Chip plastic package mold for preventing product from warping

Abstract

The chip plastic package mold comprises a movable mold and a fixed mold, an inner cavity of the fixed mold is provided with a material opening communicated with an external glue injection mechanism, a runner communicated with the material opening and a shaping cavity communicated with the runner, and an upper connecting plate and a movable cavity matched with the shaping cavity are arranged in an inner cavity of the movable mold in a sliding mode from top to bottom; the invention relates to the technical field of chip plastic package. According to the chip plastic packaging mold capable of preventing the product from warping, first-time plastic packaging is carried out, pressing rods downwards extrude the four corners of a chip during packaging, the chip is pressed, warping of the chip is prevented, then after the chip is heated, at the moment, a resin material is not shaped, a movable cavity moves downwards, and an upper connecting plate moves upwards, so that the product is prevented from being warped; at the moment, the pressing rod ascends and retracts into the movable groove and is flush with the bottom of the movable cavity, extrusion on the chip is canceled, the movable cavity moves downwards to apply downward pressure at the moment, the chip can be prevented from being tilted and waiting for solidification of the resin material, and then plastic packaging operation on the chip is achieved.

Description

Technical Field

[0001] The invention relates to the technical field of chip plastic packaging, in particular to a chip plastic packaging mold for preventing product warping. Background Art

[0002] With the updating and iteration of consumer products, under the requirements of multi-function and miniaturization, the chip packaging structure tends to develop towards high-density integration.

[0003] Due to the large number of components and chips packaged inside and their different heights, the entire packaged product is thicker. Because the thermal expansion coefficients of chips, components and plastic packaging materials do not match, local thermal stress is generated, causing the product to warp after plastic packaging. Too much warping not only makes the subsequent processes after plastic packaging more difficult (such as ball planting, cutting, and patch processes), but also significantly increases the process defect rate when the finished chip is assembled on the board by SMT, and is prone to serious device failure problems. Summary of the invention

[0004] In view of the deficiencies in the prior art, the present invention provides a chip plastic packaging mold for preventing product warping, thereby solving the above-mentioned problems.

[0005] To achieve the above purpose, the present invention is implemented through the following technical solutions: a chip encapsulation mold for preventing product warping, comprising a movable mold and a fixed mold, the inner cavity of the fixed mold is provided with a material port connected to an external injection mechanism, a flow channel connected to the material port, and a fixed mold cavity connected to the flow channel, the inner cavity of the movable mold is provided with an upper connecting plate and a movable mold cavity adapted to the fixed mold cavity sliding from top to bottom, the bottom of the upper connecting plate is fixedly connected with a pressure rod, one end of the pressure rod passes through the top of the movable mold cavity and extends to the bottom of the movable mold cavity, and the inner cavity of the movable mold cavity is provided with a movable groove that is slidably sealed with the surface of the pressure rod; The inner cavity of the movable mold is provided with a driving mechanism for driving the upper connecting plate and the movable mold cavity, the driving mechanism includes a rotating rod which is driven and rotated by a motor and is arranged in the inner cavity of the movable mold, the surface of the rotating rod is fixedly connected with a connecting rod, both ends of the connecting rod are rotatably connected with push rods, and the ends of the two push rods away from the connecting rods are rotatably connected with the bottom of the upper connecting plate and the top of the movable mold cavity through a rotating seat respectively. When in use, the chip to be plastic-sealed needs to be placed in the fixed mold cavity first, the movable mold descends to drive the movable mold cavity to fit above the fixed mold, and then resin material is injected into the material port, the resin material injected into the material port will flow into the fixed mold cavity through the runner, and the resin material flowing into the fixed mold cavity will be positioned The chip in the molding cavity is wrapped up and the first plastic sealing is performed. During the wrapping, the pressure rod is pressed downward on the four corners of the chip to press the chip to prevent it from warping. Then when the chip is heated, the resin material has not yet been fixed. At this time, the driving mechanism is started to drive the rotating rod to rotate, drive the connecting rod to rotate, and drive the upper connecting plate and the dynamic cavity to move through two push rods respectively, drive the dynamic cavity to move downward, and the upper connecting plate to move upward. At this time, the pressure rod rises upward and is retracted into the movable groove and is flush with the bottom of the dynamic cavity, canceling the squeezing of the chip. At this time, the dynamic cavity moves downward and applies downward pressure to prevent the chip from warping, waiting for the resin material to solidify, thereby achieving the plastic sealing operation of the chip.

