Die cutting method and device for TP foam rubber

Abstract

According to the TP foam rubber die cutting method and device, pre-pressing is conducted on a release bottom film and a foam rubber material, the internal stress of the material is eliminated, a micro plastic deformation layer is formed, and therefore cutting springback is reduced, and the phenomena of cutting burrs, collapse and warping are reduced; a base material of the pre-pressed material is peeled off, then a die cutting machine is adopted to conduct die cutting on the foam double-faced adhesive tape, foam waste is peeled off, a die cutting material is obtained, and the die cutting machine dynamically adjusts the feeding rate in the die cutting process according to the die cutting stage, so that initial impact on the material is reduced, material bonding is prevented, and colloid migration is eliminated; the feature point coordinates of the die-cutting material are obtained based on a visual identification tool, the die-cutting material is subjected to positioning compensation according to the feature point coordinates through an elastic limiting mechanism, then the die-cutting material and a release film are aligned and attached, TP foam rubber is obtained, the alignment precision of multiple layers of materials is improved, and high-precision attachment of the TP foam rubber and other complex special-shaped contours of mobile phones is met.

Description

Technical Field

[0001] The present application relates to the field of die-cutting technology, and in particular to a die-cutting method and device for TP foam adhesive. Background Art

[0002] TP foam adhesive is a key buffer and adhesive material between the touch panel (TP) and the display screen. Its die-cutting accuracy directly affects the assembly quality of the screen component. At present, TP foam adhesive is usually produced by traditional stamping process, using a fixed-angle die-cutting tool (usually a 90° right-angle knife) to complete the switching in one go, and then manually or mechanically remove the waste.

[0003] However, the high pressure of the traditional stamping process causes the material to deform instantly, and the stress is concentrated on the cutting edge, resulting in burrs, collapse or warping on the cutting edge; the fixed angle tool cannot adapt to the elastic retraction of the material, causing colloid migration; the positioning method using mechanical limit leads to large alignment deviation of multi-layer composite materials. Therefore, a high-precision die-cutting method for TP foam glue is urgently needed. Summary of the invention

[0004] The present application provides a TP foam adhesive die-cutting method and device to solve the technical problems of stress concentration and large alignment deviation in the existing TP foam adhesive die-cutting process.

[0005] In order to solve the above technical problems, in a first aspect, an embodiment of the present application provides a die-cutting method of TP foam adhesive, comprising:

[0006] Pre-pressing the release base film and the foam adhesive material to obtain a pre-pressed material, wherein the foam adhesive material includes a substrate and a foam double-sided adhesive;

[0007] The substrate of the pre-pressed material is peeled off, and the foam double-sided adhesive is die-cut by a die-cutting machine, and the foam waste is peeled off to obtain a die-cut material, wherein the die-cutting machine dynamically adjusts the feed rate according to the die-cutting stage during the die-cutting process;

[0008] The characteristic point coordinates of the die-cut material are obtained based on a visual recognition tool, and the die-cut material is positioned and compensated according to the characteristic point coordinates using an elastic limiting mechanism, and then the die-cut material is aligned and bonded to a release film to obtain TP foam adhesive.

[0009] In some embodiments, the pre-pressing of the release base film and the foam adhesive material to obtain the pre-pressed material includes:

[0010] The release base film and the foam adhesive material are respectively transferred to a pre-pressing platform, and the release base film and the foam adhesive material are pre-pressed twice, the first pre-pressing pressure is 0.5MPa-0.8MPa, and the second pre-pressing pressure is 1.2MPa-1.5MPa.

[0011] In some embodiments, the surface of the pre-pressing platform is provided with a micro-protrusion array, and the height of the protrusion is 20 μm to 50 μm.

[0012] In some embodiments, the die-cutting machine is used to die-cut the pre-pressed material to obtain the die-cut material, including:

[0013] Determine the die-cutting parameters of the die-cutting machine according to the die-cutting thickness of the pre-pressed material, wherein the die-cutting parameters include the cutting angle of the roller cutter and the rotation rate of each die-cutting stage, wherein the die-cutting stage includes a cutting period, a stabilization period and a knife closing period;

[0014] The target roller cutter corresponding to the roller cutter cutting angle is called, and the rotation rate of the target roller cutter in each die-cutting stage is controlled to die-cut the pre-pressed material to obtain the die-cut material.

