Multi-mode circuit board punching machine

Abstract

The invention relates to a multi-mode circuit board punching machine which comprises a control system, a punching body, a feeding side assembly and a receiving side assembly, and the receiving side assembly and the feeding side assembly are located on the two opposite sides of the punching body in the left-right direction respectively. The material supply side assembly can supply a circuit board to be processed to the stamping main body for processing, and the material receiving side assembly can collect the processed circuit board from the stamping main body; wherein the feeding side assembly is provided with a feeding manipulator and a circuit board feeding platform; the feeding mechanical arm is provided with a feeding suction cup capable of moving in the left-right direction and the vertical direction, and the feeding mechanical arm is arranged to feed a circuit board to be machined on the circuit board feeding platform into the stamping body to be machined. The circuit board feeding platform can move in the left-right direction and the front-back direction and can horizontally rotate in the vertical direction. According to the circuit board punching machine, multiple punching modes such as rotary punching and front-back jump punching are achieved through cooperation of the circuit board feeding platform and the feeding mechanical arm, and the circuit board punching machine has the advantage of being simple in structure.

Description

Technical Field

[0001] The present invention relates to a circuit board punching machine; more particularly, to a circuit board punching machine capable of performing multi-mode punching processing. Background Art

[0002] Punching machines are widely used in the process of circuit board processing, such as circuit board shape making and punching. Existing circuit board punching machines have the problem of a relatively single processing mode, which is difficult to adapt to different circuit board stamping processing requirements and needs to be improved. Summary of the invention

[0003] In view of the deficiencies in the prior art, the main purpose of the present invention is to provide a circuit board punching machine with multiple punching modes.

[0004] In order to achieve the above-mentioned main purpose, the present invention provides a multi-mode circuit board punching machine, including a control system, a stamping body, a feeding side component and a receiving side component, wherein the receiving side component and the feeding side component are respectively located on opposite sides of the stamping body in the left-right direction; the feeding side component can supply the circuit board to be processed to the stamping body for processing, and the receiving side component can collect the processed circuit board from the stamping body; wherein the feeding side component is provided with a loading robot and a circuit board loading platform; the loading robot is provided with a loading suction cup which can move in the left-right direction and the vertical direction, and is configured to feed the circuit board to be processed on the circuit board loading platform into the stamping body for processing; the circuit board loading platform is configured to be able to move in the left-right direction and the front-back direction, and can rotate horizontally around the vertical direction.

[0005] Furthermore, the feed side component is provided with an incoming material storage mechanism and a feed side transfer robot, the incoming material storage mechanism is used to store incoming circuit boards to be processed, and the feed side transfer robot is configured to place the circuit boards to be processed in the incoming material storage mechanism onto the circuit board loading platform.

[0006] Furthermore, the feed side component is also provided with a first detection camera and a second detection camera, the first detection camera is located above the incoming material storage mechanism, the second detection camera is located above the moving path of the circuit board loading platform, and the second detection camera has a higher detection accuracy than the first detection camera.

[0007] Among them, the first detection camera can identify the circuit boards and separators in the incoming material storage mechanism, and perform coarse positioning detection on the circuit boards; the second detection camera can perform fine positioning detection on the circuit boards on the circuit board loading platform through flying shooting technology, and use the circuit board loading platform (for example, rotation) to correct the circuit boards carried thereon to achieve precise control of the circuit board loading position and angle.

[0008] Furthermore, the control system is configured to control the punch press to execute the following punching modes:

[0009] Rotary punching mode: After the set punching step is completed, the loading robot takes the circuit board from the punching body and puts it back to the circuit board loading platform. After the circuit board loading platform rotates horizontally by a preset angle, the loading robot places the circuit board on the punching body for subsequent punching;

[0010] Forward and backward jumping punching mode: After the set stamping steps are completed, the loading robot takes the circuit board from the stamping body and puts it back to the circuit board loading platform. After the circuit board loading platform moves forward and backward by a preset distance, the loading robot places the circuit board on the stamping body for subsequent stamping.

