that: a first cache component 13 is provided on one side of the circuit board processing equipment, and the first cache component includes two layers of cache parts 130 stacked up and down, and a second cache component is not required. At the same time, a lifting part is provided on the tool disc, and the spindle assembly picks up the lifting part to carry a tool disc. The structure and tool change control method of other circuit board processing equipment are the same as those of application scenario one or are adaptively adjusted, and will not be repeated here.

[0120] Combination Figure 2 and Fig.14 As shown, in order to realize fully automatic handling of the cutter disc, the circuit board processing equipment includes: a workbench 10, the workbench includes a plurality of cutter disc areas 12, each of the cutter disc areas 12 is used to store the cutter disc 50; a first cache component 13 is arranged in a first direction on one side of the workbench; a spindle component 20, a plurality of the spindle components 20 are slidably connected on the crossbeam 30 above the workbench 10, and the spindle component 20 is configured to carry the cutter disc 50 between the first cache component 13 and the cutter disc area 12. In this embodiment, the first cache component 13 is arranged on the left side of the workbench 10.

[0121] In this embodiment, the first cache component 13 adopts Figure 7 The two-layer structure shown in FIG. Figure 8 The cutter disc structure and the lifting part structure shown in the figure. A first buffer component 13 is set on one side. The buffer component 13 is a stacked structure of at least two layers, one layer is used to store new cutter discs, and the other layer is used to store old cutter discs. The cutter disc can also be automatically replaced on one side. Circuit board processing equipment such as Fig.14 As shown, the method of automatically replacing the cutter disc is as follows:

[0122] S100: Control at least one spindle assembly to transfer multiple old cutter discs between the cutter disc area and the first cache assembly; so as to sequentially move the old cutter discs in the cutter disc area to the first cache assembly, and multiple old cutter discs are cached on the first cache assembly. For the first cache assembly 13, the spindle assembly 20 sequentially moves multiple old cutter discs from the cutter disc area to the transfer member 132, and the transfer member 132 can be raised and lowered to align with a cache section 130 of the first cache assembly. Under the drive of the driving member, multiple old cutter discs are transferred to a layer of cache section 130 for cache.

[0123] S200: Multiple new cutter discs are cached on the first cache component; at least one spindle component is controlled to transfer multiple new cutter discs between the first cache component and the cutter disc area, so as to move the new cutter discs in the first cache component to the cutter disc area. For the first cache component 13, multiple new cutter discs have been cached in another cache part 130. Under the drive of the driving part, multiple new cutter discs are transferred to the transfer part 132 in turn. The spindle component 20 picks up the new cutter discs on the transfer part 132 in turn, and transfers them to each cutter disc area in turn through relay transfer. In this way, the action of replacing the cutter disc is completed.

[0124] This circuit board processing equipment and tool change control method can also achieve the following technical effects: through the first cache component, on the transport path formed by the cutter disc area, the spindle assembly transmits and transfers the cutter disc laterally along the first direction, so as to realize the upper and lowering of the cutter disc from a single side of the workbench, and provide a solution for fully automatic replacement of the cutter disc. A lifting portion is set on the cutter disc, and the spindle assembly is used to pick up the cutter disc, which provides a technical solution for replacing the cutter disc from the front side, saving equipment and workshop space and lowering the cost. In addition, only one cutter disc needs to be set in the cutter disc area to realize the fully automatic replacement of the old and new cutter discs, saving space on the workbench, improving the tool change efficiency, and providing the most cost-effective solution for fully automatic replacement of cutter discs for circuit board processing equipment.

[0125] Application Scenario 7

[0126] This embodiment takes the circuit board processing equipment as a four-axis drilling equipment, a cache component, a cache portion, a lifting portion, and at least two cutter discs in each cutter disc area as an example, and describes in detail the structure of the cutter disc, the structure of the circuit board processing equipment, and the tool change control method.

[0127] In this embodiment, the structure of the circuit board processing equipment is basically the same as that of the first embodiment, except that: a first cache component 13 is provided on one side of the circuit board processing equipment, and the first cache component includes a layer of cache portion 130, and a second cache component is not required. At the same time, at least two cutter discs are provided in each cutter disc area, and a lifting portion is provided on each cutter disc, and the spindle assembly picks up the lifting portion to carry a cutter disc. The structure and tool change control method of other circuit board processing equipment are the same as those of application scenario six or are adaptively adjusted, and will not be repeated here.