[0006] As a further solution of the present invention: there are multiple material ports, and there are multiple groups of molding cavities, which are arranged in a 4X4 combination. The multiple material ports are staggered one by one with the vertical molding cavities, and the flow channels are respectively arranged on both sides of the molding cavities to evenly inject glue and prevent the existence of gaps.

[0007] As a further solution of the present invention: there are multiple pressure rods, and four are set in a group, which are symmetrically arranged at the four corners above the molding cavity, and multiple points are used for initial positioning. During the first injection of glue, the chip is effectively pressed around to prevent its edges from warping. After the pressure rods are retracted, secondary injection of glue is performed to completely form the chip.

[0008] As a further solution of the present invention: when the movable cavity is located at the initial position, the pressure rod is located below the movable cavity.

[0009] As a further solution of the present invention: two driving mechanisms are provided and are symmetrically arranged between the upper connecting plate and the dynamic cavity, and an embedded groove for placing the driving mechanism is opened on the top of the dynamic cavity.

[0010] Compared with the prior art, the present invention has the following beneficial effects: during the first plastic sealing, the pressure rod presses downward on the four corners of the chip during wrapping to press the chip to prevent it from warping; then when the chip is heated, the resin material has not yet been formed, the movable cavity moves downward, and the upper connecting plate moves upward. At this time, the pressure rod rises upward and is retracted into the movable groove and is flush with the bottom of the movable cavity, canceling the squeezing of the chip. At this time, the movable cavity moves downward and applies downward pressure to prevent the chip from warping, waiting for the resin material to solidify, thereby achieving the plastic sealing operation of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is a structural schematic diagram of the present invention; Figure 2 It is a structural schematic diagram of the mold closing state of the present invention; Figure 3 It is a top view of the structure of the fixed mold of the present invention; Figure 4 For the present invention Figure 1 A partial enlarged view of point A in the middle.

[0012] In the figure: 1. movable mold; 2. fixed mold; 3. upper connecting plate; 4. movable cavity; 5. pressure rod; 6. movable groove; 7. rotating rod; 8. connecting rod; 9. push rod; 10. rotating seat; 11. material inlet; 12. runner; 13. fixed cavity; 14. embedded groove. DETAILED DESCRIPTION

[0013] In order to further explain the technical means and effects adopted by the present invention to achieve the predetermined invention purpose, the specific implementation mode, structure, characteristics and effects of the present invention are described in detail below in combination with the accompanying drawings and preferred embodiments.

[0014] See also Figure 1-4 The present invention provides a technical solution: a chip plastic encapsulation mold for preventing product warping, comprising a movable mold 1 and a fixed mold 2, the inner cavity of the fixed mold 2 is provided with a material port 11 connected to an external glue injection mechanism, a flow channel 12 connected to the material port 11, and a fixed mold cavity 13 connected to the flow channel 12, the inner cavity of the movable mold 1 is provided with an upper connecting plate 3 and a movable mold cavity 4 adapted to the fixed mold cavity 13 sliding from top to bottom, the bottom of the upper connecting plate 3 is fixedly connected with a pressure rod 5, one end of the pressure rod 5 passes through the top of the movable mold cavity 4 and extends to the bottom of the movable mold cavity 4, and the inner cavity of the movable mold cavity 4 is provided with a movable groove 6 that is slidably sealed with the surface of the pressure rod 5; The inner cavity of the movable mold 1 is provided with a driving mechanism for driving the upper connecting plate 3 and the movable mold cavity 4. The driving mechanism includes a rotating rod 7 that is driven and rotated by a motor and is arranged in the inner cavity of the movable mold 1. The surface of the rotating rod 7 is fixedly connected with a connecting rod 8. Both ends of the connecting rod 8 are rotatably connected with push rods 9. The ends of the two push rods 9 away from the connecting rods are rotatably connected to the bottom of the upper connecting plate 3 and the top of the movable mold cavity 4 through a rotating seat 10. When in use, the chip to be plastic-sealed needs to be placed in the fixed mold cavity 13 first, and the movable mold 1 is lowered to drive the movable mold cavity 4 to fit above the fixed mold 2, and then the resin material is injected into the material port 11. The resin material injected into the material port 11 will flow into the fixed mold cavity 13 through the runner 12. The resin flowing into the fixed mold cavity 13 The material will wrap up the chip located in the molding cavity 13, and the first plastic sealing is performed at this time. When wrapping, the pressure rod 5 presses downward on the four corners of the chip to press the chip to prevent it from warping. Then when the chip is heated, the resin material has not yet been fixed. At this time, the driving mechanism is started to drive the rotating rod 7 to rotate, and the connecting rod 8 to rotate, and the upper connecting plate 3 and the movable cavity 4 are driven to move through the two push rods 9 respectively, driving the movable cavity 4 to move downward, and the upper connecting plate 3 to move upward. At this time, the pressure rod 5 rises upward and is retracted into the movable groove 6 and is flush with the bottom of the movable cavity 4, canceling the squeezing of the chip. At this time, the movable cavity 4 moves downward and applies downward pressure to prevent the chip from warping, waiting for the resin material to solidify, and then achieving the plastic sealing operation of the chip.