[0011] Furthermore, the material receiving side component includes a material unloading robot, a paper separation / empty pallet storage mechanism, a material receiving side transfer robot, a material receiving transfer platform and a material receiving storage mechanism. The paper separation / empty pallet storage mechanism is arranged behind the material receiving storage mechanism, and the material receiving transfer platform can be movably arranged forward and backward above the paper separation / empty pallet storage mechanism and the material receiving storage mechanism.

[0012] Among them, the unloading robot is provided with an unloading suction cup which can move in the left and right directions and the vertical direction, and can take out the processed circuit board from the stamping body and place it on the receiving transfer platform and the receiving storage mechanism; the receiving side transfer robot is used to place the separator paper stored in the separator paper / empty pallet storage mechanism into the receiving storage mechanism, and transfer the pallet between the separator paper / empty pallet storage mechanism, the receiving transfer platform and the receiving storage mechanism.

[0013] Furthermore, the material receiving side component includes a scrap material storage box and a scrap material support plate, the scrap material storage box is located behind the paper separation / empty tray storage mechanism; the scrap material support plate is configured to be able to flip vertically and to be able to move between a position above the material receiving storage mechanism and a position above the scrap material storage box.

[0014] Furthermore, the control system is configured to be able to control the punch press to execute a left and right jump punching mode: after the set punching step is completed, the unloading robot first moves the circuit board in the punching body toward the receiving side by a preset distance, and the punching body then performs subsequent punching.

[0015] Furthermore, the control system is configured to control the punch press to execute the following material receiving mode:

[0016] Separator paper receiving mode: After the transfer robot on the receiving side places the separator paper stored in the separator paper / empty tray storage mechanism into the receiving storage mechanism, the unloading robot directly places the processed circuit board taken out from the stamping body onto the separator paper of the receiving storage mechanism;

[0017] Pallet material receiving mode: After the transfer robot on the material receiving side places the empty pallet stored in the separation paper / empty pallet storage mechanism onto the material receiving transfer platform, the material receiving transfer platform moves to the top of the material receiving storage mechanism; the unloading robot places the processed circuit board taken out from the stamping body into the pallet on the material receiving transfer platform, and after the pallet is full, the transfer robot on the material receiving side places the pallet on the material receiving transfer platform into the material receiving storage mechanism.

[0018] Furthermore, the circuit board positioning portion includes negative pressure adsorption holes distributed in an array on the circuit board loading platform, and a check valve is provided in the negative pressure adsorption holes. During operation, the negative pressure adsorption holes covered by the circuit board can normally generate negative pressure suction force, while the negative pressure adsorption holes not covered by the circuit board are in a closed state under the action of the check valve, thereby reducing the negative pressure suction noise during operation and reducing the required negative pressure suction force.

[0019] Furthermore, the punch body includes an upper die seat for mounting an upper die and a lower die seat for mounting a lower die, and the upper die seat is configured to be able to magnetically fix the upper die. The upper die is fixed by magnetic attraction, which has the advantages of simple installation structure and convenient die change.

[0020] The technical solution of the present invention has the following beneficial effects:

[0021] In the circuit board punching machine of the present invention, the circuit board loading platform of the feeding side component can not only accurately control the loading position and angle of the circuit board carried thereon through its own movement, but also cooperate with the loading robot to realize various punching modes such as rotary punching and forward and backward jumping punching; wherein, when executing the rotary punching and forward and backward jumping punching modes, the loading angle and front and rear position of the circuit board are adjusted by the circuit board loading platform, and the loading robot only needs to move left and right and up and down, which can simplify the structure of the loading robot and promote the miniaturization of the punching machine. Furthermore, the receiving side component includes a material unloading robot, a paper separator / empty tray storage mechanism, a receiving side transfer robot, a receiving transfer platform and a receiving storage mechanism that cooperate with each other, and can be compatible with both the paper separator receiving mode and the tray receiving mode.