[0015] In some embodiments, determining the die-cutting parameters of the die-cutting machine according to the die-cutting thickness of the pre-pressed material includes:

[0016] When the die-cutting thickness of the pre-pressed material is not greater than the preset thickness, determining the die-cutting parameters of the die-cutting machine to be the first preset parameters;

[0017] When the die-cutting thickness of the pre-pressed material is greater than the preset thickness, the die-cutting parameters of the die-cutting machine are calculated based on a preset die-cutting parameter calculation formula.

[0018] In some embodiments, the preset die-cutting parameter calculation formula is expressed as:

[0019]

[0020] Wherein, h is the die-cutting thickness of the pre-pressed material, r is the roller cutter radius, θ is the roller cutter cutting angle, t is the contact time between the roller cutter and the pre-pressed material, v1 is the rotation rate during the cutting period, v2 is the rotation rate during the stable period, v3 is the rotation rate during the knife closing period, v′ is the first preset rotation rate, and v″ is the second preset rotation rate.

[0021] In some embodiments, the use of an elastic limiting mechanism to perform positioning compensation on the die-cutting material according to the coordinates of the feature points includes:

[0022] Determining the position deviation of the die-cut material according to the coordinates of the feature points;

[0023] When the position deviation is greater than a preset value, a compensation amount of the die-cutting material is generated;

[0024] The elastic limiting mechanism is used to perform positioning compensation on the die-cutting material according to the compensation amount.

[0025] In some of the embodiments, the elastic limiting mechanism includes a piezoelectric ceramic drive module and a magnetorheological damper connected to the positioning platform, and the damping coefficient of the magnetorheological damper can be dynamically adjusted according to the compensation amount.

[0026] In a second aspect, the present application also provides a TP foam adhesive die-cutting device, comprising:

[0027] A pre-pressing mechanism, used for pre-pressing the release base film and the foam adhesive material to obtain a pre-pressed material, wherein the foam adhesive material comprises a substrate and a foam double-sided adhesive;

[0028] A die-cutting mechanism, used to peel off the substrate of the pre-pressed material, and then use a die-cutting machine to die-cut the foam double-sided adhesive, and peel off the foam waste to obtain the die-cutting material, and the die-cutting machine dynamically adjusts the feed rate according to the die-cutting stage during the die-cutting process;

[0029] The laminating mechanism is used to obtain the coordinates of the feature points of the die-cut material based on the visual recognition tool, and use the elastic limiting mechanism to position and compensate the die-cut material according to the coordinates of the feature points, and then align and laminate the die-cut material with the release film to obtain TP foam glue.

[0030] In a third aspect, an embodiment of the present application further provides a die-cutting device, including a processor and a memory, wherein the memory is used to store a computer program, and when the computer program is executed by the processor, the die-cutting method of TP foam glue as described in the first aspect is implemented.

[0031] Compared with the prior art, this application has at least the following beneficial effects:

[0032] The present application pre-presses the release base film and the foam adhesive material to eliminate the internal stress of the material and form a microscopic plastic deformation layer, thereby reducing cutting rebound, cutting burrs, collapse and warping; peels off the base material of the pre-pressed material, and then uses a die-cutting machine to die-cut the foam double-sided adhesive, and peels off the foam waste to obtain the die-cut material. The die-cutting machine dynamically adjusts the feed rate according to the die-cutting stage during the die-cutting process to reduce the initial impact on the material and prevent material adhesion, and eliminate colloid migration; based on the visual recognition tool, the coordinates of the feature points of the die-cutting material are obtained, and the elastic limit mechanism is used to position and compensate the die-cutting material according to the coordinates of the feature points, and then the die-cutting material is aligned and bonded with the release film to obtain TP foam adhesive, thereby improving the alignment accuracy of multi-layer materials and meeting the high-precision bonding of complex and special-shaped contours such as mobile phone TP foam adhesive. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 A schematic diagram of the process of the die-cutting method of TP foam adhesive shown in the embodiment of the present application;