[0015] There are multiple material ports 11, and multiple groups of molding cavities 13 are arranged in a 4X4 combination. The multiple material ports 11 are staggered with the vertical molding cavities 13 one by one, and the flow channels 12 are respectively arranged on both sides of the molding cavities 13 to evenly inject glue to prevent gaps.

[0016] There are multiple pressure rods 5, and four are set in a group. They are symmetrically arranged at the four corners above the molding cavity 13, and multiple points are used for initial positioning. During the first injection of glue, the chip is effectively pressed around to prevent its edges from warping. Then, the pressure rods 5 are retracted and the second injection of glue is performed to completely shape the chip.

[0017] When the movable cavity 4 is located at the initial position, the pressing rod 5 is located below the movable cavity 4 .

[0018] Two driving mechanisms are provided and are symmetrically arranged between the upper connecting plate 3 and the movable cavity 4. The top of the movable cavity 4 is provided with an embedded groove 14 for accommodating the driving mechanism.

[0019] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Although the present invention has been disclosed as a preferred embodiment as above, it is not used to limit the present invention. Any technical personnel in this field can make some changes or modify the technical contents disclosed above into equivalent embodiments without departing from the scope of the technical solution of the present invention. However, any brief modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A chip encapsulation mold for preventing product warping, comprising a movable mold (1) and a fixed mold (2), characterized in that: The inner cavity of the fixed mold (2) is provided with a material port (11) connected to an external injection mechanism, a flow channel (12) connected to the material port (11), and a mold cavity (13) connected to the flow channel (12); the inner cavity of the movable mold (1) is provided with an upper connecting plate (3) and a movable cavity (4) adapted to the mold cavity (13) slidingly arranged from top to bottom; a pressure rod (5) is fixedly connected to the bottom of the upper connecting plate (3); one end of the pressure rod (5) passes through the top of the movable cavity (4) and extends to the bottom of the movable cavity (4); the inner cavity of the movable cavity (4) is provided with a movable groove (6) which is slidably sealed with the surface of the pressure rod (5); The inner cavity of the movable mold (1) is provided with a driving mechanism for driving the upper connecting plate (3) and the movable cavity (4), the driving mechanism comprising a rotating rod (7) arranged in the inner cavity of the movable mold (1) and driven to rotate by a motor, a connecting rod (8) being fixedly connected to the surface of the rotating rod (7), both ends of the connecting rod (8) being rotatably connected to push rods (9), and the ends of the two push rods (9) away from the connecting rods are rotatably connected to the bottom of the upper connecting plate (3) and the top of the movable cavity (4) respectively through a rotating seat (10).

2. The chip encapsulation mold for preventing product warping according to claim 1, characterized in that: The material ports (11) are provided in plurality, the shaping cavities (13) are provided in plurality and arranged in a 4×4 combination, the plurality of material ports (11) are respectively arranged in an alternating manner with the vertically arranged shaping cavities (13), and the flow channels (12) are respectively arranged on both sides of the shaping cavities (13).

3. The chip encapsulation mold for preventing product warping according to claim 1, characterized in that: The pressure rods (5) are provided in plurality and are arranged in groups of four, and are symmetrically arranged at four corners above the molding cavity (13).

4. The chip encapsulation mold for preventing product warping according to claim 1, characterized in that: When the movable cavity (4) is located at the initial position, the pressure rod (5) is located below the movable cavity (4).

5. The chip encapsulation mold for preventing product warping according to claim 1, characterized in that: Two drive mechanisms are provided and are symmetrically arranged between the upper connecting plate (3) and the movable cavity (4); an embedded groove (14) for accommodating the drive mechanism is provided at the top of the movable cavity (4).

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