[0022] In order to more clearly illustrate the purpose, technical solutions and advantages of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1is a structural diagram of a punch press in an embodiment of the present invention;

[0024] Figure 2 is a front view of a punch press according to an embodiment of the present invention;

[0025] Figure 3 is a structural diagram of a stamping die in an embodiment of the present invention;

[0026] Figure 4 It is a structural diagram of a loading robot and a unloading robot in an embodiment of the present invention;

[0027] Figure 5 It is a structural diagram of the transfer robot on the feeding side in an embodiment of the present invention;

[0028] Figure 6 is a structural diagram of a feed side component in an embodiment of the present invention;

[0029] Figure 7 is a structural diagram of a circuit board loading platform in an embodiment of the present invention;

[0030] Figure 8 is a front view of a circuit board loading platform in an embodiment of the present invention;

[0031] Fig. 9 is a structural diagram of a receiving side component in an embodiment of the present invention;

[0032] Fig.10 It is a left view of the receiving side component in the embodiment of the present invention. DETAILED DESCRIPTION

[0033] In the following description, many specific details are explained in combination with embodiments to facilitate those skilled in the art to fully understand the present invention. However, it should be understood that the following embodiments and detailed descriptions are only for illustrative purposes and do not limit the scope of protection of the present invention.

[0034] Figure 1 and Figure 2 2 is a structural diagram of the punch press in the embodiment. For the sake of clarity, the punch press outer frame and other components are omitted in the diagram. Figure 1 and Figure 2 As shown, the punch press of the embodiment includes a control system, a punching body 100, a feeding side component 200 and a receiving side component 300. The feeding side component 200 is located on the right side of the punching body 100, and can supply the circuit board to be processed to the punching body 100 for processing; the receiving side component 300 is located on the left side of the punching body 100, and can collect the processed circuit board from the punching body 100. It is easy to understand that the setting positions of the feeding side component 200 and the receiving side component 300 can be interchangeable.

[0035] like Figure 2 and Figure 3As shown, the stamping body 100 includes an upper die seat 110a for installing an upper die 400a and a lower die seat 110b for installing a lower die 400b; when working, the upper die 400a is pressed down to stamp the circuit board placed on the lower die 400b. Preferably, the upper die seat 110a is configured to be able to magnetically fix the upper die 400a. When the stamping die is installed, it is first placed on the lower die seat 110b as a whole. After the lower die 400b is locked and fixed, the upper die seat 110a descends and absorbs and fixes the upper die 400a, which has the advantages of simple installation structure and convenient die change. In the present invention, the upper die seat 110a can use a permanent magnet or an electromagnet to absorb and fix the upper die 400a.

[0036] Furthermore, auxiliary support plates 120 may be provided on the left and right sides of the lower die base 110b, and the auxiliary support plates 120 may support the end of the circuit board extending out of the lower die 400b to improve the flatness of the circuit board on the lower die 400b during stamping.

[0037] like Figure 2 and Figure 6 As shown, the feeding side component 200 is provided with a feeding robot 210 and a circuit board feeding platform 220. The feeding robot 210 is configured to feed the circuit board to be processed on the circuit board feeding platform 220 into the stamping body 100 / stamping die for stamping processing. Figure 1 As shown, a horizontal slide rail 120 extending left and right is installed on the front upper side of the punch body 100, and the loading robot 210 is installed on the horizontal slide rail 120. Figure 4 As shown, the feeding manipulator 210 is provided with a feeding drive mechanism and a feeding suction cup 211 that can only move in the left and right directions and the vertical direction. The feeding drive mechanism includes a feeding translation module 213 and a feeding lifting module 212. The feeding translation module 213 is installed on the horizontal slide rail 120 to drive the feeding suction cup 211 to move left and right; the feeding lifting module 212 is installed on the feeding translation module 213 to drive the feeding suction cup 211 to move up and down.

[0038] The circuit board loading platform 220 is connected to the loading platform driving mechanism so that it can move in the left-right direction and the front-back direction, and can rotate horizontally around the vertical direction (up-down direction), so that the circuit board to be processed carried on it can be corrected through its own movement, and the loading position and angle of the circuit board to be processed can be accurately controlled. Figures 6 to 8 As shown, the loading platform driving mechanism includes a platform front-to-back translation module 221, a platform left-to-right movement module 222 and a platform rotation module 223 which are connected in sequence. The circuit board loading platform 220 is installed on the platform rotation module 223. The platform front-to-back translation module 221, the platform left-to-right movement module 222 and the platform rotation module 223 are respectively used to drive the circuit board loading platform 220 to move forward and backward, left-to-right and rotate horizontally.