[0034] Figure 2This is a physical schematic diagram of the TP foam adhesive shown in the embodiment of the present application;

[0035] Figure 3 This is a structural block diagram of a die-cutting device for TP foam glue shown in an embodiment of the present application;

[0036] Figure 4 This is a structural block diagram of the die-cutting equipment shown in an embodiment of the present application. DETAILED DESCRIPTION

[0037] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0038] Please refer to Figure 1 , Figure 1 The present invention provides a schematic flow chart of a TP foam adhesive die-cutting method. The TP foam adhesive die-cutting method of the present embodiment includes steps S101 to S103, which are described in detail as follows:

[0039] Step S101, pre-pressing the release base film and the foam adhesive material to obtain a pre-pressed material, wherein the foam adhesive material includes a substrate and a foam double-sided adhesive.

[0040] In this step, the pre-pressing operation can reduce deformation or defects caused by uneven internal stress of the material, thereby improving the accuracy and yield rate of subsequent processing.

[0041] In some embodiments, the step S101 includes:

[0042] The release base film and the foam adhesive material are respectively transferred to a pre-pressing platform, and the release base film and the foam adhesive material are pre-pressed twice, the first pre-pressing pressure is 0.5MPa-0.8MPa, and the second pre-pressing pressure is 1.2MPa-1.5MPa.

[0043] In this embodiment, the traditional process adopts single pre-pressing or direct die-cutting, and the internal stress of the material is not fully released, resulting in edge rebound after cutting (rebound amount > 0.2mm) and dimensional deviation (±0.3mm). This embodiment can eliminate the internal stress of the material, eliminate local deformation, and eliminate the interface bubbles between the foam double-sided adhesive and the release bottom film through the first pre-pressing; the second pre-pressing can make the pre-pressed material form a microscopic plastic deformation layer, stabilize the material structure and enhance the interface bonding force, form a uniform stress distribution, and reduce the elastic retraction of the foam during die-cutting by 60%, thereby reducing the instantaneous deformation of the material and improving the die-cutting quality.

[0044] Optionally, the surface of the pre-pressing platform is provided with a micro-protrusion array, and the protrusion height is 20μm to 50μm, so as to cooperate with the pre-pressing operation to effectively release the stress inside the material, thereby improving the uniformity and stability of the material, avoiding material stratification or damage due to stress concentration, and improving the processing quality and material reliability.

[0045] Step S102, peeling off the substrate of the pre-pressed material, and then using a die-cutting machine to die-cut the foam double-sided tape, and peeling off the foam waste to obtain the die-cutting material. The die-cutting machine dynamically adjusts the feed rate according to the die-cutting stage during the die-cutting process.

[0046] In this step, the substrate of the pre-pressed material is peeled off, and the foam double-sided adhesive material is placed in the die-cutting machine. According to the preset die-cutting parameters and process requirements, the die-cutting program is started. During the die-cutting process, the die-cutting machine dynamically adjusts the feed rate according to different die-cutting stages to ensure cutting accuracy and efficiency. After the die-cutting is completed, the foam waste generated by the cutting is peeled off manually or automatically, and finally the die-cutting material that meets the design requirements is obtained.

[0047] Since the traditional vertical stamping method is prone to edge stress concentration and poor die-cutting quality, the present embodiment uses a roller die-cutting machine to dynamically adjust the feed rate of the die-cutting machine, which can effectively improve the die-cutting accuracy and processing efficiency and avoid cutting deviation or material waste caused by fixed feed rate. At the same time, dynamic adjustment can adapt to the process requirements of different die-cutting stages, ensure the integrity and consistency of the foam double-sided adhesive material, and thus improve the quality and reliability of the final die-cutting material.

[0048] In some embodiments, the die-cutting machine is used to die-cut the pre-pressed material to obtain the die-cut material, including:

[0049] Determine the die-cutting parameters of the die-cutting machine according to the die-cutting thickness of the pre-pressed material, wherein the die-cutting parameters include the cutting angle of the roller cutter and the rotation rate of each die-cutting stage, wherein the die-cutting stage includes a cutting period, a stabilization period and a knife closing period;

[0050] The target roller cutter corresponding to the roller cutter cutting angle is called, and the rotation rate of the target roller cutter in each die-cutting stage is controlled to die-cut the pre-pressed material to obtain the die-cut material.