[0128] Combination Figure 2 and Fig.15As shown, in order to realize fully automatic handling of the cutter disc, the circuit board processing equipment includes: a workbench 10, the workbench includes a plurality of cutter disc areas 12, each of the cutter disc areas 12 is used to store the cutter disc 50; a first cache component 13 is arranged in a first direction on one side of the workbench; a spindle component 20, a plurality of the spindle components 20 are slidably connected on the crossbeam 30 above the workbench 10, and the spindle component 20 is configured to carry the cutter disc 50 between the first cache component 13 and the cutter disc area 12. In this embodiment, the first cache component 13 is arranged on the right side of the workbench 10.

[0129] In this embodiment, the first cache component 13 adopts Figure 6 The single-layer structure shown in FIG. Figure 8 The cutter disc structure and the lifting part structure shown in the figure. A first buffer component 13 is set on one side. The buffer component 13 has only one layer of buffer part 130. The buffer part 130 is used to buffer the cutter disc when loading or unloading. The cutter disc can also be automatically replaced on one side. Circuit board processing equipment such as Fig.15 As shown, the method of automatically replacing the cutter disc is as follows:

[0130] S100: Control at least one spindle assembly to transfer multiple old cutter discs between the cutter disc area and the first cache assembly; so as to sequentially move the old cutter discs in the cutter disc area to the first cache assembly, and multiple old cutter discs are cached on the first cache assembly. For the first cache assembly 13, the spindle assembly 20 sequentially picks up multiple old cutter discs from the cutter disc area and moves them to the first cache area 131. Under the drive of the driving member, multiple old cutter discs are transferred to the cache section 130 of the first cache assembly for cache.

[0131] After unloading an old cutter disc in the cutter disc area, since each cutter disc area also stores another cutter disc, the spindle assembly picks up the tool in the corresponding other cutter disc to continue processing. The cutter disc transfer device 200 receives the old cutter disc on the first buffer assembly 13 and releases the new cutter disc to the first buffer assembly 13. In this way, the first buffer assembly 13 caches multiple new cutter discs.

[0132] S200: Multiple new cutter discs are cached on the first cache component; at least one spindle component is controlled to transfer multiple new cutter discs between the first cache component and the cutter disc area, so as to move the new cutter discs in the first cache component to the cutter disc area. For the first cache component 13, when multiple new cutter discs are cached on the first cache component, under the drive of the driving member, the spindle component 20 is controlled to sequentially pick up multiple new cutter discs from the first cache area 131 and move them to the cutter disc area, and multiple new cutter discs are transferred from the cache part 130 to the cutter disc area. In this way, the action of replacing the cutter disc is completed.

[0133] This circuit board processing equipment and tool change control method can also achieve the following technical effects: through the first cache component, on the transport path formed by the cutter disc area, the spindle assembly transmits and transfers the cutter disc laterally along the first direction, so as to realize the upper and lowering of the cutter disc from a single side of the workbench, and provide a solution for fully automatic replacement of the cutter disc. A lifting portion is set on the cutter disc, and the spindle assembly is used to pick up the cutter disc, which provides a technical solution for replacing the cutter disc from the front side, saving equipment and workshop space and lowering the cost. In addition, this circuit board processing equipment and tool change control method saves space on the workbench, improves tool change efficiency, and provides the most cost-effective solution for fully automatic replacement of cutter discs for circuit board processing equipment.

[0134] The embodiments of the present disclosure have been described above, and the above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and changes will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The choice of terms used herein is intended to best explain the principles of the embodiments, practical applications, or technical improvements in the marketplace, or to enable other persons of ordinary skill in the art to understand the embodiments disclosed herein. The scope of the present disclosure is defined by the appended claims.

Claims

1. A circuit board processing equipment, characterized in that: include: A workbench, the workbench comprising a plurality of cutter disc areas, each of the cutter disc areas being used to store a cutter disc; a first cache component and a second cache component are arranged in a first direction on both sides of the workbench; A spindle assembly, wherein a plurality of the spindle assemblies are slidably connected to the crossbeam above the workbench, and the spindle assembly is configured to transport the cutter disc between the first cache assembly, the cutter disc area, and the second cache assembly.