[0039] The circuit board loading platform 220 is provided with a circuit board positioning portion. Figure 7 As shown, the circuit board positioning portion can be a negative pressure adsorption hole 220a distributed in an array on the circuit board loading platform 220 to accommodate circuit boards of different sizes, shapes and / or structures. Preferably, a check valve (not visible in the figure) is provided in the negative pressure adsorption hole 220a, and the negative pressure adsorption hole 220a covered by the circuit board during the adsorption process can normally generate negative pressure suction, while the negative pressure adsorption hole 220a not covered by the circuit board is in a closed state under the action of the check valve, thereby reducing the negative pressure suction noise during adsorption and reducing the negative pressure suction force required to be applied. In addition, a positioning portion such as a positioning pin can also be provided on the circuit board loading platform 220 to position the circuit board.

[0040] Furthermore, the feed side component 200 is also provided with an incoming material storage mechanism 230 and a feed side transfer robot 240. The incoming material storage mechanism 230 is used to store incoming circuit boards to be processed, and the feed side transfer robot 240 is configured to be able to place the circuit boards to be processed in the incoming material storage mechanism 230 onto the circuit board loading platform 220. The incoming material storage mechanism 230 is disposed at the rear of the circuit board loading platform 220; the circuit board loading platform 220 can move backward to a position where the feed side transfer robot 240 receives the circuit boards to be processed, and can move forward to a position where the loading robot 210 / loading suction cup 211 can suck up the circuit boards from the circuit board loading platform 220. Figure 5 As shown, in the embodiment, the feeding side transfer robot 240 has a forward and backward moving module 241, a lifting module 242, a left and right moving module 243, a rotating module 244 and a material picking suction cup 245 which are connected in sequence, that is, the material picking suction cup 245 can move in the forward and backward, left and right, and up and down directions, and can rotate horizontally around the vertical direction.

[0041] The incoming material storage mechanism 230 is provided with a liftable incoming material carrier 231. The incoming circuit board materials to be processed can be placed on the incoming material carrier 231 in the form of being stacked and contained in a material box, or can be directly stacked on the incoming material carrier 231. A paper separator storage box 250 is provided at the rear side of the incoming material storage mechanism 230, and a material receiving funnel 251 is provided above the paper separator storage box 250. The transfer manipulator 240 on the feeding side can drop the paper separators in the incoming circuit board materials to be processed into the paper separator storage box 250 through the material receiving funnel 251. It is easy to understand that the paper separator storage box 250 can also be set at the front side of the incoming material storage mechanism 230 and located below the moving path of the circuit board loading platform 220.

[0042] Furthermore, the feeding side component 200 is also provided with a detection component 260, which includes a first detection camera 261 and a second detection camera 262. The first detection camera 261 is located above the incoming material storage mechanism 230, and the second detection camera 262 is located above the moving path of the circuit board loading platform 220. The second detection camera 262 has a higher detection accuracy than the first detection camera 261. Preferably, the detection component 260 has at least one illumination light source 263, for example, including two strip illumination light sources 263 arranged in parallel.

[0043] Usually, a paper separator is provided between the upper and lower layers of the incoming circuit board materials to be processed. The first detection camera 261 can identify the circuit board and the paper separator in the incoming material storage mechanism 230, and perform a rough positioning detection on the circuit board; the second detection camera 262 can perform a precise positioning detection on the circuit board on the circuit board loading platform 220 by using the flying shooting technology, and the circuit board loading platform 220 can correct the circuit board carried thereon by its own movement (such as rotation and / or translation) to achieve precise control of the circuit board loading position and angle.

[0044] In the embodiment, under the control of the punch press control system, the circuit board loading platform 220 and the loading robot 210 cooperate with each other, so that the punch press can realize a variety of different punching modes. Specifically, the control system is configured to control the punch press to execute the following punching modes:

[0045] Rotational punching mode: After the set stamping steps are completed, the loading robot 210 takes the circuit board from the stamping body 100 and places it back on the circuit board loading platform 220. After the circuit board loading platform 220 rotates horizontally by a preset angle (for example, 180°), the loading robot 210 places the circuit board on the stamping body 100 for subsequent stamping.