[0051] In this embodiment, the die-cutting thickness is the thickness of the foam double-sided adhesive tape. Since the roller cutter of the die-cutting machine and the pre-pressed material transmitted by the roller shaft begin to contact before the two are in a horizontal plane, the roller cutter will form an inclined surface on the horizontal section of the foam double-sided adhesive tape, resulting in poor die-cutting quality. Therefore, this embodiment selects the roller cutter with a corresponding cutting angle and rotation rate according to the die-cutting thickness of the pre-pressed material, reduces the slope of the inclined surface of the foam double-sided adhesive tape, and can effectively improve the die-cutting accuracy and processing efficiency, reduce material waste, and ensure the quality and consistency of the die-cutting material.

[0052] Optionally, determining the die-cutting parameters of the die-cutting machine according to the die-cutting thickness of the pre-pressed material includes:

[0053] When the die-cutting thickness of the pre-pressed material is not greater than the preset thickness, determining the die-cutting parameters of the die-cutting machine to be the first preset parameters;

[0054] When the die-cutting thickness of the pre-pressed material is greater than the preset thickness, the die-cutting parameters of the die-cutting machine are calculated based on a preset die-cutting parameter calculation formula; the expression of the preset die-cutting parameter calculation formula is:

[0055]

[0056] Wherein, h is the die-cutting thickness of the pre-pressed material, r is the roller cutter radius, θ is the roller cutter cutting angle, t is the contact time between the roller cutter and the pre-pressed material, v1 is the rotation rate during the cutting period, v2 is the rotation rate during the stable period, v3 is the rotation rate during the knife closing period, v′ is the first preset rotation rate, and v″ is the second preset rotation rate.

[0057] In this optional embodiment, when the die-cutting thickness is not greater than the preset thickness, the contact depth between the roller cutter and the pre-pressed material is shallow, and the inclined surface formed by the die-cutting is very short and does not affect the die-cutting quality. When the die-cutting thickness is greater than the preset thickness, the roller cutter cut-in angle is calculated according to the die-cutting thickness of the pre-pressed material and the roller cutter radius, and the rotation rate during the cut-in period is calculated in combination with the contact time between the roller cutter and the material to improve the die-cutting quality. The contact time between the roller cutter and the material is a preset amount, and the first preset rotation rate and the second preset rotation rate are preset amounts of the reference angular momentum and the average external torque.

[0058] Step S103, obtaining the coordinates of the feature points of the die-cut material based on the visual recognition tool, and using the elastic limiting mechanism to perform positioning compensation on the die-cut material according to the coordinates of the feature points, and then aligning and bonding the die-cut material with the release film to obtain TP foam adhesive.

[0059] In this step, if Figure 2As shown, the TP foam adhesive includes a release base film, a die-cut foam double-sided adhesive and a release film. This embodiment obtains the coordinates of the feature points of the die-cut material through a visual recognition tool (such as a CCD camera), and then combines the elastic limit mechanism for positioning compensation, so as to achieve high-precision alignment and bonding. It not only improves the accuracy of the alignment between the die-cut material and the release film, reduces the possible offset or misalignment during the bonding process, but also ensures the quality and consistency of the final TP foam adhesive product. In addition, automation and precision means effectively improve production efficiency, reduce material waste and labor costs, and thus optimize the overall production process.

[0060] In some embodiments, the use of an elastic limiting mechanism to perform positioning compensation on the die-cutting material according to the characteristic point coordinates includes:

[0061] Determining the position deviation of the die-cut material according to the coordinates of the feature points;

[0062] When the position deviation is greater than a preset value, a compensation amount of the die-cutting material is generated;

[0063] The elastic limiting mechanism is used to perform positioning compensation on the die-cutting material according to the compensation amount.

[0064] Optionally, the elastic limiting mechanism includes a piezoelectric ceramic drive module and a magnetorheological damper connected to the positioning platform, and the damping coefficient of the magnetorheological damper can be dynamically adjusted according to the compensation amount.