2. The circuit board processing equipment according to claim 1, characterized in that: The first cache assembly and the second cache assembly include a plurality of cache areas for placing cutter discs arranged along a second direction; at least a portion of the first cache assembly or the second cache assembly overlaps with a projection of the spindle assembly on the base.

3. The circuit board processing equipment according to claim 2, characterized in that: The first cache component is provided with a first cache area, and the second cache component is provided with a second cache area. The first cache area, the second cache area and the multiple tool disc areas are linearly arranged along a first direction, and the spindle component is controlled to transport the tool disc between the first cache area, the tool disc area and the second cache area.

4. The circuit board processing equipment according to claim 2, characterized in that: The first cache component and the second cache component include a transfer member and at least two layers of cache sections stacked along the height direction, each layer of the cache section includes a plurality of the cache areas; the transfer member is raised and lowered along the height direction to align the cache sections of each layer.

5. The circuit board processing equipment according to claim 4, characterized in that: The spindle assembly transports the cutter disc from the transfer member to the cutter disc area.

6. The circuit board processing equipment according to claim 2, characterized in that: At least one of the spindle assemblies is used to transport the cutter disc between two adjacent cutter disc areas along the first direction; or, a plurality of the spindle assemblies are used to synchronously transport a plurality of the cutter discs along the first direction.

7. The circuit board processing equipment according to claim 2, characterized in that: At least one of the cutter discs is relayed by the plurality of spindle assemblies, stays in a plurality of adjacent cutter disc areas in sequence, and moves from the first cache assembly to the second cache assembly.

8. The circuit board processing equipment according to claim 2, characterized in that: At least one of the cutter disc areas, the cutter discs in the cutter disc area are first unloaded to the second buffer assembly, and then the cutter discs transported from the adjacent cutter disc area or the first buffer assembly are received; Alternatively, in at least one of the cutter disc areas, the cutter discs in the cutter disc area are first unloaded to the adjacent cutter disc area or the second cache component, and then the cutter discs transported from the first cache component are received.

9. The circuit board processing equipment according to any one of claims 1 to 8, characterized in that: The cutter disc includes a lifting portion, and the spindle assembly includes a first robot arm and a spindle clamp. The spindle assembly picks up the lifting portion through the first robot arm or the spindle clamp to carry the cutter disc.

10. The circuit board processing equipment according to any one of claims 1 to 8, characterized in that: The cutter disc includes two lifting parts, and the spindle assembly synchronously picks up the lifting parts through two mechanical arms to synchronously transport the cutter disc.

11. The circuit board processing equipment according to claim 10, characterized in that: The spindle assembly is provided with a first mechanical arm and a second mechanical arm, and the first mechanical arm and the second mechanical arm synchronously pick up the lifting portion to carry the cutter disc; Alternatively, a third mechanical arm is slidably connected to the crossbeam, and the third mechanical arm is located close to the first cache assembly and is used to move the cutter disc in the first cache assembly to the cutter disc area; Alternatively, the third robotic arm is located close to the second cache assembly, and is used to move the cutter disc in the cutter disc area to the second cache assembly.

12. A tool change control method, characterized in that: Applied to circuit board processing equipment, including: Control at least one spindle assembly to transfer a plurality of old cutter discs between the cutter disc area and the second cache assembly; so as to sequentially transport the old cutter discs in the cutter disc area to the second cache assembly, and the plurality of old cutter discs are cached in the second cache assembly; A plurality of new cutter discs are cached on the first cache component; and at least one of the spindle components is controlled to transfer the plurality of new cutter discs between the first cache component and the cutter disc area, so as to move the plurality of new cutter discs in the first cache component to the cutter disc area.

13. A circuit board processing device, characterized in that: include: A workbench, the workbench comprising a plurality of cutter disc areas, each of the cutter disc areas being used to store a cutter disc; a first buffer component is arranged in a first direction on one side of the workbench; A spindle assembly, wherein a plurality of the spindle assemblies are slidably connected to the crossbeam above the workbench, and the spindle assembly is configured to transport the cutter disc between the first cache assembly and the cutter disc area.

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