[0046] Forward and backward jumping punching mode: After the set stamping steps are completed, the loading robot 210 takes the circuit board from the stamping body 100 and puts it back to the circuit board loading platform 220. After the circuit board loading platform 220 moves forward and backward by a preset distance, the loading robot 210 places the circuit board on the stamping body 100 for subsequent stamping.

[0047] It can be seen that when the punch press executes different punching steps of the rotary punching and forward and backward jump punching modes, the loading angle and front and rear position of the circuit board are adjusted through the circuit board loading platform 220, and the loading robot 210 only needs to move left and right and up and down to complete the loading action, which can simplify the structure of the loading robot 210 and promote the miniaturization of the punch press.

[0048] In the present invention, the loading suction cup 211 of the loading manipulator 210 may include a plurality of relatively independent suction nozzle groups for negative pressure suction, and the plurality of suction nozzle groups may selectively suction according to the change of the loading position of the circuit board, thereby reducing the required suction negative pressure and reducing the negative pressure noise. For example, the loading suction cup 211 is provided with three suction nozzle groups in the front-to-back direction, and each suction nozzle group includes a plurality of suction nozzles arranged in the left-to-right direction; in different stamping steps of the front-to-back jump stamping mode, according to the change of the front-to-back position of the circuit board during loading, only the first two or the last two suction nozzle groups need to be opened to negatively adsorb the circuit board.

[0049] Furthermore, the control system is configured to control the punch press to perform a left-right jump punching mode: after the set punching step is completed, the unloading manipulator 310 (described later) first moves the circuit board in the punching body 100 toward the receiving side by a preset distance, and the punching body 100 then performs subsequent punching. It is easy to understand that the punch press in the present invention can also perform a single punching mode, that is, the punching body 100 only punches the circuit board once.

[0050] like Fig. 9 and Fig.10 As shown, the receiving side assembly 300 includes a material unloading robot 310, a paper separator / empty tray storage mechanism 320, a receiving side transfer robot 330, a receiving transfer platform 340 and a receiving material storage mechanism 350. Among them, the receiving material storage mechanism 350 is arranged at the unloading position of the unloading robot 310 (aligned with the position of the unloading suction cup 311 of the unloading robot 310 in the left and right direction), the paper separator / empty tray storage mechanism 320 is arranged behind the receiving material storage mechanism 350, and the receiving transfer platform 340 is arranged above the paper separator / empty tray storage mechanism 320 and the receiving material storage mechanism 350 so as to be movable forward and backward. The interleaf paper / empty tray storage mechanism 320 includes an elevating bearing platform 321, which can automatically adjust the height of the top interleaf paper / empty tray as the interleaf paper / empty tray is taken out, so as to facilitate the receiving side transfer robot 330 to absorb the interleaf paper / empty tray; the receiving storage mechanism 350 includes an elevating bearing platform 351, which can automatically adjust the stacking height as the circuit boards / trays are stacked. The elevating mechanism of the bearing platform 321 and the bearing platform 351 preferably adopts a screw elevating mechanism.

[0051] The unloading robot 310 can take out the processed circuit board from the stamping body 100 / stamping die and place it on the receiving transfer platform 340 (in the tray receiving mode) and the receiving storage mechanism 350 (in the paper separation receiving mode). Figure 4As shown, the unloading manipulator 310 is provided with an unloading driving mechanism and an unloading suction cup 311 that can only move in the left and right directions and the vertical direction. The unloading driving mechanism includes an unloading translation module 313 and an unloading lifting module 312. The unloading translation module 313 is installed on the horizontal slide rail 120 to drive the unloading suction cup 311 to move left and right; the unloading lifting module 312 is installed on the unloading translation module 313 to drive the unloading suction cup 311 to move up and down.

[0052] The receiving side transfer robot 330 is used to place the separator paper stored in the separator paper / empty tray storage mechanism 320 into the receiving material storage mechanism 350, and transfer the trays between the separator paper / empty tray storage mechanism 320, the receiving material transfer platform 340 and the receiving material storage mechanism 350. Fig.10 As shown, the receiving side transfer robot 330 is provided with a forward and backward moving module 331, a lifting module 332 and a material picking suction cup 333 for sucking the separator paper / tray which are connected in sequence, that is, the material picking suction cup 333 is configured to be able to move forward and backward and to be lifted up and down.