[0065] In this embodiment, exemplarily, an optical mark point image on the surface of the material after pre-pressing is collected by a CCD camera; the outline of the mark point is extracted using an image processing algorithm (Gaussian filtering + Canny edge detection); the center coordinates of the mark point are fitted by the least squares method, and the position deviation ΔP is calculated; a compensation vector V = K·ΔP (K is the elastic coefficient of the material) is generated based on the visual positioning result; the piezoelectric ceramic module is driven to adjust the position of the limit column, with a compensation accuracy of ±0.01mm; the magnetorheological damper adjusts the damping coefficient in real time to ensure compensation stability.

[0066] In order to implement the die-cutting method of TP foam glue corresponding to the above method embodiment, so as to achieve the corresponding functions and technical effects. Figure 3 , Figure 3 The structural block diagram of a TP foam adhesive die-cutting device provided in an embodiment of the present application is shown. For the convenience of explanation, only the parts related to the present embodiment are shown. The TP foam adhesive die-cutting device provided in an embodiment of the present application includes:

[0067] A pre-pressing mechanism 301 is used to pre-press the release base film and the foam adhesive material to obtain a pre-pressed material, wherein the foam adhesive material includes a substrate and a foam double-sided adhesive;

[0068] The die-cutting mechanism 302 is used to peel off the substrate of the pre-pressed material, and then use a die-cutting machine to die-cut the foam double-sided adhesive, and peel off the foam waste to obtain the die-cutting material. The die-cutting machine dynamically adjusts the feed rate according to the die-cutting stage during the die-cutting process;

[0069] The laminating mechanism 303 is used to obtain the coordinates of the feature points of the die-cut material based on the visual recognition tool, and use the elastic limiting mechanism to position and compensate the die-cut material according to the coordinates of the feature points, and then align and laminate the die-cut material with the release film to obtain TP foam glue.

[0070] In some embodiments, the pre-pressing mechanism 301 is specifically used for:

[0071] The release base film and the foam adhesive material are respectively transferred to a pre-pressing platform, and the release base film and the foam adhesive material are pre-pressed twice, the first pre-pressing pressure is 0.5MPa-0.8MPa, and the second pre-pressing pressure is 1.2MPa-1.5MPa.

[0072] Optionally, a micro-protrusion array is provided on the surface of the pre-pressing platform, and the height of the protrusion is 20 μm to 50 μm.

[0073] In some embodiments, the die-cutting mechanism 302 is specifically used for:

[0074] Determine the die-cutting parameters of the die-cutting machine according to the die-cutting thickness of the pre-pressed material, wherein the die-cutting parameters include the cutting angle of the roller cutter and the rotation rate of each die-cutting stage, wherein the die-cutting stage includes a cutting period, a stabilization period and a knife closing period;

[0075] The target roller cutter corresponding to the roller cutter cutting angle is called, and the rotation rate of the target roller cutter in each die-cutting stage is controlled to die-cut the pre-pressed material to obtain the die-cut material.

[0076] In some embodiments, the die-cutting mechanism 302 is further used for:

[0077] When the die-cutting thickness of the pre-pressed material is not greater than the preset thickness, determining the die-cutting parameters of the die-cutting machine to be the first preset parameters;

[0078] When the die-cutting thickness of the pre-pressed material is greater than the preset thickness, the die-cutting parameters of the die-cutting machine are calculated based on a preset die-cutting parameter calculation formula.

[0079] Optionally, the preset die-cutting parameter calculation formula is expressed as:

[0080]

[0081] Wherein, h is the die-cutting thickness of the pre-pressed material, r is the roller cutter radius, θ is the roller cutter cutting angle, t is the contact time between the roller cutter and the pre-pressed material, v1 is the rotation rate during the cutting period, v2 is the rotation rate during the stable period, v3 is the rotation rate during the knife closing period, v′ is the first preset rotation rate, and v″ is the second preset rotation rate.

[0082] In some embodiments, the laminating mechanism 303 is specifically used for:

[0083] Determining the position deviation of the die-cut material according to the coordinates of the feature points;

[0084] When the position deviation is greater than a preset value, a compensation amount of the die-cutting material is generated;

[0085] The elastic limiting mechanism is used to perform positioning compensation on the die-cutting material according to the compensation amount.

[0086] Optionally, the elastic limiting mechanism includes a piezoelectric ceramic drive module and a magnetorheological damper connected to the positioning platform, and the damping coefficient of the magnetorheological damper can be dynamically adjusted according to the compensation amount.

[0087] The die-cutting device for TP foam adhesive described above can implement the die-cutting method for TP foam adhesive described above. The options in the method embodiment described above are also applicable to this embodiment and will not be described in detail here. The rest of the contents of the embodiment of this application can refer to the contents of the method embodiment described above and will not be described in detail in this embodiment.

[0088] Figure 4 This is a schematic diagram of the structure of a die-cutting device provided in one embodiment of the present application. Figure 4 As shown, the die-cutting device 4 of this embodiment includes: at least one processor 40 ( Figure 4 Only one is shown in the figure), a memory 41, and a computer program 42 stored in the memory 41 and executable on the at least one processor 40, wherein the processor 40 implements the steps of any of the above method embodiments when executing the computer program 42.

[0089] The die-cutting device may include but is not limited to a processor 40 and a memory 41. Those skilled in the art will appreciate that Figure 4 It is only an example of the die-cutting device 4 and does not constitute a limitation on the die-cutting device 4. It may include more or fewer components than shown in the figure, or a combination of certain components, or different components. For example, it may also include input and output devices, network access devices, etc.

[0090] The processor 40 may be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor may be a microprocessor or any conventional processor, etc.

[0091] In some embodiments, the memory 41 may be an internal storage unit of the die-cutting device 4, such as a hard disk or memory of the die-cutting device 4. In other embodiments, the memory 41 may also be an external storage device of the die-cutting device 4, such as a plug-in hard disk, a smart media card (SMC), a secure digital (SD) card, a flash card, etc. equipped on the die-cutting device 4. Further, the memory 41 may also include both an internal storage unit and an external storage device of the die-cutting device 4. The memory 41 is used to store an operating system, an application program, a boot loader (BootLoader), data, and other programs, such as the program code of the computer program. The memory 41 may also be used to temporarily store data that has been output or is to be output.

[0092] In addition, an embodiment of the present application further provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps in any of the above method embodiments are implemented.

[0093] An embodiment of the present application provides a computer program product. When the computer program product is run on a die-cutting device, the die-cutting device implements the steps in the above-mentioned method embodiments.

[0094] In several embodiments provided in the present application, it is understood that each box in the flow chart or block diagram can represent a module, a program segment or a part of a code, and the module, a program segment or a part of a code contains one or more executable instructions for realizing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in a different order from that marked in the accompanying drawings. For example, two consecutive boxes can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved.

[0095] If the functions are implemented in the form of software function modules and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application can be essentially or partly embodied in the form of a software product that contributes to the prior art. The computer software product is stored in a storage medium and includes several instructions for a computer device to perform all or part of the steps of the methods described in each embodiment of the present application. The aforementioned storage medium includes: various media that can store program codes, such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk.

[0096] The specific embodiments described above further describe the purpose, technical solutions and beneficial effects of the present application in detail. It should be understood that the above description is only a specific embodiment of the present application and is not intended to limit the scope of protection of the present application. It is particularly pointed out that for those skilled in the art, any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of protection of the present application.

Claims

1. A die-cutting method for TP foam adhesive, characterized in that: include: Pre-pressing the release base film and the foam adhesive material to obtain a pre-pressed material, wherein the foam adhesive material includes a substrate and a foam double-sided adhesive; The substrate of the pre-pressed material is peeled off, and the foam double-sided adhesive is die-cut by a die-cutting machine, and the foam waste is peeled off to obtain a die-cut material, wherein the die-cutting machine dynamically adjusts the feed rate according to the die-cutting stage during the die-cutting process; The characteristic point coordinates of the die-cut material are obtained based on a visual recognition tool, and the die-cut material is positioned and compensated according to the characteristic point coordinates using an elastic limiting mechanism, and then the die-cut material is aligned and bonded to a release film to obtain TP foam adhesive.