[0053] Circuit board stamping processing usually adopts a paper separator collection mode or a tray collection mode. Among them, the paper separator collection mode is generally adopted when the circuit board is still a whole product after stamping, that is, the stamped circuit boards are stacked and collected, and the upper and lower circuit boards are separated by paper separators. When the whole circuit board is divided into multiple circuit board units after stamping, the tray collection mode is generally adopted, that is, the circuit board units are placed in a tray for storage. When the paper separator collection mode is required, the paper separator / empty tray storage mechanism 320 stores paper separators; when the tray collection mode is required, the paper separator / empty tray storage mechanism 320 stores trays.

[0054] In the embodiment, the control system is configured to control the punch press to execute the paper separation receiving mode and the tray receiving mode. In the paper separation receiving mode, after the receiving side transfer robot 330 places the paper separation stored in the paper separation / empty tray storage mechanism 320 into the receiving storage mechanism 350, the unloading robot 310 directly places the processed circuit board taken out from the punching body 100 onto the paper separation of the receiving storage mechanism 350. In the tray receiving mode, the receiving side transfer robot 330 first places the empty tray stored in the paper separation / empty tray storage mechanism 320 onto the receiving transfer platform 340, and the receiving transfer platform 340 then moves to the top of the receiving storage mechanism 350; then the unloading robot 310 places the processed circuit board taken out from the punching body 100 into the tray on the receiving transfer platform 340, and after the tray is full, the receiving side transfer robot 330 places the tray on the receiving transfer platform 340 into the receiving storage mechanism 350.

[0055] Furthermore, a tray positioning structure may be provided on the receiving and transferring platform 340 to accurately control the position of the tray on the receiving and transferring platform 340, so that the unloading robot 310 can accurately place the processed circuit board into the set storage position in the tray. The tray positioning structure may be a negative pressure hole, a positioning pin that can be inserted into the tray, or a limiting rib abutting against the side of the tray, and the present invention does not impose any specific restrictions on this.

[0056] Generally, when a whole circuit board is punched into multiple circuit board monomers, waste scraps that are difficult to be recovered by the punching body 100 are generated after punching, and the waste scraps can be taken out synchronously with the circuit board monomers by the unloading manipulator 310. Accordingly, the receiving side component 300 includes a scrap storage box 361 and a scrap support plate 362. The scrap storage box 361 is located behind the paper separator / empty tray storage mechanism 320; the scrap support plate 362 is configured to be able to flip vertically and move between a position above the receiving storage mechanism 350 and a position above the scrap storage box 361. When moved to the top of the receiving storage mechanism 350, the scrap support plate 362 receives the waste scraps from the unloading manipulator 310 in a horizontal state; when moved to the top of the scrap storage box 361, the scrap support plate 362 flips vertically to throw the waste scraps into the scrap storage box 361.

[0057] Preferably, when the edge material support plate 362 is in a horizontal state, the edge material support plate 362 and the receiving and transferring platform 340 are spaced apart in the vertical direction, and the edge material support plate is located above the receiving and transferring platform 340. Furthermore, the edge material support plate 362 and the receiving and transferring platform 340 use independent driving mechanisms, that is, the edge material support plate 362 and the receiving and transferring platform 340 can operate independently.

[0058] Although the present invention is described above through preferred embodiments, it should be understood that any equivalent changes made by ordinary technicians in this field without departing from the scope of the invention of the present invention should be covered by the protection scope of the present invention.

Claims

1. A multi-mode circuit board punching machine, comprising a control system, a punching body, a feeding side component and a receiving side component, wherein the receiving side component and the feeding side component are respectively located on opposite sides of the punching body in the left and right directions; the feeding side component can supply the circuit board to be processed to the punching body for processing, and the receiving side component can collect the processed circuit board from the punching body; characterized in that: The feeding side component is provided with a loading robot and a circuit board loading platform with a circuit board positioning portion; wherein the loading robot is provided with a loading suction cup that can move in the left and right directions and the vertical direction, and is configured to feed the circuit board to be processed on the circuit board loading platform into the stamping body for processing; the circuit board loading platform is configured to be able to move in the left and right directions and the front and rear directions, and can rotate horizontally around the vertical direction.

2. The multi-mode circuit board punching machine according to claim 1, characterized in that: The feed side component is also provided with a material storage mechanism and a feed side transfer robot. The material storage mechanism is used to store incoming circuit boards to be processed, and the feed side transfer robot is configured to place the circuit boards to be processed in the material storage mechanism onto the circuit board loading platform.

3. The multi-mode circuit board punching machine according to claim 2, characterized in that: The feeding side component is also provided with a first detection camera and a second detection camera. The first detection camera is located above the incoming material storage mechanism, and the second detection camera is located above the moving path of the circuit board loading platform. The second detection camera has a higher detection accuracy than the first detection camera.

4. The multi-mode circuit board punching machine according to claim 1, characterized in that The control system is configured to control the punch press to perform the following punching modes: Rotary punching mode: After the set punching step is completed, the loading robot takes the circuit board from the punching body and puts it back to the circuit board loading platform. After the circuit board loading platform rotates horizontally by a preset angle, the loading robot places the circuit board on the punching body for subsequent punching; Forward and backward jumping punching mode: After the set stamping steps are completed, the loading robot takes the circuit board from the stamping body and puts it back to the circuit board loading platform. After the circuit board loading platform moves forward and backward by a preset distance, the loading robot places the circuit board on the stamping body for subsequent stamping.

5. The multi-mode circuit board punching machine according to claim 1, characterized in that: The receiving side assembly includes a material unloading manipulator, a paper separator / empty tray storage mechanism, a receiving side transfer manipulator, a receiving transfer platform and a receiving material storage mechanism. The paper separator / empty tray storage mechanism is arranged behind the receiving material storage mechanism, and the receiving transfer platform can be movably arranged forward and backward above the paper separator / empty tray storage mechanism and the receiving material storage mechanism. The unloading robot is provided with an unloading suction cup that can move in the left and right directions and the vertical direction, and can take out the processed circuit board from the stamping body and place it on the receiving transfer platform and the receiving storage mechanism; the receiving side transfer robot is used to place the separator paper stored in the separator paper / empty pallet storage mechanism into the receiving storage mechanism, and transfer the pallet between the separator paper / empty pallet storage mechanism, the receiving transfer platform and the receiving storage mechanism.

6. The multi-mode circuit board punching machine according to claim 5, characterized in that: The material receiving side component includes a scrap material storage box and a scrap material support plate, wherein the scrap material storage box is located behind the paper separation / empty tray storage mechanism; the scrap material support plate is configured to be able to flip vertically and to be able to move between a position above the material receiving storage mechanism and a position above the scrap material storage box.

7. The multi-mode circuit board punching machine according to claim 5, characterized in that The control system is configured to control the punch press to perform the following punching modes: Left and right jump punching mode: After the set punching steps are completed, the unloading robot first moves the circuit board in the punching body toward the receiving side by a preset distance, and the punching body then performs subsequent punching.

8. The multi-mode circuit board punching machine according to claim 5, characterized in that The control system is configured to control the punch press to execute the following material receiving mode: Separator paper receiving mode: After the transfer robot on the receiving side places the separator paper stored in the separator paper / empty tray storage mechanism into the receiving storage mechanism, the unloading robot directly places the processed circuit board taken out from the stamping body onto the separator paper of the receiving storage mechanism; Pallet material receiving mode: After the transfer robot on the material receiving side places the empty pallet stored in the separation paper / empty pallet storage mechanism onto the material receiving transfer platform, the material receiving transfer platform moves to the top of the material receiving storage mechanism; the unloading robot places the processed circuit board taken out from the stamping body into the pallet on the material receiving transfer platform, and after the pallet is full, the transfer robot on the material receiving side places the pallet on the material receiving transfer platform into the material receiving storage mechanism.

9. The multi-mode circuit board punching machine according to claim 1, characterized in that: The circuit board positioning portion comprises negative pressure adsorption holes which are distributed in an array on the circuit board loading platform, and a check valve is arranged in the negative pressure adsorption hole.

10. The multi-mode circuit board punching machine according to claim 1, characterized in that: The punching body comprises an upper die seat for mounting an upper die and a lower die seat for mounting a lower die, and the upper die seat is configured to be able to magnetically fix the upper die.

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