2. The die-cutting method of TP foam adhesive according to claim 1, characterized in that: The pre-pressing of the release base film and the foam adhesive material to obtain the pre-pressed material comprises: The release base film and the foam adhesive material are respectively transferred to a pre-pressing platform, and the release base film and the foam adhesive material are pre-pressed twice, the first pre-pressing pressure is 0.5MPa-0.8MPa, and the second pre-pressing pressure is 1.2MPa-1.5MPa.

3. The die-cutting method of TP foam adhesive according to claim 2, characterized in that: The surface of the pre-pressing platform is provided with a micro-protrusion array, and the height of the protrusion is 20 μm to 50 μm.

4. The die-cutting method of TP foam adhesive according to claim 1, characterized in that: The die-cutting machine is used to die-cut the pre-pressed material to obtain the die-cut material, comprising: Determine the die-cutting parameters of the die-cutting machine according to the die-cutting thickness of the pre-pressed material, wherein the die-cutting parameters include the cutting angle of the roller cutter and the rotation rate of each die-cutting stage, wherein the die-cutting stage includes a cutting period, a stabilization period and a knife closing period; The target roller cutter corresponding to the roller cutter cutting angle is called, and the rotation rate of the target roller cutter in each die-cutting stage is controlled to die-cut the pre-pressed material to obtain the die-cut material.

5. The die-cutting method of TP foam adhesive according to claim 4, characterized in that: Determining the die-cutting parameters of the die-cutting machine according to the die-cutting thickness of the pre-pressed material includes: When the die-cutting thickness of the pre-pressed material is not greater than the preset thickness, determining the die-cutting parameters of the die-cutting machine to be the first preset parameters; When the die-cutting thickness of the pre-pressed material is greater than the preset thickness, the die-cutting parameters of the die-cutting machine are calculated based on a preset die-cutting parameter calculation formula.

6. The die-cutting method of TP foam adhesive according to claim 5, characterized in that: The expression of the preset die-cutting parameter calculation formula is: Wherein, h is the die-cutting thickness of the pre-pressed material, r is the roller cutter radius, θ is the roller cutter cutting angle, t is the contact time between the roller cutter and the pre-pressed material, v1 is the rotation rate during the cutting period, v2 is the rotation rate during the stable period, v3 is the rotation rate during the knife closing period, v′ is the first preset rotation rate, and v″ is the second preset rotation rate.

7. The die-cutting method of TP foam adhesive according to claim 1, characterized in that: The method of using the elastic limiting mechanism to perform positioning compensation on the die-cutting material according to the coordinates of the characteristic points includes: Determining the position deviation of the die-cut material according to the coordinates of the feature points; When the position deviation is greater than a preset value, a compensation amount of the die-cutting material is generated; The elastic limiting mechanism is used to perform positioning compensation on the die-cutting material according to the compensation amount.

8. The die-cutting method of TP foam adhesive according to claim 6, characterized in that: The elastic limiting mechanism includes a piezoelectric ceramic driving module and a magnetorheological damper connected to the positioning platform, and the damping coefficient of the magnetorheological damper can be dynamically adjusted according to the compensation amount.

9. A die-cutting device for TP foam adhesive, characterized in that: include: A pre-pressing mechanism, used for pre-pressing the release base film and the foam adhesive material to obtain a pre-pressed material, wherein the foam adhesive material comprises a substrate and a foam double-sided adhesive; A die-cutting mechanism, used to peel off the substrate of the pre-pressed material, and then use a die-cutting machine to die-cut the foam double-sided adhesive, and peel off the foam waste to obtain the die-cutting material, and the die-cutting machine dynamically adjusts the feed rate according to the die-cutting stage during the die-cutting process; The laminating mechanism is used to obtain the feature point coordinates of the die-cut material based on the visual recognition tool, and use the elastic limiting mechanism to position and compensate the die-cut material according to the feature point coordinates, and then align and laminate the die-cut material with the release film to obtain TP foam glue.

10. A die-cutting device, characterized in that: It comprises a processor and a memory, wherein the memory is used to store a computer program, and when the computer program is executed by the processor, the die-cutting method of TP foam glue as claimed in any one of claims 1 to 8 is implemented.

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